TW202006847A - 打線接合裝置 - Google Patents
打線接合裝置 Download PDFInfo
- Publication number
- TW202006847A TW202006847A TW108124563A TW108124563A TW202006847A TW 202006847 A TW202006847 A TW 202006847A TW 108124563 A TW108124563 A TW 108124563A TW 108124563 A TW108124563 A TW 108124563A TW 202006847 A TW202006847 A TW 202006847A
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- Prior art keywords
- vibration
- ultrasonic
- electrode
- lead
- amplitude
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- 238000003466 welding Methods 0.000 claims description 72
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 7
- 238000004148 unit process Methods 0.000 claims 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 101100350613 Arabidopsis thaliana PLL1 gene Proteins 0.000 description 30
- 101100082028 Arabidopsis thaliana PLL2 gene Proteins 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 19
- 238000001514 detection method Methods 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 241000309551 Arthraxon hispidus Species 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000284 extract Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
- B06B1/0223—Driving circuits for generating signals continuous in time
- B06B1/0269—Driving circuits for generating signals continuous in time for generating multiple frequencies
- B06B1/0276—Driving circuits for generating signals continuous in time for generating multiple frequencies with simultaneous generation, e.g. with modulation, harmonics
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
- B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies
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- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
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Abstract
本發明於打線接合裝置100中,藉由簡單的構成來抑制打線與引線的接合品質的下降。本發明的打線接合裝置100包括:超音波焊頭14,輸入有兩個超音波振動且能夠以不同的頻率於Y方向及X方向上對安裝於前端的焊針15進行加振;以及控制部50,調整兩個超音波振動的各振動的大小,Y方向是超音波焊頭14的延伸方向,控制部50藉由調整兩個超音波振動的各振動的大小來調整焊針15的Y方向與X方向上的振幅的比率(ΔY/ΔX)。
Description
本發明是有關於一種打線接合裝置的構造。
藉由打線將半導體晶粒(die)的電極與引線框架(lead frame)的引線之間加以連接的打線接合裝置被廣泛使用。打線接合裝置是於藉由焊針(capillary)將打線壓在電極上的狀態下,使焊針超音波振動,而將打線與電極加以接合後,將打線架設於引線,於將經架設的打線壓在引線上的狀態下,使焊針超音波振動,而將打線與引線加以連接的裝置(例如參照專利文獻1)。
於專利文獻1中記載的打線接合裝置中,焊針的超音波振動的方向是超音波焊頭的延伸方向(Y方向)。另一方面,引線呈放射狀地配置於半導體晶粒的周圍,因此有時引線的延伸方向與焊針的超音波振動的方向不一致。於此情況下,架設於電極與引線之間的打線因將打線連接於引線時的超音波振動而產生共振,從而存在半導體晶粒的電極與打線的接合部剝落的問題。因此,於專利文獻1中,提出了如下的方法:藉由使半導體晶粒的載置台旋轉,或利用兩個超音波焊頭使一個焊針於XY方向上振動,使從電極朝向引線的打線的延伸方向與超音波振動的方向一致。
另外,近年來,提出了一種進行XY混合加振的接合裝置,該XY混合加振使焊針的超音波振動的方向不僅於Y方向上而且於與Y方向正交的X方向上亦同時振動(例如參照專利文獻2、專利文獻3)。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2008-60210號公報
[專利文獻2]國際申請公開2017/094558號手冊
[專利文獻3]日本專利第6180736號公報
[發明所欲解決之課題]
此外,近年來,由於積體電路(Integrated Circuit,IC)小型化的要求,引線的寬度有變窄的傾向。於此種寬度窄的引線中,當引線的延伸方向與焊針超音波振動的方向不同時,引線會因由超音波振動施加至引線的寬度方向上的力而變形,從而有時打線與引線的接合品質會下降。於此情況下,於如專利文獻1所記載般的使半導體晶粒的載置台旋轉,或利用兩個超音波焊頭使一個焊針於XY方向上振動的方法中,存在結構變得複雜,同時接合的節拍時間(takt time)變長的問題。另外,於專利文獻2、專利文獻3所記載的接合裝置中,雖然進行了XY混合加振,但沒有對引線的延伸方向與超音波振動的方向的關係進行研究,從而存在由超音波加振而產生引線的變形,而導致接合品質下降的問題。
因此,本發明的目的在於藉由簡單的構成來抑制打線與電極的接合品質的下降。
[解決課題之手段]
本發明的打線接合裝置的特徵在於包括:超音波焊頭,輸入有兩個超音波振動且能夠以不同的頻率於Y方向及與Y方向正交的X方向上對安裝於前端的接合工具進行加振;以及控制部,調整兩個超音波振動的各振動的大小,Y方向是超音波焊頭的延伸方向,控制部藉由調整兩個超音波振動的各振動的大小來調整接合工具的Y方向與X方向上的振幅的比率。
藉此,能夠以簡單的構成減小施加至電極的寬度方向上的振動能量,而抑制打線與電極的接合品質的下降。
於本發明的打線接合裝置中,亦可設為接合工具將打線連接於相對於Y方向傾斜地配置的帶狀的電極,且包括對電極的圖像進行拍攝的攝像裝置,控制部對由攝像裝置拍攝的電極的圖像進行處理並計算電極的延伸方向相對於Y方向的角度,且根據所計算出的角度來調整兩個超音波振動的各振動的大小。另外,亦可設為控制部調整各振動的大小,以使所計算出的角度越大,接合工具的Y方向上的振幅相對於X方向上的振幅的比率越小。
藉此,電極的延伸方向相對於Y方向的角度越大,越能夠減小接合工具的前端施加至電極的Y方向上的振動能量,而能夠抑制打線與電極的接合品質的下降。
於本發明的打線接合裝置中,亦可設為控制部調整各振動的大小,以使接合工具的Y方向與X方向上的振幅的比率成為電極的延伸方向的Y方向與X方向的比率。
藉此,接合工具的前端的振動範圍的對角線的延伸方向成為電極的延伸方向,能夠將輸入至電極的超音波振動的能量的方向設為電極的延伸方向,從而能夠抑制電極的變形而抑制接合品質的下降。
於本發明的打線接合裝置中,亦可設為控制部對由攝像裝置所拍攝的電極的圖像進行處理並計算電極的與延伸方向成直角的方向上的電極的寬度,且調整兩個所述超音波振動的各振動的大小,以使所述接合工具的所述電極的與延伸方向成直角的方向上的振幅不超過所計算的所述電極的所述寬度。
藉此,能夠進一步減少施加至電極的寬度方向上的力,而抑制電極的變形,從而能夠以簡單的構成抑制打線與電極的接合品質的下降。
於本發明的打線接合裝置中,亦可設為超音波焊頭包括:振動放大部,連接有能夠以兩個不同的頻率於Y方向上振動的超音波振動器,將從超音波振動器輸入的Y方向上的超音波振動放大並傳遞至所述前端;以及振動轉換部,將Y方向上的超音波振動轉換為超音波焊頭的扭轉振動。控制部調整超音波振動器的各振動的大小。另外,亦可設為振動放大部於俯視下為多邊形形狀,振動轉換部是相對於Y方向傾斜地配置的狹縫。進而,於本發明的打線接合裝置中,亦可設為超音波焊頭連接有第一超音波振動器及第二超音波振動器,第一超音波振動器使超音波焊頭於Y方向上振動,第二超音波振動器使超音波焊頭扭轉振動,控制部調整第一超音波振動器的振動的大小及第二超音波振動器的振動的大小。
能夠以簡單的構成使接合工具的前端能夠於XY方向上振動。
[發明的效果]
本發明可以藉由簡單的構成來抑制打線與電極的接合品質的下降。
<打線接合裝置的構成>
以下,一邊參照圖式一邊對實施形態的打線接合裝置100進行說明。如圖1所示,本實施形態的打線接合裝置100包括:框架10;XY工作台11,安裝於框架10上;接合頭12,安裝於XY工作台11上;接合臂13,安裝於接合頭12;超音波焊頭14,安裝於接合臂13的前端;超音波振動器16,使超音波焊頭14超音波振動;焊針15,為安裝於超音波焊頭14的前端的接合工具;加熱塊17,對安裝有半導體晶粒19的引線框架20進行加熱吸附;以及控制部50。再者,於圖1中,XY方向表示水平方向,Z方向表示上下方向。
接合頭12藉由XY工作台11於XY方向上移動。於接合頭12的內部設置有於上下方向(Z方向)上驅動接合臂13的Z方向馬達30。另外,於接合頭12的上部安裝有拍攝引線框架20的圖像的攝像裝置即相機37及供給打線38的線軸(spool)39。
Z方向馬達30包括:定子31,固定於接合頭12;以及轉子32,圍繞旋轉軸33旋轉。轉子32與接合臂13的後部成為一體,當轉子32旋轉移動時,接合臂13的前端於上下方向上移動。當轉子32旋轉移動時,焊針15的前端於大致垂直於作為半導體晶粒19的第一電極的電極19a(圖2所示)的上表面的方向上下移動。超音波焊頭14的凸緣14a藉由螺栓固定於接合臂13的前端。另外,於接合臂13的前端部分的下側的面設置有容納超音波振動器16的凹部13a。
於超音波焊頭14的前端安裝有焊針15。焊針15是於中心設置有用於使打線38穿過的孔的圓筒形,且隨著朝向前端外徑變小。加熱塊17安裝於框架10上。於加熱塊17安裝有對加熱塊17進行加熱的加熱器18,於加熱塊17的上表面吸附固定引線框架20。
經由馬達驅動器34從電源35對Z方向馬達30的定子31供給驅動電力。另外,經由超音波振動器驅動器42從電源41對超音波振動器16供給驅動電力。
控制部50是包括如下構件的電腦:中央處理單元(Central Processing Unit,CPU)52,於內部進行運算處理;記憶體53,儲存控制程式、資料等;以及設備介面51,進行與設備的輸入輸出。CPU 52、記憶體53及設備介面51藉由資料匯流排54連接。
超音波振動器16、Z方向馬達30分別經由超音波振動器驅動器42、馬達驅動器34連接於控制部50,超音波振動器16、Z方向馬達30根據控制部50的指令而運作。另外,相機37亦連接於控制部50,相機37所拍攝的圖像被輸入至控制部50。
如圖2所示,引線框架20包括:島狀物21,設置於中央且安裝有半導體晶粒19;以及帶狀的第二電極即引線22,呈放射狀地配置於島狀物21的周圍。當將半導體晶粒19安裝於島狀物21上時,引線22成為呈放射狀地配置於半導體晶粒19的周圍的狀態。
於圖2中Y方向是超音波焊頭14的延伸方向,X方向表示與Y方向正交的方向。另外,一點鏈線表示引線22的延伸方向25。如圖2所示,引線22的延伸方向相對於Y方向傾斜。另外,如圖2所示,超音波振動器16組裝入超音波焊頭14。
<基本的打線接合動作>
以下,一邊參照圖3(a)~圖3(d)一邊簡單說明藉由圖1所示的打線接合裝置100利用打線38將半導體晶粒19的電極19a與引線框架20的引線22的第二接合點24之間加以連接的打線接合的步驟。
如圖3(a)所示,將貫穿焊針15的打線38的前端形成為球狀的自由空氣球(free air ball)38a。於焊炬電極40與從焊針15的前端延伸出的打線38的前端之間產生火花,並藉由其熱形成自由空氣球38a。另外,安裝有半導體晶粒19的引線框架20被吸附固定於加熱塊17,同時藉由加熱器18被加熱至規定溫度。
接著,如圖3(b)所示,驅動Z方向馬達30使接合臂13旋轉,而使焊針15的前端朝向半導體晶粒19的電極19a下降。然後,於將自由空氣球38a按壓至半導體晶粒19的電極19a上的同時,對超音波振動器16供給交替方向上的電力,且使超音波焊頭14產生共振,而使安裝於前端的焊針15超音波振動。藉由焊針15將自由空氣球38a向電極19a的按壓及超音波振動,自由空氣球38a與半導體晶粒19的電極19a接合。
如圖3(c)所示,當將自由空氣球38a接合於半導體晶粒19的電極19a上時,陸續送出打線38同時使打線38拱絲(looping)而使焊針15於引線框架20的引線22上移動。然後,如圖3(d)所示,使焊針15下降,而將打線38按壓至引線22的第二接合點24。另外,同時向超音波振動器16供給交替方向的電力,而使焊針15超音波振動。如此,藉由按壓載荷及超音波振動將打線38接合於引線22的第二接合點24。
當向第二接合點24的接合完成時,打線38於第二接合點24的上表面被切斷。將半導體晶粒19的電極19a與引線22的第二接合點24之間加以連接的打線38成為圖2所示的連接打線23。當半導體晶粒19的所有電極19a與所有引線22的第二接合點24藉由連接打線23連接時,向半導體晶粒19的接合動作完成。
<超音波振動器及超音波焊頭的超音波振動>
接著,一邊參照圖2、圖4一邊對超音波振動器16及超音波焊頭14的超音波振動進行詳細說明。
圖2所示的超音波振動器16能夠如圖4所示般以F1、F2這兩個不同的頻率振動。當超音波振動器16以頻率F1振動時,圖2所示的超音波焊頭14以於軸方向即Y方向上伸縮的方式共振,前端的焊針15的前端於Y方向上振動。另外,當超音波振動器16以頻率F2振動時,超音波焊頭14圍繞Y軸扭轉共振。藉此,焊針15的前端於X方向上振動。如此,超音波焊頭14能夠從超音波振動器16輸入頻率F1、頻率F2這兩個超音波振動,而於XY方向上對焊針15的前端進行加振。
當將頻率F1、頻率F2設為接近例如150 kHz、180 kHz般的頻率時,焊針15的前端的振動軌跡61成為如圖5(a)、圖6的實線所示的李沙育(Lissajous)波形。另外,於X方向上的振幅ΔX1與Y方向上的振幅ΔY1相同的情況下,如圖5(b)、圖6中以實線所示,前端的振動範圍62成為大致正方形。於此情況下,相對於Y方向的振動範圍62的對角線形成的角度θ1成為45度。
於圖1所示的超音波振動器驅動器42設置有將超音波振動器16的振動頻率鎖定為頻率F1的第一相位同步電路(以下稱為PLL1)及將超音波振動器16的振動頻率鎖定為頻率F2的第二相位同步電路(以下稱為PLL2)。圖4所示的頻率F1(Y方向振動)的振動的大小及頻率F2(X方向振動)的振動的大小可以藉由變更PLL1、PLL2的各增益來調整。
例如,當增大PLL1的增益且減小PLL2的增益時,如圖4中以實線所示,頻率F1的振動的大小變大,頻率F2的振動的大小變小。於此情況下,如圖6中以虛線所示,焊針15的前端的Y方向上的振幅ΔY2變大,X方向上的振幅ΔX2變小,前端的振動軌跡63、振動範圍64成為於Y方向上長的長方形。於此情況下,相對於Y方向的振動範圍62的對角線形成的角度θ2小於45度。
相反,當減小PLL1的增益且增大PLL2的增益時,如圖4的一點鏈線所示,頻率F1的振動的大小變小,頻率F2的振動的大小變大。於此情況下,如圖6中以一點鏈線所示,焊針15的前端的Y方向上的振幅ΔY3變小,X方向上的振幅ΔX3變大,前端的振動軌跡65、振動範圍66成為於X方向上長的長方形。於此情況下,相對於Y方向的振動範圍62的對角線形成的角度θ3大於45度。
因此,藉由調整超音波振動器驅動器42的PLL1、PLL2的增益,可以調整焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(振幅ΔY相對於振幅ΔX的比率=ΔY/ΔX)。
<控制部的功能塊>
如圖7所示,控制部50包括如下三個功能塊:圖像獲取部55;圖像處理部56,對圖像獲取部55所獲取的圖像進行處理並計算引線22的延伸方向25;以及振幅調整部57,調整超音波振動器16的振動的大小而調整焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率ΔY/ΔX。該些各功能塊藉由執行記憶體53所儲存的程式來實現。
<打線接合裝置的動作>
接著,一邊參照圖8至圖11一邊對本實施形態的打線接合裝置100的動作進行說明。
<引線的延伸方向及寬度的計算>
如圖8的步驟S101所示,圖像獲取部55藉由圖1所示的相機37獲取圖2所示的引線框架20的圖像。圖9是表示相機37的視場37a中的引線22的圖像的圖。再者,當藉由相機37拍攝引線框架20時,於視場37a中包含多根引線22的圖像,但於圖9中,僅提取並記載一根引線22的圖像,而省略了其他引線22的圖像的圖示。圖像獲取部55將所拍攝的圖像輸出至圖像處理部56。
如圖8的步驟S102所示,圖像處理部56對從圖像獲取部55輸入的圖像進行處理,並如下所說明般計算引線22的延伸方向25。
如圖9所示,圖像處理部56設定跨越引線22般的兩個檢測範圍26a、26b。如圖9所示,兩個檢測範圍26a、26b設定為於引線22的長度方向上隔開而存在。
接著,圖像處理部56檢測所設定的檢測範圍26a、檢測範圍26b中的亮度變化點。通常,引線22的部分由於引線22的表面是平面,光被反射而亮度高。引線22之間的部分成為空間,因此進入該部分的光由於被位於較引線22更下方的面,例如加熱塊17的表面等反射,而亮度變低。因此,於引線22的邊緣部分中,亮度從亮度低的狀態起至亮度高的狀態之間變化。因此,圖像處理部56提取位於圖9所示的檢測範圍26a中的引線22的寬度方向上的兩個邊緣27a、28a以及位於檢測範圍26b中的引線22的寬度方向上的兩個邊緣27b、28b這四個點來作為亮度變化點。
然後,圖像處理部56使用檢測範圍26a中的邊緣27a及與檢測範圍26a隔開的檢測範圍26b中的邊緣27b來計算引線22的延伸方向25與Y方向的角度θ。同樣地,圖像處理部56使用邊緣28a及邊緣28b來計算引線22的延伸方向25與Y方向的角度θ。然後,圖像處理部56將計算出的兩個角度θ的平均值作為引線22的延伸方向25與Y方向的角度θ而輸出至振幅調整部57。此處,角度θ是引線22的延伸方向25相對於圖9的Y方向的角度,且成為0°~±90°的範圍。
另外,圖像處理部56根據檢測範圍26a中的邊緣27a、邊緣28a及檢測範圍26b中的邊緣27b、邊緣28b分別計算與引線22的延伸方向成直角的方向上的引線22的寬度,並將其平均值作為引線22的第二接合點24附近的引線22的寬度W而輸出至振幅調整部57。
<PLL1、PLL2的增益的設定>
圖8的步驟S103,如圖10所示,振幅調整部57計算焊針15的前端的X方向上的振動的振幅ΔX與Y方向上的振幅ΔY的比率ΔY/ΔX成為從圖像處理部56輸入的引線22的延伸方向25與Y方向的角度θ的絕對值的tan,即tan(|θ|)般的超音波振動器驅動器42的PLL1、PLL2的增益的比率。此時,亦可將規定了振幅ΔY與PLL1的關係及振幅ΔX與PLL2的關係的映射等儲存於記憶體53,且參照該映射來計算PLL1、PLL2的比率。
當如此般設定PLL1、PLL2的增益的比率時,如圖10所示,焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(ΔY/ΔX)成為引線22的延伸方向25的Y方向與X方向的比率。而且,焊針15的前端的振動範圍60成為長方形,且振動範圍60的對角線的延伸方向成為引線22的延伸方向。另外,引線22的延伸方向25與Y方向的角度θ越大,Y方向上的振幅ΔY越小,與X方向上的振幅ΔX越大。即,角度θ越大,振幅ΔY相對於振幅ΔX的比率=ΔY/ΔX越小。
另外,振幅調整部57基於檢測出的引線22的寬度W及引線22的延伸方向25與Y方向的角度θ,計算圖10所示的振動範圍60不超過引線22的寬度W的振幅ΔX或者振幅ΔY,根據該些振幅及以前計算出的PLL1、PLL2的增益的比率,計算PLL1、PLL2的增益,並將其儲存於記憶體53。
於圖像獲取部55獲取的圖像中包含多個引線22的情況下,圖像處理部56、振幅調整部57針對各引線22計算PLL1、PLL2的增益,並將其儲存於記憶體53。然後,對於圖像中所有的引線22將PLL1、PLL2的增益儲存於記憶體53後,對圖像獲取部55所拍攝的下一圖像進行同樣的處理,對於圖2所示的引線框架20的所有引線22,將PLL1、PLL2的增益儲存於記憶體53。如此,圖像獲取部55、圖像處理部56、振幅調整部57重覆執行圖8所示的步驟S101至步驟S104,直至對於所有的引線22將PLL1、PLL2的增益儲存於記憶體53為止。然後,對於所有的引線22將PLL1、PLL2的增益儲存於記憶體53後,於步驟S104中判斷為是(YES),而進入圖8的步驟S105,從而開始向引線框架20的接合動作。
<接合動作>
接合動作是與以前說明圖3(a)~圖3(d)的動作相同的動作,但控制部50於進行圖3(c)所示的引線22向第二接合點24的接合時,讀出記憶體53所儲存的對於各引線22的PLL1、PLL2的增益,而使超音波振動器16運作。
如以前所說明般,設定記憶體53所儲存的對於各引線22的PLL1、PLL2的增益,以使焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(ΔY/ΔX)成為引線22的延伸方向25的Y方向與X方向的比率。因此,當使用從記憶體53讀出的PLL1、PLL2的增益而使超音波振動器16運作時,如圖11所示,焊針15的前端的振動範圍60的對角線的延伸方向成為引線22的延伸方向25。
控制部50繼續進行接合動作,直至圖8的步驟S106中,向所有的引線22的接合完成為止,且當向所有的引線22的接合完成後,程式的執行完成。
本實施形態的打線接合裝置100中,將對於各引線22的PLL1、PLL2的增益設定為焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(ΔY/ΔX)成為引線22的延伸方向25的Y方向與X方向的比率。藉此,焊針15的前端的振動範圍60的對角線的延伸方向成為引線22的延伸方向25。因此,可以將輸入至引線22的超音波振動的能量方向設為引線22的延伸方向,從而可以抑制由超音波振動引起的引線22的變形而抑制接合品質的下降。
另外,本實施形態的打線接合裝置100中,引線22的延伸方向25與Y方向的角度θ越大,Y方向上的振幅ΔY就越小,與X方向上的振幅ΔX就越大。因此,角度θ越大,焊針15的前端施加至引線22的Y方向上的振動能量就越小。而且,當角度θ成為90°時,Y方向上的振幅ΔY成為零,可以將施加至引線22的寬度方向上的振動能量設為零。藉此,當將打線38與引線22接合時,可以減少施加至引線22的寬度方向上的能量,而抑制引線22的變形,並進一步抑制打線38與引線22的接合品質的下降。
另外,本實施形態的打線接合裝置100中,將對於各引線22的PLL1、PLL2的增益設定為引線22的寬度方向的振幅不超過引線22的寬度。藉此,可以抑制於接合時焊針15的前端從引線22脫離而使引線22變形的情況。藉此,可以進一步抑制打線38與引線22的接合品質的下降。
於以上說明的實施形態中,對利用打線38將半導體晶粒19的電極19a與引線框架20的引線22加以連接進行了說明,但不限於此,亦可以適用於將半導體晶粒19的電極19a與呈放射狀地配置於半導體晶粒19周圍的基板的帶狀的電極19a加以連接的情況。進而亦可以適用於將積層了半導體晶粒19的積層半導體各層的電極與其他層的電極加以連接時,而不是基板。另外,作為接合工具以焊針15為例進行了說明,但不限於焊針15,例如,亦可以適用於使用楔形(wedge)工具等的打線接合。
另外,於以上說明的實施形態中,說明了設定針對各引線22的PLL1、PLL2的增益,以使焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(ΔY/ΔX)成為引線22的延伸方向25的Y方向與X方向的比率的情況,但不限於此,亦可設為引線22的延伸方向25與Y方向的角度θ越大,振幅ΔY相對於振幅ΔX的比率=ΔY/ΔX越小。於此情況下,亦可以將規定了相對於角度θ的ΔY/ΔX的映射儲存於記憶體53,並參照該映射來設定對於各引線22的PLL1、PLL2的增益。
另外,於實施形態中,說明了基於檢測出的引線22的寬度W及引線22的延伸方向25與Y方向的角度θ來計算PLL1、PLL2的增益,以使振動範圍60不超過引線22的寬度W的情況,但不限於此。例如,於預先知道引線22的寬度W的情況下,可使用已知的寬度W藉由角度θ來計算PLL1、PLL2,或亦可設為根據寬度W來設定PLL1、PLL2的最大值,且將PLL1、PLL2設定為不超過該最大值。
接著,一邊參照圖12一邊對另一實施形態的打線接合裝置200進行說明。打線接合裝置200中,僅超音波焊頭71的結構與以前說明的打線接合裝置100的超音波焊頭14不同,而其他部分與打線接合裝置100相同,因此省略圖示及說明。
如圖12所示,本實施形態的打線接合裝置200的超音波焊頭71具有:振動放大部74,連接有能夠以兩個不同的頻率F1、F2於Y方向上振動的超音波振動器16,將從超音波振動器16輸入的Y方向上的超音波振動放大並傳遞至前端;以及振動轉換部75,將Y方向上的超音波振動轉換為超音波焊頭71的扭轉振動。振動放大部74於俯視下為四邊形形狀,且振動轉換部75包括相對於Y方向傾斜地配置的上側狹縫75a、下側狹縫75b。再者,若振動放大部74於俯視下為多邊形形狀,則不限於四邊形形狀,亦可以為六邊形或八變形。
如圖12所示,振動放大部4呈於俯視時具有等腰梯形形狀的上表面74a及底面74b的剖面實心的四稜柱形狀。於上表面74a及底面74b形成有構成振動轉換部75的兩根上側狹縫75a及兩根下側狹縫75b。另外,振動放大部74具有作為未形成振動轉換部75的面的側面74c、側面74d、後端面74e、前端面74f。於後端面74e安裝有超音波振動器16。振動放大部74成為沿著Y方向朝向前端面74f前端變細的錐形形狀,且構成為使從超音波振動器16傳遞的Y方向上的振幅放大。
於作為振動放大部74的Y方向振動的節的位置設置有上側狹縫75a、下側狹縫75b。各狹縫75a、狹縫75b的深度及寬度相同,不貫穿振動放大部4,且其最大深度未滿振動放大部4的上下方向上的厚度的1/2。
當從超音波振動器16將兩個頻率F1、F2的超音波振動輸入至超音波焊頭71時,Y方向的振動於振動放大部4中放大。而且,當Y方向上的振動穿過振動轉換部75時,Y方向上的振動的一部分被轉換為圍繞Y方向上的軸的扭轉振動。
此處,藉由振動轉換部75的結構,可以調整將頻率F1、頻率F2中的一者的Y方向振動轉換為扭轉振動的比例。例如,於增大將頻率F2的Y方向振動轉換為扭轉振動的比例,且減小將頻率F1的Y方向振動轉換為扭轉振動的比例的情況下,與以前說明的實施形態同樣地,可以藉由調整PLL1的增益及PLL2的增益來調整焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率ΔY/ΔX。
因此,本實施形態的打線接合裝置200與以前說明的打線接合裝置100同樣地,藉由設定對於各引線22的PLL1、PLL2的增益,以使焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率(ΔY/ΔX)成為引線22的延伸方向25的Y方向與X方向的比率,可以將焊針15的前端的振動範圍60的對角線的延伸方向設為引線22的延伸方向25。另外,引線22的延伸方向25與Y方向的角度θ越大,越可以減小Y方向上的振幅ΔY,越增大與X方向上的振幅ΔX。藉此,可以抑制由超音波振動引起的引線22的變形,而抑制接合品質的降低。
接著,一邊參照圖13、圖14一邊對另一實施形態的打線接合裝置300進行說明。本實施形態的打線接合裝置300構成為將以前說明的打線接合裝置100的超音波振動器16設為包含分別以不同的頻率F1、頻率F2振動的超音波振動部86a、超音波振動部86b的超音波振動器86,且超音波振動器驅動器89分別向各超音波振動部86a、超音波振動部86b供給驅動電力。除此以外的部分與以前說明的打線接合裝置100相同。
如圖13所示,超音波振動器86包含左右兩個超音波振動部86a、86b。如圖14所示,積層多個藉由設置於表面的槽82而左右絕緣的多個壓電元件81而構成超音波振動器86。槽82的一側及另一側分別構成超音波振動部86a、超音波振動部86b。從超音波振動器驅動器89向超音波振動部86a供給頻率F1的電力,向超音波振動部86b供給頻率F2的電力。
與以前說明的打線接合裝置100同樣地,當超音波振動部86a以頻率F1振動時,超音波焊頭14以於Y方向上伸縮的方式共振,前端的焊針15的前端於Y方向上振動,當超音波振動部86b以頻率F2振動時,超音波焊頭14繞Y軸扭轉共振,焊針15的前端於X方向上振動。因此,超音波振動部86a構成第一超音波振動器,超音波振動部86b構成第二超音波振動器。
由於如此般構成超音波振動器86,因此藉由調整從超音波振動器驅動器89輸出至超音波振動部86a的頻率F1的電力的大小及輸出至超音波振動部86b的頻率F2的電力的大小,可以調整焊針15的前端的Y方向上的振幅ΔY與X方向上的振幅ΔX的比率ΔY/ΔX。
本實施形態的打線接合裝置300取得與以前說明的打線接合裝置100相同的作用、效果。再者,於本實施形態中,對積層多個藉由設置於表面的槽82而左右絕緣的多個壓電元件81而構成超音波振動器86的情況進行了說明,但不限於此,亦可積層兩個分體的壓電元件且藉由兩個獨立的第一超音波振動器、第二超音波振動器來構成超音波振動器86。
如以上所說明般,各打線接合裝置100、打線接合裝置200、打線接合裝置300可以藉由簡單的構成來抑制打線38與電極的接合品質的下降。
10‧‧‧框架
11‧‧‧工作台(XY工作台)
12‧‧‧接合頭
13‧‧‧接合臂
13a‧‧‧凹部
14、71‧‧‧超音波焊頭
14a‧‧‧凸緣
15‧‧‧焊針
16、86‧‧‧超音波振動器
17‧‧‧加熱塊
18‧‧‧加熱器
19‧‧‧半導體晶粒(die)
19a‧‧‧電極
20‧‧‧引線框架(leadframe)
21‧‧‧島狀物
22‧‧‧引線
23‧‧‧連接打線
24‧‧‧接合點(第二接合點)
25‧‧‧引線22的延伸方向(一點鏈線)
26a、26b‧‧‧檢測範圍
27a、28a、27b、28b‧‧‧邊緣
30‧‧‧Z方向馬達
31‧‧‧定子
32‧‧‧轉子
33‧‧‧旋轉軸
34‧‧‧馬達驅動器
35、41‧‧‧電源
37‧‧‧相機
37a‧‧‧視場
38‧‧‧打線
38a‧‧‧自由空氣球
39‧‧‧線軸
40‧‧‧焊炬電極
42、89‧‧‧超音波振動器驅動器
50‧‧‧控制部
51‧‧‧設備介面
52‧‧‧CPU
53‧‧‧記憶體
54‧‧‧資料匯流排
55‧‧‧圖像獲取部
56‧‧‧圖像處理部
57‧‧‧振幅調整部
60、62、64、66‧‧‧振動範圍
61、63、65‧‧‧振動軌跡
74‧‧‧振動放大部
74a‧‧‧上表面
74b‧‧‧底面
74c、74d‧‧‧側面
74e‧‧‧後端面
74f‧‧‧前端面
75‧‧‧振動轉換部
75a‧‧‧上側狹縫
75b‧‧‧下側狹縫
81‧‧‧壓電元件
82‧‧‧槽
86a、86b‧‧‧超音波振動部
100、200、300‧‧‧打線接合裝置
F1、F2‧‧‧頻率
S101~S106‧‧‧步驟
W‧‧‧寬度
ΔX、ΔX1、ΔX2、ΔX3、ΔY、ΔY1、ΔY2、ΔY3‧‧‧振幅
θ、θ1、θ2、θ3‧‧‧角度
圖1是表示實施形態的打線接合裝置的構成的系統圖。
圖2是表示圖1所示的打線接合裝置的超音波焊頭、安裝有半導體晶粒的引線框架、和將半導體晶粒的電極與引線框架的引線加以連接的打線的位置關係的平面圖。
圖3(a)~圖3(d)是表示由圖1所示的打線接合裝置進行的接合動作的說明圖。
圖4是表示超音波振動器的振動頻率及振動的大小的曲線圖。
圖5(a)是表示焊針前端的振動軌跡的圖,圖5(b)是表示焊針前端的振動範圍的圖。
圖6是表示使超音波振動器的X方向及Y方向上的振動的大小變化時的焊針前端的振動軌跡及振動範圍的變化的圖。
圖7是圖1所示的打線接合裝置的控制部的功能方塊圖。
圖8是表示實施形態的打線接合裝置的動作的流程圖。
圖9是表示由攝像裝置所拍攝的引線的圖像的圖。
圖10是表示引線的延伸方向與焊針前端的X方向上的振幅ΔX及Y方向上的振幅ΔY的關係的曲線圖。
圖11是表示當藉由實施形態的接合裝置將打線接合於引線時的焊針前端的振動範圍的平面圖。
圖12是表示另一實施形態的接合裝置的超音波焊頭的構成的立體圖。
圖13是另一實施形態的接合裝置的超音波焊頭的平面圖。
圖14是表示圖13所示的接合裝置的超音波振動器的構成及驅動系統的圖。
10‧‧‧框架
11‧‧‧工作台(XY工作台)
12‧‧‧接合頭
13‧‧‧接合臂
13a‧‧‧凹部
14‧‧‧超音波焊頭
14a‧‧‧凸緣
15‧‧‧焊針
16‧‧‧超音波振動器
17‧‧‧加熱塊
18‧‧‧加熱器
19‧‧‧半導體晶粒
20‧‧‧引線框架
30‧‧‧Z方向馬達
31‧‧‧定子
32‧‧‧轉子
33‧‧‧旋轉軸
34‧‧‧馬達驅動器
35‧‧‧電源
37‧‧‧相機
38‧‧‧打線
39‧‧‧線軸
41‧‧‧電源
42‧‧‧超音波振動器驅動器
50‧‧‧控制部
51‧‧‧設備介面
52‧‧‧CPU
53‧‧‧記憶體
54‧‧‧資料匯流排
100‧‧‧打線接合裝置
Claims (8)
- 一種打線接合裝置,其特徵在於包括: 超音波焊頭,輸入有兩個超音波振動且能夠以不同的頻率於Y方向及與Y方向正交的X方向上對安裝於前端的接合工具進行加振;以及 控制部,調整兩個所述超音波振動的各振動的大小, Y方向是所述超音波焊頭的延伸方向, 所述控制部藉由調整兩個所述超音波振動的各振動的大小來調整所述接合工具的Y方向與X方向上的振幅的比率。
- 如申請專利範圍第1項所述的打線接合裝置,其中 所述接合工具將打線連接於相對於Y方向傾斜地配置的帶狀的電極, 且包括對所述電極的圖像進行拍攝的攝像裝置, 所述控制部對由所述攝像裝置拍攝的所述電極的圖像進行處理並計算所述電極的延伸方向相對於Y方向的角度, 且根據所計算出的所述角度來調整兩個所述超音波振動的各振動的大小。
- 如申請專利範圍第2項所述的打線接合裝置,其中 所述控制部調整所述各振動的大小,以使所計算出的所述角度越大,所述接合工具的Y方向上的振幅相對於X方向上的振幅的比率越小。
- 如申請專利範圍第2項或第3項所述的打線接合裝置,其中 所述控制部調整所述各振動的大小,以使所述接合工具的Y方向與X方向上的振幅的比率成為所述電極的延伸方向的Y方向與X方向的比率。
- 如申請專利範圍第3項或第4項所述的打線接合裝置,其中 所述控制部對由所述攝像裝置所拍攝的所述電極的圖像進行處理並計算所述電極的與延伸方向成直角的方向上的所述電極的寬度, 且調整兩個所述超音波振動的各振動的大小,以使所述接合工具的所述電極的與延伸方向成直角的方向上的振幅不超過所計算的所述電極的所述寬度。
- 如申請專利範圍第1項至第5項中任一項所述的打線接合裝置,其中 所述超音波焊頭包括:振動放大部,連接有能夠以兩個不同的頻率於Y方向上振動的超音波振動器,將從所述超音波振動器輸入的Y方向上的所述超音波振動放大並傳遞至所述前端;以及振動轉換部,將Y方向上的所述超音波振動轉換為所述超音波焊頭的扭轉振動,
- 所述控制部調整所述超音波振動器的各振動的大小。如申請專利範圍第6項所述的打線接合裝置,其中 所述振動放大部於俯視下為多邊形形狀,所述振動轉換部是相對於Y方向傾斜地配置的狹縫。
- 如申請專利範圍第1項至第5項中任一項所述的打線接合裝置,其中 所述超音波焊頭連接有第一超音波振動器及第二超音波振動器,所述第一超音波振動器使所述超音波焊頭於Y方向上振動,所述第二超音波振動器使所述超音波焊頭扭轉振動, 所述控制部調整所述第一超音波振動器的振動的大小及所述第二超音波振動器的振動的大小。
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