TW202031164A - 減壓鞋墊結構 - Google Patents
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Abstract
本發明係有關於一種減壓鞋墊結構,其係包含有一鞋墊本體,於所述鞋墊本體上設有一導引薄墊部及一後穩薄墊部,所述導引薄墊部為供前腳掌之第一趾骨與第一跖(蹠)骨銜接的跖趾關節至第五趾骨與第五跖(蹠)骨銜接的跖趾關節區域範圍容設,而所述後穩薄墊部供後跟骨容置,並讓第一跖趾關節處於踏位的最低點;藉此,提供腳部良好步行動態環境,具有足夠空間可以在腳部運行的路徑上作厚度遞減而導引完成一動態步伐,並增加站立時的穩定性,讓穿著者無論是在動態或靜態均能達到減輕腳部壓力的功效。
Description
本發明係有關於一種減壓鞋墊結構,尤指一種符合人體腳部運行(動態或靜態)時,能順暢導引應力流通達到減輕腳部壓力的鞋墊結構為其應用發明者。
按,現在大部分的鞋墊原廠隨鞋內附的鞋墊,大部分都是平面式均等厚度的鞋墊,有些可能會略加一點足弓厚度增加支撐性,若是高單價鞋款則可能會加裝足弓穩固硬塊;然後,在足壓最大的地方,即腳跟及前掌加裝緩震膠塊去保護地面傳來的衝擊,但此緩震膠塊反而形成行進間的阻力、浪費動能,增加行進間施加的力道。
以下說明正常的步態流程三步驟:請參閱第十圖所示,於圖中步驟(一)腳踏位處在身體前方外腳掌著地,抵銷斜向的動力,承載垂直的重力,轉移向前的推力。然後,進入步驟(二)腳掌內旋踏位由外側轉移,並延續應力至內側,腳踏位則在這個過程中移動至身體後方;然後進入步驟(三)在拇指球踏位接收蓄積前面步驟所傳遞而來向前的推力,並開始對腳掌灌注新的推動力後爆發蹬出,至此完成了一次完整而良好的步行動態。由上述的步態流程可知,但人類腳底其實不是踩在平面時最適合運作。這也就是現今世界上足部受損身體不適,足弓塌陷的人口只增不減,以及兒童扁平足比例大幅上升的主要原因;進一步論,足弓的壓力在站立時就已經存在,再加上長時間的走路或跑步對足弓的傷害可想而知,所以平面式的踏位環境根本不適合人類行走運行。
一雙性能良好的運動鞋,球鞋底部的踏面角度跟曲線是關鍵因素,而一般球鞋的設計,把這個極為重要的關鍵給忽視掉,雖然有些球鞋前掌AIR跟厚底鞋墊可以透過這些材料本身的壓縮特性,而取得腳掌所需的沉陷量,但在側向活動時產生鞋墊踏面跟鞋墊底部位上下錯位的物理現象,造成腳掌容易外翻。另外,以避震的功能來談高厚度鞋墊(5)是加分的,但如果以要取得適合對地面的施力角度來說高厚度鞋墊(5)就會是阻力,阻礙腳掌最適當的沉降,因鞋墊(5)側向錯位後,內側頂高的底弧在側向煞停或變向時,較高離地面的鞋底面,把腳掌內側頂高造成外翻[如第十一圖所示],不只難以保持穩定的身體動作,連帶腳踝外側也要增加施力才能平衡,而增加肌力負擔也造成扭傷機會增加,腳掌也會滑向外側難以支撐。
今,發明人秉持多年該相關行業之豐富設計開發及實際製作經驗,針對現有之結構再予以研究改良,提供一種減壓鞋墊結構,以期達到更佳實用價值性之目的者。
本發明之主要目的在於提供一種減壓鞋墊結構,尤其是指一種符合人體腳部運行(動態或靜態)時,能順暢導引應力流通達到減輕腳部壓力的鞋墊結構為其目的。
本發明減壓鞋墊結構主要目的與功效,係由以下具體技術手段所達成:
其係包含有一鞋墊本體,於所述鞋墊本體上設有一導引薄墊部及一後穩薄墊部,所述導引薄墊部為供前腳掌之第一趾骨與第一跖(蹠)骨銜接的跖趾關節至第五趾骨與第五跖(蹠)骨銜接的跖趾關節區域範圍容設,而所述後穩薄墊部供後跟骨容置,並讓第一跖趾關節處於踏位的最低點;藉此,提供腳部良好步行動態環境,具有足夠空間可以在腳部運行的路徑上作厚度遞減而導引完成一動態步伐,並增加站立時的穩定性,讓穿著者無論是在動態或靜態均能達到減輕腳部壓力的功效。
本發明減壓鞋墊結構的較佳實施例,其中所述鞋墊本體包含有由厚逐漸趨薄的後跟區、足弓區、前掌區,且所述前掌區往上翹起,於所述鞋墊本體之前掌區與足弓區間設有一導引薄墊部及所述後跟區設有一後穩薄墊部。
本發明減壓鞋墊結構的較佳實施例,其中所述導引薄墊部包含有一拇指段、一銜接所述拇指段的橫向導引段,且所述橫向導引段由對應第一跖趾關節往第五跖趾關節處向上傾斜,及一銜接所述橫向導引段的側受力段,並讓所述拇指段、所述橫向導引段及所述側受力段形成閃電型的導引薄墊部。
本發明減壓鞋墊結構的較佳實施例,其中所述橫向導引段對應人體腳部第一跖趾關節處凹陷一球形槽,而所述側受力段由與所述橫向導引段銜接處開始傾斜並於末端位置形成低點位,所述後穩薄墊部係對應人體腳部後跟骨且往所述後跟區凹陷而設;藉由所述球形槽、低點位及後穩薄墊部,讓腳掌重心坐落在三個低位,成為靜態站立時重心支撐點,且其受力分佈內外均勻,提供靜態站立時的穩定性。
本發明減壓鞋墊結構的較佳實施例,其中於所述鞋墊本體之導引薄墊部及後穩薄墊部表面設有止滑層。
本發明減壓鞋墊結構的較佳實施例,其中所述鞋墊本體之後跟區、足弓區周緣設有包覆用的翹起緣。
本發明減壓鞋墊結構的較佳實施例,其中所述導引薄墊部之橫向導引段之上緣處設有突起的擴大段,利用擴大段讓前掌作落於導引薄墊部更為穩固。
為令本發明所運用之技術內容、發明目的及其達成之功效有更完整且清楚的揭露,茲於下詳細說明之,並請一併參閱所揭之圖式及圖號:
首先,請參閱第一圖所示,為本發明減壓鞋墊結構之立體外觀示意圖,係包含有:
一鞋墊本體(1),所述鞋墊本體(1)包含有由厚逐漸趨薄的後跟區(11)、足弓區(12)、前掌區(13),且所述前掌區(13)往上翹起,於所述鞋墊本體(1)之前掌區(13)與足弓區(12)間設有一導引薄墊部(2)及所述後跟區(11)設有一後穩薄墊部(3),其中:
所述導引薄墊部(2)包含有一對應人體腳部第一趾骨a1的拇指段(21)、一銜接所述拇指段(21)且對應人體腳部第一、第二、第三、第四、第五跖趾關節b1、b2、b3、b4、b5的橫向導引段(22),且所述橫向導引段(22)由對應第一跖趾關節b1往第五跖趾關節b5處向上傾斜,及一銜接所述橫向導引段(22)且對應人體腳部第五跖(蹠)骨c1的側受力段(23),並讓所述拇指段(21)、所述橫向導引段(22)及所述側受力段(23)形成閃電型的導引薄墊部(2),所述拇指段(21)與所述橫向導引段(22)厚度相對所述前掌區(13)薄,而所述側受力段(23)厚度相對所述足弓區(12)薄,再於所述橫向導引段(22)對應人體腳部第一跖趾關節b1處凹陷一球形槽(221),而所述側受力段(23)由與所述橫向導引段(22)銜接處開始傾斜並於末端位置形成低點位(231);
所述後穩薄墊部(3)係對應人體腳部後跟骨d且往所述後跟區(11)凹陷而設,其厚度相對所述後跟區(11)薄。
請一併參閱第一~八圖所示,本發明鞋墊本體(1)可任意抽取式置入鞋內或直接結合於鞋體內部;然而,所述鞋墊本體(1)為採用一具有適當厚度與柔軟性的鞋墊體,並透過人體腳部的骨骼與運動行徑變化而構成所述鞋墊本體(1)厚薄的設定,以下舉例說明:
係設置一鞋墊本體(1),其所述鞋墊本體(1)上分佈有厚度約6.5mm的後跟區(11)、厚度約5.5mm的足弓區(12)及厚度約4mm的前掌區(13)[上述舉例的厚度為該區某一點的厚度,而該些區為由厚平整趨漸薄],而所述前掌區(13)因應腳趾活動同時趨漸變薄而往上翹起如船形,續,在所述鞋墊本體(1)上設有位於所述前掌區(13)與所述足弓區(12)之間的一導引薄墊部(2)及位於所述後跟區(11)的一後穩薄墊部(3),而薄墊部的設計主要為由所述鞋墊本體(1)端面凹陷變薄,能因應人體腳部關節與運動時骨骼變化而設有薄於所述鞋墊本體(1)厚度的部位,係提供關節與骨骼適當活動空間與裕度。所述導引薄墊部(2)的範圍為由拇指段(21)、橫向導引段(22)及側受力段(23)所構成的閃電型區域,進一步所述橫向導引段(22)對應人體腳部第一、第二、第三、第四、第五跖趾關節b1、b2、b3、b4、b5的大小,而讓所述橫向導引段(22)由對應第一跖趾關節b1往第五跖趾關節b5處向上傾斜,且在較低位的第一跖趾關節b1處凹陷一球形槽(221),讓球形槽(221)供較大第一跖趾關節b1容置,並讓腳掌能往內側[第一跖趾關節b1方向]傾斜。
接著,所述導引薄墊部(2)的側受力段(23)較為接近偏厚的所述足弓區(12),具有往上頂撐起外側,而配合所述球形槽(221)讓腳掌能往內側傾斜[第一跖趾關節b1處低,第五跖趾關節b5處高],同時,所述側受力段(23)末端位置也因應接續所述後跟區(11),而往下沉降,使其所述側受力段(23)由與所述橫向導引段(22)銜接處開始傾斜並於末端位置形成低點位(231),讓人體腳部第五跖(蹠)骨c1落實定位於此,最後,人體腳部後跟骨d再落於所述後跟區(11)凹陷的後穩薄墊部(3);如此,當使用者穿著鞋墊本體(1)之後,透過所述導引薄墊部(2)內所設置的球形槽(221)、低點位(231),讓第一跖趾關節b1處下陷至所述球形槽(221)內(內側點),讓腳掌往內側偏轉,而腳部第五跖(蹠)骨c1位於所述側受力段(23)之末端位置穩固外側點,再配合人體腳部後跟骨d容置於所述後穩薄墊部(3)內,讓腳掌重心坐落在三個低位,成為靜態站立時重心支撐點,且其受力分佈內外均勻,保持呈現在一種高度平衡的狀態下,三點支撐猶如爪子般牢牢扣住,提供靜態站立時強大穩定性,而此時的足弓部位並未受到拉扯及緊繃的壓力,而處在此狀態下,對身體的踝關節、膝關節、髖關節都會有良好的角度變化,呈現最自然舒適的狀態,並能改善足部病變問題。
當使用者穿著鞋墊於動態行走、運動時,透過正常的步態流程三步驟,其當踏出步伐時,腳踏位處在身體前方外腳掌著地,抵銷斜向的動力,讓腳部應力順由所述鞋墊本體(1)往下沉降之導引薄墊部(2)的側受力段(23)導引,而能承載垂直的重力,轉移向前的推力,當腳掌部位接觸地面時,隨著腳部的向前移動行走而抬起腳部時,因腳跟會逐漸抬起提高,讓腳掌內旋踏位由外側轉移,即由往下沉降之導引薄墊部(2)的橫向導引段(22)外側[第五跖趾關節b5處]往內側[第一跖趾關節b1處]導引,且因所述橫向導引段(22)內側[第一跖趾關節b1處]較為低位,並設有最低位的球形槽(221),使其應力導引更為順暢延續至內側,而所述球形槽(221)提供第一跖趾關節b1活動的空間,同時將腳掌往內側傾斜,可一邊承載著使用者體重,一邊傳導著應力,之後,再將球形槽(221)接收蓄積前面動作所傳遞而來向前的推力,並開始對腳掌灌注新的推動力後由所述導引薄墊部(2)的拇指段(21)爆發蹬出,至此完成了一次完整而良好的步行動態[應力走向請參第八圖箭頭所示]。
進一步所述鞋墊本體(1)為達到更完善包覆腳部的功效,特於所述後跟區(11)、足弓區(12)周緣環設有包覆用的翹起緣(14)。且進一步參閱第九圖所示,在所述鞋墊本體(1)之導引薄墊部(2)及後穩薄墊部(3)表面設有止滑層(4),能有效提高動態運動時,腳部不打滑的功用,而其所述止滑層(4)可採黏貼結合於所述鞋墊本體(1),或直接噴塗於所述鞋墊本體(1)者。
另外,於所述導引薄墊部(2)之橫向導引段(22)之上緣處設有突起的擴大段(24),利用擴大段(24)讓前掌作落於導引薄墊部(2)更為穩固。
然而前述之實施例或圖式並非限定本發明之產品結構或使用方式,任何所屬技術領域中具有通常知識者之適當變化或修飾,皆應視為不脫離本發明之專利範疇。
藉由以上所述,本發明結構之組成與使用實施說明可知,本發明與現有結構相較之下,具有下列優點:
1.本發明減壓鞋墊結構,藉由球形槽、低點位處在鞋墊內側、最接近外緣端點的外側即是最大的重心座落地點,內、外受力保持呈現在一種高度平衡的狀態之下,同時,配合後足的後穩薄墊部,讓腳掌重心坐落在三個低位,三點支撐猶如爪子般牢牢扣住,提供靜態站立時強大穩定性。
2.本發明減壓鞋墊結構,利用鞋墊本體上設有導正腳掌往內傾斜的導引薄墊部,讓正常或外翻的腳掌能降低腳部壓力,同時透過導引薄墊部保持腳部運行應力之導引路徑,達到運作輕鬆流暢的減壓功效。
綜上所述,本發明實施例確能達到所預期之使用功效,又其所揭露之具體構造,不僅未曾見諸於同類產品中,亦未曾公開於申請前,誠已完全符合專利法之規定與要求,爰依法提出發明專利之申請,懇請惠予審查,並賜准專利,則實感德便。
本發明:
(1):鞋墊本體
(11):後跟區
(12):足弓區
(13):前掌區
(14):翹起緣
(2):導引薄墊部
(21):拇指段
(22):橫向導引段
(221):球形槽
(23):側受力段
(231):低點位
(24):擴大段
(3):後穩薄墊部
(4):止滑層
第一圖:本發明之俯視示意圖。
第二圖:表示第一圖A-A剖面處的示意圖。
第三圖:表示第一圖B-B剖面處的示意圖。
第四圖:表示第一圖C-C剖面處的示意圖。
第五圖:表示第一圖D-D剖面處的示意圖。
第六圖:表示第一圖E-E剖面處的示意圖。
第七圖:表示第一圖F-F剖面處的示意圖。
第八圖:本發明鞋墊與腳部及應力運行示意圖。
第九圖:本發明鞋墊上設有止滑層的示意圖。
第十圖:表示正常的步態流程的示意圖。
第十一圖:傳統高厚度鞋墊側向受力的示意圖。
(1):鞋墊本體
(11):後跟區
(12):足弓區
(13):前掌區
(2):導引薄墊部
(21):拇指段
(22):橫向導引段
(221):球形槽
(23):側受力段
(231):低點位
(24):擴大段
(3):後穩薄墊部
Claims (8)
- 一種減壓鞋墊結構,係設有一鞋墊本體,所述鞋墊本體包含有由厚逐漸趨薄的後跟區、足弓區、前掌區,且所述前掌區往上翹起,於所述鞋墊本體之前掌區與足弓區間設有一導引薄墊部及所述後跟區設有一後穩薄墊部,其中: 所述導引薄墊部包含有一對應人體腳部第一趾骨的拇指段、一銜接所述拇指段且對應人體腳部第一、第二、第三、第四、第五跖趾關節的橫向導引段,且所述橫向導引段由對應第一跖趾關節往第五跖趾關節處向上傾斜,及一銜接所述橫向導引段且對應人體腳部第五跖(蹠)骨的側受力段,並讓所述拇指段、所述橫向導引段及所述側受力段形成閃電型的導引薄墊部,所述拇指段與所述橫向導引段厚度相對所述前掌區薄,而所述側受力段厚度相對所述足弓區薄,而所述側受力段由與所述橫向導引段銜接處開始傾斜並於末端位置形成低點位; 所述後穩薄墊部係對應人體腳部後跟骨且往所述後跟區凹陷而設,其厚度相對所述後跟區薄。
- 如申請專利範圍第1項所述之減壓鞋墊結構,其中於所述橫向導引段對應人體腳部第一跖趾關節處凹陷一球形槽。
- 如申請專利範圍第1或2項所述之減壓鞋墊結構,其中於所述導引薄墊部之橫向導引段之上緣處設有突起的擴大段。
- 如申請專利範圍第1或2項所述之減壓鞋墊結構,其中於所述鞋墊本體之導引薄墊部及後穩薄墊部表面設有止滑層。
- 如申請專利範圍第4項所述之減壓鞋墊結構,其中所述止滑層可採黏貼結合於所述鞋墊本體。
- 如申請專利範圍第4項所述之減壓鞋墊結構,其中所述止滑層可採直接噴塗於所述鞋墊本體。
- 如申請專利範圍第1或2項所述之減壓鞋墊結構,其中所述鞋墊本體之後跟區、足弓區周緣設有包覆用的翹起緣。
- 如申請專利範圍第4項所述之減壓鞋墊結構,其中所述鞋墊本體之後跟區、足弓區周緣設有包覆用的翹起緣。
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US16/453,003 US20200268101A1 (en) | 2019-02-21 | 2019-06-26 | Insole structure with decompression |
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FR2858525B1 (fr) * | 2003-08-05 | 2006-01-27 | Jean Luc Rhenter | Semelle plantaire a amortissement selectif |
CN2770419Y (zh) * | 2005-02-04 | 2006-04-12 | 顾蓬仙 | 鞋底呈凹凸型的鞋 |
TWI269641B (en) * | 2005-08-18 | 2007-01-01 | Tung Chi Plastics Chemistry En | Shoe material structure |
KR100933527B1 (ko) * | 2009-06-04 | 2009-12-23 | 주식회사 트렉스타 | 신발용 인솔 |
US20150272273A1 (en) * | 2014-03-25 | 2015-10-01 | Sophia Melissa WHITTINGHAM | Orthotic insole |
TWM527233U (zh) * | 2016-05-20 | 2016-08-21 | xu-dong Tu | 鞋墊結構改良 |
US20170354201A1 (en) * | 2016-06-13 | 2017-12-14 | Hsu-Tong Tu | Insole |
TWM559084U (zh) * | 2017-10-19 | 2018-05-01 | Tu Xu Dong | 止滑鞋墊結構 |
TWM581387U (zh) * | 2019-02-21 | 2019-08-01 | 涂旭東 | Decompression insole structure |
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2019
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