CN114660436A - Chip testing equipment and chip testing method - Google Patents
Chip testing equipment and chip testing method Download PDFInfo
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Abstract
The invention discloses a chip testing device and a chip testing method, wherein the chip testing method is applied to the chip testing device, when testing a chip to be tested, which testing application program is started is determined according to a configuration file set by a tester, the testing application programs of functions to be tested of the chip to be tested corresponding to different configuration files are different, different testing items of different chips to be tested are started by starting different testing application programs, finally, a testing result of the functions to be tested of the chip to be tested is obtained according to the obtained response data, when testing different functions of the chips of different manufacturers is required, the testing of different functions to be tested of different chips to be tested of different manufacturers can be realized only by changing the set configuration file according to a manufacturer of the chip to be tested and the functions to be tested, and the universality and the compatibility of the chip testing device are improved, the test efficiency is improved, the process of changing the configuration file is simple and quick, and professional programmers do not need to operate the configuration file.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a chip testing device and a chip testing method.
Background
At present, after the touch chip, the display chip or the touch display chip are produced, the touch chip, the display chip or the touch display chip need to be subjected to a testing process, an MCU (micro controller Unit) is usually selected as a main control chip by the existing chip testing equipment for testing the chips to be tested, and a functional test program of the chip to be tested is packaged in an MCU firmware, but this results in a single testing function of the chip testing equipment, that is, only the touch function of the chip to be tested or the display function of the chip to be tested can be tested alone, so that the universality and compatibility of the chip testing equipment are not high. In addition, since there are many manufacturers that produce the chips to be tested in the market, the functional test programs of the chips to be tested are different because the test configuration and the test flow of the chips to be tested of different manufacturers are different, and the process of packaging the different functional test programs of the chips to be tested of different manufacturers in the MCU firmware requires a professional programmer to operate and is complicated.
Disclosure of Invention
The invention aims to provide a chip testing device and a chip testing method, which can realize an open testing platform by matching a CPU main control module with an MCU control module, set different configuration files to test different functions to be tested of different chips to be tested of different manufacturers, improve the universality and compatibility of the chip testing device, and do not need professional programmers in the testing process.
In order to solve the technical problems, the invention provides a chip testing device which comprises a CPU main control module, an MCU control module and a communication interface module, wherein the CPU main control module is connected with the MCU control module, the MCU control module is also connected with the communication interface module, and the communication interface module is also connected with a chip to be tested;
the CPU main control module is preset with a test application program of the chip to be tested, and the CPU main control module controls a test flow through the test application program;
when the test application program is operated, the MCU control module is responsible for executing a command downloaded by the CPU main control module and sending data to the communication interface module based on the command, and the communication interface module converts the data sent by the MCU control module and completes data communication with the chip to be tested; the communication interface module converts data of the chip to be tested, which are fed back to the MCU control module, the MCU control module receives and processes the data and feeds back the processed data or the judgment result to the CPU main control module, and the CPU main control module provides a final function test result of the chip to be tested according to the processed data or the judgment result of the MCU control module.
Preferably, the test application is used for testing the touch function and/or the display function and/or the touch display function of the chip.
Preferably, the MCU control module includes any one or more of a power management unit, a display image processing unit, a voltage and current measurement unit, and an IO control and measurement unit.
Preferably, a plurality of test application programs are preset in the CPU main control module, and any one of the test application programs is used for detecting the touch function and/or the display function and/or the touch display function of the chip to be tested of the corresponding model.
Preferably, the communication interface module comprises a protocol conversion module and an interface module; the protocol conversion module is used for sending the test data to the interface module according to an interface output standard when receiving the test data, the interface module sends the test data to the chip to be tested, and sends the received response data of the chip to be tested to the MCU control module after carrying out corresponding format conversion through the protocol conversion module.
Preferably, the interface module includes a chip communication interface and a display interface.
Preferably, the chip communication interface comprises an I2C interface and/or an SPI interface and/or other IO interfaces; the display interface comprises any one or more of an MIPI DPHY interface, an MIPI CPHY interface, an LVDS interface, an EDP interface and an RGB interface.
In order to solve the above technical problems, the present invention further provides a chip testing method, application and chip testing equipment, comprising:
determining a test application program of a chip to be tested according to a preset configuration file, wherein the test application programs corresponding to different configuration files are different;
starting the test application program to execute a corresponding test item on the chip to be tested;
acquiring response data of the chip to be tested;
obtaining a final test result of the function to be tested of the chip to be tested according to the response data;
the test application program comprises at least one of a touch function test application program, a display function test application program, a touch and display function parallel test application program and a touch and display function serial test application program of the chip to be tested.
Preferably, the chip testing device comprises a CPU main control module, an MCU control module and a communication interface module, wherein the MCU control module is connected with the CPU main control module, the MCU control module is also connected with the communication interface module, and the communication interface module is connected with a chip to be tested; starting the test application program to execute the test item on the chip to be tested and acquiring response data of the chip to be tested, wherein the method comprises the following steps:
s1: starting the test application program, judging whether the chip to be tested needs to be read and written according to a test item corresponding to the test application program, and if so, entering S2;
s2: calling an interface function of a function to be tested corresponding to the test application program in the library file;
s3: accessing a corresponding equipment node of the operating system according to the interface function of the function to be tested;
s4: judging whether the chip to be tested is directly read and written, if so, entering S5, and if not, entering S6;
s5: calling an interface read-write function of the operating system driver through the equipment node, reading and writing the chip to be tested through the communication interface module, receiving response data returned to the interface read-write function by the chip to be tested through the communication interface module, and entering S8;
s6: judging whether the to-be-tested chip is read and written through the MCU control module, if so, entering S7;
s7: calling an MCU control module read-write function through the equipment node so that a firmware program of the MCU control module executes a corresponding command, realizing the read-write of the chip to be tested through the communication interface module, receiving response data returned to the MCU control module read-write function by the chip to be tested through the communication interface module, and entering S8;
s8: and the response data acquired by the read-write function is sequentially fed back to the equipment node, the library file and the application program to finish the read-write of the data of the chip to be tested.
Preferably, when the test application is a touch and display function parallel test application, starting the test application to execute the test item of the function to be tested on the chip to be tested, including:
starting the test application program, and simultaneously starting a first thread to execute a touch function test item on the chip to be tested and a second thread to execute a display function test item on the chip to be tested according to the test application program;
acquiring response data fed back by the chip to be tested when the chip to be tested executes the test item, wherein the response data comprises the following data:
acquiring touch test response data obtained when the first thread executes a touch function test item on the chip to be tested;
and acquiring display test response data obtained when the second thread executes the display function test item on the chip to be tested.
The invention provides a chip test device and a chip test method, wherein the chip test device comprises a CPU main control module, an MCU control module and a communication interface module, wherein the CPU main control module is preset with a plurality of test application programs, and the MCU control module and the communication interface module are matched to complete the detection of different functions to be tested of different chips to be tested by starting different test application programs, so that the universality and compatibility of the chip test device are improved, and the test efficiency is improved.
The chip testing method provided by the invention is applied to chip testing equipment, when testing chips to be tested, which testing application program is started is determined according to configuration files preset by a tester, the testing application programs of functions to be tested of the chips to be tested are different corresponding to different configuration files, different testing items of the chips to be tested are started by starting different testing application programs, and finally, the testing result of the functions to be tested of the chips to be tested is obtained according to the obtained response data, when the different functions of the chips of different manufacturers are required to be tested, the testing of the different functions to be tested of the different chips to be tested of different manufacturers can be realized only according to manufacturers of the chips to be tested and the configuration files to be tested, the universality and compatibility of the chip testing equipment are improved, the testing efficiency is improved, and the process of setting the configuration files is simple and quick, no professional programmer is required.
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In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a chip testing apparatus according to the present invention;
FIG. 2 is a flow chart of a chip testing method according to the present invention;
FIG. 3 is a flowchart of a test application executing test items and obtaining chip response data according to the present invention;
FIG. 4 is a flowchart of a method for indirectly reading and writing a chip through an MCU control module according to the present invention;
fig. 5 is a flowchart of a parallel testing method for touch display functions according to the present invention.
Detailed Description
The core of the invention is to provide a chip testing device and a chip testing method, which can realize an open testing platform by matching a CPU main control module with an MCU control module, set different configuration files to complete the testing of different functions to be tested of different chips to be tested of different manufacturers, improve the universality and compatibility of the chip testing device, and do not need professional programmers in the testing process.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a chip testing device provided by the present invention, and includes a CPU main control module 1, an MCU control module 2, and a communication interface module 3, where the CPU main control module 1 is connected to the MCU control module 2, the MCU control module 2 is further connected to the communication interface module 3, and a chip to be tested completes a chip testing process by connecting the communication interface module 3;
the CPU main control module 1 is preset with a test application program of a chip to be tested, and the CPU main control module 1 controls a test flow through the test application program;
when the test application program is operated, the MCU control module 2 is responsible for executing a command downloaded by the CPU main control module 1 and sending data to the communication interface module 3 based on the command, and the communication interface module 3 converts the data sent by the MCU control module 2 and completes data communication with a chip to be tested; the communication interface module 3 converts data of the chip to be tested, which is fed back to the MCU control module 2, the MCU control module 2 receives and processes the data and feeds back the processed data or the judgment result to the CPU main control module 1, and the CPU main control module 1 provides a final function test result of the chip to be tested according to the processed data or the judgment result of the MCU control module 2.
At present, after various chips are produced, a chip testing process is performed to ensure that the functions of the chips are intact, for example, a currently common touch chip, a display chip or a touch display chip, in the prior art, when the chips are subjected to function testing, an MCU control chip is usually selected as a master control, and a function to be tested is packaged in bottom firmware of an MCU, which causes that the types and testing functions of the MCU control chip functional chips are fixed, i.e., a testing object of a testing device is single, only one function of one chip can be tested, which causes that the universality and compatibility of the testing device are not high, when the types or testing functions of the chips to be changed need to be changed, the bottom firmware of the MCU control chip needs to be re-packaged, which causes the testing process to be complicated, and can be completed by professional programmers.
In order to solve the problems, the chip testing is transferred to the testing application program to be realized, according to the characteristics of chip specificity and closure, the chip testing is transferred to the application software to be executed through the parameter configuration of the software, the bridging collocation of the hardware module and the central control scheduling of the operating system, so that the chip testing scheme is flexible and changeable, and has the capability of large-scale mass production testing. The testing of the functions of the chip is realized by matching the CPU main control module with the MCU control module, specifically, a plurality of testing application programs are prestored in the CPU main control module, a user can determine which testing application program of which chip to be tested is started through setting a configuration file, after the testing application program is started, a testing item can be executed on the chip to be tested according to the testing application program, the MCU control module realizes signal conversion and control, and then a testing result of the function to be tested of the chip to be tested is obtained according to response data fed back by the chip when the testing item is executed on the chip to be tested.
It should be noted that the pre-stored multiple test application programs may be test application programs for different functions to be tested of chips to be tested, which are produced by different manufacturers, and specific selection is performed according to configuration files of users, so that test universality and compatibility of chips produced by multiple manufacturers are realized.
It should be further noted that the response data fed back by the chip herein may be response data that can visually obtain a test result, for example, whether the chip can respond to the trigger signal, or response data that needs to obtain a test result after data processing, for example, obtaining a voltage current value of the chip every preset time, obtaining a test result by calculating an average voltage current value of the chip within a preset time and then performing threshold judgment, where the specific response data is determined according to a specific test item, and the invention is not particularly limited herein.
In summary, the invention provides a chip testing device, which comprises a CPU main control module, an MCU control module and a communication interface module, wherein the CPU main control module is preset with a plurality of testing applications, and the testing of different functions to be tested of different chips to be tested is completed by starting different testing applications and matching the MCU control module and the communication interface module, and the testing of different functions to be tested of different chips to be tested of different manufacturers can be realized only by changing the configuration file according to the manufacturer of the chip to be tested and the function to be tested, so as to improve the versatility and compatibility of the chip testing equipment, improve the testing efficiency, and the process of changing the configuration file is simple and fast, and does not require professional programmer to operate.
On the basis of the above-described embodiment:
as a preferred embodiment, the test application is used for testing the touch function and/or the display function and/or the touch display function of the chip to be tested.
In this embodiment, the detection of the touch function, the display function, or the touch display function of the chip to be tested can be completed by starting different test applications, so that the universality and compatibility of the chip test equipment are improved.
It should be noted that the touch display function herein is directed to a display screen chip on the market, and the chip can simultaneously implement the touch function and the display function, so the test on the chip should simultaneously include the touch function test and the display function test.
As a preferred embodiment, the MCU control module includes any one or more of a power management unit, a display image processing unit, a voltage current measurement unit, and an IO control and measurement unit.
In this embodiment, the MCU control module is composed of a power management unit, a display image processing unit, any one or more of a voltage/current measurement unit and an IO control and measurement unit, and is configured to cooperate with the CPU main control module to complete testing of different functions to be tested of the chip to be tested, for example, the power management unit is configured to supply power to the chip test device itself and to the chip module to be tested, the display image processing unit is configured to detect an image display function of the chip to be tested, the voltage/current measurement unit is configured to detect a power supply function of the chip to be tested, the IO control and measurement unit is configured to detect a touch display function of the chip to be tested, and the versatility of the chip test device is increased.
As a preferred embodiment, a plurality of test applications are preset in the CPU main control module, and any one of the test applications is used to detect the touch function and/or the display function of the chip to be tested of the corresponding model.
In this embodiment, the pre-stored multiple test applications may be test applications with different functions to be tested of chips to be tested manufactured by different manufacturers, and specific selection is performed according to a configuration file of a user, so that test universality and compatibility of chips manufactured by multiple manufacturers are realized.
As a preferred embodiment, the communication interface module comprises a protocol conversion module and an interface module; the protocol conversion module is used for sending the test data to the interface module according to the interface output standard when receiving the test data, the interface module sends the test data to the chip to be tested, and sends the received response data of the chip to be tested to the MCU control module 2 after carrying out corresponding format conversion through the protocol conversion module.
In this embodiment, in consideration of the difference of the data protocol that may exist between the MCU control module and the chip to be tested in the actual testing process, the communication interface module in this scheme includes a protocol conversion module and an interface module, where the protocol conversion module, after receiving the test data, outputs the data to the corresponding interface according to the transmission rate output standard of the corresponding interface, and also converts the corresponding data format of the response data fed back by the chip and sends the response data to the MCU control module, so as to complete the read-write operation on the chip, thereby increasing the feasibility of the scheme.
It should be noted that the MCU control module mainly receives test data through the storage interface or the data interface, and stores the test data in the internal memory, and the MCU control module converts the test data into parallel data and transmits the parallel data to the protocol conversion module.
The MCU control module mainly comprises an MCU main control module, a data receiving interface, a power supply control module, an internal memory and a data transmitting module, wherein the main control module can be a conventional MCU chip, the data receiving interface can be USB, SD, Ethernet, WIFI and the like, the internal memory can be a flash/Nandflash and other memory chips, the power supply control module comprises a power supply generation module and a power switch control module, and the data transmitting module comprises a self-defined data interface.
The MCU control module also comprises a data processing module which mainly comprises a data processing unit, a clock module, a data receiving module, a data caching module, a power supply module and a data transmitting module. The data processing unit can be a programmable logic unit and is used for processing format conversion of data and data transmission data conversion; the clock module can be an active clock module and a passive clock module; the data receiving module is a self-defined parallel data interface; the data sending module is a self-defined parallel data interface; the data cache module can be a common data cache, such as DDR and the like; the power module is an integrated power management circuit.
As a preferred embodiment, the interface module includes any one or more of a chip communication interface and a display interface.
In this embodiment, considering that the chip to be tested includes a touch chip, a display chip and a touch display chip, the interface module in this scheme includes a chip communication interface for normal data read-write operation of the chip to be tested, and also includes a display interface for completing data read-write operation in the test process of the display function of the chip to be tested.
In a preferred embodiment, the chip communication interface comprises an I2C interface and/or an SPI interface and/or other IO interfaces; the display interface comprises any one or more of an MIPI DPHY interface, an MIPI CPHY interface, an LVDS interface, an EDP interface and an RGB interface.
In this embodiment, in consideration that communication interfaces supported by different existing chips to be tested may be different, the chip communication interfaces in the present solution include an I2C interface and/or an SPI interface and/or other IO interfaces; the compatibility of the chip testing equipment is improved.
Meanwhile, the existing display equipment or display module has multiple different display interfaces, and in order to adapt to the display test of the multiple display equipment and display module, the display interfaces of the scheme comprise at least two of MIPI DPHY interfaces and/or MIPI CPHY interfaces and/or LVDS interfaces and/or EDP interfaces and/or RGB interfaces, so that the multiple display interfaces can be flexibly configured, and the chip modules for testing different display interfaces by one equipment are realized.
Referring to fig. 2, fig. 2 is a flowchart of a chip testing method provided by the present invention, and the chip testing method is applied to a chip testing apparatus, and includes:
s11: determining a test application program of a chip to be tested according to a preset configuration file, wherein the test application programs corresponding to different configuration files are different;
s12: starting a test application program to execute a corresponding test item on a chip to be tested;
s13: acquiring response data of a chip to be tested;
s14: and obtaining a final test result of the function to be tested of the chip to be tested according to the response data.
For the introduction of the chip testing method provided by the present invention, reference is made to the above embodiment of the chip testing apparatus, and the present invention is not described herein again.
On the basis of the above-described embodiment:
referring to fig. 3 as a preferred embodiment, fig. 3 is a flowchart illustrating a test application executing a test item and acquiring chip response data according to the present invention, including:
s1: starting a test application program, judging whether a chip to be tested needs to be read and written according to a test item corresponding to the test application program, and if so, entering S2;
s2: calling a function of a function interface to be tested corresponding to the test application program in the library file;
s3: accessing a corresponding equipment node of the operating system according to the function of the functional interface to be tested;
s4: judging whether the chip to be detected is directly read and written, if so, entering S5, otherwise, entering S6;
s5: calling an interface read-write function of an operating system driver through the equipment node, reading and writing the chip to be tested through the communication interface module, receiving response data returned to the interface read-write function by the chip to be tested through the communication interface module, and entering S8;
s6: judging whether the chip to be tested is read and written through the MCU control module, if so, entering S7;
s7: calling the MCU control module read-write function through the equipment node to enable the firmware program of the MCU control module to execute a corresponding command, realizing the read-write of the chip to be tested through the communication interface module, receiving response data returned to the MCU control module read-write function by the chip to be tested through the communication interface module, and entering S8;
s8: and the response data acquired by the read-write function is sequentially fed back to the equipment node, the library file and the application program to complete the read-write of the data of the chip to be tested.
The test application program is responsible for loading test configuration of the chip to be tested and controlling a test process, and meanwhile, response data returned by the chip to be tested are judged to obtain a test result; the CPU main control unit is responsible for command transmission and data transmission between the test application program and the MCU control module; the MCU control module is responsible for receiving and executing commands downloaded by the test application program, and simultaneously transmitting and receiving data to the chip to be tested through the control communication interface module; the communication interface module is responsible for carrying out interface protocol conversion on data sent by the MCU control module and sending the converted data to the chip to be tested.
In order to realize the chip test is transferred to the application program for execution, the chip test equipment provided by the invention is composed of a CPU main control module, an MCU control module and a communication interface module, wherein a plurality of test application programs are prestored in the CPU main control module, when the test application programs are started, whether data reading and writing are needed to be carried out on the chip to be tested is judged according to test items, when data reading and writing are needed to be carried out on the chip to be tested, a function interface function to be tested corresponding to the test application program in a library file is called firstly, a corresponding equipment node of an operating system is accessed according to the function interface function to be tested, then the chip to be tested is directly read and written according to the test items, when the chip to be tested is directly read and written, the interface read and write function of a driving program of the operating system in the CPU main control module is accessed through the equipment node of the operating system, and data reading and writing are carried out on the chip to be tested through the communication interface module, then returning the obtained response data to an interface read-write function of a driver of the operating system; when the chip to be tested is not directly read and written, namely the chip to be tested is read and written through the MCU control module, the MCU control module read and write function of the driving program of the operating system can be accessed through the equipment node of the operating system, the function is called to enable the firmware program of the MCU control module to execute a corresponding test command, the chip to be tested is read and written through the communication interface module, the obtained response data are returned to the MCU control module read and write function, and finally the obtained response data can be finally returned to the test application program so as to facilitate subsequent data processing or judgment of a test result.
Referring to fig. 4, fig. 4 is a flowchart illustrating indirect reading and writing of a chip through an MCU control module according to the present invention.
In addition, the MCU control module comprises a power management module, a display image processing module, a voltage and current measurement module and an IO control and measurement module, the modules are matched with a test application program to realize the test of various functions of the chip, and the power management module is responsible for the power supply of the MCU control module and the power supply of the chip to be tested; the display image processing module is used for testing the image display function of the chip to be tested; the voltage and current module is used for testing the power supply function of the chip to be tested and measuring the voltage and the current of the chip in certain test items; the IO control and measurement module is used for testing the touch display function of the chip to be tested.
It should be noted that, here, the interface function of the to-be-tested function corresponding to the test application program in the library file is to encapsulate the read and write of the data read-write communication interface of the to-be-tested chip, such as the read and write of the I2C or SPI interface, into a library file, so that the library file has universality, and the library file can interact with the driver of the operating system through the device node to complete the read and write of the to-be-tested chip.
It should also be noted that, the invention takes the MCU control module to indirectly read and write the chip to be tested as an example, and during the actual use, the chip may also be indirectly read and written through other development boards, which is not limited herein.
As a preferred embodiment, when the test application is a touch and display function parallel test application, starting the test application to execute a test item of a function to be tested on the chip to be tested, including:
starting a test application program, and simultaneously starting a first thread to execute a touch function test item on a chip to be tested and starting a second thread to execute a display function test item on the chip to be tested according to the test application program;
acquiring response data fed back by a chip to be tested when the chip to be tested executes a test item, comprising:
acquiring touch test response data obtained when a first thread executes a touch function test item on a chip to be tested;
and acquiring display test response data obtained when the second thread executes the display function test item on the chip to be tested.
Referring to fig. 5, fig. 5 is a flowchart of a parallel testing method for touch display functions according to the present invention.
In this embodiment, it is considered that the touch and display functions are integrated into the same chip (i.e., a TDDI chip) in the prior art, that is, the touch display module can implement the touch and display functions by using one chip, so when performing a function test on the chip, the prior art usually performs the touch function and the display function of the chip to be tested in sequence, for example, the touch function test is performed first, then the chip to be tested is transferred to the display function test station and then the display function test is performed, so that two test stations are required to test the touch function and the display function respectively, and more testers are required to be configured, which increases the test time and lowers the test efficiency.
Therefore, in the scheme, the multithreading technology is adopted, when the test application program determined by setting the configuration file is the touch and display function parallel test application program, the parallel test application program is started, the touch and display functions can be tested simultaneously, specifically, the first thread is started to test the touch function of the chip to be tested, the second thread is started to test the display function of the chip to be tested, the response data of the two tested chips to be tested are respectively obtained, and then the corresponding test result of the function to be tested is judged according to the corresponding response data, so that the test time is saved, the test station and the configuration of test personnel are also saved, and the test efficiency is improved.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The chip testing equipment is characterized by comprising a CPU main control module, an MCU control module and a communication interface module, wherein the CPU main control module is connected with the MCU control module, and the MCU control module is also connected with the communication interface module;
the CPU main control module is preset with a test application program of a chip to be tested, and controls a test flow through the test application program;
when the test application program is operated, the MCU control module is responsible for executing a command downloaded by the CPU main control module and sending data to the communication interface module based on the command, and the communication interface module converts the data sent by the MCU control module and completes data communication with the chip to be tested; the communication interface module converts data of the chip to be tested, which are fed back to the MCU control module, the MCU control module receives and processes the data and feeds back the processed data or the judgment result to the CPU main control module, and the CPU main control module provides a final function test result of the chip to be tested according to the processed data or the judgment result of the MCU control module.
2. The chip test apparatus according to claim 1, wherein the test application is configured to test a touch function and/or a display function of the chip under test.
3. The chip test apparatus of claim 1, wherein the MCU control module comprises any one or more of a power management unit, a display image processing unit, a voltage current measurement unit, and an IO control and measurement unit.
4. The chip test apparatus according to claim 1, wherein a plurality of test applications are preset in the CPU main control module, and any one of the test applications is used to detect a touch function and/or a display function of the chip to be tested of a corresponding model.
5. The chip test apparatus according to claim 1, wherein the communication interface module includes a protocol conversion module and an interface module; the protocol conversion module is used for sending the test data to the interface module according to an interface output standard when receiving the test data, the interface module sends the test data to the chip to be tested, and sends the received response data of the chip to be tested to the MCU control module after carrying out corresponding format conversion through the protocol conversion module.
6. The chip test apparatus of claim 5, wherein the interface module comprises a chip communication interface and a display interface.
7. The chip test device according to claim 6, wherein the chip communication interface comprises an I2C interface and/or an SPI interface and/or other IO interfaces; the display interface comprises any one or more of an MIPIDPHY interface, an MIPI CPHY interface, an LVDS interface, an EDP interface and an RGB interface.
8. A chip testing method is characterized by being applied to chip testing equipment and comprising the following steps:
determining a test application program of a chip to be tested according to a preset configuration file, wherein the test application programs corresponding to different configuration files are different;
starting the test application program to execute corresponding test items on the chip to be tested;
acquiring response data of the chip to be tested;
obtaining a final test result of the function to be tested of the chip to be tested according to the response data;
the test application program comprises at least one of a touch function test application program, a display function test application program, a touch and display function parallel test application program and a touch and display function serial test application program of the chip to be tested.
9. The chip testing method according to claim 8, wherein the chip testing device comprises a CPU main control module, an MCU control module and a communication interface module, the MCU control module is connected to the CPU main control module, and the MCU control module is further connected to the communication interface module;
starting the test application program to execute the test item on the chip to be tested and acquiring response data of the chip to be tested, wherein the method comprises the following steps:
s1: starting the test application program, judging whether the chip to be tested needs to be read and written according to a test item corresponding to the test application program, and if so, entering S2;
s2: calling an interface function of a function to be tested corresponding to the test application program in the library file;
s3: accessing a corresponding equipment node of the operating system according to the interface function of the function to be tested;
s4: judging whether the chip to be tested is directly read and written, if so, entering S5, and if not, entering S6;
s5: calling an interface read-write function of the operating system driver through the equipment node, reading and writing the chip to be tested through the communication interface module, receiving response data returned to the interface read-write function by the chip to be tested through the communication interface module, and entering S8;
s6: judging whether the to-be-tested chip is read and written through the MCU control module, if so, entering S7;
s7: calling an MCU control module read-write function through the equipment node so that a firmware program of the MCU control module executes a corresponding command, realizing the read-write of the chip to be tested through the communication interface module, receiving response data returned to the MCU control module read-write function by the chip to be tested through the communication interface module, and entering S8;
s8: and the response data acquired by the read-write function is sequentially fed back to the equipment node, the library file and the application program to finish the read-write of the data of the chip to be tested.
10. The chip testing method according to any one of claims 8 to 9, wherein when the testing application is a touch and display function parallel testing application, starting the testing application to execute the test item of the function to be tested on the chip to be tested, comprises:
starting the test application program, and simultaneously starting a first thread to execute a touch function test item on the chip to be tested and a second thread to execute a display function test item on the chip to be tested according to the test application program;
acquiring response data fed back by the chip to be tested when the chip to be tested executes the test item, wherein the response data comprises:
acquiring touch test response data obtained when the first thread executes a touch function test item on the chip to be tested;
and acquiring display test response data obtained when the second thread executes the display function test item on the chip to be tested.
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| CN202210243152.9A CN114660436A (en) | 2022-03-11 | 2022-03-11 | Chip testing equipment and chip testing method |
| TW111125830A TW202336591A (en) | 2022-03-11 | 2022-07-08 | Chip testing device and chip testing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115792582A (en) * | 2023-02-03 | 2023-03-14 | 珠海市杰理科技股份有限公司 | Chip testing method, device and equipment |
| CN116774014A (en) * | 2023-08-21 | 2023-09-19 | 北京怀美科技有限公司 | Multi-task chip test system and multi-task chip test method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115792582A (en) * | 2023-02-03 | 2023-03-14 | 珠海市杰理科技股份有限公司 | Chip testing method, device and equipment |
| CN116774014A (en) * | 2023-08-21 | 2023-09-19 | 北京怀美科技有限公司 | Multi-task chip test system and multi-task chip test method |
| CN116774014B (en) * | 2023-08-21 | 2023-10-31 | 北京怀美科技有限公司 | Multi-task chip test system and multi-task chip test method |
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