TW201941934A - 保護膜形成用複合片及其製造方法 - Google Patents

保護膜形成用複合片及其製造方法 Download PDF

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Publication number
TW201941934A
TW201941934A TW108109279A TW108109279A TW201941934A TW 201941934 A TW201941934 A TW 201941934A TW 108109279 A TW108109279 A TW 108109279A TW 108109279 A TW108109279 A TW 108109279A TW 201941934 A TW201941934 A TW 201941934A
Authority
TW
Taiwan
Prior art keywords
film
protective film
forming
meth
adhesive layer
Prior art date
Application number
TW108109279A
Other languages
English (en)
Chinese (zh)
Inventor
佐伯尚哉
古野健太
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201941934A publication Critical patent/TW201941934A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
TW108109279A 2018-03-30 2019-03-19 保護膜形成用複合片及其製造方法 TW201941934A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/013624 WO2019187010A1 (ja) 2018-03-30 2018-03-30 保護膜形成用複合シート及びその製造方法
WOPCT/JP2018/013624 2018-03-30

Publications (1)

Publication Number Publication Date
TW201941934A true TW201941934A (zh) 2019-11-01

Family

ID=68061151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109279A TW201941934A (zh) 2018-03-30 2019-03-19 保護膜形成用複合片及其製造方法

Country Status (5)

Country Link
JP (1) JP7203087B2 (ja)
KR (1) KR102524205B1 (ja)
CN (1) CN111466014B (ja)
TW (1) TW201941934A (ja)
WO (1) WO2019187010A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432853B2 (ja) 1971-10-11 1979-10-17
JP3437369B2 (ja) * 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
EP0926732A3 (en) * 1997-12-10 2001-01-03 Nitto Denko Corporation Process for producing semiconductor device and pressure-sensitive adhesive sheet for surface protection
JP5123341B2 (ja) * 2010-03-15 2013-01-23 信越化学工業株式会社 接着剤組成物、半導体ウエハ保護膜形成用シート
JP2012015342A (ja) * 2010-06-30 2012-01-19 Dainippon Printing Co Ltd セパレータレス型ダイシングテープ
CN105074878B (zh) * 2013-03-27 2017-08-04 琳得科株式会社 保护膜形成用复合片
KR102291700B1 (ko) * 2013-08-01 2021-08-19 린텍 가부시키가이샤 보호막 형성용 복합 시트
JP6322278B2 (ja) * 2014-02-18 2018-05-09 シャープ株式会社 積層フィルム及びフィルム貼り付け方法
MY186759A (en) * 2014-08-22 2021-08-18 Lintec Corp Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
CN108966671B (zh) * 2016-03-24 2023-09-26 琳得科株式会社 支撑片及保护膜形成用复合片
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
KR20200138152A (ko) 2020-12-09
KR102524205B1 (ko) 2023-04-20
CN111466014B (zh) 2024-01-02
CN111466014A (zh) 2020-07-28
JP7203087B2 (ja) 2023-01-12
WO2019187010A1 (ja) 2019-10-03
JPWO2019187010A1 (ja) 2021-03-18

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