TW201930810A

TW201930810A - Heat dissipation module

Info

Publication number: TW201930810A
Application number: TW107146977A
Authority: TW
Inventors: 橫山雄一; 川原洋司; 齋藤祐士
Original assignee: 日商藤倉股份有限公司
Priority date: 2017-12-25
Filing date: 2018-12-25
Publication date: 2019-08-01
Also published as: WO2019131599A1

Abstract

The heat dissipation module includes a container and a wick. The wick contact with a pair of an inner wall of the container, the inner walls face to each other. The wick partitions inside of the container, and forms vapor passes for evaporated working fluid. A connecting portion is formed in the wick, the connecting portion connects at least two vapor passes to each other. The connecting portion contacts with at least one of the inner walls. A pillar which is connected to both of the inner walls is formed inside of the container.

Description

散熱模組Thermal module

發明領域
本發明是有關於散熱模組。
本申請案是根據2017年12月25日在日本申請的特願第2017-248438號及特願第2017-248439號主張優先權，並在此援用其內容。FIELD OF THE INVENTION The present invention relates to heat dissipation modules.
The present application claims priority based on Japanese Patent Application No. Hei. No. Hei.

發明背景
在專利文獻1中，揭示了熱管來作為散熱模組的一形態。熱管基本上是在將空氣等之非凝結性的氣體除氣後之容室(容器)的內部，將在目標溫度範圍內蒸發及凝結的水或酒精等的流體封入作為作動流體，進而在容室的內部設置毛細結構，該毛細結構是產生用以使液相的作動流體回流的毛細管力。BACKGROUND OF THE INVENTION In Patent Document 1, a heat pipe is disclosed as an embodiment of a heat dissipation module. The heat pipe is basically a chamber (container) in which a non-condensable gas such as air is degassed, and a fluid such as water or alcohol which evaporates and condenses in a target temperature range is sealed as an actuating fluid, and is further contained. The interior of the chamber is provided with a capillary structure which is a capillary force generated to return the operating fluid of the liquid phase.

當容室產生溫度差時，在高溫的蒸發部中，作動流體會被加熱而蒸發，容室的內部壓力也上昇。在蒸發部產生的作動流體的蒸氣會朝向溫度及壓力較低的凝結部移動，將在蒸發部接收到的熱作為蒸氣的潛熱而輸送到凝結部。在凝結部中，作動流體的蒸氣會因為散熱而凝結。而且，經凝結的作動流體滲透到毛細結構，並利用毛細結構的毛細管力而朝向蒸發部回流。
先行技術文獻
專利文獻When a temperature difference occurs in the chamber, in the high-temperature evaporation portion, the working fluid is heated and evaporated, and the internal pressure of the chamber also rises. The vapor of the operating fluid generated in the evaporation portion moves toward the condensation portion having a lower temperature and pressure, and the heat received in the evaporation portion is sent to the condensation portion as latent heat of the vapor. In the condensing section, the vapor of the actuating fluid is condensed by heat dissipation. Moreover, the condensed actuating fluid permeates into the capillary structure and recirculates toward the evaporation portion by the capillary force of the capillary structure.
Advanced technical literature patent literature

[專利文獻1]日本特開平11-183069號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-183069

發明概要
發明欲解決之課題
近年來，智慧型手機、平板PC等之攜帶型電子機器的薄型化愈發顯著。為了使搭載於如此薄型之電子機器的CPU等的熱散熱，期望著薄型的散熱模組。在薄型的散熱模組中，要求確保機械強度，並且抑制蒸氣流路之作動負荷的不均。SUMMARY OF THE INVENTION Problems to be Solved by the Invention In recent years, portable electronic devices such as smart phones and tablet PCs have become increasingly thinner. In order to dissipate heat of a CPU or the like mounted on such a thin electronic device, a thin heat dissipation module is desired. In a thin heat dissipation module, it is required to ensure mechanical strength and to suppress unevenness in the operating load of the vapor flow path.

本發明是有鑑於上述問題點而作成者，其目的在於提供一種散熱模組，可確保薄型之容室的機械強度並且可抑制蒸氣流路之作動負荷的不均。The present invention has been made in view of the above problems, and an object thereof is to provide a heat dissipating module which can ensure mechanical strength of a thin chamber and suppress unevenness in an operating load of a vapor flow path.

解決課題之手段
本發明之第1態樣之散熱模組，具備：容室，具有：於內部封入作動流體並使前述作動流體蒸發的蒸發部；及使已蒸發的前述作動流體凝結的凝結部；及毛細結構，配置於前述容室的內部，使已凝結之前述作動流體藉由毛細管力而從前述凝結部移動到前述蒸發部，前述毛細結構與前述容室之對向的一對內壁面各自接觸而分隔前述容室的內部，並形成有複數個已蒸發之前述作動流體的蒸氣流路，於前述毛細結構形成連通部，前述連通部是使前述複數個蒸氣流路當中至少2個蒸氣流路之間連通，前述連通部與前述一對內壁面之至少一方接觸，於前述容室的內部，形成有連接於前述一對內壁面之雙方的柱部。Means for Solving the Problem A heat dissipation module according to a first aspect of the present invention includes: a chamber having an evaporation portion that internally encloses an operating fluid and evaporates the operating fluid; and a condensation portion that condenses the evaporated operating fluid And a capillary structure disposed inside the chamber to move the condensed operating fluid from the condensing portion to the evaporation portion by capillary force, and a pair of inner wall surfaces of the capillary structure and the chamber Separating and separating the inside of the chamber, and forming a plurality of vapor flow paths for evaporating the operating fluid, forming a communication portion in the capillary structure, wherein the communication portion is to make at least two vapors among the plurality of vapor flow paths The flow path communicates with each other, and the communication portion is in contact with at least one of the pair of inner wall surfaces, and a column portion connected to both of the pair of inner wall surfaces is formed inside the chamber.

本發明之第2態樣之散熱模組是在上述第1態樣之散熱模組中，前述複數個蒸氣流路包含流路長度不同的蒸氣流路，前述連通部是使前述複數個蒸氣流路當中至少包含流路長度最長的蒸氣流路的2個蒸氣流路之間連通。
本發明之第3態樣之散熱模組是在上述第1或第2態樣之散熱模組中，前述連通部是使前述蒸氣流路之前述凝結部側的端部之間連通，並使前述蒸氣流路之中間部分之間不連通。
本發明之第4態樣之散熱模組是在上述第1至第3任一個態樣之散熱模組中，前述連通部是使前述蒸氣流路之前述凝結部側的端部之間連通，並使前述蒸氣流路之前述蒸發部側之端部之間不連通。
本發明之第5態樣之散熱模組是在上述第1至第4任一個態樣之散熱模組中，在前述毛細結構與前述柱部之間未形成有蒸氣流路。
本發明之第6態樣之散熱模組是在上述第1至第5任一個態樣之散熱模組中，在前述容室之框部與前述毛細結構之間，形成有非蒸氣流路的間隙。
本發明之第7態樣之散熱模組是在上述第1至第6之任一個態樣之散熱模組中，前述連通部在前述一對內壁面相互對向的對向方向中，具有為前述毛細結構之厚度的20%~50%的大小的間隙。
本發明之第8態樣之散熱模組是在上述第1至第7之任一個態樣之散熱模組中，前述連通部是形成於前述毛細結構且在前述一對內壁面對向的對向方向中凹陷的凹部。
本發明之第9態樣之散熱模組是在上述第8態樣之散熱模組中，前述毛細結構具有配置於前述蒸發部的第2凹部。
本發明之第10態樣之散熱模組是在上述第1至第9之任一個態樣之散熱模組中，前述毛細結構在前述一對內壁面之對向方向中，在與前述一對內壁面有間隔的位置具有貫通孔，前述貫通孔為前述連通部。
發明效果In a heat dissipation module according to a second aspect of the present invention, in the heat dissipation module according to the first aspect, the plurality of vapor flow paths include a vapor flow path having a different flow path length, and the communication portion is the plurality of vapor flows At least one of the two vapor flow paths including the vapor flow path having the longest flow path is connected to each other.
According to a third aspect of the invention, in the heat dissipation module of the first aspect or the second aspect, the communication portion communicates between end portions on the side of the condensation portion of the vapor flow path, and There is no communication between the intermediate portions of the aforementioned vapor flow paths.
In a heat dissipation module according to a fourth aspect of the present invention, in the heat dissipation module according to any one of the first to third aspect, the communication portion communicates between end portions on the condensation portion side of the vapor flow path. The end portions of the vapor flow path on the evaporation portion side are not communicated with each other.
In a heat dissipation module according to a fifth aspect of the present invention, in the heat dissipation module according to any one of the first to fourth aspects, a vapor flow path is not formed between the capillary structure and the column portion.
In a heat dissipation module according to a sixth aspect of the present invention, in the heat dissipation module according to any one of the first to fifth aspects, a non-vapor flow path is formed between a frame portion of the chamber and the capillary structure. gap.
In a heat dissipation module according to a seventh aspect of the present invention, in the heat dissipation module according to any one of the first to sixth aspect, the communication portion has a direction in which the pair of inner wall surfaces oppose each other A gap of 20% to 50% of the thickness of the capillary structure.
In the heat dissipation module according to the eighth aspect of the present invention, the communication portion is formed in the capillary structure and faces the pair of inner walls. A recess that is recessed in the opposite direction.
According to a ninth aspect of the invention, in the heat dissipation module of the eighth aspect, the capillary structure includes a second recess disposed in the evaporation portion.
In a heat dissipation module according to a tenth aspect of the present invention, in the heat dissipation module according to any one of the first to the ninth aspect, the capillary structure is in a direction opposite to the pair of inner wall surfaces The inner wall surface has a through hole at a position spaced apart from each other, and the through hole is the communication portion.
Effect of the invention

根據上述本發明之態樣，可提供一種可確保薄型容室的機械強度並且抑制蒸氣流路之作動負荷的不均的散熱模組。According to the aspect of the invention described above, it is possible to provide a heat dissipation module which can ensure the mechanical strength of the thin chamber and suppress the uneven operation load of the vapor flow path.

較佳實施例之詳細說明
(第1實施形態)
以下，參照圖式說明本發明之第1實施形態的散熱模組。
散熱模組的作動條件使用以下的算式(1)來表示。算式(1)中，ΔP_C 是毛細管力，ΔP_V 是蒸氣的壓力損失，ΔP_L 是液體的壓力損失。
ΔP_C ≧　ΔP_V ＋ΔP_L …(1)
由該算式(1)可知，為了加大散熱模組的最大熱輸送量，必須加大毛細管力，減少蒸氣與液體的壓力損失。Detailed description of the preferred embodiment
(First embodiment)
Hereinafter, a heat dissipation module according to a first embodiment of the present invention will be described with reference to the drawings.
The operating conditions of the heat dissipation module are expressed by the following formula (1). In the formula (1), ΔP _C is a capillary force, ΔP _V is a pressure loss of vapor, and ΔP _L is a pressure loss of a liquid.
ΔP _C ≧ ΔP _V +ΔP _L (1)
According to the formula (1), in order to increase the maximum heat transfer amount of the heat dissipation module, it is necessary to increase the capillary force and reduce the pressure loss of the vapor and the liquid.

近年來，智慧型手機、平板PC等的攜帶機器的薄型化愈發顯著，為了使搭載於該攜帶機器之CPU等的熱散熱，期望著薄型的散熱模組。在如此之薄型的散熱模組中，必須設法抑制最大熱輸送量的降低與維持該機械強度。即，關於比較大的散熱模組，由於可確保較廣的蒸氣流路與液體流路，故可減少蒸氣與液體的壓力損失，但在薄型的散熱模組中，難以確保較廣的流路。又，在薄型的散熱模組中，容室的厚度也會變薄，難以確保該機械強度。In recent years, portable devices such as smart phones and tablet PCs have become more and more thin, and in order to dissipate heat from a CPU or the like mounted on the portable device, a thin heat dissipation module is desired. In such a thin heat dissipation module, it is necessary to try to suppress the reduction in the maximum heat transfer amount and maintain the mechanical strength. That is, with respect to a relatively large heat dissipation module, since a wide vapor flow path and a liquid flow path can be secured, pressure loss of vapor and liquid can be reduced, but in a thin heat dissipation module, it is difficult to secure a wide flow path. . Further, in the thin heat dissipation module, the thickness of the chamber is also reduced, and it is difficult to secure the mechanical strength.

其中，為了確保容室的機械強度，有時候會將配置於容室之內部的毛細結構，利用作為用以保持容室的形狀的柱。如此的毛細結構分別接觸於容室之對向的一對內壁面，分隔容室的內部，在其兩側形成已蒸發的作動流體的蒸氣流路。然而，該等蒸氣流路由於會分別在凝結部中獨立存在，因此例如當蒸氣流路的作動距離(流路長度等)不同時，對作動負荷產生不均，具有散熱模組的均熱性降低的問題。當散熱模組的均熱性降低時，例如，蒸氣流路之特定部分中的溫度顯著降低而形成貯液，恐怕該蒸氣流路的一部分或全部會失去功能。另一方面，雖然也有想到以凝結部切斷成為蒸氣流路之分隔的毛細結構的方法，但如此會產生如下問題：毛細結構形成之液體流路在途中被遮擋，液體的搬送距離變短，並且也增加毛細結構的數量，使製造性降低。Among them, in order to secure the mechanical strength of the chamber, the capillary structure disposed inside the chamber is sometimes used as a column for holding the shape of the chamber. Such capillary structures respectively contact a pair of opposing inner wall faces of the chamber, partitioning the interior of the chamber, forming vapor flow paths of the evaporated actuating fluid on both sides thereof. However, the vapor flow paths are separately present in the condensation portion, and thus, for example, when the actuation distance (flow path length, etc.) of the vapor flow path is different, the actuation load is uneven, and the heat dissipation of the heat dissipation module is lowered. The problem. When the heat dissipation of the heat dissipation module is lowered, for example, the temperature in a specific portion of the vapor flow path is remarkably lowered to form a liquid storage, and some or all of the vapor flow path may lose its function. On the other hand, there is a method in which the capillary structure which is a partition of the vapor flow path is cut by the condensation portion. However, there is a problem in that the liquid flow path formed by the capillary structure is blocked in the middle, and the liquid transport distance is shortened. Also, the number of capillary structures is increased, and the manufacturability is lowered.

有鑑於上述情況，以下，針對可確保薄型容室的機械強度，並且抑制蒸氣流路之作動負荷的不均的散熱模組(蒸汽腔室)進行說明。In view of the above, a heat dissipation module (steam chamber) that can ensure the mechanical strength of the thin chamber and suppress the uneven operation load of the vapor flow path will be described below.

圖1是本實施形態之蒸汽腔室1的平截面圖。圖2是圖1所示之蒸汽腔室1之II-II箭頭方向視角的截面圖。圖3是圖1所示之蒸汽腔室1之III-III箭頭方向視角的截面圖。Fig. 1 is a plan sectional view showing a steam chamber 1 of the present embodiment. Figure 2 is a cross-sectional view of the vapor chamber 1 of Figure 1 taken along the line II-II of the arrow. Figure 3 is a cross-sectional view of the vapor chamber 1 of Figure 1 taken along the line III-III of the arrow.

(方向定義)
本說明書中，將薄型之蒸汽腔室的厚度方向，即後述之內壁面14、15彼此對向的方向稱為「對向方向」。將與對向方向正交之一方向(圖1的左右方向)稱為「左右方向」。與對向方向及左右方向之雙方正交的方向稱為前後方向。又，從對向方向觀看稱為「平面視角」，將與對向方向正交的截面圖稱為「平截面圖」。(direction definition)
In the present specification, the direction in which the thickness direction of the thin steam chamber, that is, the inner wall surfaces 14, 15 which will be described later, is referred to as the "opposing direction". One direction orthogonal to the opposite direction (the horizontal direction in FIG. 1) is referred to as "left-right direction". The direction orthogonal to both the opposite direction and the left-right direction is referred to as the front-rear direction. Further, the view from the opposite direction is referred to as a "planar view", and the cross-sectional view orthogonal to the opposite direction is referred to as a "flat view".

蒸汽腔室1是利用作動流體的潛熱的熱輸送元件。該蒸汽腔室1是如圖1所示，具有：將作動流體封入內部的容室2、及配置於容室2之內部的毛細結構3。The steam chamber 1 is a heat transporting element that utilizes latent heat of the actuating fluid. As shown in FIG. 1, the vapor chamber 1 has a chamber 2 for enclosing an operating fluid, and a capillary structure 3 disposed inside the chamber 2.

作動流體是周知之可相變化的熱輸送媒體，在容室2內進行相變化成液相與氣相。例如，作動流體可採用水(純水)或酒精或氨等。再者，在本說明書中，有時候將液相的作動流體記載為「液體」，將氣相的作動流體記載為「蒸氣」來進行說明。又，若液相與氣相沒有特別區別的話，有時候則記載為作動流體。又，作動流體未圖示。The actuating fluid is a well-known phase-changeable heat transport medium that undergoes a phase change into a liquid phase and a gas phase in the chamber 2. For example, the working fluid may be water (pure water) or alcohol or ammonia. In the present specification, the operating fluid in the liquid phase is sometimes referred to as "liquid", and the operating fluid in the gas phase is sometimes referred to as "vapor". Further, if the liquid phase and the gas phase are not particularly different, they are sometimes described as an actuating fluid. Further, the operating fluid is not shown.

容室2是密閉的中空容器，形成為左右方向及前後方向的尺寸比厚度方向(對向方向)的尺寸還大的扁平形狀。容室2的厚度為例如0.3mm~3mm左右。又，容室2在平面視角下形成為略長方形。於該容室2設定有：使已封入之作動流體蒸發的蒸發部4、及使該已蒸發的作動流體凝結的凝結部5。在本實施形態中，蒸發部4設定在圖1中紙面左上方之容室2的角落。The chamber 2 is a closed hollow container, and is formed into a flat shape in which the dimension in the left-right direction and the front-rear direction is larger than the dimension in the thickness direction (opposing direction). The thickness of the chamber 2 is, for example, about 0.3 mm to 3 mm. Further, the chamber 2 is formed in a substantially rectangular shape in a plan view. The chamber 2 is provided with an evaporation unit 4 that evaporates the enclosed operating fluid, and a condensation unit 5 that condenses the evaporated operating fluid. In the present embodiment, the evaporation portion 4 is set at the corner of the chamber 2 on the upper left side of the paper surface in Fig. 1 .

所謂蒸發部4，是從熱源100受熱的區域。再者，蒸發部4不僅從與熱源100之外形(實裝面積)相同區域受熱，也從比其外形大一圈的區域受熱。另一方面，所謂凝結部5，是設定在蒸發部4周圍的區域，且是蒸發部4以外的區域。再者，熱源100是電子機器的電子零件，可列舉例如CPU(Central Processing Unit)等。The evaporation unit 4 is a region that is heated from the heat source 100. Further, the evaporation portion 4 receives heat not only from the same region as the heat source 100 (the mounting area) but also from a region slightly larger than the outer shape. On the other hand, the condensation portion 5 is a region set around the evaporation portion 4 and is a region other than the evaporation portion 4. In addition, the heat source 100 is an electronic component of an electronic device, and a CPU (Central Processing Unit) etc. are mentioned, for example.

容室2具有：容室本體10、圖2所示之頂板11、及底板12。容室本體10可由例如銅、銅合金、鋁合金等形成。又，頂板11及底板12可由例如銅、銅合金、鋁、鋁合金、鐵、不鏽鋼、銅與不鏽鋼的複合材(Cu-SUS)、以銅夾入不鏽鋼的複合材(Cu-SUS-Cu)、鎳與不鏽鋼的複合材(Ni-SUS)、以鎳夾入不鏽鋼的複合材(Ni-SUS-Ni)等形成。The chamber 2 has a chamber body 10, a top plate 11 as shown in FIG. 2, and a bottom plate 12. The chamber body 10 may be formed of, for example, copper, a copper alloy, an aluminum alloy, or the like. Further, the top plate 11 and the bottom plate 12 may be made of, for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, a composite material of copper and stainless steel (Cu-SUS), and a composite material of copper (Cu-SUS-Cu) sandwiched between copper and copper. A composite material of nickel and stainless steel (Ni-SUS), a composite material (Ni-SUS-Ni) in which nickel is sandwiched between stainless steel, or the like.

若由熱傳導率比頂板11及底板12高的材料形成容室本體10時，頂板11及底板12宜為硬度高的材料，以防止容室2的變形。例如，若由熱傳導率高的銅形成容室本體10時，頂板11及底板12宜由銅與不鏽鋼的複合材(Cu-SUS)、以銅夾入不鏽鋼的複合材(Cu-SUS-Cu)、鎳與不鏽鋼的複合材(Ni-SUS)、以鎳夾入不鏽鋼的複合材(Ni-SUS-Ni)等形成。When the chamber body 10 is formed of a material having a higher thermal conductivity than the top plate 11 and the bottom plate 12, the top plate 11 and the bottom plate 12 are preferably made of a material having a high hardness to prevent deformation of the chamber 2. For example, when the chamber body 10 is formed of copper having a high thermal conductivity, the top plate 11 and the bottom plate 12 are preferably made of a composite material of copper and stainless steel (Cu-SUS) and a composite material of copper (Cu-SUS-Cu) sandwiched between copper and copper. A composite material of nickel and stainless steel (Ni-SUS), a composite material (Ni-SUS-Ni) in which nickel is sandwiched between stainless steel, or the like.

再者，頂板11及底板12可由相同材料形成，亦可由不同材料形成。又，頂板11及底板12可為相同厚度，亦可為不同的厚度。又，頂板11及底板12之任一者亦可與容室本體10一體形成。例如，亦可為如下構成：以壓製成型將頂板11及底板12之任一者進行溝紋加工等，藉此形成兼具圖1所示之容室本體10的框部10a及柱部10b的構件，並將另一者與其接合，藉此而形成容室2。Furthermore, the top plate 11 and the bottom plate 12 may be formed of the same material or may be formed of different materials. Moreover, the top plate 11 and the bottom plate 12 may have the same thickness or different thicknesses. Further, either of the top plate 11 and the bottom plate 12 may be integrally formed with the chamber body 10. For example, it is also possible to form a frame portion 10a and a column portion 10b having the chamber body 10 shown in Fig. 1 by performing a groove processing or the like on the top plate 11 and the bottom plate 12 by press molding. The member is joined to the other, thereby forming the chamber 2.

容室本體10是如圖1所示，具有：形成容室2之外形的框部10a、及配置在被框部10a包圍之區域的複數個柱部10b。複數個柱部10b在左右方向(容室2之短邊方向)上隔著固定的間隔來配置，且朝前後方向(容室2之長邊方向)平行地延伸。在框部10a與柱部10b之間、及相鄰的柱部10b彼此之間，形成有間隙，該間隙成為配置毛細結構3的通道13。本實施形態的通道13形成4個。As shown in FIG. 1, the chamber body 10 has a frame portion 10a that forms an outer shape of the chamber 2, and a plurality of column portions 10b that are disposed in a region surrounded by the frame portion 10a. The plurality of column portions 10b are arranged at a fixed interval in the left-right direction (the short-side direction of the chamber 2), and extend in parallel in the front-rear direction (longitudinal direction of the chamber 2). A gap is formed between the frame portion 10a and the column portion 10b and between the adjacent column portions 10b, and the gap serves as a passage 13 in which the capillary structure 3 is disposed. Four channels 13 are formed in this embodiment.

通道13是如圖2所示，由容室2之其中一方的內壁面14(第1內壁面)、與內壁面14對向之容室2之另一方的內壁面15(第2內壁面)、及連接一對內壁面14、15之間的連接面16所形成。本實施形態之容室2成為例如從底板12側接收熱源100之熱的構成。底板12的上表面成為內壁面14，頂板11的下表面成為內壁面15，柱部10b的側面(或圖1所示之框部10a的內側面10a1)成為連接面16。As shown in FIG. 2, the channel 13 is the inner wall surface 14 (the first inner wall surface) of one of the chambers 2 and the other inner wall surface 15 (the second inner wall surface) of the chamber 2 facing the inner wall surface 14. And a connecting surface 16 connecting the pair of inner wall surfaces 14, 15 is formed. The chamber 2 of the present embodiment has a configuration in which heat of the heat source 100 is received from the bottom plate 12 side, for example. The upper surface of the bottom plate 12 serves as the inner wall surface 14, and the lower surface of the top plate 11 serves as the inner wall surface 15, and the side surface of the column portion 10b (or the inner side surface 10a1 of the frame portion 10a shown in Fig. 1) serves as the joint surface 16.

柱部10b連接於一對內壁面14、15的雙方。柱部10b連接於內壁面14、15的形態在圖2之例中，是柱部10b與頂板11及底板12為個別的個體，柱部10b的上端與頂板11接觸，柱部10b的下端與底板12接觸。但，柱部10b連接於內壁面14、15的形態，亦可是柱部10b與頂板11或底板12為一體。例如，亦可在頂板11及底板12當中之其中一方，設置朝另一方突出的突部，而將該突部作為柱部10b。此種情況下，藉將柱部10b的前端接觸於內壁面14或內壁面15，柱部10b連接於內壁面14、15。又，前述突部亦可藉由將頂板11或底板12進行拉伸加工來形成。若藉由拉伸加工形成突部(柱部10b)時，平截面圖中之柱部10b的形狀成為如圖4A、圖5A、圖6A所示的形狀。The column portion 10b is connected to both of the pair of inner wall surfaces 14, 15. In the example of Fig. 2, the column portion 10b is connected to the inner wall surfaces 14 and 15, and the column portion 10b and the top plate 11 and the bottom plate 12 are individual members. The upper end of the column portion 10b is in contact with the top plate 11, and the lower end of the column portion 10b is The bottom plate 12 is in contact. However, the column portion 10b is connected to the inner wall surfaces 14, 15, or the column portion 10b may be integrated with the top plate 11 or the bottom plate 12. For example, one of the top plate 11 and the bottom plate 12 may be provided with a protrusion that protrudes toward the other side, and the protrusion may be the column portion 10b. In this case, the column portion 10b is connected to the inner wall surfaces 14, 15 by contacting the front end of the column portion 10b with the inner wall surface 14 or the inner wall surface 15. Further, the protrusion may be formed by drawing the top plate 11 or the bottom plate 12. When the projection (column portion 10b) is formed by the drawing process, the shape of the column portion 10b in the plan cross-sectional view is as shown in Figs. 4A, 5A, and 6A.

於溝槽13，如圖1所示，配置有毛細結構3。在蒸發部4中，液體蒸發後成為蒸氣，朝凝結部5前進。毛細結構3使在凝結部5內中凝結而成為液相的作動流體利用毛細管力而從凝結部5朝蒸發部4移動(回流)。本實施形態的毛細結構3是由例如將複數個細線編成格子狀的網眼所形成。形成毛細結構3的細線，可適宜使用例如熱傳導率高的銅材。該細線是例如直徑為數十μm~一百數十幾μm。In the groove 13, as shown in Fig. 1, a capillary structure 3 is disposed. In the evaporation unit 4, the liquid evaporates and becomes steam, and proceeds toward the condensation unit 5. In the capillary structure 3, the operating fluid that has condensed in the condensation portion 5 and becomes a liquid phase is moved (reflowed) from the condensation portion 5 toward the evaporation portion 4 by capillary force. The capillary structure 3 of the present embodiment is formed by, for example, a mesh in which a plurality of thin wires are arranged in a lattice shape. For the thin wire forming the capillary structure 3, for example, a copper material having a high thermal conductivity can be suitably used. The thin line is, for example, a diameter of several tens of μm to one hundred and several tens of μm.

毛細結構3具備：配置於框部10a與柱部10b之間的通道13的第1毛細結構部20、及配置於相鄰之柱部10b彼此之間的通道13的第2毛細結構部21。第1毛細結構部20及第2毛細結構部21是一體形成。第1毛細結構部20沿著框部10a的內側面10a1配置成框狀。本實施形態之第2毛細結構部21設置有複數個(第2毛細結構部21a、21b二條)。複數個第2毛細結構部21a、21b是從位於凝結部5之第1毛細結構部20朝前後方向延伸。複數個第2毛細結構部21a、21b分別通過3條相鄰之柱部10b之間的通道13。複數個第2毛細結構部21a、21b的第1端部22分別獨立***至蒸發部4。The capillary structure 3 includes a first capillary structure portion 20 that is disposed in the channel 13 between the frame portion 10a and the column portion 10b, and a second capillary structure portion 21 that is disposed in the channel 13 between the adjacent column portions 10b. The first capillary structure portion 20 and the second capillary structure portion 21 are integrally formed. The first capillary structure portion 20 is arranged in a frame shape along the inner side surface 10a1 of the frame portion 10a. The second capillary structure portion 21 of the present embodiment is provided in plurality (two of the second capillary structure portions 21a and 21b). The plurality of second capillary structure portions 21a and 21b extend in the front-rear direction from the first capillary structure portion 20 located in the condensation portion 5. The plurality of second capillary structures 21a and 21b respectively pass through the passage 13 between the three adjacent column portions 10b. The first end portions 22 of the plurality of second capillary structure portions 21a and 21b are independently inserted into the evaporation portion 4.

毛細結構3是如圖2所示，接觸於容室2之對向的一對內壁面14、15。形成於毛細結構3與內壁面14及內壁面15之界面的間隙18a，成為使液體流動的液體流路18，使液體從凝結部5往蒸發部4回流。又，毛細結構3之內部之細線的間隙18b也成為使液體流動的液體流路18，使液體從凝結部5往蒸發部4回流。再者，細線的間隙18b的空間比形成於毛細結構3與內壁面14及內壁面15之界面的間隙18a還小，因此間隙18a之液體流路18會比間隙18b之液體流路18的液體搬送能力還大。The capillary structure 3 is a pair of inner wall faces 14, 15 which are in contact with the opposing faces of the chamber 2 as shown in FIG. The gap 18a formed at the interface between the capillary structure 3 and the inner wall surface 14 and the inner wall surface 15 serves as a liquid flow path 18 through which the liquid flows, and causes the liquid to flow back from the condensation portion 5 to the evaporation portion 4. Further, the gap 18b of the thin line inside the capillary structure 3 also serves as a liquid flow path 18 through which the liquid flows, and the liquid is returned from the condensation portion 5 to the evaporation portion 4. Further, the space of the gap 18b of the thin line is smaller than the gap 18a formed at the interface between the capillary structure 3 and the inner wall surface 14 and the inner wall surface 15, so that the liquid flow path 18 of the gap 18a is larger than the liquid of the liquid flow path 18 of the gap 18b. The transfer capacity is still large.

在毛細結構3的側面3a、與相對該側面3a隔有空間地配置之連接面16之間，形成作動流體的蒸氣流路17。第2毛細結構部21配置於相鄰之柱部10b的中間位置，成為容室2之中空部(溝槽13)中之保持形狀的柱。該第2毛細結構部21接觸於一對內壁面14、15而分隔容室2的內部，於其兩側形成有蒸氣流路17。再者，第1毛細結構部20也如圖1所示，沿著框部10a的內側面10a1配置，成為容室2之外圈之中空部(溝槽13)中保持形狀的柱，於其單側(框內側)形成有蒸氣流路17。A vapor flow path 17 for the working fluid is formed between the side surface 3a of the capillary structure 3 and the connection surface 16 which is disposed with the space between the side surface 3a and the space. The second capillary structure portion 21 is disposed at an intermediate position between the adjacent column portions 10b, and serves as a column that retains the shape in the hollow portion (groove 13) of the chamber 2. The second capillary structure portion 21 is in contact with the pair of inner wall surfaces 14 and 15 to partition the inside of the chamber 2, and a vapor flow path 17 is formed on both sides thereof. Further, as shown in FIG. 1, the first capillary structure portion 20 is disposed along the inner side surface 10a1 of the frame portion 10a, and serves as a column that retains a shape in a hollow portion (groove 13) of the outer ring of the chamber 2, and A vapor flow path 17 is formed on one side (inside of the frame).

在本實施形態中，如圖1所示，藉由2條第2毛細結構部21(21a、21b)，容室2的內部(更具體而言是第1毛細結構部20之框內側的空間)分隔成3個空間，且於容室2的內部形成有3個蒸氣流路17(17a、17b、17c)。3個蒸氣流路17分別獨立而從蒸發部4朝向凝結部5延伸。In the present embodiment, as shown in FIG. 1, the inside of the chamber 2 (more specifically, the space inside the frame of the first capillary structure portion 20) is formed by the two second capillary structure portions 21 (21a, 21b). The partition is divided into three spaces, and three vapor flow paths 17 (17a, 17b, 17c) are formed inside the chamber 2. The three vapor flow paths 17 are independent from each other and extend from the evaporation portion 4 toward the condensation portion 5.

蒸氣流路17a在3個蒸氣流路17之中，從蒸發部4到凝結部5側之端部17a1的流路長度(作動距離)最短。該蒸氣流路17a從蒸發部4沿著前後方向呈直線狀延伸。再者，在蒸氣流路17a之長邊方向上延伸之直線部配置有柱部10b。Among the three vapor flow paths 17, the vapor flow path 17a has the shortest flow path length (actuation distance) from the evaporation portion 4 to the end portion 17a1 on the condensation portion 5 side. The vapor flow path 17a extends linearly from the evaporation portion 4 in the front-rear direction. Further, a column portion 10b is disposed in a straight portion extending in the longitudinal direction of the vapor flow path 17a.

蒸氣流路17b在3個蒸氣流路17之中，從蒸發部4到凝結部5側之端部17b1的流路長度(作動距離)是第2短。該蒸氣流路17b是從蒸發部4延伸到左右方向的中間位置後，朝前後方向屈曲，沿著前後方向呈直線狀延伸。再者，在蒸氣流路17b之長邊方向上延伸之直線部，也配置有柱部10b。Among the three vapor flow paths 17 of the vapor flow path 17b, the flow path length (actuation distance) from the evaporation portion 4 to the end portion 17b1 on the condensation portion 5 side is the second short. The vapor flow path 17b extends from the evaporation portion 4 to an intermediate position in the left-right direction, and then flexes in the front-rear direction and linearly extends in the front-rear direction. Further, a column portion 10b is also disposed in a straight portion extending in the longitudinal direction of the vapor flow path 17b.

蒸氣流路17c在3個蒸氣流路17之中，從蒸發部4到凝結部5側之端部17c1的流路長度(作動距離)為最長。該蒸氣流路17b從蒸發部4延伸到左右方向中之容室2的端部後，朝前後方向屈曲，沿著前後方向呈直線狀延伸。再者，在蒸氣流路17c之長邊方向上延伸之直線部，也配置有柱部10b。Among the three vapor flow paths 17 of the vapor flow path 17c, the flow path length (actuation distance) from the evaporation portion 4 to the end portion 17c1 on the condensation portion 5 side is the longest. The vapor flow path 17b extends from the evaporation portion 4 to the end portion of the chamber 2 in the left-right direction, and then flexes in the front-rear direction and linearly extends in the front-rear direction. Further, a column portion 10b is also disposed in a straight portion extending in the longitudinal direction of the vapor flow path 17c.

在毛細結構3，形成有使複數個蒸氣流路17當中至少2個蒸氣流路17之間連通的連通部30。連通部30形成於第2毛細結構部21的基部23。所謂基部23，是第2毛細結構部21當中連接於第1毛細結構部20的部分。在本實施形態中，連通部30形成有2個。藉由其中一方之連通部30，蒸氣流路17a、17b在凝結部5側之端部17a1、17b1中是互為連通。又，藉由另一方之連通部30，蒸氣流路17b、17c在凝結部5側之端部17b1、17c1中互為連通。如此，在本實施形態中，連通部30分別形成於成為蒸氣流路17之分隔的2條第2毛細結構部21，3個蒸氣流路17全部是連通的。In the capillary structure 3, a communication portion 30 that communicates between at least two of the plurality of vapor flow paths 17 is formed. The communication portion 30 is formed in the base portion 23 of the second capillary structure portion 21. The base portion 23 is a portion that is connected to the first capillary structure portion 20 among the second capillary structure portions 21. In the present embodiment, two communication portions 30 are formed. The vapor passages 17a and 17b communicate with each other in the end portions 17a1 and 17b1 on the side of the condensation portion 5 by the communication portion 30 of one of the communicating portions 30. Moreover, the vapor passages 17b and 17c communicate with each other in the end portions 17b1 and 17c1 on the side of the condensation portion 5 by the other communication portion 30. As described above, in the present embodiment, the communication portions 30 are respectively formed in the two second capillary structure portions 21 which are partitions of the vapor flow path 17, and all of the three vapor flow paths 17 are in communication.

本實施形態之連通部30如圖3所示，藉由形成於毛細結構3(第2毛細結構部21)的凹部24形成。凹部24是從一對內壁面14、15之任一者(本實施形態中為內壁面15)朝向另一者(本實施形態中為內壁面14)，朝對向方向凹陷。本實施形態中，將連通部30(凹部24)之對向方向中的尺寸稱為「間隙D」。間隙D在一對內壁面14、15的對向方向中，是毛細結構3之厚度T的20%~50%的大小。毛細結構3的厚度T是例如0.2mm~1.0mm左右。假設毛細結構3的厚度T為0.5mm，間隙D為0.10mm~0.25mm的大小。As shown in FIG. 3, the communication portion 30 of the present embodiment is formed by a concave portion 24 formed in the capillary structure 3 (second capillary structure portion 21). The recessed portion 24 is formed from one of the pair of inner wall surfaces 14 and 15 (the inner wall surface 15 in the present embodiment) toward the other (in the present embodiment, the inner wall surface 14), and is recessed in the opposing direction. In the present embodiment, the dimension in the opposing direction of the communicating portion 30 (the recess 24) is referred to as "gap D". The gap D is 20% to 50% of the thickness T of the capillary structure 3 in the opposing direction of the pair of inner wall faces 14, 15. The thickness T of the capillary structure 3 is, for example, about 0.2 mm to 1.0 mm. It is assumed that the thickness T of the capillary structure 3 is 0.5 mm, and the gap D is a size of 0.10 mm to 0.25 mm.

根據如此的凹部24，可不切斷毛細結構3而形成連通部30。毛細結構3可保持與一對內壁面14、15之至少一方(本實施形態中為內壁面14)的接觸狀態。再者，第2毛細結構部21之長邊方向上的凹部24的寬度W具有間隙D以上的大小。寬度W藉由在毛細結構3形成凹部24的方法(加工工具等)，變得比間隙D大數倍~十數倍。如此之凹部24可藉將例如毛細結構3的一部分在對向方向(厚度方向)壓製而形成。又，凹部24也可藉例如將毛細結構3的一部分部分地切削而形成。According to such a recessed part 24, the communicating portion 30 can be formed without cutting the capillary structure 3. The capillary structure 3 can be kept in contact with at least one of the pair of inner wall surfaces 14 and 15 (in the present embodiment, the inner wall surface 14). In addition, the width W of the concave portion 24 in the longitudinal direction of the second capillary structure portion 21 has a size equal to or larger than the gap D. The width W is several times to ten times larger than the gap D by the method (machining tool or the like) in which the concave portion 24 is formed in the capillary structure 3. Such a recess 24 can be formed by, for example, pressing a part of the capillary structure 3 in the opposite direction (thickness direction). Further, the concave portion 24 may be formed by, for example, partially cutting a part of the capillary structure 3.

接著，就上述構成之蒸汽腔室1構成的熱輸送循環進行說明。
蒸汽腔室1藉由接收在熱源100產生的熱，蒸發部4內的液體蒸發。在蒸發部4中，滲透於毛細結構3的液體會蒸發。在蒸發部4產生的蒸氣朝向壓力及溫度比蒸發部4低的凝結部5，在蒸氣流路17內流動。在凝結部5中，經由蒸氣流路17到達凝結部5的蒸氣被冷卻而凝結。在凝結部5產生的液體滲透於毛細結構3，並從凝結部5往蒸發部4回流。Next, a heat transfer cycle constituted by the steam chamber 1 having the above configuration will be described.
The vapor chamber 1 evaporates by the heat generated in the heat source 100 and the liquid in the evaporation portion 4. In the evaporation portion 4, the liquid that permeates the capillary structure 3 evaporates. The vapor generated in the evaporation portion 4 flows in the vapor flow path 17 toward the condensation portion 5 whose pressure and temperature are lower than that of the evaporation portion 4. In the condensation portion 5, the vapor that has reached the condensation portion 5 via the vapor flow path 17 is cooled and condensed. The liquid generated in the condensation portion 5 permeates into the capillary structure 3 and flows back from the condensation portion 5 to the evaporation portion 4.

毛細結構3從凝結部5延伸到蒸發部4，利用由圖2所示之間隙18a、18b形成之液體流路18，使液體從凝結部5往蒸發部4回流。又，毛細結構3從凝結部5到蒸發部4，與容室2之對向的一對內壁面14、15接觸，因此成為支撐容室2的柱(補強構件)，確保薄型之蒸汽腔室1的機械強度。The capillary structure 3 extends from the condensing portion 5 to the evaporation portion 4, and the liquid is circulated from the condensing portion 5 to the evaporation portion 4 by the liquid flow path 18 formed by the gaps 18a, 18b shown in Fig. 2 . Further, since the capillary structure 3 comes into contact with the pair of inner wall surfaces 14, 15 opposed to the chamber 2 from the condensation portion 5 to the evaporation portion 4, it becomes a column (reinforcing member) for supporting the chamber 2, and ensures a thin steam chamber. 1 mechanical strength.

然而，在如此的構造中，由於毛細結構3成為分隔，其兩側之蒸氣流路17內的蒸氣難以在彼此的流路中往來。又，如圖1所示，若含有流路長度不同的蒸氣流路17(17a、17b、17c)，容易對作動負荷產生不均，有時候蒸汽腔室1的均熱性會降低。因此，本實施形態中，在毛細結構3(第2毛細結構部21)之一部分形成連通部30，使至少2個蒸氣流路17彼此連通。However, in such a configuration, since the capillary structure 3 is divided, it is difficult for the vapors in the vapor flow paths 17 on both sides to flow in the flow paths of each other. Further, as shown in FIG. 1, when the vapor flow paths 17 (17a, 17b, and 17c) having different flow path lengths are included, it is easy to cause unevenness in the operating load, and sometimes the soaking property of the steam chamber 1 is lowered. Therefore, in the present embodiment, the communication portion 30 is formed in one of the capillary structures 3 (second capillary structure portions 21), and at least two vapor flow paths 17 are communicated with each other.

連通部30如圖3所示，在容室2與毛細結構3之間形成對向方向的間隙D，且隔著毛細結構3，使相鄰的蒸氣流路17內的蒸氣互通。藉此，經由連通部30而連通的蒸氣流路17的壓力或溫度分布成略均一，可消除各蒸氣流路17中的作動負荷不均。因此，蒸汽腔室1可得到高均熱性。又，毛細結構3由於在連通部30中不切斷，而保有與內壁面14的接觸狀態，故在途中液體流路18不被遮擋，可防止液體之搬送性能(搬送距離)降低。又，由於也不需要增加毛細結構3的配置數目，故也可防止蒸汽腔室1之製造容易性降低。As shown in FIG. 3, the communication portion 30 forms a gap D in the opposing direction between the chamber 2 and the capillary structure 3, and intervenes the vapor in the adjacent vapor flow path 17 via the capillary structure 3. Thereby, the pressure or temperature distribution of the vapor flow path 17 that communicates via the communication portion 30 is slightly uniform, and the unevenness of the operation load in each of the vapor flow paths 17 can be eliminated. Therefore, the vapor chamber 1 can be highly uniform in heat. Further, since the capillary structure 3 is kept in contact with the inner wall surface 14 without being cut in the communication portion 30, the liquid flow path 18 is not blocked during the passage, and the liquid transport performance (transport distance) can be prevented from being lowered. Further, since it is not necessary to increase the number of arrangement of the capillary structures 3, it is possible to prevent the ease of manufacture of the vapor chamber 1 from being lowered.

又，本實施形態中，如圖1所示，連通部30是使複數個蒸氣流路17當中至少包含流路長度最長的蒸氣流路17c的2個蒸氣流路17b、17c之間連通。流路長度較長的蒸氣流路17c中，由於蒸氣流路17的作動距離也比其他蒸氣流路17a、17b長，故作動負荷特別容易不均。藉使如此之蒸氣流路17c與其他蒸氣流路17b連通，可有效地消除作動負荷的不均。In the present embodiment, as shown in FIG. 1, the communication portion 30 communicates between the two vapor flow paths 17b and 17c including at least the vapor flow path 17c having the longest flow path length among the plurality of vapor flow paths 17. In the vapor flow path 17c having a long flow path length, since the operating distance of the vapor flow path 17 is longer than that of the other vapor flow paths 17a and 17b, the operating load is particularly likely to be uneven. By causing such a vapor flow path 17c to communicate with the other vapor flow path 17b, the unevenness of the actuation load can be effectively eliminated.

又，蒸氣流路17c中，凝結部5側之端部17c1中的壓力及溫度明顯容易降低，相較於其他蒸氣流路17a、17b也容易形成貯液。因此，藉於蒸氣流路17c的端部17c1配置連通部30，可有效地抑制端部17c1中的貯液。再者，該效果在其他蒸氣流路17a、17b中也同樣地得到。又，若藉由壓製形成連通部30(凹部24)，連通部30中的毛細結構3(第2毛細結構部21)的密度有一部分會變高，該部分中之液體的壓力損失會變高。然而，該連通部30配置於第2毛細結構部21的基部23，對於第2毛細結構部21中之液體的搬送性能整體的影響較小。Further, in the vapor flow path 17c, the pressure and temperature in the end portion 17c1 on the side of the condensation portion 5 are remarkably lowered, and the liquid storage is easily formed as compared with the other vapor flow paths 17a and 17b. Therefore, by arranging the communication portion 30 at the end portion 17c1 of the vapor flow path 17c, the liquid storage in the end portion 17c1 can be effectively suppressed. Further, this effect is similarly obtained in the other vapor flow paths 17a and 17b. Further, when the communication portion 30 (the concave portion 24) is formed by pressing, the density of the capillary structure 3 (the second capillary structure portion 21) in the communication portion 30 is partially increased, and the pressure loss of the liquid in the portion is increased. . However, the communication portion 30 is disposed on the base portion 23 of the second capillary structure portion 21, and has little influence on the overall transport performance of the liquid in the second capillary structure portion 21.

為了評價蒸汽腔室1的性能，製作了如圖4A、圖4B所示之試驗裝置。圖4A所示之蒸汽腔室1’為比較例，未形成有連通部30。比較例的蒸汽腔室’是為了與形成有連通部30之蒸汽腔室1比較性能而製作。在該蒸汽腔室1’，藉由毛細結構3形成有流路長度不同的5個蒸氣流路17a~17e。In order to evaluate the performance of the vapor chamber 1, a test apparatus as shown in Figs. 4A and 4B was fabricated. The vapor chamber 1' shown in Fig. 4A is a comparative example, and the communication portion 30 is not formed. The vapor chamber ' of the comparative example was fabricated for comparison with the steam chamber 1 in which the communication portion 30 was formed. In the steam chamber 1', five vapor flow paths 17a to 17e having different flow path lengths are formed by the capillary structure 3.

再者，圖4A所示之蒸汽腔室1’與上述之圖1所示的實施形態不同，毛細結構3不僅沿著框部10a，也沿著柱部10b配置。即，在毛細結構3與柱部10b之間，未形成有蒸氣流路17。蒸汽腔室1’中，蒸氣流路17是形成於藉被毛細結構3分隔之毛細結構3與毛細結構3之間的空間。再者，後述之圖5A及圖6A所示的形態中也同樣，蒸氣流路17形成於毛細結構3與毛細結構3之間的空間。Further, the steam chamber 1' shown in Fig. 4A is different from the embodiment shown in Fig. 1 described above, and the capillary structure 3 is disposed not only along the frame portion 10a but also along the column portion 10b. That is, the vapor flow path 17 is not formed between the capillary structure 3 and the column portion 10b. In the vapor chamber 1', the vapor flow path 17 is formed in a space between the capillary structure 3 separated by the capillary structure 3 and the capillary structure 3. Further, in the embodiment shown in FIGS. 5A and 6A to be described later, the vapor flow path 17 is formed in a space between the capillary structure 3 and the capillary structure 3.

試驗裝置是如圖4B所示，成為如下構成：在蒸汽腔室1’之其中一方的板面(例如底板12)安裝熱源100，並在蒸汽腔室1’之另一方的板面(例如頂板11)，安裝複數個溫度感測器T1~T9。溫度感測器T1~T9的配置是如圖4A所示。溫度感測器T4用以計測蒸發部4的溫度。又，溫度感測器T4以外之溫度感測器T1~T9用以計測凝結部5的溫度。又，熱源100的溫度可藉由溫度控制器101調整。As shown in FIG. 4B, the test apparatus has a configuration in which a heat source 100 is mounted on a plate surface (for example, a bottom plate 12) of one of the steam chambers 1', and a plate surface (for example, a top plate) on the other side of the steam chamber 1'. 11) Install a plurality of temperature sensors T1~T9. The configuration of the temperature sensors T1 to T9 is as shown in FIG. 4A. The temperature sensor T4 is used to measure the temperature of the evaporation portion 4. Further, temperature sensors T1 to T9 other than the temperature sensor T4 are used to measure the temperature of the condensation portion 5. Also, the temperature of the heat source 100 can be adjusted by the temperature controller 101.

圖5A所示之蒸汽腔室1’與圖4A所示之蒸汽腔室1’同樣。圖5B是顯示圖5A所示之溫度感測器T1~T9的溫度的試驗結果。如圖5B所示，該蒸汽腔室1’中，相對於溫度感測器T4中之溫度為65.8℃，溫度感測器T8、T9中之溫度降低為53.0℃、59.7℃，溫度之不均比較大。再者，配置有溫度感測器T8、T9的部分，形成有包含流路長度最長的蒸氣流路17d的複數個蒸氣流路17。The vapor chamber 1' shown in Fig. 5A is the same as the vapor chamber 1' shown in Fig. 4A. Fig. 5B is a test result showing the temperatures of the temperature sensors T1 to T9 shown in Fig. 5A. As shown in FIG. 5B, in the steam chamber 1', the temperature in the temperature sensor T4 is 65.8 ° C, and the temperature in the temperature sensors T8, T9 is lowered to 53.0 ° C, 59.7 ° C, and the temperature is uneven. bigger. Further, a portion of the temperature sensors T8 and T9 is disposed, and a plurality of vapor channels 17 including the vapor channel 17d having the longest channel length are formed.

圖6A所示之蒸汽腔室1是為了確認設置連通部30的效果而作成的實施例。如圖6A所示，在實施例之蒸汽腔室1，形成有使諸蒸氣流路17連通的連通部30(凹部24)。連通部30是分別形成於4個第2毛細結構部21的基部(與第1毛細結構部20的連接部)。其他點則與比較例之蒸汽腔室1’同樣。The steam chamber 1 shown in Fig. 6A is an embodiment created to confirm the effect of providing the communication portion 30. As shown in FIG. 6A, in the steam chamber 1 of the embodiment, a communication portion 30 (recess 24) that connects the vapor flow paths 17 is formed. The communication portion 30 is a base portion (a connection portion with the first capillary structure portion 20) that is formed in each of the four second capillary structure portions 21 . The other points are the same as those of the steam chamber 1' of the comparative example.

如圖6B所示，該蒸汽腔室1中，相對於溫度感測器T4中的溫度為65.5℃，溫度感測器T8、T9中的溫度為61.0℃、63.8℃。與比較例之蒸汽腔室1’比較，在實施例的蒸汽腔室1中，顯然溫度不均變小，可知改善了均熱性。即，可知藉由連通部30，配置有溫度感測器T8、T9的部分(包含流路長度較長的蒸氣流路17d的部分)中的作動負荷的不均已經解除。As shown in Fig. 6B, in the vapor chamber 1, the temperature in the temperature sensor T4 is 65.5 ° C, and the temperatures in the temperature sensors T8, T9 are 61.0 ° C, 63.8 ° C. In comparison with the vapor chamber 1' of the comparative example, in the vapor chamber 1 of the embodiment, it is apparent that the temperature unevenness becomes small, and it is understood that the soaking property is improved. In other words, it is understood that the unevenness of the actuation load in the portion where the temperature sensors T8 and T9 are disposed (the portion including the vapor flow path 17d having a long flow path length) has been released by the communication portion 30.

如以上說明，本實施形態之蒸汽腔室1具備有：容室2，具有：作動流體封入至內部，並且使前述作動流體蒸發的蒸發部4；及使前述已蒸發的作動流體凝結的凝結部5；及毛細結構3，是配置於容室2的內部，藉由毛細管力，使已經凝結的作動流體從凝結部5朝蒸發部4移動。毛細結構3是分別接觸於容室2之對向的一對內壁面14、15而將容室2的內部分隔，形成了複數個已經蒸發之作動流體的蒸氣流路17。在毛細結構3形成有使複數個蒸氣流路17當中至少2個蒸氣流路17之間連通的連通部30。連通部30與一對內壁面14、15之至少一方接觸，且於容室2的內部，形成有連接於一對內壁面14、15之雙方的柱部10b。As described above, the steam chamber 1 of the present embodiment includes the chamber 2, the evaporation portion 4 in which the operating fluid is sealed inside and the operating fluid is evaporated, and the condensation portion that condenses the evaporated operating fluid. 5; and the capillary structure 3 is disposed inside the chamber 2, and the actuating fluid that has been condensed is moved from the condensing portion 5 toward the evaporation portion 4 by capillary force. The capillary structure 3 is a pair of inner wall faces 14, 15 which are respectively opposed to the opposing faces of the chamber 2, and partitions the inside of the chamber 2 to form a plurality of vapor flow paths 17 which have evaporated the working fluid. In the capillary structure 3, a communication portion 30 that communicates between at least two of the plurality of vapor flow paths 17 is formed. The communication portion 30 is in contact with at least one of the pair of inner wall surfaces 14 and 15, and a column portion 10b that is connected to both of the pair of inner wall surfaces 14 and 15 is formed inside the chamber 2.

藉由採用如此之構成，可藉由柱部10b確保薄型之容室2的機械強度。進而，藉由連通部30連通諸蒸氣流路17，藉此抑制蒸氣流路17之作動負荷的不均，並得到實現了高均熱性的蒸汽腔室1。By adopting such a configuration, the mechanical strength of the thin chamber 2 can be ensured by the column portion 10b. Further, the communication portion 30 communicates with the vapor flow paths 17, thereby suppressing the unevenness of the operation load of the vapor flow path 17, and obtaining the vapor chamber 1 which realizes high uniformity.

，複數個蒸氣流路17含有流路長度不同之蒸氣流路17a~17c。在流路長度較長的蒸氣流路17b中，比較容易產生蒸氣壓的下降，更容易產生作動負荷的不均。因此如本實施形態，藉以連通部30連通流路長度最長的蒸氣流路17c與其他蒸氣流路17，可更有效地抑制作動負荷的不均。The plurality of vapor flow paths 17 include vapor flow paths 17a to 17c having different flow path lengths. In the vapor flow path 17b having a long flow path length, the vapor pressure is relatively easily lowered, and the unevenness of the actuation load is more likely to occur. Therefore, according to the present embodiment, the communication portion 30 can communicate the vapor flow path 17c having the longest flow path length and the other vapor flow path 17, and the unevenness of the actuation load can be more effectively suppressed.

又，連通部30使蒸氣流路17之凝結部5側的諸端部連通，使蒸氣流路17之諸中間部分不連通。藉由該構成，可使蒸氣流路17中之氣相之作動流體之流動更順暢。Further, the communication portion 30 communicates the end portions on the side of the condensation portion 5 of the vapor flow path 17 so that the intermediate portions of the vapor flow path 17 do not communicate. According to this configuration, the flow of the working fluid in the vapor phase in the vapor flow path 17 can be made smoother.

又，連通部30使蒸氣流路17之凝結部5側的端部之間連通，使蒸氣流路17之蒸發部4側之端部之間不連通。如此，藉僅使凝結部5側之端部之間連通，在容易產生作動負荷的不均的凝結部附近，可有效地抑制作動負荷的不均。Further, the communication portion 30 communicates between the end portions on the side of the condensation portion 5 of the vapor flow path 17, and the end portions of the vapor flow path 17 on the side of the evaporation portion 4 do not communicate with each other. In this way, by merely connecting the end portions on the side of the condensation portion 5, it is possible to effectively suppress the unevenness of the actuation load in the vicinity of the condensation portion where the operation load is likely to be uneven.

又，如圖6A所示，在毛細結構3與柱部10b之間，亦可不形成蒸氣流路。此種情況下，可抑制接觸柱部10b之氣體(氣相之作動流體)凝結而成為液體。再者，接觸柱部10b之氣體凝結而成為液體時，有時候液體會無法回到毛細結構3，連帶冷卻效率降低。也就是說，藉在毛細結構3與柱部10b之間不形成蒸氣流路，可抑制如此之現象的發生，並可防止冷卻效率低下。Further, as shown in FIG. 6A, a vapor flow path may not be formed between the capillary structure 3 and the column portion 10b. In this case, it is possible to suppress the gas (the working fluid in the gas phase) contacting the column portion 10b from being condensed to become a liquid. Further, when the gas contacting the column portion 10b is condensed to become a liquid, sometimes the liquid cannot return to the capillary structure 3, and the cooling efficiency is lowered. That is, by not forming a vapor flow path between the capillary structure 3 and the column portion 10b, occurrence of such a phenomenon can be suppressed, and cooling efficiency can be prevented from being lowered.

又，如圖1、圖6A所示，亦可在毛細結構3與框部10a之間，形成有非蒸氣流路的間隙。此種情況下，即使在毛細結構3與容室本體10之間有熱膨脹係數的差，亦可抑制因為加熱而毛細結構3熱膨脹，而壓迫到容室本體10(框部10a)。因此，可抑制容室本體10變形，並且可抑制容室本體10產生龜裂等而作動流體漏出。Further, as shown in FIG. 1 and FIG. 6A, a gap of a non-vapor flow path may be formed between the capillary structure 3 and the frame portion 10a. In this case, even if there is a difference in thermal expansion coefficient between the capillary structure 3 and the chamber body 10, the thermal expansion of the capillary structure 3 due to heating can be suppressed, and the chamber body 10 (frame portion 10a) can be pressed. Therefore, it is possible to suppress the deformation of the chamber body 10, and it is possible to suppress the occurrence of cracks or the like in the chamber body 10 and to cause the fluid to leak.

以上，已記載本發明之較佳實施形態並加以說明，但該等是例示本發明，應可理解不應被認為是用以限定者。可在不脫離本發明之範圍之下進行追加、省略、置換及其他變更。因此，本發明不應被視為受前述說明所限定，而是由申請專利範圍來限制。The preferred embodiments of the present invention have been described and illustrated in the foregoing, but are to be construed as illustrative. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Therefore, the invention should not be construed as limited by the foregoing description, but by the scope of the claims.

例如，可採用圖7A~圖9所示的變形例。在以下的說明中，就與上述之實施形態相同或同等的構成則賦與相同標號，並簡略或省略其說明。For example, a modification shown in FIGS. 7A to 9 can be employed. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

圖7A~圖7C所示之蒸汽腔室1A~1C是由毛細結構3配置於容室2之中央的1個溝槽13構成的單純構造。
在圖7A所示之蒸汽腔室1A中，蒸發部4配置於前後方向(容室2之長邊方向)的一端部，且蒸氣流路17a、17b從蒸發部4朝向前後方向之另一端部延伸。而且，蒸氣流路17a、17b之端部17a1、17b1是藉由形成於毛細結構3之另一端部的連通部30(凹部24)連通。通常，如此之構造中，作動負荷的不均會成為問題的情況較少，但即使是例如在蒸氣流路17a、17b之任一方之途中產生貯液的情況，由於是經常將蒸氣送到容室2之整體，故設置連通部30是有效的。The vapor chambers 1A to 1C shown in FIGS. 7A to 7C are simple structures composed of one groove 13 in which the capillary structure 3 is disposed at the center of the chamber 2.
In the steam chamber 1A shown in FIG. 7A, the evaporation portion 4 is disposed at one end portion in the front-rear direction (longitudinal direction of the chamber 2), and the vapor flow paths 17a, 17b are directed from the evaporation portion 4 toward the other end portion in the front-rear direction. extend. Further, the end portions 17a1, 17b1 of the vapor flow paths 17a, 17b are communicated by the communication portion 30 (the recess portion 24) formed at the other end portion of the capillary structure 3. In general, in such a configuration, the unevenness of the operating load may be a problem. However, even if the liquid is generated on the way of either of the vapor flow paths 17a and 17b, for example, the steam is often supplied to the volume. Since the entire chamber 2 is provided, it is effective to provide the communication portion 30.

在圖7B所示之蒸汽腔室1B中，蒸發部4配置於與前後方向(容室2之長邊方向)之中央錯開的位置。蒸氣流路17a、17b從蒸發部4朝向前後方向之另一端部延伸，並且蒸氣流路17c、17d從蒸發部4朝向前後方向的一端部延伸。而且，蒸氣流路17a、17b之端部17a1、17b1是藉由形成於毛細結構3之另一端部的連通部30(凹部24)而連通，並且蒸氣流路17c、17d之端部17c1,17d1是藉由形成於毛細結構3之一端部的連通部30(凹部24)而連通。如此，當蒸發部4的位置配置在與前後方向之中央錯開的位置時，會因為蒸氣流路17a、17b與蒸氣流路17c、17d而產生作動負荷的不均。因此，設置連通部30有效的。In the steam chamber 1B shown in FIG. 7B, the evaporation portion 4 is disposed at a position shifted from the center in the front-rear direction (longitudinal direction of the chamber 2). The vapor flow paths 17a and 17b extend from the evaporation portion 4 toward the other end portion in the front-rear direction, and the vapor flow paths 17c and 17d extend from the evaporation portion 4 toward one end portion in the front-rear direction. Further, the end portions 17a1, 17b1 of the vapor flow paths 17a, 17b are communicated by the communication portion 30 (recess 24) formed at the other end portion of the capillary structure 3, and the end portions 17c1, 17d1 of the vapor flow paths 17c, 17d are connected. It is communicated by the communication portion 30 (the recess 24) formed at one end of the capillary structure 3. As described above, when the position of the evaporation portion 4 is placed at a position shifted from the center in the front-rear direction, unevenness in the operating load occurs due to the vapor flow paths 17a and 17b and the vapor flow paths 17c and 17d. Therefore, it is effective to provide the communication portion 30.

在圖7C所示之蒸汽腔室1C中，蒸發部4之配置和內部構造與圖7B所示之蒸汽腔室1B同樣，但在蒸發部4中也於毛細結構3形成有凹部24a(第2凹部)。凹部24a藉加大蒸發部4中之毛細結構3的表面積，並確保大幅作動流體的蒸發面積，具有使蒸發部4的熱阻降低的效果。再者，在凹部24a中，也與配置在凝結部5的凹部24(連通部30)同樣，使蒸氣流路17之間連通。In the vapor chamber 1C shown in Fig. 7C, the arrangement and internal structure of the evaporation portion 4 are the same as those of the vapor chamber 1B shown in Fig. 7B, but in the evaporation portion 4, the concave portion 24a is also formed in the capillary structure 3 (second Concave). The concave portion 24a has an effect of reducing the thermal resistance of the evaporation portion 4 by increasing the surface area of the capillary structure 3 in the evaporation portion 4 and ensuring a large evaporation area of the fluid. Further, in the concave portion 24a, the vapor flow paths 17 are communicated with each other similarly to the concave portions 24 (communication portions 30) disposed in the condensation portion 5.

圖8所示之蒸汽腔室1D是將圖7C所示之凹部24a適用於圖1所示之蒸汽腔室1者。在蒸汽腔室1D中，第2毛細結構部21之第1端部22與第1毛細結構部20的框內側連接，於其連接部形成有凹部24a(第2凹部)。根據該構成，可加大蒸發部4中之毛細結構3的表面積，並確保大幅的作動流體之蒸發面積，藉此可使蒸發部4之熱阻降低。The steam chamber 1D shown in Fig. 8 is a one in which the recess 24a shown in Fig. 7C is applied to the steam chamber 1 shown in Fig. 1. In the steam chamber 1D, the first end portion 22 of the second capillary structure portion 21 is connected to the inside of the frame of the first capillary structure portion 20, and a recess portion 24a (second recess portion) is formed in the connection portion. According to this configuration, the surface area of the capillary structure 3 in the evaporation portion 4 can be increased, and a large evaporation area of the operating fluid can be secured, whereby the thermal resistance of the evaporation portion 4 can be lowered.

在圖9所示之蒸汽腔室1E中，連通部30是由在一對內壁面14、15之對向方向中，貫通毛細結構3之中間部(隔開一對內壁面14、15的位置)的貫通孔25而形成。藉由該構成，毛細結構3可保持與一對內壁面14、15之兩方的接觸狀態。因此，就不會阻擋液體之搬送能力比間隙18b還大的間隙18a之液體流路18。In the steam chamber 1E shown in Fig. 9, the communication portion 30 penetrates the intermediate portion of the capillary structure 3 in the opposing direction of the pair of inner wall faces 14, 15, (the position separating the pair of inner wall faces 14, 15) The through hole 25 is formed. With this configuration, the capillary structure 3 can be kept in contact with both of the pair of inner wall surfaces 14, 15. Therefore, the liquid flow path 18 of the gap 18a whose liquid transfer ability is larger than the gap 18b is not blocked.

又，例如，在上述實施形態中，已就利用連通部30使全部的蒸氣流路17連通的構成進行說明，但複數個蒸氣流路17亦可包含有由連通部30連通之蒸氣流路17、及未由連通部30連通的獨立的蒸氣流路17。In the above-described embodiment, the configuration in which all of the vapor flow paths 17 are communicated by the communication portion 30 has been described. However, the plurality of vapor flow paths 17 may include the vapor flow path 17 that is communicated by the communication portion 30. And an independent vapor flow path 17 that is not connected by the communication portion 30.

又，例如，在上述實施形態中，已就由網眼形成毛細結構的構成進行說明，但毛細結構亦可由纖維、金屬粉、毛氈、形成於容室2之凹槽(溝)、或者是將其等組合而形成。Further, for example, in the above-described embodiment, the configuration in which the capillary structure is formed by the mesh is described, but the capillary structure may be made of fibers, metal powder, felt, grooves (grooves) formed in the chamber 2, or They are formed in combination.

又，例如，在上述實施形態中，散熱模組是例示蒸汽腔室，但亦可將上述構成適用於散熱模組之其他形態即熱管。Further, for example, in the above embodiment, the heat radiation module is a steam chamber, but the above configuration may be applied to another heat pipe of the heat radiation module.

又，本實施形態之散熱模組的用途沒有特別限定，但可舉智慧型手機、平板型終端、攜帶電話、個人電腦、伺服器、影印機、遊戲機、複合機、投影機、電子機器、燃料電池、人工衛星等來例示。Moreover, the use of the heat dissipation module of the present embodiment is not particularly limited, but may be a smart phone, a tablet terminal, a mobile phone, a personal computer, a server, a photocopying machine, a game machine, a multifunction machine, a projector, an electronic device, Fuel cells, artificial satellites, and the like are exemplified.

(第2實施形態)
以下，參照圖式說明本發明之第2實施形態的散熱模組。
在以下的說明中，散熱模組的一實施形態是例示薄型的蒸汽腔室。(Second embodiment)
Hereinafter, a heat dissipation module according to a second embodiment of the present invention will be described with reference to the drawings.
In the following description, an embodiment of the heat dissipation module exemplifies a thin steam chamber.

圖10是本實施形態之蒸汽腔室1F的平截面圖。圖11是圖10所示之蒸汽腔室1F之A-A箭頭方向視角的截面圖。圖12是圖10所示之蒸汽腔室1F之B-B箭頭方向視角的截面圖。Fig. 10 is a plan sectional view showing the steam chamber 1F of the embodiment. Figure 11 is a cross-sectional view of the vapor chamber 1F shown in Figure 10 taken along the line A-A in the direction of the arrow. Figure 12 is a cross-sectional view of the vapor chamber 1F shown in Figure 10 taken along the line B-B in the direction of the arrow.

(方向定義)
本說明書中，將薄型之蒸汽腔室的厚度方向，即，後述之內壁面14、15相互對向的方向稱為「對向方向」。將與對向方向正交的一方向(圖10的左右方向)稱為「左右方向」。將與對向方向及左右方向之雙方正交的方向稱為前後方向。又，從對向方向看稱為「平面視角」，將與對向方向正交的截面圖稱為「平截面圖」。(direction definition)
In the present specification, the direction in which the thickness of the thin vapor chamber, that is, the inner wall surfaces 14, 15 which will be described later, is referred to as the "opposing direction". One direction orthogonal to the opposite direction (the horizontal direction in FIG. 10) is referred to as a "left-right direction". A direction orthogonal to both the opposing direction and the left-right direction is referred to as a front-rear direction. Further, when viewed from the opposite direction, it is referred to as a "planar view", and a cross-sectional view orthogonal to the opposite direction is referred to as a "flat view".

蒸汽腔室1F是利用作動流體之潛熱的熱輸送元件。該蒸汽腔室1F是如圖10所示，具有：作動流體封入內部的容室2、及配置於容室2之內部的毛細結構3。The steam chamber 1F is a heat transporting element that utilizes the latent heat of the actuating fluid. As shown in FIG. 10, the steam chamber 1F has a chamber 2 in which an actuating fluid is sealed, and a capillary structure 3 disposed inside the chamber 2.

作動流體是周知的可相變化的熱輸送媒體，在容室2內進行相變化成液相與氣相。例如，作動流體可採用水(純水)或酒精或氨等。再者，本說明書中，有時候將液相的作動流體記載為「液體」、將氣相的作動流體記載為「蒸氣」來進行說明。又，若沒有特別區別液相與氣相時，有時候則記載為作動流體。又，作動流體並未圖示。The actuating fluid is a well-known, phase-changeable heat transport medium that undergoes a phase change into a liquid phase and a gas phase in the chamber 2. For example, the working fluid may be water (pure water) or alcohol or ammonia. In the present specification, the operating fluid in the liquid phase is sometimes referred to as "liquid", and the operating fluid in the gas phase is sometimes referred to as "vapor". Further, if the liquid phase and the gas phase are not particularly distinguished, they are sometimes described as an actuating fluid. Also, the actuating fluid is not shown.

容室2是密閉的中空容器，形成為左右方向及前後方向的尺寸比厚度方向(對向方向)的尺寸還大的扁平形狀。容室2的厚度為例如0.3mm~3mm左右。又，容室2在平面視角下形成為略長方形。於該容室2設定有：使封入之作動流體蒸發的蒸發部4、及使該蒸發的作動流體凝結的凝結部5。在本實施形態中，蒸發部4設定在圖10中紙面左上方之容室2的角落。The chamber 2 is a closed hollow container, and is formed into a flat shape in which the dimension in the left-right direction and the front-rear direction is larger than the dimension in the thickness direction (opposing direction). The thickness of the chamber 2 is, for example, about 0.3 mm to 3 mm. Further, the chamber 2 is formed in a substantially rectangular shape in a plan view. The chamber 2 is provided with an evaporation portion 4 for evaporating the enclosed operating fluid, and a condensation portion 5 for condensing the evaporated operating fluid. In the present embodiment, the evaporation unit 4 is set at the corner of the chamber 2 on the upper left side of the paper surface in Fig. 10 .

所謂蒸發部4，是從熱源100受熱的區域。再者，蒸發部4不僅從與熱源100之外形(實裝面積)相同區域受熱，也從比其外形大一圈的區域受熱。另一方面，所謂凝結部5，是設定在蒸發部4周圍的區域，且是蒸發部4以外的區域。再者，熱源100是電子機器的電子零件，可列舉例如CPU等。The evaporation unit 4 is a region that is heated from the heat source 100. Further, the evaporation portion 4 receives heat not only from the same region as the heat source 100 (the mounting area) but also from a region slightly larger than the outer shape. On the other hand, the condensation portion 5 is a region set around the evaporation portion 4 and is a region other than the evaporation portion 4. Further, the heat source 100 is an electronic component of an electronic device, and examples thereof include a CPU and the like.

容室2具有：容室本體10、圖11所示之頂板11、及底板12。容室本體10可由例如銅、銅合金、鋁合金等形成。又，頂板11及底板12可由例如銅、銅合金、鋁、鋁合金、鐵、不鏽鋼、銅與不鏽鋼的複合材(Cu-SUS)、以銅夾入不鏽鋼的複合材(Cu-SUS-Cu)、鎳與不鏽鋼的複合材(Ni-SUS)、以鎳夾入不鏽鋼的複合材(Ni-SUS-Ni)等形成。The chamber 2 has a chamber body 10, a top plate 11 as shown in FIG. 11, and a bottom plate 12. The chamber body 10 may be formed of, for example, copper, a copper alloy, an aluminum alloy, or the like. Further, the top plate 11 and the bottom plate 12 may be made of, for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, a composite material of copper and stainless steel (Cu-SUS), and a composite material of copper (Cu-SUS-Cu) sandwiched between copper and copper. A composite material of nickel and stainless steel (Ni-SUS), a composite material (Ni-SUS-Ni) in which nickel is sandwiched between stainless steel, or the like.

再者，頂板11及底板12可由相同材料形成，亦可由不同材料形成。又，頂板11及底板12可為相同厚度，亦可為不同的厚度。又，頂板11及底板12之任一者亦可與容室本體10一體形成。例如，亦可為如下構成：以壓製成型將頂板11及底板12之任一者進行溝紋加工等，藉此形成兼具圖10所示之容室本體10的框部10a及柱部10b的構件，並將另一者與其接合，藉此而形成容室2。Furthermore, the top plate 11 and the bottom plate 12 may be formed of the same material or may be formed of different materials. Moreover, the top plate 11 and the bottom plate 12 may have the same thickness or different thicknesses. Further, either of the top plate 11 and the bottom plate 12 may be integrally formed with the chamber body 10. For example, the top plate 11 and the bottom plate 12 may be subjected to groove processing or the like by press molding, thereby forming the frame portion 10a and the column portion 10b having the chamber body 10 shown in Fig. 10 . The member is joined to the other, thereby forming the chamber 2.

容室本體10是如圖10所示，具有：形成容室2之外形的框部10a、及配置在被框部10a包圍之區域的複數個柱部10b。複數個柱部10b在左右方向(容室2之短邊方向)上隔著固定的間隔來配置，且朝前後方向(容室2之長邊方向)平行地延伸。在框部10a與柱部10b之間、及相鄰的諸柱部10b之間，形成有間隙，該間隙成為配置毛細結構3的通道13。本實施形態的通道13形成4個。As shown in FIG. 10, the chamber body 10 has a frame portion 10a that forms an outer shape of the chamber 2, and a plurality of column portions 10b that are disposed in a region surrounded by the frame portion 10a. The plurality of column portions 10b are arranged at a fixed interval in the left-right direction (the short-side direction of the chamber 2), and extend in parallel in the front-rear direction (longitudinal direction of the chamber 2). A gap is formed between the frame portion 10a and the column portion 10b and between the adjacent column portions 10b, and this gap serves as a passage 13 in which the capillary structure 3 is disposed. Four channels 13 are formed in this embodiment.

通道13是如圖11所示，由容室2之其中一方的內壁面14(第1內壁面)、與內壁面14對向之容室2之另一方的內壁面15(第2內壁面)、及連接一對內壁面14、15之間的連接面16所形成。本實施形態之容室2成為例如從底板12側接收熱源100之熱的構成。底板12的上表面成為內壁面14，頂板11的下表面成為內壁面15，柱部10b的側面(或圖10所示之框部10a的內側面10a’)成為連接面16。As shown in FIG. 11, the channel 13 is the inner wall surface 14 (the first inner wall surface) of one of the chambers 2 and the other inner wall surface 15 (the second inner wall surface) of the chamber 2 facing the inner wall surface 14. And a connecting surface 16 connecting the pair of inner wall surfaces 14, 15 is formed. The chamber 2 of the present embodiment has a configuration in which heat of the heat source 100 is received from the bottom plate 12 side, for example. The upper surface of the bottom plate 12 serves as the inner wall surface 14, and the lower surface of the top plate 11 serves as the inner wall surface 15, and the side surface of the column portion 10b (or the inner side surface 10a' of the frame portion 10a shown in Fig. 10) serves as the joint surface 16.

於通道13，如圖10所示，配置有毛細結構3。在蒸發部4中，液體蒸發後成為蒸氣，朝凝結部5前進。毛細結構3使在凝結部5內中凝結而成為液相的作動流體利用毛細管力而從凝結部5朝蒸發部4移動(回流)。本實施形態的毛細結構3是由例如將複數個細線編成格子狀的網眼所形成。形成毛細結構3的細線，可適宜使用例如熱傳導率高的銅材。該細線是例如直徑為數十μm~一百數十幾μm。In the passage 13, as shown in Fig. 10, a capillary structure 3 is disposed. In the evaporation unit 4, the liquid evaporates and becomes steam, and proceeds toward the condensation unit 5. In the capillary structure 3, the operating fluid that has condensed in the condensation portion 5 and becomes a liquid phase is moved (reflowed) from the condensation portion 5 toward the evaporation portion 4 by capillary force. The capillary structure 3 of the present embodiment is formed by, for example, a mesh in which a plurality of thin wires are arranged in a lattice shape. For the thin wire forming the capillary structure 3, for example, a copper material having a high thermal conductivity can be suitably used. The thin line is, for example, a diameter of several tens of μm to one hundred and several tens of μm.

毛細結構3具備：配置於框部10a與柱部10b之間的通道13的第1毛細結構部20、及配置於相鄰之諸柱部10b之間的通道13的第2毛細結構部21。第1毛細結構部20及第2毛細結構部21是一體形成。第1毛細結構部20沿著框部10a的內側面10a’ 配置成框狀。本實施形態之第2毛細結構部21設置有複數個(第2毛細結構部21a、21b二條)。複數個第2毛細結構部21a、21b是從位於凝結部5之第1毛細結構部20朝前後方向延伸。第2毛細結構部21的第1端部22連接於第1毛細結構部20之蒸發部4中的框內側，第2毛細結構部21的第2端部23連接於第1毛細結構部20之凝結部5中的框內側。The capillary structure 3 includes a first capillary structure portion 20 that is disposed in the channel 13 between the frame portion 10a and the column portion 10b, and a second capillary structure portion 21 that is disposed in the channel 13 between the adjacent column portions 10b. The first capillary structure portion 20 and the second capillary structure portion 21 are integrally formed. The first capillary structure portion 20 is arranged in a frame shape along the inner side surface 10a' of the frame portion 10a. The second capillary structure portion 21 of the present embodiment is provided in plurality (two of the second capillary structure portions 21a and 21b). The plurality of second capillary structure portions 21a and 21b extend in the front-rear direction from the first capillary structure portion 20 located in the condensation portion 5. The first end portion 22 of the second capillary structure portion 21 is connected to the inside of the frame in the evaporation portion 4 of the first capillary structure portion 20, and the second end portion 23 of the second capillary structure portion 21 is connected to the first capillary structure portion 20. The inside of the frame in the condensation portion 5.

毛細結構3是如圖11所示，接觸於容室2之對向的一對內壁面14、15。形成於毛細結構3與內壁面14及內壁面15之界面的間隙18a，成為使液體流動的液體流路18，使液體從凝結部5往蒸發部4回流。又，毛細結構3之內部之細線的間隙18b也成為使液體流動的液體流路18，使液體從凝結部5往蒸發部4回流。再者，細線的間隙18b的空間比形成於毛細結構3與內壁面14及內壁面15之界面的間隙18a還小，因此間隙18a之液體流路18會比間隙18b之液體流路18的液體搬送能力還大。The capillary structure 3 is a pair of inner wall faces 14, 15 which are in contact with the opposing direction of the chamber 2 as shown in FIG. The gap 18a formed at the interface between the capillary structure 3 and the inner wall surface 14 and the inner wall surface 15 serves as a liquid flow path 18 through which the liquid flows, and causes the liquid to flow back from the condensation portion 5 to the evaporation portion 4. Further, the gap 18b of the thin line inside the capillary structure 3 also serves as a liquid flow path 18 through which the liquid flows, and the liquid is returned from the condensation portion 5 to the evaporation portion 4. Further, the space of the gap 18b of the thin line is smaller than the gap 18a formed at the interface between the capillary structure 3 and the inner wall surface 14 and the inner wall surface 15, so that the liquid flow path 18 of the gap 18a is larger than the liquid of the liquid flow path 18 of the gap 18b. The transfer capacity is still large.

在毛細結構3的側面3a、與相對該側面3a隔有空間地配置之連接面16之間，形成作動流體的蒸氣流路17。第2毛細結構部21配置於相鄰之柱部10b的中間位置，成為容室2之中空部(通道13)中之保持形狀的柱。該第2毛細結構部21接觸於一對內壁面14、15而分隔容室2的內部，於其兩側形成有蒸氣流路17。再者，第1毛細結構部20也如圖10所示，沿著框部10a的內側面10a’配置，成為容室2之外圈之中空部中保持形狀的柱，於其單側(框內側)形成有蒸氣流路17。A vapor flow path 17 for the working fluid is formed between the side surface 3a of the capillary structure 3 and the connection surface 16 which is disposed with the space between the side surface 3a and the space. The second capillary structure portion 21 is disposed at an intermediate position between the adjacent column portions 10b, and serves as a column that retains the shape in the hollow portion (channel 13) of the chamber 2. The second capillary structure portion 21 is in contact with the pair of inner wall surfaces 14 and 15 to partition the inside of the chamber 2, and a vapor flow path 17 is formed on both sides thereof. Further, as shown in FIG. 10, the first capillary structure portion 20 is disposed along the inner side surface 10a' of the frame portion 10a, and serves as a column that retains a shape in the hollow portion of the outer ring of the chamber 2, on one side thereof (box) A vapor flow path 17 is formed on the inner side.

在本實施形態中，如圖10所示，藉由2條第2毛細結構部21(21a、21b)，容室2的內部(更具體而言是第1毛細結構部20之框內側的空間)分隔成3個空間，且於容室2的內部形成有3個蒸氣流路17(17a、17b、17c)。3個蒸氣流路17分別獨立而從蒸發部4朝向凝結部5延伸。於3個蒸氣流路17分別配置有柱部10b。In the present embodiment, as shown in FIG. 10, the inside of the chamber 2 (more specifically, the space inside the frame of the first capillary structure portion 20) is formed by the two second capillary structure portions 21 (21a, 21b). The partition is divided into three spaces, and three vapor flow paths 17 (17a, 17b, 17c) are formed inside the chamber 2. The three vapor flow paths 17 are independent from each other and extend from the evaporation portion 4 toward the condensation portion 5. The column portion 10b is disposed in each of the three vapor flow paths 17.

於該毛細結構3形成有凹部24。凹部24形成於第2毛細結構部21的第1端部22，至少其一部分配置於蒸發部4。本實施形態中，形成於第2毛細結構部21a之第1端部22的凹部24，從蒸發部4之內側的區域延伸到蒸發部4之外側的區域(凝結部5)。又，形成於第2毛細結構部21b之第1端部22的凹部24配置於蒸發部4之內側的區域。A concave portion 24 is formed in the capillary structure 3. The concave portion 24 is formed in the first end portion 22 of the second capillary structure portion 21, and at least a part thereof is disposed in the evaporation portion 4. In the present embodiment, the concave portion 24 formed in the first end portion 22 of the second capillary structure portion 21a extends from the region inside the evaporation portion 4 to the region outside the evaporation portion 4 (the condensation portion 5). Further, the concave portion 24 formed in the first end portion 22 of the second capillary structure portion 21b is disposed in a region inside the evaporation portion 4.

凹部24如圖12所示，從一對內壁面14、15之任一者(在本實施形態中為內壁面15)朝另一者(在本實施形態中為內壁面14)於對向方向凹陷。本實施形態中，將凹部24之對向方向的尺寸稱為「間隙D」。間隙D是在一對內壁面14、15的對向方向中，毛細結構3之厚度T之20%~50%的大小。毛細結構3的厚度T是例如0.2mm~1.0mm左右。假設毛細結構3的厚度T為0.5mm，則間隙D為0.10mm~0.25mm的大小。As shown in FIG. 12, the recessed portion 24 is opposed to the other (in the present embodiment, the inner wall surface 14) from either of the pair of inner wall surfaces 14 and 15 (in the present embodiment, the inner wall surface 15). Depression. In the present embodiment, the dimension of the concave portion 24 in the opposing direction is referred to as "gap D". The gap D is 20% to 50% of the thickness T of the capillary structure 3 in the opposing direction of the pair of inner wall faces 14, 15. The thickness T of the capillary structure 3 is, for example, about 0.2 mm to 1.0 mm. Assuming that the thickness T of the capillary structure 3 is 0.5 mm, the gap D is a size of 0.10 mm to 0.25 mm.

根據如此的凹部24，毛細結構3可保持與一對內壁面14、15之至少一方(本實施形態中為內壁面14)的接觸狀態。再者，第2毛細結構部21之長邊方向上的凹部24的寬度W具有間隙D以上的大小。寬度W藉由在毛細結構3形成凹部24的方法(加工工具等)，變得比間隙D大數倍~十數倍。如此之凹部24可藉將例如毛細結構3的一部分在對向方向(厚度方向)壓製而形成。又，凹部24也可藉例如將毛細結構3的一部分部分地切削而形成。According to such a recessed portion 24, the capillary structure 3 can be kept in contact with at least one of the pair of inner wall surfaces 14, 15 (the inner wall surface 14 in the present embodiment). In addition, the width W of the concave portion 24 in the longitudinal direction of the second capillary structure portion 21 has a size equal to or larger than the gap D. The width W is several times to ten times larger than the gap D by the method (machining tool or the like) in which the concave portion 24 is formed in the capillary structure 3. Such a recess 24 can be formed by, for example, pressing a part of the capillary structure 3 in the opposite direction (thickness direction). Further, the concave portion 24 may be formed by, for example, partially cutting a part of the capillary structure 3.

接著，就上述構成之蒸汽腔室1F構成的熱輸送循環進行說明。
蒸汽腔室1F藉由接收在熱源100產生的熱，蒸發部4內的液體蒸發。在蒸發部4中，滲透於毛細結構3的液體會蒸發。在蒸發部4產生的蒸氣朝向壓力及溫度比蒸發部4低的凝結部5，在蒸氣流路17內流動。在凝結部5中，經由蒸氣流路17到達凝結部5的蒸氣被冷卻而凝結。在凝結部5產生的液體滲透於毛細結構3，並從凝結部5往蒸發部4回流。Next, a heat transfer cycle constituted by the steam chamber 1F having the above configuration will be described.
The vapor chamber 1F evaporates the liquid in the evaporation portion 4 by receiving the heat generated in the heat source 100. In the evaporation portion 4, the liquid that permeates the capillary structure 3 evaporates. The vapor generated in the evaporation portion 4 flows in the vapor flow path 17 toward the condensation portion 5 whose pressure and temperature are lower than that of the evaporation portion 4. In the condensation portion 5, the vapor that has reached the condensation portion 5 via the vapor flow path 17 is cooled and condensed. The liquid generated in the condensation portion 5 permeates into the capillary structure 3 and flows back from the condensation portion 5 to the evaporation portion 4.

毛細結構3從凝結部5延伸到蒸發部4，利用由圖11所示之間隙18a、18b形成之液體流路18，使液體從凝結部5往蒸發部4回流。又，毛細結構3從凝結部5到蒸發部4，與容室2之對向的一對內壁面14、15接觸，因此成為支撐容室2的柱(補強構件)，確保薄型之蒸汽腔室1F的機械強度。The capillary structure 3 extends from the condensing portion 5 to the evaporation portion 4, and the liquid is circulated from the condensing portion 5 to the evaporation portion 4 by the liquid flow path 18 formed by the gaps 18a, 18b shown in FIG. Further, since the capillary structure 3 comes into contact with the pair of inner wall surfaces 14, 15 opposed to the chamber 2 from the condensation portion 5 to the evaporation portion 4, it becomes a column (reinforcing member) for supporting the chamber 2, and ensures a thin steam chamber. 1F mechanical strength.

然而，蒸發部4中之作動流體的蒸發在毛細結構3未與一對內壁面14、15接觸的部分(與蒸氣流路17等之空間接觸的部分)發生。本實施形態中，作動流體的蒸發除了在毛細結構3的側面3a發生之外，也在形成於毛細結構3的凹部24中發生。即，凹部24如圖12所示，是與內壁面14隔有間隙而形成的，因此相較於無凹部24之習知的毛細結構構造，可大幅地確保毛細結構3與空間接觸的面積。因此，蒸發部4中之作動流體的蒸發面積變大，可降低蒸發部4中的溫度，藉此，可減少蒸汽腔室1F的熱阻。However, the evaporation of the operating fluid in the evaporation portion 4 occurs in a portion where the capillary structure 3 is not in contact with the pair of inner wall surfaces 14, 15 (a portion in contact with the space of the vapor flow path 17 or the like). In the present embodiment, evaporation of the operating fluid occurs in the concave portion 24 formed in the capillary structure 3 in addition to the side surface 3a of the capillary structure 3. That is, as shown in FIG. 12, the recessed portion 24 is formed with a gap from the inner wall surface 14, so that the area of the capillary structure 3 in contact with the space can be largely ensured compared to the conventional capillary structure having no recessed portion 24. Therefore, the evaporation area of the operating fluid in the evaporation portion 4 becomes large, and the temperature in the evaporation portion 4 can be lowered, whereby the thermal resistance of the vapor chamber 1F can be reduced.

又，本實施形態中，凹部24在一對內壁面14、15的對向方向中，以毛細結構3之厚度的20%~50%的大小形成。根據該構成，凹部24形成的間隙D是藉由例如作動流體之貯液等而變得難以阻塞，可確實地確保凹部24中之毛細結構3的蒸發面積。Further, in the present embodiment, the concave portion 24 is formed to have a size of 20% to 50% of the thickness of the capillary structure 3 in the opposing direction of the pair of inner wall surfaces 14, 15. According to this configuration, the gap D formed by the concave portion 24 is hardly blocked by, for example, a liquid storage of the working fluid, and the evaporation area of the capillary structure 3 in the concave portion 24 can be reliably ensured.

又，本實施形態中，毛細結構3具有：形成為框狀的第1毛細結構部20、及配置於第1毛細結構部20之框內側的第2毛細結構部21，凹部24形成於第2毛細結構部21。第2毛細結構部21由於成為將蒸氣流路17分隔的分隔，因此在如此之第2毛細結構部21形成凹部24，藉此可使在凹部24產生的蒸氣流入被第2毛細結構部21分隔的各個蒸氣流路17。藉此，可減少各蒸氣流路17中之作動負荷的不均，得到高均熱性。Further, in the present embodiment, the capillary structure 3 has the first capillary structure portion 20 formed in a frame shape and the second capillary structure portion 21 disposed inside the frame of the first capillary structure portion 20, and the concave portion 24 is formed in the second portion. Capillary structure portion 21. Since the second capillary structure portion 21 is a partition that partitions the vapor flow path 17, the concave portion 24 is formed in the second capillary structure portion 21, whereby the vapor inflow generated in the concave portion 24 can be separated by the second capillary structure portion 21. Each of the vapor flow paths 17. Thereby, unevenness in the operating load in each of the vapor flow paths 17 can be reduced, and high uniformity can be obtained.

如以上說明，根據本實施形態，採用如下構成：具備：容室2，具有：內部封入作動流體，並使該封入的作動流體蒸發的蒸發部4；及使該蒸發的作動流體凝結的凝結部5；及毛細結構3，分別接觸於容室2之對向之一對內壁面14、15，藉由毛細管力使凝結的作動流體從凝結部5朝蒸發部4移動，毛細結構3採用如下構成：至少在蒸發部4中，具有與一對內壁面14、15之任一者隔有間隙的凹部24，藉此可得到可確保薄型之容室2的機械強度並減少熱阻的蒸汽腔室1F。As described above, the present embodiment has a configuration in which the chamber 2 includes an evaporation unit 4 that internally encloses an operating fluid and evaporates the enclosed operating fluid, and a condensation unit that condenses the evaporated operating fluid. And the capillary structure 3 is respectively in contact with the opposite inner wall surfaces 14, 15 of the chamber 2, and the condensed operating fluid is moved from the condensing portion 5 toward the evaporation portion 4 by capillary force, and the capillary structure 3 is constructed as follows At least in the evaporation portion 4, the recess portion 24 having a gap with any one of the pair of inner wall surfaces 14 and 15 is provided, whereby a vapor chamber capable of securing the mechanical strength of the thin chamber 2 and reducing the thermal resistance can be obtained. 1F.

以上，已就本發明之較佳實施形態並加以說明，但該等是本發明之例示者，應了解不應被認為是用來限定者。追加、省略、置換及其他變更可在不脫離本發明之範圍之下進行。因此，本發明不應被視為受前述說明所限定，而是由申請專利範圍限制。The preferred embodiments of the present invention have been described above, but these are exemplary of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be considered as limited by the foregoing description, but by the scope of the claims.

例如，可採用圖13A~圖14所示之變形例。以下之說明中，與上述實施形態相同或同等的構成賦與相同標號，並簡略或省略其說明。For example, a modification shown in Figs. 13A to 14 can be employed. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

圖13A~圖13C所示之蒸汽腔室1G~1I成為由毛細結構3配置於容室2之中央的1個通道13構成的單純構造。
在圖13A所示之蒸汽腔室1G中，蒸發部4配置於容室2之長邊方向的一端部，蒸氣流路17a、17b從蒸發部4朝容室2之長邊方向的另一端部延伸。而且，凹部24形成於毛細結構3的一端部。根據如此的構成，可與上述實施形態同樣，蒸發部4中之作動流體的蒸發面積變大，並可減少蒸汽腔室1A的熱阻。又，可使在凹部24產生的蒸氣流入蒸氣流路17a、17b，並得到高均熱性。The steam chambers 1G to 1I shown in FIGS. 13A to 13C are a simple structure composed of one passage 13 in which the capillary structure 3 is disposed at the center of the chamber 2.
In the vapor chamber 1G shown in Fig. 13A, the evaporation portion 4 is disposed at one end portion in the longitudinal direction of the chamber 2, and the vapor passages 17a, 17b are from the evaporation portion 4 toward the other end portion in the longitudinal direction of the chamber 2. extend. Further, the recess 24 is formed at one end portion of the capillary structure 3. According to such a configuration, as in the above-described embodiment, the evaporation area of the operating fluid in the evaporation portion 4 can be increased, and the thermal resistance of the vapor chamber 1A can be reduced. Further, the vapor generated in the concave portion 24 can flow into the vapor flow paths 17a and 17b, and high heat uniformity can be obtained.

在圖13B所示之蒸汽腔室1H中，蒸發部4配置於容室2之長邊方向之中央位置偏心的位置，蒸氣流路17a、17b從蒸發部4朝向容室2之長邊方向的另一端部延伸，並且蒸氣流路17c、17d從蒸發部4朝向容室2之長邊方向的一端部延伸。而且，凹部24形成於毛細結構3之長邊方向的略中央位置。根據如此的構成，與上述實施形態同樣，蒸發部4中之作動流體的蒸發面積變大，且可減少蒸汽腔室1A的熱阻。又，若蒸發部4的位置配置於容室2之長邊方向的中央位置偏心的位置，則在蒸氣流路17a、17b側與蒸氣流路17c、17d側，作動負荷變得容易不均，但在本構成中，可使在凹部24產生之蒸氣流入至各蒸氣流路17a、17b、17c、17d，故可減少作動負荷的不均，並可得到高均熱性。In the steam chamber 1H shown in Fig. 13B, the evaporation portion 4 is disposed at a position eccentric to the center of the longitudinal direction of the chamber 2, and the vapor flow paths 17a, 17b are directed from the evaporation portion 4 toward the longitudinal direction of the chamber 2. The other end portion extends, and the vapor flow paths 17c and 17d extend from the evaporation portion 4 toward one end portion in the longitudinal direction of the chamber 2. Further, the concave portion 24 is formed at a substantially central position in the longitudinal direction of the capillary structure 3. According to such a configuration, as in the above-described embodiment, the evaporation area of the operating fluid in the evaporation portion 4 is increased, and the thermal resistance of the vapor chamber 1A can be reduced. In addition, when the position of the evaporation unit 4 is eccentrically disposed at the center position in the longitudinal direction of the chamber 2, the operation load is easily uneven on the side of the vapor flow paths 17a and 17b and the vapor flow paths 17c and 17d. However, in the present configuration, the vapor generated in the concave portion 24 can flow into the respective vapor flow paths 17a, 17b, 17c, and 17d, so that the unevenness of the actuation load can be reduced, and high uniformity can be obtained.

在圖13C所示之蒸汽腔室1I中，蒸發部4的配置與內部構造與圖13B所示之蒸汽腔室1H同樣，但凝結部5中也於毛細結構3形成有凹部25(第2凹部)。凹部25隔著毛細結構3而使相鄰之蒸氣流路17a、17b(及蒸氣流路17c、17d)之間連通，使蒸氣往來。藉此，可消除各蒸氣流路17中之作動負荷的不均，可得到更高的均熱性。In the steam chamber 1I shown in Fig. 13C, the arrangement and internal structure of the evaporation portion 4 are the same as those of the vapor chamber 1H shown in Fig. 13B, but the concave portion 25 is also formed in the condensed portion 5 in the capillary structure 3 (the second concave portion) ). The concave portion 25 communicates between the adjacent vapor flow paths 17a and 17b (and the vapor flow paths 17c and 17d) via the capillary structure 3 to allow the vapor to flow. Thereby, the unevenness of the actuation load in each of the vapor flow paths 17 can be eliminated, and higher uniformity can be obtained.

圖14所示之蒸汽腔室1J是將圖13C所示之凹部25適用於圖10所示之蒸汽腔室1F者。在蒸汽腔室1J中，於第2毛細結構部21的第2端部23形成有凹部25。根據該構成，隔著第2毛細結構部21而使相鄰之蒸氣流路17a、17b、17c之間在凝結部5中連通，使蒸氣往來，藉此可消除各蒸氣流路17中之作動負荷的不均，得到高均熱性。The steam chamber 1J shown in Fig. 14 is a one in which the recess 25 shown in Fig. 13C is applied to the steam chamber 1F shown in Fig. 10. In the steam chamber 1J, a recess 25 is formed in the second end portion 23 of the second capillary structure portion 21. According to this configuration, the adjacent capillary passages 17 are communicated between the adjacent vapor passages 17a, 17b, and 17c via the second capillary structure portion 21 to allow steam to flow, thereby eliminating the operation in each of the vapor passages 17. Uneven load, resulting in high heat uniformity.

又，例如，在上述實施形態中，已就毛細結構由網眼形成的構成加以說明，但毛細結構亦可由纖維、金屬粉、毛氈、形成於容室2之凹槽(溝)、或者其等組合者形成。Further, for example, in the above-described embodiment, the configuration in which the capillary structure is formed by the mesh is described, but the capillary structure may be a fiber, a metal powder, a felt, a groove (groove) formed in the chamber 2, or the like. The combination is formed.

又，亦可將在第1實施形態說明的構成與在第2實施形態說明的構成組合。Further, the configuration described in the first embodiment may be combined with the configuration described in the second embodiment.

1‧‧‧蒸汽腔室(散熱模組)1‧‧‧Steam chamber (thermal module)

1'‧‧‧蒸汽腔室 1'‧‧‧Steam chamber

1A‧‧‧蒸汽腔室 1A‧‧‧Steam chamber

1B‧‧‧蒸汽腔室 1B‧‧‧Steam chamber

1C‧‧‧蒸汽腔室 1C‧‧‧Steam chamber

1D‧‧‧蒸汽腔室 1D‧‧‧Steam chamber

1E‧‧‧蒸汽腔室 1E‧‧‧Steam chamber

1F‧‧‧蒸汽腔室 1F‧‧‧Steam chamber

1G‧‧‧蒸汽腔室 1G‧‧‧Steam chamber

1H‧‧‧蒸汽腔室 1H‧‧‧Steam chamber

1I‧‧‧蒸汽腔室 1I‧‧‧Steam chamber

1J‧‧‧蒸汽腔室 1J‧‧‧Steam chamber

2‧‧‧容室 2‧‧ ‧ room

3‧‧‧毛細結構 3‧‧‧Capillary structure

3a‧‧‧側面 3a‧‧‧ side

4‧‧‧蒸發部 4‧‧‧Evaporation Department

5‧‧‧凝結部 5‧‧‧Condensation

10‧‧‧容室本體 10‧‧‧room body

10a‧‧‧框部 10a‧‧‧ Frame Department

10a'‧‧‧內側面 10a'‧‧‧ inside side

10a1‧‧‧內側面 10a1‧‧‧ inside

10b‧‧‧柱部 10b‧‧‧ pillar

11‧‧‧頂板 11‧‧‧ top board

12‧‧‧底板 12‧‧‧floor

13‧‧‧通道 13‧‧‧ channel

14‧‧‧內壁面 14‧‧‧ inner wall

15‧‧‧內壁面 15‧‧‧ inner wall

16‧‧‧連接面 16‧‧‧ Connection surface

17‧‧‧蒸氣流路 17‧‧‧Vapor flow path

17a‧‧‧蒸氣流路 17a‧‧‧Vapor flow path

17a1‧‧‧端部 17a1‧‧‧End

17b‧‧‧蒸氣流路 17b‧‧‧Vapor flow path

17b1‧‧‧端部 17b1‧‧‧ end

17c‧‧‧蒸氣流路 17c‧‧‧Vapor flow path

17c1‧‧‧端部 17c1‧‧‧ end

17d‧‧‧蒸氣流路 17d‧‧‧Vapor flow path

17d1‧‧‧端部 17d1‧‧‧ end

17e‧‧‧蒸氣流路 17e‧‧‧Vapor flow path

18‧‧‧液體流路 18‧‧‧Liquid flow path

18a‧‧‧間隙 18a‧‧‧ gap

18b‧‧‧間隙 18b‧‧‧ gap

20‧‧‧第1毛細結構部 20‧‧‧1st capillary structure

21‧‧‧第2毛細結構部 21‧‧‧2nd capillary structure

21a‧‧‧第2毛細結構部 21a‧‧‧2nd capillary structure

21b‧‧‧第2毛細結構部 21b‧‧‧2nd capillary structure

22‧‧‧前端部 22‧‧‧ front end

23‧‧‧基部 23‧‧‧ base

24‧‧‧凹部 24‧‧‧ recess

24a‧‧‧凹部(第2凹部) 24a‧‧‧ recess (2nd recess)

25‧‧‧貫通孔 25‧‧‧through holes

30‧‧‧連通部 30‧‧‧Connecting Department

100‧‧‧熱源 100‧‧‧heat source

101‧‧‧溫度控制器 101‧‧‧ Temperature Controller

A‧‧‧箭頭方向視角 A‧‧‧ arrow direction

B‧‧‧箭頭方向視角 B‧‧‧ arrow direction

D‧‧‧間隙 D‧‧‧ gap

T‧‧‧厚度 T‧‧‧ thickness

T1~T9‧‧‧溫度感測器 T1~T9‧‧‧Temperature Sensor

W‧‧‧寬度 W‧‧‧Width

圖1是第1實施形態之蒸汽腔室的平截面圖。Fig. 1 is a plan sectional view showing a vapor chamber according to a first embodiment.

圖2是圖1所示之蒸汽腔室之II-II箭頭方向視角的截面圖。 Figure 2 is a cross-sectional view of the vapor chamber of Figure 1 taken along the line II-II of the arrow.

圖3是圖1所示之蒸汽腔室之III-III箭頭方向視角的截面圖。 Figure 3 is a cross-sectional view of the vapor chamber of Figure 1 taken along the line III-III of the arrow.

圖4A是評價第1實施形態之蒸汽腔室之性能的試驗裝置的平截面圖。 Fig. 4A is a plan sectional view showing a test apparatus for evaluating the performance of the steam chamber of the first embodiment.

圖4B是圖4A的側面圖。 Fig. 4B is a side view of Fig. 4A.

圖5A是比較例之蒸汽腔室的平截面圖。 Fig. 5A is a plan sectional view of a vapor chamber of a comparative example.

圖5B是圖5A之蒸汽腔室的試驗結果。 Figure 5B is a test result of the vapor chamber of Figure 5A.

圖6A是實施例之蒸汽腔室的平截面圖。 Figure 6A is a plan cross-sectional view of the vapor chamber of the embodiment.

圖6B是圖5A之蒸汽腔室的試驗結果。 Figure 6B is a test result of the vapor chamber of Figure 5A.

圖7A是第1實施形態之第1變形例之蒸汽腔室的平截面圖。 Fig. 7A is a plan sectional view showing a vapor chamber according to a first modification of the first embodiment.

圖7B是第1實施形態之第2變形例之蒸汽腔室的平截面圖。 Fig. 7B is a plan sectional view showing a vapor chamber according to a second modification of the first embodiment.

圖7C是第1實施形態之第3變形例之蒸汽腔室的平截面圖。 Fig. 7C is a plan sectional view showing a vapor chamber according to a third modification of the first embodiment.

圖8是第1實施系形態之第4變形例之蒸汽腔室的平截面圖。 Fig. 8 is a plan sectional view showing a vapor chamber according to a fourth modification of the first embodiment.

圖9是第1實施形態之第5變形例之毛細結構之連通部中的縱截面圖。 Fig. 9 is a longitudinal cross-sectional view showing a communication portion of a capillary structure according to a fifth modification of the first embodiment.

圖10是第2實施形態之蒸汽腔室的平截面圖。 Fig. 10 is a plan sectional view showing a steam chamber of a second embodiment;

圖11是圖10所示之蒸汽腔室之A-A箭頭方向視角的截面圖。 Figure 11 is a cross-sectional view of the vapor chamber of Figure 10 taken along the line A-A of the arrow.

圖12是圖10所示之蒸汽腔室之B-B箭頭方向視角的截面圖。 Figure 12 is a cross-sectional view of the vapor chamber of Figure 10 taken along the B-B arrow direction.

圖13A是第2實施形態之第1變形例之蒸汽腔室的平截面圖。 Fig. 13A is a plan sectional view showing a vapor chamber according to a first modification of the second embodiment.

圖13B是第2實施形態之第2變形例之蒸汽腔室的平截面圖。 Fig. 13B is a plan sectional view showing a steam chamber according to a second modification of the second embodiment.

圖13C是第2實施形態之第3變形例之蒸汽腔室的平截面圖。 Fig. 13C is a plan sectional view showing a vapor chamber according to a third modification of the second embodiment.

圖14是第2實施形態之第4變形例之蒸汽腔室的平截面圖。 Fig. 14 is a plan sectional view showing a steam chamber according to a fourth modification of the second embodiment.

Claims

一種散熱模組，具備：容室，具有：於內部封入作動流體並使前述作動流體蒸發的蒸發部；及使已蒸發的前述作動流體凝結的凝結部；及毛細結構，配置於前述容室的內部，使已凝結之前述作動流體藉由毛細管力而從前述凝結部移動到前述蒸發部，前述毛細結構與前述容室之對向的一對內壁面各自接觸而分隔前述容室的內部，並形成有複數個已蒸發之前述作動流體的蒸氣流路，於前述毛細結構形成連通部，前述連通部是使前述複數個蒸氣流路當中至少2個蒸氣流路之間連通，前述連通部與前述一對內壁面之至少一方接觸，於前述容室的內部，形成有連接於前述一對內壁面之雙方的柱部。A heat dissipation module having: a chamber having: an evaporation portion that internally encloses an operating fluid and evaporates the operating fluid; and a condensation portion that condenses the evaporated operating fluid; and a capillary structure disposed inside the chamber to move the condensed operating fluid from the condensing portion to the evaporation portion by capillary force The capillary structure is in contact with a pair of inner wall surfaces facing the chamber to separate the interior of the chamber, and a plurality of vapor flow paths for evaporating the actuating fluid are formed. Forming a communication portion in the capillary structure, wherein the communication portion communicates between at least two of the plurality of vapor flow paths; The communication portion is in contact with at least one of the pair of inner wall surfaces, A column portion connected to both of the pair of inner wall surfaces is formed inside the chamber.

如請求項1之散熱模組，其中前述複數個蒸氣流路包含流路長度不同的蒸氣流路，前述連通部是使前述複數個蒸氣流路當中至少包含流路長度最長的蒸氣流路的2個蒸氣流路之間連通。The heat dissipation module of claim 1, wherein the plurality of vapor flow paths include a vapor flow path having a different flow path length, The communication portion communicates between the two vapor flow paths including at least the vapor flow path having the longest flow path length among the plurality of vapor flow paths.

如請求項1或2之散熱模組，其中前述連通部是使前述蒸氣流路之前述凝結部側的端部之間連通，並使前述蒸氣流路的中間部分之間不連通。The heat dissipation module according to claim 1 or 2, wherein the communication portion communicates between end portions on the condensation portion side of the vapor flow path, and does not communicate between intermediate portions of the vapor flow path.

如請求項1至3中任一項之散熱模組，其中前述連通部是使前述蒸氣流路之前述凝結部側的端部之間連通，並使前述蒸氣流路之前述蒸發部側的端部之間不連通。The heat dissipation module according to any one of claims 1 to 3, wherein the communication portion communicates between end portions on the condensation portion side of the vapor flow path, and ends of the vapor flow path on the evaporation portion side There is no connection between the departments.

如請求項1至4中任一項之散熱模組，其中在前述毛細結構與前述柱部之間未形成有蒸氣流路。The heat dissipation module according to any one of claims 1 to 4, wherein a vapor flow path is not formed between the capillary structure and the column portion.

如請求項1至5中任一項之散熱模組，其中在前述容室之框部與前述毛細結構之間，形成有非蒸氣流路的間隙。The heat dissipation module according to any one of claims 1 to 5, wherein a gap of the non-vapor flow path is formed between the frame portion of the chamber and the capillary structure.

如請求項1至6中任一項之散熱模組，其中前述連通部在前述一對內壁面相互對向的對向方向中，具有為前述毛細結構之厚度的20%~50%的大小的間隙。The heat dissipation module according to any one of claims 1 to 6, wherein the communication portion has a size of 20% to 50% of a thickness of the capillary structure in a direction in which the pair of inner wall surfaces face each other. gap.

如請求項1至7中任一項之散熱模組，其中前述連通部是形成於前述毛細結構且在前述一對內壁面對向的對向方向中凹陷的凹部。The heat dissipation module according to any one of claims 1 to 7, wherein the communication portion is a concave portion formed in the capillary structure and recessed in an opposing direction in which the pair of inner walls face each other.

如請求項8之散熱模組，其中前述毛細結構具有配置於前述蒸發部的第2凹部。The heat dissipation module of claim 8, wherein the capillary structure has a second recess disposed in the evaporation portion.

如請求項1至9中任一項之散熱模組，其中前述毛細結構在前述一對內壁面之對向方向中，在與前述一對內壁面有間隔的位置具有貫通孔，前述貫通孔為前述連通部。The heat dissipation module according to any one of claims 1 to 9, wherein the capillary structure has a through hole at a position spaced apart from the pair of inner wall surfaces in a direction opposite to the pair of inner wall surfaces. The through hole is the communication portion.