TW201711971A - Scribing wheel having excellent intrusion properties toward highly hard and brittle material substrates - Google Patents

Scribing wheel having excellent intrusion properties toward highly hard and brittle material substrates Download PDF

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TW201711971A
TW201711971A TW105122678A TW105122678A TW201711971A TW 201711971 A TW201711971 A TW 201711971A TW 105122678 A TW105122678 A TW 105122678A TW 105122678 A TW105122678 A TW 105122678A TW 201711971 A TW201711971 A TW 201711971A
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wheel
scribing
less
ridge line
scribing wheel
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TW105122678A
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Chinese (zh)
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TWI603930B (en
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林弘義
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三星鑽石工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/32—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist
    • B28D1/327—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist for cutting or shearing easily splittable working materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention provides a scribing wheel having excellent "intrusion" properties towards highly hard and brittle material substrates and capable of instantly forming a vertical crack in a location where scribing begins. An inclined plane having a V-shaped cross section is formed by a single crystal diamond or a multi-crystal diamond on the outer circumference of the scribing wheel, and the arithmetic mean roughness Ra of the inclined plane is set to be 0.01 [mu]m or less. A groove 15 having a gap P, which is more than 0.5 [mu]m and less than 12 [mu]m, is formed at inclined plane 14a and 14b and spaced from ridge line 13 at a predetermined distance. It is in this fashion the scribing wheel, which uses diamond as raw material, can improve the "intrusion" properties.

Description

刻劃輪 Scoring wheel

本發明係關於一種適合於刻劃高硬度脆性材料基板的刻劃輪。 The present invention relates to a scoring wheel suitable for scoring a substrate of high hardness brittle material.

以往，於液晶顯示器面板或太陽電池等之製程中，設有脆性材料基板之分斷步驟。在分斷步驟中，一邊對由超硬合金或多結晶燒結鑽石(PCD)等構成之刻劃輪施加視脆性材料基板之材質或厚度等諸多條件而定之負載，一邊使刻劃輪於脆性材料基板之表面上滾動以形成刻劃線，並形成從刻劃線往脆性材料基板之厚度方向延伸之垂直裂紋。然後，藉由沿脆性材料基板之刻劃線施加既定的力而分斷脆性材料基板，以製造出各個面板或玻璃板。 Conventionally, in a process such as a liquid crystal display panel or a solar cell, a breaking step of a brittle material substrate is provided. In the breaking step, the scribe wheel composed of a cemented carbide or a polycrystalline sintered diamond (PCD) or the like is applied with a load depending on the material or thickness of the brittle material substrate, and the scribed wheel is made of a brittle material. The surface of the substrate is rolled to form a score line, and a vertical crack extending from the score line to the thickness direction of the brittle material substrate is formed. Then, the brittle material substrate is separated by applying a predetermined force along the scribe line of the brittle material substrate to manufacture individual panels or glass sheets.

在玻璃素材製造廠中，進行基板之材料的改良、熱處理加工的各種改良所帶來的結果為出現了以下現象：在使用具備有習知的刃前端(一般刃前端)的刻劃輪(以下，亦稱為一般輪)進行刻劃的情形時，呈現「侵入不佳」的狀態，亦即在刻劃輪之滾動下，刃前端於基板表面打滑而無法形成刻劃線。 In the glass material manufacturing plant, various improvements in the material improvement of the substrate and heat treatment have resulted in the following phenomenon: the use of a scribing wheel having a conventional blade tip (general blade tip) (below) In the case of scoring, it is a state of "poor intrusion", that is, under the rolling of the scoring wheel, the tip end of the blade slips on the surface of the substrate and cannot form a score line.

在專利文獻1中揭示具有高浸透效果的刻劃輪。該刻劃輪，具有沿剖面V字形之圓周稜線於圓周方向交互形成之多個缺口與突起。當使用該刻劃輪時，能夠形成從玻璃基板表面往垂直方向相對於玻璃基板之 板厚相對較深之垂直裂紋。 A scribing wheel having a high penetration effect is disclosed in Patent Document 1. The scribing wheel has a plurality of notches and protrusions formed alternately in the circumferential direction along a circumferential ridgeline of a V-shaped cross section. When the scribing wheel is used, it can be formed from the surface of the glass substrate to the vertical direction with respect to the glass substrate A vertical crack with a relatively deep plate thickness.

上述高浸透刃前端之刻劃輪，已知為較一般刃前端之刻劃輪具有「侵入佳」的刃前端。 The scribing wheel at the front end of the high-impregnation blade is known to have a "invasive" front end of the scribing wheel at the tip end of the general blade.

專利文獻1：日本特許第3074143號公報 Patent Document 1: Japanese Patent No. 3074143

然而，在對較玻璃基板更硬之陶瓷等高硬度之脆性材料基板進行刻劃的情形時，由於超硬合金或PCD製之刻劃輪係以碳化鎢或鑽石粒子與鈷等結合材構成，因此存在有因刃前端缺損或磨耗等而無法形成長距離裂紋的情況。因此，在對較硬的脆性材料基板進行刻劃的情形時，較佳為使用較超硬合金或燒結鑽石更硬、且為均質材料的單結晶等之鑽石製刻劃輪。鑽石素材之刻劃輪中，刃前端成為鏡面狀，且傾斜面之表面粗糙度小。因此被認為更容易在基板上打滑，使「侵入」變差，而難以從刻劃開始後便使垂直裂紋產生。 However, in the case of scribing a high-hardness brittle material substrate such as ceramic which is harder than a glass substrate, since the scoring wheel made of cemented carbide or PCD is composed of a combination of tungsten carbide or diamond particles and cobalt, Therefore, there is a case where a long-distance crack cannot be formed due to a defect at the tip end of the blade or abrasion. Therefore, in the case of scribing a hard brittle material substrate, it is preferable to use a diamond scribing wheel which is harder than a super hard alloy or a sintered diamond and which is a single crystal of a homogeneous material. In the marking of the diamond material, the front end of the blade is mirror-shaped, and the surface roughness of the inclined surface is small. Therefore, it is considered that it is easier to slip on the substrate, which makes the "intrusion" worse, and it is difficult to cause vertical cracks from the start of the scribe.

本發明有鑑於上述鑽石素材之刻劃輪之問題而完成，其目的在提供一種即便是使用鑽石素材之刻劃輪對脆性材料基板進行刻劃時，「侵入」亦佳且垂直裂紋亦容易產生之刻劃輪。 The present invention has been made in view of the above problem of the scribing wheel of the above-mentioned diamond material, and the object thereof is to provide an excellent "intrusion" and vertical cracks even when the scratch pad is used to scribe a brittle material substrate using a diamond material. The wheel is engraved.

為了解決此課題，本發明之刻劃輪，於圓板周圍具有由以鑽石構成之稜線與一對傾斜面所構成之剖面V字形之刃前端，該一對傾斜面之算術平均粗糙度設為0.01μm以下，在該刃前端之傾斜面之從稜線起隔著既定間隔之位置遍及全周設置0.5μm以上、未達12μm之間距之凹部。 In order to solve the problem, the scribing wheel of the present invention has a V-shaped front end portion of a cross section formed by a ridge line formed of a diamond and a pair of inclined surfaces around the disc, and the arithmetic mean roughness of the pair of inclined surfaces is set to 0.01 μm or less, a concave portion having a distance of 0.5 μm or more and less than 12 μm is provided over the entire circumference from the ridge line at a predetermined interval from the ridge line at the tip end of the blade.

此處亦可為：該刻劃輪，沿該傾斜面之該凹部之稜線側端部與稜線之距離L為1μm以上、5μm以下。 Here, the scribe wheel may have a distance L between the ridge line side end portion of the concave portion and the ridge line along the inclined surface of 1 μm or more and 5 μm or less.

此處亦可為：該刻劃輪，由單結晶鑽石構成。 Here it can also be: the marking wheel, which consists of a single crystal diamond.

亦可為：該刻劃輪之凹部之深度設為0.3μm以下。 Alternatively, the depth of the concave portion of the scribing wheel may be set to 0.3 μm or less.

根據具有上述特徵之本發明，在刻劃輪之傾斜面，從刃前端之稜線起隔著既定距離之兩側之傾斜面之全周，以未達12μm之小間距形成凹部。因此，可獲得以下效果：刻劃時侵入性良好，且能在刻劃開始後立即以深的裂紋對高硬度基板進行刻劃。 According to the invention having the above feature, in the inclined surface of the scribing wheel, the concave portion is formed at a small pitch of less than 12 μm from the ridge line at the tip end of the blade from the entire circumference of the inclined surface on both sides of the predetermined distance. Therefore, the following effects can be obtained: the intrusion is good at the time of scribing, and the high-hardness substrate can be scored with deep cracks immediately after the start of scribing.

10‧‧‧刻劃輪 10‧‧‧scribed wheels

11‧‧‧中心軸 11‧‧‧ center axis

12‧‧‧貫通孔 12‧‧‧through holes

13‧‧‧稜線 13‧‧‧ ridgeline

14a、14b‧‧‧傾斜面 14a, 14b‧‧‧ sloped surface

15、16‧‧‧凹部 15, 16‧‧ ‧ recess

圖1，係本發明之實施形態之刻劃輪的側視圖及前視圖。 Fig. 1 is a side view and a front view of a scribe wheel of an embodiment of the present invention.

圖2，係放大顯示本實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 Fig. 2 is a side elevational view and a front elevational view showing, in an enlarged manner, a front end portion of a cutting wheel blade of the embodiment.

圖3，係本實施形態之刻劃輪之刃前端之稜線部分的剖面圖。 Fig. 3 is a cross-sectional view showing a ridge line portion of the tip end of the dicing blade of the embodiment.

圖4，係顯示使用本實施形態之刻劃輪進行刻劃之狀態的放大剖面圖。 Fig. 4 is an enlarged cross-sectional view showing a state in which scribing is performed using the scribing wheel of the embodiment.

圖5，係放大顯示本發明之第2實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 Fig. 5 is a side elevational view and a front elevational view showing, in an enlarged manner, a front end portion of a scribe wheel blade according to a second embodiment of the present invention.

圖6，係放大顯示本發明之第3實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 Fig. 6 is a side elevational view and a front elevational view showing, in an enlarged manner, a front end portion of a scribe wheel blade according to a third embodiment of the present invention.

以下，針對本發明之實施形態之刻劃輪，使用圖式詳細地進行說明。本實施形態中成為加工對象之脆性材料基板，雖為硬度高之SiC基板，但並不限定於此，亦可為液晶顯示器面板、電漿顯示器面板等之玻璃基板、單結晶矽基板、陶瓷基板、藍寶石基板等之脆性材料基板。此外， 本說明書中所使用之「算術平均粗糙度Ra」，係表示JISB0601規定之工業製品之表面粗糙度的參數之一。 Hereinafter, the scribing wheel according to the embodiment of the present invention will be described in detail using the drawings. The brittle material substrate to be processed in the present embodiment is a SiC substrate having a high hardness, but is not limited thereto, and may be a glass substrate such as a liquid crystal display panel or a plasma display panel, a single crystal germanium substrate, or a ceramic substrate. A brittle material substrate such as a sapphire substrate. In addition, The "arithmetic mean roughness Ra" used in the present specification is one of the parameters indicating the surface roughness of the industrial product specified in JIS B0601.

說明本發明之實施形態之刻劃輪形狀。圖1(a)係本實施形態之刻劃輪從其中心軸方向觀察時的前視圖，圖1(b)係該刻劃輪之側視圖。此外，圖2(a)係放大顯示稜線部分的側視圖，圖2(b)係其前視圖。 The shape of the scribe wheel of the embodiment of the present invention will be described. Fig. 1(a) is a front view of the scribe wheel of the present embodiment as seen from the direction of the central axis thereof, and Fig. 1(b) is a side view of the scribe wheel. Further, Fig. 2(a) is a side view showing an enlarged ridge line portion, and Fig. 2(b) is a front view thereof.

本實施形態之刻劃輪10，係以單結晶鑽石形成之圓板狀之輪，如圖1所示，於中心軸11之中心具有供用於軸支刻劃輪10之未圖示之銷貫通之貫通孔12。該刻劃輪10之外周面切削成剖面V字形，於其中心形成稜線13，於左右如圖示般具有傾斜面14a、14b。傾斜面14a、14b，形成為具有收斂角度(α)。傾斜面14a、14b，以傾斜面之算術平均粗糙度Ra成為0.01μm以下之方式加工。 The scribing wheel 10 of the present embodiment is a disc-shaped wheel formed of a single crystal diamond, and as shown in Fig. 1, a pin through which a shaft for the shaft scribing wheel 10 is not shown is provided at the center of the center shaft 11. Through hole 12. The outer peripheral surface of the scribing wheel 10 is cut into a V-shaped cross section, and a ridge line 13 is formed at the center thereof, and has inclined surfaces 14a and 14b as shown in the figure. The inclined faces 14a, 14b are formed to have a convergence angle (α). The inclined faces 14a and 14b are processed so that the arithmetic mean roughness Ra of the inclined faces becomes 0.01 μm or less.

此外，本實施形態之刻劃輪，如圖2所示，對在中心包含刃前端之稜線13的傾斜面14a、14b，於稍微離開稜線13之位置等間隔地以固定的間距P遍及全周實施凹部15。此處，凹部加工較佳為形成於至少在刻劃時與基板接觸之部分。圖3係顯示刃前端部分之剖面的放大剖面圖，如該圖所示，沿傾斜面之稜線13與凹部15之稜線側之端部的距離L，例如設為1μm以上、5μm以下。該凹部15為大致圓形之凹狀，隔著既定間隔形成於稜線13之兩側。該凹部15之間距P設為0.5μm以上未達12μm，較佳為未達8μm，更佳為1μm以下。此外，凹部15之深度d設為0.05μm以上未達0.7μm，較佳為0.3μm以下。 Further, as shown in Fig. 2, the scribe wheel of the present embodiment has a slanting surface 14a, 14b including a ridge line 13 at the tip end of the blade at a constant pitch P over the entire circumference at a position slightly apart from the ridge line 13. The recess 15 is implemented. Here, the concave portion processing is preferably formed at a portion in contact with the substrate at least at the time of scribing. 3 is an enlarged cross-sectional view showing a cross section of the tip end portion of the blade. As shown in the figure, the distance L between the ridge line 13 along the inclined surface and the end portion on the ridge line side of the concave portion 15 is, for example, 1 μm or more and 5 μm or less. The concave portion 15 has a substantially circular concave shape and is formed on both sides of the ridge line 13 with a predetermined interval therebetween. The distance P between the concave portions 15 is set to 0.5 μm or more and less than 12 μm, preferably less than 8 μm, and more preferably 1 μm or less. Further, the depth d of the concave portion 15 is set to 0.05 μm or more and less than 0.7 μm, preferably 0.3 μm or less.

圖4係顯示使用本實施形態之刻劃輪對玻璃基板進行刻劃時之刃前端部分之剖面的放大剖面圖。如此圖所示，在進行刻劃時，刃前 端之前端侵入玻璃基板20，在玻璃基板20之面進入到凹部15的情形下進行刻劃。如上所述，藉由在稜線13兩側形成微細的凹部加工，即便是對高硬度之SiC基板等之基板亦能夠確保一定的摩擦係數，而能夠謀求侵入性的改善。此外，由於凹部15並未與稜線13相連，因此能夠提高使用該刻劃輪10進行刻劃分斷時之基板之端面強度。 Fig. 4 is an enlarged cross-sectional view showing a cross section of a tip end portion of the blade when the glass substrate is scribed using the scribe wheel of the embodiment. As shown in this figure, when marking, the front edge The front end of the end enters the glass substrate 20, and is scribed when the surface of the glass substrate 20 enters the concave portion 15. As described above, by forming the fine concave portion on both sides of the ridge line 13, it is possible to ensure a certain friction coefficient even for a substrate having a high hardness of SiC substrate or the like, and it is possible to improve the intrusion. Further, since the concave portion 15 is not connected to the ridge line 13, it is possible to improve the end face strength of the substrate when the scribing wheel 10 is used for the dicing.

本實施形態之對以鑽石形成之刻劃輪之傾斜面的凹部加工，可使用飛秒雷射之表面加工裝置來進行。飛秒雷射係在飛秒(femtosecond)單位之極短的時間壓縮功率而成之光源，能夠對各種材料形成周期性的構造之槽或圖案。此處，如圖2、圖3所示，係對稜線13附近之傾斜面14a、14b以固定間距P進行凹部加工。而且，可藉由適當地選擇該飛秒雷射之光源或脈衝寬以進行所希望之尺寸、間距P及深度d之凹部加工。 The processing of the concave portion of the inclined surface of the scribe wheel formed by the diamond in the present embodiment can be performed using a surface processing apparatus of a femtosecond laser. The femtosecond laser is a light source that compresses power in a very short time in femtosecond units, and is capable of forming periodic grooves or patterns of various materials. Here, as shown in FIGS. 2 and 3, the inclined surfaces 14a and 14b in the vicinity of the ridge line 13 are subjected to concave processing at a fixed pitch P. Moreover, the concave portion processing of the desired size, pitch P, and depth d can be performed by appropriately selecting the source or pulse width of the femtosecond laser.

又，本實施形態中，凹部加工在圖2、圖3中雖為圓形，但亦可如圖5中顯示之第2實施形態之刻劃輪般為長圓形之凹部16，此外，亦可為橢圓形之凹部。此時，由於能夠在進行刻劃時使侵入基板之深度改變，因此能夠使刻劃負載之範圍變大。 Further, in the present embodiment, the concave portion is circular in FIGS. 2 and 3, but may be an oblong recess 16 as in the case of the second embodiment shown in Fig. 5, and It can be an elliptical recess. At this time, since the depth of the intrusion substrate can be changed at the time of scribing, the range of the scribing load can be increased.

此外，在本發明之第1實施形態中，如圖3所示雖於傾斜面14a、14b配置相對於稜線13對稱之凹部15，但如圖6中顯示第3實施形態般，在傾斜面14a、14b互相不同地形成凹部15。此外，亦可僅在傾斜面14a、14b之任某一方形成凹部15。 Further, in the first embodiment of the present invention, as shown in Fig. 3, the concave portion 15 which is symmetrical with respect to the ridge line 13 is disposed on the inclined surfaces 14a and 14b, but the inclined surface 14a is shown in Fig. 6 as in the third embodiment. The 14b forms the recess 15 differently from each other. Further, the concave portion 15 may be formed only on one of the inclined faces 14a and 14b.

本發明之實施形態之刻劃輪，侵入性良好，且即便是對高硬度之基板亦不會打滑，能夠自刻劃開始後便產生垂直裂紋。因此可獲得即便是對高硬度之基板亦能夠進行內切刻劃之優異的效果。此外，由於不會 產生打滑，因此使刻劃輪稜線均勻地磨耗，而能夠進一步地延長刻劃輪之壽命。 The scribing wheel according to the embodiment of the present invention is excellent in intrusion, and does not slip even on a substrate having a high hardness, and can generate vertical cracks from the start of scribing. Therefore, it is possible to obtain an excellent effect of performing internal scribes even on a substrate having a high hardness. Also, because it won't Slippage is generated, so that the scribe ridge line is evenly worn, and the life of the scribe wheel can be further extended.

此外在該實施形態中，雖將刻劃輪之素材設為單結晶鑽石，但亦可使用多結晶鑽石作為素材。亦在該情形，能夠藉由對刻劃輪之稜線部分實施相同之凹部加工而構成具有同樣效果之刻劃輪。 Further, in this embodiment, the material of the scoring wheel is a single crystal diamond, but a polycrystalline diamond may be used as the material. Also in this case, the scribing wheel having the same effect can be constructed by performing the same concave processing on the ridge line portion of the scoring wheel.

此外，本實施形態中，雖示出了刻劃輪整體係由單結晶鑽石構成，但例如對於在以超硬合金等構成之輪本體部藉由黏貼或成膜固定以單結晶或多結晶鑽石構成之刃前端部分而成之刻劃輪，本發明亦可適用。若是如上述之構成的刻劃輪，則能夠減少高價之鑽石的使用，提供價格便宜之刻劃輪。 Further, in the present embodiment, the entire scoring wheel is formed of a single crystal diamond, but for example, a single crystal or a polycrystalline diamond is fixed by filming or film formation on a wheel body portion made of a cemented carbide or the like. The present invention is also applicable to a scribe wheel formed by the front end portion of the blade. According to the scoring wheel constructed as described above, it is possible to reduce the use of expensive diamonds and provide a cheaper rowing wheel.

本發明可適用於對高硬度之脆性材料基板進行刻劃之刻劃裝置。 The present invention is applicable to a scoring device for scribing a high-hardness brittle material substrate.

11‧‧‧中心軸 11‧‧‧ center axis

13‧‧‧稜線 13‧‧‧ ridgeline

14a、14b‧‧‧傾斜面 14a, 14b‧‧‧ sloped surface

15‧‧‧凹部 15‧‧‧ recess

P‧‧‧間距 P‧‧‧ spacing

Claims (5)

一種刻劃輪，於圓板周圍具有由以鑽石構成之稜線與一對傾斜面所構成之剖面V字形之刃前端，該一對傾斜面之算術平均粗糙度設為0.01μm以下，在該刃前端之傾斜面之從稜線起隔著既定間隔之位置，於全周設置0.5μm以上、未達12μm之間距之凹部。 A scribing wheel having a V-shaped front end of a cross section formed by a ridge line formed of a diamond and a pair of inclined surfaces around the disc, wherein the arithmetic mean roughness of the pair of inclined surfaces is set to 0.01 μm or less, at the edge The inclined surface of the front end is provided with a recessed portion having a distance of 0.5 μm or more and less than 12 μm over the entire circumference from a position where a predetermined interval is formed from the ridge line. 如申請專利範圍第1項之刻劃輪，其中，沿該傾斜面之該凹部之稜線側端部與稜線之距離L為1μm以上、5μm以下。 In the scribe wheel of the first aspect of the invention, the distance L between the ridge line side end portion of the concave portion and the ridge line along the inclined surface is 1 μm or more and 5 μm or less. 如申請專利範圍第1或2項之刻劃輪，其由單結晶鑽石構成。 For example, the marking wheel of claim 1 or 2 is composed of a single crystal diamond. 如申請專利範圍第1或2項之刻劃輪，其中，該凹部之深度為0.3μm以下。 The marking wheel of claim 1 or 2, wherein the recess has a depth of 0.3 μm or less. 如申請專利範圍第3項之刻劃輪，其中，該凹部之深度為0.3μm以下。 The marking wheel of claim 3, wherein the recess has a depth of 0.3 μm or less.
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