TW201938951A - Lighting unit and lighting appliance characterized by obtaining an expected sound volume even if a sounding unit with a lead wire is mounted at the face of a single-sided mounting substrate - Google Patents
Lighting unit and lighting appliance characterized by obtaining an expected sound volume even if a sounding unit with a lead wire is mounted at the face of a single-sided mounting substrate Download PDFInfo
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Abstract
Description
本發明係關於具有LED(Light Emitting Diode：發光二極體)元件等發光元件的照明單元、及具備此照明單元的照明器具。The present invention relates to a lighting unit having a light-emitting element such as an LED (Light Emitting Diode) element, and a lighting device including the same.
作為具有LED元件的照明器具，以設置於天花板的吸頂燈為人所知。具有LED元件的吸頂燈，例如具備：器具本體；安裝基板，固定於器具本體；LED元件，安裝於安裝基板；複數之電路元件，構成產生用以使LED元件點亮的電力的電源電路；及透光蓋，覆蓋LED元件。As a lighting fixture having an LED element, a ceiling light installed on a ceiling is known. A ceiling light having an LED element includes, for example, an appliance body; a mounting substrate fixed to the appliance body; an LED element mounted on the mounting substrate; a plurality of circuit elements constituting a power supply circuit for generating electric power for lighting the LED element; and A light-transmitting cover covers the LED element.
以往，作為此種照明器，以設有發聲元件的吸頂燈為人所知，該發聲元件係例如為了以聲音通知使用者已收到來自遙控器的信號、或以聲音通知使用者已到了所設定的起床時刻，而發出蜂鳴音等電子音(例如專利文獻1)。
[先前技術文獻]
[專利文獻]Conventionally, as such an illuminator, a ceiling lamp provided with a sound emitting element is known, for example, to notify the user by a sound that a signal from a remote controller has been received or to notify the user that the user has arrived An electronic sound such as a beep sound is emitted at a set wake-up time (for example, Patent Document 1).
[Prior technical literature]
[Patent Literature]
[專利文獻1]日本特開2015-207380號公報[Patent Document 1] Japanese Patent Laid-Open No. 2015-207380
[發明欲解決之問題][Invention to solve the problem]
於吸頂燈等的照明器具中，吾人評估將構成電源電路的複數之電路元件與發光元件安裝於同一安裝基板。In lighting fixtures such as ceiling lamps, I have evaluated that a plurality of circuit elements and light emitting elements constituting a power supply circuit are mounted on the same mounting substrate.
於將發聲元件(蜂鳴器等)安裝於安裝有電路元件及發光元件的安裝基板時，藉由使用於雙面形成有配線的雙面基板作為安裝基板，能以發聲元件的元件本體位於發光元件的安裝面側的方式，將發聲元件安裝於安裝基板。藉此，因可將發聲元件安裝在與發光元件的光射出側為同一方向，故可使發聲元件朝向地板面。藉此，容易滿足作為照明器具的期望音量基準(例如45dB以上)。When a sound emitting element (buzzer, etc.) is mounted on a mounting substrate on which circuit elements and light emitting elements are mounted, a double-sided substrate with wiring formed on both sides is used as the mounting substrate, so that the element body of the sound emitting element can be positioned to emit light. The component mounting surface side method mounts the sound emitting component on a mounting substrate. Thereby, since the sound emitting element can be mounted in the same direction as the light emitting side of the light emitting element, the sound emitting element can be directed toward the floor surface. This makes it easy to satisfy a desired volume standard (for example, 45 dB or more) as a lighting fixture.
然而，於使用僅於單面形成配線的單面基板作為安裝基板的情形時，於安裝發光元件的面，需有配線。於此情形時，若使用具有插穿至安裝基板的貫穿孔的引線的附引線型組件(引線組件)作為發聲元件，則附引線型發聲元件必須安裝於安裝基板之與發光元件的安裝面為相反側的面。亦即，發聲元件係安裝於安裝基板的天花板側的面。結果，可能有無法確保期望音量且無法滿足作為照明器具的期望音量基準的疑慮。However, in the case where a single-sided substrate on which wiring is formed only on one side is used as the mounting substrate, wiring is required on the surface on which the light-emitting element is mounted. In this case, if a leaded component (lead component) having a lead inserted through a through hole to the mounting substrate is used as the sound generating element, the leaded sound generating element must be mounted on the mounting surface of the mounting substrate and the light emitting element as Opposite side face. That is, the sound generating element is mounted on the ceiling side surface of the mounting substrate. As a result, there is a possibility that a desired volume cannot be secured and a desired volume reference serving as a lighting fixture cannot be satisfied.
因此，雖然有考慮使用表面安裝型發聲元件來取代非附引線的發聲元件，而與發光元件安裝於同一面，但表面安裝型發聲元件相較於附引線的發聲元件，其費用高2～3倍。Therefore, although it is considered to use a surface-mounted sound emitting element instead of a non-lead sound emitting element and to mount it on the same side as the light emitting element, the surface-mounted sound emitting element is 2 to 3 more expensive than a leaded sound emitting element. Times.
本發明係用以解決如此問題而成，本發明的目的在於提供一種照明單元及照明器具，其即使使用單面基板作為安裝基板，並將附引線的發聲元件安裝於安裝基板之與安裝有發光元件的面為相反側的面，亦可得到期望音量。
[解決問題之方法]The present invention is made to solve such a problem, and an object of the present invention is to provide a lighting unit and a lighting appliance, which use a single-sided substrate as a mounting substrate, and mount a sound emitting element with a lead on the mounting substrate and a light emitting device. The surface of the element is the surface on the opposite side, and a desired volume can also be obtained.
[Solution to the problem]
為了達成上述目的，本發明的照明單元的一態樣，其具備：基台；安裝基板，配置於該基台，係於第1面形成配線的單面基板；1個以上的發光元件，安裝於該安裝基板的該第1面；複數之電路元件，安裝於該安裝基板，構成產生用以使該發光元件發光的電力的電源電路；及發聲元件，安裝在與該安裝基板的該第1面背向的第2面；該基台具有隔著既定間隔與該安裝基板對向的對向部，該安裝基板具有形成在與該對向部對向的位置的開口部。In order to achieve the above object, an aspect of the lighting unit of the present invention includes: a base; a mounting substrate, a single-sided substrate disposed on the base and attached to the first surface to form wiring; and one or more light emitting elements to be mounted On the first surface of the mounting substrate; a plurality of circuit elements are mounted on the mounting substrate to constitute a power supply circuit that generates electric power to cause the light emitting element to emit light; and a sound emitting element is mounted on the first surface of the mounting substrate. The second surface faces away from the second surface; the base has an opposing portion that opposes the mounting substrate at a predetermined interval, and the mounting substrate has an opening portion that is formed at a position that opposes the opposing portion.
又，本發明的照明器具的一態樣，其具備：上述照明單元；及透光蓋，覆蓋該照明單元。
[發明效果]Moreover, one aspect of the lighting fixture of this invention is provided with the said lighting unit, and the translucent cover which covers this lighting unit.
[Inventive effect]
依據本發明，即使將附引線的發聲元件安裝於單面基板的安裝基板之與安裝有發光元件的面為相反側的面，亦可得到期望音量。According to the present invention, a desired sound volume can be obtained even when a leaded sound emitting element is mounted on a surface of a mounting substrate of a single-sided substrate that is opposite to a surface on which a light emitting element is mounted.
以下，參考圖式說明本發明的實施形態。以下說明的實施形態，皆為顯示本發明的一具體例。因此，以下實施形態所示數值、形狀、材料、構成要件、構成要件的配置位置及連接形態等，僅為一例，其用意非用以限定本發明。因此，針對以下實施形態中之構成要件中，未記載於表示最上位概念的獨立請求項的構成要件，係作為任意的構成元件而加以說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments described below are all specific examples showing the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions, and connection forms of the constituent elements shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent request item representing the highest-level concept are described as arbitrary constituent elements.
又，各圖係示意圖，不盡然為嚴謹圖示。各圖中，對於實質上相同的構成附加相同符號，而省略或簡略重複說明。Moreover, each figure is a schematic diagram, not necessarily a rigorous illustration. In each figure, the same code | symbol is attached | subjected to the substantially the same structure, and description is abbreviate | omitted or abbreviated.
又，於本說明書及圖式中，X軸、Y軸及Z軸係表示三維垂直座標系的三軸，於本實施形態中，將Z軸方向設為鉛直方向，將垂直於Z軸的方向(平行於XY平面的方向)設為水平方向。X軸及Y軸相互垂直，且皆為垂直於Z軸的軸。又，將Z軸方向的正方向設為鉛直下方。In this specification and drawings, the X-axis, Y-axis, and Z-axis systems represent three axes of a three-dimensional vertical coordinate system. In this embodiment, the Z-axis direction is set to a vertical direction, and the direction perpendicular to the Z-axis is set. (The direction parallel to the XY plane) is set to the horizontal direction. The X axis and the Y axis are perpendicular to each other, and both are axes perpendicular to the Z axis. The positive direction in the Z-axis direction is set to be vertically below.
(實施形態)
使用圖1及圖2，說明實施形態的照明器具1的整體構成。圖1係實施形態的照明器具1的剖面圖。圖2係同照明器具1的分解立體圖。又，於圖1及圖2中，紙面上方係地板面(未圖示)的方向。亦即，圖1及圖2中，照明器具1係以與一般使用時為上下顛倒的姿勢顯示。又，圖2中，省略將構件彼此鎖固的螺絲。(Implementation form)
The overall configuration of the lighting fixture 1 according to the embodiment will be described with reference to FIGS. 1 and 2. Fig. 1 is a sectional view of a lighting fixture 1 according to the embodiment. FIG. 2 is an exploded perspective view of the same lighting device 1. In FIGS. 1 and 2, the direction above the paper surface is the floor surface (not shown). That is, in FIGS. 1 and 2, the lighting fixture 1 is displayed in an upside-down posture as compared with that in general use. In addition, in FIG. 2, screws for locking members to each other are omitted.
照明器具1設置於住宅等建物的營造建材。本實施形態之照明器具1，係設置於天花板的吸頂燈。具體而言，照明器具1藉由安裝於設於天花板的懸掛式吸頂燈座主體而設置於天花板。懸掛式吸頂燈座主體於天花板的裡側經由電線等與商用電源電性連接。照明器具1藉由安裝於懸掛式吸頂燈座主體而可獲得來自商用電源的電力。The lighting fixture 1 is installed in construction materials for buildings such as houses. The luminaire 1 according to this embodiment is a ceiling lamp installed on a ceiling. Specifically, the luminaire 1 is installed on the ceiling by being attached to a ceiling type ceiling socket main body provided on the ceiling. The main body of the suspended ceiling lamp holder is electrically connected to a commercial power source via a wire or the like on the back side of the ceiling. The luminaire 1 is capable of obtaining electric power from a commercial power source by being mounted on the main body of the suspended ceiling lamp.
如圖1及圖2所示，照明器具1具備：器具本體10；光源模組20；電路蓋30；光源蓋40；及透光蓋50。又，圖2所示，器具本體10與光源模組20，以器具本體10作為基台而構成照明單元2。As shown in FIGS. 1 and 2, the lighting fixture 1 includes: a fixture body 10; a light source module 20; a circuit cover 30; a light source cover 40; and a light transmitting cover 50. Further, as shown in FIG. 2, the fixture body 10 and the light source module 20 constitute the lighting unit 2 with the fixture body 10 as a base.
以下，使用圖1及圖2，詳細說明本實施形態的照明器具1的各構成組件。Hereinafter, each component of the lighting fixture 1 of this embodiment is demonstrated in detail using FIG.1 and FIG.2.
[器具本體(基台)]
如圖1及圖2所示，器具本體10，係支撐光源模組20、透光蓋50、電路蓋30及光源蓋40的基台。本實施形態中，器具本體10構成照明器具1的外圍構件。[Apparatus body (abutment)]
As shown in FIGS. 1 and 2, the appliance body 10 is a base supporting the light source module 20, the light transmitting cover 50, the circuit cover 30 and the light source cover 40. In the present embodiment, the fixture body 10 constitutes a peripheral member of the lighting fixture 1.
器具本體10係板金製，藉由對例如鋁板或鋼板等板金進行壓製加工而成型為既定形狀。器具本體10的配置有光源模組20之側的面，亦即第1面10a，係器具本體10的內面。為了提高第1面10a的反射性以提升光萃取效率，亦可於第1面10a塗上白色塗料或鍍上反射性金屬材料。又，與第1面10a為相反側的面亦即第2面10b，係器具本體10的外面，暴露於外部空氣。亦即，第2面10b可用作為散熱面。The apparatus body 10 is made of sheet metal, and is formed into a predetermined shape by pressing a sheet metal such as an aluminum plate or a steel plate. The side surface of the device body 10 on which the light source module 20 is arranged, that is, the first surface 10 a, is the inner surface of the device body 10. In order to improve the reflectivity of the first surface 10a to improve the light extraction efficiency, the first surface 10a may be coated with a white paint or a reflective metal material. The second surface 10b, which is the side opposite to the first surface 10a, is the outside of the appliance body 10 and is exposed to the outside air. That is, the second surface 10b can be used as a heat radiation surface.
器具本體10具有部分往地板面側突出之突出部11。突出部11係支撐光源模組20的支撐部。具體而言，突出部11支撐光源模組20的安裝基板210，突出部11的第1面10a成為用以配置安裝基板210的基板配置面。The appliance body 10 includes a protruding portion 11 partially protruding toward the floor surface side. The protruding portion 11 is a supporting portion that supports the light source module 20. Specifically, the protruding portion 11 supports the mounting substrate 210 of the light source module 20, and the first surface 10 a of the protruding portion 11 becomes a substrate placement surface on which the mounting substrate 210 is placed.
突出部11藉由壓製加工而成型為剖面形狀成大致梯形。又，突出部11的俯視形狀，係具有一定寛度作為基板配置面的圓環狀。The protruding portion 11 is formed into a substantially trapezoidal cross-sectional shape by pressing. In addition, the plan view shape of the protruding portion 11 is a ring shape having a certain width as a substrate disposition surface.
又，藉由於器具本體10形成突出部11，而於形成於器具本體10中央部的開口部13的周邊，形成凹部12。具體而言，凹部12以圍住開口部13的方式，形成為圓環狀。凹部12的底部，成為與光源模組20的安裝基板210對向的對向部12a。對向部12a形成為與安裝基板210隔著既定間隔。如此，器具本體10具有與安裝基板210隔著既定間隔並與安裝基板210對向之對向部12a。藉此，於安裝基板210與對向部12a(凹部12的底部)之間，形成空間區。Moreover, since the protruding part 11 is formed in the instrument main body 10, the recessed part 12 is formed in the periphery of the opening part 13 formed in the center part of the instrument main body 10. Specifically, the recessed portion 12 is formed in a ring shape so as to surround the opening portion 13. The bottom of the recessed portion 12 serves as an opposing portion 12 a facing the mounting substrate 210 of the light source module 20. The opposing portion 12 a is formed at a predetermined interval from the mounting substrate 210. In this manner, the appliance body 10 has the facing portion 12 a facing the mounting substrate 210 at a predetermined interval from the mounting substrate 210. Thereby, a space region is formed between the mounting substrate 210 and the facing portion 12 a (the bottom of the recessed portion 12).
於器具本體10的開口部13，設置具有圓筒狀的筒狀部之筒狀構件60。又，於筒狀構件60的內側，設有支撐構件70。支撐構件70係用為將器具本體10裝接於轉接器(未圖示)的轉接器導件，具有可與轉接器嵌合的構造。支撐構件70與轉接器可自由拆裝。轉接器與懸掛式吸頂燈座主體電性及機械性連接。具體而言，為了勾掛於懸掛式吸頂燈座主體的孔，轉接器設有L字型配件。A cylindrical member 60 having a cylindrical tubular portion is provided in the opening portion 13 of the appliance body 10. A support member 70 is provided inside the cylindrical member 60. The support member 70 is an adapter guide for attaching the instrument body 10 to an adapter (not shown), and has a structure capable of being fitted into the adapter. The support member 70 and the adapter can be detached freely. The adapter is electrically and mechanically connected to the main body of the suspended ceiling lamp holder. Specifically, the adapter is provided with an L-shaped fitting to hang on the hole of the main body of the suspended ceiling lamp holder.
於將照明器具1設置於天花板時，使用者將轉接器安裝於懸掛式吸頂燈座主體。其後，將器具本體10壓往天花板側，以使設於器具本體10的開口部13的支撐構件70裝接於轉接器。藉此，支撐構件70與轉接器卡扣，使得照明器具1固定於天花板，並使懸掛式吸頂燈座主體與照明器具1電性及機械性連接。When the lighting fixture 1 is set on the ceiling, the user installs the adapter on the main body of the suspended ceiling lamp holder. Thereafter, the appliance body 10 is pressed toward the ceiling so that the support member 70 provided in the opening portion 13 of the appliance body 10 is attached to the adapter. Thereby, the supporting member 70 and the adapter are snapped, so that the lighting fixture 1 is fixed to the ceiling, and the main body of the suspended ceiling lamp holder and the lighting fixture 1 are electrically and mechanically connected.
又，於器具本體10，設有複數個螺絲孔。螺絲螺合於螺絲孔。光源模組20、電路蓋30及光源蓋40，藉由利用此螺絲一併鎖緊而安裝於器具本體10。A plurality of screw holes are provided in the appliance body 10. The screws are screwed into the screw holes. The light source module 20, the circuit cover 30, and the light source cover 40 are fixed together by the screws and mounted on the appliance body 10.
[光源模組]
光源模組20係照明器具1的光源，例如發出白色光。如圖1所示，光源模組20由器具本體10所支撐。具體而言，光源模組20係載置於器具本體10的突出部11。[Light source module]
The light source module 20 is a light source of the lighting fixture 1 and emits white light, for example. As shown in FIG. 1, the light source module 20 is supported by the appliance body 10. Specifically, the light source module 20 is placed on the protruding portion 11 of the appliance body 10.
在此，參考圖1及圖2，使用圖3A、圖3B、圖4及圖5，說明光源模組20的詳細構成。圖3A係從天花板側所見之實施形態的光源模組20的立體圖。圖3B係從地板側所見之實施形態的同光源模組20的立體圖。圖4係同光源模組20的俯視圖。圖5係實施形態的照明器具1的半剖面圖。Here, a detailed configuration of the light source module 20 will be described with reference to FIGS. 1 and 2, using FIGS. 3A, 3B, 4 and 5. FIG. 3A is a perspective view of the light source module 20 according to the embodiment as seen from the ceiling side. FIG. 3B is a perspective view of the same light source module 20 according to the embodiment as seen from the floor side. FIG. 4 is a top view of the light source module 20. Fig. 5 is a half cross-sectional view of the lighting fixture 1 according to the embodiment.
如圖3A、圖3B及圖4所示，光源模組20具有：安裝基板210；1個以上的發光元件220；複數之電路元件230；及發聲元件240。本實施形態中，發光元件220係複數。As shown in FIGS. 3A, 3B, and 4, the light source module 20 includes: a mounting substrate 210; one or more light emitting elements 220; a plurality of circuit elements 230; and a sound emitting element 240. In this embodiment, the light emitting element 220 is plural.
光源模組20係電源一體型的發光模組，發光元件220與電路元件230皆安裝於安裝基板210。本實施形態中，於安裝基板210，亦安裝發聲元件240。亦即，安裝基板210係發光元件220、電路元件230、發聲元件240共用的共用基板，發光元件220、電路元件230及發聲元件240，安裝於同一安裝基板210。The light source module 20 is a power-integrated light-emitting module, and the light-emitting element 220 and the circuit element 230 are both mounted on the mounting substrate 210. In this embodiment, a sound generating element 240 is also mounted on the mounting substrate 210. That is, the mounting substrate 210 is a common substrate common to the light emitting element 220, the circuit element 230, and the sound emitting element 240, and the light emitting element 220, the circuit element 230, and the sound emitting element 240 are mounted on the same mounting substrate 210.
安裝基板210係印刷配線基板，該印刷配線基板以由絕緣性樹脂材料所構成的樹脂基板、由表面以樹脂覆膜而成之金屬材料所成的金屬基底基板、作為陶瓷材料之燒結體的陶瓷基板、或由玻璃材料所成的玻璃基板等作為基材，於安裝基板210的表面，形成配線。配線例如為由銅或銀等金屬薄膜所成之金屬配線。又，亦可於安裝基板210的表面，以除了連接盤部(焊接部)外覆蓋金屬配線的方式，覆蓋白色光阻膜等絕緣覆膜。又，安裝基板210不限於硬性基板，亦可為可撓性基板。The mounting substrate 210 is a printed wiring board. The printed wiring board includes a resin substrate made of an insulating resin material, a metal base substrate made of a metal material coated with a resin on the surface, and ceramics as a sintered body of a ceramic material. A substrate, a glass substrate made of a glass material, or the like is used as a base material, and wiring is formed on the surface of the mounting substrate 210. The wiring is, for example, a metal wiring formed of a metal thin film such as copper or silver. In addition, the surface of the mounting substrate 210 may be covered with an insulating film such as a white photoresist film so as to cover the metal wiring other than the land portion (soldering portion). The mounting substrate 210 is not limited to a rigid substrate, and may be a flexible substrate.
安裝基板210，係僅於一側的面形成配線之單面基板。具體而言，安裝基板210具有第1面210a、及與第1面210a背向的第2面210b，本實施形態的安裝基板210，係金屬配線以既定形狀的圖案形成於第1面210a之單面基板。因此，安裝基板210的第1面210a成為焊接面。The mounting substrate 210 is a single-sided substrate in which wiring is formed on only one surface. Specifically, the mounting substrate 210 has a first surface 210a and a second surface 210b facing away from the first surface 210a. The mounting substrate 210 of this embodiment is formed of metal wiring in a pattern of a predetermined shape on the first surface 210a. Single-sided substrate. Therefore, the first surface 210a of the mounting substrate 210 becomes a soldering surface.
安裝於安裝基板210的複數之發光元件220與複數之電路元件230，藉由形成於安裝基板210的金屬配線而電性連接。又，複數之發光元件220彼此及複數之電路元件230彼此亦藉由金屬配線而電性連接。又，安裝基板210雖為單面基板而非雙面基板，但亦可依所需，於作為單面基板的安裝基板210追加形成具有配線功能的導電構件。The plurality of light emitting elements 220 and the plurality of circuit elements 230 mounted on the mounting substrate 210 are electrically connected by metal wirings formed on the mounting substrate 210. In addition, the plurality of light emitting elements 220 and the plurality of circuit elements 230 are also electrically connected to each other through metal wiring. Although the mounting substrate 210 is a single-sided substrate instead of a double-sided substrate, a conductive member having a wiring function may be additionally formed on the mounting substrate 210 as a single-sided substrate as required.
如圖3A、圖3B及圖4所示，安裝基板210具有：發光區EA，係安裝有發光元件220的區域；及電路區CA，係安裝有電路元件230的區域。本實施形態中，發光區EA係安裝基板210的外周區，電路區CA係安裝基板210的內周區。亦即，發光區EA係位於電路區CA外側的環狀區。反之，電路區CA係位於發光區EA內側的環狀區。As shown in FIGS. 3A, 3B, and 4, the mounting substrate 210 includes a light-emitting area EA, which is an area where the light-emitting element 220 is mounted, and a circuit area CA, which is an area where the circuit element 230 is mounted. In this embodiment, the light emitting area EA is an outer peripheral area of the mounting substrate 210, and the circuit area CA is an inner peripheral area of the mounting substrate 210. That is, the light emitting area EA is a ring-shaped area located outside the circuit area CA. In contrast, the circuit area CA is a ring-shaped area located inside the light-emitting area EA.
又，如圖1及圖5所示，安裝基板210配置於器具本體10。具體而言，安裝基板210以第2面210b接觸於器具本體10的狀態，配置於器具本體10的突出部11。亦即，安裝基板210以第2面210b為天花板側而第1面210a為地板側的狀態，配置於器具本體10。As shown in FIG. 1 and FIG. 5, the mounting substrate 210 is disposed on the appliance body 10. Specifically, the mounting substrate 210 is disposed on the protruding portion 11 of the appliance body 10 in a state where the second surface 210 b is in contact with the appliance body 10. That is, the mounting substrate 210 is arranged on the appliance body 10 with the second surface 210b being the ceiling side and the first surface 210a being the floor side.
又，安裝基板210，以安裝基板210的一部分從器具本體10的突出部11往開口部13側突出的狀態，載置於器具本體10的突出部11。因此，安裝基板210的一部分，與器具本體10的凹部12對向。具體而言，從安裝基板210的突出部11突出的部分，與器具本體10的凹部12的底部(對向部12a)對向。於本實施形態中，安裝基板210中之電路區CA的部分從突出部11溢出。因此，安裝基板210的電路區CA的部分，與器具本體10的凹部12的底部(對向部12a)對向。The mounting substrate 210 is placed on the protruding portion 11 of the fixture body 10 in a state where a part of the mounting substrate 210 protrudes from the protruding portion 11 of the fixture body 10 toward the opening 13 side. Therefore, a part of the mounting substrate 210 is opposed to the recessed portion 12 of the appliance body 10. Specifically, a portion protruding from the protruding portion 11 of the mounting substrate 210 is opposed to the bottom portion (opposing portion 12 a) of the recessed portion 12 of the appliance body 10. In this embodiment, a portion of the circuit area CA in the mounting substrate 210 overflows from the protruding portion 11. Therefore, a part of the circuit area CA of the mounting substrate 210 is opposed to the bottom (opposing portion 12 a) of the recessed portion 12 of the appliance body 10.
安裝基板210具有第1開口部211及第2開口部212。第1開口部211及第2開口部212，皆為貫穿安裝基板210的貫穿孔。The mounting substrate 210 includes a first opening portion 211 and a second opening portion 212. Both the first opening portion 211 and the second opening portion 212 are through holes that penetrate the mounting substrate 210.
如圖5所示，第1開口部211形成在與器具本體10的對向部12a對向的位置。亦即，第1開口部211與器具本體10的凹部12對向。第1開口部211於光源模組20(安裝基板210)配置於器具本體10的狀態下，亦為開口狀態。亦即，於光源模組20配置於器具本體10的狀態下，第1開口部211內並未***任何構件，第1面210a側的空氣與第2面210b側的空氣為可經由第1開口部211往來的狀態。如圖3A、圖3B及圖4所示，第1開口部211存在於安裝基板210的電路區CA。亦即，第1開口部211並非形成於發光區EA，而是形成於電路區CA。As shown in FIG. 5, the first opening portion 211 is formed at a position facing the facing portion 12 a of the appliance body 10. That is, the first opening portion 211 faces the recessed portion 12 of the appliance body 10. The first opening portion 211 is also in an open state in a state where the light source module 20 (mounting substrate 210) is arranged in the appliance body 10. That is, in a state where the light source module 20 is disposed in the appliance body 10, no member is inserted into the first opening portion 211, and the air on the first surface 210a side and the air on the second surface 210b side can pass through the first opening. The state of 211 exchanges. As shown in FIGS. 3A, 3B, and 4, the first opening portion 211 exists in the circuit area CA of the mounting substrate 210. That is, the first opening portion 211 is not formed in the light emitting area EA but is formed in the circuit area CA.
又，於安裝基板210，亦形成螺絲孔，以作為第1開口部211及第2開口部212以外的貫穿孔，但第1開口部211與螺絲孔不同。具體而言，第1開口部211的開口面積，大於形成於安裝基板210的螺絲孔的開口面積。第1開口部211的開口面積，例如以約20mm2 以上為佳，約100mm2 以上較佳，200mm2 以上更佳。In addition, a screw hole is also formed in the mounting substrate 210 as a through hole other than the first opening portion 211 and the second opening portion 212, but the first opening portion 211 is different from the screw hole. Specifically, an opening area of the first opening portion 211 is larger than an opening area of a screw hole formed in the mounting substrate 210. The opening area of the first opening portion 211 is, for example, preferably about 20 mm 2 or more, more preferably about 100 mm 2 or more, and more preferably 200 mm 2 or more.
第1開口部211的俯視形狀無特別限定，可為矩形或圓形等。例如，第1開口部211的俯視形狀為矩形時，第1開口部211的大小，例如為橫15mm×縱20mm。又，第1開口部211的俯視形狀為圓形時，第1開口部211的大小，以φ5mm以上為佳。The shape of the first opening 211 in plan view is not particularly limited, and may be rectangular or circular. For example, when the planar shape of the first opening portion 211 is rectangular, the size of the first opening portion 211 is, for example, 15 mm in width × 20 mm in length. When the planar shape of the first opening 211 is circular, the size of the first opening 211 is preferably φ5 mm or more.
如圖3A、圖3B及圖4所示，第2開口部212形成於安裝基板210的中央部。因此，安裝基板210的俯視形狀為環狀。本實施形態中，第2開口部212的俯視形狀為圓形。如圖1所示，安裝基板210的第2開口部212的中心，與器具本體10的圓形的開口部13的中心一致。因此，安裝基板210以圍住器具本體10的開口部13的方式，配置於器具本體10。As shown in FIGS. 3A, 3B, and 4, the second opening portion 212 is formed in a central portion of the mounting substrate 210. Therefore, the planar shape of the mounting substrate 210 is annular. In this embodiment, the planar shape of the second opening 212 is circular. As shown in FIG. 1, the center of the second opening portion 212 of the mounting substrate 210 coincides with the center of the circular opening portion 13 of the appliance body 10. Therefore, the mounting substrate 210 is arranged on the appliance body 10 so as to surround the opening 13 of the appliance body 10.
複數之發光元件220，安裝於安裝基板210的第1面210a。亦即，發光元件220安裝於形成有配線的第1面210a。本實施形態中，複數之發光元件220於發光區EA中，以圍住第2開口部212的方式，成2列排列成環狀。The plurality of light emitting elements 220 are mounted on the first surface 210 a of the mounting substrate 210. That is, the light emitting element 220 is mounted on the first surface 210a on which the wiring is formed. In this embodiment, the plurality of light-emitting elements 220 are arranged in a ring shape in two rows so as to surround the second openings 212 in the light-emitting area EA.
各發光元件220例如為個別封裝化的表面安裝(SMD：Surface Mount Device)型LED元件，具備：白色樹脂製封裝體(容器)，具有凹部；LED晶片，一次安裝於封裝體的凹部底面；及密封構件，封入至封裝體的凹部內。密封構件由例如矽酮樹脂等透光性樹脂材料所構成。密封構件亦可為含有螢光體等波長轉換材料的含螢光體樹脂。Each light-emitting element 220 is, for example, an individually packaged Surface Mount Device (SMD: Surface Mount Device) type LED element, which includes: a white resin package (container) having a recess; an LED chip that is mounted on the bottom surface of the recess of the package at one time; The sealing member is sealed in the recess of the package. The sealing member is made of a translucent resin material such as a silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.
LED晶片為利用既定直流電力發光之半導體發光元件的一例，為發出單色可見光的裸晶片。LED晶片例如為通電則發藍色光的藍色LED晶片。此情形時，為了獲得白色光，使於密封構件含有以來自藍色LED晶片的藍色光作為激發光而螢光發光的YAG(釔‧鋁‧石榴石)等黄色螢光體。The LED chip is an example of a semiconductor light emitting device that emits light using a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium · aluminum · garnet) that fluorescently emits blue light from the blue LED chip as excitation light.
如此，本實施形態的發光元件220，係藉由藍色LED晶片及黄色螢光體所構成的B-Y類型的白色LED光源。具體而言，黄色螢光體吸收藍色LED晶片所發出的藍色光的一部分而被激發並放出黄色光，此黄色光與未被黄色螢光體所吸收的藍色光相混而成為白色光。又，密封構件中，除了黄色螢光體以外，亦可含有紅色螢光體或綠色螢光體。As described above, the light-emitting element 220 of this embodiment is a B-Y type white LED light source composed of a blue LED chip and a yellow phosphor. Specifically, the yellow phosphor absorbs a part of the blue light emitted from the blue LED chip and is excited to emit yellow light. This yellow light is mixed with the blue light that is not absorbed by the yellow phosphor to become white light. The sealing member may contain a red phosphor or a green phosphor in addition to the yellow phosphor.
又，光源模組20可為全部發光元件220的光色相同的單色類型，亦可為照明器具1的照明光可調色的調色類型。於調色類型的光源模組20的情形時，複數之發光元件220中，含有色溫等的發光色相異之複數種發光元件220。此情形時，例如，複數之發光元件220可由發出高色溫(例如白晝色)的光之第1發光元件及發出低色溫(例如燈泡色)的光之第2發光元件所構成。又，複數之發光元件220的連接態樣(串聯連接、並聯連接及串聯連接和並聯連接的組合連接等)並無特別限定。In addition, the light source module 20 may be a single-color type in which the light colors of all the light-emitting elements 220 are the same, or may be a color-adjustable type in which the illumination light of the lighting device 1 can be toned. In the case of the toning-type light source module 20, the plurality of light-emitting elements 220 include a plurality of types of light-emitting elements 220 having different emission colors such as color temperature. In this case, for example, the plurality of light-emitting elements 220 may include a first light-emitting element that emits light with a high color temperature (for example, daylight color) and a second light-emitting element that emits light with a low color temperature (for example, bulb color). The connection state of the plurality of light-emitting elements 220 (series connection, parallel connection, and combination of serial connection and parallel connection, etc.) is not particularly limited.
複數之電路元件230至少包含電源用電路元件，該電源用電路元件構成用以產生使發光元件220發光的電力之電源電路。構成電源電路的複數之電路元件230，例如將經由連接於安裝在器具本體10的支撐構件70的轉接器的引線而供給的交流電力，轉換成直流電力。由電源電路所產生的直流電力，供給至各發光元件220。藉此，各發光元件220發光。The plurality of circuit elements 230 include at least a circuit element for a power source, and the circuit element for a power source constitutes a power source circuit for generating power to cause the light emitting element 220 to emit light. The plurality of circuit elements 230 constituting the power supply circuit convert, for example, AC power supplied through a lead connected to an adapter mounted on the support member 70 of the appliance body 10 into DC power. The direct-current power generated by the power supply circuit is supplied to each light-emitting element 220. Thereby, each light emitting element 220 emits light.
構成電源電路的複數之電路元件230(電源用電路元件)，例如為電解電容器或陶瓷電容器等電容元件、電阻器等電阻元件、整流電路元件、抗流線圈、抗流變壓器、噪音濾波器、二極體、或MOSFET等開關元件或積體電路元件等半導體元件等。A plurality of circuit elements 230 (power circuit elements) constituting a power circuit include, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements such as resistors, rectifier circuit elements, anti-current coils, anti-current transformers, noise filters, Switching elements such as electrodes, MOSFETs, and semiconductor elements such as integrated circuit elements.
又，複數之電路元件230不僅包含電源用電路元件，亦可包含構成其他電路的電路元件。例如，複數之電路元件230可包含：於照明器具1具有人體感應器等感應器時，構成用以藉由來自人體感應器的信號而控制發光元件220發光狀態的控制電路之感測器用電路元件；亦可包含：構成用以對光源模組20的照明光予以調光或調色的調光電路或調色電路等控制電路元件；亦可包含：構成用以與遙控器或行動終端進行紅外線通訊或無線通訊的通訊電路之通訊用電路元件(通訊模組)等之其他電路元件。The plurality of circuit elements 230 include not only power circuit elements, but also circuit elements constituting other circuits. For example, the plurality of circuit elements 230 may include a circuit element for a sensor, which constitutes a control circuit for controlling the light-emitting state of the light-emitting element 220 by a signal from the human body sensor when the lighting device 1 has a sensor such as a human body sensor. ; It may also include: a control circuit element such as a dimming circuit or a tinting circuit that is used to dimming or tinting the illumination light of the light source module 20; it may also include: a unit that is configured to perform infrared rays with a remote control or a mobile terminal Other circuit elements such as communication circuit elements (communication modules) for communication circuits of communication or wireless communication.
複數之電路元件230包含對安裝基板210的安裝態樣不同之第1電路元件231及第2電路元件232。The plurality of circuit elements 230 include a first circuit element 231 and a second circuit element 232 having different mounting patterns to the mounting substrate 210.
第1電路元件231係表面安裝型的電路組件(SMD：Surface Mount Device)，藉由焊接而安裝於安裝基板210的表面。本實施形態中，第1電路元件231安裝於形成有安裝基板210的配線之第1面210a。The first circuit element 231 is a surface-mounted circuit module (SMD: Surface Mount Device), and is mounted on the surface of the mounting substrate 210 by soldering. In this embodiment, the first circuit element 231 is mounted on the first surface 210a of the wiring on which the mounting substrate 210 is formed.
第2電路元件232係具有元件本體及從元件本體拉出的一對引線之附引線型電路組件(引線組件)。因此，第2電路元件232藉由使引線插穿至形成於安裝基板210的貫穿孔而安裝(通孔安裝)。本實施形態之安裝基板210，因係於第1面210a形成配線的單面基板，故第2電路元件232安裝於安裝基板210的第2面210b。例如，第2電路元件232藉由使引線從第2面210b插穿至形成在與安裝基板210的配線重疊的位置之貫穿孔，且使引線的前端部焊接於第1面210a側，而與第1面210a的配線連接。亦即，第2電路元件232的元件本體位於第2面210b側，而插穿安裝基板210的貫穿孔的引線的前端部焊接於第1面210a。又，作為引線組件的第2電路元件232，係徑向引線組件或軸向引線組件。The second circuit element 232 is a leaded circuit assembly (lead assembly) having a component body and a pair of leads drawn from the component body. Therefore, the second circuit element 232 is mounted by inserting a lead wire into a through-hole formed in the mounting substrate 210 (through-hole mounting). Since the mounting substrate 210 of this embodiment is a single-sided substrate on which wiring is formed on the first surface 210a, the second circuit element 232 is mounted on the second surface 210b of the mounting substrate 210. For example, the second circuit element 232 is inserted through the lead from the second surface 210b to a through-hole formed at a position overlapping the wiring of the mounting substrate 210, and the leading end portion of the lead is soldered to the first surface 210a side, and The wiring of the first surface 210a is connected. That is, the element body of the second circuit element 232 is located on the second surface 210b side, and the front end portion of the lead wire inserted through the through hole of the mounting substrate 210 is soldered to the first surface 210a. The second circuit element 232 as a lead assembly is a radial lead assembly or an axial lead assembly.
又，複數之電路元件230包含對俯視安裝基板210時的安裝基板210的投影面積為100mm2 以上的大型電路元件。大型電路元件係作為引線組件的第2電路元件232。因此，大型電路元件安裝於安裝基板210的第2面210b。如此的大型電路元件，例舉如具有抗流變壓器或抗流線圈等線圈的線圈組件或電解電容器等。The plurality of circuit elements 230 include a large-sized circuit element having a projected area of the mounting substrate 210 in a plan view of the mounting substrate 210 of 100 mm 2 or more. The large circuit element is a second circuit element 232 as a lead assembly. Therefore, a large-sized circuit element is mounted on the second surface 210 b of the mounting substrate 210. Such a large-scale circuit element is, for example, a coil assembly or an electrolytic capacitor having a coil such as a current-resistant transformer or a current-resistant coil.
於安裝基板210的第2面210b，安裝有發出電子音的發聲元件240。發聲元件240於讓使用者知道照明器具1以遙控器等操作、或讓使用者知道已到所設定的起床時刻等的時候，發出通報音。例如，於使用者藉由操作遙控器進行照明器具1的點滅或調光控制、或進行各種設定之際，藉由使用者的遙控器操作，於照明器具1接收到紅外線信號或無線信號等信號時，發聲元件240發出聲音。又，於到了已設定的起床時刻時，發聲元件240發出聲音。發聲元件240為例如發出「嗶嗶」等蜂鳴音的電子蜂鳴器。A sound generating element 240 that emits an electronic sound is mounted on the second surface 210 b of the mounting substrate 210. The sound generating element 240 emits a notification sound when the user is informed that the lighting fixture 1 is operated by a remote controller or the like, or when the user is notified that the set time for getting up has been reached. For example, when the user controls the lighting device 1 on or off or performs various settings by operating the remote control, the user operates the remote control to receive an infrared signal or a wireless signal from the lighting device 1 When the signal is generated, the sound generating element 240 emits a sound. When the set time for getting up is reached, the sound generating element 240 emits a sound. The sound generating element 240 is an electronic buzzer that emits a beep sound such as "beep".
發聲元件240與第2電路元件232相同，係具有元件本體與一對引線的附引線型發聲元件。本實施形態中，發聲元件為徑向引線組件。The sound generating element 240 is the same as the second circuit element 232 and is a leaded sound generating element having an element body and a pair of leads. In this embodiment, the sound generating element is a radial lead assembly.
發聲元件240可安裝於第1開口部211的附近。此情形時，發聲元件240與第1開口部211間的距離，以30mm以內為佳，10mm以內更佳，5mm以內又更佳。又，從發聲元件240對照明器具1外部所發出的音量若超出既定基準，則發聲元件240與第1開口部211的距離，亦可超過30mm。The sound generating element 240 may be mounted near the first opening portion 211. In this case, the distance between the sound generating element 240 and the first opening 211 is preferably within 30 mm, more preferably within 10 mm, and even more preferably within 5 mm. In addition, if the volume of sound emitted from the sound emitting element 240 to the outside of the lighting fixture 1 exceeds a predetermined reference, the distance between the sound emitting element 240 and the first opening 211 may exceed 30 mm.
本實施形態中，發聲元件240存在於安裝基板210的電路區CA。亦即，發聲元件240安裝於安裝基板210的第2面210b中的電路區CA。此情形時，於發聲元件240的周邊，最好不要安裝大型電路元件。亦即，發聲元件240宜形成於大型電路元件230的安裝數目為少的稀疏區。In this embodiment, the sound generating element 240 exists in the circuit area CA of the mounting substrate 210. That is, the sound generating element 240 is mounted on the circuit area CA in the second surface 210 b of the mounting substrate 210. In this case, it is preferable not to mount a large circuit element around the sound generating element 240. That is, the sound generating element 240 is preferably formed in a sparse area with a small number of mounted large circuit elements 230.
又，於安裝基板210的第1面210a，安裝有電連接器250。電連接器250係外部連接端子，於電連接器250，***連接至轉接器的引線，該轉接器裝接於器具本體10的支撐構件70。亦即，電連接器250可接收經由引線所供給的交流電力(例如商用AC100V)。電連接器250所接收的交流電力，利用由複數之電路元件230所構成的電源電路而變成直流電力。電連接器250例如為快速接線端子，藉由***引線而與引線電性及機械連接。本實施形態中，電連接器250係具有於安裝基板210的第1面210a平行延伸的***孔之橫插式電連接器。因此，於使電連接器250與引線接線時，從正側面將引線***至電連接器250。An electrical connector 250 is mounted on the first surface 210 a of the mounting substrate 210. The electrical connector 250 is an external connection terminal. A lead connected to the adapter is inserted into the electrical connector 250, and the adapter is attached to the support member 70 of the appliance body 10. That is, the electrical connector 250 may receive AC power (for example, commercial AC100V) supplied via a lead. The AC power received by the electrical connector 250 is converted into DC power by a power circuit composed of a plurality of circuit elements 230. The electrical connector 250 is, for example, a quick connection terminal, and is electrically and mechanically connected to the lead by inserting the lead. In this embodiment, the electrical connector 250 is a horizontally-plugged electrical connector having insertion holes extending in parallel to the first surface 210a of the mounting substrate 210. Therefore, when the electrical connector 250 is connected to the lead, the lead is inserted into the electrical connector 250 from the front side.
如此構成的光源模組20，利用螺絲固定於器具本體10。具體而言，光源模組20載置於器具本體10的突出部11，電路蓋30藉由將螺絲***至分別設於光源蓋40及安裝基板210的螺絲孔，並將此螺絲鎖入至器具本體10的螺絲孔而固定於器具本體10。The light source module 20 configured as described above is fixed to the appliance body 10 with screws. Specifically, the light source module 20 is placed on the protruding portion 11 of the appliance body 10, and the circuit cover 30 is inserted into the screw holes provided in the light source cover 40 and the mounting substrate 210, and the screw is locked into the appliance. The screw holes of the main body 10 are fixed to the appliance main body 10.
[電路蓋]
如圖1及圖2所示，電路蓋30係覆蓋複數之電路元件230的蓋構件。具體而言，電路蓋30覆蓋複數之電路元件230中之安裝於安裝基板210的第1面210a的電路元件。亦即，電路蓋30覆蓋安裝於安裝基板210的第1面210a的第1電路元件231。因此，電路蓋30覆蓋安裝基板210的第1面210a(地板面側之面)的一部分。具體而言，電路蓋30於安裝基板210的第1面210a中的發光區EA及電路區CA中，僅覆蓋電路區CA。[Circuit cover]
As shown in FIGS. 1 and 2, the circuit cover 30 is a cover member that covers a plurality of circuit elements 230. Specifically, the circuit cover 30 covers the circuit elements of the plurality of circuit elements 230 mounted on the first surface 210 a of the mounting substrate 210. That is, the circuit cover 30 covers the first circuit element 231 mounted on the first surface 210 a of the mounting substrate 210. Therefore, the circuit cover 30 covers a part of the first surface 210 a (the surface on the floor surface side) of the mounting substrate 210. Specifically, the circuit cover 30 covers only the circuit area CA among the light-emitting area EA and the circuit area CA on the first surface 210 a of the mounting substrate 210.
電路蓋30例如為不透光性的白色，其將從發光元件射出而碰到該電路蓋30的光予以反射並導往透光蓋50的方向，但亦可為具有透光性的透光蓋。又，本實施形態中，電路蓋30為金屬製的金屬蓋，但亦可為樹脂製的樹脂蓋。又，電路蓋30可由金屬材料或不燃性樹脂材料等具有不燃性的材料所構成。The circuit cover 30 is, for example, opaque white. The light emitted from the light-emitting element and hits the circuit cover 30 is reflected and guided to the direction of the transparent cover 50. However, the circuit cover 30 may also be transparent. cover. In the present embodiment, the circuit cover 30 is a metal metal cover, but it may be a resin resin cover. The circuit cover 30 may be made of a non-combustible material such as a metal material or a non-combustible resin material.
電路蓋30係圍住器具本體10的開口部13的形狀。本實施形態中，電路蓋30的俯視形狀形成為圓環狀。又，如圖1所示，電路蓋30係以利用電路蓋30、筒狀構件60及安裝基板210形成空間區的方式構成。於此空間區內，配置電路元件230的第1電路元件231。又，電路蓋30的外側端部，由安裝基板210的第1面210a所支撐。The circuit cover 30 has a shape that surrounds the opening 13 of the appliance body 10. In this embodiment, the planar shape of the circuit cover 30 is formed into a ring shape. As shown in FIG. 1, the circuit cover 30 is configured so that a space area is formed by the circuit cover 30, the cylindrical member 60, and the mounting substrate 210. In this space area, a first circuit element 231 of the circuit element 230 is arranged. The outer end portion of the circuit cover 30 is supported by the first surface 210 a of the mounting substrate 210.
如圖2所示，於電路蓋30，形成缺口部30a。缺口部30a由樹脂蓋31所覆蓋。樹脂蓋31覆蓋安裝於安裝基板210的遙控接收部或夜燈等。遙控接收部接收由使用者操作的遙控器所發出的紅外線信號或無線信號。又，於樹脂蓋31覆蓋夜燈的情形時，可以使夜燈的光通過樹脂蓋31的方式，於樹脂蓋31形成開口部，或者，亦可藉由透光性樹脂材料構成樹脂蓋31。本實施形態中，因於樹脂蓋31形成開口部，故樹脂蓋31由光源蓋40的突出部所覆蓋。As shown in FIG. 2, a cutout portion 30 a is formed in the circuit cover 30. The cutout portion 30 a is covered with a resin cover 31. The resin cover 31 covers a remote control receiving portion, a night light, and the like mounted on the mounting substrate 210. The remote control receiving unit receives an infrared signal or a wireless signal from a remote control operated by a user. When the resin cover 31 covers the night lamp, the night light may pass through the resin cover 31 to form an opening in the resin cover 31, or the resin cover 31 may be made of a translucent resin material. In this embodiment, since the resin cover 31 is formed with an opening portion, the resin cover 31 is covered by the protruding portion of the light source cover 40.
如此構成的電路蓋30，利用螺絲，與光源模組20及光源蓋40一同安裝於器具本體10。本實施形態中，依電路蓋30、光源蓋40、光源模組20及器具本體10的順序配置並藉由4個螺絲一起鎖緊。The circuit cover 30 configured as described above is attached to the appliance body 10 together with the light source module 20 and the light source cover 40 with screws. In this embodiment, the circuit cover 30, the light source cover 40, the light source module 20, and the appliance body 10 are arranged in this order and locked together by four screws.
[光源蓋]
如圖1所示，光源蓋40係覆蓋配置於安裝基板210的發光元件220的蓋構件。本實施形態中，光源蓋40覆蓋安裝基板210的發光區EA。[Light source cover]
As shown in FIG. 1, the light source cover 40 is a cover member that covers the light emitting element 220 disposed on the mounting substrate 210. In this embodiment, the light source cover 40 covers the light emitting area EA of the mounting substrate 210.
光源蓋40係具有透光性的透光蓋，使從發光元件220射出的光穿透。亦即，從發光元件220所射出的光，入射至光源蓋40並穿透光源蓋40。藉由配置光源蓋40，可保護發光元件220或令使用者不會碰觸到安裝基板210的充電部。The light source cover 40 is a light-transmitting cover that transmits light emitted from the light-emitting element 220. That is, the light emitted from the light emitting element 220 enters the light source cover 40 and penetrates the light source cover 40. By arranging the light source cover 40, the light emitting element 220 can be protected or the user can be prevented from touching the charging portion of the mounting substrate 210.
本實施形態中，光源蓋40具有控制從發光元件220所射出光的配光之配光控制功能。具體而言，如圖1及圖2所示，光源蓋40具有分別對應複數之發光元件220之透鏡部41，複數之透鏡部41各自具有將從所對應的發光元件220射出的光的配光角予以放大之功能。透鏡部41與複數之發光元件220以一對一的方式形成。透鏡部41對應於複數之發光元件220的排列而形成於光源蓋40整體。光源蓋40的俯視形狀為環狀。如此，光源蓋40係具有透鏡功能的透鏡蓋。In this embodiment, the light source cover 40 has a light distribution control function that controls the light distribution of the light emitted from the light emitting element 220. Specifically, as shown in FIGS. 1 and 2, the light source cover 40 has a lens portion 41 corresponding to each of the plurality of light emitting elements 220, and each of the plurality of lens portions 41 has a light distribution of light emitted from the corresponding light emitting element 220. The angle is enlarged. The lens portion 41 and the plurality of light emitting elements 220 are formed one-to-one. The lens portion 41 is formed on the entire light source cover 40 in accordance with the arrangement of the plurality of light emitting elements 220. The light source cover 40 has a ring shape in a plan view. As such, the light source cover 40 is a lens cover having a lens function.
光源蓋40可使用透光性的樹脂材料而形成。例如，光源蓋40的材質為丙烯酸、聚碳酸酯或聚對苯二甲酸乙二醇酯等。又，本實施形態中之光源蓋40係透明而不具光擴散性，但光源蓋40亦可具有光擴散性。The light source cover 40 can be formed using a translucent resin material. For example, the material of the light source cover 40 is acrylic, polycarbonate, polyethylene terephthalate, or the like. In addition, although the light source cover 40 in this embodiment is transparent and does not have light diffusivity, the light source cover 40 may have light diffusivity.
光源蓋40係圍住器具本體10的開口部13的形狀。光源蓋40以覆蓋排列成環狀的複數之發光元件220的方式，形成為環狀。本實施形態中，光源蓋40的俯視形狀形成為圓環狀。The light source cover 40 has a shape that surrounds the opening 13 of the appliance body 10. The light source cover 40 is formed in a ring shape so as to cover the plurality of light emitting elements 220 arranged in a ring shape. In this embodiment, the planar shape of the light source cover 40 is formed in a ring shape.
光源蓋40以圍住電路蓋30的方式構成。亦即，於光源蓋40的開口部配置電路蓋30，而光源蓋40的外徑大於電路蓋30的外徑。The light source cover 40 is configured to surround the circuit cover 30. That is, the circuit cover 30 is disposed at the opening of the light source cover 40, and the outer diameter of the light source cover 40 is larger than the outer diameter of the circuit cover 30.
又，於光源蓋40的一部分，設置往內側突出的平板狀突出部42。突出部42覆蓋塞住電路蓋30的缺口部30a的樹脂蓋31。亦即，突出部42與樹脂蓋31重疊。In addition, a flat plate-shaped protruding portion 42 protruding inward is provided on a part of the light source cover 40. The protruding portion 42 covers the resin cover 31 which plugs the cutout portion 30 a of the circuit cover 30. That is, the protruding portion 42 overlaps the resin cover 31.
如此構成的光源蓋40，如上所述，藉由貫穿電路蓋30的4個螺絲而固定於器具本體10。又，光源蓋40的內側的端部，由安裝基板210的第1面210a所支撐。The light source cover 40 configured as described above is fixed to the appliance body 10 by the four screws penetrating the circuit cover 30 as described above. The inner end portion of the light source cover 40 is supported by the first surface 210 a of the mounting substrate 210.
[透光蓋]
透光蓋50係覆蓋照明單元2的蓋構件。亦即，透光蓋50覆蓋構成照明單元2的器具本體10及光源模組20。本實施形態中，透光蓋50亦覆蓋了覆蓋光源模組20的電路蓋30及光源蓋40。[Transparent cover]
The translucent cover 50 is a cover member that covers the lighting unit 2. That is, the transparent cover 50 covers the appliance body 10 and the light source module 20 constituting the lighting unit 2. In this embodiment, the transparent cover 50 also covers the circuit cover 30 and the light source cover 40 that cover the light source module 20.
又，透光蓋50係構成照明器具1的外圍構件的外圍蓋。透光蓋50係覆蓋器具本體10整體的燈罩。透光蓋50可自由拆裝地安裝於器具本體10。The translucent cover 50 is a peripheral cover constituting a peripheral member of the lighting device 1. The translucent cover 50 is a lamp cover that covers the entire body of the appliance 10. The translucent cover 50 is detachably attached to the appliance body 10.
透光蓋50係具有透光性的透光構件，使從光源模組20射出並穿透光源蓋40的光穿透。亦即，入射至透光蓋50內面的光，穿透透光蓋50而往透光蓋50外部導出。The light-transmitting cover 50 is a light-transmitting light-transmitting member that allows light emitted from the light source module 20 and penetrating the light source cover 40 to pass through. That is, the light incident on the inner surface of the light-transmitting cover 50 penetrates the light-transmitting cover 50 and is led out to the outside of the light-transmitting cover 50.
透光蓋50可使用透光性的樹脂材料而形成。例如，透光蓋50的材質可為丙烯酸(PMMA)、聚碳酸酯(PC)、聚對苯二甲酸乙二醇酯(PET)或聚氯乙烯等。The translucent cover 50 can be formed using a translucent resin material. For example, the material of the transparent cover 50 may be acrylic (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyvinyl chloride, or the like.
又，透光蓋50具有光擴散性。藉由使透光蓋50具有光擴散性，可使從光源蓋40入射至透光蓋50的光擴散(散射)，故可從透光蓋50整體均勻地將光導出至外部。The translucent cover 50 has light diffusibility. Since the light-transmitting cover 50 has light diffusivity, light incident from the light source cover 40 to the light-transmitting cover 50 can be diffused (scattered), so that light can be uniformly led out to the outside from the entire light-transmitting cover 50.
此情形時，例如，藉由將透光蓋50設成乳白色可使透光蓋50具有光擴散性。具體而言，藉由以使光擴散粒子分散的樹脂材料來構成透光蓋50，可使透光蓋50具有光擴散性。又，亦可藉由於透光蓋50的內面或外面形成乳白色的光擴散膜，而使透光蓋50具有光擴散性。或者，亦可藉由在透明的透光蓋50的表面形成複數之光擴散點或複數之微小凹凸(紋理)而使具有光擴散性。又，亦可藉由對乳白色的透光蓋50再形成複數之光擴散點或複數之微小凹凸而使具有光擴散性。In this case, for example, the light-transmitting cover 50 can be made light-diffusion by setting the light-transmitting cover 50 to a milky white color. Specifically, the light-transmitting cover 50 can be made to have a light-diffusing property by constituting the light-transmitting cover 50 with a resin material in which light-diffusing particles are dispersed. In addition, the light-transmitting cover 50 may have light diffusibility by forming a milky white light-diffusing film on the inside or outside of the light-transmitting cover 50. Alternatively, a plurality of light diffusion points or a plurality of minute irregularities (textures) may be formed on the surface of the transparent translucent cover 50 to provide light diffusion properties. In addition, the light-transmitting cover 50 may be formed with a plurality of light diffusion points or a plurality of minute irregularities to form the light-transmissive cover 50 so as to have light diffusibility.
又，透光蓋50的形狀係跟隨器具本體10形狀的形狀，本實施形態中，係圓形穹頂狀。又，器具本體10為四方形時，透光蓋50的形狀亦可為矩形穹頂狀。The shape of the light-transmitting cover 50 follows the shape of the device body 10, and in this embodiment, it has a circular dome shape. When the appliance body 10 is rectangular, the shape of the translucent cover 50 may be a rectangular dome shape.
[效果等]
其次，針對本實施形態中之照明器具1的作用效果，參考圖5，並比較圖6所示比較例的照明器具1X而進行說明。圖6係比較例的照明器具1X的半剖面圖。[Effects, etc.]
Next, the function and effect of the lighting fixture 1 in this embodiment will be described with reference to FIG. 5 and comparing the lighting fixture 1X of the comparative example shown in FIG. 6. Fig. 6 is a half cross-sectional view of a lighting fixture 1X of a comparative example.
如圖6所示，比較例的照明器具1X中，作為光源模組20X的安裝基板210X，係使用於雙面形成配線的雙面基板。因此，電路元件230不論是表面安裝型或是引線組件，皆可任意安裝於安裝基板210X的第1面210a及第2面210b中的任一面。As shown in FIG. 6, in the luminaire 1X of the comparative example, the mounting substrate 210X as the light source module 20X is a double-sided substrate used to form wiring on both sides. Therefore, the circuit element 230 can be arbitrarily mounted on any one of the first surface 210a and the second surface 210b of the mounting substrate 210X, whether it is a surface mount type or a lead assembly.
例如，針對大部分的電路元件230，可以電路元件230的元件本體位在與發光元件220的安裝面亦即第1面210a為相同面側的方式，安裝於安裝基板210X。此情形時，表面安裝型的第1電路元件231，藉由焊接於安裝基板210X的第1面210a而安裝於安裝基板210X。又，作為引線組件的第2電路元件232，藉由使從第1面210a往第2面210b插穿的引線焊接於第2面210b，而安裝於安裝基板210X。For example, for most of the circuit elements 230, the element body of the circuit element 230 may be mounted on the mounting substrate 210X such that the element body of the circuit element 230 is positioned on the same side as the mounting surface of the light emitting element 220, that is, the first surface 210a. In this case, the surface-mounted first circuit element 231 is mounted on the mounting substrate 210X by being soldered to the first surface 210a of the mounting substrate 210X. In addition, the second circuit element 232 as a lead assembly is mounted on the mounting substrate 210X by soldering a lead inserted from the first surface 210a to the second surface 210b to the second surface 210b.
又，比較例的照明器具1X中，因使用雙面基板作為安裝基板210X，故即使是附引線型發聲元件240，亦可使發聲元件240的元件本體位在與發光元件220的安裝面亦即第1面210a為相同面側的方式，而安裝於安裝基板210X。具體而言，藉由使從第1面210a往第2面210b插穿的引線焊接於第2面210b，而可將發聲元件240安裝於安裝基板210X。In addition, in the lighting device 1X of the comparative example, since a double-sided substrate is used as the mounting substrate 210X, even with the lead-type sound emitting element 240, the element body of the sound emitting element 240 can be positioned on the mounting surface of the light emitting element 220 The first surface 210a is mounted on the mounting substrate 210X in the same plane. Specifically, a lead inserted from the first surface 210a to the second surface 210b is soldered to the second surface 210b, so that the sound generating element 240 can be mounted on the mounting substrate 210X.
如此，比較例的照明器具1X中，因可將發聲元件240安裝在與發光元件220的光射出側為相同的方向，故可使發聲元件240與發光元件220相同地朝向地板面。藉此，發聲元件240於發出聲音時，可容易滿足作為照明器具1X的期望音量基準(例如45dB以上)。As described above, in the luminaire 1X of the comparative example, since the sound emitting element 240 can be mounted in the same direction as the light emitting side of the light emitting element 220, the sound emitting element 240 and the light emitting element 220 can be made to face the floor surface in the same way. Thereby, when the sound emitting element 240 emits a sound, it can easily satisfy a desired volume reference (for example, 45 dB or more) as the lighting apparatus 1X.
然而，於如本實施形態中的照明器具1一樣，使用單面基板作為安裝基板210時，由於安裝發光元件220的面需有配線，故於使用附引線型發聲元件240時，必須將發聲元件240安裝在與發光元件220的安裝面為相反側的面。亦即，將發聲元件240安裝於安裝基板210的天花板側的面。結果，恐怕無法確保對於發聲元件240的期望音量，且無法滿足作為照明器具的期望音量基準。However, when the single-sided substrate is used as the mounting substrate 210 as in the lighting device 1 of this embodiment, since the surface on which the light-emitting element 220 is mounted needs wiring, the sound-emitting element must be used when the lead-type sound-emitting element 240 is used. 240 is mounted on a surface opposite to the mounting surface of the light emitting element 220. That is, the sound generating element 240 is mounted on the ceiling-side surface of the mounting substrate 210. As a result, there is a fear that the desired volume for the sound emitting element 240 cannot be secured, and the desired volume reference as a lighting fixture cannot be satisfied.
因此，於本實施形態的照明器具1及照明單元2中，如圖5所示，器具本體10具有隔著既定間隔與安裝基板210對向的對向部12a，安裝基板210具有第1開口部211，該第1開口部211形成在與器具本體10的對向部12a對向的位置。Therefore, in the lighting fixture 1 and the lighting unit 2 of this embodiment, as shown in FIG. 5, the fixture body 10 has a facing portion 12 a facing the mounting substrate 210 at a predetermined interval, and the mounting substrate 210 has a first opening portion. 211, the first opening portion 211 is formed at a position facing the facing portion 12 a of the appliance body 10.
藉由此構成，即使使用單面基板作為安裝基板210，並將附引線的發聲元件240安裝在與安裝有安裝基板210的發光元件220的第1面210a為相反側的第2面210b，從發聲元件240所產生的聲音，於對向部12a等反射並通過第1開口部211，而從第2面210b側往第1面210a側前進。亦即，於發聲元件240所產生的聲音，從安裝基板210的天花板面側往地板面側移動。藉此，於發聲元件240發出聲音時可確保期望音量，故可滿足作為照明器具1的期望音量基準。因此，可實現改善發聲元件240音量的高品質的照明器具1。With this configuration, even if a single-sided substrate is used as the mounting substrate 210 and the sound emitting element 240 with a lead is mounted on the second surface 210b opposite to the first surface 210a of the light-emitting element 220 on which the mounting substrate 210 is mounted, from The sound generated by the sound generating element 240 is reflected by the opposing portion 12 a and the like, passes through the first opening portion 211, and advances from the second surface 210 b side to the first surface 210 a side. That is, the sound generated by the sound generating element 240 moves from the ceiling surface side to the floor surface side of the mounting substrate 210. Thereby, the desired sound volume can be ensured when the sound is emitted from the sound emitting element 240, so that the desired sound volume reference for the lighting fixture 1 can be satisfied. Therefore, a high-quality lighting fixture 1 capable of improving the sound volume of the sound emitting element 240 can be realized.
特別是，於本實施形態中，於形成有第1開口部211的安裝基板210的一部分的第2面210b側，形成有藉由器具本體10的凹部12與安裝基板210所圍住的空間區。藉此，於發聲元件240所產生的聲音，可通過第1開口部211而容易往第1面210a側(地板面側)移動。因此，可容易實現改善發聲元件240音量的高品質的照明器具1。In particular, in this embodiment, on the second surface 210b side of a part of the mounting substrate 210 on which the first opening portion 211 is formed, a space region surrounded by the recessed portion 12 of the appliance body 10 and the mounting substrate 210 is formed. . Thereby, the sound generated by the sound generating element 240 can be easily moved to the first surface 210a side (the floor surface side) through the first opening portion 211. Therefore, a high-quality lighting fixture 1 capable of improving the sound volume of the sound emitting element 240 can be easily realized.
而且，附引線的發聲元件240相較於表面安裝型的發聲元件為低成本，故可抑制照明器具1的成本增加。In addition, since the leaded sound emitting element 240 is lower in cost than the surface mount type sound emitting element, the increase in the cost of the lighting fixture 1 can be suppressed.
又，於本實施形態的照明器具1及照明單元2中，發聲元件240係安裝於第1開口部211的附近。Further, in the lighting fixture 1 and the lighting unit 2 of this embodiment, the sound emitting element 240 is mounted near the first opening 211.
藉由此構成，於發聲元件240所產生的聲音容易通過第1開口部211，故更加容易滿足期望音量基準。With this configuration, the sound generated by the sound generating element 240 can easily pass through the first opening portion 211, so that it is easier to satisfy the desired volume reference.
又，於本實施形態的照明器具1及照明單元2中，於發聲元件240的周邊，未安裝大型電路元件230。Further, in the lighting fixture 1 and the lighting unit 2 of this embodiment, the large-scale circuit element 230 is not mounted around the sound generating element 240.
藉由此構成，可抑制於發聲元件240所產生的聲音被大型電路元件230遮蔽。藉此，於發聲元件240所產生的聲音容易通過第1開口部211，故更容易滿足期望音量基準。With this configuration, it is possible to suppress the sound generated by the sound generating element 240 from being blocked by the large-scale circuit element 230. This makes it easier for the sound generated by the sound generating element 240 to pass through the first opening 211, so that it is easier to satisfy the desired volume reference.
又，於本實施形態的照明器具1及照明單元2中，更具有配置於該開口部附近的橫插式電連接器250。Further, the lighting fixture 1 and the lighting unit 2 of the present embodiment further include a horizontal plug-in electrical connector 250 arranged near the opening.
藉由此構成，即使是橫插式電連接器250，亦可容易將引線***至電連接器250。例如，作業員將引線***至電連接器250時，因可將拿著引線的使用者的手指的一部分(關節部等)放入至第1開口部211，故可抑制例如因手指碰到安裝基板210表面使安裝基板210成為阻礙而不易將引線***至電連接器250的情形，可容易將引線***至電連接器250。因此，第1開口部211的開口面積，宜為人的手指的一部分(關節部等)可放入左右的大小。With this configuration, it is possible to easily insert a lead wire into the electrical connector 250 even in the horizontally-plugged electrical connector 250. For example, when an operator inserts a lead wire into the electrical connector 250, a part of a finger (joint portion, etc.) of a user holding the lead wire can be placed in the first opening portion 211, so that, for example, it is possible to prevent the finger from hitting the attachment The surface of the substrate 210 makes it difficult to insert the lead into the electrical connector 250 because the mounting substrate 210 is an obstacle, and the lead can be easily inserted into the electrical connector 250. Therefore, the opening area of the first opening portion 211 is preferably such that a part of a human finger (such as a joint portion) can be left and right.
又，本實施形態的照明器具1，更具備：電路蓋30，覆蓋複數之電路元件230中之安裝於安裝基板210的第1面210a的電路元件230。The lighting fixture 1 according to this embodiment further includes a circuit cover 30 that covers the circuit elements 230 of the plurality of circuit elements 230 that are mounted on the first surface 210 a of the mounting substrate 210.
本實施形態中，如圖5所示，複數之電路元件230中，於安裝基板210的第1面210a安裝表面安裝型的第1電路元件231，而於安裝基板210的第2面210b安裝附引線的第2電路元件232。亦即，於配置有電路蓋30的第1面210a，安裝高度較低的電路元件230，而於第2面210b，安裝高度較高的電路元件230。藉此，如圖5所示，針對本實施形態的照明器具1的電路蓋30，與圖6所示的比較例的照明器具1X的電路蓋30X相比，可降低高度。藉此，於本實施形態的照明器具1中，可抑制發光元件220的光被電路蓋30所遮蔽。In this embodiment, as shown in FIG. 5, among the plurality of circuit elements 230, a surface-mounted first circuit element 231 is mounted on the first surface 210 a of the mounting substrate 210, and a second surface 210 b is mounted on the second surface 210 b of the mounting substrate 210. The second circuit element 232 of the lead. That is, the circuit element 230 having a low height is mounted on the first surface 210 a on which the circuit cover 30 is arranged, and the circuit element 230 having a high height is mounted on the second surface 210 b. As a result, as shown in FIG. 5, the circuit cover 30 of the luminaire 1 according to this embodiment can be lowered in height than the circuit cover 30X of the luminaire 1X of the comparative example shown in FIG. 6. Thereby, in the lighting fixture 1 of this embodiment, the light of the light emitting element 220 can be suppressed from being blocked by the circuit cover 30.
又，於本實施形態的照明器具1中，於電路蓋30形成缺口部30a，缺口部30a以樹脂蓋31所覆蓋。Moreover, in the lighting fixture 1 of this embodiment, the notch part 30a is formed in the circuit cover 30, and the notch part 30a is covered with the resin cover 31.
藉由此構成，即使安裝基板210的第1開口部211由電路蓋30所覆蓋，因發聲元件240所產生的聲音，不易從缺口部30a與樹脂蓋31的間隙洩出，故可滿足期望音量基準。With this configuration, even if the first opening portion 211 of the mounting substrate 210 is covered by the circuit cover 30, the sound generated by the sound emitting element 240 is not easily leaked from the gap between the notch portion 30a and the resin cover 31, so that the desired volume can be satisfied. Benchmark.
(變形例)
以上，針對本發明的照明器具，依據實施形態進行說明，但本發明不限於上述實施形態。(Modification)
As mentioned above, although the lighting fixture of this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.
例如，上述實施形態中，發聲元件240所產生的聲音所通過的第1開口部211，於安裝基板210僅形成1個，但不限於此。亦即，亦可於安裝基板210形成複數個第1開口部211。藉此，因可使於發聲元件240所產生的聲音，更容易從安裝基板210的第2面210b側往第1面210a側移動，故可更容易滿足期望音量基準。For example, in the above embodiment, the first opening portion 211 through which the sound generated by the sound generating element 240 passes is formed in the mounting substrate 210, but it is not limited thereto. That is, a plurality of first openings 211 may be formed in the mounting substrate 210. This makes it easier to move the sound generated by the sound generating element 240 from the second surface 210b side to the first surface 210a side of the mounting substrate 210, so that it is easier to meet the desired volume reference.
又，上述實施形態中，基台的一例係以器具本體10為例，但不限於此。例如，基台亦可為鋁壓鑄製或高熱傳導樹脂製的散熱座等。Moreover, in the said embodiment, an example of the abutment took the apparatus main body 10 as an example, It is not limited to this. For example, the base may be a heat sink made of aluminum die-casting or a high thermal conductivity resin.
又，上述實施形態中，光源模組20係由1個安裝基板210所構成，但不限於此。例如，亦可藉由排列複數個安裝有發光元件220的圓弧狀基板，而構成1個圓環狀的光源模組。Moreover, in the said embodiment, although the light source module 20 consists of one mounting board 210, it is not limited to this. For example, one circular light source module may be configured by arranging a plurality of arc-shaped substrates on which the light emitting elements 220 are mounted.
又，上述實施形態中，發光元件220係SMD類型的LED元件，但不限於此。例如，亦可為使用LED晶片(裸晶片)本身作為發光元件220再將此LED晶片直接安裝(1次安裝)於基板上之COB(Chip On Board：晶片直接封裝)類型的光源模組。此情形時，安裝於基板上的複數個LED晶片，可藉由密封構件總括密封，亦可個別密封。又，此密封構件亦可如上所述含有黄色螢光體等波長轉換材料。In the above embodiment, the light-emitting element 220 is an SMD-type LED element, but is not limited thereto. For example, it may be a COB (Chip On Board) type light source module that uses an LED chip (bare chip) itself as the light-emitting element 220 and directly mounts the LED chip (once mounting) on a substrate. In this case, the plurality of LED chips mounted on the substrate may be collectively sealed by a sealing member or individually sealed. The sealing member may contain a wavelength conversion material such as a yellow phosphor as described above.
又，上述實施形態中，發光元件220係為藉由藍色LED晶片與黄色螢光體而放出白色光的B-Y類型的白色LED光源，但不限於此。例如，可使用含有紅色螢光體及綠色螢光體的含螢光體樹脂，藉由將該含螢光體樹脂與藍色LED晶片組合而放出白色光。又，為了提高演色性，亦可除了黄色螢光體外，再混入紅色螢光體或綠色螢光體。又，亦可使用發出藍色以外顏色的LED晶片，例如，使用放出波長較藍色LED晶片所放出的藍色光為短的紫外線之紫外線LED晶片，藉由主要由紫外線所激發而放出藍色光、紅色光及綠色光之藍色螢光體、綠色螢光體及紅色螢光體而放出白色光。In the above embodiment, the light emitting element 220 is a B-Y type white LED light source that emits white light through a blue LED chip and a yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor can be used, and the phosphor-containing resin can be combined with a blue LED chip to emit white light. In addition, in order to improve color rendering, in addition to the yellow fluorescent body, a red fluorescent body or a green fluorescent body may be mixed. In addition, LED chips emitting colors other than blue can also be used. For example, an ultraviolet LED chip that emits shorter ultraviolet light than blue light emitted by a blue LED chip can emit blue light by being excited mainly by ultraviolet light. The red, green, and blue phosphors, green phosphors, and red phosphors emit white light.
又，上述實施形態中，發光元件220的光源係以LED為例，但亦可使用如半導體雷射等半導體發光元件、有機EL(Electro Luminescence)或無機EL等之其他固體發光元件。In the above embodiment, the light source of the light emitting element 220 is an LED, but other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence), or an inorganic EL may be used.
又，上述實施形態中，作為遙控接收部以外的功能部，亦可於內部設置檢測照明器具周邊的明亮度之明亮感測器、以紅外線檢測人體之人體感應器、或拍攝周邊影像之影像感測器。In addition, in the above embodiment, as a functional part other than the remote control receiving part, a bright sensor for detecting the brightness around the luminaire, a human sensor for detecting the human body with infrared rays, or an image sensing for capturing peripheral images may be provided inside. Tester.
又，上述實施形態中，照明器具1亦可於內部設置以有線或無線方式輸出照明器具1所接收的聲音之擴音器。此情形時，例如，可控制擴音器，使與光源模組20的點亮同步從擴音器輸出聲音。Further, in the above-mentioned embodiment, the lighting device 1 may be provided with a loudspeaker that outputs the sound received by the lighting device 1 in a wired or wireless manner. In this case, for example, the loudspeaker can be controlled to output sound from the loudspeaker in synchronization with the lighting of the light source module 20.
此外，對於上述實施形態施加所屬技術領域中具通常知識者所思及之各種變形而獲得的形態、或於不脫離本發明意旨的範圍任意組合上述實施形態的構成要素及功能而實現的形態，亦包含於本發明。In addition, the above-mentioned embodiment is a form obtained by applying various modifications considered by a person skilled in the art in the technical field to the above-mentioned embodiment, or a form realized by arbitrarily combining the constituent elements and functions of the above-mentioned embodiment without departing from the spirit of the present invention Also included in the present invention.
1、1X‧‧‧照明器具1.1X‧‧‧lighting equipment
2‧‧‧照明單元 2‧‧‧lighting unit
10‧‧‧器具本體(基台) 10‧‧‧Apparatus body (abutment)
10a‧‧‧第1面 10a‧‧‧Part 1
10b‧‧‧第2面 10b‧‧‧Part 2
11‧‧‧突出部 11‧‧‧ protrusion
12‧‧‧凹部 12‧‧‧ recess
12a‧‧‧對向部 12a‧‧‧ Opposing Department
13‧‧‧開口部 13‧‧‧ opening
20、20X‧‧‧光源模組 20, 20X‧‧‧light source module
210、210X‧‧‧安裝基板 210, 210X‧‧‧Mounting base
210a‧‧‧第1面 210a‧‧‧Part 1
210b‧‧‧第2面 210b‧‧‧Part 2
211‧‧‧第1開口部 211‧‧‧The first opening
212‧‧‧第2開口部 212‧‧‧The second opening
220‧‧‧發光元件 220‧‧‧Light-emitting element
230‧‧‧電路元件 230‧‧‧circuit components
231‧‧‧第1電路元件 231‧‧‧1st circuit element
232‧‧‧第2電路元件 232‧‧‧2nd circuit element
240‧‧‧發聲元件 240‧‧‧ sounding element
250‧‧‧電連接器 250‧‧‧electrical connector
30、30X‧‧‧電路蓋 30, 30X‧‧‧Circuit cover
30a‧‧‧缺口部 30a‧‧‧notch
31‧‧‧樹脂蓋 31‧‧‧resin cover
40‧‧‧光源蓋 40‧‧‧light source cover
41‧‧‧透鏡部 41‧‧‧Lens section
42‧‧‧突出部 42‧‧‧ protrusion
50‧‧‧透光蓋 50‧‧‧Translucent cover
60‧‧‧筒狀構件 60‧‧‧ cylindrical member
70‧‧‧支撐構件 70‧‧‧ support member
CA‧‧‧電路區 CA‧‧‧Circuit Area
EA‧‧‧發光區 EA‧‧‧Light-emitting area
【圖1】實施形態的照明器具的剖面圖。[Fig. 1] A sectional view of a lighting fixture according to an embodiment.
【圖2】實施形態的照明器具的分解立體圖。 [Fig. 2] An exploded perspective view of the lighting fixture according to the embodiment.
【圖3A】從天花板側所見之實施形態的光源模組的立體圖。 FIG. 3A is a perspective view of a light source module according to the embodiment as seen from a ceiling side.
【圖3B】從地板側所見之實施形態的光源模組的立體圖。 3B is a perspective view of the light source module according to the embodiment as seen from the floor side.
【圖4】實施形態的光源模組的俯視圖。 [Fig. 4] A plan view of a light source module according to the embodiment.
【圖5】實施形態的照明器具的半剖面圖。 [Fig. 5] A half cross-sectional view of a lighting fixture according to the embodiment.
【圖6】比較例的照明器具的半剖面圖。 Fig. 6 is a half sectional view of a lighting fixture of a comparative example.
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-046302 | 2018-03-14 | ||
| JP2018046302A JP6964236B2 (en) | 2018-03-14 | 2018-03-14 | Lighting unit and lighting equipment |
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| Publication Number | Publication Date |
|---|---|
| TW201938951A true TW201938951A (en) | 2019-10-01 |
| TWI774937B TWI774937B (en) | 2022-08-21 |
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|---|---|---|---|
| TW108107949A TWI774937B (en) | 2018-03-14 | 2019-03-11 | Lighting units and lighting fixtures |
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| JP (1) | JP6964236B2 (en) |
| TW (1) | TWI774937B (en) |
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| JP7486099B2 (en) * | 2020-04-27 | 2024-05-17 | パナソニックＩｐマネジメント株式会社 | lighting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007003630A (en) * | 2005-06-21 | 2007-01-11 | Denso Corp | Display device |
| JP5545083B2 (en) * | 2010-07-07 | 2014-07-09 | ソニー株式会社 | Speaker device |
| CN202133871U (en) * | 2011-04-29 | 2012-02-01 | 重庆欧凯电器有限公司 | Household electrical appliance timer turn button with photo-acoustic indication |
| TWM474883U (en) * | 2013-12-04 | 2014-03-21 | Lee Hsiang Yu | Led lamp with audio function |
| JP6374770B2 (en) * | 2014-11-14 | 2018-08-15 | アイリスオーヤマ株式会社 | LED lighting device |
| JP6403113B2 (en) * | 2014-11-27 | 2018-10-10 | パナソニックＩｐマネジメント株式会社 | lighting equipment |
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| Publication number | Publication date |
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| JP2019160592A (en) | 2019-09-19 |
| TWI774937B (en) | 2022-08-21 |
| JP6964236B2 (en) | 2021-11-10 |
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