TW255986B - - Google Patents
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- Publication number
- TW255986B TW255986B TW082106149A TW82106149A TW255986B TW 255986 B TW255986 B TW 255986B TW 082106149 A TW082106149 A TW 082106149A TW 82106149 A TW82106149 A TW 82106149A TW 255986 B TW255986 B TW 255986B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- heat
- heat dissipator
- attached
- bubble
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
經濟部中夹棟隼局貝工消費合作杜印製 255986 a7 _ ' --— B7 五、發明説明(厂 ~ '— -- 〔發明領域〕 本發明係有關於半導體元件,更特別.地爲使用於半 導體元件上的金屬泡體熱消散器。 、 〔發明背景〕 在半導體元件及積體電路的傳統熱消散方式爲使用 ,翼片(P i n f i n)或堆疊平板的熱消散器來置於包裝之 背面。堆晏平板和針翼片的消散器在等效於泡體消散器 (散熱效率時需更大㈣積。熱消散之效果依賴於表面 面積和元件的熱傳導率,且和週遭溫度和元件四周之空 氣流動速率有關。 〔發明之簡單摘要説明〕 本發明係利用金屬紐做成之熱消散器,以應用於 丰季體元件上。熱料特性依賴紐的有效㈣面積。 泡tt之散熱面積依紐上每平方英对之氣孔數多寡而定 :每平方英吋提供20個氣孔之泡體消散器,對大部分之 兀件而T提供了適當的表面面積且允許了充足的空氣流 動0 金屬泡嫌被固定於熱擴張器上,藉由導熱膠黏著於 半導體元件上。 本發明象徵了一先進技術’藉由以下之描述及附上 之圖示,使本發明之目的變得容易瞭解,新奇的特性被 敘述於申請專利範圍内。 本紙張尺度逋用中國國家標隼< CNS ) A4規格(210X297公釐) ----------^、-|1.^ (請先閲讀背面之注意事項再填寫本頁) S55986 A7 B7 五、發明説明( 經濟部中央棵準局貝工消費合作社印裝 〔圖面之簡單敘述〕 圖一係傳統使用針翼片之散熱器; 圖二係傳統使用堆疊平板之散熱器; 圖三係金屬泡想散熱器;且 圏四爲金屬泡禮散熱器和平板散熱器的每c/ffatt之 度數封空氣流動比之表格。 〔本發明之較佳實施例説明〕 圖一爲一針翼片之散熱器。半導體元件1〇上有一锖 張平板11位於其上部表面。針翼片散熱片12有許多翼片 13垂直於散熱片之主體12上。 圖二爲一堆疊平板散熱器。半導體元件2〇之上部平 面上有一熱擴張平板21固定於上。堆疊平板散熱器?2由 多個堆疊平板23及24组成。平板24比平板23更小。這樣 供了更大之散熱面積。 圖三爲本發明之具體圖示,爲使甩金屬泡體之散参 器。金屬泡雜於各種的來源是可用的。半導體元件3〇: -熱擴張器31附著於它的頂部表面。熱擴張器31可以: :譬如,紹或銅之平板,在擴張器土爲金屬泡 32。泡制散器32上有〇孔在其表面上,且穿 器I王體。泡“散器類似海棉上有孔延伸穿過其消= 王體。這些於表面及内部的孔提供了金屬泡雜之^ 單位體積極多的表面散熱面積。 以熱擴張板31爲銘材質爲例,大约是 泡體大约是250mi 1厚。 ^ 請 先 聞 讀 背 面 之 注 頁 裴 訂 線 本紙張从適财關家揉準(CNS ) A4· ( 210X297公釐了 255986 A7 B7 五、發明説明() 圖四爲平板散熱器和金屬泡體散熱器之比較表。泡 禮教熱器爲1.8"平方X 30"高。平板爲2".平方X .32"高 °空氣的變化量使用側流流過散熱片。每分鐘之氣流量 測取0, 100,300和500FPM。金屬泡體散熱片取每吋10,20 和40個孔。量測値代表元件每瓦之攝氏消散度數。 ’例如,一個4瓦的元件,使用平板散熱器/熱消散 器爲9.9父4 = 39.6。(:之上述周固溫度。若用2〇??1之泡體 消散器則爲8.7 X 4 = 34 . 8°C之上述周圍溫度。這是沒有 空氣流動之情形。若有一氣流3〇〇fpm,使用平板消散器 則爲14 · 4°C之上述周圍溫度。若使用金屬泡體散熱器則 爲10 . 4°C之上述周圍溫度。這是經由金屬泡體消散器之 使用,而改進了 4 °C。 ----------穿-- (請先Μ讀背面之注意事項再填寫本頁) 、τ
I 經濟部中央揉準局負工消費合作社印裝 本紙張尺度適用中國國家揉準(CNS ) Α4規格(210X297公釐)
Claims (1)
- Z55986 Α8 Β8 C8 D8 經濟部中央梯準局員工消費合作社印装 申請專利範圍 1.一種使用於半導體元件之熱消散器,由附著於半導體元 件表面之熱擴張器和附著於熱擴張器上之金屬泡髗组成 2. 如申請專利範囲第1項所述之熱消散器,其中該金屬泡 禮爲一熱傳導金屬。 3. 如申請專利範園第1項所述之熱消散器,其中該熱擴張 器爲一熱傳導金屬β 4 ·如申請專利範圍第1項所述之熱消散器,其中該金屬泡 體藉由導熱膠附著於琴熱擴張器上。 5. 如申請專利範圍第1項所述之熱消散器,其中該金屬泡 體飾以黄銅於該熱擴張器上。 6. 如申請專利範圍第1項所述之熱消散器,其中該金屬結 合被飾以黄銅於該熱擴張器上。 7 ·如申請專利範圍第1項所述之熱消散器,其中該金屬泡 體於每吋上有5到50個範園的氣孔。 8.—種用於半導體元件之熱消散器,其特徵包括: 附著於半導體元件表面之熱擴張器;及 附著於熱擴張器上之多孔鋁泡體,其中該多孔鋁泡體於 每吋上約有20個左右的氣孔。 — — — ———— 裝.—I I 訂 ^線 (請先聞讀背面之注意事項再填寫本頁) -6 -
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84665092A | 1992-03-05 | 1992-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW255986B true TW255986B (zh) | 1995-09-01 |
Family
ID=25298541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082106149A TW255986B (zh) | 1992-03-05 | 1993-08-02 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0559092A1 (zh) |
JP (1) | JPH065751A (zh) |
KR (1) | KR930020647A (zh) |
TW (1) | TW255986B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0579010A1 (en) * | 1992-07-07 | 1994-01-19 | International Business Machines Corporation | Lightweight packaging |
FR2775866B1 (fr) * | 1998-03-03 | 2000-04-07 | Telecommunications Sa | Organe dissipateur de chaleur |
DE19934554A1 (de) | 1999-07-22 | 2001-01-25 | Michael Stollenwerk | Wärmetauscher |
DE10055454A1 (de) * | 2000-11-09 | 2002-05-23 | Fujitsu Siemens Computers Gmbh | Kühlkörper |
KR100381303B1 (ko) * | 2001-01-16 | 2003-04-26 | 윤재석 | 다공성 히트싱크 |
US6888720B2 (en) * | 2002-06-18 | 2005-05-03 | Sun Microsystems, Inc. | Distributed graphitic foam heat exchanger system |
DE10324190B4 (de) * | 2003-05-28 | 2009-07-23 | M.Pore Gmbh | Wärmetauscher |
GB2404009B (en) * | 2003-07-17 | 2005-06-15 | Enfis Ltd | Cooling method and apparatus |
DE10340681B4 (de) * | 2003-09-04 | 2006-09-28 | M.Pore Gmbh | Verfahren zur Herstellung einer stoffschlüssigen, wärmeleitenden Verbindung zwischen einer offenporigen Schaumstruktur und einem nichtporösen Grundkörper für Wärmeübertrager, insbesonderer Kühlkörper |
DE10343020B4 (de) * | 2003-09-16 | 2018-01-18 | Mayser Holding Gmbh & Co. Kg | Kühlkörper, insbesondere für elektronische Bauelemente |
DE10343151B4 (de) * | 2003-09-18 | 2006-06-14 | M.Pore Gmbh | Instationärer Wärmetauscher |
DE10346423B4 (de) * | 2003-10-07 | 2006-07-13 | M.Pore Gmbh | Modularer Wärmetauscher |
US6992887B2 (en) | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
DE10352711B4 (de) * | 2003-11-06 | 2015-05-13 | Würth Elektronik Rot am See GmbH & Co. KG | Leiterplattenanordnung |
KR100584304B1 (ko) | 2004-04-30 | 2006-05-26 | 엘지전자 주식회사 | 흡열/발열 물품의 열전달 능력 향상 장치 |
DE102004021810A1 (de) * | 2004-05-03 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Elektronisches Bauelement sowie Verfahren zur Herstellung eines elektronischen Bauelementes |
DE102005004695B3 (de) * | 2005-02-02 | 2006-09-28 | Fpe Fischer Gmbh | Kühlkörper für elektrische Bauelemente |
US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
CN100433391C (zh) * | 2006-11-30 | 2008-11-12 | 何永祥 | 一种采用多孔金属材料作为散热装置的大功率发光二极管 |
DE102007021206A1 (de) | 2007-05-05 | 2008-11-06 | Hella Kgaa Hueck & Co. | Kühlkörper |
EP2071620A1 (en) * | 2007-12-12 | 2009-06-17 | Wen-Long Chyn | Heat sink having enhanced heat dissipation capacity |
KR101012502B1 (ko) * | 2008-08-20 | 2011-02-08 | 주식회사 현대엘이디 | Led 램프의 방열구조 |
FR2961894B1 (fr) | 2010-06-24 | 2013-09-13 | Valeo Vision | Dispositif a echange de chaleur, notamment pour vehicule automobile |
ES2660123T3 (es) * | 2012-09-18 | 2018-03-20 | Glatt Systemtechnik Gmbh | Sistema para el control de temperatura de componentes o subgrupos electrónicos u optoelectrónicos |
BR112015006912A2 (pt) * | 2012-09-28 | 2017-07-04 | Dow Global Technologies Llc | aparelho |
EP2900838A1 (en) * | 2012-09-28 | 2015-08-05 | Dow Global Technologies LLC | Microsphere-filled-metal components for wireless-communication towers |
CA2882409A1 (en) * | 2012-09-28 | 2014-04-03 | Dow Global Technologies Llc | Foamed-metal components for wireless-communication towers |
DE102012219673A1 (de) * | 2012-10-26 | 2014-04-30 | Robert Bosch Gmbh | Anordnung zur induktiven Energieübertragung an ein elektrisch antreibbares Fahrzeug |
JP2016184648A (ja) * | 2015-03-26 | 2016-10-20 | 住友電気工業株式会社 | ヒートシンク及び電子機器 |
US9813082B2 (en) * | 2015-10-08 | 2017-11-07 | Futurewei Technologies, Inc. | Heat spreader with thermally coductive foam core |
CN105871328A (zh) * | 2016-06-03 | 2016-08-17 | 浙江人和光伏科技有限公司 | 一种太阳能电池用接线盒 |
CN106098564A (zh) * | 2016-06-17 | 2016-11-09 | 重庆大学 | 用SiC作为基片的大功率半导体封装构造及其方法 |
US10782078B2 (en) | 2016-09-13 | 2020-09-22 | Bgt Materials Limited | Heat dissipation coating layer and manufacturing method thereof |
US10025359B2 (en) * | 2016-09-29 | 2018-07-17 | Intel Corporation | Metal foam heat exchangers for dispersing exhaust flow |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69126686T2 (de) * | 1990-08-14 | 1997-10-23 | Texas Instruments Inc | Wärmetransportmodul für Anwendungen ultrahoher Dichte und Silizium auf Siliziumpackungen |
-
1993
- 1993-02-17 JP JP5027815A patent/JPH065751A/ja active Pending
- 1993-02-26 EP EP93103059A patent/EP0559092A1/en not_active Withdrawn
- 1993-03-04 KR KR1019930003158A patent/KR930020647A/ko not_active Application Discontinuation
- 1993-08-02 TW TW082106149A patent/TW255986B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR930020647A (ko) | 1993-10-20 |
EP0559092A1 (en) | 1993-09-08 |
JPH065751A (ja) | 1994-01-14 |
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