TW202407400A - Display body and sheet for sealing optical semiconductor element - Google Patents
Display body and sheet for sealing optical semiconductor element Download PDFInfo
- Publication number
- TW202407400A TW202407400A TW112111230A TW112111230A TW202407400A TW 202407400 A TW202407400 A TW 202407400A TW 112111230 A TW112111230 A TW 112111230A TW 112111230 A TW112111230 A TW 112111230A TW 202407400 A TW202407400 A TW 202407400A
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- TW
- Taiwan
- Prior art keywords
- optical semiconductor
- semiconductor element
- layer
- colored layer
- sealing resin
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
Description
本發明係關於一種顯示體及光半導體元件密封用片材。更詳細而言，本發明係關於一種將例如自發光型顯示裝置之光半導體元件密封而成之顯示體、及適合用於密封光半導體元件之片材。The present invention relates to a display body and a sheet for sealing optical semiconductor elements. More specifically, the present invention relates to a display body in which an optical semiconductor element, such as a self-luminous display device, is sealed, and a sheet suitable for sealing the optical semiconductor element.
近年來，設計出以次毫米/微型LED顯示裝置(Mini/Micro Light Emitting Diode Display)為代表之自發光型顯示裝置，作為下一代顯示裝置。次毫米/微型LED顯示裝置之基本構成如下：高密度地排列有大量微小之光半導體元件(LED晶片)之基板用作顯示面板，該光半導體元件藉由密封材料密封，最表層積層有樹脂膜或玻璃板等覆蓋構件。In recent years, self-luminous display devices represented by sub-millimeter/micro LED display devices (Mini/Micro Light Emitting Diode Display) have been designed as next-generation display devices. The basic structure of a sub-millimeter/micro LED display device is as follows: a substrate with a large number of tiny optical semiconductor elements (LED chips) arranged at a high density is used as a display panel. The optical semiconductor elements are sealed with a sealing material, and a resin film is laminated on the outermost surface. Or covering components such as glass panels.
於具備次毫米/微型LED顯示裝置等自發光型顯示裝置之顯示體中，顯示面板之基板上配置有金屬或ITO(Indium Tin Oxide，氧化銦錫)等金屬氧化物之配線(金屬配線)。此種顯示裝置存在以下問題，例如熄滅時因上述金屬配線等光發生反射，屏幕之外觀不佳，設計性較差。由此，採用使用用於防止由金屬配線所引起之反射之防反射層作為密封光半導體元件之密封材料的技術。In displays with self-luminous display devices such as sub-millimeter/micro LED display devices, wiring (metal wiring) of metal or metal oxides such as ITO (Indium Tin Oxide) is arranged on the substrate of the display panel. This type of display device has the following problems. For example, when it is turned off, light is reflected by the above-mentioned metal wiring, resulting in poor screen appearance and poor design. Therefore, a technology is adopted that uses an anti-reflection layer for preventing reflection by metal wiring as a sealing material for sealing optical semiconductor elements.
又，於使用自發光型顯示裝置之顯示器中，存在由於光半導體元件之光源而產生明度不均(亮度不均)之問題。若產生亮度不均，則會產生稱為「色移」之現象，即於自顯示器之正面觀看之情形時與自傾斜視野觀看之情形時，色調發生變化。Furthermore, in a display using a self-luminous display device, there is a problem of brightness unevenness (brightness unevenness) due to the light source of the optical semiconductor element. If brightness unevenness occurs, a phenomenon called "color shift" will occur, in which the color tone changes when viewing the monitor from the front and when viewing it from an oblique field of view.
專利文獻1中，揭示一種可抑制亮度不均之黏著片材，該黏著片材係著色黏著劑層與無色黏著劑層之積層體，以無色黏著劑層與光半導體元件接觸之方式配置。據記載，根據上述黏著片材，於與由基板及設置於該基板之光半導體元件所形成之凹凸形狀接觸吻合之情形時，無色黏著劑層與凹凸接觸，藉由無色黏著劑層，凹凸被一定程度地吸收，由此著色黏著劑層之壓縮或變形受到抑制，藉此可抑制黏著劑層中之透過率之不均，抑制亮度不均。 [先前技術文獻] [專利文獻] Patent Document 1 discloses an adhesive sheet that can suppress brightness unevenness. The adhesive sheet is a laminate of a colored adhesive layer and a colorless adhesive layer, and is arranged so that the colorless adhesive layer is in contact with an optical semiconductor element. According to the above-mentioned adhesive sheet, when it comes into contact with the uneven shapes formed by the substrate and the optical semiconductor element provided on the substrate, the colorless adhesive layer comes into contact with the uneven shapes, and the uneven shapes are covered by the colorless adhesive layer. Absorbed to a certain extent, the compression or deformation of the colored adhesive layer is suppressed, thereby suppressing uneven transmittance in the adhesive layer and suppressing uneven brightness. [Prior technical literature] [Patent Document]
[專利文獻1]日本專利特開2020-169262號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2020-169262
[發明所欲解決之問題][Problem to be solved by the invention]
然而，具備著色黏著劑層之黏著片材雖可期待於密封光半導體元件時防止由金屬配線所引起之反射、抑制亮度不均之效果，但光半導體元件發出之光之透過性降低，結果，存在顯示體之正面亮度降低之問題。若正面亮度降低，則為了提高亮度，消耗電力增加。又，專利文獻1之黏著片材存在以下問題，即著色黏著劑層無法充分吸收自光半導體元件之側面發出之光，相鄰之光半導體元件發出之光彼此之干涉較強，易於產生色移。由此，要求一種不易發生色移且亮度較高之顯示體。However, the adhesive sheet with the colored adhesive layer can be expected to prevent reflection caused by metal wiring and suppress uneven brightness when sealing optical semiconductor elements, but the transmittance of light emitted by the optical semiconductor elements decreases, and as a result, There is a problem of reduced front brightness of the display. If the front brightness decreases, power consumption increases in order to increase the brightness. In addition, the adhesive sheet of Patent Document 1 has the following problem: the colored adhesive layer cannot fully absorb the light emitted from the side of the optical semiconductor element, and the light emitted from the adjacent optical semiconductor elements interferes strongly with each other, easily causing color shift. . Therefore, a display body that is less prone to color shift and has higher brightness is required.
本發明係基於此種狀況而想出，其目的在於提供一種不易發生色移且亮度較高之顯示體。又，本發明之另一目的在於提供一種半導體元件密封用片材，該半導體元件密封用片材藉由將光半導體元件密封，可製作不易發生色移且亮度較高之顯示體。 [解決問題之技術手段] The present invention was conceived based on this situation, and its purpose is to provide a display that is less prone to color shift and has higher brightness. Another object of the present invention is to provide a semiconductor element sealing sheet that seals optical semiconductor elements to produce a display that is less prone to color migration and has higher brightness. [Technical means to solve problems]
本發明人等為了達到上述目的而進行銳意研究，結果，發現如下顯示體不易發生色移且亮度較高，即關於該顯示體，於藉由包含著色層及非著色層之密封樹脂層將配置於基板上之複數個光半導體元件密封之狀態下，具有位於光半導體元件之正面側之著色層之截面積小於最接近之2個光半導體元件間之著色層之截面積的構造。本發明係基於該等見解而完成。The inventors of the present invention conducted intensive research in order to achieve the above object, and as a result, found that a display that is less prone to color migration and has higher brightness is disposed by a sealing resin layer including a colored layer and a non-colored layer. When the plurality of optical semiconductor elements on the substrate are sealed, the cross-sectional area of the colored layer located on the front side of the optical semiconductor element is smaller than the cross-sectional area of the colored layer between the two closest optical semiconductor elements. The present invention was completed based on these findings.
即，本發明提供一種顯示體，其具備基板、配置於上述基板上之複數個光半導體元件、及將上述複數個光半導體元件密封之密封樹脂層， 上述密封樹脂層自光半導體元件側依序包含著色層及非著色層， 於通過第一光半導體元件之重心、及與上述第一光半導體元件於同一像素內相鄰之第二光半導體元件之重心的相對於上述基板表面為垂直面之剖面上， 位於上述第一光半導體元件之正面側之上述著色層之截面積S1小於位於上述第一光半導體元件與上述第二光半導體元件之間之上述著色層之截面積S2。 That is, the present invention provides a display including a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The above-mentioned sealing resin layer includes a colored layer and a non-colored layer in order from the optical semiconductor element side, On a cross section that passes through the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel and is a vertical plane with respect to the surface of the substrate, The cross-sectional area S1 of the colored layer located on the front side of the first optical semiconductor element is smaller than the cross-sectional area S2 of the colored layer located between the first optical semiconductor element and the second optical semiconductor element.
於上述顯示體中，藉由使密封上述光半導體元件之上述密封樹脂層包含上述著色層，可防止由設置於基板上之金屬配線等所引起之光之反射。繼而，若位於光半導體元件之正面側之著色層之截面積S1較小，則表示光半導體元件之正面側之著色層之體積較小，即更多地透過光半導體元件發出之正面方向之光。另一方面，若光半導體元件間之著色層之截面積S2較大，則表示光半導體元件間之著色層之體積較大，即更多地吸收光半導體元件發出之側面方向之光。又，更多地吸收未設置光半導體元件之基板面之由金屬配線等所引起之反射光。由此，於S1小於S2之顯示體中，光半導體元件發出之光之正面方向之透過性優異，同時側面方向之透過性控制為較低，顯示體不易發生色移，且正面亮度較高。In the above display body, the sealing resin layer that seals the optical semiconductor element includes the colored layer, so that reflection of light caused by metal wiring or the like provided on the substrate can be prevented. Then, if the cross-sectional area S1 of the colored layer located on the front side of the optical semiconductor element is smaller, it means that the volume of the colored layer on the front side of the optical semiconductor element is smaller, that is, more light in the front direction emitted by the optical semiconductor element is transmitted through . On the other hand, if the cross-sectional area S2 of the colored layer between the optical semiconductor elements is larger, it means that the volume of the colored layer between the optical semiconductor elements is larger, that is, it absorbs more light from the side direction emitted by the optical semiconductor elements. In addition, more reflected light caused by metal wiring and the like on the substrate surface where the optical semiconductor element is not installed is absorbed. Therefore, in a display where S1 is smaller than S2, the transmittance of the light emitted by the optical semiconductor element in the front direction is excellent, and the transmittance in the side direction is controlled to be low. The display is less prone to color shift and has higher front brightness.
上述密封樹脂層較佳為包含擴散功能層。藉由具有此種構成，可使光半導體元件於側面方向發出之光於上述擴散功能層中擴散，進一步提高正面亮度，且可進一步抑制色移。The sealing resin layer preferably includes a diffusion functional layer. By having such a structure, the light emitted by the optical semiconductor element in the side direction can be diffused in the above-mentioned diffusion functional layer, thereby further improving the front brightness and further suppressing color shift.
上述密封樹脂層較佳為自上述光半導體元件側依序具備上述擴散功能層、上述著色層、及上述非著色層。藉由具有此種構成，正面亮度進一步提高，色移進一步受到抑制，同時即便於著色層具有凹凸形狀之情形時，亦可防止著色層表面露出於正面側(光半導體元件之相反側)之密封樹脂層表面，且正面側之密封樹脂層表面易於變得平坦，不易發生外界光之漫反射，熄滅時及發光時顯示體之外觀均提高。The sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in order from the optical semiconductor element side. By having this structure, the front brightness is further improved, the color shift is further suppressed, and even when the colored layer has an uneven shape, the surface of the colored layer is prevented from being exposed on the front side (opposite side of the optical semiconductor element) of the seal. The surface of the resin layer and the surface of the sealing resin layer on the front side are easy to become flat, making it difficult for diffuse reflection of external light to occur, and the appearance of the display body is improved both when it is turned off and when it is emitting light.
上述顯示體較佳為具備自發光型顯示裝置。The display body preferably includes a self-luminous display device.
上述顯示體較佳為圖像顯示裝置。The above-mentioned display body is preferably an image display device.
又，本發明提供一種光半導體元件密封用片材，其係用於將配置於基板上之複數個光半導體元件密封之片材， 上述片材具備包含著色層及非著色層之密封用樹脂層， 於藉由上述密封用樹脂層以上述著色層側為上述光半導體元件側之方式將上述複數個光半導體元件密封而形成密封樹脂層時， 於通過第一光半導體元件之重心、及與上述第一光半導體元件於同一像素內相鄰之第二光半導體元件之重心的相對於上述基板表面為垂直面之剖面上， 位於上述第一光半導體元件之正面側之上述著色層之截面積S1可小於位於上述第一光半導體元件與上述第二光半導體元件之間之上述著色層之截面積S2。 Furthermore, the present invention provides a sheet for sealing optical semiconductor elements, which is a sheet used for sealing a plurality of optical semiconductor elements arranged on a substrate, The above-mentioned sheet has a sealing resin layer including a colored layer and a non-colored layer, When the sealing resin layer is formed by sealing the plurality of optical semiconductor elements by the sealing resin layer so that the colored layer side is the optical semiconductor element side, On a cross section that passes through the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel and is a vertical plane with respect to the surface of the substrate, The cross-sectional area S1 of the colored layer located on the front side of the first optical semiconductor element may be smaller than the cross-sectional area S2 of the colored layer located between the first optical semiconductor element and the second optical semiconductor element.
上述密封用樹脂層較佳為包含擴散功能層。The sealing resin layer preferably includes a diffusion functional layer.
上述密封用樹脂層較佳為依序具備上述擴散功能層、上述著色層、及上述非著色層。 [發明之效果] The sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order. [Effects of the invention]
根據本發明之顯示體，不易發生由光半導體元件發出之光所引起之色移，且亮度較高。由此，上述顯示體可自較寬之視野以相同色調視認出顯示體。又，即便不提高消耗電力，上述顯示體亦較亮，外觀較佳。又，根據本發明之光半導體元件密封用片材，藉由將光半導體元件密封，可提供一種不易發生色移且亮度較高之顯示體。According to the display of the present invention, color shift caused by the light emitted by the optical semiconductor element is less likely to occur, and the brightness is higher. Therefore, the above-mentioned display body can be recognized with the same color tone from a wider field of view. In addition, even without increasing power consumption, the above-mentioned display body is brighter and has a better appearance. Furthermore, according to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display that is less prone to color shift and has higher brightness.
[顯示體] 本發明之顯示體至少具備基板、配置於上述基板上之複數個光半導體元件、及將上述複數個光半導體元件密封之密封樹脂層。上述顯示體係用於藉由光半導體元件發出之光來顯示資訊之裝置。 [display body] The display of the present invention at least includes a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements. The above display system is used for devices that display information using light emitted by optical semiconductor elements.
作為上述光半導體元件，例如可例舉藍色發光二極體、綠色發光二極體、紅色發光二極體、紫外線發光二極體等發光二極體(LED)。Examples of the optical semiconductor element include light-emitting diodes (LEDs) such as blue light-emitting diodes, green light-emitting diodes, red light-emitting diodes, and ultraviolet light-emitting diodes.
於上述基板上，上述複數個光半導體元件配置於1個像素(畫素)內，上述像素配置有複數個。即，上述複數個光半導體元件在複數個包含光半導體元件之像素中分別配置有複數個。圖1中示出針對每個像素於基板上配置複數個光半導體元件之光學構件之局部俯視圖。於圖1所示之光學構件11中，於基板2上，3個光半導體元件3a～3c以接近之方式進行配置，3個光半導體元件3a～3c形成1個像素(像素3)。又，於基板2上，3個光半導體元件3d～3f以接近之方式進行配置，3個光半導體元件3d～3f形成1個像素(像素3')。並且，於基板2上，配置有像素3、像素3'等複數個像素。On the above-mentioned substrate, the plurality of optical semiconductor elements are arranged in one pixel (pixel), and a plurality of the above-mentioned pixels are arranged. That is, a plurality of the plurality of optical semiconductor elements are respectively arranged in a plurality of pixels including the optical semiconductor element. FIG. 1 shows a partial top view of an optical component in which a plurality of optical semiconductor elements are arranged on a substrate for each pixel. In the optical member 11 shown in FIG. 1 , three optical semiconductor elements 3 a to 3 c are arranged in proximity to each other on the substrate 2 , and the three optical semiconductor elements 3 a to 3 c form one pixel (pixel 3 ). Furthermore, on the substrate 2, three optical semiconductor elements 3d to 3f are arranged in close proximity, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). Furthermore, on the substrate 2, a plurality of pixels such as the pixel 3 and the pixel 3' are arranged.
本發明之顯示體具有由基板及光半導體元件所形成之凹凸形狀，該凹凸形狀係以最接近之2個光半導體元件間未配置光半導體元件之區域之基板表面作為凹部，以光半導體元件作為凸部。The display body of the present invention has an uneven shape formed by a substrate and an optical semiconductor element. The uneven shape uses the substrate surface in the area where the optical semiconductor element is not arranged between the two closest optical semiconductor elements as the concave portion, and uses the optical semiconductor element as the concave portion. convex part.
上述基板上之上述光半導體元件之高度(自基板表面至光半導體元件正面側之端部之高度)較佳為500 μm以下。若上述高度為500 μm以下，密封樹脂層對上述凹凸形狀之吻合性更優異。The height of the optical semiconductor element on the above-mentioned substrate (the height from the surface of the substrate to the end on the front side of the optical semiconductor element) is preferably 500 μm or less. If the above-mentioned height is 500 μm or less, the conformability of the sealing resin layer to the above-mentioned uneven shape will be more excellent.
上述密封樹脂層較佳為與複數個光半導體元件接觸，並與上述凹凸形狀吻合。又，上述密封樹脂層較佳為將上述複數個光半導體元件一起密封。再者，於本說明書中，「將光半導體元件密封」係指將光半導體元件之至少一部分嵌入密封樹脂層內，或藉由上述密封樹脂層吻合覆蓋。The sealing resin layer is preferably in contact with the plurality of optical semiconductor elements and conforms to the uneven shape. Furthermore, the sealing resin layer preferably seals the plurality of optical semiconductor elements together. In addition, in this specification, "sealing the optical semiconductor element" means embedding at least part of the optical semiconductor element in the sealing resin layer, or fitting and covering it with the sealing resin layer.
上述密封樹脂層至少包含著色層及非著色層，自上述光半導體元件側依序具有上述著色層及上述非著色層。於上述密封樹脂層中，上述著色層及上述非著色層可直接積層，亦可經由其他層而積層。The sealing resin layer includes at least a colored layer and a non-colored layer, and has the colored layer and the non-colored layer in order from the side of the optical semiconductor element. In the sealing resin layer, the colored layer and the non-colored layer may be laminated directly or may be laminated via other layers.
將上述複數個光半導體元件中之任意一個作為第一光半導體元件。將與上述第一光半導體元件於同一像素內相鄰之光半導體元件作為第二光半導體元件。繼而，於通過上述第一光半導體元件之重心及上述第二光半導體元件之重心的相對於上述基板表面為垂直面之剖面上，位於上述第一光半導體元件之正面側之上述著色層之截面積S1小於位於上述第一光半導體元件與上述第二光半導體元件之間之上述著色層之截面積S2。 Any one of the plurality of optical semiconductor elements described above is used as a first optical semiconductor element. The optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is used as the second optical semiconductor element. Then, on a cross section that is a vertical plane with respect to the surface of the substrate and passes through the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element, a section of the colored layer located on the front side of the first optical semiconductor element is The area S1 is smaller than the cross-sectional area S2 of the colored layer located between the first optical semiconductor element and the second optical semiconductor element.
於上述顯示體中，藉由使密封上述光半導體元件之上述密封樹脂層包含上述著色層，可防止由設置於基板上之金屬配線等所引起之光之反射。繼而，若位於光半導體元件之正面側之著色層之截面積S1較小，則表示光半導體元件之正面側之著色層之體積較小，即更多地透過光半導體元件發出之正面方向之光。另一方面，若光半導體元件間之著色層之截面積S2較大，則表示光半導體元件間之著色層之體積較大，即更多地吸收光半導體元件發出之側面方向之光。又，更多地吸收未設置光半導體元件之基板面之由金屬配線等所引起之反射光。由此，於S1小於S2之顯示體中，光半導體元件發出之光之正面方向之透過性優異，同時側面方向之透過性控制為較低，顯示體不易發生色移，且正面亮度較高。In the above display body, the sealing resin layer that seals the optical semiconductor element includes the colored layer, so that reflection of light caused by metal wiring or the like provided on the substrate can be prevented. Then, if the cross-sectional area S1 of the colored layer located on the front side of the optical semiconductor element is smaller, it means that the volume of the colored layer on the front side of the optical semiconductor element is smaller, that is, more light in the front direction emitted by the optical semiconductor element is transmitted through . On the other hand, if the cross-sectional area S2 of the colored layer between the optical semiconductor elements is larger, it means that the volume of the colored layer between the optical semiconductor elements is larger, that is, it absorbs more light from the side direction emitted by the optical semiconductor elements. In addition, more reflected light caused by metal wiring and the like on the substrate surface where the optical semiconductor element is not installed is absorbed. Therefore, in a display where S1 is smaller than S2, the transmittance of the light emitted by the optical semiconductor element in the front direction is excellent, and the transmittance in the side direction is controlled to be low. The display is less prone to color shift and has higher front brightness.
再者，於本說明書中，「正面」係指視認出顯示體之側，例如於後述之圖2中為上方向。In addition, in this specification, the "front" refers to the side from which the display body is visible, for example, the upward direction in FIG. 2 described below.
上述截面積S1係位於光半導體元件之正面側之著色層之截面積，具體為上述垂直面剖面上分別通過光半導體元件之兩端(左右端)之2根垂線間的位於光半導體元件之正面側之著色層之截面積。又，上述截面積S2係存在於平行於基板表面之第一直線與平行於基板表面之第二直線之間且存在於第一及第二光半導體元件間的著色層之截面積。上述第一直線係通過存在於第一及第二光半導體元件間之著色層之正面側界面上最基板側之點的直線。上述第二直線係通過存在於第一及第二光半導體元件間之著色層之基板側界面上最基板側之點的直線。The above-mentioned cross-sectional area S1 is the cross-sectional area of the colored layer located on the front side of the optical semiconductor element. Specifically, it is the area between the two vertical lines passing through the two ends (left and right ends) of the optical semiconductor element on the above-mentioned vertical section and is located on the front side of the optical semiconductor element. The cross-sectional area of the colored layer on the side. In addition, the cross-sectional area S2 is the cross-sectional area of the colored layer that exists between the first straight line parallel to the substrate surface and the second straight line parallel to the substrate surface and exists between the first and second optical semiconductor elements. The first straight line is a straight line passing through the most substrate-side point on the front-side interface of the coloring layer existing between the first and second optical semiconductor elements. The second straight line is a straight line passing through the most substrate-side point on the substrate-side interface of the colored layer existing between the first and second optical semiconductor elements.
再者，於本說明書中，「光半導體元件間」係指自一光半導體元件側之端部(另一光半導體元件側之端部)至另一光半導體元件之端部(一光半導體元件側之端部)之間。又，由於光半導體元件於基板之同一面設置有複數個，故而於本說明書中，「存在於光半導體元件間」意指與基板表面平行之方向上之間，高度方向(相對於基板表面之垂直方向)之位置並無特別限定。例如存在光半導體元件間之著色層僅位於較光半導體元件之正面側之端部更靠正面側之情況。Furthermore, in this specification, "between optical semiconductor elements" means from the end of one optical semiconductor element (the end of the other optical semiconductor element) to the end of another optical semiconductor element (the end of one optical semiconductor element). between the ends of the sides). In addition, since a plurality of optical semiconductor elements are provided on the same surface of the substrate, in this specification, "existing between the optical semiconductor elements" means between the direction parallel to the substrate surface and the height direction (relative to the substrate surface). (vertical direction) is not particularly limited. For example, there may be cases where the colored layer between the optical semiconductor elements is located only closer to the front side than the end of the front side of the optical semiconductor element.
(第一實施方式) 關於本發明之顯示體，使用作為其一個實施方式之圖2所示之顯示體進行說明。圖2所示之顯示體1具備基板2、配置於基板2上之複數個光半導體元件3a～3c、將該等光半導體元件3a～3c一起密封之密封樹脂層4、及貼合於密封樹脂層4之與光半導體元件3a～3c側相反之側之表面的基材部5。圖2係通過光半導體元件3a～3c之重心之相對於基板2之垂直面剖面之放大圖。 (first embodiment) The display body of the present invention will be described using the display body shown in FIG. 2 as one embodiment. The display 1 shown in FIG. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, a sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c together, and a sealing resin bonded to the substrate 2. The base material portion 5 on the surface of the layer 4 on the side opposite to the side of the optical semiconductor elements 3a to 3c. FIG. 2 is an enlarged view of a vertical cross-section with respect to the substrate 2 through the center of gravity of the optical semiconductor elements 3a to 3c.
光半導體元件3a～3c分別藉由支持體31固定於一個基板2上。顯示體1具有由基板2及光半導體元件3a～3c所形成之凹凸形狀，該凹凸形狀係以2個以上之光半導體元件3a～3c間未配置光半導體元件之區域之基板2表面作為凹部N，以光半導體元件3a～3c作為凸部P。The optical semiconductor elements 3a to 3c are each fixed to one substrate 2 via a support 31. The display body 1 has an uneven shape formed by the substrate 2 and the optical semiconductor elements 3a to 3c. The uneven shape has the surface of the substrate 2 in the area where the optical semiconductor element is not arranged between the two or more optical semiconductor elements 3a to 3c as the recess N. , the optical semiconductor elements 3a to 3c are used as the protrusions P.
圖2中之光半導體元件3a～3c係圖1所示之光半導體元件3a～3c，光半導體元件3a～3c位於同一像素3內。例如光半導體元件3a為第一光半導體元件，光半導體元件3b為與光半導體元件3a相鄰之第二光半導體元件。The optical semiconductor elements 3a to 3c in FIG. 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located in the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.
如圖2所示，密封樹脂層4與複數個光半導體元件3a～3c接觸，並與上述凹凸形狀吻合，將複數個光半導體元件3a～3c一起密封。As shown in FIG. 2 , the sealing resin layer 4 is in contact with the plurality of optical semiconductor elements 3a to 3c and matches the above-mentioned uneven shape to seal the plurality of optical semiconductor elements 3a to 3c together.
密封樹脂層4係著色層41及非著色層42直接積層而構成，以著色層41側為光半導體元件3a～3c側之方式將光半導體元件3a～3c密封。與光半導體元件3a～3c接觸之著色層41與上述凹凸形狀吻合，於顯示體1中著色層41亦具有凹凸形狀。另一方面，非著色層42之一面藉由與著色層41之凹凸形狀吻合，具有與著色層41之凹凸形狀相反之凹凸形狀，另一面為平面(平坦)。再者，非著色層42可為後述之擴散功能層或非擴散功能層。The sealing resin layer 4 is composed of a colored layer 41 and a non-colored layer 42 directly laminated, and seals the optical semiconductor elements 3a to 3c so that the colored layer 41 side faces the optical semiconductor elements 3a to 3c. The colored layer 41 in contact with the optical semiconductor elements 3a to 3c matches the above-mentioned uneven shape, and the colored layer 41 in the display body 1 also has an uneven shape. On the other hand, one side of the non-colored layer 42 has an uneven shape that is opposite to the uneven shape of the colored layer 41 by matching the uneven shape of the colored layer 41, and the other side is flat (flat). Furthermore, the non-colored layer 42 may be a diffusion functional layer or a non-diffusion functional layer described later.
即，密封樹脂層4自光半導體元件側3a～3c依序具備著色層41及非著色層42。又，密封樹脂層4以著色層41與光半導體元件3a～3c接觸之方式，將光半導體元件3a～3c密封。That is, the sealing resin layer 4 includes the colored layer 41 and the non-colored layer 42 in order from the optical semiconductor element side 3a to 3c. Furthermore, the sealing resin layer 4 seals the optical semiconductor elements 3a to 3c such that the colored layer 41 comes into contact with the optical semiconductor elements 3a to 3c.
圖3中示出圖2所示之顯示體1之光半導體元件3a及3b間附近之放大圖。如圖3所示，於顯示體1中，將光半導體元件3a之重心、光半導體元件3b之重心分別藉由G A、G B表示。將基板2表面作為基準線B。L1係與基準線B平行之第一直線。第一直線L1通過位於作為第一光半導體元件之光半導體元件3a及作為第二光半導體元件之光半導體元件3b之間之著色層41的正面側(圖3之上側)界面之基板側(圖3之下側)端部。L2係與基準線B平行之第二直線。第二直線L2通過位於作為第一光半導體元件之光半導體元件3a及作為第二光半導體元件之光半導體元件3b之間之著色層41的基板側(圖3之下側)界面之基板側(圖3之下側)端部。其中，該基板側之端部位於基板2表面。由此，於圖3中，第二直線L2與基準線B一致。繼而，順時針地由光半導體元件3a側面、第一直線L1、光半導體元件3b側面、及第二直線L2圍成之區域之面積為截面積S2。 FIG. 3 shows an enlarged view of the vicinity between the optical semiconductor elements 3a and 3b of the display 1 shown in FIG. 2 . As shown in FIG. 3 , in the display 1 , the center of gravity of the optical semiconductor element 3 a and the center of gravity of the optical semiconductor element 3 b are represented by GA and GB respectively. Let the surface of the substrate 2 be the reference line B. L1 is the first straight line parallel to the reference line B. The first straight line L1 passes through the substrate side (FIG. 3) of the front side (upper side in FIG. 3) of the interface between the optical semiconductor element 3a as the first optical semiconductor element and the optical semiconductor element 3b as the second optical semiconductor element. lower side) end. L2 is the second straight line parallel to the reference line B. The second straight line L2 passes through the substrate side (lower side in FIG. 3 ) of the interface between the optical semiconductor element 3 a as the first optical semiconductor element and the optical semiconductor element 3 b as the second optical semiconductor element. Figure 3 lower side) end. The end on the substrate side is located on the surface of the substrate 2 . Therefore, the second straight line L2 coincides with the reference line B in FIG. 3 . Then, the area of the region surrounded clockwise by the side surface of the optical semiconductor element 3a, the first straight line L1, the side surface of the optical semiconductor element 3b, and the second straight line L2 is the cross-sectional area S2.
又，L3係通過光半導體元件3a之左側端部之相對於基板2表面之垂線。L4係通過光半導體元件3a之右側端部之相對於基板2表面之垂線。繼而，位於光半導體元件3a之正面側(圖3之上側)且由垂線L3及L4所夾之區域，即順時針地由光半導體元件3a之正面側之端面、垂線L3、著色層41之正面側界面、及垂線L4圍成之區域之面積為截面積S1。此時，顯示體1中，截面積S1小於截面積S2(S1＜S2)。In addition, L3 is a perpendicular line to the surface of the substrate 2 that passes through the left end of the optical semiconductor element 3a. L4 is a perpendicular line relative to the surface of the substrate 2 that passes through the right end of the optical semiconductor element 3a. Then, the area located on the front side of the optical semiconductor element 3a (the upper side in FIG. 3) and sandwiched by the vertical lines L3 and L4, that is, clockwise from the end surface of the front side of the optical semiconductor element 3a, the vertical line L3, and the front surface of the coloring layer 41 The area of the area enclosed by the side interface and the vertical line L4 is the cross-sectional area S1. At this time, in the display body 1, the cross-sectional area S1 is smaller than the cross-sectional area S2 (S1<S2).
於顯示體1中，藉由使密封光半導體元件3a～3c之密封樹脂層4包含著色層41，可防止由設置於基板2上之金屬配線等所引起之光之反射。繼而，若位於光半導體元件3a之正面側之著色層41之截面積S1較小，則表示光半導體元件3a之正面側之著色層41之體積較小，即更多地透過光半導體元件3a發出之正面方向之光。另一方面，若光半導體元件3a及3b間之著色層41之截面積S2較大，則表示光半導體元件間3a及3b之著色層41之體積較大，即更多地吸收光半導體元件3a發出之側面方向之光。又，更多地吸收未設置光半導體元件3a及3b之基板面之由金屬配線等所引起之反射光。由此，於S1小於S2之顯示體1中，光半導體元件3a發出之光之正面方向之透過性優異，同時側面方向之透過性控制為較低，顯示體1不易發生色移，且正面亮度較高。In the display 1, by including the colored layer 41 in the sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c, reflection of light caused by metal wiring and the like provided on the substrate 2 can be prevented. Then, if the cross-sectional area S1 of the colored layer 41 located on the front side of the optical semiconductor element 3a is smaller, it means that the volume of the colored layer 41 on the front side of the optical semiconductor element 3a is smaller, that is, more light is emitted through the optical semiconductor element 3a The light from the front direction. On the other hand, if the cross-sectional area S2 of the colored layer 41 between the optical semiconductor elements 3a and 3b is larger, it means that the volume of the colored layer 41 between the optical semiconductor elements 3a and 3b is larger, that is, it absorbs more of the optical semiconductor element 3a The light emitted from the side direction. In addition, more reflected light caused by metal wiring and the like on the substrate surface where the optical semiconductor elements 3a and 3b are not provided is absorbed. Therefore, in the display 1 where S1 is smaller than S2, the transmittance of the light emitted by the optical semiconductor element 3a in the front direction is excellent, and the transmittance in the side direction is controlled to be low. The display 1 is less prone to color shift and the front brightness is lower. higher.
再者，於圖3中，對位於像素內之一端之光半導體元件3a滿足S1＜S2之情形進行了說明，但除該情形以外或代替該情形，於將光半導體元件3b等位於像素內部之光半導體元件作為第一光半導體元件，將光半導體元件3a及/或光半導體元件3c等與像素內部之光半導體元件相鄰之光半導體元件作為第二光半導體元件之情形時，可滿足S1＜S2，於將光半導體元件3c等位於像素內之另一端之光半導體元件作為第一光半導體元件，將光半導體元件3b等與位於像素內之另一端之光半導體元件相鄰之光半導體元件作為第二光半導體元件之情形時，可滿足S1＜S2。Furthermore, in FIG. 3 , the case where the optical semiconductor element 3 a located at one end of the pixel satisfies S1 When the optical semiconductor element is used as the first optical semiconductor element and the optical semiconductor element 3a and/or the optical semiconductor element 3c adjacent to the optical semiconductor element inside the pixel is used as the second optical semiconductor element, S1< In S2, the optical semiconductor element 3c and other optical semiconductor elements located at the other end of the pixel are used as the first optical semiconductor element, and the optical semiconductor elements 3b and other adjacent optical semiconductor elements located at the other end of the pixel are regarded as the first optical semiconductor element. In the case of the second optical semiconductor element, S1<S2 can be satisfied.
又，關於位於同一像素內之所有光半導體元件之每一個，較佳為於與所有相鄰之光半導體元件之關係中滿足S1＜S2。於該情形時，例如著色層41不易阻礙圖2所示之同一像素內之所有光半導體元件3a～3c發出之光於正面傾斜方向透過，可於非常寬之視野內透過光，可更進一步提高顯示體1之正面亮度，且可更進一步抑制色移。Moreover, it is preferable that each of all optical semiconductor elements located in the same pixel satisfies S1<S2 in relation to all adjacent optical semiconductor elements. In this case, for example, the colored layer 41 is not likely to block the light emitted from all the optical semiconductor elements 3a to 3c in the same pixel shown in FIG. 2 from transmitting in the front oblique direction, and can transmit light in a very wide field of view, which can further improve the performance. The front brightness of the display body 1 can be further suppressed from color shift.
具體而言，如圖4所示，光半導體元件3a～3c發出之朝向正面之光F A、F B、及F C之透過性優異，正面亮度變高。另一方面，光半導體元件3a～3c發出之朝向右方向之光R A、R B、及R C、以及光半導體元件3a～3c發出之朝向左方向之光L A、L B、及L C之透過被著色層41阻礙，由此，像素內之相鄰之光半導體元件3a～3c各自發出之光不易相互干涉，色移受到抑制。 Specifically, as shown in FIG. 4 , the optical semiconductor elements 3a to 3c have excellent transmittance of the light FA , FB , and FC emitted toward the front, and the front brightness becomes high. On the other hand, the light RA , RB , and RC emitted from the optical semiconductor elements 3a to 3c in the right direction , and the light L A , LB , and LC emitted from the optical semiconductor elements 3a to 3c in the left direction. The transmission is blocked by the colored layer 41, so that the light emitted by the adjacent optical semiconductor elements 3a to 3c in the pixel is less likely to interfere with each other, and the color shift is suppressed.
另一方面，圖5中示出先前之顯示體之一實施方式。於圖5所示之顯示體中，自光半導體元件側依序具備非著色層42及著色層41。於該情形時，半導體元件3a～3c發出之朝向右方向之光R A、R B、及R C、以及光半導體元件3a～3c發出之朝向左方向之光L A、L B、及L C之透過不易被著色層41阻礙，同一像素內之相鄰之光半導體元件3a～3c各自發出之光相互干涉，由此，易於產生色移。再者，於圖5所示之態樣中，若增加著色層41之厚度，則光半導體元件3a～3c發出之光F A～F C之光量降低。又，若減小著色層41之厚度，則正面傾斜方向之光之透過率變高，更易於產生色移。與此相對，本發明之顯示體之情形時，可使正面亮度之高度、色移之防止、及防反射能力均優異。 On the other hand, FIG. 5 shows an embodiment of the previous display body. The display shown in FIG. 5 is provided with a non-colored layer 42 and a colored layer 41 in order from the optical semiconductor element side. In this case, the rightward lights RA , RB , and RC emitted by the semiconductor elements 3a to 3c, and the leftward lights LA , LB , and LC emitted by the optical semiconductor elements 3a to 3c The transmission is not easily blocked by the colored layer 41, and the light emitted by the adjacent optical semiconductor elements 3a to 3c in the same pixel interferes with each other, thereby easily causing color shift. Furthermore, in the aspect shown in FIG. 5 , if the thickness of the colored layer 41 is increased, the amount of light F A to F C emitted by the optical semiconductor elements 3 a to 3 c decreases. In addition, if the thickness of the colored layer 41 is reduced, the transmittance of light in the oblique direction from the front becomes higher, making color shift more likely to occur. On the other hand, in the case of the display body of the present invention, it is possible to achieve excellent front brightness, prevention of color shift, and anti-reflection ability.
如此，關於本發明之顯示體，藉由使密封樹脂層自光半導體元件側依序具備著色層及非著色層，且使S1及S2滿足S1＜S2，光半導體元件發出之光之正面方向之透過性優異，同時側面方向之透過性控制為較低，顯示體不易發生色移，且正面亮度較高。In this way, in the display of the present invention, by providing the sealing resin layer with the colored layer and the non-colored layer in order from the optical semiconductor element side, and making S1 and S2 satisfy S1<S2, the front direction of the light emitted by the optical semiconductor element is The transmittance is excellent, and the transmittance in the side direction is controlled to be low. The display is not prone to color shift, and the front brightness is high.
上述第二直線較佳為位於較第一光半導體元件之正面側之端部更靠基板側。即，第二直線L2較佳為位於低於第一光半導體元件之高度之位置(靠基板)。於該情形時，著色層可進一步吸收第一光半導體元件於側面方向發出之光，可進一步抑制色移。又，基於相同之觀點而言，上述第一直線可位於較第一光半導體元件之正面側之端部更靠基板側。The second straight line is preferably located closer to the substrate than the end of the front side of the first optical semiconductor element. That is, the second straight line L2 is preferably located at a position lower than the height of the first optical semiconductor element (near the substrate). In this case, the colored layer can further absorb the light emitted by the first optical semiconductor element in the side direction, thereby further suppressing color shift. In addition, from the same viewpoint, the first straight line may be located closer to the substrate side than the end on the front side of the first optical semiconductor element.
位於第一及第二光半導體元件間之著色層之厚度(第一直線及第二直線間之距離)較佳為小於自基板表面至光半導體元件之正面側之端部之距離(光半導體元件之高度)。於該情形時，著色層可進一步吸收第一光半導體元件於側面方向發出之光，可進一步抑制色移。The thickness of the colored layer between the first and second optical semiconductor elements (the distance between the first straight line and the second straight line) is preferably smaller than the distance from the substrate surface to the end of the front side of the optical semiconductor element (the distance between the first and second optical semiconductor elements). high). In this case, the colored layer can further absorb the light emitted by the first optical semiconductor element in the side direction, thereby further suppressing color shift.
光半導體元件之重心由光半導體元件之立體形狀決定。光半導體元件之立體形狀並無特別限定，可例舉立方體或長方體等角柱、角錐台、圓柱、圓錐台、使其等之上部為圓頂狀之形狀等。光半導體元件之立體形狀為正角柱狀之情形時之重心為光半導體元件之中心。The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples thereof include corner prisms such as cubes and rectangular parallelepipeds, pyramids, cylinders, truncated cones, and shapes in which the upper part is dome-shaped. When the three-dimensional shape of the optical semiconductor element is a right prism, the center of gravity is the center of the optical semiconductor element.
再者，於顯示體1中，可不具備基材部5。又，1個像素內之光半導體元件數可不為3個，並無特別限定。Furthermore, the display body 1 does not need to include the base material portion 5 . In addition, the number of optical semiconductor elements in one pixel does not need to be three, and is not particularly limited.
(第二實施方式) 圖6中示出本發明之顯示體之另一實施方式(第二實施方式)。圖6所示之顯示體1與圖2同樣地，具備基板2、配置於基板2上之複數個光半導體元件3a～3c、將該等光半導體元件3a～3c一起密封之密封樹脂層4、及貼合於密封樹脂層4之與光半導體元件3a～3c側相反之側之表面的基材部5。 (Second Embodiment) Another embodiment (second embodiment) of the display of the present invention is shown in FIG. 6 . The display 1 shown in FIG. 6 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, as in FIG. 2. and the base material portion 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the side of the optical semiconductor elements 3a to 3c.
於圖6所示之顯示體1中，密封樹脂層4係發揮使光擴散之功能之層(擴散功能層)43、著色層41、及非著色層42依序積層而構成，以擴散功能層43側為光半導體元件3a～3c側之方式，且以擴散功能層43與光半導體元件3a～3c接觸之方式，將光半導體元件3a～3c密封。如此，若密封樹脂層自光半導體元件側依序具備擴散功能層、著色層、及非著色層(尤其是非擴散功能層)，則光半導體元件發出之側面方向等之光於入射至著色層前於擴散功能層中擴散，正面亮度進一步提高，且色移進一步受到抑制。In the display 1 shown in FIG. 6 , the sealing resin layer 4 is composed of a layer (diffusion functional layer) 43 that functions to diffuse light, a colored layer 41 , and a non-colored layer 42 that are laminated in this order, so that the diffusion functional layer The side 43 is the side of the optical semiconductor elements 3a to 3c, and the optical semiconductor elements 3a to 3c are sealed with the diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c. In this way, if the sealing resin layer has a diffusion functional layer, a colored layer, and a non-colored layer (especially a non-diffusion functional layer) in order from the side of the optical semiconductor element, the light emitted from the optical semiconductor element in the side direction, etc., before being incident on the colored layer Diffused in the diffusion functional layer, the front brightness is further improved and the color shift is further suppressed.
與光半導體元件3a～3c接觸之擴散功能層43與凹凸形狀吻合，於顯示體1中擴散功能層43亦具有凹凸形狀。著色層41之一面藉由與擴散功能層43之凹凸形狀吻合，具有與擴散功能層43之凹凸形狀相反之凹凸形狀，另一面為平面。與著色層41接觸之非著色層42之兩個面為平面。The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c has a concave and convex shape, and the diffusion functional layer 43 in the display body 1 also has a concave and convex shape. One side of the colored layer 41 has an uneven shape that is opposite to the uneven shape of the diffusion functional layer 43 by matching the uneven shape of the diffusion functional layer 43, and the other side is flat. The two surfaces of the non-colored layer 42 in contact with the colored layer 41 are flat.
著色層41不與光半導體元件3a～3c接觸，第二直線L2與基準線B不一致。於位於光半導體元件3a之正面側之著色層41中，垂線L3及L4所夾之區域之面積為截面積S1。又，於著色層41中，光半導體元件3a及3b間之區域(垂線L4及通過光半導體元件3b之左側之端部的相對於基準線B之垂線L5所夾之區域)之面積為截面積S2。並且，截面積S1小於截面積S2。其他與圖2所示之顯示體1相同。The colored layer 41 is not in contact with the optical semiconductor elements 3a to 3c, and the second straight line L2 does not coincide with the reference line B. In the colored layer 41 located on the front side of the optical semiconductor element 3a, the area between the vertical lines L3 and L4 is the cross-sectional area S1. In addition, in the colored layer 41, the area between the optical semiconductor elements 3a and 3b (the area sandwiched by the vertical line L4 and the vertical line L5 passing through the left end of the optical semiconductor element 3b with respect to the reference line B) is the cross-sectional area. S2. Furthermore, the cross-sectional area S1 is smaller than the cross-sectional area S2. Others are the same as the display 1 shown in Figure 2 .
(第三實施方式) 圖7中示出本發明之顯示體之又一實施方式(第三實施方式)。圖7所示之顯示體1與圖2同樣地，具備基板2、配置於基板2上之複數個光半導體元件3a～3c、將該等光半導體元件3a～3c一起密封之密封樹脂層4、及貼合於密封樹脂層4之與光半導體元件3a～3c側相反之側之表面的基材部5。 (Third Embodiment) FIG. 7 shows yet another embodiment (third embodiment) of the display of the present invention. The display 1 shown in FIG. 7 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, as in FIG. 2. and the base material portion 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the side of the optical semiconductor elements 3a to 3c.
於圖7所示之顯示體1中，使用著色層41及非著色層42之間夾有擴散功能層43者，作為密封樹脂層4。即，密封樹脂層4係著色層41、擴散功能層43、及非著色層42依序積層而構成，以著色層41側為光半導體元件3a～3c側之方式，且以著色層41與光半導體元件3a～3c接觸之方式，將光半導體元件3a～3c密封。In the display 1 shown in FIG. 7 , a diffusion functional layer 43 is sandwiched between the colored layer 41 and the non-colored layer 42 as the sealing resin layer 4 . That is, the sealing resin layer 4 is composed of the colored layer 41, the diffusion functional layer 43, and the non-colored layer 42 laminated in this order, so that the colored layer 41 side faces the optical semiconductor elements 3a to 3c side, and the colored layer 41 and the light The optical semiconductor elements 3a to 3c are sealed by contacting the semiconductor elements 3a to 3c.
與光半導體元件3a～3c接觸之著色層41與凹凸形狀吻合，於顯示體1中著色層41亦具有凹凸形狀。擴散功能層43之一面藉由與著色層41之凹凸形狀吻合，具有與著色層41之凹凸形狀相反之凹凸形狀，另一面為平面。與擴散功能層43接觸之非著色層42之兩個面為平面。其他與圖2所示之顯示體1相同。The colored layer 41 in contact with the optical semiconductor elements 3a to 3c has an uneven shape, and the colored layer 41 in the display body 1 also has an uneven shape. One side of the diffusion function layer 43 has a concave-convex shape that is opposite to the concave-convex shape of the colored layer 41 by matching the concave-convex shape of the colored layer 41, and the other side is flat. The two surfaces of the non-colored layer 42 in contact with the diffusion functional layer 43 are flat. Others are the same as the display 1 shown in Figure 2 .
(第四實施方式) 圖8中示出本發明之顯示體之再一實施方式(第四實施方式)。圖8所示之顯示體1與圖2同樣地，具備基板2、配置於基板2上之複數個光半導體元件3a～3c、將該等光半導體元件3a～3c一起密封之密封樹脂層4、及貼合於密封樹脂層4之與光半導體元件3a～3c側相反之側之表面的基材部5。 (Fourth Embodiment) FIG. 8 shows yet another embodiment (fourth embodiment) of the display of the present invention. The display 1 shown in FIG. 8 is provided with a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the optical semiconductor elements 3a to 3c together, as in FIG. 2. and the base material portion 5 bonded to the surface of the sealing resin layer 4 on the side opposite to the side of the optical semiconductor elements 3a to 3c.
於圖8所示之顯示體1中，密封樹脂層4與圖6所示之顯示體1同樣地，其係擴散功能層43、著色層41、及非著色層42依序積層而構成，以擴散功能層43側為光半導體元件3a～3c側之方式，且以擴散功能層43與光半導體元件3a～3c接觸之方式，將光半導體元件3a～3c密封。與光半導體元件3a～3c接觸之擴散功能層43與凹凸形狀吻合，於顯示體1中擴散功能層43亦具有凹凸形狀。著色層41藉由與擴散功能層43之凹凸形狀吻合，兩個面具有與擴散功能層43之凹凸形狀相反之凹凸形狀。與著色層41接觸之非著色層42之一面藉由與著色層41之凹凸形狀吻合，具有與著色層41之凹凸形狀相反之凹凸形狀，另一面為平面。In the display 1 shown in FIG. 8 , the sealing resin layer 4 is composed of a diffusion functional layer 43 , a colored layer 41 , and a non-colored layer 42 laminated in order, similar to the display 1 shown in FIG. 6 . The diffusion functional layer 43 side faces the optical semiconductor elements 3a to 3c, and the optical semiconductor elements 3a to 3c are sealed with the diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c. The diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c has a concave and convex shape, and the diffusion functional layer 43 in the display body 1 also has a concave and convex shape. By matching the uneven shape of the diffusion functional layer 43, the colored layer 41 has an uneven shape on both surfaces that is opposite to the uneven shape of the diffusion functional layer 43. One side of the non-colored layer 42 in contact with the colored layer 41 has a concave-convex shape opposite to the concave-convex shape of the colored layer 41 by matching the concave-convex shape of the colored layer 41, and the other side is flat.
著色層41不與光半導體元件3a～3c接觸，第二直線L2與基準線B不一致。於位於光半導體元件3a之正面側之著色層41中，垂線L3及L4所夾之區域之面積為截面積S1。又，於著色層41中，位於光半導體元件3a及3b間且由第一直線L1及第二直線L2所夾之區域之面積為截面積S2。並且，截面積S1小於截面積S2。其他與圖6所示之顯示體1相同。The colored layer 41 is not in contact with the optical semiconductor elements 3a to 3c, and the second straight line L2 does not coincide with the reference line B. In the colored layer 41 located on the front side of the optical semiconductor element 3a, the area between the vertical lines L3 and L4 is the cross-sectional area S1. In addition, in the colored layer 41, the area of the region between the optical semiconductor elements 3a and 3b and sandwiched by the first straight line L1 and the second straight line L2 is the cross-sectional area S2. Furthermore, the cross-sectional area S1 is smaller than the cross-sectional area S2. Others are the same as the display 1 shown in Figure 6 .
圖2～8所示之顯示體之剖視圖例如可藉由於使顯示體冷卻之狀態下以通過複數個光半導體元件之重心之方式相對於基板面垂直切斷，而露出剖面，從而獲得。藉由使顯示體冷卻，可抑制因切斷時產生之熱而密封樹脂層發生熔解或變形。切斷可使用雷射光束照射或離子束照射等公知或慣用之切斷裝置進行。又，切斷後，可對露出之剖面進行磨削，而露出變形度更低之剖面。冷卻時之溫度可於抑制密封樹脂層之變形程度或顯示體之破裂之範圍內適當設定。The cross-sectional views of the display shown in FIGS. 2 to 8 can be obtained, for example, by cutting the display perpendicularly to the substrate surface so as to pass through the center of gravity of the plurality of optical semiconductor elements in a cooled state to expose the cross-section. By cooling the display body, melting or deformation of the sealing resin layer due to heat generated during cutting can be suppressed. Cutting can be performed using a known or conventional cutting device such as laser beam irradiation or ion beam irradiation. In addition, after cutting, the exposed section can be ground to expose a section with lower deformation. The temperature during cooling can be appropriately set within a range that suppresses the degree of deformation of the sealing resin layer or the cracking of the display body.
＜密封樹脂層＞ 上述密封樹脂層至少具備上述著色層及上述非著色層。構成上述密封樹脂層之各層(上述著色層及上述非著色層)分別於上述密封樹脂層內可為單層，亦可為具有相同或不同之組成之多層。於包含多層著色層或非著色層之情形時，上述多層可接觸地積層，亦可隔離地積層(例如2個著色層經由1個非著色層而積層)。又，構成上述密封樹脂層之層之總數為包含上述著色層及上述非著色層之2層以上，亦可為3層以上。上述層之總數基於減小顯示體之厚度之觀點而言，例如為10層以下，亦可為5層以下或4層以下。 ＜Sealing resin layer＞ The sealing resin layer includes at least the colored layer and the non-colored layer. Each layer constituting the sealing resin layer (the colored layer and the non-colored layer) may be a single layer in the sealing resin layer, or may be multiple layers having the same or different compositions. In the case of including multiple colored layers or non-colored layers, the multiple layers may be laminated in contact with each other or may be laminated in isolation (for example, two colored layers are laminated via one non-colored layer). Moreover, the total number of layers constituting the sealing resin layer may be two or more layers including the colored layer and the non-colored layer, or may be three or more layers. From the viewpoint of reducing the thickness of the display body, the total number of the above layers is, for example, 10 layers or less, 5 layers or less, or 4 layers or less.
於本發明之顯示體中，上述密封樹脂層自上述光半導體元件側依序具備上述著色層及上述非著色層。藉由具有此種構成，可防止具有凹凸形狀之著色層表面露出於正面側(光半導體元件側之相反側)之密封樹脂層表面，且正面側之密封樹脂層表面易於變得平坦，不易發生外界光之漫反射，熄滅時及發光時顯示體之外觀均提高。於圖2、6～8所示之顯示體1中，密封樹脂層4自光半導體元件3a～3c側依序具備著色層41及非著色層42。In the display of the present invention, the sealing resin layer includes the colored layer and the non-colored layer in order from the optical semiconductor element side. By having such a structure, the surface of the colored layer having an uneven shape can be prevented from being exposed to the surface of the sealing resin layer on the front side (the side opposite to the side of the optical semiconductor element), and the surface of the sealing resin layer on the front side can easily become flat and difficult to occur. The diffuse reflection of external light improves the appearance of the display when it is turned off and when it is illuminated. In the display 1 shown in FIGS. 2 and 6 to 8 , the sealing resin layer 4 includes a colored layer 41 and a non-colored layer 42 in order from the side of the optical semiconductor elements 3 a to 3 c.
上述密封樹脂層較佳為包含擴散功能層。藉由具有此種構成，可使光半導體元件發出之光於上述擴散功能層中擴散，進一步提高正面亮度，並進一步抑制色移。上述擴散功能層較佳為對應於本說明書中之非著色層之層。於圖2中，非著色層42可為擴散功能層，亦可為非擴散功能層。於圖6～8中，密封樹脂層4具備擴散功能層43。The sealing resin layer preferably includes a diffusion functional layer. By having such a structure, the light emitted by the optical semiconductor element can be diffused in the diffusion functional layer, thereby further increasing the front brightness and further suppressing color shift. The above-mentioned diffusion functional layer is preferably a layer corresponding to the non-colored layer in this specification. In FIG. 2 , the non-colored layer 42 can be a diffusion functional layer or a non-diffusion functional layer. In FIGS. 6 to 8 , the sealing resin layer 4 includes a diffusion functional layer 43 .
於上述密封樹脂層具備上述擴散功能層之情形時，上述密封樹脂層較佳為自上述光半導體元件側依序具備上述擴散功能層、上述著色層、及上述非著色層。上述非著色層為擴散功能層及非擴散功能層均可。藉由具有此種構成，可進一步提高正面亮度，進一步抑制色移，同時於熄滅時及發光時均可進一步提高顯示體之外觀。於圖6及圖8中，密封樹脂層4自光半導體元件3a～3c側依序具備擴散功能層43、著色層41、及非著色層42。非著色層42可為擴散功能層，亦可為非擴散功能層。When the sealing resin layer includes the diffusion functional layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in order from the optical semiconductor element side. The above-mentioned non-colored layer may be a diffusion functional layer or a non-diffusion functional layer. By having such a structure, the front brightness can be further improved, the color shift can be further suppressed, and the appearance of the display can be further improved both when it is turned off and when it is emitting light. In FIGS. 6 and 8 , the sealing resin layer 4 includes a diffusion functional layer 43 , a colored layer 41 , and a non-colored layer 42 in order from the side of the optical semiconductor elements 3 a to 3 c. The non-colored layer 42 may be a diffusion functional layer or a non-diffusion functional layer.
於本發明之顯示體中，上述著色層較佳為至少一個面(尤其是光半導體元件側之面)具有與上述凹凸形狀吻合之凹凸形狀。於該情形時，本發明之顯示體易於滿足S1＜S2。又，上述著色層之正面側之面可具有與上述凹凸形狀吻合之凹凸形狀。圖2、圖7、及圖8所示之顯示體1之正面側及光半導體元件側之兩個面具有凹凸形狀。於圖6所示之顯示體1中，著色層41僅光半導體元件側之面具有凹凸形狀，正面側之面平坦。In the display of the present invention, it is preferable that at least one surface of the colored layer (especially the surface on the side of the optical semiconductor element) has a concave and convex shape that matches the above concave and convex shape. In this case, the display of the present invention easily satisfies S1<S2. Furthermore, the front surface of the colored layer may have an uneven shape matching the uneven shape. The display body 1 shown in FIGS. 2 , 7 , and 8 has concave and convex shapes on both the front side and the optical semiconductor element side. In the display 1 shown in FIG. 6 , only the surface on the side of the optical semiconductor element of the colored layer 41 has an uneven shape, and the surface on the front side is flat.
於本發明之顯示體中，較上述著色層更靠正面側處之上述非著色層較佳為正面側為平面(平坦)。於該情形時，於上述密封樹脂層表面不易發生外界光之漫反射，熄滅時及發光時顯示體之外觀均提高。於圖2、6～8所示之顯示體1中，非著色層42之正面側平坦。In the display of the present invention, it is preferable that the non-colored layer located closer to the front side than the colored layer be flat (flat) on the front side. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, and the appearance of the display body is improved both when it is turned off and when it is emitting light. In the display 1 shown in FIGS. 2 and 6 to 8 , the front side of the non-colored layer 42 is flat.
於本發明之顯示體中，可於較上述著色層更靠上述光半導體元件側處具備上述非著色層。即，上述密封樹脂層可自上述光半導體元件側依序具備上述非著色層及上述著色層。又，於較上述著色層更靠上述光半導體元件側處具備上述非著色層之情形時，上述非著色層較佳為兩個面具有與上述凹凸形狀吻合之凹凸形狀。若具有此種構成，則上述著色層易於具有凹凸形狀。於圖6及圖8所示之顯示體1中，密封樹脂層4自光半導體元件3a～3c側依序具備作為非著色層之擴散功能層43及著色層41，擴散功能層43之兩個面具有與上述凹凸形狀吻合之凹凸形狀。In the display of the present invention, the non-colored layer may be provided on the optical semiconductor element side of the colored layer. That is, the sealing resin layer may include the non-colored layer and the colored layer in order from the optical semiconductor element side. Furthermore, when the non-colored layer is provided on the side of the optical semiconductor element rather than the colored layer, it is preferable that the non-colored layer has both surfaces having concave and convex shapes that match the concave and convex shapes. With such a structure, the colored layer can easily have an uneven shape. In the display 1 shown in FIGS. 6 and 8 , the sealing resin layer 4 has a diffusion functional layer 43 as a non-colored layer and a colored layer 41 in order from the side of the optical semiconductor elements 3 a to 3 c. The two diffusion functional layers 43 The mask has an uneven shape matching the above-mentioned uneven shape.
構成上述密封樹脂層之各層(上述著色層及上述非著色層)分別獨立，可具有黏著性，亦可不具有黏著性。其中，較佳為具有黏著性。藉由具有此種構成，上述密封樹脂層可容易地將光半導體元件密封，又，各層間之密接性優異，光半導體元件之密封性更優異。尤佳為至少與光半導體元件接觸之層具有黏著性。藉由具有此種構成，光半導體元件對密封樹脂層之吻合性及嵌入性優異。結果，即便於由光半導體元件所引起之階差較高之情形時，設計性亦優異。再者，除與光半導體元件接觸之層以外之層可不具有黏著性。於該情形時，於拼貼狀態下相鄰之密封樹脂層彼此之密接性較低，於將相鄰之小尺寸之積層體(密封樹脂層將配置於基板上之光半導體元件密封而成之積層體)彼此拉開分離時，不易發生密封樹脂層之破損或相鄰之密封樹脂層之附著。Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the above-mentioned sealing resin layer is independent, and may or may not have adhesiveness. Among them, those having adhesive properties are preferred. By having such a structure, the sealing resin layer can easily seal the optical semiconductor element, and the adhesiveness between each layer is excellent, so that the sealing property of the optical semiconductor element is even more excellent. It is particularly preferable that at least the layer in contact with the optical semiconductor element has adhesiveness. By having such a structure, the optical semiconductor element has excellent conformability and embedding properties into the sealing resin layer. As a result, designability is excellent even when the step difference caused by the optical semiconductor element is high. Furthermore, layers other than the layer in contact with the optical semiconductor element may not have adhesive properties. In this case, the adhesion between the adjacent sealing resin layers in the tiled state is low, and the adjacent small-sized laminated body (the sealing resin layer seals the optical semiconductor element arranged on the substrate) When the laminates are separated from each other, it is difficult for the sealing resin layer to be damaged or the adjacent sealing resin layer to adhere.
(著色層) 本發明之顯示體中之著色層係以防止由顯示體中設置於基板上之金屬配線等所引起之光之反射作為目的之層。上述著色層至少包含著色劑。上述著色層較佳為包含樹脂之樹脂層。上述著色劑可為染料，亦可為顏料，只要可溶解或分散於上述著色層即可。基於即便添加少量亦可達到較低之霧度，且如顏料般無沈降性而易於均勻地分佈之觀點而言，染料較佳。又，基於即便添加少量顯色性亦較高之觀點而言，顏料亦較佳。於使用顏料作為著色劑之情形時，較佳為導電性較低或無導電性者。上述著色劑可僅使用一種，亦可使用二種以上。 (shading layer) The colored layer in the display of the present invention is a layer whose purpose is to prevent reflection of light caused by metal wiring and the like provided on the substrate in the display. The above-mentioned colored layer contains at least a colorant. The colored layer is preferably a resin layer containing resin. The above-mentioned colorant may be a dye or a pigment, as long as it can be dissolved or dispersed in the above-mentioned colored layer. Dyes are preferred from the viewpoint that low haze can be achieved even when a small amount is added, and they are easy to distribute uniformly without settling like pigments. In addition, pigments are also preferred from the viewpoint of high color development even when a small amount is added. When a pigment is used as a colorant, one with low conductivity or no conductivity is preferred. Only one type of colorant may be used, or two or more types may be used.
作為上述著色劑，較佳為黑色系著色劑。作為上述黑色系著色劑，可使用公知或慣用之用於呈現黑色之著色劑(顏料、染料等)，例如可例舉碳黑(爐黑、槽法碳煙、乙炔黑、熱碳黑、燈黑、松煙等)、石墨、氧化銅、二氧化錳、苯胺黑、苝黑、鈦黑、花青黑、活性碳、鐵氧體(非磁性鐵氧體、磁性鐵氧體等)、磁鐵礦、氧化鉻、氧化鐵、二硫化鉬、鉻錯合物、蒽醌系著色劑、氮化鋯等。又，亦可使用組合調配呈現除黑色以外之顏色之著色劑而作為黑色系著色劑發揮功能之著色劑。As the colorant, a black colorant is preferred. As the black colorant, well-known or customary colorants (pigments, dyes, etc.) used to express black can be used. For example, carbon black (furnace black, channel soot, acetylene black, thermal black, lamp black, etc.) can be used. Black, pine smoke, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetic Iron ore, chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone colorants, zirconium nitride, etc. Furthermore, a colorant that functions as a black colorant by combining colorants exhibiting colors other than black may be used.
上述著色層中之著色劑之含有比率基於對顯示體賦予適當之防反射能力之觀點而言，相對於著色層之總量100質量%，較佳為0.2質量%以上，更佳為0.4質量%以上。又，上述著色劑之含有比率例如為10質量%以下，較佳為5質量%以下，更佳為3質量%以下。上述含有比率可根據著色劑之種類、或顯示體之色調及透光率等而適當設定。著色劑可以溶解或分散於適當之溶劑中之溶液或分散液之形態添加於組合物中。The content ratio of the colorant in the above-mentioned colored layer is preferably 0.2 mass% or more, and more preferably 0.4 mass% based on 100 mass% of the total amount of the colored layer, from the perspective of imparting appropriate anti-reflection ability to the display. above. Moreover, the content ratio of the said coloring agent is, for example, 10 mass % or less, Preferably it is 5 mass % or less, More preferably, it is 3 mass % or less. The above-mentioned content ratio can be appropriately set depending on the type of colorant, the color tone and light transmittance of the display, and the like. The coloring agent can be added to the composition in the form of a solution or dispersion dissolved or dispersed in an appropriate solvent.
上述著色層之霧度值(初始霧度值)並無特別限定，基於確保正面亮度及顯示體之視認性之觀點而言，較佳為50%以下，更佳為40%以下，進而較佳為30%以下，尤佳為20%以下。又，上述著色層之霧度值基於高效地降低顯示體之亮度不均之觀點而言，較佳為1%以上，更佳為3%以上，進而較佳為5%以上，尤佳為8%以上，亦可為10%以上。上述霧度值係於上述顯示體中上述著色層最厚之部分之值。The haze value (initial haze value) of the above-mentioned colored layer is not particularly limited. From the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, and still more preferably It is less than 30%, preferably less than 20%. In addition, the haze value of the above-mentioned colored layer is preferably 1% or more, more preferably 3% or more, further preferably 5% or more, and particularly preferably 8%, from the viewpoint of efficiently reducing the brightness unevenness of the display. % or more, or more than 10%. The above-mentioned haze value is the value of the thickest part of the above-mentioned colored layer in the above-mentioned display body.
上述著色層之全光線透過率並無特別限定，基於進一步提高顯示體中之金屬配線等之防反射功能、對比度之觀點而言，較佳為40%以下，更佳為30%以下，進而較佳為25%以下，尤佳為20%以下。又，上述著色層之全光線透過率基於確保顯示體之亮度之觀點而言，較佳為0.5%以上，更佳為1%以上，進而較佳為1.5%以上，尤佳為2%以上，亦可為2.5%以上、或3%以上。上述全光線透過率係於上述顯示體中上述著色層最厚之部分之值。The total light transmittance of the above-mentioned colored layer is not particularly limited. From the viewpoint of further improving the anti-reflection function and contrast of the metal wiring in the display, it is preferably 40% or less, more preferably 30% or less, and further preferably 30% or less. The best value is less than 25%, and the best value is less than 20%. In addition, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, further preferably 1.5% or more, especially 2% or more. It can also be 2.5% or more, or 3% or more. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned colored layer in the above-mentioned display body.
上述著色層之霧度值及全光線透過率分別為單層之值，可使用JIS K7136、JIS K7361-1所規定之方法進行測定，可藉由種類或厚度、著色劑之種類或調配量等進行控制。The haze value and total light transmittance of the above-mentioned colored layer are the values of a single layer respectively. They can be measured using the methods specified in JIS K7136 and JIS K7361-1. They can be measured by the type or thickness, the type or blending amount of the colorant, etc. Take control.
(非著色層) 上述非著色層係與上述著色層不同之層，其係不以防止由顯示體中設置於基板上之金屬配線等所引起之光之反射作為目的之層。上述非著色層可為無色層，亦可輕微著色。又，上述非著色層例如可為以發揮使光擴散之功能作為目的之擴散功能層，亦可為不以發揮使光擴散之功能作為目的之非擴散功能層。上述非著色層可透明，亦可不透明。上述非著色層較佳為包含樹脂之樹脂層。 (non-shading layer) The above-mentioned non-colored layer is a layer different from the above-mentioned colored layer, and is not a layer whose purpose is to prevent reflection of light caused by metal wiring or the like provided on the substrate in the display body. The above-mentioned non-colored layer may be a colorless layer or may be slightly colored. In addition, the non-colored layer may be, for example, a diffusion functional layer whose purpose is to diffuse light, or may be a non-diffusion functional layer whose purpose is not to exert a function of diffusing light. The above-mentioned non-colored layer may be transparent or opaque. The non-colored layer is preferably a resin layer containing resin.
上述非著色層中之著色劑之含有比率相對於非著色層之總量100質量%，較佳為未達0.2質量%，更佳為未達0.1質量%，進而較佳為未達0.05質量%，亦可未達0.01質量%或未達0.005質量%。The content ratio of the colorant in the non-colored layer is preferably less than 0.2 mass%, more preferably less than 0.1 mass%, and still more preferably less than 0.05 mass% relative to 100% by mass of the total amount of the non-colored layer. , it may be less than 0.01 mass% or less than 0.005 mass%.
上述非著色層之全光線透過率並無特別限定，基於確保顯示體之亮度之觀點而言，較佳為40%以上，更佳為60%以上，進而較佳為70%以上，尤佳為80%以上。又，上述非著色層之全光線透過率之上限值並無特別限定，可未達100%，亦可為99.9%以下、或99%以下。上述全光線透過率係於上述顯示體中上述非著色層最厚之部分之值。The total light transmittance of the above-mentioned non-colored layer is not particularly limited. From the perspective of ensuring the brightness of the display, it is preferably 40% or more, more preferably 60% or more, further preferably 70% or more, and particularly preferably More than 80%. In addition, the upper limit of the total light transmittance of the non-colored layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned non-colored layer in the above-mentioned display body.
上述非著色層之全光線透過率係單層之值，可使用JIS K7136、JIS K7361-1所規定之方法進行測定，可藉由非著色層之種類或厚度等進行控制。The total light transmittance of the above-mentioned non-colored layer is the value of a single layer and can be measured using the methods specified in JIS K7136 and JIS K7361-1. It can be controlled by the type or thickness of the non-colored layer.
上述擴散功能層係以使光擴散作為目的之層。若上述密封樹脂層具有上述擴散功能層，則自光半導體元件發出之光於擴散功能層中擴散，例如自光半導體元件之側面發出之光於顯示體之正面方向上發射，顯示體之正面亮度提高，且色移進一步受到抑制。上述擴散功能層較佳為包含樹脂之樹脂層。上述擴散功能層並無限定，較佳為包含光擴散性微粒子。即，上述擴散功能層較佳為包含分散於樹脂層中之光擴散性微粒子。上述光擴散性微粒子可僅使用一種，亦可使用二種以上。The above-mentioned diffusion functional layer is a layer whose purpose is to diffuse light. If the above-mentioned sealing resin layer has the above-mentioned diffusion functional layer, the light emitted from the optical semiconductor element is diffused in the diffusion functional layer. For example, the light emitted from the side of the optical semiconductor element is emitted in the front direction of the display body, and the front brightness of the display body is reduced. is improved, and color shift is further suppressed. The diffusion functional layer is preferably a resin layer containing resin. The diffusion function layer is not limited, but preferably contains light diffusing fine particles. That is, it is preferable that the said diffusion functional layer contains light diffusing microparticles dispersed in a resin layer. Only one type of the light-diffusing fine particles may be used, or two or more types may be used.
上述光擴散性微粒子係與構成擴散功能層之樹脂具有適當之折射率差，並對擴散功能層賦予擴散性能者。作為光擴散性微粒子，可例舉無機微粒子、高分子微粒子等。作為無機微粒子之材質，例如可例舉二氧化矽、碳酸鈣、氫氧化鋁、氫氧化鎂、黏土、滑石、金屬氧化物等。作為高分子微粒子之材質，例如可例舉聚矽氧樹脂、丙烯酸系樹脂(包括例如聚甲基丙烯酸甲酯等聚甲基丙烯酸酯樹脂)、聚苯乙烯樹脂、聚胺基甲酸酯樹脂、三聚氰胺樹脂、聚乙烯樹脂、環氧樹脂等。The light-diffusing fine particles have an appropriate refractive index difference with the resin constituting the diffusion functional layer and impart diffusion properties to the diffusion functional layer. Examples of light-diffusing fine particles include inorganic fine particles, polymer fine particles, and the like. Examples of the material of the inorganic fine particles include silicon dioxide, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of the material of the polymer fine particles include polysiloxy resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, Melamine resin, polyethylene resin, epoxy resin, etc.
作為上述高分子微粒子，較佳為包含聚矽氧樹脂之微粒子。又，作為上述無機微粒子，較佳為包含金屬氧化物之微粒子。作為上述金屬氧化物，較佳為氧化鈦、鈦酸鋇，更佳為氧化鈦。藉由具有此種構成，上述擴散功能層之光擴散性更優異，亮度不均進一步受到抑制。As the above-mentioned polymer fine particles, fine particles containing polysiloxy resin are preferred. Furthermore, as the above-mentioned inorganic fine particles, fine particles containing a metal oxide are preferred. As the above-mentioned metal oxide, titanium oxide and barium titanate are preferred, and titanium oxide is more preferred. By having such a structure, the light diffusivity of the diffusion functional layer is further improved, and brightness unevenness is further suppressed.
上述光擴散性微粒子之形狀並無特別限定，例如可為真球狀、扁平狀、不規則形狀。The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, a true spherical shape, a flat shape, or an irregular shape.
上述光擴散性微粒子之平均粒徑基於賦予適當之光擴散性能之觀點而言，較佳為0.1 μm以上，更佳為0.15 μm以上，進而較佳為0.2 μm以上，尤佳為0.25 μm以上。又，上述光擴散性微粒子之平均粒徑基於防止霧度值變得過高，顯示高清之圖像之觀點而言，較佳為12 μm以下，更佳為10 μm以下，進而較佳為8 μm以下。平均粒徑例如可使用庫爾特計數器進行測定。The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, further preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting appropriate light diffusion performance. Moreover, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and further preferably 8 μm or less. Below μm. The average particle diameter can be measured using a Coulter counter, for example.
上述光擴散性微粒子之折射率較佳為1.2～5，更佳為1.25～4.5，進而較佳為1.3～4，尤佳為1.35～3。The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, further preferably 1.3 to 4, and particularly preferably 1.35 to 3.
上述光擴散性微粒子與構成擴散功能層之樹脂(擴散功能層中除光擴散性微粒子以外之樹脂層)之折射率差之絕對值基於更高效地降低顯示體之亮度不均之觀點而言，較佳為0.001以上，更佳為0.01以上，進而較佳為0.02以上，尤佳為0.03以上，亦可為0.04以上、或0.05以上。又，光擴散性微粒子與樹脂之折射率差之絕對值基於防止霧度值變得過高，顯示高清之圖像之觀點而言，較佳為5以下，更佳為4以下，進而較佳為3以下。The absolute value of the difference in refractive index between the above-mentioned light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer in the diffusion functional layer other than the light-diffusing fine particles) is based on the viewpoint of more efficiently reducing the brightness unevenness of the display. It is preferably 0.001 or more, more preferably 0.01 or more, further preferably 0.02 or more, especially 0.03 or more, and may also be 0.04 or more, or 0.05 or more. Furthermore, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the difference in refractive index between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably is 3 or less.
上述擴散功能層中之上述光擴散性微粒子之含量基於對密封樹脂層賦予適當之光擴散性能之觀點而言，相對於構成擴散功能層之樹脂100質量份，較佳為0.01質量份以上，更佳為0.05質量份以上，進而較佳為0.1質量份以上，尤佳為0.15質量份以上。又，光擴散性微粒子之含量基於防止霧度值變得過高，顯示高清之圖像之觀點而言，相對於構成擴散功能層之樹脂100質量份，較佳為80質量份以下，更佳為70質量份以下。The content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more based on 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting appropriate light diffusion performance to the sealing resin layer. It is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light-diffusing fine particles is preferably 80 parts by mass or less based on 100 parts by mass of the resin constituting the diffusion functional layer, and more preferably It is 70 parts by mass or less.
上述擴散功能層之霧度值(初始霧度值)並無特別限定，基於高效地降低亮度不均之觀點而言，較佳為30%以上，更佳為40%以上，進而較佳為50%以上，尤佳為60%以上，亦可為70%以上、80%以上、90%以上、95%以上、97%以上，基於亮度不均改善效果更優異之觀點而言，進而較佳為99.9%左右。再者，上述擴散功能層之霧度值之上限並無特別限定，即可為100%。上述霧度值係於上述顯示體中上述擴散功能層最厚之部分之值。The haze value (initial haze value) of the diffusion functional layer is not particularly limited. From the viewpoint of efficiently reducing brightness unevenness, it is preferably 30% or more, more preferably 40% or more, and further preferably 50%. % or more, particularly preferably 60% or more, and may also be 70% or more, 80% or more, 90% or more, 95% or more, or 97% or more. From the viewpoint of a better brightness unevenness improvement effect, it is more preferably Around 99.9%. Furthermore, the upper limit of the haze value of the diffusion functional layer is not particularly limited, it can be 100%. The above-mentioned haze value is the value of the thickest part of the above-mentioned diffusion functional layer in the above-mentioned display body.
上述擴散功能層之全光線透過率並無特別限定，基於確保亮度之觀點而言，較佳為40%以上，更佳為60%以上，進而較佳為70%以上，尤佳為80%以上。又，上述擴散功能層之全光線透過率之上限值並無特別限定，可未達100%，亦可為99.9%以下、或99%以下。上述全光線透過率係於上述顯示體中上述擴散功能層最厚之部分之值。The total light transmittance of the above-mentioned diffusion functional layer is not particularly limited. From the perspective of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, further preferably 70% or more, and particularly preferably 80% or more. . In addition, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned diffusion functional layer in the above-mentioned display body.
上述擴散功能層之霧度值及全光線透過率分別為單層之值，可使用JIS K7136、JIS K7361-1所規定之方法進行測定，可藉由擴散功能層之種類或厚度、光擴散性微粒子之種類或調配量等進行控制。The haze value and total light transmittance of the above-mentioned diffusion functional layer are the values of a single layer respectively. They can be measured using the methods specified in JIS K7136 and JIS K7361-1. The type or thickness of the diffusion functional layer and the light diffusivity can be used. Control the type or dosage of fine particles.
上述非擴散功能層之霧度值(初始霧度值)並無特別限定，基於使顯示體之亮度優異之觀點而言，較佳為未達30%，更佳為10%以下，進而較佳為5%以下，尤佳為1%以下，亦可為0.5%以下。再者，上述非擴散功能層之霧度值之下限並無特別限定。上述霧度值係於上述顯示體中上述非擴散功能層最厚之部分之值。The haze value (initial haze value) of the above-mentioned non-diffusion functional layer is not particularly limited. From the viewpoint of making the display excellent in brightness, it is preferably less than 30%, more preferably less than 10%, and still more preferably It is 5% or less, preferably 1% or less, and it can also be 0.5% or less. Furthermore, the lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The above-mentioned haze value is the value of the thickest part of the above-mentioned non-diffusion functional layer in the above-mentioned display body.
上述非擴散功能層之全光線透過率並無特別限定，基於確保顯示體之亮度之觀點而言，較佳為60%以上，更佳為70%以上，進而較佳為80%以上，尤佳為90%以上。又，上述非擴散功能層之全光線透過率之上限值並無特別限定，可未達100%，亦可為99.9%以下、或99%以下。上述全光線透過率係於上述顯示體中上述非擴散功能層最厚之部分之值。The total light transmittance of the above-mentioned non-diffusion functional layer is not particularly limited. From the perspective of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, and further preferably 80% or more, especially preferably 80% or more. is more than 90%. In addition, the upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less. The above-mentioned total light transmittance is the value of the thickest part of the above-mentioned non-diffusion functional layer in the above-mentioned display body.
上述非擴散功能層之霧度值及全光線透過率分別為單層之值，可使用JIS K7136、JIS K7361-1所規定之方法進行測定，可藉由非擴散功能層之種類或厚度等進行控制。The haze value and total light transmittance of the above-mentioned non-diffusion functional layer are the values of a single layer respectively. They can be measured using the methods specified in JIS K7136 and JIS K7361-1, and can be determined by the type or thickness of the non-diffusion functional layer. control.
上述非擴散功能層中之著色劑及/或光擴散性微粒子之含量基於使顯示體之亮度優異之觀點而言，相對於構成非擴散功能層之樹脂100質量份，較佳為未達0.01質量份，更佳為未達0.005質量份。The content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass relative to 100 parts by mass of the resin constituting the non-diffusion functional layer from the viewpoint of making the display excellent in brightness. parts, preferably less than 0.005 parts by mass.
(樹脂層) 於上述著色層及上述非著色層為上述樹脂層之情形時，作為構成上述樹脂層之樹脂，可例舉公知或慣用之樹脂，例如可例舉丙烯酸系樹脂、胺基甲酸酯丙烯酸酯系樹脂、胺基甲酸酯系樹脂、橡膠系樹脂、環氧系樹脂、環氧丙烯酸酯系樹脂、氧雜環丁烷系樹脂、聚矽氧樹脂、聚矽氧丙烯酸系樹脂、聚酯系樹脂、聚醚系樹脂(聚乙烯醚等)、聚醯胺系樹脂、氟系樹脂、乙酸乙烯酯/氯乙烯共聚物、改性聚烯烴等。上述樹脂可僅使用一種，亦可使用二種以上。構成上述密封樹脂層之各層之樹脂相互可相同，亦可不同。 (resin layer) When the above-mentioned colored layer and the above-mentioned non-colored layer are the above-mentioned resin layers, examples of the resin constituting the above-mentioned resin layer include well-known or commonly used resins, such as acrylic resins and urethane acrylate resins. Resin, urethane resin, rubber resin, epoxy resin, epoxy acrylate resin, oxetane resin, silicone resin, silicone acrylic resin, polyester resin , polyether resin (polyvinyl ether, etc.), polyamide resin, fluorine resin, vinyl acetate/vinyl chloride copolymer, modified polyolefin, etc. Only one type of the above-mentioned resin may be used, or two or more types may be used. The resins of each layer constituting the above-mentioned sealing resin layer may be the same or different.
於上述樹脂層為具有黏著性之層(黏著層)之情形時，可使用公知或慣用之感壓型黏著劑作為上述樹脂。作為上述黏著劑，例如可例舉丙烯酸系黏著劑、橡膠系黏著劑(天然橡膠系、合成橡膠系、該等之混合系等)、聚矽氧系黏著劑、聚酯系黏著劑、胺基甲酸酯系黏著劑、聚醚系黏著劑、聚醯胺系黏著劑、氟系黏著劑等。上述黏著劑可僅使用一種，亦可使用二種以上。When the above-mentioned resin layer is an adhesive layer (adhesive layer), a well-known or commonly used pressure-sensitive adhesive can be used as the above-mentioned resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, mixtures thereof, etc.), polysilicone adhesives, polyester adhesives, and amine adhesives. Formate-based adhesives, polyether-based adhesives, polyamide-based adhesives, fluorine-based adhesives, etc. Only one type of the above-mentioned adhesive may be used, or two or more types may be used.
於不損害本發明之效果之範圍內，上述樹脂層於上述各層中亦可包含除上述各成分以外之其他成分。作為上述其他成分，可例舉硬化劑、交聯促進劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、石油樹脂、油溶性酚等)、低聚物、防老化劑、填充劑(金屬粉、有機填充劑、無機填充劑等)、抗氧化劑、塑化劑、軟化劑、界面活性劑、防靜電劑、表面潤滑劑、調平劑、光穩定劑、紫外線吸收劑、聚合抑制劑、粒狀物、箔狀物等。上述各其他成分可僅使用一種，亦可使用二種以上。Within the scope that does not impair the effects of the present invention, the above-mentioned resin layer may also contain other components in addition to the above-mentioned components in each of the above-mentioned layers. Examples of the above-mentioned other components include hardeners, cross-linking accelerators, adhesion-imparting resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, anti-aging agents, and fillers (metallic resins). powder, organic filler, inorganic filler, etc.), antioxidant, plasticizer, softener, surfactant, antistatic agent, surface lubricant, leveling agent, light stabilizer, UV absorber, polymerization inhibitor, Granules, foils, etc. Only one type of each of the above-mentioned other components may be used, or two or more types may be used.
作為上述密封樹脂層之積層構造，可例舉[著色層/擴散功能層]、[著色層/非擴散功能層]、[著色層/擴散功能層/非擴散功能層]、[著色層/非擴散功能層/擴散功能層]、[擴散功能層/著色層/非擴散功能層]、[非擴散功能層/著色層/擴散功能層]、[擴散功能層/著色層/擴散功能層]、[非擴散功能層/著色層/非擴散功能層](以上為自光半導體元件側依序)等。Examples of the laminated structure of the sealing resin layer include [colored layer/diffusion functional layer], [colored layer/non-diffusion functional layer], [colored layer/diffusion functional layer/non-diffusion functional layer], [colored layer/non-diffusion functional layer] Diffusion functional layer/diffusion functional layer], [diffusion functional layer/coloring layer/non-diffusion functional layer], [non-diffusion functional layer/coloring layer/diffusion functional layer], [diffusion functional layer/coloring layer/diffusion functional layer], [Non-diffusion functional layer/colored layer/non-diffusion functional layer] (the above is in order from the optical semiconductor element side), etc.
＜基材部＞ 本發明之顯示體可具備基材部，亦可不具備基材部。若於上述顯示體中於密封樹脂層之正面側具備上述基材部，則可使密封樹脂層表面平坦，由此不易發生光之漫反射，熄滅時及發光時顯示體之外觀均提高。又，藉由於上述基材部形成後述之防眩層或防反射層，可對顯示體賦予防眩性或防反射性。又，藉由於後述之光半導體元件密封用片材中具備上述基材部作為密封用樹脂層之支持體，光半導體元件密封用片材之操作性優異。 ＜Substrate Department＞ The display body of the present invention may or may not have a base material part. If the above-mentioned display body is provided with the above-mentioned base material portion on the front side of the sealing resin layer, the surface of the sealing resin layer can be made flat, so that diffuse reflection of light is less likely to occur, and the appearance of the display body is improved both when it is turned off and when it is emitting light. Furthermore, by forming an anti-glare layer or an anti-reflective layer to be described later on the base material portion, the display body can be provided with anti-glare properties or anti-reflective properties. Furthermore, since the sheet for sealing optical semiconductor elements described below includes the base material portion as a support for the sealing resin layer, the sheet for sealing optical semiconductor elements has excellent handleability.
上述基材部可為單層，亦可為相同或者組成或厚度等不同之多層。於上述基材部為多層之情形時，各層可藉由黏著劑層等其他層而貼合。再者，用於基材部之基材層係與密封樹脂層一起貼附於具備光半導體元件之基板之部分，僅保護於光半導體元件密封用片材之使用時(貼附時)剝離之剝離襯墊、或基材部表面之表面保護膜不包括在「基材部」中。The above-mentioned base material part may be a single layer, or may be multiple layers that are the same or have different compositions or thicknesses. When the above-mentioned base material portion is composed of multiple layers, each layer can be bonded together by other layers such as an adhesive layer. Furthermore, the base material layer used for the base material part is attached to the part of the substrate equipped with the optical semiconductor element together with the sealing resin layer, and is only protected when the optical semiconductor element sealing sheet is peeled off during use (when attached) The release liner or the surface protective film on the surface of the base material part is not included in the "base material part".
作為構成上述基材部之基材層，例如可例舉玻璃或塑膠基材(尤其是塑膠膜)等。作為構成上述塑膠基材之樹脂，例如可例舉：低密度聚乙烯、直鏈狀低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、無規共聚聚丙烯、嵌段共聚聚丙烯、均聚丙烯、聚丁烯、聚甲基戊烯、離子聚合物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯(無規、交替)共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-丙烯共聚物、環烯系聚合物、乙烯-丁烯共聚物、乙烯-己烯共聚物等聚烯烴樹脂；聚胺基甲酸酯；聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯(PBT)等聚酯；聚碳酸酯；聚醯亞胺系樹脂；聚醚醚酮；聚醚醯亞胺；芳香族聚醯胺、全芳香族聚醯胺等聚醯胺；聚苯硫醚；氟樹脂；聚氯乙烯；聚偏二氯乙烯；三乙醯纖維素(TAC)等纖維素樹脂；聚矽氧樹脂；聚甲基丙烯酸甲酯(PMMA)等丙烯酸系樹脂；聚碸；聚芳酯；聚乙酸乙烯酯等。上述樹脂可僅使用一種，亦可使用二種以上。上述基材層亦可為防反射(AR)膜、偏光板、相位差板等各種光學膜。Examples of the base material layer constituting the base material portion include glass or plastic base materials (especially plastic films). Examples of the resin constituting the above plastic base material include: low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra-low density polyethylene, random copolymerized polypropylene, embedded Segment copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate (random, alternating) copolymer, Polyolefin resins such as ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyvinylidene Polyesters such as ethylene phthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT); polycarbonate; polyimide resin; polyether ether ketone; poly Ether imine; aromatic polyamide, fully aromatic polyamide and other polyamides; polyphenylene sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; triacetyl cellulose (TAC) and other fibers Plain resin; polysiloxy resin; polymethylmethacrylate (PMMA) and other acrylic resins; polystyrene; polyarylate; polyvinyl acetate, etc. Only one type of the above-mentioned resin may be used, or two or more types may be used. The above-mentioned base material layer may also be various optical films such as anti-reflection (AR) films, polarizing plates, and phase difference plates.
上述塑膠膜之厚度較佳為20～300 μm，更佳為40～250 μm。若上述厚度為20 μm以上，則光半導體元件密封用片材之支持性及操作性進一步提高。若上述厚度為300 μm以下，則可使顯示體更薄。The thickness of the above plastic film is preferably 20-300 μm, more preferably 40-250 μm. If the thickness is 20 μm or more, the supportability and handleability of the optical semiconductor element sealing sheet will be further improved. If the thickness is 300 μm or less, the display body can be made thinner.
為了提高與密封樹脂層之密接性、保持性等，上述基材部之具備上述密封樹脂層之側之表面可實施例如：電暈放電處理、電漿處理、磨砂加工處理、臭氧暴露處理、火焰暴露處理、高壓電擊暴露處理、游離輻射處理等物理處理；鉻酸處理等化學處理；利用塗佈劑(底塗劑)進行之易接著處理等表面處理。用於提高密接性之表面處理較佳為對基材部之密封樹脂層側之整個表面實施。In order to improve the adhesion, retention, etc. with the sealing resin layer, the surface of the base material portion on the side provided with the sealing resin layer may be subjected to, for example, corona discharge treatment, plasma treatment, frosting treatment, ozone exposure treatment, flame treatment, etc. Physical treatments such as exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; and surface treatments such as easy-adhesion treatment using a coating agent (primer). Surface treatment for improving adhesion is preferably performed on the entire surface of the base material portion on the sealing resin layer side.
上述基材部之厚度基於作為支持體之功能及表面之耐擦傷性優異之觀點而言，較佳為5 μm以上，更佳為10 μm以上。上述基材部之厚度基於透明性更優異之觀點而言，較佳為300 μm以下，更佳為250 μm以下。The thickness of the base material part is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoint of excellent function as a support and scratch resistance of the surface. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of better transparency.
＜顯示體＞ 上述顯示體可具備具有防眩性及/或防反射性之層。藉由具有此種構成，可抑制上述顯示體之光澤或光之反射，使外觀更佳。作為上述具有防眩性之層，可例舉防眩處理層。作為上述具有防反射性之層，可例舉防反射處理層。防眩處理及防反射處理分別可使用公知或慣用之方法實施。上述具有防眩性之層及上述具有防反射性之層可為相同層，亦可為相互不同之層。上述具有防眩性及/或防反射性之層可僅具有一層，亦可具有二層以上。 ＜Display body＞ The above-mentioned display body may be provided with a layer having anti-glare properties and/or anti-reflective properties. By having such a structure, the gloss or light reflection of the display body can be suppressed, resulting in a better appearance. Examples of the layer having anti-glare properties include an anti-glare treatment layer. Examples of the anti-reflective layer include an anti-reflective treated layer. Anti-glare treatment and anti-reflection treatment can be implemented using known or customary methods respectively. The above-mentioned anti-glare layer and the above-mentioned anti-reflective layer may be the same layer or may be different layers. The above-mentioned anti-glare and/or anti-reflective layer may have only one layer, or may have two or more layers.
上述密封樹脂層、或以上述密封樹脂層及上述基材部作為兩個端面之積層體之霧度值(初始霧度值)並無特別限定，基於使亮度不均之抑制效果及設計性更優異之觀點而言，較佳為80%以上，更佳為85%以上，進而較佳為90%以上，尤佳為95%以上。再者，上述霧度值之上限並無特別限定。The haze value (initial haze value) of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is not particularly limited, in order to improve the suppression effect of brightness unevenness and improve the design. From the viewpoint of excellence, 80% or more is preferred, 85% or more is more preferred, 90% or more is more preferred, and 95% or more is particularly preferred. Furthermore, the upper limit of the haze value is not particularly limited.
上述密封樹脂層、或以上述密封樹脂層及上述基材部作為兩個端面之積層體之全光線透過率並無特別限定，基於進一步提高金屬配線等之防反射功能、對比度之觀點而言，較佳為40%以下，更佳為30%以下，進而較佳為20%以下。又，上述全光線透過率基於確保亮度之觀點而言，較佳為0.5%以上。The total light transmittance of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is not particularly limited. From the viewpoint of further improving the anti-reflection function and contrast of metal wiring, etc., It is preferably 40% or less, more preferably 30% or less, and still more preferably 20% or less. In addition, the above-mentioned total light transmittance is preferably 0.5% or more from the viewpoint of ensuring brightness.
上述霧度值及全光線透過率分別可使用JIS K7136、JIS K7361-1所規定之方法進行測定，可藉由構成上述密封樹脂層及上述基材部之各層之積層順序或種類、厚度等進行控制。The haze value and total light transmittance can be measured using the methods specified in JIS K7136 and JIS K7361-1, respectively, and can be determined by the lamination order, type, thickness, etc. of the layers constituting the sealing resin layer and the base material portion. control.
上述密封樹脂層、或以上述密封樹脂層及上述基材部作為兩個端面之積層體之厚度基於提高金屬配線等之防反射功能、對比度之同時，更高效地降低色移之觀點而言，較佳為10～600 μm，更佳為20～550 μm，進而較佳為30～500 μm，進而較佳為40～450 μm，尤佳為50～400 μm。再者，剝離襯墊不包括在上述厚度中。The thickness of the above-mentioned sealing resin layer or the laminate having the above-mentioned sealing resin layer and the above-mentioned base material portion as both end surfaces is based on the viewpoint of improving the anti-reflection function and contrast of metal wiring, etc., and at the same time more efficiently reducing color migration. It is preferably 10 to 600 μm, more preferably 20 to 550 μm, still more preferably 30 to 500 μm, still more preferably 40 to 450 μm, particularly preferably 50 to 400 μm. Again, release liners are not included in the above thickness.
又，本發明之顯示體較佳為具備自發光型顯示裝置。又，藉由將上述自發光型顯示裝置與視需要使用之顯示面板加以組合，可製成作為圖像顯示裝置之顯示體。該情形時之光半導體元件為LED元件。作為上述自發光型顯示裝置，可例舉LED顯示器或背光、或者有機電致發光(有機EL)顯示裝置等。上述背光尤佳為全面直下型背光。上述背光例如包含具備上述基板及配置於該基板上之複數個光半導體元件之積層體作為構成構件之至少一部分。例如於上述自發光型顯示裝置中，上述基板上積層有用於向各LED元件發送發光控制信號之金屬配線層。發出紅色(R)、綠色(G)、藍色(B)各種顏色之光之各LED元件經由金屬配線層交替地排列於基板上。金屬配線層係由銅等金屬所形成，調整各LED元件之發光程度，顯示各種顏色。Furthermore, the display body of the present invention preferably includes a self-luminous display device. Furthermore, by combining the above-mentioned self-luminous display device with a display panel used as necessary, a display body serving as an image display device can be produced. In this case, the optical semiconductor element is an LED element. Examples of the self-luminous display device include an LED display, a backlight, an organic electroluminescence (organic EL) display device, and the like. The above-mentioned backlight is preferably a full direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements arranged on the substrate as at least a part of the constituent member. For example, in the self-luminous display device described above, a metal wiring layer for transmitting light emission control signals to each LED element is laminated on the substrate. LED elements emitting red (R), green (G), and blue (B) colors of light are alternately arranged on the substrate through metal wiring layers. The metal wiring layer is made of copper and other metals and adjusts the luminous intensity of each LED element to display various colors.
本發明之顯示體可為彎折使用之顯示體，例如可彎折之圖像顯示裝置(軟性顯示器)(尤其是可摺疊之圖像顯示裝置(可摺疊顯示器))。具體而言，可例舉具備可摺疊之背光之顯示體、具備可摺疊之自發光型顯示裝置之顯示體等。The display body of the present invention can be a display body that is bent and used, such as a bendable image display device (flexible display) (especially a foldable image display device (foldable display)). Specific examples include a display having a foldable backlight, a display having a foldable self-luminous display device, and the like.
於本發明之顯示體中，由於上述密封樹脂層之光半導體元件之吻合性及嵌入性優異，故而上述光半導體元件可為次毫米LED元件或微型LED元件。In the display of the present invention, since the optical semiconductor elements in the sealing resin layer have excellent conformability and embedding properties, the optical semiconductor elements may be sub-millimeter LED elements or micro LED elements.
根據本發明之顯示體，不易發生由光半導體元件發出之光所引起之色移，且亮度較高。由此，上述顯示體可自較寬之視野以相同色調視認出顯示體。又，即便不提高消耗電力，上述顯示體亦較亮，外觀較佳。進而，根據本發明之顯示體，由基板上之金屬配線等所引起之光之反射受到抑制，光半導體元件不點亮時外觀較佳。According to the display of the present invention, color shift caused by the light emitted by the optical semiconductor element is less likely to occur, and the brightness is higher. Therefore, the above-mentioned display body can be recognized with the same color tone from a wider field of view. In addition, even without increasing power consumption, the above-mentioned display body is brighter and has a better appearance. Furthermore, according to the display of the present invention, reflection of light caused by metal wiring and the like on the substrate is suppressed, and the appearance is better when the optical semiconductor element is not lit.
[顯示體之製造方法] 本發明之顯示體可藉由將具備密封用樹脂層之光半導體元件密封用片材貼合於配置有光半導體元件之基板，並藉由密封用樹脂層將光半導體元件密封，而製造。 [Manufacturing method of display body] The display of the present invention can be produced by bonding an optical semiconductor element sealing sheet having a sealing resin layer to a substrate on which the optical semiconductor element is arranged, and sealing the optical semiconductor element with the sealing resin layer.
(光半導體元件密封用片材) 上述光半導體元件密封用片材係用於將配置於基板上之複數個光半導體元件密封之片材。上述光半導體元件密封用片材至少具備包含著色層及非著色層之密封用樹脂層。上述光半導體元件密封用片材係於藉由上述密封用樹脂層以上述著色層側為上述光半導體元件側之方式將上述複數個光半導體元件密封而形成密封樹脂層時，可滿足S1＜S2之片材。根據本發明之光半導體元件密封用片材，藉由將光半導體元件密封，可提供一種不易發生色移且亮度較高之顯示體。 (Sheet for optical semiconductor element sealing) The optical semiconductor element sealing sheet is a sheet used to seal a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. When the sheet for sealing optical semiconductor elements is formed by sealing the plurality of optical semiconductor elements with the sealing resin layer so that the colored layer side is the optical semiconductor element side, S1<S2 can be satisfied. of sheet material. According to the optical semiconductor element sealing sheet of the present invention, by sealing the optical semiconductor element, it is possible to provide a display body that is less prone to color shift and has higher brightness.
上述光半導體元件密封用片材至少具備包含著色層及非著色層之密封用樹脂層。上述密封用樹脂層係可形成本發明之顯示體中之上述密封樹脂層之層。具體而言，上述密封用樹脂層中之上述著色層係可形成本發明之顯示體中之上述著色層之層，上述密封用樹脂層中之上述非著色層係可形成本發明之顯示體中之上述非著色層之層。具體而言，上述密封用樹脂層中之上述著色層可為組成(構成成分及其等之調配比率)或物性(霧度、全光線透過率等)與本發明之顯示體中之上述著色層相同之層，亦可為藉由硬化成為本發明之顯示體中之上述著色層之層。又，上述密封用樹脂層中之上述非著色層可為組成(構成成分及其等之調配比率)或物性(霧度、全光線透過率等)與本發明之顯示體中之上述非著色層相同之層，亦可為藉由硬化成為本發明之顯示體中之上述非著色層之層。The optical semiconductor element sealing sheet includes at least a sealing resin layer including a colored layer and a non-colored layer. The sealing resin layer may form the sealing resin layer in the display of the present invention. Specifically, the colored layer in the sealing resin layer can form the colored layer in the display of the present invention, and the non-colored layer in the sealing resin layer can form the colored layer in the display of the present invention. The above-mentioned non-colored layer. Specifically, the above-mentioned colored layer in the above-mentioned sealing resin layer may have a composition (components and their blending ratios) or physical properties (haze, total light transmittance, etc.) that are consistent with the above-mentioned colored layer in the display of the present invention. The same layer may also be a layer that becomes the above-mentioned colored layer in the display of the present invention by hardening. In addition, the non-colored layer in the sealing resin layer may have a composition (components and their blending ratios) or physical properties (haze, total light transmittance, etc.) that are consistent with the non-colored layer in the display of the present invention. The same layer may also be a layer that becomes the above-mentioned non-colored layer in the display of the present invention by hardening.
上述密封用樹脂層可根據本發明之顯示體中之密封樹脂層之構造而適當設計。例如於本發明之顯示體包含上述擴散功能層之情形時，上述光半導體元件密封用片材中之上述密封用樹脂層包含擴散功能層。上述密封用樹脂層中之上述擴散功能層可為組成(構成成分及其等之調配比率)或物性(霧度、全光線透過率等)與本發明之顯示體中之上述擴散功能層相同之層，亦可為藉由硬化成為本發明之顯示體中之上述擴散功能層之層。又，上述密封用樹脂層較佳為依序具備上述擴散功能層、上述著色層、及上述非著色層。再者，擴散功能層係對應於上述著色層及上述非著色層之一之層。The sealing resin layer can be appropriately designed according to the structure of the sealing resin layer in the display of the present invention. For example, when the display of the present invention includes the diffusion functional layer, the sealing resin layer in the optical semiconductor element sealing sheet includes the diffusion functional layer. The diffusion functional layer in the sealing resin layer may have the same composition (components and blending ratios thereof) or physical properties (haze, total light transmittance, etc.) as the diffusion functional layer in the display of the present invention. The layer may also be a layer that becomes the above-mentioned diffusion functional layer in the display of the present invention by hardening. Furthermore, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order. Furthermore, the diffusion functional layer is a layer corresponding to one of the above-mentioned colored layer and the above-mentioned non-colored layer.
構成上述密封用樹脂層之各層(上述著色層及上述非著色層)分別獨立，可具有黏著性及/或接著性，亦可不具有黏著性及/或接著性。其中，較佳為具有黏著性及/或接著性。藉由具有此種構成，上述密封用樹脂層可易於貼合於基板及光半導體元件，又，各層間之密接性優異，光半導體元件之密封性更優異。尤佳為至少與光半導體元件接觸之層具有黏著性及/或接著性。藉由具有此種構成，光半導體元件對密封用樹脂層之吻合性及嵌入性優異。結果，即便於由光半導體元件所引起之階差較高之情形時，設計性亦優異。Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the above-mentioned sealing resin layer is independent, and may or may not have adhesiveness and/or adhesiveness. Among them, those having adhesiveness and/or adhesiveness are preferred. By having such a structure, the sealing resin layer can be easily bonded to the substrate and the optical semiconductor element, and the adhesiveness between the layers is excellent, so that the sealing property of the optical semiconductor element is even more excellent. It is particularly preferable that at least the layer in contact with the optical semiconductor element has adhesiveness and/or adhesiveness. By having such a structure, the optical semiconductor element has excellent conformability and embedding properties into the sealing resin layer. As a result, designability is excellent even when the step difference caused by the optical semiconductor element is high.
構成上述密封用樹脂層之各層(上述著色層及上述非著色層)分別獨立，可為具有藉由放射線照射而硬化之性質之樹脂層(放射線硬化性樹脂層)，亦可為不具有藉由放射線照射而硬化之性質之樹脂層(放射線非硬化性樹脂層)。作為上述放射線，例如可例舉電子束、紫外線、α射線、β射線、γ射線、或X射線等。於上述著色層為放射線硬化性樹脂層之情形時，上述著色層中可包含之上述著色劑較佳為吸收可見光，且具有上述放射線硬化性樹脂層可硬化之波長之光之透過性。Each layer (the above-mentioned colored layer and the above-mentioned non-colored layer) constituting the above-mentioned sealing resin layer is independently independent, and may be a resin layer (radiation curable resin layer) that has the property of being cured by radiation irradiation, or may not have the property of being cured by radiation. A resin layer that can be cured by radiation irradiation (radiation non-hardening resin layer). Examples of the radiation include electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, and X-rays. When the above-mentioned colored layer is a radiation-curable resin layer, the above-mentioned colorant that may be included in the above-mentioned colored layer preferably absorbs visible light and has light transmittance of a wavelength at which the above-mentioned radiation curable resin layer can be cured.
上述光半導體元件密封用片材可具備上述基材部。於具備上述基材部之情形時，可於基材部之至少一個面具備上述密封用樹脂層。上述密封用樹脂層之與上述基材部接觸之面係上述密封用樹脂層與光半導體元件相接之側之相反側之面。於上述光半導體元件密封用片材具備上述基材部之情形時，上述光半導體元件密封用片材與上述基材部一起貼合於光半導體元件及基板，上述光半導體元件密封用片材中之基材部成為本發明之顯示體中之基材部。The above-mentioned optical semiconductor element sealing sheet may include the above-mentioned base material part. When the base material part is provided, the sealing resin layer may be provided on at least one surface of the base material part. The surface of the sealing resin layer that is in contact with the base material portion is the surface opposite to the side of the sealing resin layer that is in contact with the optical semiconductor element. When the above-mentioned optical semiconductor element sealing sheet has the above-mentioned base material part, the above-mentioned optical semiconductor element sealing sheet is bonded to the optical semiconductor element and the substrate together with the above-mentioned base material part. In the above-mentioned optical semiconductor element sealing sheet The base material portion becomes the base material portion in the display body of the present invention.
又，上述密封用樹脂層可形成於剝離襯墊上之剝離處理面。於上述光半導體元件密封用片材形成於上述剝離襯墊之情形時，關於上述剝離襯墊，上述密封用樹脂層與光半導體元件相接之側為與剝離襯墊接觸之側。於不具有上述基材部之情形時，上述密封用樹脂層之兩個面可為與剝離襯墊接觸之側。剝離襯墊係用作上述光半導體元件密封用片材之保護材料，於將光半導體元件密封時剝離。再者，基材部及剝離襯墊可以不是必須設置的。Furthermore, the sealing resin layer may be formed on the release-treated surface of the release liner. When the optical semiconductor element sealing sheet is formed on the release liner, the side of the sealing resin layer in contact with the optical semiconductor element is the side in contact with the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be the sides in contact with the release liner. The release liner is used as a protective material for the above optical semiconductor element sealing sheet, and is peeled off when the optical semiconductor element is sealed. In addition, the base material part and the release liner do not need to be provided.
上述剝離襯墊係用於覆蓋保護上述光半導體元件密封用片材表面之要素，於將光半導體元件密封用片材貼合於配置有光半導體元件之基板時，自該片材剝離。The release liner is an element for covering and protecting the surface of the optical semiconductor element sealing sheet, and is peeled from the optical semiconductor element sealing sheet when the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is arranged.
作為上述剝離襯墊，例如可例舉聚對苯二甲酸乙二酯(PET)膜、聚乙烯膜、聚丙烯膜、表面塗佈有氟系剝離劑或丙烯酸長鏈烷基酯系剝離劑等剝離劑之塑膠膜或紙類等。Examples of the release liner include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, a film whose surface is coated with a fluorine-based release agent or a long-chain alkyl acrylate release agent, etc. Stripper for plastic film or paper, etc.
上述剝離襯墊之厚度例如為10～200 μm，較佳為15～150 μm，更佳為20～100 μm。若上述厚度為10 μm以上，則剝離襯墊加工時不易因切口而斷裂。若上述厚度為200 μm以下，則於使用時更易於自上述光半導體元件密封用片材剝離剝離襯墊。The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. If the thickness is 10 μm or more, the release liner will be less likely to break due to cuts during processing. If the thickness is 200 μm or less, the release liner can be more easily peeled off from the optical semiconductor element sealing sheet during use.
使用圖9對上述光半導體元件密封用片材之一實施方式進行說明。圖9係可形成圖2所示之顯示體之上述光半導體元件密封用片材之剖視圖。如圖9所示，光半導體元件密封用片材10可用於將配置於基板上之1個以上之光半導體元件密封，具備基材部5、及形成於基材部5上之密封用樹脂層7。密封用樹脂層7由著色層71及非著色層72之積層體而形成。著色層71及非著色層72均具有黏著性，相互直接積層。密封用樹脂層7之著色層71表面貼附有剝離襯墊6，非著色層72表面貼附有基材部5。One embodiment of the optical semiconductor element sealing sheet will be described using FIG. 9 . FIG. 9 is a cross-sectional view of the optical semiconductor element sealing sheet capable of forming the display shown in FIG. 2 . As shown in FIG. 9 , the optical semiconductor element sealing sheet 10 can be used to seal one or more optical semiconductor elements arranged on a substrate, and includes a base material part 5 and a sealing resin layer formed on the base material part 5 7. The sealing resin layer 7 is formed of a laminate of a colored layer 71 and a non-colored layer 72 . The colored layer 71 and the non-colored layer 72 both have adhesive properties and are directly laminated on each other. The release liner 6 is attached to the surface of the colored layer 71 of the sealing resin layer 7 , and the base material part 5 is attached to the surface of the non-colored layer 72 .
(密封步驟) 於使用上述光半導體元件密封用片材製造本發明之顯示體之方法中，具有密封步驟，該密封步驟係將上述光半導體元件密封用片材貼合於配置有光半導體元件之基板，並藉由密封用樹脂層將光半導體元件密封。於上述密封步驟中，具體而言，首先將剝離襯墊自上述光半導體元件密封用片材剝離，露出密封用樹脂層。繼而，將作為上述光半導體元件密封用片材之露出面之密封用樹脂層面，貼合於具備基板及配置於上述基板上之光半導體元件(較佳為複數個光半導體元件)之積層體(光學構件等)的配置有光半導體元件之基板面，於上述積層體具備複數個光半導體元件之情形時，進而以上述密封用樹脂層填充複數個光半導體元件間之間隙之方式配置複數個光半導體元件，將複數個光半導體元件一起密封。具體而言，如圖10所示，將剝離襯墊6剝離後之光半導體元件密封用片材10之著色層71，以與基板2之配置有光半導體元件3a～3c之面對向之方式配置，將光半導體元件密封用片材10貼合於基板2之配置有光半導體元件3a～3c之面，將光半導體元件3a～3c嵌入密封用樹脂層7。 (Sealing step) In the method of manufacturing the display of the present invention using the above-mentioned sheet for sealing optical semiconductor elements, there is a sealing step of laminating the above-mentioned sheet for sealing optical semiconductor elements to a substrate on which the optical semiconductor elements are arranged, and by The optical semiconductor element is sealed with a sealing resin layer. In the above-mentioned sealing step, specifically, first, the release liner is peeled off from the above-mentioned optical semiconductor element sealing sheet to expose the sealing resin layer. Next, the sealing resin layer, which is the exposed surface of the optical semiconductor element sealing sheet, is bonded to a laminate (preferably a plurality of optical semiconductor elements) including a substrate and optical semiconductor elements (preferably a plurality of optical semiconductor elements) arranged on the substrate. When the above-mentioned laminated body is provided with a plurality of optical semiconductor elements, the plurality of optical semiconductor elements are further arranged so that the above-mentioned sealing resin layer fills the gaps between the plurality of optical semiconductor elements. The semiconductor element seals a plurality of optical semiconductor elements together. Specifically, as shown in FIG. 10 , the colored layer 71 of the optical semiconductor element sealing sheet 10 after peeling off the release liner 6 faces the surface of the substrate 2 on which the optical semiconductor elements 3 a to 3 c are arranged. In the arrangement, the optical semiconductor element sealing sheet 10 is bonded to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the optical semiconductor elements 3a to 3c are embedded in the sealing resin layer 7.
上述貼合時之溫度例如為室溫～110℃之範圍內。又，上述貼合時，可減壓或加壓。藉由減壓或加壓，可抑制空隙形成於密封用樹脂層與基板或光半導體元件之間。又，於上述密封步驟中，較佳為於減壓下將光半導體元件密封用片材貼合，其後加壓。減壓之情形時之壓力例如為1～100 Pa，減壓時間例如為5～600秒。又，加壓之情形時之壓力例如為0.05～0.5 MPa，加壓時間例如為5～600秒。The temperature during the above-mentioned bonding is, for example, in the range of room temperature to 110°C. In addition, during the above-mentioned bonding, the pressure can be reduced or increased. By reducing or increasing pressure, it is possible to suppress the formation of gaps between the sealing resin layer and the substrate or optical semiconductor element. Moreover, in the above-mentioned sealing step, it is preferable to bond the optical semiconductor element sealing sheets together under reduced pressure and then apply pressure. In the case of decompression, the pressure is, for example, 1 to 100 Pa, and the decompression time is, for example, 5 to 600 seconds. In the case of pressurization, the pressure is, for example, 0.05 to 0.5 MPa, and the pressurization time is, for example, 5 to 600 seconds.
藉由適當設定上述密封用樹脂層中之著色層之厚度、或貼合時之溫度或壓力等，可對所得之顯示體中之著色層與光半導體元件之吻合性、或上述凹凸形狀中之凹部及凸部之各區域之著色層厚度進行調整。藉此，可使所得之顯示體成為滿足S1＜S2之形態。By appropriately setting the thickness of the colored layer in the sealing resin layer, the temperature or pressure during lamination, etc., it is possible to control the conformity of the colored layer and the optical semiconductor element in the resulting display, or the uneven shape of the The thickness of the colored layer in each area of the concave and convex parts is adjusted. Thereby, the obtained display body can be made into the form which satisfies S1<S2.
(放射線照射步驟) 於上述密封用樹脂層具備放射線硬化性樹脂層之情形時，上述製造方法可進而具備放射線照射步驟，該放射線照射步驟係對具備上述基板、配置於上述基板上之光半導體元件、及將上述光半導體元件密封之上述光半導體元件密封用片材之積層體照射放射線，使上述放射線硬化性樹脂層硬化而形成硬化物層。作為上述放射線，如上所述，可例舉電子束、紫外線、α射線、β射線、γ射線、X射線等。其中，較佳為紫外線。照射放射線時之溫度例如為室溫～100℃之範圍內，照射時間例如為1分鐘～1小時。 (Radiation irradiation step) In the case where the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step. The radiation irradiation step includes the above-mentioned substrate, an optical semiconductor element arranged on the above-mentioned substrate, and the above-mentioned light irradiation step. The laminated body of the optical semiconductor element sealing sheet for semiconductor element sealing is irradiated with radiation to harden the radiation curable resin layer to form a cured material layer. Examples of the radiation include, as mentioned above, electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, X-rays, and the like. Among them, ultraviolet rays are preferred. The temperature when irradiating radiation is, for example, in the range of room temperature to 100°C, and the irradiation time is, for example, 1 minute to 1 hour.
(切割步驟) 上述製造方法可進而具備切割步驟，該切割步驟係對具備上述基板、配置於上述基板上之光半導體元件、及將上述光半導體元件密封之上述光半導體元件密封用片材之積層體進行切割。上述積層體可對進行上述放射線照射步驟後之積層體進行。於上述積層體具備放射線硬化性樹脂層藉由上述放射線照射發生硬化而成之硬化物層之情形時，於上述切割步驟中，切割去除光半導體元件密封用片材之硬化物層及基板之側端部。藉此，可於側面露出充分硬化且黏著性顯著降低之硬化物層之面。上述切割可使用公知或慣用之方法進行，例如可藉由使用切割刀之方法、或雷射照射進行。 (cutting step) The above-mentioned manufacturing method may further include a cutting step of cutting a laminate including the substrate, the optical semiconductor element arranged on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. The above-mentioned laminated body can be formed on the laminated body after the above-mentioned radiation irradiation step. When the above-mentioned laminated body has a cured material layer in which the radiation-curable resin layer is cured by the above-mentioned radiation irradiation, in the above-mentioned cutting step, the cured material layer and the side of the substrate of the optical semiconductor element sealing sheet are cut and removed Ends. Thereby, the surface of the hardened material layer which is fully hardened and whose adhesiveness is significantly reduced can be exposed on the side. The above-mentioned cutting can be carried out using known or customary methods, for example, it can be carried out by using a cutting knife or laser irradiation.
(拼貼步驟) 上述製造方法可進而具備拼貼步驟，該拼貼步驟係將上述切割步驟中所得之複數個顯示體以於平面方向上接觸之方式排列。於上述拼貼步驟中，將上述切割步驟中所得之複數個積層體以於平面方向上接觸之方式排列拼貼。如此，可製造1個較大之顯示體。 (Collage steps) The above-mentioned manufacturing method may further include a collage step of arranging the plurality of display bodies obtained in the above-mentioned cutting step so as to be in contact with each other in the plane direction. In the above-mentioned collaging step, the plurality of laminated bodies obtained in the above-mentioned cutting step are arranged and collaged in such a manner that they are in contact with each other in the plane direction. In this way, a larger display body can be produced.
如上所述，可製造本發明之顯示體。於光半導體元件密封用片材10中密封用樹脂層7不具有放射線硬化性樹脂層之情形時，密封用樹脂層7成為顯示體1中之密封樹脂層4。另一方面，於光半導體元件密封用片材10中密封用樹脂層7具有放射線硬化性樹脂層之情形時，例如於非著色層72為放射線硬化性樹脂層之情形時，藉由使非著色層72硬化，而形成非著色層42，從而成為密封樹脂層4。As described above, the display body of the present invention can be produced. When the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 does not have a radiation curable resin layer, the sealing resin layer 7 becomes the sealing resin layer 4 in the display 1 . On the other hand, when the sealing resin layer 7 in the optical semiconductor element sealing sheet 10 has a radiation curable resin layer, for example, when the non-colored layer 72 is a radiation curable resin layer, by making the non-colored layer The layer 72 hardens to form the non-colored layer 42 and becomes the sealing resin layer 4 .
1:顯示體 2:基板 3a～3f:光半導體元件 3,3':像素 4:密封樹脂層 5:基材部 6:剝離襯墊 7:密封用樹脂層 10:光半導體元件密封用片材 11:光學構件 31:支持體 41:著色層 42:非著色層 43:擴散功能層(非著色層) 71:著色層 72:非著色層 B:基準線 F A:光 F B:光 F C:光 G A:重心 G B:重心 L1:第一直線 L2:第二直線 L3:垂線 L4:垂線 L5:垂線 L A:光 L B:光 L C:光 N:凹部 P:凸部 R A:光 R B:光 R C:光 S1:截面積 S2:截面積 1: Display body 2: Substrates 3a to 3f: Optical semiconductor elements 3, 3': Pixel 4: Sealing resin layer 5: Base material part 6: Release liner 7: Sealing resin layer 10: Optical semiconductor element sealing sheet 11: Optical member 31: Support 41: Colored layer 42: Non-colored layer 43: Diffusion functional layer (non-colored layer) 71: Colored layer 72: Non-colored layer B: Reference line F A : Light F B : Light F C :light G A :center of gravity G B :center of gravity L1: first straight line L2: second straight line L3: vertical line L4: vertical line L5: vertical line L A : light L B : light L C : light N: concave part P: convex part R A : Light R B :Light R C :Light S1: Cross-sectional area S2: Cross-sectional area
圖1係複數個光半導體元件以像素為單位配置於基板上之光學構件之局部俯視圖。 圖2係表示本發明之顯示體之一實施方式之局部剖視圖。 圖3係圖2所示之顯示體之局部放大圖。 圖4係表示圖2所示之顯示體之光半導體元件發光之情況的局部剖視圖。 圖5係表示先前之顯示體之光半導體元件發光之情況的局部剖視圖。 圖6係表示本發明之顯示體之另一實施方式之局部剖視圖。 圖7係表示本發明之顯示體之又一實施方式之局部剖視圖。 圖8係表示本發明之顯示體之再一實施方式之局部剖視圖。 圖9係表示本發明之光半導體元件密封用片材之一實施方式之剖視圖。 圖10係表示使用圖9所示之光半導體元件密封用片材將光半導體元件密封之步驟之局部剖視圖。 FIG. 1 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged on a substrate in units of pixels. FIG. 2 is a partial cross-sectional view showing one embodiment of the display body of the present invention. Figure 3 is a partial enlarged view of the display body shown in Figure 2. FIG. 4 is a partial cross-sectional view showing how the optical semiconductor element of the display shown in FIG. 2 emits light. FIG. 5 is a partial cross-sectional view showing how the optical semiconductor element of the conventional display emits light. FIG. 6 is a partial cross-sectional view showing another embodiment of the display body of the present invention. FIG. 7 is a partial cross-sectional view showing another embodiment of the display body of the present invention. FIG. 8 is a partial cross-sectional view showing yet another embodiment of the display body of the present invention. FIG. 9 is a cross-sectional view showing one embodiment of the optical semiconductor element sealing sheet of the present invention. FIG. 10 is a partial cross-sectional view showing a step of sealing an optical semiconductor element using the optical semiconductor element sealing sheet shown in FIG. 9 .
1:顯示體 1:Display body
2:基板 2:Substrate
3a~3c:光半導體元件 3a~3c: Optical semiconductor components
4:密封樹脂層 4:Sealing resin layer
5:基材部 5:Substrate Department
31:支持體 31:Support
41:著色層 41: Shading layer
42:非著色層 42:Non-shading layer
N:凹部 N: concave part
P:凸部 P: convex part
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-049419 | 2022-03-25 | ||
| JP2022049419A JP2023142479A (en) | 2022-03-25 | 2022-03-25 | Display body and sheet for sealing optical semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202407400A true TW202407400A (en) | 2024-02-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112111230A TW202407400A (en) | 2022-03-25 | 2023-03-24 | Display body and sheet for sealing optical semiconductor element |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023142479A (en) |
| KR (1) | KR20230139326A (en) |
| CN (1) | CN116805646A (en) |
| TW (1) | TW202407400A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6906560B2 (en) | 2019-04-03 | 2021-07-21 | リンテック株式会社 | Adhesive sheet and display |
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2022
- 2022-03-25 JP JP2022049419A patent/JP2023142479A/en active Pending
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2023
- 2023-03-21 KR KR1020230036361A patent/KR20230139326A/en unknown
- 2023-03-23 CN CN202310290325.7A patent/CN116805646A/en active Pending
- 2023-03-24 TW TW112111230A patent/TW202407400A/en unknown
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| Publication number | Publication date |
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| JP2023142479A (en) | 2023-10-05 |
| CN116805646A (en) | 2023-09-26 |
| KR20230139326A (en) | 2023-10-05 |
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