TW201919260A - Ultraviolet led packaging structure - Google Patents
Ultraviolet led packaging structure Download PDFInfo
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- TW201919260A TW201919260A TW107136556A TW107136556A TW201919260A TW 201919260 A TW201919260 A TW 201919260A TW 107136556 A TW107136556 A TW 107136556A TW 107136556 A TW107136556 A TW 107136556A TW 201919260 A TW201919260 A TW 201919260A
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- packaging structure
- ultraviolet led
- led packaging
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000010410 layer Substances 0.000 claims abstract description 135
- 239000000463 material Substances 0.000 claims abstract description 67
- 239000012790 adhesive layer Substances 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- -1 phenyl Compound Chemical class 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008635 plant growth Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Radiation-Therapy Devices (AREA)
- Media Introduction/Drainage Providing Device (AREA)
Abstract
Description
本發明是有關於一種半導體封裝結構，特別是指一種紫外LED封裝結構。The present invention relates to a semiconductor packaging structure, and particularly to a UV LED packaging structure.
發光二極體(英文簡稱LED)，是一種固體半導體發光器件。隨著LED技術的發展，LED的模組波段逐漸往近紫外甚至深紫外方向發展。眾所周之，紫外LED作為新一代綠色光源，具有光效高、壽命長、節能、環保等眾多優點，其應用領域越來越廣泛，如室內外消毒、背光源、UV列印、醫療、餐飲、植物生長等。但是當前的紫外(UV)LED封裝結構，特別是深紫外(DUV)LED封裝結構一般採用全無機封裝，此種封裝結構的光從LED芯片射出後進入到空氣，然後再經過石英玻璃等材質透射到外界。整個光路有多次的光密介質到光疏介質，而且介面是平面結構，因此存在非常大的全反射現象，對出光效率造成了很大的影響。Light emitting diode (LED for short) is a solid semiconductor light emitting device. With the development of LED technology, the module wave band of LED gradually develops in the direction of near-ultraviolet or even deep-ultraviolet. As everyone knows, as a new generation of green light source, UV LED has many advantages such as high light efficiency, long life, energy saving, environmental protection and so on. Catering, plant growth, etc. However, the current ultraviolet (UV) LED package structure, especially the deep ultraviolet (DUV) LED package structure, generally uses an all-inorganic package. The light of this package structure is emitted from the LED chip into the air, and then transmitted through quartz glass and other materials. To the outside world. The entire optical path has multiple optical dense media to optical sparse media, and the interface is a flat structure, so there is a very large total reflection phenomenon, which has a great impact on the light output efficiency.
因此，本發明的目的，即在提供一種紫外LED封裝結構。Therefore, an object of the present invention is to provide a UV LED package structure.
於是，本發明紫外LED封裝結構，包含一個支架、一個透鏡、多層黏結層、一個LED芯片單元及一個填充材料層。Therefore, the ultraviolet LED packaging structure of the present invention includes a bracket, a lens, a multi-layer adhesive layer, an LED chip unit and a filling material layer.
該支架與該透鏡通過該等黏結層進行封裝，該支架、該等黏結層與該透鏡共同圍繞界定出一個腔體。The bracket and the lens are packaged by the adhesive layers, and the bracket, the adhesive layers and the lens together define a cavity.
該LED芯片位於該腔體中。The LED chip is located in the cavity.
該填充材料層位於該腔體中且包覆該LED芯片單元，其中，至少一層黏結層的材料與該填充材料層的材料相同。The filling material layer is located in the cavity and covers the LED chip unit, wherein the material of at least one adhesive layer is the same as the material of the filling material layer.
以下將就本發明內容進行詳細說明：The following will describe the content of the present invention in detail:
較佳地，該紫外LED封裝結構包含三層黏結層且該等黏結層分別為一與該透鏡接觸的第一層、一與該支架接觸的第二層，及一位於該第一層與該第二層間的第三層。Preferably, the ultraviolet LED packaging structure includes three adhesive layers, and the adhesive layers are a first layer in contact with the lens, a second layer in contact with the bracket, and a first layer in contact with the bracket. The third floor between the second floor.
較佳地，該紫外LED封裝結構包含五層黏結層且該等黏結層分別為一與該透鏡接觸的第一層、一與該支架接觸的第二層、一位於該第一層與該第二層間的第三層、一位於該第一層與該第三層間的第四層，及一位於該第二層與該第三層間的第五層。Preferably, the ultraviolet LED packaging structure includes five adhesive layers, and the adhesive layers are a first layer in contact with the lens, a second layer in contact with the bracket, and a first layer and the first layer. A third layer between the two layers, a fourth layer between the first layer and the third layer, and a fifth layer between the second layer and the third layer.
較佳地，該等黏結層的其中一層為非連續層。Preferably, one of the bonding layers is a discontinuous layer.
較佳地，該填充材料層的材料為含有氟、矽-氟鍵、碳-氟鍵、矽-氧鍵、碳-碳鍵、甲基或苯基的化合物。Preferably, the material of the filling material layer is a compound containing fluorine, silicon-fluorine bond, carbon-fluorine bond, silicon-oxygen bond, carbon-carbon bond, methyl group or phenyl group.
較佳地，該填充材料層的材料為液態。Preferably, the material of the filling material layer is liquid.
較佳地，該填充材料層之材料的折射率介於1.3~1.6間。Preferably, the refractive index of the material of the filling material layer is between 1.3 and 1.6.
較佳地，該填充材料層之材料於260~320nm波段的透射率大於80%。Preferably, the transmittance of the material of the filling material layer in the 260-320 nm band is greater than 80%.
較佳地，該支架呈碗杯形狀。更佳地，該支架為一體成型。Preferably, the bracket is in the shape of a cup. More preferably, the bracket is integrally formed.
較佳地，該透鏡的球心是位於該支架上表面之中心位置的法線上。Preferably, the spherical center of the lens is located on a normal line at a center position of the upper surface of the bracket.
較佳地，該透鏡的球心位於該腔體中。Preferably, the spherical center of the lens is located in the cavity.
較佳地，該透鏡的球心位於該透鏡的下表面上。Preferably, the spherical center of the lens is located on the lower surface of the lens.
較佳地，該透鏡的球心位於該支架的上表面上。Preferably, the spherical center of the lens is located on the upper surface of the bracket.
較佳地，該透鏡的球心位於該LED芯片單元的上表面、下表面或內部。Preferably, a spherical center of the lens is located on an upper surface, a lower surface, or an inside of the LED chip unit.
較佳地，該透鏡的球心位於該填充材料層的上表面、下表面或內部。Preferably, the sphere center of the lens is located on the upper surface, the lower surface or the inside of the filling material layer.
較佳地，該透鏡包括一個形成於其下表面的凹槽。Preferably, the lens includes a groove formed on a lower surface thereof.
較佳地，該透鏡的上表面具有一個弧面部，且該弧面部為一球面的一部分。Preferably, the upper surface of the lens has a curved surface portion, and the curved surface portion is a part of a spherical surface.
較佳地，該透鏡的下表面為一平面。Preferably, the lower surface of the lens is a flat surface.
與現有技術相比，本發明提供的一種紫外LED封裝結構，至少包括以下功效： (1) 通過包括一凹槽的透鏡，並且該透鏡與該LED芯片單元間還設有該填充材料層，大大地提升了出光效率，相對於常規紫外LED封裝結構，光效提升幅度達到30%以上； (2) 該透鏡與該支架間設置多層黏結層，能增強黏著力和密封性，提升封裝結構的可靠性； (3) 該透鏡的球心位置，可以在該支架上表面之中心位置的法線方向移動，通過調控該球心的位置，可以使得發光角度保持基本不變，維持封裝結構的一致性。當封裝空間比較小時，可以選擇球心靠下的透鏡；當有足夠封裝空間時，可以選擇球心較高的透鏡，以達到較高的亮度。Compared with the prior art, the ultraviolet LED package structure provided by the present invention includes at least the following effects: (1) A lens including a groove is provided, and the filling material layer is further provided between the lens and the LED chip unit, greatly Compared with the conventional UV LED package structure, the light efficiency has been improved by more than 30%. (2) The multilayer adhesive layer between the lens and the bracket can enhance the adhesion and sealability, and improve the reliability of the package structure. (3) The center position of the lens can be moved in the normal direction of the center position of the upper surface of the bracket. By adjusting the position of the center of the ball, the light emitting angle can be kept basically unchanged, and the consistency of the packaging structure can be maintained. . When the packaging space is relatively small, a lens with a spherical center can be selected; when there is sufficient packaging space, a lens with a higher spherical center can be selected to achieve higher brightness.
下面結合圖式對本發明的紫外LED封裝結構進行詳細的描述，在進一步介紹本發明之前，應當理解，由於可以對特定的實施例進行改造，因此，本發明並不限於下述的特定實施例。還應當理解，由於本發明的範圍只由所附申請專利範圍限定，因此所採用的實施例只是介紹性的，而不是限制性的。The ultraviolet LED package structure of the present invention is described in detail below with reference to the drawings. Before further introducing the present invention, it should be understood that, since specific embodiments can be modified, the present invention is not limited to the specific embodiments described below. It should also be understood that, since the scope of the present invention is limited only by the scope of the appended patent applications, the embodiments used are merely introductory and not restrictive.
應當理解，本發明所使用的術語僅出於描述具體實施方式的目的，而不是旨在限制本發明。如本發明所使用的，單數形式“一”、“一種”和“所述”也旨在包括複數形式，除上下文清楚地表明之外。應進一步理解，當在本發明中使用術語“包含”、"包括"、“含有”時，用於表明陳述的特徵、整體、步驟、操作、元件、和/或封裝件的存在，而不排除一個或多個其他特徵、整體、步驟、操作、元件、封裝件、和/或它們的組合的存在或增加。It should be understood that the terminology used in the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that when the terms "comprising," "including," and "containing" are used in the present invention, they are used to indicate the presence of stated features, wholes, steps, operations, elements, and / or packages without excluding The presence or addition of one or more other features, integers, steps, operations, elements, packages, and / or combinations thereof.
除另有定義之外，本發明所使用的所有術語(包括技術術語和科學術語)具有與本發明所屬技術領域中具有通常知識者通常所理解的含義相同的含義。應進一步理解，本發明所使用的術語應被理解為具有與這些術語在本說明書的上下文和相關領域中的含義一致的含義，並且不應以理想化或過於正式的意義來理解，除本發明中明確如此定義之外。Unless otherwise defined, all terms (including technical and scientific terms) used in the present invention have the same meanings as commonly understood by those having ordinary knowledge in the technical field to which the present invention belongs. It should be further understood that the terms used in the present invention should be understood to have meanings consistent with the meanings of these terms in the context of the present specification and related fields, and should not be understood in an idealized or too formal sense, except for the present invention It is explicitly defined as such.
在本發明被詳細描述前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.
＜< 實施例Examples 1＞1 ＞
參閱圖1和2，本實施例1提供一種紫外LED封裝結構，其包含一個支架10、一個LED芯片單元30、一個填充材料層40、多層黏結層50及一個透鏡60。該支架10與該透鏡60通過該等黏結層50進行封裝，該支架10、該等黏結層50與該透鏡60共同圍繞界定出一個腔體20，該LED芯片30位於該腔體20中，該填充材料層40位於該腔體20中且包覆該LED芯片單元30，其中，至少一層黏結層50的材料與該填充材料層40的材料相同。Referring to FIGS. 1 and 2, this embodiment 1 provides a UV LED packaging structure including a bracket 10, an LED chip unit 30, a filling material layer 40, a plurality of adhesive layers 50, and a lens 60. The bracket 10 and the lens 60 are packaged by the adhesive layers 50. The bracket 10, the adhesive layers 50 and the lens 60 jointly define a cavity 20, and the LED chip 30 is located in the cavity 20. The filling material layer 40 is located in the cavity 20 and covers the LED chip unit 30. The material of at least one adhesive layer 50 is the same as the material of the filling material layer 40.
該支架10的材料可包括例如陶瓷材料的絕緣材料。該陶瓷材料包括被同時共燒的低溫共燒陶瓷(LTCC)或高溫共燒陶瓷(HTCC)。該支架10的主體材料可為氮化鋁(AlN)，或也可以是其它具有140 W/(m•K)或者更高之導熱性的金屬氮化物。The material of the bracket 10 may include an insulating material such as a ceramic material. The ceramic material includes a low-temperature co-fired ceramic (LTCC) or a high-temperature co-fired ceramic (HTCC) which is co-fired at the same time. The main body of the bracket 10 may be aluminum nitride (AlN), or may be other metal nitrides having a thermal conductivity of 140 W / (m • K) or higher.
該LED芯片單元30置於該支架10上且包括至少一個紫外LED芯片31。該紫外LED芯片31的發光波長介於200~380nm間，具體來說可以是長波(代號UV-A，波長315~380nm)、中波(UV-B，280~315nm)或短波(UV-C，200~280nm)。前述發光波長可以根據實際用途的需要選擇，該用途例如是用於表面殺菌或表面固化等；該LED芯片單元30中的紫外LED芯片數目可以根據功率需求等因素選擇；此外，根據不同的用途，本發明的該紫外LED芯片單元30可以包括多個分別具有不同發光波長的紫外LED芯片，或者該LED芯片單元30除了包括至少一個紫外LED芯片外，還可以包括至少一個具有其它發光波長的LED芯片。The LED chip unit 30 is disposed on the bracket 10 and includes at least one ultraviolet LED chip 31. The ultraviolet LED chip 31 has a light emission wavelength between 200 and 380 nm. Specifically, it can be a long wave (codename UV-A, wavelength 315 to 380 nm), medium wave (UV-B, 280 to 315 nm), or short wave (UV-C , 200 ~ 280nm). The aforementioned emission wavelength can be selected according to the needs of practical applications, such as surface sterilization or surface curing, etc .; the number of ultraviolet LED chips in the LED chip unit 30 can be selected according to factors such as power requirements; in addition, according to different applications, The ultraviolet LED chip unit 30 of the present invention may include a plurality of ultraviolet LED chips having different light emitting wavelengths, or the LED chip unit 30 may include at least one LED chip having other light emitting wavelengths in addition to at least one ultraviolet LED chip. .
該填充材料層40包覆該LED芯片單元30。該填充材料層40的材料可為含有氟、矽-氟鍵(Si-F)、碳-氟鍵(C-F)、矽-氧鍵(Si-O)、碳-碳鍵(C-C)、甲基或苯基的化合物。較佳地，該填充材料層40的材料為含有氟的化合物或該填充材料層40的材料為液態(例如含有水或於高溫和紫外光下不會固化的液態矽膠等)；此外，較佳地，該填充材料層40之材料的折射率介於1.3~1.6nD間，該填充材料層40的材料於260~320nm波段的透射率大於80%。The filling material layer 40 covers the LED chip unit 30. The material of the filling material layer 40 may be fluorine, silicon-fluorine bond (Si-F), carbon-fluorine bond (CF), silicon-oxygen bond (Si-O), carbon-carbon bond (CC), methyl Or phenyl compounds. Preferably, the material of the filling material layer 40 is a compound containing fluorine or the material of the filling material layer 40 is a liquid state (for example, liquid silicon rubber containing water or not curing under high temperature and ultraviolet light); Ground, the refractive index of the material of the filling material layer 40 is between 1.3 and 1.6 nD, and the transmittance of the material of the filling material layer 40 in the band of 260 to 320 nm is greater than 80%.
該透鏡60較佳於260~320nm間的透光率大於80%，且位於填充材料層40上。該透鏡60包括一個形成於其下表面63的凹槽62，該凹槽62提供了放置該LED芯片單元30的空間。該透鏡60的上表面64具有一個弧面部且該弧面部為一球面的一部分(即該上表面64之弧面部的每個點到該球心61之距離相同，例如為半球面)。該透鏡60的球心61位於該腔體20的上方，更進一步說明，該球心61是位於該透鏡60之下表面63與該填充材料層40之上表面41的交界面上。The lens 60 preferably has a light transmittance between 260 and 320 nm of more than 80%, and is located on the filling material layer 40. The lens 60 includes a groove 62 formed in a lower surface 63 thereof, and the groove 62 provides a space for placing the LED chip unit 30. The upper surface 64 of the lens 60 has an arc surface and the arc surface is a part of a spherical surface (that is, each point of the arc surface of the upper surface 64 is the same distance from the spherical center 61, for example, a hemispherical surface). The spherical center 61 of the lens 60 is located above the cavity 20. To further explain, the spherical center 61 is located at the interface between the lower surface 63 of the lens 60 and the upper surface 41 of the filling material layer 40.
該支架10和該透鏡60間有多層黏結層50。該等黏結層50的數量為三層且分別為一與該透鏡60接觸且與該透鏡60黏著性好的第一層51、一與該支架10接觸且與該支架10黏著性好的第二層52，及一位於該第一層51與該第二層52間且其材料與該腔體20中的填充材料層40之材料相同的第三層53。其中，該第一層51與該透鏡60間之附著力和該第二層52與該支架10間之附著力較佳為大於或等於2 MPa，該第三層53的厚度較佳不超過5 μm。該第一層51和該第二層52的材料較佳為含有矽膠(silicone)結構且其分子結構末端具有極性基團和非極性基團之化合物的材料，該第一層51與該第二層52的材料例如為底漆。該第三層53的材料例如為含有氟的氟樹脂或為液態(例如含有水或於高溫和紫外光下不會固化的液態矽膠等)。There are multiple adhesive layers 50 between the support 10 and the lens 60. The number of the adhesive layers 50 is three and each is a first layer 51 that is in contact with the lens 60 and has good adhesion to the lens 60, a second layer that is in contact with the bracket 10 and has good adhesion to the bracket 10 A layer 52 and a third layer 53 located between the first layer 51 and the second layer 52 and having the same material as that of the filling material layer 40 in the cavity 20. The adhesion between the first layer 51 and the lens 60 and the adhesion between the second layer 52 and the bracket 10 are preferably greater than or equal to 2 MPa, and the thickness of the third layer 53 is preferably not more than 5 μm. The material of the first layer 51 and the second layer 52 is preferably a material containing a silicon structure and a compound having a polar group and a non-polar group at the end of its molecular structure. The first layer 51 and the second layer 51 The material of the layer 52 is, for example, a primer. The material of the third layer 53 is, for example, a fluorine-containing fluororesin or a liquid (for example, liquid silicone containing water or not curing under high temperature and ultraviolet light).
需說明的是，在本實施例中，該等黏結層50的數量並不限於為三層，參閱圖3，該等黏結層50的數量也可以為五層，且該等黏結層50分別為一與該透鏡60接觸的第一層51、一與該支架10接觸的第二層52、一位於該第一層51與該第二層52間的第三層53、一位於該第一層51與該第三層53間的第四層54，及一位於該第二層52與該第三層53間的第五層55。該第一層51、該第二層52及該第三層53的材料分別同於圖2中該第一層51、該第二層52及該第三層53的材料，該第四層54主要是用於增強該第一層51與該第三層53間的黏著力；該第五層55主要是要用於增強該第二層52與該第三層53間的黏著力。該第四層54和該第五層55的材料分別可為其分子結構末端含有羧基(-COOH)、氫(-H)或不飽和鍵的氟樹脂或油脂類材料，例如Nusil公司的SP-120。補充說明的是，前述第四層54與第五層55的材料也可以作為該第一層51或該第二層52的材料。It should be noted that, in this embodiment, the number of the adhesive layers 50 is not limited to three layers. Referring to FIG. 3, the number of the adhesive layers 50 may also be five layers, and the adhesive layers 50 are respectively A first layer 51 in contact with the lens 60, a second layer 52 in contact with the bracket 10, a third layer 53 between the first layer 51 and the second layer 52, and a first layer A fourth layer 54 between 51 and the third layer 53 and a fifth layer 55 between the second layer 52 and the third layer 53. The materials of the first layer 51, the second layer 52, and the third layer 53 are the same as those of the first layer 51, the second layer 52, and the third layer 53 in FIG. 2, and the fourth layer 54 The fifth layer 55 is mainly used to enhance the adhesion between the first layer 51 and the third layer 53; the fifth layer 55 is mainly used to enhance the adhesion between the second layer 52 and the third layer 53. The material of the fourth layer 54 and the fifth layer 55 may be fluororesin or oil-based materials containing carboxyl (-COOH), hydrogen (-H) or unsaturated bonds at the ends of the molecular structure, for example, SP- 120. It is added that the materials of the fourth layer 54 and the fifth layer 55 can also be used as the materials of the first layer 51 or the second layer 52.
此外，在本實施例中，該等黏結層50的其中一層也可為非連續層，例如參閱圖4，該第三層53為非連續層。In addition, in this embodiment, one of the bonding layers 50 may be a discontinuous layer. For example, referring to FIG. 4, the third layer 53 is a discontinuous layer.
本實施例提供的紫外LED封裝結構，其通過包括一凹槽的透鏡，並且該透鏡與該LED芯片單元間還設有該填充材料層，大大地提升了出光效率，相對於常規紫外LED封裝結構，光效提升幅度達到30%以上；又，該透鏡與該支架間為設置多層黏結層，更增強黏著力和密封性，提升了封裝結構的可靠性。The ultraviolet LED packaging structure provided by this embodiment passes a lens including a groove, and the filling material layer is further provided between the lens and the LED chip unit, which greatly improves light output efficiency. Compared with the conventional ultraviolet LED packaging structure, , The improvement of the light efficiency has reached more than 30%; in addition, a multi-layer adhesive layer is arranged between the lens and the bracket, which further enhances the adhesion and sealing performance and improves the reliability of the packaging structure.
＜< 實施例Examples 2＞2 ＞
參閱圖5，本實施例2的紫外LED封裝結構與該實施例1相似，其不同的是，本實施例2之該透鏡60的凹槽62，其表面為近半球面，有助於提升出光效率；此外，本實施例2之該透鏡60的球心61是位於該腔體20中，更進一步說明，該球心61是位於該填充材料層40中。Referring to FIG. 5, the ultraviolet LED package structure of this embodiment 2 is similar to that of this embodiment 1, except that the groove 62 of the lens 60 of this embodiment 2 has a near hemispherical surface, which helps to improve light output. In addition, the spherical center 61 of the lens 60 in this embodiment 2 is located in the cavity 20, and further, the spherical center 61 is located in the filling material layer 40.
＜< 實施例Examples 3＞3 ＞
參閱圖6，本實施例3的紫外LED封裝結構與該實施例1相似，其不同的是，本實施例3之該透鏡60的球心61是位於該腔體20的下方，更進一步說明，該球心61是位於該LED芯片單元30的下表面上。Referring to FIG. 6, the ultraviolet LED packaging structure of this embodiment 3 is similar to that of this embodiment 1, except that the spherical center 61 of the lens 60 of this embodiment 3 is located below the cavity 20, and further explained The spherical center 61 is located on the lower surface of the LED chip unit 30.
＜< 實施例Examples 4＞4 ＞
參閱圖7，本實施例4的紫外LED封裝結構與該實施例1相似，其不同的是，本實施例4之該透鏡60的球心61是位於該腔體20的上方，更進一步說明，該球心61是位於該LED芯片單元30的上表面上，且同時位於該填充材料層50的下表面上。Referring to FIG. 7, the ultraviolet LED packaging structure of the fourth embodiment is similar to that of the first embodiment, except that the spherical center 61 of the lens 60 of the fourth embodiment is located above the cavity 20. The spherical center 61 is located on the upper surface of the LED chip unit 30 and is also located on the lower surface of the filling material layer 50.
＜< 實施例Examples 5＞5 ＞
參閱圖8，本實施例5的紫外LED封裝結構與該實施例1相似，其不同的是，本實施例5之該透鏡60的球心61是位於該透鏡60的內部。Referring to FIG. 8, the ultraviolet LED package structure of this embodiment 5 is similar to that of this embodiment 1, except that the spherical center 61 of the lens 60 of this embodiment 5 is located inside the lens 60.
從實施例1~實施例5可知，該透鏡60的球心61位置可以在該支架10上表面之中心位置的法線方向上移動。雖然該球心61的位置不同，但是該紫外LED封裝結構的發光角度可以保持基本不變，維持了該紫外LED封裝結構的一致性。當封裝空間比較小時，可以選擇球心靠下的透鏡；當有足夠封裝空間時，可以選擇球心較高的透鏡，以達到較高的亮度。需補充說明的是，該透鏡60的球心61除了可位於該LED芯片單元30的上表面上或下表面上外，也可以位於該LED芯片單元30的內部。It can be known from Examples 1 to 5 that the position of the spherical center 61 of the lens 60 can be moved in the normal direction of the center position of the upper surface of the bracket 10. Although the position of the spherical center 61 is different, the light emitting angle of the ultraviolet LED package structure can be kept substantially unchanged, and the consistency of the ultraviolet LED package structure is maintained. When the packaging space is relatively small, a lens with a spherical center can be selected; when there is sufficient packaging space, a lens with a higher spherical center can be selected to achieve higher brightness. It should be added that, in addition to being located on the upper surface or the lower surface of the LED chip unit 30, the spherical center 61 of the lens 60 may also be located inside the LED chip unit 30.
＜< 實施例Examples 6＞6 ＞
參閱圖9，本實施例6的紫外LED封裝結構與該實施例1相似，其不同的是，本實施例6的該支架10呈碗杯形狀，且該支架10包括一個位於該LED芯片單元30下方的支架基部11及一個位於該支架基部11與該等黏結層50間且圍繞該填充材料層40的支架圍繞部12，本實施例可以採用衝壓等工藝，以使該支架基部10與該支架圍繞部11呈一體成型。該支架圍繞部12的內表面121具有一定的傾斜角度，因而能反射LED所發出之光線，故有助於提高紫外LED封裝結構的出光效率。Referring to FIG. 9, the ultraviolet LED packaging structure of this embodiment 6 is similar to that of this embodiment 1, except that the bracket 10 of this embodiment 6 has a bowl shape, and the bracket 10 includes a LED chip unit 30. The lower bracket base 11 and a bracket surrounding portion 12 located between the bracket base 11 and the adhesive layers 50 and surrounding the filling material layer 40. In this embodiment, processes such as stamping can be used to make the bracket base 10 and the bracket The surrounding portion 11 is formed integrally. The inner surface 121 of the bracket surrounding portion 12 has a certain inclination angle, so it can reflect the light emitted by the LED, so it helps to improve the light output efficiency of the UV LED packaging structure.
＜< 實施例Examples 7＞7 ＞
參閱圖10，本實施例7的紫外LED封裝結構與該實施例6相似，其不同的是，本實施例7的該透鏡60還包括一位於該填充材料層40與該等黏結層50上的底平面層65及一位於該底平面層65遠離該填充材料層40之一側上的上透鏡層66。較佳地，該透鏡60的球心61是位於該底平面層65上。特別說明的是，於封裝過程中，由於吸嘴能吸住該底平面層65，因而使該透鏡60的取放更方便，封裝上更加簡便。Referring to FIG. 10, the ultraviolet LED packaging structure of this embodiment 7 is similar to that of this embodiment 6, except that the lens 60 of this embodiment 7 further includes a filler material layer 40 and the bonding layers 50. The bottom plane layer 65 and an upper lens layer 66 on one side of the bottom plane layer 65 away from the filling material layer 40. Preferably, the spherical center 61 of the lens 60 is located on the bottom plane layer 65. In particular, during the packaging process, since the suction nozzle can hold the bottom plane layer 65, the lens 60 is more convenient to take and place, and the packaging is more convenient.
＜< 實施例Examples 8＞8 ＞
參閱圖11，本實施例8的紫外LED封裝結構與該實施例7相似，其不同的是，本實施例8之該透鏡60的球心61位於該支架10的上表面上，且同時位於該LED芯片單元30的下表面上。Referring to FIG. 11, the ultraviolet LED packaging structure of this embodiment 8 is similar to that of this embodiment 7, except that the spherical center 61 of the lens 60 of this embodiment 8 is located on the upper surface of the bracket 10 and is also located at the same time. On the lower surface of the LED chip unit 30.
＜< 實施例Examples 9＞9 ＞
參閱圖12，本實施例9的紫外LED封裝結構與實施例6相似，其不同的是，本實施例9的該支架基部11與該支架圍繞部12分別為獨立加工成型，且該支架圍繞部12之內表面121的傾斜角度可以根據發光角度需要進行調整，此外，該支架圍繞部12之內表面121上還可以增設高反射塗層，以進一步增強封裝結構的發光效率。Referring to FIG. 12, the ultraviolet LED package structure of this embodiment 9 is similar to that of embodiment 6, except that the bracket base portion 11 and the bracket surrounding portion 12 of this embodiment 9 are separately processed and formed, and the bracket surrounding portion The inclination angle of the inner surface 121 of 12 can be adjusted according to the light emission angle. In addition, a highly reflective coating can be added to the inner surface 121 of the bracket surrounding portion 12 to further enhance the luminous efficiency of the packaging structure.
惟以上所述者，僅為本發明的實施例而已，當不能以此限定本發明實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾，皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, any simple equivalent changes and modifications made according to the scope of the patent application and the contents of the patent specification of the present invention are still Within the scope of the invention patent.
10‧‧‧支架10‧‧‧ Bracket
30‧‧‧LED芯片單元30‧‧‧LED chip unit
11‧‧‧支架基部11‧‧‧ support base
40‧‧‧填充材料層40‧‧‧filler layer
12‧‧‧支架圍繞部12‧‧‧ bracket surrounding
41‧‧‧上表面41‧‧‧upper surface
121‧‧‧內表面121‧‧‧Inner surface
50‧‧‧黏結層50‧‧‧ Adhesive layer
20‧‧‧腔體20‧‧‧ Cavity
51‧‧‧第一層51‧‧‧First floor
52‧‧‧第二層52‧‧‧Second floor
62‧‧‧凹槽62‧‧‧Groove
53‧‧‧第三層53‧‧‧third floor
63‧‧‧下表面63‧‧‧ lower surface
54‧‧‧第四層54‧‧‧Fourth floor
64‧‧‧上表面64‧‧‧ Top surface
55‧‧‧第五層55‧‧‧Fifth floor
65‧‧‧底平面層65‧‧‧ bottom plane layer
60‧‧‧透鏡60‧‧‧ lens
66‧‧‧上透鏡層66‧‧‧ Upper lens layer
61‧‧‧球心 61‧‧‧ Heart
本發明的其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一剖面示意圖，說明本發明紫外LED封裝結構的實施例1； 圖2是一剖面示意圖，說明該實施例1之紫外LED封裝結構的黏結層； 圖3是一剖面示意圖，說明該實施例1之紫外LED封裝結構的黏結層； 圖4是一剖面示意圖，說明該實施例1之紫外LED封裝結構的黏結層； 圖5是一剖面示意圖，說明本發明紫外LED封裝結構的實施例2； 圖6是一剖面示意圖，說明本發明紫外LED封裝結構的實施例3； 圖7是一剖面示意圖，說明本發明紫外LED封裝結構的實施例4； 圖8是一剖面示意圖，說明本發明紫外LED封裝結構的實施例5； 圖9是一剖面示意圖，說明本發明紫外LED封裝結構的實施例6； 圖10是一剖面示意圖，說明本發明紫外LED封裝結構的實施例7； 圖11是一剖面示意圖，說明本發明紫外LED封裝結構的實施例8；及 圖12是一剖面示意圖，說明本發明紫外LED封裝結構的實施例9。Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic cross-sectional view illustrating Embodiment 1 of the ultraviolet LED packaging structure of the present invention; FIG. 2 is a cross-sectional schematic view, Describe the adhesive layer of the ultraviolet LED packaging structure of the first embodiment; FIG. 3 is a schematic cross-sectional view illustrating the adhesive layer of the ultraviolet LED packaging structure of the first embodiment; FIG. 4 is a schematic cross-sectional view of the ultraviolet LED of the first embodiment. Bonding layer of the packaging structure; FIG. 5 is a schematic cross-sectional view illustrating Embodiment 2 of the UV LED packaging structure of the present invention; FIG. 6 is a schematic cross-sectional view illustrating Embodiment 3 of the UV LED packaging structure of the present invention; FIG. 7 is a schematic cross-sectional view Example 4 illustrating the ultraviolet LED packaging structure of the present invention; FIG. 8 is a schematic cross-sectional view illustrating the fifth embodiment of the ultraviolet LED packaging structure of the present invention; FIG. 10 is a schematic cross-sectional view illustrating Embodiment 7 of the ultraviolet LED packaging structure of the present invention; FIG. 11 is a schematic cross-sectional view illustrating Embodiment 8 of the ultraviolet LED packaging structure of the present invention; and FIG. 12 is a schematic cross-sectional view illustrating Embodiment 9 of the ultraviolet LED packaging structure of the present invention.
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| CN201711092487.0A CN108134007B (en) | 2017-11-08 | 2017-11-08 | A kind of ultraviolet LED encapsulating structure |
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| KR102334936B1 (en) * | 2017-11-08 | 2021-12-02 | 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 | UV LED Packaging Structure |
| US11626547B2 (en) | 2017-11-08 | 2023-04-11 | Xiamen Sanan Optoelectronics Technology, Co., Ltd. | UV LED device |
| JP7165203B2 (en) * | 2018-11-19 | 2022-11-02 | 泉州三安半導体科技有限公司 | UV package element |
| CN112397487B (en) * | 2019-08-12 | 2024-04-09 | 湖北三安光电有限公司 | Light emitting device, manufacturing method thereof, display screen comprising light emitting device and lighting fixture |
| JP7452446B2 (en) | 2021-01-13 | 2024-03-19 | 豊田合成株式会社 | ultraviolet light emitting device |
| WO2023272686A1 (en) * | 2021-07-01 | 2023-01-05 | 泉州三安半导体科技有限公司 | Light-emitting device |
| CN117148619A (en) * | 2022-09-28 | 2023-12-01 | 惠州视维新技术有限公司 | Lens, backlight module, display device and manufacturing method of backlight module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011197028A (en) * | 2010-03-17 | 2011-10-06 | Panasonic Corp | Lens with supporting frame, and optical semiconductor device |
| KR102227774B1 (en) * | 2014-10-23 | 2021-03-16 | 삼성전자주식회사 | Method for manufacturing light emitting diode package |
| CN106848031A (en) * | 2015-12-04 | 2017-06-13 | 财团法人工业技术研究院 | The encapsulating structure of ultraviolet light-emitting diodes |
| CN105845814B (en) * | 2016-05-04 | 2019-03-05 | 华中科技大学 | A kind of ultraviolet LED encapsulating structure and preparation method thereof |
| CN106784243B (en) * | 2016-12-27 | 2019-07-19 | 广东晶科电子股份有限公司 | A kind of deep ultraviolet LED packaging and preparation method thereof |
-
2017
- 2017-11-08 CN CN201711092487.0A patent/CN108134007B/en active Active
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- 2018-10-17 TW TW107136556A patent/TW201919260A/en unknown
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| Publication number | Publication date |
|---|---|
| CN108134007A (en) | 2018-06-08 |
| CN108134007B (en) | 2019-05-10 |
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