EP0754350A4 - Metallgefüllter hohlraum für elektronische packung - Google Patents

Metallgefüllter hohlraum für elektronische packung

Info

Publication number
EP0754350A4
EP0754350A4 EP95913778A EP95913778A EP0754350A4 EP 0754350 A4 EP0754350 A4 EP 0754350A4 EP 95913778 A EP95913778 A EP 95913778A EP 95913778 A EP95913778 A EP 95913778A EP 0754350 A4 EP0754350 A4 EP 0754350A4
Authority
EP
European Patent Office
Prior art keywords
electronic package
package
cavity
base
leadframe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95913778A
Other languages
English (en)
French (fr)
Other versions
EP0754350A1 (de
Inventor
Arvind Parthasarathi
Paul R Hoffman
Dexin Liang
Deepak Mahulikar
Anthony M Pasqualoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of EP0754350A1 publication Critical patent/EP0754350A1/de
Publication of EP0754350A4 publication Critical patent/EP0754350A4/de
Withdrawn legal-status Critical Current

Links

Classifications

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/293—Organic, e.g. plastic
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP95913778A 1994-04-05 1995-03-20 Metallgefüllter hohlraum für elektronische packung Withdrawn EP0754350A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22320794A 1994-04-05 1994-04-05
PCT/US1995/003468 WO1995027308A1 (en) 1994-04-05 1995-03-20 Cavity filled metal electronic package
US223207 2002-08-19

Publications (2)

Publication Number Publication Date
EP0754350A1 EP0754350A1 (de) 1997-01-22
EP0754350A4 true EP0754350A4 (de) 1998-10-07

Family

ID=22835525

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95913778A Withdrawn EP0754350A4 (de) 1994-04-05 1995-03-20 Metallgefüllter hohlraum für elektronische packung

Country Status (5)

Country Link
EP (1) EP0754350A4 (de)
JP (1) JPH09511617A (de)
AU (1) AU2103895A (de)
TW (1) TW358238B (de)
WO (1) WO1995027308A1 (de)

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US6731001B2 (en) 2000-08-10 2004-05-04 Denso Corporation Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
JP4151207B2 (ja) * 2000-08-10 2008-09-17 株式会社デンソー 半導体装置
US6782745B1 (en) * 2003-02-21 2004-08-31 Visteon Global Technologies, Inc. Slosh supressor and heat sink
US7157793B2 (en) 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
US9112422B1 (en) 2010-03-09 2015-08-18 Vlt, Inc. Fault tolerant power converter
US9402319B2 (en) 2011-05-11 2016-07-26 Vlt, Inc. Panel-molded electronic assemblies
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
KR20150023710A (ko) 2012-06-15 2015-03-05 가부시키가이샤 가네카 방열 구조체
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9936580B1 (en) 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
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AU2103895A (en) 1995-10-23
TW358238B (en) 1999-05-11
JPH09511617A (ja) 1997-11-18
EP0754350A1 (de) 1997-01-22
WO1995027308A1 (en) 1995-10-12

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