TW202124149A - 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 - Google Patents
可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 Download PDFInfo
- Publication number
- TW202124149A TW202124149A TW109137216A TW109137216A TW202124149A TW 202124149 A TW202124149 A TW 202124149A TW 109137216 A TW109137216 A TW 109137216A TW 109137216 A TW109137216 A TW 109137216A TW 202124149 A TW202124149 A TW 202124149A
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- flexible printed
- thermosetting resin
- printed wiring
- laminated film
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196803A JP2021072324A (ja) | 2019-10-29 | 2019-10-29 | フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 |
JP2019-196803 | 2019-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202124149A true TW202124149A (zh) | 2021-07-01 |
Family
ID=75714059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109137216A TW202124149A (zh) | 2019-10-29 | 2020-10-27 | 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2021072324A (ja) |
KR (1) | KR20210052274A (ja) |
TW (1) | TW202124149A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102555582B1 (ko) | 2021-07-08 | 2023-07-17 | 주식회사 엠아이이큅먼트코리아 | 플립칩 본딩을 위한 정밀 가압장치 |
KR102582980B1 (ko) | 2021-08-12 | 2023-09-26 | 주식회사 엠아이이큅먼트코리아 | 정밀 가압장치를 구비한 플립칩 레이저 본딩기 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3111441B2 (ja) * | 1993-11-30 | 2000-11-20 | 宇部興産株式会社 | プリント配線板用基板 |
WO2010024370A1 (ja) * | 2008-08-29 | 2010-03-04 | 味の素株式会社 | 金属膜付きフィルム |
JP2015149552A (ja) | 2014-02-05 | 2015-08-20 | 株式会社ニコン | ウェアラブル型電子機器 |
JP6325326B2 (ja) * | 2014-04-18 | 2018-05-16 | 積水フーラー株式会社 | 硬化性組成物 |
JP2017204538A (ja) | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
JP7225546B2 (ja) * | 2018-03-01 | 2023-02-21 | 味の素株式会社 | 封止用樹脂組成物 |
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2019
- 2019-10-29 JP JP2019196803A patent/JP2021072324A/ja active Pending
-
2020
- 2020-10-23 KR KR1020200138162A patent/KR20210052274A/ko unknown
- 2020-10-27 TW TW109137216A patent/TW202124149A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2021072324A (ja) | 2021-05-06 |
KR20210052274A (ko) | 2021-05-10 |
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