TW267268B - A patterned mirror vcsel with adjustable selective etch region - Google Patents
A patterned mirror vcsel with adjustable selective etch regionInfo
- Publication number
- TW267268B TW267268B TW084105207A TW84105207A TW267268B TW 267268 B TW267268 B TW 267268B TW 084105207 A TW084105207 A TW 084105207A TW 84105207 A TW84105207 A TW 84105207A TW 267268 B TW267268 B TW 267268B
- Authority
- TW
- Taiwan
- Prior art keywords
- selective etch
- mirror stack
- forming
- etch region
- patterned mirror
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18322—Position of the structure
- H01S5/18327—Structure being part of a DBR
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
- H01S5/209—Methods of obtaining the confinement using special etching techniques special etch stop layers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/261,272 US5557626A (en) | 1994-06-15 | 1994-06-15 | Patterned mirror VCSEL with adjustable selective etch region |
Publications (1)
Publication Number | Publication Date |
---|---|
TW267268B true TW267268B (en) | 1996-01-01 |
Family
ID=22992583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084105207A TW267268B (en) | 1994-06-15 | 1995-05-24 | A patterned mirror vcsel with adjustable selective etch region |
Country Status (4)
Country | Link |
---|---|
US (1) | US5557626A (zh) |
JP (1) | JP3745795B2 (zh) |
KR (1) | KR100341946B1 (zh) |
TW (1) | TW267268B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112567503A (zh) * | 2018-07-20 | 2021-03-26 | 牛津仪器纳米技术工具有限公司 | 半导体蚀刻方法 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5832017A (en) * | 1996-03-15 | 1998-11-03 | Motorola Inc | Reliable near IR VCSEL |
US5719892A (en) * | 1996-04-23 | 1998-02-17 | Motorola, Inc. | Hybrid mirror structure for a visible emitting VCSEL |
US5838705A (en) * | 1996-11-04 | 1998-11-17 | Motorola, Inc. | Light emitting device having a defect inhibition layer |
US6111902A (en) * | 1997-05-09 | 2000-08-29 | The Trustees Of Princeton University | Organic semiconductor laser |
US6160828A (en) * | 1997-07-18 | 2000-12-12 | The Trustees Of Princeton University | Organic vertical-cavity surface-emitting laser |
US6330262B1 (en) | 1997-05-09 | 2001-12-11 | The Trustees Of Princeton University | Organic semiconductor lasers |
US6061380A (en) * | 1997-09-15 | 2000-05-09 | Motorola, Inc. | Vertical cavity surface emitting laser with doped active region and method of fabrication |
US6044100A (en) * | 1997-12-23 | 2000-03-28 | Lucent Technologies Inc. | Lateral injection VCSEL |
US6117699A (en) * | 1998-04-10 | 2000-09-12 | Hewlett-Packard Company | Monolithic multiple wavelength VCSEL array |
US6327293B1 (en) * | 1998-08-12 | 2001-12-04 | Coherent, Inc. | Optically-pumped external-mirror vertical-cavity semiconductor-laser |
US7286585B2 (en) * | 1998-12-21 | 2007-10-23 | Finisar Corporation | Low temperature grown layers with migration enhanced epitaxy adjacent to an InGaAsN(Sb) based active region |
US6990135B2 (en) * | 2002-10-28 | 2006-01-24 | Finisar Corporation | Distributed bragg reflector for optoelectronic device |
US6905900B1 (en) | 2000-11-28 | 2005-06-14 | Finisar Corporation | Versatile method and system for single mode VCSELs |
US7065124B2 (en) | 2000-11-28 | 2006-06-20 | Finlsar Corporation | Electron affinity engineered VCSELs |
US6836501B2 (en) * | 2000-12-29 | 2004-12-28 | Finisar Corporation | Resonant reflector for increased wavelength and polarization control |
US6782027B2 (en) | 2000-12-29 | 2004-08-24 | Finisar Corporation | Resonant reflector for use with optoelectronic devices |
US6727520B2 (en) * | 2000-12-29 | 2004-04-27 | Honeywell International Inc. | Spatially modulated reflector for an optoelectronic device |
TWI227799B (en) * | 2000-12-29 | 2005-02-11 | Honeywell Int Inc | Resonant reflector for increased wavelength and polarization control |
US6606199B2 (en) | 2001-10-10 | 2003-08-12 | Honeywell International Inc. | Graded thickness optical element and method of manufacture therefor |
EP1468476A1 (de) * | 2002-01-25 | 2004-10-20 | Infineon Technologies AG | Laserdiode mit vertikalresonator und verfahren zu siener herstellung |
US6965626B2 (en) | 2002-09-03 | 2005-11-15 | Finisar Corporation | Single mode VCSEL |
US6987791B2 (en) * | 2002-10-30 | 2006-01-17 | Finisar Corporation | Long wavelength vertical cavity surface emitting lasers |
US7170916B2 (en) * | 2002-10-30 | 2007-01-30 | Finisar Corporation | Selectively etchable heterogeneous composite distributed Bragg reflector |
US6813293B2 (en) * | 2002-11-21 | 2004-11-02 | Finisar Corporation | Long wavelength VCSEL with tunnel junction, and implant |
JP4069383B2 (ja) * | 2003-03-18 | 2008-04-02 | 富士ゼロックス株式会社 | 表面発光型半導体レーザおよびその製造方法 |
US20040222363A1 (en) * | 2003-05-07 | 2004-11-11 | Honeywell International Inc. | Connectorized optical component misalignment detection system |
US7298942B2 (en) | 2003-06-06 | 2007-11-20 | Finisar Corporation | Pluggable optical optic system having a lens fiber stop |
US7433381B2 (en) | 2003-06-25 | 2008-10-07 | Finisar Corporation | InP based long wavelength VCSEL |
US7054345B2 (en) | 2003-06-27 | 2006-05-30 | Finisar Corporation | Enhanced lateral oxidation |
US7075962B2 (en) | 2003-06-27 | 2006-07-11 | Finisar Corporation | VCSEL having thermal management |
US7277461B2 (en) | 2003-06-27 | 2007-10-02 | Finisar Corporation | Dielectric VCSEL gain guide |
US6961489B2 (en) | 2003-06-30 | 2005-11-01 | Finisar Corporation | High speed optical system |
US7149383B2 (en) | 2003-06-30 | 2006-12-12 | Finisar Corporation | Optical system with reduced back reflection |
US7210857B2 (en) | 2003-07-16 | 2007-05-01 | Finisar Corporation | Optical coupling system |
US20050013539A1 (en) * | 2003-07-17 | 2005-01-20 | Honeywell International Inc. | Optical coupling system |
US6887801B2 (en) * | 2003-07-18 | 2005-05-03 | Finisar Corporation | Edge bead control method and apparatus |
US7031363B2 (en) | 2003-10-29 | 2006-04-18 | Finisar Corporation | Long wavelength VCSEL device processing |
US7125733B2 (en) * | 2004-01-13 | 2006-10-24 | Infineon Technologies Ag | Method for producing an optical emission module having at least two vertically emitting lasers |
US20050201436A1 (en) * | 2004-03-15 | 2005-09-15 | Doug Collins | Method for processing oxide-confined VCSEL semiconductor devices |
US7372886B2 (en) * | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
US7920612B2 (en) * | 2004-08-31 | 2011-04-05 | Finisar Corporation | Light emitting semiconductor device having an electrical confinement barrier near the active region |
US7829912B2 (en) * | 2006-07-31 | 2010-11-09 | Finisar Corporation | Efficient carrier injection in a semiconductor device |
US7596165B2 (en) * | 2004-08-31 | 2009-09-29 | Finisar Corporation | Distributed Bragg Reflector for optoelectronic device |
CN101432936B (zh) | 2004-10-01 | 2011-02-02 | 菲尼萨公司 | 具有多顶侧接触的垂直腔面发射激光器 |
US7860137B2 (en) | 2004-10-01 | 2010-12-28 | Finisar Corporation | Vertical cavity surface emitting laser with undoped top mirror |
JP5005937B2 (ja) * | 2006-03-24 | 2012-08-22 | 古河電気工業株式会社 | 面発光レーザ素子 |
US7505503B2 (en) * | 2007-02-23 | 2009-03-17 | Cosemi Technologies, Inc. | Vertical cavity surface emitting laser (VCSEL) and related method |
US8031752B1 (en) | 2007-04-16 | 2011-10-04 | Finisar Corporation | VCSEL optimized for high speed data |
JP5212686B2 (ja) * | 2007-08-22 | 2013-06-19 | ソニー株式会社 | 半導体レーザアレイの製造方法 |
US8031754B2 (en) * | 2008-04-24 | 2011-10-04 | The Furukawa Electric Co., Ltd. | Surface emitting laser element, surface emitting laser element array, method of fabricating a surface emitting laser element |
JP2016208049A (ja) * | 2011-03-17 | 2016-12-08 | 株式会社リコー | 面発光レーザ素子、原子発振器及び面発光レーザ素子の検査方法 |
CN110021875B (zh) | 2018-01-09 | 2022-05-13 | 苏州乐琻半导体有限公司 | 表面发射激光器器件和包括其的发光器件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0495301A1 (en) * | 1990-12-14 | 1992-07-22 | AT&T Corp. | Method for making a semiconductor laser |
US5258990A (en) * | 1991-11-07 | 1993-11-02 | The United States Of America As Represented By The Secretary Of The United States Department Of Energy | Visible light surface emitting semiconductor laser |
US5206871A (en) * | 1991-12-27 | 1993-04-27 | At&T Bell Laboratories | Optical devices with electron-beam evaporated multilayer mirror |
JP3052552B2 (ja) * | 1992-03-31 | 2000-06-12 | 株式会社日立製作所 | 面発光型半導体レーザ |
US5245622A (en) * | 1992-05-07 | 1993-09-14 | Bandgap Technology Corporation | Vertical-cavity surface-emitting lasers with intra-cavity structures |
-
1994
- 1994-06-15 US US08/261,272 patent/US5557626A/en not_active Expired - Lifetime
-
1995
- 1995-05-24 TW TW084105207A patent/TW267268B/zh not_active IP Right Cessation
- 1995-06-12 JP JP16788795A patent/JP3745795B2/ja not_active Expired - Lifetime
- 1995-06-15 KR KR1019950015823A patent/KR100341946B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112567503A (zh) * | 2018-07-20 | 2021-03-26 | 牛津仪器纳米技术工具有限公司 | 半导体蚀刻方法 |
US11961773B2 (en) | 2018-07-20 | 2024-04-16 | Oxford Instruments Nanotechnology Tools Limited | Semiconductor etching methods |
Also Published As
Publication number | Publication date |
---|---|
JPH08181393A (ja) | 1996-07-12 |
JP3745795B2 (ja) | 2006-02-15 |
US5557626A (en) | 1996-09-17 |
KR960003000A (ko) | 1996-01-26 |
KR100341946B1 (ko) | 2002-11-23 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |