TW217447B - - Google Patents

Info

Publication number
TW217447B
TW217447B TW080108500A TW80108500A TW217447B TW 217447 B TW217447 B TW 217447B TW 080108500 A TW080108500 A TW 080108500A TW 80108500 A TW80108500 A TW 80108500A TW 217447 B TW217447 B TW 217447B
Authority
TW
Taiwan
Application number
TW080108500A
Original Assignee
Shinetsu Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chem Ind Co filed Critical Shinetsu Chem Ind Co
Application granted granted Critical
Publication of TW217447B publication Critical patent/TW217447B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Liquid Crystal (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW080108500A 1991-03-18 1991-10-29 TW217447B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3078587A JP2687751B2 (ja) 1991-03-18 1991-03-18 感光性重合体材料

Publications (1)

Publication Number Publication Date
TW217447B true TW217447B (zh) 1993-12-11

Family

ID=13666046

Family Applications (1)

Application Number Title Priority Date Filing Date
TW080108500A TW217447B (zh) 1991-03-18 1991-10-29

Country Status (6)

Country Link
US (1) US5292619A (zh)
EP (1) EP0505161B1 (zh)
JP (1) JP2687751B2 (zh)
KR (1) KR0174560B1 (zh)
DE (1) DE69229419T2 (zh)
TW (1) TW217447B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624365B (zh) * 2012-02-23 2018-05-21 日立化成杜邦微系統股份有限公司 顯示器基板的製造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2146128B1 (es) * 1995-03-31 2001-03-16 Consejo Superior Investigacion Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio.
TW460728B (en) * 1995-08-03 2001-10-21 Hitachi Ltd Color LCD
US6291619B1 (en) 1997-01-30 2001-09-18 Hitachi Chemical Co., Ltd Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereof
US6816218B1 (en) * 1997-04-14 2004-11-09 Merck Patent Gmbh Homeotropically aligned liquid crystal layer and process for the homeotropic alignment of liquid crystals on plastic substrates
JP3366859B2 (ja) * 1998-03-05 2003-01-14 日立化成デュポンマイクロシステムズ株式会社 感光性ポリイミド前駆体用現像液及びこれを用いたパターン製造法
JP4078508B2 (ja) * 1998-08-26 2008-04-23 日産化学工業株式会社 液晶配向処理剤及びそれを用いた液晶素子並びに液晶の配向方法
JP4610596B2 (ja) * 1998-08-26 2011-01-12 日産化学工業株式会社 液晶配向処理剤及びそれを用いた液晶素子並びに液晶の配向方法
DE10104726A1 (de) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
KR101212135B1 (ko) * 2005-06-14 2012-12-14 엘지디스플레이 주식회사 액정표시소자 및 그 제조방법
JP4860525B2 (ja) * 2007-03-27 2012-01-25 富士フイルム株式会社 硬化性組成物及び平版印刷版原版
JP6194620B2 (ja) * 2013-04-19 2017-09-13 株式会社リコー 活性エネルギー線硬化型のインクジェット記録用インク
EP2823801B1 (de) 2013-07-12 2017-04-19 Ivoclar Vivadent AG Dentalmaterialien auf der Basis von harnstoffgruppenhaltigen Monomeren
WO2022145355A1 (ja) * 2020-12-28 2022-07-07 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1522441A1 (de) * 1966-09-16 1969-07-24 Basf Ag Verfahren zum Herstellen von lichtempfindlichen Platten
JP2516897B2 (ja) * 1983-10-21 1996-07-24 信越化学工業株式会社 感光性組成物
US5019482A (en) * 1987-08-12 1991-05-28 Asahi Kasei Kogyo Kabushiki Kaisha Polymer/oxime ester/coumarin compound photosensitive composition
JP2626696B2 (ja) * 1988-04-11 1997-07-02 チッソ株式会社 感光性重合体
JP2980359B2 (ja) * 1990-04-16 1999-11-22 富士通株式会社 感光性耐熱樹脂組成物とそれを用いたパターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624365B (zh) * 2012-02-23 2018-05-21 日立化成杜邦微系統股份有限公司 顯示器基板的製造方法

Also Published As

Publication number Publication date
US5292619A (en) 1994-03-08
KR0174560B1 (ko) 1999-03-20
EP0505161B1 (en) 1999-06-16
EP0505161A1 (en) 1992-09-23
DE69229419D1 (de) 1999-07-22
KR920018183A (ko) 1992-10-21
JPH04288365A (ja) 1992-10-13
DE69229419T2 (de) 1999-11-04
JP2687751B2 (ja) 1997-12-08

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