TW201731594A - Film pattern writing method, coating film base material, and coating device - Google Patents

Abstract

Provided are a film pattern writing method, coating film base material, and coating device that make it possible, when forming a film pattern on a base material by an inkjet process, to increase image writing performance and suppress an increase in film pattern forming time associated with an improvement in image writing performance. Specifically, a film pattern writing method for forming a film pattern by inkjetting droplets in a film forming region on a base material comprises: an underlayer film forming step of forming an underlayer film pattern by ejecting a small quantity of droplets allowing for writing an image in the film forming region on the base material; and a thick film forming step of forming a film pattern by ejecting a greater quantity of droplets on the underlayer film pattern than the droplets with which the underlayer film pattern is formed.

Description

膜圖案描繪方法、塗布膜基材、及塗布裝置Film pattern drawing method, coated film substrate, and coating device

本發明係關於一種能夠對藉由將塗布液噴出至基材上而形成之膜圖案提高圖案之描繪性、及抑制伴隨著描繪性提高之膜圖案形成時間之增加的膜圖案之描繪方法、藉由該膜圖案之描繪方法獲得之塗布膜基材、及應用於該膜圖案之描繪方法之塗布裝置。The present invention relates to a method for drawing a film pattern capable of improving a pattern of a film pattern formed by ejecting a coating liquid onto a substrate, and suppressing an increase in film pattern formation time accompanied by an improvement in descriptive property. A coating film substrate obtained by the method for drawing a film pattern, and a coating device applied to the method for drawing the film pattern.

期望藉由噴墨法將液滴噴出至玻璃或薄膜等基材上，而形成線段、矩形狀等各種形狀之塗布膜(稱為膜圖案)。例如，如印刷基板或封裝基板之配線基板(基材)中之配線圖案、功率半導體之絕緣膜圖案先前藉由光微影法而形成。然而，於光微影法中必需塗布、曝光、蝕刻等較多之步驟，進而，於蝕刻步驟中消耗大量塗布材料，因此正在研究藉由使用噴墨法以較少之步驟不浪費塗布材料而形成膜圖案。例如圖9、圖10所示，於沿著長方形之電極100之外周100a形成膜圖案101之情形時，於光微影法中，將形成膜圖案101之塗布材料塗布整面並去除膜圖案101以外之部分之塗布材料，故而膜圖案101以外之部分之塗布材料被無謂地消耗。另一方面，於噴墨法中，由於能夠將塗布材料塗布於膜圖案101部分，故而能夠藉由僅對必需塗布材料之膜圖案101部分供給塗布材料，而消除於光微影法中被視為問題之塗布材料之浪費(例如參照下述專利文獻1)。利用該噴墨法之描繪係藉由於基材102上設定與膜圖案101對應之膜形成區域103並將多個作為塗布材料之固定粒徑之液滴104噴出至該膜形成區域103而進行。即，藉由具備載置基材102之平台及噴出液滴104之液滴單元之塗布裝置，使液滴單元於載置於平台之基材102上掃描，將液滴104噴出至設定於基材102之膜形成區域103，藉此形成膜圖案101。先前技術文獻專利文獻專利文獻1：日本專利特開2000-133649號公報It is desirable to eject a droplet onto a substrate such as glass or a film by an inkjet method to form a coating film (referred to as a film pattern) of various shapes such as a line segment or a rectangular shape. For example, a wiring pattern in a wiring substrate (substrate) such as a printed substrate or a package substrate, and an insulating film pattern of a power semiconductor are previously formed by photolithography. However, in the photolithography method, a large number of steps such as coating, exposure, etching, and the like are required, and further, a large amount of coating material is consumed in the etching step, and therefore it is being studied to use no ink waste method to waste the coating material in a small number of steps. A film pattern is formed. For example, as shown in FIG. 9 and FIG. 10, when the film pattern 101 is formed along the outer circumference 100a of the rectangular electrode 100, the coating material forming the film pattern 101 is coated on the entire surface and the film pattern 101 is removed in the photolithography method. The coated material other than the film pattern 101 is unnecessarily consumed. On the other hand, in the inkjet method, since the coating material can be applied to the film pattern 101 portion, it is possible to eliminate the application in the photolithography method by supplying the coating material only to the portion of the film pattern 101 of the necessary coating material. It is waste of the coating material of the problem (for example, refer to Patent Document 1 below). The inkjet method is performed by ejecting a plurality of droplets 104 having a fixed particle diameter as a coating material onto the film formation region 103 by setting the film formation region 103 corresponding to the film pattern 101 on the substrate 102. That is, the droplet unit is scanned on the substrate 102 placed on the stage by the coating device including the stage on which the substrate 102 is placed and the droplet unit that discharges the droplets 104, and the droplets 104 are ejected to the base. The film of the material 102 forms a region 103, whereby the film pattern 101 is formed. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-133649

[發明所欲解決之問題]近年來，與配線基材102、功率半導體等之高性能化、用途擴大相應地，追求基於膜圖案形狀之複雜化、細線化的塗布之高精度化。因此，於利用先前之噴墨法形成膜圖案101時，存在無法滿足描繪之高精度化之要求之情形。即，如圖10(a)所示般，若藉由噴墨法對膜形成區域103施加液滴104，則噴附至膜形成區域103之液滴104(塗布材料)沿著基材102之表面潤濕擴散，故而擴散至較噴附瞬間之形狀略大之區域。即便考慮到此情況而噴附至膜形成區域103之略靠內側而塗布，亦因第1個液滴104與其後之液滴104重疊，導致僅1滴之液滴104與液滴彼此重疊而成之液滴104之液量及乾燥狀態不同，故而產生潤濕擴散方式不同之現象。因此，如圖10(b)所示，實際之膜圖案101之端部(邊緣部101a)係於微觀地觀察之情形時具有波紋形狀，而存在如下問題：於該波紋程度並不沿著膜形成區域103之邊界部，而如圖10(b)之箭頭般，膜圖案101之邊緣部101a超出容許範圍之情形時，無法滿足描繪之高精度化之要求。因此，本發明之目的在於提供一種於藉由噴墨法於基材上形成膜圖案之情形時能夠提高描繪性、進而能夠抑制伴隨著描繪性提高之膜圖案形成時間之增加的膜圖案描繪方法、塗布膜基材、及塗布裝置。[解決問題之技術手段]為了解決上述問題，本發明之膜圖案描繪方法之特徵在於：其係於基材上之膜形成區域藉由噴墨法施加液滴而形成膜圖案者，其包括：基底膜形成步驟，其係藉由噴出能夠對基材上之膜形成區域進行描繪之微少液滴，而形成基底膜圖案；及厚膜形成步驟，其係藉由將較形成上述基底膜圖案之液滴更大顆粒之液滴噴出至上述基底膜圖案上，而形成膜圖案。根據上述膜圖案描繪方法，藉由基底膜形成步驟利用微少液滴形成基底膜圖案，其後，藉由厚膜形成步驟將液量多於上述微少液滴之大顆粒之液滴塗布於基底膜圖案上，藉此形成膜圖案，故而能夠精度較佳地描繪膜形成區域，進而能夠抑制因高精度塗布導致之塗布時間之增加。即，藉由利用能夠對膜形成區域進行描繪之微少液滴、換言之分辨率較高之液滴進行描繪，即便複雜化、細線化之膜圖案亦能夠精度較佳地滴液至細微部分。即，由於液滴之粒徑較小且一滴之液量為少量，故而噴附至膜形成區域時之乾燥速度變快從而能夠抑制潤濕擴散。具體而言，即便於噴附至膜形成區域之液滴彼此重疊之情形時，亦與液量比先前之液滴少之程度相應地抑制潤濕擴散，故而能夠抑制膜圖案(基底膜圖案)之端部(邊緣部)之波紋現象，從而提高描繪精度。而且，於形成與膜形成區域相對應之基底膜圖案後，藉由厚膜形成步驟，使液量多於微少液滴之大顆粒之液滴噴附。即，藉由大顆粒之液滴與基底膜圖案融合而形成最終之膜圖案。藉此，與僅藉由微少液滴形成膜圖案之情形相比，能夠減少噴出次數、及掃描次數，故而能夠抑制膜圖案之形成所需之時間變長。即，若僅藉由微少液滴形成膜圖案，則1片基材所需之處理時間(產距時間)增加，進而，若處理時間變長，則微少液滴之乾燥速度較快，故而液滴彼此之融合較差，而存在因產生膜不均、條紋不均等而影響膜本身之品質之可能性。然而，於形成基底膜圖案後之厚膜形成步驟中，由於藉由較微少液滴更大顆粒之液滴形成膜圖案，故而與僅藉由微少液滴形成膜圖案之情形相比，能夠減少噴出次數而縮短塗布動作，從而能夠縮短膜圖案形成所需之時間。又，較佳為如下構成，即，上述厚膜形成步驟係於上述基底膜形成步驟結束後且於上述基底膜圖案完全乾燥前開始，並且於上述基底膜圖案完全乾燥前完成。根據上述構成，當於形成基底圖案後，藉由厚膜形成步驟塗布液量較多之大顆粒之液滴時，藉由基底膜圖案之表面張力拉拽大顆粒之液滴，藉此能夠一面防止液滴超出基底圖案而潤濕擴散，一面形成膜圖案。而且，由於在基底圖案完全乾燥前完成厚膜形成步驟，故而所有大顆粒之液滴於基底圖案乾燥前被滴液，藉此大顆粒之液滴與基底圖案融合而形成整體均勻之膜圖案，從而能夠抑制產生膜不均、條紋不均等。又，亦可設為如下構成，即，至少於上述基底膜形成步驟中，於噴出液滴而於基材形成膜圖案之液滴單元與上述基材之相對位置和對上述液滴單元之各噴嘴設定之噴出位置座標一致的情形時，自上述液滴單元噴出液滴。根據該構成，與先前之基於點陣圖資料使液滴自各噴嘴噴出而描繪膜圖案之方法相比，能夠更加提高位置分辨率而噴出液滴，故而能夠提高膜圖案之描繪性。又，為了解決上述問題，本發明之塗布膜基材之特徵在於藉由上述膜圖案描繪方法而形成。根據上述塗布膜基材，能夠製成不存在膜不均、條紋不均等之高品質之塗布膜基材。又，為了解決上述問題，本發明之塗布裝置之特徵在於具備：平台，其載置基材；及液滴單元，其一面相對於載置於上述平台之基材相對地移動，一面噴出液滴而於基材形成膜圖案；並且上述液滴單元具有：微少液滴噴嘴，其噴出能夠對基材上之膜形成區域進行描繪之微少液滴；及厚膜噴嘴，其噴出液量較上述微少液滴多之液滴。根據上述塗布裝置，具備將微少液滴噴出至液滴單元之微少液滴噴嘴、及直徑大於微少液滴之厚膜噴嘴，故而能夠於藉由微少液滴噴嘴於基材上形成基底膜圖案後，立即噴出液量較多之大顆粒之液滴，因此能夠於基底膜圖案完全乾燥前自厚膜噴嘴噴出大顆粒之液滴，從而形成膜圖案。又，能夠利用1台裝置形成藉由具有上述基底膜形成步驟及厚膜形成步驟之膜圖案描繪方法實現的塗布膜基材。又，亦可設為如下構成，即，上述液滴單元具備：第1噴嘴頭，其具有上述微少液滴噴嘴；第2噴嘴頭，其具有上述厚膜噴嘴；及頭移動機構，其使上述第1噴嘴頭及第2噴嘴頭於上述平台上移動。根據該構成，能夠於一噴嘴頭塗布動作中，使另一噴嘴頭進行閃蒸，故而能夠於微少液滴噴嘴內使液滴乾燥而抑制產生噴嘴堵塞。又，亦可設為如下構成，即，上述塗布裝置具備：位置檢測部，其檢測上述微少液滴噴嘴及上述厚膜噴嘴與上述平台上之基材之相對位置；及記憶部，其針對上述微少液滴噴嘴及上述厚膜噴嘴之各噴嘴之每一個記憶上述各噴嘴噴出液滴之噴出位置座標；並且該塗布裝置具有驅動信號輸出部，該驅動信號輸出部於由上述位置檢測部檢測出之位置與上述噴出位置座標一致時，輸出使液滴自上述各噴嘴噴出之驅動信號。根據該構成，於由位置檢測部檢測出之各噴嘴與基材之相對位置和針對各噴嘴之每一個設定之噴出位置座標一致之情形時噴出液滴，故而能夠根據位置檢測部之位置分辨率而噴出液滴。因此，與先前之基於點陣圖資料使液滴自各噴嘴噴出而描繪膜圖案之方法相比，能夠提高所噴出之液滴之位置分辨率。又，亦可設為如下構成，即，上述塗布裝置具備：位置檢測部，其至少檢測上述微少液滴噴嘴與上述平台上之基板之相對位置；及記憶部，其針對上述微少液滴噴嘴之各噴嘴之每一個記憶上述各噴嘴噴出液滴之噴出位置座標；並且該塗布裝置具有驅動信號輸出部，該驅動信號輸出部於由上述位置檢測部檢測出之位置與上述噴出位置座標一致時，輸出使液滴自上述各噴嘴噴出之驅動信號。根據該構成，僅針對微少液滴噴嘴，於各噴嘴與基材之相對位置和針對各噴嘴之每一個設定之噴出位置座標一致之情形時噴出液滴，故而能夠僅針對微少液滴噴嘴，根據位置檢測部之位置分辨率而噴出液滴。即，例如能夠藉由微少液滴噴嘴僅描繪必需高解像度之輪廓，其後，藉由厚膜噴嘴描畫輪廓內部之區域，從而能夠以短時間形成具有複雜之輪廓之膜圖案。[發明之效果]根據本發明，能夠於藉由噴墨法於基材上形成膜圖案之情形時提高描繪性，進而能夠抑制伴隨著描繪性提高之膜圖案形成時間之增加。[Problems to be Solved by the Invention] In recent years, in order to increase the performance of the wiring substrate 102 and the power semiconductor, and to expand the use, it is desired to increase the precision of the shape of the film pattern and the application of the thin line. Therefore, when the film pattern 101 is formed by the conventional inkjet method, there is a case where the accuracy of the drawing cannot be satisfied. That is, as shown in FIG. 10(a), when the droplets 104 are applied to the film formation region 103 by the inkjet method, the droplets 104 (coating material) sprayed onto the film formation region 103 are along the substrate 102. The surface is wetted and diffused, so it spreads to a slightly larger shape than the instant of the spray. Even if it is applied to the film formation region 103 slightly inside while being coated in consideration of this, the first droplet 104 overlaps with the droplet 104 thereafter, so that only one droplet 104 and the droplet overlap each other. Since the liquid amount and the dry state of the droplets 104 are different, a phenomenon in which the wetting diffusion method is different is generated. Therefore, as shown in Fig. 10 (b), the end portion (edge portion 101a) of the actual film pattern 101 has a corrugated shape in the case of microscopic observation, and there is a problem that the degree of the corrugation does not follow the film. When the boundary portion of the region 103 is formed, and the edge portion 101a of the film pattern 101 is out of the allowable range as shown by the arrow in Fig. 10(b), the accuracy of the drawing cannot be satisfied. In view of the above, it is an object of the present invention to provide a film pattern drawing method capable of improving the patterning property when forming a film pattern on a substrate by an inkjet method, and further suppressing an increase in film pattern formation time accompanying improvement in patterning property. , a coating film substrate, and a coating device. [Means for Solving the Problems] In order to solve the above problems, the film pattern drawing method of the present invention is characterized in that a film formation region attached to a substrate is formed by applying a droplet by an inkjet method to form a film pattern, and includes: a base film forming step of forming a base film pattern by ejecting minute droplets capable of depicting a film formation region on the substrate; and a thick film forming step by forming the base film pattern Droplets of larger droplets of the droplets are ejected onto the base film pattern to form a film pattern. According to the above-described film pattern drawing method, the base film formation step is performed by using the minute film formation step, and thereafter, the droplets of the large particles having the liquid amount more than the above-mentioned minute droplets are applied to the base film by the thick film formation step. By forming a film pattern on the pattern, the film formation region can be accurately drawn, and the increase in coating time due to high-precision coating can be suppressed. In other words, by drawing a droplet having a high resolution which can be drawn on the film formation region, in other words, a droplet having a high resolution, even a complicated and thinned film pattern can be accurately dripped to a fine portion. That is, since the particle diameter of the droplet is small and the amount of the liquid of one drop is small, the drying speed at the time of spraying to the film formation region is increased, and the wetting diffusion can be suppressed. Specifically, even when the droplets sprayed on the film formation region overlap each other, the wetting diffusion is suppressed in accordance with the degree that the liquid amount is smaller than the previous droplets, so that the film pattern (base film pattern) can be suppressed. The corrugation phenomenon at the end (edge portion) improves the drawing accuracy. Further, after the base film pattern corresponding to the film formation region is formed, the droplets of the large particles having a liquid amount more than the minute droplets are sprayed by the thick film forming step. That is, the final film pattern is formed by fusing droplets of large particles with the base film pattern. As a result, the number of ejections and the number of scans can be reduced as compared with the case where the film pattern is formed only by the minute droplets, so that the time required for the formation of the film pattern can be suppressed from becoming long. That is, when the film pattern is formed only by the minute droplets, the processing time (the production time) required for one substrate is increased, and further, when the treatment time is long, the drying speed of the droplets is relatively fast, so the liquid The droplets are poorly fused to each other, and there is a possibility that the quality of the film itself is affected by uneven film formation, uneven streaks, and the like. However, in the thick film forming step after the formation of the base film pattern, since the film pattern is formed by the droplets of the smaller particles having smaller droplets, the film pattern can be reduced as compared with the case where the film pattern is formed only by the minute droplets. The number of ejections shortens the coating operation, and the time required for film formation can be shortened. Further, it is preferable that the thick film forming step is performed after the completion of the base film forming step and before the base film pattern is completely dried, and before the base film pattern is completely dried. According to the above configuration, when the droplets of the large particles having a large amount of liquid are applied by the thick film forming step after the formation of the base pattern, the droplets of the large particles are pulled by the surface tension of the underlying film pattern, whereby one side can be pulled The film pattern is formed while preventing the droplets from diffusing and diffusing beyond the base pattern. Moreover, since the thick film forming step is completed before the base pattern is completely dried, all the droplets of the large particles are dripped before the base pattern is dried, whereby the droplets of the large particles are fused with the base pattern to form an overall uniform film pattern. Thereby, it is possible to suppress occurrence of film unevenness, unevenness of stripes, and the like. Further, in the base film forming step, at least the position of the droplet unit that forms the film pattern on the substrate and the substrate and the respective droplet units may be formed in at least the base film forming step. When the coordinates of the ejection position of the nozzle setting are the same, droplets are ejected from the droplet unit. According to this configuration, compared with the conventional method of ejecting droplets from the respective nozzles based on the dot pattern data and drawing the film pattern, the position resolution can be further increased and the liquid droplets can be ejected, so that the pattern property of the film pattern can be improved. Moreover, in order to solve the above problems, the coating film base material of the present invention is characterized by the film pattern drawing method described above. According to the coating film substrate described above, it is possible to produce a coating film substrate having high quality such as film unevenness and uneven streaks. Further, in order to solve the above problems, the coating apparatus of the present invention is characterized by comprising: a stage on which a substrate is placed; and a droplet unit that ejects a droplet while moving relative to a substrate placed on the stage Forming a film pattern on the substrate; and the droplet unit has: a droplet ejection nozzle that ejects a small number of droplets capable of depicting a film formation region on the substrate; and a thick film nozzle having a smaller amount of ejection liquid than the above More droplets of droplets. According to the coating apparatus described above, there is provided a minute droplet nozzle for discharging minute droplets to the droplet unit and a thick film nozzle having a diameter larger than that of the droplets, so that the base film pattern can be formed on the substrate by the minute droplet nozzle. Immediately, droplets of large particles having a large amount of liquid are ejected, so that droplets of large particles can be ejected from the thick film nozzle before the base film pattern is completely dried, thereby forming a film pattern. Further, the coating film substrate which is realized by the film pattern drawing method having the above-described base film forming step and thick film forming step can be formed by one apparatus. Further, the liquid droplet unit may include a first nozzle head including the minute droplet nozzle, a second nozzle head including the thick film nozzle, and a head moving mechanism that causes the above The first nozzle head and the second nozzle head move on the platform. According to this configuration, it is possible to cause the other nozzle head to be flashed during the nozzle head application operation, so that the droplets can be dried in the minute droplet nozzle to suppress nozzle clogging. Further, the coating apparatus may include a position detecting unit that detects a relative position of the minute droplet nozzle and the thick film nozzle and a substrate on the stage, and a memory unit that is configured to Each of the nozzles of the minute droplet nozzle and the thick film nozzle memorizes the ejection position coordinates of the droplets ejected by the respective nozzles; and the coating device has a driving signal output portion, and the driving signal output portion is detected by the position detecting portion When the position coincides with the above-described discharge position coordinates, a drive signal for discharging the liquid droplets from the respective nozzles is output. According to this configuration, when the relative position of each nozzle and the substrate detected by the position detecting unit and the discharge position coordinates set for each of the nozzles match, the liquid droplets are ejected, so that the position resolution of the position detecting unit can be determined. And the droplets are ejected. Therefore, the positional resolution of the ejected droplets can be improved as compared with the conventional method of ejecting droplets from the respective nozzles based on the dot pattern data to draw a film pattern. Further, the coating apparatus may include a position detecting unit that detects at least a relative position of the minute droplet nozzle and a substrate on the stage, and a memory unit that is directed to the minute droplet nozzle Each of the nozzles stores a discharge position coordinate of the droplets ejected by the respective nozzles, and the coating device has a drive signal output unit that matches the position of the discharge position when the position detected by the position detecting unit matches A drive signal that causes droplets to be ejected from each of the nozzles is output. According to this configuration, the droplets are ejected only when the relative positions of the respective nozzles and the substrate and the ejection position coordinates set for each of the nozzles coincide with each other, so that it is possible to apply only to the minute droplet nozzles. The droplets are ejected by the position resolution of the position detecting portion. That is, for example, only a contour having a high resolution can be drawn by a small droplet nozzle, and thereafter, a region inside the contour can be drawn by a thick film nozzle, whereby a film pattern having a complicated contour can be formed in a short time. [Effects of the Invention] According to the present invention, it is possible to improve the portability when a film pattern is formed on a substrate by an inkjet method, and it is possible to suppress an increase in film pattern formation time accompanying an improvement in the drawability.

以下，基於圖式，對本發明之實施形態進行說明。圖1係概略性地表示本發明之塗布裝置之俯視圖，圖2係圖1之塗布裝置之側視圖，圖3係表示基材與膜圖案之圖，圖3(a)係表示於片材貼附有基材之狀態之圖，圖3(b)係表示於基材上形成有膜圖案之狀態之圖。如圖1、圖2所示，塗布裝置具備載置基材W之平台10、及將塗布材料噴出至基材W上之液滴單元2，藉由一面使平台10與液滴單元2相對地移動，一面使塗布材料噴出，能夠於基材W上形成膜圖案3。即，平台10以可於一方向移動之方式形成，於液滴單元2，噴出塗布材料之噴嘴頭4以與平台10之移動方向正交之方式形成，於該等平台10與噴嘴頭4交叉之區域(塗布區域A)，噴出塗布材料而於基材W上形成膜圖案3。再者，於以下之說明中，將平台10移動之方向作為X軸方向、噴嘴頭4移動之方向作為Y軸方向、與X軸及Y軸方向兩者正交之方向作為Z軸方向而進行說明。此處，圖3係作為一例將功率半導體晶片(以下簡稱為晶片)設為基材W之情形時的圖，圖3(a)係於片材S上貼附有複數個晶片(基材W)之圖，圖3(b)係表示於基材W上形成有膜圖案3之1片晶片之圖。該晶片具有電極部E及覆蓋電極部E之絕緣膜部R，以覆蓋大致長方形之電極部E之周圍之方式設置有絕緣膜部R。於本實施形態中，供給於基材W上形成有電極部E者，藉由將塗布材料塗布於基材W上之電極部E而形成膜圖案3，最終將該膜圖案3形成為絕緣膜部R。即，於基材W，設定有與膜圖案3相對應之膜形成區域5，如圖3(b)所示，設定有圓環狀之長方形且角部形成為圓弧狀之膜形成區域5。該膜形成區域5係線寬於100 μm～300 μm之範圍內設定，線寬之偏差(波紋部分之容許範圍)於10 μm～30 μm內設定。若將複數個此種基材W貼附於片材S上並將1片片材S載置於平台10，則藉由使塗布材料之液滴30噴出至各基材W各自之膜形成區域5而形成膜圖案3。再者，於本實施形態中，以功率半導體晶片為例進行說明，但並不限定於此，亦可將如印刷基板或封裝基板之配線基板作為基材W，只要為形成線段、矩形狀等各種形狀之膜圖案3者，則可應用於所有基材。圖1、圖2所示之塗布裝置具有自上方觀察為十字形狀之基台6，於該基台6上設置有平台10、液滴單元2。具體而言，液滴單元2具有於一方向(Y軸方向)延伸之形狀，平台10設置為能夠以與液滴單元2之大致中央位置交叉之方式移動。又，該塗布裝置設定有各處理區域，於X軸方向近前側設定基材更換區域B，於平台10與液滴單元2交叉之位置設定有塗布區域A。即，平台10可移動至基材更換區域B及塗布區域A，若於基材更換區域B將基材W搬入，則平台10移動至塗布區域A，於塗布區域A在基材W上形成膜圖案3之後，再次移動至基材更換區域B，將基材W搬出。平台10係載置基材W者，將所載置之基材W以維持水平之姿勢之狀態載置。於本實施形態中，載置貼附有複數個基材W之片材S。於該平台10之表面，形成有連接有真空泵之複數個抽吸孔，藉由使真空泵作動，而使抽吸孔產生抽吸力而能夠將基材W(片材S)保持於平台10之表面。該平台10可於一方向移動。即，於基台6上設置有於X軸方向延伸之軌道11，平台10滑動自如地安裝於該軌道11。而且，於平台10安裝有線性馬達，藉由驅動控制線性馬達，而能夠移動至任意位置以及於任意位置停止。藉此，平台10能夠移動至塗布區域A及基材更換區域B。該塗布區域A係將液滴30自液滴單元2噴出至基材W上而形成膜圖案3之區域。即，平台10能夠相對於液滴單元2於X軸方向微少地移動，而能夠準確地進行特定位置處之X軸方向成分之移動。又，基材更換區域B係進行貼附有基材W之片材S之更換之區域，經由機器手等進行基材W之搬入及搬出。即，於搬入基材W時，平台10移動至基材更換區域B，將片材S(基材W)供給至平台10表面。繼而，移動至塗布區域A並於基材W形成膜圖案3之後，再次移動至基材更換區域B，將塗布膜基材W(形成有膜圖案3之基材W(片材S))經由機器手等搬出。液滴單元2係使液滴30噴附於基材W上而形成膜圖案3者。液滴單元2具有於一方向(Y軸方向)延伸之支架部21、及設置於該支架部21之噴嘴頭4。支架部21具有由2根腳部22及樑部23形成之門型形狀，該等2根腳部22係於Y軸方向隔開地設置於基台6上，該樑部23連結該等腳部22且於Y軸方向延伸。即，支架部21形成為橫跨使平台10移動之軌道11之形狀。而且，於樑部23設置有噴嘴頭4，於本實施形態中，該噴嘴頭4具有使微少液滴30a噴出之微少液滴噴嘴頭41(第1噴嘴頭)、及使液量較微少液滴30a多之液滴30b噴出之厚膜噴嘴頭42(第2噴嘴頭)。此處，於無須將微少液滴噴嘴頭41(第1噴嘴頭)、厚膜噴嘴頭42(第2噴嘴頭)區別表示之情形時，將其等簡稱為噴嘴頭4。噴嘴頭4藉由樑部23相對於腳部22升降動作而可相對於基材W升降動作。藉此，於進行對基材W噴出塗布材料之塗布動作時，能夠調節基材W與噴嘴頭4之距離以使其等之距離變得合適。於噴嘴頭4，設置有複數個噴出塗布材料之頭模組。該頭模組係將壓電元件作為驅動源之墨水噴出裝置，於與平台10對向之平坦之噴嘴面形成有複數個噴嘴。而且，藉由驅動壓電元件，能夠自各噴嘴逐滴噴出塗布材料。再者，於本實施形態中，於無須區別下述微少液滴噴嘴、厚膜噴嘴之情形時，將其等簡稱為噴嘴。又，噴嘴頭4中之微少液滴噴嘴頭41(第1噴嘴頭)係用以噴出微少液滴30a而形成基底膜圖案3者。此處，基底膜圖案3係用以形成膜圖案3之基底，且係最初形成於膜形成區域5之膜圖案3。於本實施形態中，於膜形成區域5整面形成較薄之膜即基底膜圖案3，其後，形成下述厚膜圖案3，藉此形成一體化之膜圖案3。微少液滴噴嘴頭41具有微少液滴噴嘴，藉由微少液滴30a能夠描繪複雜化、細線化之膜圖案3(基底膜圖案3)。該微少液滴30係具有描畫膜圖案3之分辨率之程度之液滴30，且係於噴附而形成塗布膜之情形時能夠根據液量與乾燥狀態之關係抑制膜形成區域5之端部(膜圖案3之邊緣部31)之波紋現象而達到膜圖案3之邊緣部31中之線寬之偏差之要求精度的程度之液滴30。先前之液滴30(10～20 pl)係若描繪複雜化、細線化之膜圖案3則於膜形成區域5之端部(邊緣部31)產生波紋現象，該波紋程度不沿著膜形成區域5之邊界部而無法滿足描繪之高精度化之要求，但藉由能夠噴出粒徑小於先前之液滴30之少量之微少液滴30a，而能夠滿足邊緣部31之要求。又，微少液滴噴嘴頭41能夠沿著樑部23於Y軸方向移動(頭移動機構)。具體而言，於樑部23上設置有於Y軸方向延伸之軌道，微少液滴噴嘴頭41滑動自如地安裝於該軌道。而且，藉由驅動控制線性馬達，能夠移動至任意位置以及於任意位置停止。藉此，微少液滴噴嘴頭41能夠移動至供塗布於基材W上進行之塗布區域A、及待機區域P。又，微少液滴噴嘴頭41能夠於Y軸方向微少地移動，從而能夠於塗布區域A對平台10上之基材W使作為塗布材料之液滴30精度較佳地噴附於Y軸方向之特定位置。即，藉由微少液滴噴嘴頭41於Y軸方向移動且平台10於X軸方向移動，微少液滴噴嘴頭41與平台10相對地移動，從而能夠使微少液滴30a精度較佳地噴附於設定在基材W上之XY平面中之膜形成區域5之特定位置。又，微少液滴噴嘴頭41係於待機區域P進行閃蒸，藉此能夠防止微少噴嘴之孔堵塞。於本實施形態中，於在塗布區域A中形成基底膜圖案32後，移動至待機區域P。而且，於待機區域P進行閃蒸直至將下一個新的片材S供給至塗布區域A而開始基底膜圖案步驟，從而能夠防止微少噴嘴之孔堵塞。又，厚膜噴嘴頭42(第2噴嘴頭)係噴出液量較微少液滴30a多之大顆粒之液滴30b而於基底膜圖案32上形成厚膜圖案33者。厚膜圖案33係為了對形成於膜形成區域5之基底膜圖案32補充塗布材料而形成膜圖案3所必需之追加之圖案(厚膜圖案33)。藉由對基底膜圖案32施加液滴30b形成厚膜圖案33，而使基底膜圖案32與厚膜圖案33一體化，從而形成與膜形成區域5相對應之膜圖案3。即，藉由於形成基底膜圖案32後且於基底膜圖案32完全乾燥前噴出液滴30b，所噴出之液滴30b與基底膜圖案32融合而形成膜圖案3。該厚膜噴嘴頭42之液滴30b雖無法滿足膜形成區域5之分辨率，但若將液滴30b自厚膜噴嘴頭42噴出至形成於膜形成區域5之基底膜圖案32，則液滴30b受到表面張力之影響，藉此所噴附之液滴30b被基底膜圖案32拉拽而能夠停留於膜形成區域5內。即，自厚膜噴嘴頭42噴出之液滴30b形成厚膜圖案33而不會自膜形成區域5漏出(溢出)，且進而與基底膜圖案32融合，藉此能夠形成膜圖案3。藉此，能夠使供給至膜形成區域5之液量增大，故而與僅藉由微少液滴噴嘴形成膜圖案3之情形相比，能夠以短時間進行膜圖案3之形成。厚膜噴嘴頭42具有能夠噴出較微少液滴噴嘴頭41更大顆粒之(液量多之)液滴30b的厚膜噴嘴，能夠噴出與先前之液滴30(10～20 pl)相同程度之液滴30b。又，厚膜噴嘴頭42能夠沿著樑部23於Y軸方向移動(頭移動機構)。具體而言，於樑部23上，與微少液滴噴嘴頭41分開設置有於Y軸方向延伸之軌道，厚膜噴嘴頭42滑動自如地安裝於該軌道。而且，藉由驅動控制線性馬達，能夠移動至任意位置以及於任意位置停止。藉此，厚膜噴嘴頭42能夠移動至供塗布於基材W上進行之塗布區域A、及待機區域P。又，厚膜噴嘴頭42能夠於Y軸方向微少地移動，從而能夠於塗布區域A對平台10上之基材W使作為塗布材料之液滴30b精度較佳地噴附於Y軸方向之特定位置。即，藉由厚膜噴嘴頭42於Y軸方向移動且平台10於X軸方向移動，厚膜噴嘴頭42與平台10相對地移動，從而能夠使液滴30b精度較佳地噴附於設定在基材W上之XY平面中之膜形成區域5之特定位置。又，厚膜噴嘴頭42係於待機區域P進行閃蒸，藉此防止厚膜噴嘴之孔堵塞。於本實施形態中，可於在塗布區域A中形成厚膜圖案33後，移動至待機區域P。而且，於待機區域P進行閃蒸直至將下一個新的片材S供給至塗布區域A而開始基底膜形成步驟後之厚膜形成步驟，藉此能夠防止厚膜噴嘴之孔堵塞。又，於樑部23，在噴嘴頭4之相反側設置有檢查單元。即，於塗布區域A與基材更換區域B之間，設置有檢查區域C，於檢查區域C中，進行基材W之定位、及所形成之膜圖案3之檢查。具體而言，於樑部23，設置有檢查相機7(CCD相機)，於檢查區域C外待機之檢查相機7可一面沿著樑部23之延伸方向移動，一面拍攝基材W表面(片材S之表面)。而且，藉由拍攝設置於基材W之對準標記，掌握膜圖案3相對於各基材W之形成位置(膜形成區域5)，並基於所掌握之膜圖案3之形成位置自噴嘴頭4噴出液滴30，藉此形成膜圖案3。又，於基材W上形成膜圖案3後，藉由檢查相機7拍攝各膜圖案3，藉此進行關於各膜圖案3是否良好之檢查。即，於檢查相機7一面沿著樑部23移動(一面於Y軸方向移動)，一面進行膜圖案3之拍攝後，平台10於X軸方向移動，再次使檢查相機7一面於Y軸方向移動，一面進行拍攝，反覆進行上述動作，藉此拍攝形成於片材S上之基材W之所有膜圖案3。繼而，將所拍攝之圖像資料發送至下述控制裝置，藉由控制裝置判定膜圖案3是否良好。控制裝置(未圖示)係為了根據預先記憶之程式執行一連串之塗布動作，而驅動控制各單元之驅動裝置並且進行塗布動作所需之各種運算者。於本實施形態中，對各基材W，記憶以對準標記為基準之膜圖案3形成位置(基準位置)，根據載置於平台10之基材W(片材S)之對準標記之偏移量，修正各基材W之膜圖案3形成位置(基準位置)。即，根據由檢查相機7拍攝之對準標記之位置資訊，修正膜圖案3形成位置，而修正膜形成區域5中之噴嘴頭4之噴出位置(噴附位置)。藉此，即便於貼附有基材W之片材S之配置略微偏移之情形時，亦能夠對片材S上之基材W精度較佳地形成膜圖案3。又，亦設定有與所應形成之膜圖案3之線寬及線寬之偏差有關之容許值，若於基材W上形成膜圖案3，則根據由檢查相機7拍攝之圖像資料算出線寬及線寬之偏差，並判定該等值是否為容許值內。假設於膜圖案3為自容許值偏離者之情形時，將其於基材更換區域B中作為不良品排出。其次，一面參照圖4所示之流程圖，一面對該塗布裝置中之動作進行說明。首先，於步驟S1中，進行基材W之搬入。具體而言，平台10於基材更換區域B待機，藉由機器手搬送貼附有複數個基材W之片材S並將其載置於平台10上。繼而，於步驟S2中，進行對準處理。於該對準處理中，進行與載置於平台10之基材W對應之膜形成區域5的位置修正。具體而言，於平台10自基材更換區域B移動至檢查區域C後，藉由檢查相機7拍攝對準標記，藉此特定出對準標記位置。繼而，根據所特定出之對準標記之偏移量修正各基材W之膜圖案3形成位置(基準位置)，從而確定膜形成區域5中之噴嘴頭4之噴出位置(噴附位置)。繼而，於步驟S3中，進行基底膜形成步驟。即，對各基材W形成基底膜圖案32。具體而言，檢查區域C之平台10移動至塗布區域A，並且微少液滴噴嘴頭41自待機區域P移動至塗布區域A。繼而，基於在上述步驟S2中算出之噴出位置資訊，將微少液滴30a噴出至各基材W之膜形成區域5。即，如圖5所示，將微少液滴30a噴出至膜形成區域5之邊界之內側，而於膜形成區域5整體形成均勻之基底膜圖案32。具體而言，如圖6所示，若將微少液滴30a噴出至膜形成區域5，則噴出至膜形成區域5之微少液滴30a由於粒徑較小且液量為少量，故而噴附至膜形成區域5內並停留於此，且藉由與噴附同時開始乾燥而抑制潤濕擴散(圖6(a))。而且，藉由鄰接之微少液滴30a彼此融合，而於膜形成區域5形成均勻之基底膜圖案32(圖6(b))。即，能夠精度較佳地描畫複雜化、細線化之膜形成區域5，抑制邊緣部31中之波紋程度。繼而，於步驟S4中進行厚膜形成步驟。該厚膜形成步驟係於基底膜圖案32上追加形成圖案(厚膜圖案33)之步驟，於基底膜圖案32完全乾燥前開始並結束。具體而言，於形成基底膜圖案32後，厚膜噴嘴頭42自待機區域P移動至塗布區域A，並基於在上述步驟S2中算出之噴出位置資訊，將液滴30b噴出至各基材W之膜形成區域5。即，如圖5及圖6(c)所示，噴出至基底膜圖案32上之液滴30b係所噴出之液滴30b受到表面張力之影響被基底膜圖案32拉拽而停留於膜形成區域5內。而且，鄰接之液滴30b彼此重疊，與此同時，與未完全乾燥之基底膜圖案32融合，藉此形成與基底膜圖案32成為一體之膜圖案3(圖6(d))。繼而，於步驟S5中，進行檢查步驟。即，判斷所形成之膜圖案3是否良好。具體而言，平台10移動至檢查區域C，並且檢查相機7移動至檢查區域C。繼而，藉由檢查相機7拍攝基材W上之所有膜圖案3，並基於所獲得之圖像資料，進行所形成之膜圖案3是否良好之判定。繼而，於步驟S6中，進行基材W之排出。即，平台10自檢查區域C移動至基材更換區域B，並將平台10上之基材W(片材S)載置於機器手，藉此將基材W排出。該排出之基材W藉由後續步驟之乾燥裝置使膜圖案3完全乾燥。如上述般，根據本實施形態之塗布裝置、膜圖案3描繪方法，藉由基底膜形成步驟利用微少液滴30a形成基底膜圖案32，其後，藉由厚膜形成步驟將較上述微少液滴30a更大顆粒之液滴30b塗布於基底膜圖案32上，藉此形成膜圖案3，故而能夠精度較佳地描繪膜形成區域5，進而能夠抑制因高精度塗布導致之塗布時間之增加，而縮短圖案形成所需之時間。又，於上述實施形態中，對在基底膜形成步驟中於膜形成區域5整體形成均勻之基底膜圖案32之例進行了說明，但亦可如圖7、圖8所示般，形成沿著膜形成區域5之邊界部之基底膜圖案32，其後進行厚膜形成步驟。具體而言，於基底膜形成步驟中，沿著膜形成區域5之邊界部、即外框噴出微少液滴30a(圖8(a))。所噴附之微少液滴30a一面相互重疊，一面沿著外框呈線狀地潤濕擴散。而且，最終，於膜形成區域5之邊界部形成沿著邊界部之線狀之基底膜圖案32(圖8(b))。即，若將微少液滴30a噴出至膜形成區域5，則噴出至膜形成區域5之微少液滴30a由於粒徑較小且液量為少量，故而噴附至膜形成區域5內並停留於此，並且藉由與噴附同時開始乾燥而抑制潤濕擴散，從而能夠精度較佳地描畫膜形成區域5。藉此，能夠抑制所形成之基底膜圖案32之邊緣部31中之波紋程度。繼而，於膜厚形成步驟中，將液滴30b噴出至膜形成區域5而形成厚膜圖案33。具體而言，藉由將液滴30b噴出至基底膜圖案32上、及基材W(電極)上，而形成厚膜圖案33。即，若噴出液滴30b，則所噴附之液滴30b彼此產生重疊而欲潤濕擴散，但之前所形成之線狀之基底膜圖案32能夠發揮堤壩之作用，抑制所噴附之液滴30b超出基底膜圖案32而潤濕擴散(圖8(c))。而且，基底膜圖案32由於其邊緣部31中之波紋程度受到抑制，故而其後所噴出之液滴30b因表面張力之影響而欲停留於由基底膜圖案32形成之框內。其結果，所噴附之液滴30b與基底膜圖案32融合並一體化而形成之膜圖案3的邊緣部31中之波紋程度受到抑制，從而不損及微少液滴30a之分辨率而形成精度較佳之膜圖案3(圖8(d))。又，於上述實施形態中，關於噴嘴頭4，對噴出微少液滴30a而形成基底膜圖案32之微少液滴噴嘴頭41(第1噴嘴頭4)與形成厚膜圖案33之厚膜噴嘴頭42(第2噴嘴頭4)獨立設置之例進行了說明，但亦可於1個噴嘴頭4設置微少液滴30a噴嘴與厚膜噴嘴。於此情形時，於形成基底膜圖案32後，可不進行噴嘴頭4之更換動作，而形成厚膜圖案33，故而即便於塗布材料之速乾性較高而基底膜圖案32迅速乾燥之情形時，亦能夠迅速噴出，就此點而言較佳。又，於上述實施形態中說明之噴出位置資訊通常根據點陣圖資料進行設定。即，如圖11所示般，以如下方式構成：於頭45(相當於上述實施形態之噴嘴8頭4)設置有5個噴嘴8(噴嘴81～85)，頭45一面於塗布方向移動，一面自噴嘴8噴出液滴，藉此形成膜圖案3。噴出位置資訊係以將基材W劃分為複數個格子狀所得之像素資料(點陣圖資料)設定，於圖11之例中如被塗滿之像素K般被設定。而且，於塗布方向上每前進1像素便輸出驅動信號，而自成為對象之噴嘴8噴出液滴。例如，於圖11之例中，若於已自左端前進1像素之狀態下將驅動信號輸入至頭45，則自噴嘴81噴出液滴。又，若於已自左端前進2像素之狀態下將驅動信號輸入至頭45，則自噴嘴82及噴嘴85噴出液滴。如此般，準備與所應形成之膜圖案3相對應之點陣圖資料，基於根據點陣圖資料之噴出位置資訊噴出液滴，而於基材W上形成膜圖案3。然而，若設定根據點陣圖資料之噴出位置資訊，則各噴嘴8每前進1像素便噴出液滴，故而噴出位置(形成膜圖案3之位置)受點陣圖資料之分辨率限制。即，於如圖12所示般，於欲在鄰接之像素K彼此之間形成膜圖案3之情形時，無法將液滴噴出至像素K彼此之邊界部V(圖中×標記係基於點陣圖資料之各格子之噴附位置)。於此種情形時將液滴噴出至任一像素K，但於該位置相當於膜形成區域5之邊緣部31之情形時，成為使膜圖案3之邊緣部31之描繪精度降低之因素。因此，不使用點陣圖資料作為噴出位置資訊，以於各噴嘴8與基材W之相對位置和針對各噴嘴8設定之噴出位置座標一致之情形時噴出液滴的方式進行控制，藉此能夠提高所噴出之液滴之位置分辨率，而能夠提高描繪精度。即，若對此種塗布裝置進行說明，則省略與上述實施形態之塗布裝置相同之構成，而首先具備檢測各噴嘴8與平台10上之基材W之相對位置的位置檢測部。於本實施形態中，該位置檢測部藉由於使平台10移動之驅動部(線性馬達)設置有編碼器，利用控制裝置對來自該編碼器之輸出脈衝進行計數，而能夠檢測平台10上之基材W與各噴嘴8之相對位置。又，控制裝置設置有記憶各噴嘴8噴出液滴之噴出位置座標之記憶部，與形成於基材W上之膜圖案3相對應地記憶有以對準標記為基準之各噴嘴8之噴出位置座標。該噴出位置座標根據對準標記之位置資訊而被修正，若針對所搬送之每個基材W藉由檢查相機7拍攝對準標記，則根據該對準標記之位置資訊修正噴出位置座標，將修正後之噴出位置座標作為新的噴出位置座標而記憶。又，控制裝置具備使各噴嘴噴出為液滴之驅動信號輸出部。於本實施形態中，微少液滴噴嘴頭41、厚膜噴嘴頭42由藉由針對各噴嘴(微少液滴噴嘴及厚膜噴嘴)之每一個賦予驅動信號而能夠獨立噴出液滴之噴嘴構成，藉由將來自驅動信號輸出部之驅動信號賦予至各噴嘴，能夠僅自被賦予之噴嘴噴出液滴。而且，驅動信號輸出部於由位置檢測部檢測出之位置與噴出位置座標一致時，對各噴嘴輸出驅動信號，而使液滴自各噴嘴噴出。即，例如圖13所示，頭45具有5個噴嘴8，以將該頭45於塗布方向移行之方式構成。而且，於記憶部，作為噴出位置座標，將噴嘴81設定為於噴出位置P1、P2噴出，將噴嘴82設定為於噴出位置P3、P4噴出，以上述方式對噴嘴81～85分別將噴出位置座標設定為P1～P9。而且，若頭45於塗布方向移行，則根據來自編碼器之輸出脈衝檢測基材W與各噴嘴8之相對位置。而且，若相對位置到達至噴出位置座標P1，則對噴嘴81輸出驅動信號，而將液滴噴出至噴出位置座標P1。如此般，若根據來自編碼器之輸出脈衝偵測出之相對位置與噴出位置座標P1～P9一致，則將驅動信號輸出至成為對象之噴嘴81～85，而陸續噴出液滴。藉由基於該噴出位置座標資訊噴出之方法至少應用於基底膜形成步驟中之液滴單元，能夠以高分辨率形成塗布圖案之輪廓，故而能夠提高描繪精度。即，如圖14所示，若基於點陣圖資料進行噴出，則於膜圖案3之端部(邊緣部31)位於點陣圖之格子之間之情形時，當將液滴噴出至所有格子時，膜圖案3便會形成於較邊緣部31之位置已預先確定之邊緣部31之位置更靠外側，故而於邊緣部31之格子交替地設定噴出位置(圖14中×標記)。如此一來，存在即便為微少液滴亦殘留不少波紋現象之情形，但在基於噴出位置座標資訊進行噴出之方法中，可不拘泥於點陣圖資料之格子，而噴出至由編碼器之位置分辨率預先確定之邊緣部31之位置(圖14中○標記)。如此般，可不拘泥於點陣圖資料之格子資訊，而將液滴噴出至與位置檢測部之分辨率相對應之位置，故而能夠提高膜圖案3之描繪性。再者，於上述實施形態中，對位置檢測部、記憶部、及驅動信號輸出部作用於微少液滴噴嘴及厚膜噴嘴之各噴嘴之例進行了說明，但亦可為至少僅對微少液滴噴嘴發揮作用之構成。即，如上所述般，藉由僅對邊緣部31基於微少液滴噴嘴之噴出位置座標資訊進行噴出，能夠高精度地描繪邊緣部31。而且，藉由利用厚膜噴嘴對由邊緣部31形成之內側之區域(由邊緣部31包圍之區域)滴液而形成膜圖案，藉由該厚膜噴嘴形成之區域由於並非特別需要位置分辨率，故而亦可基於先前之點陣圖資料進行塗布。如此般，僅微少液滴噴嘴基於噴出位置座標資訊形成邊緣部31，且於其內側之區域藉由厚膜噴嘴基於點陣圖資料形成膜圖案，藉此，與全部基於噴出位置座標資訊而形成之情形相比，能夠一面高精度地描繪膜圖案整體，一面縮短產距時間。又，亦可不僅於基底膜形成步驟基於噴出位置座標資訊進行噴出，於厚膜形成步驟亦基於噴出位置座標資訊進行噴出。Hereinafter, embodiments of the present invention will be described based on the drawings. 1 is a plan view schematically showing a coating apparatus of the present invention, FIG. 2 is a side view of the coating apparatus of FIG. 1, FIG. 3 is a view showing a substrate and a film pattern, and FIG. 3(a) is a sheet attached to the sheet. Fig. 3(b) is a view showing a state in which a film pattern is formed on a substrate. As shown in FIG. 1 and FIG. 2, the coating apparatus includes a stage 10 on which the substrate W is placed, and a droplet unit 2 that ejects the coating material onto the substrate W, and the stage 10 and the droplet unit 2 are opposed to each other. By moving, the coating material is ejected, and the film pattern 3 can be formed on the substrate W. That is, the stage 10 is formed to be movable in one direction. In the droplet unit 2, the nozzle head 4 for ejecting the coating material is formed to be orthogonal to the moving direction of the stage 10, and the platforms 10 intersect the nozzle head 4 In the region (coating region A), the coating material is discharged to form the film pattern 3 on the substrate W. In the following description, the direction in which the stage 10 is moved is referred to as the X-axis direction, the direction in which the nozzle head 4 moves is the Y-axis direction, and the direction orthogonal to both the X-axis and the Y-axis direction is performed as the Z-axis direction. Description. Here, FIG. 3 is a view showing a case where a power semiconductor wafer (hereinafter simply referred to as a wafer) is used as the substrate W, and FIG. 3(a) is a case where a plurality of wafers (substrate W) are attached to the sheet S. Fig. 3(b) is a view showing a wafer on which a film pattern 3 is formed on a substrate W. The wafer has an electrode portion E and an insulating film portion R covering the electrode portion E, and an insulating film portion R is provided so as to cover the periphery of the substantially rectangular electrode portion E. In the present embodiment, the electrode portion E is formed on the substrate W, and the coating material is applied to the electrode portion E on the substrate W to form the film pattern 3. Finally, the film pattern 3 is formed as an insulating film. Department R. In other words, the film formation region 5 corresponding to the film pattern 3 is set in the substrate W, and as shown in FIG. 3(b), a film formation region 5 in which an annular rectangular shape and a corner portion are formed in an arc shape is formed. . The film formation region 5 is set in a line width of 100 μm to 300 μm, and the variation in line width (permissible range of the corrugated portion) is set in the range of 10 μm to 30 μm. When a plurality of such substrates W are attached to the sheet S and one sheet S is placed on the stage 10, the droplets 30 of the coating material are ejected to the respective film formation regions of the respective substrates W. 5, a film pattern 3 is formed. In the present embodiment, the power semiconductor wafer is described as an example. However, the wiring substrate such as the printed circuit board or the package substrate may be used as the substrate W, and may be formed into a line segment or a rectangular shape. The film pattern of various shapes can be applied to all substrates. The coating apparatus shown in Figs. 1 and 2 has a base 6 having a cross shape as viewed from above, and a stage 10 and a droplet unit 2 are provided on the base 6. Specifically, the droplet unit 2 has a shape extending in one direction (Y-axis direction), and the stage 10 is provided to be movable so as to intersect the substantially central position of the droplet unit 2. Moreover, the coating apparatus is provided with each processing region, and the substrate replacement region B is set near the front side in the X-axis direction, and the coating region A is set at a position where the stage 10 intersects the droplet unit 2. That is, the stage 10 can be moved to the substrate replacement area B and the coating area A. When the substrate W is carried in the substrate replacement area B, the stage 10 is moved to the coating area A, and the coating area A forms a film on the substrate W. After the pattern 3, the substrate replacement region B is moved again to carry out the substrate W. The platform 10 is placed on the substrate W, and the substrate W placed thereon is placed in a state of maintaining a horizontal position. In the present embodiment, the sheet S to which a plurality of substrates W are attached is placed. A plurality of suction holes connected to the vacuum pump are formed on the surface of the platform 10, and the suction pump generates a suction force to activate the substrate W (sheet S) on the platform 10 by actuating the vacuum pump. surface. The platform 10 is movable in one direction. That is, the base 11 is provided with a rail 11 extending in the X-axis direction, and the stage 10 is slidably attached to the rail 11. Further, a linear motor is mounted on the platform 10, and by driving the linear motor, it is possible to move to an arbitrary position and stop at an arbitrary position. Thereby, the stage 10 can be moved to the coating area A and the substrate replacement area B. This coating region A is a region where the droplets 30 are ejected from the droplet unit 2 onto the substrate W to form the film pattern 3. In other words, the stage 10 can be moved little in the X-axis direction with respect to the droplet unit 2, and the movement of the X-axis direction component at the specific position can be accurately performed. Moreover, the substrate replacement area B is a region where the sheet S to which the substrate W is attached is replaced, and the substrate W is carried in and out by a robot or the like. That is, when the substrate W is carried in, the stage 10 is moved to the substrate replacement area B, and the sheet S (substrate W) is supplied to the surface of the stage 10. Then, after moving to the coating region A and forming the film pattern 3 on the substrate W, the film is moved to the substrate replacement region B again, and the coating film substrate W (the substrate W (sheet S) on which the film pattern 3 is formed) is passed through The robot hand moves out. The droplet unit 2 is a method in which the droplets 30 are sprayed onto the substrate W to form the film pattern 3. The droplet unit 2 has a holder portion 21 that extends in one direction (Y-axis direction) and a nozzle head 4 that is provided in the holder portion 21. The bracket portion 21 has a gate shape formed by two leg portions 22 and a beam portion 23, and the two leg portions 22 are provided on the base 6 so as to be spaced apart from each other in the Y-axis direction, and the beam portion 23 connects the legs The portion 22 extends in the Y-axis direction. That is, the bracket portion 21 is formed to cross the shape of the rail 11 that moves the platform 10. Further, the nozzle portion 4 is provided in the beam portion 23. In the present embodiment, the nozzle head 4 has a small number of droplet nozzle heads 41 (first nozzle heads) for ejecting minute droplets 30a, and a liquid with a small amount of liquid. The thick film nozzle head 42 (second nozzle head) which is ejected by the droplet 30b having a large number of 30a is dropped. Here, when it is not necessary to distinguish between the small droplet nozzle head 41 (first nozzle head) and the thick nozzle head 42 (second nozzle head), the nozzle head 4 is simply referred to as a nozzle head 4. The nozzle head 4 can be moved up and down with respect to the base material W by the raising and lowering operation of the beam part 23 with respect to the leg part 22. Thereby, when the coating operation of ejecting the coating material to the substrate W is performed, the distance between the substrate W and the nozzle head 4 can be adjusted so that the distance is appropriate. In the nozzle head 4, a plurality of head modules for ejecting the coating material are disposed. The head module is an ink ejecting device that uses a piezoelectric element as a driving source, and a plurality of nozzles are formed on a nozzle surface that is flat with respect to the stage 10. Further, by driving the piezoelectric element, the coating material can be ejected dropwise from each nozzle. Further, in the present embodiment, when it is not necessary to distinguish between the following minute droplet nozzles and thick film nozzles, they are simply referred to as nozzles. Further, the minute droplet head 41 (first nozzle head) of the nozzle head 4 is for forming the base film pattern 3 by discharging the minute droplets 30a. Here, the base film pattern 3 is a base for forming the film pattern 3, and is a film pattern 3 originally formed in the film formation region 5. In the present embodiment, the base film pattern 3 which is a thin film is formed on the entire surface of the film formation region 5, and thereafter, the thick film pattern 3 described below is formed, whereby the integrated film pattern 3 is formed. The minute droplet nozzle head 41 has a minute droplet nozzle, and the film pattern 3 (base film pattern 3) which is complicated and thinned can be drawn by the minute droplet 30a. The minute droplet 30 has the droplet 30 which is about the resolution of the film pattern 3, and can suppress the end of the film formation region 5 depending on the relationship between the liquid amount and the dry state when the coating film is formed by spraying. The droplets 30 of the degree of deviation of the line width in the edge portion 31 of the film pattern 3 by the corrugation phenomenon (the edge portion 31 of the film pattern 3). The previous droplet 30 (10 to 20 pl) is a corrugated phenomenon at the end portion (edge portion 31) of the film formation region 5 when the film pattern 3 which is complicated and thinned is drawn, and the degree of the corrugation does not follow the film formation region. The boundary portion of 5 does not satisfy the requirement for high precision of drawing, but the requirement of the edge portion 31 can be satisfied by being able to eject a small amount of minute droplets 30a having a smaller particle diameter than the previous droplet 30. Further, the minute droplet nozzle head 41 can move in the Y-axis direction along the beam portion 23 (head moving mechanism). Specifically, the beam portion 23 is provided with a rail extending in the Y-axis direction, and the minute droplet nozzle head 41 is slidably attached to the rail. Moreover, by driving the linear motor, it is possible to move to an arbitrary position and stop at an arbitrary position. Thereby, the minute droplet nozzle head 41 can be moved to the coating area A and the standby area P to be applied to the substrate W. Further, the minute droplet nozzle head 41 can be moved little in the Y-axis direction, and the droplets 30 as a coating material can be accurately attached to the Y-axis direction in the coating region A on the substrate W on the stage 10. Specific location. That is, by moving the droplet head 41 in the Y-axis direction and the stage 10 moving in the X-axis direction, the droplet head 41 moves relatively to the stage 10, so that the droplets 30a can be accurately attached. The specific position of the film formation region 5 in the XY plane set on the substrate W. Further, the minute droplet nozzle head 41 is flashed in the standby region P, whereby clogging of the pores of the minute nozzle can be prevented. In the present embodiment, after the base film pattern 32 is formed in the application region A, it moves to the standby region P. Further, flashing is performed in the standby area P until the next new sheet S is supplied to the coating area A to start the base film pattern step, so that clogging of the pores of the minute nozzle can be prevented. Further, the thick film nozzle head 42 (second nozzle head) is formed by forming a thick film pattern 33 on the base film pattern 32 by discharging the liquid droplets 30b having a large amount of liquid droplets 30a. The thick film pattern 33 is an additional pattern (thick film pattern 33) necessary for forming the film pattern 3 in order to replenish the base film pattern 32 formed in the film formation region 5 with a coating material. The thick film pattern 33 is formed by applying the droplets 30b to the base film pattern 32, and the base film pattern 32 and the thick film pattern 33 are integrated to form the film pattern 3 corresponding to the film formation region 5. That is, the droplets 30b are ejected after the base film pattern 32 is formed and before the base film pattern 32 is completely dried, and the ejected droplets 30b are fused with the base film pattern 32 to form the film pattern 3. Although the droplet 30b of the thick film nozzle head 42 cannot satisfy the resolution of the film formation region 5, if the droplet 30b is ejected from the thick film nozzle head 42 to the base film pattern 32 formed in the film formation region 5, the droplet The 30b is affected by the surface tension, whereby the droplet 30b to be sprayed is pulled by the base film pattern 32 to stay in the film formation region 5. In other words, the liquid droplets 30b ejected from the thick film nozzle head 42 form the thick film pattern 33 without leaking (overflowing) from the film formation region 5, and further fused with the base film pattern 32, whereby the film pattern 3 can be formed. Thereby, the amount of liquid supplied to the film formation region 5 can be increased, so that the formation of the film pattern 3 can be performed in a shorter time than in the case where the film pattern 3 is formed only by the minute droplet nozzle. The thick film nozzle head 42 has a thick film nozzle capable of ejecting droplets 30b of a larger particle size than the droplet head 41, and is capable of ejecting the same level as the previous droplet 30 (10 to 20 pl). Droplet 30b. Further, the thick film nozzle head 42 is movable in the Y-axis direction along the beam portion 23 (head moving mechanism). Specifically, a rail extending in the Y-axis direction is provided on the beam portion 23 separately from the minute droplet nozzle head 41, and the thick film nozzle head 42 is slidably attached to the rail. Moreover, by driving the linear motor, it is possible to move to an arbitrary position and stop at an arbitrary position. Thereby, the thick film nozzle head 42 can be moved to the coating area A and the standby area P to be applied to the substrate W. Further, the thick film nozzle head 42 can be moved little in the Y-axis direction, and the droplets 30b as a coating material can be accurately attached to the Y-axis direction with respect to the substrate W on the stage 10 in the coating region A. position. That is, when the thick film nozzle head 42 moves in the Y-axis direction and the stage 10 moves in the X-axis direction, the thick film nozzle head 42 moves relative to the stage 10, so that the droplets 30b can be accurately attached to the set The film formation region 5 in the XY plane on the substrate W is at a specific position. Further, the thick film nozzle head 42 is flashed in the standby area P, thereby preventing clogging of the holes of the thick film nozzle. In the present embodiment, after the thick film pattern 33 is formed in the application region A, the film can be moved to the standby region P. Further, flashing is performed in the standby area P until the next new sheet S is supplied to the coating area A to start the thick film forming step after the base film forming step, whereby the clogging of the thick film nozzle can be prevented. Further, in the beam portion 23, an inspection unit is provided on the opposite side of the nozzle head 4. That is, an inspection region C is provided between the application region A and the substrate replacement region B, and in the inspection region C, the positioning of the substrate W and the inspection of the formed film pattern 3 are performed. Specifically, the inspection unit 7 (CCD camera) is provided in the beam portion 23, and the inspection camera 7 that stands by outside the inspection region C can move along the extending direction of the beam portion 23 while photographing the surface of the substrate W (sheet) The surface of S). Further, by photographing the alignment marks provided on the substrate W, the formation position (film formation region 5) of the film pattern 3 with respect to each of the substrate W is grasped, and based on the position at which the film pattern 3 is grasped from the nozzle head 4 The droplets 30 are ejected, whereby the film pattern 3 is formed. Further, after the film pattern 3 is formed on the substrate W, each film pattern 3 is imaged by the inspection camera 7, thereby checking whether or not each film pattern 3 is good. In other words, after the inspection camera 7 moves along the beam portion 23 (moving in the Y-axis direction), the film pattern 3 is photographed, and the stage 10 is moved in the X-axis direction, and the inspection camera 7 is again moved in the Y-axis direction. While performing the above-described operation, the above-described operations are repeated to capture all the film patterns 3 of the substrate W formed on the sheet S. Then, the captured image data is transmitted to the control device described below, and it is determined by the control device whether or not the film pattern 3 is good. The control device (not shown) is a type of operator required to drive and control the drive means of each unit and perform the coating operation in order to execute a series of coating operations in accordance with a program stored in advance. In the present embodiment, the position (reference position) of the film pattern 3 based on the alignment mark is stored for each of the substrates W, and the alignment mark is based on the substrate W (sheet S) placed on the stage 10. The offset amount is corrected for the film pattern 3 formation position (reference position) of each substrate W. That is, the position of the film pattern 3 is corrected based on the positional information of the alignment mark photographed by the inspection camera 7, and the discharge position (the spray position) of the nozzle head 4 in the film formation region 5 is corrected. Thereby, even when the arrangement of the sheet S to which the substrate W is attached is slightly shifted, the film pattern 3 can be formed with high precision on the substrate W on the sheet S. Further, an allowable value relating to the deviation between the line width and the line width of the film pattern 3 to be formed is also set. When the film pattern 3 is formed on the substrate W, the line is calculated based on the image data taken by the inspection camera 7. The width and the deviation of the line width, and determine whether the value is within the allowable value. When the film pattern 3 is out of the allowable value, it is discharged as a defective product in the substrate replacement area B. Next, the operation in the coating apparatus will be described with reference to the flowchart shown in FIG. First, in step S1, the substrate W is carried in. Specifically, the stage 10 stands by in the substrate replacement area B, and the sheet S to which a plurality of substrates W are attached is carried by a robot and placed on the stage 10. Then, in step S2, an alignment process is performed. In this alignment process, the position correction of the film formation region 5 corresponding to the substrate W placed on the stage 10 is performed. Specifically, after the stage 10 is moved from the substrate replacement area B to the inspection area C, the alignment mark is photographed by the inspection camera 7, thereby specifying the alignment mark position. Then, the film pattern 3 forming position (reference position) of each substrate W is corrected based on the offset amount of the alignment mark specified, and the ejection position (spraying position) of the nozzle head 4 in the film forming region 5 is determined. Then, in step S3, a base film forming step is performed. That is, the base film pattern 32 is formed for each of the substrates W. Specifically, the stage 10 of the inspection area C moves to the coating area A, and the minute droplet nozzle head 41 moves from the standby area P to the coating area A. Then, based on the discharge position information calculated in the above-described step S2, the minute droplets 30a are ejected to the film formation region 5 of each of the substrates W. That is, as shown in FIG. 5, the minute droplets 30a are ejected to the inside of the boundary of the film formation region 5, and a uniform base film pattern 32 is formed entirely in the film formation region 5. Specifically, as shown in FIG. 6, when the minute droplets 30a are ejected to the film formation region 5, the minute droplets 30a ejected to the film formation region 5 are sprayed to the small droplets 30a because the particle diameter is small and the amount of liquid is small. The inside of the film formation region 5 stays there, and the wetting diffusion is suppressed by starting drying at the same time as the spraying (Fig. 6(a)). Further, a uniform base film pattern 32 is formed in the film formation region 5 by merging the adjacent minute droplets 30a with each other (Fig. 6(b)). In other words, the film formation region 5 which is complicated and thinned can be accurately drawn, and the degree of waviness in the edge portion 31 can be suppressed. Then, a thick film forming step is performed in step S4. This thick film forming step is a step of additionally forming a pattern (thick film pattern 33) on the base film pattern 32, and starts and ends before the base film pattern 32 is completely dried. Specifically, after the base film pattern 32 is formed, the thick film nozzle head 42 moves from the standby region P to the coating region A, and the liquid droplets 30b are ejected to the respective substrates W based on the ejection position information calculated in the above step S2. The film formation region 5 is formed. That is, as shown in Fig. 5 and Fig. 6(c), the droplets 30b ejected from the droplets 30b ejected onto the base film pattern 32 are pulled by the base film pattern 32 by the surface tension and stay in the film formation region. 5 inside. Further, the adjacent droplets 30b overlap each other, and at the same time, they are fused with the under-dried base film pattern 32, whereby the film pattern 3 integrated with the base film pattern 32 is formed (Fig. 6(d)). Then, in step S5, an inspection step is performed. That is, it is judged whether or not the formed film pattern 3 is good. Specifically, the platform 10 moves to the inspection area C, and the inspection camera 7 moves to the inspection area C. Then, all the film patterns 3 on the substrate W are imaged by the inspection camera 7, and based on the obtained image data, the determination as to whether or not the formed film pattern 3 is good is performed. Then, in step S6, the discharge of the substrate W is performed. That is, the stage 10 is moved from the inspection area C to the substrate replacement area B, and the substrate W (sheet S) on the stage 10 is placed on the robot hand, whereby the substrate W is discharged. The discharged substrate W completely dried the film pattern 3 by a drying device of a subsequent step. As described above, according to the coating apparatus and the film pattern 3 drawing method of the present embodiment, the base film pattern 32 is formed by the base film forming step using the minute droplets 30a, and thereafter, the above-mentioned minute droplets are formed by the thick film forming step. The 30a larger particle droplets 30b are applied onto the base film pattern 32, whereby the film pattern 3 is formed, so that the film formation region 5 can be accurately drawn, and the increase in coating time due to high-precision coating can be suppressed. Shorten the time required for pattern formation. Further, in the above-described embodiment, an example in which the base film pattern 32 is uniformly formed in the entire film formation region 5 in the base film forming step has been described. However, as shown in FIGS. 7 and 8, The base film pattern 32 at the boundary portion of the film formation region 5 is followed by a thick film formation step. Specifically, in the basement film forming step, the minute droplets 30a are ejected along the boundary portion of the film formation region 5, that is, the outer frame (Fig. 8(a)). The small droplets 30a to be sprayed are superposed on each other while being wetted and diffused linearly along the outer frame. Further, finally, a linear base film pattern 32 along the boundary portion is formed at the boundary portion of the film formation region 5 (Fig. 8(b)). In other words, when the minute droplets 30a are ejected to the film formation region 5, the minute droplets 30a ejected to the film formation region 5 are sprayed into the film formation region 5 and remain in the film formation region 5 because the particle diameter is small and the amount of liquid is small. Thus, by suppressing the wetting and diffusion by starting drying at the same time as the spraying, the film formation region 5 can be accurately drawn. Thereby, the degree of waviness in the edge portion 31 of the formed base film pattern 32 can be suppressed. Then, in the film thickness forming step, the liquid droplets 30b are ejected to the film formation region 5 to form a thick film pattern 33. Specifically, the thick film pattern 33 is formed by ejecting the liquid droplets 30b onto the base film pattern 32 and the substrate W (electrode). That is, when the liquid droplets 30b are ejected, the droplets 30b to be sprayed overlap each other to be wetted and diffused, but the linear base film pattern 32 formed before can function as a bank to suppress the droplets to be sprayed. 30b is wetted and diffused beyond the base film pattern 32 (Fig. 8(c)). Further, since the base film pattern 32 is suppressed by the degree of corrugation in the edge portion 31, the droplets 30b ejected thereafter are intended to stay in the frame formed by the base film pattern 32 due to the influence of the surface tension. As a result, the degree of waviness in the edge portion 31 of the film pattern 3 formed by merging and integrating the sprayed droplets 30b and the base film pattern 32 is suppressed, so that the accuracy of the minute droplets 30a is not impaired to form an accuracy. A preferred film pattern 3 (Fig. 8(d)). Further, in the above-described embodiment, the nozzle head 4 has a small droplet nozzle head 41 (first nozzle head 4) which forms the base film pattern 32 and a thick film nozzle head which forms the thick film pattern 33 by discharging the minute droplets 30a. Although the example in which 42 (the second nozzle head 4) is independently provided has been described, a nozzle having a small droplet 30a and a thick film nozzle may be provided in one nozzle head 4. In this case, after the base film pattern 32 is formed, the thick film pattern 33 can be formed without performing the replacement operation of the nozzle head 4, so that even when the quick-drying property of the coating material is high and the base film pattern 32 is rapidly dried, It is also possible to eject quickly, which is preferable in this regard. Further, the discharge position information described in the above embodiment is usually set based on the dot map data. In other words, as shown in FIG. 11, the head 45 (corresponding to the head 4 of the nozzle 8 of the above embodiment) is provided with five nozzles 8 (nozzles 81 to 85), and the head 45 moves in the coating direction. The liquid droplets are ejected from the nozzle 8 to form the film pattern 3. The ejection position information is set by dividing the substrate W into a plurality of lattice-shaped pixel data (dot map data), and is set as in the example of FIG. Further, a drive signal is output for every 1 pixel advance in the coating direction, and a droplet is ejected from the target nozzle 8. For example, in the example of FIG. 11, if a drive signal is input to the head 45 in a state where one pixel has been advanced from the left end, droplets are ejected from the nozzle 81. Further, when a drive signal is input to the head 45 in a state where two pixels have been advanced from the left end, droplets are ejected from the nozzle 82 and the nozzle 85. In this manner, the dot pattern data corresponding to the film pattern 3 to be formed is prepared, and the film pattern 3 is formed on the substrate W based on the ejection of the liquid droplets based on the ejection position information of the dot pattern data. However, if the ejection position information based on the dot pattern data is set, the droplets are ejected every time the nozzle 8 advances by one pixel, and therefore the ejection position (the position at which the film pattern 3 is formed) is limited by the resolution of the dot pattern data. That is, as shown in FIG. 12, when the film pattern 3 is to be formed between the adjacent pixels K, the liquid droplets cannot be ejected to the boundary portion V of the pixels K (the X mark in the figure is based on the dot matrix). The spray position of each grid of the figure data). In this case, the liquid droplets are ejected to any of the pixels K. However, when the position corresponds to the edge portion 31 of the film formation region 5, the drawing accuracy of the edge portion 31 of the film pattern 3 is lowered. Therefore, the dot pattern data is not used as the ejection position information, so that the droplets can be ejected when the relative positions of the nozzles 8 and the substrate W and the ejection position coordinates set for the respective nozzles 8 match. The positional resolution of the ejected droplets is increased, and the drawing accuracy can be improved. In other words, when the coating apparatus is described, the same configuration as that of the coating apparatus of the above-described embodiment is omitted, and first, a position detecting unit that detects the relative positions of the nozzles 8 and the substrate W on the stage 10 is provided. In the present embodiment, the position detecting unit is provided with an encoder (linear motor) for moving the stage 10, and the output pulse from the encoder is counted by the control device, so that the base on the stage 10 can be detected. The relative position of the material W and each nozzle 8. Further, the control device is provided with a memory portion for storing the coordinates of the discharge position at which the respective nozzles 8 discharge the liquid droplets, and the discharge positions of the respective nozzles 8 based on the alignment marks are stored in correspondence with the film pattern 3 formed on the substrate W. coordinate. The ejection position coordinates are corrected based on the position information of the alignment mark, and if the alignment mark is photographed by the inspection camera 7 for each of the substrates W to be conveyed, the ejection position coordinates are corrected based on the position information of the alignment mark, The corrected ejection position coordinates are memorized as new ejection position coordinates. Further, the control device includes a drive signal output unit that discharges the respective nozzles into droplets. In the present embodiment, the minute droplet nozzle head 41 and the thick film nozzle head 42 are constituted by nozzles that can independently eject droplets by applying a drive signal to each of the nozzles (small droplet nozzles and thick film nozzles). By applying a drive signal from the drive signal output unit to each of the nozzles, it is possible to eject the liquid droplets only from the nozzle to be supplied. Further, when the position detected by the position detecting unit coincides with the position of the discharge position, the drive signal output unit outputs a drive signal to each of the nozzles to eject the liquid droplets from the respective nozzles. That is, for example, as shown in Fig. 13, the head 45 has five nozzles 8 and is configured to move the head 45 in the coating direction. Further, in the memory unit, the nozzles 81 are set to be ejected at the ejection positions P1 and P2 as the ejection position coordinates, and the nozzles 82 are set to be ejected at the ejection positions P3 and P4, and the ejection position coordinates are respectively set to the nozzles 81 to 85 as described above. Set to P1 to P9. Further, when the head 45 is moved in the coating direction, the relative position of the substrate W and each of the nozzles 8 is detected based on the output pulse from the encoder. Further, when the relative position reaches the discharge position coordinate P1, a drive signal is output to the nozzle 81, and the liquid droplet is ejected to the discharge position coordinate P1. As described above, when the relative position detected by the output pulse from the encoder coincides with the discharge position coordinates P1 to P9, the drive signal is output to the target nozzles 81 to 85, and the droplets are successively ejected. The method of ejecting based on the ejection position coordinate information is applied to at least the droplet unit in the base film forming step, whereby the contour of the coating pattern can be formed with high resolution, so that the drawing accuracy can be improved. That is, as shown in FIG. 14, when the ejection is performed based on the dot pattern data, when the end portion (edge portion 31) of the film pattern 3 is located between the lattices of the dot pattern, the liquid droplets are ejected to all the lattices. At this time, the film pattern 3 is formed on the outer side of the position of the edge portion 31 which is predetermined at the position of the edge portion 31. Therefore, the discharge position (the mark in Fig. 14) is alternately set in the lattice of the edge portion 31. In this way, there is a case where a lot of ripples remain even for a small number of droplets, but in the method of ejecting based on the coordinate information of the ejection position, it is possible to eject to the position of the encoder without sticking to the lattice of the bitmap data. The position of the edge portion 31 whose resolution is predetermined (marked by ○ in Fig. 14). In this manner, the droplets can be ejected to a position corresponding to the resolution of the position detecting unit without being limited to the lattice information of the dot pattern data, so that the delineability of the film pattern 3 can be improved. Further, in the above-described embodiment, the position detecting unit, the memory unit, and the driving signal output unit are applied to each of the nozzles of the minute droplet nozzle and the thick film nozzle, but at least only the minute liquid may be used. The drip nozzle functions as a function. In other words, as described above, the edge portion 31 can be drawn with high precision by merely ejecting the edge portion 31 based on the ejection position coordinate information of the minute droplet nozzle. Further, a film pattern is formed by dropping a region of the inner side formed by the edge portion 31 (a region surrounded by the edge portion 31) by a thick film nozzle, and the region formed by the thick film nozzle is not particularly required for positional resolution. Therefore, it is also possible to apply the coating based on the previous dot pattern data. In this way, only the minute droplet nozzle forms the edge portion 31 based on the position information of the ejection position, and the film pattern is formed based on the dot pattern data by the thick film nozzle in the inner side region, thereby forming all the information based on the coordinate information of the ejection position. In comparison with the case, the entire film pattern can be drawn with high precision, and the production time can be shortened. Further, not only the base film forming step may be performed based on the discharge position coordinate information, but also the thick film forming step may be performed based on the discharge position coordinate information.

2‧‧‧液滴單元
3‧‧‧膜圖案
4‧‧‧噴嘴頭
5‧‧‧膜形成區域
6‧‧‧基台
7‧‧‧檢查相機
8‧‧‧噴嘴
10‧‧‧平台
11‧‧‧軌道
21‧‧‧支架部
22‧‧‧腳部
23‧‧‧樑部
30‧‧‧液滴
30a‧‧‧微少液滴
30b‧‧‧液滴
31‧‧‧邊緣部
32‧‧‧基底膜圖案
33‧‧‧厚膜圖案
41‧‧‧微少液滴噴嘴頭(第1噴嘴頭)
42‧‧‧厚膜噴嘴頭(第2噴嘴頭)
45‧‧‧頭
81～85‧‧‧噴嘴
100‧‧‧電極
100a‧‧‧電極之外周
101‧‧‧膜圖案
101a‧‧‧邊緣部
102‧‧‧基材
103‧‧‧膜形成區域
104‧‧‧液滴
A‧‧‧塗布區域
B‧‧‧基材更換區域
C‧‧‧檢查區域
E‧‧‧電極部
K‧‧‧像素
P‧‧‧待機區域
P1～P9‧‧‧噴出位置座標
R‧‧‧絕緣膜部
S‧‧‧片材
V‧‧‧邊界部
W‧‧‧基材2‧‧‧Drop unit
3‧‧‧ film pattern
4‧‧‧Nozzle head
5‧‧‧ Film formation area
6‧‧‧Abutment
7‧‧‧Check the camera
8‧‧‧ nozzle
10‧‧‧ platform
11‧‧‧ Track
21‧‧‧ bracket
22‧‧‧foot
23‧‧ ‧ Beam Department
30‧‧‧ droplets
30a‧‧‧ Minor droplets
30b‧‧‧ droplets
31‧‧‧Edge
32‧‧‧Base film pattern
33‧‧‧ thick film pattern
41‧‧‧Small droplet nozzle head (first nozzle head)
42‧‧‧Thick Film Nozzle Head (2nd Nozzle Head)
45‧‧‧ head
81-85‧‧‧ nozzle
100‧‧‧electrode
100a‧‧‧External electrode
101‧‧‧ film pattern
101a‧‧‧Edge
102‧‧‧Substrate
103‧‧‧ Film formation area
104‧‧‧ droplets
A‧‧‧ Coating area
B‧‧‧Substrate replacement area
C‧‧‧ inspection area
E‧‧‧Electrode
K‧‧ pixels
P‧‧‧Standby area
P1～P9‧‧‧Spray position coordinates
R‧‧‧Insulation film
S‧‧‧Sheet
V‧‧‧Border Department
W‧‧‧Substrate

圖1係概略性地表示本發明之塗布裝置之俯視圖。圖2係上述塗布裝置之側視圖。圖3係表示基材與膜圖案之圖，(a)係表示於片材貼附有基材之狀態之圖，(b)係表示於基材上形成有膜圖案之狀態之圖。圖4係表示本發明之膜圖案描繪方法之流程圖。圖5係表示液滴於膜形成區域之噴附狀態之概念圖。圖6係表示形成膜圖案之狀態之圖，(a)係表示使微少液滴噴附之狀態之圖，(b)係表示微少液滴彼此重疊而形成基底膜圖案之狀態之圖，(c)係表示使液量較微少液滴多之液滴噴附之狀態的圖，(d)係表示所有液滴重疊而形成膜圖案之狀態之圖。圖7係表示另一實施形態中之液滴於膜形成區域之噴附狀態的概念圖。圖8係表示另一實施形態中之形成膜圖案之狀態的圖，(a)係表示使微少液滴噴附之狀態之圖，(b)係表示微少液滴彼此重疊而形成基底膜圖案之狀態之圖，(c)係表示使液量較微少液滴多之液滴噴附之狀態的圖，(d)係表示所有液滴重疊而形成膜圖案之狀態之圖。圖9係表示形成有膜圖案之基材之圖。圖10係表示於先前之方法中於膜形成區域形成膜圖案之狀態的圖，(a)係表示於膜形成區域噴附有液滴之狀態之概念圖，(b)係表示於膜形成區域形成有膜圖案之狀態之圖。圖11係用以說明基於點陣圖資訊噴出之狀態之圖。圖12係用以說明於格子之間形成膜之狀態的圖。圖13係用以說明基於噴出位置座標資訊噴出之狀態之圖。圖14係表示基於點陣圖資訊或噴出位置座標資訊使液滴噴附於膜形成區域之狀態之圖。Fig. 1 is a plan view schematically showing a coating apparatus of the present invention. Figure 2 is a side view of the above coating apparatus. 3 is a view showing a substrate and a film pattern, wherein (a) is a view showing a state in which a substrate is attached to a sheet, and (b) is a view showing a state in which a film pattern is formed on a substrate. Fig. 4 is a flow chart showing a method of drawing a film pattern of the present invention. Fig. 5 is a conceptual view showing a state in which droplets are sprayed in a film formation region. 6 is a view showing a state in which a film pattern is formed, (a) is a view showing a state in which a minute droplet is sprayed, and (b) is a view showing a state in which a minute droplet is superposed on each other to form a base film pattern, (c) It is a figure which shows the state which the droplets of the liquid volume are the droplets of the droplets, and (d) is a figure which shows the state which the all the droplets overlap and the film pattern is formed. Fig. 7 is a conceptual view showing a state in which droplets are sprayed in a film formation region in another embodiment. Fig. 8 is a view showing a state in which a film pattern is formed in another embodiment, wherein (a) is a view showing a state in which a minute droplet is sprayed, and (b) is a diagram in which a minute droplet is superposed on each other to form a base film pattern. (c) is a view showing a state in which droplets having a small amount of liquid droplets are sprayed, and (d) is a view showing a state in which all the droplets are superposed to form a film pattern. Fig. 9 is a view showing a substrate on which a film pattern is formed. Fig. 10 is a view showing a state in which a film pattern is formed in a film formation region in the prior method, wherein (a) is a conceptual view showing a state in which a droplet is sprayed on a film formation region, and (b) is a film formation region. A diagram of a state in which a film pattern is formed. Fig. 11 is a view for explaining the state of ejection based on the dot map information. Fig. 12 is a view for explaining a state in which a film is formed between the lattices. Fig. 13 is a view for explaining a state in which the coordinate information is ejected based on the ejection position. Fig. 14 is a view showing a state in which droplets are sprayed on a film formation region based on dot pattern information or ejection position coordinate information.

3‧‧‧膜圖案 3‧‧‧ film pattern

30a‧‧‧微少液滴 30a‧‧‧ Minor droplets

30b‧‧‧液滴 30b‧‧‧ droplets

31‧‧‧邊緣部 31‧‧‧Edge

32‧‧‧基底膜圖案 32‧‧‧Base film pattern

33‧‧‧厚膜圖案 33‧‧‧ thick film pattern

Claims (8)

一種膜圖案描繪方法，其特徵在於：其係於基材上之膜形成區域藉由噴墨法施加液滴而形成膜圖案者，其包括： 基底膜形成步驟，其係藉由噴出能夠對基材上之膜形成區域進行描繪之微少液滴，而形成基底膜圖案；及 厚膜形成步驟，其係藉由將液量較形成上述基底膜圖案之液滴多之液滴噴出至上述基底膜圖案上，而形成膜圖案。A film pattern drawing method, characterized in that a film formation region on a substrate is formed by applying a droplet by an inkjet method to form a film pattern, comprising: a base film formation step, which is capable of being a film forming region on the material to form a minute droplet to form a base film pattern; and a thick film forming step by ejecting a droplet having a larger amount of liquid than the droplet forming the base film pattern to the base film On the pattern, a film pattern is formed. 如請求項1之膜圖案描繪方法，其中上述厚膜形成步驟係於上述基底膜形成步驟結束後且於上述基底膜圖案完全乾燥前開始，並且於上述基底膜圖案完全乾燥前完成。The film pattern drawing method of claim 1, wherein the thick film forming step is performed after the end of the base film forming step and before the base film pattern is completely dried, and is completed before the base film pattern is completely dried. 如請求項1或2之膜圖案描繪方法，其中至少於上述基底膜形成步驟中，於噴出液滴而於基材形成膜圖案之液滴單元與上述基材之相對位置和對上述液滴單元之各噴嘴設定之噴出位置座標一致的情形時，自上述液滴單元噴出液滴。The film pattern drawing method of claim 1 or 2, wherein at least in the base film forming step, the relative position of the droplet unit forming the film pattern on the substrate and the substrate and the droplet unit are formed by ejecting the droplet When the ejection position coordinates set by the respective nozzles match, droplets are ejected from the droplet unit. 一種塗布膜基材，其特徵在於：其係藉由如上述請求項1至3中任一項之膜圖案描繪方法而形成。A coated film substrate, which is formed by the film pattern drawing method according to any one of the above claims 1 to 3. 一種塗布裝置，其特徵在於具備：平台，其載置基材；及 液滴單元，其一面相對於載置於上述平台之基材相對地移動，一面噴出液滴而於基材形成膜圖案；並且 上述液滴單元具有：微少液滴噴嘴，其噴出能夠對基材上之膜形成區域進行描繪之微少液滴；及 厚膜噴嘴，其噴出液量較上述微少液滴多之液滴。A coating apparatus comprising: a platform on which a substrate is placed; and a droplet unit that relatively moves on a substrate placed on the platform, and ejects droplets to form a film pattern on the substrate; Further, the droplet unit has a minute droplet nozzle that ejects minute droplets capable of drawing a film formation region on the substrate, and a thick film nozzle that has a larger amount of liquid droplets than the droplets. 如請求項5之塗布裝置，其中上述液滴單元具備：第1噴嘴頭，其具有上述微少液滴噴嘴； 第2噴嘴頭，其具有上述厚膜噴嘴；及 頭移動機構，其使上述第1噴嘴頭及第2噴嘴頭於上述平台上移動。The coating apparatus according to claim 5, wherein the droplet unit includes: a first nozzle head having the minute droplet nozzle; a second nozzle head having the thick film nozzle; and a head moving mechanism that makes the first nozzle The nozzle head and the second nozzle head move on the platform. 如請求項5或6之塗布裝置，其具備：位置檢測部，其檢測上述微少液滴噴嘴及上述厚膜噴嘴與上述平台上之基材之相對位置；及記憶部，其針對上述微少液滴噴嘴及上述厚膜噴嘴之各噴嘴之每一個記憶上述各噴嘴噴出液滴之噴出位置座標；並且 該塗布裝置具有驅動信號輸出部，該驅動信號輸出部於由上述位置檢測部檢測出之位置與上述噴出位置座標一致時，輸出使液滴自上述各噴嘴噴出之驅動信號。A coating apparatus according to claim 5 or 6, further comprising: a position detecting unit that detects a relative position of the minute droplet nozzle and the thick film nozzle and a substrate on the stage; and a memory portion for the minute droplet Each of the nozzles and the nozzles of the thick film nozzles memorize the ejection position coordinates of the droplets ejected by the respective nozzles; and the coating device has a driving signal output portion that is detected by the position detecting portion and When the discharge position coordinates match, a drive signal for discharging the liquid droplets from the respective nozzles is output. 如請求項5或6之塗布裝置，其具備：檢測部，其至少檢測上述微少液滴噴嘴與上述平台上之基板之相對位置；及記憶部，其針對上述微少液滴噴嘴之各噴嘴之每一個記憶上述各噴嘴噴出液滴之噴出位置座標；並且 該塗布裝置具有驅動信號輸出部，該驅動信號輸出部於由上述位置檢測部檢測出之位置與上述噴出位置座標一致時，輸出使液滴自上述各噴嘴噴出之驅動信號。The coating apparatus according to claim 5 or 6, further comprising: a detecting unit that detects at least a relative position of the minute droplet nozzle and the substrate on the stage; and a memory unit that is directed to each of the nozzles of the minute droplet nozzle And a coating signal outputting unit that has a driving signal output unit that outputs a droplet when the position detected by the position detecting unit coincides with the ejection position coordinate A drive signal ejected from each of the above nozzles.