TW268020B - - Google Patents

Info

Publication number
TW268020B
TW268020B TW082109439A TW82109439A TW268020B TW 268020 B TW268020 B TW 268020B TW 082109439 A TW082109439 A TW 082109439A TW 82109439 A TW82109439 A TW 82109439A TW 268020 B TW268020 B TW 268020B
Authority
TW
Taiwan
Application number
TW082109439A
Original Assignee
Doconitele Silicon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18314945&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW268020(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Doconitele Silicon Kk filed Critical Doconitele Silicon Kk
Application granted granted Critical
Publication of TW268020B publication Critical patent/TW268020B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/32—Post-polymerisation treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/32—Post-polymerisation treatment
    • C08G77/36—Fractionation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
TW082109439A 1992-11-24 1993-11-10 TW268020B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33810392A JP3153367B2 (ja) 1992-11-24 1992-11-24 ポリハイドロジェンシルセスキオキサンの分子量分別方法

Publications (1)

Publication Number Publication Date
TW268020B true TW268020B (zh) 1996-01-11

Family

ID=18314945

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082109439A TW268020B (zh) 1992-11-24 1993-11-10

Country Status (5)

Country Link
US (2) US5416190A (zh)
EP (1) EP0599209A3 (zh)
JP (1) JP3153367B2 (zh)
KR (1) KR100257799B1 (zh)
TW (1) TW268020B (zh)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3465314B2 (ja) * 1993-02-23 2003-11-10 富士通株式会社 弗素含有水素シルセスキオキサンポリマーおよびその製造方法
JPH08245792A (ja) * 1995-03-10 1996-09-24 Mitsubishi Electric Corp シリコーンラダーポリマー、シリコーンラダープレポリマーおよびそれらの製造方法
US5776235A (en) * 1996-10-04 1998-07-07 Dow Corning Corporation Thick opaque ceramic coatings
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
US5807611A (en) * 1996-10-04 1998-09-15 Dow Corning Corporation Electronic coatings
US5707681A (en) * 1997-02-07 1998-01-13 Dow Corning Corporation Method of producing coatings on electronic substrates
JP3415741B2 (ja) * 1997-03-31 2003-06-09 東レ・ダウコーニング・シリコーン株式会社 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法
US6015457A (en) * 1997-04-21 2000-01-18 Alliedsignal Inc. Stable inorganic polymers
US6218497B1 (en) * 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6743856B1 (en) 1997-04-21 2004-06-01 Honeywell International Inc. Synthesis of siloxane resins
US6043330A (en) * 1997-04-21 2000-03-28 Alliedsignal Inc. Synthesis of siloxane resins
US6143855A (en) 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US5866197A (en) * 1997-06-06 1999-02-02 Dow Corning Corporation Method for producing thick crack-free coating from hydrogen silsequioxane resin
TW392288B (en) 1997-06-06 2000-06-01 Dow Corning Thermally stable dielectric coatings
SG71147A1 (en) 1997-08-29 2000-03-21 Dow Corning Toray Silicone Method for forming insulating thin films
JP3729226B2 (ja) * 1997-09-17 2005-12-21 富士通株式会社 半導体集積回路装置及びその製造方法
US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
US6218020B1 (en) 1999-01-07 2001-04-17 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with high organic content
US5906859A (en) * 1998-07-10 1999-05-25 Dow Corning Corporation Method for producing low dielectric coatings from hydrogen silsequioxane resin
JP3543669B2 (ja) 1999-03-31 2004-07-14 信越化学工業株式会社 絶縁膜形成用塗布液及び絶縁膜の形成方法
US6440550B1 (en) 1999-10-18 2002-08-27 Honeywell International Inc. Deposition of fluorosilsesquioxane films
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6572974B1 (en) 1999-12-06 2003-06-03 The Regents Of The University Of Michigan Modification of infrared reflectivity using silicon dioxide thin films derived from silsesquioxane resins
US7011868B2 (en) * 2000-03-20 2006-03-14 Axcelis Technologies, Inc. Fluorine-free plasma curing process for porous low-k materials
US6759098B2 (en) 2000-03-20 2004-07-06 Axcelis Technologies, Inc. Plasma curing of MSQ-based porous low-k film materials
US6576300B1 (en) 2000-03-20 2003-06-10 Dow Corning Corporation High modulus, low dielectric constant coatings
US6558755B2 (en) 2000-03-20 2003-05-06 Dow Corning Corporation Plasma curing process for porous silica thin film
US6913796B2 (en) * 2000-03-20 2005-07-05 Axcelis Technologies, Inc. Plasma curing process for porous low-k materials
US6518357B1 (en) 2000-10-04 2003-02-11 General Electric Company Flame retardant polycarbonate-silsesquioxane compositions, method for making and articles made thereby
US6399210B1 (en) 2000-11-27 2002-06-04 Dow Corning Corporation Alkoxyhydridosiloxane resins
US7307137B2 (en) * 2001-07-05 2007-12-11 Honeywell International Inc. Low dielectric constant materials and methods of preparation thereof
US6756085B2 (en) * 2001-09-14 2004-06-29 Axcelis Technologies, Inc. Ultraviolet curing processes for advanced low-k materials
US20030194445A1 (en) * 2001-11-12 2003-10-16 Kuhner Carla H. Compositions and methods of use of peptides in combination with biocides and/or germicides
US20040247896A1 (en) * 2001-12-31 2004-12-09 Paul Apen Organic compositions
US6596821B1 (en) * 2002-03-05 2003-07-22 Dow Corning Corporation Hydrosilyation cured silicone resins obtained by fractionation
CN1285970C (zh) * 2003-06-03 2006-11-22 三井化学株式会社 布线保护膜形成用组合物及其用途
JP2005187381A (ja) * 2003-12-25 2005-07-14 Asahi Kasei Corp ケイ素化合物の精製法
US20050215713A1 (en) * 2004-03-26 2005-09-29 Hessell Edward T Method of producing a crosslinked coating in the manufacture of integrated circuits
KR101247545B1 (ko) 2004-11-02 2013-03-26 다우 코닝 코포레이션 레지스트 조성물
US7803668B2 (en) * 2006-02-24 2010-09-28 Stmicroelectronics (Crolles 2) Sas Transistor and fabrication process
KR101293937B1 (ko) * 2006-06-28 2013-08-09 다우 코닝 코포레이션 전자 유인성 관능 그룹을 갖는 염기 첨가제를 함유한 실세스퀴옥산 수지 시스템
KR101216060B1 (ko) 2006-06-28 2012-12-28 도쿄 오카 고교 가부시키가이샤 전자 유인성 관능 그룹을 갖는 염기 첨가제를 함유한 실세스퀴옥산 수지 시스템
TWI432895B (zh) * 2010-12-01 2014-04-01 Chi Mei Corp 感光性聚矽氧烷組成物及其所形成之基材保護膜
JP6557248B2 (ja) 2014-04-09 2019-08-07 ダウ シリコーンズ コーポレーション 疎水性物品
KR20160142838A (ko) 2014-04-09 2016-12-13 다우 코닝 코포레이션 광학 요소
WO2016204014A1 (ja) * 2015-06-17 2016-12-22 株式会社ダイセル 硬化性組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615272A (en) * 1968-11-04 1971-10-26 Dow Corning Condensed soluble hydrogensilsesquioxane resin
JPS59189126A (ja) * 1983-04-13 1984-10-26 Fujitsu Ltd ポリジハイドロジエンシロキサンの製造方法
JPS6042426A (ja) * 1983-08-19 1985-03-06 Fujitsu Ltd ポリジハイドロジェンシロキサンの製法
JPS6086017A (ja) * 1983-10-17 1985-05-15 Fujitsu Ltd ポリハイドロジエンシルセスキオキサンの製法
JP2513595B2 (ja) * 1984-11-28 1996-07-03 富士通株式会社 ラダ−型シリコン樹脂の分子量分別法
US4808653A (en) * 1986-12-04 1989-02-28 Dow Corning Corporation Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors
IT1241077B (it) * 1990-03-22 1993-12-29 Donegani Guido Ist Procedimento per il frazionamento in continuo di polimeri ed apparecchiatura adatta allo scopo
US5091162A (en) * 1990-10-01 1992-02-25 Dow Corning Corporation Perhydrosiloxane copolymers and their use as coating materials
US5063267A (en) * 1990-11-28 1991-11-05 Dow Corning Corporation Hydrogen silsesquioxane resin fractions and their use as coating materials
US5165955A (en) * 1991-05-28 1992-11-24 Dow Corning Corporation Method of depositing a coating containing silicon and oxygen
US5310583A (en) * 1992-11-02 1994-05-10 Dow Corning Corporation Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide

Also Published As

Publication number Publication date
KR100257799B1 (ko) 2000-06-01
EP0599209A3 (en) 1995-03-15
KR940011528A (ko) 1994-06-21
US5416190A (en) 1995-05-16
EP0599209A2 (en) 1994-06-01
JPH06157760A (ja) 1994-06-07
US5486564A (en) 1996-01-23
JP3153367B2 (ja) 2001-04-09

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