TW387133B

TW387133B - Lead frame material and method for manufacturing the same

Info

Publication number: TW387133B
Application number: TW88100024A
Authority: TW
Inventors: Jiun-Shiun Ju; Shi-Yi Chen; Ruei-Fen Bai
Original assignee: Ind Tech Res Inst
Priority date: 1999-01-04
Filing date: 1999-01-04
Publication date: 2000-04-11

Abstract

The invention provides lead frame material and its manufacturing method. The method utilizes the vacuum coating technique to grow an inter-metal dielectric layer on the surface of a lead frame substrate. Then, a top-layered precious metal protection coating is formed on the surface of the inter-metal dielectric layer by the vacuum coating technique. Because the vacuum coating technique is used in the present invention to replace the conventional wet electroplating technique for growing lead frame coating, the selectivity of the coating materials can be increased, so as to provide a coating with special composition. The inter-metal layer may be of Ni, Ag, W, Zn, Cr, Mo, Cu, Sn, Al, Ta, Co, Nb and their alloys. The top protective coating may be Pt, Ir, Re, Ru, Rh, Pd, Au, Ag and their alloys. The top-layered protection coating may be of Rt, Ir, Re, Ru, Rh, Pd, Au, Ag and their alloys.

Description

本發明有關於一種導線架材料及其製造方法，特別有y於使用真空鍍膜法來製造導線架材料的方法。藉由真空鍍膜法，因而可增加鍍層材質二特殊組成的鍍膜。㈣而&供鋼基導線架基板因具備有優良的導電性，因而在半，裝置之傳統導線架製造上，一直佔有最大的使用 ®。通常銅基導線架首要的改進研究方向在於增加導線架表面金屬導電層的打線能力（wire bonding)與可靠度 (reliability)，以及焊接性（s〇lderabiHty)。又般而&導線架之金屬導電層必須同時具備有以下之各種特性，包括鍍層不含鉛及其化合物；抗腐蝕性；抗氧化性；高溫（>2〇(TC)穩定性；高打線能力與可焊接性等優點。為了使金屬導電層達到上述之材料特性，以往有幾種方法曾被提出作為改善。例如在真空中進行打線作業，電鍍5〜l〇em厚之金層或者在金屬導電層上再進行表面去除氧化物等步驟。而以往所提出的方法均需要增加生產步驟或生產成本，並且對高腳數(high pin)的導線架而言，更可能因電鐘層太厚而導致相鄰導線腳彼此黏貼（stick)在一起。在導線架（lead frame)製程中製造Cu/Ag、Ni/Ag、The present invention relates to a lead frame material and a manufacturing method thereof, and particularly to a method for manufacturing a lead frame material using a vacuum coating method. By the vacuum coating method, a coating with a special composition of the coating material 2 can be added. && For steel-based lead frame substrates have excellent electrical conductivity, so they have always been the largest in the traditional lead frame manufacturing of semi-devices. Generally, the main improvement research direction of copper-based lead frame is to increase the wire bonding and reliability of the metal conductive layer on the surface of the lead frame, and solderability (solderabiHty). In general, the metal conductive layer of the lead frame must also have the following characteristics at the same time, including the plating does not contain lead and its compounds; corrosion resistance; oxidation resistance; high temperature (> 20 (TC) stability; high Wire bonding ability and solderability etc. In order to make the metal conductive layer achieve the above-mentioned material characteristics, several methods have been proposed as improvements in the past. For example, wire bonding operation in a vacuum, electroplating a gold layer with a thickness of 5 ~ 10em or Steps such as removing oxides on the surface of the metal conductive layer are performed. However, the methods proposed in the past need to increase production steps or production costs, and for high pin lead frames, it is more likely to be caused by the electrical clock layer. Too thick to cause adjacent lead pins to stick to each other. Manufacture Cu / Ag, Ni / Ag,

Pd等金屬導電層應用上’目前均採用濕式電鍍方式成長’所使用之電鍍原料主要以含有劇毒之氰化物為主，因此對於一般連續式製造導線架的工廠而言，因氰化物對人員健康所造成的影響與因廢水處理排放對環境所本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐）經濟部中央標隼局員工消費合作社印製 A7 B7 ^ 一 _—___ 五、發明説明（2 ) 造成的傷害均需付出昂貴的社會成本。根據目前國内導線架製造工廠在用水的使用情況刀析，在導線架製程上需以大量的去離子水（j^评奴打) 與市水用於清洗電鍍殘留廢液，平均每一導線架約需0.5〜lKg的DI water與市水。以一個中型導線架製作工廠而s，平均月產能約為2億pieces，所需的di Water與市水月用水量約為20萬嘲，在m water與市水的成本、廢液處理的成本與對環境所造成的影響將與曰劇增。對於講求綠色環保的時代，高污染性之電鍍製程終需以其他方法取代。目前國内導線架的製作主要是以喷液選擇鍍區的水式電鍍法製作，在控制鍍液的均勻度與及控制鍍液中電流密度的均勻是相當不容易的技術，常因此而造成鍍銀不良（如鍍缺或者鍍銀不均等缺陷）、銀粒針孔、滲銀等問題。使用濕式電鍍法所成長的銀或銅等金屬，非常容易氧化；鍍液受污染或操作環境不良則容易形成鍍面政义/亏染及變色’並直接造成Wire bonding的不良。一般電鏡生產線長約1 〇〜2〇公尺，在製造的過程中非常容易造成產品刮傷；利用水洗過程也非常容易造成產品上出現水痕，而無法使用。當生產線在製造過程中出現任何異常需停機處理時’則因所有的半成品或成品均泡在藥液中或水中’而使得產品因氧化變色等問題而全部報廢’甚至連整條生產線上的藥液亦須全部更換，所損耗的成本相當高。本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） -----Γ I-.---Φ! (請先閱讀背面之注意事項再填寫本頁) -訂經濟部中央標隼局員工消費合作社印裝 A7 '^ -----------B7 五、發明説明（3 ) ' 一--In the application of metal conductive layers such as Pd, which are currently grown by wet electroplating, the plating materials used are mainly highly cyanide-containing cyanide. Therefore, in the general continuous manufacturing of leadframe factories, cyanide is a problem for personnel. Health impacts and environmental impacts due to wastewater treatment and discharge. The paper size of this paper applies Chinese National Standard (CNS) A4 (210X297 mm). Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. A7 B7 ^ I_____ V. Description of the invention (2) All the injuries caused by the method need to pay expensive social costs. According to the analysis of the current use of water by domestic lead frame manufacturing plants, a large amount of deionized water and municipal water are used to clean the plating residues in the lead frame process. Each lead is averaged. The rack requires about 0.5 ~ 1Kg of DI water and municipal water. With a medium-sized lead frame manufacturing plant, the average monthly production capacity is about 200 million pieces. The monthly water consumption of di Water and municipal water is about 200,000. The cost of m water and municipal water, and the cost of waste liquid treatment. The impact on the environment will increase dramatically. For the era of environmental protection, the highly polluting plating process must be replaced by other methods. At present, the production of domestic lead frames is mainly made by the water electroplating method of the selective plating zone of the spray liquid. It is quite difficult to control the uniformity of the plating solution and the uniformity of the current density in the plating solution. Poor silver plating (such as defects such as lack of plating or uneven silver plating), silver pinholes, and silver infiltration. Metals such as silver or copper grown by the wet plating method are very easy to oxidize; contamination of the plating solution or poor operating environment can easily form the plating surface. Political / defective and discoloration 'directly cause the failure of wire bonding. Generally, the production line of electron microscope is about 10 ~ 20 meters long. It is very easy to cause product scratches during the manufacturing process; it is also very easy to cause water marks on the product during the washing process and it cannot be used. When there is any abnormality in the production line during the manufacturing process that needs to be shut down, 'the products are all scrapped due to problems such as oxidation and discoloration because all semi-finished products or finished products are soaked in liquid or water', even the entire production line The liquid must also be completely replaced, and the cost of the loss is quite high. This paper size is in accordance with Chinese National Standard (CNS) A4 specification (21〇 > < 297mm) ----- Γ I -.--- Φ! (Please read the precautions on the back before filling this page) -Order printed A7 for consumer cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs '^ ----------- B7 V. Description of Invention (3)' I-

At T 口以上’國内導線架製造廠雖能達到相當高的產二但因採用濕式電鑛法，導致導線架容易有包括鍍銀 <銀粒針孔、變形、氧化、乾膜殘留、水痕、污染、釔色、刮傷、滲銀等各種外觀缺陷’所以終因產品良率過低而無法大幅成長。近年來’有許多研究者以改變導線架鍍膜組成的方式，來改進導電金屬層的性質。例如，等人美國專利5,510,197中提出一種新的導線架組成，其包括銅或铜合金所構成之基材，錄或鎳合金所構成之中間層以及金、銀、鈀或其合金所構成之保護層。M〇〇n 在美國專利5,75M16中提出—種將㈣其合金以電錄法成長於Fe-Ni合金基材上的方法。Mathew在美國專利 5,650,661中提出新的導線架材料，依序包括導線架基材、錄層、銅層、錫層、以及把層，在導線架基材上之各層均以電鍍法而形成。然而，由於習知技術普遍採用電鍍法，使得電鍍鍍膜的材質受限於電鍍液的種類，選擇性非常低。、·不〇以上，習知技術以濕式電鍍法成長導線架鍍膜的方法有下列缺點：、 (υ使用大量毒性極強的氰化物為原料，現場人員的傷害非常大。見與 (2) 使用大量di water與市水，造成大量水資源的浪費。 (3) 在電鍍廢液處理上，需付出昂責的環境與杜 5 本紙張尺度適用中國國家標隼（CNS ) M规格（21〇><297公羡）Above Att. 'Although domestic lead frame manufacturers can achieve a relatively high output, due to the use of wet power mining method, lead frames are prone to include silver plating < pinholes, deformation, oxidation, and dry film residue on silver particles , Water marks, pollution, yttrium color, scratches, silver infiltration and other appearance defects' so the final product yield is too low to grow significantly. In recent years, many researchers have improved the properties of the conductive metal layer by changing the composition of the lead frame coating. For example, U.S. Patent No. 5,510,197 proposed a new lead frame composition including a substrate made of copper or copper alloy, an intermediate layer made of copper or nickel alloy, and protection made of gold, silver, palladium or its alloy. Floor. Moon proposed in U.S. Patent No. 5,75M16-a method of growing an alloy of rhenium on a Fe-Ni alloy substrate by electric recording. Mathew in U.S. Patent 5,650,661 proposes a new lead frame material, which includes a lead frame substrate, a recording layer, a copper layer, a tin layer, and a handle layer. Each layer on the lead frame substrate is formed by electroplating. However, since the conventional technique generally uses electroplating, the material of the plating film is limited by the type of the plating solution, and the selectivity is very low. No. Above, the conventional technique uses the wet plating method to grow the lead frame coating method has the following disadvantages: (U uses a large amount of highly toxic cyanide as a raw material, and the personnel at the scene are very injured. See and (2) The use of a large amount of di water and municipal water results in the waste of a large amount of water resources. (3) In the treatment of electroplating waste liquid, it is necessary to pay a responsible environment and Du 5 This paper size is applicable to China National Standard (CNS) M specification (21〇 > < 297 public envy)

A7 ~__________B7 五、發明説明（4 ) ~ ' ' ；~~ 成本。 . (4) 產品良率偏低，製程控制不易。 (5) 電鍍鍍膜臈層材質受限於電鍍液的種類，選擇性非常低。因此，本發明之目的即為解決上述問題，而提供一種新穎的製造導線架材料的方法，以真空賴法取代習知的濕式電鑛法’可避免氰化物劇毒的使用，因而減少水資源的使用，並減少廢液處理的成本與對環境的影響。本發明之另一目的為，藉由真空鍍膜法，因而可增加鍍層材質的選擇性’而提供特殊組成的锻膜。藉由選擇適當的鑛層，可提高產品良率，使產值與產能同步。同時，亦可使用較便宜的鍍層，以降低製造成本。為達成本發明之目的，本發明製造導線架材料的方法’包括：以真空鍍膜法成長金屬導電中介層在一導線架基材表面，該基材為銅、銅合金、或Fe_Ni合金所形成；以及經濟部中央標率局貝工消費合作社印装 {讀先聞讀#^之注意事項再填寫本頁} 以真空鍛膜法成長頂層責金屬保護層在該金屬導電中介層表面。本發明提供一種特殊組成之導線架材料，包括：一導線架基材’係由擇自銅、銅合金、和Fe—Ni合金所組成之族群中之材料所構成；一金屬導電中介層，形成於該基材上，係由純金屬本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公後） ΓΓ 經濟部中央標準局員工消費合作社印製發明説明（5 或金屬合金所構成，該金屬為擇自由Ni，Ag，w，ZnA7 ~ __________ B7 V. Description of the Invention (4) ~ ''; ~~ Cost. (4) The product yield is low, and the process control is not easy. (5) The material of the plating layer is limited by the type of plating solution, and the selectivity is very low. Therefore, the purpose of the present invention is to solve the above problems and provide a novel method for manufacturing lead frame materials. The conventional wet electric ore method is replaced by the vacuum method, which can avoid the highly toxic use of cyanide and thus reduce water resources. And reduce the cost and environmental impact of waste liquid treatment. Another object of the present invention is to provide a forged film with a special composition by increasing the selectivity of the coating material material by the vacuum coating method. By selecting an appropriate ore layer, the product yield can be improved and the output value can be synchronized with the production capacity. At the same time, cheaper plating can also be used to reduce manufacturing costs. In order to achieve the purpose of the present invention, the method of manufacturing a lead frame material according to the present invention includes: growing a metal conductive interposer on a surface of a lead frame substrate by a vacuum coating method, the substrate being formed of copper, a copper alloy, or a Fe_Ni alloy; And printed by the Shell Standard Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs {Read the first note of this article and fill in this page} Use the vacuum forging method to grow a top-level metal protective layer on the surface of the metal conductive interposer. The invention provides a lead frame material with a special composition, including: a lead frame base material is composed of materials selected from the group consisting of copper, copper alloy, and Fe-Ni alloy; a metal conductive interlayer is formed On this substrate, the paper is made of pure metal, the paper size is in accordance with Chinese National Standards (CNS) A4 (210X 297 male) ΓΓ printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economy (5 or metal alloys, the Selective metals Ni, Ag, w, Zn

Cr’ Mo ’ Cu’ Sn，A卜 Ta，c〇 ’ Nb 所組成之族群 n . 以及丫，一頂層貴金屬保護層，形成於該中介層上，译由名貝金屬或貴金屬合金所構成，該貴金屬為擇自由pt，Ir'， Re ’ Ru，和Rh所组成之族群中。本發明提供另一種特殊組成之種導線架材括： .，匕一導線架基材，係由擇自銅、銅合金、和Fe·妬^ 金所組成之族群中之材料所構成； 1口一金屬導電中介層，形成於該基材上，係由純金屬或金屬合金所構成，該金屬為擇自由Ag，w，Zn，^，Cr 'Mo' Cu 'Sn, A bu Ta, c 0' Nb group n. And ya, a top precious metal protective layer formed on the interlayer, the translation is composed of a famous metal or precious metal alloy, the Precious metals are in the group consisting of optional free pt, Ir ', Re' Ru, and Rh. The present invention provides another special type of lead frame material including:., A lead frame base material, composed of materials selected from the group consisting of copper, copper alloys, and Fe · Jin Jin; 1 mouth A metal conductive interposer is formed on the substrate and is composed of pure metal or metal alloy. The metal is selected from Ag, w, Zn, ^,

Mo ’ A卜Ta ’ Co ’和Nb所組成之族群中；以及一頂層貴金屬保護層，形成於該中介層上，係由純貝金屬或貝金屬合金所構成，該貴金屬為擇自由 Re，Ru，Rh，Pd ’ Au，和Ag所組成之族群中。目前IC導線架的製作上以濕式電鍍法為主，本專利提供一種新穎之1C導線架的製作方法，以真空鍍膜法取代-般傳統的澄式電錄法’因而，冗導線架表^鑛層可不受電鍍鍍層的限制，增加了鍍層材料的選擇性，而可有更多的鍍膜組合。本發明特殊組成之導線架材料包括三層，即導線架基材’形成於基材上之金屬導電中介層，以及形成於中介層上之頂層貴金屬保護層。導線架基材可由銅、銅合本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐）經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（6 ) 金、或Fe-Ni合金等材料所構成。由於金屬導電中介層和頂層貴金屬保護層是以真空鍍膜法而形成的，所以此兩層鍍膜的材料可不受電鍍鍍層的限制。詳而言之，藉由真空鍍膜法，除了傳統上以濕式電鍍法所能成長的Ni、Cu、Sn或其合金之外，還可以Ag、 W、Zn、Cr、Mo、Al、Ta、Co、或Nb等高熱傳導性與高導電性之元素或合金來作為中介層（buffer layer)材料。並且，除了傳統上以濕式電鍍法所能成長的Pd、 Au、Ag或其合金之外，還可以Pt、Ir、Re、Ru、Rh等高熱傳導性與高導電性之元素或合金來作為頂層（top layer)材料。此中介層鍍膜的目的在於增加金屬導電層之可焊接性（solderability)，增加金屬導電層附著性，並阻止銅基材的成份擴散至導線架表面而不利於打線強度（the strength of wire-bonding)。此表層鑛膜的目的在於增加導線架表面抗氧化、抗高溫腐蝕等作用。因此，本發明導線架材料的範圍，應包括任何可能形成之中介層配合本發明新開發之頂層的組合，以及本發明新開發之中介層配合任何可能形成之頂層的組合0 亦即，依據本發明之第一種特殊組成導線架材料，其中之金屬導電中介層可為Ni，Ag，W，Zn，Cr，Mo, Cu，Sn，Al，Ta，Co，Nb，或上述金屬之合金，而頂層貴金屬保護層可為Pt，Ir，Re，Ru，Rh，或上述金屬本紙張尺度適用中國國家標隼（CNS ) A4規格（210'乂297公釐〉 -----Γ--Ί----- (請先閱讀背面之注意事項再填寫本頁) 訂經濟部中夬檩準局員工消費合作社印製 A7 ~ '"** ' — — B7 五、發明説明(了1 ' --- 之合金。依據本發明之第二種特殊組成導線架材料，其中之金屬導電中介層可為Ag，w，Zn，Cr，M〇, nMo 'Abu Ta' Co 'and Nb; and a top precious metal protective layer formed on the interposer, which is composed of pure shell metal or shell metal alloy, the precious metal is optional free Re, Ru , Rh, Pd 'Au, and Ag. At present, the production of IC lead frames is mainly based on the wet plating method. This patent provides a novel 1C lead frame manufacturing method, which is replaced by the vacuum coating method-the traditional traditional clear recording method. Therefore, the redundant lead frame table ^ The ore layer is not limited by the electroplating coating, which increases the selectivity of the coating material, and can have more coating combinations. The special composition lead frame material of the present invention includes three layers, namely, a lead frame substrate ', a metal conductive interposer formed on the substrate, and a top precious metal protective layer formed on the interposer. The lead frame substrate can be made of copper or copper-coated paper. Applicable to the Chinese National Standard (CNS) A4 specification (21〇 < 297 mm). Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. A7 B7 5. Description of the invention (6 ) Made of gold or Fe-Ni alloy. Since the metal conductive interposer and the top precious metal protective layer are formed by a vacuum coating method, the materials of the two coatings are not limited by the plating coating. In detail, by the vacuum coating method, in addition to Ni, Cu, Sn or an alloy thereof that can be conventionally grown by wet plating, Ag, W, Zn, Cr, Mo, Al, Ta, Co or Nb and other elements or alloys with high thermal conductivity and high conductivity are used as the buffer layer material. In addition to Pd, Au, Ag, or alloys that can be grown conventionally by wet plating, Pt, Ir, Re, Ru, and Rh can be used as elements or alloys with high thermal conductivity and high conductivity. Top layer material. The purpose of this interposer coating is to increase the solderability of the metal conductive layer, increase the adhesion of the metal conductive layer, and prevent the components of the copper substrate from diffusing to the surface of the lead frame, which is not conducive to the strength of wire-bonding. ). The purpose of this surface layer mineral film is to increase the effects of oxidation resistance and high temperature corrosion resistance on the surface of the lead frame. Therefore, the scope of the lead frame material of the present invention should include any combination of a possible formation of an interposer with the newly developed top layer of the present invention, and a combination of the newly developed interposer with any of the possibly formed top layers. The first special composition lead frame material of the invention, wherein the metal conductive interposer may be Ni, Ag, W, Zn, Cr, Mo, Cu, Sn, Al, Ta, Co, Nb, or an alloy of the above metals, and The top precious metal protective layer can be Pt, Ir, Re, Ru, Rh, or the above metals. The paper size is applicable to China National Standard (CNS) A4 (210 '乂 297mm> ----- Γ--Ί- ---- (Please read the notes on the back before filling out this page) Order printed by the Consumers 'Cooperative of the China Prospective Bureau of the Ministry of Economic Affairs A7 ~' " ** '— — B7 V. Description of the invention (1'- -Alloy. According to the second special composition lead frame material of the present invention, the metal conductive interposer may be Ag, w, Zn, Cr, Mo, n

Co ’Nb’或上述金屬之合金，而頂層貴金屬保護層可為 Pt’Ir’Re，Ru，Rh，pd，Au，Ag，或上述金屬之合金。本發明所使用之真空鍍膜法可為物理氣相沈積法或化學氣相沈積法。例如，屬於物理氣相沈積法之真空錢鑛法（SpUttering)、真空蒸鍍法（Thermal evaporation) 或離子束鑛模法（I〇n beam deposition)等。屬於化學氣相沈積法之電漿化學氣相沈積法（piasma enhancecl cvd) 等。、本發明之金屬導電中介層和貴金屬保護層之厚度並不特別限定，例如金屬導電中介層之厚度可在〇〇5以 m至2.5 μ m之間，但不以2 5 " m為限；而貴金屬保護層之厚度可在100A至800A之間，但不以800A為限。習知以濕式電鍍法在導線架上鍍銅及鍍銀的製程，共有13道程序，如表一所示。而藉由本發明之真空錢膜法’鑛銀和鏡銅的程序可同時進行，因而可將溼式電鑛法的13道程序減少至5道程序，大幅降低ic導線架在製造過程產生缺陷的機率以提高生產良率。同時，排除氰化物等化學藥品的使用，對減少環境污染的傷害提供相當大的助益。此外，真空鍍膜法更具備有製程穩定，再現性與可靠度（reliability)佳，表面保護層厚本紙張尺度適用中國國家標準（CNS ) M規格（2丨〇χ297公釐） : .---Φ — (請先閲讀背面之注意事項再填寫本頁) 訂 -1Γ· 經濟部中央標隼局員工消費合作社印製 A7 B7 五、發明説明（8 ) 度需求低等優點。以下舉數個，實施例以說明本發明之方法、特徵、及優點，但並非用以限制本發明之範圍，本發明之範圍應以所附之申請專利範圍為準。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)Co'Nb 'or an alloy of the aforementioned metals, and the top precious metal protective layer may be Pt'Ir'Re, Ru, Rh, pd, Au, Ag, or an alloy of the aforementioned metals. The vacuum coating method used in the present invention may be a physical vapor deposition method or a chemical vapor deposition method. For example, the vacuum vapor deposit method (SpUttering), vacuum evaporation method (Thermal evaporation), or ion beam deposition method (Ion beam deposition), which are physical vapor deposition methods. Plasma chemical vapor deposition (piasma enhancecl cvd) is a chemical vapor deposition method. 2. The thickness of the metal conductive interposer and the precious metal protective layer of the present invention is not particularly limited. For example, the thickness of the metal conductive interposer can be between 0.05 and 2.5 μm, but not limited to 2 5 "m.; And the thickness of the precious metal protective layer can be between 100A and 800A, but not limited to 800A. There are 13 procedures for copper plating and silver plating on the lead frame by wet plating, as shown in Table 1. And by the vacuum money film method of the present invention, the procedures of mineral silver and mirror copper can be performed simultaneously, so the 13 procedures of the wet electric mining method can be reduced to 5 procedures, which greatly reduces the defects of the ic lead frame during the manufacturing process. Chance to improve production yield. At the same time, excluding the use of chemicals such as cyanide can provide considerable benefits in reducing the harm of environmental pollution. In addition, the vacuum coating method has more stable process, good reproducibility and reliability, and the thickness of the surface protection layer. The paper size applies the Chinese National Standard (CNS) M specification (2 丨〇χ297 mm): .--- Φ — (Please read the notes on the back before filling out this page) Order -1 Γ · Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of invention (8) Low degree of demand and other advantages. Several examples are given below to illustrate the methods, features, and advantages of the present invention, but are not intended to limit the scope of the present invention. The scope of the present invention should be based on the scope of the attached patent application. This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（9 ) 表一：濕式電鍍法與真空鍍膜法製作流程比較濕式電鍍法製作流程真空鍍膜法製作流程Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of Invention (9) Table 1: Comparison of Wet Plating Process and Vacuum Coating Process Manufacturing Process Wet Plating Process Manufacturing Process Vacuum Coating Process

(請先閲讀背面之注意事項再填寫本頁) 11 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（1〇 ) 實施例1-5 試片以TAMAC194銅基導線架為基材，其化學成分為 Fe2.l~2.6wt%, P0.015〜0.15wt%，Zn0.05〜0.2wt%， Pb0.03wt%以下，Cu97wt0/〇以上°表面經過脫月旨，酸洗與 .水洗之後，再經真空電漿表面清洗處理。將電漿處理過 .之試片放置於真空濺鍍系統之中，先鍍上一層Ni中介層（為一般濕式電鍍所常用者），厚度約1.5//m，再鍍上一層本發明新開發的Pt，Pt-Ir, Ir-Re, Ir-Ru, Rh等頂層鍍膜，厚度約500A，即完成整個表面保護膜鍍製過程。各實施例導線架材料之組成見表二所不。真空濺鍍鍍膜製程條件為：使用RF磁控濺鍍系統，Ar工作壓力為1 Omtorr。相關的分析如下所述：金屬導線架表面保護鍍膜之評估方式包括以下數種。（參考資料:US5,750,016) (A) 直接進行金線打線評估，觀察金線是否能附著於金屬導線架表面。打線條件：Wire bonding : thermosonic wire bonding.(Please read the precautions on the back before filling out this page) 11 This paper size applies Chinese National Standard (CNS) A4 (210X297 mm) A7 B7 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (1〇 ) Example 1-5 The test piece used TAMAC194 copper-based lead frame as the base material, and its chemical composition was Fe2.l ~ 2.6wt%, P0.015 ~ 0.15wt%, Zn0.05 ~ 0.2wt%, Pb0.03wt% In the following, the surface of Cu97wt0 / °° or more is subjected to vacuum cleaning, acid cleaning and water washing, and then subjected to vacuum plasma surface cleaning treatment. Plasma-treated test pieces were placed in a vacuum sputtering system. A Ni interposer (commonly used in general wet electroplating) was first plated to a thickness of about 1.5 // m, and then a new layer of the invention was plated. The developed top-layer coatings of Pt, Pt-Ir, Ir-Re, Ir-Ru, Rh, etc., have a thickness of about 500A, which completes the entire surface protection film plating process. The composition of the lead frame material of each embodiment is shown in Table 2. The vacuum sputtering coating process conditions are: using RF magnetron sputtering system, Ar working pressure is 1 Omtorr. The relevant analysis is as follows: The evaluation methods for the surface protection coating of metal lead frames include the following. (Reference: US5,750,016) (A) Conduct the gold wire evaluation directly and observe whether the gold wire can be attached to the surface of the metal lead frame. Wire bonding conditions: Wire bonding: thermosonic wire bonding.

Bonding wire :金線的直徑為25 /z m。Bonding wire: The diameter of the gold wire is 25 / z m.

Ball size :直徑為 75μιη。 (B) 在400°C大氣氣氛下烘烤2分鐘，在使用20X光學顯微鏡或目視觀察表面是否破損。包括鍍膜凸起 (blister or lifting)、剝離（peeling)或褪色（bleeding)等。 (C) 使用3M Tape #810附著性測試表面金屬導電層 12 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)Ball size: 75 μm in diameter. (B) Bake at 400 ° C for 2 minutes. Use a 20X optical microscope or visually observe the surface for damage. These include coated blister or lifting, peeling or bleeding. (C) Use 3M Tape # 810 adhesion test surface metal conductive layer 12 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)

發明説明附著性 Μ Β7 經濟部中央標準局員工消費合作社印製 (D)使用刮針畫出痕跡後使用光學顯微鏡觀察到痕外圍疋否出現片狀剝落（peeling 〇r Hfting)現象。結果發現（A)，（B), (C), (D)四項分析結果都良好。 t施例6-8 、步驟同實施例1-5,使用真空鍍膜法，但頂層鍍膜使用一般濕式電鍍法常用的Ag，Pd，Aud鍍膜組成=表三所示。結果發現（A)，（B)，（c)，(D)四項分析結果都良好。 ^由實施例6-8的分析結果可知，一般濕式電鍍法所常用的中介層（如Ni)及頂層（如Ag，pd，Au)，也可以使用本發明之真空鍍膜法來成長，效果很好。另外，由實靶例1-5的分析結果可知，由於本發明使用真空鍍膜法，頂層除一般濕式電鍍法所常用的之外，可有更多的 k擇)·生例如可使用Pt，Pt-Ir，Ir-Re, Ir-Ru，Rh等頂層鍵臈，效果亦很好。Description of the invention Adhesiveness Β7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (D) After using a scraper to draw a trace, observe the trace with an optical microscope and see if there is a peeling 〇r Hfting phenomenon on the periphery. It was found that the results of (A), (B), (C), (D) were all good. tExample 6-8. The steps are the same as those in Example 1-5. The vacuum coating method is used, but the top layer coating uses the composition of Ag, Pd, and Aud coating commonly used in general wet plating methods. It was found that the results of (A), (B), (c), (D) were all good. ^ From the analysis results of Examples 6-8, it can be known that the interposer (such as Ni) and the top layer (such as Ag, pd, Au) commonly used in general wet plating methods can also be grown using the vacuum coating method of the present invention. well. In addition, from the analysis results of real target examples 1-5, it can be known that the vacuum coating method is used in the present invention, and the top layer can have more k options than those commonly used in general wet plating methods). For example, Pt can be used. Pt-Ir, Ir-Re, Ir-Ru, Rh and other top bonds 臈 also work well.

f施例9-2.Q ' ~ — 步驟同實施例1-5,使用真空鍍膜法，基材除使用 Cu V線架外，亦使用Fe_Ni 42研％導線架，頂層固定為使用本發明新開發的pt七層，而中介層則使用一般濕式電鍍法常用的Cu，Sn，或使用本發明新開發明的w， Zn，Al，Cr，Mo, Ag，Ta，Co, Nb等。鍍膜組成如表四所示。結果發現(八)，@)，（〇，（〇)四項分析結果都良好。由實施例9-29的分析結果可知，中介層除一般濕式 , 13 - 本紙張尺度適财關家;(CNS)从雜（2lGx297公餐) -— - -----r — 一,---©I, (請先聞讀背面之注意事項再填寫本頁) 訂fExample 9-2.Q '~ — The steps are the same as those in Example 1-5. The vacuum coating method is used. In addition to the Cu V wire frame, the Fe_Ni 42% lead frame is also used for the substrate. The top layer is fixed to use the new invention. The developed pt has seven layers, and the interposer uses Cu, Sn commonly used in general wet electroplating, or w, Zn, Al, Cr, Mo, Ag, Ta, Co, Nb, etc., which are newly developed by the present invention. The coating composition is shown in Table IV. It was found that (eight), @), (〇, (〇) all four analysis results are good. From the analysis results of Examples 9-29, we can know that the interlayer is generally wet type, 13-this paper scale is suitable for financial affairs; (CNS) From Miscellaneous (2lGx297 Meal)-------- r — One, --- © I, (Please read the precautions on the back before filling this page) Order

887133 五、發明説明（, =之:如::本發明使用真空鍍膜法，可 c〇,Nb等中介層鍍棋，效果亦Ai，Cr，M°，Ag，Ta，雖然本發明p D & /+ Θ 以限定本發明，任何=揭露如上1其並非用、 °热^此項技藝者，在不脫離本發明之，神和In圍内，當可作更動與调•，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 -------—---— (請先聞讀背面之注意事項再填寫本頁) -訂經濟部中央標準局員工消費合作杜印製 14 本纸張尺度適用中國國豕標準（CNS ) /\規^ ( 210X297公釐 -_ 13 a? B7 五、發明説明（）表二實施例頂層中介層基材 1 Pt Ni Cu 2 Pt-Ir Ni Cu 3 Ir-Re Ni Cu 4 Ir-Ru Ni Cu . 5 Rh Ni Cu 表三實施例頂層中介層基材 6 Ag .Ni Cu 7 Pd Ni Cu 8 Au Ni Cu --------------# II (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製表四實施例頂層中介層基材 9 Pt-Ir Cu Fe-Ni . 10 Pt-Ir W Cu 11 Pt-Ir w Fe-Ni 12 Pt-Ir Zn Cu 13 Pt-Ir Zn Fe-Ni 14 Pt-Ir A1 Cu 15 Pt-Ir A1 Fe-Ni 16 Pt-Ir Cr Cu 17 Pt-Ir Cr Fe-Ni 18 Pt-Ir Mo Cu 19 Pt-Ir Mo Fe-Ni 20 Pt-Ir Ag Cu 21 Pt-Ir Ag Fe-Ni 22 Pt-Ir Sn Cu 23 Pt-Ir Sn Fe-Ni 24 Pt-Ir Ta Cu 25 Pt-Ir Ta Fe-Ni 26 Pt-Ir Co Cu 27 Pt-Ir Co Fe-Ni 28 Pt-Ir Nb Cu 29 Pt-Ir Nb Fe-Ni 15887133 V. Description of the invention (, = = such as: The present invention uses a vacuum coating method, which can be used for interlayers such as c0, Nb, and the effect is also Ai, Cr, M °, Ag, Ta, although the present invention p D & / + Θ to limit the present invention, any = to expose the above 1 which is not used, ° hot ^ This artisan can make changes and adjustments within the scope of God and In without departing from the present invention, so the present invention The scope of protection shall be determined by the scope of the attached patent application. ------------- (Please read the notes on the back before filling this page)-Order the Central Bureau of Standards of the Ministry of Economic Affairs Printed by the employee's consumer cooperation 14 This paper size is applicable to the Chinese National Standard (CNS) / \ Regulation ^ (210X297 mm-_ 13 a? B7 V. Description of the invention () Table 2 Example of the top interposer substrate 1 Pt Ni Cu 2 Pt-Ir Ni Cu 3 Ir-Re Ni Cu 4 Ir-Ru Ni Cu. 5 Rh Ni Cu Table 3 Examples of top interposer substrate 6 Ag. Ni Cu 7 Pd Ni Cu 8 Au Ni Cu --- ----------- # II (Please read the notes on the back before filling out this page) The Central Consumers Bureau of the Ministry of Economic Affairs prints a table of the fourth embodiment of the top intermediary layer Substrate 9 Pt-Ir Cu Fe-Ni. 10 Pt-Ir W Cu 11 Pt-Ir w Fe-Ni 12 Pt-Ir Zn Cu 13 Pt-Ir Zn Fe-Ni 14 Pt-Ir A1 Cu 15 Pt-Ir A1 Fe-Ni 16 Pt-Ir Cr Cu 17 Pt-Ir Cr Fe-Ni 18 Pt-Ir Mo Cu 19 Pt-Ir Mo Fe-Ni 20 Pt-Ir Ag Cu 21 Pt-Ir Ag Fe-Ni 22 Pt-Ir Sn Cu 23 Pt-Ir Sn Fe-Ni 24 Pt-Ir Ta Cu 25 Pt-Ir Ta Fe-Ni 26 Pt-Ir Co Cu 27 Pt-Ir Co Fe-Ni 28 Pt-Ir Nb Cu 29 Pt-Ir Nb Fe- Ni 15

1T 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）1T This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)

Claims

申請專利範圍經濟部中央標準局員工消費合作社印裂 L—種製造導線架材料的方法，包括· 以真空鍍膜法成長金屬導電材表面，^ 丨層在一導線架基 =面該基材為銅、銅合金、或Fe_Ni合金所形成；以真空鍍膜法成長頂層責金屬電中介層表面。屬保濩層在該金屬導 2·如申請專利範圍第i項所述之方法，其中該真空鍍膜法為使用物理氣相沈積法或化學氣相&積法。二 3. 如申請專利範圍第2項所述之方法，其中該真空鍍膜法為使用物理氣相沈積法。 ’ 4. 如申請專利範圍第3項所述之方法，其中該真空鍍膜法為真线㈣（SputteHng)，真Μ鍍法咖: evaP〇ration)，或離子束鍍膜法（I〇n beam⑽卜 5·如申請專利範圍第2項所述之方法，其中該真空鍍膜法為使用化學氣相沈積法。 6·如申請專利範圍第1項所述之方法，其中該金屬導電中介層為純金屬或金屬合金所形成，該金屬為擇自由 Ni ’ Ag ’ W，Zn ’ Cr ’ Mo，Cu，Sn，Al，Ta，Co，和Nb所組成之族群中。 7. 如申請專利範圍第1項所述之方法，其中該貴金屬為純貴金屬或貴金屬合金所形成’該貴金屬為擇自由 Pt，Ir，Re，Ru，Rh，Pd，Au，和Ag戶斤組成之族群中。 8. 如申請專利範圍第丨項所述之方法，其中該金屬導電中介層之厚度為0.05 " m至2.5以m之間。 16 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） ----τ^---------、钉-----'10 J (請先閲讀背面之注意事項再填寫本頁) SB7133Scope of patent application: A method for manufacturing lead frame materials by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, which includes the following steps: • Growing the surface of a metal conductive material by vacuum coating; , Copper alloy, or Fe_Ni alloy; vacuum coating method is used to grow the surface of the top layer of the metal interposer. The method for protecting the metal layer in the metal guide 2. The method as described in item i of the patent application range, wherein the vacuum coating method is a physical vapor deposition method or a chemical vapor deposition method. 2. The method according to item 2 of the scope of patent application, wherein the vacuum coating method is a physical vapor deposition method. '4. The method as described in item 3 of the scope of patent application, wherein the vacuum coating method is SputteHng, true M plating method: evaPoration), or ion beam coating method (Ion beam coating method) 5. The method according to item 2 in the scope of the patent application, wherein the vacuum coating method is a chemical vapor deposition method. 6. The method according to item 1 in the scope of the patent application, wherein the metal conductive interposer is a pure metal Or metal alloy, the metal is selected from the group consisting of Ni'Ag'W, Zn'Cr'Mo, Cu, Sn, Al, Ta, Co, and Nb. The method, wherein the noble metal is formed of pure noble metal or noble metal alloy, and the noble metal is selected from the group consisting of Pt, Ir, Re, Ru, Rh, Pd, Au, and Ag. 8. If applying for a patent The method described in the first item of the scope, wherein the thickness of the metal conductive interposer is between 0.05 and 2.5 and m. 16 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) --- -τ ^ ---------, nail ----- '10 J (Please read the back first Note to fill out this page) SB7133

8888 ABCD 經濟部中央標準局貞工消費合作社印製 9·如申請專利範圍第1項所述之方法屬保護層之厚度為100人至800人之間。 10· —種導線架材料，包括：一導線架基材，係由擇自銅、釦合金金所組成之族群中之材料所構成；一金屬導電中介層，形成於該基材上或金屬合金所構成，該金屬為擇自由Ni，二：屬 Cr，Mo，Cu，Sn，Al，Ta，、 Co，Nb所組成之族群中；以及一頂層貴金屬保護層，形成於該中介層上，係由純貴金屬或貴金屬合金所構成，該貴金屬為擇自由h士， Re ’ RU，和Rh所組成之族群中。 11·一種導線架材料，包括：一導線架基材，係由擇自銅、銅合金、和Fe_Ni合金所組成之族群中之材料所構成； " 一金屬導電中介層，形成於該基材上，係由純金屬或金屬合金所構成，該金屬為擇自由Ag，w，Zn，^， Mo ’ A1 ’ Ta ’ Co ’和Nb所組成之族群中；以及一頂層貴金屬保護層，形成於該中介層上，係由純貴金屬或貴金屬合金所構成，該貴金屬為擇自由pt，ir， Re，RU，Rh，Pd，Au，和Ag所組成之族群中。 12.如申請專利範圍第1〇或u項所述之導線架材料，其中該金屬導電中介層之厚度為〇〇5" m至2 m 之間。其中該貴金和Fe-Ni合係由純金屬 ----7-I^---·©-I (請先閲讀背面之注項再填寫本頁) 訂· 17 桃張从適用中國國家操準（CNS)入4胁（210x：297公楚 S87133 經濟部中央標準局員工消費合作社印篥 AS B8 C8 D8 六、申請專利範圍 13.如申請專利範圍第10或11項所述之導線架材料，其中該貴金屬保護層之厚度為100Α至800Α之間。 ----丨--IT|丨#1— (請先閱讀背面之注意事項再填寫本頁) 訂- 線 18 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）8888 ABCD Printed by Zhengong Consumer Cooperative, Central Bureau of Standards of the Ministry of Economic Affairs 9 · The method described in item 1 of the scope of patent application is a protective layer with a thickness of between 100 and 800 people. 10 · A lead frame material, including: a lead frame base material composed of a material selected from the group consisting of copper and buckle alloy gold; a metal conductive interposer formed on the base material or a metal alloy The metal is composed of selective Ni, two: Cr, Mo, Cu, Sn, Al, Ta, Co, and Nb; and a top precious metal protective layer formed on the interposer. It is composed of pure noble metal or noble metal alloy, and the noble metal is in the group consisting of selective freedom h, Re RU, and Rh. 11. A lead frame material, comprising: a lead frame substrate composed of a material selected from the group consisting of copper, copper alloy, and Fe_Ni alloy; " a metal conductive interposer formed on the substrate It is composed of pure metal or metal alloy. The metal is selected from the group consisting of Ag, w, Zn, ^, Mo 'A1' Ta 'Co' and Nb; and a top precious metal protective layer formed on The interposer is composed of pure noble metal or noble metal alloy, and the noble metal is selected from the group consisting of pt, ir, Re, RU, Rh, Pd, Au, and Ag. 12. The lead frame material according to item 10 or u of the scope of patent application, wherein the thickness of the metal conductive interposer is between 0.05 and 2 m. Among them, the precious gold and Fe-Ni combination is made of pure metal ---- 7-I ^ --- · © -I (Please read the note on the back before filling out this page) Order · 17 Tao Zhang from applicable Chinese countries CNS entry 4 threats (210x: 297 Gongchu S87133 Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, India, AS B8, C8, D8) 6. Scope of patent application 13. The lead frame as described in item 10 or 11 of the scope of patent application Material, in which the thickness of the precious metal protective layer is between 100A and 800A. ---- 丨 --IT | 丨 # 1— (Please read the precautions on the back before filling this page) Order-Line 18 This paper size applies China National Standard (CNS) A4 specification (210X297 mm)