WO2023047768A1 - Pattern manufacturing method, program, and pattern manufacturing device - Google Patents

Pattern manufacturing method, program, and pattern manufacturing device Download PDF

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Publication number
WO2023047768A1
WO2023047768A1 PCT/JP2022/027491 JP2022027491W WO2023047768A1 WO 2023047768 A1 WO2023047768 A1 WO 2023047768A1 JP 2022027491 W JP2022027491 W JP 2022027491W WO 2023047768 A1 WO2023047768 A1 WO 2023047768A1
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WO
WIPO (PCT)
Prior art keywords
nozzles
nozzle
pattern
area
dots
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Application number
PCT/JP2022/027491
Other languages
French (fr)
Japanese (ja)
Inventor
忠 京相
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富士フイルム株式会社
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Publication of WO2023047768A1 publication Critical patent/WO2023047768A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Definitions

  • the present invention relates to a pattern manufacturing method, a program, and a pattern manufacturing apparatus, and more particularly to technology for forming highly accurate patterns using a liquid ejection head.
  • Patent Document 1 As a method for improving printing accuracy, in Patent Document 1, in order to eliminate unevenness in the boundary caused by printing in "shift mode”, only the boundary is printed in normal mode (non-shift mode), and the inside is shifted. A technique for printing in mode is described.
  • Patent Document 2 describes applying a pretreatment liquid to prevent interference between ink dots on the printing substrate and improve image quality.
  • Patent Document 1 cannot cope with the collapse of the drawing pattern caused by the characteristic variation between nozzles, and has the problem that the drawing accuracy cannot be sufficiently improved.
  • Patent Document 2 can only ensure accuracy on the base material, and cannot compensate for variations in characteristics between nozzles. rice field.
  • One aspect of a pattern manufacturing method for achieving the above object is a pattern manufacturing apparatus comprising a liquid ejection head having a plurality of nozzles for ejecting liquid, and a relative movement mechanism for relatively moving the substrate and the liquid ejection head.
  • the liquid ejection head includes a plurality of nozzle regions each having a plurality of nozzles, the nozzle regions being divided according to the positions of the nozzles in the direction of relative movement
  • a pattern forming step is provided in which the substrate and the liquid ejection head are moved relative to each other to eject the liquid from a plurality of nozzles to form a pattern by arranging a plurality of dots in a printing region on the surface of the substrate, the pattern forming step comprising:
  • dots are arranged by nozzles of a specific nozzle area among a plurality of nozzle areas in a boundary area including a boundary between a non-printing area different from the printing area in the printing area. According to this aspect, it is possible to improve the drawing accuracy of the pattern even if there are variations in characteristics within the liquid ejection head.
  • dots are preferably arranged in non-boundary areas other than the boundary areas of the print area by nozzles of a plurality of nozzle areas. As a result, a pattern in which dots are arranged in the print area can be formed.
  • the nozzles of a specific nozzle area arrange dots in the boundary area and then the nozzles of a plurality of nozzle areas arrange dots in the non-boundary area. As a result, it is possible to prevent the dots arranged in the boundary area from moving due to landing interference.
  • the specific nozzle area is preferably an upstream nozzle area arranged on the upstream side of the relative movement. Dots can thus be placed in the boundary area before they are placed in the non-boundary area.
  • the pattern forming step it is preferable to arrange dots having a size relatively larger than the size of the dots arranged in the boundary area in the area adjacent to the boundary area in the printing area. As a result, the dots can be spread over the boundary areas where the amount of liquid is relatively small.
  • the pattern is preferably formed by relatively moving the substrate and the liquid ejection head multiple times in a specific direction. Thereby, a pattern can be formed appropriately.
  • a plurality of nozzles can each arrange dots of a plurality of sizes, and the pattern forming step preferably arranges dots of the same size in the boundary area. This makes it possible to eliminate the influence of characteristic variations between dot sizes.
  • the substrate has an alignment mark, and comprises a reading step of reading the alignment mark, and an adjusting step of adjusting the landing position of the nozzle in a specific nozzle region using the result of reading the alignment mark in the reading step. is preferred. Thereby, the drawing accuracy of the boundary area can be further improved.
  • pretreatment liquid application step of previously applying a pretreatment liquid containing a functional material that suppresses wetting and spreading of the liquid to the base material.
  • a pretreatment liquid application step of previously applying a pretreatment liquid containing a functional material that suppresses wetting and spreading of the liquid to the base material.
  • the base material is an electric circuit board on which electric components are mounted
  • the printed area includes the electric components to form an electromagnetic wave shield
  • the liquid is a conductive liquid.
  • One aspect of the program for achieving the above object is a program for causing a computer to execute the above pattern manufacturing method.
  • a computer-readable non-transitory storage medium in which this program is recorded may also be included in this embodiment.
  • One aspect of a pattern manufacturing apparatus for achieving the above object comprises a liquid ejection head having a plurality of nozzles for ejecting liquid, a relative movement mechanism for relatively moving the substrate and the liquid ejection head, and at least one processor. , and at least one memory for storing instructions for causing the at least one processor to execute, the liquid ejection head having a plurality of nozzle regions each having a plurality of nozzles, the positions of the nozzles in the direction of relative movement.
  • At least one processor causes the substrate and the liquid ejection head to relatively move to eject the liquid from the plurality of nozzles to form a plurality of dots in the print area on the surface of the substrate are arranged to form a pattern, and dots are arranged by nozzles of a specific nozzle region among a plurality of nozzle regions in a boundary region including a boundary with a non-printing region different from the printing region in the printing region. manufacturing equipment. According to this aspect, it is possible to improve the drawing accuracy of the pattern even if there are variations in characteristics within the liquid ejection head.
  • pattern drawing accuracy can be improved even if there are variations in characteristics within the liquid ejection head.
  • FIG. 1 is a perspective view of an electrical component mounting board.
  • FIG. 2 is a cross-sectional view showing the three-dimensional structure of the electrical component mounting board.
  • FIG. 3 is an overall configuration diagram of the pattern manufacturing apparatus.
  • FIG. 4 is a perspective view of the head module.
  • FIG. 5 is a plan view of the nozzle surface of the silicon die.
  • FIG. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing apparatus.
  • FIG. 7 is a block diagram showing a hardware configuration example of the pattern manufacturing apparatus.
  • FIG. 8 is a diagram showing dot arrangement when a conductive pattern is formed in a print area.
  • FIG. 9 is a diagram showing dot arrangement when a conductive pattern is formed in a printing area.
  • FIG. 8 is a diagram showing dot arrangement when a conductive pattern is formed in a print area.
  • FIG. 10 is a diagram showing a printed area forming a conductive pattern on the surface of a substrate and a non-printed area.
  • FIG. 11 is a diagram showing a conductive pattern formed in the printing area.
  • FIG. 12 is a diagram for explaining ink landing interference.
  • FIG. 13 is a flow chart showing each step of the pattern manufacturing method by the pattern manufacturing apparatus.
  • FIG. 14 is a flow chart showing the details of the conductive pattern forming process.
  • FIG. 15 is a flow chart showing each step of the nozzle position adjustment method of the pattern manufacturing apparatus.
  • FIG. 16 is a schematic diagram showing a cross pattern printed on a printed wiring board.
  • FIG. 17 is an overall configuration diagram of the pattern manufacturing apparatus.
  • FIG. 18 is a plan perspective view of the nozzle surface.
  • FIG. 19 is a cross-sectional view showing the internal structure of the head module.
  • FIG. 20 is a plan view and an enlarged plan view of the nozzle surface.
  • FIG. 1 is a perspective view of an electrical component mounting board 1000.
  • the electrical component mounting board 1000 is obtained by mounting an IC 1006 , a resistor 1008 and a capacitor 1010 on a component mounting surface 1004 of a printed wiring board 1002 .
  • a conductive pattern 1020 is formed on the electric component mounting board 1000 for the IC 1006 , and an insulating coating 1022 is formed for the resistor 1008 and the capacitor 1010 . Also, on the electrical component mounting board 1000, an insulating coating 1022 is formed on the electrodes 1009 exposed without the electrical components of the printed wiring board 1002 being mounted.
  • FIG. 1 illustrates an embodiment in which one surface of the printed wiring board 1002 is used as the component mounting surface 1004, the other surface of the printed wiring board 1002 may be used as the component mounting surface. Both one surface and the other surface of may be used as component mounting surfaces.
  • the printed wiring board 1002 is provided with two alignment marks 1005 (an example of "alignment marks").
  • the alignment mark 1005 indicates a reference position of the printed wiring board 1002 .
  • a camera 13 see FIG. 3
  • the amount of relative positional deviation between the printed wiring board 1002 and the liquid ejection head 12 is detected.
  • the number, positions, and shapes of the alignment marks 1005 can be determined as appropriate.
  • the IC 1006 is an electric component in which a semiconductor integrated circuit is enclosed in a package such as resin.
  • the IC 1006 has electrodes exposed outside the package. Note that IC is an abbreviation for Integrated Circuit. Also, electrical components are sometimes called electronic components.
  • a resistor 1008 includes an electrical resistance element. Resistor 1008 also includes a resistor array 1008A in which a plurality of integrated electric resistance elements are encapsulated in a package such as resin. Capacitor 1010 includes various capacitors such as electrolytic capacitors and ceramic capacitors.
  • An insulating pattern 1024 (see FIG. 2) is formed using an insulating ink in an arrangement area of the IC 1006 among the electrical components mounted on the printed wiring board 1002, and at least part of the insulating pattern is coated with a conductive ink. is used to form the conductive pattern 1020 . 1, illustration of the insulating pattern 1024 is omitted.
  • the conductive pattern 1020 is formed by ejecting conductive ink from the liquid ejection head 12 (see FIG. 3), thereby disposing ink dots of the conductive ink in a formation region (an example of a “printing region”) of the conductive pattern 1020 . It is formed by drying and curing a series of ink dots.
  • the insulating coating 1022 and the insulating pattern 1024 are formed by ejecting insulating ink from a liquid ejection head (not shown) to arrange ink dots of the insulating ink in the formation regions of the insulating coating 1022 and the insulating pattern 1024 . It is formed by drying and curing a series of dots.
  • the conductive pattern 1020 functions as an electromagnetic shield for the purpose of suppressing electromagnetic waves received by the IC 1006 and suppressing electromagnetic waves emitted from the IC 1006 .
  • the insulating pattern 1024 serves as an insulating member for ensuring electrical insulation between the conductive pattern 1020 and the IC 1006, an adhesive member for ensuring adhesion between the conductive pattern 1020 and the IC 1006, and a member for ensuring the flatness of the base of the conductive pattern 1020. Function.
  • At least a portion of the component area of the printed wiring board 1002 where electrical components that do not require electromagnetic wave shielding are arranged is not formed with the conductive pattern 1020 and is covered with an insulating coating 1022 .
  • Electrical parts that do not require electromagnetic shielding include resistors 1008, capacitors 1010, diodes, coils, transformers, switches, and the like.
  • the electrode area where the electrode 1009 is arranged is covered with an insulating coating 1022 .
  • the insulating coating 1022 suppresses a short circuit of an electric circuit caused by adhesion of finely divided conductive ink to the resistor 1008 or the like when the conductive pattern 1020 is formed.
  • the printed wiring board 1002 on which the IC 1006, the resistor 1008 and the capacitor 1010 are mounted is an example of an “electric circuit board” on which electric parts including the IC are mounted.
  • the IC 1006 is an example of "an electrical component for which electromagnetic wave shielding is to be formed”.
  • FIG. 2 is a cross-sectional view showing the three-dimensional structure of the electrical component mounting board 1000.
  • FIG. FIG. 2 schematically shows a cross section of any IC 1006 shown in FIG. 1 with insulating patterns 1024 and conductive patterns 1020 formed thereon.
  • Board-side electrodes 1030 formed on the component mounting surface 1004 of the printed wiring board 1002 and element-side electrodes 1032 of the IC 1006 are electrically connected via solder bumps 1034 .
  • the insulating pattern 1024 is around the IC 1006 surrounding the four side surfaces 1006A of the IC 1006, and is formed closer to the printed wiring board 1002 than the back surface 1006B of the IC 1006 on which the element-side electrodes 1032 are formed. Insulating pattern 1024 may be formed at a location that contacts side 1006A of IC 1006 . The insulating pattern 1024 may be formed between the back surface 1006B of the IC 1006 and the component mounting surface 1004 of the printed wiring board 1002 .
  • the conductive pattern 1020 is formed to overlap at least part of the insulating pattern 1024 .
  • FIG. 2 shows a mode in which the conductive pattern 1020 is formed over the entire surface of the insulating pattern 1024 .
  • the conductive pattern 1020 may be formed in a region covering the side surface 1006A of the IC 1006 and the top surface 1006C of the IC 1006.
  • An insulating pattern 1024 underlying the conductive pattern 1020 may be formed on the side surface 1006A of the IC 1006 and the top surface of the IC 1006 .
  • an insulating pattern 1024 is formed at least in a region covering all the electrodes.
  • FIG. 2 illustrates the electrical component mounting board 1000 with the conductive pattern 1020 exposed
  • a protective film may be formed over the conductive pattern 1020 .
  • the protective film may have insulating properties.
  • FIG. 3 is an overall configuration diagram of the pattern manufacturing apparatus 10.
  • the pattern manufacturing apparatus 10 is an apparatus for forming a conductive pattern 1020 on a component mounting surface 1004 of a printed wiring board 1002 on which an insulating pattern 1024 is formed.
  • the pattern manufacturing apparatus 10 includes a liquid ejection head 12, a camera 13, a head supporting member 14, a conveying device 20, and a base 30.
  • the head supporting member 14 and the conveying device 20 are arranged on the upper surface of a base 30 to which a surface plate or the like is applied.
  • the liquid ejection head 12 ejects conductive ink.
  • a conductive ink is an example of a “conductive liquid” and is an ink in which a conductive material is dispersed in a solvent.
  • the conductive material is, for example, metal nanoparticles such as silver or copper.
  • a conductive pattern formed on a substrate by conductive ink can conduct electricity.
  • the liquid ejection head 12 includes a plurality of head modules 40.
  • FIG. 4 is a perspective view of one head module 40.
  • the head module 40 includes an L-shaped bracket 42 , a silicon die 44 , an ink supply channel 46 , an ink recovery channel 48 and a filter housing 50 .
  • the L-shaped bracket 42 is a member for fixing the head module 40 to the head support member 14 .
  • the silicon die 44 has a nozzle surface 60 facing the printed wiring board 1002 conveyed by the conveying device 20 .
  • FIG. 5 is a plan view of the nozzle face 60 of the silicon die 44.
  • the nozzle surface 60 has an end surface on the long side along the V direction inclined at an angle ⁇ with respect to the X direction, and an end surface on the long side along the W direction inclined at an angle ⁇ with respect to the Y direction corresponding to the substrate transfer direction. It has a planar shape of a parallelogram having end faces on the short sides.
  • the nozzle surface 60 is a plurality of nozzle regions each having a plurality of nozzles 62, and includes a plurality of nozzle regions divided according to the positions of the nozzles 62 in the Y direction (an example of the "relative movement direction").
  • the nozzle face 60 includes an upstream nozzle area 64A and a downstream nozzle area 64B.
  • a plurality of nozzles 62 are arranged in a two-dimensional matrix in the row direction along the V direction and the column direction along the W direction, respectively, in the upstream nozzle region 64A and the downstream nozzle region 64B.
  • the nozzles 62 on the 1st to 16th rows are arranged in the upstream nozzle region 64A, and the nozzles 62 on the 17th to 32nd rows are arranged in the downstream nozzle region 64B.
  • a projected nozzle array obtained by projecting the nozzles 62 in the two-dimensional matrix arrangement along the X direction is equivalent to a single nozzle array in which the nozzles 62 are arranged at approximately equal intervals at a nozzle density that achieves the maximum recording resolution in the X direction.
  • the projected nozzle row it is possible to associate a nozzle number representing the nozzle position with each nozzle in the order of the projected nozzles arranged along the X direction.
  • the nozzles 62 in the upstream nozzle region 64A and the nozzles 62 in the downstream nozzle region 64B are arranged alternately. That is, the nozzle numbers of the nozzles 62 in the upstream nozzle region 64A are odd numbers, and the nozzle numbers of the nozzles 62 in the downstream nozzle region 64B are even numbers.
  • substantially equal intervals means that droplet ejection points that can form a pattern in the pattern manufacturing apparatus 10 are substantially equally spaced.
  • the concept of equidistant spacing also applies to cases where the spacing is slightly different in consideration of at least one of manufacturing error and movement of droplets on the medium due to landing interference. included.
  • a projected nozzle array corresponds to a substantial nozzle array.
  • the liquid ejection head 12 ejects conductive ink from each of the plurality of nozzles 62 .
  • the plurality of nozzles 62 can each eject ink of a plurality of sizes, and can arrange ink dots of a plurality of sizes.
  • the ejection method of the liquid ejection head 12 is a piezoelectric method in which the conductive ink is ejected by pressurizing the conductive ink using bending deformation of the piezoelectric element.
  • the ejection method of the liquid ejection head 12 may be a thermal method in which the conductive ink is heated using a heater and the conductive ink is ejected using the film boiling phenomenon of the conductive ink. It should be noted that the term "ejection" includes meanings such as jetting, coating, and flowing down.
  • the ink supply path 46 is connected to an ink tank (not shown) through a supply pump (not shown) together with the ink supply path 46 of another head module 40 .
  • the supply pump applies pressure to the ink inside the ink supply path 46 and supplies the ink stored in the ink tank to the head module 40 .
  • the ink recovery path 48 is connected to the ink tank together with the ink recovery path 48 of the other head module 40 via a recovery pump (not shown).
  • the recovery pump applies pressure to the ink inside the ink recovery path 48 and recovers the ink supplied to the head module 40 to the ink tank.
  • the filter housing 50 accommodates a filter for removing foreign substances and the like contained in the ink inside the head module 40 .
  • the camera 13 is for photographing the alignment mark 1005 provided on the printed wiring board 1002 .
  • the camera 13 includes a light source (not shown), an imaging element (not shown), and an observation optical system (not shown). Camera 13 may be an in-line sensor.
  • the head support member 14 fixes and supports the liquid ejection head 12 and camera 13 .
  • the head support member 14 aligns a plurality of head modules 40 in the X direction, and fixes and supports them with L-shaped brackets 42 with the nozzle surfaces 60 facing the -Z direction.
  • the head support member 14 arranges the upstream nozzle region 64A on the upstream side ( ⁇ Y direction side) and the downstream nozzle region 64B on the downstream side (Y direction side) in the substrate transport direction, and each head module 40 fixed support.
  • the liquid ejection head 12 becomes a line type head in which a plurality of nozzles 62 are arranged along a length exceeding the full width of the printed wiring board 1002 . .
  • the head support member 14 fixes and supports the camera 13 with the observation optical system directed in the -Z direction.
  • the camera 13 can observe the printed wiring board 1002 after printing with the liquid ejection head 12 by being arranged on the downstream side (Y direction side) of the liquid ejection head 12 in the substrate transport direction.
  • the head support member 14 includes a head position adjustment mechanism (not shown) that adjusts the X- and Y-direction positions of the liquid ejection head 12 while maintaining a fixed positional relationship between the liquid ejection head 12 and the camera 13 . .
  • the transport device 20 (an example of a "relative movement mechanism”) transports the printed wiring board 1002 along the Y direction (an example of a "relative movement”).
  • the transport device 20 includes a table 22 that supports the printed wiring board 1002 and a moving mechanism 24 that moves the table 22 along the Y direction.
  • the table 22 has a fixing mechanism for fixing the printed wiring board 1002 .
  • the fixing mechanism may fix the printed wiring board 1002 mechanically, or may fix the printed wiring board 1002 by suction by applying a negative pressure to the printed wiring board 1002 .
  • the table 22 may include an adjustment mechanism that adjusts the distance in the Z direction between the printed wiring board 1002 and the liquid ejection head 12.
  • the table 22 may include an adjustment mechanism that adjusts the position of the printed wiring board 1002 in the X direction.
  • a ball screw drive mechanism, a belt drive mechanism, etc. are connected to the rotating shaft of the motor.
  • the moving mechanism 24 may have a linear motor.
  • the pattern manufacturing apparatus 10 moves the printed wiring board 1002 in the Y direction with respect to the liquid ejection head 12 whose position is fixed. It may be moved in the Y direction. Also, the pattern manufacturing apparatus 10 may move the printed wiring board 1002 in the Y direction and the liquid ejection head 12 in the -Y direction.
  • FIG. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing apparatus 10.
  • the pattern manufacturing apparatus 10 includes a system control section 70 , a data acquisition section 72 , a data processing section 74 , a head control section 76 , a camera control section 77 , a transport control section 78 and a memory 79 .
  • the system control unit 70 transmits command signals to the data acquisition unit 72, the data processing unit 74, the head control unit 76, the camera control unit 77, and the transport control unit 78, and controls the operation of the pattern manufacturing apparatus 10 in an integrated manner.
  • the data acquisition unit 72 acquires various data including conductive pattern data for forming the conductive pattern 1020 from an external device (not shown) such as a host computer.
  • the data processing unit 74 performs processing on various data acquired by the data acquisition unit 72 .
  • the data processing unit 74 generates conductive ink ejection data from the conductive pattern data. That is, the data processing unit 74 performs image processing such as halftone processing on the conductive pattern data to generate ejection data that defines the positions and sizes of dots corresponding to the conductive pattern.
  • the head control unit 76 controls ejection from the nozzles 62 of the liquid ejection head 12 based on the ejection data corresponding to the conductive pattern. Further, the head control unit 76 controls a head position adjusting mechanism (not shown) according to the result of reading the alignment mark 1005, which will be described later, to adjust the position of the liquid ejection head 12 in advance.
  • the camera control unit 77 controls the operation of the camera 13.
  • the camera control unit 77 causes the camera 13 to read, for example, the alignment mark 1005 (see FIG. 1) of the printed wiring board 1002 and obtains the reading result from the camera 13 .
  • the transport control unit 78 controls the operation of the transport device 20 .
  • the memory 79 stores various data, various parameters, various programs, etc. used for controlling the pattern manufacturing apparatus 10 .
  • the system control unit 70 applies various parameters and the like stored in the memory 79 to control each unit of the pattern manufacturing apparatus 10 .
  • FIG. 7 is a block diagram showing a hardware configuration example of the pattern manufacturing apparatus 10. As shown in FIG. Pattern manufacturing apparatus 10 includes a control device 80 , an input device 92 and a display device 94 .
  • a computer is applied to the control device 80 .
  • the computer is a server, personal computer, workstation, tablet terminal, or the like.
  • Controller 80 includes processor 82 , computer readable media 84 , communication interface 86 , input/output interface 88 , and bus 90 .
  • Processor 82 executes instructions stored on computer readable medium 84 .
  • the hardware structure of the processor 82 is various processors as follows.
  • Various processors include a CPU (Central Processing Unit), which is a general-purpose processor that executes software (programs) and acts as various functional units, a GPU (Graphics Processing Unit), which is a processor specialized for image processing, A circuit specially designed to execute specific processing such as PLD (Programmable Logic Device), which is a processor whose circuit configuration can be changed after manufacturing such as FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), etc. Also included are dedicated electrical circuits, which are processors with configuration, and the like.
  • One processing unit may be composed of one of these various processors, or two or more processors of the same or different type (for example, a plurality of FPGAs, a combination of CPU and FPGA, or a combination of CPU and GPU).
  • a plurality of functional units may be configured by one processor.
  • a single processor is configured by combining one or more CPUs and software.
  • a processor acts as a plurality of functional units.
  • SoC System On Chip
  • various functional units are configured using one or more of the above various processors as a hardware structure.
  • the hardware structure of these various processors is, more specifically, an electrical circuit that combines circuit elements such as semiconductor elements.
  • Processor 82 is coupled to computer-readable media 84 , communication interface 86 , and input/output interface 88 via bus 90 .
  • a computer-readable medium 84 stores instructions for processor 82 to execute.
  • the computer-readable medium 84 includes RAM (Random Access Memory) and ROM (Read Only Memory) (not shown).
  • the computer-readable medium 84 may also include a magnetic storage medium such as a hard disk, an optical disk such as a CD (Compact Disc)-ROM, and a semiconductor memory such as a USB (Universal Serial Bus) memory.
  • Computer readable medium 84 may also serve as memory 79 shown in FIG.
  • a computer readable medium 84 stores a pattern manufacturing program 85 including one or more instructions.
  • the pattern manufacturing program 85 may be provided by a computer-readable non-transitory storage medium. Also, the pattern manufacturing program 85 may be provided as an application that can be downloaded from an external server.
  • the computer-readable medium 84 stores various data and various parameters.
  • the processor 82 executes the pattern manufacturing program 85 using the RAM of the computer-readable medium 84 as a work area, and uses the data and parameters stored in the computer-readable medium 84 to perform various processes of the pattern manufacturing apparatus 10. Execute.
  • the communication interface 86 communicably connects the control device 80 with an external device via a network (not shown).
  • the network is, for example, a LAN (Local Area Network).
  • the input/output interface 88 connects the control device 80 to the input device 92 and the display device 94 .
  • the input device 92 is, for example, a keyboard, mouse, multi-touch panel, other pointing device, or a combination thereof.
  • the display device 94 is a liquid crystal display, an organic EL (Electro-Luminescence) display, a projector, or a combination thereof. Various information related to the control device 80 is displayed on the display device 94 .
  • the conductive ink may adhere to unnecessary portions, causing a short circuit. do.
  • the size accuracy of the conductive pattern may be required to be within 100 ⁇ m error.
  • FIG. 8 is a diagram showing the dot arrangement in the ideal liquid ejection head 12 when a conductive pattern is formed in a print area having a size S in the Y direction of the base material.
  • ink dots arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching
  • ink dots arranged by ejecting ink from the nozzles 62 of the downstream nozzle region 64B are shown. Dots are indicated by relatively light hatching.
  • the nozzles 62 in the upstream nozzle region 64A and the nozzles 62 in the downstream nozzle region 64B are alternately arranged in the X direction. Therefore, as shown in FIG. 8, the ink dots arranged by the nozzles 62 in the upstream nozzle region 64A and the ink dots arranged by the nozzles 62 in the downstream nozzle region 64B are alternately arranged in the X direction. Also, the ink dots arranged by the nozzles 62 in the upstream nozzle region 64A and the ink dots arranged by the nozzles 62 in the downstream nozzle region 64B are aligned in the Y direction. As described above, according to the ideal liquid ejection head 12, it is possible to form a conductive pattern of size S in the Y direction, which is a desired size.
  • the liquid ejection head 12 may have variations in characteristics within the head due to manufacturing variations in the silicon die 44 .
  • an example using the liquid ejection head 12 having variations in the characteristics of the upstream nozzle region 64A and the downstream nozzle region 64B will be described.
  • the characteristic variation of each nozzle 62 within the same nozzle region will not be discussed.
  • FIG. 9 is a diagram showing a dot arrangement when a conductive pattern is formed in a print area having a size S in the Y direction of the substrate in the liquid ejection head 12 having characteristic variations in the head.
  • the ink dots arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching
  • the dots of ink ejected from the nozzles 62 of the downstream nozzle region 64B are indicated by relatively dark hatching.
  • Ink dots arranged by ejection are indicated by relatively light hatching.
  • FIG. 9 is a diagram showing a dot arrangement when a conductive pattern is formed in a print area having a size S in the Y direction of the substrate in the liquid ejection head 12 having characteristic variations in the head.
  • the ink dots arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching
  • displacement may occur in the direction (X direction) perpendicular to the movement direction of the base material.
  • X direction perpendicular to the movement direction of the base material.
  • the error is likely to be larger for the nozzles 62 which are also located at physically distant positions.
  • one of the upstream nozzle region 64A and the downstream nozzle region 64B (an example of “a plurality of nozzle regions”) of the liquid ejection head 12 is The nozzles 62 in a nozzle area (an example of a "specific nozzle area”) place ink dots that form the boundary area of the conductive pattern.
  • FIG. 10 shows a printed area 102 forming a conductive pattern on the surface of the substrate 100 and a non-printed area 104 different from the printed area 102 .
  • the print area 102 is a fixed area area having a size of SX in the X direction and SY in the Y direction.
  • the print area 102 has a boundary 102 A with the non-print area 104 .
  • the print area 102 also includes a border area 102B including the border 102A and a non-border area 102C other than the border area 102B.
  • a boundary area 102B shown in FIG. 10 is an area extending inward by one ink dot (one pixel) from the boundary 102A.
  • FIG. 11 is a diagram showing a conductive pattern formed in the printing area 102 by the pattern manufacturing apparatus 10.
  • the ink dots 110A arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching
  • the ink dots 110A arranged by ejecting ink from the nozzles 62 of the downstream nozzle region 64B are shown.
  • Ink dots 110B are indicated by relatively light hatching.
  • ink dots 110A are arranged in the boundary area 102B of the print area 102 by the nozzles 62 of the upstream nozzle area 64A.
  • ink dots 110A and 110B are arranged by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.
  • the pattern boundary region 102B is one pixel here, it may be two pixels or more depending on the characteristic variation between the nozzle regions. Also, here, the printing areas 102 are provided on the four sides of the boundary area 102B, but the boundary area 102B may be provided on at least one side.
  • Ink dots are arranged in the boundary region 102B if the nozzles 62 are in either one of the upstream nozzle region 64A and the downstream nozzle region 64B, but as shown in FIG. It is desirable to use the nozzles 62 in the upstream nozzle region 64A. As a result, landing interference between ink dots on the surface of the substrate 100 can be suppressed. This is because the ink ejected from the nozzles 62 of the upstream nozzle area 64A forming the boundary area 102B lands first, and then the ink ejected from the downstream nozzle area 64B lands on the periphery, so more accuracy is required. This is because the ink in the boundary area 102B that is drawn is difficult to move.
  • FIG. 12 is a diagram for explaining ink landing interference, and is a side view of the substrate 100.
  • FIG. FIG. 12 shows an ink dot 111A that has landed on the surface of the substrate 100 earlier, and an ink dot 111B that has landed after the ink dot 111A.
  • the ink dot 111B that landed later moves in the direction of the ink dot 111A by being pulled by the ink dot 111A that landed earlier.
  • the ink dot 111A has a higher impact position accuracy than the ink dot 111B. Therefore, by arranging the ink dots in the boundary area 102B first, the accuracy of the positions of the ink dots in the boundary area 102B can be improved.
  • a pretreatment liquid that is a pretreatment liquid for enhancing the anchor effect to the base material 100 and contains a functional material that suppresses wetting and spreading of the conductive ink is applied to the base material 100 in advance.
  • a chemical reaction between the ink that has landed on the surface of the base material 100 and the pretreatment liquid that has been applied to the surface of the base material causes the components of the ink that react with the pretreatment liquid to quickly coagulate, further suppressing landing interference. be able to.
  • ink dots are arranged by the nozzles 62 of the upstream nozzle region 64A and the nozzles 62 of the downstream nozzle region 64B in the non-boundary region 102C. Only the ink dots by the nozzles 62 in the region 64A are arranged, and the ink dots by the nozzles 62 in the downstream nozzle region 64B are not arranged.
  • the ink dots in the boundary region 102B are fewer than the ink dots by the nozzles 62 in the downstream nozzle region 64B, and the total amount of ink dots in the printing region 102 is equal to the nozzles 62 in the upstream nozzle region 64A and less than when the pattern is formed with the nozzles 62 in the downstream nozzle region 64B.
  • ink dots in the non-boundary area 102C so as to compensate for the decrease in ink dots in the boundary area 102B.
  • the position for supplementing the ink amount is desirably a position slightly inside the non-boundary region 102C from the boundary region 102B (for example, a region adjacent to the boundary region 102B in the non-boundary region 102C). By increasing the amount of ink at such a position, it is assumed that the increased amount of ink naturally spreads over the boundary area 102B where the amount of ink is relatively small.
  • the adjacent ink dots 110A need to be connected. That is, the dot size must be such that the ink dots 110A adjacent to each other are connected. Further, in order to further enhance the effect of pattern drawing accuracy, it is desirable that the ink dots forming the boundary area 102B be of the same droplet type (an example of “same size”). As a result, it is less likely to be affected by variations in characteristics between droplet types.
  • ink dots are arranged in the boundary region 102B of the printing region 102 only by the nozzles 62 of the upstream nozzle region 64A of the liquid ejection head 12.
  • Ink dots need only be arranged by the nozzles 62 . That is, dots are arranged in the boundary region 102B by the nozzles 62 of the downstream nozzle region 64B to the extent that the pattern drawing accuracy can be improved even if there are variations in the characteristics of the nozzle region of the liquid ejection head 12. good too.
  • 90% or more of the ink dots arranged in the boundary region 102B may be arranged by the nozzles 62 of the upstream nozzle region 64A. In this case, the ink dots are formed only by the nozzles 62 of the upstream nozzle region 64A. Included in what is placed.
  • FIG. 13 is a flow chart showing each process of the pattern manufacturing method by the pattern manufacturing apparatus 10.
  • the pattern manufacturing method corresponds to a printed matter manufacturing method.
  • a printed matter includes an electronic device, and the electronic device includes an electric component mounting board.
  • the pattern manufacturing method is implemented by the processor 82 executing a pattern manufacturing program 85 (see FIG. 7).
  • a pattern manufacturing program 85 see FIG. 7
  • FIG. 7 an example of forming a conductive pattern 1020 by arranging ink dots of conductive ink in a printing region including the upper surface of the IC 1006 of the printed wiring board 1002 will be described.
  • step S ⁇ b>1 the data acquisition unit 72 acquires conductive pattern data from an external device (not shown) via the communication interface 86 .
  • the data acquisition unit 72 may acquire conductive pattern data from the input device 92 or may acquire conductive pattern data from the computer-readable medium 84 .
  • step S2 the data processing unit 74 generates conductive ink ejection data from the conductive pattern data acquired in step S1.
  • step S3 (an example of the "pattern forming process"), the head control unit 76 and the transport control unit 78 form a conductive pattern in the print area of the printed wiring board 1002 according to the ejection data generated in step S2.
  • FIG. 14 is a flowchart showing the details of the conductive pattern forming process in step S3.
  • the transport control unit 78 controls the transport device 20 to transport the printed wiring board 1002 to the initial position.
  • the initial position is a position where the table 22 (printed wiring board 1002) is arranged on the -Y direction side (upstream side in the transport direction) of the head support member 14 (liquid ejection head 12).
  • the transport control unit 78 transports the printed wiring board 1002 in the Y direction.
  • step S13 the liquid ejection head 12 ejects conductive ink onto the printed wiring board 1002 that is transported in the Y direction.
  • the head controller 76 uses the nozzles 62 in the upstream nozzle area 64A to arrange ink dots in the boundary area including the boundary between the print area and the non-print area that is different from the print area.
  • step S14 the transport control unit 78 controls the transport device 20 to transport the printed wiring board 1002 in the -Y direction and print.
  • the wiring board 1002 is returned to the initial position again.
  • the transport control unit 78 transports the printed wiring board 1002 again in the Y direction.
  • step S16 the liquid ejection head 12 ejects ink onto the printed wiring board 1002 that is transported in the Y direction.
  • the head control unit 76 arranges ink dots in non-boundary areas other than the boundary areas in the print area using the nozzles 62 in the upstream nozzle area 64A and the nozzles 62 in the downstream nozzle area 64B.
  • ink dots are arranged in the boundary area by the nozzles 62 of the upstream nozzle area 64A, and ink dots are arranged in the non-boundary area by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.
  • ink dots are arranged in the boundary area by the nozzles 62 of the upstream nozzle area 64A, and ink dots are arranged in the non-boundary area by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.
  • step S13 the nozzles 62 of the upstream nozzle area 64A arrange ink dots in the entire printing area, and in step S16, the nozzles 62 of the downstream nozzle area 64B arrange non-border areas of the printing area. Ink dots may be placed in the boundary area. Further, in one transfer of the printed wiring board 1002 in the Y direction, the nozzles 62 of the upstream nozzle region 64A arrange ink dots in the entire printing region, and the nozzles 62 of the downstream nozzle region 64B dispose ink dots in the entire printing region. Ink dots may be placed in non-boundary areas other than the boundary areas to complete the conductive pattern.
  • FIG. 15 is a flow chart showing each step of the nozzle position adjustment method of the pattern manufacturing apparatus 10.
  • the nozzle position adjustment method is performed when the state of the pattern manufacturing apparatus 10 may change.
  • the case where the state of the pattern manufacturing apparatus 10 may change includes, for example, when the liquid ejection head 12 is removed, when maintenance is performed on the conveying device 20 or the like, or when the liquid ejection head 12 is left for a long period of time.
  • the nozzle position adjustment method is performed, for example, once every morning.
  • step S21 the head control unit 76 and the transport control unit 78 use predetermined nozzles 62 to print a cross pattern for checking the nozzle position at predetermined positions on the printed wiring board 1002 .
  • a cross pattern is printed using the nozzles 62 in the upstream nozzle region 64A.
  • FIG. 16 is a schematic diagram showing the cross pattern 112 printed on the printed wiring board 1002. As shown in FIG. The position where the cross pattern 112 is printed may be the upper surface of the IC 1006 .
  • step S22 an example of a “reading step”
  • the camera control unit 77 causes the camera 13 to read the cross pattern 112 printed in step S3 and the alignment marks 1005 of the printed wiring board 1002, Get the reading result.
  • step S23 the head control unit 76 adjusts the nozzle positions of the nozzles 62 in the upstream nozzle region 64A (the positions of the liquid ejection heads 12) based on the reading results obtained in step S4. do.
  • the positional relationship between the nozzle 62 that printed the cross pattern 112 and the camera 13 can be found from the result of reading the cross pattern 112
  • the positional relationship between the nozzle 62 and the alignment mark 1005 can be found from the result of reading the alignment mark 1005 .
  • the positional relationship between the alignment mark 1005 and the printing area is known in advance from the conductive pattern data. Therefore, the nozzle positions can be adjusted so that the nozzles 62 can place ink dots in the boundary area of the print area.
  • the nozzles 62 of the upstream nozzle area 64A arrange ink dots in the boundary area of the printing area. Therefore, priority is given to the nozzle position adjustment of the nozzles 62 in the upstream nozzle region 64A. This is because if an attempt is made to make adjustments in a plurality of nozzle regions, the adjustment will end up being an average adjustment.
  • FIG. 17 is an overall configuration diagram of a pattern manufacturing apparatus 10A according to another embodiment. Here, differences between the pattern manufacturing apparatus 10A and the pattern manufacturing apparatus 10 will be described, and descriptions of common components between the two will be omitted as appropriate.
  • the pattern manufacturing apparatus 10A includes a liquid ejection head 12B.
  • the liquid ejection head 12B is a short head whose total length in the Y direction is less than the length of the printed wiring board 1002 in the Y direction.
  • the liquid ejection head 12B has a plurality of nozzle regions each having a plurality of nozzles (not shown), which are divided according to the positions of the nozzles in the X direction (an example of the “direction of relative movement”). include.
  • the arrangement of the plurality of nozzles is, for example, one-row arrangement along the Y direction or two-row zigzag arrangement.
  • the number of nozzles in the Y direction may be appropriately determined according to the printing resolution in the Y direction.
  • the liquid ejection head 12B is supported by the carriage 26.
  • a carriage 26 (an example of a “relative movement mechanism”) is movably supported in the X direction and the ⁇ X direction by a guide 28 arranged along the X direction.
  • a dot row of conductive ink is formed in the X direction on the printed wiring board 1002 .
  • FIG. 18 is a perspective plan view of a nozzle surface 202 in another form of head module 200 applied to the liquid ejection head 12.
  • FIG. Parts common to those in FIG. 5 are denoted by common reference numerals, and detailed description thereof will be omitted.
  • the shape of the nozzle surface 202 of the head module 200 is the same as the shape of the nozzle surface 60.
  • the nozzle surface 202 of the head module 200 has a first nozzle area 204A and a second nozzle area 204B, which are two nozzle areas with independent flow paths in the W direction.
  • Nozzles 206A are arranged in a two-dimensional matrix in the first nozzle region 204A
  • nozzles 206B are arranged in a two-dimensional matrix in the second nozzle region 204B.
  • the nozzles 206A belonging to the first nozzle region 204A and the nozzles 206B belonging to the second nozzle region 204B have the same number and the same arrangement.
  • Nozzles 206A and 204B are arranged alternately in a projection nozzle row obtained by projecting nozzles 206A of the first nozzle region 204A and nozzles 206B of the second nozzle region 204B of the head module 200 along the X direction. That is, the nozzle number of the nozzle 206A is odd, and the nozzle number of the nozzle 206B is even.
  • a supply channel 208A is provided for each nozzle row composed of a plurality of nozzles 206A arranged along the W direction.
  • the nozzles 206A belonging to the same nozzle row are supplied with ink from the same supply channel 208A.
  • the plurality of supply channels 208A communicate with a main supply channel 210A provided along the V direction.
  • a supply channel 208B is provided for each nozzle row composed of a plurality of nozzles 206B arranged along the W direction.
  • the nozzles 206B belonging to the same nozzle row are supplied with ink from the same supply channel 208B.
  • the plurality of supply channels 208B communicate with the main supply channel 210B provided along the V direction.
  • FIG. 19 is a cross-sectional view showing the internal structure of the head module 200.
  • FIG. Here, the first nozzle region 204A is shown.
  • the silicon die 44 of the head module 200 includes a nozzle plate 212 , a channel structure 214 , piezoelectric elements 230 , a vibration plate 232 and an adhesive layer 234 .
  • the nozzle plate 212 is provided on the lower surface of the channel structure 214 and constitutes the nozzle surface 202 .
  • the nozzle plate 212 is provided with nozzles 206A.
  • the channel structure 214 is provided with a supply channel 208A, an individual supply channel 216, a pressure chamber 218, a nozzle communication channel 220, an individual circulation channel 226, and a common circulation channel 228.
  • the supply channel 208A communicates with the main supply channel 210A (see FIG. 18).
  • the individual supply channel 216 allows the supply channel 208A and the pressure chamber 218 to communicate with each other.
  • the pressure chamber 218 is provided corresponding to the nozzle 206A.
  • the pressure chamber 218 has a substantially square planar shape, and the individual supply passage 216 is provided at one of both diagonal corners, and the nozzle communication passage 220 is provided at the other corner.
  • the shape of the pressure chamber 218 is not limited to a square, and may be polygonal, circular, or elliptical.
  • the nozzle communication passage 220 communicates the pressure chamber 218 and the nozzle 206A.
  • the individual circulation channel 226 allows the nozzle communication channel 220 and the common circulation channel 228 to communicate with each other.
  • the circulation common channel 228 communicates with the ink recovery channel 48 (see FIG. 4) via the main recovery channel (not shown).
  • a vibration plate 232 is provided on the upper surface of the flow path structure 214 .
  • the piezoelectric element 230 is arranged on the upper surface of the vibration plate 232 with an adhesive layer 234 interposed therebetween.
  • the piezoelectric element 230 is an actuator for ejecting ink from the corresponding nozzle 206A.
  • the piezoelectric element 230 has a laminated structure in which an upper electrode (individual electrode) 236, a piezoelectric layer 238, and a lower electrode (common electrode) 240 are laminated.
  • the upper electrode 236 is an individual electrode patterned in accordance with the shape of each pressure chamber 218 , and the piezoelectric element 230 is provided for each pressure chamber 218 .
  • ink supplied from an ink tank (not shown) through the ink supply channel 46 (see FIG. 4) is supplied to the pressure chamber through the main supply channel 210A and the supply channel 208A. 218.
  • a drive voltage is applied to the upper electrode 236 of the piezoelectric element 230 provided in the corresponding pressure chamber 218, the piezoelectric element 230 and the vibration plate 232 are deformed to change the volume of the pressure chamber 218, resulting in a pressure increase.
  • Ink is ejected from the nozzle 206A through the nozzle communication path 220 due to the change.
  • Ink not ejected from the nozzles 206A is recovered to an ink tank (not shown) through the individual circulation channel 226, the common circulation channel 228, the main recovery channel, and the ink recovery channel 48. This prevents thickening of the ink from the nozzle 206A during non-ejection.
  • the internal structure and operation of the second nozzle region 204B are similar to those of the first nozzle region 204A.
  • the nozzles 206A of the first nozzle area 204A or the nozzles 206B of the second nozzle area 204B arrange ink dots in the boundary area of the substrate, thereby Even if there are variations in characteristics due to the channel structure, the boundary drawing accuracy can be improved.
  • FIG. 20A and 20B are a plan view and an enlarged plan view of a nozzle surface 302 in another form of head module 300 applied to the liquid ejection head 12.
  • FIG. The nozzle surface 302 of the head module 300 has a first nozzle area 304A and a second nozzle area 304B.
  • Nozzles 306A are arranged in a row at intervals L along the X direction in the first nozzle region 304A, and nozzles 306B are arranged in a row at intervals L along the X direction in the second nozzle region 304B.
  • the nozzles 306A and 306B are arranged in a zigzag arrangement at positions shifted by L/2 in the X direction.
  • Nozzles 306A and 304B are arranged alternately in a projected nozzle row obtained by projecting nozzles 306A of the first nozzle region 304A and nozzles 306B of the second nozzle region 304B of the head module 300 along the X direction.
  • the nozzles 306A of the first nozzle region 304A or the nozzles 306B of the second nozzle region 304B arrange ink dots in the boundary region of the base material, thereby Even if there are variations in characteristics, it is possible to improve the drawing accuracy of the boundary.
  • the liquid ejection head 12 includes two nozzle regions divided according to the position of the nozzles in the direction of relative movement, and ink dots are arranged in the boundary region with the nozzles of one of the nozzle regions.
  • ink dots may be arranged in boundary regions by nozzles in any of the nozzle regions.
  • the present embodiment can be applied to the formation of the insulating pattern 1024 .
  • the present embodiment is not limited to conductive ink and insulating ink, and can be applied to formation of various patterns using a liquid ejection head.
  • Head module 302 Nozzle surface 304A... First nozzle area 304B... Second nozzle area 306A, 306B... Nozzle 1000... Electric component mounting board 1002... Printed wiring board 1004... Component mounting surface 1005... Alignment mark 1006... IC 1006A side surface 1006B rear surface 1006C upper surface 1008 resistor 1008A resistor array 1009 electrode 1010 capacitor 1020 conductive pattern 1022 insulating coating 1024 insulating pattern 1030 board-side electrode 1032 element-side electrode 1034 solder bump S1 ⁇ S3 Steps S11 to S16 of the pattern manufacturing method Detailed steps S21 to S23 of the conductive pattern forming process Steps of the nozzle position adjusting method

Abstract

Provided are a pattern manufacturing method, a program, and a pattern manufacturing device that increase pattern drawing accuracy even when there is variation in characteristics within a liquid ejection head. When a substrate and a liquid ejection head are relatively moved, said liquid ejection head including a plurality of nozzle regions that respectively have a plurality of nozzles and are divided according to the locations of said nozzles in the direction of relative movement, and a liquid is ejected from the plurality of nozzles to position a plurality of dots in a printing region of a surface of the substrate and form a pattern, the nozzle of a specific nozzle region among the plurality of nozzle regions is used to position a dot in a border region of the printing region, said border region including a border with a non-printing region that is different from the printing region.

Description

パターン製造方法、プログラム、及びパターン製造装置Pattern manufacturing method, program, and pattern manufacturing apparatus
　本発明はパターン製造方法、プログラム、及びパターン製造装置に係り、特に液体吐出ヘッドを用いて高精度のパターンを形成する技術に関する。 The present invention relates to a pattern manufacturing method, a program, and a pattern manufacturing apparatus, and more particularly to technology for forming highly accurate patterns using a liquid ejection head.
　インクジェット印刷において、印刷パターンの境界部の描画精度、特に印刷する範囲の寸法精度を高めたい場合がある。 In inkjet printing, there are cases where it is desired to increase the drawing accuracy of the boundary part of the print pattern, especially the dimensional accuracy of the printing range.
　印刷の精度を高めるための方法として、特許文献１には、「シフトモード」の印刷に起因する境界部の凹凸を無くすため、境界部だけ通常モード（非シフトモード）で印刷し、内部はシフトモードで印刷する技術が記載されている。 As a method for improving printing accuracy, in Patent Document 1, in order to eliminate unevenness in the boundary caused by printing in "shift mode", only the boundary is printed in normal mode (non-shift mode), and the inside is shifted. A technique for printing in mode is described.
　また、特許文献２には、印刷基材上でのインクドット間の干渉を防ぎ、画質を向上させるために、前処理液を塗布することが記載されている。 In addition, Patent Document 2 describes applying a pretreatment liquid to prevent interference between ink dots on the printing substrate and improve image quality.
特開平６－１７１０９１号公報JP-A-6-171091 特開２００７－１０４５号公報Japanese Unexamined Patent Application Publication No. 2007-1045
　しかしながら、特許文献１に記載された技術は、ノズル間の特性ばらつきに起因する描画パターンの崩れには対応できず、描画精度を十分に高めることはできないという課題があった。 However, the technique described in Patent Document 1 cannot cope with the collapse of the drawing pattern caused by the characteristic variation between nozzles, and has the problem that the drawing accuracy cannot be sufficiently improved.
　また、特許文献２に記載された技術は、基材上での精度を確保できるだけであり、ノズル間の特性ばらつきを補正することはできず、描画精度を十分に高めることはできないという課題があった。 In addition, the technique described in Patent Document 2 can only ensure accuracy on the base material, and cannot compensate for variations in characteristics between nozzles. rice field.
　本発明はこのような事情に鑑みてなされたもので、液体吐出ヘッド内に特性ばらつきがあってもパターンの描画精度を高めるパターン製造方法、プログラム、及びパターン製造装置を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a pattern manufacturing method, a program, and a pattern manufacturing apparatus that improve pattern drawing accuracy even if there are variations in characteristics within the liquid ejection head. .
　上記目的を達成するためのパターン製造方法の一の態様は、液体を吐出する複数のノズルを有する液体吐出ヘッドと、基材及び液体吐出ヘッドを相対移動させる相対移動機構と、を備えるパターン製造装置を用いたパターン製造方法であって、液体吐出ヘッドは、それぞれ複数のノズルを有する複数のノズル領域であって、相対移動の方向におけるノズルの位置に応じて分割された複数のノズル領域を含み、基材及び液体吐出ヘッドを相対移動させて複数のノズルから液体を吐出させ、基材の表面の印刷領域に複数のドットを配置してパターンを形成するパターン形成工程を備え、パターン形成工程は、印刷領域のうち印刷領域とは異なる非印刷領域との境界を含む境界領域に、複数のノズル領域のうちの特定のノズル領域のノズルによってドットを配置する、パターン製造方法である。本態様によれば、液体吐出ヘッド内に特性ばらつきがあってもパターンの描画精度を高めることができる。 One aspect of a pattern manufacturing method for achieving the above object is a pattern manufacturing apparatus comprising a liquid ejection head having a plurality of nozzles for ejecting liquid, and a relative movement mechanism for relatively moving the substrate and the liquid ejection head. wherein the liquid ejection head includes a plurality of nozzle regions each having a plurality of nozzles, the nozzle regions being divided according to the positions of the nozzles in the direction of relative movement, A pattern forming step is provided in which the substrate and the liquid ejection head are moved relative to each other to eject the liquid from a plurality of nozzles to form a pattern by arranging a plurality of dots in a printing region on the surface of the substrate, the pattern forming step comprising: In this pattern manufacturing method, dots are arranged by nozzles of a specific nozzle area among a plurality of nozzle areas in a boundary area including a boundary between a non-printing area different from the printing area in the printing area. According to this aspect, it is possible to improve the drawing accuracy of the pattern even if there are variations in characteristics within the liquid ejection head.
　パターン形成工程は、印刷領域のうち境界領域以外の非境界領域に、複数のノズル領域のノズルによってドットを配置することが好ましい。これにより、印刷領域にドットを配置したパターンを形成することができる。 In the pattern forming step, dots are preferably arranged in non-boundary areas other than the boundary areas of the print area by nozzles of a plurality of nozzle areas. As a result, a pattern in which dots are arranged in the print area can be formed.
　パターン形成工程は、特定のノズル領域のノズルによって境界領域にドットを配置してから複数のノズル領域のノズルによって非境界領域にドットを配置することが好ましい。これにより、境界領域に配置したドットが着弾干渉により移動することを抑制することができる。 In the pattern forming process, it is preferable that the nozzles of a specific nozzle area arrange dots in the boundary area and then the nozzles of a plurality of nozzle areas arrange dots in the non-boundary area. As a result, it is possible to prevent the dots arranged in the boundary area from moving due to landing interference.
　特定のノズル領域は、相対移動の上流側に配置された上流側ノズル領域であることが好ましい。これにより、非境界領域よりも先に境界領域にドットを配置することができる。 The specific nozzle area is preferably an upstream nozzle area arranged on the upstream side of the relative movement. Dots can thus be placed in the boundary area before they are placed in the non-boundary area.
　パターン形成工程は、境界領域以外の領域に配置するドットを増加させることが好ましい。これにより、液体総量の減少を抑制することができる。 In the pattern forming process, it is preferable to increase the number of dots arranged in areas other than the boundary area. As a result, reduction in the total amount of liquid can be suppressed.
　パターン形成工程は、印刷領域のうち境界領域に隣接する領域に、境界領域に配置するドットのサイズよりも相対的に大きいサイズのドットを配置することが好ましい。これにより、液体量が相対的に少ない境界領域にドットを広げることができる。 In the pattern forming step, it is preferable to arrange dots having a size relatively larger than the size of the dots arranged in the boundary area in the area adjacent to the boundary area in the printing area. As a result, the dots can be spread over the boundary areas where the amount of liquid is relatively small.
　パターン形成工程は、基材及び液体吐出ヘッドの特定の方向の複数回の相対移動によってパターンを形成することが好ましい。これにより、パターンを適切に形成することができる。 In the pattern forming step, the pattern is preferably formed by relatively moving the substrate and the liquid ejection head multiple times in a specific direction. Thereby, a pattern can be formed appropriately.
　パターン形成工程は、境界領域に、特定のノズル領域のノズルのみによってドットを配置することが好ましい。これにより、液体吐出ヘッド内の特性ばらつきを排除して境界領域の描画精度を高めることができる。なお、「特定のノズル領域のノズルのみ」とは、実質的に特定のノズル領域のノズルのみによってドットが配置されていればよく、本発明の効果を奏する程度に特定のノズル領域以外のノズルによって境界領域にドットが配置されることも含む。 In the pattern forming process, it is preferable to arrange dots in the boundary area using only nozzles in a specific nozzle area. As a result, it is possible to eliminate characteristic variations in the liquid ejection head and improve the drawing accuracy of the boundary area. Note that "only nozzles in a specific nozzle region" means that dots are substantially arranged only by nozzles in the specific nozzle region, and dots are arranged by nozzles other than the specific nozzle region to the extent that the effect of the present invention is exhibited. It also includes placing dots in the boundary area.
　複数のノズルは、それぞれ複数のサイズのドットを配置可能であり、パターン形成工程は、境界領域に同一サイズのドットを配置することが好ましい。これにより、ドットサイズ間の特性ばらつきの影響を排除することができる。 A plurality of nozzles can each arrange dots of a plurality of sizes, and the pattern forming step preferably arranges dots of the same size in the boundary area. This makes it possible to eliminate the influence of characteristic variations between dot sizes.
　基材は、位置合わせマークを備え、位置合わせマークを読み取る読取工程と、読取工程における位置合わせマークの読取結果を用いて特定のノズル領域のノズルの着弾位置を調整する調整工程と、を備えることが好ましい。これにより、境界領域の描画精度をさらに高めることができる。 The substrate has an alignment mark, and comprises a reading step of reading the alignment mark, and an adjusting step of adjusting the landing position of the nozzle in a specific nozzle region using the result of reading the alignment mark in the reading step. is preferred. Thereby, the drawing accuracy of the boundary area can be further improved.
　基材に対して予め液体の濡れ広がりを抑制する機能性材料を含んだ前処理液を予め塗布する前処理液塗布工程を備えることが好ましい。これにより、液体の着弾干渉を抑制してパターンの描画精度をさらに高めることができる。 It is preferable to include a pretreatment liquid application step of previously applying a pretreatment liquid containing a functional material that suppresses wetting and spreading of the liquid to the base material. Thereby, the landing interference of the liquid can be suppressed, and the drawing accuracy of the pattern can be further improved.
　基材は、電気部品が実装された電気回路基板であり、印刷領域は、電磁波シールドの形成の対象とされる電気部品を含み、液体は導電性液体であることが好ましい。これにより、電磁波シールドの形成の対象とされる電気部品に電磁波シールドとして機能するパターンを形成することができる。 It is preferable that the base material is an electric circuit board on which electric components are mounted, the printed area includes the electric components to form an electromagnetic wave shield, and the liquid is a conductive liquid. As a result, a pattern that functions as an electromagnetic shield can be formed on the electrical component that is the target of forming the electromagnetic shield.
　上記目的を達成するためのプログラムの一の態様は、上記のパターン製造方法をコンピュータに実行させるためのプログラムである。このプログラムが記録された、コンピュータが読み取り可能な非一時的記憶媒体も本態様に含んでよい。 One aspect of the program for achieving the above object is a program for causing a computer to execute the above pattern manufacturing method. A computer-readable non-transitory storage medium in which this program is recorded may also be included in this embodiment.
　上記目的を達成するためのパターン製造装置の一の態様は、液体を吐出する複数のノズルを有する液体吐出ヘッドと、基材及び液体吐出ヘッドを相対移動させる相対移動機構と、少なくとも１つのプロセッサと、少なくとも１つのプロセッサに実行させるための命令を記憶する少なくとも１つのメモリと、を備え、液体吐出ヘッドは、それぞれ複数のノズルを有する複数のノズル領域であって、相対移動の方向におけるノズルの位置に応じて分割された複数のノズル領域を含み、少なくとも１つのプロセッサは、基材及び液体吐出ヘッドを相対移動させて複数のノズルから液体を吐出させ、基材の表面の印刷領域に複数のドットを配置してパターンを形成し、印刷領域のうち印刷領域とは異なる非印刷領域との境界を含む境界領域に、複数のノズル領域のうちの特定のノズル領域のノズルによってドットを配置する、パターン製造装置である。本態様によれば、液体吐出ヘッド内に特性ばらつきがあってもパターンの描画精度を高めることができる。 One aspect of a pattern manufacturing apparatus for achieving the above object comprises a liquid ejection head having a plurality of nozzles for ejecting liquid, a relative movement mechanism for relatively moving the substrate and the liquid ejection head, and at least one processor. , and at least one memory for storing instructions for causing the at least one processor to execute, the liquid ejection head having a plurality of nozzle regions each having a plurality of nozzles, the positions of the nozzles in the direction of relative movement. at least one processor causes the substrate and the liquid ejection head to relatively move to eject the liquid from the plurality of nozzles to form a plurality of dots in the print area on the surface of the substrate are arranged to form a pattern, and dots are arranged by nozzles of a specific nozzle region among a plurality of nozzle regions in a boundary region including a boundary with a non-printing region different from the printing region in the printing region. manufacturing equipment. According to this aspect, it is possible to improve the drawing accuracy of the pattern even if there are variations in characteristics within the liquid ejection head.
　本発明によれば、液体吐出ヘッド内に特性ばらつきがあってもパターンの描画精度を高めることができる。 According to the present invention, pattern drawing accuracy can be improved even if there are variations in characteristics within the liquid ejection head.
図１は、電気部品実装基板の斜視図である。FIG. 1 is a perspective view of an electrical component mounting board. 図２は、電気部品実装基板の立体構造を示す断面図である。FIG. 2 is a cross-sectional view showing the three-dimensional structure of the electrical component mounting board. 図３は、パターン製造装置の全体構成図である。FIG. 3 is an overall configuration diagram of the pattern manufacturing apparatus. 図４は、ヘッドモジュールの斜視図である。FIG. 4 is a perspective view of the head module. 図５は、シリコンダイのノズル面の平面図である。FIG. 5 is a plan view of the nozzle surface of the silicon die. 図６は、パターン製造装置の電気的構成を示す機能ブロック図である。FIG. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing apparatus. 図７は、パターン製造装置のハードウェアの構成例を示すブロック図である。FIG. 7 is a block diagram showing a hardware configuration example of the pattern manufacturing apparatus. 図８は、印刷領域に対して導電パターンを形成した場合のドット配置を示す図である。FIG. 8 is a diagram showing dot arrangement when a conductive pattern is formed in a print area. 図９は、印刷領域に対して導電パターンを形成した場合のドット配置を示す図である。FIG. 9 is a diagram showing dot arrangement when a conductive pattern is formed in a printing area. 図１０は、基材の表面の導電パターンを形成する印刷領域、及び非印刷領域を示す図である。FIG. 10 is a diagram showing a printed area forming a conductive pattern on the surface of a substrate and a non-printed area. 図１１は、印刷領域に形成した導電パターンを示す図である。FIG. 11 is a diagram showing a conductive pattern formed in the printing area. 図１２は、インクの着弾干渉を説明するための図である。FIG. 12 is a diagram for explaining ink landing interference. 図１３は、パターン製造装置によるパターン製造方法の各工程を示すフローチャートである。FIG. 13 is a flow chart showing each step of the pattern manufacturing method by the pattern manufacturing apparatus. 図１４は、導電パターンの形成工程の詳細を示すフローチャートである。FIG. 14 is a flow chart showing the details of the conductive pattern forming process. 図１５は、パターン製造装置のノズル位置調整方法の各工程を示すフローチャートである。FIG. 15 is a flow chart showing each step of the nozzle position adjustment method of the pattern manufacturing apparatus. 図１６は、プリント配線基板に印刷された十字パターンを示す模式図である。FIG. 16 is a schematic diagram showing a cross pattern printed on a printed wiring board. 図１７は、パターン製造装置の全体構成図である。FIG. 17 is an overall configuration diagram of the pattern manufacturing apparatus. 図１８は、ノズル面の平面透視図である。FIG. 18 is a plan perspective view of the nozzle surface. 図１９は、ヘッドモジュールの内部構造を示す断面図である。FIG. 19 is a cross-sectional view showing the internal structure of the head module. 図２０は、ノズル面の平面図と平面拡大図である。FIG. 20 is a plan view and an enlarged plan view of the nozzle surface.
　以下、添付図面に従って本発明の好ましい実施形態について詳説する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
　［電気部品実装基板の構成］
　図１は、電気部品実装基板１０００の斜視図である。図１に示すように、電気部品実装基板１０００は、プリント配線基板１００２の部品実装面１００４に、ＩＣ１００６、抵抗器１００８、及びコンデンサ１０１０が実装されたものである。 [Configuration of electrical component mounting board]
FIG. 1 is a perspective view of an electrical component mounting board 1000. FIG. As shown in FIG. 1, the electrical component mounting board 1000 is obtained by mounting an IC 1006 , a resistor 1008 and a capacitor 1010 on a component mounting surface 1004 of a printed wiring board 1002 .
　電気部品実装基板１０００には、ＩＣ１００６に対して導電パターン１０２０が形成され、抵抗器１００８、及びコンデンサ１０１０に対して絶縁被覆１０２２が形成される。また、電気部品実装基板１０００には、プリント配線基板１００２の電気部品が実装されずに露出する電極１００９に対して絶縁被覆１０２２が形成される。 A conductive pattern 1020 is formed on the electric component mounting board 1000 for the IC 1006 , and an insulating coating 1022 is formed for the resistor 1008 and the capacitor 1010 . Also, on the electrical component mounting board 1000, an insulating coating 1022 is formed on the electrodes 1009 exposed without the electrical components of the printed wiring board 1002 being mounted.
　図１には、プリント配線基板１００２の一方の面が部品実装面１００４とされる態様を例示したが、プリント配線基板１００２の他方の面が部品実装面とされてもよいし、プリント配線基板１００２の一方の面及び他方の面の両面が部品実装面とされてもよい。 Although FIG. 1 illustrates an embodiment in which one surface of the printed wiring board 1002 is used as the component mounting surface 1004, the other surface of the printed wiring board 1002 may be used as the component mounting surface. Both one surface and the other surface of may be used as component mounting surfaces.
　プリント配線基板１００２には、２つのアライメントマーク１００５（「位置合わせマーク」の一例）が設けられる。アライメントマーク１００５は、プリント配線基板１００２の基準となる位置を示すものである。後述するカメラ１３（図３参照）によってアライメントマーク１００５を撮影することで、プリント配線基板１００２、及び後述する液体吐出ヘッド１２（図３参照）の相対的な位置ずれ量が検知される。アライメントマーク１００５の数、位置、及び形状は、適宜決めることができる。 The printed wiring board 1002 is provided with two alignment marks 1005 (an example of "alignment marks"). The alignment mark 1005 indicates a reference position of the printed wiring board 1002 . By photographing the alignment mark 1005 with a camera 13 (see FIG. 3), which will be described later, the amount of relative positional deviation between the printed wiring board 1002 and the liquid ejection head 12 (see FIG. 3), which will be described later, is detected. The number, positions, and shapes of the alignment marks 1005 can be determined as appropriate.
　ＩＣ１００６は、半導体集積回路が樹脂等のパッケージに封入された電気部品である。ＩＣ１００６は、パッケージの外部に電極が露出される。なお、ＩＣはIntegrated Circuitの省略語である。また、電気部品は、電子部品と呼ばれる場合もある。 The IC 1006 is an electric component in which a semiconductor integrated circuit is enclosed in a package such as resin. The IC 1006 has electrodes exposed outside the package. Note that IC is an abbreviation for Integrated Circuit. Also, electrical components are sometimes called electronic components.
　抵抗器１００８は、電気抵抗素子を含む。また、抵抗器１００８は、集積化された複数の電気抵抗素子が樹脂等のパッケージに封入された抵抗アレイ１００８Ａを含む。コンデンサ１０１０は、電解コンデンサ、及びセラミックコンデンサ等の各種のコンデンサを含む。 A resistor 1008 includes an electrical resistance element. Resistor 1008 also includes a resistor array 1008A in which a plurality of integrated electric resistance elements are encapsulated in a package such as resin. Capacitor 1010 includes various capacitors such as electrolytic capacitors and ceramic capacitors.
　プリント配線基板１００２に実装される電気部品のうち、ＩＣ１００６の配置領域は、絶縁インクを用いて絶縁パターン１０２４（図２参照）が形成され、更に、絶縁パターンの少なくとも一部に対して、導電インクを用いて導電パターン１０２０が形成される。なお、図１では、絶縁パターン１０２４の図示が省略されている。 An insulating pattern 1024 (see FIG. 2) is formed using an insulating ink in an arrangement area of the IC 1006 among the electrical components mounted on the printed wiring board 1002, and at least part of the insulating pattern is coated with a conductive ink. is used to form the conductive pattern 1020 . 1, illustration of the insulating pattern 1024 is omitted.
　導電パターン１０２０は、液体吐出ヘッド１２（図３参照）から導電インクを吐出させることで、導電パターン１０２０の形成領域（「印刷領域」の一例）に導電インクのインクドットを配置し、導電インクのインクドットの連続体を乾燥させ、硬化させることで形成される。 The conductive pattern 1020 is formed by ejecting conductive ink from the liquid ejection head 12 (see FIG. 3), thereby disposing ink dots of the conductive ink in a formation region (an example of a “printing region”) of the conductive pattern 1020 . It is formed by drying and curing a series of ink dots.
　絶縁被覆１０２２、及び絶縁パターン１０２４は、不図示の液体吐出ヘッドから絶縁インクを吐出させることで、絶縁被覆１０２２、及び絶縁パターン１０２４の形成領域に絶縁インクのインクドットを配置し、絶縁インクのインクドットの連続体を乾燥させ、硬化させることで形成される。 The insulating coating 1022 and the insulating pattern 1024 are formed by ejecting insulating ink from a liquid ejection head (not shown) to arrange ink dots of the insulating ink in the formation regions of the insulating coating 1022 and the insulating pattern 1024 . It is formed by drying and curing a series of dots.
　導電パターン１０２０は、ＩＣ１００６が受ける電磁波の抑制、及びＩＣ１００６から放出される電磁波の抑制を目的とする電磁波シールドとして機能する。絶縁パターン１０２４は、導電パターン１０２０とＩＣ１００６との電気的絶縁を確保する絶縁部材、導電パターン１０２０とＩＣ１００６と密着性を確保する接着部材、及び導電パターン１０２０の下地の平坦性を確保する部材等として機能する。 The conductive pattern 1020 functions as an electromagnetic shield for the purpose of suppressing electromagnetic waves received by the IC 1006 and suppressing electromagnetic waves emitted from the IC 1006 . The insulating pattern 1024 serves as an insulating member for ensuring electrical insulation between the conductive pattern 1020 and the IC 1006, an adhesive member for ensuring adhesion between the conductive pattern 1020 and the IC 1006, and a member for ensuring the flatness of the base of the conductive pattern 1020. Function.
　プリント配線基板１００２のうち、電磁波シールドを不要とする電気部品が配置される部品領域の少なくとも一部は、導電パターン１０２０は形成されず、絶縁被覆１０２２を用いて被覆される。電磁波シールドを不要とする電気部品は、抵抗器１００８、コンデンサ１０１０の他、ダイオード、コイル、トランス、及びスイッチ等を含む。 At least a portion of the component area of the printed wiring board 1002 where electrical components that do not require electromagnetic wave shielding are arranged is not formed with the conductive pattern 1020 and is covered with an insulating coating 1022 . Electrical parts that do not require electromagnetic shielding include resistors 1008, capacitors 1010, diodes, coils, transformers, switches, and the like.
　また、電極１００９が配置される電極領域は、絶縁被覆１０２２を用いて被覆される。絶縁被覆１０２２は、導電パターン１０２０が形成される際に微粒子化された導電インクが、抵抗器１００８等へ付着して生じる電気回路の短絡を抑制する。 Also, the electrode area where the electrode 1009 is arranged is covered with an insulating coating 1022 . The insulating coating 1022 suppresses a short circuit of an electric circuit caused by adhesion of finely divided conductive ink to the resistor 1008 or the like when the conductive pattern 1020 is formed.
　なお、ＩＣ１００６、抵抗器１００８及びコンデンサ１０１０が実装されたプリント配線基板１００２は、ＩＣを含む電気部品が実装された「電気回路基板」の一例である。ＩＣ１００６は、「電磁波シールドの形成の対象とされる電気部品」の一例である。 The printed wiring board 1002 on which the IC 1006, the resistor 1008 and the capacitor 1010 are mounted is an example of an "electric circuit board" on which electric parts including the IC are mounted. The IC 1006 is an example of "an electrical component for which electromagnetic wave shielding is to be formed".
　図２は、電気部品実装基板１０００の立体構造を示す断面図である。図２は、図１に示した任意のＩＣ１００６について、絶縁パターン１０２４、及び導電パターン１０２０が形成された状態の断面を模式的に示している。 FIG. 2 is a cross-sectional view showing the three-dimensional structure of the electrical component mounting board 1000. FIG. FIG. 2 schematically shows a cross section of any IC 1006 shown in FIG. 1 with insulating patterns 1024 and conductive patterns 1020 formed thereon.
　プリント配線基板１００２の部品実装面１００４に形成される基板側電極１０３０、及びＩＣ１００６の素子側電極１０３２は、はんだバンプ１０３４を介して電気接続される。 Board-side electrodes 1030 formed on the component mounting surface 1004 of the printed wiring board 1002 and element-side electrodes 1032 of the IC 1006 are electrically connected via solder bumps 1034 .
　絶縁パターン１０２４は、ＩＣ１００６の４つの側面１００６Ａを囲むＩＣ１００６の周囲であり、ＩＣ１００６の素子側電極１０３２が形成される裏面１００６Ｂよりもプリント配線基板１００２の側に形成される。絶縁パターン１０２４は、ＩＣ１００６の側面１００６Ａと接触する位置に形成されてもよい。絶縁パターン１０２４は、ＩＣ１００６の裏面１００６Ｂ、及びプリント配線基板１００２の部品実装面１００４の間に形成されてもよい。 The insulating pattern 1024 is around the IC 1006 surrounding the four side surfaces 1006A of the IC 1006, and is formed closer to the printed wiring board 1002 than the back surface 1006B of the IC 1006 on which the element-side electrodes 1032 are formed. Insulating pattern 1024 may be formed at a location that contacts side 1006A of IC 1006 . The insulating pattern 1024 may be formed between the back surface 1006B of the IC 1006 and the component mounting surface 1004 of the printed wiring board 1002 .
　導電パターン１０２０は、絶縁パターン１０２４の少なくとも一部に重ねて形成される。図２は、導電パターン１０２０が絶縁パターン１０２４の全面に重ねて形成される態様を示している。 The conductive pattern 1020 is formed to overlap at least part of the insulating pattern 1024 . FIG. 2 shows a mode in which the conductive pattern 1020 is formed over the entire surface of the insulating pattern 1024 .
　また、導電パターン１０２０は、ＩＣ１００６の側面１００６Ａ、及びＩＣ１００６の上面１００６Ｃを覆う領域に形成されてもよい。ＩＣ１００６の側面１００６Ａ及びＩＣ１００６の上面は、導電パターン１０２０の下地となる絶縁パターン１０２４が形成されてもよい。 Also, the conductive pattern 1020 may be formed in a region covering the side surface 1006A of the IC 1006 and the top surface 1006C of the IC 1006. An insulating pattern 1024 underlying the conductive pattern 1020 may be formed on the side surface 1006A of the IC 1006 and the top surface of the IC 1006 .
　ＩＣ１００６が、側面１００６ＡからＩＣ１００６の外側へ突出する電極を備える場合は、少なくとも、全ての電極を被覆する領域に絶縁パターン１０２４が形成される。 When the IC 1006 has electrodes protruding from the side surface 1006A to the outside of the IC 1006, an insulating pattern 1024 is formed at least in a region covering all the electrodes.
　図２には、導電パターン１０２０が露出する電気部品実装基板１０００を例示したが、導電パターン１０２０に重ねて保護膜が形成されてもよい。保護膜は、絶縁性を有していてもよい。 Although FIG. 2 illustrates the electrical component mounting board 1000 with the conductive pattern 1020 exposed, a protective film may be formed over the conductive pattern 1020 . The protective film may have insulating properties.
　［パターン製造装置］
　〔全体構成〕
　図３は、パターン製造装置１０の全体構成図である。パターン製造装置１０は、絶縁パターン１０２４が形成されたプリント配線基板１００２の部品実装面１００４に、導電パターン１０２０を形成する装置である。図３に示すように、パターン製造装置１０は、液体吐出ヘッド１２、カメラ１３、ヘッド支持部材１４、搬送装置２０、及び基台３０を備える。ヘッド支持部材１４、及び搬送装置２０は、定盤等が適用される基台３０の上面に配置される。 [Pattern manufacturing equipment]
〔overall structure〕
FIG. 3 is an overall configuration diagram of the pattern manufacturing apparatus 10. As shown in FIG. The pattern manufacturing apparatus 10 is an apparatus for forming a conductive pattern 1020 on a component mounting surface 1004 of a printed wiring board 1002 on which an insulating pattern 1024 is formed. As shown in FIG. 3, the pattern manufacturing apparatus 10 includes a liquid ejection head 12, a camera 13, a head supporting member 14, a conveying device 20, and a base 30. As shown in FIG. The head supporting member 14 and the conveying device 20 are arranged on the upper surface of a base 30 to which a surface plate or the like is applied.
　液体吐出ヘッド１２は、導電インクを吐出する。導電インクは、「導電性液体」の一例であり、導電性材料を溶剤中に分散させたインクである。導電性材料は、例えば銀、又は銅等の金属ナノ粒子である。導電インクにより基材上に形成された導電パターンは、電気を導通させることができる。 The liquid ejection head 12 ejects conductive ink. A conductive ink is an example of a “conductive liquid” and is an ink in which a conductive material is dispersed in a solvent. The conductive material is, for example, metal nanoparticles such as silver or copper. A conductive pattern formed on a substrate by conductive ink can conduct electricity.
　液体吐出ヘッド１２は、複数のヘッドモジュール４０を備える。図４は、１つのヘッドモジュール４０の斜視図である。ヘッドモジュール４０は、Ｌ型ブラケット４２、シリコンダイ４４、インク供給路４６、インク回収路４８、及びフィルタハウジング５０を備える。 The liquid ejection head 12 includes a plurality of head modules 40. FIG. 4 is a perspective view of one head module 40. FIG. The head module 40 includes an L-shaped bracket 42 , a silicon die 44 , an ink supply channel 46 , an ink recovery channel 48 and a filter housing 50 .
　Ｌ型ブラケット４２は、ヘッドモジュール４０をヘッド支持部材１４に固定するための部材である。 The L-shaped bracket 42 is a member for fixing the head module 40 to the head support member 14 .
　シリコンダイ４４は、搬送装置２０によって搬送されるプリント配線基板１００２と対向するノズル面６０を備える。図５は、シリコンダイ４４のノズル面６０の平面図である。ノズル面６０は、Ｘ方向に対して角度βの傾きを有するＶ方向に沿った長辺側の端面と、基板搬送方向に相当するＹ方向に対して角度αの傾きを持つＷ方向に沿った短辺側の端面とを有する平行四辺形の平面形状である。 The silicon die 44 has a nozzle surface 60 facing the printed wiring board 1002 conveyed by the conveying device 20 . FIG. 5 is a plan view of the nozzle face 60 of the silicon die 44. FIG. The nozzle surface 60 has an end surface on the long side along the V direction inclined at an angle β with respect to the X direction, and an end surface on the long side along the W direction inclined at an angle α with respect to the Y direction corresponding to the substrate transfer direction. It has a planar shape of a parallelogram having end faces on the short sides.
　ノズル面６０は、それぞれ複数のノズル６２を有する複数のノズル領域であって、Ｙ方向（「相対移動方向」の一例）におけるノズル６２の位置に応じて分割された複数のノズル領域を含む。図５に示す例では、ノズル面６０は、上流側ノズル領域６４Ａ、及び下流側ノズル領域６４Ｂを含む。 The nozzle surface 60 is a plurality of nozzle regions each having a plurality of nozzles 62, and includes a plurality of nozzle regions divided according to the positions of the nozzles 62 in the Y direction (an example of the "relative movement direction"). In the example shown in FIG. 5, the nozzle face 60 includes an upstream nozzle area 64A and a downstream nozzle area 64B.
　上流側ノズル領域６４Ａ、及び下流側ノズル領域６４Ｂには、それぞれＶ方向に沿う行方向、及びＷ方向に沿う列方向について、複数のノズル６２が２次元マトリクス配置される。図５に示す例では、上流側ノズル領域６４Ａには１行目から１６行目のノズル６２が配置され、下流側ノズル領域６４Ｂには１７行目から３２行目のノズル６２が配置される。また、それぞれ１行につき６４個のノズル６２が配置されている。したがって、ノズル面６０には合計で３２行×６４列＝２０４８個のノズル６２が配置されている。 A plurality of nozzles 62 are arranged in a two-dimensional matrix in the row direction along the V direction and the column direction along the W direction, respectively, in the upstream nozzle region 64A and the downstream nozzle region 64B. In the example shown in FIG. 5, the nozzles 62 on the 1st to 16th rows are arranged in the upstream nozzle region 64A, and the nozzles 62 on the 17th to 32nd rows are arranged in the downstream nozzle region 64B. Also, 64 nozzles 62 are arranged for each row. Therefore, a total of 32 rows×64 columns=2048 nozzles 62 are arranged on the nozzle surface 60 .
　２次元マトリクス配置における各ノズル６２をＸ方向に沿って投影した投影ノズル列は、Ｘ方向について最大の記録解像度を達成するノズル密度で各ノズル６２が概ね等間隔で並ぶ一列のノズル列と等価なものと考えることができる。投影ノズル列を考慮すると、Ｘ方向に沿って並ぶ投影ノズルの並び順に、各ノズルにノズル位置を表すノズル番号を対応付けることができる。液体吐出ヘッド１２の投影ノズル列は、上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２が交互に並ぶ。すなわち、上流側ノズル領域６４Ａのノズル６２のノズル番号は奇数となり、下流側ノズル領域６４Ｂのノズル６２のノズル番号は偶数となる。 A projected nozzle array obtained by projecting the nozzles 62 in the two-dimensional matrix arrangement along the X direction is equivalent to a single nozzle array in which the nozzles 62 are arranged at approximately equal intervals at a nozzle density that achieves the maximum recording resolution in the X direction. can be thought of as Considering the projected nozzle row, it is possible to associate a nozzle number representing the nozzle position with each nozzle in the order of the projected nozzles arranged along the X direction. In the projection nozzle row of the liquid ejection head 12, the nozzles 62 in the upstream nozzle region 64A and the nozzles 62 in the downstream nozzle region 64B are arranged alternately. That is, the nozzle numbers of the nozzles 62 in the upstream nozzle region 64A are odd numbers, and the nozzle numbers of the nozzles 62 in the downstream nozzle region 64B are even numbers.
　なお、概ね等間隔とは、パターン製造装置１０においてパターン形成可能な打滴点として実質的に等間隔であることを意味している。例えば、製造上の誤差、及び着弾干渉による媒体上での液滴の移動の少なくともいずれか一方を考慮して僅かに間隔を異ならせたもの等が含まれている場合も、等間隔の概念に含まれる。投影ノズル列は実質的なノズル列に相当する。 It should be noted that "substantially equal intervals" means that droplet ejection points that can form a pattern in the pattern manufacturing apparatus 10 are substantially equally spaced. For example, the concept of equidistant spacing also applies to cases where the spacing is slightly different in consideration of at least one of manufacturing error and movement of droplets on the medium due to landing interference. included. A projected nozzle array corresponds to a substantial nozzle array.
　液体吐出ヘッド１２は、複数のノズル６２のそれぞれから導電インクを吐出させる。複数のノズル６２は、それぞれ複数のサイズのインクを吐出可能であり、複数のサイズのインクドットを配置可能である。液体吐出ヘッド１２の吐出方式は、圧電素子のたわみ変形を利用して導電インクを加圧して、導電インクを吐出させる圧電方式である。液体吐出ヘッド１２の吐出方式は、ヒータを用いて導電インクを加熱し、導電インクの膜沸騰現象を利用して導電インクを吐出させるサーマル方式であってもよい。なお、吐出とは、噴射、塗布、及び流下等の意味を含む。 The liquid ejection head 12 ejects conductive ink from each of the plurality of nozzles 62 . The plurality of nozzles 62 can each eject ink of a plurality of sizes, and can arrange ink dots of a plurality of sizes. The ejection method of the liquid ejection head 12 is a piezoelectric method in which the conductive ink is ejected by pressurizing the conductive ink using bending deformation of the piezoelectric element. The ejection method of the liquid ejection head 12 may be a thermal method in which the conductive ink is heated using a heater and the conductive ink is ejected using the film boiling phenomenon of the conductive ink. It should be noted that the term "ejection" includes meanings such as jetting, coating, and flowing down.
　図４の説明に戻り、インク供給路４６は、他のヘッドモジュール４０のインク供給路４６とともに不図示の供給ポンプを介して不図示のインクタンクと接続される。供給ポンプは、インク供給路４６の内部のインクに圧力を付与し、インクタンクに貯留されているインクをヘッドモジュール４０に供給する。 Returning to the description of FIG. 4, the ink supply path 46 is connected to an ink tank (not shown) through a supply pump (not shown) together with the ink supply path 46 of another head module 40 . The supply pump applies pressure to the ink inside the ink supply path 46 and supplies the ink stored in the ink tank to the head module 40 .
　インク回収路４８は、他のヘッドモジュール４０のインク回収路４８とともに不図示の回収ポンプを介してインクタンクと接続される。回収ポンプは、インク回収路４８の内部のインクに圧力を付与し、ヘッドモジュール４０に供給されたインクをインクタンクに回収する。 The ink recovery path 48 is connected to the ink tank together with the ink recovery path 48 of the other head module 40 via a recovery pump (not shown). The recovery pump applies pressure to the ink inside the ink recovery path 48 and recovers the ink supplied to the head module 40 to the ink tank.
　フィルタハウジング５０は、ヘッドモジュール４０の内部のインクに含まれる異物等を除去するためのフィルタを収納する。 The filter housing 50 accommodates a filter for removing foreign substances and the like contained in the ink inside the head module 40 .
　図３の説明に戻り、カメラ１３は、プリント配線基板１００２に設けられたアライメントマーク１００５を撮影するためのものである。カメラ１３は、不図示の光源、不図示の撮像素子、及び不図示の観察光学系を備える。カメラ１３は、インラインセンサであってもよい。 Returning to the description of FIG. 3, the camera 13 is for photographing the alignment mark 1005 provided on the printed wiring board 1002 . The camera 13 includes a light source (not shown), an imaging element (not shown), and an observation optical system (not shown). Camera 13 may be an in-line sensor.
　ヘッド支持部材１４は、液体吐出ヘッド１２、及びカメラ１３を固定支持する。ヘッド支持部材１４は、複数のヘッドモジュール４０をそれぞれＸ方向に並べ、それぞれノズル面６０を－Ｚ方向に向けてＬ型ブラケット４２により固定支持する。ここで、ヘッド支持部材１４は、基板搬送方向における上流側（－Ｙ方向側）に上流側ノズル領域６４Ａを、下流側（Ｙ方向側）に下流側ノズル領域６４Ｂを配置して各ヘッドモジュール４０を固定支持する。液体吐出ヘッド１２は、Ｘ方向に複数のヘッドモジュール４０が並べられて配置されることで、プリント配線基板１００２の全幅を超える長さに沿って複数のノズル６２が配置されるライン型ヘッドとなる。 The head support member 14 fixes and supports the liquid ejection head 12 and camera 13 . The head support member 14 aligns a plurality of head modules 40 in the X direction, and fixes and supports them with L-shaped brackets 42 with the nozzle surfaces 60 facing the -Z direction. Here, the head support member 14 arranges the upstream nozzle region 64A on the upstream side (−Y direction side) and the downstream nozzle region 64B on the downstream side (Y direction side) in the substrate transport direction, and each head module 40 fixed support. By arranging a plurality of head modules 40 side by side in the X direction, the liquid ejection head 12 becomes a line type head in which a plurality of nozzles 62 are arranged along a length exceeding the full width of the printed wiring board 1002 . .
　また、ヘッド支持部材１４は、観察光学系を－Ｚ方向に向けてカメラ１３を固定支持する。カメラ１３は、液体吐出ヘッド１２よりも基板搬送方向における下流側（Ｙ方向側）に配置されることで、液体吐出ヘッド１２で印刷した後にプリント配線基板１００２を観察可能である。ヘッド支持部材１４は、液体吐出ヘッド１２、及びカメラ１３の一定の位置関係を保持した状態で、液体吐出ヘッド１２のＸ方向、及びＹ方向の位置を調整する不図示のヘッド位置調整機構を備える。 Also, the head support member 14 fixes and supports the camera 13 with the observation optical system directed in the -Z direction. The camera 13 can observe the printed wiring board 1002 after printing with the liquid ejection head 12 by being arranged on the downstream side (Y direction side) of the liquid ejection head 12 in the substrate transport direction. The head support member 14 includes a head position adjustment mechanism (not shown) that adjusts the X- and Y-direction positions of the liquid ejection head 12 while maintaining a fixed positional relationship between the liquid ejection head 12 and the camera 13 . .
　搬送装置２０（「相対移動機構」の一例）は、Ｙ方向に沿ってプリント配線基板１００２を搬送（「相対移動」の一例）させる。搬送装置２０は、プリント配線基板１００２を支持するテーブル２２、及びＹ方向に沿ってテーブル２２を移動させる移動機構２４を備える。 The transport device 20 (an example of a "relative movement mechanism") transports the printed wiring board 1002 along the Y direction (an example of a "relative movement"). The transport device 20 includes a table 22 that supports the printed wiring board 1002 and a moving mechanism 24 that moves the table 22 along the Y direction.
　テーブル２２は、プリント配線基板１００２を固定する固定機構を備える。固定機構は、プリント配線基板１００２を機械的に固定してもよし、プリント配線基板１００２に対して負圧を付与することで吸着して固定してもよい。 The table 22 has a fixing mechanism for fixing the printed wiring board 1002 . The fixing mechanism may fix the printed wiring board 1002 mechanically, or may fix the printed wiring board 1002 by suction by applying a negative pressure to the printed wiring board 1002 .
　テーブル２２は、プリント配線基板１００２と液体吐出ヘッド１２との間のＺ方向の距離を調整する調整機構を備えてもよい。テーブル２２は、プリント配線基板１００２のＸ方向の位置を調整する調整機構を備えてもよい。 The table 22 may include an adjustment mechanism that adjusts the distance in the Z direction between the printed wiring board 1002 and the liquid ejection head 12. The table 22 may include an adjustment mechanism that adjusts the position of the printed wiring board 1002 in the X direction.
　移動機構２４は、ボールネジ駆動機構、及びベルト駆動機構等がモータの回転軸に連結される。移動機構２４は、リニアモータを備えてもよい。 In the moving mechanism 24, a ball screw drive mechanism, a belt drive mechanism, etc. are connected to the rotating shaft of the motor. The moving mechanism 24 may have a linear motor.
　パターン製造装置１０は、位置が固定された液体吐出ヘッド１２に対して、プリント配線基板１００２をＹ方向に移動させるが、位置が固定されたプリント配線基板１００２に対して、液体吐出ヘッド１２を－Ｙ方向に移動させてもよい。また、パターン製造装置１０は、プリント配線基板１００２をＹ方向に、液体吐出ヘッド１２を－Ｙ方向に、両者を移動させてもよい。 The pattern manufacturing apparatus 10 moves the printed wiring board 1002 in the Y direction with respect to the liquid ejection head 12 whose position is fixed. It may be moved in the Y direction. Also, the pattern manufacturing apparatus 10 may move the printed wiring board 1002 in the Y direction and the liquid ejection head 12 in the -Y direction.
　〔パターン製造装置の電気的構成〕
　図６は、パターン製造装置１０の電気的構成を示す機能ブロック図である。図６に示すように、パターン製造装置１０は、システム制御部７０、データ取得部７２、データ処理部７４、ヘッド制御部７６、カメラ制御部７７、搬送制御部７８、及びメモリ７９を備える。 [Electrical Configuration of Pattern Manufacturing Apparatus]
FIG. 6 is a functional block diagram showing the electrical configuration of the pattern manufacturing apparatus 10. As shown in FIG. As shown in FIG. 6 , the pattern manufacturing apparatus 10 includes a system control section 70 , a data acquisition section 72 , a data processing section 74 , a head control section 76 , a camera control section 77 , a transport control section 78 and a memory 79 .
　システム制御部７０は、データ取得部７２、データ処理部７４、ヘッド制御部７６、カメラ制御部７７，及び搬送制御部７８へ指令信号を送信し、パターン製造装置１０の動作を統括制御する。 The system control unit 70 transmits command signals to the data acquisition unit 72, the data processing unit 74, the head control unit 76, the camera control unit 77, and the transport control unit 78, and controls the operation of the pattern manufacturing apparatus 10 in an integrated manner.
　データ取得部７２は、例えばホストコンピュータ等の不図示の外部装置から、導電パターン１０２０を形成するための導電パターンデータを含む各種のデータを取得する。 The data acquisition unit 72 acquires various data including conductive pattern data for forming the conductive pattern 1020 from an external device (not shown) such as a host computer.
　データ処理部７４は、データ取得部７２が取得した各種のデータに対する処理を実施する。データ処理部７４は、導電パターンデータから導電インクの吐出データを生成する。すなわち、データ処理部７４は、導電パターンデータに対して、ハーフトーン処理等の画像処理を施し、導電パターンに対応するドットの位置、及びドットのサイズが規定される吐出データを生成する。 The data processing unit 74 performs processing on various data acquired by the data acquisition unit 72 . The data processing unit 74 generates conductive ink ejection data from the conductive pattern data. That is, the data processing unit 74 performs image processing such as halftone processing on the conductive pattern data to generate ejection data that defines the positions and sizes of dots corresponding to the conductive pattern.
　ヘッド制御部７６は、導電パターンに対応する吐出データに基づいて、液体吐出ヘッド１２のノズル６２の吐出を制御する。また、ヘッド制御部７６は、後述するアライメントマーク１００５の読取結果に応じて不図示のヘッド位置調整機構を制御し、事前に液体吐出ヘッド１２の位置を調整する。 The head control unit 76 controls ejection from the nozzles 62 of the liquid ejection head 12 based on the ejection data corresponding to the conductive pattern. Further, the head control unit 76 controls a head position adjusting mechanism (not shown) according to the result of reading the alignment mark 1005, which will be described later, to adjust the position of the liquid ejection head 12 in advance.
　カメラ制御部７７は、カメラ１３の動作を制御する。カメラ制御部７７は、例えば、プリント配線基板１００２のアライメントマーク１００５（図１参照）をカメラ１３に読み取らせ、カメラ１３から読取結果を取得する。 The camera control unit 77 controls the operation of the camera 13. The camera control unit 77 causes the camera 13 to read, for example, the alignment mark 1005 (see FIG. 1) of the printed wiring board 1002 and obtains the reading result from the camera 13 .
　搬送制御部７８は、搬送装置２０の動作を制御する。 The transport control unit 78 controls the operation of the transport device 20 .
　メモリ７９は、パターン製造装置１０の制御に使用される各種のデータ、各種のパラメータ、及び各種のプログラム等が記憶される。システム制御部７０は、メモリ７９へ記憶される各種のパラメータ等を適用して、パターン製造装置１０の各部の制御を実施する。 The memory 79 stores various data, various parameters, various programs, etc. used for controlling the pattern manufacturing apparatus 10 . The system control unit 70 applies various parameters and the like stored in the memory 79 to control each unit of the pattern manufacturing apparatus 10 .
　〔パターン製造装置のハードウェアの構成〕
　図７は、パターン製造装置１０のハードウェアの構成例を示すブロック図である。パターン製造装置１０は、制御装置８０、入力装置９２、及びディスプレイ装置９４を備える。 [Hardware Configuration of Pattern Manufacturing Device]
FIG. 7 is a block diagram showing a hardware configuration example of the pattern manufacturing apparatus 10. As shown in FIG. Pattern manufacturing apparatus 10 includes a control device 80 , an input device 92 and a display device 94 .
　制御装置８０は、コンピュータが適用される。コンピュータは、サーバ、パーソナルコンピュータ、ワークステーション、又はタブレット端末等である。制御装置８０は、プロセッサ８２、コンピュータ可読媒体８４、通信インターフェース８６、入出力インターフェース８８、及びバス９０を備える。 A computer is applied to the control device 80 . The computer is a server, personal computer, workstation, tablet terminal, or the like. Controller 80 includes processor 82 , computer readable media 84 , communication interface 86 , input/output interface 88 , and bus 90 .
　プロセッサ８２は、コンピュータ可読媒体８４に記憶された命令を実行する。プロセッサ８２のハードウェア的な構造は、次に示すような各種のプロセッサ（processor）である。各種のプロセッサには、ソフトウェア（プログラム）を実行して各種の機能部として作用する汎用的なプロセッサであるＣＰＵ（Central Processing Unit）、画像処理に特化したプロセッサであるＧＰＵ（Graphics Processing Unit）、ＦＰＧＡ（Field Programmable Gate Array）等の製造後に回路構成を変更可能なプロセッサであるＰＬＤ（Programmable Logic Device）、ＡＳＩＣ（Application Specific Integrated Circuit）等の特定の処理を実行させるために専用に設計された回路構成を有するプロセッサである専用電気回路等が含まれる。 Processor 82 executes instructions stored on computer readable medium 84 . The hardware structure of the processor 82 is various processors as follows. Various processors include a CPU (Central Processing Unit), which is a general-purpose processor that executes software (programs) and acts as various functional units, a GPU (Graphics Processing Unit), which is a processor specialized for image processing, A circuit specially designed to execute specific processing such as PLD (Programmable Logic Device), which is a processor whose circuit configuration can be changed after manufacturing such as FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), etc. Also included are dedicated electrical circuits, which are processors with configuration, and the like.
　１つの処理部は、これら各種のプロセッサのうちの１つで構成されていてもよいし、同種又は異種の２つ以上のプロセッサ（例えば、複数のＦＰＧＡ、又はＣＰＵとＦＰＧＡの組み合わせ、あるいはＣＰＵとＧＰＵの組み合わせ）で構成されてもよい。また、複数の機能部を１つのプロセッサで構成してもよい。複数の機能部を１つのプロセッサで構成する例としては、第１に、クライアント又はサーバ等のコンピュータに代表されるように、１つ以上のＣＰＵとソフトウェアの組合せで１つのプロセッサを構成し、このプロセッサが複数の機能部として作用させる形態がある。第２に、ＳｏＣ（System On Chip）等に代表されるように、複数の機能部を含むシステム全体の機能を１つのＩＣ（Integrated Circuit）チップで実現するプロセッサを使用する形態がある。このように、各種の機能部は、ハードウェア的な構造として、上記各種のプロセッサを１つ以上用いて構成される。 One processing unit may be composed of one of these various processors, or two or more processors of the same or different type (for example, a plurality of FPGAs, a combination of CPU and FPGA, or a combination of CPU and GPU). Also, a plurality of functional units may be configured by one processor. As an example of configuring a plurality of functional units in a single processor, first, as represented by a computer such as a client or server, a single processor is configured by combining one or more CPUs and software. There is a form in which a processor acts as a plurality of functional units. Secondly, as typified by SoC (System On Chip), etc., there is a mode of using a processor that realizes the functions of the entire system including multiple functional units with a single IC (Integrated Circuit) chip. In this way, various functional units are configured using one or more of the above various processors as a hardware structure.
　さらに、これらの各種のプロセッサのハードウェア的な構造は、より具体的には、半導体素子等の回路素子を組み合わせた電気回路（circuitry）である。 Furthermore, the hardware structure of these various processors is, more specifically, an electrical circuit that combines circuit elements such as semiconductor elements.
　プロセッサ８２は、バス９０を介してコンピュータ可読媒体８４、通信インターフェース８６、及び入出力インターフェース８８と接続される。 Processor 82 is coupled to computer-readable media 84 , communication interface 86 , and input/output interface 88 via bus 90 .
　コンピュータ可読媒体８４は、プロセッサ８２に実行させるための命令を記憶する。コンピュータ可読媒体８４は、不図示のＲＡＭ（Random Access Memory）、及びＲＯＭ（Read Only Memory）を含む。また、コンピュータ可読媒体８４は、ハードディスク等の磁気記憶媒体、ＣＤ(Compact Disc)－ＲＯＭ等の光ディスク、及びＵＳＢ(Universal Serial Bus)メモリ等の半導体メモリを含んでもよい。コンピュータ可読媒体８４は、図６に示したメモリ７９を兼ねてもよい。 A computer-readable medium 84 stores instructions for processor 82 to execute. The computer-readable medium 84 includes RAM (Random Access Memory) and ROM (Read Only Memory) (not shown). The computer-readable medium 84 may also include a magnetic storage medium such as a hard disk, an optical disk such as a CD (Compact Disc)-ROM, and a semiconductor memory such as a USB (Universal Serial Bus) memory. Computer readable medium 84 may also serve as memory 79 shown in FIG.
　コンピュータ可読媒体８４は、１つ以上の命令を含むパターン製造プログラム８５を記憶する。パターン製造プログラム８５は、コンピュータの読取可能な非一時的な記憶媒体によって提供されてもよい。また、パターン製造プログラム８５は、外部のサーバからダウンロード可能なアプリケーションとして提供されてもよい。 A computer readable medium 84 stores a pattern manufacturing program 85 including one or more instructions. The pattern manufacturing program 85 may be provided by a computer-readable non-transitory storage medium. Also, the pattern manufacturing program 85 may be provided as an application that can be downloaded from an external server.
　コンピュータ可読媒体８４は、各種のデータ及び各種のパラメータ等を記憶する。プロセッサ８２は、コンピュータ可読媒体８４のＲＡＭを作業領域としてパターン製造プログラム８５を実行し、かつコンピュータ可読媒体８４に記憶されたデータ、及びパラメータを使用することで、パターン製造装置１０の各種の処理を実行する。 The computer-readable medium 84 stores various data and various parameters. The processor 82 executes the pattern manufacturing program 85 using the RAM of the computer-readable medium 84 as a work area, and uses the data and parameters stored in the computer-readable medium 84 to perform various processes of the pattern manufacturing apparatus 10. Execute.
　通信インターフェース８６は、不図示のネットワークを介して制御装置８０を外部装置と通信可能に接続する。ネットワークは、例えばＬＡＮ（Local Area Network）である。 The communication interface 86 communicably connects the control device 80 with an external device via a network (not shown). The network is, for example, a LAN (Local Area Network).
　入出力インターフェース８８は、制御装置８０を入力装置９２、及びディスプレイ装置９４に接続する。入力装置９２は、例えば、キーボード、マウス、マルチタッチパネル、その他のポインティングデバイス、又はこれらの組み合わせ等である。ディスプレイ装置９４は、液晶ディスプレイ、有機ＥＬ（Electro-Luminescence）ディスプレイ、又はプロジェクタ、又はこれらの組み合わせ等である。ディスプレイ装置９４には、制御装置８０に関連した各種の情報が表示される。 The input/output interface 88 connects the control device 80 to the input device 92 and the display device 94 . The input device 92 is, for example, a keyboard, mouse, multi-touch panel, other pointing device, or a combination thereof. The display device 94 is a liquid crystal display, an organic EL (Electro-Luminescence) display, a projector, or a combination thereof. Various information related to the control device 80 is displayed on the display device 94 .
　［課題の説明］
　近年、電気製品の小型化が進んだ結果、プリント基板上の電気部品は高密度で実装される傾向があり、導電インクを塗布して導電パターンを形成する場合に、特に導電パターンのサイズの精度、及び端部の描画位置精度の確保が課題になっている。 [Description of assignment]
In recent years, as a result of the miniaturization of electrical products, there is a tendency for electrical components on printed circuit boards to be mounted at high density. , and ensuring the drawing position accuracy of the edge is a problem.
　図１に示したプリント配線基板１００２に導電パターンを形成する場合、意図しているサイズよりも導電パターンのサイズが大きくなると不要な箇所に導電インクが付着し、電気回路が短絡する可能性が発生する。例えば、導電パターンのサイズの精度は１００μｍの誤差に収まることを要求される場合がある。導電パターンの形成にインクジェット方式の液体吐出ヘッドを利用する場合、後述するヘッド内の特性ばらつきの影響、及び描画位置調整の誤差の影響により、導電パターンの精度確保は簡単ではない。 When forming a conductive pattern on the printed wiring board 1002 shown in FIG. 1, if the size of the conductive pattern is larger than the intended size, the conductive ink may adhere to unnecessary portions, causing a short circuit. do. For example, the size accuracy of the conductive pattern may be required to be within 100 μm error. When an ink jet liquid ejection head is used to form a conductive pattern, it is not easy to ensure the precision of the conductive pattern due to the effects of variations in characteristics within the head and errors in drawing position adjustment, which will be described later.
　以下において、液体吐出ヘッド１２において一定の印刷領域に対して導電パターン形成した場合を考える。 In the following, consider a case where a conductive pattern is formed in a certain print area in the liquid ejection head 12 .
　図８は、理想的な液体吐出ヘッド１２において、基材のＹ方向にサイズＳを有する印刷領域に対して導電パターンを形成した場合のドット配置を示す図である。図８では、上流側ノズル領域６４Ａのノズル６２からのインクの吐出によって配置されたインクドットを相対的に濃いハッチングで示し、下流側ノズル領域６４Ｂのノズル６２からのインクの吐出によって配置されたインクドットを相対的に薄いハッチングで示している。 FIG. 8 is a diagram showing the dot arrangement in the ideal liquid ejection head 12 when a conductive pattern is formed in a print area having a size S in the Y direction of the base material. In FIG. 8, ink dots arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching, and ink dots arranged by ejecting ink from the nozzles 62 of the downstream nozzle region 64B are shown. Dots are indicated by relatively light hatching.
　前述のように、液体吐出ヘッド１２は、投影ノズル列において、上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２がＸ方向に交互に並んでいる。したがって、図８に示すように、上流側ノズル領域６４Ａのノズル６２によって配置されたインクドット、及び下流側ノズル領域６４Ｂのノズル６２によって配置されたインクドットは、Ｘ方向に交互に配置される。また、上流側ノズル領域６４Ａのノズル６２によって配置されたインクドット、及び下流側ノズル領域６４Ｂのノズル６２によって配置されたインクドットは、それぞれＹ方向の位置が一致している。このように、理想的な液体吐出ヘッド１２によれば、所望のサイズであるＹ方向にサイズＳの導電パターンを形成することができる。 As described above, in the projection nozzle row of the liquid ejection head 12, the nozzles 62 in the upstream nozzle region 64A and the nozzles 62 in the downstream nozzle region 64B are alternately arranged in the X direction. Therefore, as shown in FIG. 8, the ink dots arranged by the nozzles 62 in the upstream nozzle region 64A and the ink dots arranged by the nozzles 62 in the downstream nozzle region 64B are alternately arranged in the X direction. Also, the ink dots arranged by the nozzles 62 in the upstream nozzle region 64A and the ink dots arranged by the nozzles 62 in the downstream nozzle region 64B are aligned in the Y direction. As described above, according to the ideal liquid ejection head 12, it is possible to form a conductive pattern of size S in the Y direction, which is a desired size.
　しかしながら、液体吐出ヘッド１２は、シリコンダイ４４の製造上のばらつきにより、ヘッド内の特性にばらつきを有する場合がある。ここで、上流側ノズル領域６４Ａ、及び下流側ノズル領域６４Ｂの特性にばらつきを有する液体吐出ヘッド１２を用いた例について説明する。なお、議論を簡単にするため、同じノズル領域内の各ノズル６２の特性ばらつきについては議論しない。 However, the liquid ejection head 12 may have variations in characteristics within the head due to manufacturing variations in the silicon die 44 . Here, an example using the liquid ejection head 12 having variations in the characteristics of the upstream nozzle region 64A and the downstream nozzle region 64B will be described. To simplify the discussion, the characteristic variation of each nozzle 62 within the same nozzle region will not be discussed.
　図９は、ヘッド内に特性ばらつきを有する液体吐出ヘッド１２において、基材のＹ方向にサイズＳを有する印刷領域に対して導電パターンを形成した場合のドット配置を示す図である。図９では、図８と同様に、上流側ノズル領域６４Ａのノズル６２からのインクの吐出によって配置されたインクドットを相対的に濃いハッチングで示し、下流側ノズル領域６４Ｂのノズル６２からのインクの吐出によって配置されたインクドットを相対的に薄いハッチングで示している。図９に示す例では、上流側ノズル領域６４Ａのノズル６２によって配置されたインクドット、及び下流側ノズル領域６４Ｂのノズル６２によって配置されたインクドットは、Ｙ方向の位置がΔＳだけずれており、その結果、所望のサイズであるＹ方向にサイズＳの導電パターンよりもΔＳだけ大きい導電パターンが形成されている。 FIG. 9 is a diagram showing a dot arrangement when a conductive pattern is formed in a print area having a size S in the Y direction of the substrate in the liquid ejection head 12 having characteristic variations in the head. In FIG. 9, as in FIG. 8, the ink dots arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching, and the dots of ink ejected from the nozzles 62 of the downstream nozzle region 64B are indicated by relatively dark hatching. Ink dots arranged by ejection are indicated by relatively light hatching. In the example shown in FIG. 9, the positions of the ink dots arranged by the nozzles 62 in the upstream nozzle region 64A and the ink dots arranged by the nozzles 62 in the downstream nozzle region 64B are shifted by ΔS in the Y direction. As a result, a conductive pattern that is larger than the conductive pattern of size S in the Y direction, which is the desired size, by ΔS is formed.
　このような不具合が発生する理由は複数ある。そもそも複数のノズル領域の各ノズル領域によってインク滴速度、及びインク滴体積等の吐出特性が異なるため、着弾にばらつきが発生する。吐出特性を調整することも考えられるが、現実には調整誤差が発生するため吐出特性を揃えることは困難であり、作業の手間も必要となる。 There are multiple reasons why such a problem occurs. In the first place, since ejection characteristics such as ink droplet speed and ink droplet volume are different for each nozzle region of a plurality of nozzle regions, variations in landing occur. Although it is conceivable to adjust the ejection characteristics, in reality, it is difficult to match the ejection characteristics due to the occurrence of adjustment errors, and the work requires time and effort.
　また、基材の移動に対する液体吐出ヘッド１２の吐出タイミングの生成は、不図示のエンコーダ等を使用して補正をかけるものの、当然誤差が発生し、物理的に離れた位置にあるノズル６２の方が、その誤差が大きくなりやすい。 In addition, although the generation of the ejection timing of the liquid ejection head 12 with respect to the movement of the base material is corrected using an encoder or the like (not shown), an error naturally occurs, and the nozzle 62 located at a physically distant position may However, the error tends to be large.
　さらに、図９に示した例とはずれの形状が異なるが、基材の移動方向と直交する方向（Ｘ方向）にずれが発生する場合がある。例えば、基材は搬送時に多少蛇行するため、これも物理的に離れた位置にあるノズルで６２の方が、その誤差が大きくなりやすい。 Furthermore, although the shape of the displacement is different from the example shown in FIG. 9, displacement may occur in the direction (X direction) perpendicular to the movement direction of the base material. For example, since the base material meanders to some extent during transportation, the error is likely to be larger for the nozzles 62 which are also located at physically distant positions.
　［実施形態に係る導電パターン］
　本実施形態では、導電パターンの形成精度を確保するために、液体吐出ヘッド１２の上流側ノズル領域６４Ａ、及び下流側ノズル領域６４Ｂ（「複数のノズル領域」の一例）のうちのいずれか一方のノズル領域（「特定のノズル領域」の一例）のノズル６２によって、導電パターンの境界領域を形成するインクドットを配置する。 [Conductive pattern according to the embodiment]
In the present embodiment, in order to ensure the formation accuracy of the conductive pattern, one of the upstream nozzle region 64A and the downstream nozzle region 64B (an example of “a plurality of nozzle regions”) of the liquid ejection head 12 is The nozzles 62 in a nozzle area (an example of a "specific nozzle area") place ink dots that form the boundary area of the conductive pattern.
　図１０は、基材１００の表面の導電パターンを形成する印刷領域１０２、及び印刷領域１０２とは異なる非印刷領域１０４を示す図である。印刷領域１０２は、Ｘ方向にＳＸ、Ｙ方向にＳＹのサイズを有する一定の面積の領域である。印刷領域１０２は、非印刷領域１０４との境界１０２Ａを有する。また、印刷領域１０２は、境界１０２Ａを含む境界領域１０２Ｂ、及び境界領域１０２Ｂ以外の非境界領域１０２Ｃを含む。図１０に示す境界領域１０２Ｂは、境界１０２Ａからインクドット１つ分（１画素分）だけ内側までの領域である。 FIG. 10 shows a printed area 102 forming a conductive pattern on the surface of the substrate 100 and a non-printed area 104 different from the printed area 102 . The print area 102 is a fixed area area having a size of SX in the X direction and SY in the Y direction. The print area 102 has a boundary 102 A with the non-print area 104 . The print area 102 also includes a border area 102B including the border 102A and a non-border area 102C other than the border area 102B. A boundary area 102B shown in FIG. 10 is an area extending inward by one ink dot (one pixel) from the boundary 102A.
　図１１は、パターン製造装置１０によって印刷領域１０２に形成した導電パターンを示す図である。図１１では、上流側ノズル領域６４Ａのノズル６２からのインクの吐出によって配置されたインクドット１１０Ａを相対的に濃いハッチングで示し、下流側ノズル領域６４Ｂのノズル６２からのインクの吐出によって配置されたインクドット１１０Ｂを相対的に薄いハッチングで示している。図１１に示すように、印刷領域１０２の境界領域１０２Ｂには、上流側ノズル領域６４Ａのノズル６２によってインクドット１１０Ａが配置されている。一方、非境界領域１０２Ｃには、上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２によってインクドット１１０Ａ、及びインクドット１１０Ｂが配置されている。 FIG. 11 is a diagram showing a conductive pattern formed in the printing area 102 by the pattern manufacturing apparatus 10. FIG. In FIG. 11, the ink dots 110A arranged by ejecting ink from the nozzles 62 of the upstream nozzle region 64A are indicated by relatively dark hatching, and the ink dots 110A arranged by ejecting ink from the nozzles 62 of the downstream nozzle region 64B are shown. Ink dots 110B are indicated by relatively light hatching. As shown in FIG. 11, ink dots 110A are arranged in the boundary area 102B of the print area 102 by the nozzles 62 of the upstream nozzle area 64A. On the other hand, in the non-boundary area 102C, ink dots 110A and 110B are arranged by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B.
　このようにインクドットを配置することで、導電パターンのサイズについてノズル領域間の誤差が乗らないので、正確な導電パターンを形成することができる。ここでは、パターンの境界領域１０２Ｂを１画素分としたが、ノズル領域間の特性ばらつきによっては２画素分以上であってもよい。また、ここでは境界領域１０２Ｂの四方に印刷領域１０２を設けたが、境界領域１０２Ｂは少なくとも一方に設ければよい。 By arranging the ink dots in this way, errors between nozzle regions are not added to the size of the conductive pattern, so an accurate conductive pattern can be formed. Although the pattern boundary region 102B is one pixel here, it may be two pixels or more depending on the characteristic variation between the nozzle regions. Also, here, the printing areas 102 are provided on the four sides of the boundary area 102B, but the boundary area 102B may be provided on at least one side.
　境界領域１０２Ｂにインクドットを配置するのは、上流側ノズル領域６４Ａ、及び下流側ノズル領域６４Ｂのうちのいずれか一方のノズル領域のノズル６２であればよいが、図１１に示したように、上流側ノズル領域６４Ａのノズル６２を使用することが望ましい。これにより、基材１００の表面でのインクドット間の着弾干渉を抑制することができる。なぜなら、境界領域１０２Ｂを形成する上流側ノズル領域６４Ａのノズル６２から吐出されたインクが先に着弾し、その後、下流側ノズル領域６４Ｂから吐出されたインクが周辺に着弾するので、より精度が求められる境界領域１０２Ｂのインクが動きにくいためである。 Ink dots are arranged in the boundary region 102B if the nozzles 62 are in either one of the upstream nozzle region 64A and the downstream nozzle region 64B, but as shown in FIG. It is desirable to use the nozzles 62 in the upstream nozzle region 64A. As a result, landing interference between ink dots on the surface of the substrate 100 can be suppressed. This is because the ink ejected from the nozzles 62 of the upstream nozzle area 64A forming the boundary area 102B lands first, and then the ink ejected from the downstream nozzle area 64B lands on the periphery, so more accuracy is required. This is because the ink in the boundary area 102B that is drawn is difficult to move.
　図１２は、インクの着弾干渉を説明するための図であり、基材１００の側面図である。図１２には、基材１００の表面に先に着弾したインクドット１１１Ａ、及びインクドット１１１Ａよりも後に着弾したインクドット１１１Ｂを示している。後に着弾したインクドット１１１Ｂは、先に着弾したインクドット１１１Ａに引っ張られることでインクドット１１１Ａの方向に移動する。このため、インクドット１１１Ｂよりもインクドット１１１Ａの方が着弾位置の精度が高い結果となる。したがって、境界領域１０２Ｂに先にインクドットを配置することで、境界領域１０２Ｂのインクドットの位置の精度を高めることができる。 FIG. 12 is a diagram for explaining ink landing interference, and is a side view of the substrate 100. FIG. FIG. 12 shows an ink dot 111A that has landed on the surface of the substrate 100 earlier, and an ink dot 111B that has landed after the ink dot 111A. The ink dot 111B that landed later moves in the direction of the ink dot 111A by being pulled by the ink dot 111A that landed earlier. As a result, the ink dot 111A has a higher impact position accuracy than the ink dot 111B. Therefore, by arranging the ink dots in the boundary area 102B first, the accuracy of the positions of the ink dots in the boundary area 102B can be improved.
　この効果をより高めるために、基材１００へのアンカー効果を高めるための前処理液であって、導電インクの濡れ広がりを抑制する機能性材料を含んだ前処理液を基材１００に予め塗布しておく（「前処理液塗布工程」の一例）ことが望ましい。基材１００の表面に着弾したインクと、基材の表面に塗布された前処理液との化学反応によって、インク成分のうち前処理液と反応する成分を素早く凝集させ、着弾干渉をさらに抑制することができる。 In order to further enhance this effect, a pretreatment liquid that is a pretreatment liquid for enhancing the anchor effect to the base material 100 and contains a functional material that suppresses wetting and spreading of the conductive ink is applied to the base material 100 in advance. (an example of the "pretreatment liquid application step"). A chemical reaction between the ink that has landed on the surface of the base material 100 and the pretreatment liquid that has been applied to the surface of the base material causes the components of the ink that react with the pretreatment liquid to quickly coagulate, further suppressing landing interference. be able to.
　なお、図１１に示す例では、非境界領域１０２Ｃには上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２によるインクドットが配置されるが、境界領域１０２Ｂには上流側ノズル領域６４Ａのノズル６２によるインクドットのみが配置され、下流側ノズル領域６４Ｂのノズル６２によるインクドットは配置されない。このため、境界領域１０２Ｂのインクドットは、下流側ノズル領域６４Ｂのノズル６２によるインクドットの分だけインクドットが少なく、印刷領域１０２のインクドットの総量は、上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２でパターンを形成した場合よりも少ない。 In the example shown in FIG. 11, ink dots are arranged by the nozzles 62 of the upstream nozzle region 64A and the nozzles 62 of the downstream nozzle region 64B in the non-boundary region 102C. Only the ink dots by the nozzles 62 in the region 64A are arranged, and the ink dots by the nozzles 62 in the downstream nozzle region 64B are not arranged. Therefore, the ink dots in the boundary region 102B are fewer than the ink dots by the nozzles 62 in the downstream nozzle region 64B, and the total amount of ink dots in the printing region 102 is equal to the nozzles 62 in the upstream nozzle region 64A and less than when the pattern is formed with the nozzles 62 in the downstream nozzle region 64B.
　そこで、非境界領域１０２Ｃには、境界領域１０２Ｂにおいてインクドットが減った分を補うようにインクドットを配置することが望ましい。具体的には、インク滴種のコントロールにより、インクドットのサイズを大きくする（インク量を増やす）ことが望ましい。インク量を補う位置は、境界領域１０２Ｂから少しだけ非境界領域１０２Ｃに入った位置（例えば、非境界領域１０２Ｃのうち境界領域１０２Ｂに隣接する領域）であることが望ましい。このような位置のインク量を増加させることで、増加したインクは、相対的にインク量が少ない境界領域１０２Ｂに自然に広がることが想定される。 Therefore, it is desirable to arrange ink dots in the non-boundary area 102C so as to compensate for the decrease in ink dots in the boundary area 102B. Specifically, it is desirable to increase the size of ink dots (increase the amount of ink) by controlling the type of ink droplets. The position for supplementing the ink amount is desirably a position slightly inside the non-boundary region 102C from the boundary region 102B (for example, a region adjacent to the boundary region 102B in the non-boundary region 102C). By increasing the amount of ink at such a position, it is assumed that the increased amount of ink naturally spreads over the boundary area 102B where the amount of ink is relatively small.
　なお、境界領域１０２Ｂに配置されたインクドット１１０Ａが導電パターンの境界を形成するためには、互いに隣り合うインクドット１１０Ａが繋がる必要がある。すなわち、互いに隣り合うインクドット１１０Ａが繋がるドットサイズにする必要がある。また、パターン描画精度の効果をより高めるためには、境界領域１０２Ｂを形成するインクドットは、同じ滴種（「同一サイズ」の一例）であることが望ましい。これにより、滴種間の特性ばらつきの影響を受けにくくなる。 In order for the ink dots 110A arranged in the boundary region 102B to form the boundary of the conductive pattern, the adjacent ink dots 110A need to be connected. That is, the dot size must be such that the ink dots 110A adjacent to each other are connected. Further, in order to further enhance the effect of pattern drawing accuracy, it is desirable that the ink dots forming the boundary area 102B be of the same droplet type (an example of “same size”). As a result, it is less likely to be affected by variations in characteristics between droplet types.
　本実施形態では、液体吐出ヘッド１２の上流側ノズル領域６４Ａのノズル６２のみによって、印刷領域１０２の境界領域１０２Ｂにインクドットを配置したが、境界領域１０２Ｂには実質的に上流側ノズル領域６４Ａのノズル６２のみによってインクドットが配置されればよい。すなわち、液体吐出ヘッド１２のノズル領域の特性ばらつきがあってもパターンの描画精度を高めることができるという効果を奏する程度に、下流側ノズル領域６４Ｂのノズル６２によって境界領域１０２Ｂにドットを配置してもよい。例えば、境界領域１０２Ｂに配置されるインクドットの９０％以上が上流側ノズル領域６４Ａのノズル６２によって配置されたものであればよく、この場合は上流側ノズル領域６４Ａのノズル６２のみによってインクドットが配置されるものに含まれる。 In this embodiment, ink dots are arranged in the boundary region 102B of the printing region 102 only by the nozzles 62 of the upstream nozzle region 64A of the liquid ejection head 12. Ink dots need only be arranged by the nozzles 62 . That is, dots are arranged in the boundary region 102B by the nozzles 62 of the downstream nozzle region 64B to the extent that the pattern drawing accuracy can be improved even if there are variations in the characteristics of the nozzle region of the liquid ejection head 12. good too. For example, 90% or more of the ink dots arranged in the boundary region 102B may be arranged by the nozzles 62 of the upstream nozzle region 64A. In this case, the ink dots are formed only by the nozzles 62 of the upstream nozzle region 64A. Included in what is placed.
　［パターン製造方法］
　図１３は、パターン製造装置１０によるパターン製造方法の各工程を示すフローチャートである。パターン製造方法は、印刷物の製造方法に相当する。印刷物は電子デバイスを含み、電子デバイスは電気部品実装基板を含む。パターン製造方法は、プロセッサ８２がパターン製造プログラム８５（図７参照）を実行することで実現される。ここでは、プリント配線基板１００２のＩＣ１００６の上面を含む印刷領域に導電インクのインクドットを配置して導電パターン１０２０を形成する例について説明する。 [Pattern manufacturing method]
FIG. 13 is a flow chart showing each process of the pattern manufacturing method by the pattern manufacturing apparatus 10. FIG. The pattern manufacturing method corresponds to a printed matter manufacturing method. A printed matter includes an electronic device, and the electronic device includes an electric component mounting board. The pattern manufacturing method is implemented by the processor 82 executing a pattern manufacturing program 85 (see FIG. 7). Here, an example of forming a conductive pattern 1020 by arranging ink dots of conductive ink in a printing region including the upper surface of the IC 1006 of the printed wiring board 1002 will be described.
　ステップＳ１では、データ取得部７２は、通信インターフェース８６を介して不図示の外部装置から導電パターンデータを取得する。データ取得部７２は、入力装置９２から導電パターンデータを取得してもよいし、コンピュータ可読媒体８４から導電パターンデータを取得してもよい。 In step S<b>1 , the data acquisition unit 72 acquires conductive pattern data from an external device (not shown) via the communication interface 86 . The data acquisition unit 72 may acquire conductive pattern data from the input device 92 or may acquire conductive pattern data from the computer-readable medium 84 .
　ステップＳ２では、データ処理部７４は、ステップＳ１で取得した導電パターンデータから導電インクの吐出データを生成する。 In step S2, the data processing unit 74 generates conductive ink ejection data from the conductive pattern data acquired in step S1.
　最後に、ステップＳ３（「パターン形成工程」の一例）では、ヘッド制御部７６、及び搬送制御部７８は、ステップＳ２で生成した吐出データに従ってプリント配線基板１００２の印刷領域に導電パターンを形成する。 Finally, in step S3 (an example of the "pattern forming process"), the head control unit 76 and the transport control unit 78 form a conductive pattern in the print area of the printed wiring board 1002 according to the ejection data generated in step S2.
　図１４は、ステップＳ３の導電パターンの形成工程の詳細を示すフローチャートである。 FIG. 14 is a flowchart showing the details of the conductive pattern forming process in step S3.
　ステップＳ１１では、搬送制御部７８は、搬送装置２０を制御して、プリント配線基板１００２を初期位置に搬送する。初期位置とは、テーブル２２（プリント配線基板１００２）がヘッド支持部材１４（液体吐出ヘッド１２）よりも－Ｙ方向側（搬送方向の上流側）に配置される位置である。 At step S11, the transport control unit 78 controls the transport device 20 to transport the printed wiring board 1002 to the initial position. The initial position is a position where the table 22 (printed wiring board 1002) is arranged on the -Y direction side (upstream side in the transport direction) of the head support member 14 (liquid ejection head 12).
　ステップＳ１２では、搬送制御部７８は、プリント配線基板１００２をＹ方向に搬送する。 At step S12, the transport control unit 78 transports the printed wiring board 1002 in the Y direction.
　ステップＳ１３では、液体吐出ヘッド１２は、Ｙ方向に搬送されるプリント配線基板１００２に対して導電インクを吐出する。ここでは、ヘッド制御部７６は、上流側ノズル領域６４Ａのノズル６２によって、印刷領域のうち印刷領域とは異なる非印刷領域との境界を含む境界領域にインクドットを配置する。 In step S13, the liquid ejection head 12 ejects conductive ink onto the printed wiring board 1002 that is transported in the Y direction. Here, the head controller 76 uses the nozzles 62 in the upstream nozzle area 64A to arrange ink dots in the boundary area including the boundary between the print area and the non-print area that is different from the print area.
　プリント配線基板１００２の全体が液体吐出ヘッド１２と対向する位置を通過すると、ステップＳ１４では、搬送制御部７８は、搬送装置２０を制御して、プリント配線基板１００２を－Ｙ方向に搬送し、プリント配線基板１００２を再び初期位置に戻す。 When the entire printed wiring board 1002 passes through the position facing the liquid ejection head 12, in step S14, the transport control unit 78 controls the transport device 20 to transport the printed wiring board 1002 in the -Y direction and print. The wiring board 1002 is returned to the initial position again.
　ステップＳ１５では、搬送制御部７８は、プリント配線基板１００２を再びＹ方向に搬送する。 At step S15, the transport control unit 78 transports the printed wiring board 1002 again in the Y direction.
　ステップＳ１６では、液体吐出ヘッド１２は、Ｙ方向に搬送されるプリント配線基板１００２に対してインクを吐出する。ここでは、ヘッド制御部７６は、上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２によって、印刷領域のうち境界領域以外の非境界領域にインクドットを配置する。 In step S16, the liquid ejection head 12 ejects ink onto the printed wiring board 1002 that is transported in the Y direction. Here, the head control unit 76 arranges ink dots in non-boundary areas other than the boundary areas in the print area using the nozzles 62 in the upstream nozzle area 64A and the nozzles 62 in the downstream nozzle area 64B.
　これにより、境界領域に上流側ノズル領域６４Ａのノズル６２によってインクドットを配置し、非境界領域に上流側ノズル領域６４Ａのノズル６２、及び下流側ノズル領域６４Ｂのノズル６２によってインクドットを配置することができる。また、一方向（ここではＹ方向）に複数回搬送することで、先に境界領域にインクドットを配置して、その後に非境界領域にインクドットを配置することができる。 Thus, ink dots are arranged in the boundary area by the nozzles 62 of the upstream nozzle area 64A, and ink dots are arranged in the non-boundary area by the nozzles 62 of the upstream nozzle area 64A and the nozzles 62 of the downstream nozzle area 64B. can be done. Further, by conveying in one direction (the Y direction in this case) a plurality of times, it is possible to first arrange the ink dots in the boundary area and then arrange the ink dots in the non-boundary area.
　なお、ステップＳ１３において、上流側ノズル領域６４Ａのノズル６２によって、印刷領域の全体にインクドットを配置し、ステップＳ１６において、下流側ノズル領域６４Ｂのノズル６２によって、印刷領域のうち境界領域以外の非境界領域にインクドットを配置してもよい。また、プリント配線基板１００２のＹ方向の１回の搬送において、上流側ノズル領域６４Ａのノズル６２によって印刷領域の全体にインクドットを配置し、かつ下流側ノズル領域６４Ｂのノズル６２によって印刷領域のうち境界領域以外の非境界領域にインクドットを配置して、導電パターンを完成させてもよい。 In step S13, the nozzles 62 of the upstream nozzle area 64A arrange ink dots in the entire printing area, and in step S16, the nozzles 62 of the downstream nozzle area 64B arrange non-border areas of the printing area. Ink dots may be placed in the boundary area. Further, in one transfer of the printed wiring board 1002 in the Y direction, the nozzles 62 of the upstream nozzle region 64A arrange ink dots in the entire printing region, and the nozzles 62 of the downstream nozzle region 64B dispose ink dots in the entire printing region. Ink dots may be placed in non-boundary areas other than the boundary areas to complete the conductive pattern.
　図１５は、パターン製造装置１０のノズル位置調整方法の各工程を示すフローチャートである。ノズル位置調整方法は、パターン製造装置１０の状態が変わり得る場合に実施される。パターン製造装置１０の状態が変わり得る場合とは、例えば、液体吐出ヘッド１２を取り外した場合、搬送装置２０等をメンテナンスした場合、又は液体吐出ヘッド１２を長期間放置した場合等である。ノズル位置調整方法は、例えば毎朝１回実施される。 FIG. 15 is a flow chart showing each step of the nozzle position adjustment method of the pattern manufacturing apparatus 10. FIG. The nozzle position adjustment method is performed when the state of the pattern manufacturing apparatus 10 may change. The case where the state of the pattern manufacturing apparatus 10 may change includes, for example, when the liquid ejection head 12 is removed, when maintenance is performed on the conveying device 20 or the like, or when the liquid ejection head 12 is left for a long period of time. The nozzle position adjustment method is performed, for example, once every morning.
　ステップＳ２１では、ヘッド制御部７６、及び搬送制御部７８は、予め定められたノズル６２を使用してプリント配線基板１００２の予め定められた位置にノズル位置確認用の十字パターンを印刷する。ここでは、上流側ノズル領域６４Ａのノズル６２を用いて十字パターンを印刷する。図１６は、プリント配線基板１００２に印刷された十字パターン１１２を示す模式図である。十字パターン１１２を印刷する位置は、ＩＣ１００６の上面であってもよい。 In step S21, the head control unit 76 and the transport control unit 78 use predetermined nozzles 62 to print a cross pattern for checking the nozzle position at predetermined positions on the printed wiring board 1002 . Here, a cross pattern is printed using the nozzles 62 in the upstream nozzle region 64A. FIG. 16 is a schematic diagram showing the cross pattern 112 printed on the printed wiring board 1002. As shown in FIG. The position where the cross pattern 112 is printed may be the upper surface of the IC 1006 .
　図１５の説明に戻り、ステップＳ２２（「読取工程」の一例）では、カメラ制御部７７は、ステップＳ３で印刷した十字パターン１１２、及びプリント配線基板１００２のアライメントマーク１００５をカメラ１３に読み取らせ、読取結果を取得する。 Returning to the description of FIG. 15, in step S22 (an example of a “reading step”), the camera control unit 77 causes the camera 13 to read the cross pattern 112 printed in step S3 and the alignment marks 1005 of the printed wiring board 1002, Get the reading result.
　ステップＳ２３（「調整工程」の一例）では、ヘッド制御部７６は、ステップＳ４で取得した読取結果に基づいて、上流側ノズル領域６４Ａのノズル６２のノズル位置（液体吐出ヘッド１２の位置）を調整する。十字パターン１１２の読取結果から、十字パターン１１２を印刷したノズル６２、及びカメラ１３の位置関係がわかり、アライメントマーク１００５の読取結果から、ノズル６２とアライメントマーク１００５の位置関係がわかる。また、アライメントマーク１００５と印刷領域の位置関係は導電パターンデータから予めわかっている。したがって、ノズル６２が印刷領域の境界領域にインクドットを配置できるようにノズル位置の調整をすることができる。 In step S23 (an example of an "adjustment step"), the head control unit 76 adjusts the nozzle positions of the nozzles 62 in the upstream nozzle region 64A (the positions of the liquid ejection heads 12) based on the reading results obtained in step S4. do. The positional relationship between the nozzle 62 that printed the cross pattern 112 and the camera 13 can be found from the result of reading the cross pattern 112 , and the positional relationship between the nozzle 62 and the alignment mark 1005 can be found from the result of reading the alignment mark 1005 . Also, the positional relationship between the alignment mark 1005 and the printing area is known in advance from the conductive pattern data. Therefore, the nozzle positions can be adjusted so that the nozzles 62 can place ink dots in the boundary area of the print area.
　本実施形態では、上流側ノズル領域６４Ａのノズル６２によって印刷領域の境界領域にインクドットを配置する。したがって、上流側ノズル領域６４Ａのノズル６２のノズル位置調整を優先する。複数のノズル領域において調整しようとすると、平均的な調整になってしまうためである。 In this embodiment, the nozzles 62 of the upstream nozzle area 64A arrange ink dots in the boundary area of the printing area. Therefore, priority is given to the nozzle position adjustment of the nozzles 62 in the upstream nozzle region 64A. This is because if an attempt is made to make adjustments in a plurality of nozzle regions, the adjustment will end up being an average adjustment.
　［パターン製造装置の他の形態］
　図１７は、他の形態に係るパターン製造装置１０Ａの全体構成図である。ここでは、パターン製造装置１０Ａとパターン製造装置１０との違いについて説明し、両者の間で共通する構成要素の説明は適宜省略する。 [Other Forms of Pattern Manufacturing Apparatus]
FIG. 17 is an overall configuration diagram of a pattern manufacturing apparatus 10A according to another embodiment. Here, differences between the pattern manufacturing apparatus 10A and the pattern manufacturing apparatus 10 will be described, and descriptions of common components between the two will be omitted as appropriate.
　パターン製造装置１０Ａは、液体吐出ヘッド１２Ｂを備える。液体吐出ヘッド１２Ｂは、Ｙ方向の全長が、プリント配線基板１００２のＹ方向の長さに満たない短尺のヘッドである。液体吐出ヘッド１２Ｂは、それぞれ不図示の複数のノズルを有する複数のノズル領域であって、Ｘ方向（「相対移動の方向」の一例）におけるノズルの位置に応じて分割された複数のノズル領域を含む。 The pattern manufacturing apparatus 10A includes a liquid ejection head 12B. The liquid ejection head 12B is a short head whose total length in the Y direction is less than the length of the printed wiring board 1002 in the Y direction. The liquid ejection head 12B has a plurality of nozzle regions each having a plurality of nozzles (not shown), which are divided according to the positions of the nozzles in the X direction (an example of the “direction of relative movement”). include.
　複数のノズルの配置は、Ｙ方向に沿う１列配置、又は２列のジグザグ配置等である。Ｙ方向のノズル数は、Ｙ方向の記録解像度に応じて適宜決めればよい。 The arrangement of the plurality of nozzles is, for example, one-row arrangement along the Y direction or two-row zigzag arrangement. The number of nozzles in the Y direction may be appropriately determined according to the printing resolution in the Y direction.
　液体吐出ヘッド１２Ｂは、キャリッジ２６によって支持される。キャリッジ２６（「相対移動機構」の一例）は、Ｘ方向に沿って配置されるガイド２８によって、Ｘ方向、及び－Ｘ方向に移動自在に支持される。Ｘ方向へ移動（「相対移動」の一例）する液体吐出ヘッド１２Ｂから導電インクを吐出させることで、プリント配線基板１００２には、Ｘ方向に導電インクのドット列が形成される。移動機構２４によるプリント配線基板１００２のＹ方向の移動と、キャリッジ２６による液体吐出ヘッド１２ＢのＸ方向の移動とを繰り返すことで、プリント配線基板１００２の印刷領域に導電パターンを形成することができる。 The liquid ejection head 12B is supported by the carriage 26. A carriage 26 (an example of a “relative movement mechanism”) is movably supported in the X direction and the −X direction by a guide 28 arranged along the X direction. By ejecting conductive ink from the liquid ejection head 12B that moves in the X direction (an example of “relative movement”), a dot row of conductive ink is formed in the X direction on the printed wiring board 1002 . By repeating movement of the printed wiring board 1002 in the Y direction by the movement mechanism 24 and movement of the liquid ejection head 12B in the X direction by the carriage 26, a conductive pattern can be formed in the printing area of the printed wiring board 1002.
　［液体吐出ヘッドの他の形態］
　図１８は、液体吐出ヘッド１２に適用される他の形態のヘッドモジュール２００におけるノズル面２０２の平面透視図である。なお、図５と共通する部分には共通する符号を付し、詳細な説明は省略する。 [Other Forms of Liquid Ejection Head]
FIG. 18 is a perspective plan view of a nozzle surface 202 in another form of head module 200 applied to the liquid ejection head 12. FIG. Parts common to those in FIG. 5 are denoted by common reference numerals, and detailed description thereof will be omitted.
　ヘッドモジュール２００のノズル面２０２の形状は、ノズル面６０の形状と同様である。ヘッドモジュール２００のノズル面２０２は、Ｗ方向についてそれぞれ流路が独立した２つのノズル領域である第１のノズル領域２０４Ａ、及び第２のノズル領域２０４Ｂを有している。第１のノズル領域２０４Ａにはノズル２０６Ａが２次元マトリクス配置され、第２のノズル領域２０４Ｂにはノズル２０６Ｂが２次元マトリクス配置される。第１のノズル領域２０４Ａに属するノズル２０６Ａと、第２のノズル領域２０４Ｂに属するノズル２０６Ｂとは、同一数であり、同一の配置を有している。 The shape of the nozzle surface 202 of the head module 200 is the same as the shape of the nozzle surface 60. The nozzle surface 202 of the head module 200 has a first nozzle area 204A and a second nozzle area 204B, which are two nozzle areas with independent flow paths in the W direction. Nozzles 206A are arranged in a two-dimensional matrix in the first nozzle region 204A, and nozzles 206B are arranged in a two-dimensional matrix in the second nozzle region 204B. The nozzles 206A belonging to the first nozzle region 204A and the nozzles 206B belonging to the second nozzle region 204B have the same number and the same arrangement.
　ヘッドモジュール２００の第１のノズル領域２０４Ａのノズル２０６Ａ、及び第２のノズル領域２０４Ｂのノズル２０６ＢをＸ方向に沿って投影した投影ノズル列は、ノズル２０６Ａ、及び２０４Ｂが交互に並ぶ。すなわち、ノズル２０６Ａのノズル番号は奇数となり、ノズル２０６Ｂのノズル番号は偶数となる。 Nozzles 206A and 204B are arranged alternately in a projection nozzle row obtained by projecting nozzles 206A of the first nozzle region 204A and nozzles 206B of the second nozzle region 204B of the head module 200 along the X direction. That is, the nozzle number of the nozzle 206A is odd, and the nozzle number of the nozzle 206B is even.
　第１のノズル領域２０４Ａは、Ｗ方向に沿って配置された複数のノズル２０６Ａから構成されるノズル列ごとに供給流路２０８Ａが設けられる。同一のノズル列に属するノズル２０６Ａは、同一の供給流路２０８Ａからインクが供給される。この複数の供給流路２０８Ａは、Ｖ方向に沿って設けられる本供給路２１０Ａと連通している。 In the first nozzle region 204A, a supply channel 208A is provided for each nozzle row composed of a plurality of nozzles 206A arranged along the W direction. The nozzles 206A belonging to the same nozzle row are supplied with ink from the same supply channel 208A. The plurality of supply channels 208A communicate with a main supply channel 210A provided along the V direction.
　同様に、第２のノズル領域２０４Ｂは、Ｗ方向に沿って配置された複数のノズル２０６Ｂから構成されるノズル列ごとに供給流路２０８Ｂが設けられる。同一のノズル列に属するノズル２０６Ｂは、同一の供給流路２０８Ｂからインクが供給される。この複数の供給流路２０８Ｂは、Ｖ方向に沿って設けられる本供給路２１０Ｂと連通している。 Similarly, in the second nozzle region 204B, a supply channel 208B is provided for each nozzle row composed of a plurality of nozzles 206B arranged along the W direction. The nozzles 206B belonging to the same nozzle row are supplied with ink from the same supply channel 208B. The plurality of supply channels 208B communicate with the main supply channel 210B provided along the V direction.
　図１９は、ヘッドモジュール２００の内部構造を示す断面図である。ここでは、第１のノズル領域２０４Ａを示している。ヘッドモジュール２００のシリコンダイ４４は、ノズル板２１２、流路構造体２１４、圧電素子２３０、振動板２３２、及び接着層２３４を備える。 19 is a cross-sectional view showing the internal structure of the head module 200. FIG. Here, the first nozzle region 204A is shown. The silicon die 44 of the head module 200 includes a nozzle plate 212 , a channel structure 214 , piezoelectric elements 230 , a vibration plate 232 and an adhesive layer 234 .
　ノズル板２１２は、流路構造体２１４の下面に設けられ、ノズル面２０２を構成する。ノズル板２１２には、ノズル２０６Ａが設けられる。 The nozzle plate 212 is provided on the lower surface of the channel structure 214 and constitutes the nozzle surface 202 . The nozzle plate 212 is provided with nozzles 206A.
　流路構造体２１４には、供給流路２０８Ａ、個別供給路２１６、圧力室２１８、ノズル連通路２２０、循環個別流路２２６、循環共通流路２２８が設けられる。 The channel structure 214 is provided with a supply channel 208A, an individual supply channel 216, a pressure chamber 218, a nozzle communication channel 220, an individual circulation channel 226, and a common circulation channel 228.
　供給流路２０８Ａは、本供給路２１０Ａ（図１８参照）と連通する。個別供給路２１６は、供給流路２０８Ａと圧力室２１８とを連通させる。 The supply channel 208A communicates with the main supply channel 210A (see FIG. 18). The individual supply channel 216 allows the supply channel 208A and the pressure chamber 218 to communicate with each other.
　圧力室２１８は、ノズル２０６Ａに対応して設けられている。圧力室２１８は、平面形状が概略正方形となっており、対角線上の両隅部の一方に個別供給路２１６が設けられ、他方にノズル連通路２２０が設けられる。なお、圧力室２１８の形状は、正方形に限定されず、多角形、円形、又は楕円形であってもよい。 The pressure chamber 218 is provided corresponding to the nozzle 206A. The pressure chamber 218 has a substantially square planar shape, and the individual supply passage 216 is provided at one of both diagonal corners, and the nozzle communication passage 220 is provided at the other corner. Note that the shape of the pressure chamber 218 is not limited to a square, and may be polygonal, circular, or elliptical.
　ノズル連通路２２０は、圧力室２１８とノズル２０６Ａとを連通させる。循環個別流路２２６は、ノズル連通路２２０と循環共通流路２２８とを連通させる。 The nozzle communication passage 220 communicates the pressure chamber 218 and the nozzle 206A. The individual circulation channel 226 allows the nozzle communication channel 220 and the common circulation channel 228 to communicate with each other.
　循環共通流路２２８は、不図示の本回収路を介してインク回収路４８（図４参照）と連通する。 The circulation common channel 228 communicates with the ink recovery channel 48 (see FIG. 4) via the main recovery channel (not shown).
　流路構造体２１４の上面には、振動板２３２が設けられる。圧電素子２３０は、接着層２３４を介して振動板２３２の上面に配置される。 A vibration plate 232 is provided on the upper surface of the flow path structure 214 . The piezoelectric element 230 is arranged on the upper surface of the vibration plate 232 with an adhesive layer 234 interposed therebetween.
　圧電素子２３０は、対応するノズル２０６Ａからインクを吐出させるためのアクチュエータである。圧電素子２３０は、上部電極（個別電極）２３６、圧電体層２３８、及び下部電極（共通電極）２４０が積層された積層構造を有する。上部電極２３６は、各圧力室２１８の形状に対応してパターニングされた個別電極となっており、圧力室２１８毎に、それぞれ圧電素子２３０が設けられている。 The piezoelectric element 230 is an actuator for ejecting ink from the corresponding nozzle 206A. The piezoelectric element 230 has a laminated structure in which an upper electrode (individual electrode) 236, a piezoelectric layer 238, and a lower electrode (common electrode) 240 are laminated. The upper electrode 236 is an individual electrode patterned in accordance with the shape of each pressure chamber 218 , and the piezoelectric element 230 is provided for each pressure chamber 218 .
　このように構成されるヘッドモジュール２００において、不図示のインクタンクからインク供給路４６（図４参照）を介して供給されるインクは、本供給路２１０Ａ、及び供給流路２０８Ａを介して圧力室２１８に供給される。対応する圧力室２１８に設けられた圧電素子２３０の上部電極２３６に駆動電圧が印加されると、圧電素子２３０、及び振動板２３２が変形して圧力室２１８の容積が変化し、これに伴う圧力変化によりノズル連通路２２０を介してノズル２０６Ａからインクが吐出される。 In the head module 200 configured as described above, ink supplied from an ink tank (not shown) through the ink supply channel 46 (see FIG. 4) is supplied to the pressure chamber through the main supply channel 210A and the supply channel 208A. 218. When a drive voltage is applied to the upper electrode 236 of the piezoelectric element 230 provided in the corresponding pressure chamber 218, the piezoelectric element 230 and the vibration plate 232 are deformed to change the volume of the pressure chamber 218, resulting in a pressure increase. Ink is ejected from the nozzle 206A through the nozzle communication path 220 due to the change.
　ノズル２０６Ａから吐出されなかったインクは、循環個別流路２２６、循環共通流路２２８、本回収路、及びインク回収路４８を介して不図示のインクタンクへ回収される。これにより、非吐出時におけるノズル２０６Ａのインクの増粘が防止される。 Ink not ejected from the nozzles 206A is recovered to an ink tank (not shown) through the individual circulation channel 226, the common circulation channel 228, the main recovery channel, and the ink recovery channel 48. This prevents thickening of the ink from the nozzle 206A during non-ejection.
　ここでは、第１のノズル領域２０４Ａについて説明したが、第２のノズル領域２０４Ｂにおける内部構造、及び動作も第１のノズル領域２０４Ａと同様である。 Although the first nozzle region 204A has been described here, the internal structure and operation of the second nozzle region 204B are similar to those of the first nozzle region 204A.
　ヘッドモジュール２００を有する液体吐出ヘッド１２において、第１のノズル領域２０４Ａのノズル２０６Ａ、又は第２のノズル領域２０４Ｂのノズル２０６Ｂによって基材の境界領域にインクドットを配置することで、液体吐出ヘッド内に流路構造による特性ばらつきがあっても境界の描画精度を高めることができる。 In the liquid ejection head 12 having the head module 200, the nozzles 206A of the first nozzle area 204A or the nozzles 206B of the second nozzle area 204B arrange ink dots in the boundary area of the substrate, thereby Even if there are variations in characteristics due to the channel structure, the boundary drawing accuracy can be improved.
　図２０は、液体吐出ヘッド１２に適用される他の形態のヘッドモジュール３００におけるノズル面３０２の平面図と平面拡大図である。ヘッドモジュール３００のノズル面３０２は、第１のノズル領域３０４Ａ、及び第２のノズル領域３０４Ｂを有している。第１のノズル領域３０４Ａにはノズル３０６ＡがＸ方向に沿って間隔Ｌで一列に配置され、第２のノズル領域３０４Ｂにはノズル３０６ＢがＸ方向に沿って間隔Ｌで一列に配置される。ノズル３０６Ａとノズル３０６Ｂとは、Ｘ方向にＬ／２だけずれた位置に配置されたジグザグ配置となっている。 20A and 20B are a plan view and an enlarged plan view of a nozzle surface 302 in another form of head module 300 applied to the liquid ejection head 12. FIG. The nozzle surface 302 of the head module 300 has a first nozzle area 304A and a second nozzle area 304B. Nozzles 306A are arranged in a row at intervals L along the X direction in the first nozzle region 304A, and nozzles 306B are arranged in a row at intervals L along the X direction in the second nozzle region 304B. The nozzles 306A and 306B are arranged in a zigzag arrangement at positions shifted by L/2 in the X direction.
　ヘッドモジュール３００の第１のノズル領域３０４Ａのノズル３０６Ａ、及び第２のノズル領域３０４Ｂのノズル３０６ＢをＸ方向に沿って投影した投影ノズル列は、ノズル３０６Ａ、及び３０４Ｂが交互に並ぶ。 Nozzles 306A and 304B are arranged alternately in a projected nozzle row obtained by projecting nozzles 306A of the first nozzle region 304A and nozzles 306B of the second nozzle region 304B of the head module 300 along the X direction.
　ヘッドモジュール３００を有する液体吐出ヘッド１２において、第１のノズル領域３０４Ａのノズル３０６Ａ、又は第２のノズル領域３０４Ｂのノズル３０６Ｂによって基材の境界領域にインクドットを配置することで、ノズル領域間に特性ばらつきがあっても境界の描画精度を高めることができる。 In the liquid ejection head 12 having the head module 300, the nozzles 306A of the first nozzle region 304A or the nozzles 306B of the second nozzle region 304B arrange ink dots in the boundary region of the base material, thereby Even if there are variations in characteristics, it is possible to improve the drawing accuracy of the boundary.
　ここまでは、相対移動の方向におけるノズルの位置に応じて分割された２つのノズル領域を含む液体吐出ヘッド１２において、一方のノズル領域のノズルで境界領域にインクドットを配置する例を説明したが、ノズル特性に応じて分割された３つ以上のノズル領域を含む液体吐出ヘッドにおいて、いずれかのノズル領域のノズルで境界領域にインクドットを配置してもよい。 So far, an example has been described in which the liquid ejection head 12 includes two nozzle regions divided according to the position of the nozzles in the direction of relative movement, and ink dots are arranged in the boundary region with the nozzles of one of the nozzle regions. In a liquid ejection head including three or more nozzle regions divided according to nozzle characteristics, ink dots may be arranged in boundary regions by nozzles in any of the nozzle regions.
　［その他］
　ここまで導電パターン１０２０の形成について説明したが、本実施形態は、絶縁パターン１０２４の形成に適用することができる。さらに、本実施形態は、導電インク、及び絶縁インクに限定されず、液体吐出ヘッドを用いた各種パターンの形成に対して応用することができる。 [others]
Although the formation of the conductive pattern 1020 has been described so far, the present embodiment can be applied to the formation of the insulating pattern 1024 . Furthermore, the present embodiment is not limited to conductive ink and insulating ink, and can be applied to formation of various patterns using a liquid ejection head.
　本発明の技術的範囲は、上記の実施形態に記載の範囲には限定されない。各実施形態における構成等は、本発明の趣旨を逸脱しない範囲で、各実施形態間で適宜組み合わせることができる。 The technical scope of the present invention is not limited to the scope described in the above embodiments. Configurations and the like in each embodiment can be appropriately combined between each embodiment without departing from the gist of the present invention.
１０、１０Ａ…パターン製造装置
１２、１２Ｂ…液体吐出ヘッド
１３…カメラ
１４…ヘッド支持部材
２０…搬送装置
２２…テーブル
２４…移動機構
２６…キャリッジ
２８…ガイド
３０…基台
４０…ヘッドモジュール
４２…Ｌ型ブラケット
４４…シリコンダイ
４６…インク供給路
４８…インク回収路
５０…フィルタハウジング
６０…ノズル面
６２…ノズル
６４Ａ…上流側ノズル領域
６４Ｂ…下流側ノズル領域
７０…システム制御部
７２…データ取得部
７４…データ処理部
７６…ヘッド制御部
７７…カメラ制御部
７８…搬送制御部
７９…メモリ
８０…制御装置
８２…プロセッサ
８４…コンピュータ可読媒体
８５…パターン製造プログラム
８６…通信インターフェース
８８…入出力インターフェース
９０…バス
９２…入力装置
９４…ディスプレイ装置
１００…基材
１０２…印刷領域
１０２Ａ…境界
１０２Ｂ…境界領域
１０２Ｃ…非境界領域
１０４…非印刷領域
１１０Ａ、１１０Ｂ、１１１Ａ、１１１Ｂ…インクドット
１１２…十字パターン
２００…ヘッドモジュール
２０２…ノズル面
２０４Ａ…第１のノズル領域
２０４Ｂ…第２のノズル領域
２０６Ａ、２０６Ｂ…ノズル
２０８Ａ、２０８Ｂ…供給流路
２１０Ａ、２１０Ｂ…本供給路
２１２…ノズル板
２１４…流路構造体
２１６…個別供給路
２１８…圧力室
２２０…ノズル連通路
２２６…循環個別流路
２２８…循環共通流路
２３０…圧電素子
２３２…振動板
２３４…接着層
２３６…上部電極
２３８…圧電体層
２４０…下部電極
３００…ヘッドモジュール
３０２…ノズル面
３０４Ａ…第１のノズル領域
３０４Ｂ…第２のノズル領域
３０６Ａ、３０６Ｂ…ノズル
１０００…電気部品実装基板
１００２…プリント配線基板
１００４…部品実装面
１００５…アライメントマーク
１００６…ＩＣ
１００６Ａ…側面
１００６Ｂ…裏面
１００６Ｃ…上面
１００８…抵抗器
１００８Ａ…抵抗アレイ
１００９…電極
１０１０…コンデンサ
１０２０…導電パターン
１０２２…絶縁被覆
１０２４…絶縁パターン
１０３０…基板側電極
１０３２…素子側電極
１０３４…はんだバンプ
Ｓ１～Ｓ３…パターン製造方法のステップ
Ｓ１１～Ｓ１６…導電パターンの形成工程の詳細なステップ
Ｓ２１～Ｓ２３…ノズル位置調整方法のステップ DESCRIPTION OF SYMBOLS 10, 10A... Pattern manufacturing apparatus 12, 12B... Liquid discharge head 13... Camera 14... Head supporting member 20... Conveying device 22... Table 24... Moving mechanism 26... Carriage 28... Guide 30... Base 40... Head module 42... L Mold bracket 44 Silicon die 46 Ink supply path 48 Ink recovery path 50 Filter housing 60 Nozzle surface 62 Nozzle 64A Upstream nozzle region 64B Downstream nozzle region 70 System control unit 72 Data acquisition unit 74 Data processing unit 76 Head control unit 77 Camera control unit 78 Transport control unit 79 Memory 80 Control device 82 Processor 84 Computer readable medium 85 Pattern manufacturing program 86 Communication interface 88 Input/output interface 90 Bus 92 Input device 94 Display device 100 Base material 102 Print area 102A Boundary area 102B Border area 102C Non-boundary area 104 Non-print area 110A, 110B, 111A, 111B Ink dot 112 Cross pattern 200 Head module 202 Nozzle surface 204A First nozzle region 204B Second nozzle regions 206A, 206B Nozzles 208A, 208B Supply channels 210A, 210B Main supply channel 212 Nozzle plate 214 Channel structure 216 Individual supply channel 218 Pressure chamber 220 Nozzle communication channel 226 Individual circulation channel 228 Common circulation channel 230 Piezoelectric element 232 Diaphragm 234 Adhesive layer 236 Upper electrode 238 Piezoelectric layer 240 Lower electrode 300... Head module 302... Nozzle surface 304A... First nozzle area 304B... Second nozzle area 306A, 306B... Nozzle 1000... Electric component mounting board 1002... Printed wiring board 1004... Component mounting surface 1005... Alignment mark 1006... IC
1006A side surface 1006B rear surface 1006C upper surface 1008 resistor 1008A resistor array 1009 electrode 1010 capacitor 1020 conductive pattern 1022 insulating coating 1024 insulating pattern 1030 board-side electrode 1032 element-side electrode 1034 solder bump S1 ∼S3 Steps S11 to S16 of the pattern manufacturing method Detailed steps S21 to S23 of the conductive pattern forming process Steps of the nozzle position adjusting method

Claims (15)

  1. 　液体を吐出する複数のノズルを有する液体吐出ヘッドと、
    　基材及び前記液体吐出ヘッドを相対移動させる相対移動機構と、
    　を備えるパターン製造装置を用いたパターン製造方法であって、
    　前記液体吐出ヘッドは、それぞれ複数のノズルを有する複数のノズル領域であって、前記相対移動の方向におけるノズルの位置に応じて分割された複数のノズル領域を含み、
    　前記基材及び前記液体吐出ヘッドを相対移動させて前記複数のノズルから液体を吐出させ、前記基材の表面の印刷領域に複数のドットを配置してパターンを形成するパターン形成工程を備え、
    　前記パターン形成工程は、前記印刷領域のうち前記印刷領域とは異なる非印刷領域との境界を含む境界領域に、前記複数のノズル領域のうちの特定のノズル領域のノズルによってドットを配置する、
    　パターン製造方法。     a liquid ejection head having a plurality of nozzles for ejecting liquid;
    a relative movement mechanism for relatively moving the substrate and the liquid ejection head;
    A pattern manufacturing method using a pattern manufacturing apparatus comprising
    the liquid ejection head includes a plurality of nozzle regions each having a plurality of nozzles, the plurality of nozzle regions divided according to the positions of the nozzles in the direction of the relative movement;
    a pattern forming step of forming a pattern by arranging a plurality of dots in a printing region on the surface of the base material by relatively moving the base material and the liquid discharge head to discharge the liquid from the plurality of nozzles;
    In the pattern forming step, dots are arranged by nozzles of a specific nozzle area among the plurality of nozzle areas in a boundary area including a boundary between the print area and a non-print area different from the print area.
    Pattern manufacturing method.
  2. 　前記パターン形成工程は、前記印刷領域のうち前記境界領域以外の非境界領域に、前記複数のノズル領域のノズルによってドットを配置する、
    　請求項１に記載のパターン製造方法。     In the pattern forming step, dots are arranged by nozzles of the plurality of nozzle regions in a non-boundary region other than the boundary region in the printing region.
    The pattern manufacturing method according to claim 1.
  3. 　前記パターン形成工程は、前記特定のノズル領域のノズルによって前記境界領域にドットを配置してから前記複数のノズル領域のノズルによって前記非境界領域にドットを配置する、
    　請求項２に記載のパターン製造方法。     In the pattern forming step, the nozzles in the specific nozzle area arrange dots in the boundary area, and then the nozzles in the plurality of nozzle areas arrange dots in the non-boundary area.
    The pattern manufacturing method according to claim 2.
  4. 　前記特定のノズル領域は、前記相対移動の上流側に配置された上流側ノズル領域である、
    　請求項１から３のいずれか１項に記載のパターン製造方法。     The specific nozzle area is an upstream nozzle area arranged upstream of the relative movement,
    The pattern manufacturing method according to any one of claims 1 to 3.
  5. 　前記パターン形成工程は、前記境界領域以外の領域に配置するドットを増加させる、
    　請求項１から４のいずれか１項に記載のパターン製造方法。     The pattern forming step increases the number of dots arranged in areas other than the boundary area.
    The pattern manufacturing method according to any one of claims 1 to 4.
  6. 　前記パターン形成工程は、前記印刷領域のうち前記境界領域に隣接する領域に、前記境界領域に配置するドットのサイズよりも相対的に大きいサイズのドットを配置する、
    　請求項１から５のいずれか１項に記載のパターン製造方法。     In the pattern forming step, dots having a size relatively larger than the size of dots to be arranged in the boundary area are arranged in an area adjacent to the boundary area in the printing area.
    The pattern manufacturing method according to any one of claims 1 to 5.
  7. 　前記パターン形成工程は、前記基材及び前記液体吐出ヘッドの特定の方向の複数回の相対移動によって前記パターンを形成する、
    　請求項１から６のいずれか１項に記載のパターン製造方法。     In the pattern forming step, the pattern is formed by relatively moving the substrate and the liquid ejection head multiple times in a specific direction.
    The pattern manufacturing method according to any one of claims 1 to 6.
  8. 　前記パターン形成工程は、前記境界領域に、前記特定のノズル領域のノズルのみによってドットを配置する、
    　請求項１から７のいずれか１項に記載のパターン製造方法。     In the pattern forming step, dots are arranged in the boundary area only by the nozzles of the specific nozzle area.
    The pattern manufacturing method according to any one of claims 1 to 7.
  9. 　前記複数のノズルは、それぞれ複数のサイズのドットを配置可能であり、
    　前記パターン形成工程は、前記境界領域に同一サイズのドットを配置する、
    　請求項１から８のいずれか１項に記載のパターン製造方法。     The plurality of nozzles can each arrange dots of a plurality of sizes,
    In the pattern forming step, dots of the same size are arranged in the boundary area.
    The pattern manufacturing method according to any one of claims 1 to 8.
  10. 　前記基材は、位置合わせマークを備え、
    　前記位置合わせマークを読み取る読取工程と、
    　前記読取工程における前記位置合わせマークの読取結果を用いて前記特定のノズル領域のノズルの着弾位置を調整する調整工程と、
    　を備える請求項１から９のいずれか１項に記載のパターン製造方法。     the substrate comprises an alignment mark;
    a reading step of reading the alignment mark;
    an adjustment step of adjusting the landing positions of the nozzles in the specific nozzle region using the reading result of the alignment mark in the reading step;
    The pattern manufacturing method according to any one of claims 1 to 9, comprising:
  11. 　前記基材に対して液体の濡れ広がりを抑制する機能性材料を含んだ前処理液を予め塗布する前処理液塗布工程を備える、
    　を備える請求項１から１０のいずれか１項に記載のパターン製造方法。     A pretreatment liquid application step of applying in advance a pretreatment liquid containing a functional material that suppresses wetting and spreading of the liquid on the base material,
    The pattern manufacturing method according to any one of claims 1 to 10, comprising:
  12. 　前記基材は、電気部品が実装された電気回路基板であり、
    　前記印刷領域は、電磁波シールドの形成の対象とされる前記電気部品を含み、
    　前記液体は導電性液体である、
    　請求項１から１１のいずれか１項に記載のパターン製造方法。     The base material is an electric circuit board on which electric components are mounted,
    the printed area includes the electrical component targeted for formation of an electromagnetic shield;
    the liquid is a conductive liquid;
    The pattern manufacturing method according to any one of claims 1 to 11.
  13. 　請求項１から１２のいずれか１項に記載のパターン製造方法をコンピュータに実行させるためのプログラム。 A program for causing a computer to execute the pattern manufacturing method according to any one of claims 1 to 12.
  14. 　非一時的かつコンピュータ読取可能な記録媒体であって、請求項１３に記載のプログラムが記録された記録媒体。 A non-temporary computer-readable recording medium in which the program according to claim 13 is recorded.
  15. 　液体を吐出する複数のノズルを有する液体吐出ヘッドと、
    　基材及び前記液体吐出ヘッドを相対移動させる相対移動機構と、
    　少なくとも１つのプロセッサと、
    　前記少なくとも１つのプロセッサに実行させるための命令を記憶する少なくとも１つのメモリと、
    　を備え、
    　前記液体吐出ヘッドは、それぞれ複数のノズルを有する複数のノズル領域であって、前記相対移動の方向におけるノズルの位置に応じて分割された複数のノズル領域を含み、
    　前記少なくとも１つのプロセッサは、
    　前記基材及び前記液体吐出ヘッドを相対移動させて前記複数のノズルから液体を吐出させ、前記基材の表面の印刷領域に複数のドットを配置してパターンを形成し、
    　前記印刷領域のうち前記印刷領域とは異なる非印刷領域との境界を含む境界領域に、前記複数のノズル領域のうちの特定のノズル領域のノズルによってドットを配置する、
    　パターン製造装置。     a liquid ejection head having a plurality of nozzles for ejecting liquid;
    a relative movement mechanism for relatively moving the substrate and the liquid ejection head;
    at least one processor;
    at least one memory storing instructions for execution by the at least one processor;
    with
    the liquid ejection head includes a plurality of nozzle regions each having a plurality of nozzles, the plurality of nozzle regions divided according to the positions of the nozzles in the direction of the relative movement;
    The at least one processor
    forming a pattern by arranging a plurality of dots in a printing region on the surface of the base material by moving the base material and the liquid discharge head relative to each other to discharge the liquid from the plurality of nozzles;
    arranging dots by nozzles of a specific nozzle area among the plurality of nozzle areas in a boundary area including a boundary between the print area and a non-print area different from the print area;
    Pattern manufacturing equipment.
PCT/JP2022/027491 2021-09-24 2022-07-13 Pattern manufacturing method, program, and pattern manufacturing device WO2023047768A1 (en)

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