TW201913857A - Cracking device - Google Patents
Cracking device Download PDFInfo
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- TW201913857A TW201913857A TW107128155A TW107128155A TW201913857A TW 201913857 A TW201913857 A TW 201913857A TW 107128155 A TW107128155 A TW 107128155A TW 107128155 A TW107128155 A TW 107128155A TW 201913857 A TW201913857 A TW 201913857A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
本發明係關於一種將經形成劃線之基板沿著該劃線分斷之裂斷裝置。The present invention relates to a severing device for cutting a scribe line formed substrate along the scribe line.
於分斷玻璃等脆性材料基板之加工時，例如專利文獻1與專利文獻2所揭示，使用劃線輪等槽加工用工具於基板表面形成劃線。其後，藉由將經形成劃線之面朝下，自基板之上方使沿著劃線延長之裂斷棒下降並按壓，使脆性材料基板於緩衝薄板上稍撓曲為V字狀，而使龜裂自劃線起向深處方向滲透，並沿著劃線裂斷。When processing a substrate made of a brittle material such as glass, for example, as disclosed in Patent Literature 1 and Patent Literature 2, a groove is formed on the surface of the substrate using a groove processing tool such as a scribing wheel. After that, the scribe line is faced downward, and the breaking rod extending along the scribe line is lowered and pressed from above the substrate, so that the brittle material substrate is slightly deflected into a V shape on the buffer sheet, and Make the crack penetrate deep from the scribe line and break along the scribe line.
又，於專利文獻3，提出有於此種裂斷裝置之裂斷棒之左右設置包含彈性體之擋板部，且於裂斷時藉由擋板片擴開脆性材料基板之裂斷裝置。 [先前技術文獻] [專利文獻]Further, in Patent Document 3, a cracking device is proposed in which a baffle portion including an elastic body is provided on the left and right of a cracking rod of such a cracking device, and a fragile material substrate is expanded by a baffle sheet during cracking. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利第3787489號公報 [專利文獻2]日本專利特開平10-330125號公報 [專利文獻3]日本專利特開平2012-218247號公報[Patent Literature 1] Japanese Patent No. 3787489 [Patent Literature 2] Japanese Patent Laid-Open No. 10-330125 [Patent Literature 3] Japanese Patent Laid-Open No. 2012-218247
[發明所欲解決之問題][Problems to be solved by the invention]
根據先前以來之裂斷裝置，於藉由裂斷棒而將脆性材料基板撓曲為V字狀並分斷時，左右的基板之鄰接之上端緣部分以彼此推擠般干涉並產生小缺損之傷痕。若產生此種缺損，則即使為微小之缺損亦自該處於裂斷後之基板之表面產生裂紋等，有產生不良品之可能性之問題點。又，若產生缺損之微小片殘留於緩衝薄板，則於下次裂斷時，有損傷脆性材料基板之虞。According to the previous cracking device, when the brittle material substrate is bent into a V shape by the cracking rod and broken, the adjacent upper edge portions of the left and right substrates interfere with each other and cause small defects. Bruises. If such a defect occurs, even a small defect may cause cracks from the surface of the substrate after the crack, and there is a problem that a defective product may be generated. In addition, if the microchip having a defect is left on the buffer sheet, there is a possibility that the brittle material substrate may be damaged at the next break.
成裂斷對象之脆性材料基板係經貼合之基板，有於形成格子狀之多數個功能區域之間形成密封材之情形。將此種基板於每個功能區域於密封區域之部***斷之情形時，於密封材料之部分有龜裂未充分浸透，分斷變難之問題點。The brittle material substrate to be fractured is a bonded substrate, and a sealing material may be formed between a plurality of functional regions forming a grid. When such a substrate is broken at a part of each functional area in a sealing area, there is a problem that cracks in the sealing material are not sufficiently penetrated, and breaking becomes difficult.
又，根據先前以來之裂斷裝置，有需要以將裂斷棒之前端部分成為基板之劃線之正上方之方式配置脆性材料基板並使之垂直地下降，於脆性材料基板之定位上花費功夫之問題點。In addition, according to the previous cracking device, it is necessary to arrange the brittle material substrate so that the front end portion of the cracking rod is directly above the scribe line of the substrate and lower it vertically, and it takes time to locate the brittle material substrate. The problem point.
又於專利文獻3之裂斷裝置中雖藉由擋板部而拉離脆性材料基板，但有無法確實地控制拉離間隔之問題點。In the breaking device of Patent Document 3, although the brittle material substrate is pulled away by the baffle portion, there is a problem that the pulling distance cannot be controlled reliably.
本發明之目的在於提供無需將脆性材料基板正確地配置於平台上，於分斷時分斷端面未彼此干涉，可無缺損地獲得完美分斷端面之裂斷裝置。 [解決問題之技術手段]The purpose of the present invention is to provide a cracking device that does not need to correctly arrange the brittle material substrate on the platform, and the cutting end faces do not interfere with each other at the time of cutting, and can obtain a perfect cutting end face without defects. [Technical means to solve the problem]
為了解決該課題，本發明之裂斷裝置具備：基板支持機構，其支撐經形成劃線之脆性材料基板；裂斷棒本體，其保持於上述基板支持機構之上部自如上下移動，且剖面形成為T字狀；側棒，其彈性地保持於剖面為T字狀之上述裂斷棒本體之下表面之兩側，於下表面具有摩擦構件，以對於裂斷棒本體保持平行狀態於特定範圍內沿上下方向及自上述裂斷棒本體遠離之方向自如移動；及移動機構，其於上述脆性材料基板之按壓時使上述側棒之至少一者沿自基板之劃線遠離之方向移動。In order to solve this problem, the breaking device of the present invention includes: a substrate supporting mechanism that supports a substrate made of a brittle material formed by scribe lines; a breaking rod body that is held on the upper portion of the substrate supporting mechanism to move up and down freely, and has a cross section formed as T-shaped; side rods, which are elastically held on both sides of the lower surface of the fractured rod body with a T-shaped cross section, and have friction members on the lower surface to keep the fractured rod body in a parallel state within a specific range Freely move in the up-down direction and a direction away from the fractured rod body; and a moving mechanism that moves at least one of the side bars in a direction away from the scribe line of the substrate when the brittle material substrate is pressed.
於此處上述移動機構亦可具備：擴展構件，其設置於上述裂斷棒本體之側面；及輥軸，其配置於上述側棒之與上述裂斷棒之側面對向之面，且接觸於上述裂斷棒本體及上述擴展構件之斜面。Here, the moving mechanism may further include: an expansion member provided on a side surface of the fractured rod body; and a roller shaft disposed on a side of the side rod that is opposite to the side surface of the fractured rod, and in contact with The fractured rod body and the inclined surface of the extension member.
於此處上述移動機構亦可具備：擴展構件，其設置於上述側棒之側面；及輥軸，其配置於上述側棒之與上述裂斷棒之側面對向之面，且接觸於上述擴展構件之斜面。Here, the moving mechanism may further include: an expansion member provided on a side surface of the side rod; and a roller shaft disposed on a side of the side rod that is opposite to the side surface of the broken rod and in contact with the extension The slope of the component.
於此處亦可進而具有彈性地連結上述一對側棒之彈性連結機構。 [發明之效果]Here, an elastic connection mechanism for elastically connecting the pair of side bars may be further provided. [Effect of the invention]
根據具有此種特徵之本發明，向下按壓裂斷棒並藉由摩擦構件以劃線為中心藉由向兩側擴展使脆性材料基板自劃線起向左右分斷。此時因左右之分斷端面拉離，故有分斷端面不會彼此干涉，能夠獲得無缺損並完美之分斷面之效果。於分斷時拉離分斷剖面之間隔可藉由擴展構件之形狀成為所期望之值。According to the present invention having such a feature, the fragile material substrate is divided from the scribe line to the left and right by compressing the rupture rod downward and spreading to both sides with the friction member centered on the scribe line. At this time, because the left and right split end faces are pulled away, the split end faces do not interfere with each other, and a flawless and perfect split effect can be obtained. The interval at which the section is pulled apart at the time of breaking can be a desired value by the shape of the expansion member.
又於本發明中無需以劃線位於裂斷棒之正下方之方式定位基板，故亦無產生定位不良之問題點之虞。進而，於分斷貼合基板之情形時上下之基板之劃線之位置無需一致。In the present invention, it is not necessary to position the substrate in such a manner that the scribe line is located directly below the breaking rod, so there is no risk of a problem of poor positioning. Furthermore, when the bonded substrates are separated, the positions of the scribe lines of the upper and lower substrates need not be the same.
接著對本發明之實施形態之裂斷裝置進行詳細說明。圖1係顯示本實施形態之裂斷裝置之一例之立體圖，圖2係裂斷棒全體之立體圖。裂斷裝置10具備載置應分斷脆性材料基板11(例如貼合基板)之平台12。該平台12可沿著水平軌道13a、13b向Y方向移動，且藉由由馬達14而旋轉之螺旋軸15予以驅動。又，平台12可藉由內建馬達之驅動部16於水平面內旋轉。另平台12與該移動及旋轉機構構成支持脆性材料基板11之基板支持機構。Next, a cracking device according to an embodiment of the present invention will be described in detail. FIG. 1 is a perspective view showing an example of the breaking device of the present embodiment, and FIG. 2 is a perspective view of the entire breaking rod. The breaking device 10 includes a stage 12 on which a brittle material substrate 11 (for example, a bonded substrate) is placed. The platform 12 can move in the Y direction along the horizontal rails 13 a and 13 b and is driven by a screw shaft 15 rotated by a motor 14. In addition, the platform 12 can be rotated in a horizontal plane by a driving portion 16 with a built-in motor. In addition, the platform 12 and the moving and rotating mechanism constitute a substrate supporting mechanism that supports the brittle material substrate 11.
本實施形態之裂斷裝置以跨越平台12上之方式設置橋接部17，該橋接部17具備於平台12之兩側之支持柱17a、17b及向X方向延伸之橫棧17c、17d。於該橫棧17c之中央設置馬達18。馬達18之旋轉力傳遞至垂直之一對軸部19，構成為藉由軸部19使裂斷棒20可對於平台12保持平行之狀態進行上下升降。The breaking device of this embodiment is provided with a bridging portion 17 across the platform 12. The bridging portion 17 includes support columns 17 a and 17 b on both sides of the platform 12 and horizontal stacks 17 c and 17 d extending in the X direction. A motor 18 is provided in the center of the horizontal stack 17c. The rotation force of the motor 18 is transmitted to a pair of vertical shaft portions 19, and the split rod 20 can be vertically moved up and down by the shaft portion 19 while maintaining the parallel to the platform 12.
裂斷棒20如圖2所示，係配合成裂斷對象之脆性材料基板11之尺寸沿水平方向延長之長條構件。裂斷棒20具有剖面T字形之裂斷棒本體21，與設置於裂斷棒本體21之左右下方之一對側棒22、23。裂斷棒本體21包含上部之細長之平板狀構件即頂棒21a，與自頂棒之中央部向下方垂直地突出之中心棒21b。As shown in FIG. 2, the breaking rod 20 is an elongated member that extends along the horizontal direction in the size of the brittle material substrate 11 to be broken. The breaking rod 20 includes a breaking rod body 21 having a T-shaped cross section, and a pair of side rods 22 and 23 provided on the left and right lower sides of the breaking rod body 21. The broken rod body 21 includes a top rod 21a, which is an elongated flat plate-shaped member at the upper portion, and a center rod 21b protruding vertically downward from the center portion of the top rod.
接著對裂斷棒本體21進行詳細地說明。圖3係顯示使裂斷棒本體21之上下反轉之狀態之立體圖。圖4(a)係裂斷棒本體21之剖視圖。如圖3所示於中心棒21b之右側面，於自裂斷棒本體之端部隔開特定間隔之位置設置一對擴展構件24a、24b。該擴展構件係如於圖4剖面所顯示之三角柱狀之構件，該斜面構成為隨著如圖示般自下側朝上沿右側方變寬。又，於中心棒21b之與擴展構件24a、24b對應之左側面，亦設置與擴展構件24a、24b對稱之形狀之擴展構件25a、25b。Next, the broken rod body 21 will be described in detail. FIG. 3 is a perspective view showing a state where the fractured rod body 21 is reversed up and down. Fig. 4 (a) is a cross-sectional view of the broken rod body 21. As shown in FIG. 3, a pair of expansion members 24 a and 24 b are provided on the right side of the center rod 21 b at positions spaced apart from each other at the ends of the self-split rod body. The expansion member is a triangular columnar member as shown in the cross-section of FIG. 4, and the inclined surface is configured to widen from the lower side to the right side as shown in the figure. Further, on the left side of the center rod 21b corresponding to the expansion members 24a, 24b, expansion members 25a, 25b having a shape symmetrical to the expansion members 24a, 24b are also provided.
於頂棒21a之下表面右側設置圖3、圖4(a)所示之圓形之凹槽26a、26b。又，以隔著中心棒21b於左側之下表面，設置圖4(a)所示之凹槽27a、27b。又，如圖3所示於中心棒21b之下表面，設置與長邊方向正交之一對槽28a、28b。On the right side of the lower surface of the top rod 21a, circular grooves 26a and 26b shown in Figs. 3 and 4 (a) are provided. Further, grooves 27a and 27b shown in Fig. 4 (a) are provided on the lower left surface via the center rod 21b. Moreover, as shown in FIG. 3, a pair of grooves 28a, 28b are provided on the lower surface of the center rod 21b orthogonal to the longitudinal direction.
接著就側棒22、23與該連結構件利用圖5進行說明。側棒22、23係於中央隔著中心棒21b以彼此成對之方式設置之與裂斷棒本體21相同長度之角柱狀之構件。於側棒22之上表面，於與頂棒21a之朝下設置之圓形凹槽26a、26b對應之位置，亦設置2個部位之圓形凹槽31a、31b。於側棒23之上表面，於與頂棒21a之朝下設置之圓形凹槽27a、27b對應之位置，亦設置2個部位之凹槽32a、32b。且於凹槽26a與31a，凹槽26b與31b，以貫通該等之方式嵌入2個螺旋彈簧33a、33b。同樣地於凹槽27a與32a，凹槽27b與32b中，以貫通該等之方式嵌入2個螺旋彈簧34a、34b。Next, the side bars 22 and 23 and this connection member are demonstrated using FIG. 5. FIG. The side rods 22 and 23 are angular pillar-shaped members of the same length as the split rod body 21 provided in the center with the center rod 21b in pairs with each other. On the upper surface of the side bar 22, at two positions corresponding to the circular grooves 26a and 26b provided downward of the top bar 21a, circular grooves 31a and 31b are also provided. On the upper surface of the side bar 23, grooves 32a and 32b are also provided at two positions corresponding to the circular grooves 27a and 27b provided downward of the top bar 21a. In the grooves 26a and 31a, the grooves 26b and 31b are inserted into the two coil springs 33a and 33b in such a manner as to penetrate therethrough. Similarly, in the grooves 27a and 32a and the grooves 27b and 32b, two coil springs 34a and 34b are inserted so as to penetrate through them.
又，於側棒22之左側側面嵌設有一對輥軸35a、35b。輥軸35a、35b可自由地旋轉，且形成為一部分自左側面突出。於側棒23之右側側面亦同樣嵌設有一對輥軸36a、36b。輥軸36a、36b可自由地旋轉，且形成為一部分自右側面突出。進而，於側棒22、23之下表面，貼附有用於以側棒22、23按壓基板時賦予摩擦力之摩擦板37、38。A pair of roller shafts 35a and 35b are fitted on the left side surface of the side bar 22. The roller shafts 35a and 35b are freely rotatable, and are formed so that a part may protrude from a left side surface. Similarly, a pair of roller shafts 36a and 36b are embedded in the right side surface of the side bar 23. The roller shafts 36a and 36b are freely rotatable, and are formed so that a part may protrude from a right side surface. Further, friction plates 37 and 38 are attached to the lower surfaces of the side bars 22 and 23 for imparting frictional force when the substrate is pressed by the side bars 22 and 23.
進而左右之側棒22、23於輥軸35a、35b之外側之左側面設置圓形之凹槽39a、39b，於個別對應之位置同樣地於側棒23亦於對應之右側面設置凹槽。該等凹槽，藉由收納於形成於中心棒21b之下表面之槽28a、28b而張設之螺旋彈簧41a、41b予以連結。通常藉由螺旋彈簧41a、41b使輥軸35a、35b、36a、36b接觸於中心棒21b之左右側壁，並規定側棒22、23之左右方向之位置。該等螺旋彈簧33a、33b、34a、34b、41a、及41b係對於裂斷棒本體21彈性地支持一對側棒22、23，並可於上下及左右移動之彈性連結構件。Further, the left and right side bars 22, 23 are provided with circular grooves 39a, 39b on the left side of the outer side of the roller shafts 35a, 35b, and the corresponding corresponding positions are also provided on the side bars 23 and the corresponding right side surfaces. The grooves are connected by coil springs 41a and 41b which are accommodated in grooves 28a and 28b formed on the lower surface of the center rod 21b. The roll shafts 35a, 35b, 36a, and 36b are usually brought into contact with the left and right side walls of the center rod 21b by the coil springs 41a and 41b, and the left and right positions of the side rods 22 and 23 are defined. The coil springs 33a, 33b, 34a, 34b, 41a, and 41b are elastic connecting members that elastically support the pair of side bars 22 and 23 for the broken rod body 21 and can move up, down, and left and right.
於此處，擴展構件24a、24b、25a、25b與輥軸35a、35b、36a、36b構成隨著裂斷棒20之下降使側棒22、23沿左右擴展之方式移動之移動機構。Here, the expansion members 24a, 24b, 25a, and 25b and the roller shafts 35a, 35b, 36a, and 36b constitute a moving mechanism that moves the side bars 22 and 23 to expand left and right as the breaking bar 20 descends.
另，如圖1所示，於橫棧17d安裝：相機51，其用以檢測脆性材料基板11之位置；及監視器52，其顯示以相機51拍攝之圖像。相機51藉由拍攝設置於平台12上之脆性材料基板11之角部表面之位置特定用之定位標記，而檢測脆性材料基板11之位置。若定位標記位於基準設定位置，則開始裂斷作業。In addition, as shown in FIG. 1, mounted on the horizontal stack 17 d: a camera 51 for detecting the position of the brittle material substrate 11; and a monitor 52 for displaying an image taken by the camera 51. The camera 51 detects the position of the fragile material substrate 11 by photographing positioning marks for specifying the position of the corner surface of the fragile material substrate 11 provided on the platform 12. If the positioning mark is at the reference setting position, the breaking operation is started.
接著，對該裂斷裝置之動作利用圖6~圖10進行說明。脆性材料基板11作為貼合基板，以前段之裂斷步驟於2片基板之兩面形成劃線S。且如圖1所示，以該劃線S平行於裂斷棒20之長度方向之方式載置於平台12上。接著，使平台11移動使脆性材料基板11之應分斷之劃線S定位於裂斷棒20之中心棒21b下方。此時如圖6所示安裝於側棒22、23之輥軸35a、35b、36a、36b接觸於中心棒21b之側壁。Next, the operation of the breaking device will be described with reference to FIGS. 6 to 10. The brittle material substrate 11 is used as a bonding substrate, and the slicing step S is formed on both sides of the two substrates in the previous step of breaking. And as shown in FIG. 1, the scribe line S is placed on the platform 12 in such a manner that the scribe line S is parallel to the length direction of the breaking rod 20. Next, the platform 11 is moved so that the scribe line S of the brittle material substrate 11 to be broken is positioned below the center rod 21 b of the breaking rod 20. At this time, as shown in FIG. 6, the roller shafts 35a, 35b, 36a, and 36b mounted on the side bars 22 and 23 contact the side walls of the center bar 21b.
接著如圖7所示若使裂斷棒20下降，則最初左右之側棒22、23之摩擦板37、38隔著劃線S接觸於脆性材料基板11之左右兩邊部分。再者，若使裂斷棒20下降，則如圖8所示使側棒22、23之螺旋彈黃33a、33b、34a、34b收縮，將脆性材料基板11如箭頭符號般向下方向按壓。再者，若裂斷棒20下降，則如圖9所示輥軸35a、35b、36a、36b分別與擴展構件24a、24b、25a、25b接觸，使側棒22向右下方位移，使側棒23向左下方位移。此時，因於側棒22、23之下表面設置摩擦板37、38，故如箭頭符號所示朝下方及左右位移之力作用於以脆性材料基板11之劃線S為中心向左右分離之方向。因此於脆性材料基板11之劃線S產生裂斷並向深處方向滲透，自劃線S將脆性材料基板11裂斷。若於此狀態下使裂斷棒20進一步下降，則如圖10所示側棒22、23之摩擦構件將脆性材料基板11向左右擴展並按壓，完成裂斷。於該分斷時，由於脆性材料基板11接受朝自劃線S遠離之方向的力(賦壓)，故與分斷同時將脆性材料基板11之鄰接之左右之分斷端面拉離，端面不會產生彼此接觸等之干涉。藉此，不會發生缺損等之傷痕，可獲得端面強度優異之分斷面。Next, as shown in FIG. 7, when the breaking rod 20 is lowered, the friction plates 37 and 38 of the left and right side rods 22 and 23 contact the left and right sides of the brittle material substrate 11 through the scribe line S, respectively. Furthermore, when the breaking rod 20 is lowered, the spiral elastic yellows 33a, 33b, 34a, and 34b of the side rods 22 and 23 are contracted as shown in FIG. 8, and the brittle material substrate 11 is pressed downward as shown by an arrow symbol. Furthermore, when the breaking rod 20 is lowered, as shown in FIG. 9, the roller shafts 35a, 35b, 36a, and 36b are in contact with the expansion members 24a, 24b, 25a, and 25b, respectively. 23 Shift to the lower left. At this time, since the friction plates 37 and 38 are provided on the lower surfaces of the side bars 22 and 23, the force of downward and leftward and rightward movement as shown by the arrow symbol acts on the left and right sides separated by the scribe line S of the brittle material substrate 11. direction. Therefore, the scribe line S of the brittle material substrate 11 is broken and penetrates in a deep direction, and the brittle material substrate 11 is ruptured by the scribe line S. When the breaking rod 20 is further lowered in this state, the friction members of the side rods 22 and 23 expand the brittle material substrate 11 to the left and right and press as shown in FIG. 10 to complete the breaking. At the time of this breaking, since the brittle material substrate 11 receives a force (pressurizing) in a direction away from the scribe line S, the breaking end surfaces of the brittle material substrate 11 adjacent to each other are pulled away at the same time as the breaking, and the end surface does not Interference such as contact with each other will occur. Thereby, a flaw such as a defect does not occur, and a divided surface having excellent end face strength can be obtained.
由側棒22、23朝左右之位移而產生之朝左右之拉離之力由擴展構件24a、24b、25a、25b之形狀決定。因此，如圖4(b)所示可藉由選擇擴展構件之傾斜角度越接近垂直位移量越變小之傾斜角度而使側棒22、23朝左右之位移量任意地變化。又擴展構件並不限定於三角柱狀，亦可構成為如圖4(c)所示之圓弧狀。The left-right pull-out force generated by the lateral rods 22 and 23's displacement to the left and right is determined by the shape of the expansion members 24a, 24b, 25a, and 25b. Therefore, as shown in FIG. 4 (b), the displacement amount of the side bars 22, 23 can be arbitrarily changed by selecting the inclination angle at which the inclination angle of the expansion member becomes closer to the vertical displacement amount. The extension member is not limited to a triangular column shape, and may be configured in an arc shape as shown in FIG. 4 (c).
雖於該實施形態中將擴展構件24a、24b、25a、25b設於中心棒21b之左右側壁，於位於與此對應之位置之側棒22、23設置輥軸35a、35b、36a、36b作為移動機構，但亦可如圖11所示於中心棒21b之左右側壁設置輥軸61a、61b、62a、62b，於與此接觸之側棒22、23之側壁預先設置擴展構件63a、63b、64a、64b。於此情形時，擴展構件63a、63b、64a、64b必需構成為越向上則朝側方之突出量越小，若向下則越大。Although in this embodiment, the expansion members 24a, 24b, 25a, and 25b are provided on the left and right side walls of the center rod 21b, and the rollers 35a, 35b, 36a, and 36b are provided on the side rods 22 and 23 at corresponding positions, for movement As shown in FIG. 11, roller shafts 61a, 61b, 62a, and 62b may be provided on the left and right side walls of the center rod 21b, and extension members 63a, 63b, 64a, and 64b. In this case, the expansion members 63a, 63b, 64a, and 64b must be configured such that the more they project toward the side, the smaller the projections are, and the larger the projections are toward the bottom.
於此實施形態中由於並非藉由裂斷棒直接按壓劃線之上方，故只要於裂斷開始時劃線配置於側棒22、23之下表面之摩擦板37、38之中間即可，無需高精度地定位基板。再者，於貼合基板之上下形成劃線之情形時，亦無需使上下之劃線之位置正確地一致。又該實施形態雖對貼合基板之裂斷進行說明，但毋庸贅言，即使為單板之基板亦可進行裂斷。In this embodiment, since the upper part of the scribe line is not directly pressed by the rupture bar, it is only necessary to arrange the scribe line at the middle of the friction plates 37 and 38 on the lower surface of the side bars 22 and 23 at the beginning of the rupture. Position the substrate with high accuracy. In addition, when a scribe line is formed on the bonded substrate, the position of the scribe line on the top and bottom does not need to be exactly the same. In addition, although this embodiment describes cracking of a bonded substrate, it goes without saying that even a single-board substrate can be cracked.
又，只要藉由裂斷棒20之下降而使側棒22、23自中心棒21b向左右分離之方向變化即可，故擴展構件及輥軸只要於至少2個部位並行安裝者即可，亦可為3個部位以上。In addition, as long as the side bars 22 and 23 are separated from the center bar 21b to the left and right directions by the fall of the breaking rod 20, the extension member and the roller shaft may be installed in parallel at least at two positions. It can be 3 or more places.
又，於該實施形態中雖如圖1所示於裂斷裝置之平台上配置基板，使裂斷棒升降，但亦應用於分斷於帶式輸送機上移動之基板之裂斷裝置。於此情形時於帶式輸送機上設置橋接部17即可，帶式輸送機成基板支持機構。In this embodiment, although a substrate is arranged on the platform of the breaking device as shown in FIG. 1 to raise and lower the breaking rod, it is also applied to a breaking device that breaks the substrate moving on a belt conveyor. In this case, the bridge portion 17 may be provided on the belt conveyor, and the belt conveyor becomes a substrate supporting mechanism.
再者，於該實施形態中一對側棒以分別相對於中心棒向左右擴展，但亦可一側棒僅設為上下移動，僅另一側棒於上下移動及側方位移。又，雖於一對側棒之下表面設置摩擦板，但未必限定於板狀者，只要具有摩擦功能之摩擦機構即足夠。 [產業上之可利用性]Furthermore, in this embodiment, a pair of side bars are extended leftward and rightward relative to the center bar, but one side bar may be set to move up and down only, and only the other side bar may be moved up and down and displaced laterally. Moreover, although a friction plate is provided on the lower surface of a pair of side bars, it is not necessarily limited to a plate-shaped one, and a friction mechanism having a friction function is sufficient. [Industrial availability]
本發明係可應用於沿著劃線將玻璃基板、半導體基板、薄膜太陽電池之基板等脆性材料裂斷之裂斷裝置。The present invention is applicable to a breaking device for breaking a brittle material such as a glass substrate, a semiconductor substrate, and a substrate of a thin-film solar cell along a scribe line.
10‧‧‧裂斷裝置10‧‧‧ Splitting device
11‧‧‧脆性材料基板11‧‧‧ Brittle material substrate
12‧‧‧平台12‧‧‧ platform
13a‧‧‧水平軌道13a‧‧‧Horizon
13b‧‧‧水平軌道13b‧‧‧ horizontal orbit
14‧‧‧馬達14‧‧‧ Motor
15‧‧‧螺旋軸15‧‧‧Screw shaft
16‧‧‧驅動部16‧‧‧Driver
17a‧‧‧支持柱17a‧‧‧ support column
17b‧‧‧支持柱17b‧‧‧ support column
17c‧‧‧橫棧17c‧‧‧horizontal stack
17d‧‧‧橫棧17d‧‧‧horizontal stack
18‧‧‧馬達18‧‧‧ Motor
19‧‧‧軸部19‧‧‧ Shaft
20‧‧‧裂斷棒20‧‧‧ Splitting Rod
21‧‧‧裂斷棒本體21‧‧‧ Splitting rod body
21a‧‧‧頂棒21a‧‧‧ Top stick
21b‧‧‧中心棒21b‧‧‧Center Stick
22‧‧‧側棒22‧‧‧Side Stick
23‧‧‧側棒23‧‧‧Side Stick
24a‧‧‧擴展構件24a‧‧‧Expansion component
24b‧‧‧擴展構件24b‧‧‧Expansion component
25a‧‧‧擴展構件25a‧‧‧Expansion component
25b‧‧‧擴展構件25b‧‧‧extension component
26a‧‧‧凹槽26a‧‧‧groove
26b‧‧‧凹槽26b‧‧‧groove
27a‧‧‧凹槽27a‧‧‧groove
27b‧‧‧凹槽27b‧‧‧groove
28a‧‧‧槽28a‧‧‧slot
28b‧‧‧槽28b‧‧‧slot
31a‧‧‧凹槽31a‧‧‧groove
31b‧‧‧凹槽31b‧‧‧groove
32a‧‧‧凹槽32a‧‧‧groove
32b‧‧‧凹槽32b‧‧‧groove
33a‧‧‧螺旋彈簧33a‧‧‧ Coil Spring
33b‧‧‧螺旋彈簧33b‧‧‧ Coil Spring
34a‧‧‧螺旋彈簧34a‧‧‧ Coil Spring
34b‧‧‧螺旋彈簧34b‧‧‧helical spring
35a‧‧‧輥軸35a‧‧‧ roller
35b‧‧‧輥軸35b‧‧‧ roller
36a‧‧‧輥軸36a‧‧‧Roller
36b‧‧‧輥軸36b‧‧‧ roller
37‧‧‧摩擦板37‧‧‧ Friction plate
38‧‧‧摩擦板38‧‧‧ Friction plate
39a‧‧‧凹槽39a‧‧‧groove
39b‧‧‧凹槽39b‧‧‧groove
41a‧‧‧螺旋彈簧41a‧‧‧helical spring
41b‧‧‧螺旋彈簧41b‧‧‧helical spring
51‧‧‧相機51‧‧‧ Camera
52‧‧‧監視器52‧‧‧Monitor
61a‧‧‧輥軸61a‧‧‧Roller
61b‧‧‧輥軸61b‧‧‧ roller
62a‧‧‧輥軸62a‧‧‧Roller
62b‧‧‧輥軸62b‧‧‧ roller
63a‧‧‧擴展構件63a‧‧‧Expansion component
63b‧‧‧擴展構件63b‧‧‧extension
64a‧‧‧擴展構件64a‧‧‧Expansion component
64b‧‧‧擴展構件64b‧‧‧extension
S‧‧‧劃線S‧‧‧ crossed
X‧‧‧方向X‧‧‧ direction
Y‧‧‧方向Y‧‧‧ direction
圖1係顯示本發明之實施形態之裂斷裝置之一例之立體圖。 圖2係顯示本實施形態之裂斷棒之立體圖。 圖3係使本實施形態之裂斷棒之頂棒反轉之立體圖。 圖4(a)~(c)係顯示本實施形態及變化例之頂棒之剖視圖。 圖5係顯示本實施形態之一對側棒與其連結構件之立體圖。 圖6係顯示本實施形態之裂斷裝置之裂斷過程之剖視圖(其1)。 圖7係顯示本實施形態之裂斷裝置之裂斷過程之剖視圖(其2)。 圖8係顯示本實施形態之裂斷裝置之裂斷過程之剖視圖(其3)。 圖9係顯示本實施形態之裂斷裝置之裂斷過程之剖視圖(其4)。 圖10係顯示本實施形態之裂斷裝置之裂斷過程之剖視圖(其5)。 圖11係顯示本發明之其他實施形態之頂棒與側棒之剖視圖。FIG. 1 is a perspective view showing an example of a breaking device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a broken rod of the present embodiment. FIG. 3 is a perspective view of the ejector rod of the cracked rod in this embodiment being reversed. 4 (a)-(c) are cross-sectional views showing ejector rods according to this embodiment and a modification. FIG. 5 is a perspective view showing a pair of side bars and a connecting member thereof according to this embodiment. FIG. 6 is a sectional view (No. 1) showing the breaking process of the breaking device of the present embodiment. Fig. 7 is a sectional view (No. 2) showing the breaking process of the breaking device of the present embodiment. FIG. 8 is a sectional view (No. 3) showing the breaking process of the breaking device of the embodiment. Fig. 9 is a sectional view (No. 4) showing the breaking process of the breaking device of the present embodiment. FIG. 10 is a cross-sectional view (No. 5) showing the breaking process of the breaking device of the present embodiment. FIG. 11 is a cross-sectional view showing a top bar and a side bar according to another embodiment of the present invention.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017164274A JP2019038237A (en) | 2017-08-29 | 2017-08-29 | Break device |
| JP2017-164274 | 2017-08-29 |
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| TW201913857A true TW201913857A (en) | 2019-04-01 |
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| TW107128155A TW201913857A (en) | 2017-08-29 | 2018-08-13 | Cracking device |
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| KR (1) | KR20190024767A (en) |
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|---|---|---|---|---|
| JP4058542B2 (en) | 1997-05-30 | 2008-03-12 | 三星ダイヤモンド工業株式会社 | Substrate break device, substrate break method, substrate cutting device and substrate cutting system |
| JP3787489B2 (en) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for breaking brittle substrate |
| JP5210409B2 (en) | 2011-04-06 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | Break device |
-
2017
- 2017-08-29 JP JP2017164274A patent/JP2019038237A/en not_active Abandoned
-
2018
- 2018-08-13 TW TW107128155A patent/TW201913857A/en unknown
- 2018-08-24 CN CN201810972233.6A patent/CN109421180A/en not_active Withdrawn
- 2018-08-27 KR KR1020180100664A patent/KR20190024767A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019038237A (en) | 2019-03-14 |
| CN109421180A (en) | 2019-03-05 |
| KR20190024767A (en) | 2019-03-08 |
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