TW202120257A - Cutting device which does not damage a wafer and a cutting blade and does not suck cutting water and cutting debris from the position between a fixing base and a cutting blade - Google Patents

Cutting device which does not damage a wafer and a cutting blade and does not suck cutting water and cutting debris from the position between a fixing base and a cutting blade Download PDF

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TW202120257A
TW202120257A TW109141260A TW109141260A TW202120257A TW 202120257 A TW202120257 A TW 202120257A TW 109141260 A TW109141260 A TW 109141260A TW 109141260 A TW109141260 A TW 109141260A TW 202120257 A TW202120257 A TW 202120257A
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cutting
rotating shaft
blade
rotation
water
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TW109141260A
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新田秀次
湯澤治信
松下嘉男
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)

Abstract

The subject of this invention is to provide a cutting device which does not damage a wafer and a cutting blade and does not suck cutting water and cutting debris from the position between a fixing base and a cutting blade. When the value measured by the pressure gauge (56) does not reach the allowable value, the cutting device (2) is disposed with a control means (70) to prevent the start of rotation of the rotating shaft (26) and the start of supply of the cutting water; and while the value measured by the pressure gauge (56) reaches the allowable value, the control means (70) allows the start of rotation of the rotating shaft (26) and also allows the start of supply of cutting water after the start of rotation of the rotating shaft (26).

Description

切削裝置Cutting device

本發明係有關包含保持被加工物之保持手段、和可旋轉支持將切削保持於保持手段之被加工物的刀刃備於外周之切削刀的切削手段、和於切削刀與被加工物供給切削水之切削水供給手段、相對加工輸送保持手段與切削手段之進給手段的切削裝置。The present invention relates to a cutting means including a holding means for holding a workpiece, and a cutting tool that rotatably supports the cutting edge of the workpiece to be cut and held by the holding means on the outer periphery, and the cutting tool and the workpiece are supplied with cutting water The cutting device is the cutting water supply means, the relative processing conveying and holding means and the cutting means of the cutting means.

IC、LSI等之複數之裝置形成於經由分割預定線所分割之表面之晶圓，係藉由具備可旋轉切削刀之切削裝置，分割成各個裝置晶片，分割之各裝置晶片係利用於行動電話、個人電腦等之電氣機器。Plural devices such as IC, LSI, etc. are formed on a wafer that is divided by a predetermined dividing line. It is divided into individual device chips by a cutting device equipped with a rotatable cutter. The divided device chips are used in mobile phones. , Electrical equipment such as personal computers.

本申請人係提案可進行將切削刀以螺母締結於固定座時所需特殊工具之回避、與將切削刀以螺母締結於固定板時個人差之回避的切削裝置(例如參照專利文獻1)。The applicant proposes a cutting device capable of avoiding special tools required when a cutting blade is connected to a fixed seat with a nut, and avoiding personal differences when a cutting blade is connected to a fixed plate with a nut (for example, refer to Patent Document 1).

此切削裝置係包含保持被加工物之保持手段、和可旋轉支持將切削保持於保持手段之被加工物的刀刃備於外周之切削刀的切削手段、和於切削刀與被加工物供給切削水之切削水供給手段、相對加工輸送保持手段與切削手段之進給手段的切削裝置。切削手段係具備轉動軸、和可旋轉支持旋轉軸之殼體、和保持形成於旋轉軸之前端之切削刀之固定座。固定座係具有***於形成在切削刀之中央之開口的輪殼部、和露出支持形成於輪殼部之外周的切削刀之刀刃的環狀之支持部、和開口於輪殼部與支持部之間，吸引保持切削刀之吸引孔、和將吸引孔連通於吸引源之連通路徑。 [先前技術文獻] [專利文獻]This cutting device includes a holding means for holding the workpiece, and a cutting means for rotatably supporting the cutting blade of the workpiece held by the holding means on the outer periphery, and supplying cutting water to the cutting blade and the workpiece The cutting device is the cutting water supply means, the relative processing conveying and holding means and the cutting means of the cutting means. The cutting means is provided with a rotating shaft, a housing that can rotatably support the rotating shaft, and a fixed seat for holding the cutting knife formed at the front end of the rotating shaft. The fixing base has a wheel housing part inserted in the opening formed in the center of the cutting blade, an annular support part that exposes the cutting edge of the cutting blade formed on the outer periphery of the wheel housing part, and an opening in the wheel housing part and the support part In between, the suction hole that sucks and holds the cutting blade, and the communication path that connects the suction hole to the suction source. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2002-154054號公報[Patent Document 1] JP 2002-154054 A

[發明欲解決之課題][The problem to be solved by the invention]

但是，在於固定座與切削刀之間，介入有異物，無法得充分吸引力之狀態下，進行旋轉切削刀，施以切削加工時，會有晶圓及切削刀受到損傷之問題。However, there is a problem of damage to the wafer and the cutter when the rotating cutter is performed in a state where there is a foreign object intervening between the fixed seat and the cutter and cannot be sufficiently attracted.

又，即使於固定座適切裝設切削刀之時，於供給切削水之時，會有從固定座與切削刀之間之些微間隙，伴隨切削水，吸引切削屑之問題。Moreover, even when the cutting tool is properly installed in the fixed seat, when cutting water is supplied, there will be a problem of a slight gap between the fixed seat and the cutting tool, which is accompanied by the cutting water, which attracts cutting chips.

有鑑於上述事實之本發明之課題係提供不損傷晶圓及切削刀之同時，不會從固定座與切削刀之間吸引切削水及切削屑之切削裝置。 [為解決課題之手段]In view of the foregoing facts, the subject of the present invention is to provide a cutting device that does not damage the wafer and the cutting blade, and does not attract cutting water and cutting chips from between the holder and the cutting blade. [Means to solve the problem]

本發明係為解決上述課題，提供以下之切削裝置。即，本發明係提供包含保持被加工物之保持手段、和可旋轉支持將切削保持於該保持手段之被加工物的刀刃備於外周之切削刀的切削手段、和於該切削刀與被加工物，供給切削水之切削水供給手段、和相對加工輸送該保持手段與該切削手段之進給手段的切削裝置中，該切削手段係至少由旋轉軸、和可旋轉支持該旋轉軸之殼體、和保持形成於該旋轉軸之前端之該切削刀之固定座所構成，該固定座係包含***形成於該切削刀之中央之開口的輪殼部、和露出支持形成於該輪殼部之外周的該切削刀之刀刃的環狀之支持部、和開口於該輪殼部與該支持部之間，吸引保持該切削刀之吸引孔、和將該吸引孔連通於吸引源之連通路徑，具備於該連通路徑配設壓力計，該壓力計所計測之值未達容許值之時，阻止該旋轉軸之旋轉開始及切削水之供給開始，該壓力計所計測之值達到容許值之時，容許該旋轉軸之旋轉開始之同時，該旋轉軸之旋轉開始時之後，容許切削水之供給開始的控制手段的切削裝置。In order to solve the above-mentioned problems, the present invention provides the following cutting device. That is, the present invention provides a cutting means including a holding means for holding a workpiece, and a cutting tool rotatably supporting the cutting edge of the workpiece held by the holding means on the outer periphery, and the cutting tool and the workpiece The cutting water supply means for supplying cutting water, and the cutting device for conveying the holding means and the feeding means for the cutting means relative to processing, the cutting means is at least a rotating shaft and a housing that rotatably supports the rotating shaft , And a fixed seat that holds the cutting blade formed at the front end of the rotating shaft, the fixed seat includes a wheel shell portion inserted into an opening formed in the center of the cutting blade, and an exposed support formed on the wheel shell portion The ring-shaped support portion of the cutting edge of the cutting knife on the outer periphery, and the suction hole that opens between the wheel housing portion and the support portion, sucks and holds the suction hole of the cutting knife, and a communication path that connects the suction hole to the suction source, Equipped with a pressure gauge installed in the communication path. When the value measured by the pressure gauge does not reach the allowable value, the rotation of the rotating shaft and the supply of cutting water are prevented, and the value measured by the pressure gauge reaches the allowable value A cutting device that permits the start of the rotation of the rotating shaft at the same time as the start of the rotation of the rotating shaft and allows the start of the supply of cutting water.

較佳係該切削手段係以該切削刀對向之方式，配設2個，該控制手段係在該壓力計所計測之值達到容許值之狀態，於雙方之該切削手段之該固定座，裝設該切削刀之時，容許僅一方之該切削手段所進行之保持於該保持手段之被加工物之切削的同時，旋轉另一方之該切削手段之該旋轉軸。 [發明效果]Preferably, the cutting means are arranged in such a way that the cutting blades are opposed to each other, and the control means is in the state that the value measured by the pressure gauge reaches the allowable value, and the fixed seat of the cutting means on both sides, When the cutting tool is installed, it is allowed to rotate the rotation axis of the other cutting means while cutting the workpiece held by the holding means by the cutting means of only one side. [Effects of the invention]

本發明之切削裝置係包含保持被加工物之保持手段、和可旋轉支持將切削保持於該保持手段之被加工物的刀刃備於外周之切削刀的切削手段、和於該切削刀與被加工物，供給切削水之切削水供給手段、和相對加工輸送該保持手段與該切削手段之進給手段，該切削手段係至少由旋轉軸、和可旋轉支持該旋轉軸之殼體、和保持形成於該旋轉軸之前端之該切削刀之固定座所構成，該固定座係包含***形成於該切削刀之中央之開口的輪殼部、和露出支持形成於該輪殼部之外周的該切削刀之刀刃的環狀之支持部、和開口於該輪殼部與該支持部之間，吸引保持該切削刀之吸引孔、和將該吸引孔連通於吸引源之連通路徑，具備於該連通路徑配設壓力計，該壓力計所計測之值未達容許值之時，阻止該旋轉軸之旋轉開始及切削水之供給開始，該壓力計所計測之值達到容許值之時，容許該旋轉軸之旋轉開始之同時，該旋轉軸之旋轉開始時之後，容許切削水之供給開始的控制手段之故，在於固定座與切削刀之間，介入有異物，無法得充分吸引力之時(即，壓力計所計測之值未達容許值之時)，不啟始切削加工，解決損傷晶圓及切削刀之問題。又，於本發明之切削裝置中，於旋轉軸之旋轉開始時以後，容許切削水之供給開始之故，於固定座及切削刀，即使附著切削水及切削屑，由於固定座及切削刀之離心力，甩掉切削水及切削屑，不會從固定座及切削刀之間之些微間隙，伴隨切削水吸引到切削屑。The cutting device of the present invention includes a holding means for holding a workpiece, and a cutting means for rotatably supporting a cutting blade that cuts and holds the workpiece on the holding means on the outer periphery, and the cutting tool and the workpiece The cutting water supply means for supplying cutting water, and the feeding means for conveying the holding means and the cutting means relative to processing, the cutting means is formed by at least a rotating shaft, a housing that rotatably supports the rotating shaft, and holding The fixed seat of the cutting tool at the front end of the rotating shaft is composed of a wheel housing part inserted into an opening formed in the center of the cutting tool, and an exposed support formed on the outer periphery of the wheel housing part. The annular support portion of the blade of the knife, and the suction hole that is opened between the wheel housing portion and the support portion to attract and hold the cutting blade, and the communication path connecting the suction hole to the suction source are provided in the communication The path is equipped with a pressure gauge. When the value measured by the pressure gauge does not reach the allowable value, the rotation of the rotating shaft and the supply of cutting water are prevented. When the value measured by the pressure gauge reaches the allowable value, the rotation is allowed At the same time when the rotation of the shaft starts, the control means that allows the supply of cutting water to start after the rotation of the rotation shaft starts, because there is a foreign object intervening between the holder and the cutting tool, and when sufficient attraction cannot be obtained (ie. , When the value measured by the pressure gauge does not reach the allowable value), the cutting process will not be started to solve the problem of damage to the wafer and cutter. Moreover, in the cutting device of the present invention, after the start of the rotation of the rotating shaft, the supply of cutting water is allowed to start, and even if cutting water and cutting chips adhere to the holder and the cutting tool, due to the gap between the holder and the cutting tool The centrifugal force throws away the cutting water and cutting chips, and the cutting water will not be attracted to the cutting chips from the slight gap between the fixed seat and the cutting tool.

以下、對於根據本發明所構成之切削裝置之適切實施形態，參照圖面加以說明。Hereinafter, a suitable embodiment of the cutting device constructed according to the present invention will be described with reference to the drawings.

圖1所示切削裝置2係包含保持被加工物之保持手段4、和可旋轉支持將切削保持於保持手段4之被加工物的刀刃備於外周之切削刀的切削手段6、和於切削刀與被加工物供給切削水之切削水供給手段8(參照圖2)、和相對加工輸送保持手段4與切削手段6之進給手段10。然而，圖1中，相互正交之X軸方向、Y軸方向、Z軸方向係各別以箭頭X、Y、Z加以顯示。X軸方向及Y軸方向所規定之平面係實質上為水平的。The cutting device 2 shown in FIG. 1 includes a holding means 4 for holding the workpiece, and a cutting means 6 that rotatably supports the cutting edge of the workpiece for cutting and holding the holding means 4 on the outer periphery, and the cutting tool The cutting water supply means 8 (refer to FIG. 2) for supplying cutting water with the workpiece, and the feeding means 10 facing the processing conveying and holding means 4 and the cutting means 6. However, in FIG. 1, the X-axis direction, Y-axis direction, and Z-axis direction orthogonal to each other are shown by arrows X, Y, and Z respectively. The plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

保持手段4係具備搭載於移動自如在X軸方向之基板12的X軸可動板14、和固定於X軸可動板14之上面之支柱16、和固定於支柱16之上端之覆蓋板18。於覆蓋板18中，形成圓形開口18a，透過圓形開口18a，延伸於上方之夾盤20則旋轉自如搭載於支柱16之上端。夾盤20係經由內藏於支柱16之夾盤用馬達(未圖示)，令延伸於上下方向軸線為中心加以旋轉。The holding means 4 includes an X-axis movable plate 14 mounted on a substrate 12 that is movable in the X-axis direction, a pillar 16 fixed to the upper surface of the X-axis movable plate 14, and a cover plate 18 fixed to the upper end of the pillar 16. In the cover plate 18, a circular opening 18a is formed. Through the circular opening 18a, the chuck 20 extending above is rotatably mounted on the upper end of the pillar 16. The chuck 20 is rotated by a chuck motor (not shown) embedded in the support column 16 with an axis extending in the vertical direction as the center.

於夾盤20之上端部分，配置有連接於吸引手段(未圖示)之多孔質之圓形狀之吸著盤22。然後，於夾盤20中，經由以吸引手段於吸著盤22之上面生成吸引力，吸引保持載置於吸著盤22之上面之被加工物。又，於夾盤20之周緣，在周方向隔著間隔，配置複數之夾鉗24。At the upper end of the chuck 20, a porous circular suction cup 22 connected to a suction means (not shown) is arranged. Then, in the chuck 20, an attractive force is generated on the upper surface of the suction plate 22 by a suction means, and the processed object placed on the upper surface of the suction plate 22 is sucked and held. In addition, on the periphery of the chuck 20, a plurality of clamps 24 are arranged at intervals in the circumferential direction.

圖示之實施形態之切削手段6係相互於Y軸方向隔著間隔，以切削刀對向之方式，具有配設2個之第一之切削手段6a名第二之切削手段6b。於圖示之實施形態之切削手段6中，將保持於保持手段4之被加工物，經由2個切削刀，成為可同時施以切削加工者。參照圖2及圖3加以說明時，第一之切削手段6a係至少由轉動軸26(參照圖3)、和可旋轉支持旋轉軸26之殼體28、和保持形成於旋轉軸26之前端之切削刀30之固定座32所構成。The cutting means 6 of the illustrated embodiment are spaced apart from each other in the Y-axis direction, and the cutting blades are opposed to each other, and two cutting means 6a and 6b are arranged as the first cutting means 6a and the second cutting means 6b. In the cutting means 6 of the embodiment shown in the figure, the workpiece held by the holding means 4 can be simultaneously cut by two cutting blades. 2 and 3 for description, the first cutting means 6a is made up of at least the rotating shaft 26 (refer to Figure 3), and the housing 28 that can rotatably support the rotating shaft 26, and the holding formed at the front end of the rotating shaft 26 The cutting tool 30 is constituted by a fixed seat 32.

於旋轉軸26之另一端、連結為了旋轉旋轉軸26之馬達(未圖示)。如圖2所示，於殼體28之前端，裝設有刀罩34。刀罩34係包含固定於殼體28之前端之主要部36、和搖動自如地支持於主要部36之可動部38。切削刀30係具有圓筒狀之基台40、和裝設於基台40之單側面之外周部之環狀之刀刃42。於基台40之中央部，形成圓形狀之開口40a。然而，圖3中，為了方便，省略刀罩34。At the other end of the rotating shaft 26, a motor (not shown) for rotating the rotating shaft 26 is connected. As shown in FIG. 2, a knife cover 34 is installed at the front end of the housing 28. The blade cover 34 includes a main part 36 fixed to the front end of the housing 28 and a movable part 38 supported by the main part 36 in a rocking manner. The cutting blade 30 has a cylindrical base 40 and an annular cutting edge 42 mounted on the outer periphery of one side surface of the base 40. At the center of the base 40, a circular opening 40a is formed. However, in FIG. 3, the knife cover 34 is omitted for convenience.

參照圖3加以持續說明時，固定座32係包含***於形成在切削刀30之中央之開口40a的輪殼部44、和露出支持形成於輪殼部44之外周的切削刀30之刀刃42的環狀之支持部46、和開口於輪殼部44與支持部46之間，吸引保持切削刀30之吸引孔50、和將吸引孔50連通於吸引源52之連通路徑54。3 to continue the description, the fixed seat 32 includes a wheel shell portion 44 inserted in the opening 40a formed in the center of the cutting blade 30, and exposed and supporting the cutting edge 42 of the cutting blade 30 formed on the outer periphery of the wheel shell portion 44 The annular support portion 46 and the suction hole 50 that opens between the wheel shell portion 44 and the support portion 46 to attract and hold the cutting blade 30 and the communication path 54 that connects the suction hole 50 to the suction source 52.

輪殼部44係形成為圓柱狀，輪殼部44之直徑係對應於切削刀30之基台40之開口40a之直徑。支持部46之外徑係較切削刀30之刀刃42之外徑為小，於固定板32裝著切削刀30之時，從固定座32露出刀刃42。又，支持部46之Y軸方向前端面係較輪殼部44之Y軸方向前端面後退。The wheel shell portion 44 is formed in a cylindrical shape, and the diameter of the wheel shell portion 44 corresponds to the diameter of the opening 40 a of the base 40 of the cutter 30. The outer diameter of the supporting part 46 is smaller than the outer diameter of the cutting edge 42 of the cutting blade 30. When the cutting blade 30 is mounted on the fixing plate 32, the cutting edge 42 is exposed from the fixing seat 32. In addition, the front end surface of the support portion 46 in the Y-axis direction is receded from the front end surface of the wheel housing portion 44 in the Y-axis direction.

於輪殼部44與支持部46之間，設有較支持部46之前端更向Y軸方向後退之環狀凹處48，於此環狀凹處48，形成為吸引保持切削刀30之吸引孔50。於圖示之實施形態之固定座32中，設有一對之吸引孔50。吸引孔50係可為1個，為了使旋轉平衡良好，以等角度間隔形成2個以上者為佳。如圖3所示，各吸引孔50係於吸引源52，隔著連通路徑54加以連通。於連通路徑54，配設計測連通路徑54內之壓力的壓力計56、和為了開閉連通路徑54之閥58。然後，於固定座32，經由在開啟閥58之狀態作動吸引源52，吸引保持嵌合於輪殼部44之切削刀30。Between the wheel shell portion 44 and the support portion 46, there is provided a ring-shaped recess 48 that recedes in the Y-axis direction than the front end of the support portion 46. The ring-shaped recess 48 is formed to attract and hold the cutting blade 30.孔50. In the fixing base 32 of the illustrated embodiment, a pair of suction holes 50 are provided. The number of suction holes 50 may be one, and in order to achieve a good rotation balance, it is preferable to form two or more at equal angular intervals. As shown in FIG. 3, each suction hole 50 is connected to a suction source 52 and communicates with each other via a communication path 54. The communication path 54 is equipped with a pressure gauge 56 designed to measure the pressure in the communication path 54 and a valve 58 for opening and closing the communication path 54. Then, in the fixed seat 32, the suction source 52 is actuated in a state where the valve 58 is opened to suck and hold the cutting blade 30 fitted in the wheel shell part 44.

又，第一之切削手段6a係如圖1所示，包含支持於適切移動自如於Y軸方向之支持構件(未圖示)的Y軸可動片60、和支持於移動自如於Z軸方向之Y軸可動片60的Z軸可動片62。於Z軸可動片62之下端，固定有上述殼體28。然而，對於第二之切削手段6b，與第一之切削手段6a同一之構成即可之故，附上與第一之切削手段6a相同之符號，省略說明。In addition, the first cutting means 6a is shown in FIG. 1, and includes a Y-axis movable piece 60 supported by a support member (not shown) that is suitably movable in the Y-axis direction, and a Y-axis movable piece 60 supported by a support member that is freely movable in the Z-axis direction. The Z-axis movable piece 62 of the Y-axis movable piece 60. At the lower end of the Z-axis movable piece 62, the above-mentioned housing 28 is fixed. However, as for the second cutting means 6b, the same configuration as the first cutting means 6a is sufficient, and the same reference numerals as those of the first cutting means 6a are attached, and the description is omitted.

參照圖2，對於切削水供給手段8加以說明。切削水供給手段8係包含附設於刀罩34之主要部36之圓筒狀之供給口64、和連通於供給口64之一對之噴嘴66。供給口64係連通於切削水供給源(未圖示)，於連通供給口64與切削水供給源之水路(未圖示)，設置開閉此水路之閥(未圖示)。如圖2(b)及圖2(c)所示，噴嘴66中，形成有複數之噴射孔68。然後，於切削水供給手段8係於保持在保持手段4之被加工物，經由切削手段6施以切削加工之時，將從切削水供給源供給至供給口64之切削水，將從噴嘴66之噴射孔68切削水，朝向切削刀30及被加工物加以噴射。2, the cutting water supply means 8 will be described. The cutting water supply means 8 includes a cylindrical supply port 64 attached to the main portion 36 of the blade cover 34 and a nozzle 66 communicating with a pair of the supply ports 64. The supply port 64 communicates with a cutting water supply source (not shown), and a water path (not shown) that communicates the supply port 64 with the cutting water supply source is provided with a valve (not shown) for opening and closing the water path. As shown in FIG. 2(b) and FIG. 2(c), the nozzle 66 has a plurality of injection holes 68 formed thereon. Then, when the cutting water supply means 8 is attached to the workpiece held by the holding means 4 and the cutting process is applied via the cutting means 6, the cutting water supplied from the cutting water supply source to the supply port 64 will be supplied from the nozzle 66 The cutting water of the spray hole 68 is sprayed toward the cutting blade 30 and the workpiece.

如圖3所示，於壓力計56，電性連接控制切削裝置2之作動之控制手段70，以壓力計56計測之值則送至控制手段70。由電腦構成之控制手段70係具有根據控制程式演算處理之中央處理裝置(CPU)、和收納控制程式等之唯讀記憶體(ROM)、和收納演算結果等之可讀寫之隨機存取記憶體(RAM)(皆未圖示)。然後，控制手段70係壓力計56所計測之值未達容許值之時，阻止旋轉軸26之旋轉開始及切削水之供給開始，壓力計56所計測之值達到容許值之時，容許旋轉軸26之旋轉開始的同時，於旋轉軸26之旋轉開始時之後，容許切削水之供給開始。As shown in FIG. 3, the pressure gauge 56 is electrically connected to the control means 70 that controls the operation of the cutting device 2, and the value measured by the pressure gauge 56 is sent to the control means 70. The control means 70 composed of a computer has a central processing unit (CPU) for calculating and processing according to a control program, a read-only memory (ROM) for storing the control program, etc., and a read-write random access memory for storing calculation results, etc. RAM (all not shown). Then, when the value measured by the pressure gauge 56 does not reach the allowable value, the control means 70 prevents the rotation of the rotating shaft 26 from starting and the supply of cutting water starts, and when the value measured by the pressure gauge 56 reaches the allowable value, the rotating shaft is allowed At the same time when the rotation of 26 starts, after the rotation of the rotating shaft 26 starts, the supply of cutting water is allowed to start.

圖示之實施形態之進給手段10係如圖1所示，包含X軸進給手段72、和配設於跨過基台12而設之門型框(未圖示)的第一・第二之Y軸進給手段74a、74b、和第一・第二之Z軸進給手段76a、76b。X軸進給手段72係具有延伸在連結於X軸可動板14之X軸方向之滾珠螺桿78，和旋轉滾珠螺桿78之馬達80。然後，X軸進給手段72係經由滾珠螺桿78，將馬達80之旋轉運動變換成直線運動，傳達至X軸可動板14，對於切削手段6，將保持手段4向X軸方向相對性加工輸送。The feeding means 10 of the illustrated embodiment is shown in FIG. 1, and includes an X-axis feeding means 72, and the first and the second part of the door frame (not shown) arranged across the base 12 The second Y-axis feeding means 74a, 74b, and the first and second Z-axis feeding means 76a, 76b. The X-axis feeding means 72 has a ball screw 78 extending in the X-axis direction connected to the X-axis movable plate 14 and a motor 80 that rotates the ball screw 78. Then, the X-axis feeding means 72 converts the rotational motion of the motor 80 into linear motion via the ball screw 78, and transmits it to the X-axis movable plate 14. For the cutting means 6, the holding means 4 is relatively processed and transported in the X-axis direction. .

第一之Y軸進給手段74a係具有延伸在連結於Y軸可動片60之Y軸方向之滾珠螺桿82，和旋轉滾珠螺桿82之馬達84。然後，第一之Y軸進給手段74a係經由滾珠螺桿82，將馬達84之旋轉運動變換成直線運動，傳達至Y軸可動片60，對於保持手段4，將第一之切削手段6a向Y軸方向相對性加工輸送(分級輸送)。又，於第一之Y軸進給手段74a，馬達84則連接於滾珠螺桿82之Y軸方向一端部，另一方面，於第二之Y軸進給手段74b，馬達84除了連接於滾珠螺桿84之Y軸方向另一端部之部分以外、第二之Y軸進給手段74b係可與第一之Y軸進給手段74a為同一之構成。然後，第二之Y軸進給手段74b係對於保持手段4，將第二之切削手段6b向Y軸方向相對性加工輸送(分級輸送)。The first Y-axis feeding means 74a has a ball screw 82 extending in the Y-axis direction connected to the Y-axis movable piece 60, and a motor 84 that rotates the ball screw 82. Then, the first Y-axis feeding means 74a converts the rotational motion of the motor 84 into linear motion via the ball screw 82, and transmits it to the Y-axis movable piece 60. For the holding means 4, the first cutting means 6a is directed to Y Relative processing and conveying in the axial direction (graded conveying). In addition, in the first Y-axis feeding means 74a, the motor 84 is connected to one end of the ball screw 82 in the Y-axis direction. On the other hand, in the second Y-axis feeding means 74b, the motor 84 is connected to the ball screw. Except for the part of the other end in the Y-axis direction of 84, the second Y-axis feeding means 74b can have the same structure as the first Y-axis feeding means 74a. Then, the second Y-axis feeding means 74b is for relative processing and conveying (stage conveying) of the second cutting means 6b in the Y-axis direction with respect to the holding means 4.

第一之Z軸進給手段76a係具有延伸在連結於Z軸可動片62之Z軸方向之滾珠螺桿(未圖示)，和旋轉此滾珠螺桿之馬達86。然後，第一之Z軸進給手段76a係經由滾珠螺桿，將馬達86之旋轉運動變換成直線運動，傳達至Z軸可動片62，對於保持手段4，將第一之切削手段6a向Z軸方向相對性加工輸送(切入輸送)。又，第一之Z軸進給手段76a與可為同一構成之第二之Z軸進給手段76b係對於保持手段4，將第二之切削手段6b向Z軸方向相對性加工輸送(切入輸送)。The first Z-axis feeding means 76a has a ball screw (not shown) extending in the Z-axis direction connected to the Z-axis movable piece 62, and a motor 86 that rotates the ball screw. Then, the first Z-axis feeding means 76a converts the rotational motion of the motor 86 into linear motion via a ball screw, and transmits it to the Z-axis movable piece 62. For the holding means 4, the first cutting means 6a is directed to the Z-axis Directional relative processing and conveying (cut-in conveying). In addition, the first Z-axis feeding means 76a and the second Z-axis feeding means 76b, which can be of the same configuration, are for the holding means 4, and the second cutting means 6b is relatively processed and conveyed in the Z-axis direction (cutting conveyance). ).

如上述之切削裝置2中，於第一之切削手段6a或第二之切削手段6b之任一者，於固定座32與切削刀30間，介入有異物等之時，於固定座32與切削刀30間會產生間隙，從此間隙流入空氣至連通路徑54內之故，連通路徑54內之壓力無法下降至容許值(例如，絕對壓力0.03MPa程度)，固定座32保持切削刀30之吸引力無法達到所需要之值。因此，於壓力計56所計測之值未達容許值之時，控制手段70係阻止第一・第二之切削手段6a、6b之雙方之旋轉軸26之旋轉開始及切削水之供給開始。As in the above-mentioned cutting device 2, when any one of the first cutting means 6a or the second cutting means 6b is inserted between the fixed seat 32 and the cutting tool 30, when a foreign object or the like is inserted between the fixed seat 32 and the cutting There is a gap between the cutters 30, and air flows into the communication path 54 from this gap. Therefore, the pressure in the communication path 54 cannot be reduced to an allowable value (for example, the absolute pressure is about 0.03 MPa), and the fixed seat 32 maintains the attractive force of the cutter 30 Unable to reach the required value. Therefore, when the value measured by the pressure gauge 56 does not reach the allowable value, the control means 70 prevents the start of rotation of the rotation shaft 26 of both the first and second cutting means 6a, 6b and the start of the supply of cutting water.

另一方面，於第一・第二之切削手段6a、6b之雙方，於固定座32與切削刀30間，未有介入異物等之時，將切削刀30吸引保持(裝設)於固定座32之時，固定座32之支持部46與切削刀30則緊密接觸。結果，連通路徑54內之壓力則下降至許容值，以所需要之吸引力，切削刀30被保持於固定座32。因此，於壓力計56所計測之值達到容許值之時，控制手段70係容許第一・第二之切削手段6a、6b之雙方之旋轉軸26之旋轉開始的同時，於雙方之旋轉軸26之旋轉開始時之後，容許切削水之供給開始。On the other hand, in both the first and second cutting means 6a, 6b, when there is no foreign matter or the like between the fixed seat 32 and the cutting blade 30, the cutting blade 30 is sucked and held (installed) on the fixed seat At 32, the supporting portion 46 of the fixed seat 32 and the cutting blade 30 are in close contact. As a result, the pressure in the communication path 54 drops to a permissible value, and the cutting blade 30 is held on the fixed seat 32 with the required attractive force. Therefore, when the value measured by the pressure gauge 56 reaches the allowable value, the control means 70 allows the first and second cutting means 6a, 6b to start the rotation of the rotating shafts 26 at the same time as the two rotating shafts 26 After the rotation starts, the supply of cutting water is allowed to start.

如此圖示之實施形態之切削裝置2中，具備任一方之壓力計56所計測之值未達到容許值之時，阻止第一・第二之切削手段6a、6b之雙方之旋轉軸26之旋轉開始及切削水之供給開始，雙方之壓力計56所計測之值達到容許值之時，容許第一・第二之切削手段6a、6b之雙方之旋轉軸26之旋轉開始的同時，於雙方之旋轉軸26之旋轉開始時之後，容許切削水之供給開始之控制手段70之故，在於固定座32與切削刀30之間，介入有異物，無法得充分吸引力之時，不啟始切削加工之故，不會損傷晶圓及切削刀30。In the cutting device 2 of the embodiment shown in the figure, when the value measured by the pressure gauge 56 provided with one of them does not reach the allowable value, the rotation of the rotation shaft 26 of both the first and second cutting means 6a, 6b is prevented When the value measured by the pressure gauge 56 on both sides reaches the allowable value at the start and the supply of cutting water, the rotation of the rotation shafts 26 of both the first and second cutting means 6a and 6b is allowed to start at the same time as both After the rotation of the rotating shaft 26 is started, the control means 70 that allows the supply of cutting water to start is because of the foreign matter intervening between the fixed seat 32 and the cutting blade 30, and the cutting process is not started when sufficient attraction is not obtained. Therefore, the wafer and the cutter 30 will not be damaged.

又，於切削裝置2中，於旋轉軸26之旋轉開始時以後，容許切削水之供給開始之故，於固定座32及切削刀30，即使附著切削水及切削屑，由於固定座32及切削刀30之離心力，甩掉切削水及切削屑，不會從固定座32及切削刀30之間之些微間隙，伴隨切削水吸引到切削屑。Moreover, in the cutting device 2, after the start of the rotation of the rotating shaft 26, the supply of cutting water is allowed to start. Even if cutting water and cutting chips adhere to the fixed seat 32 and the cutting blade 30, the fixed seat 32 and cutting The centrifugal force of the knife 30 throws away the cutting water and cutting chips, and the cutting water will not be attracted to the cutting chips from the slight gap between the fixed seat 32 and the cutting knife 30 along with the cutting water.

又，於切削裝置2中，僅經由第一・第二之切削手段6a、6b之任一方，可將保持於保持手段4之被加工物加以切削。此時，控制手段70係在雙方之壓力計56所計測之值達到容許值之狀態下，於雙方之固定座32，裝設切削刀30之時，容許僅第一・第二之切削手段6a、6b之一方所進行之被加工物之切削的同時，旋轉第一・第二之切削手段6a、6b之另一方之旋轉軸26。In addition, in the cutting device 2, the workpiece held by the holding means 4 can be cut by only one of the first and second cutting means 6a and 6b. At this time, the control means 70 is to allow only the first and second cutting means 6a when the cutting tool 30 is installed on the fixing seats 32 of both sides when the values measured by the pressure gauges 56 of both sides reach the allowable value. , While cutting the workpiece by one of 6b, rotate the rotation shaft 26 of the other of the first and second cutting means 6a, 6b.

由此，經由一方之切削手段6之切削所產生之切削屑，不會有附著於另一方之切削手段6之固定座32，而污染固定座32之情形。即，在壓力計56所計測之值達到容許值之狀態下，經由於另一方之切削手段6之固定座32，裝設切削刀30，可防止向另一方之切削手段6之固定座32之切削屑的附著。Therefore, the cutting chips generated by the cutting by one cutting means 6 will not adhere to the fixing seat 32 of the other cutting means 6 and contaminate the fixing seat 32. That is, when the value measured by the pressure gauge 56 reaches the allowable value, the cutting tool 30 is installed through the fixing seat 32 of the other cutting means 6 to prevent the fixing seat 32 of the other cutting means 6 Adhesion of cutting chips.

又，即使另一方之切削手段6之切削刀30設於固定座32，不會有經由一方之切削手段6之切削所產生之切削屑從切削刀30與固定座32之些微間隙被加以吸引之情形。即，經由旋轉另一方之切削手段6之旋轉軸26，藉由旋轉之離心力，可防止從固定座32與切削刀30之些微間隙吸引切削屑。In addition, even if the cutting tool 30 of the other cutting means 6 is set on the fixed seat 32, the chips generated by the cutting by the one cutting means 6 will not be attracted from the slight gap between the cutting tool 30 and the fixed seat 32 situation. That is, by rotating the rotating shaft 26 of the other cutting means 6, the centrifugal force of the rotation prevents the suction of cutting chips from the slight gap between the fixed seat 32 and the cutting blade 30.

然而，圖示之實施形態之切削裝置2中，雖說明了具備2個切削手段6之情形，但切削手段6亦可為1個。However, in the cutting device 2 of the illustrated embodiment, although the case where two cutting means 6 are provided has been described, the number of cutting means 6 may be one.

2:切削裝置 4:保持手段 6:切削手段 6a:第一之切削手段 6b:第二之切削手段 8:切削水供給手段 10:進給手段 26:旋轉軸 28:殼體 30:切削刀 32:固定座 42:刀刃 44:輪殼部 46:支持部 50:吸引孔 52:吸引源 54:連通路徑 56:壓力計 70:控制手段2: Cutting device 4: keep the means 6: Cutting means 6a: The first cutting method 6b: The second cutting method 8: Cutting water supply means 10: Feeding means 26: Rotation axis 28: shell 30: Cutter 32: fixed seat 42: Blade 44: Wheel shell 46: Support Department 50: Attraction hole 52: Attraction source 54: Connected Path 56: Pressure gauge 70: Control

[圖1]根據本發明所構成之切削裝置之一部分斜視圖。 [圖2](a)圖1所示切削手段之一部分斜視圖、(b)顯示從(a)所示之狀態提升切削水供給部狀態的斜視圖，(c)顯示從(b)所示之狀態取下切削刀狀態的斜視圖。 [圖3]圖1所示切削手段之一部分剖面圖。[Figure 1] A partial perspective view of a cutting device constructed according to the present invention. [Fig. 2] (a) A partial oblique view of the cutting means shown in Fig. 1, (b) an oblique view showing the state of raising the cutting water supply from the state shown in (a), and (c) showing the state shown in (b) The oblique view of the state with the cutter removed. [Fig. 3] A partial cross-sectional view of the cutting means shown in Fig. 1.

6:切削手段 6: Cutting means

6a:第一之切削手段 6a: The first cutting method

6b:第二之切削手段 6b: The second cutting method

26:旋轉軸 26: Rotation axis

28:殼體 28: shell

30:切削刀 30: Cutter

32:固定座 32: fixed seat

40:基台 40: Abutment

40a:開口 40a: opening

42:刀刃 42: Blade

44:輪殼部 44: Wheel shell

46:支持部 46: Support Department

48:環狀凹處 48: Annular recess

50:吸引孔 50: Attraction hole

52:吸引源 52: Attraction source

54:連通路徑 54: Connected Path

56:壓力計 56: Pressure gauge

58:閥 58: Valve

70:控制手段 70: Control

Claims (2)

一種切削裝置，包含保持被加工物之保持手段、和可旋轉地支持將切削保持於該保持手段之被加工物的刀刃備於外周之切削刀的切削手段、和對該切削刀與被加工物供給切削水之切削水供給手段、相對地加工輸送該保持手段與該切削手段之進給手段的切削裝置，其特徵係 該切削手段係至少由轉動軸、和可旋轉地支持該旋轉軸之殼體、和形成於該旋轉軸之前端且保持該切削刀之固定座所構成， 該固定座係包含***於形成在該切削刀之中央之開口的輪殼部、和形成於該輪殼部之外周且使該切削刀之刀刃露出來支持的環狀之支持部、和開口於該輪殼部與該支持部之間，吸引保持該切削刀之吸引孔、和將該吸引孔連通於吸引源之連通路徑， 具備於該連通路徑配設壓力計，該壓力計所計測之值未達容許值之時，阻止該旋轉軸之旋轉開始及切削水之供給開始，該壓力計所計測之值達到容許值之時，容許該旋轉軸之旋轉開始之同時，該旋轉軸之旋轉開始時之後，容許切削水之供給開始的控制手段。A cutting device comprising a holding means for holding a workpiece, a cutting means for rotatably supporting a cutting blade for cutting the workpiece held by the holding means on the outer periphery, and the cutting tool and the workpiece The cutting water supply means for supplying cutting water, and the cutting device for processing and conveying the holding means and the feeding means of the cutting means relatively, are characterized by The cutting means is composed of at least a rotating shaft, a housing rotatably supporting the rotating shaft, and a fixed seat formed at the front end of the rotating shaft and holding the cutting knife, The fixing seat includes a wheel housing portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the wheel housing portion and supporting the cutting edge of the cutting blade by exposing it, and an opening in Between the wheel shell portion and the support portion, the suction hole that sucks and holds the cutting blade, and the communication path that connects the suction hole to the suction source, Equipped with a pressure gauge installed in the communication path. When the value measured by the pressure gauge does not reach the allowable value, the rotation of the rotating shaft and the supply of cutting water are prevented, and the value measured by the pressure gauge reaches the allowable value , Allows the start of the rotation of the rotating shaft at the same time, after the start of the rotation of the rotating shaft, the control means to allow the start of the supply of cutting water. 如請求項1記載之切削裝置，其中，該切削手段係以該切削刀為對向之方式，配設有2個， 該控制手段係在該壓力計所計測之值達到容許值之狀態，於雙方之該切削手段之該固定座，裝設該切削刀之時，容許僅一方之該切削手段所進行之保持於該保持手段之被加工物之切削的同時，旋轉另一方之該切削手段之該旋轉軸。Such as the cutting device described in claim 1, wherein the cutting means is arranged with the cutting knife as the opposite way, and two are provided, The control means is in the state that the value measured by the pressure gauge reaches the allowable value. When the fixing seat of the cutting means of both sides is installed, the cutting tool is allowed to be maintained by the cutting means of only one side. While cutting the workpiece of the holding means, rotate the rotation axis of the other cutting means.
TW109141260A 2019-11-27 2020-11-25 Cutting device which does not damage a wafer and a cutting blade and does not suck cutting water and cutting debris from the position between a fixing base and a cutting blade TW202120257A (en)

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US5718615A (en) * 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
JP2002154054A (en) 2000-11-17 2002-05-28 Disco Abrasive Syst Ltd Attaching mechanism for cutting blade
JP6108999B2 (en) 2013-07-18 2017-04-05 株式会社ディスコ Cutting equipment
JP6069122B2 (en) * 2013-07-22 2017-02-01 株式会社ディスコ Cutting equipment
JP2016111173A (en) * 2014-12-05 2016-06-20 株式会社ディスコ Cutting device
JP6815770B2 (en) * 2016-07-13 2021-01-20 株式会社ディスコ Cutting equipment
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