TW201842052A - 環氧樹脂組成物及電子零件裝置 - Google Patents

環氧樹脂組成物及電子零件裝置 Download PDF

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Publication number
TW201842052A
TW201842052A TW107111320A TW107111320A TW201842052A TW 201842052 A TW201842052 A TW 201842052A TW 107111320 A TW107111320 A TW 107111320A TW 107111320 A TW107111320 A TW 107111320A TW 201842052 A TW201842052 A TW 201842052A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
compound
mass
specific
Prior art date
Application number
TW107111320A
Other languages
English (en)
Chinese (zh)
Inventor
井上依子
中村真也
遠藤由則
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW201842052A publication Critical patent/TW201842052A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW107111320A 2017-03-31 2018-03-30 環氧樹脂組成物及電子零件裝置 TW201842052A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017072889 2017-03-31
JP2017-072889 2017-03-31

Publications (1)

Publication Number Publication Date
TW201842052A true TW201842052A (zh) 2018-12-01

Family

ID=63676421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111320A TW201842052A (zh) 2017-03-31 2018-03-30 環氧樹脂組成物及電子零件裝置

Country Status (4)

Country Link
JP (2) JP7212830B2 (ja)
CN (1) CN110461938A (ja)
TW (1) TW201842052A (ja)
WO (1) WO2018181813A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7255411B2 (ja) * 2019-07-30 2023-04-11 味の素株式会社 樹脂組成物
JP7415961B2 (ja) * 2021-01-14 2024-01-17 信越化学工業株式会社 有機ケイ素化合物を含むゴム組成物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0551435A (ja) * 1991-08-23 1993-03-02 Mitsui Toatsu Chem Inc エポキシ樹脂組成物
JPH1121426A (ja) * 1997-07-02 1999-01-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP2001131393A (ja) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2002128868A (ja) * 2000-10-24 2002-05-09 Japan Epoxy Resin Kk 半導体封止用エポキシ樹脂組成物
JP4096806B2 (ja) * 2003-05-13 2008-06-04 ジャパンエポキシレジン株式会社 フェノール樹脂、エポキシ樹脂用硬化剤、及びエポキシ樹脂組成物
JP2007031698A (ja) * 2005-06-21 2007-02-08 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
TWI494338B (zh) * 2009-12-14 2015-08-01 Nippon Steel & Sumikin Chem Co An epoxy resin, a method for producing the same, an epoxy resin composition and a hardened product using the same
WO2011129272A1 (ja) * 2010-04-13 2011-10-20 積水化学工業株式会社 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
JP5768529B2 (ja) * 2011-06-24 2015-08-26 三菱化学株式会社 三次元積層型半導体装置用の層間充填材組成物及びその塗布液
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
KR101480178B1 (ko) * 2011-12-20 2015-01-09 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
CN103819870B (zh) * 2012-11-16 2016-06-15 株式会社田村制作所 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
KR101518502B1 (ko) * 2012-12-26 2015-05-11 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP6198483B2 (ja) * 2013-06-28 2017-09-20 太陽インキ製造株式会社 熱硬化性樹脂組成物及びプリント配線板
JP6315170B2 (ja) * 2013-09-30 2018-04-25 ナガセケムテックス株式会社 半導体封止用エポキシ樹脂組成物、半導体実装構造体、およびその製造方法
JP6398824B2 (ja) * 2015-03-23 2018-10-03 味の素株式会社 樹脂シート
JP6555042B2 (ja) * 2015-09-17 2019-08-07 味の素株式会社 粒状樹脂組成物
KR102637946B1 (ko) * 2015-09-30 2024-02-20 세키스이가가쿠 고교가부시키가이샤 수지 조성물 및 다층 기판
CN106398112B (zh) * 2016-05-31 2019-09-13 江苏华海诚科新材料股份有限公司 一种适用于esop封装的环氧树脂组合物

Also Published As

Publication number Publication date
JP2023030182A (ja) 2023-03-07
WO2018181813A1 (ja) 2018-10-04
JPWO2018181813A1 (ja) 2020-02-06
CN110461938A (zh) 2019-11-15
JP7485009B2 (ja) 2024-05-16
JP7212830B2 (ja) 2023-01-26

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