TWI607845B - Breaking method of brittle substrate - Google Patents
Breaking method of brittle substrate Download PDFInfo
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- TWI607845B TWI607845B TW105130435A TW105130435A TWI607845B TW I607845 B TWI607845 B TW I607845B TW 105130435 A TW105130435 A TW 105130435A TW 105130435 A TW105130435 A TW 105130435A TW I607845 B TWI607845 B TW I607845B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/18—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by milling, e.g. channelling by means of milling tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
本發明係關於一種脆性基板之分斷方法。 The present invention relates to a method of breaking a brittle substrate.
平面顯示器面板或太陽電池面板等電氣機器之製造中，屢屢必須對脆性基板進行分斷。典型的分斷方法，首先是在脆性基板上形成裂紋線。此處所謂的「裂紋線」(crack line)，係往脆性基板之厚度方向部分伸展而成之裂紋在脆性基板之表面上呈線狀延伸者。接著，進行所謂的裂斷步驟。具體而言，係藉由對脆性基板施加應力，使裂紋線之裂紋往厚度方向完全伸展。藉此，沿裂紋線將脆性基板分斷。 In the manufacture of electrical equipment such as flat panel displays or solar panel panels, it is often necessary to break the brittle substrate. A typical method of breaking is to first form a crack line on a brittle substrate. Here, the "crack line" is a portion in which a crack extending in a thickness direction of a brittle substrate extends linearly on the surface of a brittle substrate. Next, a so-called cracking step is performed. Specifically, by applying stress to the brittle substrate, the crack of the crack line is completely extended in the thickness direction. Thereby, the brittle substrate is broken along the crack line.
根據日本特開平9-188534號公報(專利文獻1)，於刻劃時產生位於玻璃板上面之凹槽。上述公報中，該凹槽稱為「刻劃線」。又在刻設刻劃線的同時，產生從刻劃線往其下方延伸之裂紋。據此在上述公報之分斷技術中，可以說在形成「刻劃線」的同時，形成上述裂紋線。 According to Japanese Laid-Open Patent Publication No. Hei 9-188534 (Patent Document 1), a groove located above the glass sheet is generated at the time of scribing. In the above publication, the groove is referred to as "marking". At the same time as the scribe line is engraved, a crack extending from the scribe line to the lower side is generated. According to the breaking technique of the above publication, it can be said that the above-mentioned crack line is formed while forming the "scribe line".
專利文獻1：日本特開平9-188534號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. Hei 9-188534
本發明人等開發出與上述習知分斷技術不同之獨特的分斷技術。根據此技術，首先，藉由刃前端在脆性基板上滑動而使脆性基板產生塑性變形(plastic deformation)，藉此形成稱為溝槽線(trench line)之槽形狀。在形成溝槽線之時間點，於其下方不形成裂紋。之後，沿溝槽線使裂紋伸展， 以形成裂紋線。也就是說，與上述習知技術不同處在於，先形成不伴隨裂紋之溝槽線，之後沿溝槽線形成裂紋線。之後，沿裂紋線進行裂斷步驟。 The present inventors have developed a unique breaking technique that is different from the above-described conventional breaking technique. According to this technique, first, the brittle substrate is plastically deformed by sliding the tip end of the blade on the brittle substrate, thereby forming a groove shape called a trench line. At the point of time when the groove line is formed, no crack is formed below it. After that, the crack is stretched along the groove line. To form a crack line. That is to say, the difference from the above-described prior art is that a groove line which does not accompany cracks is formed first, and then a crack line is formed along the groove line. Thereafter, the cracking step is performed along the crack line.
不伴隨裂紋之溝槽線，相較於習知伴隨裂紋之刻劃線，可藉由在較低負載下之刃前端之滑動來形成。若對刃前端之負載小，則對刃前端施加之破壞亦變小。據此，根據該獨特之分斷技術，能夠延長刃前端之壽命。 A groove line that does not accompany a crack can be formed by sliding a tip end of a blade at a lower load than a conventional scribe line with a crack. If the load on the tip end of the blade is small, the damage applied to the tip end of the blade is also reduced. Accordingly, according to the unique breaking technique, the life of the blade tip can be extended.
在上述獨特之技術中，用於沿溝槽線開始形成裂紋線之步驟是必要的。為此，必須有促使藉由溝槽線之形成而在脆性基板中產生之內部應力釋放之契機。作為賦予該契機之方法之一，本發明人等發現以與溝槽線交叉之方式形成一般刻劃線之步驟是很有效的。然而，該步驟將導致基板之分斷方法變得煩雜。據此，被期望有取代該步驟之更為容易之步驟。 Among the above unique techniques, a step for forming a crack line along the groove line is necessary. For this reason, there must be an opportunity to promote the release of internal stress generated in the brittle substrate by the formation of the groove lines. As one of the methods for giving the opportunity, the inventors have found that it is effective to form a general scribe line so as to intersect the groove line. However, this step will cause the breaking method of the substrate to become cumbersome. Accordingly, it is desirable to have an easier step to replace this step.
本發明係為解決上述課題而完成，其目的在提供一種在形成其下方不具有裂紋之溝槽線後，能夠容易地形成沿溝槽線之裂紋線的脆性基板之分斷方法。 The present invention has been made to solve the above problems, and an object of the invention is to provide a method for breaking a brittle substrate which can easily form a crack line along a groove line after forming a groove line having no crack below.
本發明之脆性基板之分斷方法，具有以下之步驟。 The breaking method of the brittle substrate of the present invention has the following steps.
藉由在脆性基板之一面上使刃前端以第1速度從第1位置滑動至第2位置，以在一面上產生塑性變形，藉此形成具有槽形狀之第1溝槽線。形成第1溝槽線之步驟，係以可獲得無裂紋狀態之方式進行，該無裂紋狀態係在第1溝槽線下方，脆性基板在與第1溝槽線交叉之方向連續相連之狀態。 The tip end of the blade is slid from the first position to the second position at a first speed on one surface of the brittle substrate, and plastic deformation is formed on one surface to form a first groove line having a groove shape. The step of forming the first trench line is performed in a state in which the crack-free state is obtained below the first trench line, and the fragile substrate is continuously connected in the direction intersecting the first trench line.
在形成第1溝槽線之步驟後，在脆性基板之一面上使刃前端進一步以較第1速度慢之第2速度從第2位置往第3位置滑動，以在一面上 產生塑性變形，藉此形成具有槽形狀之第2溝槽線。形成第2溝槽線之步驟，係以可獲得無裂紋狀態之方式進行，該無裂紋狀態係在第2溝槽線下方，脆性基板在與第2溝槽線交叉之方向連續相連之狀態。 After the step of forming the first groove line, the tip end of the blade is further slid from the second position to the third position at a second speed slower than the first speed on one surface of the brittle substrate, on one side Plastic deformation occurs, thereby forming a second groove line having a groove shape. The step of forming the second groove line is performed in a state in which the crack-free state is obtained below the second groove line, and the fragile substrate is continuously connected in the direction intersecting the second groove line.
藉由在形成第2溝槽線之步驟中滑動之刃前端到達第3位置，使脆性基板之裂紋從第3位置沿第2溝槽線伸展，藉此形成第1裂紋線。藉由第1裂紋線而在第2溝槽線下方使脆性基板在與第2溝槽線交叉之方向的連續相連斷開。 When the tip end of the blade that slides in the step of forming the second groove line reaches the third position, the crack of the brittle substrate is extended from the third position along the second groove line, thereby forming the first crack line. The brittle substrate is continuously disconnected in the direction intersecting the second groove line below the second groove line by the first crack line.
藉由第1裂紋線到達第2位置，使脆性基板之裂紋從第2位置沿第1溝槽線伸展，藉此形成第2裂紋線。藉由第2裂紋線而在第1溝槽線下方使脆性基板在與第1溝槽線交叉之方向的連續相連斷開。 When the first crack line reaches the second position, the crack of the brittle substrate is extended from the second position along the first groove line, thereby forming the second crack line. The brittle substrate is continuously disconnected in the direction intersecting the first groove line below the first groove line by the second crack line.
沿第1裂紋線及第2裂紋線分斷脆性基板。 The brittle substrate is divided along the first crack line and the second crack line.
根據本發明，藉由為了形成第1溝槽線而滑動之刃前端進一步滑動至第3位置，形成沿第1溝槽線之第2裂紋線。也就是，藉由使用於形成第1溝槽線之刃前端之滑動進一步繼續進行，能夠容易地沿第1溝槽線形成第2裂紋線。 According to the invention, the tip end of the blade that slides in order to form the first groove line is further slid to the third position, and the second crack line along the first groove line is formed. That is, the sliding of the tip end of the blade for forming the first groove line is further continued, so that the second crack line can be easily formed along the first groove line.
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
50、50u、50v‧‧‧切割器具 50, 50u, 50v‧‧‧ cutting instruments
51、51u、51v‧‧‧刃前端 51, 51u, 51v‧‧‧ blade front end
CL1、CL2‧‧‧裂紋線(第1及第2裂紋線) CL1, CL2‧‧‧ crack line (1st and 2nd crack lines)
N1~N4‧‧‧位置(第1~第4位置) N1~N4‧‧‧ position (1st to 4th positions)
SF1‧‧‧上面(一面) SF1‧‧‧ above (one side)
TL1~TL3‧‧‧溝槽線(第1~第3溝槽線) TL1~TL3‧‧‧ Groove line (1st to 3rd groove lines)
圖1，係概略性地顯示本發明之實施形態1中的脆性基板之分斷方法之構成的流程圖。 Fig. 1 is a flow chart schematically showing the configuration of a breaking method of a brittle substrate in the first embodiment of the present invention.
圖2，係概略性地顯示本發明之實施形態1中的脆性基板之分斷方法之第1步驟的俯視圖。 Fig. 2 is a plan view schematically showing a first step of the breaking method of the brittle substrate in the first embodiment of the present invention.
圖3，係沿圖2之線III-III的概略剖面圖。 Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2 .
圖4，係沿圖2之線IV-IV的概略剖面圖。 Figure 4 is a schematic cross-sectional view taken along line IV-IV of Figure 2 .
圖5，係概略性地顯示本發明之實施形態1中的脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 5 is a plan view schematically showing a second step of the breaking method of the brittle substrate in the first embodiment of the present invention.
圖6，係沿圖5之線VI-VI的概略剖面圖。 Fig. 6 is a schematic cross-sectional view taken along line VI-VI of Fig. 5.
圖7，係沿圖5之線VII-VII的概略剖面圖。 Figure 7 is a schematic cross-sectional view taken along line VII-VII of Figure 5.
圖8，係概略性地顯示本發明之實施形態1中的脆性基板之分斷方法之第3步驟的俯視圖。 Fig. 8 is a plan view schematically showing a third step of the breaking method of the brittle substrate in the first embodiment of the present invention.
圖9，係沿圖8之線IX-IX的概略剖面圖。 Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 8.
圖10，係脆性基板之沿第1裂紋線之分斷面的顯微照片。 Figure 10 is a photomicrograph of a cross section of the brittle substrate along the first crack line.
圖11，係脆性基板之沿第2裂紋線之分斷面的顯微照片。 Figure 11 is a photomicrograph of a cross section of the brittle substrate along the second crack line.
圖12，係概略性地顯示本發明之實施形態1中的脆性基板之分斷方法中使用之切割器具之構成的側視圖。 FIG. 12 is a side view schematically showing a configuration of a cutting instrument used in the breaking method of the brittle substrate in the first embodiment of the present invention.
圖13，係在圖12之箭頭XIII之視點下的概略俯視圖。 Fig. 13 is a schematic plan view of the arrow XIII of Fig. 12;
圖14，係概略性地顯示本發明之實施形態2中的脆性基板之分斷方法中使用之切割器具之構成的側視圖。 Fig. 14 is a side view schematically showing the configuration of a cutting instrument used in the breaking method of the brittle substrate in the second embodiment of the present invention.
圖15，係在圖14之箭頭XV之視點下的概略俯視圖。 Fig. 15 is a schematic plan view of the arrow XV of Fig. 14;
圖16，係概略性地顯示本發明之實施形態3中的脆性基板之分斷方法中使用之切割器具之構成的側視圖。 Fig. 16 is a side view schematically showing the configuration of a cutting instrument used in the breaking method of the brittle substrate in the third embodiment of the present invention.
圖17，係在圖16之箭頭XVII之視點下的概略俯視圖。 Fig. 17 is a schematic plan view of the arrow XVII of Fig. 16.
圖18，係概略性地顯示本發明之實施形態4中的脆性基板之分斷方法之第1步驟的俯視圖。 Fig. 18 is a plan view schematically showing a first step of the breaking method of the brittle substrate in the fourth embodiment of the present invention.
圖19，係沿圖18之線XIX-XIX的概略剖面圖。 Figure 19 is a schematic cross-sectional view taken along line XIX-XIX of Figure 18.
圖20，係概略性地顯示本發明之實施形態4中的脆性基板之分斷方法之第2步驟的俯視圖。 Fig. 20 is a plan view schematically showing a second step of the breaking method of the brittle substrate in the fourth embodiment of the present invention.
圖21，係沿圖20之線XXI-XXI的概略剖面圖。 Figure 21 is a schematic cross-sectional view taken along line XXI-XXI of Figure 20.
圖22，係概略性地顯示本發明之實施形態4中的脆性基板之分斷方法之第3步驟的俯視圖。 Fig. 22 is a plan view schematically showing a third step of the breaking method of the brittle substrate in the fourth embodiment of the present invention.
圖23，係沿圖22之線XXIII-XXIII的概略剖面圖。 Figure 23 is a schematic cross-sectional view taken along line XXIII-XXIII of Figure 22.
以下，根據圖式說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described based on the drawings.
(玻璃基板之分斷方法) (Method of breaking glass substrate)
圖1，係概略性地顯示本實施形態中的脆性基板之分斷方法之構成的流程圖。以下，針對該分斷方法進行說明。 Fig. 1 is a flow chart schematically showing the configuration of a breaking method of a brittle substrate in the present embodiment. Hereinafter, the breaking method will be described.
參照圖2~圖4，首先，準備將被分斷之玻璃基板4(脆性基板)。玻璃基板4，具有上面SF1(一面)、與其相反之下面SF2。又，玻璃基板4，具有與上面SF1垂直之厚度方向DT(圖3)。此外，準備具有刃前端51之切割器具50(圖4)。關於切割器具50之構成及其使用方法之細節，留待後敘。 Referring to Fig. 2 to Fig. 4, first, a glass substrate 4 (brittle substrate) to be broken is prepared. The glass substrate 4 has an upper surface SF1 (one surface) and a lower surface SF2 opposite thereto. Further, the glass substrate 4 has a thickness direction DT (FIG. 3) perpendicular to the upper surface SF1. Further, a cutting instrument 50 (Fig. 4) having a blade leading end 51 is prepared. Details regarding the constitution of the cutting instrument 50 and the method of use thereof will be described later.
接下來，使與玻璃基板4分開配置之刃前端51，接近玻璃基板4。藉此，在玻璃基板4之上面SF1上的位置N1(第1位置)，刃前端51接觸玻璃基板4。位置N1係與玻璃基板4之上面SF1之緣分離。 Next, the blade tip end 51 disposed separately from the glass substrate 4 is brought close to the glass substrate 4. Thereby, the blade tip end 51 contacts the glass substrate 4 at the position N1 (first position) on the upper surface SF1 of the glass substrate 4. The position N1 is separated from the edge of the upper surface SF1 of the glass substrate 4.
接下來，在步驟S10(圖1)，於玻璃基板4之上面SF1上， 如箭頭M1(圖2及圖4)所示，使刃前端51從位置N1滑動至與位置N1不同的位置N2(第2位置)。該滑動速度即第1速度，可以是使用機械性的刃前端時之典型的刻劃速度，例如為100mm/秒左右。藉由此滑動在上面SF1上產生塑性變形。藉由此動作，形成具有槽形狀之溝槽線TL1(第1溝槽線)。 Next, in step S10 (FIG. 1), on the upper surface SF1 of the glass substrate 4, As shown by the arrow M1 (Figs. 2 and 4), the blade distal end 51 is slid from the position N1 to a position N2 (second position) different from the position N1. The sliding speed, that is, the first speed, may be a typical scoring speed when a mechanical tip end is used, and is, for example, about 100 mm/sec. By this sliding, plastic deformation occurs on the upper surface SF1. By this operation, the groove line TL1 (first groove line) having a groove shape is formed.
溝槽線TL1，以可獲得無裂紋狀態之方式形成。此處所謂的無裂紋狀態，係在溝槽線TL1之下方，玻璃基板4在與溝槽線TL1之延伸方向(圖2及圖4中的橫方向)交叉之方向DC(圖3)連續相連之狀態。在無裂紋狀態下，雖形成有因塑性變形產生之溝槽線TL1，但並未形成沿其之裂紋。為了獲得無裂紋狀態，施加於刃前端51之負載，調整為小至不產生裂紋之程度，且會產生塑性變形、而後於其下方產生裂紋之程度。關於下述的其他溝槽線，無裂紋狀態亦以同樣方式定義。 The groove line TL1 is formed in such a manner that a crack-free state can be obtained. Here, the crack-free state is below the groove line TL1, and the glass substrate 4 is continuously connected in the direction DC (Fig. 3) intersecting with the extending direction of the groove line TL1 (the horizontal direction in Figs. 2 and 4). State. In the crack-free state, although the groove line TL1 due to plastic deformation is formed, no crack is formed along it. In order to obtain a crack-free state, the load applied to the tip end 51 of the blade is adjusted to such an extent that cracks are not generated, and plastic deformation occurs, and then cracks are generated under the blade. Regarding the other groove lines described below, the crack-free state is also defined in the same manner.
另外，上述塑性變形雖係以玻璃基板4表面不會被刮削之低負載充分地形成，但玻璃基板4可稍微被刮削。但此種刮削會產生不佳的微細碎片，因此較佳為不產生刮削。 Further, the plastic deformation described above is sufficiently formed by a low load on which the surface of the glass substrate 4 is not scraped, but the glass substrate 4 can be slightly scraped. However, such scraping produces poor fine fragments, so it is preferred that no scraping occurs.
接下來，在步驟S20(圖1)，於玻璃基板4之上面SF1上，如箭頭M2(圖2及圖4)所示，使刃前端51從位置N2往與位置N1及位置N2皆不同之位置N3(第3位置)滑動。若包含上述溝槽線TL1之形成步驟而言，使刃前端51從位置N1經由位置N2往位置N3連續地滑動。位置N3係與玻璃基板4之上面SF1之緣分離。藉由該滑動而於上面SF1上產生塑性變形。以此形成具有槽形狀之溝槽線TL2(第2溝槽線)。 Next, in step S20 (FIG. 1), on the upper surface SF1 of the glass substrate 4, as shown by an arrow M2 (FIGS. 2 and 4), the blade tip end 51 is different from the position N2 to the position N1 and the position N2. Position N3 (3rd position) slides. When the step of forming the groove line TL1 is included, the blade tip end 51 is continuously slid from the position N1 to the position N3 via the position N2. The position N3 is separated from the edge of the upper surface SF1 of the glass substrate 4. Plastic deformation occurs on the upper surface SF1 by the sliding. Thus, a groove line TL2 (second groove line) having a groove shape is formed.
溝槽線TL2，以可獲得無裂紋狀態之方式形成。形成溝槽線TL2時施加於刃前端51之負載，可與形成溝槽線TL1時施加於刃前端51 之負載相同，亦可不同。另外，將兩負載設為相同者，負載控制較容易。 The groove line TL2 is formed in such a manner that a crack-free state can be obtained. The load applied to the blade tip end 51 when the groove line TL2 is formed may be applied to the blade tip end 51 when the groove line TL1 is formed. The load is the same or different. In addition, if the two loads are set to be the same, load control is easier.
刃前端從位置N2往位置N3之滑動，以較上述第1速度慢之第2速度進行。第2速度，較佳為小於25mm/秒，更佳為小於5mm/秒，例如1mm/秒左右。因此，在步驟之效率上，上述第1速度設為100mm/秒以上時，第2速度較佳為小於第1速度之25%，更佳為小於5%。 The tip end of the blade slides from the position N2 to the position N3, and is performed at a second speed that is slower than the first speed. The second speed is preferably less than 25 mm/sec, more preferably less than 5 mm/sec, for example about 1 mm/sec. Therefore, in the efficiency of the step, when the first speed is 100 mm/sec or more, the second speed is preferably less than 25% of the first speed, and more preferably less than 5%.
參照圖5~圖7，在步驟S30(圖1)，藉由在形成溝槽線TL2之步驟中滑動之刃前端51到達位置N3，如箭頭R1(圖5及圖7)所示，厚度方向DT中的玻璃基板4之裂紋從位置N3沿溝槽線TL2伸展。藉此，形成裂紋線CL1(第1裂紋線)。 Referring to FIGS. 5-7, in step S30 (FIG. 1), the front end 51 of the blade is slid in the step of forming the groove line TL2 to reach the position N3 as indicated by the arrow R1 (FIGS. 5 and 7). The crack of the glass substrate 4 in the DT extends from the position N3 along the groove line TL2. Thereby, the crack line CL1 (first crack line) is formed.
因裂紋線CL1之形成，溝槽線TL2之無裂紋狀態消失。換言之，因裂紋線CL1而在溝槽線TL2之下方，將玻璃基板4在與溝槽線TL2之延伸方向(圖5及圖7中的橫方向)交叉之方向DC(圖6)的連續相連斷開。此處，所謂的「連續相連」，換言之，係未被裂紋妨礙之相連。另外，如上所述在連續相連斷開之狀態中，玻璃基板4之部分可透過裂紋線CL1之裂紋彼此接觸。此外，亦可在溝槽線TL之緊鄰下方稍微殘留連續相連。 Due to the formation of the crack line CL1, the crack-free state of the groove line TL2 disappears. In other words, the glass substrate 4 is continuously connected in the direction DC (FIG. 6) intersecting the extending direction of the groove line TL2 (the lateral direction in FIGS. 5 and 7) below the groove line TL2 due to the crack line CL1. disconnect. Here, the so-called "continuous connection", in other words, is not connected by cracks. Further, as described above, in the state of continuous disconnection, the portions of the glass substrate 4 which are permeable to the crack line CL1 are in contact with each other. Further, it is also possible to have a small continuous continuous connection immediately below the groove line TL.
如上所述，裂紋之伸展開始之詳細的構因(mechanism)不明，因而難以事前精密地預測位置N3位於何處。然而，若使上述第2速度足夠小，則據此有較高的機率使位置N3為十分接近位置N2之位置。 As described above, the detailed mechanism of the start of the crack propagation is unknown, and it is difficult to accurately predict where the position N3 is located in advance. However, if the second speed is sufficiently small, there is a high probability that the position N3 is at a position very close to the position N2.
在步驟S40(圖1)，當裂紋線CL1到達位置N2時，以此為契機，如箭頭R2(圖5及圖7)所示，使玻璃基板4之厚度方向之裂紋從位置N2沿溝槽線TL1伸展。據此，形成裂紋線CL2(第2裂紋線)。因裂紋線CL2之形成，溝槽線TL1之無裂紋狀態消失。換言之，藉由裂紋線CL2而在溝 槽線TL1之下方，將玻璃基板4在與溝槽線TL1交叉之方向的連續相連斷開。 In step S40 (Fig. 1), when the crack line CL1 reaches the position N2, as a result, as shown by the arrow R2 (Figs. 5 and 7), the crack in the thickness direction of the glass substrate 4 is along the groove from the position N2. Line TL1 stretches. Thereby, the crack line CL2 (second crack line) is formed. Due to the formation of the crack line CL2, the crack-free state of the groove line TL1 disappears. In other words, in the trench by the crack line CL2 Below the groove line TL1, the glass substrate 4 is continuously disconnected in a direction intersecting the groove line TL1.
參照圖8及圖9，本實施形態中，如上所述在裂紋線CL1形成後，刃前端51之滑動亦繼續。亦即，在玻璃基板4之上面SF1上，如箭頭M3所示，刃前端51以第2速度進一步從位置N3往與位置N1~N3皆不同之位置N4(第4位置)滑動。藉由該滑動而在上面SF1上產生塑性變形。據此形成具有槽形狀之溝槽線TL3(第3溝槽線)。溝槽線TL3能以可獲得無裂紋狀態之方式形成。換言之，在位置N1~N4進行刃前端51之滑動，在位置N2~N4之間之任一位置N3產生裂紋。 Referring to Fig. 8 and Fig. 9, in the present embodiment, as described above, after the crack line CL1 is formed, the sliding of the blade tip end 51 continues. That is, on the upper surface SF1 of the glass substrate 4, as indicated by an arrow M3, the blade tip end 51 is further slid at a second speed from a position N3 to a position N4 (fourth position) different from the positions N1 to N3. Plastic deformation occurs on the upper surface SF1 by the sliding. According to this, the groove line TL3 (third groove line) having the groove shape is formed. The groove line TL3 can be formed in such a manner that a crack-free state can be obtained. In other words, the blade tip end 51 slides at the positions N1 to N4, and a crack occurs at any position N3 between the positions N2 to N4.
接著，在玻璃基板4之上面SF1上之位置N4，刃前端51從玻璃基板4離開。位置N4係與玻璃基板4之上面SF1之緣分離。藉此，結束刃前端51從位置N1起依序經由位置N2及位置N3而抵達位置N4之滑動步驟。刃前端51在位置N2與位置N4之間滑動之距離，小於刃前端51在位置N1與位置N2之間滑動之距離。刃前端51在位置N2與位置N4之間滑動之距離，較佳為2mm以上，更佳為20mm以上。因此，在上述之第2速度為1mm/秒之情形時，刃前端51在位置N2與位置N4之間滑動之時間，較佳為2秒以上，更佳為20秒以上。 Next, at the position N4 on the upper surface SF1 of the glass substrate 4, the blade leading end 51 is separated from the glass substrate 4. The position N4 is separated from the edge of the upper surface SF1 of the glass substrate 4. Thereby, the sliding edge end 51 is sequentially slid from the position N1 to the position N4 via the position N2 and the position N3. The distance at which the blade leading end 51 slides between the position N2 and the position N4 is smaller than the distance the blade leading end 51 slides between the position N1 and the position N2. The distance at which the blade tip end 51 slides between the position N2 and the position N4 is preferably 2 mm or more, and more preferably 20 mm or more. Therefore, when the second speed is 1 mm/sec, the time during which the blade tip 51 slides between the position N2 and the position N4 is preferably 2 seconds or longer, more preferably 20 seconds or longer.
接下來，在步驟S50(圖1)，沿裂紋線CL1及裂紋線CL2將玻璃基板4分斷。亦即，進行所謂的裂斷步驟。裂斷步驟，可藉由對玻璃基板4施加外力來進行。例如，將應力施加構件(例如，稱為「裂斷棒」之構件)以朝向玻璃基板4之上面SF1上之裂紋線CL1及裂紋線CL2(圖9)之方式按壓於下面SF2上，藉此將用於使裂紋線CL1及裂紋線CL2之裂紋裂開 之應力施加於玻璃基板4。另外，在裂紋線CL1及裂紋線CL2於形成時往厚度方向DT完全進展之情形時，裂紋線CL1及裂紋線CL2之形成，與玻璃基板4之分斷同時產生。 Next, in step S50 (FIG. 1), the glass substrate 4 is divided along the crack line CL1 and the crack line CL2. That is, a so-called cracking step is performed. The cracking step can be performed by applying an external force to the glass substrate 4. For example, a stress applying member (for example, a member called a "cracking rod") is pressed against the lower surface SF2 so as to face the crack line CL1 and the crack line CL2 (FIG. 9) on the upper surface SF1 of the glass substrate 4. Will be used to crack cracks in crack line CL1 and crack line CL2 The stress is applied to the glass substrate 4. Further, when the crack line CL1 and the crack line CL2 are completely progressed in the thickness direction DT at the time of formation, the formation of the crack line CL1 and the crack line CL2 occurs simultaneously with the division of the glass substrate 4.
另外，上述裂紋線之形成步驟，本質上與所謂的裂斷步驟不同。裂斷步驟，係藉由使既已形成之裂紋往厚度方向進一步伸展而將基板完全分離。而裂紋線之形成步驟，係從藉由溝槽線之形成而獲得之無裂紋狀態，帶來往具有裂紋之狀態之變化。該變化是因無裂紋狀態具有之內部應力開放而產生。 Further, the step of forming the crack line described above is substantially different from the so-called cracking step. The cracking step completely separates the substrate by further stretching the formed crack in the thickness direction. The step of forming the crack line is a change from a crack-free state obtained by the formation of the groove line to a state having a crack. This change is caused by the opening of the internal stress in the crack-free state.
藉由以上所述進行玻璃基板4之分斷。關於玻璃基板4之分斷面之品質，與沿裂紋線CL1之部分相比，沿裂紋線CL2之部分較良好。圖10及圖11，分別是沿圖8之玻璃基板4之裂紋線CL1及裂紋線CL2的分斷面(由前視觀察之剖面)之顯微照片。在沿裂紋線CL1之分斷面(圖10)上，在裂紋線CL1之區域，可清楚觀察到凹凸之鯊魚齒狀之模樣。相對於此，在沿裂紋線CL2之分斷面(圖11)上，並無觀察到如上述之模樣，而是觀察到較良好的鏡面。 The division of the glass substrate 4 is performed by the above. Regarding the quality of the cross-section of the glass substrate 4, the portion along the crack line CL2 is better than the portion along the crack line CL1. 10 and 11 are micrographs of a cross section (a cross section viewed from the front) of the crack line CL1 and the crack line CL2 along the glass substrate 4 of Fig. 8, respectively. In the section along the crack line CL1 (Fig. 10), in the region of the crack line CL1, the shark tooth shape of the unevenness can be clearly observed. On the other hand, in the cross section along the crack line CL2 (Fig. 11), the above-described pattern was not observed, but a relatively good mirror surface was observed.
(切割器具) (cutting device)
圖12，係概略性地顯示切割器具50之構成的側視圖。圖13，係在圖12之箭頭XIII之視點下的概略俯視圖。另外，箭頭XIII之方向，對應於玻璃基板4之上面SF1之法線方向。切割器具50具有刃前端51及柄52。刃前端51，藉由固定在作為其之保持具的柄52而保持。 Fig. 12 is a side view schematically showing the configuration of the cutting instrument 50. Fig. 13 is a schematic plan view of the arrow XIII of Fig. 12; Further, the direction of the arrow XIII corresponds to the normal direction of the upper surface SF1 of the glass substrate 4. The cutting instrument 50 has a blade front end 51 and a shank 52. The blade leading end 51 is held by being fixed to the shank 52 as a holder thereof.
刃前端51，具有突起部PP、稜線部PS1~PS4(第1~第4稜線部)、側面SD1~SD4。側面SD1~SD4，朝向彼此不同之方向。稜線部PS1 係側面SD1及SD2間之邊界部。稜線部PS2係側面SD3及SD4間之邊界部。稜線部PS3係側面SD1及SD3間之邊界部。稜線部PS4係側面SD2及SD4間之邊界部。在以箭頭XIII(圖12)之視野觀察刃前端51的俯視圖(圖13)中，稜線部PS1及稜線部PS2，在一直線(圖中的橫方向之直線)上，從突起部PP起彼此往相反方向延伸。圖12中，稜線部PS1及PS2之夾角，換言之，從突起部PP起稜線部PS1延伸之方向、與從突起部PP起稜線部PS2延伸之方向的夾角，較佳為鈍角，例如140°左右。刃前端51，如圖12及圖13所示，較佳為具有四角錐之頂點部之形狀。 The blade tip end 51 has a projection portion PP, ridge portions PS1 to PS4 (first to fourth ridge portions), and side faces SD1 to SD4. The sides SD1 to SD4 are oriented in different directions from each other. Ridge line PS1 It is the boundary between the sides SD1 and SD2. The ridge portion PS2 is a boundary portion between the side faces SD3 and SD4. The ridge portion PS3 is a boundary portion between the side faces SD1 and SD3. The ridge portion PS4 is a boundary portion between the side faces SD2 and SD4. In the plan view (FIG. 13) of the blade tip end 51 viewed from the field of view of the arrow XIII (FIG. 12), the ridge portion PS1 and the ridge portion PS2 are moved from the projection portion PP to each other in a straight line (a straight line in the horizontal direction in the drawing). The opposite direction extends. In Fig. 12, the angle between the ridge portions PS1 and PS2, in other words, the angle from the direction in which the projection portion PP extends from the ridge portion PS1 and the direction in which the ridge portion PS2 extends from the projection portion PP is preferably an obtuse angle, for example, about 140°. . As shown in Figs. 12 and 13, the blade tip end 51 preferably has a shape of a vertex portion of a quadrangular pyramid.
另外，稜線部PS1，係在側面SD1與側面SD2之間刃前端51之表面交會之部分，因此若在微觀下，會具有若干的曲率半徑(以下，亦稱為稜線部PS1之曲率半徑)。該曲率半徑，例如為數μm~十數μm之程度。關於稜線部PS2亦相同。稜線部PS1之曲率半徑與稜線部PS2之曲率半徑，可彼此相同，亦可彼此不同。 Further, the ridge portion PS1 is a portion where the surface of the blade tip end 51 intersects between the side surface SD1 and the side surface SD2. Therefore, if it is microscopically, it has a certain radius of curvature (hereinafter also referred to as a radius of curvature of the ridge portion PS1). The radius of curvature is, for example, about several μm to ten μm. The same applies to the ridge portion PS2. The radius of curvature of the ridge portion PS1 and the radius of curvature of the ridge portion PS2 may be the same as each other or different from each other.
刃前端51，從可將硬度及表面粗糙度設較小的觀點而言，較佳為以鑽石製作。亦即，較佳為刃前端51係鑽石尖點。更佳為刃前端51由單結晶鑽石作成。另外，亦可使用非單結晶之鑽石，例如，亦可使用以CVD(Chemical Vapor Deposition)法合成之多結晶體鑽石。或者，亦可使用藉由鐵族元素等之結合材結合單結晶或多結晶體鑽石粒子而成之燒結鑽石。多結晶體鑽石粒子，可藉由以不含鐵族元素等之結合材之方式使微粒之石墨或非石墨狀碳燒結而作成。 The blade tip end 51 is preferably made of diamond from the viewpoint of setting the hardness and the surface roughness to be small. That is, it is preferable that the blade front end 51 is a diamond cusp. More preferably, the tip end 51 is made of a single crystal diamond. Further, a non-single crystal diamond may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may also be used. Alternatively, a sintered diamond obtained by combining a single crystal or a polycrystalline diamond particle by a combination of an iron group element or the like may be used. The polycrystalline diamond particles can be produced by sintering graphite or non-graphite carbon of the fine particles in such a manner that they do not contain a bonding material such as an iron group element.
柄52沿軸方向AX延伸。在圖12所示之例子中，以軸方向AX大致沿從突起部PP起稜線部PS1延伸之方向、與從突起部PP起稜線部 PS2延伸之方向之中間的方向的方式，將刃前端51安裝於柄52。 The shank 52 extends in the axial direction AX. In the example shown in FIG. 12, the axial direction AX substantially follows the direction in which the ridge line portion PS1 extends from the projection portion PP, and the ridge portion from the projection portion PP. The blade tip end 51 is attached to the shank 52 in such a manner that the direction in which the PS2 extends is in the middle.
接下來，針對溝槽線TL1~TL3(圖9)形成時之切割器具50之使用方法，於以下進行說明。 Next, a method of using the cutting tool 50 at the time of forming the groove lines TL1 to TL3 (FIG. 9) will be described below.
首先，將刃前端51(圖12)之突起部PP按壓於上面SF1之位置N1(圖4)。接著，使已按壓之刃前端51於玻璃基板4之上面SF1上滑動。刃前端51，在上面SF1上，沿從稜線部PS2朝稜線部PS1之方向DA滑動。嚴格而言，使刃前端51沿著從稜線部PS2朝稜線部PS1之方向投影至上面SF1上而成之方向DA滑動。方向DA，大致上是沿突起部PP附近的稜線部PS1及稜線部PS2之各個延伸方向投影至上面SF1上而成之方向。在圖12中，方向DA，對應於從刃前端51起延伸之軸方向AX投影至上面SF1上而成之方向。據此，刃前端51藉由柄52而於上面SF1上拖行滑動。 First, the projection PP of the blade tip end 51 (Fig. 12) is pressed against the position N1 of the upper surface SF1 (Fig. 4). Next, the pressed blade tip end 51 is slid over the upper surface SF1 of the glass substrate 4. The blade leading end 51 slides on the upper surface SF1 in the direction DA from the ridge portion PS2 toward the ridge portion PS1. Strictly speaking, the blade tip end 51 is slid in the direction DA formed by projecting from the ridge portion PS2 toward the ridge portion PS1 onto the upper surface SF1. The direction DA is substantially a direction in which the ridge line portion PS1 and the ridge portion PS2 in the vicinity of the protrusion portion PP are projected onto the upper surface SF1. In Fig. 12, the direction DA corresponds to the direction in which the axial direction AX extending from the blade leading end 51 is projected onto the upper surface SF1. Accordingly, the blade leading end 51 is slid on the upper surface SF1 by the shank 52.
於玻璃基板4之上面SF1上滑動之刃前端51(圖12)之稜線部PS1及稜線部PS2，分別與玻璃基板4之上面SF1形成夾角角度AG1及AG2。較佳為角度AG2大於角度AG1。若角度AG2小於角度AG1，則難以產生裂紋線CL1(圖7)。此外，若角度AG1及角度AG2大致相同，則是否產生裂紋線CL1容易不穩定。產生這些現象之構因正確來講並不明，但推測應當是因刃前端51之滑動而在玻璃基板4內產生之應力分布因刃前端51之姿勢而產生變化之故。 The ridge line portion PS1 and the ridge line portion PS2 of the blade tip end 51 (FIG. 12) which slides on the upper surface SF1 of the glass substrate 4 form angle angles AG1 and AG2 with the upper surface SF1 of the glass substrate 4, respectively. Preferably, the angle AG2 is greater than the angle AG1. If the angle AG2 is smaller than the angle AG1, it is difficult to generate the crack line CL1 (Fig. 7). Further, if the angle AG1 and the angle AG2 are substantially the same, whether or not the crack line CL1 is generated is likely to be unstable. It is not clear that the cause of these phenomena is correct, but it is presumed that the stress distribution generated in the glass substrate 4 due to the sliding of the tip end 51 of the blade changes due to the posture of the blade tip end 51.
(效果) (effect)
根據本實施形態，如圖2及圖4所示，用於形成溝槽線TL1而滑動之刃前端51進一步往位置N3滑動。據此，如圖5及圖7所示，形成溝槽線 TL2，之後，沿溝槽線TL2形成裂紋線CL1。以該裂紋線CL1到達位置N2為契機，形成沿溝槽線TL1之裂紋線CL2。由以上可知，僅使用於形成溝槽線TL1之刃前端51之滑動進一步繼續進行，便能容易地沿溝槽線TL1形成裂紋線CL2。 According to the present embodiment, as shown in Figs. 2 and 4, the blade tip end 51 for sliding the groove line TL1 is further slid to the position N3. Accordingly, as shown in FIGS. 5 and 7, the groove line is formed. TL2, after which the crack line CL1 is formed along the groove line TL2. When the crack line CL1 reaches the position N2, the crack line CL2 along the groove line TL1 is formed. As described above, it is understood that the crack line CL2 can be easily formed along the groove line TL1 only by the sliding of the blade tip end 51 for forming the groove line TL1.
位置N1(圖4)係與玻璃基板4之上面SF1之緣分離。藉此，可避免因刃前端51與玻璃基板4之上面SF1之緣的碰撞而引起的問題。具體而言，使刃前端51之高度方向之控制變容易。此外，能夠抑制對刃前端51的損害。此外，能夠避免玻璃基板4之緣的缺欠。 The position N1 (Fig. 4) is separated from the edge of the upper surface SF1 of the glass substrate 4. Thereby, problems caused by the collision of the blade tip end 51 and the edge of the upper surface SF1 of the glass substrate 4 can be avoided. Specifically, the control of the height direction of the blade tip end 51 is facilitated. Further, damage to the tip end 51 of the blade can be suppressed. Further, the defect of the edge of the glass substrate 4 can be avoided.
位置N3(圖7)係與玻璃基板4之上面SF1之緣分離。藉此，並不一定要使刃前端51滑動至玻璃基板4之上面SF1之緣以使裂紋線CL1產生。據此，能夠避免因刃前端51切到玻璃基板4之緣而引起的問題。具體而言，使刃前端51之高度方向之控制變容易。此外，能夠抑制對刃前端51的損害。又，能夠避免玻璃基板4之緣的缺欠。 The position N3 (Fig. 7) is separated from the edge of the upper surface SF1 of the glass substrate 4. Thereby, it is not necessary to slide the blade leading end 51 to the edge of the upper surface SF1 of the glass substrate 4 to cause the crack line CL1 to be generated. According to this, it is possible to avoid the problem caused by the edge of the blade tip 51 being cut to the edge of the glass substrate 4. Specifically, the control of the height direction of the blade tip end 51 is facilitated. Further, damage to the tip end 51 of the blade can be suppressed. Moreover, the defect of the edge of the glass substrate 4 can be avoided.
在本實施形態中，亦在形成裂紋線CL1之後，刃前端51之滑動繼續。亦即，在玻璃基板4之上面SF1上，使刃前端51以第2速度從位置N3往位置N4滑動，藉此形成溝槽線TL3(圖9)。其理由係因形成裂紋線CL1之時點的預測、或在形成裂紋線CL1之瞬間使刃前端51之滑動狀態改變之反饋(feedback)的瞬時實施困難之故。因此，概率上開始形成裂紋線CL1之可能性高的時點之後，亦經過某程度繼續形成溝槽線，亦即形成溝槽線TL3，此為用於充分提高裂紋線CL1之產生機率的實用性高之方法。但在容許使用高程度之控制系統的情形時，可進行上述之反饋，於該情形，例如可將刃前端51之滑動之終點設為位置N3。 Also in the present embodiment, the sliding of the blade tip end 51 continues after the crack line CL1 is formed. That is, on the upper surface SF1 of the glass substrate 4, the blade tip end 51 is slid from the position N3 to the position N4 at the second speed, thereby forming the groove line TL3 (FIG. 9). The reason for this is that the prediction of the timing at which the crack line CL1 is formed or the instantaneous feedback of the change in the sliding state of the blade tip end 51 at the moment of forming the crack line CL1 is difficult. Therefore, after the probability that the crack line CL1 is likely to be formed at a high probability, the groove line is further formed to some extent, that is, the groove line TL3 is formed, which is useful for sufficiently increasing the probability of occurrence of the crack line CL1. High method. However, in the case where a high degree of control system is allowed, the above feedback can be performed. In this case, for example, the end point of the sliding of the blade tip end 51 can be set to the position N3.
位置N4(圖9)係與玻璃基板4之上面SF1之緣分離。藉此，無需使刃前端51滑動至玻璃基板4之上面SF1之緣。據此能夠避免因刃前端51切到玻璃基板4之緣而引起的問題。具體而言，使刃前端51之高度方向之控制變容易。此外，能夠抑制對刃前端51的損害。又，能夠避免玻璃基板4之緣的缺欠。 The position N4 (Fig. 9) is separated from the edge of the upper surface SF1 of the glass substrate 4. Thereby, it is not necessary to slide the blade front end 51 to the edge of the upper surface SF1 of the glass substrate 4. According to this, it is possible to avoid the problem caused by the edge of the blade tip 51 being cut to the edge of the glass substrate 4. Specifically, the control of the height direction of the blade tip end 51 is facilitated. Further, damage to the tip end 51 of the blade can be suppressed. Moreover, the defect of the edge of the glass substrate 4 can be avoided.
刃前端51(圖9)在位置N2與位置N4之間滑動之距離，小於刃前端51在位置N1與位置N2之間滑動之距離。藉此，提高刃前端51滑動之總距離中溝槽線TL1所占的比例。由於形成溝槽線TL1之第1速度較形成溝槽線TL2之第2速度快，因此縮短步驟所需之時間。此外，由於沿溝槽線TL1(亦即沿裂紋線CL2)之分斷面(圖11)，具有較沿溝槽線TL2(亦即沿裂紋線CL1)之分斷面更高品質之分斷面，因此能夠增加分斷面中、高品質之部分的比例。 The distance at which the blade tip end 51 (Fig. 9) slides between the position N2 and the position N4 is smaller than the distance the blade tip end 51 slides between the position N1 and the position N2. Thereby, the ratio of the groove line TL1 in the total distance in which the blade tip end 51 slides is increased. Since the first speed at which the groove line TL1 is formed is faster than the second speed at which the groove line TL2 is formed, the time required for the step is shortened. In addition, since the section along the groove line TL1 (that is, along the crack line CL2) (FIG. 11) has a higher quality division along the section line TL2 (that is, along the crack line CL1) Therefore, it is possible to increase the proportion of the high-quality part of the section.
刃前端51(圖9)在位置N2與位置N4之間滑動之距離，較佳為2mm以上，更佳為20mm以上。藉此，能夠更確實地使裂紋線CL1產生。 The distance at which the blade tip end 51 (Fig. 9) slides between the position N2 and the position N4 is preferably 2 mm or more, and more preferably 20 mm or more. Thereby, the crack line CL1 can be generated more reliably.
形成溝槽線TL2(圖4)時之刃前端51之滑動速度即第2速度，較佳為小於25mm/秒，更佳為小於5mm/秒。藉此，能夠更確實地使裂紋線CL1產生。 The sliding speed of the blade leading end 51 when the groove line TL2 (Fig. 4) is formed is the second speed, preferably less than 25 mm/sec, more preferably less than 5 mm/sec. Thereby, the crack line CL1 can be generated more reliably.
參照圖14及圖15，在本實施形態中，取代切割器具50(圖12)而使用切割器具50u。切割器具50u，取代刃前端51(圖12及圖13)而具有刃前端51u。在刃前端51u，設有頂面TD1、與包圍頂面TD1之複數個面。該等複數個面 包含側面TD2及側面TD3。頂面TD1、側面TD2及側面TD3，朝向彼此不同之方向，且彼此相鄰。刃前端51u，具有頂面TD1、側面TD2及側面TD3交會之頂點，藉由該頂點構成刃前端51u之突起部PP。此外，側面TD2及側面TD3，形成有從突起部PP起延伸之稜線部PS。 Referring to Fig. 14 and Fig. 15, in the present embodiment, the cutting tool 50u is used instead of the cutting tool 50 (Fig. 12). The cutting tool 50u has a blade tip end 51u instead of the blade tip end 51 (Figs. 12 and 13). At the blade front end 51u, a top surface TD1 and a plurality of surfaces surrounding the top surface TD1 are provided. The plural faces Includes side TD2 and side TD3. The top surface TD1, the side surface TD2, and the side surface TD3 are oriented in different directions from each other and adjacent to each other. The blade tip end 51u has a vertex where the top surface TD1, the side surface TD2, and the side surface TD3 meet, and the vertex constitutes the protrusion portion PP of the blade leading end 51u. Further, the side surface TD2 and the side surface TD3 are formed with a ridge line portion PS extending from the protrusion portion PP.
接下來，針對溝槽線TL1~TL3(圖9)形成時之切割器具50u之兩種使用方法，於以下進行說明。 Next, two methods of using the cutting tool 50u at the time of forming the groove lines TL1 to TL3 (FIG. 9) will be described below.
在第1使用方法中，首先，於上面SF1，將刃前端51u(圖14)之突起部PP按壓於位置N1(圖4)。接著，使已按壓之刃前端51u在玻璃基板4之上面SF1上滑動。刃前端51u，於上面SF1上，沿從頂面TD1朝稜線部PS之方向DA滑動。嚴格而言，使刃前端51u沿著從頂面TD1朝稜線部PS之方向投影至上面SF1上而成之方向DA滑動。方向DA，大致上是沿突起部PP附近的稜線部PS之延伸方向投影至上面SF1上而成之方向。在圖14中，方向DA，對應於從刃前端51u起延伸之軸方向AX投影至上面SF1上而成之方向。據此，刃前端51u藉由柄52而於上面SF1上拖行滑動。於玻璃基板4之上面SF1上滑動之刃前端51u之稜線部PS及頂面TD1，分別與玻璃基板4之上面SF1形成夾角角度AH1及AH2。為了容易產生裂紋線CL1(圖7)，只要以使角度AH1較小且角度AH2較大之方式調整刃前端51u之姿勢即可。 In the first method of use, first, the protrusion PP of the blade tip end 51u (FIG. 14) is pressed against the position N1 (FIG. 4) on the upper surface SF1. Next, the pressed blade tip end 51u is slid over the upper surface SF1 of the glass substrate 4. The blade leading end 51u slides on the upper surface SF1 in the direction DA from the top surface TD1 toward the ridge portion PS. Strictly speaking, the blade tip end 51u is slid in the direction DA formed by projecting from the top surface TD1 toward the ridge line portion PS onto the upper surface SF1. The direction DA is substantially a direction in which the ridge line portion PS in the vicinity of the protrusion portion PP is projected onto the upper surface SF1. In Fig. 14, the direction DA corresponds to the direction in which the axial direction AX extending from the blade leading end 51u is projected onto the upper surface SF1. Accordingly, the blade leading end 51u is slid on the upper surface SF1 by the shank 52. The ridge line portion PS and the top surface TD1 of the blade tip end 51u which slides on the upper surface SF1 of the glass substrate 4 form angle angles AH1 and AH2 with the upper surface SF1 of the glass substrate 4, respectively. In order to easily generate the crack line CL1 (FIG. 7), the posture of the blade tip end 51u may be adjusted so that the angle AH1 is small and the angle AH2 is large.
在第2使用方法中，將刃前端51u之滑動方向設為與方向DA相反之方向DB。據此，刃前端51u藉由柄52而於上面SF1上從位置N1往位置N4推進。為了容易產生裂紋線CL1(圖7)，與上述相反地，只要以使角度AH1較大且角度AH2較小之方式調整刃前端51u之姿勢即可。 In the second method of use, the sliding direction of the blade tip end 51u is set to the direction DB opposite to the direction DA. Accordingly, the blade leading end 51u is advanced from the position N1 to the position N4 on the upper surface SF1 by the shank 52. In order to easily generate the crack line CL1 (FIG. 7), contrary to the above, the posture of the blade tip end 51u may be adjusted so that the angle AH1 is large and the angle AH2 is small.
參照圖16及圖17，在本實施形態中，取代切割器具50(圖12)而使用切割器具50v。切割器具50v，取代刃前端51(圖12及圖13)而具有刃前端51v。在刃前端51v，設有圓錐面SC，該圓錐面SC具有作為突起部PP之頂點。 Referring to Fig. 16 and Fig. 17, in the present embodiment, the cutting tool 50v is used instead of the cutting tool 50 (Fig. 12). The cutting tool 50v has a blade tip end 51v instead of the blade tip end 51 (Figs. 12 and 13). At the blade tip end 51v, a conical surface SC having a vertex as the protrusion portion PP is provided.
接下來，針對溝槽線TL1~TL3(圖9)形成時之切割器具50v之使用方法進行說明。首先，於上面SF1，將刃前端51v(圖16)之突起部PP按壓於位置N1(圖4)。接著，使已按壓之刃前端51v在玻璃基板4之上面SF1上滑動。在圖16中，方向DA，對應於從刃前端51v起延伸之軸方向AX投影至上面SF1上而成之方向。據此，刃前端51v藉由柄52而於上面SF1上拖行滑動。為了容易產生裂紋線CL1(圖7)，只要圓錐面SC與上面SF1所夾之角度，如圖16所示，與方向DA之相反側(圖16中之左側)相比，於方向DA之側(圖16中之右側)較小即可。 Next, a method of using the cutting instrument 50v at the time of forming the groove lines TL1 to TL3 (FIG. 9) will be described. First, in the above SF1, the projection PP of the blade leading end 51v (Fig. 16) is pressed against the position N1 (Fig. 4). Next, the pressed blade tip end 51v is slid over the upper surface SF1 of the glass substrate 4. In Fig. 16, the direction DA corresponds to the direction in which the axial direction AX extending from the blade leading end 51v is projected onto the upper surface SF1. Accordingly, the blade leading end 51v is slid on the upper surface SF1 by the shank 52. In order to easily generate the crack line CL1 (Fig. 7), as long as the angle between the conical surface SC and the upper surface SF1 is as shown in Fig. 16, on the side opposite to the direction DA (the left side in Fig. 16), on the side of the direction DA (on the right side in Figure 16) is small.
參照圖18及圖19，在本實施形態中，在溝槽線TL1之形成與溝槽線TL2之形成中，不僅刃前端51之滑動速度，刃前端51施加於玻璃基板4之負載亦改變。具體而言，在藉由刃前端51以上述之第1速度滑動以形成溝槽線TL1時，在本實施形態中，相較於其他實施形態，使刃前端51之負載較低。另外，在藉由刃前端51以上述之第2速度滑動以形成溝槽線TL2時之負載，則與其他實施形態相同。據此，溝槽線TL1形成時之負載，小於溝槽線TL2形成時之負載。如上述之負載選擇的結果為，溝槽線TL1之寬 度小於溝槽線TL2之寬度。又，溝槽線TL1之深度小於溝槽線TL2之深度。 Referring to Fig. 18 and Fig. 19, in the present embodiment, in the formation of the groove line TL1 and the formation of the groove line TL2, not only the sliding speed of the blade tip end 51 but also the load applied to the glass substrate 4 by the blade tip end 51 is changed. Specifically, when the blade tip end 51 is slid at the first speed described above to form the groove line TL1, in the present embodiment, the load of the blade tip end 51 is lower than that of the other embodiment. Further, the load when the blade tip end 51 is slid at the second speed described above to form the groove line TL2 is the same as that of the other embodiment. Accordingly, the load at the time of formation of the trench line TL1 is smaller than the load at the time of formation of the trench line TL2. As a result of the above load selection, the width of the trench line TL1 is The degree is smaller than the width of the groove line TL2. Further, the depth of the trench line TL1 is smaller than the depth of the trench line TL2.
參照圖20及圖21，藉由在形成溝槽線TL2之步驟中滑動之刃前端51到達玻璃基板4之上面SF1上的位置N3，如箭頭R1所示，使玻璃基板4於厚度方向DT之裂紋沿溝槽線TL2從位置N3伸展至位置N2。藉此，形成裂紋線CL1。在本實施形態中，藉由如上述般將溝槽線TL1形成時之刃前端51之負載設較小，而與實施形態1不同，並不形成裂紋線CL2(圖5及圖7)。換言之，溝槽線TL1及溝槽線TL2之中僅沿溝槽線TL2形成裂紋線。 Referring to Fig. 20 and Fig. 21, the leading end 51 of the blade which slides in the step of forming the groove line TL2 reaches the position N3 on the upper surface SF1 of the glass substrate 4, and the glass substrate 4 is oriented in the thickness direction DT as indicated by an arrow R1. The crack extends from the position N3 to the position N2 along the groove line TL2. Thereby, the crack line CL1 is formed. In the present embodiment, the load of the blade tip end 51 when the groove line TL1 is formed is set to be small as described above, and unlike the first embodiment, the crack line CL2 is not formed (FIGS. 5 and 7). In other words, among the groove line TL1 and the groove line TL2, only the crack line is formed along the groove line TL2.
參照圖22及圖23，之後，以與實施形態1(圖8及圖9)同樣之理由，刃前端51之滑動從位置N3繼續至位置N4。藉此形成溝槽線TL3。溝槽線TL3形成時之負載，可與溝槽線TL2形成時之負載相同。接著在位置N4，刃前端51從玻璃基板4離開。藉此，結束刃前端51從位置N1起依序經由位置N2及位置N3而抵達位置N4之滑動步驟。 Referring to Fig. 22 and Fig. 23, the sliding of the blade tip end 51 continues from the position N3 to the position N4 for the same reason as in the first embodiment (Figs. 8 and 9). Thereby, the groove line TL3 is formed. The load at the time of forming the trench line TL3 can be the same as the load when the trench line TL2 is formed. Next, at the position N4, the blade leading end 51 is separated from the glass substrate 4. Thereby, the sliding edge end 51 is sequentially slid from the position N1 to the position N4 via the position N2 and the position N3.
接下來，沿裂紋線CL1(換言之係溝槽線TL2)及溝槽線TL1將玻璃基板4分斷。亦即，進行所謂的裂斷步驟。裂斷步驟，可藉由對玻璃基板4施加外力而進行。例如，將應力施加構件(例如，稱為「裂斷棒」之構件)以朝向玻璃基板4之上面SF1上之裂紋線CL1(圖23)之方式按壓於下面SF2上，藉此將用於使裂紋線CL1之裂紋裂開之應力施加於玻璃基板4。以該應力施加為契機，裂紋沿溝槽線TL1從位置N2朝向位置N1伸展。據此，將玻璃基板4分斷之位置，除了裂紋線CL1(換言之係溝槽線TL2)外，進一步藉由溝槽線TL1規定。 Next, the glass substrate 4 is divided along the crack line CL1 (in other words, the groove line TL2) and the groove line TL1. That is, a so-called cracking step is performed. The cracking step can be performed by applying an external force to the glass substrate 4. For example, a stress applying member (for example, a member called a "cracking rod") is pressed against the lower surface SF2 toward the crack line CL1 (FIG. 23) on the upper surface SF1 of the glass substrate 4, whereby The stress of crack cracking of the crack line CL1 is applied to the glass substrate 4. With the application of this stress, the crack extends from the position N2 toward the position N1 along the groove line TL1. Accordingly, the position at which the glass substrate 4 is divided is further defined by the groove line TL1 in addition to the crack line CL1 (in other words, the groove line TL2).
另外，關於上述以外之構成，由於與上述其他實施形態之構 成大致相同，因此針對相同或相對應之要素標記相同符號，且不重覆其說明。 In addition, the configuration other than the above is due to the configuration of the other embodiments described above. The same reference numerals are given to the same or corresponding elements, and the description thereof is not repeated.
根據本實施形態，將形成溝槽線TL1時之刃前端51之負載設更小。由此能夠抑制刃前端51之磨耗。 According to the present embodiment, the load of the blade tip end 51 when the groove line TL1 is formed is made smaller. Thereby, the wear of the blade tip end 51 can be suppressed.
另外，在上述各實施形態中，雖已針對玻璃基板4之上面SF1為平坦之情形進行了說明，但上面SF1亦可彎曲。此外，雖圖示溝槽線TL1~TL3為直線狀之情形，但溝槽線TL1~TL3亦可為曲線狀。此外，玻璃基板4之上面SF1上之刃前端51之滑動，係藉由玻璃基板4與刃前端51之間的相對移動而實施，因此只要控制玻璃基板4及刃前端51至少一方之移動便能實施。此外，雖已針對使用玻璃基板4作為脆性基板的情形進行了說明，但脆性基板亦可由玻璃以外之脆性材料作成，例如，亦可由陶瓷、矽、化合物半導體、藍寶石或石英作成。 Further, in each of the above embodiments, the case where the upper surface SF1 of the glass substrate 4 is flat has been described, but the upper surface SF1 may be curved. Further, although the groove lines TL1 to TL3 are shown as being linear, the groove lines TL1 to TL3 may be curved. Further, since the sliding of the tip end 51 of the blade SF1 on the upper surface SF1 of the glass substrate 4 is performed by the relative movement between the glass substrate 4 and the blade tip end 51, it is possible to control at least one of the glass substrate 4 and the blade tip end 51 to move. Implementation. Further, although the case where the glass substrate 4 is used as the brittle substrate has been described, the brittle substrate may be made of a brittle material other than glass, and may be made of, for example, ceramic, germanium, compound semiconductor, sapphire or quartz.
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
CL1、CL2‧‧‧裂紋線(第1及第2裂紋線) CL1, CL2‧‧‧ crack line (1st and 2nd crack lines)
N1~N3‧‧‧位置(第1~第3位置) N1~N3‧‧‧ position (1st to 3rd position)
R1、R2‧‧‧箭頭 R1, R2‧‧‧ arrows
SF1‧‧‧上面(一面) SF1‧‧‧ above (one side)
TL1、TL2‧‧‧溝槽線(第1及第2溝槽線) TL1, TL2‧‧‧ groove lines (1st and 2nd groove lines)
Claims (8)
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| JP2015191311A JP6547556B2 (en) | 2015-09-29 | 2015-09-29 | Method of dividing brittle substrate |
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| TWI607845B true TWI607845B (en) | 2017-12-11 |
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| JP (1) | JP6547556B2 (en) |
| KR (1) | KR101851070B1 (en) |
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| JP6201608B2 (en) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | Scribing method |
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- 2016-09-13 KR KR1020160118382A patent/KR101851070B1/en active IP Right Grant
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| CN101668712A (en) * | 2007-04-27 | 2010-03-10 | 旭硝子株式会社 | Device and method for making cut line in strip sheet glass, and method for producing strip sheet glass |
| TWI427046B (en) * | 2009-01-30 | 2014-02-21 | Mitsuboshi Diamond Ind Co Ltd | Broken material of the brittle material substrate |
| TW201318987A (en) * | 2011-09-28 | 2013-05-16 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
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| TW201716196A (en) | 2017-05-16 |
| CN107009524A (en) | 2017-08-04 |
| JP6547556B2 (en) | 2019-07-24 |
| KR101851070B1 (en) | 2018-04-20 |
| CN107009524B (en) | 2019-03-29 |
| JP2017064987A (en) | 2017-04-06 |
| KR20170038149A (en) | 2017-04-06 |
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