TW202336591A - Chip testing device and chip testing method - Google Patents

Chip testing device and chip testing method Download PDF

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TW202336591A
TW202336591A TW111125830A TW111125830A TW202336591A TW 202336591 A TW202336591 A TW 202336591A TW 111125830 A TW111125830 A TW 111125830A TW 111125830 A TW111125830 A TW 111125830A TW 202336591 A TW202336591 A TW 202336591A
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test
chip
module
control module
data
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TW111125830A
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侯衛京
曹興
林欽發
曾睿
黃余毅
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大陸商敦泰電子(深圳)有限公司
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Abstract

A chip testing method is applied to the chip testing device. When testing a to-be-tested chip, it is determined which test application program to start according to the configuration file set by the tester. Different configuration files correspond to different test application programs for the to-be-tested functions of the to-be-tested chip. By starting different test application programs to start test items of different to-be-tested functions of different to-be-tested chips, it is finally obtained a test result of the to-be-tested function of the to-be-tested chip according to the acquired response data. When testing different functions of chips from different manufacturers, it is only required to change the set configuration files according to the manufacturer and the to-be-tested function of the to-be-tested chip, thus to test different to-be-tested functions of different to-be-tested chips from different manufacturers.

Description

晶片測試設備及晶片測試方法Wafer testing equipment and chip testing methods

本發明涉及晶片測試技術領域，特別是涉及一種晶片測試設備及晶片測試方法。The present invention relates to the technical field of wafer testing, and in particular to a wafer testing equipment and a wafer testing method.

目前，觸控晶片、顯示晶片或觸控顯示晶片在生產完畢後，都需要經過測試的流程，現有的對這些待測晶片進行測試的晶片測試設備通常選用MCU（Microcontroller Unit，微控制單元）作為主控晶片，將待測晶片的功能測試程式封裝在MCU韌體中，但這樣會導致晶片測試設備的測試功能單一，即僅能單獨測試待測晶片的觸控功能或者單獨測試待測晶片的顯示功能，使得晶片測試設備的通用性和兼容性不高。此外，市面上有多家生產上述待測晶片的廠家，由於不同廠家的待測晶片的測試配置與測試流程不同，因此待測晶片的功能測試程式也不相同，將不同廠家的待測晶片的不同的功能測試程式封裝在MCU韌體中需要專業編程人員操作且封裝的過程較為複雜。At present, touch chips, display chips or touch display chips need to go through a testing process after production. Existing chip testing equipment for testing these chips to be tested usually uses MCU (Microcontroller Unit) as the The main control chip encapsulates the functional test program of the chip under test in the MCU firmware, but this will result in a single test function of the chip test equipment, that is, it can only test the touch function of the chip under test alone or test the touch function of the chip under test alone. The display function makes the wafer test equipment less versatile and compatible. In addition, there are many manufacturers on the market that produce the above-mentioned chips under test. Since the test configurations and test processes of the chips under test are different from different manufacturers, the functional test procedures of the chips under test are also different. The functions of the chips under test from different manufacturers are also different. The packaging of different functional test programs in MCU firmware requires professional programmers to operate and the packaging process is relatively complicated.

本發明的目的是提供一種晶片測試設備及晶片測試方法，可以通過CPU主控模組搭配MCU控制模組，實現開放性測試平台，設置不同的設定檔來完成對不同廠家的不同待測晶片的不同待測功能的測試，提高了晶片測試設備的通用性和兼容性，且測試過程不需要專業的編程人員。The purpose of the present invention is to provide a chip testing equipment and a chip testing method, which can realize an open testing platform through the CPU main control module and the MCU control module, and set different configuration files to complete the testing of different chips to be tested from different manufacturers. The testing of different functions to be tested improves the versatility and compatibility of chip testing equipment, and the testing process does not require professional programmers.

為解決上述技術問題，本發明提供了一種晶片測試設備，包括CPU主控模組、MCU控制模組和通訊接口模組，所述CPU主控模組與所述MCU控制模組連接，所述MCU控制模組還與所述通訊接口模組連接，所述通訊接口模組還與待測晶片連接；In order to solve the above technical problems, the present invention provides a chip testing equipment, including a CPU main control module, an MCU control module and a communication interface module. The CPU main control module is connected to the MCU control module, and the The MCU control module is also connected to the communication interface module, and the communication interface module is also connected to the chip to be tested;

所述CPU主控模組預設有所述待測晶片的測試應用程式，所述CPU主控模組通過所述測試應用程式進行測試流程的控制；The CPU main control module is preset with a test application program for the chip under test, and the CPU main control module controls the test process through the test application program;

在運行所述測試應用程式時，所述MCU控制模組負責執行CPU主控模組下傳的命令，並基於所述命令向所述通訊接口模組發送數據，所述通訊接口模組針對由所述MCU控制模組發送的數據進行轉換，並完成與所述待測晶片的數據通訊；所述通訊接口模組針對向所述MCU控制模組反饋的待測晶片的數據進行轉換，所述MCU控制模組接受並處理所述數據，並將處理後數據或者判斷結果反饋至所述CPU主控模組，所述CPU主控模組根據所述處理後數據或者所述MCU控制模組判斷結果提供待測晶片的最終功能測試結果。When running the test application, the MCU control module is responsible for executing commands transmitted by the CPU main control module and sending data to the communication interface module based on the commands. The communication interface module is configured for The data sent by the MCU control module is converted, and data communication with the chip under test is completed; the communication interface module converts the data of the chip under test that is fed back to the MCU control module. The MCU control module receives and processes the data, and feeds back the processed data or judgment results to the CPU main control module. The CPU main control module makes judgments based on the processed data or the MCU control module. The results provide the final functional test results of the chip under test.

優選的，所述測試應用程式用於針對晶片的觸控功能和/或顯示功能和/或觸控顯示功能進行測試。Preferably, the test application is used to test the touch function and/or the display function and/or the touch display function of the chip.

優選的，所述MCU控制模組包括電源管理單元、顯示圖像處理單元、電壓電流測量單元及IO控制和測量單元中的任意一種或多種。Preferably, the MCU control module includes any one or more of a power management unit, a display image processing unit, a voltage and current measurement unit, and an IO control and measurement unit.

優選的，所述CPU主控模組預設有多個測試應用程式，任意一個測試應用程式用於針對其對應型號的所述待測晶片的觸控功能和/或顯示功能和/或觸控顯示功能進行檢測。Preferably, the CPU main control module is preset with multiple test applications, and any one of the test applications is used for the touch function and/or display function and/or touch control of the chip under test of its corresponding model. Display function is tested.

優選的，所述通訊接口模組包括協議轉換模組和接口模組；所述協議轉換模組用於在接收到測試數據時按照接口輸出標準將所述測試數據發送至所述接口模組，所述接口模組將所述測試數據發送至所述待測晶片，並將接收到的所述待測晶片的響應數據通過協議轉換模組進行相應的格式轉換後發送至所述MCU控制模組。Preferably, the communication interface module includes a protocol conversion module and an interface module; the protocol conversion module is used to send the test data to the interface module according to the interface output standard when receiving test data, The interface module sends the test data to the chip under test, and performs corresponding format conversion on the received response data of the chip under test through the protocol conversion module and then sends it to the MCU control module. .

優選的，所述接口模組包括晶片通訊接口及顯示接口。Preferably, the interface module includes a chip communication interface and a display interface.

優選的，所述晶片通訊接口包括I2C接口和/或SPI接口和/或其他IO接口；所述顯示接口包括MIPI DPHY接口、MIPI CPHY接口、LVDS接口、EDP接口及RGB接口的任意一種或多種。Preferably, the chip communication interface includes I2C interface and/or SPI interface and/or other IO interface; the display interface includes any one or more of MIPI DPHY interface, MIPI CPHY interface, LVDS interface, EDP interface and RGB interface.

為解決上述技術問題，本發明還提供了一種晶片測試方法，應用於晶片測試設備，包括：In order to solve the above technical problems, the present invention also provides a wafer testing method, which is applied to wafer testing equipment, including:

根據預設的設定檔確定待測晶片的測試應用程式，不同的設定檔對應的測試應用程式不同；Determine the test application for the chip under test based on the default profile. Different profiles correspond to different test applications;

啟動所述測試應用程式以對所述待測晶片執行對應的測試項；Launch the test application to execute corresponding test items on the chip under test;

獲取所述待測晶片的響應數據；Obtain response data of the wafer under test;

根據所述響應數據得到所述待測晶片的待測功能的最終測試結果；Obtain the final test result of the function under test of the chip under test according to the response data;

測試應用程式包括待測晶片的觸控功能測試應用程式、顯示功能測試應用程式、觸控與顯示功能併行測試應用程式及觸控與顯示功能串行測試應用程式中的至少一種。The test application includes at least one of a touch function test application, a display function test application, a touch and display function parallel test application, and a touch and display function serial test application of the chip under test.

優選的，所述晶片測試設備包括CPU主控模組、MCU控制模組和通訊接口模組，所述MCU控制模組與所述CPU主控模組連接，所述MCU控制模組還與所述通訊接口模組連接，所述通訊接口模組與待測晶片連接；啟動所述測試應用程式以對所述待測晶片執行所述測試項，獲取對所述待測晶片的響應數據，包括：Preferably, the chip testing equipment includes a CPU main control module, an MCU control module and a communication interface module, the MCU control module is connected to the CPU main control module, and the MCU control module is also connected to the The communication interface module is connected, and the communication interface module is connected to the chip under test; the test application is started to execute the test item on the chip under test, and the response data to the chip under test is obtained, including :

S1：啟動所述測試應用程式，根據所述測試應用程式對應的測試項判斷是否需要讀寫所述待測晶片，若是，進入S2；S1: Start the test application, and determine whether it is necessary to read and write the chip under test based on the test items corresponding to the test application. If so, enter S2;

S2：調用函式庫檔案中與所述測試應用程式對應的待測功能的接口函數；S2: Call the interface function of the function under test corresponding to the test application in the function library file;

S3：根據所述待測功能的接口函數訪問對應的操作系統的設備節點；S3: Access the device node of the corresponding operating system according to the interface function of the function to be tested;

S4：判斷是否直接讀寫所述待測晶片，若是，進入S5，若否，進入S6；S4: Determine whether to directly read and write the chip under test, if so, enter S5, if not, enter S6;

S5：通過所述設備節點調用所述操作系統驅動程序的接口讀寫函數，並通過所述通訊接口模組對所述待測晶片進行讀寫，再通過所述通訊接口模組接收所述待測晶片返回至所述接口讀寫函數的響應數據，進入S8；S5: Call the interface read and write function of the operating system driver through the device node, read and write the chip to be tested through the communication interface module, and then receive the chip to be tested through the communication interface module. The test chip returns the response data of the interface read and write function and enters S8;

S6：判斷是否通過所述MCU控制模組讀寫所述待測晶片，若是，則進入S7；S6: Determine whether the chip under test is read and written through the MCU control module. If so, enter S7;

S7：通過所述設備節點調用MCU控制模組讀寫函數以使MCU控制模組的韌體程序執行相應命令，並通過所述通訊接口模組實現對所述待測晶片的讀寫，再通過所述通訊接口模組接收所述待測晶片返回至所述MCU控制模組讀寫函數的響應數據，進入S8；S7: Call the MCU control module read and write functions through the device node so that the firmware program of the MCU control module executes the corresponding command, and reads and writes the chip under test through the communication interface module, and then through The communication interface module receives the response data from the chip under test returned to the read-write function of the MCU control module and enters S8;

S8：所述讀寫函數獲取的響應數據依次反饋給所述設備節點、函式庫檔案及應用程式，完成所述待測晶片數據的讀寫。S8: The response data obtained by the read and write functions are fed back to the device nodes, function library files and applications in sequence to complete the reading and writing of the chip data to be tested.

優選的，當所述測試應用程式為觸控與顯示功能併行測試應用程式時，啟動所述測試應用程式以對所述待測晶片執行所述待測功能的測試項，包括：Preferably, when the test application is a parallel test application for touch and display functions, the test application is started to execute the test items of the function under test on the chip under test, including:

啟動所述測試應用程式，根據所述測試應用程式同時啟動第一執行緒對所述待測晶片執行觸控功能測試項和啟動第二執行緒對所述待測晶片執行顯示功能測試項；Start the test application program, and simultaneously start a first execution thread to perform a touch function test item on the chip under test and a second execution thread to perform a display function test item on the chip under test according to the test application program;

獲取對所述待測晶片執行所述測試項時所述待測晶片反饋的響應數據，包括：Obtain the response data fed back by the chip under test when the test item is executed on the chip under test, including:

獲取所述第一執行緒對所述待測晶片執行觸控功能測試項時得到的觸控測試響應數據；Obtain touch test response data obtained when the first execution thread performs a touch function test item on the chip under test;

獲取所述第二執行緒對所述待測晶片執行顯示功能測試項時得到的顯示測試響應數據。Obtain display test response data obtained when the second execution thread performs a display function test item on the chip under test.

本發明提供了一種晶片測試設備及晶片測試方法，本發明提供的晶片測試設備包括CPU主控模組、MCU控制模組和通訊接口模組，CPU主控模組預設有多個測試應用程式，通過啟動不同的測試應用程式，配合MCU控制模組和通訊接口模組來完成對不同待測晶片的不同待測功能的檢測，提高了晶片測試設備的通用性和兼容性，提高了測試效率。The invention provides a chip testing equipment and a chip testing method. The chip testing equipment provided by the invention includes a CPU main control module, an MCU control module and a communication interface module. The CPU main control module is preset with multiple test applications. By starting different test applications and cooperating with the MCU control module and communication interface module to complete the detection of different functions under test of different chips under test, the versatility and compatibility of the chip test equipment is improved, and the test efficiency is improved. .

本發明提供的晶片測試方法應用於晶片測試設備，在進行待測晶片測試時，根據測試人員預設的設定檔來確定啟動哪個測試應用程式，不同的設定檔對應的待測晶片的待測功能的測試應用程式不同，通過啟動不同的測試應用程式來啟動不同待測晶片的不同待測功能的測試項，最終根據得到的響應數據得到待測晶片的待測功能的測試結果，當需要對不同廠家的晶片的不同功能進行測試時，只需要根據待測晶片的生產廠家及待測功能更改設置的設定檔即可實現對不同廠家的不同待測晶片的不同待測功能的測試，提高了晶片測試設備的通用性和兼容性，提高了測試效率，且更改設置設定檔的過程簡單快捷，不需要專業的編程人員操作。The chip testing method provided by the present invention is applied to chip testing equipment. When testing the chip to be tested, which test application to start is determined according to the configuration file preset by the tester. Different configuration files correspond to the functions of the chip to be tested. Different test applications are used. By launching different test applications, the test items of different functions under test of different chips under test are started. Finally, the test results of the functions under test of the chips under test are obtained based on the obtained response data. When it is necessary to test different functions of the chips under test, When testing different functions of chips from different manufacturers, you only need to change the settings according to the manufacturer of the chip to be tested and the function to be tested, so that you can test the different functions to be tested on different chips from different manufacturers, which improves the efficiency of the chip. The versatility and compatibility of the test equipment improves the test efficiency, and the process of changing the setting profile is simple and fast, and does not require professional programmers to operate.

本發明的核心是提供一種晶片測試設備及晶片測試方法，可以通過CPU主控模組搭配MCU控制模組，實現開放性測試平台，設置不同的設定檔來完成對不同廠家的不同待測晶片的不同待測功能的測試，提高了晶片測試設備的通用性和兼容性，且測試過程不需要專業的編程人員。The core of the present invention is to provide a chip testing equipment and a chip testing method, which can realize an open testing platform through the CPU main control module and the MCU control module, and set different configuration files to complete the testing of different chips to be tested from different manufacturers. The testing of different functions to be tested improves the versatility and compatibility of chip testing equipment, and the testing process does not require professional programmers.

為使本發明實施例的目的、技術方案和優點更加清楚，下面將結合本發明實施例中的圖式，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例是本發明一部分實施例，而不是全部的實施例。基於本發明中的實施例，所屬技術領域具通常知識者在沒有做出創造性勞動前提下所獲得的所有其他實施例，都屬本發明保護的範圍。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary skill in the technical field without making creative efforts shall fall within the scope of protection of the present invention.

請參照圖1，圖1為本發明提供的一種晶片測試設備的結構示意圖，包括CPU主控模組1、MCU控制模組2和通訊接口模組3，CPU主控模組1與MCU控制模組2連接，MCU控制模組2還與通訊接口模組3連接，待測晶片通過連接通訊接口模組3完成晶片測試流程；Please refer to Figure 1. Figure 1 is a schematic structural diagram of a chip testing equipment provided by the present invention, including a CPU main control module 1, an MCU control module 2 and a communication interface module 3. The CPU main control module 1 and the MCU control module Group 2 is connected, MCU control module 2 is also connected to communication interface module 3, and the chip under test completes the chip testing process by connecting to communication interface module 3;

CPU主控模組1預設有待測晶片的測試應用程式，CPU主控模組1通過測試應用程式進行測試流程的控制；The CPU main control module 1 is preset with a test application program for the chip under test, and the CPU main control module 1 controls the test process through the test application program;

在運行測試應用程式時，MCU控制模組2負責執行CPU主控模組1下傳的命令，並基於命令向通訊接口模組3發送數據，通訊接口模組3針對由MCU控制模組2發送的數據進行轉換，並完成與待測晶片的數據通訊；通訊接口模組3針對向MCU控制模組2反饋的待測晶片的數據進行轉換，MCU控制模組2接受並處理數據，並將處理後數據或者判斷結果反饋至CPU主控模組1，CPU主控模組1根據處理後數據或者MCU控制模組2判斷結果提供待測晶片的最終功能測試結果。When running the test application, the MCU control module 2 is responsible for executing the commands transmitted by the CPU main control module 1 and sending data to the communication interface module 3 based on the commands. The communication interface module 3 responds to the data sent by the MCU control module 2. The data of the chip under test is converted and the data communication with the chip under test is completed; the communication interface module 3 converts the data of the chip under test fed back to the MCU control module 2, and the MCU control module 2 accepts and processes the data and processes the data. The final data or judgment results are fed back to the CPU main control module 1. The CPU main control module 1 provides the final functional test results of the chip under test based on the processed data or the judgment results of the MCU control module 2.

目前，各種晶片在完成生產過後，都會有晶片測試的流程來保證晶片的功能完好，例如現在常見的觸控晶片、顯示晶片或觸控顯示晶片，現有技術在對這些晶片進行功能測試時，通常選擇MCU控制晶片作為主控，將待測試的功能封裝在MCU的底層韌體中，這就導致MCU控制晶片能晶片的種類和測試的功能都是固定的，也即測試設備的測試對象單一，僅能測試一種晶片的一種功能，導致測試設備的通用性和兼容性不高，當需要更改待測晶片的種類或更改待測功能時，就需要對MCU控制晶片的底層韌體進行重新封裝，導致測試過程複雜化，需要專業編程人員才能完成。At present, after the production of various chips, there will be a chip testing process to ensure that the functions of the chips are intact, such as the common touch chips, display chips or touch display chips. The existing technology usually performs functional testing on these chips. Select the MCU control chip as the main control, and encapsulate the functions to be tested in the underlying firmware of the MCU. This results in the MCU control chip capable of fixed chip types and test functions, that is, the test object of the test equipment is single. Only one function of one chip can be tested, resulting in low versatility and compatibility of the test equipment. When the type of chip under test needs to be changed or the function under test needs to be changed, the underlying firmware of the MCU control chip needs to be repackaged. This complicates the testing process and requires professional programmers to complete it.

為了解決上述問題，本方案將晶片測試轉移到測試應用程式來實現，根據晶片專用性和封閉性的特點，通過軟體的參數配置、硬體模組的橋接搭配和操作系統的中控調度，將晶片測試轉移到應用軟體來執行，使得晶片測試方案靈活多變，並具備大規模量產測試的能力。通過CPU主控模組配合MCU控制模組，實現對晶片功能的測試，具體的，CPU主控模組中預存有多個測試應用程式，使用者可以通過設置設定檔來確定啟用哪個待測晶片的哪個待測功能的測試應用程式，啟動測試應用程式後，就可以根據測試應用程式對待測晶片執行測試項，由MCU控制模組實現訊號的轉換和控制，然後根據對待測晶片執行測試項時晶片反饋的響應數據得到待測晶片的待測功能的測試結果。In order to solve the above problems, this solution transfers the chip test to the test application. According to the specificity and closedness of the chip, through the parameter configuration of the software, the bridging of the hardware module and the central control scheduling of the operating system, Chip testing is transferred to application software for execution, making the chip testing solution flexible and capable of large-scale mass production testing. The CPU main control module cooperates with the MCU control module to test the chip function. Specifically, the CPU main control module has multiple test applications pre-stored. The user can determine which chip to be tested is enabled by setting the configuration file. Which test application of the function to be tested, after starting the test application, you can execute the test items on the chip under test according to the test application, the MCU control module realizes the conversion and control of the signal, and then execute the test items according to the chip under test The response data fed back by the chip obtains the test results of the function to be tested of the chip under test.

需要說明的是，這裡的預存的多個測試應用程式可以是不同廠家生產的待測晶片的不同待測功能的測試應用程式，根據使用者的設定檔進行具體的選擇，實現了對多家廠家生產的晶片的測試通用性和兼容性。It should be noted that the multiple pre-stored test applications here can be test applications with different functions to be tested for the chips under test produced by different manufacturers. Specific selections are made based on the user's profile, thus realizing the testing of multiple manufacturers. Testing of produced wafers for versatility and compatibility.

還需要說明的是，這裡的晶片反饋的響應數據可以是能直觀得到測試結果的響應數據，例如晶片是否能對觸發訊號作出響應，也可以是需要經過數據處理後得到測試結果的響應數據，例如獲取每隔預設時間晶片的電壓電流值，通過計算預設時間內的晶片的平均電壓電流值，然後進行臨界值判斷後來得到測試結果，具體的響應數據是根據具體的測試項決定，本發明在此不做特別的限定。It should also be noted that the response data fed back by the chip here can be response data that can intuitively obtain test results, such as whether the chip can respond to a trigger signal, or it can be response data that requires data processing to obtain test results, such as Obtain the voltage and current value of the chip every preset time, calculate the average voltage and current value of the chip within the preset time, and then perform critical value judgment to obtain the test result. The specific response data is determined according to the specific test item. The present invention There are no special restrictions here.

綜上，本發明提供了一種晶片測試裝置，包括CPU主控模組1、MCU控制模組2和通訊接口模組3，CPU主控模組1預設有多個測試應用程式，通過啟動不同的測試應用程式，配合MCU控制模組2和通訊接口模組3來完成對不同待測晶片的不同待測功能的檢測，只需要根據待測晶片的生產廠家及待測功能更改設置的設定檔即可實現對不同廠家的不同待測晶片的不同待測功能的測試，提高了晶片測試設備的通用性和兼容性，提高了測試效率，且更改設置設定檔的過程簡單快捷，不需要專業的編程人員操作。In summary, the present invention provides a chip testing device, which includes a CPU main control module 1, an MCU control module 2 and a communication interface module 3. The CPU main control module 1 is preset with multiple test applications. By starting different The test application cooperates with the MCU control module 2 and the communication interface module 3 to complete the detection of different functions under test of different chips under test. You only need to change the settings file according to the manufacturer of the chip under test and the function under test. It can realize the testing of different functions to be tested on different chips under test from different manufacturers, which improves the versatility and compatibility of chip testing equipment, improves the testing efficiency, and the process of changing the setting profile is simple and fast, and does not require professional expertise. Programmer operation.

在上述實施例的基礎上：Based on the above embodiments:

作為一種優選的實施例，測試應用程式用於針對待測晶片的觸控功能和/或顯示功能和/或觸控顯示功能進行測試。As a preferred embodiment, the test application is used to test the touch function and/or the display function and/or the touch display function of the chip under test.

本實施例中，通過啟動不同的測試應用程式，就可以完成對待測晶片的觸控功能、顯示功能或觸控顯示功能的檢測，增加了晶片測試設備的通用性與兼容性。In this embodiment, by launching different test applications, the touch function, display function or touch display function of the chip under test can be detected, which increases the versatility and compatibility of the chip testing equipment.

需要注意的是，這裡的觸控顯示功能針對的是現在市面上的顯示屏晶片，該晶片可以同時實現觸控功能與顯示功能，因此對該晶片的測試應該同時包括觸控功能測試和顯示功能測試。It should be noted that the touch display function here is aimed at the display chip currently on the market. This chip can realize both touch function and display function at the same time. Therefore, the test of the chip should include both touch function test and display function. test.

作為一種優選的實施例，MCU控制模組2包括電源管理單元、顯示圖像處理單元、電壓電流測量單元及IO控制和測量單元中的任意一種或多種。As a preferred embodiment, the MCU control module 2 includes any one or more of a power management unit, a display image processing unit, a voltage and current measurement unit, and an IO control and measurement unit.

本實施例中，MCU控制模組2由電源管理單元、顯示圖像處理單元、電壓電流測量單元及IO控制和測量單元中的任意一種或多種構成，用於與CPU主控模組1配合以完成對待測晶片的不同待測功能的測試，例如這裡的電源管理單元是用於對晶片測試設備自身的供電和對待測晶片模組的供電，顯示圖像處理單元用於檢測待測晶片的圖像顯示功能，電壓電流測量單元用於檢測待測晶片的供電功能，IO控制和測量單元用於檢測待測晶片的觸控顯示功能，增加了晶片測試設備的通用性。In this embodiment, the MCU control module 2 is composed of any one or more of a power management unit, a display image processing unit, a voltage and current measurement unit, and an IO control and measurement unit, and is used to cooperate with the CPU main control module 1 to Complete the testing of different functions of the chip under test. For example, the power management unit here is used to power the chip test equipment itself and the chip module under test. The image processing unit is used to detect the chip under test. Like the display function, the voltage and current measurement unit is used to detect the power supply function of the chip under test, and the IO control and measurement unit is used to detect the touch display function of the chip under test, increasing the versatility of the chip testing equipment.

作為一種優選的實施例，CPU主控模組1預設有多個測試應用程式，任意一個測試應用程式用於針對其對應型號的所述待測晶片的觸控功能和/或顯示功能進行檢測。As a preferred embodiment, the CPU main control module 1 is preset with multiple test applications, and any one of the test applications is used to detect the touch function and/or display function of the chip under test of its corresponding model. .

本實施例中，這裡的預存的多個測試應用程式可以是不同廠家生產的待測晶片的不同待測功能的測試應用程式，根據使用者的設定檔進行具體的選擇，實現了對多家廠家生產的晶片的測試通用性和兼容性。In this embodiment, the plurality of pre-stored test applications here can be test applications with different functions to be tested for chips under test produced by different manufacturers. Specific selections are made according to the user's profile, thus realizing the testing of multiple manufacturers. Testing of produced wafers for versatility and compatibility.

作為一種優選的實施例，通訊接口模組3包括協議轉換模組和接口模組；協議轉換模組用於在接收到測試數據時按照接口輸出標準將測試數據發送至接口模組，接口模組將測試數據發送至待測晶片，並將接收到的待測晶片的響應數據通過協議轉換模組進行相應的格式轉換後發送至MCU控制模組2。As a preferred embodiment, the communication interface module 3 includes a protocol conversion module and an interface module; the protocol conversion module is used to send the test data to the interface module according to the interface output standard when receiving the test data, and the interface module The test data is sent to the chip under test, and the received response data of the chip under test is converted into the corresponding format through the protocol conversion module and then sent to the MCU control module 2.

本實施例中，考慮到在實際測試過程中，MCU控制模組2與待測晶片之間可能存在數據協議的差異，因此本方案的通訊接口模組3包括了協議轉換模組和接口模組，協議轉換模組在接收到測試數據後，會將該數據按照對應接口的傳輸速率輸出標準輸出至對應接口，並將晶片反饋的響應數據也進行相應的數據格式轉換後發送至MCU控制模組2，以完成對晶片的讀寫操作，增加了方案的可行性。In this embodiment, considering that during the actual test process, there may be data protocol differences between the MCU control module 2 and the chip under test, the communication interface module 3 of this solution includes a protocol conversion module and an interface module , after receiving the test data, the protocol conversion module will output the data to the corresponding interface according to the transmission rate output standard of the corresponding interface, and also convert the response data fed back by the chip into the corresponding data format and send it to the MCU control module 2. To complete the reading and writing operations on the chip, increasing the feasibility of the solution.

需要注意的是，MCU控制模組2主要通過儲存接口或者數據接口接收測試數據，並將測試數據存在內部儲存器，MCU控制模組2會將測試數據轉換成並列數據傳輸給協議轉換模組。It should be noted that the MCU control module 2 mainly receives test data through the storage interface or data interface and stores the test data in the internal memory. The MCU control module 2 will convert the test data into parallel data and transmit it to the protocol conversion module.

MCU控制模組2主要有MCU主控模組、數據接收接口、供電控制模組、內部儲存器、數據發送模組組成，其中主控模組可以為常規的MCU晶片，數據接收接口可以為USB、SD、乙太網、WIFI等，內部儲存器可以為flash/Nandflash等儲存晶片，供電控制模組由電源產生模組和電源開關控制模組組成，數據發送模組由自定義的數據接口組成。The MCU control module 2 mainly consists of an MCU main control module, a data receiving interface, a power supply control module, an internal memory, and a data sending module. The main control module can be a conventional MCU chip, and the data receiving interface can be a USB , SD, Ethernet, WIFI, etc. The internal memory can store chips such as flash/Nandflash. The power supply control module consists of a power generation module and a power switch control module. The data sending module consists of a customized data interface. .

MCU控制模組2內還包括了數據處理模組，數據處理模組主要有數據處理單元、時鐘模組、數據接收模組、數據緩存模組、電源模組和數據發送模組。數據處理單元可為可編程邏輯單元，處理數據的格式轉化和數據傳輸數據轉化；時鐘模組可為有源時鐘模組和無源時鐘模組；數據接收模組為自定義的並列數據接口；數據發送模組為自定義的並列數據接口；數據緩存模組可為常用的數據緩存器，如DDR等；電源模組為積體電源管理電路。The MCU control module 2 also includes a data processing module. The data processing module mainly includes a data processing unit, a clock module, a data receiving module, a data cache module, a power module and a data sending module. The data processing unit can be a programmable logic unit, processing data format conversion and data transmission data conversion; the clock module can be an active clock module or a passive clock module; the data receiving module is a customized parallel data interface; The data sending module is a custom parallel data interface; the data cache module can be a commonly used data buffer, such as DDR, etc.; the power module is an integrated power management circuit.

作為一種優選的實施例，接口模組包括晶片通訊接口及顯示接口的任意一種或多種。As a preferred embodiment, the interface module includes any one or more of a chip communication interface and a display interface.

本實施例中，考慮到我們這裡的待測晶片包括觸控晶片、顯示晶片及觸控顯示晶片，因此本方案中的接口模組包括了晶片通訊接口以用於正常的待測晶片的數據讀寫操作，也包括顯示接口來完成對待測晶片的顯示功能的測試過程中的數據讀寫的操作。In this embodiment, considering that the chip under test here includes a touch chip, a display chip and a touch display chip, the interface module in this solution includes a chip communication interface for normal data reading of the chip under test. The write operation also includes the display interface to complete the data reading and writing operations during the test process of the display function of the chip under test.

作為一種優選的實施例，晶片通訊接口包括I2C接口和/或SPI接口和/或其他IO接口；顯示接口包括MIPI DPHY接口、MIPI CPHY接口、LVDS接口、EDP接口及RGB接口的任意一種或多種。As a preferred embodiment, the chip communication interface includes I2C interface and/or SPI interface and/or other IO interface; the display interface includes any one or more of MIPI DPHY interface, MIPI CPHY interface, LVDS interface, EDP interface and RGB interface.

本實施例中，考慮到現有的不同的待測晶片支持的通訊接口可能會有所差異，因此本方案中的晶片通訊接口包括了I2C接口和/或SPI接口和/或其他IO接口，提高了晶片測試設備的兼容性。In this embodiment, considering that the communication interfaces supported by different existing chips under test may be different, the chip communication interface in this solution includes an I2C interface and/or an SPI interface and/or other IO interfaces, which improves the Wafer test equipment compatibility.

同時考慮到現有的顯示設備或者顯示模組存在多種不同的顯示接口，為了適配多種顯示設備及顯示模組的顯示測試，本方案的顯示接口包括MIPI DPHY接口和/或MIPI CPHY接口和/或LVDS接口和/或EDP接口和/或RGB接口中的至少兩種，從而可以靈活配置多種顯示接口，實現一台設備測試不同顯示接口的晶片模組。At the same time, considering that there are many different display interfaces in existing display devices or display modules, in order to adapt to the display testing of multiple display devices and display modules, the display interface of this solution includes MIPI DPHY interface and/or MIPI CPHY interface and/or At least two of the LVDS interface and/or EDP interface and/or RGB interface, so that multiple display interfaces can be flexibly configured to enable one device to test chip modules with different display interfaces.

本發明還提供了一種晶片測試方法，請參照圖2，圖2為本發明提供的一種晶片測試方法的流程圖，應用於晶片測試設備，包括：The present invention also provides a wafer testing method. Please refer to Figure 2. Figure 2 is a flow chart of a wafer testing method provided by the present invention, which is applied to wafer testing equipment and includes:

S11：根據預設的設定檔確定待測晶片的測試應用程式，不同的設定檔對應的測試應用程式不同；S11: Determine the test application for the chip under test based on the default configuration file. Different configuration files correspond to different test applications;

S12：啟動測試應用程式以對待測晶片執行對應的測試項；S12: Start the test application to execute the corresponding test items on the chip under test;

S13：獲取待測晶片的響應數據；S13: Obtain the response data of the chip under test;

S14：根據響應數據得到待測晶片的待測功能的最終測試結果。S14: Obtain the final test result of the function under test of the chip under test based on the response data.

對於本發明提供的一種晶片測試方法的介紹請參照上述晶片測試裝置實施例，本發明在此不再贅述。For an introduction to the wafer testing method provided by the present invention, please refer to the above embodiment of the wafer testing device, and the present invention will not be described in detail here.

在上述實施例的基礎上：Based on the above embodiments:

作為一種優選的實施例，請參照圖3，圖3為本發明提供的一種測試應用程式執行測試項並獲取晶片響應數據的流程圖，包括：As a preferred embodiment, please refer to Figure 3. Figure 3 is a flow chart of a test application provided by the present invention to execute test items and obtain chip response data, including:

S1：啟動測試應用程式，根據測試應用程式對應的測試項判斷是否需要讀寫待測晶片，若是，進入S2；S1: Start the test application, and determine whether it is necessary to read and write the chip under test based on the test items corresponding to the test application. If so, enter S2;

S2：調用函式庫檔案中與測試應用程式對應的待測功能接口函數；S2: Call the function interface function under test corresponding to the test application in the function library file;

S3：根據待測功能接口函數訪問對應的操作系統的設備節點；S3: Access the device node of the corresponding operating system according to the functional interface function to be tested;

S4：判斷是否直接讀寫待檢測晶片，若是，進入S5，若否，進入S6；S4: Determine whether to directly read and write the chip to be tested. If so, go to S5; if not, go to S6;

S5：通過設備節點調用操作系統驅動程式的接口讀寫函數，並通過通訊接口模組3對待測晶片進行讀寫，再通過通訊接口模組3接收待測晶片返回至接口讀寫函數的響應數據，進入S8；S5: Call the interface read-write function of the operating system driver through the device node, read and write the chip under test through the communication interface module 3, and then receive the response data from the chip under test returned to the interface read-write function through the communication interface module 3 , enter S8;

S6：判斷是否通過MCU控制模組2讀寫待測晶片，若是，則進入S7；S6: Determine whether to read and write the chip under test through MCU control module 2, if so, enter S7;

S7：通過設備節點調用MCU控制模組2讀寫函數以使MCU控制模組2的韌體程式執行相應命令，並通過通訊接口模組3實現對待測晶片的讀寫，再通過通訊接口模組3接收待測晶片返回至MCU控制模組2讀寫函數的響應數據，進入S8；S7: Call the read and write functions of the MCU control module 2 through the device node to make the firmware program of the MCU control module 2 execute the corresponding commands, and realize the reading and writing of the chip under test through the communication interface module 3, and then through the communication interface module 3 3. Receive the response data from the chip under test returned to the read and write function of MCU control module 2, and enter S8;

S8：讀寫函數獲取的響應數據依次反饋給設備節點、函式庫檔案及應用程式，完成待測晶片數據的讀寫。S8: The response data obtained by the read and write functions are fed back to the device nodes, function library files and applications in turn to complete the reading and writing of the chip data under test.

其中，測試應用程式負責加載待測晶片的測試配置和控制測試流程，同時也會對待測晶片返回的響應數據進行判斷，得到測試結果；CPU主控單元負責測試應用程式和MCU控制模組2之間的命令傳輸和數據傳輸；MCU控制模組2負責接收並執行測試應用程式下傳的命令，同時通過控制通訊接口模組3向待測晶片傳輸和接收數據；通訊接口模組3負責對MCU控制模組2發送的數據進行接口協議轉換，並把轉換後的數據發送至待測晶片。Among them, the test application is responsible for loading the test configuration of the chip under test and controlling the test process. It will also judge the response data returned by the chip under test to obtain the test results; the CPU main control unit is responsible for testing the application and the MCU control module 2. command transmission and data transmission between; the MCU control module 2 is responsible for receiving and executing the commands transmitted by the test application, and at the same time transmitting and receiving data to the chip under test by controlling the communication interface module 3; the communication interface module 3 is responsible for controlling the MCU The data sent by the control module 2 is converted into the interface protocol, and the converted data is sent to the chip under test.

為了實現將晶片測試轉移到應用程式來執行，本發明提供的晶片測試設備是由CPU主控模組1、MCU控制模組2及通訊接口模組3組成，其中CPU主控模組1中預存了多個測試應用程式，當測試應用程式啟動後，會根據測試項判斷是否需要對待測晶片進行數據讀寫，當需要對待測晶片進行數據讀寫時，會先調用函式庫檔案中與測試應用程式對應的待測功能接口函數，並根據該待測功能接口函數訪問對應的操作系統的設備節點，然後根據測試項中是否直接對待測晶片進行讀寫，當是直接對待測晶片進行讀寫時，會通過操作系統的設備節點訪問CPU主控模組1中的操作系統的驅動程式的接口讀寫函數並通過通訊接口模組3對待測晶片進行數據讀寫，然後將得到的響應數據返回至操作系統的驅動程式的接口讀寫函數；當不是直接對待測晶片進行讀寫時，即通過MCU控制模組2對待測晶片進行讀寫，此時會通過操作系統的設備節點訪問操作系統的驅動程式的MCU控制模組2讀寫函數，調用此函數以使MCU控制模組2的韌體程式執行相應的測試命令，通過通訊接口模組3實現對所述待測晶片的讀寫，並將得到的響應數據返回至MCU控制模組2讀寫函數，最後即可將得到的響應數據最終返回至測試應用程式以便後續的數據處理或者測試結果的判斷。In order to transfer the chip test to the application program for execution, the chip test equipment provided by the present invention is composed of a CPU main control module 1, an MCU control module 2 and a communication interface module 3, in which the CPU main control module 1 pre-stores Multiple test applications are installed. When the test application is started, it will determine whether it is necessary to read and write data to the chip under test based on the test items. When it is necessary to read and write data to the chip under test, it will first call the function library file and test The application program corresponds to the function interface function under test, and accesses the device node of the corresponding operating system according to the function interface function under test, and then reads and writes directly to the chip under test according to whether the test item is directly read and written to the chip under test. When the device node of the operating system is used, the interface read and write functions of the driver of the operating system in the CPU main control module 1 are accessed, and the data of the chip under test is read and written through the communication interface module 3, and then the response data is returned. Interface read and write functions to the driver of the operating system; when the chip under test is not read and written directly, the chip under test is read and written through the MCU control module 2, and the operating system is accessed through the device node of the operating system. The MCU control module 2 read and write function of the driver program calls this function to make the firmware program of the MCU control module 2 execute the corresponding test command, and realizes reading and writing of the chip under test through the communication interface module 3, and Return the obtained response data to the MCU control module 2 read-write function, and finally return the obtained response data to the test application for subsequent data processing or judgment of test results.

請參照圖4，圖4為本發明提供的一種通過MCU控制模組2間接讀寫晶片方法的流程圖。Please refer to FIG. 4 , which is a flow chart of a method for indirectly reading and writing a chip through the MCU control module 2 provided by the present invention.

此外，這裡的MCU控制模組2包括電源管理模組、顯示圖像處理模組、電壓電流測量模組和IO控制和測量模組，這些模組與測試應用程式配合以實現對晶片的多種功能的測試，其中，電源管理模組負責MCU控制模組2自身的供電及對待測晶片的供電；顯示圖像處理模組用於待測晶片的圖像顯示功能的測試；電壓電流模組用於待測晶片的供電功能的測試以及在某些測試項中對晶片的電壓電流進行測量；IO控制和測量模組用於待測晶片的觸控顯示功能的測試。In addition, the MCU control module 2 here includes a power management module, a display image processing module, a voltage and current measurement module, and an IO control and measurement module. These modules cooperate with the test application to implement various functions of the chip. The test, in which the power management module is responsible for the power supply of the MCU control module 2 itself and the power supply of the chip under test; the display image processing module is used for testing the image display function of the chip under test; the voltage and current module is used for Test the power supply function of the chip under test and measure the voltage and current of the chip in certain test items; the IO control and measurement module is used to test the touch display function of the chip under test.

需要注意的是，這裡函式庫檔案中與測試應用程式對應的待測功能接口函數是指將待測晶片的數據讀寫通訊接口的讀寫例如I2C或SPI接口的讀寫封裝成函式庫檔案，從而使得函式庫檔案具有通用性，函式庫檔案通過設備節點，即可以與操作系統的驅動程式交互數據，以完成對待測晶片的讀寫。It should be noted that the function interface function under test corresponding to the test application in the function library file here refers to encapsulating the reading and writing of the data reading and writing communication interface of the chip under test, such as the reading and writing of the I2C or SPI interface, into a function library File, thus making the library file universal. The library file can interact with the driver of the operating system through the device node to complete the reading and writing of the chip under test.

還需要注意的是，本發明是以通過MCU控制模組2間接讀寫待測晶片為例，在實際使用過程中，也可以通過其他開發板間接讀寫晶片，本發明在此不作特別的限定。It should also be noted that the present invention takes the indirect reading and writing of the chip under test through the MCU control module 2 as an example. In actual use, the chip can also be indirectly read and written through other development boards. The present invention is not specifically limited here. .

作為一種優選的實施例，當測試應用程式為觸控與顯示功能併行測試應用程式時，啟動測試應用程式以對待測晶片執行待測功能的測試項，包括：As a preferred embodiment, when the test application is a parallel test application for touch and display functions, the test application is started to perform the test items of the function under test on the chip under test, including:

啟動測試應用程式，根據測試應用程式同時啟動第一執行緒對待測晶片執行觸控功能測試項和啟動第二執行緒對待測晶片執行顯示功能測試項；Start the test application, and simultaneously start the first execution thread to perform the touch function test item of the chip under test and the second execution thread to perform the display function test item of the chip under test according to the test application program;

獲取對待測晶片執行測試項時待測晶片反饋的響應數據，包括：Obtain the response data fed back by the chip under test when executing test items on the chip under test, including:

獲取第一執行緒對待測晶片執行觸控功能測試項時得到的觸控測試響應數據；Obtain the touch test response data obtained when the first execution thread performs the touch function test item on the chip under test;

獲取第二執行緒對待測晶片執行顯示功能測試項時得到的顯示測試響應數據。Obtain the display test response data obtained when the second execution thread executes the display function test item on the chip under test.

請參照圖5，圖5為發明提供的一種觸控顯示功能併行測試方法的流程圖。Please refer to FIG. 5 , which is a flow chart of a parallel testing method for touch display functions provided by the invention.

本實施例中，考慮到現有技術將觸控和顯示功能積體到同一晶片（即TDDI晶片）中的做法已成為主流，即觸控顯示模組採用一顆晶片就可以實現觸控和顯示的功能，這樣對這種晶片進行功能測試時，現有技術通常是先後進行待測晶片的觸控功能和顯示功能，例如先進行觸控功能測試，然後將待測晶片轉移到顯示功能測試工位再進行顯示功能測試，這樣就需要兩個測試工位來分別測試觸控功能和顯示功能，而且還需要配置更多的測試人員，增長了測試時間，使得測試效率偏低。In this embodiment, considering that the existing technology integrates touch and display functions into the same chip (i.e., TDDI chip), it has become mainstream, that is, the touch display module can achieve touch and display using one chip. Function, when performing functional testing on such a chip, the existing technology usually performs the touch function and display function of the chip to be tested successively. For example, the touch function is tested first, and then the chip to be tested is transferred to the display function testing station. To test the display function, two test stations are needed to test the touch function and display function respectively, and more testers are required, which increases the test time and makes the test efficiency low.

因此本方案中，採用多執行緒技術，當通過設置設定檔確定的測試應用程式為觸控與顯示功能併行測試應用程式時，啟用該併行測試應用程式，就可以同時測試觸控和顯示功能，具體的，開啟第一執行緒來進行待測晶片的觸控功能的測試的同時開啟第二執行緒來進行待測晶片的顯示功能的測試，分別獲取兩項測試的待測晶片的響應數據後根據對應的響應數據判斷對應的待測功能測試結果，這樣不僅節省了測試時間，同時也節省了測試工位及測試人員配置，增加了測試的效率。Therefore, in this solution, multi-threading technology is used. When the test application determined by setting the configuration file is a parallel test application for touch and display functions, by enabling the parallel test application, the touch and display functions can be tested at the same time. Specifically, the first execution thread is opened to test the touch function of the chip under test, and the second execution thread is opened to test the display function of the chip under test, and the response data of the chip under test for the two tests are obtained respectively. The corresponding test results of the function to be tested are judged based on the corresponding response data, which not only saves testing time, but also saves test stations and test personnel configuration, and increases the efficiency of testing.

還需要說明的是，在本說明書中，諸如第一和第二等之類的關係術語僅僅用來將一個實體或者操作與另一個實體或操作區分開來，而不一定要求或者暗示這些實體或操作之間存在任何這種實際的關係或者順序。而且，術語「包括」、「包含」或者其任何其他變體意在涵蓋非排他性的包含，從而使得包括一系列要素的過程、方法、物品或者設備不僅包括那些要素，而且還包括沒有明確列出的其他要素，或者是還包括為這種過程、方法、物品或者設備所固有的要素。在沒有更多限制的情況下，由語句「包括一個…」限定的要素，並不排除在包括要素的過程、方法、物品或者設備中還存在另外的相同要素。It should also be noted that in this specification, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations There is no such actual relationship or sequence between operations. Furthermore, the terms "comprises," "comprises" or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element qualified by the statement "comprises a..." does not exclude the presence of additional identical elements in the process, method, article, or device that includes the element.

對所公開的實施例的上述說明，使所屬技術領域具通常知識者能夠實現或使用本發明。對這些實施例的多種修改對所屬技術領域具通常知識者來說將是顯而易見的，本文中所定義的一般原理可以在不脫離本發明的精神或範圍的情況下，在其他實施例中實現。因此，本發明將不會被限制於本文所示的這些實施例，而是要符合與本文所公開的原理和新穎特點相一致的最寬的範圍。The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

1:CPU主控模組 2:MCU控制模組 3:通訊接口模組 S1~S8:步驟 S11~S14:步驟 1:CPU main control module 2:MCU control module 3: Communication interface module S1~S8: steps S11~S14: Steps

為了更清楚地說明本發明實施例中的技術方案，下面將對現有技術和實施例中所需要使用的圖式作簡單地介紹，顯而易見地，下面描述中的圖式僅僅是本發明的一些實施例，對於所屬技術領域具通常知識者而言，在不付出創造性勞動的前提下，還可以根據這些圖式獲得其他的圖式。 [圖1] 為本發明提供的一種晶片測試設備的結構示意圖。 [圖2]為本發明提供的一種晶片測試方法的流程圖。 [圖3]為本發明提供的一種測試應用程式執行測試項並獲取晶片響應數據的流程圖。 [圖4]為本發明提供的一種通過MCU控制模組間接讀寫晶片方法的流程圖。 [圖5]為本發明提供的一種觸控顯示功能併行測試方法的流程圖。 In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the prior art and the drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some implementations of the present invention. For example, for those with general knowledge in the technical field, other schemas can be obtained based on these schemas without exerting creative work. [Figure 1] is a schematic structural diagram of a wafer testing equipment provided by the present invention. [Fig. 2] is a flow chart of a wafer testing method provided by the present invention. [Fig. 3] is a flow chart for a test application program provided by the present invention to execute test items and obtain chip response data. [Figure 4] is a flow chart of a method of indirectly reading and writing a chip through an MCU control module provided by the present invention. [Fig. 5] is a flow chart of a parallel testing method for touch display functions provided by the present invention.

1:CPU主控模組 1:CPU main control module

2:MCU控制模組 2:MCU control module

3:通訊接口模組 3: Communication interface module

Claims (14)

一種晶片測試設備，包括一CPU主控模組、一MCU控制模組和一通訊接口模組，該CPU主控模組與該MCU控制模組連接，該MCU控制模組還與該通訊接口模組連接； 該CPU主控模組預設有一待測晶片的一測試應用程式，該CPU主控模組通過該測試應用程式進行測試流程的控制； 在運行該測試應用程式時，該MCU控制模組負責執行CPU主控模組下傳的一命令，並基於該命令向該通訊接口模組發送數據，該通訊接口模組針對由該MCU控制模組發送的數據進行轉換，並完成與該待測晶片的數據通訊；以及 該通訊接口模組針對向該MCU控制模組反饋的待測晶片的數據進行轉換，該MCU控制模組接受並處理該數據，並將處理後數據或者判斷結果反饋至該CPU主控模組，該CPU主控模組根據該處理後數據或者該MCU控制模組判斷結果提供該待測晶片的最終功能測試結果。 A chip testing equipment includes a CPU main control module, an MCU control module and a communication interface module. The CPU main control module is connected to the MCU control module, and the MCU control module is also connected to the communication interface module. group connection; The CPU main control module is preset with a test application program for a chip under test, and the CPU main control module controls the test process through the test application program; When running the test application, the MCU control module is responsible for executing a command transmitted by the CPU main control module and sending data to the communication interface module based on the command. The communication interface module is for the module controlled by the MCU. Convert the data sent by the group and complete data communication with the chip under test; and The communication interface module converts the data of the chip under test fed back to the MCU control module. The MCU control module accepts and processes the data, and feeds the processed data or judgment results back to the CPU main control module. The CPU main control module provides the final functional test result of the chip under test based on the processed data or the judgment result of the MCU control module. 如請求項1所述的晶片測試設備，其中該測試應用程式用於針對該待測晶片的觸控功能和顯示功能中的至少一種進行測試。The chip testing equipment of claim 1, wherein the testing application is used to test at least one of the touch function and the display function of the chip under test. 如請求項1所述的晶片測試設備，其中該MCU控制模組包括一電源管理單元、一顯示圖像處理單元、一電壓電流測量單元及一IO控制和測量單元中的任意一種或多種。The chip testing equipment of claim 1, wherein the MCU control module includes any one or more of a power management unit, a display image processing unit, a voltage and current measurement unit, and an IO control and measurement unit. 如請求項1所述的晶片測試設備，其中該CPU主控模組預設有多個測試應用程式，該等測試應用程式中任意一個測試應用程式用於針對其對應型號的該待測晶片的觸控功能和顯示功能中的至少一種進行檢測。The chip testing equipment as described in claim 1, wherein the CPU main control module is preset with a plurality of test applications, and any one of the test applications is used to test the chip under test for its corresponding model. At least one of the touch function and the display function is detected. 如請求項1所述的晶片測試設備，其中該通訊接口模組包括一協議轉換模組和一接口模組；該協議轉換模組用於在接收到一測試數據時按照接口輸出標準將該測試數據發送至該接口模組，該接口模組將該測試數據發送至該待測晶片，並將接收到的該待測晶片的響應數據通過該協議轉換模組進行相應的格式轉換後發送至該MCU控制模組。The chip testing equipment of claim 1, wherein the communication interface module includes a protocol conversion module and an interface module; the protocol conversion module is used to convert the test data according to the interface output standard when receiving a test data. The data is sent to the interface module, the interface module sends the test data to the chip under test, and the received response data of the chip under test is converted into the corresponding format through the protocol conversion module and then sent to the chip. MCU control module. 如請求項5所述的晶片測試設備，其中該接口模組包括一晶片通訊接口及一顯示接口。The chip testing equipment of claim 5, wherein the interface module includes a chip communication interface and a display interface. 如請求項6所述的晶片測試設備，其中該晶片通訊接口包括一I2C接口、一SPI接口和其他IO接口中的至少一種；該顯示接口包括一MIPI DPHY接口、一MIPI CPHY接口、一LVDS接口、一EDP接口及一RGB接口的任意一種或多種。The chip testing equipment as described in claim 6, wherein the chip communication interface includes at least one of an I2C interface, an SPI interface and other IO interfaces; the display interface includes a MIPI DPHY interface, a MIPI CPHY interface, and an LVDS interface , any one or more of an EDP interface and an RGB interface. 如請求項1所述的晶片測試設備，其中該MCU控制模組包括一MCU主控模組、一數據接收接口、一供電控制模組、一內部儲存器、一數據發送模組。The chip testing equipment of claim 1, wherein the MCU control module includes an MCU main control module, a data receiving interface, a power supply control module, an internal memory, and a data sending module. 如請求項8所述的晶片測試設備，其中該MCU主控模組為一MCU晶片，該數據接收接口為一USB接口、一SD接口、一乙太網接口或一WIFI接口，該內部儲存器為一flash或一Nandflash儲存晶片，該供電控制模組包括一電源產生模組或一電源開關控制模組，該數據發送模組包括一數據接口。The chip testing equipment as described in claim 8, wherein the MCU main control module is an MCU chip, the data receiving interface is a USB interface, an SD interface, an Ethernet interface or a WIFI interface, and the internal memory For a flash or a Nandflash storage chip, the power supply control module includes a power generation module or a power switch control module, and the data sending module includes a data interface. 如請求項8所述的晶片測試設備，其中該MCU控制模組還包括一數據處理模組，該數據處理模組包含一數據處理單元、一時鐘模組、一數據接收模組、一數據緩存模組、一電源模組和一數據發送模組。The chip testing equipment of claim 8, wherein the MCU control module further includes a data processing module, which includes a data processing unit, a clock module, a data receiving module, and a data buffer. module, a power module and a data sending module. 如請求項10所述的晶片測試設備，其中該數據處理單元為一可編程邏輯單元，用於處理數據的格式轉化和數據傳輸數據轉化； 該時鐘模組為一有源時鐘模組或一無源時鐘模組； 該數據接收模組為自定義的數據接口； 該數據發送模組為自定義的數據接口； 該數據緩存模組為一數據緩存器；以及 該電源模組為一積體電源管理電路。 The wafer testing equipment according to claim 10, wherein the data processing unit is a programmable logic unit, used to process data format conversion and data transmission data conversion; The clock module is an active clock module or a passive clock module; The data receiving module is a customized data interface; The data sending module is a customized data interface; The data cache module is a data register; and The power module is an integrated power management circuit. 一種晶片測試方法，應用於一晶片測試設備，該晶片測試方法包括： 根據預設的設定檔確定一待測晶片的一測試應用程式，不同的設定檔對應的測試應用程式不同； 啟動該測試應用程式以對該待測晶片執行對應的一測試項； 獲取該待測晶片的一響應數據； 根據該響應數據得到該待測晶片的待測功能的最終測試結果；以及 該測試應用程式包括該待測晶片的一觸控功能測試應用程式、一顯示功能測試應用程式、一觸控與顯示功能併行測試應用程式及一觸控與顯示功能串行測試應用程式中的至少一種。 A wafer testing method, applied to a wafer testing equipment, the wafer testing method includes: Determine a test application for a chip under test based on a default profile. Different profiles correspond to different test applications; Launch the test application to execute a corresponding test item on the chip under test; Obtain a response data of the chip under test; Obtain the final test result of the function under test of the chip under test based on the response data; and The test application includes at least one of a touch function test application, a display function test application, a touch and display function parallel test application and a touch and display function serial test application of the chip under test. One kind. 如請求項12所述的晶片測試方法，其中該晶片測試設備包括一CPU主控模組、一MCU控制模組和一通訊接口模組，該MCU控制模組與該CPU主控模組連接，該MCU控制模組還與該通訊接口模組連接；以及 啟動該測試應用程式以對該待測晶片執行該測試項，獲取對該待測晶片的該響應數據，包括： S1：啟動該測試應用程式，根據該測試應用程式對應的測試項判斷是否需要讀寫該待測晶片，若是，進入S2； S2：調用函式庫檔案中與該測試應用程式對應的待測功能的接口函數； S3：根據該待測功能的接口函數訪問對應的一操作系統的一設備節點； S4：判斷是否直接讀寫該待測晶片，若是，進入S5，若否，進入S6； S5：通過該設備節點調用該操作系統驅動程式的接口讀寫函數，並通過該通訊接口模組對該待測晶片進行讀寫，再通過該通訊接口模組接收該待測晶片返回至該接口讀寫函數的響應數據，進入S8； S6：判斷是否通過該MCU控制模組讀寫該待測晶片，若是，則進入S7； S7：通過該設備節點調用一MCU控制模組讀寫函數以使該MCU控制模組的韌體程式執行相應命令，並通過該通訊接口模組實現對該待測晶片的讀寫，再通過該通訊接口模組接收該待測晶片返回至該MCU控制模組讀寫函數的響應數據，進入S8；以及 S8：該讀寫函數獲取的響應數據依次反饋給該設備節點、函式庫檔案及應用程式，完成該待測晶片數據的讀寫。 The chip testing method as described in claim 12, wherein the chip testing equipment includes a CPU main control module, an MCU control module and a communication interface module, and the MCU control module is connected to the CPU main control module, The MCU control module is also connected to the communication interface module; and Start the test application to execute the test item on the chip under test and obtain the response data for the chip under test, including: S1: Start the test application, and determine whether it is necessary to read and write the chip under test based on the test items corresponding to the test application. If so, enter S2; S2: Call the interface function of the function under test corresponding to the test application in the function library file; S3: Access a device node of a corresponding operating system according to the interface function of the function to be tested; S4: Determine whether to directly read and write the chip under test. If so, go to S5; if not, go to S6; S5: Call the interface read and write function of the operating system driver through the device node, read and write the chip under test through the communication interface module, and then receive the chip under test through the communication interface module and return to the interface Read and write the response data of the function and enter S8; S6: Determine whether the chip under test is read and written through the MCU control module. If so, enter S7; S7: Call an MCU control module read and write function through the device node to cause the MCU control module's firmware program to execute the corresponding command, and realize reading and writing of the chip under test through the communication interface module, and then through the The communication interface module receives the response data returned by the chip under test to the read-write function of the MCU control module and enters S8; and S8: The response data obtained by the read and write function is fed back to the device node, function library file and application program in turn to complete the reading and writing of the chip data under test. 如請求項12或13所述的晶片測試方法，其中當該測試應用程式為該觸控與顯示功能併行測試應用程式時，啟動該測試應用程式以對該待測晶片執行該待測功能的測試項，包括： 啟動該測試應用程式，根據該測試應用程式同時啟動一第一執行緒對該待測晶片執行觸控功能測試項和啟動一第二執行緒對該待測晶片執行顯示功能測試項；以及 獲取對該待測晶片執行該測試項時該待測晶片反饋的響應數據，包括： 獲取該第一執行緒對該待測晶片執行觸控功能測試項時得到的觸控測試響應數據；以及 獲取該第二執行緒對該待測晶片執行顯示功能測試項時得到的顯示測試響應數據。 The chip testing method as described in claim 12 or 13, wherein when the test application is the touch and display function parallel test application, the test application is started to perform the test of the function under test on the chip under test items, including: Start the test application, and simultaneously start a first execution thread to perform a touch function test item on the chip under test and a second execution thread to perform a display function test item on the chip under test according to the test application program; and Obtain the response data fed back by the chip under test when the test item is executed on the chip under test, including: Obtain the touch test response data obtained when the first execution thread performs the touch function test item on the chip under test; and Obtain display test response data obtained when the second execution thread performs a display function test item on the chip under test.
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