TW202222976A - Liquid resin composition and cured product of the same - Google Patents
Liquid resin composition and cured product of the same Download PDFInfo
- Publication number
- TW202222976A TW202222976A TW110138136A TW110138136A TW202222976A TW 202222976 A TW202222976 A TW 202222976A TW 110138136 A TW110138136 A TW 110138136A TW 110138136 A TW110138136 A TW 110138136A TW 202222976 A TW202222976 A TW 202222976A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- mass
- less
- epoxy
- resin composition
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 35
- 239000011342 resin composition Substances 0.000 title claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 118
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 118
- 239000000945 filler Substances 0.000 claims abstract description 43
- 239000000919 ceramic Substances 0.000 claims abstract description 29
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 29
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000003118 aryl group Chemical group 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 125000003827 glycol group Chemical group 0.000 claims description 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 abstract description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 8
- 238000009736 wetting Methods 0.000 abstract 1
- -1 polysiloxane Polymers 0.000 description 27
- 239000000203 mixture Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 239000007822 coupling agent Substances 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229940079593 drug Drugs 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 206010059866 Drug resistance Diseases 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 229960002887 deanol Drugs 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- JQQSUOJIMKJQHS-UHFFFAOYSA-N pentaphenyl group Chemical group C1=CC=CC2=CC3=CC=C4C=C5C=CC=CC5=CC4=C3C=C12 JQQSUOJIMKJQHS-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HUCQPHINKBNKRU-UHFFFAOYSA-N (4-methylphenyl)phosphane Chemical compound CC1=CC=C(P)C=C1 HUCQPHINKBNKRU-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 229940126534 drug product Drugs 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000000825 pharmaceutical preparation Substances 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000005581 pyrene group Chemical group 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical class NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本揭示涉及一種液狀樹脂組成物及液狀樹脂組成物之硬化物，詳細來說是涉及一種含有環氧樹脂、硬化劑及陶瓷充填材之液狀樹脂組成物及該液狀樹脂組成物之硬化物。The present disclosure relates to a liquid resin composition and a hardened product of the liquid resin composition, and in particular to a liquid resin composition containing an epoxy resin, a hardener and a ceramic filler, and a liquid resin composition of the liquid resin composition. hardened material.
AiP(Antenna in Package，天線封裝)等半導體封裝中之密封所用的密封材有被要求在基板的加壓成形中之塑模後的翹曲要小。作為使低翹曲性發揮之手法，一般是使用作為低應力化劑之聚矽氧、丙烯酸橡膠等。作為這種組成物，已知有一種含有有機聚矽氧烷與環氧樹脂之環氧・聚矽氧混合樹脂組成物(參照專利文獻1(日本公開專利公報第2018-145377號))。The sealing material used for sealing in semiconductor packages such as AiP (Antenna in Package) is required to have less warpage after molding in the press molding of the substrate. As a means of exerting low warpage properties, polysiloxane, acrylic rubber, etc., which are stress reducing agents, are generally used. As such a composition, an epoxy-polysiloxane mixed resin composition containing an organopolysiloxane and an epoxy resin is known (refer to Patent Document 1 (Japanese Laid-Open Patent Publication No. 2018-145377 )).
這種密封材除了低翹曲性，還有被要求耐熱性、對鹼或極性溶劑的耐藥性、以及對硬化磨削後之表面的感光性聚醯亞胺等耐熱絕緣塗層之濡溼性等各種特性要優異。但是，前述習知之樹脂組成物無法滿足該等特性。In addition to low warpage, this sealing material is required to have heat resistance, resistance to alkalis or polar solvents, and moisture resistance to heat-resistant insulating coatings such as photosensitive polyimide on the surface after hardening and grinding. and other characteristics to be excellent. However, the above-mentioned conventional resin compositions cannot satisfy these characteristics.
本揭示之課題在於提供一種維持低翹曲性且耐熱性、耐藥性及耐熱絕緣塗層之濡溼性優異的液狀樹脂組成物及該液狀樹脂組成物之硬化物。An object of the present disclosure is to provide a liquid resin composition excellent in heat resistance, chemical resistance, and moisture resistance of a heat-resistant insulating coating while maintaining low warpage, and a cured product of the liquid resin composition.
本揭示一態樣之液狀樹脂組成物含有環氧樹脂、硬化劑及陶瓷充填材。前述環氧樹脂包含第1環氧樹脂與第2環氧樹脂。前述第1環氧樹脂具有聚伸烷基二醇骨架。前述第2環氧樹脂具有芳香環，且於1分子中具有3個以上環氧基。前述硬化劑包含於1分子中具有2個以上酚性羥基之化合物。前述環氧樹脂中之前述第1環氧樹脂的比率為10質量%以上且25質量%以下。The liquid resin composition of one aspect of the present disclosure contains an epoxy resin, a hardener, and a ceramic filler. The said epoxy resin contains a 1st epoxy resin and a 2nd epoxy resin. The said 1st epoxy resin has a polyalkylene glycol skeleton. The said 2nd epoxy resin has an aromatic ring, and has 3 or more epoxy groups in 1 molecule. The said hardening|curing agent contains the compound which has two or more phenolic hydroxyl groups in 1 molecule. The ratio of the said 1st epoxy resin in the said epoxy resin is 10 mass % or more and 25 mass % or less.
本揭示一態樣之硬化物係前述液狀樹脂組成物之硬化物。A cured product of one aspect of the present disclosure is a cured product of the aforementioned liquid resin composition.
用以實施發明之形態 ＜液狀樹脂組成物＞ 本實施形態之液狀樹脂組成物(以下亦稱組成物(X))含有環氧樹脂、硬化劑及陶瓷充填材。環氧樹脂包含第1環氧樹脂與第2環氧樹脂。第1環氧樹脂具有聚伸烷基二醇骨架。第2環氧樹脂具有芳香環，且於1分子中具有3個以上環氧基。硬化劑包含於1分子中具有2個以上酚性羥基之化合物。環氧樹脂中之第1環氧樹脂的比率為10質量%以上且25質量%以下。 Form for carrying out the invention <Liquid resin composition> The liquid resin composition of the present embodiment (hereinafter, also referred to as composition (X)) contains an epoxy resin, a curing agent, and a ceramic filler. The epoxy resin includes a first epoxy resin and a second epoxy resin. The first epoxy resin has a polyalkylene glycol skeleton. The second epoxy resin has an aromatic ring and has three or more epoxy groups in one molecule. The curing agent includes a compound having two or more phenolic hydroxyl groups in one molecule. The ratio of the 1st epoxy resin in an epoxy resin is 10 mass % or more and 25 mass % or less.
本案發明人等發現，在液狀樹脂組成物中，藉由使用第1環氧樹脂及第2環氧樹脂之2種特定環氧樹脂與前述特定硬化劑，並將環氧樹脂中之第1環氧樹脂的比率設為前述特定範圍，低翹曲性、耐熱性、耐藥性及耐熱絕緣塗層之濡溼性即可全都滿足。如此一來，根據本揭示，可提供一種維持低翹曲性且耐熱性、耐藥性及耐熱絕緣塗層之濡溼性優異的液狀樹脂組成物。The inventors of the present application found that, in the liquid resin composition, by using two specific epoxy resins of the first epoxy resin and the second epoxy resin and the above-mentioned specific curing agent, the first epoxy resin among the epoxy resins was mixed. The ratio of the epoxy resin is set to the above-mentioned specific range, and all of low warpage resistance, heat resistance, chemical resistance, and moisture resistance of the heat-resistant insulating coating can be satisfied. In this way, according to the present disclosure, it is possible to provide a liquid resin composition excellent in heat resistance, chemical resistance, and moisture resistance of the heat-resistant insulating coating while maintaining low warpage resistance.
本實施形態之液狀樹脂組成物具備前述構成即可發揮前述效果之理由雖然未必明確，但例如可推測如下。亦即，認為藉由使用具有聚伸烷基二醇骨架之第1環氧樹脂，並將其比率設為10質量%以上，可有助於降低翹曲，並且藉由將其比率設為25質量%以下，可抑制濡溼性的惡化。又，認為藉由使用具有芳香環，且於1分子中具有3個以上環氧基之第2環氧樹脂，可因為芳香環的存在及環氧樹脂之交聯結構的形成而提升耐熱性，又，藉由使用於1分子中具有2個以上酚性羥基之硬化劑，可提升耐藥性。藉由該等，本實施形態之液狀組成物可做成令低翹曲性、耐熱性、耐藥性及耐熱絕緣塗層之濡溼性全都優異之物。Although the reason why the liquid resin composition of the present embodiment can exhibit the above-mentioned effects by having the above-mentioned constitution is not necessarily clear, for example, it can be assumed as follows. That is, it is considered that by using the first epoxy resin having a polyalkylene glycol skeleton and setting the ratio to 10% by mass or more, it can contribute to the reduction of warpage, and by setting the ratio to 25 Mass % or less can suppress the deterioration of wettability. In addition, it is considered that by using the second epoxy resin having an aromatic ring and having three or more epoxy groups in one molecule, the heat resistance can be improved due to the presence of the aromatic ring and the formation of a cross-linked structure of the epoxy resin, Moreover, drug resistance can be improved by using the hardening|curing agent which has two or more phenolic hydroxyl groups in 1 molecule. With these, the liquid composition of the present embodiment can be made excellent in all of low warpage resistance, heat resistance, chemical resistance, and moisture resistance of the heat-resistant insulating coating.
以下，針對組成物(X)之各成分進行說明。Hereinafter, each component of the composition (X) will be described.
[環氧樹脂] 環氧樹脂是於1分子中具有2個以上環氧基之化合物。環氧樹脂包含第1環氧樹脂與第2環氧樹脂。環氧樹脂亦可包含與第1環氧樹脂及第2環氧樹脂不同之第3環氧樹脂。環氧樹脂在25℃下宜為液狀。 [Epoxy resin] An epoxy resin is a compound which has two or more epoxy groups in 1 molecule. The epoxy resin includes a first epoxy resin and a second epoxy resin. The epoxy resin may contain a third epoxy resin different from the first epoxy resin and the second epoxy resin. The epoxy resin is preferably liquid at 25°C.
(第1環氧樹脂) 第1環氧樹脂是具有聚伸烷基二醇骨架之環氧樹脂。第1環氧樹脂宜具有2個環氧基。第1環氧樹脂在25℃下宜為液狀。第1環氧樹脂可使用1種或2種以上。 (1st epoxy resin) The first epoxy resin is an epoxy resin having a polyalkylene glycol skeleton. The first epoxy resin preferably has two epoxy groups. The first epoxy resin is preferably liquid at 25°C. One type or two or more types of the first epoxy resins can be used.
聚伸烷基二醇骨架是指包含連結了2個以上伸烷基二醇單元之結構的骨架，且是指例如(-R-O-)n所示骨架(R為伸烷基，n為2以上之整數)。The polyalkylene glycol skeleton refers to a skeleton including a structure in which two or more alkylene glycol units are connected, and refers to, for example, a skeleton represented by (-R-O-)n (R is an alkylene group, and n is 2 or more). integer).
第1環氧樹脂可舉例如下述式(1)所示化合物等。The first epoxy resin may, for example, be a compound represented by the following formula (1).
[化學式1]
式(1)中，R A為碳數2~10之伸烷基。R 1及R 2分別獨立為單鍵或碳數1~20之2價有機基。E 1及E 2分別獨立為包含環氧基之1價基。n為2以上且1000以下之整數。 In formula (1), R A is an alkylene group having 2 to 10 carbon atoms. R 1 and R 2 are each independently a single bond or a divalent organic group having 1 to 20 carbon atoms. E 1 and E 2 are each independently a monovalent group including an epoxy group. n is an integer of 2 or more and 1000 or less.
R 1所示碳數2~10之伸烷基可舉例如乙二基、丙二基、丁二基、戊二基、己二基、辛二基、癸二基等。 Examples of the alkylene group represented by R 1 having 2 to 10 carbon atoms include ethylenediyl, propanediyl, butanediyl, pentanediyl, hexanediyl, octanediyl, and decanediyl.
「有機基」是指包含至少1個碳原子之基。R 1及R 2所示碳數1~20之2價有機基可舉例如取代或非取代之2價烴基等。取代基可舉羥基、烷氧基、鹵素原子等。 "Organic group" means a group containing at least one carbon atom. The divalent organic group having 1 to 20 carbon atoms represented by R 1 and R 2 includes, for example, a substituted or unsubstituted divalent hydrocarbon group. As a substituent, a hydroxyl group, an alkoxy group, a halogen atom, etc. are mentioned.
E 1及E 2所示包含環氧基之1價基可舉例如取代或非取代之環氧基、取代或非取代之環氧丙基等。取代基可舉例如甲基等烷基等。 Examples of the monovalent group including an epoxy group represented by E 1 and E 2 include a substituted or unsubstituted epoxy group, and a substituted or unsubstituted glycidyl group. As a substituent, an alkyl group, such as a methyl group, etc. are mentioned, for example.
n宜為2以上且500以下，5以上且300以下較佳，10以上且200以下更佳。n is preferably 2 or more and 500 or less, preferably 5 or more and 300 or less, more preferably 10 or more and 200 or less.
第1環氧樹脂可舉例如聚乙二醇二環氧丙基醚、聚丙二醇二環氧丙基醚、聚三亞甲二醇二環氧丙基醚、聚四亞甲二醇二環氧丙基醚、聚六亞甲二醇二環氧丙基醚等。Examples of the first epoxy resin include polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, polytrimethylene glycol diglycidyl ether, and polytetramethylene glycol diglycidyl ether. base ether, polyhexamethylene glycol diglycidyl ether, etc.
第1環氧樹脂之市售物可舉例如阪本藥品工業社製之SR-4PG、SR-TPG、日鐵Chemical & Material社製之PG-207、PG-207GS、三菱Chemical社製之YX7400、四日市合成社製之EPOGOSEY PT等。Commercially available first epoxy resins include SR-4PG and SR-TPG manufactured by Sakamoto Pharmaceutical Co., Ltd., PG-207 and PG-207GS manufactured by Nippon Steel Chemical & Material Corporation, YX7400 manufactured by Mitsubishi Chemical Corporation, and Yokkaichi. EPOGOSEY PT produced by Synthetic Corporation.
環氧樹脂整體中之第1環氧樹脂的比率為10質量%以上且25質量%以下這點很重要。藉由將第1環氧樹脂的比率設為該範圍，可兼顧低翹曲性與耐熱絕緣塗層之濡溼性雙方。第1環氧樹脂的比率若小於10質量%，翹曲便會增大。該比率若大於25質量%，濡溼性便會惡化。It is important that the ratio of the 1st epoxy resin in the whole epoxy resin is 10 mass % or more and 25 mass % or less. By setting the ratio of the first epoxy resin to this range, both low warpage properties and the wettability of the heat-resistant insulating coating can be achieved. When the ratio of the first epoxy resin is less than 10 mass %, the warpage increases. When this ratio exceeds 25 mass %, wettability will worsen.
第1環氧樹脂的比率宜為13質量%以上，15質量%以上較佳。第1環氧樹脂的比率宜為22質量%以下，20質量%以下較佳。The ratio of the first epoxy resin is preferably 13% by mass or more, more preferably 15% by mass or more. The ratio of the first epoxy resin is preferably 22 mass % or less, more preferably 20 mass % or less.
第1環氧樹脂對組成物(X)的比率宜為1質量%以上且10質量%以下，2質量%以上且6質量%以下較佳，3質量%以上且5質量%以下更佳。The ratio of the first epoxy resin to the composition (X) is preferably 1 mass % or more and 10 mass % or less, preferably 2 mass % or more and 6 mass % or less, and more preferably 3 mass % or more and 5 mass % or less.
(第2環氧樹脂) 第2環氧樹脂是具有芳香環，且於1分子中具有3個以上環氧基之環氧樹脂。第2環氧樹脂在25℃下宜為液狀。第2環氧樹脂之環氧基數宜為3以上且10以下，3以上且6以下較佳，3或4更佳。第2環氧樹脂可使用1種或2種以上。 (the second epoxy resin) The second epoxy resin is an epoxy resin having an aromatic ring and having three or more epoxy groups in one molecule. The second epoxy resin is preferably liquid at 25°C. The number of epoxy groups of the second epoxy resin is preferably 3 or more and 10 or less, more preferably 3 or more and 6 or less, and more preferably 3 or 4. As the second epoxy resin, one type or two or more types can be used.
作為芳香環，可舉例如苯環、萘環、蒽環、菲環、芘環、稠四苯環、稠五苯環、茚環、茀環、苝環等。As an aromatic ring, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a pyrene ring, a fused tetraphenyl ring, a fused pentaphenyl ring, an indene ring, a perylene ring, a perylene ring, etc. are mentioned, for example.
第2環氧樹脂可舉例如下述式(2)所示化合物等。The second epoxy resin may, for example, be a compound represented by the following formula (2).
[化學式2]
式(2)中，Ar 1為取代或非取代之碳數6~38之2價芳香族烴基。R 3及R 4分別獨立為單鍵、氧原子、-NH-、氮原子或碳數1~20之2~5價有機基。E 3及E 4分別獨立為包含環氧基之1價基。R 3為單鍵、氧原子或-NH-時，x為1；R 3為氮原子時，x為2；R 3為2~5價有機基時，x為1~4之整數。R 4為單鍵、氧原子或-NH-時，y為1；R 4為氮原子時，y為2；R 4為2~5價有機基時，y為1~4之整數。x為2以上時，多個E3彼此可相同亦可相異，y為2以上時，多個E4彼此可相同亦可相異。惟，x+y為3以上。 In formula (2), Ar 1 is a substituted or unsubstituted divalent aromatic hydrocarbon group having 6 to 38 carbon atoms. R 3 and R 4 are each independently a single bond, an oxygen atom, -NH-, a nitrogen atom, or a 2- to 5-valent organic group having 1 to 20 carbon atoms. E 3 and E 4 are each independently a monovalent group including an epoxy group. When R 3 is a single bond, oxygen atom or -NH-, x is 1; when R 3 is a nitrogen atom, x is 2; when R 3 is a 2-5 valent organic group, x is an integer of 1-4. When R 4 is a single bond, oxygen atom or -NH-, y is 1; when R 4 is a nitrogen atom, y is 2; when R 4 is a 2-5 valent organic group, y is an integer of 1-4. When x is 2 or more, the plurality of E3s may be the same or different from each other, and when y is 2 or more, the plurality of E4s may be the same or different from each other. However, x+y is 3 or more.
Ar 1所示2價芳香族烴基可舉例如苯二基、甲苯二基、二甲苯二基、萘二基、蒽二基、菲二基、芘二基、稠四苯二基、稠五苯二基、茚二基、茀二基、苝二基、聯苯二基、聯三苯二基等。芳香族烴基之取代基可舉例如羥基、鹵素原子、包含環氧基之1價基等。 Examples of the divalent aromatic hydrocarbon group represented by Ar 1 include benzenediyl, toluenediyl, xylylenediyl, naphthalenediyl, anthracenediyl, phenanthrenediyl, pyrenediyl, condensed tetraphenyldiyl, condensed pentaphenyl Diyl, indene diyl, indene diyl, perylene diyl, biphenyl diyl, bitriphenyl diyl, etc. As a substituent of an aromatic hydrocarbon group, a hydroxyl group, a halogen atom, a monovalent group containing an epoxy group, etc. are mentioned, for example.
第2環氧樹脂可舉例如N,N,N',N'-四環氧丙基-4,4'亞甲基雙苯胺、對胺苯酚-二環氧丙基醚等。The second epoxy resin includes, for example, N,N,N',N'-tetraglycidyl-4,4'methylenedianiline, p-aminophenol-diglycidyl ether, and the like.
第2環氧樹脂之市售物可舉例如HUNTSMAN社製之AralditeMY510、MY600、MY720、MY721、MY725、三菱Chemical社製之630、ADEKA社製之EP3900等。Commercially available second epoxy resins include Araldite MY510, MY600, MY720, MY721, MY725 manufactured by HUNTSMAN, 630 manufactured by Mitsubishi Chemical Corporation, and EP3900 manufactured by ADEKA Corporation.
環氧樹脂整體中之第2環氧樹脂的比率宜為5質量%以上且80質量%以下。此時，可進一步提升組成物(X)的耐熱性。該比率較宜為10質量%以上且70質量%以下，20質量%以上且60質量%以下更佳。It is preferable that the ratio of the 2nd epoxy resin in the whole epoxy resin is 5 mass % or more and 80 mass % or less. In this case, the heat resistance of the composition (X) can be further improved. The ratio is preferably 10% by mass or more and 70% by mass or less, and more preferably 20% by mass or more and 60% by mass or less.
第2環氧樹脂對組成物(X)的比率宜為2質量%以上且30質量%以下，3質量%以上且20質量%以下較佳，5質量%以上且10質量%以下更佳。The ratio of the second epoxy resin to the composition (X) is preferably 2 mass % or more and 30 mass % or less, preferably 3 mass % or more and 20 mass % or less, and more preferably 5 mass % or more and 10 mass % or less.
(第3環氧樹脂) 第1環氧樹脂及第2環氧樹脂以外之第3環氧樹脂在25℃下宜為液狀。第3環氧樹脂可舉例如雙酚F型環氧樹脂、雙酚A型環氧樹脂、加氫雙酚型環氧樹脂、聯苯型環氧樹脂、含萘環環氧樹脂、脂環式環氧樹脂、雙環戊二烯型環氧樹脂、苯酚酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、三苯基甲烷型環氧樹脂、脂肪族系環氧樹脂、含環氧丙基之聚矽氧樹脂、環氧丙基胺型環氧樹脂等，且具有2個環氧基者等。從進一步提升耐熱性的觀點來看，第3環氧樹脂宜包含雙酚F型環氧樹脂(具有2個環氧基者)。 (the third epoxy resin) The third epoxy resin other than the first epoxy resin and the second epoxy resin is preferably liquid at 25°C. Examples of the third epoxy resin include bisphenol F type epoxy resin, bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, biphenyl type epoxy resin, naphthalene ring-containing epoxy resin, and alicyclic epoxy resin. Epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, aliphatic epoxy resin, glycidyl-containing epoxy resin Polysiloxane, glycidylamine type epoxy resin, etc., and those with two epoxy groups, etc. From the viewpoint of further improving heat resistance, the third epoxy resin preferably contains a bisphenol F-type epoxy resin (those having two epoxy groups).
環氧樹脂整體中之第3環氧樹脂的比率宜為10質量%以上且80質量%以下。此時，可進一步提升組成物(X)的耐熱性。該比率較宜為15質量%以上且70質量%以下，20質量%以上且60質量%以下更佳。It is preferable that the ratio of the 3rd epoxy resin in the whole epoxy resin is 10 mass % or more and 80 mass % or less. In this case, the heat resistance of the composition (X) can be further improved. The ratio is preferably 15% by mass or more and 70% by mass or less, and more preferably 20% by mass or more and 60% by mass or less.
第3環氧樹脂對組成物(X)的比率宜為1質量%以上且20質量%以下，2質量%以上且15質量%以下較佳，3質量%以上且10質量%以下更佳。The ratio of the third epoxy resin to the composition (X) is preferably 1 mass % or more and 20 mass % or less, preferably 2 mass % or more and 15 mass % or less, and more preferably 3 mass % or more and 10 mass % or less.
[硬化劑] 硬化劑包含於1分子中具有2個以上酚性羥基之化合物(以下亦稱硬化劑A)。硬化劑A在25℃下宜為液狀。硬化劑亦可包含硬化劑A以外之其他硬化劑。硬化劑可使用1種或2種以上。 [hardener] The curing agent includes a compound having two or more phenolic hydroxyl groups in one molecule (hereinafter, also referred to as curing agent A). Hardener A is preferably liquid at 25°C. The hardener may also contain other hardeners than the hardener A. One type or two or more types of hardeners can be used.
硬化劑A可舉例如苯酚酚醛樹脂、甲酚酚醛樹脂、萘酚酚醛樹脂等酚醛型樹脂；具有伸苯基骨架或聯伸苯基骨架之苯酚芳烷基樹脂、具有伸苯基骨架或聯伸苯基骨架之萘酚芳烷基樹脂等芳烷基型樹脂；三酚甲烷型樹脂等多官能型酚樹脂；雙環戊二烯型苯酚酚醛樹脂、雙環戊二烯型萘酚酚醛樹脂等雙環戊二烯型酚樹脂；萜改質酚樹脂；雙酚A、雙酚F等雙酚型樹脂；三嗪改質酚醛樹脂等。Examples of the hardener A include phenolic resins such as phenol novolac resins, cresol novolac resins, and naphthol novolac resins; Aralkyl type resins such as naphthol aralkyl resins with phenyl skeleton; polyfunctional phenol resins such as trisphenol methane type resins; dicyclopentadiene type phenol novolac resins, dicyclopentadiene type naphthol novolac resins, etc. Diene-type phenol resin; terpene-modified phenol resin; bisphenol-type resin such as bisphenol A and bisphenol F; triazine-modified phenolic resin, etc.
硬化劑整體中之硬化劑A的比率宜為50質量%以上。此時，可進一步提升組成物(X)的耐藥性。該比率較宜為80質量%以上，95質量%以上更佳。硬化劑A的比率亦可為100質量%。The ratio of the curing agent A in the entire curing agent is preferably 50 mass % or more. In this case, the drug resistance of the composition (X) can be further improved. The ratio is preferably 80% by mass or more, more preferably 95% by mass or more. The ratio of the hardener A may be 100 mass %.
相對於環氧樹脂100質量份，硬化劑A的比率宜為30質量份以上且100質量份以下。此時，可進一步提升組成物(X)的耐藥性。該比率較宜為40質量份以上且80質量份以下，50質量份以上且70質量份以下更佳。The ratio of the hardener A is preferably 30 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the epoxy resin. In this case, the drug resistance of the composition (X) can be further improved. The ratio is preferably 40 parts by mass or more and 80 parts by mass or less, and more preferably 50 parts by mass or more and 70 parts by mass or less.
硬化劑A對組成物(X)的比率宜為2質量%以上且30質量%以下，4質量%以上且20質量%以下較佳，8質量%以上且15質量%以下更佳。The ratio of the hardener A to the composition (X) is preferably 2 mass % or more and 30 mass % or less, preferably 4 mass % or more and 20 mass % or less, and more preferably 8 mass % or more and 15 mass % or less.
其他硬化劑可舉例如酸酐系硬化劑、芳香族胺系硬化劑、咪唑系硬化劑、醯肼系硬化劑、聚硫醇系硬化劑、路易斯酸-胺錯合物系硬化劑等。As other hardeners, acid anhydride type hardeners, aromatic amine type hardeners, imidazole type hardeners, hydrazide type hardeners, polythiol type hardeners, Lewis acid-amine complex type hardeners, etc. are mentioned, for example.
相對於環氧樹脂1當量，硬化劑的當量例如為0.6以上且1.4以下。The equivalent of the hardener is, for example, 0.6 or more and 1.4 or less with respect to 1 equivalent of the epoxy resin.
相對於環氧樹脂100質量份，硬化劑的比率宜為30質量份以上且100質量份以下，40質量份以上且80質量份以下較佳，50質量份以上且70質量份以下更佳。The ratio of the hardener is preferably 30 parts by mass or more and 100 parts by mass or less, preferably 40 parts by mass or more and 80 parts by mass or less, and more preferably 50 parts by mass or more and 70 parts by mass or less, relative to 100 parts by mass of the epoxy resin.
硬化劑對組成物(X)的比率宜為2質量%以上且30質量%以下，4質量%以上且20質量%以下較佳，8質量%以上且15質量%以下更佳。The ratio of the hardener to the composition (X) is preferably 2 mass % or more and 30 mass % or less, preferably 4 mass % or more and 20 mass % or less, and more preferably 8 mass % or more and 15 mass % or less.
[硬化促進劑] 組成物(X)可含有硬化促進劑。 [hardening accelerator] Composition (X) may contain a hardening accelerator.
硬化促進劑可舉例如2-甲基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑等咪唑類；1,8-二氮雜雙環[5.4.0]-十一烯-7、1,5-二氮雜雙環[4.3.0]壬烯-5、5,6-二丁基胺基-1,8-二氮雜雙環[5.4.0]十一烯-7等環脒類；2-(二甲基胺基甲基)酚、三伸乙二胺、苄基二甲基胺、三乙醇胺、二甲基胺基乙醇、參(二甲基胺基甲基)酚等三級胺類；三丁基膦、甲基二苯基膦、三苯基膦、參(4-甲基苯基)膦、二苯基膦、三苯基膦與對苯醌之加成反應物、苯基膦等有機膦類；四苯硼酸四苯鏻、乙基三苯硼酸四苯鏻、四丁硼酸四丁鏻等四取代硼酸四取代鏻；具有硼酸鹽以外之對陰離子的四級鏻鹽；四苯硼酸2-乙基-4-甲基咪唑、四苯硼酸N-甲基嗎福林等四苯基硼鹽等。Examples of hardening accelerators include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, and 2-ethyl-4-methylimidazole; 1,8-diazabicyclo[5.4.0 ]-undecene-7, 1,5-diazabicyclo[4.3.0]nonene-5, 5,6-dibutylamino-1,8-diazabicyclo[5.4.0]deca Cyclic amidines such as monoene-7; 2-(dimethylaminomethyl)phenol, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, gins (dimethylaminoethanol) Aminomethyl) phenol and other tertiary amines; tributyl phosphine, methyl diphenyl phosphine, triphenyl phosphine, ginseng (4-methylphenyl) phosphine, diphenyl phosphine, triphenyl phosphine and Addition reactants of p-benzoquinone, organic phosphines such as phenylphosphine; tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate, tetrabutylphosphonium tetrabutylborate, etc.; Quaternary phosphonium salts other than the anion; tetraphenylboronate such as 2-ethyl-4-methylimidazole tetraphenylboronic acid, N-methyl mofolin tetraphenylboronic acid, etc.
相對於環氧樹脂100質量份，硬化促進劑的比率宜為0.1質量份以上且10質量份以下，1質量份以上且5質量份以下較佳。The ratio of the hardening accelerator is preferably 0.1 part by mass or more and 10 parts by mass or less, preferably 1 part by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the epoxy resin.
硬化促進劑對組成物(X)的比率例如為0.05質量%以上且1質量%以下。The ratio of the hardening accelerator to the composition (X) is, for example, 0.05 mass % or more and 1 mass % or less.
[陶瓷充填材] 陶瓷充填材可舉例如二氧化矽、氧化鋁、氮化鋁、氮化矽等。二氧化矽可舉例如結晶二氧化矽、非結晶二氧化矽、非晶二氧化矽、熔融二氧化矽、破碎狀二氧化矽等。陶瓷充填材可將該等之2種以上混合來使用。 [Ceramic filler] Examples of the ceramic filler include silica, alumina, aluminum nitride, silicon nitride, and the like. Examples of the silica include crystalline silica, amorphous silica, amorphous silica, fused silica, broken silica, and the like. The ceramic filler can be used by mixing two or more of these.
陶瓷充填材的粒子形狀可舉例如球狀、鏈狀、繭狀、異形狀、不定形狀等。The particle shape of the ceramic filler includes, for example, a spherical shape, a chain shape, a cocoon shape, an irregular shape, an indeterminate shape, and the like.
陶瓷充填材的平均粒徑宜為0.5µm以上且10µm以下，0.5µm以上且5µm以下較佳。陶瓷充填材可使用1種充填材，亦可使用平均粒徑彼此不同之2種以上充填材。陶瓷充填材宜包含平均粒徑不同之2種充填材。The average particle size of the ceramic filler is preferably 0.5µm or more and 10µm or less, preferably 0.5µm or more and 5µm or less. As the ceramic filler, one type of filler may be used, or two or more types of fillers having different average particle diameters from each other may be used. The ceramic filler should preferably contain two types of fillers with different average particle sizes.
陶瓷充填材的平均粒徑是從藉由雷射繞射散射法所進行之測定結果求得之粒度分布求出的中值粒徑(D50)。The average particle diameter of the ceramic filler is the median diameter (D50) obtained from the particle size distribution obtained from the measurement result by the laser diffraction scattering method.
陶瓷充填材包含2種充填材時，陶瓷充填材宜包含平均粒徑為1µm以上且50µm以下的充填材(以下亦稱充填材1)及平均粒徑為0.1µm以上且小於1µm的充填材(以下亦稱充填材2)。此時，可進一步提高陶瓷充填材的含量。When the ceramic filler contains two types of fillers, the ceramic filler should preferably include fillers with an average particle size of 1 µm or more and 50 µm or less (hereinafter also referred to as filler 1) and fillers with an average particle size of 0.1 µm or more and less than 1 µm ( Hereinafter, it is also referred to as filler 2). In this case, the content of the ceramic filler can be further increased.
充填材1的平均粒徑宜為0.5µm以上且10µm以下，0.5µm以上且5µm以下較佳。The average particle size of the filler 1 is preferably 0.5 µm or more and 10 µm or less, preferably 0.5 µm or more and 5 µm or less.
陶瓷充填材整體中之充填材1的比率宜為50質量%以上且99質量%以下，60質量%以上且90質量%以下較佳，70質量%以上且85質量%以下更佳。The ratio of the filler 1 in the entire ceramic filler is preferably 50 mass % or more and 99 mass % or less, preferably 60 mass % or more and 90 mass % or less, and more preferably 70 mass % or more and 85 mass % or less.
充填材2的平均粒徑宜為0.2µm以上且0.9µm以下，0.5µm以上且0.7µm以下較佳。The average particle size of the filler 2 is preferably 0.2 µm or more and 0.9 µm or less, preferably 0.5 µm or more and 0.7 µm or less.
陶瓷充填材整體中之充填材2的比率宜為1質量%以上且50質量%以下，10質量%以上且40質量%以下較佳，15質量%以上且30質量%以下更佳。The ratio of the filler 2 in the entire ceramic filler is preferably 1 mass % or more and 50 mass % or less, preferably 10 mass % or more and 40 mass % or less, and more preferably 15 mass % or more and 30 mass % or less.
充填材2對充填材1的質量比(充填材2/充填材1)宜為0.1以上且1以下，且宜為0.2以上0.5以下。The mass ratio of the filler 2 to the filler 1 (filler 2/filler 1) is preferably 0.1 or more and 1 or less, and preferably 0.2 or more and 0.5 or less.
組成物(X)中之陶瓷充填材的比率宜為50質量%以上，60質量%以上較佳，70質量%以上更佳。該比率宜為90質量%以下，80質量%以下較佳，75質量%以下更佳。The ratio of the ceramic filler in the composition (X) is preferably 50 mass % or more, more preferably 60 mass % or more, and more preferably 70 mass % or more. The ratio is preferably 90 mass % or less, more preferably 80 mass % or less, and more preferably 75 mass % or less.
陶瓷充填材宜業經例如耦合劑等進行表面處理。陶瓷充填材可藉由經表面處理而提升與環氧樹脂之親和性。耦合劑可舉例如矽烷耦合劑、鈦酸酯耦合劑、鋁耦合劑、鋁/鋯耦合劑等。矽烷耦合劑可舉例如γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等環氧丙氧基矽烷；N-β(胺乙基)- γ-胺丙基三甲氧基矽烷、γ-胺丙基三乙氧基矽烷、N-苯基-γ-胺丙基三甲氧基矽烷等胺基矽烷；烷基矽烷；脲基矽烷；乙烯基矽烷等。相對於陶瓷充填材及耦合劑的合計量，耦合劑的比率例如為0.01質量%以上且1質量%以下。The ceramic filler should be surface-treated with, for example, a coupling agent. The ceramic filler can improve the affinity with epoxy resin by surface treatment. As a coupling agent, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, an aluminum/zirconium coupling agent, etc. are mentioned, for example. Examples of silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyl Glycidoxysilanes such as trimethoxysilane; N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ- Amine silanes such as aminopropyl trimethoxysilane; alkyl silanes; ureido silanes; vinyl silanes, etc. The ratio of the coupling agent is, for example, 0.01 mass % or more and 1 mass % or less with respect to the total amount of the ceramic filler and the coupling agent.
[添加劑] 組成物(X)亦可在不損及本實施形態效果之範圍內含有前述成分以外之添加劑。添加劑可舉例如阻燃劑、阻燃助劑、離子捕捉劑(ion trap agent)、著色劑、低應力化劑、賦黏劑、聚矽氧可撓劑等。 [additive] The composition (X) may contain additives other than the aforementioned components within a range that does not impair the effects of the present embodiment. Examples of additives include flame retardants, flame retardant aids, ion trap agents, colorants, stress reducing agents, tackifiers, polysiloxane flexible agents, and the like.
阻燃劑可舉例如氫氧化鎂、氫氧化鋁、紅磷等。As a flame retardant, magnesium hydroxide, aluminum hydroxide, red phosphorus, etc. are mentioned, for example.
著色劑可舉例如碳黑、赤鐵氧化物、氧化鈦、酞青素、苝黑等。As a coloring agent, carbon black, hematite oxide, titanium oxide, phthalocyanin, perylene black, etc. are mentioned, for example.
低應力化劑可舉例如聚矽氧彈性體、聚矽氧樹脂、聚矽氧油、丁二烯系橡膠等。丁二烯系橡膠可舉例如丙烯酸甲酯-丁二烯-苯乙烯共聚物、甲基丙烯酸甲酯-丁二烯-苯乙烯共聚物等。Examples of the stress reducing agent include polysiloxane elastomer, polysiloxane resin, polysiloxane oil, butadiene-based rubber, and the like. The butadiene-based rubber includes, for example, a methyl acrylate-butadiene-styrene copolymer, a methyl methacrylate-butadiene-styrene copolymer, and the like.
組成物(X)由於低翹曲性、耐熱性、耐藥性及耐熱絕緣塗層之濡溼性優異，因此可適合用於例如AiP等半導體封裝中之密封用。Since the composition (X) is excellent in low warpage, heat resistance, chemical resistance, and moisture resistance of the heat-resistant insulating coating, it can be suitably used for sealing in semiconductor packages such as AiP.
＜硬化物＞ 本實施形態之硬化物是組成物(X)之硬化物。本實施形態之硬化物可藉由將組成物(X)在例如氧化鋁陶瓷等陶瓷基板上利用真空壓製成形機等進行加熱成形而製得。加熱成形的溫度例如為100℃以上且180℃以下，宜為120℃以上且150℃以下。加熱成形的時間例如為10秒以上且1小時以下，宜為1分鐘以上且20分鐘以下。 <hardened product> The cured product of the present embodiment is the cured product of the composition (X). The cured product of the present embodiment can be obtained by heat-molding the composition (X) on a ceramic substrate such as alumina ceramics using a vacuum press molding machine or the like. The temperature of thermoforming is, for example, 100°C or higher and 180°C or lower, and preferably 120°C or higher and 150°C or lower. The time for thermoforming is, for example, 10 seconds or more and 1 hour or less, and preferably 1 minute or more and 20 minutes or less.
[實施例] 以下，藉由實施例進一步詳細說明本揭示，但本揭示不受該等實施例任何限定。 [Example] Hereinafter, the present disclosure will be further described in detail through examples, but the present disclosure is not limited in any way by these examples.
＜液狀樹脂組成物的調製＞ 將表1所示原料摻混，以混合機均勻地混合分散而獲得液狀樹脂組成物。另外，原料的詳細內容如下述。 -環氧樹脂 ・第1環氧樹脂：日鐵Chemical & Material社製之「PG207」。聚丙二醇二環氧丙基醚。 ・第2環氧樹脂：HUNTSMAN社製之「Araldite MY720」。N,N,N',N'-四環氧丙基-4,4'-亞甲基雙苯胺。 ・第3環氧樹脂：雙酚F型環氧樹脂。三菱Chemical社製之「806」。 -硬化劑 ・苯酚系硬化劑：明和化成社製之「MEH8000H」。 ・酸酐系硬化劑：新日本理化社製之「RIKACID MH-700」。 ・芳香族胺系硬化劑：日本化藥社製之「KAYAHARD A-A」。4,4'-二胺-3,3'-二乙基二苯基甲烷。 -硬化促進劑 ・咪唑系硬化促進劑：四國化成社製之「2E4MZ」 陶瓷充填材 ・充填材1：Denka社製之「FB-3SDX」。熔融二氧化矽。球狀。平均粒徑3.3µm。 ・充填材2：Admatechs社製之「SO25H」。球狀二氧化矽。平均粒徑0.6µm。-耦合劑： ・矽烷耦合劑：Momentive社製之「A187」。環氧矽烷(γ-環氧丙氧基丙基三甲氧基矽烷)。 -著色劑 ・碳黑：三菱Chemical社製之「MA-100」。 <Preparation of liquid resin composition> The raw materials shown in Table 1 were blended and uniformly mixed and dispersed with a mixer to obtain a liquid resin composition. In addition, the details of the raw materials are as follows. -Epoxy resin ・The first epoxy resin: "PG207" manufactured by Nippon Steel Chemical & Material. Polypropylene glycol diglycidyl ether. ・Second epoxy resin: "Araldite MY720" manufactured by HUNTSMAN. N,N,N',N'-tetraglycidyl-4,4'-methylenedianiline. ・The third epoxy resin: Bisphenol F type epoxy resin. "806" manufactured by Mitsubishi Chemical Corporation. -hardener ・Phenol-based hardener: "MEH8000H" manufactured by Meiwa Chemical Co., Ltd. ・Acid anhydride type hardener: "RIKACID MH-700" manufactured by Nippon Rika Corporation. ・Aromatic amine hardener: "KAYAHARD A-A" manufactured by Nippon Kayaku Co., Ltd. 4,4'-Diamine-3,3'-diethyldiphenylmethane. -hardening accelerator ・Imidazole-based hardening accelerator: "2E4MZ" manufactured by Shikoku Chemical Co., Ltd. Ceramic filler ・Filling material 1: "FB-3SDX" manufactured by Denka Corporation. Fused silica. spherical. The average particle size is 3.3µm. ・Filling material 2: "SO25H" manufactured by Admatechs. Spherical silica. The average particle size is 0.6µm. -Coupling agent: ・Silane coupling agent: "A187" manufactured by Momentive Corporation. Epoxysilane (γ-glycidoxypropyltrimethoxysilane). -Colorant ・Carbon black: "MA-100" manufactured by Mitsubishi Chemical Corporation.
＜特性評估＞ [低翹曲性] 使用尺寸70mm×60mm、厚度0.2mm的氧化鋁陶瓷，以塑模厚度0.5m，利用真空壓製成形機在135℃、5分鐘的條件下進行成形，並測定成形後的翹曲量。 A：翹曲量小於0.5mm。 B：翹曲量為0.5mm以上且小於1mm。 C：翹曲量為1mm以上。 <Characteristic evaluation> [Low warpage] Using alumina ceramics with a size of 70 mm×60 mm and a thickness of 0.2 mm, with a mold thickness of 0.5 m, molding was performed by a vacuum press molding machine at 135° C. for 5 minutes, and the warpage amount after molding was measured. A: The warpage amount is less than 0.5 mm. B: The warpage amount is 0.5 mm or more and less than 1 mm. C: The warpage amount is 1 mm or more.
[耐熱性] 藉由動態黏彈性測定裝置(DMA)測定玻璃轉移溫度(Tg)。 A：Tg為150℃以上。 B：Tg為125℃以上且低於150℃。 C：Tg低於125℃。 [heat resistance] The glass transition temperature (Tg) was measured by a dynamic viscoelasticity measuring device (DMA). A: Tg is 150°C or higher. B: Tg is 125°C or higher and lower than 150°C. C: Tg is lower than 125°C.
[耐熱絕緣塗層之濡溼性] 藉由富士FILM Electronic Materials社製之「Polyimide LTC9320」的旋塗膜對液狀樹脂組成物之硬化物的磨削表面的形成性進行評估。磨削是使用DISCO社製之研磨機，磨削輪是使用SD3000，以磨削目標深度5µm進行表面磨削。塗膜是使用MIKASA社製之旋塗機，以工作台旋轉數2000rpm、塗佈目標厚度3µm進行塗佈。從試驗片外周起算5mm內側排除在評估對象外。 A：未確認到1.0mm 2以上的塗膜缺損及波浪紋。 B：未確認到1.0mm 2以上的塗膜缺損，但確認到波浪紋。 C：確認到1.0mm 2以上的塗膜缺損。 [Wet properties of heat-resistant insulating coating] The formability of the ground surface of the cured product of the liquid resin composition was evaluated by a spin-coating film of "Polyimide LTC9320" manufactured by Fuji FILM Electronic Materials. Grinding was performed using a grinder manufactured by DISCO, and the grinding wheel was SD3000, and the surface was ground at a target grinding depth of 5µm. The coating film was applied using a spin coater manufactured by MIKASA, with a table rotation speed of 2000 rpm and a coating target thickness of 3 µm. The inside of 5 mm from the outer periphery of the test piece was excluded from the evaluation object. A: No coating film defect or wavy pattern of 1.0 mm 2 or more was confirmed. B: No coating film defect of 1.0 mm 2 or more was confirmed, but wavy lines were confirmed. C: Defects in the coating film of 1.0 mm 2 or more were confirmed.
[耐藥性] 測定液狀樹脂組成物之硬化物(尺寸50mm×50mm、厚0.3mm)在藥品液中之40℃、12小時處理後的質量變化。使用10質量%KOH水溶液及N-甲基吡咯啶酮(NMP)來作為藥品。 A：在兩藥品中，質量變化小於±0.5質量%。 B：在兩藥品中，質量變化小於±1質量%(惟，在兩藥品中，質量變化小於±0.5質量%的情況除外)。 C：在任一藥品中，質量變化為±1質量%以上。 [resistance] The mass change of the cured product of the liquid resin composition (size 50 mm×50 mm, thickness 0.3 mm) in the chemical solution at 40° C. for 12 hours was measured. 10 mass % KOH aqueous solution and N-methylpyrrolidone (NMP) were used as medicines. A: In both medicines, the mass change was less than ±0.5% by mass. B: In both medicines, the mass change is less than ±1% by mass (except for the case where the mass change is less than ±0.5% by mass in both medicines). C: In any drug product, the mass change is ±1 mass % or more.
[表1]
(無)(none)
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