TW357181B - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- TW357181B TW357181B TW085110085A TW85110085A TW357181B TW 357181 B TW357181 B TW 357181B TW 085110085 A TW085110085 A TW 085110085A TW 85110085 A TW85110085 A TW 85110085A TW 357181 B TW357181 B TW 357181B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- inorganic filler
- comprizes
- alumina
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17326795 | 1995-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW357181B true TW357181B (en) | 1999-05-01 |
Family
ID=15957287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085110085A TW357181B (en) | 1995-07-10 | 1996-08-19 | Epoxy resin composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US5854316A (zh) |
EP (1) | EP0780436A4 (zh) |
KR (1) | KR100388141B1 (zh) |
AU (1) | AU6368996A (zh) |
TW (1) | TW357181B (zh) |
WO (1) | WO1997003129A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10176036A (ja) * | 1996-12-19 | 1998-06-30 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH10195179A (ja) * | 1997-01-08 | 1998-07-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP3349963B2 (ja) * | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
JP2000239542A (ja) * | 1999-02-18 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法 |
WO2000055254A1 (de) * | 1999-03-16 | 2000-09-21 | Vantico Ag | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
KR100359904B1 (ko) * | 2000-09-04 | 2002-11-07 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
US20090065358A1 (en) * | 2006-12-20 | 2009-03-12 | Yamaha Hatsudoki Kabushiki Kaisha | Oxygen sensor, and internal combustion engine and transport apparatus provided with the oxygen sensor |
US20110221017A1 (en) * | 2008-11-07 | 2011-09-15 | Sumitomo Bakelite Company, Ltd. | Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
JP5555639B2 (ja) * | 2008-12-22 | 2014-07-23 | 電気化学工業株式会社 | 粉末、その製造方法、及びその粉末を含む樹脂組成物 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58225120A (ja) * | 1982-06-25 | 1983-12-27 | Mitsubishi Gas Chem Co Inc | 半導体封止用エポキシ樹脂組成物 |
JPS6084361A (ja) * | 1983-10-15 | 1985-05-13 | Matsushita Electric Works Ltd | 樹脂組成物 |
JPS6164756A (ja) * | 1984-09-05 | 1986-04-03 | Nippon Steel Corp | 無機充填熱硬化性樹脂組成物 |
JPS61203121A (ja) * | 1985-03-06 | 1986-09-09 | Fujitsu Ltd | 半導体封止用エポキシ樹脂組成物 |
JPS63160254A (ja) * | 1986-12-23 | 1988-07-04 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPS63183915A (ja) * | 1987-01-26 | 1988-07-29 | Matsushita Electric Works Ltd | 高熱放散性エポキシ樹脂組成物 |
JPS63299151A (ja) * | 1987-05-28 | 1988-12-06 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPH01109753A (ja) * | 1987-10-23 | 1989-04-26 | Hitachi Ltd | 半導体装置 |
US5056214A (en) * | 1989-12-19 | 1991-10-15 | Mark Iv Industries, Inc | Method of making a molded transformer enclosure |
JPH04188855A (ja) * | 1990-11-22 | 1992-07-07 | Nitto Denko Corp | 半導体装置 |
US5362775A (en) * | 1991-03-27 | 1994-11-08 | Nippondenso Co., Ltd. | Epoxy resin composition and cured product thereof |
JP2501143B2 (ja) * | 1991-04-26 | 1996-05-29 | 東レ株式会社 | 半導体封止用エポキシ樹脂組成物 |
JP2862718B2 (ja) * | 1991-05-20 | 1999-03-03 | 日東電工株式会社 | 半導体装置 |
EP0544618A1 (de) * | 1991-11-27 | 1993-06-02 | Ciba-Geigy Ag | Hochgefüllte Epoxid-Giessharzmassen |
JPH06240111A (ja) * | 1993-02-15 | 1994-08-30 | Matsushita Electric Ind Co Ltd | 電子部品封止用エポキシ樹脂組成物 |
JP2874089B2 (ja) * | 1994-04-13 | 1999-03-24 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
JPH0827251A (ja) * | 1994-07-15 | 1996-01-30 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
-
1996
- 1996-07-10 AU AU63689/96A patent/AU6368996A/en not_active Abandoned
- 1996-07-10 US US08/793,460 patent/US5854316A/en not_active Expired - Lifetime
- 1996-07-10 EP EP96923051A patent/EP0780436A4/en not_active Withdrawn
- 1996-07-10 KR KR1019970701560A patent/KR100388141B1/ko not_active IP Right Cessation
- 1996-07-10 WO PCT/JP1996/001919 patent/WO1997003129A1/ja not_active Application Discontinuation
- 1996-08-19 TW TW085110085A patent/TW357181B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970705609A (ko) | 1997-10-09 |
EP0780436A1 (en) | 1997-06-25 |
AU6368996A (en) | 1997-02-10 |
KR100388141B1 (ko) | 2003-10-17 |
WO1997003129A1 (en) | 1997-01-30 |
US5854316A (en) | 1998-12-29 |
EP0780436A4 (en) | 2000-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EG19657A (en) | Hair conditioning compositions with silicone conditioning agent containing silicone resin | |
GR3015316T3 (en) | Polypropylene resin composition. | |
AU1633988A (en) | Tree resistant compositions | |
EP0388037A3 (en) | Low density self-extinguishing epoxide composition | |
CA2063819A1 (en) | Chewing gum composition with accelerated, controlled release of active agents | |
DE69533358D1 (de) | Härtbare zusammensetzungen | |
ES8405612A1 (es) | Procedimiento de preparar composiciones cosmeticas de maquillaje | |
GEP20022822B (en) | Process for Preparing Derivatives of the Taxoid Family | |
IN165233B (zh) | ||
GB0123572D0 (en) | Polymer compositions | |
TW357181B (en) | Epoxy resin composition | |
GR3003622T3 (zh) | ||
TW349000B (en) | Fungicidal two-component composition based on R-metalaxyl and usage thereof | |
MY107113A (en) | Epoxy resin composition for semiconductor sealing. | |
EP0789055A4 (en) | POLYOXYMETHYLENE RESIN COMPOSITION | |
EP0292004A3 (en) | Aqueous coating composition | |
AU591772B2 (en) | Substituted oxime-ethers and their use as bioregulators to lower the endogenous ethylene level in plants | |
EP0206544A3 (en) | Instantaneously curable composition | |
ES2074249T3 (es) | Compuesto tetra-n-glicidilo y mezclas reticulables del mismo. | |
ZA982513B (en) | Chemical compositions | |
BR9814730A (pt) | Composição polimerizável lìquida substancialmente sem gel | |
AU3546597A (en) | Stabilised and buffered hydrogen peroxide solution, method for making same and use thereof for decontaminating contact lenses | |
JPS57195136A (en) | Ionomer resin composition reinforced with aromatic polyamide fiber | |
AU2459195A (en) | Photopolymerizable composition | |
JPS56166259A (en) | Resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |