KR20170027597A - Flexible electrode substrates and methods of manufacturing the same - Google Patents
Flexible electrode substrates and methods of manufacturing the same Download PDFInfo
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- KR20170027597A KR20170027597A KR1020150124430A KR20150124430A KR20170027597A KR 20170027597 A KR20170027597 A KR 20170027597A KR 1020150124430 A KR1020150124430 A KR 1020150124430A KR 20150124430 A KR20150124430 A KR 20150124430A KR 20170027597 A KR20170027597 A KR 20170027597A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
There is provided a flexible electrode substrate including a plurality of metal wirings formed on a flexible substrate. The flexible electrode substrate can include a highly integrated metal wiring and has excellent electrical characteristics, which can be widely used in home appliances, advanced computers, and communication devices. In addition, since the flexible electrode substrate can be highly integrated and miniaturized, it can be widely used in industry, and the flexible electrode substrate is also excellent in flexibility such as warping and folding, so that it is widely used in fields requiring various steric properties such as flexible displays .
Description
The present invention relates to a flexible electrode substrate. More particularly, the present invention relates to a method of manufacturing a flexible substrate using a metal wiring formed on a graphene layer.
A flexible substrate is a substrate to which electrical components such as chips and devices are mounted and a wiring is connected to the substrate to allow current to flow therethrough. When the substrate is required to be bent, folded, or curled, And the like.
In general, a flexible substrate can be produced using a polymer, paper, fabric, and the like, and can be classified into a single layer substrate, a double-sided substrate, and a multi-layer substrate depending on its form.
An electronic device such as an active device, a passive device, or a resistor may be mounted on one surface of the flexible substrate, and a metal interconnection may be formed between the electronic devices to electrically connect the electronic devices and / Signal can be transmitted or received.
On the other hand, as the technology develops, the electronic components become highly integrated and highly functional, and the demand for small electronic products rapidly increases, the size of the metal wiring between the electronic elements becomes a very important factor. However, there is a limitation in that a fine metal wiring is difficult to extinguish a large amount of electric current, and in order to overcome such a limitation, studies are being conducted by inserting a metal wiring into a substrate and using the same as an electrode. Conventional techniques for inserting a metal wiring into a substrate include a method of etching a desired pattern through a deposition etch, a method of applying a CMP method to a copper (Cu) thin film which is difficult to dry-etch for pattern formation, And Damascene method.
However, when the substrate is manufactured to include a metal wiring, problems such as degradation of electrical characteristics, folding property, etc. may be caused.
Embodiments of the present invention provide a flexible electrode substrate having high electrical conductivity and high flexibility while having high integration density.
Another embodiment of the present invention provides a method of manufacturing the flexible electrode substrate.
In one embodiment of the invention, a flexible substrate; And a flexible electrode substrate including a plurality of metal wirings formed on the flexible substrate.
In an exemplary embodiment, the plurality of metal wirings may be recessed into the flexible substrate.
In an exemplary embodiment, the plurality of metal wirings may be formed on the flexible substrate.
In an exemplary embodiment, the flexible electrode substrate may further include an adhesive layer interposed between the plurality of metal wirings and the flexible substrate.
In an exemplary embodiment, the adhesive layer may comprise an epoxy-based adhesive or an imide-based adhesive.
In an exemplary embodiment, the flexible electrode substrate may further include a graphene cover layer formed on upper, lower, and side surfaces of the plurality of metal wirings.
In an exemplary embodiment, the flexible substrate may comprise at least one cured material selected from the group consisting of polydimethylsiloxane, polyethylene terephthalate, polyimide, polyamide, polyethylene, polystyrene, and epoxy resin.
In an exemplary embodiment, the metallization may comprise at least one selected from the group consisting of copper, nickel, gold, silver and alloys thereof.
In another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; applying a polymer material to cover the plurality of metal wirings and then curing the metal material to form a flexible substrate having the plurality of metal wirings embedded therein; And separating the temporary substrate and the graphene layer from the metal wiring and the flexible substrate to manufacture a flexible electrode substrate including the flexible substrate having the plurality of metal wiring recessed therein do.
In another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; semi-curing the polymer thin film to produce a flexible adhesive substrate; Bonding the flexible adhesive substrate to the metal wiring; And peeling the temporary substrate and the graphene layer from the metal wiring; And curing the flexible adhesive substrate to form a flexible substrate, thereby manufacturing a flexible electrode substrate including the flexible substrate and a plurality of metal wires formed on the flexible substrate.
In another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; curing the polymer thin film to produce a flexible substrate; Applying an adhesive to the upper surface of the flexible substrate to form an adhesive layer; Bonding the flexible substrate on which the adhesive layer is formed to the metal wiring; And a step of peeling off the temporary substrate and the graphene layer from the flexible substrate on which the plurality of metal wirings and the adhesive layer are formed to form the flexible wiring board including the flexible wiring board and the flexible wiring board including the adhesive layer interposed between the metal wiring and the flexible wiring board, The method of manufacturing a flexible electrode substrate according to the present invention includes the steps of: preparing an electrode substrate;
In an exemplary embodiment, the adhesive may be an epoxy-based adhesive or an imide-based adhesive.
In an exemplary embodiment, the metal wiring may be formed through electroplating using at least one selected from the group consisting of copper, nickel, silver, gold, and alloys thereof.
In an exemplary embodiment, the graphene layer may be formed through one or more processes selected from the group consisting of a chemical vapor deposition process, a carbonization process, and a liquid phase growth process.
According to the method of manufacturing a flexible electrode substrate according to an embodiment of the present invention, a flexible electrode substrate including a metal wiring can be formed by patterning on a temporary substrate on which a graphene layer is deposited, and the temporary substrate is repeatedly used Which can drastically reduce the process steps.
In addition, the metal wirings can be peeled off without defects owing to the low adhesive force due to the surface characteristics of the graphene layer, and thus a flexible electrode substrate including highly integrated metal wirings can be manufactured.
The flexible electrode substrate can include a highly integrated metal wiring and is excellent in electrical characteristics and can be widely used in household appliances, advanced computers, and communication devices. In addition, the flexible electrode substrate can be highly integrated and miniaturized, and can be widely used in industry. In addition, since the flexible electrode substrate is also excellent in flexibility such as warpage and folding, it can be widely used in fields requiring various steric properties such as a flexible display.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram illustrating methods of fabricating flexible electrode substrates in accordance with embodiments of the present invention. FIG.
2 is a schematic view showing a method of manufacturing a flexible electrode substrate manufactured according to an embodiment of the present invention.
3 is a schematic view showing a method of manufacturing a flexible electrode substrate manufactured according to another embodiment of the present invention.
4 is a schematic view showing a method of manufacturing a flexible electrode substrate manufactured according to another embodiment of the present invention.
5A-5C are cross-sectional views of flexible electrode substrates made in accordance with embodiments of the present invention.
6 is a photograph showing a flexible electrode substrate manufactured according to an embodiment of the present invention.
FIG. 7 is a photograph showing the results of measurement of bending test, rolling test, and folding test of the flexible electrode substrate manufactured according to an embodiment of the present invention.
FIG. 8 is a photograph showing the folding test result of the flexible electrode substrate manufactured according to an embodiment of the present invention. FIG.
9 is a photograph showing a result of a luminescence experiment of a flexible substrate manufactured according to an embodiment of the present invention.
As used herein, the term " flexible electrode substrate " is a concept including metal wiring and a flexible substrate. The flexible electrode substrate may include, for example, a metal wiring embedded in the flexible substrate and the flexible substrate. Alternatively, the flexible electrode substrate may include a metal wiring formed on the flexible substrate and a flexible substrate formed under the metal wiring.
As used herein, the term " flexible substrate " refers to a substrate comprising a cured polymeric material, and " flexible adhesive substrate " refers to a substrate comprising a semi-cured polymeric material.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention.
Manufacturing method of flexible electrode substrate
The present invention provides a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; Applying a polymer material to cover the metal wiring and curing the metal material to form a flexible substrate; And separating the temporary substrate and the graphene layer from the metal wiring and the flexible substrate to form a flexible electrode substrate including the flexible substrate having the plurality of metal wiring recessed therein; The present invention relates to a method of manufacturing a flexible electrode substrate.
2 is a schematic view showing a manufacturing method of the flexible electrode substrate. Referring to FIG. 2, each step will be described.
First, a graphene layer is formed on a temporary substrate.
Specifically, a graphene layer may be formed on the temporary substrate by a chemical vapor deposition process, a carbonization process, a liquid crystal growth process, or the like.
In an exemplary embodiment, the temporary substrate may serve as a support to which the metal may be plated, and may include at least one selected from the group consisting of metals such as copper, nickel, etc., polymers, semiconductor materials, ceramic materials and the like . The temporary substrate may be formed to have a shape corresponding to the shape of the finally formed flexible substrate. For example, when a curved flexible substrate is manufactured, a curved temporary substrate can be used.
In an exemplary embodiment, the graphene layer may be formed by growing a compound containing carbon on the temporary substrate through a CVD process and / or a liquid crystal growth process. At this time, the carbon-containing compound may be a compound having 6 or less carbon atoms, preferably 4 or less carbon atoms, and more preferably 2 or less carbon atoms. For example, the carbon containing compound may be present in a group consisting of carbon monoxide, ethane, ethylene, ethanol, acetylene, propane, propylene, butane, butadiene, pentane, pentene, cyclopentadiene, hexane, cyclohexane, benzene, And may include at least one selected.
Since the graphene layer includes graphene exhibiting not only excellent conductivity but also barrier properties, a plurality of metal wirings formed on the graphene layer may be formed to have a uniform thickness on the temporary substrate. In addition, when the temporary substrate is physically peeled, it can be assisted so that they can be smoothly peeled off.
In an exemplary embodiment, the graphene layer may have a monolayer to 3000 layered stack of atoms. Preferably, the graphene layer may have a structure in which a single layer to 500 layers of atomic layers are stacked.
Accordingly, the graphene layer may have a thickness of about 0.34 nm to about 1,000 um, and preferably a thickness of about 0.34 nm to about 2.38 nm. When the thickness of the graphene layer is less than 0.34 nm, the peeling effect with the metal wiring may not be excellent, and when the thickness exceeds 1,000 mu m, the thickness may become large and the peeling effect may not be excellent.
Then, a plurality of metal wirings are formed on the graphene layer.
Specifically, a photoresist pattern is formed on the graphene layer to expose a portion of the graphene layer, and a plurality of metal wirings are formed on the exposed graphene layer using the photoresist pattern. Thereafter, the photoresist pattern may be removed through an organic cleaning process or the like.
If a photoresist pattern is not formed, an insulating film is formed on the graphene layer, and a mask pattern exposing a part of the insulating film is formed. Thereafter, the insulating film is etched through an etching process using the mask pattern as an etching mask to form a plurality of insulating film patterns and a plurality of openings between the plurality of insulating film patterns. Then, a conductive film pattern filling the plurality of openings is formed, and the mask pattern and the insulating film pattern are removed. When such an insulating film is used, durability is excellent and it can be used semi-permanently.
In an exemplary embodiment, the insulating layer may include silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ), or the like, and may be used as a dummy structure for forming the metal wiring.
In an exemplary embodiment, the mask pattern may be formed on the insulating film in a plurality of such that only the region for forming the metal wiring is exposed.
In an exemplary embodiment, the mask patterns may be formed on the graphene layer by performing photolithography, electron beam lithography, a printing process, a vacuum deposition process, or the like.
In the above embodiment, the plurality of mask patterns are described as being formed on the graphene layer. However, when performing the shadow mask deposition process, the plurality of metal wirings may be formed on the graphene layer without forming the mask patterns. .
In an exemplary embodiment, the metal wiring may be formed through electroplating using a metal such as copper, nickel, silver, gold, and the like. Alternatively, it may be formed through an electroless plating process, a vacuum deposition process, a printing process, or the like.
Thereafter, a process of removing the photoresist pattern or the insulating film pattern may be performed.
Specifically, the photoresist pattern is subjected to organic cleaning such as acetone, and silicon oxide, silicon nitride, or the like of the insulating film pattern may be etched using a solution of hydrofluoric acid (HF), a solution of BOE (Buffer Oxide Etchant) and / or a solution of LAL (Low Ammonium Fluoride Liquid) Or the like by using a wet etching process using an etchant.
Accordingly, a plurality of metal wirings may be formed in a part of the graphene layer formed on the temporary substrate, whereby a part of the upper surface of the graphene layer may be exposed.
The metal wirings are formed to have a plurality of distances and are spaced apart from each other by a predetermined distance, so that recesses can be formed between the respective metal wirings. That is, each of the recesses may be formed between adjacent metal wirings.
Although not shown, a graphene cover layer may be further formed on the metal wiring to cover upper, lower, and side surfaces of the metal wiring by performing a chemical vapor deposition process, a carbonization process, a liquid crystal growth process, have.
At this time, a mask pattern covering only the upper surface of the exposed graphene layer may be formed so that the graphene cover layer is not formed on the graphene layer on which the mask pattern is formed.
Then, a recess formed between the plurality of metal wirings is embedded, and a polymer material is coated and hardened to cover the metal wirings to form a flexible substrate which sinks the metal wirings.
In an exemplary embodiment, the polymeric material can be applied to fill the recesses formed between the plurality of metal wirings and to cover the metal wirings, whereby the flexible substrate has a shape covering the metal wirings Respectively.
In an exemplary embodiment, the polymeric material may include one or more selected from the group consisting of thermoplastic high molecular materials such as polydimethylsiloxane, polyethylene terephthalate, polyimide, polyamide, polyethylene, polystyrene, and epoxy resin.
In the exemplary embodiment, the polymer material may be cured by a process such as a thermal curing process, a photo-curing process, a radical curing process, an anion curing process, and a cation curing process.
Then, the temporary substrate and the graphene layer are peeled from the metal wiring and the flexible substrate.
That is, the metal wiring and the flexible substrate formed on the graphene layer can be separated from the graphene layer by performing a physical stripping step.
At this time, since the graphene layer, the metal wiring, and the flexible substrate are attached only with very weak van der Waals force, the metal wiring and the flexible substrate can be easily peeled off from the graphene layer.
Thus, the metal wiring embedded in the flexible substrate; And a flexible electrode substrate including the flexible substrate can be manufactured.
According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; semi-curing the polymer thin film to produce a flexible substrate; Bonding the flexible substrate to the metal wiring; And separating the temporary substrate and the graphene layer from the metal interconnection to form a flexible electrode substrate including the flexible substrate on which the plurality of metal interconnection lines are formed; The method comprising the steps of:
3 is a schematic view showing a manufacturing method of the flexible electrode substrate. Referring to FIG. 3, each step will be described. The method may further include the steps of: preparing a graphene layer on the temporary substrate; And the step of forming the metal wiring on the graphene layer include the same or similar processes as the manufacturing process of the flexible electrode substrate described with reference to FIG. 2, so a detailed description thereof will be omitted.
First, a graphene layer is formed on a temporary substrate. Then, a plurality of metal wirings are formed on the graphene layer.
Although not shown, a graphene cover layer may be further formed on the metal wiring to cover the side surfaces and the upper surface of the metal wiring by performing processes such as chemical vapor deposition, carbonization, and liquid growth.
Thereafter, the polymer thin film is semi-cured to prepare a flexible adhesive substrate.
In an exemplary embodiment, the polymer thin film may include at least one selected from the group consisting of thermoplastic polymer materials such as polydimethylsiloxane, polyethylene terephthalate, polyimide, polyamide, polyethylene, polystyrene, and epoxy resin. In addition, the polymer thin film may be semi-hardened through a heat curing process, a light curing process, a radical curing process, an anion curing process, a cation curing process, or the like to be a flexible adhesive substrate.
Next, the flexible substrate is bonded to the metal wiring formed on the graphene layer. At this time, since the flexible adhesive substrate has excellent adhesive force, it can be easily adhered to the metal wiring.
At this time, since the metal wiring and the flexible adhesive substrate are merely adhered, only the upper surface of the metal wiring can be in contact with the flexible adhesive substrate.
Thereafter, the metal wiring formed on the upper portion of the graphene layer is peeled off from the graphene layer.
That is, the graphene layer and the temporary substrate can be separated from the metal wiring and the semi-cured polymer substrate in contact therewith (i.e., flexible adhesive substrate).
At this time, since the metal wiring and the graphene layer formed under the metal wiring are attached with only very weak van der Waals force as compared with the combination of the metal wiring and the flexible adhesive substrate, the graphene layer can be easily peeled off from the metal wiring.
Accordingly, the metal wiring can be moved to the flexible adhesive substrate which is the semi-cured polymer substrate.
Thereafter, the flexible adhesive substrate is completely cured to form a flexible substrate. In an exemplary embodiment, the curing process may be a thermal curing process, a photo-curing process, a radical curing process, an anion curing process, a cation curing process, and the like.
Thus, a metal wiring formed on a flexible substrate; And a flexible electrode substrate including the flexible substrate can be manufactured.
According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a graphene layer on a temporary substrate; Forming a plurality of metal wirings on the graphene layer; curing the polymer thin film to produce a flexible substrate; Applying an adhesive to the upper surface of the flexible substrate to form an adhesive layer; Bonding the flexible substrate on which the adhesive layer is formed to the metal wiring; And a step of peeling off the temporary substrate and the graphene layer from the flexible substrate on which the plurality of metal wirings and the adhesive layer are formed to form the flexible wiring board including the flexible wiring board and the flexible wiring board including the adhesive layer interposed between the metal wiring and the flexible wiring board, The method of manufacturing a flexible electrode substrate according to the present invention includes the steps of: preparing an electrode substrate;
4 is a schematic view showing a manufacturing method of the flexible electrode substrate. The above process is similar to or similar to the manufacturing process of the flexible electrode substrate described with reference to FIG. 3, except that an adhesive layer is formed by applying an adhesive to the upper surface of the cured flexible substrate instead of the upper surface of the semi-cured flexible adhesive substrate A detailed description thereof will be omitted.
First, a graphene layer is formed on a temporary substrate. Then, a plurality of metal wirings are formed on the graphene layer.
Subsequently, the polymer thin film is cured to produce a flexible substrate.
Thereafter, an adhesive is applied on the flexible substrate to form an adhesive layer. Specifically, an epoxy adhesive or an imide adhesive can be applied on the flexible substrate to form an adhesive layer.
At this time, the adhesive layer may have a thickness of 0.001 mm to 10 mm. As the adhesive layer is formed, adhesion between the metal lines and the flexible substrate can be improved. If the thickness of the adhesive layer is too thick, it may be difficult to secure flexibility after curing, and if it is too thin, the adhesive strength may be insufficient.
Subsequently, a flexible substrate having the metal adhesive layer formed thereon is bonded to the upper surface of a plurality of metal wires formed on the graphene layer.
At this time, the flexible substrate may be bonded such that the metal wiring and the adhesive layer formed on the flexible substrate are in contact with each other. That is, an adhesive layer may be interposed between the plurality of metal wirings and the flexible substrate.
Thereafter, the metal wiring formed on the upper portion of the graphene layer is peeled off from the graphene layer.
That is, the temporary substrate and the graphene layer can be separated from the flexible wiring board on which the metal wiring and the adhesive layer in contact with the metal wiring are formed.
At this time, since the graphene layer under the metal wiring and the metal wiring are attached only with very weak van der Waals force as compared with the bonding between the adhesive layer and the metal wiring, the graphene layer can be easily peeled off from the metal wiring.
Accordingly, the metal wiring can be moved to the flexible substrate on which the adhesive layer is formed, more specifically, to the adhesive layer.
Thereafter, the semi-cured polymeric material of the flexible adhesive substrate is cured to form a flexible substrate including a cured polymeric material, thereby forming a flexible substrate, an adhesive layer formed on the flexible substrate, and a plurality of A flexible electrode substrate containing a metal can be produced.
According to the method of manufacturing a flexible electrode substrate according to an embodiment of the present invention, a flexible electrode substrate including a metal wiring can be formed by patterning on a temporary substrate on which a graphene layer is deposited, and the temporary substrate is repeatedly used Which can drastically reduce the process steps. In addition, when the patterned insulator is not removed in the process of forming the metal wiring, the temporary substrate can be semi-permanently used. As a result, the efficiency of the process can be increased, thereby reducing the production cost of the product.
In addition, the metal wirings can be peeled off without defects owing to the low adhesive force due to the surface characteristics of the graphene layer, and thus a flexible electrode substrate including a highly integrated metal wiring can be manufactured.
Flexible electrode substrate
In the present invention, a flexible substrate; And a plurality of metal lines formed on the flexible substrate.
5A-5C are plan views illustrating flexible electrode substrates fabricated in accordance with embodiments of the present invention.
Referring to FIG. 5A, the flexible electrode substrate manufactured according to one embodiment of the present invention includes a flexible substrate; And a plurality of metal lines embedded in the flexible substrate.
In an exemplary embodiment, the flexible substrate may be comprised of a cured polymeric material and may be a thermoplastic polymeric material such as polydimethylsiloxane, polyethylene terephthalate, polyimide, polyamide, polyethylene, polystyrene, One or more selected from the group consisting of the cured polymeric material.
In an exemplary embodiment, the flexible substrate may be formed by curing by a process such as a heat curing process, a light curing process, a radical curing process, an anion curing process, a cation curing process and the like.
In an exemplary embodiment, the metallization may comprise at least one selected from the group consisting of copper, nickel, gold, silver and alloys thereof.
In an exemplary embodiment, the flexible electrode substrate may further include a graphene cover layer formed on an upper surface, a side surface, and a lower surface of the plurality of metal wirings. In this case, the graphene cover layer can facilitate current flow in the metal wiring. The graphene cover layer may be a single layer or a stack of two or more layers, preferably a single layer or a stack of 3,000 layers. More preferably, the graphene layer may be formed of a single layer or a layer of not more than 500 layers.
In an exemplary embodiment, the graphene cover layer may have a thickness within about 0.34 nm to about 1000 mm. Preferably, the graphene cover layer may have a thickness within about 0.34 nm to 2.38 nm.
In an exemplary embodiment, the graphene cover layer may be formed through one or more processes selected from the group consisting of a chemical vapor deposition process, a carbonization process, and a liquid phase growth process.
Meanwhile, referring to FIG. 5B, the flexible electrode substrate manufactured according to another embodiment of the present invention includes a flexible substrate; And a plurality of metal wirings formed on the flexible substrate. The flexible electrode substrate includes substantially the same or similar structure as the flexible electrode substrate described with reference to FIG. 5A except that a plurality of metal wirings are formed on a flexible substrate, and thus a detailed description thereof will be omitted.
In an exemplary embodiment, the flexible substrate and the metal wiring may be bonded. That is, the upper surface of the metal wiring and the flexible substrate may be bonded.
Meanwhile, referring to FIG. 5C, the flexible electrode substrate manufactured according to another embodiment of the present invention includes a flexible substrate; An adhesive layer formed on the flexible substrate; And a plurality of metal lines formed on the flexible adhesive layer; . ≪ / RTI > The flexible electrode substrate includes substantially the same or similar structure as the flexible electrode substrate described with reference to FIG. 5B, except that an adhesive layer is formed on the flexible substrate, so that detailed description thereof will be omitted.
In an exemplary embodiment, the adhesive layer is formed on a flexible substrate, and the adhesive strength between the plurality of metal wirings and the flexible substrate can be improved.
In an exemplary embodiment, the adhesive layer may have a thickness ranging from 0.001 mm to 10 mm, and may include an epoxy adhesive or an imide adhesive.
In an exemplary embodiment, the adhesive layer may be in contact with the upper surface of the flexible substrate and the lower surfaces of the metal lines as they are interposed between the flexible substrate and the metal lines.
The flexible electrode substrate including a plurality of metal wirings and a flexible substrate according to an embodiment of the present invention is fabricated by a very simple process, and is semi-permanently usable, thereby reducing cost. In addition, the flexible electrode substrate is excellent in flexibility such as folding characteristics and can be widely used in fields requiring flexibility such as wearable devices. In addition, the flexible electrode substrate can be highly integrated and miniaturized, and can be widely used in industry.
The embodiments of the present invention described above should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of protection of the present invention as long as it is obvious to those skilled in the art.
Example 1
A graphene layer having a thickness of 0.025 mm was deposited on one side of a copper substrate having a width of 40 mm and a vertical size of 60 mm using a CVD process. On one side of the coated copper substrate, a pattern was formed by photolithography.
Thereafter, a copper wiring having a thickness of 10 mu m was formed by an electrolytic plating method, and then the photoresist pattern was removed using acetone.
Then, PDMS was coated on the graphene layer on which the copper wiring was formed and cured to form a flexible substrate having the copper wiring recessed therein.
Thereafter, the flexible substrate having the copper wiring embedded in the upper portion of the graphene layer was physically peeled off from the graphene layer formed on the copper substrate to produce the flexible electrode substrate including the copper wiring and the flexible substrate.
Example 2
A graphene layer having a thickness of 0.025 mm was deposited on one side of a copper substrate having a width of 40 mm and a vertical size of 60 mm using a CVD process. Thereafter, a 300 nm thick copper metal wiring was formed through a vacuum deposition process using a shadow mask.
Then, PDMS was coated on the graphene layer having the copper metal wiring formed thereon and then cured to form a flexible substrate. Then, the copper metal wiring formed on the upper portion of the graphene layer and the flexible substrate were physically peeled off to produce a flexible electrode substrate including the copper metal wiring and the flexible substrate.
Example 3
A graphene layer having a thickness of 0.025 mm was deposited on one side of a copper substrate having a width of 40 mm and a vertical size of 60 mm using a CVD process. On one surface of the copper substrate coated with the first graphene layer, a SiO 2 insulating film was formed by thermal evaporation method, and a metal wiring having a fine pattern was formed thereon by grape resist method. Thereafter, the SiO 2 portion not covered with the photoresist was etched with the BOE solution, and the remaining photoresist was removed with acetone.
Then, a metal wiring having a thickness of 10 mu m was electroplated using an electrolytic plating method. Next, the PDMS was semi-cured to form a flexible adhesive substrate, and the flexible adhesive substrate was adhered to the metal interconnection.
Then, the metal wiring to which the flexible adhesive substrate was adhered was physically peeled off from the graphene layer and the copper substrate and cured to prepare a flexible electrode substrate including the metal wiring and the flexible substrate.
Example 4
A graphene layer having a thickness of 0.025 mm was deposited on one side of a copper substrate having a width of 40 mm and a vertical size of 60 mm using a CVD process. On one surface of the copper substrate coated with the first graphene layer, a SiO 2 insulating film was formed by thermal evaporation method, and a metal wiring having a fine pattern was formed thereon by grape resist method. Thereafter, the SiO 2 portion not covered with the photoresist was etched with the BOE solution, and the remaining photoresist was removed with acetone.
Then, a metal wiring having a thickness of 10 mu m was electroplated using an electrolytic plating method. Subsequently, a PET substrate on which an adhesive layer was formed by applying an adhesive on the PET substrate was provided, and then the PET substrate on which the adhesive layer was formed was adhered to the metal interconnection.
Thereafter, the metal wiring with the PET substrate having the adhesive layer formed thereon was physically peeled off from the graphene layer to produce a flexible electrode substrate including the metal wiring and the PET substrate.
Experimental Example 1
The flexible electrode substrate prepared according to Example 1 was observed, and its bending, curling and folding experiments were carried out.
Specifically, the method of measuring and comparing the resistance values of the flexible electrode substrate manufactured according to Example 1 in the unstrained state, the bending state, the curled state, and the folded state was performed. In this case, the radius of curvature in the bending test was 0.45 cm, the radius of curvature in the curling test was 1 mm, and in the folding test, the sample was folded in half and folded again in half to measure the resistance.
FIG. 6 is a photograph showing a flexible electrode substrate manufactured according to an embodiment of the present invention, and FIG. 7 is a graph showing the results of bending test, rolling test, and folding test of the flexible electrode substrate manufactured according to an embodiment of the present invention FIG.
6 and 7, the flexible electrode substrate according to the first embodiment exhibits the outer shape as shown in FIG. 6, and it can be seen that the metal wiring is embedded in the flexible substrate. As shown in FIG. 7, As a result, it was confirmed that the flexible electrode substrate was excellent in bending and rolling.
Experimental Example 2
The flexible electrode substrate manufactured according to Example 1 was observed, and durability (reliability) was confirmed through repeated bending experiments. At this time, the size of the test sample was 3 × 4 cm, the thickness was 80 μm, and the speed was 30 mm / sec. The bending test was carried out by setting the bending angle to 90 degrees (radius of curvature: 7 mm) without bending the test sample, and the test was repeated 15,000 times.
8 is a photograph showing a result of repeated bending test of a flexible electrode substrate manufactured according to an embodiment of the present invention.
6 and 8, it was confirmed that the flexible electrode substrate including the metal interconnection fabricated according to Example 1 exhibits the outer shape as shown in FIG. 6, and even in the repeated experiments of 15,000 times, Durability (reliability) was confirmed.
Experimental Example 3
The flexible electrode substrate fabricated according to Example 1 was observed, and the LED bonding experiment was conducted in which the LED chip was inserted to perform the bending test and the light emission test.
At this time, the LED chip used was 2 x 2 mm and vertical type. 19 LEDs were mounted on the flexible electrode substrate, and then bending was performed to a radius of curvature of 0.45 cm under a condition of applying a voltage of 50 V. The results are shown in FIG.
9, the flexible electrode substrate manufactured according to Example 1 showed no change in the luminescence of the LED even under the condition of bending up to 0.45 cm. Accordingly, it can be confirmed that the present invention can be applied to a flexible or wearable device.
Claims (14)
Wherein the plurality of metal wirings are embedded in the flexible substrate.
Wherein the plurality of metal wirings are formed on the flexible substrate.
Further comprising an adhesive layer interposed between the plurality of metal wirings and the flexible substrate.
Wherein the adhesive layer comprises an epoxy adhesive or an imide adhesive.
Further comprising a graphene cover layer formed on upper, lower, and side surfaces of the plurality of metal wirings.
Wherein the flexible substrate comprises at least one material selected from the group consisting of polydimethylsiloxane, polyethylene terephthalate, polyimide, polyamide, polyethylene, polystyrene, and epoxy resin.
Wherein the metal wiring comprises at least one selected from the group consisting of copper, nickel, gold, silver, and alloys thereof.
Forming a plurality of metal wirings on the graphene layer;
Applying a polymer material to cover the plurality of metal wirings and curing the metal material to form a flexible substrate having the plurality of metal wirings embedded therein; And
And separating the temporary substrate and the graphene layer from the metal wiring and the flexible substrate to manufacture a flexible electrode substrate including the flexible substrate having the plurality of metal wiring recessed therein.
Forming a plurality of metal wirings on the graphene layer;
Semi-curing the polymer thin film to produce a flexible adhesive substrate;
Bonding the flexible adhesive substrate to the metal wiring;
Peeling the temporary substrate and the graphene layer from the metal wiring; And
And curing the flexible adhesive substrate to form a flexible substrate, thereby manufacturing a flexible electrode substrate including the flexible substrate and a plurality of metal wirings formed on the flexible substrate.
Forming a plurality of metal wirings on the graphene layer;
Curing the polymer thin film to produce a flexible substrate;
Applying an adhesive to the upper surface of the flexible substrate to form an adhesive layer;
Bonding the flexible substrate on which the adhesive layer is formed to the metal wiring; And
The temporary substrate and the graphene layer are peeled off from the flexible substrate on which the plurality of metal wirings and the adhesive layer are formed to form a flexible electrode including the adhesive layer interposed between the flexible wiring substrate and the flexible wiring substrate, A method of manufacturing a flexible electrode substrate, the method comprising: fabricating a substrate;
Wherein the adhesive is an epoxy adhesive or an imide adhesive.
Wherein the metal wiring is formed through electroplating using at least one selected from the group consisting of copper, nickel, silver, gold, and alloys thereof.
Wherein the graphene layer is formed through at least one process selected from the group consisting of a chemical vapor deposition process, a carbonization process, and a liquid crystal growth process.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200050816A (en) | 2018-11-02 | 2020-05-12 | 한국전기연구원 | Suspended electrode and manufacturing method thereof |
| KR20220134975A (en) * | 2021-03-29 | 2022-10-06 | 울산과학기술원 | Manufacturing method of metal-based flexible electrode and metal-based flexible electrode manufactured thereby |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120130120A (en) | 2011-05-19 | 2012-11-29 | 한국기계연구원 | Metallization method for flexible substrate |
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2015
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120130120A (en) | 2011-05-19 | 2012-11-29 | 한국기계연구원 | Metallization method for flexible substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200050816A (en) | 2018-11-02 | 2020-05-12 | 한국전기연구원 | Suspended electrode and manufacturing method thereof |
| KR20220134975A (en) * | 2021-03-29 | 2022-10-06 | 울산과학기술원 | Manufacturing method of metal-based flexible electrode and metal-based flexible electrode manufactured thereby |
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