TW202040231A - Substrate dividing method and substrate dividing device do not easily produce chippings to improve accuracy of end surface of the substrate - Google Patents

Abstract

The invention provides a substrate dividing method capable of precisely dividing a substrate without complicated devices. The substrate dividing method includes a step of forming a scribing line S along a predetermined dividing line of a brittle material substrate W; and a step of enabling a surface of the scribing line S to generate compression and expansion through a breaking p bar 44 that nearly presses blade shape in parallel at the vicinity of the scribing line S so as to divide the brittle material substrate W along the scribe line S.

Description

基板分斷方法及基板分斷裝置 Substrate breaking method and substrate breaking device

本發明係有關一種實施於用以將使用在平板顯示器(flat panel display；FPD)的顯示面板基板之玻璃基板等脆性材料基板分斷成複數個基板的基板分斷方法及基板分斷裝置。 The present invention relates to a substrate breaking method and a substrate breaking device for breaking a brittle material substrate such as a glass substrate used in a flat panel display (FPD) display panel substrate into a plurality of substrates.

液晶顯示裝置等顯示面板基板一般係使用屬於脆性材料基板之玻璃基板所製成。液晶顯示裝置係透過使一對玻璃基板形成適當的間隔且使之貼合，並將液晶封入在其間隔內而製成。 Display panel substrates such as liquid crystal display devices are generally made of glass substrates that are brittle material substrates. The liquid crystal display device is manufactured by forming a pair of glass substrates at an appropriate interval, bonding them together, and sealing the liquid crystal in the interval.

在製造如此之顯示面板基板的情況下，係實施透過分斷貼合基板(使一對的基板W貼合而成的基板)來製作複數個顯示面板基板的方法(參考例如發明專利文獻1)。 In the case of manufacturing such a display panel substrate, a method of manufacturing a plurality of display panel substrates by splitting the bonded substrate (a substrate formed by bonding a pair of substrates W) is implemented (see, for example, Patent Document 1) .

[發明專利文獻1]日本特開平第6-48755號公報。 [Patent Document 1 of Invention] Japanese Patent Application Laid-Open No. 6-48755.

在習知的貼合基板之分斷方法中係需要以下步驟：為了分斷一側的基 板W而使貼合基板的正反面翻轉的翻轉步驟；穿透一側的基板W經刻劃所生成的垂直裂痕(crack)，以將一側的基板W進行分斷的斷開(break)步驟。然其具有構成包括有這些步驟的基板分斷裝置的結構複雜，且其設置面積會變得很大的問題。 In the conventional breaking method of bonded substrates, the following steps are required: In order to break the substrate on one side A reversing step in which the front and back surfaces of the bonded substrates are turned over by the board W; the vertical cracks generated by the scribing of the substrate W on one side to break the substrate W on one side step. However, it has a problem that the structure of the substrate cutting device including these steps is complicated, and the installation area becomes large.

更進一步地，習知的斷開步驟所使用的方法，亦即在自基板的反面側沿著刻劃道按壓基板進行分斷的方法中，由於基板會被彎曲再行分斷，因此在分斷後的基板之分斷面上容易產生碎屑等瑕疵。 Furthermore, the conventional method used in the breaking step, that is, in the method of pressing the substrate from the reverse side of the substrate along the scoring path for breaking, since the substrate is bent and then broken, Defects such as chips are prone to occur on the broken surface of the broken substrate.

本發明之目的係在基板分斷方法中，不需複雜的裝置即將基板高精度地進行分斷。 The purpose of the present invention is to cut the substrate with high precision without requiring a complicated device.

以下係對作為解決課題之技術手段的複數個態樣來作說明。該些態樣係可因應需求而任意地組合。 The following is a description of the plural aspects of the technical means to solve the problem. These aspects can be combined arbitrarily according to requirements.

有關於本發明的一態樣之基板分斷方法係具備以下的步驟： The substrate breaking method related to one aspect of the present invention includes the following steps:

◎沿著脆性材料基板的預定分斷道形成刻劃道的步驟。 ◎The step of forming scribe lanes along the predetermined breaking lanes of the brittle material substrate.

◎透過在刻劃道的附近幾乎平行地按壓刀刃形狀的斷開桿，使刻劃道之表面產生壓縮膨脹，並藉此將脆性材料基板沿著刻劃道進行分斷的步驟。 ◎The step of pressing the blade-shaped breaking rod almost parallel to the scribe lane to compress and expand the surface of the scribe lane, thereby breaking the brittle material substrate along the scribe lane.

在本方法中，可藉由以斷開桿按住形成有刻劃道之基板表面而分斷基板。因此，與習知技術不同之處，在於不需要將基板翻轉並由基板反面進行斷開。 In this method, the substrate can be divided by pressing the surface of the substrate on which the scribed channel is formed with a breaking rod. Therefore, it is different from the prior art in that it does not need to be turned over and disconnected from the reverse side of the substrate.

特別是基板的分斷並非將基板彎曲，而是藉由基板的刻劃道之表面所產生的壓縮膨脹而成，因此分斷只要一瞬間就完成。其結果係不易產生碎屑(chipping)等，故提升了基板的端面之精度。 In particular, the breaking of the substrate is not made by bending the substrate, but by compression and expansion generated on the surface of the scribed path of the substrate, so the breaking can be completed in an instant. As a result, chipping and the like are less likely to be generated, so the accuracy of the end surface of the substrate is improved.

亦可透過刻劃道的形成而沿著預定分斷道形成將基板的表面作為基部的垂直裂痕。 It is also possible to form a vertical crack with the surface of the substrate as a base along the predetermined dividing line by forming the scribe line.

亦可透過斷開桿的按壓使垂直裂痕的基板之表面部位產生壓縮力，並藉此使基板的底面部位產生張力，使得垂直裂痕穿透至該基板的底面部位，以分斷基板。 It is also possible to press the breaking rod to generate a compressive force on the surface part of the substrate of the vertical crack, and thereby generate tension on the bottom part of the substrate, so that the vertical crack penetrates to the bottom part of the substrate to break the substrate.

在此方法中，由於基板的分斷並非將基板彎曲，而是藉由基板的刻劃道之表面所產生的壓縮膨脹而成，因此分斷只要一瞬間就完成。其結果係不易產生碎屑(chipping)等，故提升了基板的端面之精度。 In this method, since the breaking of the substrate is not bending the substrate, but is formed by compression and expansion generated on the surface of the scribed path of the substrate, the breaking can be completed in an instant. As a result, chipping and the like are less likely to be generated, so the accuracy of the end surface of the substrate is improved.

斷開桿的按壓位置亦可形成在與刻劃道隔開0.5mm以下的間隔之處。 The pressing position of the breaking rod may also be formed at a distance of 0.5 mm or less from the scribe lane.

於此方法中，刻劃道係確實地被分斷。 In this method, the scribe system is definitely broken.

脆性材料基板亦可為包括兩片基板的貼合基板。 The brittle material substrate may also be a bonded substrate including two substrates.

於形成刻劃道的步驟中，亦可沿著兩片基板的預定分斷道分別形成刻劃道。 In the step of forming the scribe lanes, the scribe lanes may also be formed along the predetermined dividing lanes of the two substrates.

於分斷脆性材料基板的步驟中，亦可透過在兩片基板之各個刻劃道的附近將各個斷開桿從相反側按壓，以將兩片基板沿著各個刻劃道進行分斷。 In the step of breaking the brittle material substrate, it is also possible to separate the two substrates along each scribe lane by pressing each breaking rod from the opposite side near each scribe lane of the two substrates.

於此方法中，能夠將兩片基板高精度地進行分斷。 In this method, two substrates can be divided with high precision.

於分斷脆性材料基板的步驟中，亦可透過在兩片基板之刻劃道的附近將斷開桿分別從相反側同時進行按壓，以將兩片基板沿著刻劃道同時進行分斷。 In the step of breaking the brittle material substrate, it is also possible to simultaneously separate the two substrates along the scoring path by pressing the breaking rods from opposite sides in the vicinity of the scoring path of the two substrates.

在此方法中，係得以同時分斷兩片基板。原因在於藉由將兩根斷開桿分別對兩片基板同時進行按壓，因此能夠不撓彎兩片基板，而是利用壓縮膨脹來完成分斷。 In this method, two substrates can be divided simultaneously. The reason is that by pressing the two breaking rods respectively on the two substrates at the same time, it is possible to not bend the two substrates, but use compression and expansion to complete the breaking.

有關於本發明的另一態樣之基板分斷裝置，係用以將形成有刻劃道的脆性材料基板沿著刻劃道來進行分斷的裝置，其具備按壓力產生部、斷開桿、以及扭矩機構。 A substrate cutting device related to another aspect of the present invention is a device for cutting a brittle material substrate formed with scribe lanes along the scribe lane, and includes a pressing force generating portion and a breaking rod , And torque mechanism.

斷開桿係用以透過在刻劃道的附近幾乎平行地進行按壓，而使刻劃道之表面產生壓縮膨脹，並藉此將脆性材料基板沿著刻劃道進行分斷之構件。 The breaking rod is a member used to compress and expand the surface of the scribed road by pressing almost parallel to the vicinity of the scribed road, thereby dividing the brittle material substrate along the scribed road.

扭矩機構係用以將來自按壓力產生部的按壓力傳遞至斷開桿的機構。 The torque mechanism is a mechanism for transmitting the pressing force from the pressing force generation unit to the disconnect lever.

在此裝置中，係藉由以斷開桿按住形成有刻劃道之基板表面，而得以分斷基板。藉此，與習知技術不同的是，本發明不需要翻轉基板並從基板的反面來進行斷開。 In this device, the substrate is broken by pressing the surface of the substrate on which the scribed channel is formed with a breaking rod. In this way, unlike the conventional technology, the present invention does not need to turn the substrate and disconnect from the reverse side of the substrate.

特別是基板的分斷並非將基板彎曲，而是藉由基板的刻劃道之表面所產生的壓縮膨脹而成，因此分斷只要一瞬間就完成。其結果係不易產生碎屑等，故提升了基板的端面之精度。 In particular, the breaking of the substrate is not made by bending the substrate, but by compression and expansion generated on the surface of the scribed path of the substrate, so the breaking can be completed in an instant. As a result, it is not easy to generate chips, etc., so the accuracy of the end face of the substrate is improved.

特別是在此裝置中，由於透過扭矩機構來增加按壓力，因此從斷開桿傳遞至基板的載重(load)會變得非常大。 Especially in this device, since the pressing force is increased by the torque mechanism, the load transmitted from the disconnect lever to the substrate becomes very large.

在本發明之基板分斷方法及基板分斷裝置中，係可高精度地將基板進行分斷。 In the substrate cutting method and substrate cutting device of the present invention, the substrate can be broken with high precision.

1:刻劃裝置 1: Scribing device

2:工作台 2: workbench

3:移動台 3: mobile station

5a,5b:軌道 5a, 5b: track

6:馬達 6: Motor

7:滾珠螺桿 7: Ball screw

11:橋架 11: Bridge

12a,12b:支柱 12a, 12b: pillar

13:導件 13: guide

14:刻劃頭 14: Scribe head

15:夾持具接頭 15: clamp connector

16:夾持具單元 16: Gripper unit

20:刻劃輪，輪具 20: Scribing wheel, wheel tool

20A,20B:輪具 20A, 20B: Wheels

20a:刀部 20a: knife

31:斷開裝置 31: Disconnect device

32:工作台 32: Workbench

33:移動台 33: mobile station

35a,35b:軌道 35a, 35b: track

36:馬達 36: Motor

37:滾珠螺桿 37: Ball screw

41:橋架 41: Bridge

42a,42b:支柱 42a, 42b: pillar

44:斷開桿 44: Disconnect lever

44A:第1斷開桿 44A: 1st disconnect lever

44B:第2斷開桿 44B: 2nd disconnect lever

44a:刀部 44a: Knife

44b:稜線 44b: ridge

45:氣缸 45: cylinder

51:連接構件 51: connecting member

53,53A,53B:扭矩機構 53, 53A, 53B: Torque mechanism

53a:第1板件 53a: first plate

53b:第2板件 53b: 2nd plate

53c:第3板件 53c: 3rd board

61:控制器 61: Controller

D1:第1預定分斷道 D1: The first scheduled break

D2:第2預定分斷道 D2: The second scheduled break

D3:第3預定分斷道 D3: The third scheduled break

D4:第4預定分斷道 D4: The 4th scheduled sub-circuit

D5:第5預定分斷道 D5: The 5th scheduled break

D6:第6預定分斷道 D6: The sixth scheduled sub-circuit

D7:第7預定分斷道 D7: No. 7 scheduled sub-circuit

D8:第8預定分斷道 D8: The 8th scheduled sub-circuit

d:間隔 d: interval

P:按壓道 P: Press road

P1:第1按壓道 P1: First compression channel

P2:第2按壓道 P2: Second compression channel

P3:第3按壓道 P3: The third compression channel

P4:第4按壓道 P4: The fourth compression channel

P5:第5按壓道 P5: The fifth compression channel

P6:第6按壓道 P6: The sixth compression channel

P7:第7按壓道 P7: The seventh compression channel

P8:第8按壓道 P8: 8th compression channel

S:刻劃道 S: Scribe Road

S1:第1刻劃道 S1: The first score

S2:第2刻劃道 S2: The second score

S3:第3刻劃道 S3: The third score

S4:第4刻劃道 S4: 4th road

S5:第5刻劃道 S5: No. 5 Scribe Road

S6:第6刻劃道 S6: No. 6 road

S7:第7刻劃道 S7: The seventh track

S8:第8刻劃道 S8: No. 8 road

Vm,Vm1,Vm2:垂直裂痕 Vm, Vm1, Vm2: vertical crack

W:脆性材料基板，基板 W: brittle material substrate, substrate

W1:第1基板 W1: The first substrate

W2:第2基板 W2: Second substrate

Wa:基板 Wa: substrate

Ws:貼合基板 Ws: Laminated substrate

α1,α2:刀刃角 α1,α2: blade angle

圖1係刻劃裝置的立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the scoring device.

圖2係斷開裝置的立體示意圖。 Figure 2 is a perspective schematic view of the disconnect device.

圖3係斷開裝置的局部立體圖。 Figure 3 is a partial perspective view of the disconnect device.

圖4係斷開裝置的局部前視圖。 Figure 4 is a partial front view of the disconnect device.

圖5係斷開桿的立體圖。 Fig. 5 is a perspective view of the broken rod.

圖6係顯示斷開裝置的控制結構之方塊圖。 Figure 6 is a block diagram showing the control structure of the disconnect device.

圖7係基板的剖面示意圖。 Figure 7 is a schematic cross-sectional view of the substrate.

圖8係用以說明刻劃圖案的俯視圖。 FIG. 8 is a top view for explaining the scoring pattern.

圖9係實施態樣2的基板之剖面示意圖。 9 is a schematic cross-sectional view of the substrate of Embodiment 2.

1.實施態樣1 1. Implementation style 1

(1)刻劃裝置 (1) Scribing device

利用圖1來說明刻劃裝置1。圖1係刻劃裝置的立體示意圖。刻劃裝置1係用以將脆性材料基板W(以下稱為「基板W」)進行刻劃加工的裝置。基板W係例如玻璃基板、陶瓷基板、藍寶石基板、矽基板等。 The scoring device 1 will be explained using FIG. 1. Figure 1 is a three-dimensional schematic diagram of the scoring device. The scribing device 1 is a device for scribing a brittle material substrate W (hereinafter referred to as "substrate W"). The substrate W is, for example, a glass substrate, a ceramic substrate, a sapphire substrate, a silicon substrate, and the like.

刻劃裝置1係具備用以載置基板W的工作台2。工作台2係載置於移動台 3上，移動台3係能夠沿著水平的軌道(rail)5a、軌道5b移動，並藉由透過馬達(motor)6而旋轉的滾珠螺桿(ball screw)7來驅動。 The scribing device 1 includes a table 2 on which a substrate W is placed. Workbench 2 is placed on the mobile platform 3, the moving table 3 can move along horizontal rails 5a and 5b, and is driven by a ball screw 7 rotating through a motor 6.

此外，在以下的說明中係將軌道5a、軌道5b之延伸的水平方向作為Y方向，並將與其直交的水平方向作為X方向。 In addition, in the following description, the horizontal direction in which the rail 5a and the rail 5b extend is referred to as the Y direction, and the horizontal direction perpendicular thereto is referred to as the X direction.

工作台2係具備能夠將基板W保持在固定位置(fixed position)的保持手段(圖未示)。保持手段係例如從在工作台2上打洞而成的多數個小吸附孔(圖未示)之抽吸手段。 The table 2 is provided with a holding means (not shown) capable of holding the substrate W at a fixed position (fixed position). The holding means is, for example, a suction means formed from a plurality of small suction holes (not shown in the figure) formed by drilling holes in the worktable 2.

於刻劃裝置1中，橋架(bridge)11係以橫跨移動台3與工作台2的方式透過支柱12a、支柱12b沿著X軸方向而架設。 In the scribing device 1, a bridge 11 is erected along the X-axis direction through pillars 12a and 12b so as to straddle the moving platform 3 and the workbench 2.

在橋架11中係安裝有導件(guide)13，且刻劃頭(scribe head)14係沿著導件13以可沿著X軸方向移動的方式設置。接著，在刻劃頭14中，係經由夾持具接頭(holder joint)15而安裝夾持具單元(holder unit)16。 A guide 13 is installed in the bridge 11, and a scribe head 14 is arranged along the guide 13 in a manner movable along the X-axis direction. Next, in the scoring head 14, a holder unit 16 is installed via a holder joint 15.

夾持具單元16係具有夾持具(holder)(圖未示)以及刻劃輪(scribing wheel)20(圖7，以下稱為「輪具20」)。輪具20係旋轉自如地由夾持具所支撐。在輪具20上係形成有刀部20a。刀部20a之刀刃角α1一般呈鈍角，係在100°至140°之範圍，較佳地係在110°至130°之範圍。此外，刀刃角的具體角度係可依據欲切斷的脆性材料基板W之材質、厚度等而適當地設定。 The holder unit 16 has a holder (not shown in the figure) and a scribing wheel 20 (FIG. 7, hereinafter referred to as "wheel 20"). The wheel 20 is rotatably supported by the clamp. The wheel 20 is formed with a knife portion 20a. The cutting edge angle α1 of the knife portion 20a is generally obtuse, and is in the range of 100° to 140°, preferably in the range of 110° to 130°. In addition, the specific angle of the blade angle can be appropriately set according to the material and thickness of the brittle material substrate W to be cut.

(2)斷開裝置 (2) Disconnect device

(2-1)概要說明 (2-1) Summary description

利用圖2來說明斷開裝置31(基板分斷裝置的一示例)。圖2係斷開裝置的 立體示意圖。此外，由於圖2係用以概要說明的圖式，故將其適當地簡化，因此具有與後述的圖3至圖5不同的部分。 The breaking device 31 (an example of a substrate breaking device) will be explained using FIG. 2. Figure 2 of the disconnect device Three-dimensional schematic diagram. In addition, since FIG. 2 is a schematic diagram for general description, it is simplified appropriately, and therefore it has parts different from FIGS. 3 to 5 described later.

斷開裝置31係具備用以載置基板W的工作台32。工作台32係載置於移動台33上，移動台33係能夠沿著水平的軌道35a、軌道35b而在Y方向上移動，並藉由透過馬達36而旋轉的滾珠螺桿37來驅動。 The breaking device 31 includes a table 32 on which the substrate W is placed. The table 32 is placed on the moving table 33, and the moving table 33 can move in the Y direction along the horizontal rail 35 a and the rail 35 b and is driven by the ball screw 37 rotated by the motor 36.

工作台32係具備與工作台2同樣能夠將基板W保持在固定位置的保持手段。 The table 32 is provided with holding means capable of holding the substrate W at a fixed position similarly to the table 2.

於斷開裝置31中，橋架41係以橫跨移動台33與其頂部之工作台32的方式透過支柱42a、支柱42b沿著X軸方向而架設。 In the disconnecting device 31, the bridge 41 is erected along the X-axis direction through the pillars 42a and 42b so as to straddle the movable platform 33 and the work platform 32 on the top thereof.

斷開桿44係透過氣缸(air cylinder)45而可升降。 The disconnect rod 44 can be raised and lowered through an air cylinder 45.

位於斷開桿44之下端的刀部44a係如圖5及圖7所示，係由在長度方向上具有稜線44b之朝下的三角形所形成。亦即，斷開桿44之刀部44a係構成V字形，且其刀刃角α2呈鈍角。 The knife portion 44a located at the lower end of the breaking rod 44 is formed by a downward triangle with a ridge 44b in the longitudinal direction, as shown in FIGS. 5 and 7. That is, the knife portion 44a of the breaking rod 44 is formed in a V shape, and the knife edge angle α2 is an obtuse angle.

斷開桿44之刀部44a的形狀係具有在實質上與輪具20之刀部20a同等的形狀。亦即，斷開桿44之刀刃與輪具20之刀刃的形狀係設定為具有相同尺寸、相同形狀(角度)。其結果為，刀部44a之刀刃角α2呈鈍角，係在100°至140°之範圍，較佳地係在110°至130°之範圍。 The shape of the knife portion 44a of the break lever 44 has substantially the same shape as the knife portion 20a of the wheel 20. That is, the shape of the blade of the breaking rod 44 and the blade of the wheel 20 are set to have the same size and the same shape (angle). As a result, the cutting edge angle α2 of the knife portion 44a is an obtuse angle, which is in the range of 100° to 140°, preferably in the range of 110° to 130°.

(2-2)詳細說明 (2-2) Detailed description

利用圖3至圖5來詳細說明斷開裝置31。圖3係斷開裝置的局部立體圖。 圖4係斷開裝置的局部前視圖。圖5係斷開桿的立體圖。 The disconnecting device 31 will be described in detail using FIGS. 3 to 5. Figure 3 is a partial perspective view of the disconnect device. Figure 4 is a partial front view of the disconnect device. Fig. 5 is a perspective view of the broken rod.

斷開裝置31係具有連接構件51。連接構件51係藉由氣缸45而朝上下方向驅動。 The disconnecting device 31 has a connecting member 51. The connecting member 51 is driven up and down by the air cylinder 45.

斷開裝置31係具有扭矩機構53。扭矩機構53係用以增大來自連接構件51之載重並傳遞至斷開桿44的機構。扭矩機構53係具有兩組的扭矩機構53A及扭矩機構53B。兩組的扭矩機構53A及扭矩機構53B係在X方向上並排而配置。 The disconnect device 31 has a torque mechanism 53. The torque mechanism 53 is a mechanism for increasing the load from the connecting member 51 and transmitting it to the disconnect lever 44. The torque mechanism 53 has two sets of torque mechanisms 53A and 53B. The torque mechanism 53A and the torque mechanism 53B of the two groups are arranged side by side in the X direction.

以下係說明扭矩機構53A(因扭矩機構53B也相同，故省略其說明)。扭矩機構53A係具有第1板件53a、第2板件53b、以及第3板件53c。第1板件53a與第3板件53c係在同一方向上延長。第2板件53b係大致呈三角形的形狀。第1板件53a之上側的一端係旋轉自如地連接在連接構件51的下部，第1板件53a之下端係旋轉自如地連接在第2板件53b之上緣的一側。第2板件53b之上側的另一端係旋轉自如地連接在斷開裝置31的靜止部。第3板件53c之上端係無法旋轉地連接在第2板件53b的下端。亦即，第2板件53b與在第3板件53c係構成一體的構件。第3板件53c之下端係旋轉自如地連接在斷開桿44的夾持具。 Hereinafter, the torque mechanism 53A will be described (because the torque mechanism 53B is also the same, its description is omitted). The torque mechanism 53A has a first plate 53a, a second plate 53b, and a third plate 53c. The first plate 53a and the third plate 53c are extended in the same direction. The second plate 53b has a substantially triangular shape. The upper end of the first plate 53a is rotatably connected to the lower part of the connecting member 51, and the lower end of the first plate 53a is rotatably connected to the side of the upper edge of the second plate 53b. The other end on the upper side of the second plate 53b is rotatably connected to the stationary part of the disconnect device 31. The upper end of the third plate 53c is non-rotatably connected to the lower end of the second plate 53b. That is, the second plate 53b and the third plate 53c are integral members. The lower end of the third plate 53c is a clamp that is rotatably connected to the disconnect lever 44.

藉由以上的連接方式，第1板件53a之下端係相對於上端位在X方向之外側。再且，第3板件53c之下端係相對於上端位在X方向之外側。 With the above connection method, the lower end of the first plate 53a is located on the outer side in the X direction with respect to the upper end. Furthermore, the lower end of the third plate 53c is located on the outer side in the X direction with respect to the upper end.

藉由以上的結構，係能夠以簡單的結構即將很大的力量賦予斷開桿44。 With the above structure, it is possible to impart a large force to the disconnect lever 44 with a simple structure.

(2-3)控制結構 (2-3) Control structure

利用圖6來說明斷開裝置31的控制結構。圖6係顯示斷開裝置的控制結構之方塊圖。 The control structure of the disconnect device 31 will be explained using FIG. 6. Figure 6 is a block diagram showing the control structure of the disconnect device.

斷開裝置31係具有控制器(controller)61。控制器61係具有處理器(processor)(例如CPU(Central Processing Unit；中央處理器))、記憶裝置(例如ROM(Read Only Memory；唯讀記憶體)、RAM(Random Access Memory；隨機存取記憶體)、HDD(Hard Disk Drive；硬式磁碟機)、SSD(Solid State Disk；固態硬碟))、以及各種介面(interface)(例如類比/數位轉換器(A/D converter)、數位/類比轉換器(D/A converter)、通信介面(communication interface)等)的電腦系統(computer system)。控制部係透過執行儲存在記憶部(對應於記憶裝置的記憶區域之一部分或全部)的程式(program)而進行各種控制動作。 The disconnect device 31 has a controller 61. The controller 61 has a processor (such as a CPU (Central Processing Unit; central processing unit)), a memory device (such as a ROM (Read Only Memory), RAM (Random Access Memory; random access memory) , HDD (Hard Disk Drive), SSD (Solid State Disk)), and various interfaces (such as analog/digital converter (A/D converter), digital/analog A converter (D/A converter), a communication interface (communication interface), etc.). The control unit performs various control actions by executing programs stored in the memory unit (corresponding to part or all of the memory area of the memory device).

雖然控制器61係可由單一的處理器所構成，但亦可由為了各自控制而獨立的複數個處理器所構成。 Although the controller 61 can be constituted by a single processor, it can also be constituted by a plurality of independent processors for respective control.

控制器61的各個要件之功能，其一部分或全部亦可被作為構成控制器61的電腦系統中可執行的程式來實現。另外，控制部的各個要件之功能的一部分亦可包括訂製積體電路(custom IC)。 Part or all of the functions of the various elements of the controller 61 can also be implemented as executable programs in the computer system constituting the controller 61. In addition, a part of the function of each element of the control unit may also include a custom IC.

控制器61係連接於馬達36及氣缸45。 The controller 61 is connected to the motor 36 and the cylinder 45.

雖未圖示，但在控制器61上係連接有用以檢測基板W的尺寸、形狀及位置的感測器、用以檢測各個裝置的狀態之感測器及開關，及資訊輸入裝置。 Although not shown, the controller 61 is connected to a sensor for detecting the size, shape and position of the substrate W, sensors and switches for detecting the state of each device, and an information input device.

(3)基板分斷方法 (3) Substrate breaking method

使用了上述刻劃裝置1及斷開裝置31的基板分斷方法係例如為了將基板W進行分斷以獲得複數片基板而實施。 The substrate cutting method using the above-mentioned scribing device 1 and the cutting device 31 is implemented, for example, to divide the substrate W to obtain a plurality of substrates.

(3-1)刻劃道形成步驟 (3-1) Steps for forming scribe lanes

利用圖7來說明刻劃道形成步驟。圖7係基板的剖面示意圖。 The step of forming the scribe lane will be explained using FIG. 7. Figure 7 is a schematic cross-sectional view of the substrate.

沿著單片板(single panel)的基板W之預定分斷道使輪具20壓接基板W並轉動，以對基板W進行刻劃。藉此，朝向基板W的厚度方向之垂直裂痕Vm係沿著預定分斷道依序形成而成為刻劃道S。垂直裂痕Vm係以自基板W的表面到達基板W的厚度之50%以上的方式、更佳地以到達80%以上的方式、再更佳地以到達90%以上的方式而形成。 Along a predetermined breaking path of the substrate W of a single panel, the wheel 20 is pressed against the substrate W and rotated, so as to score the substrate W. Thereby, the vertical cracks Vm facing the thickness direction of the substrate W are sequentially formed along the predetermined breaking path to become the scribed path S. The vertical cracks Vm are formed from the surface of the substrate W to 50% or more of the thickness of the substrate W, more preferably 80% or more, and even more preferably 90% or more.

(3-2)斷開步驟 (3-2) Disconnect step

利用圖7來說明斷開步驟。此外，以下的動作係藉由控制器61的控制來進行。 Use FIG. 7 to explain the disconnection step. In addition, the following operations are performed by the control of the controller 61.

如圖7所示，在作為目標之分斷後的基板之區域外，係相對於刻劃道S以間隔d隔開，且幾乎平行地將斷開桿44對基板W進行按壓。亦即，斷開桿44的按壓道P係相對於刻劃道S呈平行。詳細而言，透過在刻劃道S的附近幾乎平行地按壓刀刃形狀的斷開桿44，使刻劃道S之表面產生壓縮膨脹，並藉此將基板W沿著刻劃道S進行分斷。具體而言，係以使刻劃道S之上側被嵌合的方式相互地按壓，且同時相互地拓寬下側。產生此現象的原因在於，工作台32的表面堅固，而基板W幾乎不會被彎曲之故。 As shown in FIG. 7, the target area of the substrate after the division is separated from the scribe line S by an interval d, and the breaking rod 44 is pressed against the substrate W almost in parallel. That is, the pressing path P of the breaking rod 44 is parallel to the scoring path S. In detail, by pressing the blade-shaped breaking rod 44 almost parallel to the scribe lane S, the surface of the scribe lane S is compressed and expanded, and thereby the substrate W is divided along the scribe lane S. . Specifically, it presses against each other so that the upper side of the scribe lane S is fitted, and simultaneously widens the lower side mutually. The reason for this phenomenon is that the surface of the table 32 is firm, and the substrate W is hardly bent.

在此方法中，與前述習知技術不同的是，本發明不需翻轉基板並從基板的反面來進行斷開，而是透過利用斷開桿44對形成了刻劃道S的基板W之表 面進行按壓，而得以分斷基板W。 In this method, unlike the aforementioned prior art, the present invention does not need to turn the substrate over and disconnect from the opposite side of the substrate, but instead uses the disconnect lever 44 to apply the surface of the substrate W on which the scribe line S is formed. The substrate W can be broken by pressing the surface.

以此方式，由於基板W並非是被折彎而分斷，而是藉由基板W的壓縮膨脹而在一瞬間被分斷，因此不易產生碎屑等不良情況。 In this way, since the substrate W is not broken by being bent, but broken in an instant by the compression and expansion of the substrate W, it is difficult to produce defects such as chips.

詳細而言，藉由斷開桿44的刀部44a嵌入基板W的表面，在基板W的表面部分增加了壓縮力，而使壓縮力作用在已經形成的刻劃道S之垂直裂痕Vm的表面部分上。此情況下，形成刻劃道S的垂直裂痕Vm係以相對於基板W的厚度到達50%以上的方式所形成，且藉由基板W的表面部分被壓縮，使得刻劃道S的垂直裂痕Vm在基板W的表面部分的間隙成為被壓縮的狀態，並且由於在底面部分會成為被拉伸的狀態，因此垂直裂痕Vm係朝向基板W的底面穿透，而該垂直裂痕Vm會到達基板W的底面。接著藉由垂直裂痕Vm係遍及整個刻劃道S並成為到達基板W的底面之狀態，而使基板W沿著刻劃道S被分斷。 In detail, by inserting the knife portion 44a of the breaking rod 44 into the surface of the substrate W, a compressive force is added to the surface of the substrate W, so that the compressive force acts on the surface of the vertical crack Vm of the scribe lane S already formed. Partially. In this case, the vertical crack Vm forming the scribe lane S is formed in such a way that the thickness of the substrate W reaches more than 50%, and the surface portion of the substrate W is compressed, so that the vertical crack Vm of the scribe lane S The gap in the surface portion of the substrate W becomes compressed and the bottom portion becomes stretched. Therefore, the vertical crack Vm penetrates toward the bottom surface of the substrate W, and the vertical crack Vm reaches the bottom surface of the substrate W. Underside. Then, the vertical crack Vm runs through the entire scribe lane S and reaches the bottom surface of the substrate W, so that the substrate W is divided along the scribe lane S.

較佳地，按壓道P與刻劃道S的間隔d係在0.5mm以下。其理由在於，當間隔d大於0.5mm時，則作用於刻劃道S的垂直裂痕Vm之表面側部分的壓縮力會不足，而恐有垂直裂痕Vm無法到達基板W的底面之疑慮。此外，更佳地，按壓道P與刻劃道S的間隔d係在0.2mm至0.3mm之範圍。 Preferably, the interval d between the pressing track P and the scoring track S is less than 0.5 mm. The reason is that when the interval d is greater than 0.5 mm, the compressive force acting on the surface side portion of the vertical crack Vm of the scribe lane S may be insufficient, and there may be concerns that the vertical crack Vm cannot reach the bottom surface of the substrate W. In addition, more preferably, the interval d between the pressing track P and the scoring track S is in the range of 0.2 mm to 0.3 mm.

此外，賦予斷開桿44的推力(thrust force)被設定為以輪具20形成刻劃道S時會產生與基板W所接受的表面壓力(surface pressure)相等之表面壓力。 In addition, the thrust force imparted to the breaking rod 44 is set to generate a surface pressure equal to the surface pressure received by the substrate W when the scoring track S is formed by the wheel 20.

(4)實施例 (4) Example

(4-1)刻劃圖案 (4-1) Scribe pattern

利用圖8來說明刻劃圖案的一示例。圖8係用以說明刻劃圖案的俯視圖。 An example of the scoring pattern is explained using FIG. 8. FIG. 8 is a top view for explaining the scoring pattern.

基板W係沿著第1預定分斷道D1至第8預定分斷道D8而依序被分斷，藉此形成2列×2行之四片的基板Wa。 The substrate W is sequentially divided along the first predetermined dividing lane D1 to the eighth predetermined dividing lane D8, thereby forming a four-piece substrate Wa of 2 columns×2 rows.

第1預定分斷道D1係與沿著第1列之兩片的基板Wa之列方向(橫向)的邊緣對應，且對於沿著基板W之列方向之一側的邊緣設定有一定的間隔。第2預定分斷道D2係與接近第1列之兩片的基板Wa之第2列的基板Wa的邊緣對應。第3預定分斷道D3係與接近第2列之兩片的基板Wa之第1列的基板Wa的邊緣對應，且與第2預定分斷道D2以2mm至4mm的間隔隔開。第4預定分斷道D4係與沿著第2列之兩片的基板Wa之列方向(橫向)的邊緣對應，且對於沿著基板W之列方向之另一側的邊緣設定有一定的間隔。第5預定分斷道D5係與沿著第1行之兩片的基板Wa之行方向(縱向)的邊緣對應，且對於沿著基板W之行方向之一側的邊緣設定有一定的間隔。第6預定分斷道D6係與接近第1行之兩片的基板Wa之第2行的基板Wa的邊緣對應。第7預定分斷道D7係與接近第2行之兩片的基板Wa之第1行的基板Wa的邊緣對應，且與第6預定分斷道D6以2mm至4mm的間隔隔開。第8預定分斷道D8係與沿著第2行之兩片的基板Wa之行方向(縱向)的邊緣對應，且對於沿著基板W之行方向之另一側的邊緣設定有一定的間隔。 The first predetermined dividing line D1 corresponds to the edge in the column direction (lateral direction) of the two substrates Wa in the first column, and a certain interval is set for the edge along one side of the substrate W in the column direction. The second predetermined dividing line D2 corresponds to the edge of the substrate Wa in the second row close to the two substrate Wa in the first row. The third predetermined dividing line D3 corresponds to the edge of the substrate Wa in the first row close to the two substrates Wa in the second row, and is separated from the second predetermined dividing line D2 at an interval of 2 mm to 4 mm. The fourth predetermined dividing line D4 corresponds to the edge in the column direction (lateral direction) of the two substrates Wa in the second column, and a certain interval is set for the edge along the other side of the substrate W in the column direction . The fifth predetermined dividing line D5 corresponds to the edge along the row direction (longitudinal) of the two substrates Wa in the first row, and a certain interval is set for the edge along one side of the substrate W in the row direction. The sixth predetermined dividing line D6 corresponds to the edge of the substrate Wa in the second row close to the two substrate Wa in the first row. The seventh predetermined dividing lane D7 corresponds to the edge of the substrate Wa in the first row close to the two substrates Wa in the second row, and is separated from the sixth predetermined dividing lane D6 at an interval of 2 mm to 4 mm. The eighth predetermined dividing track D8 corresponds to the edge along the row direction (longitudinal) of the two substrates Wa in the second row, and a certain interval is set for the edge along the other side of the substrate W in the row direction .

(4-2)刻劃道之形成 (4-2) The formation of the carved road

使輪具20對著基板W沿著例如第1預定分斷道D1至第4預定分斷道D4，依其順序以壓接狀態轉動。藉此，基板W的厚度之50%以上的深度之垂直裂 痕係在第1刻劃道S1至第4刻劃道S4的正下方分別形成。 The wheel 20 is made to face the substrate W along, for example, the first predetermined dividing path D1 to the fourth predetermined dividing path D4, and the wheel 20 is rotated in a crimped state in order. Thereby, vertical cracks at a depth of more than 50% of the thickness of the substrate W The marks are formed directly below the first scribe lane S1 to the fourth scribe lane S4, respectively.

在此狀態下，使輪具20沿著第5預定分斷道D5以壓接狀態轉動。藉此，係沿著第5預定分斷道D5而形成第5刻劃道S5。 In this state, the wheel 20 is rotated along the fifth predetermined dividing path D5 in a crimped state. Thereby, the fifth scribed lane S5 is formed along the fifth predetermined dividing lane D5.

其後以同樣的方式，使輪具20沿著第6預定分斷道D6至第8預定分斷道D8依序以壓接狀態轉動，並沿著第6預定分斷道D6至第8預定分斷道D8而依序分別形成第6刻劃道S6至第8刻劃道S8。 Thereafter, in the same manner, the wheel 20 is rotated in a crimped state along the sixth predetermined dividing lane D6 to the eighth predetermined dividing lane D8 in sequence, and along the sixth predetermined dividing lane D6 to the eighth predetermined dividing lane. The lane D8 is divided to form a sixth scribe lane S6 to an eighth scribe lane S8, respectively.

(4-3)分斷步驟 (4-3) Breaking steps

在相對於第1刻劃道S1與基板Wa呈相反側的基板W之邊緣部上，係對第1刻劃道S1隔開0.5mm以下的間隔而將斷開桿44對基板進行按壓。第1按壓道P1係相對於第1刻劃道S1呈平行。藉此，第1刻劃道S1之垂直裂痕係朝向基板W的底面穿透而到達基板W的底面。該作用的產生係遍及第1刻劃道S1的整體，藉此使基板W沿著第1刻劃道S1被分斷。 On the edge portion of the substrate W on the opposite side to the substrate Wa with respect to the first scribe lane S1, the first scribe lane S1 is spaced at an interval of 0.5 mm or less to press the break bar 44 against the substrate. The first pressing track P1 is parallel to the first scribe track S1. Thereby, the vertical crack of the first scribe lane S1 penetrates toward the bottom surface of the substrate W and reaches the bottom surface of the substrate W. This action is generated throughout the entire first scribe lane S1, thereby causing the substrate W to be divided along the first scribe lane S1.

其次，在相對於第2刻劃道S2與基板Wa呈相反側的區域上，係對第2刻劃道S2隔開0.5mm以下的間隔而將斷開桿44對基板W進行按壓。第2按壓道P2係相對於第2刻劃道S2呈平行。藉此，第2刻劃道S2之垂直裂痕係以從基板W的表面到達基板W的底面之方式進行穿透，並透過垂直裂痕遍及第2刻劃道S2的整體並到達基板W的底面，而使基板W沿著第2刻劃道S2被分斷。 Next, in an area on the opposite side to the substrate Wa with respect to the second scribe lane S2, the second scribe lane S2 is spaced at an interval of 0.5 mm or less to press the break bar 44 against the substrate W. The second pressing track P2 is parallel to the second scribe track S2. Thereby, the vertical crack of the second scribe lane S2 penetrates from the surface of the substrate W to the bottom surface of the substrate W, and penetrates the entire second scribe lane S2 and reaches the bottom surface of the substrate W through the vertical crack. The substrate W is divided along the second scribe lane S2.

使斷開桿44對基板Wa的相反側沿著第3刻劃道S3及第4刻劃道S4分別進行按壓。第3按壓道P3及第4按壓道P4係相對於第3刻劃道S3及第4刻劃道S4分別呈平行。藉此，基板W係沿著第3刻劃道S3以及第4刻劃道S4依序被 分斷。 The break bar 44 is pressed against the opposite side of the substrate Wa along the third scribe lane S3 and the fourth scribe lane S4, respectively. The third pressing track P3 and the fourth pressing track P4 are parallel to the third scoring track S3 and the fourth scoring track S4, respectively. Thereby, the substrate W is sequentially covered along the third scribe lane S3 and the fourth scribe lane S4 Break off.

其後，使斷開桿44在第1刻劃道S1與第2刻劃道S2之間、第3刻劃道S3與第4刻劃道S4之間，在基板Wa的相反側沿著第5刻劃道S5至第8刻劃道S8分別進行按壓。第5按壓道P5、第6按壓道P6、第7按壓道P7以及第8按壓道P8係相對於第5刻劃道S5、第6刻劃道S6、第7刻劃道S7以及第8刻劃道S8分別呈平行。藉此，基板W係沿著第5刻劃道S5至第8刻劃道S8被分斷，且不要的部位被去除而獲得四片的基板Wa。 After that, the break bar 44 is set between the first scribe lane S1 and the second scribe lane S2, between the third scribe lane S3 and the fourth scribe lane S4, and along the first scribe lane on the opposite side of the substrate Wa. The 5th scribe lane S5 to the 8th scribe lane S8 are pressed respectively. The fifth pressure track P5, the sixth pressure track P6, the seventh pressure track P7, and the eighth pressure track P8 are relative to the fifth scoring track S5, the sixth scoring track S6, the seventh scoring track S7, and the eighth scoring track. The lanes S8 are parallel respectively. Thereby, the substrate W is divided along the fifth scribe lane S5 to the eighth scribe lane S8, and unnecessary parts are removed to obtain four substrate Wa.

2.實施態樣2 2. Implementation status 2

雖然實施態樣1係利用單片板的基板來說明了一實施態樣，但基板的種類並不特別予以限定。在將例如貼合母基板(一對的基板W相互貼合者)之各基板W分別分斷的情況下亦可適用本發明。 Although Embodiment 1 uses a single-plate substrate to illustrate an embodiment, the type of substrate is not particularly limited. For example, the present invention can be applied to the case where each substrate W of a bonded mother substrate (a pair of substrates W are bonded to each other) is separately divided.

利用圖9來說明作為上述示例之實施態樣2。圖9係實施態樣2的基板之剖面示意圖。此外，由於基本的結構係與實施態樣1相同，故在以下係以相異點為主軸進行說明。 The implementation mode 2 as the above-mentioned example is explained using FIG. 9. 9 is a schematic cross-sectional view of the substrate of Embodiment 2. In addition, since the basic structure is the same as that of the first embodiment, the following description focuses on the different points.

貼合基板Ws係由形成有第1刻劃道S1之第1基板W1與形成有第2刻劃道S2之第2基板W2貼合而成。 The bonded substrate Ws is formed by bonding a first substrate W1 formed with a first scribe lane S1 and a second substrate W2 formed with a second scribe lane S2.

斷開裝置係具有上下配置的第1斷開桿44A及第2斷開桿44B。 The disconnect device has a first disconnect lever 44A and a second disconnect lever 44B arranged vertically.

(1)刻劃道形成步驟 (1) Steps for forming scribe lanes

如圖9所示，係使輪具20A沿著第1基板W1的預定分斷道而壓接第1基板 W1並轉動，以對第1基板W1進行刻劃。藉此，朝向第1基板W1之厚度方向的垂直裂痕Vm1係沿著預定分斷道而依序被形成並成為第1刻劃道S1。垂直裂痕Vm1係以自第1基板W1的表面到達厚度之50%以上的方式、較佳地以到達80%以上的方式、再更佳地以到達90%以上的方式而形成。 As shown in FIG. 9, the wheel 20A is crimped to the first substrate along a predetermined breaking path of the first substrate W1 W1 rotates in parallel to scribe the first substrate W1. Thereby, the vertical cracks Vm1 facing the thickness direction of the first substrate W1 are sequentially formed along the predetermined dividing lanes and become the first scribe lanes S1. The vertical crack Vm1 is formed to reach 50% or more of the thickness from the surface of the first substrate W1, preferably 80% or more, and more preferably 90% or more.

如圖9所示，係使輪具20B沿著第2基板W2的預定分斷道而壓接第2基板W2並轉動，以對第2基板W2進行刻劃。藉此，朝向第2基板W2之厚度方向的垂直裂痕Vm2係沿著預定分斷道而依序被形成並成為第2刻劃道S2。垂直裂痕Vm2係以自第2基板W2的表面到達厚度之50%以上的方式、較佳地以到達80%以上的方式、再更佳地以到達90%以上的方式而形成。 As shown in FIG. 9, the second substrate W2 is crimped and rotated by the wheel 20B along the predetermined dividing path of the second substrate W2 to scribe the second substrate W2. Thereby, the vertical cracks Vm2 facing the thickness direction of the second substrate W2 are sequentially formed along the predetermined dividing lanes and become the second scribe lanes S2. The vertical crack Vm2 is formed from the surface of the second substrate W2 to 50% or more of the thickness, preferably 80% or more, and more preferably 90% or more.

此外，第1刻劃道S1與第2刻劃道S2在俯視下係形成於相同的位置。 In addition, the first scribe lane S1 and the second scribe lane S2 are formed at the same position in a plan view.

以此方式，係沿著第1基板W1及第2基板W2的預定分斷道而分別形成第1刻劃道S1及第2刻劃道S2。 In this way, the first scribe lane S1 and the second scribe lane S2 are formed along the predetermined dividing lanes of the first substrate W1 and the second substrate W2, respectively.

(2)斷開步驟 (2) Disconnect step

如圖9所示，在作為目標之分斷後的基板之區域外，係相對於第1刻劃道S1隔開間隔d，且幾乎平行地將第1斷開桿44A對第1基板W1進行按壓。又，與上述動作同時地在作為目標之分斷後的基板之區域外，係相對於第2刻劃道S2隔開間隔d，且幾乎平行地將第2斷開桿44B對第2基板W2進行按壓。第1按壓道P1與第2按壓道P2係在俯視下位於相同的位置。其結果係使第1基板W1與第2基板W2同時被分斷。 As shown in FIG. 9, outside the area of the target substrate after the division is separated from the first scribe lane S1 by an interval d, and the first breaking rod 44A is pressed against the first substrate W1 almost in parallel . In addition, at the same time as the above operation, outside the area of the target substrate after the division, the second scribe line S2 is spaced apart by a distance d, and the second breaking rod 44B is almost parallel to the second substrate W2. Press. The first pressing track P1 and the second pressing track P2 are located at the same position in a plan view. As a result, the first substrate W1 and the second substrate W2 are simultaneously divided.

如上所述，透過在第1基板W1及第2基板W2之第1刻劃道S1及第2刻劃 道S2的附近將第1斷開桿44A及第2斷開桿44B分別從相反側進行按壓，而使第1基板W1及第2基板W2沿著第1刻劃道S1及第2刻劃道S2進行分斷。 As described above, through the first scribe lane S1 and the second scribe on the first substrate W1 and the second substrate W2 In the vicinity of the lane S2, the first breaking rod 44A and the second breaking rod 44B are pressed from opposite sides, respectively, so that the first substrate W1 and the second substrate W2 are along the first scribe lane S1 and the second scribe lane S2 breaks.

詳細而言，透過在第1刻劃道S1及第2刻劃道S2各自的附近幾乎平行地按壓刀刃形狀的第1斷開桿44A及第2斷開桿44B，而使第1刻劃道S1及第2刻劃道S2之表面產生壓縮膨脹，並藉此將第1基板W1及第2基板W2沿著第1刻劃道S1及第2刻劃道S2進行分斷。 In detail, by pressing the blade-shaped first breaking lever 44A and the second breaking lever 44B in the vicinity of each of the first scoring lane S1 and the second scoring lane S2 almost in parallel, the first scoring lane The surfaces of S1 and the second scribe lane S2 undergo compression and expansion, thereby dividing the first substrate W1 and the second substrate W2 along the first scribe lane S1 and the second scribe lane S2.

在此方法中，係藉由以第1斷開桿44A及第2斷開桿44B對形成了第1刻劃道S1及第2刻劃道S2的基板Ws之表面進行按壓，而得以分斷第1基板W1及第2基板W2。 In this method, the first breaking rod 44A and the second breaking rod 44B are used to press the surface of the substrate Ws on which the first scribe lane S1 and the second scribe lane S2 are formed, thereby breaking The first substrate W1 and the second substrate W2.

以此方式，由於第1基板W1及第2基板W2並非是被折彎而分斷，而是藉由第1基板W1及第2基板W2的壓縮膨脹而在一瞬間被分斷，因此不易產生碎屑等不良情況。 In this way, since the first substrate W1 and the second substrate W2 are not broken by being bent, but are broken in an instant by the compression and expansion of the first substrate W1 and the second substrate W2, it is not easy to produce Defects such as debris.

3.其他實施態樣 3. Other implementation aspects

以上雖然針對本發明的複數個實施態樣做了說明，但本發明並非限定於上述實施態樣者，只要在不脫離發明的要旨之範圍下即可做各式各樣地變更。特別是在本說明書中所記載之複數個實施態樣及變形例係可因應需要而任意組合。 Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the gist of the invention. In particular, the plural implementation modes and modification examples described in this specification can be combined arbitrarily as needed.

本發明亦可適用於石英基板、藍寶石基板、半導體晶圓、陶瓷基板等分斷。又本發明亦可適用於平面顯示面板(flat display panel)的一種之電漿顯示面板(plasma display panel；PDP)、有機電致發光面板(organic EL panel)、無 機電致發光面板(inorganic EL panel)、穿透式投影機基板(transmission projector board)、反射型投影機基板(reflective projector board)。 The invention can also be applied to the breaking of quartz substrates, sapphire substrates, semiconductor wafers, ceramic substrates and the like. In addition, the present invention can also be applied to plasma display panels (PDP), organic electroluminescence panels (organic EL panels), and non-flat display panels. Inorganic EL panel, transmission projector board, reflective projector board.

扭矩結構並非限定於實施態樣1者。 The torque structure is not limited to that of Embodiment 1.

賦予斷開桿很大推力的結構並不限定於氣缸與扭矩結構的組合。亦可係例如大型的直動氣缸(direct-acting air cylinder)。 The structure that imparts a large thrust to the disconnect lever is not limited to the combination of the cylinder and the torque structure. It can also be a large direct-acting air cylinder, for example.

[產業上之可利用性] [Industrial availability]

本發明係可廣泛地適用於為了將脆性材料基板分斷成複數片基板而實施的基板分斷方法。 The present invention can be widely applied to a substrate breaking method implemented for breaking a brittle material substrate into a plurality of substrates.

20:刻劃輪，輪具 20: Scribing wheel, wheel tool

20a:刀部 20a: knife

32:工作台 32: Workbench

44:斷開桿 44: Disconnect lever

44a:刀部 44a: Knife

d:間隔 d: interval

P:按壓道 P: Press road

S:刻劃道 S: Scribe Road

Vm:垂直裂痕 Vm: vertical crack

W:脆性材料基板，基板 W: brittle material substrate, substrate

α1,α2:刀刃角 α1,α2: blade angle

Claims (6)

一種基板分斷方法，其具備： A substrate breaking method, which includes: 沿著脆性材料基板的預定分斷道形成刻劃道的步驟；以及 The step of forming scribe lanes along predetermined breaking lanes of the brittle material substrate; and 透過在前述刻劃道的附近幾乎平行地按壓刀刃形狀的斷開桿，使前述刻劃道之表面產生壓縮膨脹，並藉此將前述脆性材料基板沿著前述刻劃道進行分斷的步驟。 The step of pressing the cutting bar in the shape of a knife edge almost parallel to the vicinity of the scribed road to compress and expand the surface of the scribed road, thereby separating the brittle material substrate along the scribed road. 如請求項1所記載之基板分斷方法，其中： The substrate breaking method described in claim 1, in which: 透過前述刻劃道的形成而沿著前述預定分斷道形成將前述基板的表面作為基部的垂直裂痕； Forming a vertical crack with the surface of the substrate as a base along the predetermined dividing line through the formation of the scribe lane; 透過前述斷開桿的按壓使前述垂直裂痕的前述基板之表面部位產生壓縮力，並藉此使前述基板的底面部位產生張力，使得前述垂直裂痕穿透至前述基板的前述底面部位，以分斷前述基板。 The pressing force of the breaking rod causes the vertical cracks to generate compressive force on the surface of the substrate, thereby generating tension on the bottom surface of the substrate, so that the vertical crack penetrates to the bottom surface of the substrate to break The aforementioned substrate. 如請求項1或請求項2所記載之基板分斷方法，其中： Such as the substrate breaking method described in claim 1 or 2, in which: 前述斷開桿的按壓位置係形成在與前述刻劃道隔開0.5mm以下的間隔之處。 The pressing position of the breaking lever is formed at a distance of 0.5 mm or less from the scribe lane. 如請求項1或請求項2所記載之基板分斷方法，其中： Such as the substrate breaking method described in claim 1 or 2, in which: 前述脆性材料基板係包括兩片基板的貼合基板； The aforementioned brittle material substrate is a laminated substrate including two substrates; 於形成前述刻劃道的步驟中，係沿著前述兩片基板的預定分斷道分別 形成刻劃道； In the step of forming the aforementioned scribe lanes, along the predetermined dividing lanes of the aforementioned two substrates, respectively Form a scribe 於分斷前述脆性材料基板的步驟中，透過在前述兩片基板之前述刻劃道的附近將前述斷開桿分別從相反側按壓，以將前述兩片基板沿著前述刻劃道進行分斷。 In the step of breaking the brittle material substrate, the breaking rods are pressed from opposite sides in the vicinity of the scribed lanes of the two substrates to separate the two substrates along the scribed lanes. . 如請求項4所記載之基板分斷方法，其中： The substrate breaking method as described in claim 4, where: 於分斷前述脆性材料基板的步驟中，透過在前述兩片基板之前述刻劃道的附近將前述斷開桿分別從相反側同時進行按壓，以將前述兩片基板沿著前述刻劃道同時進行分斷。 In the step of breaking the brittle material substrate, the breaking rods are simultaneously pressed from opposite sides in the vicinity of the scribed path of the two substrates, so as to simultaneously push the two substrates along the scribed path. Perform breaking. 一種基板分斷裝置，係用以將形成有刻劃道的脆性材料基板沿著前述刻劃道來進行分斷的裝置，其具備： A substrate breaking device is a device for breaking a brittle material substrate formed with scribe lanes along the aforementioned scribe lane, and includes: 按壓力產生部； Press the pressure generating part; 斷開桿，係用以透過在前述刻劃道的附近幾乎平行地進行按壓，而使前述刻劃道之表面產生壓縮膨脹，並藉此將前述脆性材料基板沿著前述刻劃道進行分斷；以及 The breaking rod is used to compress and expand the surface of the scribed road by pressing almost parallel to the vicinity of the scribed road, thereby breaking the brittle material substrate along the scribed road ;as well as 扭矩機構，係用以將來自前述按壓力產生部的按壓力傳遞至前述斷開桿。 The torque mechanism is for transmitting the pressing force from the pressing force generating portion to the disconnect lever.

Images