TW202313362A - Pattern manufacturing method, program, and pattern manufacturing device - Google Patents

Pattern manufacturing method, program, and pattern manufacturing device Download PDF

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TW202313362A
TW202313362A TW111127930A TW111127930A TW202313362A TW 202313362 A TW202313362 A TW 202313362A TW 111127930 A TW111127930 A TW 111127930A TW 111127930 A TW111127930 A TW 111127930A TW 202313362 A TW202313362 A TW 202313362A
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nozzle
area
pattern
nozzles
aforementioned
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京相忠
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日商富士軟片股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided are a pattern manufacturing method, a program, and a pattern manufacturing device that increase pattern drawing accuracy even when there is variation in characteristics within a liquid ejection head. When a substrate and a liquid ejection head are relatively moved, said liquid ejection head including a plurality of nozzle regions that respectively have a plurality of nozzles and are divided according to the locations of said nozzles in the direction of relative movement, and a liquid is ejected from the plurality of nozzles to position a plurality of dots in a printing region of a surface of the substrate and form a pattern, the nozzle of a specific nozzle region among the plurality of nozzle regions is used to position a dot in a border region of the printing region, said border region including a border with a non-printing region that is different from the printing region.

Description

圖案製造方法、程式及圖案製造裝置Pattern manufacturing method, program and pattern manufacturing device

本發明係關於圖案製造方法、程式及圖案製造裝置，特別係關於使用液體吐出頭形成高精度的圖案之技術。The present invention relates to a pattern manufacturing method, a program, and a pattern manufacturing device, and particularly relates to a technique for forming a high-precision pattern using a liquid discharge head.

在噴墨印刷中，有時欲提高印刷圖案的邊界部的描繪精度，特別欲提高印刷範圍的尺寸精度。In inkjet printing, it is sometimes desired to improve the drawing accuracy of the boundary portion of the printed pattern, particularly the dimensional accuracy of the printing area.

作為用於提高印刷精度的方法，在專利文獻1中，記載有由於沒有由“位移模式”的印刷引起之邊界部的凹凸，因此僅邊界部藉由通常模式（非位移模式）進行印刷，而內部藉由位移模式進行印刷之技術。As a method for improving printing accuracy, in Patent Document 1, it is described that since there is no unevenness at the boundary portion caused by printing in the “displacement mode”, only the boundary portion is printed in the normal mode (non-displacement mode), and Internal printing technology by displacement mode.

又，在專利文獻2中記載有塗佈預處理液以防止印刷基材上的墨點之間的干擾，且提高畫質。In addition, Patent Document 2 describes applying a pretreatment liquid to prevent interference between ink dots on a printing substrate and to improve image quality.

專利文獻1：日本特開平6-171091號公報 專利文獻2：日本特開2007-1045號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 6-171091 Patent Document 2: Japanese Patent Laid-Open No. 2007-1045

然而，專利文獻1中所記載之技術存在無法應對由噴嘴間的特性偏差引起之描繪圖案的崩潰，且無法充分提高描繪精度之課題。However, the technique described in Patent Document 1 has problems in that it cannot deal with collapse of drawing pattern due to characteristic variation among nozzles, and cannot sufficiently improve drawing accuracy.

又，專利文獻2中所記載之技術存在僅能夠確保基材上的精度，無法校正噴嘴間的特性偏差，無法充分提高描繪精度之課題。In addition, the technology described in Patent Document 2 has the problem that it can only ensure the accuracy on the substrate, but cannot correct the variation in characteristics between nozzles, and cannot sufficiently improve the drawing accuracy.

本發明係鑑於這樣的情況完成的，目的在於提供一種即使在液體吐出頭內存在特性偏差，亦提高圖案的描繪精度之圖案製造方法、程式及圖案製造裝置。The present invention was made in view of such circumstances, and an object of the present invention is to provide a pattern manufacturing method, a program, and a pattern manufacturing device that improve the drawing accuracy of a pattern even if there is a characteristic variation in a liquid discharge head.

在為了達成上述目的的圖案製造方法之一的態樣中，圖案製造裝置方法使用圖案製造裝置之圖案製造方法，前述圖案製造裝置具備：液體吐出頭，具有吐出液體之複數個噴嘴；及相對移動機構，使基材及液體吐出頭相對移動，前述圖案製造方法中，液體吐出頭包含分別具有複數個噴嘴且依據相對移動的方向中的噴嘴的位置分割而成之複數個噴嘴區域，圖案製造方法包括使基材及液體吐出頭相對移動而使液體從複數個噴嘴吐出，在基材的表面的印刷區域配置複數個點形成圖案之圖案形成步驟，在圖案形成步驟中，藉由複數個噴嘴區域中的特定的噴嘴區域的噴嘴，在印刷區域中包括與和印刷區域不同之非印刷區域的邊界之邊界區域中配置點。依據本態樣，即使在液體吐出頭內存在特性偏差，亦能夠提高圖案的描繪精度。In one aspect of the pattern manufacturing method in order to achieve the above object, the pattern manufacturing device method uses the pattern manufacturing method of the pattern manufacturing device, and the aforementioned pattern manufacturing device is equipped with: a liquid ejection head with a plurality of nozzles for ejecting liquid; and relative movement Mechanism to relatively move the base material and the liquid ejection head. In the aforementioned pattern manufacturing method, the liquid ejection head includes a plurality of nozzle areas each having a plurality of nozzles and divided according to the positions of the nozzles in the direction of relative movement. The pattern manufacturing method Including moving the base material and the liquid ejection head relatively so that the liquid is ejected from a plurality of nozzles, and arranging a plurality of dots to form a pattern in the printing area on the surface of the base material. In the pattern forming step, through a plurality of nozzle areas In the specific nozzle area, dots are arranged in a border area including a boundary area of a printing area and a non-printing area different from the printing area. According to this aspect, even if there is a characteristic variation in the liquid discharge head, it is possible to improve the drawing accuracy of the pattern.

在圖案形成步驟中，藉由複數個噴嘴區域的噴嘴，在與印刷區域中除邊界區域以外的非邊界區域中配置點為較佳。藉此，能夠形成在印刷區域配置點之圖案。In the pattern forming step, it is preferable to arrange dots in a non-border area other than the border area in the printing area by nozzles of a plurality of nozzle areas. Thereby, a pattern in which dots are arranged in the printing area can be formed.

在圖案形成步驟中，藉由特定的噴嘴區域的噴嘴在邊界區域配置點之後，藉由複數個噴嘴區域的噴嘴在非邊界區域中配置點為較佳。藉此，能夠抑制在邊界區域中配置之點藉由著陸干擾移動。In the pattern forming step, it is preferable to arrange dots in the non-boundary area by nozzles of a plurality of nozzle areas after the dots are arranged in the boundary area by nozzles of a specific nozzle area. Thereby, it is possible to suppress the movement of the point arranged in the boundary area by the interference of the landing.

特定的噴嘴區域為配置於相對移動的上游側之上游側噴嘴區域為較佳。藉此，能夠比在非邊界區域之前在邊界區域配置點。It is preferable that the specific nozzle area is an upstream side nozzle area arranged on the upstream side of the relative movement. Thereby, it is possible to place points in the boundary area before the non-boundary area.

在圖案形成步驟中，增加配置於除邊界區域以外的區域之點為較佳。藉此，能夠抑制液體總量的減少。In the pattern forming step, it is preferable to increase the number of dots arranged in areas other than the border area. Thereby, reduction of the total amount of liquid can be suppressed.

在圖案形成步驟中，在印刷區域中與邊界區域相鄰之區域，配置比配置在邊界區域之點的尺寸相對大尺寸的點為較佳。藉此，能夠在液體量相對少的邊界區域散佈點。In the pattern forming step, it is preferable to arrange dots of a relatively larger size than dots arranged in the border region in the region adjacent to the border region in the printing region. Thereby, it is possible to scatter dots in a boundary area where the amount of liquid is relatively small.

在圖案形成步驟中，藉由基材及液體吐出頭的特定方向的複數次相對移動來形成圖案為較佳。藉此，能夠適當地形成圖案。In the pattern forming step, it is preferable to form the pattern by a plurality of relative movements of the substrate and the liquid discharge head in a specific direction. Thereby, a pattern can be formed suitably.

在圖案形成步驟中，在邊界區域，僅藉由特定噴嘴區域的噴嘴配置點為較佳。藉此，能夠排除液體吐出頭內的特性偏差而提高邊界區域的描繪精度。再者，“僅特定噴嘴區域的噴嘴”係指，實際上可以僅藉由特定噴嘴區域的噴嘴配置點，亦包括發揮本發明的效果之程度內藉由除特定噴嘴區域以外的噴嘴在邊界區域配置點。In the pattern forming step, in the boundary area, it is preferable to place dots only by nozzles in a specific nozzle area. Thereby, it is possible to eliminate characteristic variation in the liquid discharge head and improve the drawing accuracy of the boundary region. Furthermore, "nozzles only in a specific nozzle area" means that it is actually possible to arrange nozzles only in a specific nozzle area, and also includes nozzles other than the specific nozzle area in the boundary area to the extent that the effect of the present invention is exerted. configuration point.

複數個噴嘴能夠分別配置複數尺寸的點，在圖案形成步驟中，在邊界區域配置相同尺寸的點為較佳。藉此，能夠排除點尺寸之間的特性偏差的影響。Dots of a plurality of sizes can be respectively arranged in a plurality of nozzles, and it is preferable to arrange dots of the same size in a boundary region in the pattern forming step. Thereby, the influence of the characteristic variation between dot sizes can be eliminated.

基材具備對齊標記，圖案製造方法具備：讀取對齊標記之讀取步驟、及使用讀取步驟中之對齊標記的讀取結果調整特定噴嘴區域的噴嘴的著陸位置之調整步驟為較佳。藉此，能夠進一步提高邊界區域的描繪精度。The substrate has an alignment mark, and the pattern manufacturing method preferably includes a reading step of reading the alignment mark, and an adjustment step of adjusting the landing position of a nozzle in a specific nozzle area using the reading result of the alignment mark in the reading step. Thereby, the drawing accuracy of the boundary region can be further improved.

圖案製造方法具備對基材預先塗佈包含預先抑制液體的濕擴散之功能性材料之預處理液之預處理液塗佈步驟為較佳。藉此，能夠抑制液體的著陸干擾而進一步提高圖案的描繪精度。It is preferable that the pattern manufacturing method includes a pretreatment liquid coating step of pre-coating a pretreatment liquid containing a functional material that suppresses wet diffusion of liquid on the base material in advance. Thereby, it is possible to further improve the drawing accuracy of the pattern by suppressing the disturbance of the landing of the liquid.

基材為安裝電氣組件而成之電路基板，印刷區域包括作為電磁波遮蔽的形成對象之電氣組件，液體為導電性液體為較佳。藉此，能夠在作為電磁波遮蔽的形成對象之電氣組件形成用作電磁波遮蔽之圖案。The base material is a circuit substrate mounted with electrical components, the printed area includes electrical components to be formed for electromagnetic wave shielding, and the liquid is preferably a conductive liquid. Thereby, the pattern for electromagnetic wave shielding can be formed in the electrical component which is the formation object of electromagnetic wave shielding.

為了達成上述目的的程式之一的態樣為用於使電腦執行上述圖案製造方法的程式。記錄有該程式之電腦能夠讀取的非暫時性的記憶媒體亦可以包含於本態樣中。One aspect of the program for achieving the above object is a program for causing a computer to execute the above pattern manufacturing method. A non-transitory memory medium that can be read by a computer on which the program is recorded can also be included in this aspect.

在為了達成上述目的的圖案製造裝置之一的態樣中，圖案製造裝置具備：液體吐出頭，具有吐出液體之複數個噴嘴；相對移動機構，使基材及液體吐出頭相對移動；至少一個處理器；及至少一個記憶體，儲存用於使至少一個處理器執行的命令，液體吐出頭包括分別具有複數個噴嘴且依據相對移動的方向上的噴嘴的位置分割而成之複數個噴嘴區域，至少一個處理器進行如下處理：使基材及液體吐出頭相對移動而將液體從複數個噴嘴吐出，在基材的表面的印刷區域配置複數個點形成圖案，藉由複數個噴嘴區域中的特定噴嘴區域的噴嘴，在印刷區域中包括與和印刷區域不同之非印刷區域的邊界之邊界區域中配置點。依據本態樣，即使在液體吐出頭內存在特性偏差，亦能夠提高圖案的描繪精度。 [發明效果] In one aspect of the pattern manufacturing device in order to achieve the above object, the pattern manufacturing device is equipped with: a liquid discharge head having a plurality of nozzles for discharging liquid; a relative movement mechanism for relatively moving the base material and the liquid discharge head; at least one processing device; and at least one memory, storing commands for at least one processor to execute, the liquid ejection head includes a plurality of nozzle areas respectively having a plurality of nozzles and divided according to the positions of the nozzles in the direction of relative movement, at least One processor performs the following processing: the substrate and the liquid ejection head are relatively moved to discharge the liquid from a plurality of nozzles, a plurality of dots are arranged in the printing area on the surface of the substrate to form a pattern, and a specific nozzle in the plurality of nozzle areas The nozzles of the area arrange dots in a border area including a border of a non-printing area different from the printing area in the printing area. According to this aspect, even if there is a characteristic variation in the liquid discharge head, it is possible to improve the drawing accuracy of the pattern. [Invention effect]

依據本發明，即使在液體吐出頭內存在特性偏差，亦能夠提高圖案的描繪精度。According to the present invention, even if there is a characteristic variation in the liquid discharge head, it is possible to improve the drawing accuracy of the pattern.

以下，按照附圖面對本發明的較佳實施形態進行詳細說明。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[電氣組件安裝基板的結構] 圖1係電氣組件安裝基板1000的立體圖。如圖1所示，電氣組件安裝基板1000為在印刷配線基板1002的組件安裝面1004上安裝有IC1006、電阻器1008及電容器1010而成之者。 [Structure of electrical component mounting substrate] FIG. 1 is a perspective view of an electrical component mounting substrate 1000 . As shown in FIG. 1 , an electrical component mounting board 1000 is formed by mounting an IC 1006 , a resistor 1008 , and a capacitor 1010 on a component mounting surface 1004 of a printed wiring board 1002 .

在電氣組件安裝基板1000中，在IC1006上形成有導電圖案1020，在電阻器1008及電容器1010上形成有絕緣塗層1022。又，在電氣組件安裝基板1000中，在印刷配線基板1002的沒有安裝電氣組件而曝露之電極1009上形成有絕緣塗層1022。In electrical component mounting substrate 1000 , conductive pattern 1020 is formed on IC 1006 , and insulating coating 1022 is formed on resistor 1008 and capacitor 1010 . In addition, in the electrical component mounting substrate 1000, an insulating coating layer 1022 is formed on the exposed electrode 1009 of the printed wiring substrate 1002 where no electrical component is mounted.

在圖1中，例示了印刷配線基板1002的一面成為組件安裝面1004之態樣，但印刷配線基板1002的另一面亦可以成為組件安裝面，印刷配線基板1002一面及另一面的兩面亦可以成為組件安裝面。In FIG. 1 , an example is shown in which one side of the printed wiring board 1002 becomes the component mounting surface 1004, but the other side of the printed wiring board 1002 may also be the component mounting surface, and both surfaces of the one side and the other side of the printed wiring board 1002 may also be Component mounting surface.

在印刷配線基板1002上設置有2個對準標記1005（“對齊標記”的一例）。對準標記1005表示成為印刷配線基板1002的基準之位置。使用後述之照相機13（參閱圖3）拍攝對準標記1005，藉此可偵知印刷配線基板1002、及後述之液體吐出頭12（參閱圖3）的相對位移量。對準標記1005的數量、位置、及形狀能夠適當確定。Two alignment marks 1005 (an example of “alignment marks”) are provided on the printed wiring board 1002 . Alignment mark 1005 indicates a position serving as a reference for printed wiring board 1002 . The alignment mark 1005 is photographed by the camera 13 (see FIG. 3 ) described later, and the relative displacement between the printed wiring board 1002 and the liquid discharge head 12 (see FIG. 3 ) described later can be detected. The number, position, and shape of the alignment marks 1005 can be appropriately determined.

IC1006為半導體積體電路裝入於樹脂等的封裝中之電氣組件。IC1006的電極曝露於封裝的外部。再者，IC為Integrated Circuit（積體電路）的縮寫字。又，電氣組件有時亦可以稱為電子組件。IC1006 is an electrical component in which a semiconductor integrated circuit is encased in a package such as resin. The electrodes of IC1006 are exposed outside the package. Furthermore, IC is an acronym for Integrated Circuit (integrated circuit). In addition, electrical components may also be referred to as electronic components sometimes.

電阻器1008包括電氣電阻元件。又，電阻器1008包括被積體化之複數個電氣電阻元件裝入於樹脂等的封裝之電阻陣列1008A。電容器1010包括電解電容器、及陶瓷電容器等的各種電容器。Resistor 1008 includes an electrical resistive element. Furthermore, the resistor 1008 includes a resistor array 1008A in which a plurality of integrated electric resistance elements are packaged in resin or the like. The capacitor 1010 includes various types of capacitors such as electrolytic capacitors and ceramic capacitors.

在印刷配線基板1002上所安裝之電氣組件中，使用絕緣油墨在IC1006的配置區域形成絕緣圖案1024（參閱圖2），進而使用導電油墨在絕緣圖案的至少一部分形成導電圖案1020。再者，在圖1中，絕緣圖案1024的圖示被省略。In the electrical components mounted on the printed wiring board 1002 , an insulating pattern 1024 (see FIG. 2 ) is formed on the area where the IC 1006 is disposed using insulating ink, and a conductive pattern 1020 is formed on at least a part of the insulating pattern using conductive ink. Furthermore, in FIG. 1 , illustration of the insulating pattern 1024 is omitted.

導電圖案1020藉由如下方式形成：從液體吐出頭12（參閱圖3）吐出導電油墨，藉此在導電圖案1020的形成區域（“印刷區域”的一例）配置導電油墨的墨點，並使導電油墨的墨點的連續本體乾燥而硬化。The conductive pattern 1020 is formed by discharging the conductive ink from the liquid discharge head 12 (see FIG. 3 ), thereby disposing ink dots of the conductive ink in the formation area of the conductive pattern 1020 (an example of a "printing area"), and making conductive ink dots. The continuous body of dots of ink dries and hardens.

絕緣塗層1022及絕緣圖案1024藉由如下方式形成：從未圖示的液體吐出頭吐出絕緣油墨，藉此在絕緣塗層1022及絕緣圖案1024的形成區域配置絕緣油墨的墨點，使絕緣油墨的墨點的連續本體乾燥而硬化。The insulating coat 1022 and the insulating pattern 1024 are formed by discharging insulating ink from a liquid ejection head not shown, thereby disposing dots of the insulating ink in the area where the insulating coat 1022 and the insulating pattern 1024 are formed, so that the insulating ink The continuous body of ink dots dries and hardens.

導電圖案1020作為電磁波遮蔽而發揮功能，該電磁波遮蔽的目的在於抑制由IC1006受到之電磁波，及抑制從IC1006釋放之電磁波。絕緣圖案1024作為如下構件發揮功能：確保導電圖案1020與IC1006的電氣絕緣之絕緣構件、確保導電圖案1020與IC1006的密接性之接著構件、及確保導電圖案1020的基底的平坦性之構件等。The conductive pattern 1020 functions as an electromagnetic wave shield. The purpose of the electromagnetic wave shield is to suppress electromagnetic waves received by the IC 1006 and to suppress electromagnetic waves emitted from the IC 1006 . The insulating pattern 1024 functions as an insulating member ensuring electrical insulation between the conductive pattern 1020 and the IC 1006 , an adhesive member ensuring the adhesion between the conductive pattern 1020 and the IC 1006 , and a member ensuring flatness of the base of the conductive pattern 1020 .

印刷配線基板1002中，配置有無需電磁波遮蔽之電氣組件之組件區域的至少一部分被絕緣塗層1022包覆，而不形成導電圖案1020。不需要電磁波遮蔽之電氣組件包括：除電阻器1008、電容器1010以外的二極體、線圈、變壓器、及開關等。In the printed wiring board 1002 , at least a part of the component area where the electrical components that do not require electromagnetic wave shielding are arranged is covered with the insulating coating 1022 , and the conductive pattern 1020 is not formed. Electrical components that do not require electromagnetic wave shielding include: diodes, coils, transformers, and switches other than resistors 1008 and capacitors 1010 .

又，配置有電極1009之電極區域被絕緣塗層1022包覆。絕緣塗層1022抑制形成導電圖案1020時被微粒子化之導電油墨附著於電阻器1008等而引起之電路的短路。Also, the electrode region where the electrode 1009 is disposed is covered with an insulating coating 1022 . The insulating coating layer 1022 suppresses the short circuit of the circuit caused by the adherence of the conductive ink atomized when forming the conductive pattern 1020 to the resistor 1008 and the like.

再者，安裝IC1006、電阻器1008及電容器1010而成之印刷配線基板1002為安裝包括IC之電氣組件而成之“電路基板”的一例。IC1006為“成為電磁波遮蔽的形成對象之電氣組件”的一例。In addition, the printed wiring board 1002 which mounted IC1006, the resistor 1008, and the capacitor 1010 is an example of the "circuit board" which mounted the electric component including IC. IC1006 is an example of "an electrical component that becomes an object of electromagnetic wave shielding".

圖2係表示電氣組件安裝基板1000的立體結構之剖面圖。圖2示意性地表示在圖1所示之任意IC1006在形成有絕緣圖案1024、及導電圖案1020之狀態下的剖面。FIG. 2 is a cross-sectional view showing the three-dimensional structure of the electrical component mounting substrate 1000 . FIG. 2 schematically shows a cross section of any IC 1006 shown in FIG. 1 in a state where an insulating pattern 1024 and a conductive pattern 1020 are formed.

印刷配線基板1002的組件安裝面1004中所形成之基板側電極1030、及IC1006的元件側電極1032經由焊料凸塊1034電連接。The substrate-side electrode 1030 formed on the component mounting surface 1004 of the printed wiring board 1002 and the element-side electrode 1032 of the IC 1006 are electrically connected via solder bumps 1034 .

絕緣圖案1024形成在包圍IC1006的4個側面1006A之IC1006的周圍，且比形成有IC1006的元件側電極1032之背面1006B更靠印刷配線基板1002側的位置。絕緣圖案1024亦可以形成在與IC1006側面1006A接觸之位置。絕緣圖案1024亦可以形成在IC1006的背面1006B及印刷配線基板1002的組件安裝面1004之間。The insulating pattern 1024 is formed around the IC 1006 surrounding the four side surfaces 1006A of the IC 1006 , and is located closer to the printed wiring board 1002 side than the back surface 1006B on which the element-side electrode 1032 of the IC 1006 is formed. The insulating pattern 1024 may also be formed at a position in contact with the side surface 1006A of the IC 1006 . The insulating pattern 1024 may also be formed between the back surface 1006B of the IC 1006 and the component mounting surface 1004 of the printed wiring board 1002 .

導電圖案1020形成為與絕緣圖案1024的至少一部分重疊。圖2表示導電圖案1020形成為與絕緣圖案1024的整體重疊之態樣。The conductive pattern 1020 is formed to overlap at least a portion of the insulating pattern 1024 . FIG. 2 shows a state in which the conductive pattern 1020 is formed to overlap the entirety of the insulating pattern 1024 .

又，導電圖案1020可以形成在覆蓋IC1006的側面1006A、及IC1006的上表面1006C之區域。在IC1006的側面1006A及IC1006的上表面，亦可以形成作為導電圖案1020的基底之絕緣圖案1024。In addition, the conductive pattern 1020 may be formed in a region covering the side surface 1006A of the IC 1006 and the upper surface 1006C of the IC 1006 . An insulating pattern 1024 serving as a base of the conductive pattern 1020 may also be formed on the side surface 1006A of the IC 1006 and the upper surface of the IC 1006 .

在IC1006具備從側面1006A向IC1006的外側突出之電極之情況下，至少在包覆所有電極之區域形成絕緣圖案1024。In the case where IC 1006 has electrodes protruding from side surface 1006A to the outside of IC 1006 , insulating pattern 1024 is formed at least in a region covering all the electrodes.

在圖2例示曝露有導電圖案1020之電氣組件安裝基板1000，但亦可以形成有與導電圖案1020重疊之保護膜。保護膜亦可以具有絕緣性。FIG. 2 exemplifies the electrical component mounting substrate 1000 with the conductive pattern 1020 exposed, but a protective film overlapping the conductive pattern 1020 may also be formed. The protective film may also have insulating properties.

[圖案製造裝置] 〔整體結構〕 圖3為圖案製造裝置10的整體結構圖。圖案製造裝置10為在形成絕緣圖案1024而成之印刷配線基板1002的組件安裝面1004形成導電圖案1020之裝置。如圖3所示，圖案製造裝置10具備：液體吐出頭12、照相機13、頭支撐構件14、輸送裝置20及基座30。頭支撐構件14及輸送裝置20配置於平板等所適用之基座30的上表面。 [Pattern making device] 〔the whole frame〕 FIG. 3 is an overall configuration diagram of the pattern manufacturing device 10 . The pattern manufacturing apparatus 10 is an apparatus for forming the conductive pattern 1020 on the component mounting surface 1004 of the printed wiring board 1002 formed by forming the insulating pattern 1024 . As shown in FIG. 3 , the pattern manufacturing device 10 includes a liquid discharge head 12 , a camera 13 , a head support member 14 , a transfer device 20 , and a base 30 . The head supporting member 14 and the transport device 20 are disposed on the upper surface of a base 30 to which a flat plate or the like is applied.

液體吐出頭12吐出導電油墨。導電油墨為“導電性液體”的一例，係將導電性材料分散於溶劑中而成之油墨。導電性材料例如為銀或銅等金屬奈米粒子。藉由導電油墨在基材上所形成之導電圖案能夠導電。The liquid discharge head 12 discharges conductive ink. Conductive ink is an example of "conductive liquid", which is an ink made by dispersing a conductive material in a solvent. The conductive material is, for example, metal nanoparticles such as silver or copper. The conductive pattern formed on the substrate by the conductive ink can conduct electricity.

液體吐出頭12具備複數個頭模40。圖4係1個頭模40的立體圖。頭模40具備L型支架42、矽晶片44、油墨供給路徑46、油墨回收路徑48及過濾器殼體50。The liquid discharge head 12 includes a plurality of head molds 40 . FIG. 4 is a perspective view of a headform 40 . The headform 40 includes an L-shaped bracket 42 , a silicon wafer 44 , an ink supply path 46 , an ink recovery path 48 and a filter case 50 .

L型支架42為用於將頭模40固定在頭支撐構件14的構件。The L-shaped bracket 42 is a member for fixing the headform 40 to the head supporting member 14 .

矽晶片44具備與藉由輸送裝置20輸送之印刷配線基板1002相對向之噴嘴面60。圖5為矽晶片44的噴嘴面60的俯視圖。噴嘴面60為具有沿相對於X方向具有角度β的傾斜之V方向之長邊側的端面、及沿相對於相當於基板輸送方向之Y方向具有角度α傾斜之W方向之短邊側的端面之平行四邊形的平面形狀。The silicon wafer 44 has a nozzle surface 60 facing the printed wiring board 1002 conveyed by the conveyance device 20 . FIG. 5 is a top view of the nozzle face 60 of the silicon wafer 44 . The nozzle surface 60 has an end surface on the long side in the V direction inclined at an angle β with respect to the X direction, and an end surface on the short side in the W direction inclined at an angle α with respect to the Y direction corresponding to the substrate transport direction. The plane shape of a parallelogram.

噴嘴面60包括分別具有複數個噴嘴62且依據Y方向（“相對移動方向”的一例）上的噴嘴62的位置分割而成之複數個噴嘴區域。在圖5所示之例中，噴嘴面60包括上游側噴嘴區域64A、及下游側噴嘴區域64B。The nozzle surface 60 includes a plurality of nozzle regions each having a plurality of nozzles 62 and divided according to the positions of the nozzles 62 in the Y direction (an example of the “relative movement direction”). In the example shown in FIG. 5 , the nozzle surface 60 includes an upstream nozzle area 64A and a downstream nozzle area 64B.

在上游側噴嘴區域64A及下游側噴嘴區域64B中，複數個噴嘴62分別二維矩陣配置在沿V方向之行方向、及沿W方向之列方向上。在圖5所示之例中，從第1行至第16行的噴嘴62配置在上游側噴嘴區域64A中，從第17行至第32行的噴嘴62配置在下游側噴嘴區域64B中。又，每行中配置有64個噴嘴62。因此，在噴嘴面60上合計配置有32行×64列=2048個噴嘴62。In the upstream nozzle region 64A and the downstream nozzle region 64B, the plurality of nozzles 62 are arranged in a two-dimensional matrix in the row direction along the V direction and the column direction along the W direction, respectively. In the example shown in FIG. 5 , the nozzles 62 in the first to sixteenth rows are arranged in the upstream nozzle area 64A, and the nozzles 62 in the seventeenth to thirty-second rows are arranged in the downstream nozzle area 64B. Also, 64 nozzles 62 are arranged in each row. Therefore, a total of 32 rows×64 columns=2048 nozzles 62 are arranged on the nozzle surface 60 .

二維矩陣配置中之將各噴嘴62沿X方向投影之投影噴嘴列能夠認為係與在X方向上各噴嘴62以達成最大記錄解析度之噴嘴密度以大致等間隔排列之一列噴嘴列等價。若考慮投影噴嘴列，則能夠將表示噴嘴位置之噴嘴編號以沿X方向排列之投影噴嘴的排序對應於各噴嘴。關於液體吐出頭12的投影噴嘴列，上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62交替排列。亦即，上游側噴嘴區域64A的噴嘴62的噴嘴編號為奇數，下游側噴嘴區域64B的噴嘴62的噴嘴編號為偶數。In the two-dimensional matrix arrangement, the projected nozzle row in which the nozzles 62 are projected in the X direction can be considered to be equivalent to a nozzle row in which the nozzles 62 are arranged at substantially equal intervals in the X direction at a nozzle density to achieve the maximum recording resolution. Considering the projection nozzle row, the nozzle numbers indicating the nozzle positions can be associated with each nozzle in the order of the projection nozzles arranged in the X direction. Regarding the projection nozzle row of the liquid discharge head 12 , the nozzles 62 in the upstream nozzle area 64A and the nozzles 62 in the downstream nozzle area 64B are alternately arranged. That is, the nozzle numbers of the nozzles 62 in the upstream nozzle area 64A are odd numbers, and the nozzle numbers of the nozzles 62 in the downstream nozzle area 64B are even numbers.

再者，大致等間隔係指，在圖案製造裝置10中，作為能夠形成圖案的滴點實際上為等間隔。例如，即使在考慮製造上的誤差、及由著陸干擾引起之媒體上的液滴的移動的至少任一者而包括稍微間隔不同等的情況下，亦包括在等間隔的概念中。投影噴嘴列相當於實際上的噴嘴列。It should be noted that substantially equal intervals mean that, in the pattern manufacturing apparatus 10 , droplet dots capable of forming a pattern are substantially equally spaced. For example, even if a slightly different interval is included in consideration of at least any one of manufacturing errors and movement of droplets on the medium due to landing disturbance, it is included in the concept of equal intervals. The projected nozzle row corresponds to the actual nozzle row.

液體吐出頭12使導電油墨分別從複數個噴嘴62吐出。複數個噴嘴62能夠分別吐出複數尺寸的油墨，且能夠配置複數尺寸的墨點。液體吐出頭12的吐出方式為利用壓電元件的撓曲變形對導電油墨進行加壓，使導電油墨吐出之壓電方式。液體吐出頭12的吐出方式亦可以為使用加熱器對導電油墨進行加熱，利用導電油墨的膜沸騰現象使導電油墨吐出之熱方式。再者，吐出包括噴射、塗佈及流下等的含義。The liquid discharge head 12 discharges the conductive ink from the plurality of nozzles 62 respectively. The plurality of nozzles 62 can respectively discharge inks of a plurality of sizes, and can arrange ink dots of a plurality of sizes. The discharge method of the liquid discharge head 12 is a piezoelectric method in which the conductive ink is pressurized by flexural deformation of the piezoelectric element to discharge the conductive ink. The discharge method of the liquid discharge head 12 may also be a thermal method in which the conductive ink is heated using a heater and the conductive ink is discharged by utilizing the film boiling phenomenon of the conductive ink. In addition, spouting includes the meaning of spraying, coating, flowing down, and the like.

返回到圖4的說明，油墨供給路徑46與其他頭模40的油墨供給路徑46一同經由未圖示的供給泵與未圖示的油墨槽連接。供給泵向油墨供給路徑46的內部油墨施加壓力，將儲存於油墨槽之油墨供給到頭模40。Returning to the description of FIG. 4 , the ink supply path 46 is connected to an ink tank (not shown) via a supply pump (not shown), together with ink supply paths 46 of other head dies 40 . The supply pump applies pressure to the ink inside the ink supply path 46 and supplies the ink stored in the ink tank to the head die 40 .

油墨回收路徑48與其他頭模40的油墨回收路徑48一同經由未圖示的回收泵與油墨槽連接。回收泵向油墨回收路徑48的內部油墨施加壓力，將供給至頭模40之油墨回收到油墨槽中。The ink recovery path 48 is connected to an ink tank through a recovery pump (not shown) together with the ink recovery paths 48 of other head dies 40 . The recovery pump applies pressure to the ink inside the ink recovery path 48, and recovers the ink supplied to the head die 40 into the ink tank.

過濾器殼體50收納用於去除在頭模40內部的油墨中所含有之異物等的過濾器。The filter case 50 accommodates a filter for removing foreign matter and the like contained in the ink inside the head die 40 .

返回到圖3的說明中，照相機13用於拍攝設置於印刷配線基板1002上之對準標記1005。照相機13具備未圖示的光源、未圖示的攝像元件及未圖示的觀察光學系統。照相機13亦可以係線上感測器。Returning to the description of FIG. 3 , the camera 13 is used to photograph the alignment mark 1005 provided on the printed wiring board 1002 . The camera 13 includes a not-shown light source, a not-shown imaging element, and a not-shown observation optical system. The camera 13 can also be a tethered sensor.

頭支撐構件14固定支撐液體吐出頭12及照相機13。頭支撐構件14將複數個頭模40分別向X方向排列，藉由L型支架42分別將噴嘴面60朝向-Z方向進行固定支撐。其中，頭支撐構件14將上游側噴嘴區域64A配置於基板輸送方向上之上游側（-Y方向側），將下游側噴嘴區域64B配置於下游側（Y方向側）而固定支撐各頭模40。液體吐出頭12成為藉由沿X方向排列配置複數個頭模40，沿超過印刷配線基板1002的整個寬度之長度配置複數個噴嘴62之線型頭。The head support member 14 fixedly supports the liquid discharge head 12 and the camera 13 . The head support member 14 arranges a plurality of head molds 40 in the X direction, respectively, and fixes and supports the nozzle surfaces 60 in the −Z direction by the L-shaped brackets 42 . Among them, the head supporting member 14 arranges the upstream nozzle area 64A on the upstream side (-Y direction side) in the substrate conveyance direction, and arranges the downstream side nozzle area 64B on the downstream side (Y direction side) to fixedly support each head mold 40 . The liquid ejection head 12 is a line head in which a plurality of head molds 40 are arranged in a row along the X direction, and a plurality of nozzles 62 are arranged along a length exceeding the entire width of the printed wiring board 1002 .

又，頭支撐構件14將觀察光學系統朝著-Z方向固定支撐照相機13。照相機13配置於比液體吐出頭12更靠基板輸送方向上之下游側（Y方向側），藉此利用液體吐出頭12進行印刷之後能夠觀察印刷配線基板1002。頭支撐構件14具備在保持液體吐出頭12及照相機13的一定的位置關係之狀態下，調整液體吐出頭12的X方向及Y方向的位置之未圖示的頭位置調整機構。Also, the head support member 14 fixes and supports the camera 13 with the observation optical system facing the −Z direction. The camera 13 is disposed on the downstream side (Y direction side) of the liquid discharge head 12 in the board conveyance direction, whereby the printed wiring board 1002 can be observed after printing with the liquid discharge head 12 . The head support member 14 includes a head position adjustment mechanism (not shown) for adjusting the positions of the liquid discharge head 12 in the X direction and the Y direction while maintaining a constant positional relationship between the liquid discharge head 12 and the camera 13 .

輸送裝置20（“相對移動機構”的一例）沿Y方向輸送印刷配線基板1002（“相對移動”的一例）。輸送裝置20具備支撐印刷配線基板1002之工作台22、及沿Y方向移動工作台22之移動機構24。The conveyance device 20 (an example of a "relative movement mechanism") conveys the printed wiring board 1002 (an example of a "relative movement") in the Y direction. The conveyance apparatus 20 is provided with the table 22 which supports the printed wiring board 1002, and the moving mechanism 24 which moves the table 22 to a Y direction.

工作台22具備固定印刷配線基板1002之固定機構。固定機構可以機械地固定印刷配線基板1002，亦可以藉由對印刷配線基板1002施加負壓來吸附而固定。The table 22 has a fixing mechanism for fixing the printed wiring board 1002 . The fixing mechanism can fix the printed wiring board 1002 mechanically, or can be fixed by applying negative pressure to the printed wiring board 1002 to attract and fix it.

工作台22可以具備調整印刷配線基板1002與液體吐出頭12之間的Z方向的距離之調整機構。工作台22亦可以具備調整印刷配線基板1002的X方向位置之調整機構。The table 22 may include an adjustment mechanism for adjusting the distance in the Z direction between the printed wiring board 1002 and the liquid discharge head 12 . The stage 22 may be equipped with the adjustment mechanism which adjusts the X direction position of the printed wiring board 1002.

在移動機構24中，滾珠螺桿驅動機構及皮帶驅動機構等與馬達的旋轉軸連結。移動機構24亦可以具備線性馬達。In the moving mechanism 24 , a ball screw drive mechanism, a belt drive mechanism, and the like are connected to the rotation shaft of the motor. The moving mechanism 24 may also include a linear motor.

圖案製造裝置10可以相對於位置被固定之液體吐出頭12將印刷配線基板1002沿Y方向移動，但相對於位置被固定之印刷配線基板1002，將液體吐出頭12沿-Y方向移動。又，圖案製造裝置10可以使印刷配線基板1002沿Y方向，使液體吐出頭12沿-Y方向移動。The pattern manufacturing apparatus 10 can move the printed circuit board 1002 in the Y direction with respect to the liquid discharge head 12 whose position is fixed, but can move the liquid discharge head 12 in the -Y direction with respect to the printed circuit board 1002 with the fixed position. In addition, the pattern manufacturing apparatus 10 can move the printed wiring board 1002 in the Y direction and the liquid discharge head 12 in the −Y direction.

〔圖案製造裝置的電氣結構〕 圖6係表示圖案製造裝置10的電氣結構之功能框圖。如圖6所示，圖案製造裝置10具備：系統控制部70、資料獲取部72、資料處理部74、頭控制部76、照相機控制部77、輸送控制部78及記憶體79。 [Electrical structure of the pattern making device] FIG. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing device 10 . As shown in FIG. 6 , the pattern manufacturing apparatus 10 includes a system control unit 70 , a data acquisition unit 72 , a data processing unit 74 , a head control unit 76 , a camera control unit 77 , a transport control unit 78 and a memory 79 .

系統控制部70向資料獲取部72、資料處理部74、頭控制部76、照相機控制部77及輸送控制部78發送指令訊號，統括控制圖案製造裝置10的動作。The system control unit 70 sends command signals to the data acquisition unit 72 , data processing unit 74 , head control unit 76 , camera control unit 77 and transport control unit 78 to collectively control the operation of the pattern manufacturing device 10 .

資料獲取部72例如從主機電腦等未圖示的外部裝置，獲取包括用於形成導電圖案1020的導電圖案資料之各種資料。The data acquisition unit 72 acquires various data including conductive pattern data for forming the conductive pattern 1020 from an external device (not shown) such as a host computer, for example.

資料處理部74對由資料獲取部72獲取之各種資料實施處理。資料處理部74從導電圖案資料生成導電油墨的吐出資料。亦即，資料處理部74對導電圖案資料實施半色調處理等的圖像處理，生成規定有與導電圖案對應之點的位置、及點的尺寸之吐出資料。The data processing unit 74 processes various data acquired by the data acquisition unit 72 . The data processing unit 74 generates discharge data of conductive ink from the conductive pattern data. That is, the data processing unit 74 performs image processing such as halftone processing on the conductive pattern data, and generates discharge data in which the positions and sizes of dots corresponding to the conductive patterns are specified.

頭控制部76依據與導電圖案對應之吐出資料，控制液體吐出頭12的噴嘴62的吐出。又，頭控制部76依據後述之對準標記1005的讀取結果控制未圖示的頭位置調整機構，預先調整液體吐出頭12的位置。The head control unit 76 controls the discharge from the nozzles 62 of the liquid discharge head 12 based on the discharge data corresponding to the conductive pattern. Furthermore, the head control unit 76 controls a head position adjustment mechanism (not shown) based on the reading result of the alignment mark 1005 described later, and adjusts the position of the liquid discharge head 12 in advance.

照相機控制部77控制照相機13的動作。照相機控制部77例如使照相機13讀取印刷配線基板1002的對準標記1005（參閱圖1），從照相機13獲取讀取結果。The camera control unit 77 controls the operation of the camera 13 . For example, the camera control unit 77 causes the camera 13 to read the alignment mark 1005 (see FIG. 1 ) of the printed wiring board 1002 , and acquires the reading result from the camera 13 .

輸送控制部78控制輸送裝置20的動作。The transport control unit 78 controls the operation of the transport device 20 .

記憶體79儲存使用於圖案製造裝置10的控制之各種資料、各種參數及各種程式等。系統控制部70適用儲存於記憶體79之各種參數等，實施圖案製造裝置10的各部控制。The memory 79 stores various data, various parameters, various programs, and the like used in the control of the pattern manufacturing apparatus 10 . The system control unit 70 applies various parameters and the like stored in the memory 79 to control each unit of the pattern manufacturing apparatus 10 .

〔圖案製造裝置的硬體的結構〕 圖7係表示圖案製造裝置10的硬體的結構例之框圖。圖案製造裝置10具備：控制裝置80、輸入裝置92及顯示裝置94。 [Structure of the hardware of the pattern making device] FIG. 7 is a block diagram showing a configuration example of hardware of the pattern manufacturing device 10 . The pattern manufacturing device 10 includes a control device 80 , an input device 92 , and a display device 94 .

電腦適用於控制裝置80。電腦為伺服器、個人電腦、工作站或平板終端等。控制裝置80具備：處理器82、電腦可讀媒體84、通訊介面86、輸入/輸出介面88及匯流排90。A computer is suitable for controlling the device 80 . The computer is a server, a personal computer, a workstation or a tablet terminal and the like. The control device 80 includes: a processor 82 , a computer readable medium 84 , a communication interface 86 , an input/output interface 88 and a bus 90 .

處理器82執行儲存於電腦可讀媒體84之命令。處理器82的硬體結構為如下所示各種處理器（processor）。在各種處理器中，包括專用電路等，該專用電路為具有專門設計之電路結構之處理器，該電路結構用於在製造執行軟體（程式）並用作各種功能部之通用的處理器亦即CPU（Central Processing Unit：中央處理單元）、專用於圖像處理之處理器亦即GPU（Graphics Processing Unit：圖案處理單元）、FPGA（Field Programmable Gate Array：場域可程式閘陣列）等之後執行能夠變更電路結構的處理器亦即PLD（Programmable Logic Device：可程式化邏輯裝置）、ASIC（Application Specific Integrated Circuit：特殊應用積體電路）等的特定處理。Processor 82 executes instructions stored on computer readable medium 84 . The hardware configuration of the processor 82 includes various processors as shown below. Among various processors, special-purpose circuits are included. The special-purpose circuit is a processor with a specially designed circuit structure. (Central Processing Unit: Central Processing Unit), a processor dedicated to image processing, that is, GPU (Graphics Processing Unit: pattern processing unit), FPGA (Field Programmable Gate Array: Field Programmable Gate Array), etc., can be changed after execution The processor of the circuit structure is the specific processing of PLD (Programmable Logic Device: Programmable Logic Device), ASIC (Application Specific Integrated Circuit: Application Specific Integrated Circuit), etc.

1個處理部可以由該等各種處理器中的1個構成，亦可以由同種類或不同種類的2個以上的處理器（例如複數個FPGA、或CPU與FPGA的組合、或者CPU與GPU的組合）構成。又，可以由1個處理器構成複數個功能部。作為由1個處理器構成複數個功能部之例，第1，係為了以用戶端或伺服器等的電腦為代表，由1個以上的CPU與軟體的組合構成1個處理器，該處理器用作複數個功能部之形態。第2，係為了以SoC（System On Chip）等為代表，使用由1個IC（Integrated Circuit）晶片實現包括複數個功能部之系統整體的功能之處理器之形態。如此，各種功能部作為硬體結構，使用1個以上上述各種處理器而構成。One processing unit may be composed of one of these various processors, or may be composed of two or more processors of the same type or different types (such as a plurality of FPGAs, or a combination of CPU and FPGA, or a combination of CPU and GPU). combination) composition. Also, a plurality of functional units may be constituted by one processor. As an example of a plurality of functional units constituted by one processor, firstly, for a computer such as a client or a server, a processor is constituted by a combination of one or more CPUs and software, and the processor uses Form of multiple functional parts. The second is to use a single IC (Integrated Circuit) chip, represented by a SoC (System On Chip), to realize the functions of the entire system including a plurality of functional parts. In this way, the various functional units are configured using one or more of the above-mentioned various processors as a hardware configuration.

此外，更具體而言，該等各種處理器的硬體結構為組合半導體元件等的電路元件而成之電路（circuitry）。Moreover, more specifically, the hardware structure of these various processors is a circuit (circuitry) which combines circuit elements, such as a semiconductor element.

處理器82經由匯流排90與電腦可讀媒體84、通訊介面86、及輸入/輸出介面88連接。The processor 82 is connected to the computer readable medium 84 , the communication interface 86 , and the input/output interface 88 via the bus 90 .

電腦可讀媒體84儲存用於使處理器82執行的命令。電腦可讀媒體84包括未圖示的RAM（Random Access Memory：隨機存取記憶體）及ROM（Read Only Memory：唯讀記憶體）。又，電腦可讀媒體84亦可以包括硬碟等磁性記憶媒體、CD(Compact Disc：小型光碟)-ROM等光碟、及USB(Universal Serial Bus：通用序列匯流排)記憶體等半導體記憶體。電腦可讀媒體84亦可以作為圖6所示之記憶體79。Computer readable medium 84 stores instructions for execution by processor 82 . The computer-readable medium 84 includes RAM (Random Access Memory: Random Access Memory) and ROM (Read Only Memory), not shown. In addition, the computer-readable medium 84 may include magnetic storage media such as hard disks, optical disks such as CD (Compact Disc)-ROM, and semiconductor memories such as USB (Universal Serial Bus: Universal Serial Bus) memory. The computer readable medium 84 can also serve as the memory 79 shown in FIG. 6 .

電腦可讀媒體84儲存包括1個以上的命令之圖案製造程式85。圖案製造程式85可以藉由電腦的可讀取的非暫時性的記憶媒體提供。又，圖案製造程式85可以作為能夠從外部的伺服器下載的應用程式來提供。The computer-readable medium 84 stores the pattern creation program 85 including one or more commands. The pattern creation program 85 can be provided by a computer-readable non-transitory storage medium. Also, the pattern creation program 85 may be provided as an application program that can be downloaded from an external server.

電腦可讀媒體84儲存各種資料及各種參數等。處理器82將電腦可讀媒體84的RAM作為作業區域執行圖案製造程式85，且藉由使用儲存於電腦可讀媒體84之資料及參數，執行圖案製造裝置10的各種處理。The computer-readable medium 84 stores various data, various parameters, and the like. The processor 82 executes the pattern making program 85 using the RAM of the computer readable medium 84 as a work area, and executes various processes of the pattern making device 10 by using the data and parameters stored in the computer readable medium 84 .

通訊介面86經由未圖示的綱路以能夠通訊的方式將控制裝置80連接於外部裝置。綱路例如為LAN（Local Area Network）。The communication interface 86 connects the control device 80 to an external device in a communicable manner via a not-shown path. The route is, for example, LAN (Local Area Network).

輸入/輸出介面88將控制裝置80與輸入裝置92及顯示裝置94連接。輸入裝置92例如為鍵盤、滑鼠、多點觸控面板、其他的指向裝置、或該等的組合等。顯示裝置94為液晶顯示、有機EL（Electro-Luminescence：電致發光）顯示、或投影機、或該等的組合等。在顯示裝置94中顯示與控制裝置80有關之各種資訊。The input/output interface 88 connects the control device 80 with an input device 92 and a display device 94 . The input device 92 is, for example, a keyboard, a mouse, a multi-touch panel, other pointing devices, or a combination thereof. The display device 94 is a liquid crystal display, an organic EL (Electro-Luminescence: electroluminescence) display, a projector, or a combination thereof. Various information related to the control device 80 is displayed on the display device 94 .

[課題的說明] 近年來，電氣製品小型化之結果，印刷基板上的電氣組件趨向於高密度安裝，在塗佈導電油墨形成導電圖案的情況下，特別是確保導電圖案的尺寸精度及端部的描繪位置精度成為課題。 [explanation of problem] In recent years, as a result of the miniaturization of electrical products, electrical components on printed circuit boards tend to be mounted at high density. In the case of coating conductive ink to form conductive patterns, it is especially important to ensure the dimensional accuracy of the conductive pattern and the accuracy of the drawing position of the end. topic.

在圖1所示之印刷配線基板1002上形成導電圖案的情況下，若導電圖案的尺寸大於預期尺寸，則導電油墨附著於不必要的部分，而有可能產生電路短路。例如，導電圖案的尺寸精度有時要求在100μm的誤差範圍內。在導電圖案的形成中利用噴墨方式的液體吐出頭的情況下，藉由後述之頭內的特性偏差的影響及描繪位置調整的誤差的影響，難以確保導電圖案的精度。In the case of forming a conductive pattern on the printed wiring board 1002 shown in FIG. 1 , if the size of the conductive pattern is larger than expected, conductive ink may adhere to unnecessary parts, which may cause a short circuit. For example, the dimensional accuracy of the conductive pattern is sometimes required to be within an error range of 100 μm. When an inkjet type liquid ejection head is used to form a conductive pattern, it is difficult to ensure the accuracy of the conductive pattern due to the influence of characteristic variations in the head and the influence of errors in drawing position adjustment described later.

以下，考慮在液體吐出頭12中的一定印刷區域形成導電圖案之情況。Hereinafter, a case where a conductive pattern is formed in a certain printing area in the liquid discharge head 12 will be considered.

圖8係表示在理想的液體吐出頭12中在基材的Y方向具有尺寸S之印刷區域形成導電圖案之情況的點配置之圖。在圖8中，將藉由來自上游側噴嘴區域64A的噴嘴62的油墨的吐出所配置之墨點由相對農的影線表示，將藉由來自下游側噴嘴區域64B的噴嘴62的油墨的吐出所配置之墨點由相對淡的影線表示。FIG. 8 is a diagram showing a dot arrangement in a case where a conductive pattern is formed in a printed area having a dimension S in the Y direction of the substrate in an ideal liquid discharge head 12 . In FIG. 8 , ink dots arranged by ejection of ink from the nozzles 62 of the upstream nozzle area 64A are indicated by opposite hatching, and ink dots arranged by ejection of ink from the nozzles 62 of the downstream nozzle area 64B are shown by opposite hatching. The deployed ink dots are indicated by relatively light hatching.

如前所述，在液體吐出頭12中，上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62在投影噴嘴列中沿X方向交替排列。因此，如圖8所示，藉由上游側噴嘴區域64A的噴嘴62所配置之墨點及藉由下游側噴嘴區域64B的噴嘴62所配置之墨點沿X方向交替配置。又，藉由上游側噴嘴區域64A的噴嘴62所配置之墨點及藉由下游側噴嘴區域64B的噴嘴62所配置之墨點分別在Y方向上的位置一致。如此，依據理想的液體吐出頭12，能夠形成所期望的尺寸亦即Y方向上尺寸S的導電圖案。As described above, in the liquid discharge head 12 , the nozzles 62 in the upstream nozzle region 64A and the nozzles 62 in the downstream nozzle region 64B are alternately arranged in the X direction in the projection nozzle row. Therefore, as shown in FIG. 8 , the ink dots arranged by the nozzles 62 of the upstream nozzle area 64A and the ink dots arranged by the nozzles 62 of the downstream nozzle area 64B are alternately arranged in the X direction. In addition, the positions in the Y direction of the ink dots arranged in the nozzles 62 of the upstream nozzle area 64A and the ink dots arranged in the nozzles 62 of the downstream nozzle area 64B are the same. In this way, depending on the ideal liquid discharge head 12 , it is possible to form a conductive pattern having a desired size, that is, a size S in the Y direction.

然而，液體吐出頭12有時藉由矽晶片44的製造上的偏差，在頭內的特性上具有偏差。其中，對使用在上游側噴嘴區域64A及下游側噴嘴區域64B的特性上具有偏差之液體吐出頭12之例進行說明。再者，為了便於討論，對相同噴嘴區域內的各噴嘴62的特性偏差不進行討論。However, the liquid ejection head 12 may have variations in characteristics within the head due to variations in the manufacture of the silicon wafer 44 . Here, an example of using the liquid discharge head 12 having variations in the characteristics of the upstream nozzle region 64A and the downstream nozzle region 64B will be described. In addition, for convenience of discussion, the characteristic variation of each nozzle 62 in the same nozzle area will not be discussed.

圖9係表示在頭內具有特性偏差之液體吐出頭12中在基材的Y方向具有尺寸S之印刷區域形成導電圖案之情況的點配置之圖。在圖9中，與圖8相同地，將藉由來自上游側噴嘴區域64A的噴嘴62的油墨的吐出所配置之墨點由相對農的影線表示，將藉由來自下游側噴嘴區域64B的噴嘴62的油墨的吐出所配置之墨點由相對淡的影線表示。在如圖9所示例中，藉由上游側噴嘴區域64A的噴嘴62所配置之墨點及藉由下游側噴嘴區域64B的噴嘴62所配置之墨點在Y方向上的位置偏移ΔS，其結果，形成有比所期望的尺寸亦即Y方向上的尺寸S的導電圖案大ΔS的導電圖案。9 is a diagram showing a dot arrangement in a case where a conductive pattern is formed in a printed area having a dimension S in the Y direction of a base material in a liquid discharge head 12 having characteristic variation within the head. In FIG. 9 , similar to FIG. 8 , ink dots arranged by ejection of ink from the nozzles 62 of the upstream nozzle area 64A are indicated by opposite hatching, and ink dots arranged by ejection of the ink from the nozzle area 64B on the downstream side are shown by opposite hatching. Ink dots arranged to discharge ink from the nozzles 62 are indicated by relatively light hatching. In the example shown in FIG. 9 , the positions of the ink dots disposed by the nozzles 62 of the upstream nozzle area 64A and the ink dots disposed by the nozzles 62 of the downstream nozzle area 64B are displaced by ΔS in the Y direction, which is ΔS. As a result, a conductive pattern larger by ΔS than a desired size, that is, a size S in the Y direction, is formed.

產生該種問題的理由有複數個。藉由原本複數個噴嘴區域的各噴嘴區域，油墨滴速度及油墨滴體積等的吐出特性不同，因此在著陸中產生偏差。亦可以考慮調整吐出特性，但在現實中，由於產生調整誤差而難以使吐出特性均勻化，且作業費時費力。There are several reasons for such a problem. Originally, discharge characteristics such as ink droplet velocity and ink droplet volume are different in each of the plurality of nozzle areas, and therefore variations occur in landing. It is also conceivable to adjust the discharge characteristics, but in reality, it is difficult to make the discharge characteristics uniform due to adjustment errors, and the work is time-consuming and laborious.

又，關於相對於基材的移動的液體吐出頭12的吐出定時的產生，雖使用未圖示的編碼器等進行校正，但必然產生誤差，位於物理上分離之位置的噴嘴62側的其誤差容易變大。In addition, although the discharge timing of the liquid discharge head 12 relative to the movement of the substrate is corrected using an encoder not shown, an error will inevitably occur, and the error on the nozzle 62 side located at a physically separated position Easy to get bigger.

此外，偏離的形狀與圖9所示之例不同，但有時與基材的移動方向正交之方向（X方向）上產生偏差。例如，基材在輸送時多少存在彎曲，因此這亦是位於物理上分離之位置的噴嘴62側的其誤差容易變大。In addition, although the shape of the deviation is different from the example shown in FIG. 9 , deviation may occur in the direction (X direction) perpendicular to the moving direction of the substrate. For example, since the substrate is somewhat warped during conveyance, the error tends to be large on the side of the nozzle 62 located at a physically separated position.

[實施形態之導電圖案] 在本實施形態中，為了確保導電圖案的形成精度，藉由液體吐出頭12的上游側噴嘴區域64A及下游側噴嘴區域64B（“複數個噴嘴區域”的一例）中的任一者的噴嘴區域（“特定的噴嘴區域”的一例）的噴嘴62，配置形成導電圖案的邊界區域之墨點。 [Conductive Pattern of Embodiment] In this embodiment, in order to ensure the formation accuracy of the conductive pattern, the nozzle area of any one of the upstream side nozzle area 64A and the downstream side nozzle area 64B (an example of "plurality of nozzle areas") of the liquid discharge head 12 In the nozzles 62 (an example of a "specific nozzle area"), ink dots in a boundary area forming a conductive pattern are arranged.

圖10係表示形成基材100表面的導電圖案之印刷區域102及與印刷區域102不同之非印刷區域104之圖。印刷區域102為在X方向具有S X的尺寸，在Y方向具有S Y的尺寸之一定面積的區域。印刷區域102具有與非印刷區域104的邊界102A。又，印刷區域102具有包括邊界102A之邊界區域102B、及除邊界區域102B以外之非邊界區域102C。圖10所示之邊界區域102B為從邊界102A向內側一個墨點（1像素量）為止的區域。 FIG. 10 is a diagram showing a printed area 102 forming a conductive pattern on the surface of a substrate 100 and a non-printed area 104 different from the printed area 102 . The printing area 102 is a region having a size of S X in the X direction and a size of S Y in the Y direction. Printed area 102 has a boundary 102A with non-printed area 104 . Furthermore, the printing area 102 has a border area 102B including the border 102A, and a non-border area 102C other than the border area 102B. The boundary area 102B shown in FIG. 10 is an area extending one ink dot (one pixel) inward from the boundary 102A.

圖11係表示藉由圖案製造裝置10形成於印刷區域102之導電圖案之圖。在圖11中，將藉由來自上游側噴嘴區域64A的噴嘴62的油墨的吐出所配置之墨點110A由相對農的影線表示，將藉由來自下游側噴嘴區域64B的噴嘴62的油墨的吐出所配置之墨點110B由相對淡的影線表示。如圖11所示，藉由上游側噴嘴區域64A的噴嘴62在印刷區域102的邊界區域102B配置墨點110A。另一方面，藉由上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62在非邊界區域102C配置墨點110A及墨點110B。FIG. 11 is a diagram showing a conductive pattern formed in the printing area 102 by the pattern manufacturing device 10 . In FIG. 11 , the ink dot 110A arranged by the ejection of the ink from the nozzle 62 of the nozzle area 64A on the upstream side is represented by the opposite hatching, and the ink dot 110A arranged by the ink from the nozzle 62 of the nozzle area 64B on the downstream side is shown by the opposite hatching. The ink dots 110B that are ejected are indicated by relatively light hatching. As shown in FIG. 11 , the ink dots 110A are arranged in the boundary area 102B of the printing area 102 by the nozzles 62 of the upstream nozzle area 64A. On the other hand, the ink dots 110A and 110B are arranged in the non-boundary area 102C by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.

藉由如此配置墨點，關於導電圖案的尺寸在噴嘴區域之間沒有誤差，因此能夠形成精確的導電圖案。在此，將圖案的邊界區域102B設為1像素量，但依據噴嘴區域間的特性偏差亦可以為2像素量以上。又，在此在邊界區域102B的四方設置了印刷區域102，但可以在至少一側上設置邊界區域102B。By arranging the ink dots in this way, there is no error between nozzle areas with respect to the size of the conductive pattern, and thus a precise conductive pattern can be formed. Here, the boundary region 102B of the pattern is set to be 1 pixel, but it may be 2 pixels or more depending on the characteristic variation between nozzle regions. Also, here, the printing area 102 is provided on four sides of the border area 102B, but the border area 102B may be provided on at least one side.

在邊界區域102B配置墨點，只要係上游側噴嘴區域64A及下游側噴嘴區域64B中的任一者的噴嘴區域的噴嘴62即可，如圖11所示，使用上游側噴嘴區域64A的噴嘴62為較佳。藉此，能夠抑制基材100表面的墨點間的著陸干擾。這是因為，從形成邊界區域102B之上游側噴嘴區域64A的噴嘴62吐出之油墨最先著陸，之後從下游側噴嘴區域64B吐出之油墨在周邊著陸，因此更加要求精度之邊界區域102B的油墨難以移動。Ink dots are arranged in the boundary area 102B, as long as they are the nozzles 62 of any one of the upstream nozzle area 64A and the downstream nozzle area 64B. As shown in FIG. 11 , the nozzles 62 of the upstream nozzle area 64A are used. is better. Thereby, landing interference between ink dots on the surface of the substrate 100 can be suppressed. This is because the ink ejected from the nozzle 62 forming the upstream nozzle area 64A of the boundary area 102B lands first, and then the ink ejected from the downstream nozzle area 64B lands on the periphery, so the ink in the boundary area 102B, which requires more precision, is difficult to move.

圖12係用於說明油墨的著陸干擾的圖，係基材100的側面圖。在圖12表示最先在基材100的表面著陸之墨點111A及在墨點111A之後著陸之墨點111B。之後著陸之墨點111B被最先著陸之墨點111A拉動，藉此向墨點111A的方向移動。因此，墨點111A的著陸位置的精度高於墨點111B之結果。因此，最先在邊界區域102B配置墨點，藉此能夠提高邊界區域102B的墨點位置的精度。FIG. 12 is a diagram for explaining ink landing disturbance, and is a side view of the substrate 100 . FIG. 12 shows an ink dot 111A that lands first on the surface of the substrate 100 and an ink dot 111B that lands after the ink dot 111A. The ink dot 111B that landed thereafter is pulled by the ink dot 111A that landed first, thereby moving in the direction of the ink dot 111A. Therefore, the accuracy of the landing position of the ink dot 111A is higher than that of the ink dot 111B. Therefore, by arranging ink dots in the boundary area 102B first, the accuracy of the position of the ink dots in the boundary area 102B can be improved.

為了更提高該效果，將用於提高對基材100的投錨效果且包括抑制導電油墨的濕擴散之功能性材料之預處理液預先塗佈於基材100（“預處理液塗佈步驟”的一例）為較佳。藉由著陸於基材100的表面之油墨與塗佈於基材的表面之預處理液的化學反應，使油墨成分中與預處理液反應之成分迅速凝聚，進而能夠抑制著陸干擾。In order to further enhance this effect, a pretreatment solution for improving the anchoring effect on the substrate 100 and including a functional material that suppresses the wet diffusion of the conductive ink is pre-coated on the substrate 100 ("pretreatment solution coating step") One example) is preferred. Due to the chemical reaction between the ink landed on the surface of the substrate 100 and the pretreatment liquid coated on the surface of the substrate, the components of the ink components that react with the pretreatment liquid are rapidly aggregated, thereby suppressing landing disturbance.

再者，在圖11所示之例中，在非邊界區域102C配置有基於上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62的墨點，在邊界區域102B僅配置有基於上游側噴嘴區域64A的噴嘴62的墨點，並不配置有基於下游側噴嘴區域64B的噴嘴62之墨點。因此，關於邊界區域102B的墨點，基於下游側噴嘴區域64B的噴嘴62的墨點的程度墨點少，印刷區域102的墨點的總量少於在藉由上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62形成圖案之情況。Furthermore, in the example shown in FIG. 11 , the ink dots based on the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B are arranged in the non-boundary area 102C, and only the ink dots based on the upstream ink dots are arranged in the boundary area 102B. The ink dots of the nozzles 62 of the side nozzle area 64A are not arranged with the ink dots of the nozzles 62 of the downstream side nozzle area 64B. Therefore, regarding the ink dots in the boundary area 102B, the ink dots based on the ink dots of the nozzles 62 in the downstream nozzle area 64B are less, and the total amount of ink dots in the printing area 102 is smaller than that in the nozzles 62 of the upstream nozzle area 64A. And the case where the nozzle 62 of the downstream side nozzle area 64B forms a pattern.

因此，在非邊界區域102C以補充在邊界區域102B中墨點的減少的量的方式配置墨點為較佳。具體而言，藉由油墨滴種類的控制，增加墨點的尺寸（增加油墨量）為較佳。補充油墨量之位置為從邊界區域102B稍微靠近非邊界區域102C之位置（例如，非邊界區域102C中與邊界區域102B相鄰之區域）為較佳。藉由增加該種位置的油墨量，可以預想為增加之油墨在油墨量相對少的邊界區域102B自然擴散。Therefore, it is preferable to arrange the ink dots in the non-boundary area 102C so as to complement the decreased amount of ink dots in the boundary area 102B. Specifically, it is better to increase the size of the ink dot (increase the amount of ink) by controlling the type of the ink drop. It is preferable to replenish the amount of ink at a position slightly closer to the non-border area 102C from the border area 102B (for example, an area adjacent to the border area 102B in the non-border area 102C). By increasing the amount of ink in such a position, it can be expected that the increased ink will naturally spread in the boundary area 102B where the amount of ink is relatively small.

再者，為了使配置於邊界區域102B之墨點110A形成導電圖案的邊界，需要連接相互相鄰之墨點110A。亦即，需要設為連接相互相鄰之墨點110A之點尺寸。又，為了提高圖案描繪精度的效果，形成邊界區域102B之墨點為相同滴種（“同一尺寸”的一例）為較佳。藉此，不易受到滴種間的特性偏差的影響。Moreover, in order to make the ink dots 110A arranged in the boundary region 102B form the boundary of the conductive pattern, it is necessary to connect the ink dots 110A adjacent to each other. That is, it is necessary to set the dot size to connect ink dots 110A adjacent to each other. In addition, in order to enhance the effect of pattern drawing accuracy, it is preferable that the ink dots forming the boundary region 102B are of the same droplet type (an example of "same size"). This makes it less likely to be affected by variations in characteristics between species.

在本實施形態中，僅藉由液體吐出頭12的上游側噴嘴區域64A的噴嘴62，在印刷區域102的邊界區域102B配置墨點，但在邊界區域102B中實際上僅藉由上游側噴嘴區域64A的噴嘴62配置墨點即可。亦即，以起到即使液體吐出頭12的噴嘴區域存在特性偏差，亦能夠提高圖案的描繪精度等效果之程度，可以藉由下游側噴嘴區域64B的噴嘴62在邊界區域102B配置點。例如，配置於邊界區域102B之墨點的90%以上藉由上游側噴嘴區域64A的噴嘴62所配置即可，該情況包含於僅藉由上游側噴嘴區域64A的噴嘴62配置墨點之情況中。In this embodiment, ink dots are arranged in the boundary area 102B of the printing area 102 only by the nozzles 62 of the upstream nozzle area 64A of the liquid discharge head 12, but actually only the upstream nozzle area is used in the boundary area 102B. Nozzles 62 of 64A may be provided with ink dots. That is, dots can be arranged in the boundary area 102B by the nozzles 62 of the downstream side nozzle area 64B to the extent that the drawing accuracy of the pattern can be improved even if the characteristics of the nozzle areas of the liquid discharge head 12 vary. For example, more than 90% of the ink dots arranged in the boundary area 102B may be arranged by the nozzles 62 of the upstream nozzle area 64A, and this case is included in the case where ink dots are arranged only by the nozzles 62 of the upstream nozzle area 64A. .

[圖案製造方法] 圖13係表示基於圖案製造裝置10的圖案製造方法的各步驟之流程圖。圖案製造方法相當於印刷物的製造方法。印刷物包括電子裝置，電子裝置包括電氣組件安裝基板。圖案製造方法藉由處理器82執行圖案製造程式85（參閱圖7）來實現。在此，對在包括印刷配線基板1002的IC1006的上表面之印刷區域配置導電油墨的墨點形成導電圖案1020之例進行說明。 [pattern manufacturing method] FIG. 13 is a flow chart showing each step of the pattern manufacturing method by the pattern manufacturing device 10 . The pattern production method corresponds to the production method of printed matter. The printed matter includes an electronic device, and the electronic device includes an electrical component mounting substrate. The pattern manufacturing method is realized by the processor 82 executing the pattern manufacturing program 85 (refer to FIG. 7 ). Here, an example in which conductive pattern 1020 is formed by arranging ink dots of conductive ink in the printed area including the upper surface of IC 1006 of printed wiring board 1002 will be described.

在步驟S1中，資料獲取部72經由通訊介面86從未圖示的外部裝置獲取導電圖案資料。資料獲取部72可以從輸入裝置92獲取導電圖案資料，亦可以從電腦可讀媒體84獲取導電圖案資料。In step S1 , the data acquiring unit 72 acquires conductive pattern data from an external device not shown through the communication interface 86 . The data obtaining unit 72 can obtain the conductive pattern data from the input device 92 , and can also obtain the conductive pattern data from the computer readable medium 84 .

在步驟S2中，資料處理部74從在步驟S1中獲取之導電圖案資料生成導電油墨的吐出資料。In step S2, the data processing part 74 produces|generates the discharge data of a conductive ink from the conductive pattern data acquired in step S1.

最後，在步驟S3（“圖案形成步驟”的一例）中，頭控制部76及輸送控制部78按照在步驟S2中生成之吐出資料在印刷配線基板1002的印刷區域形成導電圖案。Finally, in step S3 (an example of the "pattern forming step"), the head control unit 76 and the conveyance control unit 78 form a conductive pattern on the printed area of the printed wiring board 1002 according to the discharge data generated in step S2.

圖14係表示步驟S3的導電圖案的形成步驟的詳細之流程圖。FIG. 14 is a flowchart showing the details of the step of forming the conductive pattern in step S3.

在步驟S11中，輸送控制部78控制輸送裝置20將印刷配線基板1002輸送至初始位置。初始位置係指，工作台22（印刷配線基板1002）配置於比頭支撐構件14（液體吐出頭12）更靠-Y方向側（輸送方向的上游側）之位置。In step S11 , the conveyance control unit 78 controls the conveyance device 20 to convey the printed wiring board 1002 to the initial position. The initial position means that the stage 22 (printed wiring board 1002 ) is arranged on the −Y direction side (upstream side in the transport direction) of the head supporting member 14 (liquid discharge head 12 ).

在步驟S12中，輸送控制部78將印刷配線基板1002向Y方向輸送。In step S12, the conveyance control part 78 conveys the printed wiring board 1002 to a Y direction.

在步驟S13中，液體吐出頭12對沿Y方向輸送之印刷配線基板1002吐出導電油墨。在此，頭控制部76藉由上游側噴嘴區域64A的噴嘴62在印刷區域中包括與和印刷區域不同之非印刷區域的邊界之邊界區域配置墨點。In step S13 , the liquid discharge head 12 discharges the conductive ink to the printed wiring board 1002 conveyed in the Y direction. Here, the head control unit 76 arranges ink dots in the printing area including the border area of the non-printing area different from the printing area by the nozzles 62 of the upstream nozzle area 64A.

若印刷配線基板1002的整體通過與液體吐出頭12相對向之位置，則在步驟S14中，輸送控制部78控制輸送裝置20將印刷配線基板1002向-Y方向輸送，並再次將印刷配線基板1002返回到初始位置。If the entire printed wiring board 1002 passes through the position facing the liquid discharge head 12, then in step S14, the transport control unit 78 controls the transport device 20 to transport the printed wiring board 1002 in the -Y direction, and then the printed wiring board 1002 is again Return to the initial position.

在步驟S15中，輸送控制部78再次將印刷配線基板1002向Y方向輸送。In step S15, the conveyance control part 78 conveys the printed wiring board 1002 to the Y direction again.

在步驟S16中，液體吐出頭12對沿Y方向輸送之印刷配線基板1002吐出油墨。在此，頭控制部76藉由上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62在印刷區域中除邊界區域以外的非邊界區域配置墨點。In step S16, the liquid discharge head 12 discharges ink to the printed wiring board 1002 conveyed in the Y direction. Here, the head control unit 76 arranges ink dots in the non-boundary area other than the boundary area in the printing area through the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.

藉此，能夠藉由上游側噴嘴區域64A的噴嘴62在邊界區域配置墨點，藉由上游側噴嘴區域64A的噴嘴62及下游側噴嘴區域64B的噴嘴62在非邊界區域配置墨點。又，藉由沿一個方向（在此為Y方向）複數次進行輸送，最先在邊界區域配置墨點，之後能夠在非邊界區域配置墨點。Thereby, ink dots can be arranged in the boundary area by the nozzles 62 of the upstream nozzle area 64A, and ink dots can be arranged in the non-boundary area by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B. Also, by carrying out multiple times of conveyance in one direction (here, the Y direction), ink dots can be arranged in the boundary area first, and then ink dots can be arranged in the non-boundary area.

再者，在步驟S13中，藉由上游側噴嘴區域64A的噴嘴62在印刷區域的整體配置墨點，在步驟S16中，可以藉由下游側噴嘴區域64B的噴嘴62在印刷區域中除邊界區域以外的非邊界區域配置墨點。又，在印刷配線基板1002的Y方向的1次輸送中，藉由上游側噴嘴區域64A的噴嘴62在印刷區域的整體配置墨點，且藉由下游側噴嘴區域64B的噴嘴62在印刷區域中除邊界區域以外的非邊界區域配置墨點，而可以完成導電圖案。Furthermore, in step S13, ink dots are arranged in the entire printing area by the nozzles 62 of the upstream nozzle area 64A, and in step S16, the boundary area can be removed in the printing area by the nozzles 62 of the downstream nozzle area 64B. Ink dots are arranged outside the non-boundary area. In addition, in one conveyance of the printed wiring board 1002 in the Y direction, ink dots are arranged in the entire printing area by the nozzles 62 of the upstream nozzle area 64A, and ink dots are arranged in the printing area by the nozzles 62 of the downstream nozzle area 64B. Ink dots are arranged in the non-border area other than the border area, and a conductive pattern can be completed.

圖15係表示圖案製造裝置10的噴嘴位置調整方法的各步驟之流程圖。噴嘴位置調整方法在可以改變在圖案製造裝置10的狀態的情況下實施。在可以改變圖案製造裝置10的狀態的情況係指，例如，在卸下液體吐出頭12的情況、在維護輸送裝置20等的情況、或在長期放置液體吐出頭12之情況等。噴嘴位置調整方法例如每天早上實施1次。FIG. 15 is a flow chart showing each step of the nozzle position adjustment method of the pattern manufacturing apparatus 10. As shown in FIG. The nozzle position adjustment method is carried out when the state of the pattern manufacturing apparatus 10 can be changed. The case where the state of the pattern manufacturing apparatus 10 can be changed means, for example, when the liquid discharge head 12 is detached, when the transport device 20 is maintained, or when the liquid discharge head 12 is left for a long time. The nozzle position adjustment method is implemented once every morning, for example.

在步驟S21中頭控制部76及輸送控制部78使用預定噴嘴62在印刷配線基板1002的預定位置印刷噴嘴位置確認用的十字圖案。在此，使用上游側噴嘴區域64A的噴嘴62印刷十字圖案。圖16係表示在印刷配線基板1002中所印刷之十字圖案112之示意圖。印刷十字圖案112之位置可以係IC1006的上表面。In step S21 , the head control unit 76 and the transport control unit 78 print a cross pattern for checking the nozzle position at a predetermined position on the printed wiring board 1002 using the predetermined nozzle 62 . Here, the cross pattern is printed using the nozzles 62 of the upstream nozzle area 64A. FIG. 16 is a schematic diagram showing a cross pattern 112 printed on the printed wiring board 1002 . The position where the cross pattern 112 is printed may be the upper surface of the IC 1006 .

返回到圖15的說明，在步驟S22（“讀取步驟”的一例）中，照相機控制部77使照相機13讀取在步驟S3中印刷之十字圖案112及印刷配線基板1002的對準標記1005，來獲取讀取結果。Returning to the description of FIG. 15, in step S22 (an example of the "reading step"), the camera control unit 77 causes the camera 13 to read the cross pattern 112 printed in step S3 and the alignment mark 1005 of the printed wiring board 1002, to get the read results.

在步驟S23（“調整步驟”的一例）中，頭控制部76基於在步驟S4中獲取之讀取結果，調整上游側噴嘴區域64A的噴嘴62的噴嘴位置（液體吐出頭12的位置）。從十字圖案112的讀取結果，可知印刷十字圖案112之噴嘴62及照相機13的位置關係，從對準標記1005的讀取結果，可知噴嘴62與對準標記1005的位置關係。又，對準標記1005與印刷區域的位置關係從導電圖案資料中預先得知。因此，能夠調整噴嘴位置，以使噴嘴62在印刷區域的邊界區域配置墨點。In step S23 (an example of “adjustment step”), head control unit 76 adjusts the nozzle position (position of liquid discharge head 12 ) of nozzle 62 in upstream nozzle area 64A based on the reading result acquired in step S4. From the reading result of the cross pattern 112 , the positional relationship between the nozzle 62 and the camera 13 printing the cross pattern 112 can be known, and from the reading result of the alignment mark 1005 , the positional relationship between the nozzle 62 and the alignment mark 1005 can be known. In addition, the positional relationship between the alignment mark 1005 and the printing area is known in advance from the conductive pattern data. Therefore, the nozzle position can be adjusted so that the nozzle 62 arranges ink dots in the boundary area of the printing area.

在本實施形態中，藉由上游側噴嘴區域64A的噴嘴62在印刷區域的邊界區域配置墨點。因此，優先調整上游側噴嘴區域64A的噴嘴62的噴嘴位置。這是因為，若在複數個噴嘴區域中試圖進行調整，則導致平均調整。In this embodiment, ink dots are arranged in the boundary area of the printing area by the nozzles 62 of the upstream nozzle area 64A. Therefore, the adjustment of the nozzle positions of the nozzles 62 in the upstream nozzle area 64A is prioritized. This is because an attempt to perform adjustment in a plurality of nozzle areas results in average adjustment.

[圖案製造裝置的其他形態] 圖17係其他形態之圖案製造裝置10A的整體結構圖。在此，對圖案製造裝置10A與圖案製造裝置10的不同進行說明，適當省略兩者間共通之構成要素的說明。 [Other forms of pattern making device] FIG. 17 is an overall configuration diagram of another pattern manufacturing apparatus 10A. Here, the difference between the pattern manufacturing apparatus 10A and the pattern manufacturing apparatus 10 will be described, and the description of common components between both will be appropriately omitted.

圖案製造裝置10A具備液體吐出頭12B。液體吐出頭12B為Y方向的總長度小於印刷配線基板1002的Y方向的長度的短頭。液體吐出頭12B包括具有各種未圖示的複數個噴嘴且依據X方向（“相對移動的方向”的一例）上的噴嘴的位置分割而成之複數個噴嘴區域。The pattern manufacturing apparatus 10A includes a liquid discharge head 12B. The liquid discharge head 12B is a short head whose total length in the Y direction is smaller than the length of the printed wiring board 1002 in the Y direction. The liquid discharge head 12B includes a plurality of nozzle regions that have a plurality of nozzles (not shown) and are divided according to nozzle positions in the X direction (an example of “relative movement direction”).

複數個噴嘴的配置係沿Y方向之1列配置、或2列Z形配置等。Y方向的噴嘴數可以依據Y方向的記錄解析度適當確定。The arrangement of the plurality of nozzles is arranged in one row along the Y direction, or arranged in two rows in a Z-shape, or the like. The number of nozzles in the Y direction can be appropriately determined according to the recording resolution in the Y direction.

液體吐出頭12B被托架26支撐。托架26（“相對移動機構”的一例）藉由沿X方向配置之導件28在X方向及-X方向支撐為移動自如。從向X方向移動（“相對移動”的一例）之液體吐出頭12B吐出導電油墨，藉此在印刷配線基板1002上，沿X方向形成有導電油墨的點列。重複基於移動機構24之印刷配線基板1002的Y方向的移動、及基於托架26之液體吐出頭12B的X方向的移動，藉此能夠在印刷配線基板1002的印刷區域形成導電圖案。The liquid discharge head 12B is supported by a bracket 26 . The bracket 26 (an example of a “relative movement mechanism”) is freely supported in the X direction and the −X direction by a guide 28 arranged along the X direction. By discharging the conductive ink from the liquid discharge head 12B that moves in the X direction (an example of “relative movement”), a dot row of the conductive ink is formed in the X direction on the printed wiring board 1002 . By repeating the Y-direction movement of the printed wiring board 1002 by the moving mechanism 24 and the X-direction movement of the liquid discharge head 12B by the carriage 26 , conductive patterns can be formed on the printed area of the printed wiring board 1002 .

[液體吐出頭的其他形態] 圖18係在液體吐出頭12中所適用之其他形態的頭模200中的噴嘴面202的俯視透視圖。再者，在與圖5共通部分標記共通之符號，並省略詳細的說明。 [Other forms of liquid discharge head] FIG. 18 is a top perspective view of the nozzle surface 202 of another form of head mold 200 applied to the liquid discharge head 12 . In addition, the common code|symbol is attached|subjected to the common part with FIG. 5, and detailed description is abbreviate|omitted.

頭模200的噴嘴面202的形狀與噴嘴面60的形狀相同。頭模200的噴嘴面202具有作為在W方向中每個流路獨立之2個噴嘴區域的第1的噴嘴區域204A及第2的噴嘴區域204B。在第1的噴嘴區域204A中二維矩陣配置噴嘴206A，在第2的噴嘴區域204B中二維矩陣配置噴嘴206B。屬於第1的噴嘴區域204A之噴嘴206A與屬於第2的噴嘴區域204B之噴嘴206B係相同數量，且具有相同的配置。The nozzle surface 202 of the head die 200 has the same shape as the nozzle surface 60 . The nozzle surface 202 of the head die 200 has a first nozzle region 204A and a second nozzle region 204B as two independent nozzle regions for each flow path in the W direction. The nozzles 206A are arranged in a two-dimensional matrix in the first nozzle region 204A, and the nozzles 206B are arranged in a two-dimensional matrix in the second nozzle region 204B. The nozzles 206A belonging to the first nozzle area 204A and the nozzles 206B belonging to the second nozzle area 204B are the same number and have the same arrangement.

在將頭模200的第1噴嘴區域204A的噴嘴206A及第2噴嘴區域204B的噴嘴206B沿X方向投影之投影噴嘴列中，噴嘴206A及204B交替排列。亦即，噴嘴206A的噴嘴編號為奇數，噴嘴206B的噴嘴編號為偶數。The nozzles 206A and 204B are arranged alternately in the projection nozzle row projecting the nozzles 206A of the first nozzle area 204A and the nozzles 206B of the second nozzle area 204B of the head mold 200 in the X direction. That is, the nozzle number of the nozzle 206A is an odd number, and the nozzle number of the nozzle 206B is an even number.

在第1噴嘴區域204A中，每由沿W方向所配置之複數個噴嘴206A構成之噴嘴列，設置有供給流路208A。從相同供給流路208A向屬於相同噴嘴列之噴嘴206A供給油墨。該複數個供給流路208A與沿V方向設置之主供給路徑210A連通。In the first nozzle region 204A, a supply flow path 208A is provided for every nozzle row composed of a plurality of nozzles 206A arranged along the W direction. Ink is supplied from the same supply channel 208A to the nozzles 206A belonging to the same nozzle row. The plurality of supply channels 208A communicate with the main supply channel 210A provided along the V direction.

相同地，在第2噴嘴區域204B中，每由沿W方向所配置之複數個噴嘴206B構成之噴嘴列，設置有供給流路208B。從相同供給流路208B向屬於相同噴嘴列之噴嘴206B供給油墨。該複數個供給流路208B與沿V方向設置之主供給路徑210B連通。Similarly, in the second nozzle region 204B, a supply flow path 208B is provided for each nozzle row composed of a plurality of nozzles 206B arranged along the W direction. Ink is supplied from the same supply channel 208B to the nozzles 206B belonging to the same nozzle row. The plurality of supply channels 208B communicate with the main supply channel 210B provided along the V direction.

圖19係表示頭模200的內部結構之剖面圖。在此，示出了第1噴嘴區域204A。頭模200的矽晶片44具備：噴嘴板212、流路結構體214、壓電元件230、振動板232及接著層234。FIG. 19 is a cross-sectional view showing the internal structure of the headform 200. As shown in FIG. Here, the first nozzle area 204A is shown. The silicon wafer 44 of the head mold 200 includes a nozzle plate 212 , a channel structure 214 , a piezoelectric element 230 , a vibrating plate 232 and an adhesive layer 234 .

噴嘴板212設置於流路結構體214的下表面而構成噴嘴面202。在噴嘴板212設置有噴嘴206A。The nozzle plate 212 is provided on the lower surface of the flow channel structure 214 to constitute the nozzle surface 202 . Nozzles 206A are provided on the nozzle plate 212 .

在流路結構體214中，設置有供給流路208A、個別供給路徑216、壓力室218、噴嘴連通路220、循環個別流路226、循環共通流路228。The flow path structure 214 is provided with a supply flow path 208A, an individual supply path 216 , a pressure chamber 218 , a nozzle communication path 220 , an individual circulation flow path 226 , and a circulation common flow path 228 .

供給流路208A與主供給路徑210A（參閱圖18）連通。個別供給路徑216使供給流路208A與壓力室218連通。The supply channel 208A communicates with a main supply channel 210A (see FIG. 18 ). The individual supply path 216 communicates the supply flow path 208A with the pressure chamber 218 .

壓力室218對應於噴嘴206A而設置。壓力室218的平面形狀為概略正方形，在對角線上的兩角部中的—個角部中設置有個別供給路徑216，在另一個角部中設置有噴嘴連通路220。再者，壓力室218的形狀並不限定於正方形，可以為多邊形、圓形或橢圓形。The pressure chamber 218 is provided corresponding to the nozzle 206A. The planar shape of the pressure chamber 218 is roughly square, and the individual supply path 216 is provided at one of the diagonal corners, and the nozzle communication path 220 is provided at the other corner. Furthermore, the shape of the pressure chamber 218 is not limited to a square, and may be polygonal, circular or elliptical.

噴嘴連通路220使壓力室218與噴嘴206A連通。循環個別流路226使噴嘴連通路220與循環共通流路228連通。The nozzle communication path 220 communicates the pressure chamber 218 with the nozzle 206A. The circulation individual flow path 226 communicates the nozzle communication path 220 with the circulation common flow path 228 .

循環共通流路228經由未圖示的主回收路徑與油墨回收路徑48（參閱圖4）連通。The circulation common flow path 228 communicates with the ink recovery path 48 (see FIG. 4 ) via a main recovery path not shown.

在流路結構體214的上表面設置振動板232。壓電元件230經由接著層234配置在振動板232的上表面。A vibrating plate 232 is provided on the upper surface of the channel structure 214 . The piezoelectric element 230 is disposed on the upper surface of the vibrating plate 232 via an adhesive layer 234 .

壓電元件230係用於從所對應之噴嘴206A吐出油墨的致動器。壓電元件230具有：積層有上部電極（個別電極）236、壓電體層238及下部電極（共通電極）240而成之積層結構。上部電極236係對應於各壓力室218的形狀圖案化之個別電極，每壓力室218分別設置有壓電元件230。The piezoelectric element 230 is an actuator for ejecting ink from the corresponding nozzle 206A. The piezoelectric element 230 has a laminated structure in which an upper electrode (individual electrode) 236 , a piezoelectric layer 238 , and a lower electrode (common electrode) 240 are laminated. The upper electrode 236 is an individual electrode patterned corresponding to the shape of each pressure chamber 218 , and each pressure chamber 218 is respectively provided with a piezoelectric element 230 .

在如此構成之頭模200中，從未圖示的油墨槽經由油墨供給路徑46（參閱圖4）所供給之油墨經由主供給路徑210A及供給流路208A供給至壓力室218。若對在對應之壓力室218中所設置之壓電元件230的上部電極236施加驅動電壓，則壓電元件230及振動板232變形而壓力室218的容積發生變化，隨之藉由壓力變化經由噴嘴連通路220從噴嘴206A吐出油墨。In the head die 200 configured in this way, the ink supplied from the ink tank (not shown) through the ink supply path 46 (see FIG. 4 ) is supplied to the pressure chamber 218 through the main supply path 210A and the supply flow path 208A. When a driving voltage is applied to the upper electrode 236 of the piezoelectric element 230 provided in the corresponding pressure chamber 218, the piezoelectric element 230 and the vibrating plate 232 are deformed and the volume of the pressure chamber 218 changes, and the pressure changes through The nozzle communication path 220 discharges ink from the nozzle 206A.

未從噴嘴206A吐出之油墨經由循環個別流路226、循環共通流路228、主回收路徑及油墨回收路徑48被回收至未圖示的油墨槽中。藉此，防止非吐出時的噴嘴206A的油墨的濃稠。The ink not ejected from the nozzle 206A is recovered to an ink tank (not shown) through the individual circulation flow path 226 , the common circulation flow path 228 , the main recovery path, and the ink recovery path 48 . This prevents thickening of the ink in the nozzle 206A during non-discharging.

在此，對第1噴嘴區域204A進行了說明，但第2噴嘴區域204B中之內部結構及動作亦與第1噴嘴區域204A相同。Here, the first nozzle region 204A has been described, but the internal structure and operation of the second nozzle region 204B are also the same as those of the first nozzle region 204A.

在具有頭模200之液體吐出頭12中，藉由第1噴嘴區域204A的噴嘴206A或第2噴嘴區域204B的噴嘴206B在基材的邊界區域配置墨點，藉此即使在液體吐出頭內具有基於流路結構之特性偏差亦能夠提高邊界的描繪精度。In the liquid discharge head 12 having the head die 200, the ink dots are arranged in the boundary region of the base material by the nozzles 206A of the first nozzle area 204A or the nozzles 206B of the second nozzle area 204B, so that even if the liquid discharge head has The characteristic deviation based on the flow channel structure can also improve the accuracy of drawing the boundary.

圖20係在液體吐出頭12所適用之其他形態的頭模300中的噴嘴面302的俯視圖與俯視放大圖。頭模300的噴嘴面302具有第1噴嘴區域304A、及第2噴嘴區域304B。在第1噴嘴區域304A中噴嘴306A沿X方向以間隔L配置成一列，在第2噴嘴區域304B中噴嘴306B沿X方向以間隔L配置成一列。噴嘴306A與噴嘴306B呈配置在沿X方向僅偏移L/2的位置之Z形配置。FIG. 20 is a plan view and an enlarged plan view of the nozzle surface 302 in another form of head mold 300 to which the liquid discharge head 12 is applied. The nozzle surface 302 of the head mold 300 has a first nozzle region 304A and a second nozzle region 304B. In the first nozzle region 304A, the nozzles 306A are arranged in a row along the X direction at an interval L, and in the second nozzle region 304B, the nozzles 306B are arranged in a row along the X direction at an interval L. The nozzles 306A and 306B are arranged in a Z-shape at positions offset by L/2 along the X direction.

在將頭模300的第1噴嘴區域304A的噴嘴306A及第2噴嘴區域304B的噴嘴306B沿X方向投影之投影噴嘴列中，噴嘴306A及304B交替排列。The nozzles 306A and 304B are arranged alternately in the projection nozzle row projecting the nozzles 306A of the first nozzle area 304A and the nozzles 306B of the second nozzle area 304B of the head mold 300 in the X direction.

在具有頭模300之液體吐出頭12中，藉由第1噴嘴區域304A的噴嘴306A或第2噴嘴區域304B的噴嘴306B在基材的邊界區域配置墨點，藉此即使在噴嘴區域間具有特性偏差亦能夠提高邊界的描繪精度。In the liquid ejection head 12 having the head die 300, the ink dots are arranged in the boundary area of the base material by the nozzles 306A of the first nozzle area 304A or the nozzles 306B of the second nozzle area 304B, thereby having characteristics even between the nozzle areas. The deviation can also improve the drawing accuracy of the boundary.

目前為止，對在包括依據相對移動的方向上的噴嘴的位置所分割之2個噴嘴區域之液體吐出頭12中，利用一個噴嘴區域的噴嘴在邊界區域配置墨點之例進行了說明，但在包括依據噴嘴特性所分割之3個以上的噴嘴區域之液體吐出頭中，可以利用任一噴嘴區域的噴嘴在邊界區域配置墨點。So far, in the liquid discharge head 12 including two nozzle areas divided according to the positions of the nozzles in the direction of relative movement, an example in which ink dots are arranged in a boundary area using nozzles in one nozzle area has been described. In a liquid discharge head including three or more nozzle areas divided according to nozzle characteristics, ink dots can be arranged in boundary areas using nozzles in any one of the nozzle areas.

[其他] 目前為止對導電圖案1020的形成進行了說明，但本實施形態能夠適用於絕緣圖案1024的形成中。此外，本實施形態並不限定於導電油墨及絕緣油墨，能夠應用於使用液體吐出頭之各種圖案的形成中。 [other] The formation of the conductive pattern 1020 has been described so far, but this embodiment can be applied to the formation of the insulating pattern 1024 . In addition, this embodiment is not limited to conductive ink and insulating ink, and can be applied to the formation of various patterns using a liquid discharge head.

本發明的技術的範圍並不限定於上述實施形態中記載的範圍。在不脫離本發明的主旨之範圍內，各實施形態中的結構等在各實施形態間能夠適當組合。The technical scope of the present invention is not limited to the scope described in the above-mentioned embodiments. The structure etc. in each embodiment can be combined suitably among each embodiment in the range which does not deviate from the summary of this invention.

10,10A:圖案製造裝置 12,12B:液體吐出頭 13:照相機 14:頭支撐構件 20:輸送裝置 22:工作台 24:移動機構 26:托架 28:導件 30:基座 40:頭模 42:L型支架 44:矽晶片 46:油墨供給路徑 48:油墨回收路徑 50:過濾器殼體 60:噴嘴面 62:噴嘴 64A:上游側噴嘴區域 64B:下游側噴嘴區域 70:系統控制部 72:資料獲取部 74:資料處理部 76:頭控制部 77:照相機控制部 78:輸送控制部 79:記憶體 80:控制裝置 82:處理器 84:電腦可讀媒體 85:圖案製造程式 86:通訊介面 88:輸入/輸出介面 90:匯流排 92:輸入裝置 94:顯示裝置 100:基材 102:印刷區域 102A:邊界 102B:邊界區域 102C:非邊界區域 104:非印刷區域 110A,110B,111A,111B:墨點 112:十字圖案 200:頭模 202:噴嘴面 204A:第1的噴嘴區域 204B:第2的噴嘴區域 206A,206B:噴嘴 208A,208B:供給流路 210A,210B:主供給路徑 212:噴嘴板 214:流路結構體 216:個別供給路徑 218:壓力室 220:噴嘴連通路 226:循環個別流路 228:循環共通流路 230:壓電元件 232:振動板 234:接著層 236:上部電極 238:壓電體層 240:下部電極 300:頭模 302:噴嘴面 304A:第1的噴嘴區域 304B:第2的噴嘴區域 306A,306B:噴嘴 1000:電氣組件安裝基板 1002:印刷配線基板 1004:組件安裝面 1005:對準標記 1006:IC 1006A:側面 1006B:背面 1006C:上表面 1008:電阻器 1008A:電阻陣列 1009:電極 1010:電容器 1020:導電圖案 1022:絕緣塗層 1024:絕緣圖案 1030:基板側電極 1032:元件側電極 1034:焊料凸塊 L:間隔 S、S X、S y:尺寸 S1～S3:圖案製造方法的步驟 S11～S16:導電圖案的形成步驟的詳細步驟 S21～S23:噴嘴位置調整方法的步驟 ΔS:位置偏移 10, 10A: Pattern manufacturing device 12, 12B: Liquid discharge head 13: Camera 14: Head support member 20: Conveying device 22: Workbench 24: Moving mechanism 26: Bracket 28: Guide 30: Base 40: Head mold 42: L-shaped holder 44: Silicon wafer 46: Ink supply path 48: Ink recovery path 50: Filter case 60: Nozzle surface 62: Nozzle 64A: Upstream nozzle area 64B: Downstream nozzle area 70: System control unit 72 : Data acquisition unit 74: Data processing unit 76: Head control unit 77: Camera control unit 78: Transport control unit 79: Memory 80: Control device 82: Processor 84: Computer readable medium 85: Pattern production program 86: Communication Interface 88: input/output interface 90: bus bar 92: input device 94: display device 100: substrate 102: printing area 102A: border 102B: border area 102C: non-border area 104: non-printing area 110A, 110B, 111A, 111B: ink dot 112: cross pattern 200: head die 202: nozzle surface 204A: first nozzle area 204B: second nozzle area 206A, 206B: nozzles 208A, 208B: supply flow path 210A, 210B: main supply path 212 : Nozzle plate 214: Flow path structure 216: Individual supply path 218: Pressure chamber 220: Nozzle communication path 226: Circulation individual flow path 228: Circulation common flow path 230: Piezoelectric element 232: Vibration plate 234: Bonding layer 236: Upper electrode 238: Piezoelectric layer 240: Lower electrode 300: Head mold 302: Nozzle surface 304A: First nozzle area 304B: Second nozzle areas 306A, 306B: Nozzle 1000: Electrical component mounting board 1002: Printed wiring board 1004 : component mounting surface 1005: alignment mark 1006: IC 1006A: side 1006B: back 1006C: upper surface 1008: resistor 1008A: resistor array 1009: electrode 1010: capacitor 1020: conductive pattern 1022: insulating coating 1024: insulating pattern 1030 : Substrate-side electrode 1032 : Element-side electrode 1034 : Solder bump L: Spaces S, S x , S y : Sizes S1-S3: Steps S11-S16 of the pattern manufacturing method: Detailed steps S21-S23 of the formation step of the conductive pattern : Step ΔS of nozzle position adjustment method: Position offset

圖1係電氣組件安裝基板的立體圖。 圖2係表示電氣組件安裝基板的立體結構之剖面圖。 圖3係圖案製造裝置的整體結構圖。 圖4係頭模的立體圖。 圖5係矽晶片（silicon die）的噴嘴面的俯視圖。 圖6係表示圖案製造裝置的電氣結構之功能框圖。 圖7係表示圖案製造裝置的硬體的結構例之框圖。 圖8係表示當在印刷區域形成導電圖案時的點配置之圖。 圖9係表示當在印刷區域形成導電圖案時的點配置之圖。 圖10係表示形成基材表面的導電圖案之印刷區域及非印刷區域之圖。 圖11係表示形成於印刷區域之導電圖案之圖。 圖12係用於說明油墨的著陸干擾的圖。 圖13係表示基於圖案製造裝置的圖案製造方法的各步驟之流程圖。 圖14係表示導電圖案的形成步驟的詳細之流程圖。 圖15係表示圖案製造裝置的噴嘴位置調整方法的各步驟之流程圖。 圖16係表示在印刷配線基板中所印刷之十字圖案之示意圖。 圖17係圖案製造裝置的整體結構圖。 圖18係噴嘴面的俯視透視圖。 圖19係表示頭模的內部結構之剖面圖。 圖20係噴嘴面的俯視圖與俯視放大圖。 FIG. 1 is a perspective view of an electrical component mounting substrate. Fig. 2 is a sectional view showing a three-dimensional structure of an electrical component mounting substrate. Fig. 3 is an overall structural view of the pattern manufacturing device. Figure 4 is a perspective view of the headform. FIG. 5 is a top view of a nozzle surface of a silicon die. Fig. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing device. Fig. 7 is a block diagram showing a configuration example of hardware of the pattern manufacturing device. Fig. 8 is a diagram showing a dot arrangement when a conductive pattern is formed in a printing area. Fig. 9 is a diagram showing a dot arrangement when a conductive pattern is formed in a printing area. Fig. 10 is a diagram showing a printed area and a non-printed area where a conductive pattern is formed on the surface of a substrate. FIG. 11 is a diagram showing a conductive pattern formed in a printing area. Fig. 12 is a diagram for explaining ink landing disturbance. Fig. 13 is a flow chart showing each step of the pattern manufacturing method using the pattern manufacturing device. FIG. 14 is a detailed flow chart showing the steps of forming the conductive pattern. Fig. 15 is a flow chart showing each step of a nozzle position adjustment method of the pattern manufacturing apparatus. FIG. 16 is a schematic diagram showing a cross pattern printed on a printed wiring board. Fig. 17 is an overall structural view of the pattern manufacturing device. Figure 18 is a top perspective view of the nozzle face. Fig. 19 is a sectional view showing the internal structure of the headform. Fig. 20 is a top view and a top view enlarged view of the nozzle surface.

S11~S16:步驟 S11~S16: Steps

Claims (15)

一種圖案製造方法，其係使用圖案製造裝置之圖案製造方法，前述圖案製造裝置具備： 液體吐出頭，具有吐出液體之複數個噴嘴；及 相對移動機構，使基材及前述液體吐出頭相對移動，前述圖案製造方法中， 前述液體吐出頭包含分別具有複數個噴嘴且依據前述相對移動的方向中的噴嘴的位置分割而成之複數個噴嘴區域， 前述圖案製造方法具備使前述基材及前述液體吐出頭相對移動而使液體從前述複數個噴嘴吐出，在前述基材的表面的印刷區域配置複數個點形成圖案之圖案形成步驟， 在前述圖案形成步驟中，藉由前述複數個噴嘴區域中的特定的噴嘴區域的噴嘴，在前述印刷區域中包括與和前述印刷區域不同之非印刷區域的邊界之邊界區域中，配置點。 A pattern manufacturing method, which is a pattern manufacturing method using a pattern manufacturing device, the aforementioned pattern manufacturing device has: Liquid discharge head having a plurality of nozzles for discharging liquid; and The relative movement mechanism makes the base material and the aforementioned liquid discharge head move relative to each other. In the aforementioned pattern manufacturing method, The liquid discharge head includes a plurality of nozzle areas each having a plurality of nozzles and divided according to positions of the nozzles in the direction of the relative movement, The aforementioned pattern manufacturing method includes a pattern forming step of relatively moving the aforementioned base material and the aforementioned liquid discharge head to discharge the liquid from the aforementioned plurality of nozzles, and arranging a plurality of dots in a printing area on the surface of the aforementioned base material to form a pattern, In the pattern forming step, dots are arranged in a boundary area of the printing area including a boundary of a non-printing area different from the printing area by nozzles of a specific nozzle area among the plurality of nozzle areas. 如請求項1所述之圖案製造方法，其中 在前述圖案形成步驟中，藉由前述複數個噴嘴區域的噴嘴，在與前述印刷區域中除前述邊界區域以外的非邊界區域配置點。 The pattern manufacturing method as described in Claim 1, wherein In the pattern forming step, dots are arranged in a non-boundary area of the printing area other than the border area by the nozzles of the plurality of nozzle areas. 如請求項2所述之圖案製造方法，其中 在前述圖案形成步驟中，藉由前述特定的噴嘴區域的噴嘴在前述邊界區域配置點之後，藉由前述複數個噴嘴區域的噴嘴在前述非邊界區域中配置點。 The pattern manufacturing method as described in Claim 2, wherein In the pattern forming step, after dots are arranged in the border region by nozzles of the specific nozzle region, dots are arranged in the non-border region by nozzles of the plurality of nozzle regions. 如請求項1至請求項3之任一項所述之圖案製造方法，其中 前述特定的噴嘴區域為配置於前述相對移動的上游側之上游側噴嘴區域。 The pattern manufacturing method according to any one of claim 1 to claim 3, wherein The specific nozzle area is an upstream nozzle area arranged on the upstream side of the relative movement. 如請求項1至請求項4之任一項所述之圖案製造方法，其中 在前述圖案形成步驟中，增加配置於除前述邊界區域以外的區域之點。 The pattern manufacturing method according to any one of claim 1 to claim 4, wherein In the aforementioned pattern forming step, dots arranged in areas other than the aforementioned border area are added. 如請求項1至請求項5之任一項所述之圖案製造方法，其中 在前述圖案形成步驟中，在前述印刷區域中與前述邊界區域相鄰之區域，配置比配置在前述邊界區域之點的尺寸相對大尺寸的點。 The pattern manufacturing method according to any one of claim 1 to claim 5, wherein In the pattern forming step, dots having a size relatively larger than dots arranged in the border region are arranged in a region adjacent to the border region in the printing region. 如請求項1至請求項6之任一項所述之圖案製造方法，其中 在前述圖案形成步驟中，藉由前述基材及前述液體吐出頭的特定方向的複數次相對移動來形成前述圖案。 The pattern manufacturing method according to any one of claim 1 to claim 6, wherein In the pattern forming step, the pattern is formed by a plurality of relative movements of the substrate and the liquid discharge head in a specific direction. 如請求項1至請求項7之任一項所述之圖案製造方法，其中 在前述圖案形成步驟中，在前述邊界區域，僅藉由前述特定噴嘴區域的噴嘴配置點。 The pattern manufacturing method according to any one of claim 1 to claim 7, wherein In the pattern forming step, in the boundary area, dots are arranged only by nozzles in the specific nozzle area. 如請求項1至請求項8之任一項所述之圖案製造方法，其中 前述複數個噴嘴能夠分別配置複數尺寸的點， 在前述圖案形成步驟中，在前述邊界區域配置相同尺寸的點。 The pattern manufacturing method according to any one of claim 1 to claim 8, wherein The aforementioned plurality of nozzles can respectively arrange dots of a plurality of sizes, In the aforementioned pattern forming step, dots of the same size are arranged in the aforementioned border area. 如請求項1至請求項9之任一項所述之圖案製造方法，其中 前述基材具備對齊標記， 前述圖案製造方法具備： 讀取步驟，讀取前述對齊標記、及 調整步驟，使用前述讀取步驟中之前述對齊標記的讀取結果，調整前述特定噴嘴區域的噴嘴的著陸位置。 The pattern manufacturing method according to any one of claim 1 to claim 9, wherein The aforementioned substrates are provided with alignment marks, The aforementioned pattern manufacturing method has: a reading step of reading the aforementioned alignment marks, and The adjustment step is to adjust the landing position of the nozzle in the specific nozzle area by using the reading result of the alignment mark in the reading step. 如請求項1至請求項10之任一項所述之圖案製造方法，其具備： 預處理液塗佈步驟，對前述基材預先塗佈預處理液，前述預處理液包含抑制液體的濕擴散之功能性材料。 The pattern manufacturing method according to any one of claim 1 to claim 10, which has: In the step of applying the pretreatment liquid, the pretreatment liquid is pre-coated on the substrate, and the pretreatment liquid includes a functional material that suppresses the wet diffusion of the liquid. 如請求項1至請求項11之任一項所述之圖案製造方法，其中 前述基材為安裝電氣組件而成之電路基板， 前述印刷區域包括作為電磁波遮蔽的形成對象之前述電氣組件， 前述液體為導電性液體。 The pattern manufacturing method according to any one of claim 1 to claim 11, wherein The aforementioned substrate is a circuit substrate mounted with electrical components, The aforementioned printed area includes the aforementioned electrical component as an object of electromagnetic wave shielding, The aforementioned liquid is a conductive liquid. 一種程式，其用於使電腦執行請求項1至請求項12之任一項所述之圖案製造方法。A program for causing a computer to execute the pattern manufacturing method described in any one of claim 1 to claim 12. 一種記錄媒體，其係電腦可讀取的非暫時性記錄媒體，且記錄有請求項13所述之程式。A recording medium, which is a non-transitory recording medium readable by a computer, and records the program described in claim 13. 一種圖案製造裝置，其係具備： 液體吐出頭，具有吐出液體之複數個噴嘴； 相對移動機構，使基材及前述液體吐出頭相對移動； 至少一個處理器；及 至少一個記憶體，儲存用於使前述至少一個處理器執行的命令， 前述液體吐出頭包括分別具有複數個噴嘴且依據前述相對移動的方向上的噴嘴的位置分割而成之複數個噴嘴區域， 前述至少一個處理器進行如下處理： 使前述基材及前述液體吐出頭相對移動而使液體從前述複數個噴嘴吐出，在前述基材的表面的印刷區域配置複數個點形成圖案， 藉由前述複數個噴嘴區域中的特定噴嘴區域的噴嘴，在前述印刷區域中包括與和前述印刷區域不同之非印刷區域的邊界之邊界區域中配置點。 A pattern manufacturing device, which has: A liquid discharge head having a plurality of nozzles for discharging liquid; The relative movement mechanism makes the base material and the aforementioned liquid discharge head relatively move; at least one processor; and at least one memory storing commands for execution by the aforementioned at least one processor, The liquid ejection head includes a plurality of nozzle areas each having a plurality of nozzles and divided according to the positions of the nozzles in the direction of the relative movement, The aforementioned at least one processor performs the following processing: relatively moving the base material and the liquid discharge head to discharge the liquid from the plurality of nozzles, arranging a plurality of dots in the printing area on the surface of the base material to form a pattern, Dots are arranged in a boundary area including a boundary of a non-printing area different from the printing area in the printing area by nozzles of a specific nozzle area among the plurality of nozzle areas.
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