TW201634573A - 聚對苯二甲酸亞烷基酯樹脂組合物 - Google Patents

聚對苯二甲酸亞烷基酯樹脂組合物 Download PDF

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Publication number
TW201634573A
TW201634573A TW104142424A TW104142424A TW201634573A TW 201634573 A TW201634573 A TW 201634573A TW 104142424 A TW104142424 A TW 104142424A TW 104142424 A TW104142424 A TW 104142424A TW 201634573 A TW201634573 A TW 201634573A
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Taiwan
Prior art keywords
mass
component
terephthalate resin
polyalkylene terephthalate
molded article
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TW104142424A
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English (en)
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TWI680156B (zh
Inventor
Kouichi Sakata
Shinya Yamada
Nobuhiro Yamamoto
Tetsuro Yamamoto
Yoshiaki Matsuoka
Toyohisa Fujimoto
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Wintech Polymer Ltd
Kaneka Corp
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Publication of TW201634573A publication Critical patent/TW201634573A/zh
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Publication of TWI680156B publication Critical patent/TWI680156B/zh

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    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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Abstract

本發明揭示一種聚對苯二甲酸亞烷基酯樹脂組合物，其包含：(A)聚對苯二甲酸亞烷基酯樹脂；及(B)丙烯酸系核殼型高分子，其係平均粒徑為2μm以上，核層成分的含量，對核層與殼層成分的共計量為80質量%以上未滿100質量%；及一種成形品，其係成形聚對苯二甲酸亞烷基酯樹脂組合物而成。

Description

聚對苯二甲酸亞烷基酯樹脂組合物
本發明係關於聚對苯二甲酸亞烷基酯樹脂組合物。詳言之，關於在與各種形狀的構件的嵌入成形品的耐熱衝擊性及耐衝擊性均平衡佳且優良，而有用於汽車零件、電氣‧電子零件等的聚對苯二甲酸亞烷基酯樹脂組合物。
聚對苯二甲酸丁二醇酯樹脂(以下亦稱為「PBT樹脂」)等的聚對苯二甲酸亞烷基酯樹脂，由於機械性質、電性、其他的物理、化學性質優良，且加工性良好，故作為工程塑膠使用於汽車零件、電氣‧電子零件等的廣泛的用途。特別是，可良好地使用在，從外部的水分、灰塵、或衝擊等的損壞保護的目的而收容搭載電子零件的機板的盒材，或內包感測器探針或連接器接頭等的嵌入成形品等。
嵌入成形法，係將預先配置在金屬模內的金屬或無機固體所構成的構件(以下，亦稱為嵌入構件)，以射出成形的樹脂包入的成形法，在可得到有效利用嵌入構件的剛性及導電性，及樹脂的賦形性的零件上，由於步驟簡單而被廣泛地使用。但是，在聚對苯二甲酸亞烷基酯樹脂與嵌入構件之間，由於根據溫度變化的膨脹收縮率(所謂線膨脹係數)差非常大，故樹脂部較薄壁的成形品，具有壁厚變化較大的部分的成形品、 具有銳角的成形品等，有在成形後馬上破裂，或因使用中的溫度變化而破裂等的問題。又，熔融狀態的樹脂在金屬模內繞進嵌入構件匯合時，會形成稱為接合的接縫的部分，故以此作為起點發生龜裂的問題也很多。因此，嵌入成形品，現狀在其用途及形狀等有相當的限制。
另一方面，在該等的零件，要求進一步改善耐熱衝擊性，以可耐使用於汽車的引擎室內或屋外等的溫度變化嚴苛的環境下使用，可使用於作為框盒所需的耐衝擊性。對於該等要求，例如，在日本特開2007-169367號公報，揭示，對聚對苯二甲酸丁二醇酯樹脂，調合既定量熱塑性彈性體或核殼高分子作為耐衝擊改良劑的聚對苯二甲酸丁二醇酯樹脂組合物。
又，日本特開2009-155448號公報及WO2008/032636號公報，分別揭示，對聚對苯二甲酸丁二醇酯樹脂，以既定量調合，核層係以丙烯酸系橡膠構成，而具有特定粒徑的核殼型高分子，及玻璃纖維的聚對苯二甲酸丁二醇酯樹脂組合物。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開2007-169367號公報
[專利文獻2]日本特開2009-155448號公報
[專利文獻3]WO2008/032636號公報
於日本特開2007-169367號公報，使用核殼高分子，具體是核殼型丙烯酸橡膠作為耐衝擊改良劑，惟橡膠層的平均粒徑為1.0μm以下。本發明者們研究的結果，此時，包含殼層的核殼整體的平均粒徑為1μm左右的小，包含如此的粒徑小的核殼型丙烯橡膠的聚對苯二甲酸亞烷基酯樹脂組合物，雖然耐衝擊性優良，但發現耐熱衝擊性低。又，假設把殼層的比例極端地變大，而使核殼整體的平均粒徑變大，含有如此的核層的成分的比例小的核殼型丙烯橡膠的聚對苯二甲酸亞烷基酯樹脂組合物，亦發現耐熱衝擊性低。
又，日本特開2009-155448號公報與WO2008/032636號公報，雖使用平均粒徑為2μm以上的核殼型高分子，但本發明者們研究的結果，如此的核殼型高分子，不適宜選擇核層與殼層的構成時，發現無法得到充分的耐熱衝擊性的改善效果。特別是，嵌入構件的形狀使用板狀的東西的時候，即使是以一般認為對使用如日本特開2009-155448號公報的實施例的塊狀的嵌入構件有利的組合物，確認耐衝擊性可能並不充分。
本發明的實施形態，係為解決以上的課題而完成者，其目的係在於提供，可得在以各種形狀的嵌入構件的嵌入成形品，耐熱衝擊性及耐衝擊性均平衡佳且優良的對苯二甲酸亞烷基酯樹脂組合物的技術。
本發明者們為解決上述課題專心研究。結果發現使用含有平均粒徑為2μm以上，且核層成分的含量，對核層與 殼層成分共計量為80質量%以上未滿100質量%的丙烯酸系核殼型高分子的聚對苯二甲酸亞烷基酯樹脂組合物時，耐熱衝擊性及耐衝擊性均平衡佳且優良，而達至完成本發明。更具體而言，本發明的實施形態，係關於如下的聚對苯二甲酸亞烷基酯樹脂組合物及成形品。
(1)一種聚對苯二甲酸亞烷基酯樹脂組合物，其包含：(A)聚對苯二甲酸亞烷基酯樹脂；及(B)丙烯酸系核殼型高分子，其係平均粒徑為2μm以上，核層成分的含量，對核層與殼層成分的共計量為80質量%以上未滿100質量%。
(2)如(1)所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為2.5μm以上20μm以下，核層成分的含量，對核層與殼層成分的共計量為85質量%以上95質量%以下。
(3)如(1)所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為3μm以上10μm以下，核層成分的含量，對核層與殼層成分的共計量為90質量%以上92質量%以下。
(4)如(1)所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為約3μm，核層成分的含量，對核層與殼層成分的共計量為約90質量%。
(5)如(1)至(4)之任何一項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的含量，對上述(A)成分100質量部為10質量部以上50質量部以下。
(6)如(1)至(5)之任何一項所述的聚對苯二甲酸亞 烷基酯樹脂組合物，其中進一步對上述(A)成分100質量部，含有10質量部以上100質量部以下的(C)填充劑。
(7)如(1)至(6)之任何一項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中在製作下述嵌入成形品A時，滿足下述耐熱衝擊性條件A：
(嵌入成形品A)
將寬21mm×90mm×90mm、厚1.6mm的L型鐵板嵌入，樹脂部係寬25mm×70mm×70mm、厚3.6mm的L型板狀，一部分的樹脂部的最小壁厚為1mm的嵌入成形品。
(耐熱衝擊性條件A)
使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步，升溫至140℃的過程作為1個循環的耐熱衝擊試驗，成形品發生龜裂前的循環數為100以上。
(8)如(1)至(6)之任何一項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中在製作下述嵌入成形品B時，滿足下述耐熱衝擊性條件B：
(嵌入成形品B)
將寬20mm×150mm、厚1.6mm的I型鐵板嵌入，樹脂部係寬25mm×120mm、厚4mm的I型板狀，一部分的樹脂部的最小壁厚為1mm的嵌入成形品。
(耐熱衝擊性條件B)
使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步，升溫至140℃的過 程作為1個循環的耐熱衝擊試驗，成形品發生龜裂前的循環數為40以上。
(9)一種成形品，其係成形(1)至(8)之任何一項所述的聚對苯二甲酸亞烷基酯樹脂組合物而成。
(10)如(9)所述的成形品，其係將上述聚對苯二甲酸亞烷基酯樹脂組合物，及嵌入成形金屬或無機固體的嵌入構件而成的嵌入成形品。
(11)如(10)所述的成形品，其中上述嵌入構件，係板狀的電性連接導體。
(12)如(11)所述的成形品，其中上述板狀的電性連接導體的嵌入構件，在以與板狀的平面的長邊方向直角的剖面，寬度的最大值對厚度的最大值的比為2以上。
根據本發明的實施形態，可得可與各種形狀的嵌入構件的嵌入成形品，耐熱衝擊性及耐衝擊性均平衡佳且優良的聚對苯二甲酸亞烷基酯樹脂組合物。
10‧‧‧嵌入成形品
12、18、22‧‧‧樹脂部
14‧‧‧鐵芯
16‧‧‧L型板狀構件
20‧‧‧I型板狀構件
第1圖係表示在實施例的耐熱衝擊性評估所製造的角柱狀的嵌入構件的嵌入成形品的立體圖(一部分透視圖)。
第2圖係表示第1圖所示嵌入成形品的圖，(b)係上面圖，(a)係沿著(b)的IIa-IIa線的剖面圖。
第3圖係表示在實施例的耐熱衝擊性評估所製造的板狀(L型)嵌入構件的上面圖。
第4圖係表示使用第3圖所示板狀(L型)嵌入構件的嵌入成形品的圖，(a)係上面圖，(b)係沿著(a)的IVb-IVb線的剖面圖，(c)係沿著(a)的IVc-VIVc線的剖面圖。
第5圖係表示在實施例的耐熱性評估所製造的板狀(I型)嵌入構件的上面圖。
第6圖係表示使用第5圖所示的板狀(I型)嵌入構件的嵌入成形品之圖，(b)係沿著(a)的VIb-VIb線的剖面圖，(c)係沿著(a)的VIc-VIc線的剖面圖。
以下詳細說明關於本發明的實施形態。惟本發明並非限定於以下的實施形態。
<聚對苯二甲酸亞烷基酯樹脂組合物>
本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物，含有：(A)聚對苯二甲酸亞烷基酯樹脂；及(B)丙烯酸系核殼型高分子，其係平均粒徑為2μm以上，核層成分的含量，對核層與殼層成分的共計量為80質量%以上未滿100質量%。以下說明關於包含在聚對苯二甲酸亞烷基酯樹脂組合物中的各成分
[(A)聚對苯二甲酸亞烷基酯樹脂]
關於本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物的基礎樹脂的(A)聚對苯二甲酸亞烷基酯樹脂，係以二羧氧化合物及/或其酯形成性衍生物為主成分的二羧酸成分，與以二醇化合物及/或其酯形成性衍生物為主成分的二醇成分反應而得之熱塑性聚酯樹脂之中，作為二羧酸成分以對苯二甲酸 及/或其酯形成性衍生物為主成分，作為二醇成分以亞烷基二醇及/或其酯形成性衍生物為主成分者。
聚對苯二甲酸亞烷基酯樹脂，亦可使用在主成分以外的二羧酸成分或二醇成分，進一步將其他可共聚合的單體，組合羥羧酸成分、內脂成分等(以下，有稱為共聚合性單體之情形)之共聚酯。
主成分以外的二羧酸成分，可舉例如，脂肪族二羧酸(例如琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二羧酸、十二烷二羧酸、十六烷二羧酸、二聚酸等的C4-40左右的二羧酸、以C4-14左右的二羧酸為佳)；脂環族二羧酸(例如六氫鄰苯二甲酸、六氫間苯二甲酸、六氫對苯二甲酸、5-雙環庚烯-2,3-二羧酸等的C4-40左右的二羧酸，以C8-12左右的二羧酸為佳)；對苯二甲酸以外的芳香族二羧酸(例如鄰苯二甲酸、間苯二甲酸、甲基間苯二甲酸、甲基對苯二甲酸、2,6-萘二羧酸等的萘二羧酸、4,4'-聯苯二羧酸，4,4'-二苯氧基醚二羧酸、4,4'-二氧安息香酸、4,4'-二苯基甲烷二羧酸、4,4'-二苯酮二羧酸等的C8-16左右的二羧酸)，或該等的衍生物(例如，低級烷基酯、芳基酯、酸酐等的可形成酯的衍生物)。適合與對苯二甲酸組合使用的二羧酸成分，可舉間苯二甲酸、萘二羧酸等，亦可將該等組合二種以上使用。惟，作為共聚合性單體的二羧酸成分全體，以50莫耳%以上為佳，以80莫耳%以上更佳，特別佳的是90莫耳%以上為芳香族二羧氧化合物。再者，亦可按照需要併用偏苯三酸、均苯四甲酸等的多元羧酸或其酯形成衍生物(醇酯等)等。併用如此的多官能性 化合物，則亦可得分枝狀的聚對苯二甲酸亞烷基酯樹脂。
主成分以外的二醇成分，可舉脂肪族烷二醇(例如，乙二醇、三亞甲基二醇、丙二醇、1,4-丁二醇、1,3-丁二醇、新戊二醇、己二醇、辛二醇、癸二醇等的C2-12左右的脂肪族二醇、以C2-10左右的脂肪族二醇之中，以使用於作為主成分者以外的脂肪族烷二醇為佳)；聚氧亞烷基二醇(具有複數C2-4左右的氧亞烷基單位的二醇，例如二甘醇、二丙二醇、二-四亞甲基二醇、三乙二醇、三丙二醇、聚四亞甲基二醇等)；脂環族二醇(例如，1,4-環己烷二醇、1,4-環己烷二甲醇、氫化雙酚A等)等。又，亦可併用對苯二酚、間苯二酚、雙酚、2,2-雙(4-羥基苯基)丙烷、2,2-雙-(4-(2-羥基乙氧基)苯基)丙烷、二甲苯二醇等的芳香族二醇。惟，作為共聚合性單體的二醇成分全體的，以50莫耳%以上為佳，以80莫耳%以上更佳，特別佳的是90莫耳%以上為亞烷基二醇。再者，亦可按照需要，併用甘油、三羥甲基丙烷、三羥甲基乙烷、異戊四醇等的多元醇或其酯形成性衍生物。併用如此的多官能性化合物，則亦可得到分枝狀的熱塑性聚酯樹脂。
氧羧酸(或氧羧酸成分或氧羧酸類)，可舉例如，氧安息香酸、氧萘酸、羥基苯基醋酸、二醇酸、氧己酸等的氧羧酸或該等的衍生物等。內酯，可舉丙內酯、丁內酯、戊內酯、己內酯(例如，ε-己內酯等)等的C3-12內酯等。
再者，在於共聚酯，共聚合性單體的比例，例如可由0.01莫耳%以上30莫耳%以下左右的範圍選擇，通常為1莫耳%以上25莫耳%以下左右，以3莫耳%以上20莫耳%以下 左右為佳，以5莫耳%以上15莫耳%以下左右更佳。又，組合同聚酯與共聚酯使用時，同聚酯與共聚酯的比例，以共聚合性單體的比例，對全單體係0.01莫耳%以上30莫耳%以下(以1莫耳%以上25莫耳%以下左右為佳，以3莫耳%以上20莫耳%以下左右更佳，以5莫耳%以上15莫耳%以下左右特別佳)的範圍，通常可由前者/後者=99/1~1/99(質量比)，以95/5~5/95(質量比)為佳，以90/10~10/90(質量比)左右的範圍選擇。
在較佳的聚對苯二甲酸亞烷基酯樹脂，包含以對苯二甲酸亞烷基酯為主成分(例如，50~100莫耳%、以75~100莫耳%左右)的同聚酯或共聚酯[例如，聚對苯二甲酸乙二醇酯(PET)、聚對苯二甲酸三亞甲基酯(PTT)、聚對苯二甲酸丁二醇酯(PBT)等的聚C2-4對苯二甲酸亞烷基酯)的同聚酯；在以苯二甲酸亞烷基酯單位為主成分的共聚合成分含有間苯二甲酸亞烷基酯單位的共聚酯、以對苯二甲酸亞烷基酯單位為主成分的共聚合成分含有萘二甲酸亞烷基酯單位的共聚酯]，該等可以1種單獨或組合2種以上使用。
特別佳的聚對苯二甲酸亞烷基酯樹脂，係包含對苯二甲酸乙二醇酯、對苯二甲酸三亞甲基酯、對苯二甲酸四亞甲基酯等的C2-4對苯二甲酸亞烷基酯80莫耳%以上(特別是以90莫耳%以上)的同聚酯樹脂或共聚酯樹脂(例如聚對苯二甲酸乙二醇酯樹脂、聚對苯二甲酸三亞甲基酯樹脂、聚對苯二甲酸丁二醇酯樹脂、間苯二甲酸變性聚對苯二甲酸乙二醇酯樹脂、間苯二甲酸變性聚對苯二甲酸三亞甲基酯樹脂、間苯二甲酸變性聚對苯二甲酸丁二醇酯樹脂、萘二羧酸變性聚對苯二甲酸乙 二醇酯樹脂、萘二羧酸變性聚對苯二甲酸三亞甲基酯樹脂、萘二羧酸變性聚對苯二甲酸丁二醇酯樹脂等)。
該等之中，以聚對苯二甲酸乙二醇酯樹脂、聚對苯二甲酸丁二醇酯樹脂為佳，特別是以聚對苯二甲酸丁二醇酯樹脂為佳。
聚對苯二甲酸亞烷基酯樹脂的末端羧基量，只要不阻礙本發明的效果，並無特別限定。聚對苯二甲酸亞烷基酯樹脂的末端羧基量，以30meq/kg以下為佳，以25meq/kg以下更佳。聚對苯二甲酸亞烷基酯樹脂的末端羧基量過多，則有損及耐水解性的可能性。
聚對苯二甲酸亞烷基酯樹脂的固有黏度(IV)在不阻礙本發明的效果的範圍，並無特別限定。聚對苯二甲酸亞烷基酯樹脂的固有黏度，以0.6~1.3dL/g為佳，以0.7~1.2dL/g更佳。使用該範圍的固有黏度的聚對苯二甲酸亞烷基酯樹脂時，所得聚對苯二甲酸亞烷基酯樹脂組合物將成成形性特別優良者。又，亦可混合具有不同的固有黏度的聚對苯二甲酸亞烷基酯樹脂，調整固有黏度。例如，藉由混合固有黏度為1.0dL/g的聚對苯二甲酸亞烷基酯樹脂，與固有黏度為0.8dL/g的聚對苯二甲酸亞烷基酯樹脂，製作固有黏度為0.9dL/g的聚對苯二甲酸亞烷基酯樹脂。聚對苯二甲酸亞烷基酯樹脂的固有黏度(IV)，例如，可於鄰氯酚中，以溫度35℃的條件測定。
再者，聚對苯二甲酸亞烷基酯樹脂，亦可使用市售品，亦可使用將二羧酸成分或其反應性衍生物、二醇成分或其反應性衍生物、及按照必要可共聚合的單體，以慣用的方 法，例如酯交換、直接酯化法等共聚合(聚縮合)而製造者。
[(B)丙烯酸系核殼型高分子]
核殼型高分子，係具有包含核層(核部)，及將該核層(核層的表面)的一部分或全部披覆的殼層的多層架構的高分子。在核殼型高分子，較佳的是核層及殼層之中的任意一方，係以橡膠成分(軟質成分)構成，另一方的成分由硬質成分構成。
核層，通常，以橡膠成分構成的情形為多，在本發明的實施形態，使用丙烯酸系橡膠為佳。橡膠成分的玻璃轉移溫度，例如，以0℃以下(例如，-10℃以下)為佳，以-20℃以下(例如-180~-25℃左右)更佳，進一步以-30℃以下(例如-150~-40℃左右)為佳。
可使用於作為橡膠成分的丙烯酸系橡膠，係以丙烯酸系單體[特別是，丙烯酸烷基酯(丙烯酸丁酯等的丙烯酸C1~C12烷基酯，以丙烯酸C1~C8烷基酯為佳，以丙烯酸C2~C6烷基酯更佳)等的丙烯酸酯]為主成分的高分子。丙烯酸系橡膠，可為丙烯酸系單體單獨或共聚物(丙烯酸系單體的相互的共聚物、丙烯酸系單體與其他的含有不飽和鍵結的單體的共聚物等)，亦可為丙烯酸系單體(及其他的含有不飽和鍵結的單體)的架橋性單體的共聚物。
架橋性單體，可舉例如(甲基)丙烯酸系單體{多官能性(甲基)丙烯酸酯[例如，二(甲基)丙烯酸丁二醇酯等的(甲基)丙烯酸亞烷基酯；二(甲基)丙烯酸乙二醇酯、二(甲基)丙烯酸丁二醇酯、聚(或寡聚)(甲基)丙烯酸乙二醇酯(二(甲基)丙烯酸二甘醇酯、二(甲基)丙烯酸三乙二醇等)、三(甲基)丙烯酸甘油 酯、三羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二(甲基)丙烯酸異戊四醇酯、四(甲基)丙烯酸異戊四醇酯、四(甲基)丙烯酸二異戊四醇酯、六(甲基)丙烯酸二異戊四醇酯等的(多)羥基烷聚(甲基)丙烯酸酯等]的乙烯基系單體(例如，(甲基)丙烯酸乙烯酯、二乙烯基苯等)；(甲基)丙烯酸縮水甘油酯等}、具有聚合性不飽和鍵結的水解縮合性化合物[例如，具有(甲基)丙烯醯基之矽烷偶合劑(3-三甲氧基丙基(甲基)丙烯酸酯等的(甲基)丙烯醯氧烷基三烷氧基矽烷等)等]、丙烯酸系化合物(例如，(甲基)丙烯酸烯丙酯、馬來酸二烯丙酯、富馬酸二烯丙酯、依康酸二烯丙酯、馬來酸單烯丙酯、富馬酸單烯丙酯、(異)氰脲酸三烯丙酯等)等。該等的架橋性單體，可以單獨或組合2種以上使用。
在丙烯酸系橡膠，丙烯酸酯(特別是，烷基丙烯酸酯)的比例，對丙烯酸系橡膠全體，例如，以50~100質量%為佳，以70~99質量%更佳，進一步以80~98質量%左右為佳。又，在丙烯酸系橡膠，架橋性單體的比例，對丙烯酸酯100質量部，例如，以0.1~10質量部為佳，以0.2~5質量部更佳，進一步以0.3~5質量部左右為佳。
再者，核層，可係以丙烯酸系橡膠為主成分之情形，亦可進一步包含非橡膠成分(例如，後述的硬質樹脂成分)。
核層的構造，可為均勻的構造，亦可為不均勻的構造(義式臘腸構造等)。
在核殼型高分子，殼層，通常，多以硬質樹脂成 分(或玻璃狀樹脂成分)構成。硬質樹脂成分的玻璃轉移溫度，例如可由0℃以上(例如，20℃以上)的範圍選擇，例如30℃以上(例如30~300℃左右)，以50℃以上(例如60~250℃左右)為佳，進一步以70℃以上(例如80~200℃左右)為佳。
如此的硬質樹脂成分，通常，以乙烯基系聚合物(乙烯基系單體的聚合物)構成。在乙烯基系聚合物(樹脂)，乙烯基系單體(乙烯基系單體)，只要是可將乙烯基系聚合物調整為如上所述的玻璃轉移溫度，並無特別限定，例如在甲基丙烯酸系單體[例如，甲基丙烯酸烷基酯(例如，甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯、甲基丙烯酸己酯，甲基丙烯酸-2-乙基己基酯等的甲基丙烯酸C1~C20烷基酯，以甲基丙烯酸C1~C10烷基酯為佳，以甲基丙烯酸C1~C6烷基酯更佳)、甲基丙烯酸芳酯(甲基丙烯酸苯酯等)、甲基丙烯酸環烷酯(甲基丙烯酸環己酯等)等的甲基丙烯酸酯等]等之外，可舉上述例示之單體[例如，丙烯酸系單體、芳香族乙烯基系單體(例如，苯乙烯等)、烯烴系單體、氰化乙烯基系單體(例如(甲基)丙烯腈等)]等。該等的乙烯基系單體，可以單獨或組合2種以上使用。乙烯基系單體，大多係以選自由甲基丙烯酸系單體、芳香族乙烯基系單體、氰化乙烯基系單體之至少1種[特別是，至少為甲基比興酸酯(甲基丙烯酸甲酯等的甲基丙烯酸烷酯等)]為聚合成分的聚合物。
殼層，只要有將核層的一部分或全部披覆，可為單一的層，亦可係以複數的層形成。
在核殼型高分子，核層成分對核層與殼層共計的 比例，以80質量%以上未滿100質量%為佳，以85質量%以上95質量%以下(例如約90質量%)更佳，進一步以90質量%以上92質量%以下為佳。核層的比例超過80質量%，則容易得到充分的耐熱衝擊性的改善效果。核層的比例在95質量%以下，則在製造核殼型高分子的難易度方面有利，故在取得性及品質穩定性方面較佳。再者，核層與殼層的各成分的比例，可由1H NMR圖譜的來自各構成成分的波峰部的積分值算出的分析確認，但通常會大致與製造核殼型高分子時的各單體調合比例一致，故可以此作為基礎算出。
在本發明的實施形態，(B)核殼型高分子，係在殼層成分具有反應性官能基時，由於加上樹脂組合物的耐衝擊性及耐熱衝擊性優良，耐水解性特別優良而佳。
上述反應性官能基的種類，可舉環氧基、羥基、羧基、烷氧基、異氰酸酯基、酸酐基、酸氯化物基等，其中以環氧基為佳。上述反應性官能基的量，對核殼型高分子100g，以1mmol以上40mmol以下為佳，再者以2mmol以上20mmol以下更佳，又進一步以3mmol以上15mmol以下為佳。藉由具有1mmol以上的官能基，耐衝擊性有更優良的趨勢。另一方面，在40mmol以下時，由於樹脂組合物的流動性有不容易下降的趨勢而佳。
在本發明的實施形態，(B)核殼型高分子的含量，對(A)聚對苯二甲酸亞烷基酯樹脂100質量部，以5質量部以上50質量部以下為佳，以10質量部以上30質量部以下更佳。藉由使之在於該範圍，可不大大地損及所得聚對苯二甲酸亞烷 基酯樹脂組合物的耐水解性或流動性，而可改善耐熱衝擊性。
在本發明的實施形態，(B)核殼型高分子的平均粒徑，以2μm以上為佳，以2.5μm以上20μm以下(例如約3μm左右)更佳，進一步以3μm以上10μm以下為佳。平均粒徑在2μm以上時，容易得到充分的耐熱衝擊性改善效果，可平衡良好地提升耐熱衝擊性及耐衝擊性。平均粒徑在20μm以下時，相對較容易製造核殼型高分子，在製造成本面較佳。又，平均粒徑在20μm以下，則所得聚對苯二甲酸亞烷基酯樹脂組合物，耐水解性優良而特別佳。再者，在本發明所謂「平均粒徑」係指將乳膠狀態的核殼型高分子，使用日機裝株式會社製MICROTRAC UPA150測定之體積平均粒徑(μm)。
如此的核殼型高分子，特別是，殼層係以硬質成分構成時，由於藉由硬質成分的殼使粒徑穩定化，故可抑制在擠出時或成形時的熔融混練條件的聚對苯二甲酸亞烷基酯樹脂組合物中的分散狀態(平均粒徑)的離散，對其他的彈性體較有利。
[(C)填充劑]
本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物，亦可含有(C)填充劑。藉由含有(C)填充劑，可提升機械特性。又，藉由減低聚對苯二甲酸亞烷基酯樹脂組合物的成形收縮率或線膨脹係數，可期待進一步提升耐熱衝擊性。
(C)成分的填充劑，包含纖維狀填充劑[例如，玻璃纖維、石棉纖維、碳纖維、二氧化矽纖維、氧化鋁纖維、矽酸鋁纖維、氧化鋯纖維、氮化硼纖維、氮化矽纖維、硼纖維、鈦 酸鉀纖維、碳化矽纖維、鬚晶(碳化矽、氧化鋁、氮化矽等的鬚晶)等的無機質纖維，或以聚醯胺或氟樹脂等形成的有機質纖維等]；板狀填充劑[例如，滑石、雲母、玻璃片、石墨等]；粉狀填充劑[例如，玻璃珠、玻璃粉、研磨纖維(玻璃等的研磨纖維)、矽酸鈣岩礦等]，該等填充劑之中，以玻璃系填充劑(玻璃纖維、玻璃片、玻璃珠等)、滑石、雲母、矽酸鈣岩礦等為佳，其中玻璃纖維，由取得性、強度及剛性方面，可良好地使用。又，板狀或粉狀的填充劑，由抑制聚對苯二甲酸亞烷基酯樹脂組合物的成形收縮率及線膨脹係數的異向性方面，可良好地使用。在使用該等的填充劑，可按照必要使用習知的表面處理劑。
使用纖維狀填充劑作為(C)成分時，其形狀雖無特別限定，例如長度，以100μm~5mm為佳，以500μm~3mm左右更佳，直徑例如，以1~50μm為佳，以3~30μm左右更佳。又，使用板狀填充劑或粉狀填充劑時，其平均粒徑，並無特別限定，例如以0.1~100μm為佳，以0.1~50μm左右更佳。該等的(C)填充劑，可以1種單獨或組合2種以上使用。
(C)成分的填充劑的添加量，對(A)聚對苯二甲酸亞烷基酯樹脂100質量部，以10質量部以上100質量部以下為佳，以20質量部以上90質量部以下更佳，進一步以30質量部以上80質量部以下(例如40~70質量部)左右為佳。藉由使之在該範圍，可不大大地損及樹脂組合物的流動性，而可提升機械特性。
[其他的成分]
於本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物，在不阻礙本發明的效果的範圍，為賦予按照其目的所期望的特性，可調合一般添加於熱塑性樹脂及熱硬化性樹脂之習知的物質，例如，防止氧化劑、紫外線吸收劑等的穩定劑、耐水解改善劑(例如，環氧樹脂等)、防止帶電劑、難燃劑、難燃助劑、滴下防止劑、染料或顏料等的著色劑、脫模劑、潤滑劑、結晶化促進劑、結晶核劑等。
[調製方法]
本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物，以可使用先前一般用於調製樹脂組合物的設備及方法簡單地調製。例如，將各成分混合之後，藉由單軸或雙軸的擠出機混練，擠出調製膠粒，之後，成形的方法；一旦調製組成不同的膠粒，將該膠粒以既定量混合供於成形，成形後得到目標組成的成形品的方法；將各成分的1種或2種以上直接投入成形機的方法等，均可使用。
<成形品>
本發明的實施形態的成形品，係成形本發明的聚對苯二甲酸亞烷基酯樹脂組合物而成。成形方法，並無特別限定，可採用習知的成形方法。關於本發明的實施形態的成形品，較佳的是將本發明的聚對苯二甲酸亞烷基酯樹脂組合物與由金屬或無機固體組成的嵌入構件嵌入成形而成的嵌入成形品。金屬及無機固體，並無特別限定，金屬，可例示鋁、鎂、不鏽鋼、銅等，形成於樹脂基板上的電子電路等的金屬導體部亦包含於此。無機固體，可例示陶瓷等。嵌入成形，可以習知的方法進 行。
如已所述，使用板狀的電性連接導體作為嵌入構件時，在先前有耐熱衝擊性不充份的情形，但在本發明的實施形態的成形品，即使在如此的情形亦可得到優良的耐熱衝擊性。如此的板狀的電性連接導體，具體可舉，在垂直於板狀的平面的長邊方向上的剖面，寬度的最大值對厚度的最大值的比為2以上者(例如，匯流條等的配線材料)。
再者，在本發明的實施形態的板狀的電性連接導體，厚度平均以3mm以下為佳，平均以2mm以下更佳。另一方面，板狀的電性連接導體的厚度的下限值，並無特別限定，通常為0.1mm。
又，本發明的實施形態的成形品(嵌入成形品的態樣)，披覆板狀電性連接導體的樹脂部的厚度，並無特別限定，通常為平均3mm以下，平均以2mm以下為佳。樹脂構件的厚度的下限值，並無特別限定，通常為0.1mm。在此，所謂披覆板狀的電性連接導體的樹脂部的厚度，係指由嵌入成形品的表面，對正下面的電性連接導體的表面的垂直方向的長度。又，電性連接導體，係複數在之間夾著樹脂部的層而嵌入在1個嵌入成形品中時，此時的樹脂部的厚度，可係由嵌入成形品的表面正下面的(最外層的)電性連接導體的厚度，與夾於各電性連接導體間的樹脂部之層的厚度，惟該等的樹脂部的厚度之中，只要任意一個在上述樹脂部的厚度的範圍內時，期望考慮在該樹脂部的耐熱衝擊性。
樹脂部的厚度，與電性連接導體的厚度的比，樹脂部的比 例極端地高(電性連接導體過薄)時，有因樹脂部的收縮使電性連接導體變形之虞，樹脂部的比例極端地低(樹脂部過薄)時，由有因樹脂的流動性不足而成形不良之虞的觀點，樹脂部：電性連接導體=1：8~8：1為佳，以1：5~5：1更佳。
本發明的實施形態的聚對苯二甲酸亞烷基酯樹脂組合物、及使用L型或I型的嵌入構件製作嵌入成形品時，將嵌入構件具體的形狀，及對應該形狀的耐熱衝擊性條件之例，表示如下。
(1)L型嵌入構件
在製作下述嵌入成形品A時，滿足下述耐熱衝擊性條件A。
(嵌入成形品A)
將寬度21mm×90mm×90mm，厚度1.6mm的L型鐵板嵌入，樹脂部為寬度25mm×70mm×70mm，厚度3.6mm的L型板狀，一部分的樹脂部的最小壁厚為1mm的嵌入成形品。
(耐熱衝擊性條件A)
使用冷熱衝擊試驗機，以140℃加熱1時間30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步升溫至140℃的過程作為1循環的耐熱衝擊試驗，在成形品發生龜裂的循環數為100以上(以120以上更佳，以150以上特別佳)。
(2)I型嵌入構件
在製作下述嵌入成形品B時，滿足下述耐熱衝擊性條件B。
(嵌入成形品B)
將寬度20mm×150mm，厚度1.6mm的I型鐵板嵌入，樹脂部為寬度25mm×120mm，厚度4mm的I型板狀，一部分的樹 脂部的最小壁厚為1mm的嵌入成形品。
(耐熱衝擊性條件B)
使用冷熱衝擊試驗機，以140℃加熱1時間30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步升溫至140℃的過程作為1循環的耐熱衝擊試驗，在成形品發生龜裂的循環數為40以上(以50以上為佳，以60以上特別佳)。
[實施例]
以下，以實施例更加詳細地說明本發明，惟本發明不應限定於該等。
<材料>
．(A)聚對苯二甲酸亞烷基酯樹脂
Wintech Polymer(股)製PBT樹脂，固有黏度0.69dl/g，末端羧基量24meq/kg
．(B)丙烯酸系核殼型高分子
B-1：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為90質量%的丙烯酸系核殼型高分子，平均粒徑3μm
B-2：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為90質量%的丙烯酸系核殼型高分子，平均粒徑20μm
B-3：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為90質量%的丙烯酸系核殼型高分子，平均粒徑30μm
B-4：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使 用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑0.1μm
B-5：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑0.2μm
B-6：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑0.5μm
B-7：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑1.4μm
B-8：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑3.3μm
B-9：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯聚合物(乙烯基系共聚物)，核層的比例為80質量%的丙烯酸系核殼型高分子，平均粒徑10.5μm
B-10：核層使用丙烯酸丁酯聚合物(丙烯酸系橡膠)，殼層使用甲基丙烯酸甲酯/甲基丙烯酸縮水甘油酯共聚物(乙烯基系共聚物)，核層的比例為90質量%，甲基丙烯酸甲酯與甲基丙烯酸縮水甘油酯的比例為9質量%：1質量%的丙烯酸系核殼型高分子，平均粒徑3μm
．(C)玻璃纖維
日本電氣硝子(股)製，產品名：T-187
．氧化防止劑
BASF日本(株式會社)製，產品名：Irganox1010
．耐水解性改善劑
三菱化學(股)製環氧樹脂，產品名：環氧樹脂JER005K
<實施例1~4，比較例1~6>
對(A)聚對苯二甲酸亞烷基酯樹脂100質量部，將各成份以第1表所示比例混合之後，使用30mmφ的雙軸擠出機(日本製鋼所TEX-30)，料管溫度260℃，吐出量15kg/h，螺桿旋轉數150rpm，熔融混練擠出，得到由聚對苯二甲酸亞烷基酯樹脂組成的膠粒。接著，由該膠粒以射出成形製作各種試驗片，進行下述物性評估。將結果一併示於第1表。
[熔融黏度]
將上述膠粒以140℃乾燥3小時之後，遵照ISO11443，使用Capilograph 1B(東洋精密機械製造所公司製)，爐體溫度260℃，毛細管φ1mm×20mmL，以剪切速度1000sec-1測定熔融黏度。
[抗拉強度及抗拉斷裂應變]
將上述膠粒以140℃乾燥3小時之後，以樹脂溫度260℃，模具溫度80℃，射出時間15秒，冷卻時間15秒，射出成形ISO3167抗拉試驗片，遵照ISO527-1,2，測定抗拉強度及抗拉斷裂應變。
[耐衝擊性(夏氏衝擊強度)]
將上述膠粒以成形溫度260℃，模具溫度80℃射出成形，製作夏氏衝擊試驗片，遵照ISO179/1eA，以23℃測定夏氏衝 擊強度。
[耐熱衝擊性(角柱狀構件)]
使用上述膠粒，以樹脂溫度260℃，模具溫度65℃，射出時間25秒，冷卻時間10秒，對試驗片成形用模具(於長22mm、寬22mm、高28mm的角柱內部，嵌入長14mm、寬14mm、高24mm的鐵芯的模具)，使一部分的樹脂部的最小壁厚成1mm，嵌入射出成形，製造嵌入成形品。將製造的嵌入成形品示於第1圖、第2圖。第1圖所示嵌入成形品10，係鐵芯14嵌入在樹脂部12的嵌入成形品的立體圖，第2圖係該嵌入成形品的(a)剖面圖(沿(b)的IIa-IIa線的剖面圖)，(b)係上面圖。鐵芯10，係如第2圖(a)所示，由底面24~26mm的部分為圓柱。又，如第2圖(b)所示，鐵芯14的周圍的樹脂部12的最小壁厚為1mm。再者，填充樹脂的針點澆口，係在第2圖(a)以箭頭表示的樹脂部底面的中央位置。對所得嵌入成形品，使用冷熱衝擊試驗機，進行以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步升溫至140℃的過程為1循環的耐熱衝擊試驗，測定直到成形品發生龜裂的循環數，將5個樣品的平均破壞壽命作為耐熱衝擊性的評估。
[耐熱衝擊性(L型板狀構件)]
使用上述膠粒，以樹脂溫度260℃，模具溫度65℃，射出時間25秒，冷卻時間10秒，對試驗片成形用模具(於寬度25mm×70mm×70mm，厚度3.6mm的L型板狀構件內部，嵌入寬21mm×90mm×90mm，厚度1.6mm(剖面的寬/厚比為13.1)的L型鐵板的模具)，使一部分的樹脂部的最小壁厚成1mm，嵌 入射出成形，製造嵌入成形品。將使用的L型板狀構件、及製造的嵌入成形品示於第3圖、第4圖。第3圖係表示L型板狀構件16的上面圖，第4圖係表示L型板狀構件16嵌入在樹脂部18的嵌入成形品的上面圖((a))及剖面圖((b)，(c))。L型板狀構件的兩端附近的兩個孔係在模具內用於嵌入針而固定者，又，第4圖所示樹脂部18的孔，係以模具內的針壓附固定L型板狀構件16，以此狀態填充樹脂時，樹脂繞過針而流動所形成。又，第4圖(a)，將填充樹脂的側澆口(寬度：4mm，厚度：3mm)的位置以虛線表示，該側澆口係位在由樹脂部18的右側面下端部的上方1mm。對所得嵌入成形品，使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步升溫至140℃的過程為1循環的耐熱衝擊試驗，測定直到成形品發生龜裂的循環數，將5個樣品的平均破壞壽命作為耐熱衝擊性的評估。
[耐熱衝擊性(I型板狀構件)]
使用上述膠粒，以樹脂溫度260℃，模具溫度65℃，射出時間25秒，冷卻時間10秒，對試驗片成形用模具(於寬度25mm×120mm，厚度4mm的I型板狀構件內部，嵌入寬度20mm×150mm，厚度1.6mm(剖面的寬/厚比為12.5)的I型鐵板的模具)，使一部分的樹脂部的最小壁厚成1mm，嵌入射出成形，製造嵌入成形品。將使用的I型板狀構件、及製造的嵌入成形品示於第5圖、第6圖。第5圖係表示I型板狀構件20的上面圖，第6圖係表示I型板狀構件20嵌入在樹脂部22的嵌入成形品的上面圖((a))及剖面圖((b)，(c))。I型板狀構件的 的兩端附近的兩個孔係在模具內用於嵌入針而固定者，又，第6圖所示樹脂部22的孔，係以模具內的針壓附固定I型板狀構件20，以此狀態填充樹脂時，樹脂繞過針而流動所形成。又，在第6圖(a)，將填充樹脂的側澆口(寬度：4mm，厚度：3mm)的位置以虛線表示，該側澆口係位在由樹脂部22的下側面左端部的右邊1mm。對所得嵌入成形品，使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步升溫至140℃的過程為1循環的耐熱衝擊試驗，測定直到成形品發生龜裂的循環數，將5個樣品的平均破壞壽命作為耐熱衝擊性的評估。
[耐水解性]
將使用於抗拉強度的測定的試驗片，以壓力釜試驗機，以121℃，100%RH的條件處理96小時，在中途每24小時測定處理後的抗拉強度，求處理前後的保持率。
[第1表]
由第1表可知，藉由使用平均粒徑為2μm以上，且核層成分對核層與殼層成分共計超過80質量%的丙烯酸系核殼型高分子，可不大大地損及耐衝擊性地大幅度提升耐熱衝擊性(實施例1~4)。再者，平均粒徑未滿2μm時，並不一定對耐熱衝擊性有利(比較例1~3)。又，即使平均粒徑大，但核層 的成分在80質量%以下時(比較例4~6)，在角柱型嵌入構件，不容易看到核層的成分超過80質量%時的差，在板狀嵌入構件，可以看到顯著的差。再者，由平均粒徑變得過大則可預測耐熱衝擊性、耐衝擊性及耐水解性會有下降的傾向，故難以預測可得藉由特定本發明的範圍所得的效果。
又，丙烯酸系核殼型高分子係具有反應性官能基時，所得聚對苯二甲酸亞烷基酯樹脂組合物，加上耐衝擊性與耐熱衝擊性優良，可成為耐水解性特別優良者(實施例4)。
本發明係主張以日本專利申請編號2014-265294為優先權，且其全部內容以參考資料包含於此。
記載於本說明書的所有文獻、專利申請、及技術規格，係以參考資料包含於此之各個文獻、專利文獻、及技術規格，與具體且各個記載的情形同程度，以參考資料包含於本說明書。

Claims (12)

  1. 一種聚對苯二甲酸亞烷基酯樹脂組合物，包含：(A)聚對苯二甲酸亞烷基酯樹脂；及(B)丙烯酸系核殼型高分子，其係平均粒徑為2μm以上，核層成分的含量，對核層與殼層成分的共計量為80質量%以上未滿100質量%。
  2. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為2.5μm以上20μm以下，核層成分的含量，對核層與殼層成分的共計量為85質量%以上95質量%以下。
  3. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為3μm以上10μm以下，核層成分的含量，對核層與殼層成分的共計量為90質量%以上92質量%以下。
  4. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的平均粒徑為約3μm，核層成分的含量，對核層與殼層成分的共計量為約90質量%。
  5. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中上述(B)成分的含量，對上述(A)成分100質量部為5質量部以上50質量部以下。
  6. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中進一步對上述(A)成分100質量部，含有10質量部以上100質量部以下的(C)填充劑。
  7. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中在製作下述嵌入成形品A時，滿足下述耐熱 衝擊性條件A：(嵌入成形品A)將寬21mm×90mm×90mm、厚1.6mm的L型鐵板嵌入，樹脂部係寬25mm×70mm×70mm、厚3.6mm的L型板狀，一部分的樹脂部的最小壁厚為1mm的嵌入成形品；(耐熱衝擊性條件A)使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步，升溫至140℃的過程作為1個循環的耐熱衝擊試驗，成形品發生龜裂前的循環數為100以上。
  8. 如申請專利範圍第1項所述的聚對苯二甲酸亞烷基酯樹脂組合物，其中在製作下述嵌入成形品B時，滿足下述耐熱衝擊性條件B：(嵌入成形品B)將寬20mm×150mm、厚1.6mm的I型鐵板嵌入，樹脂部係寬25mm×120mm、厚4mm的I型板狀，一部分的樹脂部的最小壁厚為1mm的嵌入成形品；(耐熱衝擊性條件B)使用冷熱衝擊試驗機，以140℃加熱1小時30分鐘之後，降溫至-40℃冷卻1小時30分鐘，進一步，升溫至140℃的過程作為1個循環的耐熱衝擊試驗，成形品發生龜裂前的循環數為40以上。
  9. 一種成形品，成形申請專利範圍第1至8項中任一項所述的聚對苯二甲酸亞烷基酯樹脂組合物而成。
  10. 如申請專利範圍第9項所述的成形品，其中將上述聚對苯二甲酸亞烷基酯樹脂組合物，及嵌入成形金屬或無機固體的嵌入構件而成的嵌入成形品。
  11. 如申請專利範圍第10項所述的成形品，其中上述嵌入構件，係板狀的電性連接導體。
  12. 如申請專利範圍第11項所述的成形品，其中上述板狀的電性連接導體的嵌入構件，在以與板狀的平面的長邊方向直角的剖面，寬度的最大值對厚度的最大值的比為2以上。
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EP3239237B1 (en) 2020-09-09
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CN107109038A (zh) 2017-08-29
JP6506306B2 (ja) 2019-04-24
WO2016104201A1 (ja) 2016-06-30
EP3239237A4 (en) 2018-07-04
CN107109038B (zh) 2019-07-05
US20170342260A1 (en) 2017-11-30
US10655007B2 (en) 2020-05-19
JPWO2016104201A1 (ja) 2017-10-05

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