JP7461132B2 - Cutting Equipment - Google Patents

Cutting Equipment Download PDF

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Publication number
JP7461132B2
JP7461132B2 JP2019214137A JP2019214137A JP7461132B2 JP 7461132 B2 JP7461132 B2 JP 7461132B2 JP 2019214137 A JP2019214137 A JP 2019214137A JP 2019214137 A JP2019214137 A JP 2019214137A JP 7461132 B2 JP7461132 B2 JP 7461132B2
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Prior art keywords
cutting
cutting blade
rotating shaft
blade
holding
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JP2021084162A (en
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秀次 新田
治信 湯澤
嘉男 松下
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Disco Corp
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Disco Corp
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Priority to JP2019214137A priority Critical patent/JP7461132B2/en
Priority to KR1020200147615A priority patent/KR20210065844A/en
Priority to TW109141260A priority patent/TW202120257A/en
Priority to CN202011338136.5A priority patent/CN112847857A/en
Publication of JP2021084162A publication Critical patent/JP2021084162A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)

Description

本発明は、被加工物を保持する保持手段と、保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、切削ブレードと被加工物に切削水を供給する切削水供給手段と、保持手段と切削手段とを相対的に加工送りする送り手段と、を含む切削装置に関する。 The present invention relates to a cutting device that includes a holding means for holding a workpiece, a cutting means that rotatably supports a cutting blade having a cutting edge on its outer periphery for cutting the workpiece held by the holding means, a cutting water supplying means that supplies cutting water to the cutting blade and the workpiece, and a feeding means that feeds the holding means and the cutting means relatively to each other for processing.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、切削ブレードを回転可能に備えた切削装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer with multiple devices such as ICs and LSIs formed on its surface along planned division lines is divided into individual device chips by a cutting machine equipped with a rotatable cutting blade, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

本出願人は、切削ブレードをナットでマウントに締結する際に必要な特殊工具の回避、切削ブレードをナットでマウントに締結する際の個人差の回避、を可能にした切削装置を提案した（たとえば特許文献１参照）。 The applicant has proposed a cutting device that makes it possible to avoid special tools required when fastening a cutting blade to a mount with a nut, and avoid individual differences when fastening a cutting blade to a mount with a nut (for example, (See Patent Document 1).

この切削装置は、被加工物を保持する保持手段と、保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、切削ブレードと被加工物に切削水を供給する切削水供給手段と、保持手段と切削手段とを相対的に加工送りする送り手段とを含む。切削手段は、回転軸と、回転軸を回転可能に支持するハウジングと、回転軸の先端に形成され切削ブレードを保持するマウントとを備える。マウントは、切削ブレードの中央に形成された開口に挿入されるボス部と、ボス部の外周に形成され切削ブレードの切り刃を露出させて支持するリング状の支持部と、ボス部と支持部との間に開口し切削ブレードを吸引保持する吸引孔と、吸引孔を吸引源に連通する連通路とを有する。 This cutting device includes a holding means for holding the workpiece, a cutting means rotatably supporting a cutting blade having a cutting edge on its outer periphery for cutting the workpiece held by the holding means, a cutting water supplying means for supplying cutting water to the cutting blade and the workpiece, and a feed means for relatively feeding the holding means and the cutting means for processing. The cutting means includes a rotating shaft, a housing for rotatably supporting the rotating shaft, and a mount formed at the tip of the rotating shaft for holding the cutting blade. The mount has a boss portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the boss portion for supporting the cutting blade while exposing it, a suction hole that opens between the boss portion and the support portion for suctioning and holding the cutting blade, and a communication passage that connects the suction hole to a suction source.

特開２００２－１５４０５４号公報Japanese Patent Application Publication No. 2002-154054

しかし、マウントと切削ブレードとの間に異物が介在し充分な吸引力が得られない状態で切削ブレードを回転させて切削加工を施すとウエーハおよび切削ブレードを損傷させるという問題がある。 However, if foreign matter is present between the mount and the cutting blade and sufficient suction force is not obtained, there is a problem that the wafer and cutting blade may be damaged if the cutting blade is rotated to perform cutting.

また、マウントに切削ブレードが適正に装着されている場合であっても、切削水を供給した際に、マウントと切削ブレードとの間の僅かな隙間から切削水と共に切削屑が吸引されてしまうという問題がある。 Even if the cutting blade is properly attached to the mount, there is a problem in that when cutting water is supplied, cutting chips are sucked in along with the cutting water through the small gap between the mount and the cutting blade.

上記事実に鑑みてなされた本発明の課題は、ウエーハおよび切削ブレードを損傷させることがないと共に、マウントと切削ブレードとの間から切削水および切削屑が吸引されることがない切削装置を提供することである。 In light of the above, the objective of the present invention is to provide a cutting device that does not damage the wafer or cutting blade, and does not suck in cutting water or cutting chips between the mount and the cutting blade.

本発明は上記課題を解決するために以下の切削装置を提供する。すなわち、被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含む切削装置であって、該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備え、該切削手段は、該切削ブレードが対向するように２個配設され、該制御手段は、該圧力計が計測した値が許容値に達した状態で双方の該切削手段の該マウントに該切削ブレードが装着されている場合に、一方の該切削手段のみによる該保持手段に保持された被加工物の切削を許容すると共に、他方の該切削手段の該回転軸を回転させる切削装置を本発明は提供する。 In order to solve the above problems, the present invention provides the following cutting device: That is, the cutting device includes a holding means for holding a workpiece, a cutting means rotatably supporting a cutting blade having a cutting edge on its outer periphery for cutting the workpiece held by the holding means, a cutting water supplying means for supplying cutting water to the cutting blade and the workpiece, and a feeding means for relatively feeding the holding means and the cutting means for processing, the cutting means being at least composed of a rotating shaft, a housing for rotatably supporting the rotating shaft, and a mount formed at the tip of the rotating shaft for holding the cutting blade, the mount including a boss portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the boss portion for supporting the cutting blade while exposing the cutting edge, and a ring-shaped support portion opening between the boss portion and the support portion for suction-holding the cutting blade. The present invention provides a cutting device which includes a suction hole and a communication passage which connects the suction hole to a suction source, a pressure gauge disposed in the communication passage, and a control means which prevents the rotating shaft from starting to rotate and the supply of cutting water from starting if the value measured by the pressure gauge does not reach an allowable value, and allows the rotating shaft to start to rotate and allows the supply of cutting water to start after the rotating shaft starts to rotate if the value measured by the pressure gauge reaches the allowable value, wherein two cutting means are disposed so that the cutting blades face each other, and the control means allows the cutting of a workpiece held by the holding means by only one of the cutting means and rotates the rotating shaft of the other cutting means when the cutting blades are attached to the mounts of both cutting means when the value measured by the pressure gauge reaches the allowable value.

本発明の切削装置は、被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含み、該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備え、該切削手段は、該切削ブレードが対向するように２個配設され、該制御手段は、該圧力計が計測した値が許容値に達した状態で双方の該切削手段の該マウントに該切削ブレードが装着されている場合に、一方の該切削手段のみによる該保持手段に保持された被加工物の切削を許容すると共に、他方の該切削手段の該回転軸を回転させるので、マウントと切削ブレードとの間に異物が介在し充分な吸引力が得られない場合は、圧力計が計測した値が許容値に達しないため切削加工が開始されず、ウエーハおよび切削ブレードを損傷させるという問題が解消する。また、本発明の切削装置においては、回転軸の回転開始時以降において切削水の供給開始を許容するので、マウントおよび切削ブレードに切削水および切削水が付着しても、マウントおよび切削ブレードの遠心力によって切削水および切削屑が吹き飛ばされ、マウントと切削ブレードとの間の僅かな隙間から切削水と共に切削屑が吸引されることがない。 The cutting device of the present invention includes: a holding means for holding a workpiece; a cutting means rotatably supporting a cutting blade having a cutting blade on the outer periphery for cutting the workpiece held by the holding means; The cutting means includes a cutting water supply means for supplying cutting water to the cutting blade and the workpiece, and a feeding means for relatively feeding the holding means and the cutting means. The housing includes at least a housing that rotatably supports a rotating shaft, and a mount that is formed at the tip of the rotating shaft and holds the cutting blade, and the mount is inserted into an opening formed in the center of the cutting blade. a ring-shaped support part formed on the outer periphery of the boss part to expose and support the cutting edge of the cutting blade; and a ring-shaped support part that is opened between the boss part and the support part to suck the cutting blade. It includes a suction hole to be held and a communication path that communicates the suction hole with the suction source, and a pressure gauge is disposed in the communication path, and if the value measured by the pressure gauge does not reach the allowable value, the rotation The start of rotation of the shaft and the start of supply of cutting water are prevented, and when the value measured by the pressure gauge reaches the allowable value, the start of rotation of the rotary shaft is allowed, and the cutting water is stopped after the start of rotation of the rotary shaft. The cutting means is provided with two cutting blades facing each other, and the control means is configured to control the pressure when the value measured by the pressure gauge reaches a permissible value. When the cutting blade is attached to the mounts of both cutting means, only one cutting means is allowed to cut the workpiece held by the holding means, and the other cutting means is allowed to cut the workpiece held by the holding means. Since the rotating shaft is rotated , if there is a foreign object between the mount and the cutting blade and sufficient suction force cannot be obtained, the value measured by the pressure gauge will not reach the allowable value and cutting will not start. First, the problem of damaging the wafer and cutting blade is eliminated. In addition, in the cutting device of the present invention, since the supply of cutting water is allowed to start after the rotation of the rotary shaft starts, even if the cutting water and cutting water adhere to the mount and cutting blade, the mount and cutting blade will not be centrifuged. The cutting water and cutting debris are blown away by the force, and the cutting debris is not sucked together with the cutting water through the small gap between the mount and the cutting blade.

本発明に従って構成された切削装置の一部斜視図。1 is a partial perspective view of a cutting device constructed in accordance with the present invention; （ａ）図１に示す切削手段の一部斜視図、（ｂ）（ａ）に示す状態から切削水供給部を跳ね上げた状態を示す斜視図、（ｃ）（ｂ）に示す状態から切削ブレードを取り外した状態を示す斜視図。(a) A partial perspective view of the cutting means shown in Fig. 1, (b) A perspective view showing a state in which the cutting water supply section is flipped up from the state shown in (a), (c) Cutting from the state shown in (b) A perspective view showing a state in which the blade is removed. 図１に示す切削手段の一部断面図。FIG. 2 is a partial sectional view of the cutting means shown in FIG. 1;

以下、本発明に従って構成された切削装置の好適実施形態について図面を参照しつつ説明する。 Hereinafter, preferred embodiments of a cutting device configured according to the present invention will be described with reference to the drawings.

図１に示す切削装置２は、被加工物を保持する保持手段４と、保持手段４に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段６と、切削ブレードと被加工物に切削水を供給する切削水供給手段８（図２参照）と、保持手段４と切削手段６とを相対的に加工送りする送り手段１０と、を含む。なお、図１には、互いに直交するＸ軸方向、Ｙ軸方向、Ｚ軸方向がそれぞれ矢印Ｘ、Ｙ、Ｚで示されている。Ｘ軸方向およびＹ軸方向が規定する平面は実質上水平である。 The cutting device 2 shown in FIG. 1 includes a holding means 4 for holding a workpiece, and a cutting means rotatably supporting a cutting blade having a cutting blade on the outer periphery for cutting the workpiece held by the holding means 4. 6, a cutting water supply means 8 (see FIG. 2) that supplies cutting water to the cutting blade and the workpiece, and a feeding means 10 that relatively feeds the holding means 4 and the cutting means 6 for processing. In FIG. 1, the X-axis direction, Y-axis direction, and Z-axis direction, which are perpendicular to each other, are indicated by arrows X, Y, and Z, respectively. The plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

保持手段４は、Ｘ軸方向に移動自在に基板１２に搭載されたＸ軸可動板１４と、Ｘ軸可動板１４の上面に固定された支柱１６と、支柱１６の上端に固定されたカバー板１８とを備える。カバー板１８には円形開口１８ａが形成され、円形開口１８ａを通って上方に延びるチャックテーブル２０が支柱１６の上端に回転自在に搭載されている。チャックテーブル２０は、支柱１６に内蔵されたチャックテーブル用モータ（図示していない。）によって上下方向に延びる軸線を中心として回転される。 The holding means 4 includes an X-axis movable plate 14 mounted on a substrate 12 so as to be movable in the X-axis direction, a column 16 fixed to the upper surface of the X-axis movable plate 14, and a cover plate fixed to the upper end of the column 16. 18. A circular opening 18a is formed in the cover plate 18, and a chuck table 20 extending upward through the circular opening 18a is rotatably mounted on the upper end of the support column 16. The chuck table 20 is rotated about an axis extending in the vertical direction by a chuck table motor (not shown) built into the support column 16.

チャックテーブル２０の上端部分には、吸引手段（図示していない。）に接続された多孔質の円形状の吸着チャック２２が配置されている。そして、チャックテーブル２０においては、吸引手段で吸着チャック２２の上面に吸引力を生成することにより、吸着チャック２２の上面に載せられた被加工物を吸引保持するようになっている。また、チャックテーブル２０の周縁には、周方向に間隔をおいて複数のクランプ２４が配置されている。 A porous circular suction chuck 22 connected to a suction means (not shown) is disposed at the upper end of the chuck table 20. The suction means generates a suction force on the upper surface of the suction chuck 22, so that the workpiece placed on the upper surface of the suction chuck 22 is sucked and held by the chuck table 20. In addition, a number of clamps 24 are disposed at intervals around the periphery of the chuck table 20.

図示の実施形態の切削手段６は、互いにＹ軸方向に間隔をおいて切削ブレードが対向するように２個配設された第一の切削手段６ａおよび第二の切削手段６ｂを有している。図示の実施形態の切削手段６においては、保持手段４に保持された被加工物を２個の切削ブレードによって同時に切削加工を施すことができるようになっている。図２および図３を参照して説明すると、第一の切削手段６ａは、回転軸２６（図３参照）と、回転軸２６を回転可能に支持するハウジング２８と、回転軸２６の先端に形成され切削ブレード３０を保持するマウント３２と、から少なくとも構成されている。 The cutting means 6 of the illustrated embodiment includes a first cutting means 6a and a second cutting means 6b, which are arranged such that two cutting blades face each other and are spaced from each other in the Y-axis direction. . In the cutting means 6 of the illustrated embodiment, the workpiece held by the holding means 4 can be simultaneously cut by two cutting blades. Referring to FIGS. 2 and 3, the first cutting means 6a includes a rotating shaft 26 (see FIG. 3), a housing 28 that rotatably supports the rotating shaft 26, and a housing 28 formed at the tip of the rotating shaft 26. and a mount 32 for holding the cutting blade 30.

回転軸２６の他端には、回転軸２６を回転させるためのモータ（図示していない。）が連結されている。図２に示すとおり、ハウジング２８の先端にはブレードカバー３４が装着されている。ブレードカバー３４は、ハウジング２８の先端に固定された主部３６と、主部３６に揺動自在に支持された可動部３８とを含む。切削ブレード３０は、円筒状の基台４０と、基台４０の片側面の外周部に装着された環状の切り刃４２とを有する。基台４０の中央部には円形状の開口４０ａが形成されている。なお、図３においては、便宜上、ブレードカバー３４を省略している。 A motor (not shown) for rotating the rotating shaft 26 is connected to the other end of the rotating shaft 26. As shown in FIG. 2, a blade cover 34 is attached to the tip of the housing 28. The blade cover 34 includes a main part 36 fixed to the tip of the housing 28 and a movable part 38 supported by the main part 36 so as to be freely swingable. The cutting blade 30 has a cylindrical base 40 and an annular cutting blade 42 attached to the outer periphery of one side of the base 40. A circular opening 40a is formed in the center of the base 40. For convenience, the blade cover 34 is omitted from FIG. 3.

図３を参照して説明を続けると、マウント３２は、切削ブレード３０の中央に形成された開口４０ａに挿入されるボス部４４と、ボス部４４の外周に形成され切削ブレード３０の切り刃４２を露出させて支持するリング状の支持部４６と、ボス部４４と支持部４６との間に開口し切削ブレード３０を吸引保持する吸引孔５０と、吸引孔５０を吸引源５２に連通する連通路５４とを含む。 Continuing the description with reference to FIG. 3, the mount 32 includes a boss portion 44 that is inserted into an opening 40a formed in the center of the cutting blade 30, and a boss portion 44 that is formed on the outer periphery of the boss portion 44 and a cutting edge 42 of the cutting blade 30. a ring-shaped support part 46 that exposes and supports the cutting blade 30; a suction hole 50 that is opened between the boss part 44 and the support part 46 and holds the cutting blade 30 under suction; and a communication hole that communicates the suction hole 50 with a suction source 52. passage 54.

ボス部４４は円柱状に形成されており、ボス部４４の直径は切削ブレード３０の基台４０の開口４０ａの直径に対応している。支持部４６の外径は切削ブレード３０の切り刃４２の外径よりも小さく、マウント３２に切削ブレード３０が装着された際に、マウント３２から切り刃４２が露出するようになっている。また、支持部４６のＹ軸方向先端面は、ボス部４４のＹ軸方向先端面よりも後退している。 The boss portion 44 is formed in a cylindrical shape, and the diameter of the boss portion 44 corresponds to the diameter of the opening 40a of the base 40 of the cutting blade 30. The outer diameter of the support portion 46 is smaller than the outer diameter of the cutting blade 42 of the cutting blade 30, so that the cutting blade 42 is exposed from the mount 32 when the cutting blade 30 is mounted on the mount 32. Further, the tip end surface of the support portion 46 in the Y-axis direction is set back from the tip surface of the boss portion 44 in the Y-axis direction.

ボス部４４と支持部４６との間には、支持部４６の先端よりもＹ軸方向に更に後退した環状凹所４８が設けられており、この環状凹所４８には、切削ブレード３０を吸引保持するための吸引孔５０が形成されている。図示の実施形態のマウント３２には一対の吸引孔５０が設けられている。吸引孔５０は１個でもよいが、回転バランスを良好にするために等角度間隔で２個以上形成されているのが好ましい。図３に示すとおり、各吸引孔５０は吸引源５２に連通路５４を介して連通している。連通路５４には、連通路５４内の圧力を計測する圧力計５６と、連通路５４を開閉するためのバルブ５８とが配設されている。そして、マウント３２においては、バルブ５８を開けた状態で吸引源５２を作動することにより、ボス部４４に嵌め合わされた切削ブレード３０を吸引保持するようになっている。 Between the boss 44 and the support 46, there is provided an annular recess 48 that is further back in the Y-axis direction than the tip of the support 46, and this annular recess 48 is formed with a suction hole 50 for suction-holding the cutting blade 30. The mount 32 in the illustrated embodiment is provided with a pair of suction holes 50. Although one suction hole 50 may be provided, it is preferable to form two or more suction holes 50 at equal angular intervals in order to improve rotational balance. As shown in FIG. 3, each suction hole 50 communicates with the suction source 52 via a communication passage 54. The communication passage 54 is provided with a pressure gauge 56 for measuring the pressure in the communication passage 54 and a valve 58 for opening and closing the communication passage 54. In the mount 32, the suction source 52 is operated with the valve 58 open to suction-hold the cutting blade 30 fitted to the boss 44.

また、第一の切削手段６ａは、図１に示すとおり、Ｙ軸方向に移動自在に適宜の支持部材（図示していない。）に支持されたＹ軸可動片６０と、Ｚ軸方向に移動自在にＹ軸可動片６０に支持されたＺ軸可動片６２とを含む。Ｚ軸可動片６２の下端には、上記ハウジング２８が固定されている。なお、第二の切削手段６ｂについては、第一の切削手段６ａと同一の構成でよいので第一の切削手段６ａの構成と同一の符号を付し、説明を省略する。 1, the first cutting means 6a includes a Y-axis movable piece 60 supported by an appropriate support member (not shown) so as to be movable in the Y-axis direction, and a Z-axis movable piece 62 supported by the Y-axis movable piece 60 so as to be movable in the Z-axis direction. The housing 28 is fixed to the lower end of the Z-axis movable piece 62. The second cutting means 6b may have the same configuration as the first cutting means 6a, so it is given the same reference numerals as the configuration of the first cutting means 6a and a description thereof will be omitted.

図２を参照して切削水供給手段８について説明する。切削水供給手段８は、ブレードカバー３４の主部３６に付設された円筒状の供給口６４と、供給口６４に連通する一対のノズル６６とを含む。供給口６４は切削水供給源（図示していない。）に連通しており、供給口６４と切削水供給源とを連通する水路（図示していない。）には、この水路を開閉するバルブ（図示していない。）が設けられている。図２（ｂ）および図２（ｃ）に示すとおり、ノズル６６には複数の噴射孔６８が形成されている。そして、切削水供給手段８においては、保持手段４に保持された被加工物に切削手段６によって切削加工を施す際に、切削水供給源から供給口６４に供給された切削水をノズル６６の噴射孔６８から切削水を切削ブレード３０および被加工物に向かって噴射するようになっている。 The cutting water supply means 8 will be described with reference to FIG. 2. The cutting water supply means 8 includes a cylindrical supply port 64 attached to the main portion 36 of the blade cover 34 and a pair of nozzles 66 communicating with the supply port 64. The supply port 64 communicates with a cutting water supply source (not shown), and a water passage (not shown) communicating the supply port 64 with the cutting water supply source is provided with a valve (not shown) for opening and closing the water passage. As shown in FIG. 2(b) and FIG. 2(c), the nozzle 66 has a plurality of injection holes 68. In the cutting water supply means 8, when the cutting means 6 cuts the workpiece held by the holding means 4, the cutting water supplied to the supply port 64 from the cutting water supply source is injected from the injection holes 68 of the nozzle 66 toward the cutting blade 30 and the workpiece.

図３に示すとおり、圧力計５６には、切削装置２の作動を制御する制御手段７０が電気的に接続されており、圧力計５６で計測した値が制御手段７０に送られるようになっている。コンピュータから構成されている制御手段７０は、制御プログラムに従って演算処理する中央処理装置（ＣＰＵ）と、制御プログラム等を格納するリードオンリメモリ（ＲＯＭ）と、演算結果等を格納する読み書き可能なランダムアクセスメモリ（ＲＡＭ）とを有する（いずれも図示していない。）。そして、制御手段７０は、圧力計５６が計測した値が許容値に達しない場合は回転軸２６の回転開始および切削水の供給開始を阻止し、圧力計５６が計測した値が許容値に達した場合は回転軸２６の回転開始を許容すると共に回転軸２６の回転開始時以降において切削水の供給開始を許容するようになっている。 As shown in FIG. 3, the pressure gauge 56 is electrically connected to a control means 70 for controlling the operation of the cutting device 2, and the value measured by the pressure gauge 56 is sent to the control means 70. There is. The control means 70, which is composed of a computer, includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program, etc., and a read/write random access memory that stores the calculation results, etc. and a memory (RAM) (none of which is shown). The control means 70 prevents the rotation of the rotating shaft 26 and the start of supply of cutting water when the value measured by the pressure gauge 56 does not reach the allowable value, and prevents the value measured by the pressure gauge 56 from reaching the allowable value. In this case, the rotation of the rotating shaft 26 is allowed to start, and the supply of cutting water is allowed to start after the rotation of the rotating shaft 26 starts.

図示の実施形態の送り手段１０は、図１に示すとおり、Ｘ軸送り手段７２と、基台１２をまたいで配設された門型フレーム（図示せず）に配設された第一・第二のＹ軸送り手段７４ａ、７４ｂと、第一・第二のＺ軸送り手段７６ａ、７６ｂとを含む。Ｘ軸送り手段７２は、Ｘ軸可動板１４に連結されＸ軸方向に延びるボールねじ７８と、ボールねじ７８を回転させるモータ８０とを有する。そして、Ｘ軸送り手段７２は、ボールねじ７８によりモータ８０の回転運動を直線運動に変換してＸ軸可動板１４に伝達し、切削手段６に対して保持手段４をＸ軸方向に相対的に加工送りする。 As shown in FIG. 1, the feeding means 10 of the illustrated embodiment includes an X-axis feeding means 72, and first and second It includes two Y-axis feeding means 74a, 74b and first and second Z-axis feeding means 76a, 76b. The X-axis feeding means 72 includes a ball screw 78 that is connected to the X-axis movable plate 14 and extends in the X-axis direction, and a motor 80 that rotates the ball screw 78. The X-axis feeding means 72 converts the rotational motion of the motor 80 into a linear motion using a ball screw 78 and transmits the linear motion to the X-axis movable plate 14, and holds the holding means 4 relative to the cutting means 6 in the X-axis direction. Send it for processing.

第一のＹ軸送り手段７４ａは、Ｙ軸可動片６０に連結されＹ軸方向に延びるボールねじ８２と、ボールねじ８２を回転させるモータ８４とを有する。そして、第一のＹ軸送り手段７４ａは、ボールねじ８２によりモータ８４の回転運動を直線運動に変換してＹ軸可動片６０に伝達し、保持手段４に対して第一の切削手段６ａをＹ軸方向に相対的に加工送り（割り出し送り）する。また、第一のＹ軸送り手段７４ａにおいてはモータ８４がボールねじ８２のＹ軸方向一端部に接続されている一方、第二のＹ軸送り手段７４ｂにおいてはモータ８４がボールねじ８４のＹ軸方向他端部に接続されている点を除き、第二のＹ軸送り手段７４ｂは第一のＹ軸送り手段７４ａと同一の構成でよい。そして、第二のＹ軸送り手段７４ｂは、保持手段４に対して第二の切削手段６ｂをＹ軸方向に相対的に加工送り（割り出し送り）する。 The first Y-axis feeding means 74a includes a ball screw 82 that is connected to the Y-axis movable piece 60 and extends in the Y-axis direction, and a motor 84 that rotates the ball screw 82. The first Y-axis feeding means 74a converts the rotational motion of the motor 84 into linear motion using the ball screw 82 and transmits the linear motion to the Y-axis movable piece 60. Perform processing feed (index feed) relatively in the Y-axis direction. Further, in the first Y-axis feeding means 74a, the motor 84 is connected to one end of the ball screw 82 in the Y-axis direction, while in the second Y-axis feeding means 74b, the motor 84 is connected to the Y-axis of the ball screw 84. The second Y-axis feeding means 74b may have the same configuration as the first Y-axis feeding means 74a, except that it is connected to the other end in the direction. The second Y-axis feeding means 74b processes and feeds the second cutting means 6b relative to the holding means 4 in the Y-axis direction (index feeding).

第一のＺ軸送り手段７６ａは、Ｚ軸可動片６２に連結されＺ軸方向に延びるボールねじ（図示していない。）と、このボールねじを回転させるモータ８６とを有する。そして、第一のＺ軸送り手段７６ａは、ボールねじによりモータ８６の回転運動を直線運動に変換してＺ軸可動片６２に伝達し、保持手段４に対して第一の切削手段６ａをＺ軸方向に相対的に加工送り（切り込み送り）する。また、第一のＺ軸送り手段７６ａと同一の構成でよい第二のＺ軸送り手段７６ｂは、保持手段４に対して第二の切削手段６ｂをＺ軸方向に相対的に加工送り（切り込み送り）する。 The first Z-axis feed means 76a has a ball screw (not shown) that is connected to the Z-axis movable piece 62 and extends in the Z-axis direction, and a motor 86 that rotates the ball screw. The first Z-axis feed means 76a converts the rotational motion of the motor 86 into linear motion using the ball screw and transmits it to the Z-axis movable piece 62, feeding (cutting) the first cutting means 6a in the Z-axis direction relative to the holding means 4. The second Z-axis feed means 76b, which may have the same configuration as the first Z-axis feed means 76a, feeds (cuts) the second cutting means 6b in the Z-axis direction relative to the holding means 4.

上述したとおりの切削装置２では、第一の切削手段６ａまたは第二の切削手段６ｂのいずれかにおいて、マウント３２と切削ブレード３０との間に異物等が介在していると、マウント３２と切削ブレード３０との間に隙間が生じ、この隙間から連通路５４内に空気が流入するため、連通路５４内の圧力が許容値（たとえば、絶対圧０．０３ＭＰａ程度）まで下がらず、マウント３２が切削ブレード３０を保持する吸引力が所要値に達することがない。したがって、圧力計５６が計測した値が許容値に達しない場合に制御手段７０は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始および切削水の供給開始を阻止する。 In the cutting device 2 as described above, if a foreign object is present between the mount 32 and the cutting blade 30 in either the first cutting means 6a or the second cutting means 6b, the mount 32 and the cutting blade 30 may be interposed. A gap is created between the blade 30 and the air flows into the communication path 54 from this gap, so the pressure in the communication path 54 does not fall to the allowable value (for example, about 0.03 MPa absolute pressure), and the mount 32 The suction force holding the cutting blade 30 never reaches the required value. Therefore, when the value measured by the pressure gauge 56 does not reach the allowable value, the control means 70 prevents the rotation shafts 26 of both the first and second cutting means 6a and 6b from starting to rotate and from starting the supply of cutting water. do.

一方、第一・第二の切削手段６ａ、６ｂの双方において、マウント３２と切削ブレード３０との間に異物等が介在していない場合、切削ブレード３０をマウント３２に吸引保持（装着）させた際に、マウント３２の支持部４６と切削ブレード３０とが密着することになる。そうすると、連通路５４内の圧力が許容値まで下がり、所要の吸引力で切削ブレード３０がマウント３２に保持される。したがって、圧力計５６が計測した値が許容値に達した場合に制御手段７０は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始を許容すると共に、双方の回転軸２６の回転開始時以降において切削水の供給開始を許容する。 On the other hand, in both the first and second cutting means 6a, 6b, if there is no foreign matter between the mount 32 and the cutting blade 30, when the cutting blade 30 is suction-held (attached) to the mount 32, the support part 46 of the mount 32 and the cutting blade 30 will come into close contact with each other. Then, the pressure in the communication passage 54 drops to an allowable value, and the cutting blade 30 is held to the mount 32 with the required suction force. Therefore, when the value measured by the pressure gauge 56 reaches the allowable value, the control means 70 allows the rotation shafts 26 of both the first and second cutting means 6a, 6b to start rotating, and allows the supply of cutting water to start after both rotation shafts 26 start rotating.

このように図示の実施形態の切削装置２においては、いずれか一方の圧力計５６が計測した値が許容値に達しない場合は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始および切削水の供給開始を阻止し、双方の圧力計５６が計測した値が許容値に達した場合は、第一・第二の切削手段６ａ、６ｂの双方の回転軸２６の回転開始を許容すると共に、双方の回転軸２６の回転開始時以降において切削水の供給開始を許容する制御手段７０を備えるので、マウント３２と切削ブレード３０との間に異物が介在し充分な吸引力が得られない場合には切削加工が開始されないため、ウエーハおよび切削ブレード３０を損傷させることがない。 In this way, in the cutting device 2 of the illustrated embodiment, if the value measured by one of the pressure gauges 56 does not reach the allowable value, the rotation shafts of both the first and second cutting means 6a, 6b 26 and the supply of cutting water, and when the values measured by both pressure gauges 56 reach the allowable value, the rotation shafts 26 of both the first and second cutting means 6a, 6b are stopped. Since it is provided with a control means 70 that allows the start of rotation and also allows the start of supply of cutting water after the start of rotation of both rotating shafts 26, there is no possibility that foreign matter will be present between the mount 32 and the cutting blade 30 and sufficient suction will be achieved. Since cutting is not started if no force is obtained, the wafer and cutting blade 30 will not be damaged.

また、切削装置２においては、回転軸２６の回転開始時以降において切削水の供給開始を許容するので、マウント３２および切削ブレード３０に切削水および切削水が付着しても、マウント３２および切削ブレード３０の遠心力によって切削水および切削屑が吹き飛ばされ、マウント３２と切削ブレード３０との間の僅かな隙間から切削水と共に切削屑が吸引されることがない。 Further, in the cutting device 2, the supply of cutting water is allowed to start after the rotation of the rotating shaft 26 starts, so even if the cutting water and the cutting water adhere to the mount 32 and the cutting blade 30, the mount 32 and the cutting blade Cutting water and cutting waste are blown away by the centrifugal force of 30, and the cutting waste is not sucked together with the cutting water from the small gap between the mount 32 and the cutting blade 30.

また、切削装置２においては、第一・第二の切削手段６ａ、６ｂのいずれか一方のみによって、保持手段４に保持された被加工物を切削するときがある。このようなとき、制御手段７０は、双方の圧力計５６が計測した値が許容値に達した状態で双方のマウント３２に切削ブレード３０が装着されている場合に、第一・第二の切削手段６ａ、６ｂの一方のみによる被加工物の切削を許容すると共に、第一・第二の切削手段６ａ、６ｂの他方の回転軸２６を回転させる。 Further, in the cutting device 2, there are times when the workpiece held by the holding means 4 is cut by only one of the first and second cutting means 6a, 6b. In such a case, the control means 70 controls the first and second cutting blades when the cutting blades 30 are attached to both mounts 32 with the values measured by both pressure gauges 56 reaching the allowable value. Cutting of the workpiece by only one of the means 6a, 6b is allowed, and the other rotating shaft 26 of the first and second cutting means 6a, 6b is rotated.

これによって、一方の切削手段６の切削によって発生する切削屑が他方の切削手段６のマウント３２に付着してマウント３２が汚染されることがない。すなわち、圧力計５６が計測した値が許容値に達した状態で他方の切削手段６のマウント３２に切削ブレード３０が装着されていることによって、他方の切削手段６のマウント３２への切削屑の付着が防止される。 This prevents cutting chips generated by cutting with one cutting means 6 from adhering to the mount 32 of the other cutting means 6 and contaminating the mount 32. In other words, by attaching the cutting blade 30 to the mount 32 of the other cutting means 6 when the value measured by the pressure gauge 56 reaches the allowable value, adhesion of cutting chips to the mount 32 of the other cutting means 6 is prevented.

また、他方の切削手段６の切削ブレード３０がマウント３２に装着されていても、一方の切削手段６の切削によって発生する切削屑が切削ブレード３０とマウント３２との僅かな隙間から吸引されることがない。すなわち、他方の切削手段６の回転軸２６を回転させることで、回転による遠心力によってマウント３２と切削ブレード３０との僅かな隙間から切削屑が吸引されることが防止される。 In addition, even if the cutting blade 30 of the other cutting means 6 is attached to the mount 32, cutting chips generated by cutting with one cutting means 6 are not sucked in through the small gap between the cutting blade 30 and the mount 32. In other words, by rotating the rotating shaft 26 of the other cutting means 6, the centrifugal force caused by the rotation prevents cutting chips from being sucked in through the small gap between the mount 32 and the cutting blade 30.

なお、図示の実施形態の切削装置２において切削手段６を２個備える例を説明したが、切削手段６は１個であってもよい。 Although an example in which the cutting device 2 of the illustrated embodiment includes two cutting means 6 has been described, the number of cutting means 6 may be one.

２：切削装置
４：保持手段
６：切削手段
６ａ：第一の切削手段
６ｂ：第二の切削手段
８：切削水供給手段
１０：送り手段
２６：回転軸
２８：ハウジング
３０：切削ブレード
３２：マウント
４２：切り刃
４４：ボス部
４６：支持部
５０：吸引孔
５２：吸引源
５４：連通路
５６：圧力計
７０：制御手段 2: Cutting device 4: Holding means 6: Cutting means 6a: First cutting means 6b: Second cutting means 8: Cutting water supply means 10: Feeding means 26: Rotating shaft 28: Housing 30: Cutting blade 32: Mount 42: Cutting edge 44: Boss portion 46: Support portion 50: Suction hole 52: Suction source 54: Communication passage 56: Pressure gauge 70: Control means

Claims (1)

被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該切削ブレードと被加工物に切削水を供給する切削水供給手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含む切削装置であって、
該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され該切削ブレードを保持するマウントと、から少なくとも構成され、
該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、
該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始および切削水の供給開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容すると共に該回転軸の回転開始時以降において切削水の供給開始を許容する制御手段を備え、
該切削手段は、該切削ブレードが対向するように２個配設され、
該制御手段は、該圧力計が計測した値が許容値に達した状態で双方の該切削手段の該マウントに該切削ブレードが装着されている場合に、一方の該切削手段のみによる該保持手段に保持された被加工物の切削を許容すると共に、他方の該切削手段の該回転軸を回転させる切削装置。 A cutting device including: a holding means for holding a workpiece; a cutting means for rotatably supporting a cutting blade having a cutting edge on its outer periphery for cutting the workpiece held by the holding means; a cutting water supplying means for supplying cutting water to the cutting blade and the workpiece; and a feeding means for feeding the holding means and the cutting means relatively for processing,
The cutting means is at least composed of a rotating shaft, a housing that rotatably supports the rotating shaft, and a mount that is formed at a tip of the rotating shaft and holds the cutting blade;
The mount includes a boss portion inserted into an opening formed in the center of the cutting blade, a ring-shaped support portion formed on the outer periphery of the boss portion for supporting the cutting edge of the cutting blade while exposing it, a suction hole opening between the boss portion and the support portion for suction-holding the cutting blade, and a communication passage connecting the suction hole to a suction source,
a control means for preventing the start of rotation of the rotating shaft and the start of supply of cutting water when a value measured by the pressure gauge does not reach an allowable value, and for allowing the start of rotation of the rotating shaft and allowing the start of supply of cutting water after the start of rotation of the rotating shaft when the value measured by the pressure gauge reaches the allowable value ;
The cutting means includes two cutting blades arranged opposite to each other,
The control means is a cutting device that allows cutting of the workpiece held by the holding means by only one of the cutting means when the cutting blades are attached to the mounts of both cutting means and the value measured by the pressure gauge reaches an allowable value, and rotates the rotation shaft of the other cutting means .
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TW109141260A TW202120257A (en) 2019-11-27 2020-11-25 Cutting device which does not damage a wafer and a cutting blade and does not suck cutting water and cutting debris from the position between a fixing base and a cutting blade
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JP2015023222A (en) 2013-07-22 2015-02-02 株式会社ディスコ Cutting apparatus
JP2015023139A (en) 2013-07-18 2015-02-02 株式会社ディスコ Cutting device
JP2016111173A (en) 2014-12-05 2016-06-20 株式会社ディスコ Cutting device
JP2018010952A (en) 2016-07-13 2018-01-18 株式会社ディスコ Cutting apparatus
JP2019104068A (en) 2017-12-08 2019-06-27 株式会社ディスコ Cutting device

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JP2002154054A (en) 2000-11-17 2002-05-28 Disco Abrasive Syst Ltd Attaching mechanism for cutting blade

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JP2015023139A (en) 2013-07-18 2015-02-02 株式会社ディスコ Cutting device
JP2015023222A (en) 2013-07-22 2015-02-02 株式会社ディスコ Cutting apparatus
JP2016111173A (en) 2014-12-05 2016-06-20 株式会社ディスコ Cutting device
JP2018010952A (en) 2016-07-13 2018-01-18 株式会社ディスコ Cutting apparatus
JP2019104068A (en) 2017-12-08 2019-06-27 株式会社ディスコ Cutting device

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