TW347482B - Apparatus and method for bonding tape - Google Patents
Apparatus and method for bonding tapeInfo
- Publication number
- TW347482B TW347482B TW084110234A TW84110234A TW347482B TW 347482 B TW347482 B TW 347482B TW 084110234 A TW084110234 A TW 084110234A TW 84110234 A TW84110234 A TW 84110234A TW 347482 B TW347482 B TW 347482B
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- length
- anisotropically electroconductive
- anisotropically
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6236892A JP3060850B2 (ja) | 1994-09-30 | 1994-09-30 | 異方性導電テープの圧着方法 |
JP24279094A JP3206331B2 (ja) | 1994-10-06 | 1994-10-06 | 異方性導電テープの貼着装置及び異方性導電テープの貼着方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW347482B true TW347482B (en) | 1998-12-11 |
Family
ID=26532926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084110234A TW347482B (en) | 1994-09-30 | 1995-09-30 | Apparatus and method for bonding tape |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100285171B1 (ko) |
TW (1) | TW347482B (ko) |
WO (1) | WO1996010838A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5698443A (en) * | 1995-06-27 | 1997-12-16 | Calydon, Inc. | Tissue specific viral vectors |
US6676935B2 (en) | 1995-06-27 | 2004-01-13 | Cell Genesys, Inc. | Tissue specific adenoviral vectors |
JP3704502B2 (ja) | 2002-01-15 | 2005-10-12 | 松下電器産業株式会社 | 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02293721A (ja) * | 1989-05-08 | 1990-12-04 | Sharp Corp | 異方性導電膜貼り付け方法 |
JP3045427B2 (ja) * | 1992-06-22 | 2000-05-29 | ソニー株式会社 | 異方性導電膜の貼付け方法および装置 |
JP2769263B2 (ja) * | 1992-06-22 | 1998-06-25 | ケル株式会社 | 転写用異方性接着剤テープの作成方法および装置 |
-
1995
- 1995-09-28 KR KR1019970702108A patent/KR100285171B1/ko not_active IP Right Cessation
- 1995-09-28 WO PCT/JP1995/001964 patent/WO1996010838A1/en not_active Application Discontinuation
- 1995-09-30 TW TW084110234A patent/TW347482B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100285171B1 (ko) | 2001-03-15 |
KR970706601A (ko) | 1997-11-03 |
WO1996010838A1 (en) | 1996-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |