TW374041B - Method for polishing semiconductor wafer and apparatus for cleaning and drying a semiconductor wafer - Google Patents
Method for polishing semiconductor wafer and apparatus for cleaning and drying a semiconductor waferInfo
- Publication number
- TW374041B TW374041B TW085107234A TW85107234A TW374041B TW 374041 B TW374041 B TW 374041B TW 085107234 A TW085107234 A TW 085107234A TW 85107234 A TW85107234 A TW 85107234A TW 374041 B TW374041 B TW 374041B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- polishing
- face
- cleaning
- drying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96303165A EP0805000A1 (en) | 1996-05-02 | 1996-05-02 | Semiconductor wafer post-polish clean and dry method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
TW374041B true TW374041B (en) | 1999-11-11 |
Family
ID=8224923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085107234A TW374041B (en) | 1996-05-02 | 1996-06-15 | Method for polishing semiconductor wafer and apparatus for cleaning and drying a semiconductor wafer |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0805000A1 (zh) |
TW (1) | TW374041B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19709217A1 (de) * | 1997-03-06 | 1998-09-10 | Wacker Siltronic Halbleitermat | Verfahren zur Behandlung einer polierten Halbleiterscheibe gleich nach Abschluß einer Politur der Halbleiterscheibe |
US6110011A (en) * | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
DE10052762A1 (de) | 2000-10-25 | 2002-05-16 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe |
EP1571694A4 (en) | 2002-12-10 | 2008-10-15 | Nikon Corp | EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE |
CN106271922B (zh) * | 2016-08-30 | 2018-05-25 | 重庆凯龙科技有限公司 | 用于隔热板的加工装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4178188A (en) * | 1977-09-14 | 1979-12-11 | Branson Ultrasonics Corporation | Method for cleaning workpieces by ultrasonic energy |
JPS608189B2 (ja) * | 1980-09-04 | 1985-03-01 | 三菱マテリアル株式会社 | 研磨装置 |
FR2505713A1 (fr) * | 1981-05-18 | 1982-11-19 | Procedes Equip Sciences Ind Sa | Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables |
JPH084105B2 (ja) * | 1987-06-19 | 1996-01-17 | 株式会社エンヤシステム | ウェハ接着方法 |
JP2655975B2 (ja) * | 1992-09-18 | 1997-09-24 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
-
1996
- 1996-05-02 EP EP96303165A patent/EP0805000A1/en not_active Withdrawn
- 1996-06-15 TW TW085107234A patent/TW374041B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0805000A1 (en) | 1997-11-05 |
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