TW358238B - Cavity filled metal electronic package - Google Patents

Cavity filled metal electronic package

Info

Publication number
TW358238B
TW358238B TW084104480A TW84104480A TW358238B TW 358238 B TW358238 B TW 358238B TW 084104480 A TW084104480 A TW 084104480A TW 84104480 A TW84104480 A TW 84104480A TW 358238 B TW358238 B TW 358238B
Authority
TW
Taiwan
Prior art keywords
electronic package
cavity
cavity filled
filled metal
lead frame
Prior art date
Application number
TW084104480A
Other languages
English (en)
Chinese (zh)
Inventor
Arvind Parthasarathi
Paul R Hoffman
Dexin Lianga
Deerak Mahulikar
Anthony M Pasqualoni
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of TW358238B publication Critical patent/TW358238B/zh

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Classifications

    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW084104480A 1994-04-05 1995-05-05 Cavity filled metal electronic package TW358238B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22320794A 1994-04-05 1994-04-05

Publications (1)

Publication Number Publication Date
TW358238B true TW358238B (en) 1999-05-11

Family

ID=22835525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084104480A TW358238B (en) 1994-04-05 1995-05-05 Cavity filled metal electronic package

Country Status (5)

Country Link
EP (1) EP0754350A4 (de)
JP (1) JPH09511617A (de)
AU (1) AU2103895A (de)
TW (1) TW358238B (de)
WO (1) WO1995027308A1 (de)

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US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
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US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
US9402319B2 (en) 2011-05-11 2016-07-26 Vlt, Inc. Panel-molded electronic assemblies
US10356946B2 (en) 2012-06-15 2019-07-16 Kaneka Corporation Heat dissipation structure
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9936580B1 (en) 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10158357B1 (en) 2016-04-05 2018-12-18 Vlt, Inc. Method and apparatus for delivering power to semiconductors
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads

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JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
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WO1995027308A1 (en) 1995-10-12
EP0754350A1 (de) 1997-01-22
JPH09511617A (ja) 1997-11-18
AU2103895A (en) 1995-10-23
EP0754350A4 (de) 1998-10-07

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