JPWO2022085522A1 - - Google Patents
Info
- Publication number
- JPWO2022085522A1 JPWO2022085522A1 JP2022557018A JP2022557018A JPWO2022085522A1 JP WO2022085522 A1 JPWO2022085522 A1 JP WO2022085522A1 JP 2022557018 A JP2022557018 A JP 2022557018A JP 2022557018 A JP2022557018 A JP 2022557018A JP WO2022085522 A1 JPWO2022085522 A1 JP WO2022085522A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020176908 | 2020-10-21 | ||
PCT/JP2021/037787 WO2022085522A1 (en) | 2020-10-21 | 2021-10-12 | Liquid resin composition and cured object obtained therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022085522A1 true JPWO2022085522A1 (en) | 2022-04-28 |
Family
ID=81290397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022557018A Pending JPWO2022085522A1 (en) | 2020-10-21 | 2021-10-12 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022085522A1 (en) |
CN (1) | CN116390967A (en) |
TW (1) | TW202222976A (en) |
WO (1) | WO2022085522A1 (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2906083B2 (en) * | 1990-11-07 | 1999-06-14 | 宇宙開発事業団 | Lightweight heat-insulating resin composition |
JPH09268221A (en) * | 1996-04-01 | 1997-10-14 | Nippon Oil Co Ltd | Resin composition for prepreg |
JP2007138002A (en) * | 2005-11-17 | 2007-06-07 | Yokohama Rubber Co Ltd:The | Thermosetting resin composition |
JP2007284474A (en) * | 2006-04-12 | 2007-11-01 | Yokohama Rubber Co Ltd:The | Epoxy resin composition |
JP2007284467A (en) * | 2006-04-12 | 2007-11-01 | Yokohama Rubber Co Ltd:The | Epoxy resin composition |
JP5228853B2 (en) * | 2008-12-01 | 2013-07-03 | 東レ株式会社 | Epoxy resin composition, fiber reinforced composite material, and production method thereof |
JP5163912B2 (en) * | 2010-02-16 | 2013-03-13 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device |
KR101842822B1 (en) * | 2014-03-25 | 2018-03-27 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Liquid resin composition, cured product, wiring structure, and package using wiring structure |
WO2017191801A1 (en) * | 2016-05-06 | 2017-11-09 | Dic株式会社 | Resin composition, molded article, layered body, and adhesive |
JP7148507B2 (en) * | 2017-05-31 | 2022-10-05 | 昭和電工マテリアルズ株式会社 | Liquid resin composition for sealing and electronic component device |
JP7148508B2 (en) * | 2017-05-31 | 2022-10-05 | 昭和電工マテリアルズ株式会社 | COMPRESSION MOLDING LIQUID RESIN COMPOSITION AND ELECTRONIC PARTS DEVICE |
US10775556B2 (en) * | 2018-09-19 | 2020-09-15 | PEYSMIAN S.p.A. | Optical fibre having a crosslinked secondary coating |
-
2021
- 2021-10-12 JP JP2022557018A patent/JPWO2022085522A1/ja active Pending
- 2021-10-12 CN CN202180070761.2A patent/CN116390967A/en active Pending
- 2021-10-12 WO PCT/JP2021/037787 patent/WO2022085522A1/en active Application Filing
- 2021-10-14 TW TW110138136A patent/TW202222976A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202222976A (en) | 2022-06-16 |
CN116390967A (en) | 2023-07-04 |
WO2022085522A1 (en) | 2022-04-28 |