FR2775866B1 - Organe dissipateur de chaleur - Google Patents

Organe dissipateur de chaleur

Info

Publication number
FR2775866B1
FR2775866B1 FR9802531A FR9802531A FR2775866B1 FR 2775866 B1 FR2775866 B1 FR 2775866B1 FR 9802531 A FR9802531 A FR 9802531A FR 9802531 A FR9802531 A FR 9802531A FR 2775866 B1 FR2775866 B1 FR 2775866B1
Authority
FR
France
Prior art keywords
heat dissipator
dissipator
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9802531A
Other languages
English (en)
Other versions
FR2775866A1 (fr
Inventor
Daniel Neuwisse
Bernard Moulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagemcom Energy and Telecom SAS
Original Assignee
Societe Anonyme de Telecommunications SAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Anonyme de Telecommunications SAT filed Critical Societe Anonyme de Telecommunications SAT
Priority to FR9802531A priority Critical patent/FR2775866B1/fr
Publication of FR2775866A1 publication Critical patent/FR2775866A1/fr
Application granted granted Critical
Publication of FR2775866B1 publication Critical patent/FR2775866B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9802531A 1998-03-03 1998-03-03 Organe dissipateur de chaleur Expired - Lifetime FR2775866B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9802531A FR2775866B1 (fr) 1998-03-03 1998-03-03 Organe dissipateur de chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9802531A FR2775866B1 (fr) 1998-03-03 1998-03-03 Organe dissipateur de chaleur

Publications (2)

Publication Number Publication Date
FR2775866A1 FR2775866A1 (fr) 1999-09-10
FR2775866B1 true FR2775866B1 (fr) 2000-04-07

Family

ID=9523562

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9802531A Expired - Lifetime FR2775866B1 (fr) 1998-03-03 1998-03-03 Organe dissipateur de chaleur

Country Status (1)

Country Link
FR (1) FR2775866B1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065751A (ja) * 1992-03-05 1994-01-14 Texas Instr Inc <Ti> 金属フォーム放熱器
JPH0795636B2 (ja) * 1992-06-16 1995-10-11 昭和アルミニウム株式会社 ピン形フィンを備えた放熱器の製造法
EP1056130B1 (fr) * 1992-08-06 2003-10-29 Pfu Limited Dispositif de refroidissement pour un composant générant de la chaleur

Also Published As

Publication number Publication date
FR2775866A1 (fr) 1999-09-10

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
TP Transmission of property

Owner name: SAGECOM ENERGY & TELECOM SAS, FR

Effective date: 20120725

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20