TW358238B - Cavity filled metal electronic package - Google Patents
Cavity filled metal electronic packageInfo
- Publication number
- TW358238B TW358238B TW084104480A TW84104480A TW358238B TW 358238 B TW358238 B TW 358238B TW 084104480 A TW084104480 A TW 084104480A TW 84104480 A TW84104480 A TW 84104480A TW 358238 B TW358238 B TW 358238B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic package
- cavity
- cavity filled
- filled metal
- lead frame
- Prior art date
Links
Classifications
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- H—ELECTRICITY
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22320794A | 1994-04-05 | 1994-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW358238B true TW358238B (en) | 1999-05-11 |
Family
ID=22835525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084104480A TW358238B (en) | 1994-04-05 | 1995-05-05 | Cavity filled metal electronic package |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0754350A4 (de) |
JP (1) | JPH09511617A (de) |
AU (1) | AU2103895A (de) |
TW (1) | TW358238B (de) |
WO (1) | WO1995027308A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4151207B2 (ja) * | 2000-08-10 | 2008-09-17 | 株式会社デンソー | 半導体装置 |
US6731001B2 (en) | 2000-08-10 | 2004-05-04 | Denso Corporation | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
US6782745B1 (en) * | 2003-02-21 | 2004-08-31 | Visteon Global Technologies, Inc. | Slosh supressor and heat sink |
US7157793B2 (en) * | 2003-11-12 | 2007-01-02 | U.S. Monolithics, L.L.C. | Direct contact semiconductor cooling |
US9112422B1 (en) | 2010-03-09 | 2015-08-18 | Vlt, Inc. | Fault tolerant power converter |
US8966747B2 (en) | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
US9402319B2 (en) | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
US10356946B2 (en) | 2012-06-15 | 2019-07-16 | Kaneka Corporation | Heat dissipation structure |
US9967984B1 (en) | 2015-01-14 | 2018-05-08 | Vlt, Inc. | Power adapter packaging |
US9936580B1 (en) | 2015-01-14 | 2018-04-03 | Vlt, Inc. | Method of forming an electrical connection to an electronic module |
US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2502511B2 (ja) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | 半導体装置の製造方法 |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
US5098864A (en) * | 1989-11-29 | 1992-03-24 | Olin Corporation | Process for manufacturing a metal pin grid array package |
US5134462A (en) * | 1990-08-27 | 1992-07-28 | Motorola, Inc. | Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate |
NO911774D0 (no) * | 1991-05-06 | 1991-05-06 | Sensonor As | Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme. |
JP2827684B2 (ja) * | 1992-03-17 | 1998-11-25 | 日本電気株式会社 | 半導体装置 |
US5239131A (en) * | 1992-07-13 | 1993-08-24 | Olin Corporation | Electronic package having controlled epoxy flow |
US5324888A (en) * | 1992-10-13 | 1994-06-28 | Olin Corporation | Metal electronic package with reduced seal width |
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1995
- 1995-03-20 JP JP7525729A patent/JPH09511617A/ja active Pending
- 1995-03-20 EP EP95913778A patent/EP0754350A4/de not_active Withdrawn
- 1995-03-20 AU AU21038/95A patent/AU2103895A/en not_active Abandoned
- 1995-03-20 WO PCT/US1995/003468 patent/WO1995027308A1/en not_active Application Discontinuation
- 1995-05-05 TW TW084104480A patent/TW358238B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO1995027308A1 (en) | 1995-10-12 |
EP0754350A1 (de) | 1997-01-22 |
JPH09511617A (ja) | 1997-11-18 |
AU2103895A (en) | 1995-10-23 |
EP0754350A4 (de) | 1998-10-07 |
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