TW201829118A - Chuck table and grinding device capable of sucking and holding a workpiece on a holding surface of a chuck table even the plate workpiece is warped - Google Patents
Chuck table and grinding device capable of sucking and holding a workpiece on a holding surface of a chuck table even the plate workpiece is warped Download PDFInfo
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- TW201829118A TW201829118A TW106142369A TW106142369A TW201829118A TW 201829118 A TW201829118 A TW 201829118A TW 106142369 A TW106142369 A TW 106142369A TW 106142369 A TW106142369 A TW 106142369A TW 201829118 A TW201829118 A TW 201829118A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
發明領域 本發明是有關於一種吸引保持板狀工件的工作夾台及對吸引保持於工作夾台上的板狀工件施行磨削的磨削裝置。FIELD OF THE INVENTION The present invention relates to a work clamp that attracts and holds a plate-like workpiece and a grinding device that performs grinding on the plate-like workpiece that is attracted and held on the work clamp.
發明背景 對板狀工件等的被加工物進行磨削的磨削裝置至少具備有吸引保持板狀工件的工作夾台、對被吸引保持於工作夾台的板狀工件進行磨削的磨削機構、暫置板狀工件的暫置台、及將板狀工件從暫置台搬入工作夾台的搬入機構(參照例如下述之專利文獻1)。並且，板狀工件是在藉由搬入機構而從暫置台被搬入工作夾台上，且在工作夾台的保持面上被吸引保持之後，以磨削機構磨削到達到規定的厚度為止。BACKGROUND OF THE INVENTION A grinding device for grinding a workpiece such as a plate-shaped workpiece includes at least a work clamp that sucks and holds the plate-shaped workpiece, and a grinding mechanism that grinds plate-shaped workpiece that is sucked and held on the work-piece. , A temporary table for temporarily plate-shaped workpieces, and a loading mechanism for transferring a plate-shaped workpiece from the temporary table into a work clamp (see, for example, Patent Document 1 below). In addition, the plate-shaped workpiece is carried into the work chuck from the temporary table by the carry-in mechanism, and is sucked and held on the holding surface of the work chuck, and then is ground by the grinding mechanism to a predetermined thickness.
然而，有在板狀工件的外周部產生翹曲的情況(參照例如下述之專利文獻2)。即便將這樣的板狀工件搬入工作夾台，由於外周部會朝向從工作夾台的保持面遠離的上方向翹曲，所以無法以保持面來充分地吸引保持板狀工件。因此，在例如藉由搬入機構將已翹曲的板狀工件搬入工作夾台之時，是使搬入機構朝向保持面並將板狀工件的外周部按壓於保持面上，並且使保持面與吸引源連通以在保持面上吸引保持板狀工件。又，例如，在下述之專利文獻3中，也提出有透過彈性墊在工作夾台上吸引保持板狀工件的方法。在所述方法中，因為當以工作夾台的保持面來吸引板狀工件時，是使彈性墊收縮而使板狀工件沈入彈性墊，所以能夠消除板狀工件的外周部的翹曲。 先前技術文獻 專利文獻However, there is a case where warpage occurs in the outer peripheral portion of the plate-shaped workpiece (see, for example, Patent Document 2 described below). Even if such a plate-like workpiece is carried into the work clamp, the outer peripheral portion is warped toward the upper direction away from the holding surface of the work clamp, so the holding surface cannot sufficiently attract and hold the plate-shaped workpiece. Therefore, for example, when a warped plate-shaped workpiece is carried into a work clamp by a carrying-in mechanism, the carrying-in mechanism faces the holding surface and presses the outer peripheral portion of the plate-shaped workpiece against the holding surface, and the holding surface and the suction The source communicates to attract and hold the plate-like workpiece on the holding surface. In addition, for example, Patent Document 3 described below also proposes a method for attracting and holding a plate-like workpiece on a work clamp via an elastic pad. In this method, when the plate-shaped workpiece is attracted by the holding surface of the work table, the elastic pad is contracted to sink the plate-shaped workpiece into the elastic pad, so that the warpage of the outer peripheral portion of the plate-shaped workpiece can be eliminated. Prior Art Literature Patent Literature
專利文獻1：日本專利特開2001-313326號公報 專利文獻2：日本專利特開2006-261415號公報 專利文獻3：日本專利特開2015-199153號公報Patent Literature 1: Japanese Patent Laid-Open No. 2001-313326 Patent Literature 2: Japanese Patent Laid-Open No. 2006-261415 Patent Literature 3: Japanese Patent Laid-Open No. 2015-199153
發明概要 發明欲解決之課題 但是，即使是使用如上述的方法，仍有吸引力從工作夾台的保持面與板狀工件的外周部之間的微小的間隙洩漏，而變得無法以保持面來吸引保持板狀工件的外周部的情況。當在此狀態下原樣藉由磨削機構開始進行板狀工件的磨削時，會有使板狀工件從工作夾台脫落而變得無法加工的問題。SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, even when the method described above is used, leakage from a small gap between the holding surface of the work clamp table and the outer peripheral portion of the plate-shaped workpiece is still attractive, and the holding surface becomes impossible. To attract and hold the outer peripheral portion of the plate-shaped workpiece. When the grinding of the plate-like workpiece is started by the grinding mechanism as it is in this state, there is a problem that the plate-like workpiece falls off the work table and becomes impossible to process.
本發明是有鑒於上述事實而作成之發明，其目的在於形成即使是有翹曲的板狀工件也能夠在工作夾台的保持面上吸引保持。 用以解決課題之手段The present invention has been made in view of the above-mentioned facts, and an object thereof is to form a plate-shaped workpiece that can be warped and held on a holding surface of a work clamp even if it is warped. Means to solve the problem
本發明是一種吸引保持板狀工件的工作夾台，其具備：多孔板，具有吸引保持板狀工件的保持面；及框體，具備使該保持面露出而收容該多孔板的凹部，其中該框體具備：吸引孔，形成於該凹部的底面且可與吸引源相連通；及水供給孔，在將已收容於該框體的該凹部的該多孔板圍繞之上表面開口而形成，且可與水供給源相連通。The present invention is a work clamping table for attracting and holding a plate-shaped workpiece, comprising: a perforated plate having a holding surface for attracting and holding a plate-shaped workpiece; and a frame body having a recess for exposing the holding surface to accommodate the porous plate, wherein the The frame body includes: a suction hole formed on a bottom surface of the recessed portion and capable of communicating with a suction source; and a water supply hole formed by opening an upper surface of the porous plate that has been accommodated in the recessed portion of the frame body, and Can communicate with water supply source.
又，本發明是一種磨削裝置，並具備將上述工作夾台可旋轉地裝設的保持機構、對該工作夾台所吸引保持的板狀工件進行磨削之具有磨削磨石的磨削機構、及將板狀工件搬入該工作夾台的搬入機構，該磨削裝置在藉由該搬入機構將板狀工件搬入該工作夾台且使該工作夾台吸引保持板狀工件時，從前述水供給孔將水供給到前述框體的上表面，以一邊將板狀工件的外周部水封，一邊使吸引保持有板狀工件的該工作夾台旋轉，而能夠以該磨削機構來對板狀工件進行磨削。 發明效果Furthermore, the present invention is a grinding device including a holding mechanism for rotatably mounting the work clamp table, and a grinding mechanism with a grinding stone for grinding a plate-shaped workpiece attracted and held by the work clamp table. And a loading mechanism for moving a plate-shaped workpiece into the work clamp, the grinding device removes the plate-shaped workpiece into the work clamp by the loading mechanism and makes the work clamp attract and hold the plate-shaped workpiece from the water. The supply hole supplies water to the upper surface of the frame body, and while the outer peripheral portion of the plate-shaped workpiece is water-sealed, the work clamp which sucks and holds the plate-shaped workpiece is rotated, and the plate can be aligned by the grinding mechanism. The workpiece is ground. Invention effect
本發明之工作夾台由於具備具有吸引保持板狀工件的保持面的多孔板、及具備使保持面露出而收容多孔板的凹部之框體，且其中框體具備形成於凹部的底面且可與吸引源相連通的吸引孔、及在將已收容於框體的凹部的該多孔板圍繞之上表面開口而形成，且可與水供給源相連通的水供給孔，所以可以從水供給孔供給水來將板狀工件的外周部水封，並且以保持面來吸引保持板狀工件，因而即使是外周部有翹曲的板狀工件，也能夠防止吸引力從工作夾台的保持面與板狀工件的外周部之間洩漏之情況，而確實地以工作夾台的保持面來吸引保持板狀工件。The work clamp of the present invention is provided with a porous plate having a holding surface that attracts and holds a plate-shaped workpiece, and a frame body having a recessed portion that exposes the holding surface and accommodates the porous plate. A suction hole that communicates with a suction source and a water supply hole that is formed around the upper surface of the perforated plate that has been accommodated in a recessed portion of the frame and that can communicate with a water supply source can be supplied from the water supply hole. Water is used to seal the outer periphery of the plate-shaped workpiece, and the holding surface is used to attract and hold the plate-shaped workpiece. Therefore, even if the plate-shaped workpiece has a warped outer periphery, it can prevent the attraction force from holding the surface and the plate of the work clamp. In the case of leakage between the outer peripheral portions of the workpiece, the plate-shaped workpiece is attracted and held by the holding surface of the work clamp.
又，由於本發明之磨削裝置是構成為具備將上述工作夾台可旋轉地裝設的保持機構、對工作夾台所吸引保持的板狀工件進行磨削之具有磨削磨石的磨削機構、及將板狀工件搬入工作夾台的搬入機構，且在藉由搬入機構將板狀工件搬入工作夾台且使工作夾台吸引保持板狀工件時，從上述水供給孔將水供給到上述框體的上表面，以一邊將板狀工件的外周部水封，一邊使吸引保持有板狀工件的工作夾台旋轉，而以磨削機構來對板狀工件進行磨削，所以與上述同樣地，即使是外周部有翹曲的板狀工件，也能夠防止吸引力從工作夾台的保持面與板狀工件的外周部之間洩漏之情況。從而，能夠防止板狀工件在磨削中從工作夾台脫落之疑慮，而能夠以工作夾台的保持面確實地吸引保持板狀工作並實施磨削加工。In addition, the grinding device of the present invention is a grinding mechanism having a grinding stone having a holding mechanism that rotatably mounts the work clamp table and a plate-shaped workpiece that is attracted and held by the work clamp table. And a loading mechanism for loading the plate-shaped workpiece into the work clamp table, and when the plate-shaped workpiece is moved into the work clamp table by the loading mechanism and the work clamp table is attracted and held, the water is supplied to the above from the water supply hole. The upper surface of the frame body is configured to grind the plate-shaped workpiece by a grinding mechanism while rotating the work clamp which sucks and holds the plate-shaped workpiece while water-sealing the outer peripheral portion of the plate-shaped workpiece. Even if it is a plate-like workpiece having a warped outer peripheral portion, it is possible to prevent the suction force from leaking between the holding surface of the work table and the outer peripheral portion of the plate-like workpiece. Therefore, it is possible to prevent the plate-like workpiece from falling out of the work clamp during grinding, and it is possible to reliably attract and hold the plate-shaped work with the holding surface of the work clamp and perform the grinding process.
用以實施發明之形態 圖1所示的磨削裝置1具有在Y軸方向上延伸的裝置基台2，且在裝置基台2的-Y方向側上將載台3a、3b相鄰而配設。在載台3a上載置有收容磨削前的板狀工件的片匣4a，而在載台3b上載置有收容磨削後的板狀工件的片匣4b。在與片匣4a及片匣4b相面對的位置上配設有搬出入機構5，該搬出入機構5是進行從片匣4a的板狀工件之搬出，並且進行到片匣4b之板狀工件的搬入。在搬出入機構5的可動範圍內配設有用於暫置板狀工件的暫置台6、及洗淨並去除附著於磨削後的板狀工件上的磨削屑的洗淨機構7。The grinding device 1 shown in FIG. 1 has a device base 2 extending in the Y-axis direction, and the stages 3a and 3b are arranged adjacent to each other on the -Y direction side of the device base 2. Assume. A cassette 4a for storing a plate-like workpiece before grinding is placed on the stage 3a, and a cassette 4b for storing a plate-like workpiece after grinding is placed on the stage 3b. A loading / unloading mechanism 5 is disposed at a position facing the cassette 4a and the cassette 4b. The loading / unloading mechanism 5 carries out a plate-shaped workpiece from the cassette 4a, and proceeds to the plate-like shape of the cassette 4b. Move in the workpiece. Within the movable range of the carry-in / out mechanism 5, a temporary table 6 for temporarily arranging a plate-like workpiece, and a cleaning mechanism 7 for washing and removing grinding debris adhering to the plate-like workpiece after grinding are disposed.
在裝置基台2的中央部配設有可旋轉的轉台8。在轉台8上具備有供例如3個吸引保持板狀工件的工作夾台10可旋轉地裝設的保持機構13。可以藉由旋轉轉台8來使保持機構13公轉，而使保持機構13在對工作夾台10進行板狀工件的裝卸的裝卸區域P1、及將板狀工件粗磨削、精磨削的磨削區域P2之間移動。A rotatable turntable 8 is arranged at the center of the device base 2. The turntable 8 is provided with a holding mechanism 13 rotatably provided with, for example, three work chucks 10 for holding and holding a plate-like workpiece. The holding mechanism 13 can be revolved by rotating the turntable 8 so that the holding mechanism 13 can perform rough and fine grinding of the plate-shaped workpiece in the loading and unloading area P1 for loading and unloading the plate-shaped workpiece on the work clamp table 10. Area P2 moves.
在裝置基台2的+Y方向側的端部上豎立設置有於Z軸方向上延伸的支柱28。在支柱28的前方側透過磨削進給機構30A而配設有磨削機構20A。磨削機構20A具備有：具有Z軸方向的軸心的主軸21、連接於主軸21的一端的馬達22、將主軸21以可旋轉的方式圍繞並支撐的主軸殼體23、保持主軸殼體23的支持器24、透過安裝座25而裝卸自如地裝設在主軸21的下端的磨削輪26a、及在磨削輪26a的下部固接成圓環狀的粗磨削用的磨削磨石27a。並且，可以藉由驅動馬達22使主軸21旋轉，而使磨削輪26a以規定的旋轉速度旋轉。A pillar 28 extending in the Z-axis direction is erected on an end portion on the + Y direction side of the device base 2. A grinding mechanism 20A is disposed on the front side of the pillar 28 through a grinding feed mechanism 30A. The grinding mechanism 20A includes a main shaft 21 having a shaft center in the Z-axis direction, a motor 22 connected to one end of the main shaft 21, a main shaft housing 23 that rotatably surrounds and supports the main shaft 21, and a main shaft housing 23 Holder 24, a grinding wheel 26a detachably mounted on the lower end of the main shaft 21 through a mounting seat 25, and a grinding stone for rough grinding fixed to a circular shape at the lower portion of the grinding wheel 26a 27a. In addition, the spindle 21 can be rotated by the drive motor 22 to rotate the grinding wheel 26a at a predetermined rotation speed.
磨削進給機構30A具備有：在Z軸方向上延伸的滾珠螺桿31、連接於滾珠螺桿31的一端的馬達32、與滾珠螺桿31平行地延伸且配設於支柱28的一對導軌33、及將其中一面連結於支持器24的升降板34。於升降板34的另一面滑動接觸有一對導軌33，且在形成於升降板34的中央部之螺帽螺合有滾珠螺桿31。可以藉由以馬達32旋動滾珠螺桿31，而將磨削機構20A與升降板34一起沿著一對導軌33於Z軸方向上磨削進給。The grinding feed mechanism 30A includes a ball screw 31 extending in the Z-axis direction, a motor 32 connected to one end of the ball screw 31, a pair of guide rails 33 extending in parallel with the ball screw 31 and disposed on a support 28, And one side is connected to the lift plate 34 of the holder 24. A pair of guide rails 33 are slidably contacted on the other surface of the lifting plate 34, and a ball screw 31 is screwed into a nut formed at a central portion of the lifting plate 34. The grinding mechanism 20A and the lifting plate 34 can be ground and fed along the pair of guide rails 33 in the Z-axis direction by rotating the ball screw 31 with the motor 32.
在裝置基台2的+Y方向側的端部上，與支柱28之間設置規定的間隔而豎立設置有支柱29。在支柱29的前方側透過磨削進給機構30B而配設有磨削機構20B。磨削機構20B具備透過安裝座25而裝卸自如地裝設在主軸21的下端的磨削輪26b、及在磨削輪26b的下部固接成圓環狀之精磨削用的磨削磨石27b，除了這些以外，是成為與磨削機構20A同樣的構成。在磨削機構20B中，可以藉由驅動馬達22使主軸21旋轉，而使磨削輪26b以規定的旋轉速度旋轉。On the end portion on the + Y direction side of the device base 2, a predetermined distance is provided from the support column 28, and a support column 29 is erected. A grinding mechanism 20B is disposed on the front side of the pillar 29 through a grinding feed mechanism 30B. The grinding mechanism 20B includes a grinding wheel 26b detachably mounted on the lower end of the main shaft 21 through a mount 25, and a grinding wheel for fine grinding fixed to a circular shape at the lower portion of the grinding wheel 26b. 27b has the same structure as the grinding mechanism 20A except for these. In the grinding mechanism 20B, the main shaft 21 can be rotated by the drive motor 22, and the grinding wheel 26b can be rotated at a predetermined rotation speed.
關於磨削進給機構30B，也是成為與磨削進給機構30A同樣的構成。亦即，磨削進給機構30B具備滾珠螺桿31、連接於滾珠螺桿31的一端的馬達32、與滾珠螺桿31平行地延伸且配設於支柱29的一對導軌33、及將其中一面連結於支持器24的升降板34，且可以藉由馬達32旋動滾珠螺桿31，而將磨削機構20B與升降板34一起沿著一對導軌33於Z軸方向上磨削進給。The grinding feed mechanism 30B also has the same configuration as the grinding feed mechanism 30A. That is, the grinding feed mechanism 30B includes a ball screw 31, a motor 32 connected to one end of the ball screw 31, a pair of guide rails 33 extending in parallel with the ball screw 31 and disposed on the pillar 29, and connecting one surface thereof to The lifting plate 34 of the holder 24 can rotate the ball screw 31 by the motor 32 to grind and feed the grinding mechanism 20B and the lifting plate 34 along the pair of guide rails 33 in the Z-axis direction.
在磨削機構20A及磨削機構20B的下方側各自配設有測量板狀工件的厚度的厚度測量機構40。厚度測量機構40具備有接觸式的第1量器41與第2量器42。在厚度測量機構40中，能夠以第1量器41測量保持於工作夾台10上的板狀工件的高度，並且以第2量器42測量工作夾台10的高度，而計算各自的測量値之差來作為板狀工件的厚度。A thickness measuring mechanism 40 for measuring the thickness of a plate-like workpiece is disposed below each of the grinding mechanism 20A and the grinding mechanism 20B. The thickness measurement mechanism 40 includes a contact-type first gauge 41 and a second gauge 42. In the thickness measuring mechanism 40, the height of the plate-shaped workpiece held on the work clamp table 10 can be measured by the first gauge 41, and the height of the work clamp table 10 can be measured by the second gauge 42 to calculate the respective measurements. The difference is taken as the thickness of the plate-like workpiece.
在暫置台6的附近配設有將暫置於暫置台6之磨削前的板狀工件搬入已定位於裝卸區域P1的工作夾台10的搬入機構9。又，在洗淨機構7的附近配設有將吸引保持在已定位於裝卸區域P1的工作夾台10之磨削後的板狀工件搬入洗淨機構7的搬入機構9a。A carry-in mechanism 9 is provided near the temporary table 6 to carry the plate-shaped workpiece temporarily placed on the temporary table 6 before grinding into the work clamp table 10 positioned in the loading / unloading area P1. Further, a carrying-in mechanism 9 a is provided in the vicinity of the washing mechanism 7 to carry the ground plate-shaped workpiece sucked and held on the work table 10 positioned in the loading / unloading area P1 into the washing mechanism 7.
如圖2所示，搬入機構9、9a具備有：具有吸引保持板狀工件的吸引面90a的搬送墊90、將一端連結於搬送墊90的支臂部91、連接於支臂部91的另一端且可旋轉及升降的軸部92、及連接於軸部92的馬達93。於搬送墊90上連接有吸引源94，而變得可讓吸引源94的吸引力作用於吸引面90a來吸引保持板狀工件。在搬入機構9中，是藉由驅動馬達93而旋轉軸部92，以使支臂部91於水平方向上旋繞，且使搬送墊90在圖1所示的暫置台6與已定位於裝卸區域P1的工作夾台10之間移動。又，在搬入機構9a中，當驅動馬達93而使軸部92旋轉時，能夠使支臂部91於水平方向上旋繞，而使搬送墊90在已定位於裝卸區域P1的工作夾台10與洗淨機構7之間移動。此外，在搬入機構9，9a中，當升降軸部92時，能夠使支臂部91朝上下方向(Z軸方向)升降，而使搬送墊90升降。As shown in FIG. 2, the carry-in mechanisms 9 and 9 a include a transfer pad 90 having a suction surface 90 a that sucks and holds a plate-like workpiece, an arm portion 91 that connects one end to the transfer pad 90, and another arm portion 91 connected to the arm portion 91. A shaft portion 92 that is rotatable and liftable at one end, and a motor 93 connected to the shaft portion 92. A suction source 94 is connected to the transfer pad 90, and the attraction force of the suction source 94 can be made to act on the suction surface 90a to attract and hold the plate-shaped workpiece. In the carry-in mechanism 9, the shaft portion 92 is rotated by the drive motor 93 so that the arm portion 91 is wound in the horizontal direction, and the transfer pad 90 is positioned on the temporary table 6 shown in FIG. 1 and has been positioned in the loading and unloading area. The work clamp table 10 of P1 moves between. Moreover, in the carrying-in mechanism 9a, when the motor 93 is driven to rotate the shaft portion 92, the arm portion 91 can be wound in the horizontal direction, and the transfer pad 90 can be positioned on the work clamp table 10 and the loading and unloading area P1. The washing mechanism 7 moves between them. In addition, in the carrying-in mechanisms 9 and 9a, when the shaft portion 92 is raised and lowered, the arm portion 91 can be raised and lowered in the vertical direction (Z-axis direction), and the transfer pad 90 can be raised and lowered.
如圖2所示，工作夾台10具備有多孔板11及框體12，該多孔板11具有吸引保持板狀工件的保持面11a，該框體12具備使保持面11a露出而收容多孔板11的凹部120。框體12是裝設於構成保持機構13的基座130上。於基座130的下端連結有旋轉接頭15。在框體12及旋轉接頭15形成有成為吸引力的通道的吸引路16，且在吸引路16上是透過吸引閥17a而連接有吸引源17。又，在框體12及旋轉接頭15形成有成為水之流路的水路18，且在水路18上是透過供水閥19a而連接有水供給源19。在旋轉接頭15上連接有旋轉機構14，該旋轉機構14是用以使裝設於基座130的工作夾台10旋轉。As shown in FIG. 2, the work chuck 10 includes a perforated plate 11 having a holding surface 11 a for attracting and holding a plate-shaped workpiece, and a frame 12, and the frame 12 is provided with the holding surface 11 a exposed to accommodate the perforated plate 11.的 槽 部 120。 The recess 120. The frame body 12 is mounted on a base 130 constituting the holding mechanism 13. A rotary joint 15 is connected to the lower end of the base 130. The casing 12 and the rotary joint 15 are formed with a suction path 16 which is a suction path, and a suction source 17 is connected to the suction path 16 through a suction valve 17a. Further, a water passage 18 serving as a water flow path is formed in the housing 12 and the rotary joint 15, and a water supply source 19 is connected to the water passage 18 through a water supply valve 19 a. A rotary mechanism 14 is connected to the rotary joint 15, and the rotary mechanism 14 is used to rotate the work clamp 10 mounted on the base 130.
圖3所顯示的是將多孔板11收容於框體12前的狀態。多孔板11是形成為例如圓盤狀，且是由多孔陶瓷等的多孔質構件所構成。本實施形態所示之多孔板11的保持面11a是形成為與板狀工件相似形狀，且具有與板狀工件大致相同的面積。在框體12形成有環狀的凸部123，此凸部123的内側的區域成為因應於多孔板11的形狀而形成的凹部120。亦即，框體12的凹部120的内徑是形成得僅比多孔板11的外徑稍大，而變得可將多孔板11嵌入凹部120。FIG. 3 shows a state before the porous plate 11 is housed in the frame body 12. The porous plate 11 is formed in a disc shape, for example, and is made of a porous member such as a porous ceramic. The holding surface 11a of the porous plate 11 shown in this embodiment is formed in a shape similar to a plate-like workpiece, and has a substantially same area as the plate-like workpiece. A ring-shaped convex portion 123 is formed in the frame body 12, and a region inside the convex portion 123 is a concave portion 120 formed in accordance with the shape of the porous plate 11. That is, the inner diameter of the recessed portion 120 of the frame body 12 is formed only slightly larger than the outer diameter of the porous plate 11, so that the porous plate 11 can be fitted into the recessed portion 120.
凹部120的底面120a是形成為平坦面，以將多孔板11的下表面11b水平地固定。在凹部120的底面120a的中央形成有可通過圖2所示的吸引路16來與吸引源17連通的吸引孔121。又，在凹部120的底面120a，於比底面120a更低的位置上形成有吸引溝122。藉由使其通過吸引孔121而於吸引溝122產生負壓，能夠將吸引力傳達到已嵌合於凹部120的多孔板11，而在保持面11a上發揮吸引作用。再者，在圖示之例中，吸引孔121雖然僅於凹部120的底面120a之中央形成有1個，但吸引孔121的數量或位置並未受限。從而，將吸引孔121的數量增加到2個以上，並且分別形成在底面120a的所期望的位置上亦可。The bottom surface 120 a of the recessed portion 120 is formed as a flat surface to horizontally fix the lower surface 11 b of the porous plate 11. A suction hole 121 is formed in the center of the bottom surface 120 a of the recessed portion 120 so as to communicate with the suction source 17 through the suction path 16 shown in FIG. 2. A suction groove 122 is formed on the bottom surface 120a of the recessed portion 120 at a position lower than the bottom surface 120a. By causing a negative pressure to be generated in the suction groove 122 through the suction hole 121, the suction force can be transmitted to the porous plate 11 fitted in the recessed portion 120, and the suction effect can be exerted on the holding surface 11a. Furthermore, in the example shown in the figure, although one suction hole 121 is formed only at the center of the bottom surface 120 a of the recessed portion 120, the number or position of the suction holes 121 is not limited. Therefore, the number of the suction holes 121 may be increased to two or more, and the suction holes 121 may be formed at desired positions on the bottom surface 120a, respectively.
如圖2所示，框體12的凸部123的上表面123a是設定在與將多孔板11嵌合於凹部120時的保持面11a相同高度位置而成為基準面。並且，於板狀工件的磨削時，是使上述的第2量器42接觸於上表面123a來測量工作夾台10的高度。As shown in FIG. 2, the upper surface 123 a of the convex portion 123 of the frame body 12 is set at the same height position as the holding surface 11 a when the porous plate 11 is fitted into the concave portion 120, and becomes a reference surface. In the grinding of the plate-like workpiece, the height of the work table 10 is measured by bringing the second gauge 42 into contact with the upper surface 123a.
在凸部123的上表面123a形成有複數個可通過水路18與水供給源19連通的水供給孔124。水供給孔124是在凸部123的上表面123a開口，而能夠朝向上表面123a的上方噴出水。如圖3所示，本實施形態所示之水供給孔124是在沿著多孔板11的外周的外側之位置上設置規定的間隔而形成有複數個，且整體而言是形成為環狀。又，雖然在圖示的例子中，水供給孔124的形狀是設成圓形的開口部，但亦可設成例如環狀之連續的開口部來形成。A plurality of water supply holes 124 are formed in the upper surface 123 a of the convex portion 123, and the water supply holes 124 can communicate with the water supply source 19 through the water path 18. The water supply hole 124 is opened on the upper surface 123a of the convex portion 123, and can eject water toward the upper surface 123a. As shown in FIG. 3, the water supply holes 124 shown in this embodiment are formed in a plurality of predetermined intervals at positions along the outer side of the outer periphery of the porous plate 11, and are formed in a ring shape as a whole. In addition, in the example shown in the figure, the shape of the water supply hole 124 is a circular opening, but it may be formed by, for example, a ring-shaped continuous opening.
在將多孔板11收容於框體12的情況下，是在凹部120的底面120a例如塗佈接著材之後，將多孔板11嵌入凹部120，以使底面120a接著固定多孔板11的下表面11b。藉此，如圖4所示，可形成使多孔板11與框體12成為一體的工作夾台10。複數個水供給孔124是形成為包圍多孔板11的外周而定位。當以如此構成的工作夾台10的保持面11a吸引保持板狀工件時，會成為藉由複數個水供給孔124將板狀工件的外周部包圍的狀態。在所述狀態下，能夠藉由從複數個水供給孔124噴出水，以在板狀工件的外周部的外側形成水層，而藉由水層將板狀工件的外周部水封並且在保持面11a上吸引保持板狀工件。如此，由於在本發明之工作夾台10中，即便在欲以工作夾台10保持的板狀工件的外周部有翹曲，也能藉由水層將板狀工件的外周部水封，所以能夠防止吸引力從外周部與保持面11a之間洩漏之情況，而變得可確實地以保持面11a來吸引保持板狀工件。When the perforated plate 11 is housed in the frame body 12, the bottom surface 120 a of the recessed portion 120 is coated with a bonding material, for example, and the perforated plate 11 is fitted into the recessed portion 120 so that the bottom surface 120 a adheres to the lower surface 11 b of the perforated plate 11. As a result, as shown in FIG. 4, a work chuck 10 in which the porous plate 11 and the frame 12 are integrated can be formed. The plurality of water supply holes 124 are formed to be positioned so as to surround the outer periphery of the porous plate 11. When the plate-shaped workpiece is attracted and held by the holding surface 11 a of the work table 10 configured in this manner, the outer peripheral portion of the plate-shaped workpiece is surrounded by the plurality of water supply holes 124. In this state, water can be sprayed from the plurality of water supply holes 124 to form a water layer outside the outer peripheral portion of the plate-shaped workpiece, and the outer peripheral portion of the plate-shaped workpiece can be water-sealed by the water layer and held. The plate-shaped workpiece is attracted and held on the surface 11a. As described above, in the work clamp table 10 of the present invention, even if the outer peripheral portion of the plate-shaped workpiece to be held by the work clamp 10 is warped, the outer peripheral portion of the plate-shaped workpiece can be water-sealed by the water layer. It is possible to prevent the suction force from leaking from between the outer peripheral portion and the holding surface 11a, and it becomes possible to reliably attract and hold the plate-shaped workpiece with the holding surface 11a.
接著，說明磨削裝置1的動作例。圖5(a)所示的板狀工件W為圓形板狀的被加工物的一例，並於圖1所示的片匣4a中收容有複數個。首先，搬出入機構5是從片匣4a中取出1片磨削前的板狀工件W，且如圖5(a)所示，將板狀工件W暫置於暫置台6。於此，板狀工件W的外周部Wc會因以密封樹脂將元件晶片密封時所產生的熱的影響等，而產生有例如朝從暫置台6的上表面遠離的上方向翹曲。如圖5(b)所示，搬入機構9是藉由使搬送墊90與支臂部91一起下降，而使搬送墊90的吸引面90a接觸於在暫置台6上以翹曲的狀態被暫置之板狀工件W的上表面，且以搬送墊90朝下方按壓。搬入機構9是使吸引源94的吸引力作用於吸引面90a以吸引保持板狀工件W。如此進行，而使搬入機構9接收板狀工件W。Next, an operation example of the grinding device 1 will be described. The plate-like workpiece W shown in FIG. 5 (a) is an example of a circular plate-shaped workpiece, and a plurality of the plate-like workpieces W are stored in the cassette 4 a shown in FIG. 1. First, the carry-in / out mechanism 5 takes out one piece of the plate-like workpiece W before grinding from the cassette 4a, and temporarily places the plate-like workpiece W on the temporary table 6 as shown in FIG. 5 (a). Here, the outer peripheral portion Wc of the plate-like workpiece W may be warped in an upward direction away from the upper surface of the temporary stage 6 due to the influence of heat generated when the element wafer is sealed with a sealing resin, for example. As shown in FIG. 5 (b), the carrying-in mechanism 9 lowers the carrying pad 90 together with the arm portion 91, so that the suction surface 90a of the carrying pad 90 comes into contact with the temporary table 6 and is temporarily warped. The upper surface of the plate-like workpiece W is placed on the upper surface, and the conveyance pad 90 is pressed downward. The carry-in mechanism 9 applies the attraction force of the attraction source 94 to the attraction surface 90a to attract and hold the plate-like workpiece W. In this way, the loading mechanism 9 receives the plate-like workpiece W.
搬入機構9是使搬送墊90與支臂部91一起上升，並且如圖6(a)所示，藉由驅動馬達93來將軸部92朝箭頭A方向旋轉，而使支臂部91於水平方向上旋繞，且使搬送墊90移動到工作夾台10的上方側。接著，搬入機構9是使搬送墊90與支臂部91一起下降，而將板狀工件W載置於工作夾台10的保持面11a。The carry-in mechanism 9 raises the transfer pad 90 together with the arm portion 91, and as shown in FIG. 6 (a), the shaft portion 92 is rotated in the direction of arrow A by the drive motor 93, so that the arm portion 91 is horizontal. It rotates in the direction, and moves the conveyance pad 90 to the upper side of the work table 10. Next, the carry-in mechanism 9 lowers the transfer pad 90 together with the arm portion 91 and places the plate-shaped workpiece W on the holding surface 11 a of the work table 10.
如圖6(b)所示，開啟已配設於吸引路16的吸引閥17a，使吸引作用通過吸引源17與吸引路16而在工作夾台10的保持面11a上發揮，並以保持面11a來吸引保持板狀工件W。搬入機構9是使吸引面90a的吸引力釋放且使搬送墊90與支臂部91一起上升。在搬送墊90從板狀工件W遠離之前，打開配設於水路18的供水閥19a，而從水供給源19到水路18開始進行規定量的水的供給，且使水從水供給孔124往上方側噴出。從水供給孔124將水持續噴出並形成圍繞板狀工件W的外周部Wc的水層100，且藉由水層100將板狀工件W的外周部Wc水封。然後，使搬送墊90從板狀工件W退避。如此進行，而從搬入機構9將板狀工件W移交到工作夾台10。As shown in FIG. 6 (b), the suction valve 17a provided in the suction path 16 is opened, and the suction effect is exerted on the holding surface 11a of the work clamp table 10 through the suction source 17 and the suction path 16, and the holding surface is 11a to attract and hold the plate-shaped workpiece W. The carry-in mechanism 9 releases the suction force of the suction surface 90 a and raises the transfer pad 90 together with the arm portion 91. Before the transfer pad 90 moves away from the plate-like workpiece W, the water supply valve 19a provided in the water passage 18 is opened, and a predetermined amount of water is supplied from the water supply source 19 to the water passage 18, and the water is passed from the water supply hole 124 to The upper side squirts. Water is continuously sprayed from the water supply hole 124 to form a water layer 100 surrounding the outer peripheral portion Wc of the plate-shaped workpiece W, and the outer peripheral portion Wc of the plate-shaped workpiece W is water-sealed by the water layer 100. Then, the transfer pad 90 is retracted from the plate-like workpiece W. In this manner, the plate-like workpiece W is transferred from the loading mechanism 9 to the work table 10.
接著，藉由使圖1所示的轉台8旋轉，以使已吸引保持板狀工件W的工作夾台10移動到磨削機構20A的下方。如圖7所示，藉由旋轉機構14使工作夾台10例如朝箭頭A方向旋轉，且磨削機構20A是旋轉主軸21而使磨削磨石27a以規定的旋轉速度朝箭頭A方向旋轉，並且藉由圖1所示的磨削進給機構30A使磨削機構20A例如朝-Z方向下降，而以磨削磨石27a來對板狀工件W的上表面整個面邊按壓邊進行粗磨削。Next, by rotating the turntable 8 shown in FIG. 1, the work table 10 that has attracted and held the plate-like workpiece W is moved below the grinding mechanism 20A. As shown in FIG. 7, the worktable 10 is rotated, for example, in the direction of arrow A by the rotation mechanism 14, and the grinding mechanism 20A is the rotating spindle 21, so that the grinding stone 27 a is rotated in the direction of arrow A at a predetermined rotation speed. In addition, the grinding feed mechanism 30A shown in FIG. 1 is used to lower the grinding mechanism 20A in, for example, the -Z direction, and the upper surface of the plate-like workpiece W is rough-grinded by the grinding grindstone 27a. cut.
粗磨削中是從水供給源19到水路18持續供給水，並從水供給孔124噴出水，以藉由水層100經常地將板狀工件W的外周部Wc水封。因此，即便因外周部Wc的翹曲而使得保持面11a與外周部Wc之間產生些許的間隙，也能夠藉由水層100防止吸引力從保持面11a洩漏之情形。如此，可藉由水層100將板狀工件W的外周部Wc水封，並且以旋轉的磨削磨石27a將板狀工件W的上表面整個面粗磨削至達到規定的厚度為止。板狀工件W的粗磨削中，是使用圖1所示的厚度測量機構40，並經常地測量板狀工件W的厚度，以在達到規定的厚度之時間點上結束粗磨削。In the rough grinding, water is continuously supplied from the water supply source 19 to the water path 18, and water is sprayed from the water supply hole 124, so that the outer peripheral portion Wc of the plate-shaped workpiece W is always water-sealed by the water layer 100. Therefore, even if a slight gap is generated between the holding surface 11a and the outer peripheral portion Wc due to the warpage of the outer peripheral portion Wc, it is possible to prevent the attractive force from leaking from the holding surface 11a by the water layer 100. In this way, the outer peripheral portion Wc of the plate-like workpiece W can be water-sealed by the water layer 100, and the entire surface of the upper surface of the plate-like workpiece W can be roughly ground by the rotating grinding stone 27a to a predetermined thickness. In the rough grinding of the plate-like workpiece W, the thickness measuring mechanism 40 shown in FIG. 1 is used, and the thickness of the plate-like workpiece W is often measured to finish the rough grinding at a point when the predetermined thickness is reached.
如上述，雖然可將外周部Wc水封到板狀工件W的粗磨削結束為止，但由於當將板狀工件W進行一定程度薄化時，即會消除外周部Wc的翹曲，所以亦可在這種情況下，停止從水供給源19對水路18的水的供給。亦即，粗磨削中只要在消除板狀工件W的外周部Wc的翹曲以前，可將外周部Wc水封並且以工作夾台10來吸引保持板狀工件W即可。As described above, although the outer peripheral portion Wc can be water-sealed until the rough grinding of the plate-shaped workpiece W is completed, the warpage of the outer peripheral portion Wc is eliminated when the plate-shaped workpiece W is thinned to a certain extent. In this case, the supply of water to the water path 18 from the water supply source 19 may be stopped. That is, in the rough grinding, before the warpage of the outer peripheral portion Wc of the plate-shaped workpiece W is eliminated, the outer peripheral portion Wc may be water-sealed and the plate-shaped workpiece W may be sucked and held by the work clamp 10.
結束粗磨削後，將圖1所示的轉台8進一步旋轉，而使吸引保持有粗磨削後的板狀工件W的工作夾台10移動到磨削機構20B的下方。精磨削是藉由與粗磨削同樣的動作來進行。亦即，使工作夾台10旋轉，並且磨削機構20B是旋轉主軸21，而使磨削磨石27b以規定的旋轉速度旋轉。藉由磨削進給機構30A使磨削機構20B例如朝-Z方向下降，而以磨削磨石27b來對板狀工件W的上表面整個面按壓並且進行精磨削。在進行精磨削時，只要板狀工件W的外周部Wc的翹曲未被消除，即宜與粗磨削同樣地從水供給孔124噴出水，以藉由水層100經常地將板狀工件W的外周部Wc水封，並且以保持面11a來吸引保持板狀工件W。精磨削中，是使用厚度測量機構40經常地測量板狀工件W的厚度，以在達到規定的精磨削厚度的時間點上結束精磨削。After the rough grinding is completed, the turntable 8 shown in FIG. 1 is further rotated to move the worktable 10 that sucks and holds the plate-like workpiece W after the rough grinding to the lower side of the grinding mechanism 20B. Fine grinding is performed by the same operation as rough grinding. That is, the work chuck 10 is rotated, and the grinding mechanism 20B is the rotation main shaft 21, and the grinding stone 27b is rotated at a predetermined rotation speed. The grinding feed mechanism 30A lowers the grinding mechanism 20B in, for example, the -Z direction, and the entire surface of the upper surface of the plate-like workpiece W is pressed with the grinding grindstone 27b to perform fine grinding. When the fine grinding is performed, as long as the warpage of the outer peripheral portion Wc of the plate-like workpiece W is not eliminated, it is preferable to spray water from the water supply hole 124 in the same manner as the rough grinding, so that the plate-like shape is frequently passed through the water layer 100. The outer peripheral portion Wc of the workpiece W is water-sealed, and the plate-shaped workpiece W is attracted and held by the holding surface 11 a. In the finish grinding, the thickness of the plate-like workpiece W is constantly measured using the thickness measuring mechanism 40 to finish the finish grinding at a time point when the predetermined finish grinding thickness is reached.
結束精磨削後，使轉台8旋轉，而將工作夾台10定位於裝卸區域P1，並藉由搬入機構9a將磨削完成的板狀工件W從工作夾台10搬送到洗淨機構7。並且，以洗淨機構7將板狀工件W洗淨後，藉由搬出入機構5將板狀工件W收容於片匣4b。After finishing the grinding, the turntable 8 is rotated to position the work clamp table 10 in the loading / unloading area P1, and the ground plate-shaped workpiece W is transferred from the work clamp table 10 to the cleaning mechanism 7 by the carrying-in mechanism 9a. After the plate-like workpiece W is washed by the cleaning mechanism 7, the plate-like workpiece W is stored in the cassette 4 b by the carry-in / out mechanism 5.
像這樣，由於本發明之磨削裝置1是構成為具備：保持機構13，供工作夾台10可旋轉地裝設；磨削機構20A、20B，磨削工作夾台10所吸引保持的板狀工件W；及搬入機構9，將板狀工件W搬入工作夾台10，且藉由搬入機構9將板狀工件W搬入工作夾台10且使工作夾台10吸引保持板狀工件W後，可從水供給孔124將水供給到框體12的上表面123a來形成水層100，且藉由水層100將板狀工件W的外周部Wc水封並且使工作夾台10旋轉，而以磨削機構20A、20B對板狀工件W進行磨削，所以即使是外周部Wc有翹曲的板狀工件W，也能夠防止吸引力從工作夾台10的保持面11a與板狀工件W的外周部Wc之間洩漏之情況。從而，能夠防止板狀工件W在磨削中從工作夾台10脫落之疑慮，而能夠以工作夾台10的保持面11a來確實地吸引保持板狀工件W並實施磨削加工。As described above, the grinding device 1 of the present invention is configured to include: a holding mechanism 13 for rotatably mounting the work clamp 10; and grinding mechanisms 20A and 20B that are held in a plate shape sucked and held by the work clamp 10. Workpiece W; and a loading mechanism 9 for loading the plate-shaped workpiece W into the work clamp table 10, and for moving the plate-shaped workpiece W into the work clamp table 10 by the loading mechanism 9, and making the work clamp table 10 attract and hold the plate-shaped workpiece W, Water is supplied from the water supply hole 124 to the upper surface 123a of the frame body 12 to form a water layer 100, and the outer peripheral portion Wc of the plate-shaped workpiece W is water-sealed by the water layer 100 and the work table 10 is rotated to grind. The cutting mechanisms 20A and 20B grind the plate-shaped workpiece W. Therefore, even if the plate-shaped workpiece W has a warped outer peripheral portion Wc, it is possible to prevent attraction from the holding surface 11a of the work table 10 and the outer periphery of the plate-shaped workpiece W. Leakage between parts Wc. Therefore, it is possible to prevent the plate-shaped workpiece W from falling off from the work table 10 during grinding, and it is possible to reliably suck and hold the plate-shaped work W by the holding surface 11 a of the work table 10 and perform grinding processing.
雖然在上述實施形態所示的工作夾台10中，多孔板11的保持面11a具有與板狀工件W大致相同的面積，但工作夾台10的保持面11a的面積亦可為例如比板狀工件W稍微小的面積。又，工作夾台10的保持面11a的面積亦可為比板狀工件W稍微大的面積。即使在此情形下，由於仍然能夠根據本發明而從複數個水供給孔124噴出水，來將板狀工件W的外周部Wc水封，所以能夠防止吸引力從工作夾台10的保持面11a與板狀工件W的外周部Wc之間洩漏之情況，而以保持面11a來確實地吸引保持板狀工件。Although the holding surface 11a of the perforated plate 11 in the work clamp table 10 shown in the above embodiment has approximately the same area as the plate-like workpiece W, the area of the holding surface 11a of the work clamp table 10 may be, for example, larger than that of a plate. The work W has a slightly smaller area. The area of the holding surface 11 a of the work table 10 may be slightly larger than the area of the plate-like workpiece W. Even in this case, since the water can be sprayed from the plurality of water supply holes 124 according to the present invention to water-seal the outer peripheral portion Wc of the plate-shaped workpiece W, it is possible to prevent the suction force from holding the surface 11 a of the work clamp 10 In the case of leakage from the outer peripheral portion Wc of the plate-shaped workpiece W, the holding surface 11 a is used to reliably attract and hold the plate-shaped workpiece.
1‧‧‧磨削裝置1‧‧‧Grinding device
2‧‧‧裝置基台2‧‧‧ device abutment
3a、3b‧‧‧載台3a, 3b ‧‧‧ carrier
4a、4b‧‧‧片匣4a, 4b‧‧‧ cassette
5‧‧‧搬出入機構5‧‧‧ Moved in and out of the institution
6‧‧‧暫置台6‧‧‧ temporary table
7‧‧‧洗淨機構7‧‧‧cleaning agency
8‧‧‧轉台8‧‧‧ turntable
9、9a‧‧‧搬入機構9, 9a ‧ ‧ ‧ moved in
10‧‧‧工作夾台10‧‧‧Work clamp
11‧‧‧多孔板11‧‧‧ multi-well plate
11a‧‧‧保持面11a‧‧‧ keep face
11b‧‧‧下表面11b‧‧‧ lower surface
12‧‧‧框體12‧‧‧Frame
13‧‧‧保持機構13‧‧‧ holding agency
14‧‧‧旋轉機構14‧‧‧ rotating mechanism
15‧‧‧旋轉接頭15‧‧‧ Rotary Joint
16‧‧‧吸引路16‧‧‧ Attraction
17、94‧‧‧吸引源17, 94‧‧‧ Attraction source
17a‧‧‧吸引閥17a‧‧‧Suction valve
18‧‧‧水路18‧‧‧ Waterway
19‧‧‧水供給源19‧‧‧ Water supply source
19a‧‧‧供水閥19a‧‧‧ water supply valve
20A、20B‧‧‧磨削機構20A, 20B‧‧‧Grinding mechanism
21‧‧‧主軸21‧‧‧ Spindle
22、32、93‧‧‧馬達22, 32, 93‧‧‧ Motor
23‧‧‧主軸殼體23‧‧‧ Spindle housing
24‧‧‧支持器24‧‧‧ Supporter
25‧‧‧安裝座25‧‧‧Mount
26a、26b‧‧‧磨削輪26a, 26b ‧‧‧ grinding wheels
27a、27b‧‧‧磨削磨石27a, 27b‧‧‧grinding stone
28、29‧‧‧支柱28, 29‧‧‧ Pillar
30A、30B‧‧‧磨削進給機構30A, 30B‧‧‧Grinding feed mechanism
31‧‧‧滾珠螺桿31‧‧‧ball screw
33‧‧‧導軌33‧‧‧Guide
34‧‧‧升降板34‧‧‧ Lifting plate
40‧‧‧厚度測量機構40‧‧‧thickness measuring mechanism
41‧‧‧第1量器41‧‧‧The first measuring device
42‧‧‧第2量器42‧‧‧ 2nd measuring device
90‧‧‧搬送墊90‧‧‧ transfer pad
90a‧‧‧吸引面90a‧‧‧ attracting surface
91‧‧‧支臂部91‧‧‧arm arm
92‧‧‧軸部92‧‧‧ Shaft
100‧‧‧水層100‧‧‧ water layer
120‧‧‧凹部120‧‧‧ Recess
120a‧‧‧底面120a‧‧‧ Underside
121‧‧‧吸引孔121‧‧‧ suction hole
122‧‧‧吸引溝122‧‧‧Attraction trench
123‧‧‧凸部123‧‧‧ convex
123a‧‧‧上表面123a‧‧‧ Top surface
124‧‧‧水供給孔124‧‧‧Water supply hole
130‧‧‧基座130‧‧‧ base
A‧‧‧箭頭A‧‧‧arrow
P1‧‧‧裝卸區域P1‧‧‧Loading area
P2‧‧‧磨削區域P2‧‧‧Grinding area
W‧‧‧板狀工件W‧‧‧ plate workpiece
Wc‧‧‧外周部Wc‧‧‧ Peripheral Department
±X、±Y、±Z‧‧‧方向± X, ± Y, ± Z‧‧‧ directions
圖1是顯示磨削裝置之一例的構成的立體圖。 圖2是顯示工作夾台、保持機構及搬入機構的構成的截面圖。 圖3是顯示工作夾台的構成的分解立體圖。 圖4是顯示工作夾台的構成的立體圖。 圖5是顯示藉由搬入機構接收已暫置於暫置台上的板狀工件之狀態的截面圖。 圖6是顯示藉由搬入機構將板狀工件移交至工作夾台之狀態的截面圖。 圖7是顯示一邊將被吸引保持於工作夾台的板狀工件的外周部水封，一邊對板狀工件進行磨削之狀態的截面圖。FIG. 1 is a perspective view showing a configuration of an example of a grinding apparatus. FIG. 2 is a cross-sectional view showing the configuration of a work table, a holding mechanism, and a carry-in mechanism. FIG. 3 is an exploded perspective view showing a configuration of a work clamp. FIG. 4 is a perspective view showing the configuration of a work clamp. 5 is a cross-sectional view showing a state in which a plate-shaped workpiece temporarily placed on a temporary table is received by a carry-in mechanism. FIG. 6 is a cross-sectional view showing a state where a plate-like workpiece is transferred to a work clamp table by a loading mechanism. FIG. 7 is a cross-sectional view showing a state in which the plate-like workpiece is ground while the outer peripheral portion of the plate-like workpiece attracted and held on the work clamp is water-sealed.
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| JP2017-002553 | 2017-01-11 | ||
| JP2017002553A JP6920063B2 (en) | 2017-01-11 | 2017-01-11 | How to hold a plate-shaped work |
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| TW201829118A true TW201829118A (en) | 2018-08-16 |
| TWI758364B TWI758364B (en) | 2022-03-21 |
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| JP (1) | JP6920063B2 (en) |
| KR (1) | KR102310075B1 (en) |
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| JP7358222B2 (en) * | 2019-12-06 | 2023-10-10 | 株式会社ディスコ | Plate-shaped object holder |
| CN111113205A (en) * | 2019-12-25 | 2020-05-08 | 昆山昌利达精密机械有限公司 | Polishing platform for hardware fitting machining |
| US11652080B2 (en) * | 2021-05-27 | 2023-05-16 | Intel Corporation | Thermal compression bonder nozzle with vacuum relief features |
| CN113770913B (en) * | 2021-10-28 | 2022-11-04 | 华海清科股份有限公司 | Sucking disc revolving stage and system of processing |
| CN115302644B (en) * | 2022-10-11 | 2023-01-31 | 南京宏泰晶智能装备科技有限公司 | Vertical punching device for monocrystalline silicon wafer |
| CN115383389B (en) * | 2022-10-28 | 2023-03-17 | 镇江华舟电器有限公司 | Cubical switchboard curb plate welded fastening device |
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| JPS6094842U (en) * | 1983-12-05 | 1985-06-28 | 九州日本電気株式会社 | Grinding equipment for semiconductor substrates |
| JPH10135316A (en) * | 1996-10-28 | 1998-05-22 | Sony Corp | Vacuum chucking method for thin substrate and vacuum chuck table apparatus therefor |
| JP4417525B2 (en) | 2000-04-28 | 2010-02-17 | 株式会社ディスコ | Grinding equipment |
| US6475067B1 (en) * | 2001-12-11 | 2002-11-05 | Budget Maintenance Concrete Services, Inc. | Dry method of concrete floor restoration |
| JP4732736B2 (en) * | 2004-11-08 | 2011-07-27 | 株式会社岡本工作機械製作所 | Device wafer vacuum chuck system and method for polishing back surface of device wafer using the same |
| JP2006261415A (en) | 2005-03-17 | 2006-09-28 | Denso Corp | Manufacturing method for semiconductor device |
| JP5406676B2 (en) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | Wafer processing equipment |
| JP5944724B2 (en) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | Chuck table |
| JP5999972B2 (en) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | Holding table |
| JP6132547B2 (en) * | 2012-12-25 | 2017-05-24 | 株式会社ディスコ | Negative pressure generator |
| JP2015199153A (en) | 2014-04-07 | 2015-11-12 | 株式会社ディスコ | Holding table, and grinding method and cutting method using the same |
| JP6312554B2 (en) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | Processing method of package substrate |
| JP2016047561A (en) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | Grinding device |
| JP2016078147A (en) * | 2014-10-14 | 2016-05-16 | 株式会社ディスコ | Grinding device |
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