TW202039729A - Surface protective film - Google Patents

Surface protective film Download PDF

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TW202039729A
TW202039729A TW109123762A TW109123762A TW202039729A TW 202039729 A TW202039729 A TW 202039729A TW 109123762 A TW109123762 A TW 109123762A TW 109123762 A TW109123762 A TW 109123762A TW 202039729 A TW202039729 A TW 202039729A
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weight
parts
peeling
fluorine
adhesive composition
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TW109123762A
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TWI711683B (en
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設樂浩司
徐創矢
佐佐木翔悟
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日商日東電工股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
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    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a surface protective film that has ultraeasy separability, while having a low possibility of contaminating the surface of an object to which the surface protective film is bonded. A surface protective film according to the present invention has an adhesive layer; and the peel strength as measured by bonding a polyethylene terephthalate film having a thickness of 25 [mu]m to the adhesive layer and peeling the polyethylene terephthalate film therefrom in 30 minutes at 23 DEG C at a peeling angle of 180 DEG and at a peeling rate of 6,000 mm/minute is 0.08 N/25 mm or less.

Description

表面保護膜Surface protective film

本發明係關於一種表面保護膜。The present invention relates to a surface protective film.

於光學構件或電子構件之製造步驟中，為了防止於加工、組裝、檢查、傳輸等時對表面造成損傷，通常會於露出面貼附表面保護膜。於無需進行表面保護時將此種表面保護膜自光學構件或電子構件剝離(專利文獻1)。 如上所述欲自貼附有此種表面保護膜之光學構件或電子構件剝離表面保護膜時，重要的是僅該表面保護膜與光學構件或電子構件之界面處可順利剝離。 然而，於光學構件或電子構件具備薄玻璃或障壁膜等易破損構件之情形時，若欲剝離所貼附之表面保護膜，則即便於使用先前之具有輕剝離性之表面保護膜時，亦存在因剝離力而導致該易破損構件破損之情況。 因此，業界要求相較於先前之具有輕剝離性之表面保護膜而更具輕剝離性、即具有超輕剝離性之表面保護膜。 此處，為了減輕剝離力，若使表面保護膜之黏著劑層中大量含有先前之剝離劑，則有時可表現出一定程度之超輕剝離性。然而，此種方法存在如下問題：剝離表面保護膜後，被黏著體表面受剝離劑污染之程度較大，且若欲再次貼附表面保護膜，則因被黏著體表面受污染而導致表面保護膜變得難以貼附。 又，光學構件或電子構件於保管時通常保留著於製造步驟中為了防止表面於加工、組裝、檢查、傳輸等時受損而貼附於露出面之表面保護膜。於該情形時，若於貼附有先前之表面保護膜之狀態下保管，則存在黏著力經時上升而變得重剝離化之問題。 如上所述，於光學構件或電子構件之製造步驟中，為了防止表面於加工、組裝、檢查、傳輸等時受損而貼附於露出面之表面保護膜存在若干應改良點，即，賦予超輕剝離性、可減輕被黏著體表面之污染性、可抑制經時性之重剝離化等應改良點。 [先前技術文獻] [專利文獻] 專利文獻1：日本專利特開2016-17109號公報In the manufacturing steps of optical or electronic components, in order to prevent damage to the surface during processing, assembly, inspection, transmission, etc., a surface protective film is usually attached to the exposed surface. When surface protection is unnecessary, such a surface protection film is peeled off from an optical member or an electronic member (Patent Document 1). When the surface protective film is to be peeled off from the optical member or electronic member to which such a surface protective film is attached as described above, it is important that only the interface between the surface protective film and the optical member or electronic member can be peeled off smoothly. However, when optical or electronic components are equipped with easily damaged components such as thin glass or barrier film, if you want to peel off the attached surface protection film, even when using the previous lightly peelable surface protection film, There are cases where the easily breakable member is damaged due to the peeling force. Therefore, the industry requires a surface protective film with lighter peelability, that is, an ultralight peelable surface protective film, compared with the previous lightly peelable surface protective film. Here, in order to reduce the peeling force, if a large amount of the previous peeling agent is contained in the adhesive layer of the surface protective film, a certain degree of ultra-light peeling may be exhibited. However, this method has the following problems: after peeling off the surface protection film, the surface of the adherend is contaminated by the release agent to a large extent, and if the surface protection film is to be attached again, the surface of the adherend will be contaminated and cause surface protection The film becomes difficult to stick. In addition, optical components or electronic components usually remain in the manufacturing process during storage, and are attached to the surface protection film on the exposed surface in order to prevent the surface from being damaged during processing, assembly, inspection, and transmission. In this case, if it is stored in a state where the previous surface protective film is attached, there is a problem that the adhesive force rises over time and becomes heavy peeling. As described above, in the manufacturing steps of optical or electronic components, in order to prevent the surface from being damaged during processing, assembly, inspection, transmission, etc., the surface protective film attached to the exposed surface has several points that should be improved, that is, to give super It should be improved, such as light peeling, reducing pollution on the surface of the adherend, and preventing heavy peeling with time. [Prior Technical Literature] [Patent Literature] Patent Document 1: Japanese Patent Laid-Open No. 2016-17109

[發明所欲解決之問題] 本發明之課題在於提供一種被賦予超輕剝離性之表面保護膜，提供一種可減輕被黏著體表面之污染性之表面保護膜，提供一種可抑制經時性之重剝離化之表面保護膜。 [解決問題之技術手段] 本發明之表面保護膜係具有黏著劑層者，並且 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.08 N/25 mm以下。 於一實施形態中，對上述黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.02 N/25 mm以下。 本發明之表面保護膜係具有黏著劑層者，並且 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.35 N/25 mm以下。 於一實施形態中，對上述黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.07 N/25 mm以下。 本發明之表面保護膜係具有黏著劑層者，並且 對該黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.135 N/25 mm以下。 於一實施形態中，對上述黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.023 N/25 mm以下。 本發明之表面保護膜係具有黏著劑層者，並且 對該黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.35 N/25 mm以下。 於一實施形態中，對上述黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.05 N/25 mm以下。 於一實施形態中，本發明之表面保護膜之殘存接著率為50%以上。 於一實施形態中，構成上述黏著劑層之黏著劑係由黏著劑組合物形成，該黏著劑組合物包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑。 於一實施形態中，上述聚矽氧系添加劑為選自含矽氧烷鍵之化合物、含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種。 於一實施形態中，上述氟系添加劑為選自含氟化合物、含羥基之氟系化合物、含交聯性官能基之氟系化合物中之至少一種。 於一實施形態中，上述基礎聚合物為選自胺基甲酸酯系樹脂、丙烯酸系樹脂、橡膠系樹脂、聚矽氧系樹脂中之至少一種。 於一實施形態中，上述胺基甲酸酯系樹脂為由含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物形成之胺基甲酸酯系樹脂。 於一實施形態中，上述胺基甲酸酯系樹脂為由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物形成之胺基甲酸酯系樹脂。 於一實施形態中，上述黏著劑組合物包含脂肪酸酯。 本發明之光學構件係貼附有本發明之表面保護膜者。 本發明之電子構件係貼附有本發明之表面保護膜者。 [發明之效果] 根據本發明，可提供一種具備超輕剝離性、被黏著體表面之污染性較低之表面保護膜。[The problem to be solved by the invention] The subject of the present invention is to provide a surface protective film that is endowed with ultra-light peeling properties, to provide a surface protective film that can reduce contamination on the surface of an adherend, and to provide a surface protective film that can inhibit heavy peeling over time. [Technical means to solve the problem] The surface protection film of the present invention has an adhesive layer, and A polyethylene terephthalate film with a thickness of 25 μm was bonded to the adhesive layer. After 30 minutes at 23°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 6000 The peeling force when peeling at mm/min is 0.08 N/25 mm or less. In one embodiment, a polyethylene terephthalate film with a thickness of 25 μm is attached to the adhesive layer, and after 30 minutes at 23°C, the polyethylene terephthalate film is peeled off at a peeling angle When peeling at 180 degrees and a peeling speed of 300 mm/min, the peeling force is 0.02 N/25 mm or less. The surface protection film of the present invention has an adhesive layer, and A polyethylene terephthalate film with a thickness of 25 μm was attached to the adhesive layer. After 7 days at 80°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 6000 When peeling at mm/min, the peeling force is 0.35 N/25 mm or less. In one embodiment, a 25 μm-thick polyethylene terephthalate film is attached to the adhesive layer, and after 7 days at 80°C, the polyethylene terephthalate film is peeled off at a peeling angle When peeling at 180 degrees and a peeling speed of 300 mm/min, the peeling force is 0.07 N/25 mm or less. The surface protection film of the present invention has an adhesive layer, and A glass plate with a thickness of 1000 μm was attached to the adhesive layer, and after 30 minutes at 23°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min was 0.135 N/25 mm or less. In one embodiment, a glass plate with a thickness of 1000 μm is attached to the adhesive layer, and after 30 minutes at 23°C, the glass plate is peeled at a peeling angle of 180 degrees and a peeling speed of 300 mm/min. The force is less than 0.023 N/25 mm. The surface protection film of the present invention has an adhesive layer, and A glass plate with a thickness of 1000 μm was attached to the adhesive layer, and after 7 days at 80°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min was 0.35 N/25 mm or less. In one embodiment, a glass plate with a thickness of 1000 μm is attached to the adhesive layer, and after 7 days at 80°C, the glass plate is peeled at a peeling angle of 180 degrees and a peeling speed of 300 mm/min. The force is below 0.05 N/25 mm. In one embodiment, the residual adhesion rate of the surface protective film of the present invention is 50% or more. In one embodiment, the adhesive constituting the adhesive layer is formed of an adhesive composition, and the adhesive composition includes a base polymer, and a silicone-based additive and/or a fluorine-based additive. In one embodiment, the polysiloxane-based additive is at least one selected from the group consisting of siloxane bond-containing compounds, hydroxyl-containing polysiloxane-based compounds, and crosslinkable functional groups-containing polysiloxane-based compounds. In one embodiment, the fluorine-based additive is at least one selected from a fluorine-containing compound, a hydroxyl-containing fluorine-based compound, and a crosslinkable functional group-containing fluorine-based compound. In one embodiment, the above-mentioned base polymer is at least one selected from the group consisting of urethane resin, acrylic resin, rubber resin, and silicone resin. In one embodiment, the above-mentioned urethane-based resin is a urethane-based resin formed from a composition containing a polyol (A) and a polyfunctional isocyanate compound (B). In one embodiment, the above-mentioned urethane-based resin is a urethane-based resin formed from a composition containing a urethane prepolymer (C) and a polyfunctional isocyanate compound (B). In one embodiment, the adhesive composition includes fatty acid ester. The optical component of the present invention is one with the surface protective film of the present invention attached. The electronic component of the present invention is one with the surface protective film of the present invention attached. [Effects of Invention] According to the present invention, it is possible to provide a surface protective film with ultra-light peelability and low contamination on the surface of the adherend.

≪≪表面保護膜≫≫ 本發明之表面保護膜具有黏著劑層。本發明之表面保護膜只要具有黏著劑層，則亦可於無損本發明之效果之範圍內具備任意適宜之其他構件。代表性而言，本發明之表面保護膜具有基材層與黏著劑層。 圖1係本發明之一實施形態之表面保護膜之概略剖視圖。圖1中，表面保護膜10具備基材層1與黏著劑層2。圖1中，基材層1與黏著劑層2係直接積層。 圖1中，黏著劑層2之與基材層1相反一側之表面亦可具備任意適宜之剝離襯墊以於使用前加以保護等(未作圖示)。作為剝離襯墊，例如可列舉：紙或塑膠膜等基材(襯墊基材)之表面經聚矽氧處理之剝離襯墊、於紙或塑膠膜等基材(襯墊基材)之表面層壓有聚烯烴系樹脂之剝離襯墊等。關於作為襯墊基材之塑膠膜，例如可列舉：聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。作為襯墊基材之塑膠膜，較佳為聚乙烯膜。 剝離襯墊之厚度較佳為1 μm～500 μm，更佳為3 μm～450 μm，進而較佳為5 μm～400 μm，尤佳為10 μm～300 μm。 表面保護膜之厚度較佳為5 μm～500 μm，更佳為10 μm～450 μm，進而較佳為15 μm～400 μm，尤佳為20 μm～300 μm。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力較佳為0.08 N/25 mm以下，更佳為0.075 N/25 mm以下，進而較佳為0.07 N/25 mm以下，進而較佳為0.065 N/25 mm以下，尤佳為0.06 N/25 mm以下，最佳為0.055 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若於高達6000 mm/min之非常高速之剝離速度下之上述剝離力處於上述範圍內，則本發明之表面保護膜可表現出非常優異之超輕剝離性。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力較佳為0.02 N/25 mm以下，更佳為0.018 N/25 mm以下，進而較佳為0.015 N/25 mm以下，尤佳為0.012 N/25 mm以下，最佳為0.01 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若上述剝離力處於上述範圍內，則本發明之表面保護膜可表現出超輕剝離性。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力較佳為0.35 N/25 mm以下，更佳為0.33 N/25 mm以下，進而較佳為0.3 N/25 mm以下，進而較佳為0.27 N/25 mm以下，尤佳為0.25 N/25 mm以下，最佳為0.23 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若於80℃下經過7天後之上述剝離力處於上述範圍內，則本發明之表面保護膜可充分地抑制經時性之重剝離化。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力較佳為0.07 N/25 mm以下，更佳為0.06 N/25 mm以下，進而較佳為0.05 N/25 mm以下，尤佳為0.045 N/25 mm以下，最佳為0.04 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若上述剝離力處於上述範圍內，則本發明之表面保護膜可抑制經時性之重剝離化。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力較佳為0.135 N/25 mm以下，更佳為0.1 N/25 mm以下，進而較佳為0.07 N/25 mm以下，進而較佳為0.065 N/25 mm以下，尤佳為0.06 N/25 mm以下，最佳為0.055 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若於高達6000 mm/min之非常高速之剝離速度下之上述剝離力處於上述範圍內，則本發明之表面保護膜可表現出非常優異之超輕剝離性。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力較佳為0.023 N/25 mm以下，更佳為0.022 N/25 mm以下，進而較佳為0.02 N/25 mm以下，尤佳為0.015 N/25 mm以下，最佳為0.013 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若上述剝離力處於上述範圍內，則本發明之表面保護膜可表現出超輕剝離性。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力較佳為0.35 N/25 mm以下，更佳為0.3 N/25 mm以下，進而較佳為0.25 N/25 mm以下，進而較佳為0.2 N/25 mm以下，尤佳為0.15 N/25 mm以下，最佳為0.1 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若於80℃下經過7天後之上述剝離力處於上述範圍內，則本發明之表面保護膜可充分地抑制經時性之重剝離化。再者，下文對上述剝離力之測定進行詳細說明。 關於本發明之表面保護膜之一實施形態，對黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力較佳為0.05 N/25 mm以下，更佳為0.045 N/25 mm以下，進而較佳為0.04 N/25 mm以下，尤佳為0.035 N/25 mm以下，最佳為0.03 N/25 mm以下。上述剝離力之下限實際上為0.001 N/25 mm以上。若上述剝離力處於上述範圍內，則本發明之表面保護膜可抑制經時性之重剝離化。再者，下文對上述剝離力之測定進行詳細說明。 本發明之表面保護膜之殘存接著率較佳為50%以上，更佳為55%～100%，進而較佳為60%～100%，尤佳為65%～100%，最佳為70%～100%。若上述殘存接著率處於上述範圍內，則本發明之表面保護膜可表現出被黏著體表面之污染性較低之效果。再者，下文對殘存接著率之測定進行詳細說明。 本發明之表面保護膜可藉由任意適宜之方法而製造。作為此種製造方法，可依據例如 (1)於基材層上塗佈黏著劑層之形成材料之溶液或熱熔融液之方法、 (2)將於隔離件上塗佈黏著劑層之形成材料之溶液或熱熔融液而形成之黏著劑層移著至基材層上之方法、 (3)將黏著劑層之形成材料以擠出方式形成塗佈至基材層上之方法、 (4)將基材層與黏著劑層以雙層或多層之形式擠出之方法、 (5)於基材層上單層層壓黏著劑層之方法、或於基材層上將黏著劑層連同層壓層一併進行雙層層壓之方法、 (6)將黏著劑層與膜或層壓層等基材層形成材料進行雙層或多層層壓之方法 等任意適宜之製造方法而進行。 作為塗佈方法，例如可使用輥式塗佈機法、缺角輪塗佈機法、模嘴塗佈機法、反向塗佈機法、絲網印刷法、凹版塗佈機法等。 ≪基材層≫ 基材層可僅為1層，亦可為2層以上。基材層亦可經延伸。 基材層之厚度較佳為4 μm～450 μm，更佳為8 μm～400 μm，進而較佳為12 μm～350 μm，尤佳為16 μm～250 μm。 對於基材層之未設置黏著劑層之面，為了形成易於解捲之捲繞體等，例如可對基材層添加脂肪醯胺、聚伸乙基亞胺、長鏈烷基系添加劑等而進行脫模處理，或可設置包含聚矽氧系、長鏈烷基系、氟系等任意適宜之剝離劑之塗層。 作為基材層之材料，可根據用途而採用任意適宜之材料。例如可列舉：塑膠、紙、金屬膜、不織布等。較佳為塑膠。即，基材層較佳為塑膠膜。基材層可僅由1種材料構成，亦可由2種以上之材料構成。例如可由2種以上之塑膠構成。 作為上述塑膠，例如可列舉：聚酯系樹脂、聚醯胺系樹脂、聚烯烴系樹脂等。作為聚酯系樹脂，例如可列舉：聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等。作為聚烯烴系樹脂，例如可列舉：烯烴單體之均聚物、烯烴單體之共聚物等。作為聚烯烴系樹脂，具體而言，例如可列舉：均聚丙烯；以乙烯成分作為共聚合成分之嵌段系、無規系、接枝系等之丙烯系共聚物；反應器TPO(Thermoplastic Polyolefin，熱塑性聚烯烴)；低密度、高密度、線性低密度、超低密度等之乙烯系聚合物；乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸甲酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-丙烯酸丁酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物等乙烯系共聚物等。 基材層視需要可含有任意適宜之添加劑。作為基材層可含有之添加劑，例如可列舉：抗氧化劑、紫外線吸收劑、光穩定劑、抗靜電劑、填充劑、顏料等。基材層可含有之添加劑之種類、數量可根據目的而適當設定。尤其於基材層之材料為塑膠之情形時，較佳為含有若干上述添加劑以防止劣化等。就耐候性提高等觀點而言，作為添加劑，可尤佳地列舉：抗氧化劑、紫外線吸收劑、光穩定劑、填充劑。 作為抗氧化劑，可採用任意適宜之抗氧化劑。作為此種抗氧化劑，例如可列舉：酚系抗氧化劑、磷系加工熱穩定劑、內酯系加工熱穩定劑、硫系耐熱穩定劑、酚-磷系抗氧化劑等。關於抗氧化劑之含有比率，相對於基材層之基礎樹脂(於基材層為摻合物之情形時，該摻合物為基礎樹脂)，較佳為1重量%以下，更佳為0.5重量%以下，進而較佳為0.01重量%～0.2重量%。 作為紫外線吸收劑，可採用任意適宜之紫外線吸收劑。作為此種紫外線吸收劑，例如可列舉：苯并***系紫外線吸收劑、三𠯤系紫外線吸收劑、二苯甲酮系紫外線吸收劑等。關於紫外線吸收劑之含有比率，相對於形成基材層之基礎樹脂(於基材層為摻合物之情形時，該摻合物為基礎樹脂)，較佳為2重量%以下，更佳為1重量%以下，進而較佳為0.01重量%～0.5重量%。 作為光穩定劑，可採用任意適宜之光穩定劑。作為此種光穩定劑，例如可列舉：受阻胺系光穩定劑、苯甲酸酯系光穩定劑等。關於光穩定劑之含有比率，相對於形成基材層之基礎樹脂(於基材層為摻合物之情形時，該摻合物為基礎樹脂)，較佳為2重量%以下，更佳為1重量%以下，進而較佳為0.01重量%～0.5重量%。 作為填充劑，可採用任意適宜之填充劑。作為此種填充劑，例如可列舉無機系填充劑等。作為無機系填充劑，具體而言，例如可列舉：碳黑、氧化鈦、氧化鋅等。關於填充劑之含有比率，相對於形成基材層之基礎樹脂(於基材層為摻合物之情形時，該摻合物為基礎樹脂)，較佳為20重量%以下，更佳為10重量%以下，進而較佳為0.01重量%～10重量%。 進而，作為添加劑，為了賦予抗靜電性，亦可較佳地列舉界面活性劑、無機鹽、多元醇、金屬化合物、碳等無機系、低分子量系及高分子量系抗靜電劑。尤其就污染、維持黏著性之觀點而言，較佳為高分子量系抗靜電劑或碳。 ≪黏著劑層≫ 黏著劑層可藉由任意適宜之製造方法製造。作為此種製造方法，例如可列舉如下方法：於基材層上塗佈作為黏著劑層之形成材料的組合物，而於基材層上形成黏著劑層。作為此種塗佈方法，例如可列舉：輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、氣刀塗佈法、使用模嘴塗佈機等之擠壓塗佈等。 黏著劑層之厚度較佳為1 μm～150 μm，更佳為2 μm～140 μm，進而較佳為3 μm～130 μm，進而較佳為4 μm～120 μm，進而較佳為5 μm～100 μm，進而較佳為10 μm～90 μm，尤佳為20 μm～85 μm，最佳為30 μm～80 μm。 黏著劑層係由黏著劑構成。黏著劑係由黏著劑組合物形成。 黏著劑組合物較佳為包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑。 關於黏著劑組合物中之聚矽氧系添加劑及/或氟系添加劑之含量，以相對於基礎聚合物100重量份之聚矽氧系添加劑與氟系添加劑之合計量計，較佳為0.01重量份～50重量份，更佳為0.02重量份～25重量份，進而較佳為0.025重量份～10重量份，尤佳為0.03重量份～5重量份，最佳為0.05重量份～3重量份。若黏著劑組合物中之聚矽氧系添加劑及/或氟系添加劑之含量處於上述範圍內，則本發明之表面保護膜不僅能夠表現出更高之超輕剝離性，且能夠進一步降低被黏著體表面之污染性。 ＜基礎聚合物＞ 基礎聚合物較佳為選自胺基甲酸酯系樹脂、丙烯酸系樹脂、橡膠系樹脂、聚矽氧系樹脂中之至少一種。就更能夠表現出本發明之效果之方面而言，基礎聚合物更佳為胺基甲酸酯系樹脂、丙烯酸系樹脂。 [胺基甲酸酯系樹脂] 作為胺基甲酸酯系樹脂，可於無損本發明之效果之範圍內採用任意適宜之胺基甲酸酯系樹脂。作為胺基甲酸酯系樹脂，較佳為由含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂、或由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂。藉由採用如上所述者作為胺基甲酸酯系樹脂，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 胺基甲酸酯系樹脂可於無損本發明之效果之範圍內含有任意適宜之成分。作為此種成分，例如可列舉：胺基甲酸酯系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 胺基甲酸酯系樹脂較佳為包含抗氧化劑、紫外線吸收劑、光穩定劑等防劣化劑。藉由胺基甲酸酯系樹脂包含防劣化劑，而即便於貼附至被黏著體後於加熱狀態下保存，被黏著體上亦不易出現糊劑殘留等，從而能夠優化糊劑殘留防止性。防劣化劑可僅為1種，亦可為2種以上。作為防劣化劑，尤佳為抗氧化劑。 作為抗氧化劑，例如可列舉：自由基鏈抑制劑、過氧化物分解劑等。 作為自由基鏈抑制劑，例如可列舉：酚系抗氧化劑、胺系抗氧化劑等。 作為過氧化物分解劑，例如可列舉：硫系抗氧化劑、磷系抗氧化劑等。 作為酚系抗氧化劑，例如可列舉：單酚系抗氧化劑、雙酚系抗氧化劑、高分子型酚系抗氧化劑等。 作為單酚系抗氧化劑，例如可列舉：2,6-二第三丁基對甲酚、丁基化羥基大茴香醚、2,6-二第三丁基-4-乙基苯酚、β-(3,5-二第三丁基-4-羥基苯基)丙酸硬脂酯等。 作為雙酚系抗氧化劑，例如可列舉：2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-第三丁基苯酚)、4,4'-硫代雙(3-甲基-6-第三丁基苯酚)、4,4'-亞丁基雙(3-甲基-6-第三丁基苯酚)、3,9-雙[1,1-二甲基-2-[β-(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基]乙基]2,4,8,10-四氧雜螺[5,5]十一烷等。 作為高分子型酚系抗氧化劑，例如可列舉：1,1,3-三(2-甲基-4-羥基-5-第三丁基苯基)丁烷、1,3,5-三甲基-2,4,6-三(3,5-二第三丁基-4-羥基苄基)苯、四-[亞甲基-3-(3',5'-二第三丁基-4'-羥基苯基)丙酸酯]甲烷、雙[3,3'-雙-(4'-羥基-3'-第三丁基苯基)丁酸]二醇酯、1,3,5-三(3',5'-二第三丁基-4'-羥基苄基)-S-三𠯤-2,4,6-(1H,3H,5H)三酮、生育酚等。 作為硫系抗氧化劑，例如可列舉：3,3'-硫代二丙酸二月桂酯、3,3'-硫代二丙酸二肉豆蔻酯、3,3'-硫代二丙酸二硬脂酯等。 作為磷系抗氧化劑，例如可列舉：亞磷酸三苯酯、亞磷酸二苯基異癸酯、亞磷酸苯基二異癸酯等。 作為紫外線吸收劑，例如可列舉：二苯甲酮系紫外線吸收劑、苯并***系紫外線吸收劑、水楊酸系紫外線吸收劑、草醯替苯胺系紫外線吸收劑、氰基丙烯酸酯系紫外線吸收劑、三𠯤系紫外線吸收劑等。 作為二苯甲酮系紫外線吸收劑，例如可列舉：2,4-二羥基二苯甲酮、2-羥基-4-甲氧基二苯甲酮、2-羥基-4-辛氧基二苯甲酮、2-羥基-4-十二烷氧基二苯甲酮、2,2'-二羥基-4-二甲氧基二苯甲酮、2,2'-二羥基-4,4'-二甲氧基二苯甲酮、2-羥基-4-甲氧基-5-磺基二苯甲酮、雙(2-甲氧基-4-羥基-5-苯甲醯基苯基)甲烷等。 作為苯并***系紫外線吸收劑，例如可列舉：2-(2'-羥基-5'-甲基苯基)苯并***、2-(2'-羥基-5'-第三丁基苯基)苯并***、2-(2'-羥基-3',5'-二第三丁基苯基)苯并***、2-(2'-羥基-3'-第三丁基-5'-甲基苯基)-5-氯苯并***、2-(2'-羥基-3',5'-二第三丁基苯基)5-氯苯并***、2-(2'-羥基-3',5'-二第三戊基苯基)苯并***、2-(2'-羥基-4'-辛氧基苯基)苯并***、2-[2'-羥基-3'-(3'',4'',5'',6'',-四氫鄰苯二甲醯亞胺甲基)-5'-甲基苯基]苯并***、2,2'亞甲基雙[4-(1,1,3,3-四甲基丁基)-6-(2H-苯并***-2-基)苯酚]、2-(2'-羥基-5'-甲基丙烯醯氧基苯基)-2H-苯并***等。 作為水楊酸系紫外線吸收劑，例如可列舉：水楊酸苯酯、水楊酸對第三丁基苯酯、水楊酸對辛基苯酯等。 作為氰基丙烯酸酯系紫外線吸收劑，例如可列舉：2-氰基-3,3'-二苯基丙烯酸2-乙基己酯、2-氰基-3,3'-二苯基丙烯酸乙酯等。 作為光穩定劑，例如可列舉：受阻胺系光穩定劑、紫外線穩定劑等。 作為受阻胺系光穩定劑，例如可列舉：雙(2,2,6,6-四甲基-4-哌啶基)癸二酸酯、雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯、甲基-1,2,2,6,6-五甲基-4-哌啶基癸二酸酯等。 作為紫外線穩定劑，例如可列舉：雙(辛基苯基)硫化鎳、[2,2'-硫代雙(4-第三辛基苯酚)]正丁基胺鎳、3,5-二第三丁基-4-羥基苄基-磷酸單乙醇鎳錯合物、二丁基二硫代胺基甲酸鎳、苯甲酸酯型之抑制劑(quencher)、二丁基二硫代胺基甲酸鎳等。 (由含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂) 由含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂具體而言較佳為使含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物硬化而得之胺基甲酸酯系樹脂。 多元醇(A)可僅為1種，亦可為2種以上。 多官能異氰酸酯化合物(B)可僅為1種，亦可為2種以上。 作為多元醇(A)，例如可較佳地列舉：聚酯多元醇、聚醚多元醇、聚己內酯多元醇、聚碳酸酯多元醇、蓖麻油系多元醇。作為多元醇(A)，更佳為聚醚多元醇。 作為聚酯多元醇，例如可藉由多元醇成分與酸成分之酯化反應而獲得。 作為多元醇成分，例如可列舉：乙二醇、二乙二醇、1,3-丁二醇、1,4-丁二醇、新戊二醇、3-甲基-1,5-戊二醇、2-丁基-2-乙基-1,3-丙二醇、2,4-二乙基-1,5-戊二醇、1,2-己二醇、1,6-己二醇、1,8-辛二醇、1,9-壬二醇、2-甲基-1,8-辛二醇、1,8-癸二醇、十八烷二醇、甘油、三羥甲基丙烷、季戊四醇、己三醇、聚丙二醇等。作為酸成分，例如可列舉：琥珀酸、甲基琥珀酸、己二酸、庚二酸、壬二酸、癸二酸、1,12-十二烷二酸、1,14-十四烷二酸、二聚酸、2-甲基-1,4-環己烷二羧酸、2-乙基-1,4-環己烷二羧酸、對苯二甲酸、間苯二甲酸、鄰苯二甲酸、間苯二甲酸、對苯二甲酸、1,4-萘二甲酸、4,4'-聯苯二羧酸、該等之酸酐等。 作為聚醚多元醇，例如可列舉藉由以水、低分子多元醇(丙二醇、乙二醇、甘油、三羥甲基丙烷、季戊四醇等)、雙酚類(雙酚A等)、二羥基苯(鄰苯二酚、間苯二酚、對苯二酚等)等作為起始劑，使環氧乙烷、環氧丙烷、環氧丁烷等環氧烷加成聚合而獲得之聚醚多元醇。具體而言，例如可列舉：聚乙二醇、聚丙二醇、聚四亞甲基二醇等。 作為聚己內酯多元醇，例如可列舉藉由ε-己內酯、σ-戊內酯等環狀酯單體之開環聚合而獲得之己內酯系聚酯二醇等。 作為聚碳酸酯多元醇，例如可列舉：使上述多元醇成分與碳醯氯進行縮聚合反應而獲得之聚碳酸酯多元醇；使上述多元醇成分與碳酸二甲酯、碳酸二乙酯、碳酸二丙酯、碳酸二異丙酯、碳酸二丁酯、碳酸乙基丁酯、碳酸乙二酯、碳酸丙二酯、碳酸二苯酯、碳酸二苄酯等碳酸二酯類進行酯交換縮合而獲得之聚碳酸酯多元醇；併用2種以上之上述多元醇成分而獲得之共聚合聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與含羧基之化合物進行酯化反應而獲得之聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與含羥基之化合物進行醚化反應而獲得之聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與酯化合物進行酯交換反應而獲得之聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與含羥基之化合物進行酯交換反應而獲得之聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與二羧酸化合物進行縮聚合反應而獲得之聚酯系聚碳酸酯多元醇；使上述各種聚碳酸酯多元醇與環氧烷進行共聚合而獲得之共聚合聚醚系聚碳酸酯多元醇等。 作為蓖麻油系多元醇，例如可列舉使蓖麻油脂肪酸與上述多元醇成分反應而獲得之蓖麻油系多元醇。具體而言，例如可列舉使蓖麻油脂肪酸與聚丙二醇反應而獲得之蓖麻油系多元醇。 多元醇(A)之數量平均分子量Mn較佳為300～100000，更佳為400～75000，進而較佳為450～50000，尤佳為500～30000。藉由將多元醇(A)之數量平均分子量Mn調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 作為多元醇(A)，較佳為含有具有3個OH基且數量平均分子量Mn為300～100000之多元醇(A1)。多元醇(A1)可僅為1種，亦可為2種以上。 多元醇(A)中之多元醇(A1)之含有比率較佳為5重量%以上，更佳為25重量%～100重量%，進而較佳為50重量%～100重量%。藉由將多元醇(A)中之多元醇(A1)之含有比率調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 多元醇(A1)之數量平均分子量Mn較佳為1000～100000，更佳為1200～80000，進而較佳為1500～70000，進而較佳為1750～50000，尤佳為1500～40000，最佳為2000～30000。藉由將多元醇(A1)之數量平均分子量Mn調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 多元醇(A)亦可含有具有3個以上之OH基且數量平均分子量Mn為20000以下之多元醇(A2)。多元醇(A2)可僅為1種，亦可為2種以上。多元醇(A2)之數量平均分子量Mn較佳為100～20000，更佳為150～10000，進而較佳為200～7500，尤佳為300～6000，最佳為300～5000。若多元醇(A2)之數量平均分子量Mn脫離上述範圍，則尤其存在黏著力之經時上升性變高之虞，存在無法表現出優異之二次加工性之虞。作為多元醇(A2)，可較佳地列舉：具有3個OH基之多元醇(三醇)、具有4個OH基之多元醇(四醇)、具有5個OH基之多元醇(五醇)、具有6個OH基之多元醇(六醇)。 關於作為多元醇(A2)之具有4個OH基之多元醇(四醇)、具有5個OH基之多元醇(五醇)、具有6個OH基之多元醇(六醇)之至少1種之合計量，以於多元醇(A)中之含有比率計，較佳為70重量%以下，更佳為60重量%以下，進而較佳為40重量%以下，尤佳為30重量%以下。藉由將多元醇(A)中之作為多元醇(A2)之具有4個OH基之多元醇(四醇)、具有5個OH基之多元醇(五醇)、具有6個OH基之多元醇(六醇)之至少1種調整至上述範圍，而可提供透明性優異之胺基甲酸酯系樹脂，又，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 多元醇(A)中之多元醇(A2)之含有比率較佳為95重量%以下，更佳為0重量%～75重量%。藉由將多元醇(A)中之多元醇(A2)之含有比率調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 關於多元醇(A2)中之具有4個以上之OH基且數量平均分子量Mn為20000以下之多元醇之含有比率，相對於多元醇(A)整體，較佳為未達70重量%，更佳為60重量%以下，進而較佳為50重量%以下，尤佳為40重量%以下，最佳為30重量%以下。藉由將多元醇(A2)中之具有4個以上之OH基且數量平均分子量Mn為20000以下之多元醇之含有比率調整至上述範圍，可提供透明性優異之胺基甲酸酯系樹脂，又，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 多官能異氰酸酯化合物(B)可僅為1種，亦可為2種以上。 作為多官能異氰酸酯化合物(B)，可採用能夠用於胺基甲酸酯化反應之任意適宜之多官能異氰酸酯化合物。作為此種多官能異氰酸酯化合物(B)，例如可列舉：多官能脂肪族系異氰酸酯化合物、多官能脂環族系異氰酸酯、多官能芳香族系異氰酸酯化合物等。 作為多官能脂肪族系異氰酸酯化合物，例如可列舉：三亞甲基二異氰酸酯、四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、五亞甲基二異氰酸酯、1,2-伸丙基二異氰酸酯、1,3-伸丁基異氰酸酯、十二亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯等。 作為多官能脂環族系異氰酸酯化合物，例如可列舉：1,3-環戊烯二異氰酸酯、1,3-環己烷二異氰酸酯、1,4-環己烷二異氰酸酯、異佛爾酮二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化苯二甲基二異氰酸酯、氫化甲苯二異氰酸酯、氫化四甲基苯二甲基二異氰酸酯等。 作為多官能芳香族系二異氰酸酯化合物，例如可列舉：苯二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、2,2'-二苯基甲烷二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、4,4'-甲苯胺二異氰酸酯、4,4'-二苯醚二異氰酸酯、4,4'-二苯基二異氰酸酯、1,5-萘二異氰酸酯、苯二甲基二異氰酸酯等。 作為多官能異氰酸酯化合物(B)，亦可列舉：上述各種多官能異氰酸酯化合物之三羥甲基丙烷加成物、與水反應所得之縮二脲體、具有異氰尿酸酯環之三聚物等。又，亦可併用該等。 作為多元醇(A)與多官能異氰酸酯化合物(B)中之NCO基與OH基之當量比，以NCO基/OH基表示，較佳為5.0以下，更佳為0.1～3.0，進而較佳為0.2～2.5，尤佳為0.3～2.25，最佳為0.5～2.0。藉由將NCO基/OH基之當量比調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 關於多官能異氰酸酯化合物(B)之含有比率，相對於多元醇(A)，多官能異氰酸酯化合物(B)較佳為1.0重量%～30重量%，更佳為1.5重量%～27重量%，進而較佳為2.0重量%～25重量%，尤佳為2.3重量%～23重量%，最佳為2.5重量%～20重量%。藉由將多官能異氰酸酯化合物(B)之含有比率調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 聚胺基甲酸酯系樹脂具體而言較佳為使含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物硬化而形成。 作為使含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物硬化而形成胺基甲酸酯系樹脂之方法，可於無損本發明之效果之範圍內採用利用塊狀聚合或溶液聚合等之胺基甲酸酯化反應方法等任意適宜之方法。 為了使含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物硬化，較佳為使用觸媒。作為此種觸媒，例如可列舉：有機金屬系化合物、三級胺化合物等。 作為有機金屬系化合物，例如可列舉：鐵系化合物、錫系化合物、鈦系化合物、鋯系化合物、鉛系化合物、鈷系化合物、鋅系化合物等。該等之中，就反應速度與黏著劑層之適用期之方面而言，較佳為鐵系化合物、錫系化合物。 作為鐵系化合物，例如可列舉：乙醯丙酮酸鐵、2-乙基己酸鐵等。 作為錫系化合物，例如可列舉：二氯化二丁基錫、氧化二丁基錫、二溴化二丁基錫、順丁烯二酸二丁基錫、二月桂酸二丁基錫、二乙酸二丁基錫、硫化二丁基錫、三丁基甲醇錫、乙酸三丁基錫、三乙基乙醇錫、三丁基乙醇錫、氧化二辛基錫、二月桂酸二辛基錫、氯化三丁基錫、三氯乙酸三丁基錫、2-乙基己酸錫等。 作為鈦系化合物，例如可列舉：二氯化二丁基鈦、鈦酸四丁酯、三氯丁氧基鈦等。 作為鋯系化合物，例如可列舉：環烷酸鋯、乙醯丙酮酸鋯等。 作為鉛系化合物，例如可列舉：油酸鉛、2-乙基己酸鉛、苯甲酸鉛、環烷酸鉛等。 作為鈷系化合物，例如可列舉：2-乙基己酸鈷、苯甲酸鈷等。 作為鋅系化合物，例如可列舉：環烷酸鋅、2-乙基己酸鋅等。 作為三級胺化合物，例如可列舉：三乙基胺、三伸乙基二胺、1,8-二氮雜雙環-(5,4,0)-十一烯-7等。 觸媒可僅為1種，亦可為2種以上。又，亦可將觸媒與交聯延遲劑等併用。關於觸媒之量，相對於多元醇(A)，較佳為0.005重量%～1.00重量%，更佳為0.01重量%～0.75重量%，進而較佳為0.01重量%～0.50重量%，尤佳為0.01重量%～0.20重量%。藉由將觸媒之量調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 含有多元醇(A)與多官能異氰酸酯化合物(B)之組合物可於無損本發明之效果之範圍內包含任意適宜之其他成分。作為此種其他成分，例如可列舉：聚胺基甲酸酯系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 (由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂) 由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂若為使用所謂「胺基甲酸酯預聚物」作為原料而獲得之胺基甲酸酯系樹脂，則可採用任意適宜之胺基甲酸酯系樹脂。 作為由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂，例如可列舉由含有作為胺基甲酸酯預聚物(C)之聚胺基甲酸酯多元醇與多官能異氰酸酯化合物(B)之組合物所形成之胺基甲酸酯系樹脂。胺基甲酸酯預聚物(C)可僅為1種，亦可為2種以上。多官能異氰酸酯化合物(B)可僅為1種，亦可為2種以上。 作為胺基甲酸酯預聚物(C)之聚胺基甲酸酯多元醇較佳為如下者：使聚酯多元醇(a1)或聚醚多元醇(a2)各自單獨地、或者以(a1)與(a2)之混合物之形式，於存在或不存在觸媒之條件下，與有機聚異氰酸酯化合物(a3)反應而成者。 作為聚酯多元醇(a1)，可使用任意適宜之聚酯多元醇。作為此種聚酯多元醇(a1)，例如可列舉使酸成分與二醇成分反應所得之聚酯多元醇。作為酸成分，例如可列舉：對苯二甲酸、己二酸、壬二酸、癸二酸、鄰苯二甲酸酐、間苯二甲酸、偏苯三甲酸等。作為二醇成分，例如可列舉：乙二醇、丙二醇、二乙二醇、丁二醇、1,6-己二醇、3-甲基-1,5-戊二醇、3,3'-二羥甲基庚烷、聚氧乙二醇、聚氧丙二醇、1,4-丁二醇、新戊二醇、丁基乙基戊二醇、作為多元醇成分之甘油、三羥甲基丙烷、季戊四醇等。作為聚酯多元醇(a1)，另外亦可列舉使聚己內酯、聚(β-甲基-γ-戊內酯)、聚戊內酯等內酯類進行開環聚合而獲得之聚酯多元醇等。 作為聚酯多元醇(a1)之分子量，自低分子量至高分子量均可使用。作為聚酯多元醇(a1)之分子量，數量平均分子量較佳為100～100000。若數量平均分子量未達100，則反應性變高，存在易凝膠化之虞。若數量平均分子量超過100000，則反應性變低，進而存在聚胺基甲酸酯多元醇本身之凝集力變小之虞。關於聚酯多元醇(a1)之使用量，於構成聚胺基甲酸酯多元醇之多元醇中，較佳為0莫耳%～90莫耳%。 作為聚醚多元醇(a2)，可使用任意適宜之聚醚多元醇。作為此種聚醚多元醇(a2)，例如可列舉藉由如下方式獲得之聚醚多元醇：使用水、丙二醇、乙二醇、甘油、三羥甲基丙烷等低分子量多元醇作為起始劑，使環氧乙烷、環氧丙烷、環氧丁烷、四氫呋喃等環氧乙烷(oxirane)化合物進行聚合而成者。作為此種聚醚多元醇(a2)，具體而言，例如可列舉：聚丙二醇、聚乙二醇、聚四亞甲基二醇等官能基數為2以上之聚醚多元醇。 作為聚醚多元醇(a2)之分子量，自低分子量至高分子量均可使用。作為聚醚多元醇(a2)之分子量，數量平均分子量較佳為100～100000。若數量平均分子量未達100，則反應性變高，存在易凝膠化之虞。若數量平均分子量超過100000，則反應性變低，進而存在聚胺基甲酸酯多元醇本身之凝集力變小之虞。關於聚醚多元醇(a2)之使用量，於構成聚胺基甲酸酯多元醇之多元醇中，較佳為0莫耳%～90莫耳%。 聚醚多元醇(a2)視需要可將其一部分取代成乙二醇、1,4-丁二醇、新戊二醇、丁基乙基戊二醇、甘油、三羥甲基丙烷、季戊四醇等二醇類、或乙二胺、N-胺基乙基乙醇胺、異佛爾酮二胺、苯二甲胺等多元胺類等而併用。 作為聚醚多元醇(a2)，可僅使用2官能性之聚醚多元醇，亦可部分使用或全部使用數量平均分子量為100～100000、且1分子中具有至少3個以上之羥基之聚醚多元醇。作為聚醚多元醇(a2)，若部分使用或全部使用數量平均分子量為100～100000、且1分子中具有至少3個以上之羥基之聚醚多元醇，則黏著力與再剝離性之均衡性可變得良好。此種聚醚多元醇若數量平均分子量未達100，則反應性變高，存在易凝膠化之虞。又，此種聚醚多元醇若數量平均分子量超過100000，則反應性變低，進而存在聚胺基甲酸酯多元醇本身之凝集力變小之虞。此種聚醚多元醇之數量平均分子量更佳為100～10000。 作為有機聚異氰酸酯化合物(a3)，可使用任意適宜之有機聚異氰酸酯化合物。作為此種有機聚異氰酸酯化合物(a3)，例如可列舉：芳香族聚異氰酸酯、脂肪族聚異氰酸酯、芳香脂肪族聚異氰酸酯、脂環族聚異氰酸酯等。 作為芳香族聚異氰酸酯，例如可列舉：1,3-苯二異氰酸酯、4,4'-二苯基二異氰酸酯、1,4-苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-甲苯胺二異氰酸酯、2,4,6-甲苯三異氰酸酯、1,3,5-苯三異氰酸酯、二甲氧苯胺二異氰酸酯、4,4'-二苯醚二異氰酸酯、4,4',4''-三苯基甲烷三異氰酸酯等。 作為脂肪族聚異氰酸酯，例如可列舉：三亞甲基二異氰酸酯、四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、五亞甲基二異氰酸酯、1,2-伸丙基二異氰酸酯、2,3-伸丁基二異氰酸酯、1,3-伸丁基二異氰酸酯、十二亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯等。 作為芳香脂肪族聚異氰酸酯，例如可列舉：ω,ω'-二異氰酸酯基-1,3-二甲基苯、ω,ω'-二異氰酸酯基-1,4-二甲基苯、ω,ω'-二異氰酸酯基-1,4-二乙基苯、1,4-四甲基苯二甲基二異氰酸酯、1,3-四甲基苯二甲基二異氰酸酯等。 作為脂環族聚異氰酸酯，例如可列舉：異氰酸3-異氰酸基甲基-3,5,5-三甲基環己酯、1,3-環戊烷二異氰酸酯、1,3-環己烷二異氰酸酯、1,4-環己烷二異氰酸酯、甲基-2,4-環己烷二異氰酸酯、甲基-2,6-環己烷二異氰酸酯、4,4'-亞甲基雙(異氰酸環己酯)、1,4-雙(異氰酸甲酯)環己烷、1,4-雙(異氰酸甲酯)環己烷等。 作為有機聚異氰酸酯化合物(a3)，亦可併用三羥甲基丙烷加成物、與水反應所得之縮二脲體、具有異氰尿酸酯環之三聚物等。 作為獲得聚胺基甲酸酯多元醇時可用之觸媒，可使用任意適宜之觸媒。作為此種觸媒，例如可列舉：三級胺系化合物、有機金屬系化合物等。 作為三級胺系化合物，例如可列舉：三乙基胺、三伸乙基二胺、1,8-二氮雜雙環(5,4,0)-十一烯-7(DBU)等。 作為有機金屬系化合物，例如可列舉：錫系化合物、非錫系化合物等。 作為錫系化合物，例如可列舉：二氯化二丁基錫、氧化二丁基錫、二溴化二丁基錫、二順丁烯二酸二丁基錫、二月桂酸二丁基錫(DBTDL)、二乙酸二丁基錫、硫化二丁基錫、硫化三丁基錫、氧化三丁基錫、乙酸三丁基錫、三乙基乙醇錫、三丁基乙醇錫、氧化二辛基錫、氯化三丁基錫、三氯乙酸三丁基錫、2-乙基己酸錫等。 作為非錫系化合物，例如可列舉：二氯化二丁基鈦、鈦酸四丁酯、三氯丁氧基鈦等鈦系化合物；油酸鉛、2-乙基己酸鉛、苯甲酸鉛、環烷酸鉛等鉛系化合物；2-乙基己酸鐵、乙醯丙酮酸鐵等鐵系化合物；苯甲酸鈷、2-乙基己酸鈷等鈷系化合物；環烷酸鋅、2-乙基己酸鋅等鋅系化合物；環烷酸鋯等鋯系化合物等。 於獲得聚胺基甲酸酯多元醇時使用觸媒之情形時，於存在聚酯多元醇與聚醚多元醇兩種多元醇之系統中，因該等反應性之差異，若系統中之觸媒為單一種類，則易產生凝膠化或反應溶液混濁之問題。因此，藉由於獲得聚胺基甲酸酯多元醇時使用2種觸媒，而容易控制反應速度、觸媒之選擇性等，能夠解決該等問題。作為上述2種觸媒之組合，例如可列舉：三級胺/有機金屬系、錫系/非錫系、錫系/錫系，較佳為錫系/錫系，更佳為二月桂酸二丁基錫與2-乙基己酸錫之組合。其調配比以重量比計，2-乙基己酸錫/二月桂酸二丁基錫較佳為未達1，更佳為0.2～0.6。若調配比為1以上，則因觸媒活性之均衡性而存在易凝膠化之虞。 於獲得聚胺基甲酸酯多元醇時使用觸媒之情形時，相對於聚酯多元醇(a1)、聚醚多元醇(a2)及有機聚異氰酸酯化合物(a3)之總量，觸媒之使用量較佳為0.01～1.0重量%。 於獲得聚胺基甲酸酯多元醇時使用觸媒之情形時，反應溫度較佳為未達100℃，更佳為85℃～95℃。若為100℃以上，則存在難以控制反應速度、交聯結構之虞，存在難以獲得具有特定分子量之聚胺基甲酸酯多元醇之虞。 於獲得聚胺基甲酸酯多元醇時，亦可不使用觸媒。於該情形時，反應溫度較佳為100℃以上，更佳為110℃以上。又，於無觸媒條件下獲得聚胺基甲酸酯多元醇時，較佳為使之反應3小時以上。 作為獲得聚胺基甲酸酯多元醇之法，例如可列舉：1)將聚酯多元醇、聚醚多元醇、觸媒及有機聚異氰酸酯全部添加至燒瓶中之方法；2)將聚酯多元醇、聚醚多元醇及觸媒添加至燒瓶內，滴加有機聚異氰酸酯之方法。作為獲得聚胺基甲酸酯多元醇之方法，就反應控制之方面而言，較佳為2)之方法。 於獲得聚胺基甲酸酯多元醇時，可使用任意適宜之溶劑。作為此種溶劑，例如可列舉：甲基乙基酮、乙酸乙酯、甲苯、二甲苯、丙酮等。該等溶劑之中，較佳為甲苯。 作為多官能異氰酸酯化合物(B)，可援用上述者。 含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物可於無損本發明之效果之範圍內包含任意適宜之其他成分。作為此種其他成分，例如可列舉：聚胺基甲酸酯系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 作為由含有胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)之組合物所形成之聚胺基甲酸酯系樹脂之製造方法，只要為使用所謂「胺基甲酸酯預聚物」作為原料而製造聚胺基甲酸酯系樹脂之方法，則可採用任意適宜之製造方法。 胺基甲酸酯預聚物(C)之數量平均分子量Mn較佳為3000～1000000。 作為胺基甲酸酯預聚物(C)與多官能異氰酸酯化合物(B)中之NCO基與OH基之當量比，以NCO基/OH基表示，較佳為5.0以下，更佳為0.01～3.0，進而較佳為0.02～2.5，尤佳為0.03～2.25，最佳為0.05～2.0。藉由將NCO基/OH基之當量比調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 關於多官能異氰酸酯化合物(B)之含有比率，相對於胺基甲酸酯預聚物(C)，多官能異氰酸酯化合物(B)較佳為0.01重量%～30重量%，更佳為0.03重量%～20重量%，進而較佳為0.05重量%～15重量%，尤佳為0.075重量%～10重量%，最佳為0.1重量%～8重量%。藉由將多官能異氰酸酯化合物(B)之含有比率調整至上述範圍內，能夠提高黏著劑層之潤濕性，因此本發明之表面保護膜於貼附時能夠避免夾帶氣泡。 [丙烯酸系樹脂] 作為丙烯酸系樹脂，可於無損本發明之效果之範圍內採用例如日本專利特開2013-241606號方法等所記載之公知之丙烯酸系黏著劑等任意適宜之丙烯酸系黏著劑。 丙烯酸系樹脂可於無損本發明之效果之範圍內含有任意適宜之成分。作為此種成分，例如可列舉：丙烯酸系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 [橡膠系樹脂] 作為橡膠系樹脂，可於無損本發明之效果之範圍內採用例如日本專利特開2015-074771號公報等所記載之公知之橡膠系黏著劑等任意適宜之橡膠系黏著劑。該等可僅為1種，亦可為2種以上。 橡膠系樹脂可於無損本發明之效果之範圍內含有任意適宜之成分。作為此種成分，例如可列舉：橡膠系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 [聚矽氧系樹脂] 作為聚矽氧系黏著劑，可於無損本發明之效果之範圍內採用例如日本專利特開2014-047280號公報等所記載之公知之聚矽氧系黏著劑等任意適宜之聚矽氧系黏著劑。該等可僅為1種，亦可為2種以上。 聚矽氧系樹脂可於無損本發明之效果之範圍內含有任意適宜之成分。作為此種成分，例如可列舉：聚矽氧系樹脂以外之樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 ＜聚矽氧系添加劑＞ 聚矽氧系添加劑可於無損本發明之效果之範圍內採用任意適宜之聚矽氧系添加劑。作為此種聚矽氧系添加劑，可較佳地列舉選自含矽氧烷鍵之化合物、含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種。 聚矽氧系添加劑可僅為1種，亦可為2種以上。 作為含矽氧烷鍵之化合物，例如可列舉：於聚有機矽氧烷骨架(聚二甲基矽氧烷等)之主鏈或側鏈導入聚醚基而成之聚醚改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入聚酯基而成之聚酯改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入有機化合物而成之有機化合物導入聚有機矽氧烷、對(甲基)丙烯酸系樹脂導入聚有機矽氧烷而成之聚矽氧改性(甲基)丙烯酸系樹脂、對有機化合物導入聚有機矽氧烷而成之聚矽氧改性有機化合物、使有機化合物與聚矽氧化合物共聚合而成之含有聚矽氧之有機化合物等。關於此種含矽氧烷鍵之聚合物，作為市售品，例如可列舉：商品名「LE-302」(共榮社化學株式會社製造)、BYK-Chemie・Japan股份有限公司製造之BYK系列之調平劑(「BYK-300」、「BYK-301/302」、「BYK-306」、「BYK-307」、「BYK-310」、「BYK-315」、「BYK-313」、「BYK-320」、「BYK-322」、「BYK-323」、「BYK-325」、「BYK-330」、「BYK-331」、「BYK-333」、「BYK-337」、「BYK-341」、「BYK-344」、「BYK-345/346」、「BYK-347」、「BYK-348」、「BYK-349」、「BYK-370」、「BYK-375」、「BYK-377」、「BYK-378」、「BYK-UV3500」、「BYK-UV3510」、「BYK-UV3570」、「BYK-3550」、「BYK-SILCLEAN3700」、「BYK-SILCLEAN3720」等)、Algin Chemie公司製造之AC系列之調平劑(「AC FS180」、「AC FS360」、「AC S20」等)、共榮社化學股份有限公司製造之Polyflow系列之調平劑(「Polyflow KL-400X」、「Polyflow KL-400HF」、「Polyflow KL-401」、「Polyflow KL-402」、「Polyflow KL-403」、「Polyflow KL-404」等)、信越化學工業股份有限公司製造之KP系列之調平劑(「KP-323」、「KP-326」、「KP-341」、「KP-104」、「KP-110」、「KP-112」等)、信越化學工業公司製造之X22系列、KF系列等、Dow Corning Toray股份有限公司製造之調平劑(「LP-7001」、「LP-7002」、「8032ADDITIVE」、「57ADDITIVE」、「L-7604」、「FZ-2110」、「FZ-2105」、「67ADDITIVE」、「8618ADDITIVE」、「3ADDITIVE」、「56ADDITIVE」等)等。 作為含羥基之聚矽氧系化合物，例如可列舉：於聚有機矽氧烷骨架(聚二甲基矽氧烷等)之主鏈或側鏈導入聚醚基而成之聚醚改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入聚酯基而成之聚酯改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入有機化合物而成之有機化合物導入聚有機矽氧烷、對(甲基)丙烯酸系樹脂導入聚有機矽氧烷而成之聚矽氧改性(甲基)丙烯酸系樹脂、對有機化合物導入聚有機矽氧烷而成之聚矽氧改性有機化合物、使有機化合物與聚矽氧化合物共聚合而成之含有聚矽氧之有機化合物等。該等之中，羥基可為聚有機矽氧烷骨架所具有，亦可為聚醚基、聚酯基、(甲基)丙烯醯基、有機化合物所具有。關於此種含羥基之聚矽氧，作為市售品，例如可列舉：商品名「X-22-4015」、「X-22-4039」、「KF6000」、「KF6001」、「KF6002」、「KF6003」、「X-22-170BX」、「X-22-170DX」、「X-22-176DX」、「X-22-176F」(信越化學工業股份有限公司製造)，BYK-Chemie・Japan股份有限公司製造之「BYK-370」、「BYK-SILCLEAN3700」、「BYK-SILCLEAN3720」等。 作為含交聯性官能基之聚矽氧系化合物，例如可列舉：於聚有機矽氧烷骨架(聚二甲基矽氧烷等)之主鏈或側鏈導入聚醚基而成之聚醚改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入聚酯基而成之聚酯改性聚有機矽氧烷、於聚有機矽氧烷骨架之主鏈或側鏈導入有機化合物而成之有機化合物導入聚有機矽氧烷、對(甲基)丙烯酸系樹脂導入聚有機矽氧烷而成之聚矽氧改性(甲基)丙烯酸系樹脂、對有機化合物導入聚有機矽氧烷而成之聚矽氧改性有機化合物、使有機化合物與聚矽氧化合物共聚合而成之含有聚矽氧之有機化合物等。該等之中，交聯性官能基可為聚有機矽氧烷骨架所具有，亦可為聚醚基、聚酯基、(甲基)丙烯醯基、有機化合物所具有。作為交聯性官能基，可列舉：胺基、環氧基、巰基、羧基、異氰酸酯基、甲基丙烯酸酯基等。關於此種含有異氰酸酯基之聚矽氧，作為市售品，例如可列舉：Dow Corning Toray股份有限公司製造之「BY16-855」、「SF8413」、「BY16-839」、「SF8421」、「BY16-750」、「BY16-880」、「BY16-152C」，信越化學工業股份有限公司製造之「KF-868」、「KF-865」、「KF-864」、「KF-859」、「KF-393」、「KF-860」、「KF-880」、「KF-8004」、「KF-8002」、「KF-8005」、「KF-867」、「KF-8021」、「KF-869」、「KF-861」、「X-22-343」、「KF-101」、「X-22-2000」、「X-22-4741」、「KF-1002」、「KF-2001」、「X-22-3701E」、「X-22-164」、「X-22-164A」、「X-22-164B」、「X-22-164AS」、「X-22-2445」等。 ＜氟系添加劑＞ 作為氟系添加劑，可於無損本發明之效果之範圍內採用任意適宜之氟系添加劑。作為此種氟系添加劑，可較佳地列舉選自含氟化合物、含羥基之氟系化合物、含交聯性官能基之氟系化合物中之至少一種。 氟系添加劑可僅為1種，亦可為2種以上。 作為含氟化合物，例如可列舉：具有氟脂肪族烴骨架之化合物、使有機化合物與氟化合物共聚合而成之含氟有機化合物、包含有機化合物之含氟化合物等。作為氟脂肪族烴骨架，例如可列舉：氟甲烷、氟乙烷、氟丙烷、氟異丙烷、氟丁烷、氟異丁烷、氟第三丁烷、氟戊烷、氟己烷等氟C1-C10烷烴等。作為此種含氟化合物，作為市售品，例如可列舉：AGC Seimi Chemical股份有限公司製造之Surflon系列之調平劑(「S-242」、「S-243」、「S-420」、「S-611」、「S-651」、「S-386」等)，BYK-Chemie・Japan股份有限公司製造之BYK系列之調平劑(「BYK-340」等)，Algin Chemie公司製造之AC系列之調平劑(「AC 110a」、「AC 100a」等)，DIC股份有限公司製造之MEGAFAC系列之調平劑(「MEGAFAC F-114」、「MEGAFAC F-410」、「MEGAFAC F-444」、「MEGAFAC EXP TP-2066」、「MEGAFAC F-430」、「MEGAFAC F-472SF」、「MEGAFAC F-477」、「MEGAFAC F-552」、「MEGAFAC F-553」、「MEGAFAC F-554」、「MEGAFAC F-555」、「MEGAFAC R-94」、「MEGAFAC RS-72-K」、「MEGAFAC RS-75」、「MEGAFAC F-556」、「MEGAFAC EXP TF-1367」、「MEGAFAC EXP TF-1437」、「MEGAFAC F-558」、「MEGAFAC EXP TF-1537」等)，Sumitomo 3M股份有限公司製造之FC系列之調平劑(「FC-4430」、「FC-4432」等)，NEOS股份有限公司製造之FTERGENT系列之調平劑(「FTERGENT 100」、「FTERGENT 100C」、「FTERGENT 110」、「FTERGENT 150」、「FTERGENT 150CH」、「FTERGENT A-K」、「FTERGENT 501」、「FTERGENT 250」、「FTERGENT 251」、「FTERGENT 222F」、「FTERGENT 208G」、「FTERGENT 300」、「FTERGENT 310」、「FTERGENT 400SW」等)，北村化學產業股份有限公司製造之PF系列之調平劑(「PF-136A」、「PF-156A」、「PF-151N」、「PF-636」、「PF-6320」、「PF-656」、「PF-6520」、「PF-651」、「PF-652」、「PF-3320」等)等。 作為含羥基之氟系化合物，例如可使用先前公知之樹脂，例如可列舉國際公開第94/06870號說明書、日本專利特開平8-12921號公報、日本專利特開平10-72569號公報、日本專利特開平4-275379號公報、國際公開第97/11130號說明書、國際公開第96/26254號說明書等中所記載之含羥基之氟樹脂。作為其他之含羥基之氟樹脂，例如可列舉日本專利特開平8-231919號公報、日本專利特開平10-265731號公報、日本專利特開平10-204374號公報、日本專利特開平8-12922號公報等中所記載之氟烯烴共聚物等。另外，亦可列舉：含羥基之化合物中具有經氟化之烷基之化合物的共聚物、使含羥基之化合物與含氟化合物共聚合而成之含氟有機化合物、含有含羥基之有機化合物之含氟化合物等。作為此種含羥基之氟系化合物，作為市售品，例如可列舉：商品名「Lumiflon」(旭硝子股份有限公司製造)、商品名「Cefral Coat」(Central Glass股份有限公司製造)、商品名「Zaffron」(東亞合成股份有限公司製造)、商品名「Zeffle」(Daikin Industries股份有限公司製造)、商品名「MEGAFAC F-571」、「Fluonate」(DIC股份有限公司製造)等。 作為含交聯性官能基之氟系化合物，例如可列舉：如全氟辛酸等之具有經氟化之烷基之羧酸化合物、含交聯性官能基之化合物中具有經氟化之烷基之化合物的共聚物、使含交聯性官能基之化合物與含氟化合物共聚合而成之含氟有機化合物、含有含交聯性官能基之化合物之含氟化合物等。作為此種含交聯性官能基之氟系化合物，作為市售品，例如可列舉：商品名「MEGAFAC  F-570」、「MEGAFAC RS-55」、「MEGAFAC RS-56」、「MEGAFAC RS-72-K」、「MEGAFAC RS-75」、「MEGAFAC RS-76-E」、「MEGAFAC RS-76-NS」、「MEGAFAC RS-78」、「MEGAFAC RS-90」(DIC股份有限公司製造)等。 ＜其他成分＞ 黏著劑組合物可於無損本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可列舉：其他樹脂成分、黏著賦予劑、無機填充劑、有機填充劑、金屬粉、顏料、箔狀物、軟化劑、防老化劑、導電劑、紫外線吸收劑、抗氧化劑、光穩定劑、表面潤滑劑、調平劑、防腐蝕劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。 黏著劑組合物亦可包含脂肪酸酯。脂肪酸酯可僅為1種，亦可為2種以上。 脂肪酸酯之數量平均分子量Mn較佳為100～800，更佳為150～500，進而較佳為200～480，尤佳為200～400，最佳為250～350。藉由將脂肪酸酯之數量平均分子量Mn調整至上述範圍內，能夠提高黏著劑層之潤濕性。 作為脂肪酸酯，可於無損本發明之效果之範圍內採用任意適宜之脂肪酸酯。作為此種脂肪酸酯，例如可列舉：聚氧乙烯雙酚A月桂酸酯、硬脂酸丁酯、棕櫚酸2-乙基己酯、硬脂酸2-乙基己酯、山萮酸單甘油酯、2-乙基己酸鯨蠟酯、肉豆蔻酸異丙酯、棕櫚酸異丙酯、異硬脂酸膽固醇酯、甲基丙烯酸月桂酯、椰子油脂肪酸甲酯、月桂酸甲酯、油酸甲酯、硬脂酸甲酯、肉豆蔻酸肉豆蔻酯、肉豆蔻酸辛基十二烷基酯、季戊四醇單油酸酯、季戊四醇單硬脂酸酯、季戊四醇四棕櫚酸酯、硬脂酸硬脂酯、硬脂酸異十三烷基酯、2-乙基己酸三甘油酯、月桂酸丁酯、油酸辛酯等。 於黏著劑組合物包含脂肪酸酯之情形時，關於脂肪酸酯之含有比率，相對於基礎聚合物100重量份，較佳為1重量份～50重量份，更佳為1.5重量份～45重量份，進而較佳為2重量份～40重量份，尤佳為2.5重量份～35重量份，最佳為3重量份～30重量份。 黏著劑組合物亦可含有包含氟有機陰離子之離子性液體。藉由黏著劑組合物含有包含氟有機陰離子之離子性液體，可提供抗靜電性非常優異之黏著劑組合物。此種離子性液體可僅為1種，亦可為2種以上。 本發明中，所謂離子性液體意指於25℃下呈液狀之熔鹽(離子性化合物)。 作為離子性液體，只要為包含氟有機陰離子之離子性液體，則可於無損本發明之效果之範圍內採用任意適宜之離子性液體。作為此種離子性液體，較佳為由氟有機陰離子與鎓陽離子構成之離子性液體。藉由採用由氟有機陰離子與鎓陽離子構成之離子性液體作為離子性液體，可提供抗靜電性極優異之黏著劑組合物。 作為能夠構成離子性液體之鎓陽離子，可於無損本發明之效果之範圍內採用任意適宜之鎓陽離子。作為此種鎓陽離子，較佳為選自含氮之鎓陽離子、含硫之鎓陽離子、含磷之鎓陽離子中之至少一種。藉由選擇該等鎓陽離子，可提供抗靜電性極優異之黏著劑組合物。 作為能夠構成離子性液體之鎓陽離子，較佳為選自具有通式(1)～(5)所表示之結構之陽離子中之至少一種。 [化1]

Figure 02_image001
通式(1)中，Ra表示碳數4～20之烴基，亦可包含雜原子，Rb及Rc相同或不同，表示氫或碳數1～16之烴基，亦可包含雜原子。其中，於氮原子包含雙鍵之情形時，無Rc。 通式(2)中，Rd表示碳數2～20之烴基，亦可包含雜原子，Re、Rf及Rg相同或不同，表示氫或碳數1～16之烴基，亦可包含雜原子。 通式(3)中，Rh表示碳數2～20之烴基，亦可包含雜原子，Ri、Rj及Rk相同或不同，表示氫或碳數1～16之烴基，亦可包含雜原子。 通式(4)中，Z表示氮原子、硫原子或磷原子，Rl、Rm、Rn及Ro相同或不同，表示碳數1～20之烴基，亦可包含雜原子。其中，於Z為硫原子之情形時，無Ro。 通式(5)中，X表示Li原子、Na原子或K原子。 作為通式(1)所表示之陽離子，例如可列舉：吡啶鎓陽離子、吡咯烷鎓陽離子、哌啶鎓陽離子、具有吡咯啉骨架之陽離子、具有吡咯骨架之陽離子等。 作為通式(1)所表示之陽離子之具體例，例如可列舉：1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-乙基-3-甲基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-辛基-4-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子、1,1-二甲基吡咯烷鎓陽離子等吡啶鎓陽離子；1-乙基-1-甲基吡咯烷鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丁基吡咯烷鎓陽離子、1-甲基-1-戊基吡咯烷鎓陽離子、1-甲基-1-己基吡咯烷鎓陽離子、1-甲基-1-庚基吡咯烷鎓陽離子、1-乙基-1-丙基吡咯烷鎓陽離子、1-乙基-1-丁基吡咯烷鎓陽離子、1-乙基-1-戊基吡咯烷鎓陽離子、1-乙基-1-己基吡咯烷鎓陽離子、1-乙基-1-庚基吡咯烷鎓陽離子、1,1-二丙基吡咯烷鎓陽離子、1-丙基-1-丁基吡咯烷鎓陽離子、1,1-二丁基吡咯烷鎓陽離子等吡咯烷鎓陽離子；1-丙基哌啶鎓陽離子、1-戊基哌啶鎓陽離子、1-甲基-1-乙基哌啶鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子、1-甲基-1-丁基哌啶鎓陽離子、1-甲基-1-戊基哌啶鎓陽離子、1-甲基-1-己基哌啶鎓陽離子、1-甲基-1-庚基哌啶鎓陽離子、1-乙基-1-丙基哌啶鎓陽離子、1-乙基-1-丁基哌啶鎓陽離子、1-乙基-1-戊基哌啶鎓陽離子、1-乙基-1-己基哌啶鎓陽離子、1-乙基-1-庚基哌啶鎓陽離子、1-丙基-1-丁基哌啶鎓陽離子、1,1-二甲基哌啶鎓陽離子、1,1-二丙基哌啶鎓陽離子、1,1-二丁基哌啶鎓陽離子等哌啶鎓陽離子；2-甲基-1-吡咯啉陽離子；1-乙基-2-苯基吲哚陽離子；1,2-二甲基吲哚陽離子；1-乙基咔唑陽離子等。 該等之中，更能表現出本發明之效果之方面而言，可較佳地列舉：1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-乙基-3-甲基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-辛基-4-甲基吡啶鎓陽離子等吡啶鎓陽離子，1-乙基-1-甲基吡咯烷鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丁基吡咯烷鎓陽離子、1-甲基-1-戊基吡咯烷鎓陽離子、1-甲基-1-己基吡咯烷鎓陽離子、1-甲基-1-庚基吡咯烷鎓陽離子、1-乙基-1-丙基吡咯烷鎓陽離子、1-乙基-1-丁基吡咯烷鎓陽離子、1-乙基-1-戊基吡咯烷鎓陽離子、1-乙基-1-己基吡咯烷鎓陽離子、1-乙基-1-庚基吡咯烷鎓陽離子等吡咯烷鎓陽離子，1-甲基-1-乙基哌啶鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子、1-甲基-1-丁基哌啶鎓陽離子、1-甲基-1-戊基哌啶鎓陽離子、1-甲基-1-己基哌啶鎓陽離子、1-甲基-1-庚基哌啶鎓陽離子、1-乙基-1-丙基哌啶鎓陽離子、1-乙基-1-丁基哌啶鎓陽離子、1-乙基-1-戊基哌啶鎓陽離子、1-乙基-1-己基哌啶鎓陽離子、1-乙基-1-庚基哌啶鎓陽離子、1-丙基-1-丁基哌啶鎓陽離子等哌啶鎓陽離子等；更佳為1-己基吡啶鎓陽離子、1-乙基-3-甲基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-辛基-4-甲基吡啶鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子。 作為通式(2)所表示之陽離子，例如可列舉：咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。 作為通式(2)所表示之陽離子之具體例，例如可列舉：1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子、1,2-二甲基-3-丙基咪唑鎓陽離子、1-乙基-2,3-二甲基咪唑鎓陽離子、1-丁基-2,3-二甲基咪唑鎓陽離子、1-己基-2,3-二甲基咪唑鎓陽離子等咪唑鎓陽離子；1,3-二甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3-三甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,5-四甲基-1,4,5,6-四氫嘧啶鎓陽離子等四氫嘧啶鎓陽離子；1,3-二甲基-1,4-二氫嘧啶鎓陽離子、1,3-二甲基-1,6-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,4-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,6-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,6-二氫嘧啶鎓陽離子等二氫嘧啶鎓陽離子等。 該等之中，更能表現出本發明之效果之方面而言，較佳為1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子等咪唑鎓陽離子，更佳為1-乙基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子。 作為通式(3)所表示之陽離子，例如可列舉：吡唑鎓陽離子、吡唑啉鎓陽離子等。 作為通式(3)所表示之陽離子之具體例，例如可列舉：1-甲基吡唑鎓陽離子、3-甲基吡唑鎓陽離子、1-乙基-2-甲基吡唑啉鎓陽離子、1-乙基-2,3,5-三甲基吡唑鎓陽離子、1-丙基-2,3,5-三甲基吡唑鎓陽離子、1-丁基-2,3,5-三甲基吡唑鎓陽離子等吡唑鎓陽離子；1-乙基-2,3,5-三甲基吡唑啉鎓陽離子、1-丙基-2,3,5-三甲基吡唑啉鎓陽離子、1-丁基-2,3,5-三甲基吡唑啉鎓陽離子等吡唑啉鎓陽離子等。 作為通式(4)所表示之陽離子，例如可列舉：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子、或者上述烷基之一部分被取代為烯基或烷氧基、進而環氧基而成者等。 作為通式(4)所表示之陽離子之具體例，例如可列舉：四甲基銨陽離子、四乙基銨陽離子、四丁基銨陽離子、四戊基銨陽離子、四己基銨陽離子、四庚基銨陽離子、三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基丙基銨陽離子、三甲基癸基銨陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、三甲基鋶陽離子、三乙基鋶陽離子、三丁基鋶陽離子、三己基鋶陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、四甲基鏻陽離子、四乙基鏻陽離子、四丁基鏻陽離子、四己基鏻陽離子、四辛基鏻陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子、二烯丙基二甲基銨陽離子等。 該等之中，更能表現出本發明之效果之方面而言，可較佳地列舉：三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等非對稱之四烷基銨陽離子，三烷基鋶陽離子、四烷基鏻陽離子、或N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、二烯丙基二甲基銨陽離子、N,N-二甲基-N-乙基-N-丙基銨陽離子、N,N-二甲基-N-乙基-N-丁基銨陽離子、N,N-二甲基-N-乙基-N-戊基銨陽離子、N,N-二甲基-N-乙基-N-己基銨陽離子、N,N-二甲基-N-乙基-N-庚基銨陽離子、N,N-二甲基-N-乙基-N-壬基銨陽離子、N,N-二甲基-N,N-二丙基銨陽離子、N,N-二乙基-N-丙基-N-丁基銨陽離子、N,N-二甲基-N-丙基-N-戊基銨陽離子、N,N-二甲基-N-丙基-N-己基銨陽離子、N,N-二甲基-N-丙基-N-庚基銨陽離子、N,N-二甲基-N-丁基-N-己基銨陽離子、N,N-二乙基-N-丁基-N-庚基銨陽離子、N,N-二甲基-N-戊基-N-己基銨陽離子、N,N-二甲基-N,N-二己基銨陽離子、三甲基庚基銨陽離子、N,N-二乙基-N-甲基-N-丙基銨陽離子、N,N-二乙基-N-甲基-N-戊基銨陽離子、N,N-二乙基-N-甲基-N-庚基銨陽離子、N,N-二乙基-N-丙基-N-戊基銨陽離子、三乙基丙基銨陽離子、三乙基戊基銨陽離子、三乙基庚基銨陽離子、N,N-二丙基-N-甲基-N-乙基銨陽離子、N,N-二丙基-N-甲基-N-戊基銨陽離子、N,N-二丙基-N-丁基-N-己基銨陽離子、N,N-二丙基-N,N-二己基銨陽離子、N,N-二丁基-N-甲基-N-戊基銨陽離子、N,N-二丁基-N-甲基-N-己基銨陽離子、三辛基甲基銨陽離子、N-甲基-N-乙基-N-丙基-N-戊基銨陽離子等，更佳為三甲基丙基銨陽離子。 作為能夠構成離子性液體之氟有機陰離子，可於無損本發明之效果之範圍內採用任意適宜之氟有機陰離子。此種氟有機陰離子可完全經氟化(全氟化)，亦可部分經氟化。 作為此種氟有機陰離子，例如可列舉：經氟化之芳基磺酸鹽、全氟烷磺酸鹽、雙(氟磺醯基)醯亞胺、雙(全氟烷磺醯基)醯亞胺、氰基全氟烷磺醯基醯胺、雙(氰基)全氟烷磺醯基甲基化物、氰基-雙-(全氟烷磺醯基)甲基化物、三(全氟烷磺醯基)甲基化物、三氟乙酸鹽、全氟烷化物、三(全氟烷磺醯基)甲基化物、(全氟烷磺醯基)三氟乙醯胺等。 該等氟有機陰離子之中，更佳為全氟烷基磺酸鹽、雙(氟磺醯基)醯亞胺、雙(全氟烷磺醯基)醯亞胺，更具體而言，例如為三氟甲磺酸鹽、五氟乙磺酸鹽、七氟丙磺酸鹽、九氟丁磺酸鹽、雙(氟磺醯基)醯亞胺、雙(三氟甲磺醯基)醯亞胺。 作為離子性液體之具體例，可適當選用上述陽離子成分與上述陰離子成分之組合。作為此種離子性液體之具體例，例如可列舉：1-己基吡啶鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基吡啶鎓三氟甲磺酸鹽、1-乙基-3-甲基吡啶鎓五氟乙磺酸鹽、1-乙基-3-甲基吡啶鎓七氟丙磺酸鹽、1-乙基-3-甲基吡啶鎓九氟丁磺酸鹽、1-丁基-3-甲基吡啶鎓三氟甲磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)醯亞胺、1-丁基-3-甲基吡啶鎓雙(五氟乙磺醯基)醯亞胺、1-辛基-4-甲基吡啶鎓雙(氟磺醯基)醯亞胺、1,1-二甲基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-乙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-戊基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-己基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-庚基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-戊基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-己基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-庚基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-丙基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二甲基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-乙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-己基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-庚基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-己基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-庚基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-丙基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二甲基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺，1-甲基-1-乙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-戊基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-己基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-庚基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-戊基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-己基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-庚基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-丙基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二甲基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-乙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-己基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-庚基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-己基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-庚基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-丙基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓三氟乙酸鹽、1-乙基-3-甲基咪唑鎓七氟丁酸鹽、1-乙基-3-甲基咪唑鎓三氟甲磺酸鹽、1-乙基-3-甲基咪唑鎓七氟丙磺酸鹽、1-乙基-3-甲基咪唑鎓九氟丁磺酸鹽、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓三(三氟甲磺醯基)甲基化物、1-丁基-3-甲基咪唑鎓三氟乙酸鹽、1-丁基-3-甲基咪唑鎓七氟丁酸鹽、1-丁基-3-甲基咪唑鎓三氟甲磺酸鹽、1-丁基-3-甲基咪唑鎓全氟丁磺酸鹽、1-丁基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-己基-3-甲基咪唑鎓三氟甲磺酸鹽、1-己基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、1,2-二甲基-3-丙基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-2,3,5-三甲基吡唑鎓雙(三氟甲磺醯基)醯亞胺、1-丙基-2,3,5-三甲基吡唑鎓雙(三氟甲磺醯基)醯亞胺、1-丁基-2,3,5-三甲基吡唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-2,3,5-三甲基吡唑鎓雙(五氟乙磺醯基)醯亞胺、1-丙基-2,3,5-三甲基吡唑鎓雙(五氟乙磺醯基)醯亞胺、1-丁基-2,3,5-三甲基吡唑鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-2,3,5-三甲基吡唑鎓(三氟甲磺醯基)三氟乙醯胺、1-丙基-2,3,5-三甲基吡唑鎓(三氟甲磺醯基)三氟乙醯胺、1-丁基-2,3,5-三甲基吡唑鎓(三氟甲磺醯基)三氟乙醯胺、三甲基丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-丁基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-壬基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N,N-二丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-丁基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丁基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丁基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-戊基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N,N-二己基銨雙(三氟甲磺醯基)醯亞胺、三甲基庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N,N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、三乙基丙基銨雙(三氟甲磺醯基)醯亞胺、三乙基戊基銨雙(三氟甲磺醯基)醯亞胺、三乙基庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-甲基-N-乙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-丁基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N,N-二己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丁基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丁基-N-甲基-N-己基銨雙(三氟甲磺醯基)醯亞胺、三辛基甲基銨雙(三氟甲磺醯基)醯亞胺、N-甲基-N-乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、1-丁基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-丁基-3-甲基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-乙基-3-甲基咪唑鎓(三氟甲磺醯基)三氟乙醯胺、四己基銨雙(三氟甲磺醯基)醯亞胺、二烯丙基二甲基銨三氟甲磺酸鹽、二烯丙基二甲基銨雙(三氟甲磺醯基)醯亞胺、二烯丙基二甲基銨雙(五氟乙磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨三氟甲磺酸鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(五氟乙磺醯基)醯亞胺、縮水甘油基三甲基銨三氟甲磺酸鹽、縮水甘油基三甲基銨雙(三氟甲磺醯基)醯亞胺、縮水甘油基三甲基銨雙(五氟乙磺醯基)醯亞胺、二烯丙基二甲基銨雙(三氟甲磺醯基)醯亞胺、二烯丙基二甲基雙(五氟乙磺醯基)醯亞胺、鋰雙(三氟甲磺醯基)醯亞胺、鋰雙(氟磺醯基)醯亞胺等。 該等離子性液體之中，更佳為1-己基吡啶鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基吡啶鎓三氟甲磺酸鹽、1-乙基-3-甲基吡啶鎓五氟乙磺酸鹽、1-乙基-3-甲基吡啶鎓七氟丙磺酸鹽、1-乙基-3-甲基吡啶鎓九氟丁磺酸鹽、1-丁基-3-甲基吡啶鎓三氟甲磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)醯亞胺、1-辛基-4-甲基吡啶鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓三氟甲磺酸鹽、1-乙基-3-甲基咪唑鎓七氟丙磺酸鹽、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、1-己基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、三甲基丙基銨雙(三氟甲磺醯基)醯亞胺、鋰雙(三氟甲磺醯基)醯亞胺、鋰雙(氟磺醯基)醯亞胺。 離子性液體可使用市售者，但亦可藉由如下方式合成。作為離子性液體之合成方法，只要可獲得目標離子性液體，則並無特別限定，通常採用如文獻「離子性液體-開發之最前沿與未來-」(CMC股份有限公司出版發行)所記載之鹵化物法、氫氧化物法、酸酯法、錯合反應法及中和法等。 下述針對鹵化物法、氫氧化物法、酸酯法、錯合反應法及中和法，以含氮之鎓鹽為例而揭示其合成方法，但關於其他之含硫之鎓鹽、含磷之鎓鹽等其他離子性液體，亦可藉由相同方法獲得。 鹵化物法係藉由如反應式(1)～(3)所示之反應而進行之方法。首先，使三級胺與鹵化烷基反應而獲得鹵化物(反應式(1)，作為鹵素，使用氯、溴、碘)。 使所獲得之鹵化物與具有目標離子性液體之陰離子結構(A- )的酸(HA)或鹽(MA，M為銨、鋰、鈉、鉀等會與目標陰離子形成鹽之陽離子)反應而獲得目標離子性液體(R4 NA)。 [化2]
Figure 02_image003
氫氧化物法係藉由如反應式(4)～(8)所示之反應而進行之方法。首先，利用離子交換膜法電解(反應式(4))、OH型離子交換樹脂法(反應式(5))或與氧化銀(Ag2 O)之反應(反應式(6))，由鹵化物(R4 NX)獲得氫氧化物(R4 NOH)(作為鹵素，使用氯、溴、碘)。 針對所獲得之氫氧化物，與上述鹵化法同樣地藉由採用反應式(7)～(8)之反應而獲得目標離子性液體(R4 NA)。 [化3]
Figure 02_image005
酸酯法係藉由如反應式(9)～(11)所示之反應而進行之方法。首先，使三級胺(R3 N)與酸酯反應而獲得酸酯物(反應式(9)，作為酸酯，使用硫酸、亞硫酸、磷酸、亞磷酸、碳酸等無機酸之酯、或者甲磺酸、甲基膦酸、甲酸等有機酸之酯等)。 針對所獲得之酸酯物，與上述鹵化法同樣地藉由採用反應式(10)～(11)之反應而獲得目標離子性液體(R4 NA)。又，亦可藉由使用三氟甲磺酸甲酯、三氟乙酸甲酯等作為酸酯而獲得直接離子性液體。 [化4]
Figure 02_image007
中和法係藉由如反應式(12)所示之反應而進行之方法。可藉由使三級胺與CF3 COOH、CF3 SO3 H、(CF3 SO2 )2 NH、(CF3 SO2 )3 CH、(C2 F5 SO2 )2 NH等有機酸反應而獲得。 [化5]
Figure 02_image009
上述反應式(1)～(12)中記載之R表示氫或碳數1～20之烴基，亦可包含雜原子。 作為離子性液體之調配量，根據所使用之聚合物與離子性液體之相溶性而有所改變，因此不可一概而論，一般而言，相對於基礎聚合物100重量份，較佳為0.001重量份～50重量份，更佳為0.01重量份～40重量份，進而較佳為0.01重量份～30重量份，尤佳為0.01重量份～20重量份，最佳為0.01重量份～10重量份。藉由將離子性液體之調配量調整至上述範圍內，可提供抗靜電性非常優異之黏著劑組合物。若離子性液體之上述調配量未達0.01重量份，則存在無法獲得充分之抗靜電特性之虞。若離子性液體之上述調配量超過50重量份，則存在對被黏著體之污染變嚴重之傾向。 黏著劑組合物亦可於無損本發明之效果之範圍內包含改性聚矽氧油。藉由黏著劑組合物包含改性聚矽氧油，能夠表現出抗靜電特性之效果。尤其藉由與離子性液體併用，能夠更有效地表現出抗靜電特性之效果。 於黏著劑組合物包含改性聚矽氧油之情形時，關於其含有比率，相對於基礎聚合物100重量份，較佳為0.001重量份～50重量份，更佳為0.005重量份～40重量份，進而較佳為0.007重量份～30重量份，尤佳為0.008重量份～20重量份，最佳為0.01重量份～10重量份。藉由將改性聚矽氧油之含有比率調整至上述範圍內，能夠更有效地表現出抗靜電特性之效果。 作為改性聚矽氧油，可於無損本發明之效果之範圍內採用任意適宜之改性聚矽氧油。作為此種改性聚矽氧油，例如可列舉能夠從信越化學工業股份有限公司購得之改性聚矽氧油。 作為改性聚矽氧油，較佳為聚醚改性聚矽氧油。藉由採用聚醚改性聚矽氧油，能夠更有效地表現出抗靜電特性之效果。 作為聚醚改性聚矽氧油，可列舉：側鏈型之聚醚改性聚矽氧油、兩末端型之聚醚改性聚矽氧油等。該等之中，就能夠充分地更有效地表現出抗靜電特性之效果之方面而言，較佳為兩末端型之聚醚改性聚矽氧油。 ≪≪用途≫≫ 本發明之表面保護膜具備超輕剝離性，被黏著體表面之污染性較低。因此，可較佳地用於光學構件或電子構件之表面保護。本發明之光學構件係貼附有本發明之表面保護膜者。本發明之電子構件係貼附有本發明之表面保護膜者。 [實施例] 以下，藉由實施例而具體地說明本發明，但本發明不受該等實施例之任何限定。再者，實施例等中之試驗及評價方法如下所述。再者，於記載有「份」之情形時，只要無特別說明，則意指「重量份」，於記載有「%」之情形時，只要無特別說明，則意指「重量%」。 ＜剝離速度6000 mm/min下之對PET剝離力(23℃×30分鐘後之剝離力及80℃×7天後之剝離力)＞ 對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，將該聚對苯二甲酸乙二酯膜於23℃、剝離角度180度、剝離速度6000 mm/min下進行剝離，藉由如下方式測定此時之剝離力。 於已將隔離件剝離之表面保護膜(寬度50 mm×長度140 mm)之與黏著劑層相反一側之面之整個面，使用2 kg手壓輥，經由雙面膠帶(日東電工公司製造，商品名「No.531」)而貼附SUS304板。 繼而，於黏著劑層之表面貼附聚對苯二甲酸乙二酯膜(Toray公司製造，商品名「Lumirror S-10」，厚度：25 μm、寬度：25 mm)(溫度：23℃，濕度：65%，使2 kg輥往返1次)。 藉由拉伸試驗對以如上方式獲得之評價用試樣進行測定。作為拉伸試驗機，使用島津製作所公司製造之商品名「Autograph AG-Xplus HS 6000 mm/min高速模式(AG-50NX plus)」。將評價用試樣設置於拉伸試驗機後，於23℃之環境溫度下放置30分鐘後或於80℃之溫度環境下放置7天後，開始進行拉伸試驗。拉伸試驗之條件設為剝離角度：180度、剝離速度(拉伸速度)：6000 mm/min。測定自上述表面保護膜剝離PET膜時之荷重，將此時之平均荷重作為表面保護膜之剝離力。 ＜剝離速度300 mm/min下之對PET剝離力(23℃×30分鐘後之剝離力及80℃×7天後之剝離力)＞ 對黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，將該聚對苯二甲酸乙二酯膜於23℃、剝離角度180度、剝離速度300 mm/min下進行剝離，藉由如下方式測定此時之剝離力。 於已將隔離件剝離之表面保護膜(寬度50 mm×長度140 mm)之與黏著劑層相反一側之面之整個面，使用2 kg手壓輥，經由雙面膠帶(日東電工公司製造，商品名「No.531」)而貼附SUS304板。 繼而，於黏著劑層之表面貼附聚對苯二甲酸乙二酯膜(Toray公司製造，商品名「Lumirror S-10」，厚度：25 μm、寬度：25 mm)(溫度：23℃，濕度：65%，使2 kg輥往返1次)。 將以如上方式獲得之評價用試樣供於拉伸試驗。作為拉伸試驗機，使用島津製作所公司製造之商品名「Autograph AG-Xplus HS 6000 mm/min高速模式(AG-50NX plus)」。將評價用試樣設置於拉伸試驗機後，於23℃之環境溫度下放置30分鐘後或於80℃之溫度環境下放置7天後，開始進行拉伸試驗。拉伸試驗之條件設為剝離角度：180度、剝離速度(拉伸速度)：300 mm/min。測定自上述表面保護膜剝離PET膜時之荷重，將此時之平均荷重作為表面保護膜之剝離力。 ＜殘存接著率＞ 使用手壓輥，於玻璃板(松浪硝子製造，1.35 mm×10 cm×10 cm)之整個面貼合表面保護膜，於溫度23℃、濕度55%RH之環境下保管24小時後，以0.3 m/min之速度剝離表面保護膜，於溫度23℃、濕度55%RH之環境下，藉由使2.0 kg輥往返1次而貼附所切出之長度150 mm、寬度19 mm之No.31B膠帶(日東電工股份有限公司製造，基材厚度：25 μm)。於溫度23℃、濕度55%RH之環境下固化30分鐘後，使用拉伸試驗機(島津製作所公司製造之商品名「Autograph AG-Xplus HS 6000 mm/min高速模式(AG-50NX plus)」)，於剝離角度180度、拉伸速度300 mm/min下進行剝離，測定黏著力。 另外，對未經如上之處理之玻璃板，亦同樣地測定寬度19 mm之No.31B膠帶之黏著力，根據下式而算出殘存接著率。 殘存接著率(%)＝(對表面保護膜剝離後之玻璃板之No.31B黏著力/對玻璃板之No.31B黏著力)×100 該殘存接著率成為表面保護膜之黏著劑成分於被黏著體表面之轉印程度或對被黏著體表面之污染程度之指標。殘存接著率之值越高，則越可謂不會污染被黏著體之優質之表面保護膜，殘存接著率之值越低，則越可謂被黏著體之表面受到黏著劑成分等之污染。 ＜剝離速度6000 mm/min下之對玻璃剝離力(23℃×30分鐘後之剝離力及80℃×7天後之剝離力)＞ 藉由使2 kg手壓輥往返一次，而於玻璃(鈉鈣玻璃，松浪硝子工業股份有限公司製造)上貼附已將隔離件剝離之表面保護膜(寬度25 mm×長度140 mm)。 利用拉伸試驗機對以如上方式獲得之評價用試樣進行測定。作為拉伸試驗機，使用島津製作所公司製造之商品名「Autograph AG-Xplus HS 6000 mm/min高速模式(AG-50NX plus)」。將評價用試樣設置於拉伸試驗機後，於23℃之環境溫度下放置30分鐘後或於80℃之溫度環境下放置7天後，開始進行拉伸試驗。拉伸試驗之條件設為剝離角度：180度、剝離速度(拉伸速度)：6000 mm/min。測定自上述玻璃剝離表面保護膜時之荷重，將此時之平均荷重作為表面保護膜之剝離力。 ＜剝離速度300 mm/min下之對玻璃剝離力(23℃×30分鐘後之剝離力及80℃×7天後之剝離力)＞ 藉由使2 kg手壓輥往返一次，而於玻璃(鈉鈣玻璃，松浪硝子工業股份有限公司製造)上貼附已將隔離件剝離之表面保護膜(寬度25 mm×長度140 mm)。 利用拉伸試驗機對以如上方式獲得之評價用試樣進行測定。作為拉伸試驗機，使用島津製作所公司製造之商品名「Autograph AG-Xplus HS 6000 mm/min高速模式(AG-50NX plus)」。將評價用試樣設置於拉伸試驗機後，於23℃之環境溫度下放置30分鐘後或於80℃之溫度環境下放置7天後，開始進行拉伸試驗。拉伸試驗之條件設為剝離角度：180度、剝離速度(拉伸速度)：300 mm/min。測定自上述玻璃剝離表面保護膜時之荷重，將此時之平均荷重作為表面保護膜之剝離力。 [實施例1] 添加作為多元醇(A)之作為具有3個OH基之多元醇的PREMINOL S3011(旭硝子股份有限公司製造，Mn＝10000)：85重量份、作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：13重量份、作為具有3個OH基之多元醇的SANNIX GP-1000(三洋化成股份有限公司製造，Mn＝1000)：2重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：18重量份、觸媒(日本化學產業股份有限公司製造，商品名：Nacem Fe(III)：0.1重量份、作為脂肪酸酯之肉豆蔻酸異丙酯(花王股份有限公司製造，商品名：EXCEPARL IPM，Mn＝270)：20重量份、1-乙基-3-甲基咪唑鎓雙(氟甲磺醯基)醯亞胺(第一工業製藥股份有限公司製造，商品名：AS110)：1.5重量份、兩末端型之聚醚改性聚矽氧油(信越化學工業股份有限公司製造，商品名：KF-6004)：0.02重量份、含矽氧烷鍵之聚合物(共榮社化學股份有限公司製造，商品名：LE-302)：0.25重量份、作為稀釋溶劑之乙酸乙酯，進行混合攪拌，而製造黏著劑組合物(1)。 利用槽輥，將所獲得之黏著劑組合物(1)以乾燥後之厚度成為10 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化(cure)乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(1)。 將結果示於表1。 [實施例2] 不使用1-乙基-3-甲基咪唑鎓雙(氟甲磺醯基)醯亞胺(第一工業製藥股份有限公司製造，商品名：AS110)，進而使用含氟聚合物(DIC製造，商品名：F-571)：0.50重量份代替含矽氧烷鍵之聚合物(共榮社化學股份有限公司製造，商品名：LE-302)：0.25重量份，除此以外，以與實施例1相同之方式進行，製造黏著劑組合物(2)，而獲得附隔離件之表面保護膜(2)。 將結果示於表1。 [實施例3] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為1.00重量份，除此以外，以與實施例2相同之方式進行，製造黏著劑組合物(3)，而獲得附隔離件之表面保護膜(3)。 將結果示於表1。 [實施例4] 於製造黏著劑組合物時，進而使用含氟聚合物(DIC製造，商品名：F-571)：0.30重量份，除此以外，以與實施例1相同之方式進行，製造黏著劑組合物(4)，而獲得附隔離件之表面保護膜(4)。 將結果示於表1。 [實施例5] 使用含氟聚合物(DIC製造，商品名：F-571)：0.30重量份代替含矽氧烷鍵之聚合物(共榮社化學股份有限公司製造，商品名：LE-302)：0.25重量份，除此以外，以與實施例1相同之方式進行，製造黏著劑組合物(5)，而獲得附隔離件之表面保護膜(5)。 將結果示於表1。 [實施例6] 添加作為多元醇(A)之作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：100重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：18重量份、觸媒(日本化學產業股份有限公司製造，商品名：Nacem Fe(III)：0.1重量份、含羥基之聚矽氧(信越化學工業股份有限公司製造，商品名：X-22-4015)：0.25重量份、作為稀釋溶劑之乙酸乙酯，進行混合攪拌，而製造黏著劑組合物(6)。 使用黏著劑組合物(6)，與實施例1相同之方式進行，而獲得附隔離件之表面保護膜(6)。 將結果示於表1。 [比較例1] 添加作為多元醇(A)之作為具有3個OH基之多元醇的PREMINOL S3011(旭硝子股份有限公司製造，Mn＝10000)：85重量份、作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：13重量份、作為具有3個OH基之多元醇的SANNIX GP-1000(三洋化成股份有限公司製造，Mn＝1000)：2重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：18重量份、觸媒(日本化學產業股份有限公司製造，商品名：Nacem Fe(III)：0.1重量份、作為稀釋溶劑之乙酸乙酯，進行混合攪拌，而製造黏著劑組合物(C1)。 使用黏著劑組合物(C1)，與實施例1相同之方式進行，而獲得附隔離件之表面保護膜(C1)。 將結果示於表1。 [比較例2] 於製造黏著劑組合物時，進而使用兩末端型之聚醚改性聚矽氧油(信越化學工業股份有限公司製造，商品名：KF-6004)：0.02重量份，除此以外，以與比較例1相同之方式進行，製造黏著劑組合物(C2)，而獲得附隔離件之表面保護膜(C2)。 將結果示於表1。 [比較例3] 添加作為多元醇(A)之作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：100重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：18重量份、觸媒(日本化學產業股份有限公司製造，商品名：Nacem Fe(III)：0.1重量份、作為稀釋溶劑之乙酸乙酯，進行混合攪拌，而製造黏著劑組合物(C3)。 使用黏著劑組合物(C3)，與實施例1相同之方式進行，而獲得附隔離件之表面保護膜(C3)。 將結果示於表1。 [比較例4] 不使用1-乙基-3-甲基咪唑鎓雙(氟甲磺醯基)醯亞胺(第一工業製藥股份有限公司製造，商品名：AS110)及含矽氧烷鍵之聚合物(共榮社化學股份有限公司製造，商品名：LE-302)，除此以外，以與實施例1相同之方式進行，製造黏著劑組合物(C4)，而獲得附隔離件之表面保護膜(C4)。 將結果示於表1。 [比較例5] 不使用含矽氧烷鍵之聚合物，將肉豆蔻酸異丙酯(花王股份有限公司製造，商品名：EXCEPARL IPM，Mn＝270)之使用量變更為30重量份，將兩末端型之聚醚改性聚矽氧油(信越化學工業股份有限公司製造，商品名：KF-6004)之使用量變更為0.01重量份，除此以外，以與實施例1相同之方式進行，製造黏著劑組合物(C5)，而獲得附隔離件之表面保護膜(C5)。 將結果示於表1。 [比較例6] 於製造黏著劑組合物時，進而使用肉豆蔻酸異丙酯(花王股份有限公司製造，商品名：EXCEPARL IPM，Mn＝270)：25重量份，除此以外，以與比較例1相同之方式進行，製造黏著劑組合物(C6)，而獲得附隔離件之表面保護膜(C6)。 將結果示於表1。 [比較例7] 使用聚矽氧剝離劑(信越化學工業股份有限公司製造，商品名：KS-776A)：0.15重量份代替兩末端型之聚醚改性聚矽氧油(信越化學工業股份有限公司製造，商品名：KF-6004)：0.01重量份，除此以外，以與比較例5相同之方式進行，製造黏著劑組合物(C7)，而獲得附隔離件之表面保護膜(C7)。 將結果示於表1。 [表1]    調配(重量份) 23℃×30分鐘後 對PET剝離力 (N/25 mm) 殘存接著率(%) 基礎聚合物 AS110 KS-776A KF-6004 IPM LE-302 F-571 X-22 -4015 剝離速度 300 mm/min 剝離速度 6000 mm/min 實施例1 100 1.5 - 0.02 20 0.25 - - 0.010 0.055 72 實施例2 100 - - 0.02 20 - 0.50 - 0.007 0.051 70 實施例3 100 - - 0.02 20 - 1.00 - 0.006 0.043 67 實施例4 100 1.5 - 0.02 20 0.25 0.30 - 0.006 0.049 68 實施例5 100 1.5 - 0.02 20 - 0.30 - 0.006 0.046 72 實施例6 100 - - - - - - 0.25 0.016 0.061 91 比較例1 100 - - - - - - - 0.038 0.194 94 比較例2 100 - - 0.02 - - - - 0.049 0.207 81 比較例3 100 - - - - - - - 0.047 0.146 98 比較例4 100 - - 0.02 20 - - - 0.020 0.094 83 比較例5 100 1.5 - 0.01 30 - - - 0.020 0.090 77 比較例6 100 - - - 25 - - - 0.032 0.112 97 比較例7 100 1.5 0.15 - 20 - - - 0.008 0.043 38 [實施例7] 調配作為胺基甲酸酯預聚物(C)之「CYABINE SH-109」(固形物成分54%，含脂肪酸酯，Toyo Ink公司製造)：100重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：7.05重量份、含氟聚合物(DIC製造，商品名：F-571)：1.00重量份、作為稀釋溶劑之甲苯：208重量份，利用分散機進行攪拌，而製造黏著劑組合物(7)。 利用槽輥，將所獲得之黏著劑組合物(7)以乾燥後之厚度成為10 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(7)。 將結果示於表2。 [實施例8] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為2.00重量份，除此以外，以與實施例7相同之方式進行，製造黏著劑組合物(8)，而獲得附隔離件之表面保護膜(8)。 將結果示於表2。 [實施例9] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為3.00重量份，除此以外，以與實施例7相同之方式進行，製造黏著劑組合物(9)，而獲得附隔離件之表面保護膜(9)。 將結果示於表2。 [表2]    調配(重量份) 23℃×30分鐘後 對PET剝離力 (N/25 mm) 殘存接著率(%) 基礎聚合物 SH-109 Coronate HX F-571 剝離速度 300 mm/min 剝離速度 6000 mm/min 實施例7 100 7.05 1.00 0.014 0.074 97 實施例8 100 7.05 2.00 0.014 0.068 96 實施例9 100 7.05 3.00 0.015 0.058 98 [實施例10] 調配作為胺基甲酸酯預聚物(C)之「CYABINE SH-109」(固形物成分54%，含脂肪酸酯，Toyo Ink公司製造)：100重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：3.6重量份、含氟聚合物(DIC製造，商品名：F-571)：1.00重量份、作為稀釋溶劑之甲苯：208重量份，利用分散機進行攪拌，而製造黏著劑組合物(10)。 利用槽輥，將所獲得之黏著劑組合物(10)以乾燥後之厚度成為50 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(10)。 將結果示於表3、表4。 [實施例11] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為3.00重量份，除此以外，以與實施例10相同之方式進行，製造黏著劑組合物(11)，而獲得附隔離件之表面保護膜(11)。 將結果示於表3、表4。 [實施例12] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為5.00重量份，除此以外，以與實施例10相同之方式進行，製造黏著劑組合物(12)，而獲得附隔離件之表面保護膜(12)。 將結果示於表3、表4。 [比較例8] 不使用含氟聚合物(DIC製造，商品名：F-571)，除此以外，以與實施例10相同之方式進行，製造黏著劑組合物(C8)，而獲得附隔離件之表面保護膜(C8)。 將結果示於表3、表4。 [比較例9] 將Coronate HX(Nippon Polyurethane Industry股份有限公司製造)之使用量變更為7.05重量份，不使用含氟聚合物(DIC製造，商品名：F-571)，除此以外，以與實施例10相同之方式進行，製造黏著劑組合物(C9)，而獲得附隔離件之表面保護膜(C9)。 將結果示於表3、表4。 [實施例13] 調配作為胺基甲酸酯預聚物(C)之「CYABINE SH-109」(固形物成分54%，含脂肪酸酯，Toyo Ink公司製造)：100重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：7.05重量份、含氟聚合物(DIC製造，商品名：F-571)：1.00重量份、作為稀釋溶劑之甲苯：208重量份，利用分散機進行攪拌，而製造黏著劑組合物(13)。 利用槽輥，將所獲得之黏著劑組合物(13)以乾燥後之厚度成為50 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(13)。 將結果示於表3、表4。 [實施例14] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為3.00重量份，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(14)，而獲得附隔離件之表面保護膜(14)。 將結果示於表3、表4。 [實施例15] 將含氟聚合物(DIC製造，商品名：F-571)之使用量變更為5.00重量份，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(15)，而獲得附隔離件之表面保護膜(15)。 將結果示於表3、表4。 [比較例10] 不使用含氟聚合物(DIC製造，商品名：F-571)，使用聚矽氧剝離劑(信越化學工業股份有限公司製造，商品名：KS-776A)：1重量份，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(C10)，而獲得附隔離件之表面保護膜(C10)。 將結果示於表3、表4。 [比較例11] 不使用含氟聚合物(DIC製造，商品名：F-571)，使用聚矽氧剝離劑(信越化學工業股份有限公司製造，商品名：KS-776A)：3重量份，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(C11)，而獲得附隔離件之表面保護膜(C11)。 將結果示於表3、表4。 [比較例12] 將Coronate HX(Nippon Polyurethane Industry股份有限公司製造)之使用量變更為17.7重量份，不使用含氟聚合物(DIC製造，商品名：F-571)，使黏著劑層之厚度成為10 μm，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(C12)，而獲得附隔離件之表面保護膜(C12)。 將結果示於表3、表4。 [比較例13] 將Coronate HX(Nippon Polyurethane Industry股份有限公司製造)之使用量變更為17.7重量份，不使用含氟聚合物(DIC製造，商品名：F-571)，使黏著劑層之厚度成為25 μm，除此以外，以與實施例13相同之方式進行，製造黏著劑組合物(C13)，而獲得附隔離件之表面保護膜(C13)。 將結果示於表3、表4。 [實施例16] 調配作為多元醇(A)之作為具有3個OH基之多元醇的PREMINOL S3011(旭硝子股份有限公司製造，Mn＝10000)：85重量份、作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：13重量份、作為具有3個OH基之多元醇的SANNIX GP-1000(三洋化成股份有限公司製造，Mn＝1000)：2重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：17.7重量份、含氟聚合物(DIC製造，商品名：F-571)：0.3重量份、作為稀釋溶劑之乙酸乙酯：200重量份，利用分散機進行攪拌，而製造黏著劑組合物(16)。 利用槽輥，將所獲得之黏著劑組合物(16)以乾燥後之厚度成為10 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(16)。 將結果示於表3、表4。 [實施例17] 使黏著劑層之厚度成為25 μm，除此以外，以與實施例16同樣地進行，製造黏著劑組合物(17)，而獲得附隔離件之表面保護膜(17)。 將結果示於表3、表4。 [實施例18] 調配作為多元醇(A)之作為具有3個OH基之多元醇的PREMINOL S3011(旭硝子股份有限公司製造，Mn＝10000)：85重量份、作為具有3個OH基之多元醇的SANNIX GP-3000(三洋化成股份有限公司製造，Mn＝3000)：13重量份、作為具有3個OH基之多元醇的SANNIX GP-1000(三洋化成股份有限公司製造，Mn＝1000)：2重量份、作為多官能異氰酸酯化合物(B)之多官能脂環族系異氰酸酯化合物Coronate HX(Nippon Polyurethane Industry股份有限公司製造)：17.7重量份、含羥基之聚矽氧(信越化學工業股份有限公司製造，商品名：X-22-4015)：0.3重量份、作為稀釋溶劑之乙酸乙酯：200重量份，利用分散機進行攪拌，而製造黏著劑組合物(18)。 利用槽輥，將所獲得之黏著劑組合物(18)以乾燥後之厚度成為10 μm之方式塗佈於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，Toray公司製造)，於乾燥溫度130℃、乾燥時間30秒之條件下固化乾燥。如此於基材上製作黏著劑層。繼而，使一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材(隔離件)之聚矽氧處理面貼合於黏著劑層之表面，而獲得附隔離件之表面保護膜(18)。 將結果示於表3、表4。 [實施例19] 使黏著劑層之厚度成為25 μm，除此以外，以與實施例18相同之方式進行，製造黏著劑組合物(19)，而獲得附隔離件之表面保護膜(19)。 將結果示於表3、表4。 [表3]    主劑 HX F-571 X-22-4015 KS-776A 胺基甲酸酯預聚物 SH-109 聚醚多元醇 交聯劑 含氟聚合物 含羥基之 聚矽氧 聚矽氧 剝離劑 實施例10 100    3.6 1       實施例11 100    3.6 3       實施例12 100    3.6 5       比較例8 100    3.6          比較例9 100    7.05          實施例13 100    7.05 1       實施例14 100    7.05 3       實施例15 100    7.05 5       比較例10 100    7.05       1 比較例11 100    7.05       3 比較例12 100    17.7          比較例13 100    17.7          實施例16    100 17.7 0.3       實施例17    100 17.7 0.3       實施例18    100 17.7    0.3    實施例19    100 17.7    0.3    [表4]    殘存接著率 對玻璃剝離力(N/25 mm) 對PET剝離力(N/25 mm) 23℃×30分鐘後 剝離速度 300 mm/min 80℃×7天後 剝離速度 300 mm/min 23℃×30分鐘後 剝離速度 6000 mm/min 80℃×7天後 剝離速度 6000 mm/min 23℃×30分鐘後 剝離速度 300 mm/min 80℃×7天後 剝離速度 300 mm/min 23℃×30分鐘後 剝離速度 6000 mm/min 80℃×7天後 剝離速度 6000 mm/min 實施例10 76% 0.010 0.020 0.036 0.192 0.007 0.035 0.045 0.223 實施例11 71% 0.012 0.031 0.035 0.144 0.011 0.022 0.049 0.157 實施例12 67% 0.013 0.035 0.039 0.096 0.011 0.030 0.042 0.164 比較例8 81% 0.024 0.211 0.140 1.461 0.051 0.806 0.373 4.579 比較例9 79% 0.016 0.078 0.060 0.383 0.020 0.149 0.109 1.164 實施例13 74% 0.010 0.012 0.020 0.064 0.009 0.014 0.032 0.068 實施例14 76% 0.009 0.013 0.020 0.045 0.008 0.012 0.021 0.052 實施例15 72% 0.009 0.015 0.022 0.048 0.010 0.015 0.025 0.047 比較例10 13% 0.007 0.008 0.015 0.021 0.012 0.086 0.060 0.872 比較例11 13% 0.007 0.007 0.018 0.023 - - - - 比較例12 102% 0.036 0.073 0.304 0.385 0.035 0.079 0.188 0.360 比較例13 100% 0.049 0.076 0.327 0.392 0.032 0.072 0.189 0.393 實施例16 91% 0.013 0.028 0.030 0.097 0.012 0.038 0.051 0.130 實施例17 94% 0.010 0.026 0.027 0.083 0.011 0.038 0.046 0.092 實施例18 93% 0.019 0.045 0.053 0.154 0.016 0.039 0.059 0.155 實施例19 94% 0.022 0.045 0.065 0.143 0.014 0.037 0.065 0.166 [實施例20] 將實施例1中獲得之附隔離件之表面保護膜(1)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例21] 將實施例2中獲得之附隔離件之表面保護膜(2)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例22] 將實施例3中獲得之附隔離件之表面保護膜(3)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例23] 將實施例4中獲得之附隔離件之表面保護膜(4)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例24] 將實施例5中獲得之附隔離件之表面保護膜(5)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例25] 將實施例6中獲得之附隔離件之表面保護膜(6)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例26] 將實施例1中獲得之附隔離件之表面保護膜(1)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例27] 將實施例2中獲得之附隔離件之表面保護膜(2)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例28] 將實施例3中獲得之附隔離件之表面保護膜(3)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例29] 將實施例4中獲得之附隔離件之表面保護膜(4)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例30] 將實施例5中獲得之附隔離件之表面保護膜(5)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例31] 將實施例6中獲得之附隔離件之表面保護膜(6)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例32] 將實施例7中獲得之附隔離件之表面保護膜(7)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例33] 將實施例10中獲得之附隔離件之表面保護膜(10)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例34] 將實施例13中獲得之附隔離件之表面保護膜(13)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例35] 將實施例16中獲得之附隔離件之表面保護膜(16)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例36] 將實施例18中獲得之附隔離件之表面保護膜(18)之隔離件剝離，將黏著劑層側貼附於作為光學構件之偏光板(日東電工股份有限公司製造，商品名「TEG1465DUHC」)，而獲得貼附有表面保護膜之光學構件。 [實施例37] 將實施例7中獲得之附隔離件之表面保護膜(7)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例38] 將實施例10中獲得之附隔離件之表面保護膜(10)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例39] 將實施例13中獲得之附隔離件之表面保護膜(13)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例40] 將實施例16中獲得之附隔離件之表面保護膜(16)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [實施例41] 將實施例18中獲得之附隔離件之表面保護膜(18)之隔離件剝離，將黏著劑層側貼附於作為電子構件之導電性膜(日東電工股份有限公司製造，商品名「ELECRYSTA V270L-TFMP」)，而獲得貼附有表面保護膜之電子構件。 [產業上之可利用性] 本發明之表面保護膜能夠用於任意適宜之用途。較佳為本發明之表面保護膜適用於光學構件或電子構件之領域。≪≪Surface protection film≫≫ The surface protection film of the present invention has an adhesive layer. As long as the surface protection film of the present invention has an adhesive layer, it may be provided with any suitable other members within a range that does not impair the effects of the present invention. Typically, the surface protection film of the present invention has a substrate layer and an adhesive layer. Fig. 1 is a schematic cross-sectional view of a surface protective film according to an embodiment of the present invention. In FIG. 1, the surface protection film 10 includes a base layer 1 and an adhesive layer 2. In FIG. 1, the base material layer 1 and the adhesive layer 2 are directly laminated. In FIG. 1, the surface of the adhesive layer 2 opposite to the base layer 1 can also be provided with any suitable release liner for protection before use (not shown). As a release liner, for example, a release liner in which the surface of a substrate (liner substrate) such as paper or plastic film is treated with silicone, and a surface of a substrate (liner substrate) such as paper or plastic film Release liner laminated with polyolefin resin. Regarding the plastic film used as the backing substrate, for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, and vinyl chloride copolymer film can be cited. , Polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, etc. The plastic film as the base material of the cushion is preferably a polyethylene film. The thickness of the release liner is preferably 1 μm to 500 μm, more preferably 3 μm to 450 μm, still more preferably 5 μm to 400 μm, and particularly preferably 10 μm to 300 μm. The thickness of the surface protection film is preferably 5 μm to 500 μm, more preferably 10 μm to 450 μm, still more preferably 15 μm to 400 μm, and particularly preferably 20 μm to 300 μm. Regarding one embodiment of the surface protection film of the present invention, a polyethylene terephthalate film with a thickness of 25 μm is bonded to an adhesive layer, and after 30 minutes at 23°C, the polyethylene terephthalate When the ester film is peeled at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min, the peeling force is preferably 0.08 N/25 mm or less, more preferably 0.075 N/25 mm or less, and still more preferably 0.07 N/25 mm or less , Further preferably 0.065 N/25 mm or less, particularly preferably 0.06 N/25 mm or less, and most preferably 0.055 N/25 mm or less. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force at a very high peeling speed as high as 6000 mm/min is within the above range, the surface protective film of the present invention can exhibit very excellent ultra-light peeling properties. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a polyethylene terephthalate film with a thickness of 25 μm is bonded to an adhesive layer, and after 30 minutes at 23°C, the polyethylene terephthalate When the ester film is peeled at a peeling angle of 180 degrees and a peeling speed of 300 mm/min, the peeling force is preferably 0.02 N/25 mm or less, more preferably 0.018 N/25 mm or less, and still more preferably 0.015 N/25 mm or less , Particularly preferably below 0.012 N/25 mm, most preferably below 0.01 N/25 mm. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the above-mentioned peeling force is within the above-mentioned range, the surface protective film of the present invention can exhibit ultra-light peeling properties. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a polyethylene terephthalate film with a thickness of 25 μm is attached to the adhesive layer, and after 7 days at 80°C, the polyethylene terephthalate When the ester film is peeled at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min, the peeling force is preferably 0.35 N/25 mm or less, more preferably 0.33 N/25 mm or less, and still more preferably 0.3 N/25 mm or less , And more preferably 0.27 N/25 mm or less, particularly preferably 0.25 N/25 mm or less, and most preferably 0.23 N/25 mm or less. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force after 7 days at 80°C is within the above range, the surface protection film of the present invention can sufficiently suppress re-peeling with time. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a polyethylene terephthalate film with a thickness of 25 μm is attached to the adhesive layer, and after 7 days at 80°C, the polyethylene terephthalate The peeling force when the ester film is peeled at a peeling angle of 180 degrees and a peeling speed of 300 mm/min is preferably 0.07 N/25 mm or less, more preferably 0.06 N/25 mm or less, and still more preferably 0.05 N/25 mm or less , Particularly preferably below 0.045 N/25 mm, most preferably below 0.04 N/25 mm. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force is within the above range, the surface protective film of the present invention can suppress re-peeling over time. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a glass plate with a thickness of 1000 μm is attached to an adhesive layer, and after 30 minutes at 23° C., a peeling angle of 180 degrees from the glass plate and a peeling speed of 6000 mm/min The peeling force during peeling is preferably 0.135 N/25 mm or less, more preferably 0.1 N/25 mm or less, still more preferably 0.07 N/25 mm or less, and still more preferably 0.065 N/25 mm or less, especially It is 0.06 N/25 mm or less, preferably 0.055 N/25 mm or less. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force at a very high peeling speed as high as 6000 mm/min is within the above range, the surface protective film of the present invention can exhibit very excellent ultra-light peeling properties. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a glass plate with a thickness of 1000 μm is attached to an adhesive layer, and after 30 minutes at 23°C, a peeling angle of 180 degrees from the glass plate and a peeling speed of 300 mm/min The peeling force during peeling is preferably 0.023 N/25 mm or less, more preferably 0.022 N/25 mm or less, still more preferably 0.02 N/25 mm or less, particularly preferably 0.015 N/25 mm or less, most preferably Below 0.013 N/25 mm. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the above-mentioned peeling force is within the above-mentioned range, the surface protective film of the present invention can exhibit ultra-light peeling properties. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a glass plate with a thickness of 1000 μm is attached to an adhesive layer, and after 7 days at 80°C, a peeling angle of 180 degrees from the glass plate and a peeling speed of 6000 mm/min The peeling force during peeling is preferably 0.35 N/25 mm or less, more preferably 0.3 N/25 mm or less, still more preferably 0.25 N/25 mm or less, and still more preferably 0.2 N/25 mm or less, especially It is 0.15 N/25 mm or less, preferably 0.1 N/25 mm or less. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force after 7 days at 80°C is within the above range, the surface protection film of the present invention can sufficiently suppress re-peeling with time. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. Regarding one embodiment of the surface protection film of the present invention, a glass plate with a thickness of 1000 μm is attached to an adhesive layer, and after 7 days at 80°C, a peeling angle of 180 degrees from the glass plate and a peeling speed of 300 mm/min The peeling force during peeling is preferably 0.05 N/25 mm or less, more preferably 0.045 N/25 mm or less, still more preferably 0.04 N/25 mm or less, particularly preferably 0.035 N/25 mm or less, and most preferably Below 0.03 N/25 mm. The lower limit of the above peel force is actually 0.001 N/25 mm or more. If the peeling force is within the above range, the surface protective film of the present invention can suppress re-peeling over time. Furthermore, the measurement of the above-mentioned peeling force will be described in detail below. The residual adhesion rate of the surface protective film of the present invention is preferably 50% or more, more preferably 55%-100%, still more preferably 60%-100%, particularly preferably 65%-100%, most preferably 70% ~100%. If the above-mentioned residual adhesion rate is within the above-mentioned range, the surface protective film of the present invention can exhibit the effect of lower contamination of the adherend surface. Furthermore, the measurement of the residual adhesion rate will be described in detail below. The surface protection film of the present invention can be manufactured by any suitable method. Such a manufacturing method can be based on, for example, (1) coating a solution or hot melt of the adhesive layer forming material on the substrate layer, (2) coating the adhesive layer forming material on the separator The method of transferring the adhesive layer formed by the solution or hot melt to the substrate layer, (3) The method of extruding the forming material of the adhesive layer and coating it on the substrate layer, (4) The method of extruding the substrate layer and the adhesive layer in the form of double or multilayer, (5) the method of laminating the adhesive layer on the substrate layer in a single layer, or the adhesive layer and the layer on the substrate layer The laminating is carried out by any suitable manufacturing method, such as a method of double-layer lamination together, (6) a method of double-layer or multilayer lamination of an adhesive layer and a substrate layer forming material such as a film or laminate layer. As the coating method, for example, a roll coater method, a chipped wheel coater method, a die nozzle coater method, a reverse coater method, a screen printing method, a gravure coater method, etc. can be used. ≪Base layer≫ The base layer can be only one layer, or two or more layers. The substrate layer may also be extended. The thickness of the substrate layer is preferably 4 μm to 450 μm, more preferably 8 μm to 400 μm, still more preferably 12 μm to 350 μm, and particularly preferably 16 μm to 250 μm. For the surface of the substrate layer where the adhesive layer is not provided, in order to form a winding body that is easy to unwind, for example, aliphatic amide, polyethyleneimine, and long-chain alkyl-based additives can be added to the substrate layer. Perform mold release treatment, or can be provided with a coating containing any suitable release agent such as silicone, long-chain alkyl, fluorine, etc. As the material of the substrate layer, any suitable material can be used according to the application. For example, plastic, paper, metal film, non-woven fabric, etc. can be cited. Preferably it is plastic. That is, the base material layer is preferably a plastic film. The base material layer may be composed of only one type of material, or may be composed of two or more types of materials. For example, it can be composed of more than two types of plastics. Examples of the above-mentioned plastics include polyester resins, polyamide resins, and polyolefin resins. Examples of polyester-based resins include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of polyolefin resins include homopolymers of olefin monomers and copolymers of olefin monomers. Specific examples of polyolefin-based resins include: homopolypropylene; block-based, random-based, and graft-based propylene-based copolymers using ethylene as a copolymerization component; reactor TPO (Thermoplastic Polyolefin , Thermoplastic polyolefin); ethylene polymers of low density, high density, linear low density, ultra-low density, etc.; ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene- Ethylene copolymers such as ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, etc. The substrate layer may contain any suitable additives as needed. Examples of additives that may be contained in the substrate layer include antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, fillers, and pigments. The type and amount of additives that the substrate layer can contain can be appropriately set according to the purpose. Especially when the material of the substrate layer is plastic, it is preferable to contain some of the above additives to prevent deterioration. From the viewpoint of improving weather resistance, etc., as additives, particularly preferably, antioxidants, ultraviolet absorbers, light stabilizers, and fillers can be cited. As the antioxidant, any suitable antioxidant can be used. Examples of such antioxidants include phenol-based antioxidants, phosphorus-based processing heat stabilizers, lactone-based processing heat stabilizers, sulfur-based heat-resistant stabilizers, phenol-phosphorus-based antioxidants, and the like. Regarding the antioxidant content, relative to the base resin of the base layer (when the base layer is a blend, the blend is the base resin), preferably 1% by weight or less, more preferably 0.5% by weight % Or less, more preferably 0.01% by weight to 0.2% by weight. As the ultraviolet absorber, any suitable ultraviolet absorber can be used. As such an ultraviolet absorber, a benzotriazole type ultraviolet absorber, a triazole type ultraviolet absorber, a benzophenone type ultraviolet absorber, etc. are mentioned, for example. Regarding the content ratio of the ultraviolet absorber, relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin), preferably 2% by weight or less, more preferably 1% by weight or less, more preferably 0.01% by weight to 0.5% by weight. As the light stabilizer, any suitable light stabilizer can be used. Examples of such light stabilizers include hindered amine-based light stabilizers and benzoate-based light stabilizers. Regarding the content ratio of the light stabilizer, it is preferably 2% by weight or less relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin), preferably 2% by weight or less, more preferably 1% by weight or less, more preferably 0.01% by weight to 0.5% by weight. As the filler, any suitable filler can be used. Examples of such fillers include inorganic fillers. As an inorganic filler, specifically, carbon black, titanium oxide, zinc oxide, etc. are mentioned, for example. Regarding the content ratio of the filler, relative to the base resin forming the base layer (when the base layer is a blend, the blend is the base resin), it is preferably 20% by weight or less, more preferably 10 % By weight or less, more preferably 0.01% by weight to 10% by weight. Furthermore, as an additive, in order to impart antistatic properties, surfactants, inorganic salts, polyols, metal compounds, carbon and other inorganic, low molecular weight, and high molecular weight antistatic agents can also be preferably cited. Particularly from the viewpoint of contamination and maintaining adhesion, a high molecular weight antistatic agent or carbon is preferred. ≪Adhesive layer≫ The adhesive layer can be manufactured by any suitable manufacturing method. As such a manufacturing method, for example, a method of applying a composition as a forming material of the adhesive layer on the base material layer, and forming the adhesive layer on the base material layer. Examples of such coating methods include roll coating, gravure coating, reverse coating, roller brush coating, spray coating, air knife coating, and extrusion coating using a die coating machine. Wait. The thickness of the adhesive layer is preferably 1 μm to 150 μm, more preferably 2 μm to 140 μm, still more preferably 3 μm to 130 μm, still more preferably 4 μm to 120 μm, still more preferably 5 μm to 100 μm, more preferably 10 μm to 90 μm, particularly preferably 20 μm to 85 μm, most preferably 30 μm to 80 μm. The adhesive layer is composed of an adhesive. The adhesive is formed of an adhesive composition. The adhesive composition preferably contains a base polymer, and a silicone-based additive and/or a fluorine-based additive. Regarding the content of silicone-based additives and/or fluorine-based additives in the adhesive composition, the total amount of silicone-based additives and fluorine-based additives relative to 100 parts by weight of the base polymer is preferably 0.01 weight Parts by weight to 50 parts by weight, more preferably 0.02 parts by weight to 25 parts by weight, still more preferably 0.025 parts by weight to 10 parts by weight, particularly preferably 0.03 parts by weight to 5 parts by weight, most preferably 0.05 parts by weight to 3 parts by weight . If the content of the silicone-based additives and/or fluorine-based additives in the adhesive composition is within the above range, the surface protection film of the present invention can not only exhibit higher ultra-light peeling properties, but also can further reduce the adhesion Pollution of body surface. <Base polymer> The base polymer is preferably at least one selected from the group consisting of urethane resins, acrylic resins, rubber resins, and silicone resins. In terms of more capable of expressing the effects of the present invention, the base polymer is more preferably a urethane resin or an acrylic resin. [Urethane-based resin] As the urethane-based resin, any suitable urethane-based resin can be used within a range that does not impair the effects of the present invention. The urethane-based resin is preferably a urethane-based resin formed from a composition containing a polyol (A) and a polyfunctional isocyanate compound (B), or a urethane-based resin A urethane-based resin formed by a composition of a polymer (C) and a polyfunctional isocyanate compound (B). By using the urethane resin as described above, the wettability of the adhesive layer can be improved. Therefore, the surface protective film of the present invention can avoid entrainment of air bubbles during attachment. The urethane-based resin may contain any appropriate component within a range that does not impair the effect of the present invention. Examples of such components include: resin components other than urethane resins, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive Agents, ultraviolet absorbers, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. The urethane-based resin preferably contains an anti-deterioration agent such as an antioxidant, an ultraviolet absorber, and a light stabilizer. Since the urethane-based resin contains an anti-deterioration agent, even if it is stored in a heated state after being attached to the adherend, paste residue is less likely to appear on the adherend, so that the paste residue prevention performance can be optimized . The anti-deterioration agent may be only one type or two or more types. As an anti-deterioration agent, an antioxidant is particularly preferred. Examples of antioxidants include radical chain inhibitors and peroxide decomposers. Examples of radical chain inhibitors include phenolic antioxidants and amine antioxidants. Examples of peroxide decomposers include sulfur-based antioxidants and phosphorus-based antioxidants. Examples of phenolic antioxidants include monophenolic antioxidants, bisphenolic antioxidants, and polymer phenolic antioxidants. Examples of monophenol-based antioxidants include 2,6-di-tert-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-tert-butyl-4-ethylphenol, and β- (3,5-Di-tert-butyl-4-hydroxyphenyl) stearyl propionate, etc. Examples of bisphenol antioxidants include 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl- 6-tertiary butylphenol), 4,4'-thiobis(3-methyl-6-tertiary butylphenol), 4,4'-butylene bis(3-methyl-6-tertiary Butylphenol), 3,9-bis[1,1-dimethyl-2-[β-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]ethyl ]2,4,8,10-Tetraoxaspiro[5,5]undecane and so on. Examples of polymer type phenolic antioxidants include: 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1,3,5-trimethyl Base-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tetra-(methylene-3-(3',5'-di-tert-butyl- 4'-hydroxyphenyl)propionate]methane, bis[3,3'-bis-(4'-hydroxy-3'-tert-butylphenyl)butyric acid]diol ester, 1,3,5 -Tris(3',5'-di-tert-butyl-4'-hydroxybenzyl)-S-tris-2,4,6-(1H,3H,5H)trione, tocopherol, etc. Examples of sulfur-based antioxidants include: 3,3'-thiodipropionate dilauryl ester, 3,3'-thiodipropionate dimyristate, 3,3'-thiodipropionate Stearyl ester and so on. Examples of phosphorus-based antioxidants include triphenyl phosphite, diphenyl isodecyl phosphite, and phenyl diisodecyl phosphite. Examples of ultraviolet absorbers include: benzophenone-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, salicylic acid-based ultraviolet absorbers, oxaniline-based ultraviolet absorbers, and cyanoacrylate-based ultraviolet rays Absorbents, three UV absorbers, etc. As the benzophenone-based ultraviolet absorber, for example, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octyloxybenzophenone Methyl ketone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-dimethoxybenzophenone, 2,2'-dihydroxy-4,4' -Dimethoxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, bis(2-methoxy-4-hydroxy-5-benzylphenyl) Methane etc. Examples of benzotriazole-based ultraviolet absorbers include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole and 2-(2'-hydroxy-5'-tertiary butyl) Phenyl) benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl) benzotriazole, 2-(2'-hydroxy-3'-tert-butyl -5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)5-chlorobenzotriazole, 2- (2'-Hydroxy-3',5'-Ditertiary pentylphenyl)benzotriazole, 2-(2'-hydroxy-4'-octyloxyphenyl)benzotriazole, 2-[ 2'-Hydroxy-3'-(3``,4'',5'',6'',-Tetrahydrophthaliminomethyl)-5'-methylphenyl)benzotris Azole, 2,2'methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol], 2-(2 '-Hydroxy-5'-methacryloxyphenyl)-2H-benzotriazole and the like. Examples of the salicylic acid-based ultraviolet absorbers include phenyl salicylate, p-tert-butylphenyl salicylate, and p-octylphenyl salicylate. Examples of cyanoacrylate-based ultraviolet absorbers include 2-ethylhexyl 2-cyano-3,3'-diphenyl acrylate, ethyl 2-cyano-3,3'-diphenyl acrylate Ester etc. Examples of the light stabilizer include hindered amine-based light stabilizers and ultraviolet stabilizers. Examples of hindered amine-based light stabilizers include bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1,2,2,6,6-penta Methyl-4-piperidinyl) sebacate, methyl-1,2,2,6,6-pentamethyl-4-piperidinyl sebacate, etc. Examples of ultraviolet stabilizers include bis(octylphenyl) nickel sulfide, [2,2'-thiobis(4-tertiary octylphenol)] n-butylamine nickel, 3,5-di Tributyl-4-hydroxybenzyl-phosphate monoethanol nickel complex, nickel dibutyl dithiocarbamate, benzoate type inhibitor (quencher), dibutyl dithiocarbamate Nickel etc. (Urethane-based resin formed from a composition containing polyol (A) and polyfunctional isocyanate compound (B)) Formed from a composition containing polyol (A) and polyfunctional isocyanate compound (B) Specifically, the urethane-based resin is preferably a urethane-based resin obtained by curing a composition containing a polyol (A) and a polyfunctional isocyanate compound (B). The polyol (A) may be only one type or two or more types. The polyfunctional isocyanate compound (B) may be only one type or two or more types. As the polyol (A), for example, a polyester polyol, a polyether polyol, a polycaprolactone polyol, a polycarbonate polyol, and a castor oil-based polyol are preferably mentioned. As the polyol (A), polyether polyol is more preferable. As a polyester polyol, it can obtain by the esterification reaction of a polyol component and an acid component, for example. Examples of polyol components include ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, and 3-methyl-1,5-pentanediol. Alcohol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octadecanediol, glycerin, trimethylolpropane , Pentaerythritol, hexanetriol, polypropylene glycol, etc. Examples of acid components include succinic acid, methylsuccinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid Acid, dimer acid, 2-methyl-1,4-cyclohexanedicarboxylic acid, 2-ethyl-1,4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, o-benzene Dicarboxylic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-biphenyl dicarboxylic acid, these acid anhydrides, etc. Examples of polyether polyols include water, low molecular weight polyols (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzene (Catechol, resorcinol, hydroquinone, etc.) etc. as the initiator, polyether polyether obtained by addition polymerization of ethylene oxide, propylene oxide, butylene oxide, etc. alcohol. Specifically, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like can be cited. Examples of polycaprolactone polyols include caprolactone polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone and σ-valerolactone. Examples of polycarbonate polyols include: polycarbonate polyols obtained by subjecting the above-mentioned polyol component and carbon chloride to a condensation polymerization reaction; and combining the above-mentioned polyol component with dimethyl carbonate, diethyl carbonate, and carbonic acid Dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethyl butyl carbonate, ethylene carbonate, propylene carbonate, diphenyl carbonate, dibenzyl carbonate and other carbonic acid diesters undergo transesterification condensation and The obtained polycarbonate polyol; the copolymerized polycarbonate polyol obtained by combining two or more of the above-mentioned polyol components; the polycarbonate obtained by the esterification reaction of the above-mentioned various polycarbonate polyols and carboxyl-containing compounds Ester polyols; polycarbonate polyols obtained by etherification of the above-mentioned various polycarbonate polyols and hydroxyl-containing compounds; polycarbonates obtained by transesterification of the above-mentioned various polycarbonate polyols and ester compounds Ester polyol; polycarbonate polyol obtained by transesterifying the above various polycarbonate polyols and hydroxyl-containing compounds; obtained by polycondensing the above various polycarbonate polyols and dicarboxylic acid compounds Polyester-based polycarbonate polyol; copolymerized polyether-based polycarbonate polyol obtained by copolymerizing the above-mentioned various polycarbonate polyols and alkylene oxide, etc. Examples of castor oil-based polyols include castor oil-based polyols obtained by reacting castor oil fatty acids with the above-mentioned polyol components. Specifically, for example, castor oil-based polyols obtained by reacting castor oil fatty acid with polypropylene glycol are mentioned. The number average molecular weight Mn of the polyol (A) is preferably 300 to 100,000, more preferably 400 to 75,000, still more preferably 450 to 50,000, particularly preferably 500 to 30,000. By adjusting the number average molecular weight Mn of the polyol (A) to the above range, the wettability of the adhesive layer can be improved, and therefore the surface protective film of the present invention can avoid entrainment of bubbles during attachment. The polyol (A) preferably contains a polyol (A1) having 3 OH groups and a number average molecular weight Mn of 300 to 100,000. The polyol (A1) may be only one type or two or more types. The content ratio of the polyol (A1) in the polyol (A) is preferably 5% by weight or more, more preferably 25% by weight to 100% by weight, and still more preferably 50% by weight to 100% by weight. By adjusting the content ratio of the polyol (A1) in the polyol (A) to the above range, the wettability of the adhesive layer can be improved. Therefore, the surface protection film of the present invention can avoid entrainment of air bubbles during attachment. The number average molecular weight Mn of the polyol (A1) is preferably 1,000 to 100,000, more preferably 1,200 to 80,000, still more preferably 1,500 to 70,000, still more preferably 1750 to 50,000, particularly preferably 1,500 to 40,000, most preferably 2000～30000. By adjusting the number average molecular weight Mn of the polyol (A1) to the above range, the wettability of the adhesive layer can be improved, so the surface protective film of the present invention can avoid entrainment of air bubbles during attachment. The polyol (A) may also contain a polyol (A2) having 3 or more OH groups and a number average molecular weight Mn of 20,000 or less. The polyol (A2) may be only one type or two or more types. The number average molecular weight Mn of the polyol (A2) is preferably 100 to 20,000, more preferably 150 to 10,000, further preferably 200 to 7,500, particularly preferably 300 to 6,000, and most preferably 300 to 5,000. If the number average molecular weight Mn of the polyol (A2) deviates from the above-mentioned range, in particular, there is a possibility that the rise of the adhesive force over time becomes high, and there is a possibility that excellent secondary workability cannot be expressed. As the polyol (A2), there can be preferably cited: a polyol with 3 OH groups (triol), a polyol with 4 OH groups (tetraol), and a polyol with 5 OH groups (pentaol) ), a polyol (hexaol) with 6 OH groups. Regarding at least one of polyols (A2) with 4 OH groups (tetraol), 5 OH groups (pentaol), and 6 OH groups (hexaol) The total amount, based on the content ratio in the polyol (A), is preferably 70% by weight or less, more preferably 60% by weight or less, still more preferably 40% by weight or less, and particularly preferably 30% by weight or less. By taking the polyol (A) as the polyol (A2), the polyol with 4 OH groups (tetraol), the polyol with 5 OH groups (pentaol), and the polyol with 6 OH groups At least one of the alcohols (hexaols) is adjusted to the above range to provide urethane resins with excellent transparency and can improve the wettability of the adhesive layer. Therefore, the surface protective film of the present invention is applied to It can avoid entrainment of air bubbles when attached. The content ratio of the polyol (A2) in the polyol (A) is preferably 95% by weight or less, and more preferably 0% to 75% by weight. By adjusting the content ratio of the polyol (A2) in the polyol (A) to the above range, the wettability of the adhesive layer can be improved. Therefore, the surface protective film of the present invention can avoid air bubbles during attachment. Regarding the content ratio of polyols having 4 or more OH groups and a number average molecular weight Mn of 20,000 or less in the polyol (A2), it is preferably less than 70% by weight, more preferably, relative to the entire polyol (A) It is 60% by weight or less, more preferably 50% by weight or less, particularly preferably 40% by weight or less, and most preferably 30% by weight or less. By adjusting the content ratio of the polyol having 4 or more OH groups and the number average molecular weight Mn of 20,000 or less in the polyol (A2) to the above range, a urethane-based resin with excellent transparency can be provided. In addition, the wettability of the adhesive layer can be improved, so the surface protection film of the present invention can avoid entrainment of air bubbles when attaching. The polyfunctional isocyanate compound (B) may be only one type or two or more types. As the polyfunctional isocyanate compound (B), any suitable polyfunctional isocyanate compound that can be used in the urethane reaction can be used. As such a polyfunctional isocyanate compound (B), a polyfunctional aliphatic isocyanate compound, a polyfunctional alicyclic isocyanate, a polyfunctional aromatic isocyanate compound, etc. are mentioned, for example. Examples of polyfunctional aliphatic isocyanate compounds include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene isocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc. Examples of polyfunctional alicyclic isocyanate compounds include 1,3-cyclopentene diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, and isophorone diisocyanate , Hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated tetramethylxylylene diisocyanate, etc. Examples of polyfunctional aromatic diisocyanate compounds include phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4' -Diphenylmethane diisocyanate, 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, benzene diisocyanate Methyl diisocyanate, etc. Examples of the polyfunctional isocyanate compound (B) include trimethylolpropane adducts of the above-mentioned various polyfunctional isocyanate compounds, biuret compounds obtained by reacting with water, and terpolymers having isocyanurate rings Wait. Moreover, these can also be used together. As the equivalent ratio of the NCO group to the OH group in the polyol (A) and the polyfunctional isocyanate compound (B), expressed as NCO group/OH group, it is preferably 5.0 or less, more preferably 0.1 to 3.0, and still more preferably 0.2 to 2.5, particularly preferably 0.3 to 2.25, most preferably 0.5 to 2.0. By adjusting the equivalent ratio of NCO group/OH group to the above range, the wettability of the adhesive layer can be improved. Therefore, the surface protective film of the present invention can avoid entrainment of air bubbles during attachment. Regarding the content ratio of the polyfunctional isocyanate compound (B), relative to the polyol (A), the polyfunctional isocyanate compound (B) is preferably 1.0% by weight to 30% by weight, more preferably 1.5% by weight to 27% by weight, and further It is preferably 2.0% by weight to 25% by weight, particularly preferably 2.3% by weight to 23% by weight, and most preferably 2.5% by weight to 20% by weight. By adjusting the content ratio of the polyfunctional isocyanate compound (B) to the above range, the wettability of the adhesive layer can be improved, so the surface protective film of the present invention can avoid entrainment of air bubbles during application. Specifically, the polyurethane resin is preferably formed by curing a composition containing a polyol (A) and a polyfunctional isocyanate compound (B). As a method of curing the composition containing the polyol (A) and the polyfunctional isocyanate compound (B) to form a urethane-based resin, the use of bulk polymerization or solution polymerization can be used within the scope of not impairing the effects of the present invention. Any suitable method such as the carbamate reaction method. In order to harden the composition containing the polyol (A) and the polyfunctional isocyanate compound (B), it is preferable to use a catalyst. Examples of such catalysts include organometallic compounds and tertiary amine compounds. Examples of the organometallic compound include iron-based compounds, tin-based compounds, titanium-based compounds, zirconium-based compounds, lead-based compounds, cobalt-based compounds, and zinc-based compounds. Among them, in terms of the reaction rate and the pot life of the adhesive layer, iron-based compounds and tin-based compounds are preferred. Examples of iron-based compounds include iron acetopyruvate and iron 2-ethylhexanoate. Examples of tin-based compounds include dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin maleate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin sulfide, tributyltin Methyl tin methoxide, tributyl tin acetate, triethyl tin ethoxide, tributyl tin ethoxide, dioctyl tin oxide, dioctyl tin dilaurate, tributyl tin chloride, tributyl tin trichloroacetate, 2-ethylhexyl Tin acid etc. As a titanium compound, dibutyl titanium dichloride, tetrabutyl titanate, titanium trichlorobutoxide, etc. are mentioned, for example. As a zirconium compound, zirconium naphthenate, zirconium acetylacetonate, etc. are mentioned, for example. Examples of the lead-based compound include lead oleate, lead 2-ethylhexanoate, lead benzoate, lead naphthenate, and the like. Examples of cobalt compounds include cobalt 2-ethylhexanoate, cobalt benzoate, and the like. Examples of zinc-based compounds include zinc naphthenate and zinc 2-ethylhexanoate. Examples of tertiary amine compounds include triethylamine, triethylenediamine, 1,8-diazabicyclo-(5,4,0)-undecene-7, and the like. There may be only one type of catalyst, or two or more types. In addition, a catalyst and a crosslinking retarder may be used in combination. The amount of the catalyst is preferably 0.005% to 1.00% by weight relative to the polyol (A), more preferably 0.01% to 0.75% by weight, still more preferably 0.01% to 0.50% by weight, particularly preferably It is 0.01% by weight to 0.20% by weight. By adjusting the amount of the catalyst within the above range, the wettability of the adhesive layer can be improved. Therefore, the surface protection film of the present invention can avoid entrainment of air bubbles during attachment. The composition containing the polyol (A) and the polyfunctional isocyanate compound (B) may contain any appropriate other components within the range that does not impair the effects of the present invention. Examples of such other components include: resin components other than polyurethane resins, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, and anti-aging agents , Conductive agents, UV absorbers, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. (A urethane-based resin formed from a composition containing a urethane prepolymer (C) and a polyfunctional isocyanate compound (B)) From a urethane prepolymer (C) and If the urethane resin formed from the composition of the polyfunctional isocyanate compound (B) is a urethane resin obtained by using the so-called "urethane prepolymer" as a raw material, it can be used Any suitable urethane resin. As a urethane-based resin formed from a composition containing a urethane prepolymer (C) and a polyfunctional isocyanate compound (B), for example, a urethane prepolymer containing (C) A urethane-based resin formed by a combination of a polyurethane polyol and a polyfunctional isocyanate compound (B). The urethane prepolymer (C) may be only one type or two or more types. The polyfunctional isocyanate compound (B) may be only one type or two or more types. The polyurethane polyol as the urethane prepolymer (C) is preferably the following: the polyester polyol (a1) or the polyether polyol (a2) is made separately or with ( a1) The mixture of (a2) is formed by reacting with the organic polyisocyanate compound (a3) in the presence or absence of a catalyst. As the polyester polyol (a1), any suitable polyester polyol can be used. As such a polyester polyol (a1), the polyester polyol obtained by making an acid component and a diol component react is mentioned, for example. As an acid component, terephthalic acid, adipic acid, azelaic acid, sebacic acid, phthalic anhydride, isophthalic acid, trimellitic acid etc. are mentioned, for example. As the glycol component, for example, ethylene glycol, propylene glycol, diethylene glycol, butylene glycol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 3,3'- Dimethylolheptane, polyoxyethylene glycol, polyoxypropylene glycol, 1,4-butanediol, neopentyl glycol, butyl ethyl pentane glycol, glycerin as a polyol component, trimethylol propane , Pentaerythritol, etc. As the polyester polyol (a1), a polyester obtained by ring-opening polymerization of lactones such as polycaprolactone, poly(β-methyl-γ-valerolactone), polyvalerolactone, etc. Polyols, etc. As the molecular weight of the polyester polyol (a1), it can be used from low molecular weight to high molecular weight. As the molecular weight of the polyester polyol (a1), the number average molecular weight is preferably 100 to 100,000. If the number average molecular weight is less than 100, the reactivity becomes high and there is a possibility of easy gelation. If the number average molecular weight exceeds 100,000, the reactivity becomes low, and there is a possibility that the cohesive force of the polyurethane polyol itself may decrease. Regarding the usage amount of the polyester polyol (a1), in the polyol constituting the polyurethane polyol, it is preferably 0 mol% to 90 mol%. As the polyether polyol (a2), any suitable polyether polyol can be used. As such a polyether polyol (a2), for example, a polyether polyol obtained by using low molecular weight polyols such as water, propylene glycol, ethylene glycol, glycerin, and trimethylolpropane as a starter can be cited , Ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and other oxirane compounds are polymerized. Specific examples of such a polyether polyol (a2) include polyether polyols having a functional group number of 2 or more such as polypropylene glycol, polyethylene glycol, and polytetramethylene glycol. As the molecular weight of the polyether polyol (a2), it can be used from low molecular weight to high molecular weight. As the molecular weight of the polyether polyol (a2), the number average molecular weight is preferably 100 to 100,000. If the number average molecular weight is less than 100, the reactivity becomes high and there is a possibility of easy gelation. If the number average molecular weight exceeds 100,000, the reactivity becomes low, and there is a possibility that the cohesive force of the polyurethane polyol itself may decrease. Regarding the usage amount of the polyether polyol (a2), in the polyol constituting the polyurethane polyol, it is preferably 0 mol% to 90 mol%. Polyether polyol (a2) may be partially substituted into ethylene glycol, 1,4-butanediol, neopentyl glycol, butyl ethyl pentane glycol, glycerin, trimethylol propane, pentaerythritol, etc. Diols, or polyamines such as ethylenediamine, N-aminoethylethanolamine, isophoronediamine, xylylenediamine, etc., are used in combination. As the polyether polyol (a2), only bifunctional polyether polyols can be used, or a part or all of polyethers having a number average molecular weight of 100 to 100,000 and having at least 3 hydroxyl groups in one molecule can be used Polyol. As the polyether polyol (a2), if a polyether polyol having a number average molecular weight of 100 to 100,000 and having at least 3 hydroxyl groups in one molecule is used partially or completely, the balance of adhesion and releasability will be achieved Can become good. If such a polyether polyol has a number average molecular weight of less than 100, the reactivity becomes high, and there is a possibility of easy gelation. Moreover, if the number average molecular weight of such a polyether polyol exceeds 100,000, the reactivity becomes low, and there is a possibility that the cohesive force of the polyurethane polyol itself may decrease. The number average molecular weight of this polyether polyol is more preferably 100 to 10,000. As the organic polyisocyanate compound (a3), any suitable organic polyisocyanate compound can be used. As such an organic polyisocyanate compound (a3), aromatic polyisocyanate, aliphatic polyisocyanate, araliphatic polyisocyanate, alicyclic polyisocyanate, etc. are mentioned, for example. As the aromatic polyisocyanate, for example, 1,3-benzene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-benzene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2 ,4-Toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-toluidine triisocyanate, 1,3,5-benzene triisocyanate, dimethoxyaniline Isocyanate, 4,4'-diphenyl ether diisocyanate, 4,4',4''-triphenylmethane triisocyanate, etc. Examples of aliphatic polyisocyanates include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3 -Butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc. As araliphatic polyisocyanates, for example, ω,ω'-diisocyanate-1,3-dimethylbenzene, ω,ω'-diisocyanato-1,4-dimethylbenzene, ω,ω '-Diisocyanate group-1,4-diethylbenzene, 1,4-tetramethylxylylene diisocyanate, 1,3-tetramethylxylylene diisocyanate, etc. As the alicyclic polyisocyanate, for example, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3- Cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylene Bis (cyclohexyl isocyanate), 1,4-bis (methyl isocyanate) cyclohexane, 1,4-bis (methyl isocyanate) cyclohexane, etc. As the organic polyisocyanate compound (a3), a trimethylolpropane adduct, a biuret obtained by reacting with water, a trimer having an isocyanurate ring, and the like may also be used in combination. As a catalyst that can be used when obtaining polyurethane polyols, any suitable catalyst can be used. Examples of such catalysts include tertiary amine compounds and organometallic compounds. Examples of tertiary amine compounds include triethylamine, triethylenediamine, 1,8-diazabicyclo(5,4,0)-undecene-7 (DBU), and the like. Examples of organometallic compounds include tin-based compounds and non-tin-based compounds. Examples of tin-based compounds include: dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin dimaleate, dibutyltin dilaurate (DBTDL), dibutyltin diacetate, dibutyltin sulfide Butyl tin, tributyl tin sulfide, tributyl tin oxide, tributyl tin acetate, triethyl tin ethoxide, tributyl tin ethoxide, dioctyl tin oxide, tributyl tin chloride, tributyl tin trichloroacetate, tin 2-ethylhexanoate Wait. Examples of non-tin compounds include titanium compounds such as dibutyl titanium dichloride, tetrabutyl titanate, and titanium trichlorobutoxide; lead oleate, lead 2-ethylhexanoate, and lead benzoate , Lead-based compounds such as lead naphthenate; Iron-based compounds such as iron 2-ethylhexanoate, iron acetylpyruvate; Cobalt compounds such as cobalt benzoate and cobalt 2-ethylhexanoate; Zinc naphthenate, 2 -Zinc compounds such as zinc ethylhexanoate; zirconium compounds such as zirconium naphthenate, etc. When a catalyst is used when obtaining polyurethane polyols, in a system where there are two polyols of polyester polyol and polyether polyol, due to the difference in the reactivity, if the contact in the system If the medium is of a single type, the problem of gelation or turbidity of the reaction solution is likely to occur. Therefore, by using two kinds of catalysts when obtaining polyurethane polyol, it is easy to control the reaction rate, the selectivity of the catalyst, etc., and these problems can be solved. As a combination of the above two types of catalysts, for example, tertiary amine/organic metal, tin/non-tin, tin/tin, preferably tin/tin, more preferably dilauric acid Combination of butyl tin and tin 2-ethylhexanoate. The blending ratio is based on the weight ratio, and the 2-ethylhexanoate/dibutyltin dilaurate is preferably less than 1, more preferably 0.2-0.6. If the blending ratio is 1 or more, there is a possibility of easy gelation due to the balance of catalyst activity. In the case of using a catalyst when obtaining polyurethane polyols, relative to the total amount of polyester polyol (a1), polyether polyol (a2) and organic polyisocyanate compound (a3) The usage amount is preferably 0.01 to 1.0% by weight. In the case of using a catalyst when obtaining a polyurethane polyol, the reaction temperature is preferably less than 100°C, more preferably 85°C to 95°C. If it is 100° C. or higher, it may be difficult to control the reaction rate and the crosslinked structure, and it may be difficult to obtain a polyurethane polyol having a specific molecular weight. When obtaining polyurethane polyol, a catalyst may not be used. In this case, the reaction temperature is preferably 100°C or higher, more preferably 110°C or higher. Moreover, when obtaining a polyurethane polyol under the condition of no catalyst, it is preferable to make it react for 3 hours or more. As a method of obtaining polyurethane polyols, for example: 1) a method of adding all of the polyester polyol, polyether polyol, catalyst, and organic polyisocyanate to a flask; 2) adding the polyester polyol Alcohol, polyether polyol and catalyst are added to the flask, and the organic polyisocyanate is added dropwise. As a method of obtaining a polyurethane polyol, the method of 2) is preferable in terms of reaction control. When obtaining polyurethane polyol, any suitable solvent can be used. As such a solvent, methyl ethyl ketone, ethyl acetate, toluene, xylene, acetone, etc. are mentioned, for example. Among these solvents, toluene is preferred. As the polyfunctional isocyanate compound (B), the above can be cited. The composition containing the urethane prepolymer (C) and the polyfunctional isocyanate compound (B) may contain any appropriate other components within the range that does not impair the effect of the present invention. Examples of such other components include: resin components other than polyurethane resins, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, and anti-aging agents , Conductive agents, UV absorbers, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. As a method for producing a polyurethane resin formed from a composition containing a urethane prepolymer (C) and a polyfunctional isocyanate compound (B), as long as it is a so-called "urethane "Prepolymer" is a method of manufacturing polyurethane resin as a raw material, and any suitable manufacturing method can be adopted. The number average molecular weight Mn of the urethane prepolymer (C) is preferably 3,000 to 1,000,000. As the equivalent ratio of the NCO group to the OH group in the urethane prepolymer (C) and the polyfunctional isocyanate compound (B), expressed as NCO group/OH group, it is preferably 5.0 or less, more preferably 0.01 to 3.0, more preferably 0.02 to 2.5, particularly preferably 0.03 to 2.25, most preferably 0.05 to 2.0. By adjusting the equivalent ratio of NCO group/OH group to the above range, the wettability of the adhesive layer can be improved. Therefore, the surface protective film of the present invention can avoid entrainment of air bubbles during attachment. Regarding the content ratio of the polyfunctional isocyanate compound (B), the polyfunctional isocyanate compound (B) is preferably 0.01% by weight to 30% by weight, more preferably 0.03% by weight relative to the urethane prepolymer (C) ~20% by weight, more preferably 0.05% to 15% by weight, particularly preferably 0.075% to 10% by weight, most preferably 0.1% to 8% by weight. By adjusting the content ratio of the polyfunctional isocyanate compound (B) to the above range, the wettability of the adhesive layer can be improved, so the surface protective film of the present invention can avoid entrainment of air bubbles during application. [Acrylic resin] As the acrylic resin, any suitable acrylic adhesives such as known acrylic adhesives described in Japanese Patent Laid-Open No. 2013-241606 method and the like can be used within the range that does not impair the effects of the present invention. The acrylic resin may contain any appropriate component within a range that does not impair the effects of the present invention. Examples of such components include: resin components other than acrylic resins, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, ultraviolet absorbers Agents, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. [Rubber-based resin] As the rubber-based resin, any suitable rubber-based adhesives such as known rubber-based adhesives described in Japanese Patent Laid-Open No. 2015-074771 and the like can be used within a range that does not impair the effects of the present invention. These may be only one type or two or more types. The rubber-based resin may contain any appropriate component within a range that does not impair the effects of the present invention. Examples of such components include: resin components other than rubber-based resins, tackifiers, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, ultraviolet absorbers Agents, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. [Polysiloxane-based resin] As a silicone-based adhesive, any known polysiloxane-based adhesive described in Japanese Patent Laid-Open No. 2014-047280 etc. can be used within the range that does not impair the effects of the present invention. Suitable silicone adhesive. These may be only one type or two or more types. The silicone-based resin may contain any appropriate component within a range that does not impair the effects of the present invention. Examples of such components include: resin components other than silicone resins, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, Ultraviolet absorbers, antioxidants, light stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc. <Polysiloxane-based additive> As the polysiloxane-based additive, any suitable polysiloxane-based additive can be used within a range that does not impair the effect of the present invention. As such a polysiloxane-based additive, preferably, at least one selected from the group consisting of siloxane bond-containing compounds, hydroxyl-containing polysiloxane-based compounds, and crosslinkable functional group-containing polysiloxane-based compounds. The polysiloxane-based additives may be only one type or two or more types. Examples of compounds containing siloxane bonds include: polyether-modified polyorganosilicon in which polyether groups are introduced into the main chain or side chain of polyorganosiloxane skeleton (polydimethylsiloxane, etc.) Polyorganosiloxane, polyester modified polyorganosiloxane formed by introducing a polyester group into the main chain or side chain of the polyorganosiloxane skeleton, and introducing organic compounds into the main chain or side chain of the polyorganosiloxane skeleton Polysiloxane modified (meth)acrylic resin made by introducing organic compounds into polyorganosiloxane, polyorganosiloxane into (meth)acrylic resin, and polyorganosiloxane into organic compound Polysiloxane modified organic compounds, organic compounds containing polysiloxanes, etc., which are copolymerized with organic compounds and polysiloxane compounds. Regarding such siloxane bond-containing polymers, commercially available products include, for example, the trade name "LE-302" (manufactured by Kyoeisha Chemical Co., Ltd.), BYK series manufactured by BYK-Chemie Japan Co., Ltd Leveling agent ("BYK-300", "BYK-301/302", "BYK-306", "BYK-307", "BYK-310", "BYK-315", "BYK-313", " BYK-320”, “BYK-322”, “BYK-323”, “BYK-325”, “BYK-330”, “BYK-331”, “BYK-333”, “BYK-337”, “BYK- 341", "BYK-344", "BYK-345/346", "BYK-347", "BYK-348", "BYK-349", "BYK-370", "BYK-375", "BYK- 377", "BYK-378", "BYK-UV3500", "BYK-UV3510", "BYK-UV3570", "BYK-3550", "BYK-SILCLEAN3700", "BYK-SILCLEAN3720", etc.), Algin Chemie AC series of leveling agents ("AC FS180", "AC FS360", "AC S20", etc.) manufactured by Kyoeisha Chemical Co., Ltd. Polyflow series of leveling agents ("Polyflow KL-400X", " Polyflow KL-400HF", "Polyflow KL-401", "Polyflow KL-402", "Polyflow KL-403", "Polyflow KL-404", etc.), KP series leveling agents manufactured by Shin-Etsu Chemical Co., Ltd. ("KP-323", "KP-326", "KP-341", "KP-104", "KP-110", "KP-112", etc.), X22 series, KF series manufactured by Shin-Etsu Chemical Industry Co., Ltd. Etc., leveling agent manufactured by Dow Corning Toray Co., Ltd. ("LP-7001", "LP-7002", "8032ADDITIVE", "57ADDITIVE", "L-7604", "FZ-2110", "FZ-2105 ", "67ADDITIVE", "8618ADDITIVE", "3ADDITIVE", "56ADDITIVE", etc.). Examples of hydroxyl-containing polysiloxane compounds include: polyether-modified polyorganic compounds in which polyether groups are introduced into the main chain or side chain of polyorganosiloxane skeleton (polydimethylsiloxane, etc.) Silicone, polyester modified polyorganosiloxane formed by introducing a polyester group into the main chain or side chain of the polyorganosiloxane skeleton, and introducing organic compounds into the main chain or side chain of the polyorganosiloxane skeleton Polysiloxane modified (meth)acrylic resin made by introducing organic compounds into polyorganosiloxane, polyorganosiloxane into (meth)acrylic resins, and polyorganosiloxane into organic compounds Polysiloxane modified organic compound made of alkane, organic compound containing polysiloxane made by copolymerizing organic compound and polysiloxane compound, etc. Among them, the hydroxyl group may be possessed by the polyorganosiloxane skeleton, and may also be possessed by a polyether group, a polyester group, a (meth)acryl group, or an organic compound. Regarding such hydroxyl-containing polysiloxanes, as commercial products, for example, trade names "X-22-4015", "X-22-4039", "KF6000", "KF6001", "KF6002", and "KF6003","X-22-170BX","X-22-170DX","X-22-176DX","X-22-176F" (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-Chemie・Japan "BYK-370", "BYK-SILCLEAN3700", "BYK-SILCLEAN3720", etc. manufactured by Co., Ltd. As a polysiloxane compound containing a crosslinkable functional group, for example, a polyether formed by introducing a polyether group into the main chain or side chain of a polyorganosiloxane skeleton (polydimethylsiloxane, etc.) Modified polyorganosiloxane, polyester modified polyorganosiloxane formed by introducing a polyester group into the main chain or side chain of the polyorganosiloxane skeleton, on the main chain or side chain of the polyorganosiloxane skeleton Introducing organic compound into polyorganosiloxane, polyorganosiloxane into (meth)acrylic resin, polysiloxane modified (meth)acrylic resin, into organic compound Polysiloxane-modified organic compound made of polyorganosiloxane, polysiloxane-containing organic compound made by copolymerizing organic compound and polysiloxane compound, etc. Among these, the crosslinkable functional group may be possessed by the polyorganosiloxane skeleton, or possessed by a polyether group, a polyester group, a (meth)acryl group, or an organic compound. As a crosslinkable functional group, an amino group, an epoxy group, a mercapto group, a carboxyl group, an isocyanate group, a methacrylate group, etc. are mentioned. Regarding such isocyanate group-containing polysiloxanes, as commercial products, for example, "BY16-855", "SF8413", "BY16-839", "SF8421", and "BY16 manufactured by Dow Corning Toray Co., Ltd. -750", "BY16-880", "BY16-152C", "KF-868", "KF-865", "KF-864", "KF-859", "KF" manufactured by Shin-Etsu Chemical Industry Co., Ltd. -393", "KF-860", "KF-880", "KF-8004", "KF-8002", "KF-8005", "KF-867", "KF-8021", "KF-869 ", "KF-861", "X-22-343", "KF-101", "X-22-2000", "X-22-4741", "KF-1002", "KF-2001", "X-22-3701E", "X-22-164", "X-22-164A", "X-22-164B", "X-22-164AS", "X-22-2445", etc. <Fluorine-based additives> As the fluorine-based additives, any suitable fluorine-based additives can be used within a range that does not impair the effects of the present invention. As such a fluorine-based additive, at least one selected from a fluorine-containing compound, a hydroxyl-containing fluorine-based compound, and a crosslinkable functional group-containing fluorine-based compound is preferably used. The fluorine-based additive may be only one type or two or more types. Examples of the fluorine-containing compound include a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound obtained by copolymerizing an organic compound and a fluorine compound, and a fluorine-containing compound containing an organic compound. Examples of the fluoroaliphatic hydrocarbon skeleton include: fluoromethane, fluoroethane, fluoropropane, fluoroisopropane, fluorobutane, fluoroisobutane, fluorobutane, fluoropentane, fluorohexane, and other fluorine C1 -C10 alkanes and so on. As such a fluorine-containing compound, as a commercially available product, for example, the Surflon series leveling agent manufactured by AGC Seimi Chemical Co., Ltd. ("S-242", "S-243", "S-420", S-611", "S-651", "S-386", etc.), BYK series leveling agents manufactured by BYK-Chemie・Japan Co., Ltd. ("BYK-340" etc.), AC manufactured by Algin Chemie Series of leveling agents ("AC 110a", "AC 100a", etc.), MEGAFAC series of leveling agents manufactured by DIC Co., Ltd. ("MEGAFAC F-114", "MEGAFAC F-410", "MEGAFAC F-444"","MEGAFAC EXP TP-2066", "MEGAFAC F-430", "MEGAFAC F-472SF", "MEGAFAC F-477", "MEGAFAC F-552", "MEGAFAC F-553", "MEGAFAC F-554 ", "MEGAFAC F-555", "MEGAFAC R-94", "MEGAFAC RS-72-K", "MEGAFAC RS-75", "MEGAFAC F-556", "MEGAFAC EXP TF-1367", "MEGAFAC EXP TF-1437", "MEGAFAC F-558", "MEGAFAC EXP TF-1537", etc.), FC series leveling agents manufactured by Sumitomo 3M Co., Ltd. ("FC-4430", "FC-4432", etc.), NEOS Co., Ltd. FTERGENT series of levelers ("FTERGENT 100", "FTERGENT 100C", "FTERGENT 110", "FTERGENT 150", "FTERGENT 150CH", "FTERGENT AK", "FTERGENT 501", "FTERGENT 250", "FTERGENT 251", "FTERGENT 222F", "FTERGENT 208G", "FTERGENT 300", "FTERGENT 310", "FTERGENT 400SW", etc.), the PF series leveling agent manufactured by Kitamura Chemical Industry Co., Ltd. ( "PF-136A", "PF-156A", "PF-151N", "PF-636", "PF-6320", "PF-656", "PF-6520", "PF-651", "PF -652", "PF-3320", etc.) etc. As the hydroxyl-containing fluorine-based compound, for example, previously known resins can be used, for example, International Publication No. 94/06870, Japanese Patent Laid-Open No. 8-12921, Japanese Patent Laid-Open No. 10-72569, and Japanese Patent The hydroxyl-containing fluororesin described in JP 4-275379, International Publication No. 97/11130, International Publication No. 96/26254, etc. Examples of other hydroxyl-containing fluororesins include Japanese Patent Laid-Open No. 8-231919, Japanese Patent Laid-Open No. 10-265731, Japanese Patent Laid-Open No. 10-204374, and Japanese Patent Laid-Open No. 8-12922. Fluoroolefin copolymers described in the gazette, etc. In addition, examples include copolymers of compounds having fluorinated alkyl groups among hydroxyl-containing compounds, fluorine-containing organic compounds formed by copolymerizing hydroxyl-containing compounds with fluorine-containing compounds, and hydroxy-containing organic compounds. Fluorine-containing compounds, etc. As such a hydroxyl-containing fluorine-based compound, as a commercially available product, for example, the product name "Lumiflon" (manufactured by Asahi Glass Co., Ltd.), the product name "Cefral Coat" (manufactured by Central Glass Co., Ltd.), and the product name "Zaffron" (manufactured by Toagosei Co., Ltd.), trade name "Zeffle" (manufactured by Daikin Industries Co., Ltd.), trade name "MEGAFAC F-571", "Fluonate" (manufactured by DIC Co., Ltd.), etc. As the fluorine-based compound containing a crosslinkable functional group, for example, a carboxylic acid compound having a fluorinated alkyl group such as perfluorooctanoic acid, and a compound having a fluorinated alkyl group among the crosslinkable functional group-containing compounds Copolymers, fluorine-containing organic compounds copolymerized with crosslinkable functional group-containing compounds and fluorine-containing compounds, fluorine-containing compounds containing crosslinkable functional group-containing compounds, etc. As such a crosslinkable functional group-containing fluorine compound, commercially available products include, for example, trade names "MEGAFAC F-570", "MEGAFAC RS-55", "MEGAFAC RS-56", and "MEGAFAC RS- 72-K", "MEGAFAC RS-75", "MEGAFAC RS-76-E", "MEGAFAC RS-76-NS", "MEGAFAC RS-78", "MEGAFAC RS-90" (manufactured by DIC Co., Ltd.) Wait. <Other components> The adhesive composition may contain any suitable other components within a range that does not impair the effects of the present invention. Examples of such other components include: other resin components, adhesion imparting agents, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, anti-aging agents, conductive agents, ultraviolet absorbers, anti-aging agents, Oxidizing agent, light stabilizer, surface lubricant, leveling agent, anti-corrosion agent, heat-resistant stabilizer, polymerization inhibitor, lubricant, solvent, catalyst, etc. The adhesive composition may also contain fatty acid esters. There may be only one type of fatty acid ester, or two or more types. The number average molecular weight Mn of the fatty acid ester is preferably 100-800, more preferably 150-500, still more preferably 200-480, particularly preferably 200-400, most preferably 250-350. By adjusting the number average molecular weight Mn of the fatty acid ester within the above range, the wettability of the adhesive layer can be improved. As the fatty acid ester, any suitable fatty acid ester can be used within a range that does not impair the effects of the present invention. Examples of such fatty acid esters include: polyoxyethylene bisphenol A laurate, butyl stearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, and behenic acid mono Glycerides, cetyl 2-ethylhexanoate, isopropyl myristate, isopropyl palmitate, cholesterol isostearate, lauryl methacrylate, coconut fatty acid methyl ester, methyl laurate, Methyl oleate, methyl stearate, myristyl myristate, octyl lauryl myristate, pentaerythritol monooleate, pentaerythritol monostearate, pentaerythritol tetrapalmitate, stearic acid Stearyl ester, isotridecyl stearate, triglyceride 2-ethylhexanoate, butyl laurate, octyl oleate, etc. When the adhesive composition contains fatty acid esters, the content ratio of fatty acid esters is preferably 1 part by weight to 50 parts by weight, more preferably 1.5 parts by weight to 45 parts by weight relative to 100 parts by weight of the base polymer Parts, more preferably 2 parts by weight to 40 parts by weight, particularly preferably 2.5 parts by weight to 35 parts by weight, most preferably 3 parts by weight to 30 parts by weight. The adhesive composition may also contain an ionic liquid containing fluorine organic anions. Since the adhesive composition contains an ionic liquid containing fluorine organic anions, it is possible to provide an adhesive composition with excellent antistatic properties. There may be only one type of such ionic liquid, or two or more types. In the present invention, the so-called ionic liquid means molten salt (ionic compound) that is liquid at 25°C. As the ionic liquid, as long as it is an ionic liquid containing a fluorine organic anion, any suitable ionic liquid can be used within a range that does not impair the effects of the present invention. As such an ionic liquid, an ionic liquid composed of a fluorine organic anion and an onium cation is preferred. By using an ionic liquid composed of a fluorine organic anion and an onium cation as the ionic liquid, an adhesive composition with extremely excellent antistatic properties can be provided. As the onium cation capable of constituting the ionic liquid, any suitable onium cation can be used within a range that does not impair the effect of the present invention. Such an onium cation is preferably at least one selected from the group consisting of nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations. By selecting these onium cations, an adhesive composition with extremely excellent antistatic properties can be provided. The onium cation capable of constituting the ionic liquid is preferably at least one selected from cations having structures represented by the general formulas (1) to (5). [化1]
Figure 02_image001
In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbons, which may also include heteroatoms, and Rb and Rc are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbons, and may also include heteroatoms. However, when the nitrogen atom contains a double bond, there is no Rc. In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbons, which may also include heteroatoms, and Re, Rf and Rg are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbons, and may also include heteroatoms. In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbons, and may also include a heteroatom. Ri, Rj, and Rk are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbons, and may also include a heteroatom. In the general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, and R1, Rm, Rn, and Ro are the same or different, and represent a hydrocarbon group with 1 to 20 carbon atoms, and may include heteroatoms. Among them, when Z is a sulfur atom, there is no Ro. In the general formula (5), X represents Li atom, Na atom or K atom. Examples of cations represented by the general formula (1) include pyridinium cations, pyrrolidinium cations, piperidinium cations, cations having a pyrroline skeleton, and cations having a pyrrole skeleton. As specific examples of the cation represented by the general formula (1), for example, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methyl Pyridium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methyl Pyridinium cation, 1-butyl-3,4-dimethylpyridinium cation, 1,1-dimethylpyrrolidinium cation and other pyridinium cations; 1-ethyl-1-methylpyrrolidinium cation , 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1- Hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1- Ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, 1,1-dipropylpyrrolidinium cation , 1-propyl-1-butylpyrrolidinium cation, 1,1-dibutylpyrrolidinium cation and other pyrrolidinium cations; 1-propylpiperidinium cation, 1-pentylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentanium Piperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl 1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation Cation, 1-propyl-1-butylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1,1-dibutylpiperidinium cation Cation piperidinium cation; 2-methyl-1-pyrroline cation; 1-ethyl-2-phenylindole cation; 1,2-dimethylindole cation; 1-ethylcarbazole cation, etc. . Among them, in terms of the aspect that can more express the effect of the present invention, it can preferably include: 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethylpyridinium cation, 3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1- Pyridium cations such as octyl-4-methylpyridinium cation, 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1- Butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1- Ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidine Onium cation, 1-ethyl-1-heptylpyrrolidinium cation and other pyrrolidinium cations, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptyl Piperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl Piperidinium cations such as 1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, etc.; more preferably 1-hexyl Pyridium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1- Propylpyrrolidinium cation, 1-methyl-1-propylpiperidinium cation. Examples of the cation represented by the general formula (2) include imidazolium cations, tetrahydropyrimidinium cations, and dihydropyrimidinium cations. Specific examples of the cation represented by the general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazole Onium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methyl Imidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation and other imidazolium cations ; 1,3-Dimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2 ,3,4-Tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, etc. Hydropyrimidinium cation; 1,3-dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl -1,4-dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidine Dihydropyrimidinium cations such as onium cations, 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium cations, etc. Among them, in terms of more exhibiting the effects of the present invention, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3- Methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3 -Methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation and other imidazolium cations, more preferably 1-ethyl-3 -Methylimidazolium cation, 1-hexyl-3-methylimidazolium cation. Examples of the cation represented by the general formula (3) include pyrazolium cation, pyrazolium cation, and the like. Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, and 1-ethyl-2-methylpyrazolium cation , 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5- Pyrazolium cations such as trimethylpyrazolium cation; 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazoline Pyrazolinium cations such as onium cations and 1-butyl-2,3,5-trimethylpyrazolinium cations. The cation represented by the general formula (4) includes, for example, tetraalkylammonium cation, trialkylaluminium cation, tetraalkylphosphonium cation, or a part of the above-mentioned alkyl group is substituted with an alkenyl group or an alkoxy group, and further Those made of epoxy groups. As specific examples of the cation represented by the general formula (4), for example, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrapentylammonium cation, tetrahexylammonium cation, tetraheptyl Ammonium cation, triethylmethylammonium cation, tributylethylammonium cation, trimethylpropylammonium cation, trimethyldecylammonium cation, N,N-diethyl-N-methyl-N- (2-Methoxyethyl) ammonium cation, glycidyl trimethylammonium cation, trimethyl alumium cation, triethyl alumium cation, tributyl alumium cation, trihexyl alumium cation, diethyl methyl alumium cation Cation, dibutyl ethyl phosphonium cation, dimethyl decyl phosphonium cation, tetramethyl phosphonium cation, tetraethyl phosphonium cation, tetrabutyl phosphonium cation, tetrahexyl phosphonium cation, tetraoctyl phosphonium cation, triethyl cation Methyl phosphonium cation, tributyl ethyl phosphonium cation, trimethyl decyl phosphonium cation, diallyl dimethyl ammonium cation, etc. Among them, in terms of better showing the effects of the present invention, it can be preferably listed: triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethyl Asymmetric tetramethyl phosphonium cation, dibutyl ethyl phosphonium cation, dimethyl decyl phosphonium cation, triethyl methyl phosphonium cation, tributyl ethyl phosphonium cation, trimethyl decyl phosphonium cation, etc. Alkyl ammonium cation, trialkyl phosphonium cation, tetraalkyl phosphonium cation, or N,N-diethyl-N-methyl-N-(2-methoxyethyl) ammonium cation, glycidyl trimethyl Base ammonium cation, diallyldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butyl Base ammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl -N-ethyl-N-heptylammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation , N,N-Diethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N -Propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N ,N-Diethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N- Dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentyl Ammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation , Triethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl- N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl -N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl- N-propyl-N-pentylammonium cation, etc., more preferably trimethylpropylammonium cation. As the fluorine organic anion capable of constituting the ionic liquid, any suitable fluorine organic anion can be used within a range that does not impair the effects of the present invention. Such fluorine organic anions can be completely fluorinated (perfluorinated) or partially fluorinated. Examples of such fluorine organic anions include: fluorinated arylsulfonates, perfluoroalkanesulfonates, bis(fluorosulfonyl)imines, and bis(perfluoroalkanesulfonyl)imines. Amine, cyanoperfluoroalkanesulfonamide, bis(cyano)perfluoroalkanesulfonyl methide, cyano-bis-(perfluoroalkanesulfonyl)methide, tris(perfluoroalkane) Sulfonyl) methide, trifluoroacetate, perfluoroalkane, tris(perfluoroalkanesulfonyl) methide, (perfluoroalkanesulfonyl)trifluoroacetamide and the like. Among the fluoroorganic anions, more preferred are perfluoroalkyl sulfonates, bis(fluorosulfonyl)imines, and bis(perfluoroalkanesulfonyl)imines, and more specifically, for example, Trifluoromethanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluorosulfonyl) imide, bis(trifluoromethanesulfonyl) sulfonate amine. As a specific example of the ionic liquid, a combination of the above-mentioned cation component and the above-mentioned anion component can be appropriately selected. As specific examples of such ionic liquids, for example, 1-hexylpyridinium bis(fluorosulfonyl)imidine, 1-ethyl-3-methylpyridinium triflate, 1- Ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonic acid Salt, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-butyl-3 -Methylpyridinium bis(pentafluoroethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1,1-dimethylpyrrolidinium Bis(trifluoromethanesulfonyl)imid, 1-methyl-1-ethylpyrrolidinium bis(trifluoromethanesulfonyl)imid, 1-methyl-1-propylpyrrolidinium Bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(fluorosulfonyl)imide, 1-methyl-1-butylpyrrolidinium bis( Trifluoromethanesulfonyl) imide, 1-methyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imidine, 1-methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl) Fluoromethanesulfonyl) imide, 1-methyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imidine, 1-ethyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl) Fluoromethanesulfonyl) imide, 1-ethyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl) iminium, 1-ethyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl) Fluoromethanesulfonyl) imide, 1-ethyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imidine, 1-ethyl-1-heptylpyrrolidinium bis(trifluoro Methanesulfonyl) imidimide, 1,1-dipropylpyrrolidinium bis(trifluoromethanesulfonyl)imidine, 1-propyl-1-butylpyrrolidinium bis(trifluoromethanesulfon) Amino) imidimide, 1,1-dibutylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dimethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1- Ethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1- Propylpiperidinium bis(fluorosulfonyl)imide, 1-methyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-pentyl Piperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-heptylpiper Pyridinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpiperidine Pyridinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-hexylpiperidine Onium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropylpiperidinium bis (Trifluoromethanesulfonyl) imine, 1- Propyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dibutylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1- Dimethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-ethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1 -Propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1 -Pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1- Heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1- Butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1- Hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dipropylpyrrole Alkyl bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dibutylpyrrolidinium Bis(pentafluoroethanesulfonyl)imide, 1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide Imine, 1,1-dimethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-ethylpiperidinium bis(pentafluoroethanesulfonyl)imide , 1-Methyl-1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide , 1-Methyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl) imide, 1-methyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl) imide, 1-methyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Ethyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1 ,1-Dipropylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1 -Dibutylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-ethyl-3-methylimidazolium heptafluorobutane Acid salt, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium Nonafluorobutanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl) imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl) Imine, 1-ethyl-3-methylimidazolium bis(pentafluoroethanesulfonyl ) Imine, 1-ethyl-3-methylimidazolium tris(trifluoromethanesulfonyl) methide, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl- 3-methylimidazolium heptafluorobutyrate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium perfluorobutanesulfonate, 1- Butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-hexyl-3-methylimidazolium triflate, 1-hexyl-3-methylimidazolium bis (Fluorosulfonyl) imine, 1,2-dimethyl-3-propylimidazolium bis(trifluoromethanesulfonyl) imide, 1-ethyl-2,3,5-trimethyl Pyrazolium bis(trifluoromethanesulfonyl)imide, 1-propyl-2,3,5-trimethylpyrazolium bis(trifluoromethanesulfonyl)imide, 1-butane Yl-2,3,5-trimethylpyrazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-2,3,5-trimethylpyrazolium bis(pentafluoroethanesulfon Amino) amide, 1-propyl-2,3,5-trimethylpyrazolium bis(pentafluoroethanesulfonyl) amide, 1-butyl-2,3,5-trimethyl Pyrazolium bis(pentafluoroethanesulfonyl) imide, 1-ethyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1- Propyl-2,3,5-trimethylpyrazolium (trifluoromethanesulfonyl) trifluoroacetamide, 1-butyl-2,3,5-trimethylpyrazolium (trifluoromethyl Sulfonyl) trifluoroacetamide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imidine, N,N-dimethyl-N-ethyl-N-propylammonium bis(tri Fluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N -Ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide Amine, N,N-dimethyl-N-ethyl-N-heptylammonium bis(trifluoromethanesulfonyl)imidine, N,N-dimethyl-N-ethyl-N-nonyl Ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dipropylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl -N-propyl-N-butylammonium bis(trifluoromethanesulfonyl) imide, N,N-dimethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl) ) Iminium, N,N-dimethyl-N-propyl-N-hexylammonium bis(trifluoromethanesulfonyl) iminium, N,N-dimethyl-N-propyl-N- Heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N- Dimethyl-N-butyl-N-heptylammonium bis(trifluoromethanesulfonyl) imide, N,N-dimethyl-N-pentyl-N-hexylammonium bis(trifluoromethanesulfon) Amino) amide, N,N-dimethyl-N,N-dihexyl ammonium bis (trifluoromethanesulfonyl) amide, trimethylheptyl ammonium bis (trifluoromethanesulfonyl) Amide, N,N-diethyl-N-methyl-N-propylammonium bis(trifluoromethanesulfonyl) Imine, N,N-diethyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imidine, N,N-diethyl-N-methyl-N,N -Heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, triethyl Propylammonium bis(trifluoromethanesulfonyl)imid, triethylpentylammonium bis(trifluoromethanesulfonyl)imid, triethylheptylammonium bis(trifluoromethanesulfonyl) ) Iminium, N,N-dipropyl-N-methyl-N-ethylammonium bis(trifluoromethanesulfonyl) iminium, N,N-dipropyl-N-methyl-N -Pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N -Dipropyl-N,N-Dihexylammonium bis(trifluoromethanesulfonyl) imide, N,N-Dibutyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl) Yl)imine, N,N-dibutyl-N-methyl-N-hexylammonium bis(trifluoromethanesulfonyl)imid, trioctylmethylammonium bis(trifluoromethanesulfonyl) ) Iminium, N-methyl-N-ethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl) iminium, 1-butylpyridinium (trifluoromethanesulfonyl) Group) trifluoroacetamide, 1-butyl-3-methylpyridinium (trifluoromethanesulfonyl) trifluoroacetamide, 1-ethyl-3-methylimidazolium (trifluoromethanesulfonyl) Group) trifluoroacetamide, tetrahexylammonium bis(trifluoromethanesulfonyl) imidine, diallyldimethylammonium triflate, diallyldimethylammonium bis(trifluoromethanesulfonate) Fluoromethylsulfonyl)imidine, diallyldimethylammonium bis(pentafluoroethanesulfonyl)imidine, N,N-diethyl-N-methyl-N-(2-methyl (Oxyethyl)ammonium triflate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide , N,N-Diethyl-N-Methyl-N-(2-Methoxyethyl)ammonium bis(pentafluoroethanesulfonyl)imidine, glycidyltrimethylammonium trifluoromethanesulfonate Acid salt, glycidyltrimethylammonium bis(trifluoromethanesulfonyl)imid, glycidyltrimethylammonium bis(pentafluoroethanesulfonyl)imid, diallyldimethyl Ammonium bis(trifluoromethanesulfonyl)imide, diallyldimethylbis(pentafluoroethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis (Fluorosulfonyl) imine and the like. Among the plasmonic liquids, more preferred are 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, and 1-ethyl-3 -Methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1- Butyl-3-methylpyridinium triflate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imidine, 1-octyl-4-methylpyridine Onium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis (Fluorosulfonyl) iminium, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl) iminium, 1-methyl-1-propylpiperidinium bis(fluoro Sulfonyl) imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3 -Methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-hexyl-3-methylimidazolium Bis(fluorosulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl) Group) imine. A commercially available ionic liquid can be used, but it can also be synthesized in the following manner. As the synthesis method of ionic liquid, as long as the target ionic liquid can be obtained, it is not particularly limited, and it is usually used as described in the document "Ionic Liquid-Frontier and Future of Development -" (published by CMC Co., Ltd.) Halide method, hydroxide method, acid ester method, complex reaction method and neutralization method, etc. The following describes the synthesis method of the halide method, the hydroxide method, the ester method, the complex reaction method and the neutralization method, taking nitrogen-containing onium salts as examples, but regarding other sulfur-containing onium salts, Other ionic liquids such as phosphorus onium salts can also be obtained by the same method. The halide method is a method performed by the reactions shown in the reaction formulas (1) to (3). First, a tertiary amine is reacted with a halogenated alkyl group to obtain a halide (reaction formula (1), chlorine, bromine, and iodine are used as the halogen). Make the obtained halide and the anion structure of the target ionic liquid (A - ) Acid (HA) or salt (MA, M is ammonium, lithium, sodium, potassium and other cations that will form a salt with the target anion) to obtain the target ionic liquid (R 4 NA). [化2]
Figure 02_image003
The hydroxide method is a method carried out by the reactions shown in reaction formulas (4) to (8). First, use ion exchange membrane electrolysis (reaction formula (4)), OH type ion exchange resin method (reaction formula (5)) or with silver oxide (Ag 2 O) reaction (reaction formula (6)), from the halide (R 4 NX) to obtain hydroxide (R 4 NOH) (As the halogen, chlorine, bromine, and iodine are used). For the obtained hydroxide, the target ionic liquid (R) is obtained by using the reaction of reaction formulas (7) to (8) in the same way as the above halogenation method. 4 NA). [化3]
Figure 02_image005
The acid ester method is a method performed by the reactions shown in reaction formulas (9) to (11). First, make the tertiary amine (R 3 N) reacting with an acid ester to obtain an acid ester (reaction formula (9), as the acid ester, an ester of an inorganic acid such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, carbonic acid, etc., or methanesulfonic acid, methylphosphonic acid, Organic acid esters such as formic acid, etc.). For the obtained acid ester, the target ionic liquid (R) is obtained by using the reaction of reaction formulas (10) to (11) in the same way as the above halogenation method. 4 NA). Moreover, a direct ionic liquid can also be obtained by using methyl trifluoromethanesulfonate, methyl trifluoroacetate, etc. as an acid ester. [化4]
Figure 02_image007
The neutralization method is a method performed by the reaction shown in the reaction formula (12). Can be combined with tertiary amine and CF 3 COOH, CF 3 SO 3 H, (CF 3 SO 2 ) 2 NH, (CF 3 SO 2 ) 3 CH, (C 2 F 5 SO 2 ) 2 Obtained by reaction of organic acids such as NH. [化5]
Figure 02_image009
R described in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may also include a heteroatom. The blending amount of the ionic liquid varies according to the compatibility between the polymer used and the ionic liquid. Therefore, it cannot be generalized. Generally speaking, it is preferably 0.001 parts by weight relative to 100 parts by weight of the base polymer. 50 parts by weight, more preferably 0.01 parts by weight to 40 parts by weight, further preferably 0.01 parts by weight to 30 parts by weight, particularly preferably 0.01 parts by weight to 20 parts by weight, most preferably 0.01 parts by weight to 10 parts by weight. By adjusting the blending amount of the ionic liquid within the above range, an adhesive composition with very excellent antistatic properties can be provided. If the above-mentioned blending amount of the ionic liquid is less than 0.01 parts by weight, there is a possibility that sufficient antistatic properties may not be obtained. If the above-mentioned blending amount of the ionic liquid exceeds 50 parts by weight, there is a tendency that the contamination of the adherend becomes serious. The adhesive composition may also contain modified silicone oil within a range that does not impair the effects of the present invention. The adhesive composition contains modified silicone oil, which can exhibit antistatic properties. Especially by using it in combination with ionic liquids, it can more effectively exhibit antistatic properties. When the adhesive composition contains modified silicone oil, the content ratio is preferably 0.001 to 50 parts by weight, and more preferably 0.005 to 40 parts by weight relative to 100 parts by weight of the base polymer Parts by weight, more preferably 0.007 parts by weight to 30 parts by weight, particularly preferably 0.008 parts by weight to 20 parts by weight, most preferably 0.01 parts by weight to 10 parts by weight. By adjusting the content ratio of the modified silicone oil to the above range, the antistatic properties can be more effectively exhibited. As the modified silicone oil, any suitable modified silicone oil can be used within a range that does not impair the effects of the present invention. Examples of such modified silicone oils include modified silicone oils available from Shin-Etsu Chemical Co., Ltd. As the modified silicone oil, polyether modified silicone oil is preferred. By using polyether modified silicone oil, it can show the effect of antistatic properties more effectively. Examples of polyether-modified silicone oil include: side chain type polyether-modified silicone oil, two-terminal type polyether-modified silicone oil, and the like. Among them, the two-terminal type polyether-modified silicone oil is more preferable in terms of exhibiting the effect of antistatic properties sufficiently and more effectively. ≪≪Usage≫≫ The surface protective film of the present invention has ultra-light peelability and low pollution on the surface of the adherend. Therefore, it can be preferably used for surface protection of optical components or electronic components. The optical component of the present invention is one with the surface protective film of the present invention attached. The electronic component of the present invention is one with the surface protective film of the present invention attached. [Examples] Hereinafter, the present invention will be specifically explained through examples, but the present invention is not limited by these examples. In addition, the test and evaluation methods in Examples etc. are as follows. Furthermore, when "parts" is stated, it means "parts by weight" as long as there is no special description, and when "%" is stated, it means "weight%" as long as there is no special description. <Peeling force against PET at a peeling speed of 6000 mm/min (peeling force at 23°C × 30 minutes and peeling force at 80°C × 7 days)> Laminating polyethylene terephthalic acid with a thickness of 25 μm to the adhesive layer The ethylene terephthalate film was peeled at 23° C., a peeling angle of 180 degrees, and a peeling speed of 6000 mm/min. The peeling force at this time was measured as follows. Use a 2 kg hand roller on the entire surface of the surface protection film (width 50 mm × length 140 mm) from which the separator has been peeled off on the side opposite to the adhesive layer, using a double-sided tape (manufactured by Nitto Denko Corporation, Product name "No.531") and attached SUS304 board. Then, a polyethylene terephthalate film (manufactured by Toray, trade name "Lumirror S-10", thickness: 25 μm, width: 25 mm) was attached to the surface of the adhesive layer (temperature: 23°C, humidity : 65%, make 2 kg roller back and forth once). The sample for evaluation obtained in the above manner was measured by a tensile test. As the tensile tester, the trade name "Autograph AG-Xplus HS 6000 mm/min high-speed mode (AG-50NX plus)" manufactured by Shimadzu Corporation was used. After setting the sample for evaluation in the tensile tester, it is placed in an ambient temperature of 23°C for 30 minutes or at a temperature of 80°C for 7 days, and then the tensile test is started. The conditions of the tensile test are as follows: peel angle: 180 degrees, peel speed (tensile speed): 6000 mm/min. The load when peeling the PET film from the surface protective film was measured, and the average load at this time was used as the peeling force of the surface protective film. <Peeling force against PET at a peeling speed of 300 mm/min (peeling force at 23°C × 30 minutes and peeling force at 80°C × 7 days)> Laminating 25 μm polyethylene terephthalic acid to the adhesive layer The ethylene terephthalate film was peeled at 23°C, a peeling angle of 180 degrees, and a peeling speed of 300 mm/min. The peeling force at this time was measured as follows. Use a 2 kg hand roller on the entire surface of the surface protection film (width 50 mm × length 140 mm) from which the separator has been peeled off on the side opposite to the adhesive layer, using a double-sided tape (manufactured by Nitto Denko Corporation, Product name "No.531") and attached SUS304 board. Then, a polyethylene terephthalate film (manufactured by Toray, trade name "Lumirror S-10", thickness: 25 μm, width: 25 mm) was attached to the surface of the adhesive layer (temperature: 23°C, humidity : 65%, make 2 kg roller back and forth once). The sample for evaluation obtained in the above manner was subjected to a tensile test. As the tensile tester, the trade name "Autograph AG-Xplus HS 6000 mm/min high-speed mode (AG-50NX plus)" manufactured by Shimadzu Corporation was used. After setting the sample for evaluation in the tensile tester, it is placed in an ambient temperature of 23°C for 30 minutes or at a temperature of 80°C for 7 days, and then the tensile test is started. The conditions of the tensile test are as follows: peel angle: 180 degrees, peel speed (tensile speed): 300 mm/min. The load when peeling the PET film from the surface protective film was measured, and the average load at this time was used as the peeling force of the surface protective film. <Remaining Adhesion Rate> Use a hand roller to apply a surface protective film to the entire surface of a glass plate (made by Songnang Glass, 1.35 mm×10 cm×10 cm), and store it at a temperature of 23°C and a humidity of 55%RH 24 After hours, peel off the surface protective film at a speed of 0.3 m/min. Under an environment of temperature 23℃ and humidity 55%RH, attach the cut length 150 mm and width 19 by making a 2.0 kg roller back and forth once. mm No.31B tape (manufactured by Nitto Denko Co., Ltd., substrate thickness: 25 μm). After curing for 30 minutes in an environment with a temperature of 23°C and a humidity of 55%RH, use a tensile testing machine (trade name "Autograph AG-Xplus HS 6000 mm/min high speed mode (AG-50NX plus)" manufactured by Shimadzu Corporation) , Peel off at a peeling angle of 180 degrees and a tensile speed of 300 mm/min to measure the adhesion. In addition, the adhesive force of No. 31B tape with a width of 19 mm was measured in the same way for the glass plate not treated as above, and the residual adhesion rate was calculated according to the following formula. Residual adhesion rate (%) = (No. 31B adhesion to the glass plate after peeling off the surface protective film / No. 31B adhesion to the glass plate) × 100 The residual adhesion rate becomes the adhesive component of the surface protective film. An indicator of the degree of transfer on the surface of the adherend or the degree of contamination on the surface of the adherend. The higher the value of the residual adhesion rate, the more it can be said that the high-quality surface protective film of the adherend will not be contaminated. The lower the value of the residual adhesion rate, the more it can be said that the surface of the adherend is contaminated by the adhesive components. <Peel force against glass at a peeling speed of 6000 mm/min (peel force at 23℃×30 minutes and peel force at 80℃×7 days)> By making a 2 kg hand roller back and forth, the glass ( Soda-lime glass (manufactured by Songlang Glass Industry Co., Ltd.) is attached with a surface protective film (width 25 mm x length 140 mm) with the separator peeled off. The sample for evaluation obtained in the above manner was measured using a tensile tester. As the tensile tester, the trade name "Autograph AG-Xplus HS 6000 mm/min high-speed mode (AG-50NX plus)" manufactured by Shimadzu Corporation was used. After setting the sample for evaluation in the tensile tester, it is placed in an ambient temperature of 23°C for 30 minutes or at a temperature of 80°C for 7 days, and then the tensile test is started. The conditions of the tensile test are as follows: peel angle: 180 degrees, peel speed (tensile speed): 6000 mm/min. The load when peeling the surface protective film from the above-mentioned glass was measured, and the average load at this time was used as the peeling force of the surface protective film. <Peeling force against glass at a peeling speed of 300 mm/min (peeling force at 23℃×30 minutes and peeling force at 80℃×7 days)> By making a 2 kg hand roller back and forth once, the glass ( Soda-lime glass (manufactured by Songlang Glass Industry Co., Ltd.) is attached with a surface protective film (width 25 mm x length 140 mm) with the separator peeled off. The sample for evaluation obtained in the above manner was measured using a tensile tester. As the tensile tester, the trade name "Autograph AG-Xplus HS 6000 mm/min high-speed mode (AG-50NX plus)" manufactured by Shimadzu Corporation was used. After setting the sample for evaluation in the tensile tester, it is placed in an ambient temperature of 23°C for 30 minutes or at a temperature of 80°C for 7 days, and then the tensile test is started. The conditions of the tensile test are as follows: peel angle: 180 degrees, peel speed (tensile speed): 300 mm/min. The load when peeling the surface protective film from the above-mentioned glass was measured, and the average load at this time was used as the peeling force of the surface protective film. [Example 1] PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) as a polyol having 3 OH groups was added as a polyol (A): 85 parts by weight as a polyol having 3 OH groups SANNIX GP-3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000): 13 parts by weight, as a polyol with 3 OH groups, SANNIX GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn=1000): 2 Parts by weight, Polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) as the polyfunctional isocyanate compound (B): 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nacem Fe(III): 0.1 parts by weight, isopropyl myristate as a fatty acid ester (manufactured by Kao Co., Ltd., trade name: EXCEPARL IPM, Mn=270): 20 parts by weight, 1-ethyl-3- Methylimidazolium bis(fluoromethanesulfonyl)imide (manufactured by Daiichi Industrial Pharmaceutical Co., Ltd., trade name: AS110): 1.5 parts by weight, two-terminal polyether modified silicone oil (Shin-Etsu Chemical Industrial Co., Ltd., trade name: KF-6004): 0.02 parts by weight, silicone bond-containing polymer (Kyoeisha Chemical Co., Ltd., trade name: LE-302): 0.25 parts by weight, as a dilution The ethyl acetate of the solvent is mixed and stirred to produce the adhesive composition (1). Using a grooved roller, the obtained adhesive composition (1) is applied to the adhesive composition (1) so that the thickness after drying becomes 10 μm. The base material of ester resin "Lumirror S10" (thickness 38 μm, manufactured by Toray Corporation) is cured and dried under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the base material. Then, A polysiloxane-treated surface of a 25 μm thick polyester resin-containing substrate (separator) treated with polysiloxane is attached to the surface of the adhesive layer to obtain a surface protective film with a spacer (1) The results are shown in Table 1. [Example 2] 1-ethyl-3-methylimidazolium bis(fluoromethanesulfonyl)imidide (manufactured by Daiichi Industrial Pharmaceutical Co., Ltd., trade name: AS110), and then use a fluoropolymer (manufactured by DIC, trade name: F-571): 0.50 parts by weight instead of the siloxane bond-containing polymer (manufactured by Kyoeisha Chemical Co., Ltd., trade name: LE-302) : 0.25 parts by weight, except that, in the same manner as in Example 1, an adhesive composition (2) was produced to obtain a surface protective film with a separator (2). The results are shown in Table 1. [Implementation Example 3] Change the usage amount of fluoropolymer (manufactured by DIC, trade name: F-571) to Except for 1.00 parts by weight, in the same manner as in Example 2, an adhesive composition (3) was produced to obtain a surface protective film with a separator (3). The results are shown in Table 1. [Example 4] In the production of the adhesive composition, a fluoropolymer (manufactured by DIC, trade name: F-571): 0.30 parts by weight was further used, except for this, the same method as in Example 1 was used to produce Adhesive composition (4) to obtain a surface protective film with spacer (4). The results are shown in Table 1. [Example 5] A fluoropolymer (manufactured by DIC, trade name: F-571): 0.30 parts by weight was used instead of a siloxane bond-containing polymer (manufactured by Kyoeisha Chemical Co., Ltd., trade name: LE-302) ): 0.25 parts by weight, except for this, proceed in the same manner as in Example 1 to produce an adhesive composition (5) to obtain a surface protective film with a separator (5). The results are shown in Table 1. [Example 6] SANNIX GP-3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000) as a polyol (A) as a polyol having 3 OH groups: 100 parts by weight, as a polyfunctional isocyanate compound ( B) Multifunctional alicyclic isocyanate compound Coronaate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.): 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nacem Fe(III): 0.1 parts by weight , Hydroxyl-containing polysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: X-22-4015): 0.25 parts by weight, ethyl acetate as a diluent solvent, mixed and stirred to produce an adhesive composition (6 ). The adhesive composition (6) was used in the same manner as in Example 1 to obtain a separator-attached surface protective film (6). The results are shown in Table 1. [Comparative Example 1] Addition as a polyol ( A) PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) as a polyol with 3 OH groups: 85 parts by weight, SANNIX GP-3000 as a polyol with 3 OH groups (Sanyo Chemical Co., Ltd. Company manufacture, Mn=3000): 13 parts by weight, as a polyol with 3 OH groups, SANNIX GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn=1000): 2 parts by weight, as a polyfunctional isocyanate compound (B ) Polyfunctional alicyclic isocyanate compound Coronaate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.): 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nacem Fe(III): 0.1 parts by weight, Ethyl acetate as a diluent solvent was mixed and stirred to produce an adhesive composition (C1). The adhesive composition (C1) was used in the same manner as in Example 1 to obtain a surface protective film with a separator ( C1). The results are shown in Table 1. [Comparative Example 2] In the manufacture of the adhesive composition, a two-terminal polyether-modified silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF) was further used. -6004): 0.02 parts by weight, except that, in the same manner as in Comparative Example 1, an adhesive composition (C2) was produced to obtain a separator-attached surface protective film (C2). The results are shown in Table 1. [Comparative Example 3] SANNIX GP-3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000) as a polyol (A) as a polyol having 3 OH groups: 100 parts by weight, as a polyfunctional isocyanate compound (B) the polyfunctional alicyclic isocyanate compound Coronaate HX (Nippon Po Produced by Lyurethane Industry Co., Ltd.: 18 parts by weight, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: Nacem Fe(III): 0.1 parts by weight, ethyl acetate as a dilution solvent, mixed and stirred, and manufactured Adhesive composition (C3). The adhesive composition (C3) was used in the same manner as in Example 1 to obtain a surface protective film with a separator (C3). The results are shown in Table 1. [Comparative Example 4] 1-ethyl-3-methylimidazolium bis(fluoromethanesulfonyl)imidide (manufactured by Daiichi Industrial Pharmaceutical Co., Ltd., trade name: AS110) and silicone-containing bonds were not used The polymer (manufactured by Kyoeisha Chemical Co., Ltd., trade name: LE-302), except for this, was carried out in the same manner as in Example 1 to produce an adhesive composition (C4) to obtain a spacer with Surface protection film (C4). The results are shown in Table 1. [Comparative Example 5] The amount of isopropyl myristate (manufactured by Kao Co., Ltd., trade name: EXCEPARL IPM, Mn=270) was changed to 30 parts by weight without using a polymer containing siloxane bonds. The usage amount of the two-terminal polyether modified silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-6004) was changed to 0.01 parts by weight, except for this, the same method as in Example 1 was carried out. , Manufacture the adhesive composition (C5), and obtain the surface protective film with spacer (C5). The results are shown in Table 1. [Comparative Example 6] In the manufacture of the adhesive composition, isopropyl myristate (manufactured by Kao Co., Ltd., trade name: EXCEPARL IPM, Mn=270): 25 parts by weight was further used for comparison. In the same manner as in Example 1, an adhesive composition (C6) was produced to obtain a surface protective film with a separator (C6). The results are shown in Table 1. [Comparative Example 7] Use of silicone release agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KS-776A): 0.15 parts by weight instead of two-terminal polyether modified silicone oil (Shin-Etsu Chemical Co., Ltd. Produced by the company, trade name: KF-6004): 0.01 parts by weight. Except for this, proceed in the same manner as in Comparative Example 5 to produce an adhesive composition (C7) to obtain a surface protective film with spacer (C7) . The results are shown in Table 1. [Table 1]    Blending (parts by weight) Peeling force to PET after 23℃×30 minutes (N/25 mm) Survival rate (%) Base polymer AS110 KS-776A KF-6004 IPM LE-302 F-571 X-22 -4015 Peeling speed 300 mm/min Peeling speed 6000 mm/min Example 1 100 1.5 - 0.02 20 0.25 - - 0.010 0.055 72 Example 2 100 - - 0.02 20 - 0.50 - 0.007 0.051 70 Example 3 100 - - 0.02 20 - 1.00 - 0.006 0.043 67 Example 4 100 1.5 - 0.02 20 0.25 0.30 - 0.006 0.049 68 Example 5 100 1.5 - 0.02 20 - 0.30 - 0.006 0.046 72 Example 6 100 - - - - - - 0.25 0.016 0.061 91 Comparative example 1 100 - - - - - - - 0.038 0.194 94 Comparative example 2 100 - - 0.02 - - - - 0.049 0.207 81 Comparative example 3 100 - - - - - - - 0.047 0.146 98 Comparative example 4 100 - - 0.02 20 - - - 0.020 0.094 83 Comparative example 5 100 1.5 - 0.01 30 - - - 0.020 0.090 77 Comparative example 6 100 - - - 25 - - - 0.032 0.112 97 Comparative example 7 100 1.5 0.15 - 20 - - - 0.008 0.043 38 [Example 7] "CYABINE SH-109" (54% solid content, containing fatty acid ester, manufactured by Toyo Ink) as a urethane prepolymer (C) was formulated: 100 parts by weight, as a polyfunctional Polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) of isocyanate compound (B): 7.05 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571): 1.00 parts by weight, Toluene as a diluent solvent: 208 parts by weight, stirred with a disperser to produce an adhesive composition (7). Using a grooved roller, the obtained adhesive composition (7) was applied to a polyester resin-containing substrate "Lumirror S10" (thickness 38 μm, manufactured by Toray) so that the thickness after drying became 10 μm, and Curing and drying under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated substrate (separator) with a thickness of 25 μm and a silicone-treated polysilicate was attached to the surface of the adhesive layer to obtain a surface protective film with a spacer ( 7). The results are shown in Table 2. [Example 8] Except for changing the usage amount of the fluoropolymer (manufactured by DIC, trade name: F-571) to 2.00 parts by weight, the same procedure as in Example 7 was carried out to produce an adhesive composition ( 8) to obtain a surface protective film (8) with spacers. The results are shown in Table 2. [Example 9] Except that the usage amount of the fluoropolymer (manufactured by DIC, trade name: F-571) was changed to 3.00 parts by weight, the same procedure as in Example 7 was carried out to produce an adhesive composition ( 9), and obtain the surface protective film with spacer (9). The results are shown in Table 2. [Table 2]    Blending (parts by weight) Peeling force to PET after 23℃×30 minutes (N/25 mm) Survival rate (%) Basic polymer SH-109 Coronate HX F-571 Peeling speed 300 mm/min Peeling speed 6000 mm/min Example 7 100 7.05 1.00 0.014 0.074 97 Example 8 100 7.05 2.00 0.014 0.068 96 Example 9 100 7.05 3.00 0.015 0.058 98 [Example 10] "CYABINE SH-109" (54% solid content, containing fatty acid ester, manufactured by Toyo Ink) as a urethane prepolymer (C) was formulated: 100 parts by weight, as a polyfunctional The polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) of the isocyanate compound (B): 3.6 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571): 1.00 part by weight, Toluene as a diluent solvent: 208 parts by weight, stirred with a disperser to produce an adhesive composition (10). Using a grooved roller, the obtained adhesive composition (10) was applied to a polyester resin-containing substrate "Lumirror S10" (thickness 38 μm, manufactured by Toray) so that the thickness after drying became 50 μm, and It is cured and dried under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated substrate (separator) with a thickness of 25 μm and a silicone-treated polysilicate was attached to the surface of the adhesive layer to obtain a surface protective film with a spacer ( 10). The results are shown in Table 3 and Table 4. [Example 11] Except for changing the usage amount of fluoropolymer (manufactured by DIC, trade name: F-571) to 3.00 parts by weight, the same procedure as in Example 10 was carried out to produce an adhesive composition ( 11), and obtain a surface protective film (11) with spacers. The results are shown in Table 3 and Table 4. [Example 12] Except for changing the usage amount of the fluoropolymer (manufactured by DIC, trade name: F-571) to 5.00 parts by weight, the same procedure as in Example 10 was carried out to manufacture an adhesive composition ( 12) to obtain a surface protective film (12) with spacers. The results are shown in Table 3 and Table 4. [Comparative Example 8] Except that no fluoropolymer (manufactured by DIC, trade name: F-571) was used, the same procedure as in Example 10 was carried out to produce an adhesive composition (C8) to obtain a barrier The surface protective film of the piece (C8). The results are shown in Table 3 and Table 4. [Comparative Example 9] The usage amount of Coronaate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) was changed to 7.05 parts by weight, and the fluoropolymer (manufactured by DIC, trade name: F-571) was not used. In the same manner as in Example 10, an adhesive composition (C9) was produced to obtain a surface protective film with a separator (C9). The results are shown in Table 3 and Table 4. [Example 13] "CYABINE SH-109" (54% solid content, containing fatty acid ester, manufactured by Toyo Ink) as a urethane prepolymer (C) was formulated: 100 parts by weight, as a polyfunctional The polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) of the isocyanate compound (B): 7.05 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571): 1.00 parts by weight, Toluene as a diluent solvent: 208 parts by weight, stirred with a disperser to produce an adhesive composition (13). Using a grooved roller, the obtained adhesive composition (13) was applied to a polyester resin-containing substrate "Lumirror S10" (thickness 38 μm, manufactured by Toray) so that the thickness after drying became 50 μm, and It is cured and dried under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated substrate (separator) with a thickness of 25 μm and a silicone-treated polysilicate was attached to the surface of the adhesive layer to obtain a surface protective film with a spacer ( 13). The results are shown in Table 3 and Table 4. [Example 14] Except for changing the usage amount of fluoropolymer (manufactured by DIC, trade name: F-571) to 3.00 parts by weight, the same procedure as in Example 13 was carried out to produce an adhesive composition ( 14) to obtain a surface protective film (14) with spacers. The results are shown in Table 3 and Table 4. [Example 15] Except for changing the usage amount of fluoropolymer (manufactured by DIC, trade name: F-571) to 5.00 parts by weight, the same procedure as in Example 13 was carried out to produce an adhesive composition ( 15) to obtain a surface protective film (15) with spacers. The results are shown in Table 3 and Table 4. [Comparative Example 10] Without using a fluoropolymer (manufactured by DIC, trade name: F-571), a silicone release agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KS-776A): 1 part by weight, Except for this, it carried out in the same way as Example 13, and produced the adhesive composition (C10), and obtained the surface protection film (C10) with a separator. The results are shown in Table 3 and Table 4. [Comparative Example 11] Instead of using a fluoropolymer (manufactured by DIC, trade name: F-571), a silicone release agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KS-776A): 3 parts by weight, Except for this, it carried out in the same way as Example 13, and produced the adhesive composition (C11), and obtained the surface protection film (C11) with a separator. The results are shown in Table 3 and Table 4. [Comparative Example 12] The usage amount of Coronaate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) was changed to 17.7 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571) was not used, and the thickness of the adhesive layer Except that it became 10 micrometers, it carried out similarly to Example 13, and produced the adhesive composition (C12), and obtained the surface protection film (C12) with a separator. The results are shown in Table 3 and Table 4. [Comparative Example 13] The usage amount of Coronaate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) was changed to 17.7 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571) was not used, and the thickness of the adhesive layer was changed. Except that it became 25 μm, it was performed in the same manner as in Example 13 to produce an adhesive composition (C13), and a separator-attached surface protective film (C13) was obtained. The results are shown in Table 3 and Table 4. [Example 16] PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) as a polyol having 3 OH groups as a polyol (A): 85 parts by weight as a polyol having 3 OH groups SANNIX GP-3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000): 13 parts by weight, as a polyol with 3 OH groups, SANNIX GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn=1000): 2 Parts by weight, the polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) as the polyfunctional isocyanate compound (B): 17.7 parts by weight, fluoropolymer (manufactured by DIC, trade name: F-571) ): 0.3 parts by weight, ethyl acetate as a dilution solvent: 200 parts by weight, and agitated by a disperser to produce an adhesive composition (16). Using a grooved roller, the obtained adhesive composition (16) was applied to a polyester resin-containing substrate "Lumirror S10" (thickness 38 μm, manufactured by Toray) so that the thickness after drying became 10 μm. It is cured and dried under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated substrate (separator) with a thickness of 25 μm and a silicone-treated polysilicate was attached to the surface of the adhesive layer to obtain a surface protective film with a spacer ( 16). The results are shown in Table 3 and Table 4. [Example 17] Except that the thickness of the adhesive layer was 25 μm, the same procedure as in Example 16 was carried out to produce an adhesive composition (17), and a separator-attached surface protective film (17) was obtained. The results are shown in Table 3 and Table 4. [Example 18] PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) as a polyol having 3 OH groups as a polyol (A): 85 parts by weight as a polyol having 3 OH groups SANNIX GP-3000 (manufactured by Sanyo Chemical Co., Ltd., Mn=3000): 13 parts by weight, as a polyol with 3 OH groups, SANNIX GP-1000 (manufactured by Sanyo Chemical Co., Ltd., Mn=1000): 2 Parts by weight, Polyfunctional alicyclic isocyanate compound Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a polyfunctional isocyanate compound (B): 17.7 parts by weight, hydroxyl-containing polysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd.) , Trade name: X-22-4015): 0.3 parts by weight, ethyl acetate as a diluent solvent: 200 parts by weight, stirred with a disperser to produce the adhesive composition (18). Using a grooved roller, the obtained adhesive composition (18) was applied to a polyester resin-containing substrate "Lumirror S10" (thickness 38 μm, manufactured by Toray) so that the thickness after drying became 10 μm. It is cured and dried under the conditions of a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated substrate (separator) with a thickness of 25 μm and a silicone-treated polysilicate was attached to the surface of the adhesive layer to obtain a surface protective film with a spacer ( 18). The results are shown in Table 3 and Table 4. [Example 19] Except that the thickness of the adhesive layer was 25 μm, the same procedure as in Example 18 was carried out to produce an adhesive composition (19) to obtain a surface protective film with spacer (19) . The results are shown in Table 3 and Table 4. [table 3]    Main agent HX F-571 X-22-4015 KS-776A Urethane prepolymer SH-109 Polyether polyol Crosslinking agent Fluoropolymer Polysiloxane containing hydroxyl Silicone stripper Example 10 100    3.6 1       Example 11 100    3.6 3       Example 12 100    3.6 5       Comparative example 8 100    3.6          Comparative example 9 100    7.05          Example 13 100    7.05 1       Example 14 100    7.05 3       Example 15 100    7.05 5       Comparative example 10 100    7.05       1 Comparative example 11 100    7.05       3 Comparative example 12 100    17.7          Comparative example 13 100    17.7          Example 16    100 17.7 0.3       Example 17    100 17.7 0.3       Example 18    100 17.7    0.3    Example 19    100 17.7    0.3    [Table 4]    Survival rate Peeling force to glass (N/25 mm) Peeling force to PET (N/25 mm) Peeling speed 300 mm/min after 23℃×30 minutes 80℃×7 days after peeling speed 300 mm/min Peeling speed 6000 mm/min after 23℃×30 minutes 80℃×7 days after peeling speed 6000 mm/min Peeling speed 300 mm/min after 23℃×30 minutes 80℃×7 days after peeling speed 300 mm/min Peeling speed 6000 mm/min after 23℃×30 minutes 80℃×7 days after peeling speed 6000 mm/min Example 10 76% 0.010 0.020 0.036 0.192 0.007 0.035 0.045 0.223 Example 11 71% 0.012 0.031 0.035 0.144 0.011 0.022 0.049 0.157 Example 12 67% 0.013 0.035 0.039 0.096 0.011 0.030 0.042 0.164 Comparative example 8 81% 0.024 0.211 0.140 1.461 0.051 0.806 0.373 4.579 Comparative example 9 79% 0.016 0.078 0.060 0.383 0.020 0.149 0.109 1.164 Example 13 74% 0.010 0.012 0.020 0.064 0.009 0.014 0.032 0.068 Example 14 76% 0.009 0.013 0.020 0.045 0.008 0.012 0.021 0.052 Example 15 72% 0.009 0.015 0.022 0.048 0.010 0.015 0.025 0.047 Comparative example 10 13% 0.007 0.008 0.015 0.021 0.012 0.086 0.060 0.872 Comparative example 11 13% 0.007 0.007 0.018 0.023 - - - - Comparative example 12 102% 0.036 0.073 0.304 0.385 0.035 0.079 0.188 0.360 Comparative example 13 100% 0.049 0.076 0.327 0.392 0.032 0.072 0.189 0.393 Example 16 91% 0.013 0.028 0.030 0.097 0.012 0.038 0.051 0.130 Example 17 94% 0.010 0.026 0.027 0.083 0.011 0.038 0.046 0.092 Example 18 93% 0.019 0.045 0.053 0.154 0.016 0.039 0.059 0.155 Example 19 94% 0.022 0.045 0.065 0.143 0.014 0.037 0.065 0.166 [Example 20] The separator of the surface protective film with separator (1) obtained in Example 1 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 21] The separator of the surface protection film with separator (2) obtained in Example 2 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 22] The separator of the separator-attached surface protection film (3) obtained in Example 3 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 23] The separator of the surface protective film with separator (4) obtained in Example 4 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 24] The separator of the surface protective film with separator (5) obtained in Example 5 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 25] The separator of the surface protective film with separator (6) obtained in Example 6 was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product) as an optical member Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 26] The separator of the surface protection film with separator (1) obtained in Example 1 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 27] The separator of the surface protection film with separator (2) obtained in Example 2 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 28] The separator of the surface protection film with separator (3) obtained in Example 3 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 29] The separator of the surface protective film with separator (4) obtained in Example 4 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 30] The separator of the surface protective film with separator (5) obtained in Example 5 was peeled off, and the adhesive layer side was attached to the conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 31] The separator of the surface protection film with separator (6) obtained in Example 6 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 32] The separator of the surface protective film with separator (7) obtained in Example 7 was peeled off, and the adhesive layer side was attached to a polarizing plate as an optical member (manufactured by Nitto Denko Co., Ltd., product Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 33] The separator of the surface protective film with separator (10) obtained in Example 10 was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product) as an optical member Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 34] The separator of the surface protection film with separator (13) obtained in Example 13 was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product) as an optical member Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 35] The separator of the surface protective film with separator (16) obtained in Example 16 was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product) as an optical member Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 36] The separator of the surface protection film with separator (18) obtained in Example 18 was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Co., Ltd., product) as an optical member Name "TEG1465DUHC"), and obtain an optical component with a surface protective film attached. [Example 37] The separator of the surface protection film with separator (7) obtained in Example 7 was peeled off, and the adhesive layer side was attached to the conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 38] The separator of the surface protection film with separator (10) obtained in Example 10 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 39] The separator of the surface protection film with separator (13) obtained in Example 13 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 40] The separator of the surface protective film with separator (16) obtained in Example 16 was peeled off, and the adhesive layer side was attached to the conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Example 41] The separator of the surface protective film with separator (18) obtained in Example 18 was peeled off, and the adhesive layer side was attached to a conductive film as an electronic component (manufactured by Nitto Denko Co., Ltd., The trade name is "ELECRYSTA V270L-TFMP"), and an electronic component with a surface protective film attached. [Industrial Applicability] The surface protective film of the present invention can be used for any suitable applications. Preferably, the surface protection film of the present invention is suitable for the field of optical components or electronic components.

1:基材層 2:黏著劑層 10:表面保護膜1: Substrate layer 2: Adhesive layer 10: Surface protective film

圖1係本發明之一實施形態之表面保護膜之概略剖視圖。Fig. 1 is a schematic cross-sectional view of a surface protective film according to an embodiment of the present invention.

1:基材層 1: Substrate layer

2:黏著劑層 2: Adhesive layer

10:表面保護膜 10: Surface protective film

Claims (9)

一種表面保護膜，其係具有黏著劑層者，並且 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.08 N/25 mm以下， 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於23℃下經過30分鐘後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.02 N/25 mm以下， 構成該黏著劑層之黏著劑係由黏著劑組合物形成， 該黏著劑組合物包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑， 該基礎聚合物為胺基甲酸酯預聚物， 該聚矽氧系添加劑為選自含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種， 該氟系添加劑為選自具有氟脂肪族烴骨架之化合物、使有機化合物與氟化合物共聚合而成之含氟有機化合物、含羥基之氟化合物、含交聯性官能基之氟系化合物中之至少一種， 該黏著劑組合物中之該聚矽氧系添加劑及/或該氟系添加劑之含量，以相對於該基礎聚合物100重量份之該聚矽氧系添加劑與該氟系添加劑之合計量計，為0.01重量份～50重量份， 其中，上述黏著劑組合物為下者之情形時除外： 將作為胺基甲酸酯黏著劑之「CYABINE SH-109H」(固形物成分54%，Toyo Chem股份有限公司製造)100重量份、作為交聯劑之「CYABINE BXX-6269」(Toyo Chem股份有限公司製造)6.9重量份、調平劑(Grandic PC4100(聚矽氧)，DIC公司製造)：0.05重量份或0.01重量份，以甲苯稀釋至黏著劑組合物之固形物成分成為45%，利用分散機進行攪拌而得之胺基甲酸酯系黏著劑組合物。A surface protective film, which has an adhesive layer, and A polyethylene terephthalate film with a thickness of 25 μm was bonded to the adhesive layer. After 30 minutes at 23°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 6000 The peeling force when peeling at mm/min is 0.08 N/25 mm or less, A polyethylene terephthalate film with a thickness of 25 μm was bonded to the adhesive layer, and after 30 minutes at 23°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 300 When peeling at mm/min, the peeling force is 0.02 N/25 mm or less, The adhesive constituting the adhesive layer is formed of an adhesive composition, The adhesive composition includes a base polymer, and silicone additives and/or fluorine additives, The base polymer is a urethane prepolymer, The polysiloxane-based additive is at least one selected from the group consisting of hydroxyl-containing polysiloxane-based compounds and crosslinkable functional group-containing polysiloxane-based compounds, The fluorine-based additive is selected from a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound formed by copolymerizing an organic compound and a fluorine compound, a hydroxyl-containing fluorine compound, and a crosslinkable functional group-containing fluorine-based compound At least one, The content of the silicone-based additive and/or the fluorine-based additive in the adhesive composition is based on the total amount of the silicone-based additive and the fluorine-based additive relative to 100 parts by weight of the base polymer, 0.01 parts by weight to 50 parts by weight, Among them, except when the above-mentioned adhesive composition is the following: 100 parts by weight of "CYABINE SH-109H" (54% solid content, manufactured by Toyo Chem Co., Ltd.) as a urethane adhesive, and "CYABINE BXX-6269" as a crosslinking agent (Toyo Chem Co., Ltd.) Made by the company) 6.9 parts by weight, leveling agent (Grandic PC4100 (polysiloxane), manufactured by DIC): 0.05 parts by weight or 0.01 parts by weight, diluted with toluene until the solid content of the adhesive composition becomes 45%, and disperse The urethane-based adhesive composition obtained by stirring with a machine. 一種表面保護膜，其係具有黏著劑層者，並且 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.35 N/25 mm以下， 對該黏著劑層貼合厚度25 μm之聚對苯二甲酸乙二酯膜，於80℃下經過7天後，將該聚對苯二甲酸乙二酯膜以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.07 N/25 mm以下， 構成該黏著劑層之黏著劑係由黏著劑組合物形成， 該黏著劑組合物包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑， 該基礎聚合物為胺基甲酸酯預聚物， 該聚矽氧系添加劑為選自含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種， 該氟系添加劑為選自具有氟脂肪族烴骨架之化合物、使有機化合物與氟化合物共聚合而成之含氟有機化合物、含羥基之氟化合物、含交聯性官能基之氟系化合物中之至少一種， 該黏著劑組合物中之該聚矽氧系添加劑及/或該氟系添加劑之含量，以相對於該基礎聚合物100重量份之該聚矽氧系添加劑與該氟系添加劑之合計量計，為0.01重量份～50重量份， 其中，上述黏著劑組合物為下者之情形時除外： 將作為胺基甲酸酯黏著劑之「CYABINE SH-109H」(固形物成分54%，Toyo Chem股份有限公司製造)100重量份、作為交聯劑之「CYABINE BXX-6269」(Toyo Chem股份有限公司製造)6.9重量份、調平劑(Grandic PC4100(聚矽氧)，DIC公司製造)：0.05重量份或0.01重量份，以甲苯稀釋至黏著劑組合物之固形物成分成為45%，利用分散機進行攪拌而得之胺基甲酸酯系黏著劑組合物。A surface protective film, which has an adhesive layer, and A polyethylene terephthalate film with a thickness of 25 μm was attached to the adhesive layer. After 7 days at 80°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 6000 When peeling at mm/min, the peeling force is 0.35 N/25 mm or less, A polyethylene terephthalate film with a thickness of 25 μm was attached to the adhesive layer. After 7 days at 80°C, the polyethylene terephthalate film was peeled at a peeling angle of 180 degrees and a peeling speed of 300 The peeling force when peeling at mm/min is 0.07 N/25 mm or less, The adhesive constituting the adhesive layer is formed of an adhesive composition, The adhesive composition includes a base polymer, and silicone additives and/or fluorine additives, The base polymer is a urethane prepolymer, The polysiloxane-based additive is at least one selected from the group consisting of hydroxyl-containing polysiloxane-based compounds and crosslinkable functional group-containing polysiloxane-based compounds, The fluorine-based additive is selected from a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound formed by copolymerizing an organic compound and a fluorine compound, a hydroxyl-containing fluorine compound, and a crosslinkable functional group-containing fluorine-based compound At least one, The content of the silicone-based additive and/or the fluorine-based additive in the adhesive composition is based on the total amount of the silicone-based additive and the fluorine-based additive relative to 100 parts by weight of the base polymer, 0.01 parts by weight to 50 parts by weight, Among them, except when the above-mentioned adhesive composition is the following: 100 parts by weight of "CYABINE SH-109H" (54% solid content, manufactured by Toyo Chem Co., Ltd.) as a urethane adhesive and "CYABINE BXX-6269" as a crosslinking agent (Toyo Chem Co., Ltd.) Made by the company) 6.9 parts by weight, leveling agent (Grandic PC4100 (polysiloxane), manufactured by DIC): 0.05 parts by weight or 0.01 parts by weight, diluted with toluene until the solid content of the adhesive composition becomes 45%, and disperse The urethane-based adhesive composition obtained by stirring with a machine. 一種表面保護膜，其係具有黏著劑層者，並且 對該黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.135 N/25 mm以下， 對該黏著劑層貼合厚度1000 μm之玻璃板，於23℃下經過30分鐘後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.023 N/25 mm以下， 構成該黏著劑層之黏著劑係由黏著劑組合物形成， 該黏著劑組合物包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑， 該基礎聚合物為胺基甲酸酯預聚物， 該聚矽氧系添加劑為選自含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種， 該氟系添加劑為選自具有氟脂肪族烴骨架之化合物、使有機化合物與氟化合物共聚合而成之含氟有機化合物、含羥基之氟化合物、含交聯性官能基之氟系化合物中之至少一種， 該黏著劑組合物中之該聚矽氧系添加劑及/或該氟系添加劑之含量，以相對於該基礎聚合物100重量份之該聚矽氧系添加劑與該氟系添加劑之合計量計，為0.01重量份～50重量份， 其中，上述黏著劑組合物為下者之情形時除外： 將作為胺基甲酸酯黏著劑之「CYABINE SH-109H」(固形物成分54%，Toyo Chem股份有限公司製造)100重量份、作為交聯劑之「CYABINE BXX-6269」(Toyo Chem股份有限公司製造)6.9重量份、調平劑(Grandic PC4100(聚矽氧)，DIC公司製造)：0.05重量份或0.01重量份，以甲苯稀釋至黏著劑組合物之固形物成分成為45%，利用分散機進行攪拌而得之胺基甲酸酯系黏著劑組合物。A surface protective film, which has an adhesive layer, and A glass plate with a thickness of 1000 μm was attached to the adhesive layer, and after 30 minutes at 23°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min was 0.135 N/25 mm below, A glass plate with a thickness of 1000 μm was attached to the adhesive layer, and after 30 minutes at 23°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 300 mm/min was 0.023 N/25 mm below, The adhesive constituting the adhesive layer is formed of an adhesive composition, The adhesive composition includes a base polymer, and silicone additives and/or fluorine additives, The base polymer is a urethane prepolymer, The polysiloxane-based additive is at least one selected from the group consisting of hydroxyl-containing polysiloxane-based compounds and crosslinkable functional group-containing polysiloxane-based compounds, The fluorine-based additive is selected from a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound formed by copolymerizing an organic compound and a fluorine compound, a hydroxyl-containing fluorine compound, and a crosslinkable functional group-containing fluorine-based compound At least one, The content of the silicone-based additive and/or the fluorine-based additive in the adhesive composition is based on the total amount of the silicone-based additive and the fluorine-based additive relative to 100 parts by weight of the base polymer, 0.01 parts by weight to 50 parts by weight, Among them, except when the above-mentioned adhesive composition is the following: 100 parts by weight of "CYABINE SH-109H" (54% solid content, manufactured by Toyo Chem Co., Ltd.) as a urethane adhesive, and "CYABINE BXX-6269" as a crosslinking agent (Toyo Chem Co., Ltd.) Made by the company) 6.9 parts by weight, leveling agent (Grandic PC4100 (polysiloxane), manufactured by DIC): 0.05 parts by weight or 0.01 parts by weight, diluted with toluene until the solid content of the adhesive composition becomes 45%, and disperse The urethane-based adhesive composition obtained by stirring with a machine. 一種表面保護膜，其係具有黏著劑層者，並且 對該黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度6000 mm/min進行剝離時之剝離力為0.35 N/25 mm以下， 對上述黏著劑層貼合厚度1000 μm之玻璃板，於80℃下經過7天後，自該玻璃板以剝離角度180度、剝離速度300 mm/min進行剝離時之剝離力為0.05 N/25 mm以下， 構成該黏著劑層之黏著劑係由黏著劑組合物形成， 該黏著劑組合物包含基礎聚合物、與聚矽氧系添加劑及/或氟系添加劑， 該基礎聚合物為胺基甲酸酯預聚物， 該聚矽氧系添加劑為選自含羥基之聚矽氧系化合物、含交聯性官能基之聚矽氧系化合物中之至少一種， 該氟系添加劑為選自具有氟脂肪族烴骨架之化合物、使有機化合物與氟化合物共聚合而成之含氟有機化合物、含羥基之氟化合物、含交聯性官能基之氟系化合物中之至少一種， 該黏著劑組合物中之該聚矽氧系添加劑及/或該氟系添加劑之含量，以相對於該基礎聚合物100重量份之該聚矽氧系添加劑與該氟系添加劑之合計量計，為0.01重量份～50重量份， 其中，上述黏著劑組合物為下者之情形時除外： 將作為胺基甲酸酯黏著劑之「CYABINE SH-109H」(固形物成分54%，Toyo Chem股份有限公司製造)100重量份、作為交聯劑之「CYABINE BXX-6269」(Toyo Chem股份有限公司製造)6.9重量份、調平劑(Grandic PC4100(聚矽氧)，DIC公司製造)：0.05重量份或0.01重量份，以甲苯稀釋至黏著劑組合物之固形物成分成為45%，利用分散機進行攪拌而得之胺基甲酸酯系黏著劑組合物。A surface protective film, which has an adhesive layer, and A glass plate with a thickness of 1000 μm was attached to the adhesive layer, and after 7 days at 80°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 6000 mm/min was 0.35 N/25 mm below, A glass plate with a thickness of 1000 μm is attached to the above adhesive layer. After 7 days at 80°C, the peeling force when peeling from the glass plate at a peeling angle of 180 degrees and a peeling speed of 300 mm/min is 0.05 N/25 mm below, The adhesive constituting the adhesive layer is formed of an adhesive composition, The adhesive composition includes a base polymer, and silicone additives and/or fluorine additives, The base polymer is a urethane prepolymer, The polysiloxane-based additive is at least one selected from the group consisting of hydroxyl-containing polysiloxane-based compounds and crosslinkable functional group-containing polysiloxane-based compounds, The fluorine-based additive is selected from a compound having a fluoroaliphatic hydrocarbon skeleton, a fluorine-containing organic compound formed by copolymerizing an organic compound and a fluorine compound, a hydroxyl-containing fluorine compound, and a crosslinkable functional group-containing fluorine-based compound At least one, The content of the silicone-based additive and/or the fluorine-based additive in the adhesive composition is based on the total amount of the silicone-based additive and the fluorine-based additive relative to 100 parts by weight of the base polymer, 0.01 parts by weight to 50 parts by weight, Among them, except when the above-mentioned adhesive composition is the following: 100 parts by weight of "CYABINE SH-109H" (54% solid content, manufactured by Toyo Chem Co., Ltd.) as a urethane adhesive and "CYABINE BXX-6269" as a crosslinking agent (Toyo Chem Co., Ltd.) Made by the company) 6.9 parts by weight, leveling agent (Grandic PC4100 (polysiloxane), manufactured by DIC): 0.05 parts by weight or 0.01 parts by weight, diluted with toluene until the solid content of the adhesive composition becomes 45%, and disperse The urethane-based adhesive composition obtained by stirring with a machine. 如請求項1至4中任一項之表面保護膜，其殘存接著率為50%以上。For the surface protective film of any one of claims 1 to 4, the residual adhesion rate is more than 50%. 如請求項1至4中任一項之表面保護膜，其中上述黏著劑組合物包含脂肪酸酯。The surface protection film according to any one of claims 1 to 4, wherein the adhesive composition contains fatty acid ester. 如請求項5之表面保護膜，其中上述黏著劑組合物包含脂肪酸酯。The surface protection film of claim 5, wherein the adhesive composition contains fatty acid esters. 一種光學構件，其貼附有如請求項1至7中任一項之表面保護膜。An optical member to which the surface protection film according to any one of claims 1 to 7 is attached. 一種電子構件，其貼附有如請求項1至7中任一項之表面保護膜。An electronic component to which the surface protection film according to any one of claims 1 to 7 is attached.
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