TWI555117B - Electronic parts conveyor and electronic parts inspection device - Google Patents
Electronic parts conveyor and electronic parts inspection device Download PDFInfo
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- TWI555117B TWI555117B TW104116707A TW104116707A TWI555117B TW I555117 B TWI555117 B TW I555117B TW 104116707 A TW104116707 A TW 104116707A TW 104116707 A TW104116707 A TW 104116707A TW I555117 B TWI555117 B TW I555117B
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Description
本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The present invention relates to an electronic component conveying device and an electronic component inspection device.
先前以來,已知有例如對IC(Integrated Circuit,積體電路)器件等電子零件之電氣特性進行檢查之電子零件檢查裝置,於該電子零件檢查裝置,組裝有用以將IC器件搬送至檢查部之保持部為止之電子零件搬送裝置。於檢查IC器件時,將IC器件配置於保持部,相對於保持部對IC器件進行定位,使設置於保持部之複數個探針接腳(電極)與IC器件之各端子接觸。 In the prior art, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device is known, and the electronic component inspection device is assembled to transport the IC device to the inspection portion. The electronic component transport device up to the holding unit. When the IC device is inspected, the IC device is placed in the holding portion, and the IC device is positioned with respect to the holding portion, so that a plurality of probe pins (electrodes) provided in the holding portion are in contact with the respective terminals of the IC device.
於此種電子零件檢查裝置中,若IC器件之端子微細化,則需要將IC器件定位於保持部之定位機構。 In such an electronic component inspection apparatus, if the terminal of the IC device is made fine, it is necessary to position the IC device in the positioning mechanism of the holding portion.
於專利文獻1中記載有如下定位機構,即:利用2個按壓構件自相互正交之2個方向按壓電子零件而使其移動,並將該電子零件壓抵於設置在保持部之抵接部,藉此進行定位。 Patent Document 1 discloses a positioning mechanism that presses an electronic component in two directions orthogonal to each other by two pressing members, and presses the electronic component against a contact portion provided in the holding portion. To locate it.
[專利文獻1]日本專利特開2012-122774號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-122774
然而,於專利文獻1所記載之裝置中,電子零件搬送裝置於抓持電子零件並將其搬送至保持部,且鬆開電子零件而使其下落至保持部 內時,未對定位機構通知已鬆開電子零件,故而定位機構於並不知道電子零件何時被鬆開之情況下進行電子零件之定位。因此,有弄錯開始電子零件之定位之時序之虞,若弄錯該時序,則有損壞電子零件之虞。又,例如若以將電子零件完全配置於保持部之方式充分地推遲開始電子零件之定位之時序,則至定位結束為止需要較長之時間。 However, in the device described in Patent Document 1, the electronic component conveying device grips the electronic component and conveys it to the holding portion, and releases the electronic component to drop it to the holding portion. In the meantime, the positioning mechanism is not notified that the electronic component has been released, so the positioning mechanism performs the positioning of the electronic component without knowing when the electronic component is released. Therefore, there is a flaw in the timing of starting the positioning of the electronic component. If the timing is mistaken, the electronic component is damaged. Further, for example, if the timing of starting the positioning of the electronic component is sufficiently delayed so that the electronic component is completely disposed in the holding portion, it takes a long time until the positioning ends.
本發明之目的在於提供一種可抑制電子零件之損壞,且可迅速地將電子零件定位於保持部之電子零件搬送裝置及電子零件檢查裝置。 An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can suppress damage of an electronic component and can quickly position the electronic component to the holding portion.
本發明係為了解決上述問題之至少一部分而完成者,可設為以下之形態或應用例而實現。 The present invention has been made in order to solve at least a part of the above problems, and can be realized in the following aspects or application examples.
[應用例1] [Application Example 1]
本發明之電子零件搬送裝置之特徵在於具備:抓持部,其抓持電子零件;保持部,其保持上述電子零件;以及定位機構,其將上述電子零件定位於上述保持部之特定位置;且於上述抓持部鬆開上述電子零件之後,使上述定位機構作動而進行上述電子零件之定位。 An electronic component transporting apparatus according to the present invention includes: a gripping portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; After the grip portion releases the electronic component, the positioning mechanism is actuated to position the electronic component.
藉此,可於抓持部鬆開電子零件之後,迅速地進行電子零件之定位。又,由於在抓持部鬆開電子零件之後進行電子零件之定位,故而可抑制電子零件之損壞。 Thereby, the positioning of the electronic component can be quickly performed after the grip portion releases the electronic component. Moreover, since the positioning of the electronic component is performed after the grip portion is released from the electronic component, damage of the electronic component can be suppressed.
[應用例2] [Application Example 2]
於本發明之電子零件搬送裝置中,較佳為上述定位機構係於進行上述電子零件之定位之情形時,使用流體而使配置於上述保持部之上述電子零件移動。 In the electronic component conveying apparatus of the present invention, preferably, the positioning means moves the electronic component disposed in the holding portion by using a fluid when the electronic component is positioned.
藉此,例如對保持部噴射流體,利用該流體使電子零件移動而進行定位,藉此,與利用按壓構件壓抵電子零件而進行定位之情形相比,可抑制電子零件之損壞。 Thereby, for example, the fluid is ejected to the holding portion, and the electronic component is moved by the fluid to be positioned, whereby the damage of the electronic component can be suppressed as compared with the case where the pressing member presses the electronic component to perform positioning.
[應用例3] [Application Example 3]
於本發明之電子零件搬送裝置中,較佳為具備:搬送機構,其具有上述抓持部,且搬送上述電子零件;電子零件搬送控制部,其控制上述搬送機構之作動;以及定位控制部,其控制上述定位機構之作動;且上述電子零件搬送控制部係將通知已鬆開上述電子零件之第1信號發送至上述定位控制部。 Preferably, the electronic component transporting apparatus of the present invention includes: a transporting mechanism having the gripping portion and transporting the electronic component; an electronic component transport control unit that controls an operation of the transport mechanism; and a positioning control unit; The electronic component transport control unit transmits a first signal for notifying that the electronic component has been released to the positioning control unit.
藉此,定位控制部可獲知抓持部已鬆開電子零件,藉此,可抑制電子零件之損壞。 Thereby, the positioning control portion can know that the grip portion has released the electronic component, whereby the damage of the electronic component can be suppressed.
[應用例4] [Application Example 4]
於本發明之電子零件搬送裝置中,較佳為於發送上述第1信號之後,上述定位控制部控制上述定位機構之作動而進行上述電子零件之定位,當上述定位結束時,將通知上述定位已結束之第2信號發送至上述電子零件搬送控制部。 In the electronic component transport apparatus of the present invention, preferably, after the transmitting the first signal, the positioning control unit controls the positioning of the positioning mechanism to perform positioning of the electronic component, and when the positioning is completed, notifying that the positioning has been performed. The second signal that has ended is sent to the electronic component transport control unit.
藉此,可抑制於進行電子零件之定位之情形時電子零件損壞。 Thereby, it is possible to suppress damage of the electronic component when the electronic component is positioned.
又,電子零件搬送控制部可獲知電子零件之定位已結束,藉此,可於電子零件之定位已結束之狀態下迅速地進行下一動作之控制。 Further, the electronic component transport control unit can know that the positioning of the electronic component has been completed, whereby the control of the next operation can be quickly performed in a state where the positioning of the electronic component is completed.
[應用例5] [Application 5]
於本發明之電子零件搬送裝置中,較佳為上述定位控制部控制上述定位機構之作動而進行上述電子零件之定位,當上述定位結束時,將通知上述定位已結束之第2信號發送至上述電子零件搬送控制部。 In the electronic component transport apparatus of the present invention, preferably, the positioning control unit controls the positioning of the positioning mechanism to perform positioning of the electronic component, and when the positioning is completed, transmits a second signal indicating that the positioning has been completed to the Electronic parts transport control unit.
藉此,電子零件搬送控制部可獲知電子零件之定位已結束,藉此,可於電子零件之定位已結束之狀態下迅速地進行下一動作之控制。 Thereby, the electronic component conveyance control unit can know that the positioning of the electronic component has been completed, whereby the control of the next operation can be quickly performed in a state where the positioning of the electronic component is completed.
[應用例6] [Application Example 6]
於本發明之電子零件搬送裝置中,較佳為於發送上述第2信號之後,上述電子零件搬送控制部控制上述搬送機構之作動而使上述抓持部接近上述保持部。 In the electronic component transport apparatus of the present invention, preferably, after transmitting the second signal, the electronic component transport control unit controls the operation of the transport mechanism to bring the grip portion closer to the holding portion.
藉此,電子零件搬送控制部可於電子零件之定位已結束之狀態下,迅速地進行使抓持部接近保持部之動作之控制。 Thereby, the electronic component conveyance control unit can quickly control the operation of bringing the gripping portion closer to the holding portion in a state where the positioning of the electronic component is completed.
[應用例7] [Application Example 7]
於本發明之電子零件搬送裝置中,較佳為上述抓持部具有抽吸氣體之抽吸機構,利用上述抽吸機構而抽吸上述氣體,藉由吸附上述電子零件而抓持上述電子零件。 In the electronic component conveying apparatus of the present invention, it is preferable that the gripping portion has a suction mechanism that sucks gas, and the gas is sucked by the suction mechanism, and the electronic component is gripped by adsorbing the electronic component.
藉此,可抑制抓持部使電子零件損壞之情況。 Thereby, it is possible to suppress the damage of the electronic component by the grip portion.
[應用例8] [Application Example 8]
於本發明之電子零件搬送裝置中,較佳為上述電子零件搬送控制部係於上述抽吸機構停止上述氣體之抽吸之後,將上述第1信號發送至上述定位控制部。 In the electronic component transport apparatus of the present invention, preferably, the electronic component transport control unit transmits the first signal to the positioning control unit after the suction mechanism stops the suction of the gas.
若抽吸機構停止氣體之抽吸,則電子零件被自抓持部鬆開,故而,藉此根據發送上述第1信號而定位控制部可獲知抓持部已鬆開電子零件。 When the suction mechanism stops the suction of the gas, the electronic component is released from the grip portion, whereby the positioning control portion can know that the grip portion has released the electronic component based on the transmission of the first signal.
[應用例9] [Application Example 9]
於本發明之電子零件搬送裝置中,較佳為上述電子零件搬送控制部係於在上述抽吸機構停止上述氣體之抽吸之後經過特定時間後,將上述第1信號發送至上述定位控制部。 In the electronic component transport apparatus of the present invention, preferably, the electronic component transport control unit transmits the first signal to the positioning control unit after a lapse of a predetermined time after the suction mechanism stops the suction of the gas.
若抽吸機構停止氣體之抽吸,則電子零件被自抓持部鬆開,若 經過上述特定時間,則電子零件被配置於保持部,故而,藉此根據發送上述第1信號而定位控制部可獲知抓持部鬆開電子零件並已將電子零件配置於保持部之情況。 If the suction mechanism stops the suction of the gas, the electronic component is released from the gripping portion, if After the specific time has elapsed, the electronic component is placed in the holding portion. Therefore, the positioning control unit can know that the gripping portion has released the electronic component and has placed the electronic component on the holding portion based on the transmission of the first signal.
[應用例10] [Application Example 10]
於本發明之電子零件搬送裝置中,較佳為具備控制上述電子零件搬送裝置之作動之控制部,上述控制部係於在鬆開上述電子零件之後經過特定時間後,控制上述定位機構之作動而進行上述電子零件之定位。 In the electronic component conveying apparatus of the present invention, preferably, the control unit is configured to control the operation of the electronic component conveying device, and the control unit controls the operation of the positioning mechanism after a predetermined time has elapsed after the electronic component is released. Perform the positioning of the above electronic parts.
當於抓持部鬆開電子零件之後經過特定時間時,電子零件被配置於保持部,藉此,可於將電子零件配置於保持部之後進行電子零件之定位。 When a certain time elapses after the grip portion releases the electronic component, the electronic component is placed on the holding portion, whereby the electronic component can be positioned after the electronic component is placed on the holding portion.
[應用例11] [Application Example 11]
於本發明之電子零件搬送裝置中,較佳為具備搬送機構,該搬送機構具有上述抓持部,且搬送上述電子零件,上述控制部係當上述定位結束時,控制上述搬送機構之作動而使上述抓持部接近上述保持部。 Preferably, the electronic component transporting apparatus according to the present invention includes a transporting mechanism that includes the gripping unit and transports the electronic component, and the control unit controls the operation of the transporting mechanism when the positioning is completed. The grip portion is close to the holding portion.
藉此,控制部可於電子零件之定位已結束之狀態下,進行使抓持部接近保持部之動作之控制。 Thereby, the control unit can control the operation of bringing the grip portion closer to the holding portion in a state where the positioning of the electronic component is completed.
[應用例12] [Application Example 12]
本發明之電子零件檢查裝置之特徵在於具備:抓持部,其抓持電子零件;保持部,其保持上述電子零件;定位機構,其將上述電子零件定位於上述保持部之特定位置;以及檢查部,其檢查上述電子零件;且於上述抓持部鬆開上述電子零件之後,使上述定位機構作動而 進行上述電子零件之定位。 An electronic component inspection apparatus according to the present invention is characterized by comprising: a grip portion that grips an electronic component; a holding portion that holds the electronic component; and a positioning mechanism that positions the electronic component at a specific position of the holding portion; and a part that inspects the electronic component; and after the gripping portion releases the electronic component, the positioning mechanism is actuated Perform the positioning of the above electronic parts.
藉此,於抓持部鬆開電子零件之後,可迅速地進行電子零件之定位。又,由於在抓持部鬆開電子零件之後進行電子零件之定位,故而可抑制電子零件之損壞。 Thereby, after the electronic component is released by the grip portion, the positioning of the electronic component can be quickly performed. Moreover, since the positioning of the electronic component is performed after the grip portion is released from the electronic component, damage of the electronic component can be suppressed.
1‧‧‧檢查裝置 1‧‧‧Checking device
2‧‧‧供給部 2‧‧‧Supply Department
3‧‧‧供給側排列部 3‧‧‧Supply side alignment
4‧‧‧搬送部 4‧‧‧Transportation Department
5‧‧‧檢查部 5‧‧‧Inspection Department
6‧‧‧回收側排列部 6‧‧‧Recycling side alignment
7‧‧‧回收部 7‧‧Recycling Department
8‧‧‧控制部 8‧‧‧Control Department
9‧‧‧IC器件 9‧‧‧IC devices
10‧‧‧搬送裝置 10‧‧‧Transporting device
11‧‧‧基座 11‧‧‧Base
12‧‧‧蓋部 12‧‧‧ 盖部
41‧‧‧搬運梭 41‧‧‧Transport shuttle
42‧‧‧供給機器人 42‧‧‧Supply robot
43‧‧‧檢查機器人 43‧‧‧Check the robot
44‧‧‧回收機器人 44‧‧‧Recycling robot
51‧‧‧保持部 51‧‧‧ Keeping Department
52‧‧‧保持面 52‧‧‧ Keep face
53‧‧‧壁部 53‧‧‧ wall
54‧‧‧基板 54‧‧‧Substrate
55‧‧‧凹部 55‧‧‧ recess
81‧‧‧搬送控制部 81‧‧‧Transportation Control Department
82‧‧‧定位控制部 82‧‧‧ Positioning Control Department
83‧‧‧檢查控制部 83‧‧‧Check Control Department
91‧‧‧本體部 91‧‧‧ Body Department
92‧‧‧端子 92‧‧‧ terminals
93‧‧‧端子配置面 93‧‧‧Terminal configuration surface
100‧‧‧定位機構 100‧‧‧ Positioning mechanism
111‧‧‧基座面 111‧‧‧ base surface
131‧‧‧管體 131‧‧‧pipe body
132‧‧‧管體 132‧‧‧ tube body
133‧‧‧管體 133‧‧‧ tube body
134‧‧‧管體 134‧‧‧pipe body
141‧‧‧閥門 141‧‧‧ Valve
142‧‧‧閥門 142‧‧‧ valve
143‧‧‧閥門 143‧‧‧ valve
144‧‧‧閥門 144‧‧‧ valve
151‧‧‧泵 151‧‧‧ pump
152‧‧‧泵 152‧‧‧ pump
153‧‧‧泵 153‧‧‧ pump
154‧‧‧泵 154‧‧‧ pump
155‧‧‧抽吸泵 155‧‧ ‧ suction pump
161‧‧‧壓力感測器 161‧‧‧pressure sensor
162‧‧‧壓力感測器 162‧‧‧pressure sensor
341‧‧‧載置台 341‧‧‧mounting table
411‧‧‧袋部 411‧‧‧ Bag Department
421‧‧‧支持框架 421‧‧‧Support framework
422‧‧‧移動框架 422‧‧‧Mobile framework
423‧‧‧手單元 423‧‧‧Hand unit
431‧‧‧支持框架 431‧‧‧Support framework
432‧‧‧移動框架 432‧‧‧Mobile framework
433‧‧‧手單元 433‧‧‧Hand unit
434‧‧‧吸附噴嘴 434‧‧‧Adsorption nozzle
441‧‧‧支持框架 441‧‧‧Support framework
442‧‧‧移動框架 442‧‧‧Mobile framework
443‧‧‧手單元 443‧‧‧Hand unit
510‧‧‧保持部本體 510‧‧‧ Keeping the body
531‧‧‧傾斜面 531‧‧‧ sloped surface
551‧‧‧角部 551‧‧‧ corner
552‧‧‧角部 552‧‧‧ corner
553‧‧‧面 553‧‧‧ face
554‧‧‧面 554‧‧‧ Face
555‧‧‧面 555‧‧‧ face
556‧‧‧面 556‧‧‧ Face
1311‧‧‧開口 1311‧‧‧ openings
1321‧‧‧開口 1321‧‧‧ openings
1331‧‧‧開口 1331‧‧‧ openings
1341‧‧‧開口 1341‧‧‧ openings
S101‧‧‧步驟 S101‧‧‧Steps
S102‧‧‧步驟 S102‧‧‧Steps
S103‧‧‧步驟 S103‧‧‧Steps
S104‧‧‧步驟 S104‧‧‧Steps
S105‧‧‧步驟 S105‧‧‧Steps
S106‧‧‧步驟 S106‧‧‧Steps
S107‧‧‧步驟 S107‧‧‧Steps
S108‧‧‧步驟 S108‧‧‧Steps
S109‧‧‧步驟 S109‧‧‧Steps
S110‧‧‧步驟 S110‧‧‧Steps
S111‧‧‧步驟 S111‧‧‧Steps
S112‧‧‧步驟 S112‧‧‧Steps
S113‧‧‧步驟 S113‧‧‧ steps
S114‧‧‧步驟 S114‧‧‧Steps
S115‧‧‧步驟 S115‧‧‧Steps
S201‧‧‧步驟 S201‧‧‧ steps
S202‧‧‧步驟 S202‧‧‧Steps
S203‧‧‧步驟 S203‧‧‧Steps
S204‧‧‧步驟 S204‧‧‧Steps
S205‧‧‧步驟 S205‧‧‧Steps
S206‧‧‧步驟 S206‧‧‧ steps
S207‧‧‧步驟 S207‧‧‧Steps
O‧‧‧中心軸 O‧‧‧ center axis
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略圖。 Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.
圖2係表示圖1所示之電子零件檢查裝置之搬送部及檢查部之圖。 Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;
圖3係表示圖1所示之電子零件檢查裝置之檢查部之保持部的剖視圖。 Fig. 3 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1;
圖4係沿圖3中之A-A線之剖視圖。 Figure 4 is a cross-sectional view taken along line A-A of Figure 3.
圖5係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 FIG. 5 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.
圖6係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 Fig. 6 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1.
圖7係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 Fig. 7 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1.
圖8係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 FIG. 8 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.
圖9係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 FIG. 9 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.
圖10係用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。 FIG. 10 is a view for explaining an operation when the electronic component is positioned in the holding portion in the electronic component inspection device shown in FIG. 1.
圖11係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 11 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.
圖12係表示本發明之電子零件檢查裝置之第2實施形態中之搬送 部及檢查部的圖。 Fig. 12 is a view showing the conveyance in the second embodiment of the electronic component inspection device of the present invention; Department and inspection department map.
圖13係表示圖12所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 13 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 12.
以下,基於隨附圖式所示之實施形態,對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.
<第1實施形態> <First embodiment>
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略圖。圖2係表示圖1所示之電子零件檢查裝置之搬送部及檢查部之圖。圖3係表示圖1所示之電子零件檢查裝置之檢查部之保持部的剖視圖。圖4係沿圖3中之A-A線之剖視圖。圖5~圖10分別為用以說明於圖1所示之電子零件檢查裝置中將電子零件定位於保持部之情形時之動作的圖。圖11係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; Fig. 3 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1; Figure 4 is a cross-sectional view taken along line A-A of Figure 3. 5 to 10 are views for explaining the operation in the case where the electronic component is positioned in the holding portion in the electronic component inspection device shown in Fig. 1. Fig. 11 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1.
再者,以下,為方便起見而如圖1所示,將相互正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面成為水平,Z軸成為鉛直。又,亦將與X軸平行之方向稱為「X方向」,將與Y軸平行之方向稱為「Y方向」,將與Z軸平行之方向稱為「Z方向」。又,亦將電子零件之搬送方向之上游側簡稱為「上游側」,將電子零件之搬送方向之下游側簡稱為「下游側」。又,本案說明書中所提及之「水平」並不限定於完全水平,只要不妨礙電子零件之搬送,則亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。 In the following, for the sake of convenience, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". In addition, the upstream side of the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side of the transport direction of the electronic component is simply referred to as "downstream side". Moreover, the "level" mentioned in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.
又,將圖4~圖6、圖8、圖10中之上側稱為「上」或「上方」,將下側稱為「下」或「下方」。 In addition, the upper side in FIG. 4 to FIG. 6, FIG. 8, and FIG. 10 is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower".
又,於圖3~圖10中圖示有檢查部之4個保持部中之1個,又,圖示有搬送部之4個手單元中之1個。又,於圖3~圖10中,於保持部中省略與電子零件之端子接觸之探針接腳等之圖示。 In addition, one of the four holding parts of the inspection unit is shown in FIG. 3 to FIG. 10, and one of the four hand units of the conveyance unit is shown. In addition, in FIGS. 3 to 10, the probe pins and the like which are in contact with the terminals of the electronic component are omitted from the holding portion.
圖1所示之檢查裝置(電子零件檢查裝置)1例如為用以對BGA(Ball grid array,球柵陣列)封裝或LGA(Land grid array,平面柵格陣列)封裝等IC器件、LCD(Liquid Crystal Display,液晶顯示器)、CIS(CMOS(Complementary Metal Oxide Semiconductor)Image Sensor,互補金氧半導體影像感測器)等電子零件之電氣特性進行檢查、測試(以下簡稱為「檢查」)之裝置。再者,以下,為方便說明,以使用IC器件作為進行檢查之上述電子零件之情形為代表進行說明,將其設為「IC器件9」。而且,以下,作為該IC器件9而列舉BGA封裝為例進行說明。 The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, an IC device such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package, and an LCD (Liquid). A device for inspecting and testing (hereinafter referred to as "inspection") for electrical characteristics of electronic components such as a crystal display (Crystal Display), a CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, and a complementary MOS image sensor). In the following, for convenience of explanation, a case where the IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 9". In the following, a BGA package will be described as an example of the IC device 9.
首先,對IC器件9進行說明。 First, the IC device 9 will be described.
如圖5及圖6所示,IC器件9為BGA封裝,且具有本體部91、及設置於本體部91之外部之複數個端子(電極)92。本體部91之形狀並無特別限定,但於本實施形態中形成板狀,又,於自其厚度方向(於IC器件9被保持於保持部51之狀態下為Z方向)觀察時形成四邊形。再者,於本實施形態中,該四邊形為正方形或長方形。 As shown in FIGS. 5 and 6, the IC device 9 is a BGA package and has a body portion 91 and a plurality of terminals (electrodes) 92 provided outside the body portion 91. The shape of the main body portion 91 is not particularly limited. However, in the present embodiment, the shape is formed into a plate shape, and the square shape is formed when viewed from the thickness direction (the Z direction in the state in which the IC device 9 is held by the holding portion 51). Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle.
本體部91之圖5中下側之面為端子配置面93,複數個端子92係於該端子配置面93呈格子狀配置。又,各端子92為半圓狀之焊料球。再者,各端子92之形狀當然不限定於半圓狀。 The lower surface of the main body portion 91 in FIG. 5 is a terminal arrangement surface 93, and a plurality of terminals 92 are arranged in a lattice shape on the terminal arrangement surface 93. Further, each of the terminals 92 is a semicircular solder ball. Further, the shape of each terminal 92 is of course not limited to a semicircular shape.
其次,對檢查裝置1進行說明。 Next, the inspection apparatus 1 will be described.
如圖1所示,檢查裝置1具備具有進行IC器件9之定位之定位機構100的搬送裝置(電子零件搬送裝置)10。 As shown in FIG. 1, the inspection apparatus 1 is provided with a conveyance apparatus (electronic component conveyance apparatus) 10 which has the positioning mechanism 100 which performs the positioning of the IC device 9.
即,檢查裝置1具有供給部2、供給側排列部3、搬送部(搬送機構)4、檢查部5、回收側排列部6、回收部7、以及作為進行該等各部(檢查裝置1)之控制之控制部之搬送控制部(電子零件搬送控制部)(第1控制部)81、定位控制部(第2控制部)82及檢查控制部(第3控制部)83。再者,搬送控制部81係控制搬送部4等之作動(驅動),定位控制部82 係控制定位機構100等之作動。 In other words, the inspection device 1 includes the supply unit 2, the supply side array unit 3, the transport unit (transport mechanism) 4, the inspection unit 5, the collection side array unit 6, the collection unit 7, and the respective units (inspection unit 1). The conveyance control unit (electronic component conveyance control unit) (first control unit) 81, the positioning control unit (second control unit) 82, and the inspection control unit (third control unit) 83 of the control unit. Further, the transport control unit 81 controls the operation (drive) of the transport unit 4 and the like, and the positioning control unit 82 It controls the operation of the positioning mechanism 100 and the like.
又,檢查裝置1具有:基座11,其供配置供給部2、供給側排列部3、搬送部4、檢查部5、回收側排列部6及回收部7;以及蓋部12,其以收容供給側排列部3、搬送部4、檢查部5及回收側排列部6之方式被覆於基座11。再者,基座11之上表面即基座面111成為大致水平,且於該基座面111配置有供給側排列部3、搬送部4、檢查部5、回收側排列部6之構成構件。又,此外,檢查裝置1亦可視需要而具有用於加熱IC器件9之加熱器或腔室等。 Further, the inspection apparatus 1 includes a susceptor 11 for arranging the supply unit 2, the supply-side arranging unit 3, the conveying unit 4, the inspection unit 5, the collection-side arranging unit 6, and the collecting unit 7, and a lid portion 12 for accommodating The supply-side arranging unit 3, the conveying unit 4, the inspection unit 5, and the collection-side arranging unit 6 are covered on the susceptor 11. Further, the base surface 111 on the upper surface of the susceptor 11 is substantially horizontal, and the supply side arranging portion 3, the conveying portion 4, the inspection portion 5, and the recovery side arranging portion 6 are disposed on the base surface 111. Further, in addition, the inspection apparatus 1 may have a heater or a chamber or the like for heating the IC device 9 as needed.
此種檢查裝置1係以如下方式構成,即:供給部2對供給側排列部3供給IC器件9,供給側排列部3將所供給之IC器件9進行排列,搬送部4將已排列之IC器件9搬送至檢查部5,檢查部5檢查所搬送之IC器件9,搬送部4將已結束檢查之IC器件9搬送/排列於回收側排列部6,回收部7回收排列於回收側排列部6之IC器件9。根據此種檢查裝置1,可自動地進行IC器件9之供給、檢查、回收。再者,於檢查裝置1中,搬送裝置(電子零件搬送裝置)10包括供給部2、供給側排列部3、搬送部4、檢查部5之一部分、回收側排列部6、回收部7、搬送控制部81及定位控制部82等。搬送裝置10係進行IC器件9之搬送、利用定位機構100之IC器件9向檢查部5之保持部51之特定位置的定位等。再者,亦將使IC器件9定位於保持部51之特定位置簡稱為「將IC器件9定位於保持部51」。 The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC device 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC devices 9, and the transport unit 4 arranges the ICs. The device 9 is transported to the inspection unit 5, and the inspection unit 5 inspects the transported IC device 9. The transport unit 4 transports/arranges the IC device 9 that has been inspected to the recovery side array unit 6, and the collection unit 7 collects and collects the array side on the recovery side. 6 IC device 9. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC device 9 can be automatically performed. In the inspection apparatus 1, the transport apparatus (electronic component transport apparatus) 10 includes a supply unit 2, a supply side array unit 3, a transport unit 4, a part of the inspection unit 5, a collection side array unit 6, a collection unit 7, and a transport unit. The control unit 81, the positioning control unit 82, and the like. The transport device 10 performs transport of the IC device 9, positioning of the IC device 9 of the positioning mechanism 100 to a specific position of the holding portion 51 of the inspection portion 5, and the like. Further, the specific position at which the IC device 9 is positioned at the holding portion 51 is also simply referred to as "positioning the IC device 9 to the holding portion 51".
以下,對搬送部4、檢查部5及定位機構100之構成進行說明。 Hereinafter, the configuration of the transport unit 4, the inspection unit 5, and the positioning mechanism 100 will be described.
《搬送部》 "Transport Department"
如圖2所示,搬送部4係如下單元,即,將配置於供給側排列部3之載置台341上之IC器件9搬送至檢查部5為止,且將已結束利用檢查部5之檢查之IC器件9搬送至回收側排列部6為止。此種搬送部4具有搬運梭41、供給機器人42、檢查機器人43及回收機器人44。 As shown in FIG. 2, the transport unit 4 is a unit that transports the IC device 9 disposed on the mounting table 341 of the supply-side arranging unit 3 to the inspection unit 5, and the inspection by the inspection unit 5 is completed. The IC device 9 is transported to the recovery side array portion 6. The transport unit 4 includes a transport shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.
-搬運梭- - Handling shuttle -
搬運梭41為如下之搬運梭,其用以將載置台341上之IC器件9搬送至檢查部5之附近為止,進而用以將已利用檢查部5進行檢查之檢查完畢之IC器件9搬送至回收側排列部6之附近為止。於此種搬運梭41,沿X方向並列地形成有用以收容IC器件9之4個袋部411。又,搬運梭41由線性運動導件引導,利用線性馬達等驅動源而可沿X方向往返移動。 The transport shuttle 41 is a transport shuttle for transporting the IC device 9 on the mounting table 341 to the vicinity of the inspection unit 5, and further transports the IC device 9 that has been inspected by the inspection unit 5 to the inspection. The vicinity of the collection side alignment portion 6 is collected. In the transport shuttle 41, four pocket portions 411 for accommodating the IC device 9 are formed in parallel in the X direction. Further, the transport shuttle 41 is guided by the linear motion guide, and is reciprocally movable in the X direction by a drive source such as a linear motor.
-供給機器人- -Supply robots -
供給機器人42係將配置於載置台341上之IC器件9搬送至搬運梭41之機器人。此種供給機器人42具有:支持框架421,其被支持於基座11;移動框架422,其被支持於支持框架421,且可相對於支持框架421沿Y方向往返移動;以及4個手單元(抓持機器人)423,其等被支持於移動框架422。各手單元423具備升降機構及吸附噴嘴,可藉由吸附而抓持IC器件9。 The supply robot 42 transports the IC device 9 disposed on the mounting table 341 to the robot of the transport shuttle 41. Such a supply robot 42 has a support frame 421 supported by the base 11 and a moving frame 422 supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421; and 4 hand units ( The gripping robot 423, which is supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.
-檢查機器人- - Check the robot -
檢查機器人43係將收容於搬運梭41之IC器件9朝檢查部5搬送,並且將已結束檢查之IC器件9自檢查部5朝搬運梭41搬送之機器人。又,檢查機器人43亦可於檢查時,將IC器件9壓抵於檢查部5而對IC器件9施加特定之檢查壓力。此種檢查機器人43具有:支持框架431,其被支持於基座11;移動框架432,其被支持於支持框架431,且可相對於支持框架431沿Y方向往返移動;以及4個手單元(抓持機器人)(抓持部)433,其等被支持於移動框架432。 The inspection robot 43 transports the IC device 9 housed in the transport shuttle 41 to the inspection unit 5, and transports the IC device 9 that has finished the inspection from the inspection unit 5 to the transport shuttle 41. Further, the inspection robot 43 can also apply a specific inspection pressure to the IC device 9 by pressing the IC device 9 against the inspection portion 5 at the time of inspection. Such an inspection robot 43 has a support frame 431 supported by the base 11 and a moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431; and 4 hand units ( A gripping robot) (grip) 433, which is supported by the moving frame 432.
各手單元433具備升降機構及吸附噴嘴434(參照圖5),可藉由吸附而抓持(保持)IC器件9。各手單元433相同,故而以下對其中一個進行說明。 Each of the hand units 433 includes an elevating mechanism and an adsorption nozzle 434 (see FIG. 5), and the IC device 9 can be grasped (held) by adsorption. Each of the hand units 433 is the same, and therefore one of them will be described below.
於自Z方向(鉛垂方向)觀察時,手單元433形成與下述檢查部5之 保持部51之凹部55對應之形狀。具體而言,於自Z方向觀察時,手單元433形成四邊形,且略微小於凹部55之內周部。再者,於本實施形態中,該四邊形為正方形或長方形。關於該手單元433,於泵151及152噴射空氣,且泵153及154抽吸空氣時,相對於保持部51配置於特定距離之位置,藉此,可利用手單元433覆蓋凹部55(參照圖8)。 When viewed from the Z direction (vertical direction), the hand unit 433 is formed with the inspection unit 5 described below. The concave portion 55 of the holding portion 51 has a corresponding shape. Specifically, when viewed from the Z direction, the hand unit 433 is formed in a quadrangular shape and slightly smaller than the inner peripheral portion of the concave portion 55. Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle. In the hand unit 433, when the air is ejected from the pumps 151 and 152, and the pumps 153 and 154 suck the air, they are disposed at a predetermined distance from the holding portion 51, whereby the recess 55 can be covered by the hand unit 433 (refer to the figure). 8).
又,於吸附噴嘴434連接有管體,該管體連接於抽吸空氣(氣體)之抽吸泵155,藉由該抽吸泵155之作動而抽吸上述氣體,從而吸附IC器件9(參照圖5)。再者,升降機構及抽吸泵155之作動由搬送控制部81控制。又,抽吸空氣(氣體)之抽吸機構包括吸附噴嘴434、抽吸泵155、及將吸附噴嘴434與抽吸泵155連接之管體。 Further, a pipe body is connected to the adsorption nozzle 434, and the pipe body is connected to a suction pump 155 that sucks air (gas), and the gas is sucked by the operation of the suction pump 155 to adsorb the IC device 9 (refer to Figure 5). Further, the operation of the elevating mechanism and the suction pump 155 is controlled by the transport control unit 81. Further, the suction mechanism that sucks air (gas) includes an adsorption nozzle 434, a suction pump 155, and a tube that connects the adsorption nozzle 434 to the suction pump 155.
-回收機器人- -Recycling robots -
回收機器人44係將已結束利用檢查部5之檢查之IC器件9搬送至回收側排列部6之機器人。此種回收機器人44具有:支持框架441,其被支持於基座11;移動框架442,其被支持於支持框架441,且可相對於支持框架441沿Y方向往返移動;以及4個手單元(抓持機器人)443,其等被支持於移動框架442。各手單元443具備升降機構及吸附噴嘴,可藉由吸附而抓持IC器件9。 The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the collection-side arranging unit 6. Such a recycling robot 44 has a support frame 441 supported by the base 11 and a moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441; and 4 hand units ( The gripping robot 443 is supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and the IC device 9 can be gripped by suction.
此種搬送部4係以如下方式搬送IC器件9。首先,搬運梭41朝圖中左側移動,供給機器人42將載置台341上之IC器件9搬送至搬運梭41(STEP(步驟)1)。其次,搬運梭41朝中央移動,檢查機器人43將搬運梭41上之IC器件9朝檢查部5搬送(STEP2)。其次,檢查機器人43將已結束利用檢查部5之檢查之IC器件9朝搬運梭41搬送(STEP3)。其次,搬運梭41朝圖中右側移動,回收機器人44將搬運梭41上之檢查完畢之IC器件9搬送至回收側排列部6。藉由重複此種STEP1~STEP3,可經由檢查部5將IC器件9朝回收側排列部6搬送。 The transfer unit 4 transports the IC device 9 as follows. First, the transport shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC device 9 on the mount 341 to the transport shuttle 41 (STEP 1). Next, the transport shuttle 41 moves toward the center, and the inspection robot 43 transports the IC device 9 on the transport shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has finished the inspection by the inspection unit 5 to the transport shuttle 41 (STEP 3). Then, the transport shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC device 9 on the transport shuttle 41 to the recovery side array portion 6. By repeating such STEPs 1 to STEP 3, the IC device 9 can be transported to the recovery side arranging unit 6 via the inspection unit 5.
以上,對搬送部4之構成進行了說明,但作為搬送部4之構成, 只要可將載置台341上之IC器件9朝檢查部5搬送,並將已結束檢查之IC器件9朝回收側排列部6搬送,則並無特別限定。例如亦可省略搬運梭41,利用供給機器人42、檢查機器人43及回收機器人44中之任一個機器人,進行自載置台341朝檢查部5之搬送及自檢查部5朝回收側排列部6之搬送。 Although the configuration of the transport unit 4 has been described above, the configuration of the transport unit 4 is The IC device 9 on the mounting table 341 can be transported to the inspection unit 5, and the IC device 9 that has finished the inspection is transported to the recovery side array unit 6, and is not particularly limited. For example, the transfer robot 41 may be omitted, and any one of the supply robot 42, the inspection robot 43, and the recovery robot 44 may be used to transport the self-mounted table 341 to the inspection unit 5 and the self-inspection unit 5 to the recovery-side alignment unit 6. .
《檢查部》 Inspection Department
檢查部5係對IC器件9之電氣特性進行檢查、測試之單元。如圖2所示,檢查部5具有供配置IC器件9之4個保持部51。於該等保持部51,分別設置有與IC器件9之端子電性連接之複數個探針接腳(未圖示)。各探針接腳電性連接於檢查控制部83。於檢查IC器件9時,將1個IC器件9配置(保持)於1個保持部51。配置於保持部51之IC器件9之各端子92分別藉由檢查機器人43之手單元433之按壓而以特定之檢查壓力壓抵於各探針接腳。藉此,可使IC器件9之各端子92與各探針接腳電性連接(接觸),經由探針接腳而進行IC器件9之檢查。IC器件9之檢查係基於記憶於檢查控制部83之程式而進行。再者,關於保持部51係於下文進行詳細敍述。 The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 has four holding portions 51 for arranging the IC device 9. A plurality of probe pins (not shown) electrically connected to the terminals of the IC device 9 are provided in the holding portions 51, respectively. Each probe pin is electrically connected to the inspection control unit 83. When the IC device 9 is inspected, one IC device 9 is placed (held) in one holding portion 51. Each of the terminals 92 of the IC device 9 disposed in the holding portion 51 is pressed against each of the probe pins with a specific inspection pressure by the pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal 92 of the IC device 9 can be electrically connected (contacted) to each probe pin, and the IC device 9 can be inspected via the probe pin. The inspection of the IC device 9 is performed based on the program stored in the inspection control unit 83. Further, the holding portion 51 will be described in detail below.
《各控制部》 "Control Departments"
搬送控制部81係控制搬送部4等之作動。該搬送控制部81係例如控制供給部2、供給側排列部3、搬送部4、回收側排列部6及回收部7之各部之作動,進行IC器件9之搬送等。 The conveyance control unit 81 controls the operation of the conveyance unit 4 and the like. The conveyance control unit 81 controls the operation of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the collection-side arranging unit 6, and the recovery unit 7, for example, to carry out the transport of the IC device 9.
又,定位控制部82係控制定位機構100等之作動。該定位控制部82係例如控制搬送部4、檢查部5、回收側排列部6及回收部7之各部之作動,進行IC器件9向保持部51之定位等。 Further, the positioning control unit 82 controls the operation of the positioning mechanism 100 and the like. The positioning control unit 82 controls the operation of each of the transport unit 4, the inspection unit 5, the collection side array unit 6, and the collection unit 7, for example, and positions the IC device 9 to the holding unit 51.
又,檢查控制部83係例如基於記憶於未圖示之記憶體內之程式,而進行配置於檢查部5之IC器件9之電氣特性之檢查等。 In addition, the inspection control unit 83 performs inspection of electrical characteristics of the IC device 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown).
再者,構成為可於搬送控制部81與定位控制部82之間、搬送控 制部81與檢查控制部83之間、定位控制部82與檢查控制部83之間分別進行通信。 Furthermore, it is configured to be movable between the transport control unit 81 and the positioning control unit 82. Communication between the control unit 81 and the inspection control unit 83, and between the positioning control unit 82 and the inspection control unit 83 are performed.
《定位機構》 Positioning Agency
其次,對定位機構100進行說明,但關於檢查部5之4個保持部51之各定位機構100係相同,故而以下對其中1個進行說明。(關於下述IC器件之定位、檢查及其前後之動作之說明亦相同)。 Next, the positioning mechanism 100 will be described. However, the positioning mechanisms 100 of the four holding portions 51 of the inspection unit 5 are the same, and therefore, one of them will be described below. (The descriptions regarding the positioning, inspection, and actions of the IC devices described below are also the same).
如圖3~圖5所示,定位機構100具有:保持部51,其具有保持部本體510;4個管體131、132、133及134;4個閥門141、142、143及144;4個泵151、152、153及154;手單元433;以及2個壓力感測器(檢測部)161及162。管體131、132、133、134之內腔為供空氣(流體)流動之流路。再者,管體131~134中之***至保持部本體510之下述壁部53之部位(一端部)為保持部51之構成要素。即,保持IC器件9之保持部51包括保持部本體510、及管體131~134之***至壁部53之部位(一端部)等。又,壓力感測器161係對管體133內之壓力進行檢測之感測器,壓力感測器161之檢測結果係發送至定位控制部82。又,壓力感測器162係對管體134內之壓力進行檢測之感測器,壓力感測器162之檢測結果被發送至定位控制部82。 As shown in FIG. 3 to FIG. 5, the positioning mechanism 100 has a holding portion 51 having a holding portion body 510, four tubes 131, 132, 133 and 134, four valves 141, 142, 143 and 144; four Pumps 151, 152, 153, and 154; hand unit 433; and two pressure sensors (detection portions) 161 and 162. The inner chambers of the tubes 131, 132, 133, and 134 are flow paths through which air (fluid) flows. Further, a portion (one end portion) of the tubular bodies 131 to 134 that is inserted into the lower wall portion 53 of the holding portion main body 510 is a constituent element of the holding portion 51. That is, the holding portion 51 that holds the IC device 9 includes the holding portion main body 510, and a portion (one end portion) into which the tube portions 131 to 134 are inserted into the wall portion 53 and the like. Further, the pressure sensor 161 is a sensor that detects the pressure in the tube body 133, and the detection result of the pressure sensor 161 is sent to the positioning control unit 82. Further, the pressure sensor 162 is a sensor that detects the pressure in the tube 134, and the detection result of the pressure sensor 162 is sent to the positioning control unit 82.
保持部本體510具備:基板54,其具有保持IC器件9之保持面(電子零件保持面)52;以及壁部53,其以包圍保持面52之方式設置於基板上。再者,保持面52與XY平面平行。 The holder main body 510 includes a substrate 54 having a holding surface (electronic component holding surface) 52 that holds the IC device 9 and a wall portion 53 that is provided on the substrate so as to surround the holding surface 52. Furthermore, the holding surface 52 is parallel to the XY plane.
保持部本體510之形狀並無特別限定,但於本實施形態中,於自Z方向(鉛垂方向)(與保持面正交之方向)觀察時形成四邊形。再者,於本實施形態中,該四邊形為正方形或長方形。 The shape of the holding portion main body 510 is not particularly limited. However, in the present embodiment, a quadrangular shape is formed when viewed from the Z direction (vertical direction) (the direction orthogonal to the holding surface). Furthermore, in the present embodiment, the quadrilateral is a square or a rectangle.
又,壁部53之形狀並無特別限定,但於本實施形態中,壁部53形成四邊形之框狀,且形成於基板54之外周部。即,壁部53之內表面之形狀及外表面之形狀係於自Z方向觀察時分別為四邊形。再者,於 本實施形態中,該四邊形為正方形或長方形。藉此,於保持部本體510,形成有於自Z方向觀察時形成四邊形之凹部55。該凹部55之底面為保持面52。再者,於本實施形態中,如圖9所示,IC器件9係以其角部配置於凹部55(壁部53)之圖9中之左下之角部552之方式進行定位。 Further, the shape of the wall portion 53 is not particularly limited. However, in the present embodiment, the wall portion 53 is formed in a rectangular frame shape and formed on the outer peripheral portion of the substrate 54. That is, the shape of the inner surface of the wall portion 53 and the shape of the outer surface are respectively quadrangular when viewed from the Z direction. Furthermore, In this embodiment, the quadrilateral is a square or a rectangle. Thereby, the holding portion main body 510 is formed with a concave portion 55 which is formed in a quadrangular shape when viewed from the Z direction. The bottom surface of the recess 55 is a holding surface 52. Further, in the present embodiment, as shown in FIG. 9, the IC device 9 is positioned such that its corner portion is disposed at the lower left corner portion 552 of FIG. 9 of the concave portion 55 (wall portion 53).
又,於壁部53之內周部之上部,形成有內側低於外側之傾斜面531。藉此,於將IC器件9配置於保持部51時,IC器件9可沿傾斜面531容易地***至凹部55內,且配置於保持面52上。 Further, an inclined surface 531 whose inner side is lower than the outer side is formed on the upper portion of the inner peripheral portion of the wall portion 53. Thereby, when the IC device 9 is placed on the holding portion 51, the IC device 9 can be easily inserted into the concave portion 55 along the inclined surface 531 and disposed on the holding surface 52.
又,於保持部本體510之外周部、即壁部53上連接有管體131~134之一端部。此情形時,管體131~134之一端部配置於四邊形之4個邊。而且,管體131~134之一端部之開口(開口部)1311~1341係於壁部53之內表面開放。 Further, one end of the tubular bodies 131 to 134 is connected to the outer peripheral portion of the holding portion main body 510, that is, the wall portion 53. In this case, one end of the tubular bodies 131 to 134 is disposed on four sides of the quadrilateral. Further, the openings (openings) 1311 to 1341 at one end of the tubular bodies 131 to 134 are open to the inner surface of the wall portion 53.
再者,第1流路包含管體131之***至壁部53之部位(一端部),第2流路包含管體132之***至壁部53之部位(一端部),第3流路包含管體133之***至壁部53之部位(一端部),第4流路包含管體134之***至壁部53之部位(一端部)。 Further, the first flow path includes a portion (one end portion) of the tubular body 131 inserted into the wall portion 53, and the second flow path includes a portion (one end portion) of the tubular body 132 inserted into the wall portion 53, and the third flow path includes The tubular body 133 is inserted into a portion (one end portion) of the wall portion 53, and the fourth flow path includes a portion (one end portion) of the tubular body 134 that is inserted into the wall portion 53.
又,於本實施形態中,管體131及132之一端部配置於凹部55之對角線上之角部551、552中之角部551之附近,管體133及134之一端部配置於凹部55之對角線上之角部551、552中之角部552之附近。即,管體131之一端部與管體133之一端部係於X方向錯開,管體132之一端部與管體134之一端部係於Y方向錯開。 Further, in the present embodiment, one end of the tubular bodies 131 and 132 is disposed in the vicinity of the corner portion 551 of the corner portions 551 and 552 on the diagonal line of the concave portion 55, and one end portion of the tubular bodies 133 and 134 is disposed in the concave portion 55. The vicinity of the corner 552 of the corner portions 551, 552 on the diagonal line. That is, one end of the tubular body 131 and one end of the tubular body 133 are offset in the X direction, and one end of the tubular body 132 is offset from the end of the tubular body 134 in the Y direction.
又,於本實施形態中,管體131~134之一端部分別相對於構成凹部55(壁部53)之內表面之4個面553、554、555及556正交。藉此,管體131之一端部之流路方向與管體132之一端部之流路方向正交,管體133之一端部之流路方向與管體134之一端部之流路方向正交。即,表示流過管體131之一端部之流體之流動的第1向量與表示流過管體132之一端部之流體之流動的第2向量所成之角度為90度,表示流過管 體133之一端部之流體之流動的第3向量與表示流過管體134之一端部之流體之流動的第4向量所成之角度為90度。藉此,可藉由空氣流而容易地使IC器件9朝X方向及Y方向移動。 Further, in the present embodiment, one of the end portions of the tubular bodies 131 to 134 is orthogonal to the four faces 553, 554, 555 and 556 constituting the inner surface of the concave portion 55 (wall portion 53). Thereby, the flow path direction of one end portion of the pipe body 131 is orthogonal to the flow path direction of one end portion of the pipe body 132, and the flow path direction of one end portion of the pipe body 133 is orthogonal to the flow path direction of one end portion of the pipe body 134. . That is, the angle between the first vector indicating the flow of the fluid flowing through one end of the tubular body 131 and the second vector indicating the flow of the fluid flowing through one end of the tubular body 132 is 90 degrees, indicating that the flow through the tube The third vector of the flow of the fluid at one end of the body 133 forms an angle of 90 degrees with the fourth vector representing the flow of the fluid flowing through one end of the tubular body 134. Thereby, the IC device 9 can be easily moved in the X direction and the Y direction by the air flow.
再者,管體131之一端部之流路方向與管體132之一端部之流路方向只要交叉即可,又,管體133之一端部之流路方向與管體134之一端部之流路方向只要交叉即可。即,表示流過管體131之一端部之流體之流動的第1向量與表示流過管體132之一端部之流體之流動的第2向量所成之角度只要不為0度及180度即可,表示流過管體133之一端部之流體之流動的第3向量與表示流過管體134之一端部之流體之流動的第4向量所成之角度只要不為0度及180度即可。 Further, the flow path direction of one end portion of the pipe body 131 and the flow path direction of one end portion of the pipe body 132 may be crossed, and the flow path direction of one end portion of the pipe body 133 and one end portion of the pipe body 134 may flow. Just cross the direction of the road. That is, the angle between the first vector indicating the flow of the fluid flowing through one end of the tubular body 131 and the second vector indicating the flow of the fluid flowing through one end of the tubular body 132 is not necessarily 0 degrees and 180 degrees. The angle between the third vector indicating the flow of the fluid flowing through one end of the tubular body 133 and the fourth vector indicating the flow of the fluid flowing through one end of the tubular body 134 may be 0 degrees and 180 degrees. can.
又,如圖6所示,開口1311~1341係於IC器件9被保持於保持部51之狀態下,較端子配置面93更跨靠Z方向上方及下方而配置。藉由將開口1311~1341之一部分配置於較端子配置面93更靠Z方向下方,可藉由空氣流而使IC器件9浮起,且藉由將開口1311~1341之一部分配置於較端子配置面93更靠Z方向上方,可藉由空氣流而對IC器件9施加更強之力,藉此,於進行IC器件9之定位之情形時,可容易地使IC器件9移動。 Further, as shown in FIG. 6, the openings 1311 to 1341 are disposed such that the IC device 9 is held by the holding portion 51, and is disposed above and below the Z-direction in the Z-direction. By arranging one of the openings 1311 to 1341 in the Z direction below the terminal arrangement surface 93, the IC device 9 can be floated by the air flow, and a part of the openings 1311 to 1341 can be arranged in the terminal arrangement. The face 93 is further above the Z direction, and a stronger force can be applied to the IC device 9 by the air flow, whereby the IC device 9 can be easily moved when the IC device 9 is positioned.
再者,開口1311~1341亦可於IC器件9被保持於保持部51之狀態下,僅配置於較端子配置面93更靠Z方向下方,又,亦可僅配置於較端子配置面93更靠Z方向上方。 Further, the openings 1311 to 1341 may be disposed only below the terminal arrangement surface 93 in the Z direction while the IC device 9 is held by the holding portion 51, or may be disposed only on the terminal arrangement surface 93. It is above the Z direction.
又,管體131~134之一端部之中心軸(流路之中心軸)O係於IC器件9被保持於保持部51之狀態下,通過端子配置面93與保持面52之間。藉此,於進行IC器件9之定位之情形時,可容易地使IC器件9移動。 Further, the central axis (the central axis of the flow path) O of one end of the tubular bodies 131 to 134 is between the terminal arrangement surface 93 and the holding surface 52 while the IC device 9 is held by the holding portion 51. Thereby, the IC device 9 can be easily moved when the positioning of the IC device 9 is performed.
又,如圖3及圖4所示,於與管體131~134之一端部不同之另一端部分別設置有泵151~154。又,於管體131~134之中途分別設置有 閥門141~144。泵151及152分別為噴射空氣(流體)之噴射部,泵153及154分別為抽吸空氣(流體)之抽吸部。若藉由泵151及152之作動而自泵151及152噴射空氣,則該空氣係於管體131及132內流動,自開口1311及1321噴射至凹部55內。又,若藉由泵153及154之作動而使泵153及154抽吸空氣,則凹部55內之空氣被自開口1331及1341抽吸(排出),該空氣係於管體133及134內流動,且排出至外部。再者,記載於圖3及圖4中之泵151~154之附近之箭頭表示空氣流動之方向。 Further, as shown in FIGS. 3 and 4, pumps 151 to 154 are provided at the other end portions different from the end portions of the tubular bodies 131 to 134, respectively. Moreover, it is provided in the middle of the tubes 131 to 134, respectively. Valves 141~144. The pumps 151 and 152 are injection portions for injecting air (fluid), respectively, and the pumps 153 and 154 are suction portions for sucking air (fluid), respectively. When air is injected from the pumps 151 and 152 by the actuation of the pumps 151 and 152, the air flows into the tubes 131 and 132 and is ejected from the openings 1311 and 1321 into the recess 55. Further, when the pumps 153 and 154 are sucked by the operation of the pumps 153 and 154, the air in the recess 55 is sucked (discharged) from the openings 1331 and 1341, and the air flows in the tubes 133 and 134. And discharged to the outside. Further, the arrows shown in the vicinity of the pumps 151 to 154 in Figs. 3 and 4 indicate the direction in which the air flows.
又,藉由閥門141~144之開閉而開閉管體131~134之內腔。又,作為閥門141~144,只要使用可調整其開度者,即可藉由上述開度之調整而調整流過管體131~134內之空氣之流量。又,亦可藉由調整泵151~154之輸出而調整於管體131~134內流動之空氣之流量。再者,泵151~154及閥門141~144之驅動係由定位控制部82控制。 Further, the inner cavities of the tubular bodies 131 to 134 are opened and closed by the opening and closing of the valves 141 to 144. Further, as the valves 141 to 144, if the opening degree can be adjusted, the flow rate of the air flowing through the tubes 131 to 134 can be adjusted by the adjustment of the opening degree. Further, the flow rate of the air flowing through the tubes 131 to 134 can be adjusted by adjusting the outputs of the pumps 151 to 154. Further, the driving of the pumps 151 to 154 and the valves 141 to 144 is controlled by the positioning control unit 82.
《IC器件之定位、檢查及其前後之動作》 "Locating, Checking, and Actions of IC Devices"
其次,基於圖5~圖11說明將IC器件9定位於保持部51並進行檢查時之動作及控制。 Next, the operation and control when the IC device 9 is positioned in the holding portion 51 and inspected will be described based on FIGS. 5 to 11 .
如圖11所示,首先,使抽吸泵155作動而抽吸空氣,將IC器件9吸附於吸附噴嘴434,藉此,利用手單元433抓持IC器件9並將該IC器件9搬送至保持部51,如圖5所示,將IC器件9***至保持部51之凹部55內之特定位置(步驟S101)。於本實施形態中,將手單元433之下端部配置於凹部55內之上端部,使手單元433停止。藉此,利用該手單元433而覆蓋凹部55。藉此,可抑制空氣自凹部55內洩漏,又,可防止因空氣流而導致IC器件9自凹部55飛出。 As shown in Fig. 11, first, the suction pump 155 is actuated to suck air, and the IC device 9 is attracted to the adsorption nozzle 434, whereby the IC device 9 is grasped by the hand unit 433 and the IC device 9 is carried to the holding. In the portion 51, as shown in FIG. 5, the IC device 9 is inserted into a specific position in the concave portion 55 of the holding portion 51 (step S101). In the present embodiment, the lower end portion of the hand unit 433 is disposed at the upper end portion of the recess portion 55, and the hand unit 433 is stopped. Thereby, the recess 55 is covered by the hand unit 433. Thereby, leakage of air from the concave portion 55 can be suppressed, and the IC device 9 can be prevented from flying out of the concave portion 55 due to the air flow.
其次,如圖6及圖7所示,使抽吸泵155之空氣之抽吸停止,藉此,自手單元433鬆開IC器件9。即,使IC器件9自手單元433脫離、下落(步驟S102)。又,此處,於停止抽吸泵155之空氣之抽吸之後,即,於手單元433將IC器件9鬆開之後,等待IC器件9被配置於保持面 52上之前之特定時間。藉此,IC器件9***至凹部55內,且配置於保持面52上。而且,於經過上述特定時間之後執行步驟S103。 Next, as shown in FIGS. 6 and 7, the suction of the air of the suction pump 155 is stopped, whereby the IC device 9 is released from the hand unit 433. That is, the IC device 9 is detached from the hand unit 433 and dropped (step S102). Further, here, after the suction of the air of the suction pump 155 is stopped, that is, after the IC unit 9 is released by the hand unit 433, the IC device 9 is waited for being placed on the holding surface. The specific time before 52. Thereby, the IC device 9 is inserted into the recess 55 and disposed on the holding surface 52. Moreover, step S103 is performed after the lapse of the above specific time.
其次,搬送控制部81係將通知手單元433已鬆開IC器件9之第1信號發送至定位控制部82(步驟S103),定位控制部82接收第1信號(步驟S104)。藉此,定位控制部82掌握手單元433鬆開IC器件9,且IC器件9被配置於保持面52上。 Next, the transport control unit 81 transmits the first signal that the notification hand unit 433 has released the IC device 9 to the positioning control unit 82 (step S103), and the positioning control unit 82 receives the first signal (step S104). Thereby, the positioning control unit 82 grasps that the hand unit 433 releases the IC device 9, and the IC device 9 is disposed on the holding surface 52.
其次,進行IC器件9向保持部51之定位(步驟S105)。該IC器件9之定位係以如下方式進行。 Next, the positioning of the IC device 9 to the holding portion 51 is performed (step S105). The positioning of the IC device 9 is performed in the following manner.
首先,如圖8及圖9所示,打開閥門141~144,使泵151~154作動。藉由泵151及152之作動而自泵151及152噴射空氣,該空氣係於管體131及132內流動,並自開口1311及1321噴射至凹部55內。又,藉由泵153及154之作動,泵153及154抽吸空氣,凹部55內之空氣被自開口1331及1341抽吸,該空氣係於管體133及134內流動,且排出至外部。藉此,於凹部55內產生空氣流,藉由該空氣流,IC器件9朝向面555及556移動,並壓抵於面555及556,從而將IC器件9之角部配置於凹部55之角部552。以上,IC器件9之定位完成(結束)。 First, as shown in Figs. 8 and 9, the valves 141 to 144 are opened to operate the pumps 151 to 154. Air is injected from the pumps 151 and 152 by the actuation of the pumps 151 and 152, and the air flows in the tubes 131 and 132 and is ejected from the openings 1311 and 1321 into the recess 55. Further, by the operation of the pumps 153 and 154, the pumps 153 and 154 suck the air, and the air in the recess 55 is sucked from the openings 1331 and 1341, and the air flows in the tubes 133 and 134 and is discharged to the outside. Thereby, an air flow is generated in the recess 55, and the IC device 9 is moved toward the faces 555 and 556 by the air flow, and is pressed against the faces 555 and 556, thereby arranging the corners of the IC device 9 at the corner of the recess 55. Part 552. Above, the positioning of the IC device 9 is completed (end).
又,此處,定位控制部82係以如下方式檢測IC器件9之定位結束之情況。 Here, the positioning control unit 82 detects that the positioning of the IC device 9 is completed as follows.
首先,利用壓力感測器161、162檢測管體133、134內之壓力。 First, the pressures in the tubes 133, 134 are detected by the pressure sensors 161, 162.
IC器件9於進行其定位之前遠離開口1331、1341,但當定位結束時,配置於堵塞開口1331之一部分及開口1341之一部分之位置。藉此,管體133、134內之壓力降低。因此,於設定特定之閾值,且利用壓力感測器161、162所檢測出之管體133、134內之壓力小於上述閾值之情形時,判斷IC器件9之定位結束。 The IC device 9 is away from the openings 1331, 1341 before being positioned, but is disposed at a position where one of the openings 1331 and a portion of the opening 1341 are closed when the positioning is completed. Thereby, the pressure in the tubes 133, 134 is lowered. Therefore, when a specific threshold is set and the pressure in the tubes 133, 134 detected by the pressure sensors 161, 162 is less than the above threshold, it is judged that the positioning of the IC device 9 is completed.
再者,當然亦可代替利用上述壓力感測器161、162檢測管體133、134內之壓力之方法,而與下述第2實施形態同樣地,使用自開 始IC器件9之定位時起等待預先設定之特定時間之方法。 Further, of course, instead of detecting the pressure in the tubular bodies 133 and 134 by the pressure sensors 161 and 162, the self-opening may be used in the same manner as in the second embodiment described below. The method of waiting for a predetermined time before starting the positioning of the IC device 9.
其次,定位控制部82將通知IC器件9之定位結束之第2信號發送至搬送控制部81(步驟S106),搬送控制部81接收第2信號(步驟S107)。藉此,搬送控制部81掌握IC器件9之定位結束之情況。 Next, the positioning control unit 82 transmits a second signal indicating that the positioning of the IC device 9 has been completed to the transport control unit 81 (step S106), and the transport control unit 81 receives the second signal (step S107). Thereby, the conveyance control unit 81 grasps the state in which the positioning of the IC device 9 is completed.
其次,如圖10所示,使手單元433下降,並接近保持部51,利用該手單元433而將IC器件9朝下方按壓(步驟S108)。藉由該手單元433之按壓,而將IC器件9之各端子92與各探針接腳電性連接,從而結束IC器件9之檢查之準備。 Next, as shown in FIG. 10, the hand unit 433 is lowered and approaches the holding portion 51, and the IC device 9 is pressed downward by the hand unit 433 (step S108). By pressing the hand unit 433, the terminals 92 of the IC device 9 are electrically connected to the probe pins, thereby completing the preparation for inspection of the IC device 9.
其次,搬送控制部81將通知IC器件9之檢查之準備已結束之第3信號發送至檢查控制部83(步驟S109),檢查控制部83接收第3信號(步驟S110)。藉此,檢查控制部83掌握IC器件9之檢查之準備已結束之情況。 Next, the transport control unit 81 transmits a third signal informing that the preparation of the IC device 9 has been completed to the inspection control unit 83 (step S109), and the inspection control unit 83 receives the third signal (step S110). Thereby, the inspection control unit 83 grasps that the preparation for the inspection of the IC device 9 has been completed.
其次,進行IC器件9之檢查(步驟S111)。 Next, the inspection of the IC device 9 is performed (step S111).
其次,檢查控制部83將通知IC器件9之檢查已結束之第4信號發送至搬送控制部81(步驟S112),搬送控制部81接收第4信號(步驟S113)。藉此,搬送控制部81掌握IC器件9之檢查已結束之情況。 Then, the inspection control unit 83 transmits a fourth signal indicating that the inspection of the IC device 9 has been completed to the transport control unit 81 (step S112), and the transport control unit 81 receives the fourth signal (step S113). Thereby, the conveyance control unit 81 grasps that the inspection of the IC device 9 has ended.
其次,利用手單元433抓持IC器件9,並自保持部51取出(步驟S114),將該IC器件9搬送至特定位置(步驟S115)。以下,進行IC器件9之分類等各動作(作業)。 Next, the IC device 9 is grasped by the hand unit 433, and taken out from the holding portion 51 (step S114), and the IC device 9 is transported to a specific position (step S115). Hereinafter, each operation (work) such as classification of the IC device 9 is performed.
此處,於本實施形態中,打開閥門141~144而使泵151~154作動之動作係於將IC器件9配置於保持部51之保持面52上之後進行,但並不限定於此,例如亦可於將IC器件9配置於保持面52上之前進行。 Here, in the present embodiment, the operation of opening the valves 141 to 144 to operate the pumps 151 to 154 is performed after the IC device 9 is placed on the holding surface 52 of the holding portion 51, but the present invention is not limited thereto. It can also be performed before the IC device 9 is placed on the holding surface 52.
又,較佳為使IC器件9自上述手單元433脫離之第1時序與使上述泵151~154作動而自泵151及152噴射空氣且上述泵153及154抽吸空氣之第2時序相同或如上所述第1時序早(先)於第2時序。 Further, it is preferable that the first timing of disengaging the IC device 9 from the hand unit 433 and the second timing of injecting air from the pumps 151 and 152 by the pumps 151 to 154 and the pumps 153 and 154 sucking air are preferably the same or As described above, the first timing is earlier (first) than the second timing.
若第1時序遲於第2時序,則IC器件9暴露於空氣流之時間變長, 有因該空氣流而導致IC器件9被冷卻之虞,但若第1時序與第2時序相同或第1時序早於第2時序,則可抑制因空氣流而導致IC器件9被冷卻。 If the first timing is later than the second timing, the time during which the IC device 9 is exposed to the air flow becomes longer. Although the IC device 9 is cooled by the air flow, if the first timing is the same as the second timing or the first timing is earlier than the second timing, the IC device 9 can be prevented from being cooled by the air flow.
又,於第1時序早於第2時序之情形時,較佳為於IC器件9到達保持面52之前,開始自泵151及152噴射空氣,且開始利用泵153及154抽吸空氣。藉此,除於保持面52與IC器件9之端子配置面93之間產生空氣流以外,於保持面52與IC器件9之各端子92之間有亦產生空氣流,藉由該空氣流而可使IC器件9容易地浮起。 Further, when the first timing is earlier than the second timing, it is preferable to start the air injection from the pumps 151 and 152 before the IC device 9 reaches the holding surface 52, and to start pumping the air by the pumps 153 and 154. Thereby, in addition to generating an air flow between the holding surface 52 and the terminal arrangement surface 93 of the IC device 9, there is also an air flow between the holding surface 52 and each terminal 92 of the IC device 9, by which the air flow The IC device 9 can be easily floated.
再者,自泵151及152噴射空氣之時序與空氣自開口1311及1321噴射至凹部55內之時序相同,又,泵153及154抽吸空氣之時序與自開口1331及1341抽吸凹部55內之空氣之時序相同。 Furthermore, the timing of the air injection from the pumps 151 and 152 is the same as the timing at which the air is injected into the recess 55 from the openings 1311 and 1321, and the timing of the suction of the air by the pumps 153 and 154 and the suction recess 55 from the openings 1331 and 1341. The timing of the air is the same.
如以上所作說明般,於該檢查裝置1中,可於手單元433將IC器件9鬆開之後迅速地進行IC器件9之定位。 As described above, in the inspection apparatus 1, the positioning of the IC device 9 can be quickly performed after the hand unit 433 releases the IC device 9.
又,由於在手單元433將IC器件9鬆開之後進行IC器件9之定位,故而可抑制IC器件9之損壞。 Further, since the positioning of the IC device 9 is performed after the hand unit 433 releases the IC device 9, the damage of the IC device 9 can be suppressed.
又,由於利用空氣流使IC器件9移動而進行定位,故而可抑制IC器件9之損壞。 Further, since the IC device 9 is moved by the air flow to perform positioning, damage of the IC device 9 can be suppressed.
又,於IC器件9之定位結束之狀態下,可迅速地利用手單元433將IC器件9朝下方按壓,藉此,可迅速地使IC器件9之各端子92與各探針接腳電性連接。 Further, in the state where the positioning of the IC device 9 is completed, the IC device 9 can be quickly pressed downward by the hand unit 433, whereby the terminals 92 of the IC device 9 and the respective probe pins can be quickly electrically connected. connection.
再者,於本實施形態中,於進行IC器件9之定位之情形時,進行空氣之噴射與抽吸之兩者,但並不限定於此,例如亦可不進行空氣之噴射與抽吸中之任一者。 Further, in the present embodiment, when the IC device 9 is positioned, both the ejection and the suction of the air are performed. However, the present invention is not limited thereto. For example, the ejection and the suction of the air may not be performed. Either.
即便於不進行空氣之抽吸之情形時,亦可利用管體133及134排出凹部55內之空氣而形成空氣流。又,即便於不進行空氣之噴射之情形時,亦可利用管體131及132將空氣導入至凹部55內。再者,於不進 行空氣之抽吸之情形時,亦可省略管體133及134,而於壁部53設置空氣之排出用之孔(流路)。又,於不進行空氣之噴射之情形時,亦可省略管體131及132,而於壁部53設置空氣之導入用之孔(流路)。 That is, in the case where the suction of the air is not performed, the air in the recess 55 can be discharged by the tubes 133 and 134 to form an air flow. Further, even when the air is not sprayed, the air can be introduced into the recess 55 by the tubes 131 and 132. Furthermore, if you don’t In the case of suction of air, the tubes 133 and 134 may be omitted, and the holes (flow paths) for discharging the air may be provided in the wall portion 53. Further, when the air is not sprayed, the tubes 131 and 132 may be omitted, and the wall 53 may be provided with a hole (flow path) for introducing air.
又,於進行IC器件9之定位之情形時,賦予時間差而並非同時進行泵151~154之作動。即,泵151與泵152之空氣之噴射時期不同,又,泵153與泵154之空氣之抽吸時期不同。以下說明兩種方法。 Further, when the IC device 9 is positioned, the time difference is given and the operations of the pumps 151 to 154 are not simultaneously performed. That is, the injection timing of the air of the pump 151 and the pump 152 is different, and the pumping period of the air of the pump 153 and the pump 154 is different. The two methods are described below.
於第1種方法中,首先,使泵151及153作動,藉由泵151之作動而將空氣自開口1311噴射至凹部55內,藉由泵153之作動,而自開口1331抽吸凹部55內之空氣。藉此,於凹部55內產生空氣流,藉由該空氣流而IC器件9朝面555移動並壓抵於面555。 In the first method, first, the pumps 151 and 153 are actuated, and the air is ejected from the opening 1311 into the recess 55 by the action of the pump 151, and the pump 153 is actuated to suck the recess 55 from the opening 1331. The air. Thereby, an air flow is generated in the recess 55, and the IC device 9 moves toward the surface 555 by the air flow and is pressed against the surface 555.
其次,使泵152及154作動,藉由泵152之作動而將空氣自開口1321噴射至凹部55內,藉由泵154之作動而自開口1341抽吸凹部55內之空氣。藉此,於凹部55內產生空氣流,藉由該空氣流而使得IC器件9朝向面556移動並壓抵於面556,從而將IC器件9之角部配置於凹部55之角部552(參照圖9)。以上,IC器件9之定位結束。 Next, the pumps 152 and 154 are actuated, and the air is ejected from the opening 1321 into the recess 55 by the action of the pump 152, and the air in the recess 55 is sucked from the opening 1341 by the action of the pump 154. Thereby, an air flow is generated in the concave portion 55, and the IC device 9 is moved toward the surface 556 by the air flow and pressed against the surface 556, thereby arranging the corner portion of the IC device 9 at the corner portion 552 of the concave portion 55 (refer to Figure 9). Above, the positioning of the IC device 9 is completed.
於第2種方法中,首先,使泵152及154作動,藉由泵152之作動而將空氣自開口1321噴射至凹部55內,藉由泵154之作動而自開口1341抽吸凹部55內之空氣。藉此,於凹部55內產生空氣流,藉由該空氣流而使得IC器件9朝向面556移動,並壓抵於面556。 In the second method, first, the pumps 152 and 154 are actuated, and the air is ejected from the opening 1321 into the recess 55 by the action of the pump 152, and the suction portion 55 is sucked from the opening 1341 by the action of the pump 154. air. Thereby, an air flow is generated in the recess 55, and the IC device 9 is moved toward the face 556 by the air flow, and is pressed against the face 556.
其次,使泵151及153作動,藉由泵151之作動而將空氣自開口1311噴射至凹部55內,藉由泵153之作動,而自開口1331抽吸凹部55內之空氣。藉此,於凹部55內產生空氣流,藉由該空氣流而使得IC器件9朝向面555移動並壓抵於面555,從而將IC器件9之角部配置於凹部55之角部552(參照圖9)。以上,IC器件9之定位結束。 Next, the pumps 151 and 153 are actuated, and the air is ejected from the opening 1311 into the recess 55 by the action of the pump 151, and the air in the recess 55 is sucked from the opening 1331 by the action of the pump 153. Thereby, an air flow is generated in the concave portion 55, and the IC device 9 is moved toward the surface 555 and pressed against the surface 555 by the air flow, thereby arranging the corner portion of the IC device 9 at the corner portion 552 of the concave portion 55 (refer to Figure 9). Above, the positioning of the IC device 9 is completed.
又,亦可設置調整利用泵151所噴射之空氣(流體)之溫度的溫度調整部、及調整利用泵152所噴射之空氣(流體)之溫度的溫度調整 部。藉此,於被稱為高溫檢查之於相對較高之設定溫度(例如100℃)進行之檢查中,於進行IC器件9之定位之情形時,即便噴射空氣,亦可將IC器件9之溫度保持於上述設定溫度。 Further, a temperature adjustment unit that adjusts the temperature of the air (fluid) injected by the pump 151 and a temperature adjustment for adjusting the temperature of the air (fluid) injected by the pump 152 may be provided. unit. Thereby, in the inspection performed at a relatively high set temperature (for example, 100 ° C) called a high temperature inspection, the temperature of the IC device 9 can be performed even when air is injected in the case of performing the positioning of the IC device 9. Maintain at the above set temperature.
<第2實施形態> <Second embodiment>
圖12係表示本發明之電子零件檢查裝置之第2實施形態中之搬送部及檢查部之圖。圖13係表示圖12所示之電子零件檢查裝置之控制動作之流程圖。 Fig. 12 is a view showing a conveying unit and an inspection unit in a second embodiment of the electronic component inspection device according to the present invention. Fig. 13 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 12.
以下,對第2實施形態進行說明,但以與上述第1實施形態不同之點為中心進行說明,關於相同之事項係省略其說明。 In the following, the second embodiment will be described, but the description of the same matters will be omitted.
如圖12所示,於第2實施形態之檢查裝置1中,相當於圖1所示之搬送控制部81、定位控制部82及檢查控制部83者由1個控制部8構成。 As shown in FIG. 12, in the inspection apparatus 1 of the second embodiment, the transport control unit 81, the positioning control unit 82, and the inspection control unit 83 shown in FIG. 1 are constituted by one control unit 8.
以下,基於圖5~圖10、圖13,說明將IC器件9定位於保持部51並進行檢查時之動作及控制。 Hereinafter, the operation and control when the IC device 9 is positioned in the holding portion 51 and inspected will be described based on FIGS. 5 to 10 and FIG.
如圖13所示,首先,使抽吸泵155作動,抽吸空氣,並將IC器件9吸附於吸附噴嘴434,藉此,利用手單元433抓持IC器件9,並將該IC器件9搬送至保持部51,如圖5所示,將IC器件9***至保持部51之凹部55內之特定位置為止(步驟S201)。於本實施形態中,將手單元433之下端部配置於凹部55內之上端部,使手單元433停止。藉此,利用該手單元433覆蓋凹部55。藉此,可抑制空氣自凹部55內洩漏,又,可防止因空氣流而導致IC器件9自凹部55飛出。 As shown in Fig. 13, first, the suction pump 155 is actuated to suck air, and the IC device 9 is attracted to the adsorption nozzle 434, whereby the IC device 9 is grasped by the hand unit 433, and the IC device 9 is transported. As shown in FIG. 5, the holding portion 51 is inserted into the specific position in the concave portion 55 of the holding portion 51 (step S201). In the present embodiment, the lower end portion of the hand unit 433 is disposed at the upper end portion of the recess portion 55, and the hand unit 433 is stopped. Thereby, the recess 55 is covered by the hand unit 433. Thereby, leakage of air from the concave portion 55 can be suppressed, and the IC device 9 can be prevented from flying out of the concave portion 55 due to the air flow.
其次,如圖6及圖7所示,使抽吸泵155之空氣之抽吸停止,藉此,自手單元433鬆開IC器件9。即,使IC器件9自手單元433脫離、下落(步驟S202)。又,此處,於使抽吸泵155之空氣之抽吸停止之後,即,於手單元433將IC器件9鬆開之後,等待IC器件9被配置於保持面52上為止之特定時間。藉此,IC器件9***至凹部55內,且配置於保持面52上。繼而,於經過上述特定時間之後,進行IC器件9向保持部 51之定位(步驟S203)。該IC器件9之定位係以與上述第1實施形態相同之方式進行。 Next, as shown in FIGS. 6 and 7, the suction of the air of the suction pump 155 is stopped, whereby the IC device 9 is released from the hand unit 433. That is, the IC device 9 is detached from the hand unit 433 and dropped (step S202). Here, after the suction of the air of the suction pump 155 is stopped, that is, after the IC unit 9 is released by the hand unit 433, it waits for a specific time until the IC device 9 is placed on the holding surface 52. Thereby, the IC device 9 is inserted into the recess 55 and disposed on the holding surface 52. Then, after the specific time has elapsed, the IC device 9 is moved to the holding portion. Positioning 51 (step S203). The positioning of the IC device 9 is performed in the same manner as in the first embodiment described above.
IC器件9之定位結束後,執行下述步驟S204。再者,此處,於開始IC器件9之定位時,即,於打開閥門141~144,使泵151~154作動時起,等待預先設定之特定時間。上述特定時間被設定為與自開始IC器件9之定位時起至定位結束為止之時間相等或略長於所述之時間。藉此,藉由等待上述特定時間而結束IC器件9之定位。 After the positioning of the IC device 9 is completed, the following step S204 is performed. Here, at the time of starting the positioning of the IC device 9, that is, when the valves 141 to 144 are opened and the pumps 151 to 154 are actuated, the predetermined time is preset. The specific time described above is set to be equal to or slightly longer than the time from the start of positioning of the IC device 9 to the end of positioning. Thereby, the positioning of the IC device 9 is ended by waiting for the specific time described above.
再者,當然亦可代替等待上述特定時間之方法,而與上述第1實施形態同樣地,使用利用壓力感測器161、162檢測管體133、134內之壓力之方法。 Further, of course, instead of the method of waiting for the specific time described above, a method of detecting the pressure in the tubes 133 and 134 by the pressure sensors 161 and 162 may be used in the same manner as in the first embodiment.
其次,如圖10所示,使手單元433下降並接近保持部51,利用該手單元433而將IC器件9朝下方按壓(步驟S204)。藉由該手單元433之按壓,而將IC器件9之各端子92與各探針接腳電性連接,結束IC器件9之檢查之準備。 Next, as shown in FIG. 10, the hand unit 433 is lowered and brought close to the holding portion 51, and the IC device 9 is pressed downward by the hand unit 433 (step S204). By pressing the hand unit 433, the terminals 92 of the IC device 9 are electrically connected to the probe pins, and the preparation for inspection of the IC device 9 is completed.
其次,進行IC器件9之檢查(步驟S205)。 Next, the inspection of the IC device 9 is performed (step S205).
其次,利用手單元433抓持IC器件9,並自保持部51取出(步驟S206),將該IC器件9搬送至特定位置(步驟S207)。以下,進行IC器件9之分類等各動作(作業)。 Next, the IC device 9 is gripped by the hand unit 433, and taken out from the holding unit 51 (step S206), and the IC device 9 is transported to a specific position (step S207). Hereinafter, each operation (work) such as classification of the IC device 9 is performed.
根據如上所述之第2實施形態,亦可發揮與上述第1實施形態相同之效果。 According to the second embodiment described above, the same effects as those of the first embodiment described above can be exhibited.
再者,於本實施形態中,搬送控制部81、定位控制部82及檢查控制部83由1個控制部8構成,但並不限定於此,例如亦可為搬送控制部81及定位控制部82由1個控制部構成,檢查控制部83與上述控制部分開地設置。 In the present embodiment, the transport control unit 81, the positioning control unit 82, and the inspection control unit 83 are configured by one control unit 8. However, the present invention is not limited thereto, and may be, for example, a transport control unit 81 and a positioning control unit. The 82 is composed of one control unit, and the inspection control unit 83 is provided to be open to the control unit.
以上,基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行了說明,但本發明並不限定於此,各部之構成亦 可置換為具有相同功能之任意構成。又,亦可對本發明附加其他任意之構成物。 Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit is also It can be replaced with any configuration having the same function. Further, any other constituents may be added to the present invention.
再者,於上述實施形態中,流路之數量為4個,但並不限定於此,流路之數量亦可為1個、2個、3個或5個以上。又,例如於流路之數量為2個之情形時,亦可將其中一者用於空氣之噴射,將另一者用於空氣之抽吸。又,此情形時,亦可不進行空氣之噴射與抽吸中之任一者。 Further, in the above embodiment, the number of the flow paths is four, but the number of the flow paths may be one, two, three or five or more. Further, for example, when the number of the flow paths is two, one of them may be used for the ejection of air and the other for the suction of the air. Further, in this case, either one of air injection and suction may not be performed.
又,於上述實施形態中,使用空氣作為流體,但於本發明中並不限定於此,例如可應用氮氣、氬氣、二氧化碳、氟系氣體、或包含該等之混合氣體等各種絕緣性氣體等氣體。 In the above embodiment, air is used as the fluid. However, the present invention is not limited thereto. For example, nitrogen gas, argon gas, carbon dioxide gas, fluorine gas, or various insulating gases including the mixed gas may be used. Wait for the gas.
又,於上述實施形態中,定位機構係利用流體而直接使電子零件移動,但於本發明中並不限定於此,例如亦可利用流體,使按壓構件移動,利用該按壓構件而按壓電子零件並使其移動。又,亦可利用馬達等驅動源而使按壓構件移動,利用該按壓構件而按壓電子零件並使其移動。 Further, in the above-described embodiment, the positioning mechanism directly moves the electronic component by the fluid. However, the present invention is not limited thereto. For example, the pressing member may be moved by the fluid, and the electronic component may be pressed by the pressing member. And make it move. Further, the pressing member can be moved by a driving source such as a motor, and the electronic component can be pressed and moved by the pressing member.
又,於上述實施形態中,作為檢測電子零件之定位已結束之檢測部而使用壓力感測器,但於本發明中並不限定於此,例如可列舉流量感測器、接觸感測器、光感測器等。 Further, in the above-described embodiment, the pressure sensor is used as the detecting portion for detecting the completion of the positioning of the electronic component. However, the present invention is not limited thereto, and examples thereof include a flow rate sensor and a contact sensor. Light sensor, etc.
51‧‧‧保持部 51‧‧‧ Keeping Department
52‧‧‧保持面 52‧‧‧ Keep face
53‧‧‧壁部 53‧‧‧ wall
54‧‧‧基板 54‧‧‧Substrate
55‧‧‧凹部 55‧‧‧ recess
100‧‧‧定位機構 100‧‧‧ Positioning mechanism
131‧‧‧管體 131‧‧‧pipe body
132‧‧‧管體 132‧‧‧ tube body
133‧‧‧管體 133‧‧‧ tube body
134‧‧‧管體 134‧‧‧pipe body
141‧‧‧閥門 141‧‧‧ Valve
142‧‧‧閥門 142‧‧‧ valve
143‧‧‧閥門 143‧‧‧ valve
144‧‧‧閥門 144‧‧‧ valve
151‧‧‧泵 151‧‧‧ pump
152‧‧‧泵 152‧‧‧ pump
153‧‧‧泵 153‧‧‧ pump
154‧‧‧泵 154‧‧‧ pump
161‧‧‧壓力感測器 161‧‧‧pressure sensor
162‧‧‧壓力感測器 162‧‧‧pressure sensor
510‧‧‧保持部本體 510‧‧‧ Keeping the body
551‧‧‧角部 551‧‧‧ corner
552‧‧‧角部 552‧‧‧ corner
553‧‧‧面 553‧‧‧ face
554‧‧‧面 554‧‧‧ Face
555‧‧‧面 555‧‧‧ face
556‧‧‧面 556‧‧‧ Face
1311‧‧‧開口 1311‧‧‧ openings
1321‧‧‧開口 1321‧‧‧ openings
1331‧‧‧開口 1331‧‧‧ openings
1341‧‧‧開口 1341‧‧‧ openings
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
Claims (10)
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JP2014110560A JP2015224990A (en) | 2014-05-28 | 2014-05-28 | Electronic component conveying apparatus and electronic component inspection apparatus |
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TW201545262A TW201545262A (en) | 2015-12-01 |
TWI555117B true TWI555117B (en) | 2016-10-21 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5825500A (en) * | 1995-11-27 | 1998-10-20 | Tokyo Electron Limited | Unit for transferring to-be-inspected object to inspection position |
US6481187B1 (en) * | 1997-07-16 | 2002-11-19 | Robotic Vision Systems, Inc. | Position sensing system and method for an inspection handling system |
JP2006245174A (en) * | 2005-03-02 | 2006-09-14 | Dainippon Printing Co Ltd | Positioning stage, pattern forming equipment, inspection device, position correction method, substrate supporting part |
-
2014
- 2014-05-28 JP JP2014110560A patent/JP2015224990A/en active Pending
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2015
- 2015-05-25 TW TW104116707A patent/TWI555117B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5825500A (en) * | 1995-11-27 | 1998-10-20 | Tokyo Electron Limited | Unit for transferring to-be-inspected object to inspection position |
US6481187B1 (en) * | 1997-07-16 | 2002-11-19 | Robotic Vision Systems, Inc. | Position sensing system and method for an inspection handling system |
JP2006245174A (en) * | 2005-03-02 | 2006-09-14 | Dainippon Printing Co Ltd | Positioning stage, pattern forming equipment, inspection device, position correction method, substrate supporting part |
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