TW202349478A - Conveyance unit and processing device capable of drying a work-piece or a lower surface of a frame unit containing the work-piece and suppressing a decrease in productivity - Google Patents
Conveyance unit and processing device capable of drying a work-piece or a lower surface of a frame unit containing the work-piece and suppressing a decrease in productivity Download PDFInfo
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- TW202349478A TW202349478A TW112121035A TW112121035A TW202349478A TW 202349478 A TW202349478 A TW 202349478A TW 112121035 A TW112121035 A TW 112121035A TW 112121035 A TW112121035 A TW 112121035A TW 202349478 A TW202349478 A TW 202349478A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
本發明是有關於一種用於搬送被加工物或包含被加工物之框架單元的搬送單元、及具備此搬送單元之加工裝置。The present invention relates to a transport unit for transporting a workpiece or a frame unit containing the workpiece, and a processing device provided with the transport unit.
IC(積體電路，Integrated Circuit)等之器件的晶片是在行動電話以及個人電腦等的各種電子機器中不可或缺的構成要素。像這樣的晶片是以例如以下的順序來製造。Chips of devices such as ICs (Integrated Circuits) are indispensable components in various electronic devices such as mobile phones and personal computers. Such a wafer is manufactured in the following procedure, for example.
首先，實施光刻等而在包含晶圓等之被加工物的正面形成多數個元件，藉此形成複數個器件。接著，對被加工物的背面側進行磨削來將被加工物薄化。接著，沿著複數個器件的交界切削被加工物來將被加工物分割成複數個晶片。First, photolithography or the like is performed to form a plurality of elements on the front surface of a workpiece including a wafer or the like, thereby forming a plurality of devices. Next, the back side of the workpiece is ground to thin the workpiece. Next, the workpiece is cut along the boundaries of the plurality of devices to divide the workpiece into a plurality of wafers.
在對被加工物進行磨削之磨削裝置或對被加工物進行切削之切削裝置等的加工裝置中，一般而言，是在被加工物的下表面(例如正面)側已被工作夾台保持之狀態下，從上表面(例如背面)側來加工被加工物。In processing devices such as a grinding device for grinding a workpiece or a cutting device for cutting a workpiece, generally speaking, the lower surface (for example, the front) side of the workpiece is clamped by a work chuck. In the maintained state, the workpiece is processed from the upper surface (for example, the back surface) side.
又，當在此加工裝置中加工被加工物時，會起因於加工具與被加工物之摩擦而使被加工物被加熱並且產生被去除之被加工物的碎屑(加工屑)。並且，若發生被加工物的加熱及/或加工屑對被加工物的附著，會有以下疑慮：被加工物破損，且/或從被加工物所製造之晶片的品質惡化。In addition, when the workpiece is processed in this processing device, the workpiece is heated due to friction between the processing tool and the workpiece, and chips (machining chips) of the removed workpiece are generated. Furthermore, if heating of the workpiece and/or adhesion of processing chips to the workpiece occurs, there is a concern that the workpiece may be damaged and/or the quality of wafers produced from the workpiece may deteriorate.
因此，在加工裝置中，大多會在已對被加工物的上表面供給有純水等之液體(加工液)的狀態下對被加工物進行加工，並於之後在對被加工物的上表面供給有純水等之液體(洗淨液)的狀態下對被加工物進行洗淨。一般而言，此洗淨會在藉由有別於上述之工作夾台的旋轉工作台來保持被加工物的下表面側之狀態下進行。Therefore, in the processing apparatus, the workpiece is often processed in a state where liquid (machining fluid) such as pure water is supplied to the upper surface of the workpiece, and then the upper surface of the workpiece is processed. The workpiece is washed while supplying a liquid (cleaning liquid) such as pure water. Generally speaking, this cleaning is performed in a state where the lower surface side of the workpiece is held by a rotary table that is different from the above-mentioned work chuck.
在此，在已從工作夾台搬出之被加工物中，會有以下情形：不僅其上表面是濕的，其下表面也是濕的。例如，當完成被加工物之加工後，為了使被加工物從工作夾台分開而有從工作夾台朝向被加工物供給空氣之作法。Here, in the workpiece that has been moved out from the work chuck, there may be a case where not only the upper surface but also the lower surface is wet. For example, in order to separate the workpiece from the work chuck after completing the processing of the workpiece, there is a method of supplying air from the workchuck to the workpiece.
在此情況下，加工液會繞進被加工物與工作夾台之間的間隙，而有被加工物的下表面被弄濕之情形。並且，若藉由旋轉工作台保持下表面已被弄濕之被加工物，會有以下疑慮：於將此被加工物洗淨後，要將被加工物從旋轉工作台搬出會變得較困難。In this case, the machining fluid may flow into the gap between the workpiece and the work chuck, and the lower surface of the workpiece may become wet. Furthermore, if the workpiece whose lower surface has been wetted is held on the rotary table, there is a concern that it will be difficult to remove the workpiece from the rotary table after the workpiece is washed. .
根據此點，已提出有以下作法：設置朝向被加工物的搬送路徑噴射空氣之氣簾(參照例如專利文獻1)。在具備此氣簾之加工裝置中，可以藉由使加工後的被加工物移動成在由氣簾所噴射出之空氣中穿行，而使附著於被加工物之加工液飛散並去除。From this point of view, it has been proposed to provide an air curtain that injects air toward the conveyance path of the workpiece (see, for example, Patent Document 1). In a processing device equipped with this air curtain, the processed workpiece can be moved to pass through the air ejected from the air curtain, so that the machining fluid adhering to the workpiece can be scattered and removed.
因此，在此加工裝置中，可以在被加工物往旋轉工作台的搬入之前，使被加工物的下表面乾燥。其結果，在此加工裝置中，變得容易將洗淨後的被加工物從旋轉工作台搬出。 先前技術文獻 專利文獻 Therefore, in this processing apparatus, the lower surface of the workpiece can be dried before the workpiece is loaded into the rotary table. As a result, in this processing device, it becomes easy to carry out the cleaned workpiece from the rotary table. Prior technical literature patent documents
專利文獻1：日本特開平9-293695號公報Patent Document 1: Japanese Patent Application Laid-Open No. 9-293695
發明欲解決之課題The problem to be solved by the invention
在上述之加工裝置中，於將被加工物的下表面乾燥時，必須將被加工物在由氣簾所噴射之空氣中穿行時的移動速度設得較小。不過，在此情況下，直到完成被加工物的加工為止所需要的時間會變長，而有產出量降低之疑慮。In the above-mentioned processing device, when drying the lower surface of the object to be processed, the moving speed of the object to be processed when passing through the air sprayed by the air curtain must be set small. However, in this case, the time required until the processing of the workpiece is completed becomes longer, and there is a concern that the throughput decreases.
有鑒於這一點，本發明之目的在於提供一種既可使被加工物或包含被加工物之框架單元的下表面乾燥，並且抑制產出量的降低之搬送單元及/或包含此搬送單元之加工裝置。 用以解決課題之手段 In view of this, it is an object of the present invention to provide a conveyor unit and/or a process including the conveyor unit that can dry a workpiece or the lower surface of a frame unit containing the workpiece while suppressing a decrease in throughput. device. means to solve problems
根據本發明的一個層面，可提供一種搬送單元，用於搬送被加工物或包含該被加工物之框架單元，前述搬送單元具備：保持機構，用於保持該被加工物或該框架單元；傾斜度調整機構，用於調整已被該保持機構保持之該被加工物或該框架單元的傾斜度；水平方向移動機構，用於使已被該保持機構保持之該被加工物或該框架單元沿著水平方向移動；鉛直方向移動機構，用於使已被該保持機構保持之該被加工物或該框架單元沿著鉛直方向移動；及空氣噴射器，從藉由該水平方向移動機構使已被該保持機構保持之該被加工物或該框架單元沿著該水平方向移動時的該被加工物或該框架單元的移動路徑來觀看，為定位在下方，且朝向上方噴射空氣， 該傾斜度調整機構調整該被加工物或該框架單元的傾斜度，以使已被該保持機構保持之該被加工物或該框架單元的行進方向前側比行進方向後側成為更上方，且該水平方向移動機構使已被該保持機構保持之該被加工物或該框架單元，在該空氣噴射器已朝向上方噴射該空氣之狀態下以通過該空氣噴射器的上方的方式移動。 According to one aspect of the present invention, a transport unit can be provided for transporting an object to be processed or a frame unit containing the object to be processed. The transport unit is provided with: a holding mechanism for holding the object to be processed or the frame unit; and tilting. The degree adjustment mechanism is used to adjust the inclination of the workpiece or the frame unit held by the holding mechanism; the horizontal movement mechanism is used to move the workpiece or the frame unit held by the holding mechanism along the moves in the horizontal direction; a vertical moving mechanism is used to move the workpiece or the frame unit that has been held by the holding mechanism in the vertical direction; and an air injector is used to move the workpiece that has been held by the holding mechanism in the vertical direction; The holding mechanism holds the workpiece or the frame unit when viewed from the movement path of the workpiece or the frame unit when moving along the horizontal direction, so as to be positioned downward and spray air upward, The inclination adjustment mechanism adjusts the inclination of the workpiece or the frame unit so that the front side in the traveling direction of the workpiece or the frame unit held by the holding mechanism is higher than the rear side in the traveling direction, and the The horizontal moving mechanism moves the workpiece or the frame unit held by the holding mechanism in a manner that passes above the air injector in a state where the air injector injects the air upward.
根據本發明的另一個層面，可提供一種加工裝置，用於加工被加工物，前述加工裝置具備：工作夾台，用於在一邊對該被加工物的上表面供給加工液一邊對該被加工物進行加工時保持該被加工物的下表面側；旋轉工作台，用於在一邊對該被加工物的該上表面供給洗淨液一邊對該被加工物進行洗淨時保持該被加工物的該下表面側；片匣載置區域，供用於容置該被加工物之片匣載置；及搬送單元，用於在該工作夾台與該旋轉工作台之間、或該旋轉工作台與該片匣之間的至少一者，搬送該被加工物或包含該被加工物之框架單元， 該搬送單元具備：保持機構，用於保持該被加工物或該框架單元；傾斜度調整機構，用於調整已被該保持機構保持之該被加工物或該框架單元的傾斜度；水平方向移動機構，用於使已被該保持機構保持之該被加工物或該框架單元沿著水平方向移動；鉛直方向移動機構，用於使已被該保持機構保持之該被加工物或該框架單元沿著鉛直方向移動；及空氣噴射器，從藉由該水平方向移動機構使已被該保持機構保持之該被加工物或該框架單元沿著該水平方向移動時的該被加工物或該框架單元的移動路徑來觀看，為定位在下方，且朝向上方噴射空氣， 該傾斜度調整機構調整該被加工物或該框架單元的傾斜度，以使已被該保持機構保持之該被加工物或該框架單元的行進方向前側比行進方向後側成為更上方，且該水平方向移動機構使已被該保持機構保持之該被加工物或該框架單元，在該空氣噴射器已朝向上方噴射該空氣之狀態下以通過該空氣噴射器的上方的方式移動。 發明效果 According to another aspect of the present invention, a processing device for processing a workpiece is provided. The processing device includes a work chuck for processing the workpiece while supplying a machining fluid to an upper surface of the workpiece. When the object is being processed, the lower surface side of the object is held; the rotating table is used to hold the object while supplying cleaning liquid to the upper surface of the object while cleaning the object. The lower surface side of and at least one of the cassettes, transporting the object to be processed or the frame unit containing the object to be processed, The transport unit is equipped with: a holding mechanism for holding the workpiece or the frame unit; an inclination adjustment mechanism for adjusting the inclination of the workpiece or the frame unit held by the holding mechanism; horizontal movement The mechanism is used to move the workpiece or the frame unit held by the holding mechanism in the horizontal direction; the vertical movement mechanism is used to move the workpiece or the frame unit held by the holding mechanism in the horizontal direction. Move in the vertical direction; and the air injector moves the workpiece or the frame unit held by the holding mechanism from the workpiece or the frame unit in the horizontal direction from the horizontal movement mechanism. Looking at the moving path, it is positioned below and sprays air upward. The inclination adjustment mechanism adjusts the inclination of the workpiece or the frame unit so that the front side in the traveling direction of the workpiece or the frame unit held by the holding mechanism is higher than the rear side in the traveling direction, and the The horizontal moving mechanism moves the workpiece or the frame unit held by the holding mechanism in a manner that passes above the air injector in a state where the air injector injects the air upward. Invention effect
在本發明的搬送單元中，是傾斜度調整機構調整被加工物或框架單元的傾斜度，以使已被保持機構保持之被加工物或包含被加工物之框架單元的行進方向前側比行進方向後側成為更上方，且水平方向移動機構使已被保持機構保持之被加工物或框架單元，在空氣噴射器已朝向上方噴射空氣之狀態下以通過空氣噴射器的上方的方式移動。In the transport unit of the present invention, the inclination adjustment mechanism adjusts the inclination of the object to be processed or the frame unit so that the object to be processed or the frame unit including the object to be processed held by the holding mechanism is farther forward in the traveling direction than in the traveling direction. The rear side becomes further upward, and the horizontal movement mechanism moves the workpiece or the frame unit held by the holding mechanism so as to pass above the air injector in a state where the air injector injects air upward.
亦即，在此搬送單元中，是在已傾斜成被加工物或框架單元的行進方向前側比行進方向後側成為更上方之狀態下，進行對被加工物或框架單元的下表面之空氣的噴射。在此情況下，例如已附著於被加工物或框架單元的下表面之液體(例如加工液)會一邊沿著下表面一邊朝向被加工物或框架單元的行進方向後側流動，而變得容易從該後端掉落。That is, in this transport unit, air is blown to the lower surface of the workpiece or the frame unit in a state where the front side of the workpiece or frame unit in the traveling direction is higher than the rear side in the travel direction. Squirt. In this case, for example, the liquid (for example, the machining fluid) that has adhered to the lower surface of the workpiece or the frame unit flows toward the rear side of the workpiece or the traveling direction of the frame unit along the lower surface, making it easier to Dropped from that backend.
因此，在利用此搬送單元將被加工物或框架單元例如從工作夾台搬送至旋轉工作台的情況下，可以將被加工物或框架單元的移動速度設得較大。其結果，在此搬送單元中，變得既可使被加工物或框架單元的下表面乾燥，並且抑制產出量的降低。Therefore, when this transport unit is used to transport a workpiece or a frame unit, for example, from a work chuck to a rotary table, the moving speed of the workpiece or frame unit can be set high. As a result, in this transport unit, it is possible to suppress a decrease in throughput while drying the workpiece or the lower surface of the frame unit.
用以實施發明之形態Form used to implement the invention
參照附加圖式來說明本發明的實施形態。圖1是示意地顯示磨削裝置之一例的立體圖。再者，圖1所示之X軸方向(左右方向)以及Y軸方向(前後方向)是在水平面上相互正交之方向，又，Z軸方向(上下方向)是正交於X軸方向以及Y軸方向之方向(鉛直方向)。Embodiments of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view schematically showing an example of a grinding device. Furthermore, the X-axis direction (left-right direction) and the Y-axis direction (front-back direction) shown in Figure 1 are directions orthogonal to each other on the horizontal plane, and the Z-axis direction (up-down direction) is orthogonal to the X-axis direction and The direction of the Y-axis (vertical direction).
圖1所示之磨削裝置2具備支撐或容置各構成要素之基台4。在此基台4的前端部的上表面分別設置有一對片匣載置區域6a、6b。並且，在各片匣載置區域6a、6b之上載置有片匣8a、8b，前述片匣8a、8b可供複數個被加工物以在Z軸方向上相互隔有距離之狀態來容置。The
亦即，在各片匣8a、8b設置有可在各個容置區域容置被加工物之複數層的容置區域。圖2是示意地顯示可容置於片匣8a、8b之被加工物之一例的立體圖。圖2所示之被加工物11是具有例如呈圓形的正面11a以及背面11b，且由矽(Si)等的半導體材料所構成之晶圓。That is, each of the
此被加工物11是被設定成格子狀之複數條分割預定線13區劃成複數個區域，且在各區域的正面11a側形成有IC等的器件15。又，被加工物11亦可包含設置成覆蓋此器件15之薄膜狀的膠帶。此膠帶具有和被加工物11的直徑大致相等的直徑，且由例如樹脂所構成。This
並且，此膠帶會緩和對被加工物11的背面11b側進行磨削時施加於正面11a側之衝擊而保護器件15。再者，對被加工物11的材質、形狀、構造以及大小等並無限制。例如，被加工物11亦可包含其他的半導體材料、陶瓷、樹脂或金屬。Furthermore, this tape protects the
又，如圖1所示，於片匣載置區域6a、6b的後方形成有凹陷4a，在此凹陷4a的內側設置有搬送單元10。此搬送單元10可在以下時候利用：將磨削前的被加工物11從片匣8a、8b的複數個容置區域的任一個(原本的容置區域)搬出，又，將磨削後的被加工物11搬入例如原本的容置區域時。Furthermore, as shown in FIG. 1 , a
具體而言，搬送單元10具有例如複數個關節與機械手，且在此機械手的一面保持被加工物11。此外，搬送單元10也可以使保持被加工物11之機械手翻轉，亦即使被加工物11的上下翻轉。Specifically, the
又，在凹陷4a的斜後方，設置有用於調整被加工物11的位置之位置調整機構12。此位置調整機構12包含圓盤狀的位置調整用工作台、與配置於位置調整用工作台的周圍之複數個銷。並且，已被搬送單元10從片匣8a、8b搬出之被加工物11可被搬入此位置調整用工作台，來將其中心對齊於預定的位置。In addition, a
具體而言，被加工物11是以其背面11b朝向上方的方式搬入位置調整用工作台。然後，複數個銷會沿著位置調整用工作台的徑方向朝位置調整用工作台接近。藉此，複數個銷會接觸於被加工物11的側面而使被加工物11稍微移動。其結果，可將被加工物11的中心對齊於預定的位置。Specifically, the
又，在位置調整機構12的側邊，設置有將被加工物11保持並朝後方搬送之搬送單元14。此搬送單元14具有例如在Z軸方向上延伸之支撐軸、基端部固定在此支撐軸的上端部且在和Z軸方向正交之方向上延伸之臂、與固定在此臂的前端部的下側之吸引墊。Furthermore, on the side of the
此外，搬送單元14的支撐軸已連接於馬達等的旋轉驅動源。並且，若使此旋轉驅動源動作，支撐軸會以沿著Z軸方向之直線作為旋轉軸來旋轉。又，搬送單元14的支撐軸已連結於例如滾珠螺桿式的移動機構(未圖示)。並且，若使此移動機構動作，支撐軸便會沿著Z軸方向移動，亦即支撐軸會升降。In addition, the support shaft of the
例如，搬送單元14會以以下之順序來將被加工物11保持並朝後方搬送。首先，使支撐軸旋轉，以將吸引墊定位在已在位置調整機構12中將中心對齊於預定的位置之被加工物11的正上方。接著，使支撐軸下降，以使此吸引墊接觸於被加工物11的背面(上表面)11b。For example, the
接著，藉由吸引墊吸引並保持被加工物11的背面(上表面)11b側。接著，使支撐軸上升，以使保持被加工物11之吸引墊上升。接著，使支撐軸旋轉，以使保持被加工物11之吸引墊旋繞。藉此，將被加工物11搬送到後方。Next, the back surface (upper surface) 11b side of the
於搬送單元14的後方設置有轉台16。此轉台16已連接於馬達等的旋轉驅動源。並且，當使此旋轉驅動源動作時，轉台16即以通過轉台16的上表面的中心且沿著Z軸方向之直線作為旋轉軸來旋轉。A
又，在轉台16中，沿著轉台16的圓周方向以大致相等的角度之間隔設置有3個圓盤狀的工作台基座(未圖示)。此外，在各工作台基座的上部裝設有用於保持被加工物11的正面(下表面)11a側之工作夾台18。Furthermore, in the
此工作夾台18具有例如由陶瓷等所構成，且透過軸承等而支撐在工作台基座之圓盤狀的框體。又，在工作夾台18的框體的上表面形成有具有呈圓形的底面之凹部，且在此凹部固定有由多孔質陶瓷等所構成之圓盤狀的多孔板。This work table 18 has a disc-shaped frame made of, for example, ceramics and supported on a work table base through bearings and the like. Furthermore, a recessed portion having a circular bottom surface is formed on the upper surface of the frame of the
此外，工作夾台18的多孔板的上表面與包圍多孔板之框體的上表面具有和圓錐的側面對應之形狀，且在保持被加工物11時作為保持面而發揮功能。又，工作夾台18的框體已連接於馬達等的旋轉驅動源。並且，若使此馬達動作，工作夾台18即以通過工作夾台18的保持面的中心之直線作為旋轉軸來旋轉。In addition, the upper surface of the porous plate of the
又，工作夾台18的框體是透過工作台基座而連結於傾斜度調整機構(未圖示)。此傾斜度調整機構包含沿著工作夾台18的圓周方向以大致相等的角度之間隔來配置之2個可動軸以及1個固定軸。並且，當2個可動軸的至少一個使工作台基座以及工作夾台局部地升降時，工作夾台18的旋轉軸的傾斜度即被調整。In addition, the frame of the
又，工作夾台18的多孔板的下表面側，是透過已形成於該框體之流路等，而連通於噴射器等的吸引源(未圖示)以及鋼瓶等的空氣供給源(未圖示)。並且，若在已將被加工物11放置於工作夾台18的保持面之狀態下使吸引源動作，被加工物11的正面(下表面)11a側即被吸引並保持於工作夾台18。In addition, the lower surface side of the porous plate of the
又，若在已形成於工作夾台18的框體之流路成為負壓的狀態下使空氣供給源動作，即可對此流路供給空氣來成為常壓，而變得容易使被加工物11從工作夾台18分開。In addition, if the air supply source is operated in a state where the flow path formed in the frame of the
再者，若在已將工作夾台18裝設於工作台基座的狀態下使轉台16旋轉，工作夾台18即和工作台基座一起移動。具體而言，在此情況下，工作台基座以及工作夾台18會沿著轉台16的圓周方向移動。Furthermore, when the
藉此，可以將工作台基座以及工作夾台18依序地定位到例如相鄰於搬送單元14之搬入搬出位置A、搬入搬出位置的斜後方的粗磨削位置B、與粗磨削位置的側邊的精磨削位置C。Thereby, the table base and the
然後，可將已藉由搬送單元14搬送到後方之被加工物11，搬入已定位在搬入搬出位置A之工作夾台18。例如，被加工物11往工作夾台18之搬入，是以以下的順序來進行。Then, the
首先，使搬送單元14的支撐軸下降，以使已被搬送單元14的吸引墊保持之被加工物11朝工作夾台18的保持面接近。接著，停止由吸引墊所進行之被加工物11的背面(上表面)11b側的吸引。藉此，被加工物11會從吸引墊分離而被搬入到工作夾台18。First, the support shaft of the
接著，使和工作夾台18的多孔板的下表面側連通之吸引源動作，以將被加工物11的正面(下表面)11a側吸引並保持於工作夾台18。接著，使轉台16旋轉，以將保持此被加工物11之工作夾台18定位到粗磨削位置B。Next, the suction source connected to the lower surface side of the porous plate of the
在粗磨削位置B以及精磨削位置C的各個位置的後方，設置有柱狀的支撐構造20。在各支撐構造20的前表面側設有移動機構22。此移動機構22具備沿著Z軸方向延伸之一對導軌24。此外，在一對導軌24以可滑動的態樣安裝有移動板26。A
又，在移動板26的後表面側固定有滾珠螺桿的螺帽(未圖示)，且在此螺帽以可旋轉的態樣連結有沿著Z軸方向延伸之螺桿軸28。又，此螺帽會容置因應於螺桿軸28的旋轉而在螺桿軸28的表面滾動之多數個滾珠。In addition, a ball screw nut (not shown) is fixed to the rear surface side of the moving
此外，在螺桿軸28的一端部(上端部)連接有馬達30。並且，當藉由馬達30使螺桿軸28旋轉時，多數個滾珠會在螺帽內循環而使移動板26和螺帽一起沿著Z軸方向移動。In addition, a
又，在移動板26的前表面(正面)設置有磨削單元32。此磨削單元32具備固定在移動板26之主軸殼體34。此外，在主軸殼體34中以可旋轉的態樣容置有主軸(未圖示)，前述主軸是沿著Z軸方向或相對於Z軸方向稍微傾斜之方向而延伸。Moreover, the grinding
又，主軸的前端部(下端部)是從主軸殼體34的下端面露出，且在此下端部固定有圓盤狀的安裝座36。並且，於粗磨削位置B側之磨削單元32的安裝座36的下表面，裝設有粗磨削用的磨削輪38a。同樣地，在精磨削位置C側之磨削單元32的安裝座36的下表面，裝設有精磨削用的磨削輪38b。In addition, the front end portion (lower end portion) of the spindle is exposed from the lower end surface of the
又，在已容置於主軸殼體34之主軸的基端部(上端部)連接有馬達40。並且，若使此馬達動作，安裝座36以及磨削輪38a、38b會和主軸一起以沿著Z軸方向或相對於Z軸方向稍微傾斜之直線作為旋轉軸來旋轉。Furthermore, the
再者，各磨削輪38a、38b包含由不鏽鋼或鋁等金屬所構成之環狀的輪基台。又，在輪基台的下表面，沿著輪基台的圓周方向以大致相等的角度之間隔固定有複數個磨削磨石。Furthermore, each
並且，複數個磨削磨石的各個包含陶瓷或熱固性樹脂等的結合劑、與分散在此結合劑之鑽石等磨粒。再者，包含於精磨削用的磨削輪38b所具備之磨削磨石之磨粒的平均粒徑，比包含於粗磨削用的磨削輪38a所具備之磨削磨石之磨粒的平均粒徑更小。Furthermore, each of the plurality of grinding stones contains a bonding agent such as ceramics or thermosetting resin, and abrasive grains such as diamond dispersed in the bonding agent. Furthermore, the average particle size of the abrasive grains included in the
又，在各磨削輪38a、38b的附近設置有液體供給單元(未圖示)。此液體供給單元具有例如在平面視角下位於磨削輪38a、38b的內側之噴嘴、與對此噴嘴供給純水等的液體(加工液)之泵。Moreover, a liquid supply unit (not shown) is provided near each
並且，若使此泵動作，即可從噴嘴將加工液供給到已被定位在粗磨削位置B或精磨削位置C之工作夾台18保持正面(下表面)11a側之被加工物11的背面(上表面)11b。When this pump is activated, the machining fluid can be supplied from the nozzle to the
又，當將保持被加工物11之工作夾台18定位到粗磨削位置B或精磨削位置C時，會進行被加工物11的背面(上表面)11b側的粗磨削或精磨削。並且，只要完成被加工物11的背面(上表面)11b側的粗磨削以及精磨削，即可使轉台16旋轉，來將保持被加工物11之工作夾台18定位到搬入搬出位置A。In addition, when the
在搬入搬出位置A的前方，且在搬送單元14的側邊設置有將被加工物11保持並朝前方搬送之搬送單元42。圖3是示意地顯示搬送單元42的詳細的構造的局部剖面側視圖。此搬送單元42具有用於保持被加工物11的背面(上表面)11b側之保持機構44。In front of the loading and unloading position A, and on the side of the
保持機構44具有例如由陶瓷等所構成之圓盤狀的框體44a。於此框體44a的下表面形成有具有圓形的底面之凹部，且在此凹部固定有由多孔質陶瓷等所構成之圓盤狀的多孔板44b。又，在框體44a的上表面側形成有複數個螺孔，於此複數個螺孔的各個螺合有螺栓46。The holding
具體來說，此螺栓46具有沿著Z軸方向延伸之圓柱狀的軸部、及直徑比此軸部更大且沿著Z軸方向之長度較小的六角柱狀的頭部。此外，此軸部具有形成有牙山之下部(螺絲部)、以及未形成有牙山之上部(圓筒部)。並且，螺栓46的螺絲部是螺合於形成於框體44a的上表面側之螺孔。Specifically, this
又，在框體44a的上表面側形成有和多孔板44b的上表面側連通之貫通孔，此貫通孔是透過配管(未圖示)以及閥(未圖示)而連通於噴射器等的吸引源(未圖示)以及鋼瓶等的空氣供給源(未圖示)。In addition, a through hole communicating with the upper surface side of the
並且，若在被加工物11的背面11b已接觸於多孔板44b的下表面(保持面)的狀態下使吸引源動作，被加工物11的背面(上表面)11b側即被吸引並保持於保持機構44。又，若在形成於框體44a的上表面側之貫通孔等已成為負壓的狀態下使空氣供給源動作，即可對此貫通孔供給空氣來成為常壓，而變得容易使被加工物11從保持機構44分開。Furthermore, when the suction source is operated while the
在保持機構44的上方設置有用於調整已被保持機構44保持之被加工物11的傾斜度之傾斜度調整機構48。此傾斜度調整機構48具有圓盤狀的支撐構件48a。並且，在支撐構件48a形成有在厚度方向上貫通支撐構件48a，且各自的剖面呈圓形之複數個貫通孔。An
這些貫通孔是定位成和已形成於框體44a的上表面側之複數個螺孔重疊，且在各貫通孔可供螺栓46的圓筒部通過。又，螺栓46的頭部的直徑比貫通孔的直徑更大。因此，不會有螺栓46通過貫通孔而掉落之情形。These through holes are positioned so as to overlap with a plurality of screw holes formed on the upper surface side of the
又，在螺栓46的軸部當中位於框體44a與支撐構件48a之間的部分的周圍，設置有壓縮線圈彈簧50。換言之，此部分是位於壓縮線圈彈簧50的內側。並且，對框體44a以及支撐構件48a會作用有因為將壓縮線圈彈簧50壓縮而產生之反作用力。In addition, a
又，在支撐構件48a的側部連結有臂48b的前端部。此臂48b是沿著和Z軸方向正交之方向延伸，且在其基端部連接有馬達48c。並且，若使此馬達48c動作，臂48b以及支撐構件48a即以沿著臂48b延伸之方向的直線作為旋轉軸來旋轉。Moreover, the front end part of the
因此，可以在藉由保持機構44保持有被加工物11之情況下，藉由使傾斜度調整機構48的馬達48c動作，來調整被加工物11的傾斜度。例如，此傾斜度調整機構48將被加工物11的傾斜度調整成被加工物11的背面(上表面)11b相對於水平面所形成之角度為30°以上且55°以下。Therefore, when the
在馬達48c的下方設置有用於使已被保持機構44保持之被加工物11沿著水平方向移動之水平方向移動機構52。此水平方向移動機構52具有沿著Z軸方向延伸之支撐軸52a。並且，為了藉由支撐軸52a來支撐傾斜度調整機構48以及保持機構44，而將馬達48c固定在此支撐軸52a的前端部(上端部)。A
又，在支撐軸52a的基端部連接有馬達52b。並且，若使此馬達52b動作，支撐軸52a會以沿著Z軸方向之直線作為旋轉軸來旋轉。因此，可以在藉由保持機構44保持有被加工物11的情況下，使水平方向移動機構52的馬達52b動作，藉此，以支撐軸52a作為中心來使被加工物11旋繞，亦即使被加工物11沿著水平方向移動。Moreover, the
在水平方向移動機構52的側邊，設置有用於使已被保持機構44保持之被加工物11沿著Z軸方向(鉛直方向)移動之鉛直方向移動機構54。此鉛直方向移動機構54是滾珠螺桿式的移動機構。具體而言，鉛直方向移動機構54具有正面側已固定在水平方向移動機構52的馬達52b的側部之移動板54a。A
在此移動板54a的背面側固定有容置多數個滾珠之螺帽54b。並且，在此螺帽54b螺合有沿著Z軸方向延伸之螺桿軸54c。又，螺桿軸54c是設置在各自沿著Z軸方向延伸之一對導軌(未圖示)之間，且移動板54a是以可滑動的態樣安裝在此一對導軌的正面側。A
此外，在螺桿軸54c的基端部(下端部)連接有馬達54d。並且，當藉由馬達54d使螺桿軸54c旋轉時，多數個滾珠會在螺帽54b內循環而使移動板54a和螺帽54b一起沿著Z軸方向移動。Moreover, the
因此，可以在藉由保持機構44保持有被加工物11的情況下，使鉛直方向移動機構54的馬達54d動作，藉此，使被加工物11沿著Z軸方向(鉛直方向)移動。Therefore, when the
在鉛直方向移動機構54的附近設置有空氣噴射器(例如氣簾或氣動刮刀(air knife)等)56，前述空氣噴射器56設置成沿著X軸方向延伸，且從自其上表面的一端部涵蓋到另一端部之區域朝向上方噴射空氣。An air injector (such as an air curtain or an air knife) 56 is provided near the
具體而言，從在搬入搬出位置A與後述之洗淨裝置58之間、且藉由水平方向移動機構52使已被保持機構44保持之被加工物11沿著水平方向移動時之被加工物11的移動路徑來觀看，此空氣噴射器56是定位在下方。Specifically, when the
又，在此空氣噴射器56的上表面設置有例如沿著X軸方向延伸之狹縫狀的噴射口，且空氣會從此噴射口噴射。又，此噴射口的沿著X軸方向的長度是例如比被加工物11的直徑更大。In addition, the upper surface of the
然後，當將保持磨削後的被加工物11之工作夾台18定位到搬入搬出位置A時，即可藉由搬送單元42將被加工物11從工作夾台18搬出。例如，被加工物11自工作夾台18之搬出，是以以下的順序來進行。Then, when the
首先，使和工作夾台18的多孔板的下表面側連通之吸引源的動作停止。接著，使和工作夾台18的多孔板的下表面側連通之空氣供給源動作。此時，被加工物11會瞬間從工作夾台18分開。並且，會有在被加工物11的粗磨削以及精磨削時所供給之加工液繞進其間隙之情形。其結果，有被加工物11的正面(下表面)11a被弄濕之情形。First, the operation of the suction source communicating with the lower surface side of the porous plate of the
接著，使水平方向移動機構52的馬達52b動作來使保持機構44旋繞，以將保持機構44定位到放置在工作夾台18之上的被加工物11的正上方。接著，使鉛直方向移動機構54的馬達54d動作來讓保持機構44下降，以使保持機構44的多孔板44b的下表面接觸於被加工物11的背面(上表面)11b。Next, the
接著，使和多孔板44b的上表面側連通之吸引源動作，以將被加工物11的背面(上表面)11b側吸引並保持於保持機構44。接著，使鉛直方向移動機構54的馬達54d動作來讓保持機構44上升，以使被加工物11從工作夾台18分開。Next, the suction source connected to the upper surface side of the
接著，使被加工物11以被加工物11通過空氣噴射器56的上方的方式沿著水平方向移動。圖4是示意地顯示藉由搬送單元42使被加工物11移動之情形的局部剖面側視圖。於此移動時，是使傾斜度調整機構48的馬達48c動作，而將被加工物11的傾斜度調整成被加工物11的行進方向前側比行進方向後側成為更上方。Next, the
並且，在已使空氣噴射器56動作成朝向上方噴射空氣Air之狀態下，使水平方向移動機構52的馬達52b動作成使被加工物11通過空氣噴射器56的上方。Then, in a state where the
在此情況下，空氣Air會朝被加工物11的正面(下表面)11a噴射，而使已附著於此正面(下表面)11a之加工液L，一邊沿著正面(下表面)11a一邊朝向被加工物11的行進方向後側流動，而變得容易從該後端掉落。藉此，被加工物11的正面(下表面)11a會乾燥。In this case, the air Air is sprayed toward the front surface (lower surface) 11a of the
再者，亦可將對被加工物11的行進方向後側噴射空氣時之被加工物11的移動速度(後半的移動速度)變更成：變得比對該行進方向前側噴射空氣時之被加工物11的移動速度(前半的移動速度)更慢。例如，亦可將後半的移動速度變更成前半的移動速度的3/4倍以下、1/2倍以下或1/4倍以下。Furthermore, the moving speed of the workpiece 11 (movement speed in the second half) when air is injected to the rear side in the traveling direction of the
或者，亦可在被加工物11通過空氣噴射器56的上方時，將被加工物11的移動速度變更成逐漸地變慢。在以這些方式變更被加工物11的移動速度的情況下，會變得更容易使被加工物11的正面(下表面)11a乾燥。Alternatively, when the workpiece 11 passes above the
如圖1所示，於搬送單元42的側邊設置有洗淨裝置58，前述洗淨裝置58會洗淨從工作夾台18搬出之被加工物11。此洗淨裝置58具備例如旋轉工作台與洗淨單元，前述旋轉工作台用於保持被加工物11的正面(下表面)11a側，前述洗淨單元包含對已被旋轉工作台保持之被加工物11的背面(上表面)11b側供給純水等的液體(洗淨液)之噴嘴。As shown in FIG. 1 , a
再者，此旋轉工作台具有和圖1所示之工作夾台18同樣的構造，又，已連接於馬達等的旋轉驅動源。並且，若使此旋轉驅動源動作，旋轉工作台即以通過旋轉工作台的上表面的中心且沿著Z軸方向之直線作為旋轉軸來旋轉。In addition, this rotary table has the same structure as the
然後，可對旋轉工作台搬入已藉由搬送單元42從工作夾台18搬出之被加工物11。例如，被加工物11往旋轉工作台之搬入，是以以下的順序來進行。Then, the
首先，使水平方向移動機構52的馬達52b動作來讓被加工物11旋繞，以將已被保持機構44保持之被加工物11定位到旋轉工作台的正上方。接著，使鉛直方向移動機構54的馬達54d動作來讓被加工物11下降，以使被加工物11的正面(下表面)11a朝旋轉工作台的保持面接近。First, the
接著，使和保持機構44的多孔板44b的上表面側連通之吸引源的動作停止。接著，使和保持機構44的多孔板44b的上表面側連通之空氣供給源動作，以使被加工物11從保持機構44分開。藉此，被加工物11往旋轉工作台之搬入即完成。Next, the operation of the suction source communicating with the upper surface side of the
在此洗淨裝置58中，可藉由一邊使保持被加工物11的正面(下表面)11a側之旋轉工作台旋轉，一邊從洗淨單元對被加工物11的背面(上表面)11b供給洗淨液來洗淨被加工物11。並且，當洗淨裝置58中的被加工物11之洗淨完成時，搬送單元10會將被加工物11從洗淨裝置58搬入到片匣8a、8b的複數個容置區域之任一個(例如原本的容置區域)。In this
在上述之磨削裝置2的搬送單元42中，傾斜度調整機構48將被加工物11的傾斜度調整成已被保持機構44保持之被加工物11的行進方向前側比行進方向後側成為更上方，且水平方向移動機構52使已被保持機構44保持之被加工物11，在空氣噴射器56已朝向上方噴射空氣Air的狀態下以通過空氣噴射器56的上方的方式移動(參照圖4)。In the
亦即，在此搬送單元42中，是在已傾斜成被加工物11的行進方向前側比行進方向後側成為更上方之狀態下，進行對被加工物11的正面(下表面)11a之空氣Air的噴射。此時，附著於被加工物11的正面(下表面)11a之液體(例如加工液L)會一邊沿著正面(下表面)11a一邊朝向被加工物11的行進方向後側流動，而變得容易從該後端掉落。That is, in this
因此，在利用此搬送單元42將被加工物11例如從工作夾台18搬送至洗淨裝置58的旋轉工作台的情況下，可以將被加工物11的移動速度設得較大。其結果，在此搬送單元42中，變得既可使被加工物11的正面(下表面)11a乾燥，並且抑制產出量的降低。Therefore, when the
再者，上述之內容為本發明的一個態樣，本發明的內容並不限定於上述之內容。例如，在本發明中，亦可藉由在被加工物11通過空氣噴射器56的上方時使被加工物11朝向斜上方行進，而將被加工物11與空氣噴射器56之鉛直方向上的間隔設為固定。Furthermore, the above content is an aspect of the present invention, and the content of the present invention is not limited to the above content. For example, in the present invention, when the workpiece 11 passes above the
具體而言，在此情況下，只要在被加工物11通過空氣噴射器56的上方時，使水平方向移動機構52的馬達52b與鉛直方向移動機構54的馬達54d同時動作即可。Specifically, in this case, when the workpiece 11 passes above the
又，本發明的搬送單元亦可設置在洗淨裝置58的旋轉工作台與片匣8a、8b之間。亦即，本發明的搬送單元亦可為以下之單元：使正面(下表面)11a已隨著被加工物11的洗淨而被弄濕之被加工物11乾燥。Furthermore, the transport unit of the present invention may be provided between the rotary table of the
又，本發明之搬送單元亦可為以下之單元：可實施從工作夾台18往洗淨裝置58的旋轉工作台之被加工物11的搬送、與從洗淨裝置58的旋轉工作台往片匣8a、8b的搬送之雙方。亦即，本發明之搬送單元亦可為以下之單元：使正面(下表面)11a已隨著被加工物11的加工而被弄濕之被加工物11乾燥，並且使正面(下表面)11a已隨著被加工物11的洗淨而被弄濕之被加工物11乾燥。Furthermore, the transport unit of the present invention may be a unit capable of transporting the workpiece 11 from the
又，本發明的搬送單元亦可設置在磨削裝置2以外的加工裝置。圖5是示意地顯示像這樣的加工裝置之一例的立體圖，圖6是示意地顯示圖5所示之加工裝置的一部分的構成要素的俯視圖。Furthermore, the transport unit of the present invention may be provided in a processing device other than the grinding
具體來說，圖5以及圖6所示之加工裝置是可切削被加工物11之切削裝置60。再者，圖5以及圖6所示之U軸方向(前後方向)以及V軸方向(左右方向)是在水平面上相互正交之方向，又，W軸方向(上下方向)是垂直於U軸方向以及V軸方向之方向(鉛直方向)。Specifically, the processing device shown in FIGS. 5 and 6 is a cutting
切削裝置60具備可搭載各構成要素之基台62。又，在基台62的角部設置有片匣工作台64。此片匣工作台64的上表面包含適合於載置片匣66之片匣載置區域68。再者，在片匣66設置有可在各個容置區域容置包含被加工物11之框架單元的複數層的容置區域。The cutting
圖7是示意地顯示包含被加工物11之框架單元之一例的立體圖。圖7所示之框架單元17具有圓盤狀的切割膠帶19。此切割膠帶19的直徑比被加工物11的直徑更長。並且，在切割膠帶19的中央區域貼附有被加工物11的背面11b。FIG. 7 is a perspective view schematically showing an example of the frame unit including the
切割膠帶19具有例如具有可撓性之薄膜狀的基材層、與設置在基材層的一面(被加工物11側之面)之黏著層(糊層)。具體而言，此基材層可由聚烯烴(PO)、聚丙烯(PP)、聚對苯二甲酸乙二酯(PET)、聚氯乙烯(PVC)或聚苯乙烯(PS)等來構成。又，此黏著層可由紫外線硬化型之矽氧橡膠、丙烯酸系材料或環氧系材料等來構成。The dicing
又，在切割膠帶19的外周區域貼附有環狀的框架21，前述框架21形成有直徑比被加工物11更長之圓形的開口21a。此框架21可由例如鋁或不鏽鋼等之金屬材料來構成。Furthermore, an
此外，圖5所示之片匣工作台64已連結於W軸方向移動機構(未圖示)。此W軸方向移動機構會調整已載置在片匣載置區域68之片匣66的高度，以便可適當地進行框架單元17對片匣66的搬入搬出。In addition, the
又，在基台62的上方設置有工作夾台70、一對切削單元(加工單元)72、旋轉工作台74、洗淨單元76與搬送單元78。Furthermore, above the
工作夾台70在對被加工物11進行加工時是隔著切割膠帶19來保持被加工物11的背面(下表面)11b側。再者，工作夾台70具有和圖1所示之工作夾台18同樣的構造，並連通於噴射器等的吸引源(未圖示)以及鋼瓶等的空氣供給源(未圖示)。When processing the
又，工作夾台70已連結於U軸方向移動機構(未圖示)以及旋轉驅動源(未圖示)。U軸方向移動機構包含例如滾珠螺桿以及馬達，且使工作夾台70從設置有一對切削單元72之切削室移動至片匣工作台64與旋轉工作台74之間的待機位置D。In addition, the
又，旋轉驅動源包含例如主軸以及馬達，並以通過工作夾台70的上表面的中心且沿著W軸方向之直線作為旋轉軸來使工作夾台70旋轉。The rotation drive source includes, for example, a spindle and a motor, and rotates the
此外，在工作夾台70的周圍，沿著工作夾台70的圓周方向以大致相等的角度之間隔設置有4個夾具80。4個夾具80的各個在工作夾台70隔著切割膠帶19保持被加工物11的背面(下表面)11b側時，會在比工作夾台70的保持面更低的位置上保持框架21。In addition, four
一對切削單元72的各個是從正面(上表面)11a側對被加工物11進行切削。具體而言，各切削單元72具有沿著V軸方向而延伸之主軸。於此主軸的前端部裝設有圓環狀的切削刀片。Each of the pair of cutting
又，主軸的基端部已連結於馬達等之旋轉驅動源(未圖示)。並且，當使此旋轉驅動源動作時，切削刀片即以沿著V軸方向之直線作為旋轉軸來和主軸一起旋轉。In addition, the base end portion of the spindle is connected to a rotational drive source (not shown) such as a motor. When this rotation drive source is activated, the cutting insert rotates together with the spindle using a straight line along the V-axis direction as the rotation axis.
又，一對切削單元72的各個已連結於V軸方向移動機構(未圖示)以及W軸方向移動機構(未圖示)。V軸方向移動機構包含例如滾珠螺桿以及馬達，且使切削單元72在切削室的內側沿著V軸方向移動。In addition, each of the pair of cutting
又，W軸方向移動機構包含例如滾珠螺桿以及馬達，且使切削單元72在切削室的內側沿著W軸方向移動。並且，在切削裝置60中，可藉由如上述地在已使切削刀片旋轉之狀態下使切削刀片與被加工物11接觸，而從正面(上表面)11a側切削被加工物11。In addition, the W-axis direction moving mechanism includes, for example, a ball screw and a motor, and moves the cutting
此外，在一對切削單元72的各個的附近設置有液體供給單元(未圖示)。此液體供給單元會在切削被加工物11時將加工液供給到被加工物11的正面(上表面)11a。In addition, a liquid supply unit (not shown) is provided near each of the pair of cutting
具體而言，液體供給單元具有例如以可和一對切削單元72的各個一起移動的方式連結於切削單元72之噴嘴、及對此噴嘴供給加工液之泵。並且，若使此泵動作，即可從噴嘴將加工液供給到已被定位在切削室之工作夾台70保持背面(下表面)11b側之被加工物11的正面(上表面)11a。Specifically, the liquid supply unit has, for example, a nozzle connected to the cutting
旋轉工作台74在對被加工物11進行洗淨時是隔著切割膠帶19來保持被加工物11的背面(下表面)11b側。再者，旋轉工作台74具有和圖1所示之工作夾台18同樣的構造，並連通於噴射器等的吸引源(未圖示)以及鋼瓶等的空氣供給源(未圖示)。When cleaning the
又，旋轉工作台74已連接於旋轉驅動源(未圖示)。此旋轉驅動源包含例如主軸以及馬達，且以通過旋轉工作台74的上表面的中心且沿著W軸方向之直線作為旋轉軸來使旋轉工作台74旋轉。Furthermore, the rotary table 74 is connected to a rotation drive source (not shown). This rotation drive source includes, for example, a spindle and a motor, and rotates the rotation table 74 with a straight line passing through the center of the upper surface of the rotation table 74 and along the W-axis direction as the rotation axis.
洗淨單元76具有沿著W軸方向延伸之管狀的支撐軸。在此支撐軸的下端部連接有用於使支撐軸旋轉之馬達等的旋轉驅動源。又，在支撐軸的上端部連接有臂。The
此臂是以相當於從支撐軸的上端部到旋轉工作台74的上表面的中心的距離之長度在正交於W軸方向之方向上延伸之管狀的構件。又，在臂的前端部以朝向下方放出洗淨水的方式設置有噴嘴。This arm is a tubular member extending in a direction orthogonal to the W-axis direction with a length corresponding to the distance from the upper end of the support shaft to the center of the upper surface of the rotary table 74 . Moreover, a nozzle is provided at the front end of the arm so as to discharge wash water downward.
此外，支撐軸已連通於供給洗淨液之泵。因此，若於例如旋轉軸部以將噴嘴定位到旋轉工作台74的上方後，使此泵動作，即可從噴嘴將洗淨液供給到已被旋轉工作台74保持背面(下表面)11b側之被加工物11的正面(上表面)11a。In addition, the support shaft is connected to a pump that supplies cleaning fluid. Therefore, if, for example, the shaft is rotated to position the nozzle above the rotary table 74, and then the pump is operated, the cleaning liquid can be supplied from the nozzle to the back surface (lower surface) 11b side held by the rotary table 74. The front surface (upper surface) 11a of the
搬送單元78可在例如將保持在已定位於待機位置D之工作夾台70且包含切削後的被加工物11之框架單元17，從工作夾台70搬送至旋轉工作台74時利用。此搬送單元78具有用於抓住框架21之把持部(未圖示)、與包含吸引墊等之保持機構，前述吸引墊是用於吸引框架21的上表面側來保持框架單元17。The
又，此保持機構已連結於傾斜度調整機構(未圖示)、V軸方向移動機構(水平方向移動機構)(未圖示)以及W軸方向移動機構(鉛直方向移動機構)(未圖示)。傾斜度調整機構(未圖示)具有前端部固定於保持機構且沿著U軸方向延伸之臂、與連接於臂的基端部之馬達。In addition, this holding mechanism is connected to the inclination adjustment mechanism (not shown), the V-axis direction movement mechanism (horizontal movement mechanism) (not shown), and the W-axis direction movement mechanism (vertical direction movement mechanism) (not shown). ). The tilt adjustment mechanism (not shown) has an arm whose front end is fixed to the holding mechanism and extends along the U-axis direction, and a motor connected to the base end of the arm.
並且，若在保持機構保持了框架單元17的框架21的狀態下使馬達動作，即可調整已被保持機構保持之框架單元17的傾斜度。例如，此傾斜度調整機構將框架單元17的傾斜度調整成：包含於框架單元17之框架21的上表面相對於水平面所形成之角度為30°以上且55°以下。Furthermore, if the motor is operated while the holding mechanism holds the
又，V軸方向移動機構包含例如滾珠螺桿以及馬達，且使搬送單元78從旋轉工作台74的上方的位置移動至已載置在片匣工作台64之片匣66的附近的位置。又，W軸方向移動機構包含例如滾珠螺桿以及馬達，且調整搬送單元78的高度。The V-axis direction moving mechanism includes, for example, a ball screw and a motor, and moves the
此外，此搬送單元78具有空氣噴射器(例如氣簾或氣動刮刀等)82，前述空氣噴射器82設置成沿著U軸方向延伸，且從自其上表面的一端部涵蓋到另一端部之區域朝向上方噴射空氣。In addition, this
具體而言，從在待機位置D與旋轉工作台74之間、且藉由V軸方向移動機構使已被搬送單元78的保持機構保持之被加工物11沿著V軸方向移動時之被加工物11的移動路徑來觀看，此空氣噴射器82是定位在下方。Specifically, the
又，在此空氣噴射器82的上表面設置有例如沿著U軸方向延伸之狹縫狀的噴射口，且空氣會從此噴射口噴射。又，此噴射口的沿著U軸方向的長度是例如比包含於框架單元17之切割膠帶19的直徑更大。In addition, the upper surface of the
並且，當將保持包含切削後的被加工物11之框架單元17的工作夾台70定位到待機位置D時，即可藉由搬送單元78將被加工物11從工作夾台70搬送至旋轉工作台74。例如，此被加工物11的搬送是以以下的順序來進行。Furthermore, when the
首先，使和工作夾台70連通之吸引源的動作停止。接著，使和工作夾台70連通之空氣供給源動作。此時，框架單元70會瞬間從工作夾台18分開。並且，會有在被加工物11的切削時所供給之加工液繞進其間隙之情形。其結果，有切割膠帶19的下表面被弄濕之情形。First, the action of the suction source connected to the
接著，使V軸方向移動機構動作，以將搬送單元78的保持機構定位到放置在工作夾台70之上的被加工物11的正上方。接著，使W軸方向移動機構動作來讓保持機構下降，以使此保持機構接觸於框架單元17的框架21的上表面。Next, the V-axis direction moving mechanism is operated to position the holding mechanism of the
接著，藉由此保持機構來保持框架單元17。接著，使搬送單元78的W軸方向移動機構動作來讓保持機構上升，以使框架單元17從工作夾台70分開。接著，使搬送單元78的傾斜度調整機構動作，而將被加工物11的傾斜度調整成框架單元17的行進方向前側比行進方向後側成為更上方。Next, the
接著，在使空氣噴射器82動作成朝向上方噴射空氣之狀態下，使框架單元17沿著V軸方向移動成框架單元17通過空氣噴射器82的上方。Next, while the
在此情況下，空氣會朝切割膠帶19的下表面噴射，而使已附著於此下表面之加工液，一邊沿著下表面一邊朝向框架單元17的行進方向後側流動，而變得容易從該後端掉落。藉此，切割膠帶19的下表面會乾燥。In this case, air will be sprayed toward the lower surface of the cutting
再者，亦可將對框架單元17的行進方向後側噴射空氣時之框架單元17的移動速度(後半的移動速度)變更成：變得比對該行進方向前側噴射空氣時之框架單元17的移動速度(前半的移動速度)更慢。例如，亦可將後半的移動速度變更成前半的移動速度的3/4倍以下、1/2倍以下或1/4倍以下。Furthermore, the moving speed of the
或者，亦可在框架單元17通過空氣噴射器82的上方時，將框架單元17的移動速度變更成逐漸地變慢。在以這些方式變更框架單元17的移動速度的情況下，會變得更容易使切割膠帶19的下表面乾燥。Alternatively, when the
在上述之切削裝置60的搬送單元78中，是傾斜度調整機構調整框架單元17的傾斜度，以使已被保持機構保持之框架單元17的行進方向前側比行進方向後側成為更上方，且V軸方向移動機構使已被保持機構保持之框架單元17，在空氣噴射器82已朝向上方噴射空氣之狀態下以通過空氣噴射器82的上方的方式移動。In the
亦即，在此搬送單元78中，是在已傾斜成框架單元17的行進方向前側比行進方向後側成為更上方的狀態下，進行對切割膠帶19的下表面之空氣的噴射。在此情況下，已附著於切割膠帶19的下表面之加工液會一邊沿著下表面一邊朝向切割膠帶19的行進方向後側流動，而變得容易從該後端掉落。That is, in this
因此，在利用此搬送單元78將框架單元17例如從工作夾台70搬送至旋轉工作台74的情況下，可以將框架單元17的移動速度設得較大。其結果，在此搬送單元78中，變得既可使切割膠帶19的下表面乾燥，並且抑制產出量的降低。Therefore, when the
此外，在切削裝置60中，在將框架單元17從旋轉工作台74搬送至片匣66時也可利用搬送單元78。因此，在此切削裝置60中，不僅可讓下表面已隨著被加工物11的加工而被弄濕之切割膠帶19乾燥，還可以讓下表面已隨著被加工物11的洗淨而被弄濕之切割膠帶19乾燥。In addition, in the
另外，上述之實施形態之構造及方法等，只要在不脫離本發明的目的之範圍內，皆可以合宜變更來實施。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented within the scope which does not deviate from the object of this invention.
2:磨削裝置
4:基台
4a:凹陷
6a,6b,68:片匣載置區域
8a,8b,66:片匣
10,14,42,78:搬送單元
11:被加工物
11a:正面
11b:背面
12:位置調整機構
13:分割預定線
15:器件
16:轉台
17:框架單元
18,70:工作夾台
19:切割膠帶
20:支撐構造
21:框架
21a:開口
22:移動機構
24:導軌
26,54a:移動板
28,54c:螺桿軸
30,40,48c,52b,54d:馬達
32:磨削單元
34:主軸殼體
36:安裝座
38a,38b:磨削輪
44:保持機構
44a:框體
44b:多孔板
46:螺栓
48:傾斜度調整機構
48a:支撐構件
48b:臂
50:壓縮線圈彈簧
52:水平方向移動機構
52a:支撐軸
54:鉛直方向移動機構
54b:螺帽
56,82:空氣噴射器
58:洗淨裝置
60:切削裝置
62:基台
64:片匣工作台
72:切削單元
74:旋轉工作台
76:洗淨單元
80:夾具
Air:空氣
A:搬入搬出位置
B:粗磨削位置
C:精磨削位置
D:待機位置
L:加工液
X,Y,Z,U,V,W:方向
2:Grinding device
4:
圖1是示意地顯示磨削裝置之一例的立體圖。 圖2是示意地顯示被加工物之一例的立體圖。 圖3是示意地顯示包含於磨削裝置之搬送單元之一例的詳細的構造的局部剖面側視圖。 圖4是示意地顯示藉由搬送單元使被加工物移動之情形的局部剖面側視圖。 圖5是示意地顯示切削裝置之一例的立體圖。 圖6是示意地顯示切削裝置的一部分的構成要素的俯視圖。 圖7是示意地顯示包含被加工物之框架單元之一例的立體圖。 FIG. 1 is a perspective view schematically showing an example of a grinding device. FIG. 2 is a perspective view schematically showing an example of a workpiece. 3 is a partial cross-sectional side view schematically showing the detailed structure of an example of a transport unit included in the grinding device. FIG. 4 is a partial cross-sectional side view schematically showing how the workpiece is moved by the transport unit. FIG. 5 is a perspective view schematically showing an example of the cutting device. FIG. 6 is a plan view schematically showing some components of the cutting device. 7 is a perspective view schematically showing an example of a frame unit including a workpiece.
11:被加工物 11: Processed objects
11a:正面 11a: Front
11b:背面 11b: Back
44:保持機構 44: Maintain agency
44a:框體 44a:frame
44b:多孔板 44b:Porous plate
46:螺栓 46:bolt
48:傾斜度調整機構 48: Inclination adjustment mechanism
48a:支撐構件 48a:Supporting members
50:壓縮線圈彈簧 50: Compression coil spring
56:空氣噴射器 56:Air ejector
Air:空氣 Air: air
L:加工液 L: machining fluid
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-093843 | 2022-06-09 | ||
| JP2022093843A JP2023180487A (en) | 2022-06-09 | 2022-06-09 | Conveying unit and processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202349478A true TW202349478A (en) | 2023-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112121035A TW202349478A (en) | 2022-06-09 | 2023-06-06 | Conveyance unit and processing device capable of drying a work-piece or a lower surface of a frame unit containing the work-piece and suppressing a decrease in productivity |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023180487A (en) |
| KR (1) | KR20230169847A (en) |
| CN (1) | CN117219536A (en) |
| TW (1) | TW202349478A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3349339B2 (en) | 1996-04-24 | 2002-11-25 | シャープ株式会社 | Dicing machine with visual inspection function |
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2022
- 2022-06-09 JP JP2022093843A patent/JP2023180487A/en active Pending
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2023
- 2023-05-30 KR KR1020230069192A patent/KR20230169847A/en unknown
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| KR20230169847A (en) | 2023-12-18 |
| CN117219536A (en) | 2023-12-12 |
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