TW202236464A - Heater unit of heat treatment oven - Google Patents
Heater unit of heat treatment oven Download PDFInfo
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- TW202236464A TW202236464A TW110118836A TW110118836A TW202236464A TW 202236464 A TW202236464 A TW 202236464A TW 110118836 A TW110118836 A TW 110118836A TW 110118836 A TW110118836 A TW 110118836A TW 202236464 A TW202236464 A TW 202236464A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/64—Heating elements specially adapted for furnaces using ribbon, rod, or wire heater
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
- F26B23/04—Heating arrangements using electric heating
- F26B23/06—Heating arrangements using electric heating resistance heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
- H05B3/08—Heater elements structurally combined with coupling elements or holders having electric connections specially adapted for high temperatures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
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Abstract
Description
本發明是關於在熱處理爐的腔室內部對玻璃基板進行熱處理時使基板面的溫度均勻性保持穩定的熱處理爐的加熱器單元。The present invention relates to a heater unit of a heat treatment furnace for stabilizing the temperature uniformity of the substrate surface when heat treating a glass substrate in a chamber of the heat treatment furnace.
最近,顯示器的市場是應用於TV、手機、屏幕等各種影像裝置,由於技術的快速發展,推動產品性能升級的努力不斷地進行。有機發光顯示裝置及LCD基板是下一代顯示器其中之一且在各種產品領域中使用。組成顯示器裝置的玻璃基板是經熱處理製造而成,而且熱處理時為了滿足各個工藝要求的條件,只有阻斷外部氣體的影響且使向腔室外部釋放的熱最小化,才能夠避免性能下降並且降低產品不良率。此外,為了改善完成品的收率,熱處理時基板的面內偏差越小越好,因此需要一種高性能的熱處理爐,針對這種高性能的熱處理爐的研究正在持續進行。Recently, the display market is applied to various video devices such as TVs, mobile phones, and screens. Due to the rapid development of technology, efforts to promote product performance upgrades are constantly being carried out. Organic light emitting display devices and LCD substrates are one of next generation displays and are used in various product fields. The glass substrate that makes up the display device is manufactured by heat treatment, and in order to meet the conditions required by various processes during heat treatment, only by blocking the influence of external air and minimizing the heat released to the outside of the chamber can performance degradation and reduction be avoided. Product defect rate. In addition, in order to improve the yield of finished products, the smaller the in-plane deviation of the substrate during heat treatment, the better. Therefore, a high-performance heat treatment furnace is required, and research on such a high-performance heat treatment furnace is ongoing.
在製造作為典型的平板顯示器的有機發光顯示裝置基板或LCD玻璃基板(以下稱之為'基板'或者'玻璃基板')的過程中,溫度控制和溫度均勻性是確保優質的基板質量和收率所必不可少的。例如,在基於熱處理爐的基板製造工藝中,由於基板表面形成有機物層可能會包含一定量的水分,因此需要進行用於蒸發水分的乾燥工藝。LCD玻璃基板製造工藝中,在基板表面上塗布感光膜之前先進行清洗過程,而在清洗過程之後執行用於去除水分的加熱乾燥工藝。如此,基板製造工藝的大部分都執行加熱及乾燥工藝,以此來製造基板。基板製造工藝中產生的水分可通過紫外線或放入包括加熱器(sheath heater)等發熱體的熱處理爐的腔室內經加熱乾燥後去除。有關於此,韓國授權專利公報第10-1238560號及韓國公開專利公報第10-2013-0028322號中已提出'LCD玻璃爐腔室'。但是,將加熱器作為發熱體的現有熱處理爐的發熱體布置方式,在滿足基板製造工藝所需的高溫性能和溫度均勻性方面存在局限性。因此,需要開發一種可以在熱處理爐的腔室內部使用且在高溫下仍不破壞絕緣地保持溫度均勻性的加熱器發熱體以及可滿足基板製造工藝中所需的高溫性能和溫度均勻性的全新的熱處理爐的加熱器。In the process of manufacturing organic light-emitting display device substrates or LCD glass substrates (hereinafter referred to as 'substrates' or 'glass substrates'), which are typical flat panel displays, temperature control and temperature uniformity are essential to ensure excellent substrate quality and yield essential. For example, in a substrate manufacturing process based on a heat treatment furnace, since an organic layer formed on the surface of the substrate may contain a certain amount of moisture, a drying process for evaporating moisture is required. In the LCD glass substrate manufacturing process, a cleaning process is performed before coating a photosensitive film on the surface of the substrate, and a heating and drying process for removing moisture is performed after the cleaning process. As such, most of the substrate manufacturing process performs heating and drying processes to manufacture the substrate. Moisture generated in the substrate manufacturing process can be removed by ultraviolet rays or by heating and drying in a chamber of a heat treatment furnace including a heating element such as a heater (sheath heater). Regarding this, Korean Patent Publication No. 10-1238560 and Korean Laid-Open Patent Publication No. 10-2013-0028322 have proposed 'LCD glass furnace chamber'. However, the arrangement of heating elements in existing heat treatment furnaces using heaters as heating elements has limitations in meeting the high temperature performance and temperature uniformity required by the substrate manufacturing process. Therefore, it is necessary to develop a heater heating element that can be used inside the chamber of a heat treatment furnace and maintain temperature uniformity without destroying insulation at high temperatures, and a new type of heater that can meet the high temperature performance and temperature uniformity required in the substrate manufacturing process. The heater of the heat treatment furnace.
先前技術文獻prior art literature
專利文獻patent documents
專利文獻1. 韓國授權專利公報第10-1238560號(公開日期2013年02月28日)。Patent Document 1. Korean Granted Patent Publication No. 10-1238560 (publication date: February 28, 2013).
專利文獻2. 韓國授權專利公報第10-0722154號(公開日期2007年05月28日)。Patent Document 2. Korean Granted Patent Publication No. 10-0722154 (publication date May 28, 2007).
專利文獻3. 韓國公開專利公報第10-2013-0028322號(公開日期2013年03月19日)。Patent Document 3. Korean Laid-Open Patent Publication No. 10-2013-0028322 (publication date: March 19, 2013).
發明概要Summary of the invention
發明欲解决之課題The problem to be solved by the invention
本發明要解決的一技術問題是,提供一種在熱處理爐的腔室內部對基板進行熱處理時使基板面的溫度均勻性保持穩定的熱處理爐的加熱器單元。A technical problem to be solved by the present invention is to provide a heater unit for a heat treatment furnace that maintains stable temperature uniformity on the substrate surface when the substrate is heat treated inside the chamber of the heat treatment furnace.
本發明要解決的一技術問題是,提供一種可以在熱處理爐的腔室內部使用且在高溫下仍不破壞絕緣地保持溫度均勻性並能夠滿足基板製造工藝所需的高溫性能和溫度均勻性的熱處理爐的加熱器單元。A technical problem to be solved by the present invention is to provide a heat treatment furnace that can be used inside the chamber of a heat treatment furnace and maintain temperature uniformity without destroying insulation at high temperatures and can meet the high temperature performance and temperature uniformity required by the substrate manufacturing process. Heater unit for heat treatment furnaces.
解決課題之方法solution to the problem
根據本發明,上述目的可通過熱處理爐的加熱器單元實現,熱處理爐具有容納基板並對基本進行加熱乾燥的腔室,而且所述腔室中安裝有多個加熱器單元,從而通過多個所述加熱器單元產生的熱對基板進行加熱或乾燥,所述加熱器單元包括:管道,其內置有通過電阻發熱的電熱絲並進行加熱;上部熱傳遞板與下部熱傳遞板,其布置於所述管道的上部和下部;以及多個套管部,其布置於所述上部熱傳遞板與所述下部熱傳遞板之間並保持所述上部熱傳遞板與所述下部熱傳遞板的間距,而且用於支撐所述上部熱傳遞板與所述下部熱傳遞板。According to the present invention, the above-mentioned object can be achieved by a heater unit of a heat treatment furnace having a chamber for accommodating a substrate and heating and drying a substrate, and a plurality of heater units are installed in the chamber so that by a plurality of the The heat generated by the heater unit heats or dries the substrate, and the heater unit includes: a pipeline with a built-in electric heating wire that generates heat through resistance and heats it; an upper heat transfer plate and a lower heat transfer plate, which are arranged on the the upper and lower parts of the pipe; and a plurality of sleeve parts arranged between the upper heat transfer plate and the lower heat transfer plate and maintaining a distance between the upper heat transfer plate and the lower heat transfer plate, And for supporting the upper heat transfer plate and the lower heat transfer plate.
根據本發明的實施例,所述管道可以是具有中空結構的圓形。According to an embodiment of the present invention, the pipe may be circular with a hollow structure.
根據本發明的實施例,所述管道的一端可安裝有通過與導電部接觸來供電的電源套筒,並且以所述電源套筒的布置位置為基準可布置有套筒放熱塊。根據本發明的實施例,所述套管部具有中空孔且包括基於所述下部熱傳遞板的開口孔來確定位置的套管,所述套管可通過支撐手段沿著所述開口孔安裝固定。根據本發明的實施例,所述支撐手段可包括:固定件,其從上部熱傳遞板向下部方向突出並沿著所述套管的中空孔進入,以位於在下部熱傳遞板上穿孔形成的開口孔的中心;以及止動螺母,其在下部熱傳遞板的底面支撐所述固定件。According to an embodiment of the present invention, one end of the pipe may be installed with a power supply sleeve for supplying power through contact with the conductive part, and a sleeve heat release block may be arranged based on the arrangement position of the power supply sleeve. According to an embodiment of the present invention, the sleeve portion has a hollow hole and includes a sleeve whose position is determined based on the opening hole of the lower heat transfer plate, and the sleeve can be installed and fixed along the opening hole by a supporting means . According to an embodiment of the present invention, the supporting means may include: a fixing piece, which protrudes downward from the upper heat transfer plate and enters along the hollow hole of the sleeve, so as to be located in the hole formed by the lower heat transfer plate. the center of the open hole; and a retaining nut supporting the mount on the bottom surface of the lower heat transfer plate.
根據本發明的實施例,在所述下部熱傳遞板的下部面和所述止動螺母的上部面之間可設置墊圈,以防止固定件的移動和變形。According to an embodiment of the present invention, a washer may be provided between the lower face of the lower heat transfer plate and the upper face of the stop nut to prevent movement and deformation of the fixing member.
發明效果Invention effect
本發明具有在熱處理爐的腔室內部對基板進行熱處理時使基板面的溫度均勻性保持穩定的效果。The present invention has the effect of stabilizing the temperature uniformity of the substrate surface when the substrate is heat-treated inside the chamber of the heat treatment furnace.
此外,本發明具有可以在熱處理爐的腔室內部使用且在高溫下仍不破壞絕緣地保持溫度均勻性並能夠滿足基板製造工藝中所需的高溫性能和溫度均勻性的效果。In addition, the present invention has the effect that it can be used inside a chamber of a heat treatment furnace, maintain temperature uniformity without destroying insulation at high temperatures, and can satisfy high-temperature performance and temperature uniformity required in a substrate manufacturing process.
此外,本發明通過在加熱器單元的上部熱傳遞板與下部熱傳遞板之間夾設***式套管部從而可控制上部熱傳遞板與下部熱傳遞板的熱變形或者因上部熱傳遞板與下部熱傳遞板上施加的衝擊而引起的位置變形在內的各種變形因素。In addition, the present invention can control the thermal deformation of the upper heat transfer plate and the lower heat transfer plate by interposing the plug-in sleeve portion between the upper heat transfer plate and the lower heat transfer plate of the heater unit or the upper heat transfer plate and the lower heat transfer plate. Various deformation factors including position deformation caused by impact applied on the lower heat transfer plate.
此外,本發明通過使組成加熱器單元的上部熱傳遞板與下部熱傳遞板保持一定間距從而滿足基板製造工藝所需的高溫性能和溫度均勻性。In addition, the present invention satisfies the high temperature performance and temperature uniformity required for the substrate manufacturing process by maintaining a certain distance between the upper heat transfer plate and the lower heat transfer plate constituting the heater unit.
下面,對根據本發明的優選實施例的熱處理爐的加熱器單元進行說明。Next, a heater unit of a heat treatment furnace according to a preferred embodiment of the present invention will be described.
圖1是顯示熱處理爐100的示例。圖2是顯示熱處理爐100正面的示例。圖3是俯視熱處理爐100的示例。圖4是顯示熱處理爐100一側面的示例。FIG. 1 is an example showing a
圖1至圖4所示的附圖顯示熱處理爐100的整體結構,是包括腔室200的熱處理爐100的示例。The drawings shown in FIGS. 1 to 4 show the overall structure of the
如圖1至圖4所示,為了將待熱處理基板放入腔室200內預置的各台或者將熱處理工藝結束的基板從腔室200搬出,熱處理爐100的前側可具有遮擋器部120,後側可具有爐門部110。As shown in FIGS. 1 to 4 , in order to put the substrates to be heat-treated into the preset stations in the
此外,熱處理爐100具有用於容納待加熱或者乾燥的基板的腔室200,腔室200內安裝有由加熱體組成的多個加熱器單元300,從而可利用加熱器單元300產生的熱對基板進行加熱或者通過蒸發水分進行乾燥。In addition, the
此外,熱處理爐100在腔室200的一側具有可供含工藝氣體的流體流入的供氣口,以及可供腔室內200流體排出的排氣口,並包括框架與多個匯流條連接的導電部301,所述框架具有用於支撐並托起腔室200的支托。所述匯流條與加熱器單元300的電熱絲連接以導通電流。In addition, the
此外,雖然根據配置會有所不同但是一般情況下,組成加熱器單元300的發熱體的管道310的上下部設置有與其緊貼的上部熱傳遞板321、下部熱傳遞板322,從而在腔室內可有效地進行基板加熱工藝。In addition, although it varies depending on the configuration, in general, the upper and lower parts of the
其中,起到熱處理爐100的發熱體作用的加熱器單元300可以是在管道(金屬保護管)內中置由電阻發熱的電熱絲302(發熱線)並且加入並填充作為絕緣粉末的氧化鎂(MgO)以使電熱絲302與管道310絕緣的加熱器。管道310可以作為礦物絕緣加熱器(Mineral Insulated Heater)而使用,這種情況下,具有可製作成細長狀的特徵。Among them, the
另外,圖1和圖4中未說明的附圖標記為腔室200的內盒體210和外盒體220。另一未說明的附圖標記是冷卻外套230,其通過在腔室200內形成冷卻氣流並通過腔室200內部形成的冷卻氣流通道,將腔室200冷卻至均勻溫度分布。又另一未說明的附圖標記是使引線突出並通過引線向腔室200內供電的供電部240。In addition, reference numerals not described in FIG. 1 and FIG. 4 are the
作為參考,如圖1和圖4所示的構成熱處理爐100的基本構件,例如,腔室200的結構與工藝氣體的供氣及排氣系統、包括向加熱器單元300供電的匯流條的導電部301以及供電部240的構件與本發明沒有直接的關聯。此外,所述熱處理爐100的基本構件與本發明的主旨無關且為已知的構件,因此本發明將省略其說明。For reference, the basic components constituting the
如圖1至圖4所示,通常,為了將待熱處理基板放入腔室200內預置的各台或者將熱處理工藝結束的基板從腔室200搬出,熱處理爐100的前側可具有遮擋器120,後側可具有爐門110。As shown in FIGS. 1 to 4 , in general, in order to put the substrates to be heat-treated into the preset stations in the
此外,熱處理爐100具有用於容納待加熱或者乾燥的基板的腔室200,腔室200內安裝有由加熱體組成的加熱器單元300,從而可利用加熱器單元300產生的熱對基板進行加熱或者通過蒸發水分進行乾燥。In addition, the
此外,雖然根據配置會有所不同但是一般情況下,組成加熱器的發熱體的上下部設置有與其緊貼的上/下部熱傳遞板321及322,從而可有效地進行基板加熱工藝。In addition, although it varies depending on the configuration, in general, the upper and lower parts of the heating element constituting the heater are provided with upper/lower
此外,熱處理爐100在腔室200的一側具有可供含工藝氣體的流體流入的供氣口,以及可供腔室200內流體排出的排氣口,並包括框架和與多個匯流條連接的導電部301,所述框架具有用於支撐並托起腔室200的支托,所述匯流條與加熱器的電熱絲連接以導通電流。In addition, the
另外,為了去除腔室200內基板的熱處理工藝中基板上殘留的水分,熱處理爐100包括加熱器,而且為了提高產品的質量,需要具備更有效且高性能的工藝能力。In addition, in order to remove residual moisture on the substrate during the heat treatment process of the substrate in the
另外,為了通過縮短熱處理工藝時間來對更多的產品進行量產,設置於腔室200內部的加熱器單元300需要具有高性能的同時結構上應具有優異的耐久性。In addition, in order to mass-produce more products by shortening the heat treatment process time, the
但是,現有的熱處理爐的加熱器單元難以在高溫下仍不破壞絕緣地保持溫度均勻性,而且很難充分地滿足基板製造工藝中要求的高溫性能和溫度均勻性。However, it is difficult for the heater unit of the existing heat treatment furnace to maintain temperature uniformity at high temperature without destroying the insulation, and it is difficult to fully satisfy the high temperature performance and temperature uniformity required in the substrate manufacturing process.
因此,本發明提供一種可以在熱處理爐100的腔室200內部使用且在高溫下仍不破壞絕緣地保持溫度均勻性並能夠滿足基板製造工藝中所需的高溫性能和溫度均勻性的熱處理爐100的加熱器單元300。Therefore, the present invention provides a
下面,參照圖5至圖11詳細說明根據本發明的熱處理爐100加熱器單元300的主要構件。Hereinafter, main components of the
圖5是根據本發明一實施例的布置於熱處理爐上100的加熱器單元300的示例。圖6是顯示根據本發明一實施例的布置於熱處理爐100上的加熱器單元300的平面結構的示例。圖7是顯示根據本發明一實施例的加熱器單元300的示例。圖8是截取圖7的A部並具體顯示的示例。圖9是說明根據本發明一實施例的加熱器單元300的具體結構的示例。FIG. 5 is an example of a
如圖5至圖9所示,根據本發明實施例的熱處理爐100的加熱器單元300可以在腔室200內布置多個,所述腔室200用於容納基板並對基板(未圖示)進行加熱乾燥。熱處理爐100可配置成通過加熱器單元300產生的熱對基板進行加熱或乾燥。As shown in FIGS. 5 to 9 ,
其次,加熱器單元300可由管道310組成,所述管道310中內置有由電阻發熱的電熱絲302並通過其進行加熱。Secondly, the
其中,起到發熱體作用的管道310可優選為具有中空結構的圓形管道310,其中內置有電熱絲302。為了具有高溫發熱性能、耐久性以及均勻分布的高溫發熱性能,如圖7及圖8所示,圓形管道310可優選保持一定間距且設置成彎曲狀。Wherein, the
如此,當採用圓形管道310時,可製成保持一定間距的同時具有非急劇彎曲的柔順彎曲狀的發熱體,從而能夠起到使溫度保持均勻的重要作用,並且使厚度變細的同時能夠減小基於厚度的彎曲度的局限性和間距。基於此,在作為熱處理爐的發熱體使用時,可具有能夠提高整體性能的益處。In this way, when the
此外,如圖9所示,加熱器單元300可包括上部熱傳遞板321、下部熱傳遞板322以及多個套管部330,所述上部熱傳遞板321、下部熱傳遞板322布置於管道310的上部和下部,所述多個套管部330布置於上部熱傳遞板321與下部熱傳遞板322之間並保持上部熱傳遞板321與下部熱傳遞板322之間的間距,而且用於支撐上部熱傳遞板321、下部熱傳遞板322。In addition, as shown in FIG. 9 , the
此外,如圖8所示,加熱器單元300管道310的一端安裝有通過導電部301連接來供電的電源套筒311,而且以電源套筒311的布置位置為準,可布置有套筒放熱塊312。In addition, as shown in Figure 8, one end of the
其中,電源套筒311引導導電部301的連接,而且可配置成阻斷管道310向外部輻射的熱損失。為此,以電源套筒311的布置位置為準,其周邊部安裝有套筒放熱塊312,通過其進行高溫放熱,從而可從過熱引起的導電部301損壞或火災危險中有效保護導電部301。Wherein, the
套筒放熱塊312可優選地選自耐高溫且放熱性能和電絕緣性優秀的鋁合金或者陶瓷材料。The sleeve
圖10是說明根據本發明一實施例的加熱器單元300套管331結構的示例。圖11是顯示根據本發明一實施例的加熱器單元300套管331的分解狀態的示例。FIG. 10 is a diagram illustrating an example of the structure of the
此外,如圖9至圖11所示,加熱器單元300的套管部330具有中空孔332,並且可包括套管331,所述套管331基於下部熱傳遞板322的開口孔323確定位置。套管331可通過支撐手段沿著開口孔323安裝固定。In addition, as shown in FIGS. 9 to 11 , the
其中,套管331位於以管道310為基準的上部和下部且夾設在與其接觸的上部熱傳遞板321與下部熱傳遞板322之間,從而可以在高溫下不破壞絕緣地控制上部熱傳遞板321與下部熱傳遞板322的移動和變形並形成一定間距,進而使溫度均勻性保持一定。Wherein, the
例如,上部熱傳遞板321與下部熱傳遞板322將由管道310傳遞的熱最終輻射到熱處理爐100的腔室200內,此時如果上部熱傳遞板321與下部熱傳遞板322之間產生間距或熱應力變形等,則溫度均勻性會發生偏差。這會引起熱處理爐100中設定的熱輻射面積發生變形和熱平衡的急劇變化的問題。For example, the upper
根據熱處理爐100的腔室200內布置的加熱器單元300的溫度均勻性及溫度控制程度差異,基板的熱處理製造中對收率和性能產生直接或間接的影響。According to the difference in temperature uniformity and temperature control degree of the
根據本發明,以***方式夾設在上部熱傳遞板321與下部熱傳遞板322之間的套管部330能夠有效地控制上部熱傳遞板321與下部熱傳遞板322的熱變形或者因上部熱傳遞板321與下部熱傳遞板322上施加的衝擊而引起的位置變形在內的各種變形因素,並使上部熱傳遞板321與下部熱傳遞板322保持一定間距,從而滿足基板製造工藝中所需的高溫性能和溫度均勻性。According to the present invention, the
為此,在上部熱傳遞板321與下部熱傳遞板322之間通過支撐手段可布置多個套管331,支撐手段可包括:固定件340,其從上部熱傳遞板321向下部方向突出並沿著套管331的中空孔332進入,以位於下部熱傳遞板322上穿孔形成的開口孔323的中心;以及止動螺母341,其在下部熱傳遞板322的底面支撐固定件340。To this end, a plurality of
如圖10所示,套管部330可安裝於上部熱傳遞板321與下部熱傳遞板322之間,如圖11所示,套管331通過從上部熱傳遞板321向下部方向突出並沿著套管331的中空孔332進入的固定件340在下部熱傳遞板322上確定位置,並在上部熱傳遞板321與下部熱傳遞板322之間形成一定間距,該間距起到支撐上部熱傳遞板321與下部熱傳遞板322的作用,因此即使對上部熱傳遞板321與下部熱傳遞板322施加高熱仍能夠保持一定間距。As shown in FIG. 10, the
此外,如圖10所示,固定件340從上部熱傳遞板321突出並穿過套管331的中空孔332後,沿著下部熱傳遞板322的開口孔323***,而且通過在下部熱傳遞板322的底面緊固止動螺母341從而以牢固的狀態進行支撐固定。其中,如果在下部熱傳遞板322的底面與止動螺母341的接觸面之間設置墊圈342,則可有效防止固定件340的移動和變形。In addition, as shown in FIG. 10 , after the fixing
如此,根據本發明的熱處理爐100的加熱器單元300具有如下益處:可以在熱處理爐100的腔室200內部使用且在高溫下仍不破壞絕緣地保持溫度均勻性,並能夠滿足基板製造工藝中所需的高溫性能和溫度均勻性。In this way, the
此外,通過在上部熱傳遞板321與下部熱傳遞板322之間夾設***式套管部330,從而具有可控制上部熱傳遞板321與下部熱傳遞板322的熱變形或者因上部熱傳遞板321與下部熱傳遞板322上施加的衝擊而引起的位置變形在內的各種變形因素的益處。In addition, by interposing the plug-in
此外,通過使上部熱傳遞板321與下部熱傳遞板322保持一定間距,從而具有能夠滿足基板製造工藝中所需的高溫性能和溫度均勻性的益處。In addition, by maintaining a certain distance between the upper
本發明雖然是參照附圖中圖示的一實施例進行說明的,但本發明並不限於這些實施例,在不脫離本發明主旨的範圍內可進行修改和變形,這些修改和變形屬於本發明的技術思想。Although the present invention has been described with reference to an embodiment illustrated in the accompanying drawings, the present invention is not limited to these embodiments, modifications and variations can be made within the scope not departing from the gist of the present invention, and these modifications and variations belong to the present invention technical thinking.
100:熱處理爐 110:爐門 120:遮擋器 200:腔室 210:內盒體 220:外盒體 230:冷卻外套 240:供電部 300:加熱器單元 301:導電部 302:電熱絲 310:管道 311:電源套筒 312:套筒放熱塊 321:上部熱傳遞板 322:下部熱傳遞板 323:開口孔 330:套管部 331:套管 332:中空孔 340:固定件 341:止動螺母 342:墊圈 100: heat treatment furnace 110: furnace door 120: Occluder 200: chamber 210: inner box body 220: outer box body 230: cooling jacket 240: Power supply department 300: heater unit 301: Conductive part 302: heating wire 310: pipeline 311: power socket 312: Sleeve heat release block 321: Upper heat transfer plate 322: Lower heat transfer plate 323: opening hole 330: casing part 331: Casing 332: hollow hole 340:Fixer 341: Stop nut 342: Gasket
圖1是顯示熱處理爐的示例。 圖2是顯示熱處理爐正面的示例。 圖3是俯視熱處理爐的示例。 圖4是顯示熱處理爐一側面的示例。 圖5是根據本發明一實施例的布置於熱處理爐上的加熱器單元的示例。 圖6是顯示根據本發明一實施例的布置於熱處理爐上的加熱器單元平面結構的示例。 圖7是顯示根據本發明一實施例的加熱器單元的示例。 圖8是截取圖7的A部並具體顯示的示例。 圖9是說明根據本發明一實施例的加熱器單元的具體結構的示例。 圖10是說明根據本發明一實施例的加熱器單元套管結構的示例。 圖11是顯示根據本發明一實施例的加熱器單元套管的分解狀態的示例。 Fig. 1 is an example showing a heat treatment furnace. Fig. 2 is an example showing the front of the heat treatment furnace. Fig. 3 is an example of a heat treatment furnace viewed from above. Fig. 4 is an example showing one side of the heat treatment furnace. FIG. 5 is an example of a heater unit arranged on a heat treatment furnace according to an embodiment of the present invention. FIG. 6 is an example showing a planar structure of a heater unit arranged on a heat treatment furnace according to an embodiment of the present invention. FIG. 7 is a diagram showing an example of a heater unit according to an embodiment of the present invention. FIG. 8 is an example in which part A of FIG. 7 is intercepted and shown in detail. FIG. 9 is an example illustrating a specific structure of a heater unit according to an embodiment of the present invention. FIG. 10 is a diagram illustrating an example of a heater unit bushing structure according to an embodiment of the present invention. FIG. 11 is an example showing an exploded state of a heater unit sleeve according to an embodiment of the present invention.
300:加熱器單元 300: heater unit
301:導電部 301: Conductive part
302:電熱絲 302: heating wire
310:管道 310: pipeline
311:電源套筒 311: power socket
312:套筒放熱塊 312: Sleeve heat release block
321:上部熱傳遞板 321: Upper heat transfer plate
322:下部熱傳遞板 322: Lower heat transfer plate
323:開口孔 323: opening hole
330:套管部 330: casing part
331:套管 331: Casing
332:中空孔 332: hollow hole
340:固定件 340:Fixer
341:止動螺母 341: Stop nut
342:墊圈 342: Gasket
Claims (6)
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JPH0213704A (en) * | 1988-06-30 | 1990-01-18 | Toshiba Corp | Liquid fuel burner |
JP3833439B2 (en) * | 2000-05-02 | 2006-10-11 | 株式会社ノリタケカンパニーリミテド | Multistage heating furnace for large substrates, double-sided heating type far-infrared panel heater, and air supply / exhaust method in the heating furnace |
US7220365B2 (en) * | 2001-08-13 | 2007-05-22 | New Qu Energy Ltd. | Devices using a medium having a high heat transfer rate |
JP3917994B2 (en) * | 2004-08-24 | 2007-05-23 | 株式会社石井表記 | Coating film drying oven |
KR100638584B1 (en) * | 2005-08-01 | 2006-10-27 | 삼성전자주식회사 | Device of heating a wafer and method of setting the device |
KR100722154B1 (en) | 2005-08-16 | 2007-05-28 | 주식회사 제우스 | Oven chamber for LCD glass substrate which sealing is enhanced |
JP5377463B2 (en) * | 2010-11-16 | 2013-12-25 | 東京エレクトロン株式会社 | Heat treatment device |
KR101970184B1 (en) * | 2011-03-01 | 2019-04-18 | 어플라이드 머티어리얼스, 인코포레이티드 | Thin heated substrate support |
KR101380138B1 (en) | 2011-09-09 | 2014-04-01 | 주식회사 아이비원 | Chamber type drying apparatus for glass using ir steel heater |
KR101238560B1 (en) | 2012-11-29 | 2013-02-28 | 주식회사 디엠텍 | Panel display glass oven chamber |
TW201510451A (en) * | 2013-04-11 | 2015-03-16 | Ngk Insulators Ltd | Drying furnace |
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