TW201625958A - Data generation device of detection, data generation method for detection and program - Google Patents
Data generation device of detection, data generation method for detection and program Download PDFInfo
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本發明係關於作成用以檢查構成形成在檢查對象基板的電路網的複數電子零件等電路要素的個別檢查用資料的檢查用資料作成裝置、檢查用資料作成方法及記錄有程式之電腦可讀取記錄媒體。 The present invention relates to an inspection data creation device for inspecting individual inspection materials for forming circuit elements such as a plurality of electronic components formed on a circuit net of an inspection target substrate, a test data creation method, and a computer capable of reading a program. Record media.
以該類檢查用資料作成裝置而言,本案申請人係已提出下述專利文獻1所揭示之檢查用資料作成裝置。該檢查用資料作成裝置係作成供根據在被設在裝載有電子零件的電路基板的導體圖案上的檢查點所測定出之有關電子零件的電性參數的測定值、及該電性參數的基準值來進行電路基板的檢查的基板檢查裝置之用的檢查用資料(包含指定作為該測定之對象的檢查點的資訊、及表示該基準值的資訊的檢查用資料)的檢查用資料作成裝置,其包括:包含關於導體圖案的資訊及關於電子零件的資訊而記憶表示電路基板的電路構成的電路設計資料的記憶部;及根據電路設計資料,執行將電路基板的動作進行模擬的模擬處理的處理部,處理部係根據電路設計資料,執行模擬處理,來作成檢查用資料。此時,檢查點係設在全部電子零件的兩端部。 In the case of the inspection data creation apparatus of the present invention, the applicant of the present invention has proposed the inspection data creation apparatus disclosed in the following Patent Document 1. The inspection data creation device is a measurement value for an electrical parameter of an electronic component measured based on a checkpoint provided on a conductor pattern of a circuit board on which an electronic component is mounted, and a reference for the electrical parameter. The inspection data creation device for the inspection material (including the information specifying the inspection point to be the measurement target and the inspection data indicating the reference value) for the substrate inspection device for the inspection of the circuit board, The present invention includes: a memory unit that includes information on a conductor pattern and information on the electronic component, and memorizes circuit design data indicating a circuit configuration of the circuit board; and performs processing of analog processing for simulating the operation of the circuit board based on the circuit design data. The processing unit performs simulation processing based on the circuit design data to create inspection data. At this time, the check points are provided at both ends of all the electronic parts.
【專利文獻1】日本特開2013-213787號公報(第4-8頁、第1-2圖) [Patent Document 1] Japanese Laid-Open Patent Publication No. 2013-213787 (pages 4-8, 1-2)
但是,在上述檢查用資料作成裝置存在有如以下所示之應改善的課題。亦即,在該檢查用資料作成裝置中,如上所述,必須在作為測定對象的電子零件的兩端設有檢查點。但是,例如,若存在被內置於電路基板的電子零件時、或存在與端子相連接的導體圖案未形成在電路基板的表面的電子零件時,關於該等電子零件,由於無法在兩端設置檢查點,因此存在有無法作成有關該等電子零件的檢查用資料(結果,檢查覆蓋率會降低)之應改善的課題。 However, there is a problem that the above-described inspection data creation apparatus should be improved as shown below. In other words, in the inspection data creating apparatus, as described above, it is necessary to provide inspection points at both ends of the electronic component to be measured. However, for example, when there is an electronic component built in a circuit board or an electronic component in which a conductor pattern connected to a terminal is not formed on the surface of the circuit board, the electronic component cannot be inspected at both ends. Therefore, there is a problem that it is impossible to prepare inspection materials for such electronic components (the result is that the inspection coverage is lowered).
本發明係為改善該課題所完成者,主要目的在提供可提高有關包含在兩端未設定有檢查點的電子零件等電路要素的電路網的個別檢查用資料的自動作成率的檢查用資料作成裝置、檢查用資料作成方法及記錄有程式之電腦可讀取記錄媒體。 The present invention has been made to improve the problem, and the main object of the present invention is to provide an inspection data for an automatic production rate of an individual inspection data for a circuit network including circuit components such as electronic components in which no inspection points are provided at both ends. The device, the inspection data creation method, and the computer with the program recorded can read the recording medium.
為達成上述目的,申請專利範圍第1項之檢查用資料作成裝置係包括作成使探針接觸被配設在檢查對象基板的表面而與電路網相連接的檢查點,來檢查形成在該檢查對象基板之構成該電路網的互相作電性連接的複數電路要素之中 的至少1個電路要素時之供前述電路網之用的個別檢查用資料的處理部的檢查用資料作成裝置,其特徵為:前述處理部係執行以下處理:正常時模擬處理,其係根據將前述複數電路要素設為全部正常狀態時的正常電路網表,對正常狀態的前述電路網執行以預先規定的檢查內容所檢查的模擬而求出正常時檢查結果;故障時模擬處理,其係根據將前述複數電路要素之中的至少1個電路要素作為檢查對象而形成為故障狀態,而且將剩餘的電路要素形成為全部正常狀態時的故障電路網表,對該故障狀態的前述電路網執行以前述檢查內容所檢查的模擬而求出故障時檢查結果;及個別檢查用資料作成處理,其係將前述正常時檢查結果與前述故障時檢查結果為相異時的前述檢查內容,形成為檢查前述檢查對象時的前述個別檢查用資料。 In order to achieve the above object, the inspection data creation device of the first application of the patent application includes the inspection point in which the probe is placed in contact with the circuit net on the surface of the inspection target substrate, and the inspection is performed on the inspection object. The plurality of circuit elements constituting the circuit network electrically connected to each other In the case of at least one circuit element, the inspection data creation device of the processing unit for the individual inspection data for the circuit network is characterized in that the processing unit performs the following processing: normal time simulation processing, which is based on The normal circuit netlist in the case where all of the plurality of circuit elements are in the normal state, and the normal network inspection result is performed on the circuit network in the normal state by the simulation of the predetermined inspection content; the failure time simulation processing is based on At least one of the plurality of circuit elements is formed as a failure state as an inspection target, and the remaining circuit elements are formed into a fault circuit netlist in all normal states, and the circuit network of the fault state is executed. The failure check result is obtained by the simulation of the inspection content; and the individual inspection data creation process is performed by checking the aforementioned inspection content when the normal time inspection result and the failure time inspection result are different. The above-mentioned individual inspection materials when inspecting the object.
申請專利範圍第2項之檢查用資料作成裝置係在如申請專利範圍第1項之檢查用資料作成裝置中,前述處理部係根據前述正常電路網表,執行一邊按照預先規定的順序來變更作為前述檢查對象的前述至少1個電路要素,一邊作成複數前述故障電路網表的故障網表作成處理,且根據在該故障網表作成處理中所作成的前述故障電路網表,執行前述故障時模擬處理。 The inspection data creation device of the second application of the patent application is the inspection data creation device according to the first aspect of the patent application, wherein the processing unit is changed in accordance with a predetermined order in accordance with the normal circuit net list. The at least one circuit element to be inspected is subjected to a fault netlist creation process of the plurality of fault circuit netlists, and the fault time simulation is performed based on the fault circuit netlist created in the fault netlist creation process. deal with.
申請專利範圍第3項之檢查用資料作成裝置係在如申請專利範圍第1項之檢查用資料作成裝置中,前述處理部係當在前述正常時模擬處理及前述故障時模擬處理中執行以伴隨對前述電路網施加電壓的前述檢查內容進行檢查的前述模擬,並且執行前述個別檢查用資料作成處理來作成前述個別 檢查用資料,在該正常時模擬處理的前述正常時檢查結果與在該故障時模擬處理的前述故障時檢查結果為不相異而存在該個別檢查用資料原為未作成的前述檢查對象時,使前述所施加的電壓的電壓值上升,來執行前述正常時模擬處理、前述故障時模擬處理及前述個別檢查用資料作成處理。 The inspection data creation device of the third aspect of the patent application is the inspection data creation device according to the first aspect of the patent application, wherein the processing unit is executed in the normal time simulation process and the failure time simulation process. The aforementioned simulation for inspecting the aforementioned inspection contents of the voltage applied to the circuit network, and performing the aforementioned individual inspection data creation processing to create the aforementioned individual In the inspection data, when the normal time inspection result of the normal time simulation processing is not different from the above-described failure time inspection result of the simulation processing at the time of the failure, and the inspection target object that the individual inspection inspection material is originally uncreated, The normal-time simulation processing, the failure-time simulation processing, and the individual inspection data creation processing are performed by increasing the voltage value of the applied voltage.
申請專利範圍第4項之檢查用資料作成裝置係在如申請專利範圍第2項之檢查用資料作成裝置中,前述處理部係當在前述正常時模擬處理及前述故障時模擬處理中執行以伴隨對前述電路網施加電壓的前述檢查內容進行檢查的前述模擬,並且執行前述個別檢查用資料作成處理來作成前述個別檢查用資料,在該正常時模擬處理的前述正常時檢查結果與在該故障時模擬處理的前述故障時檢查結果為不相異而存在該個別檢查用資料原為未作成的前述檢查對象時,使前述所施加的電壓的電壓值上升,來執行前述正常時模擬處理、前述故障時模擬處理及前述個別檢查用資料作成處理。 The inspection data creation device of the fourth aspect of the patent application is the inspection data creation device according to the second aspect of the patent application, wherein the processing unit is executed in the normal time simulation process and the failure time simulation process. The above-described simulation for inspecting the above-described inspection contents of the voltage applied to the circuit network, and performing the individual inspection data creation processing to create the individual inspection data, and the normal time inspection result of the normal time simulation processing and the failure time When the inspection result of the above-described failure in the simulation process is not different, and the individual inspection data is originally the unprocessed inspection target, the voltage value of the applied voltage is increased to perform the normal-time simulation processing and the failure. The time simulation process and the above-mentioned individual inspection data are processed.
申請專利範圍第5項之檢查用資料作成裝置係在如申請專利範圍第1項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,在使除了以前述電路網中之該個別檢查用資料所被檢查的前述檢查對象之外的前述電路要素的參數值,在該電路要素的容許範圍內改變的狀態下,利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the fifth application of the patent application is the inspection data creation device according to the first aspect of the patent application, wherein the processing unit performs verification processing for the individual inspection data creation processing. The parameter data of the circuit element other than the inspection target to be inspected by the individual inspection material in the circuit network is changed within the allowable range of the circuit element. Then, the normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍6記載的檢查用資料作成裝置係在如申請專利範圍第2項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,在使除了以前述電路網中之該個別檢查用資料所被檢查的前述檢查對象之外的前述電路要素的參數值,在該電路要素的容許範圍內改變的狀態下,利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the invention of claim 6 is the inspection data creation device according to the second aspect of the patent application, wherein the processing unit performs a verification process for creating the individual inspection data creation process. In the above-described individual inspection data, the parameter values of the circuit elements other than the inspection target inspected by the individual inspection materials in the circuit network are changed within the allowable range of the circuit elements. The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第7項之檢查用資料作成裝置係在如申請專利範圍第3項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,在使除了以前述電路網中之該個別檢查用資料所被檢查的前述檢查對象之外的前述電路要素的參數值,在該電路要素的容許範圍內改變的狀態下,利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the seventh application of the patent application is the inspection data creation device according to the third aspect of the patent application, wherein the processing unit performs verification processing for the individual inspection data creation processing. The parameter data of the circuit element other than the inspection target to be inspected by the individual inspection material in the circuit network is changed within the allowable range of the circuit element. Then, the normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第8項之檢查用資料作成裝置係在如申請專利範圍第4項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,在使除了以前述電路網中之該個別檢查用資料所被檢查的前述檢查對象之外的前述電路要素的參數值,在該電路要素的容許範圍內改變的狀態下,利用 以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the eighth application of the patent application is the inspection data creation device according to item 4 of the patent application scope, and the processing unit performs verification processing for the individual inspection data creation processing. The parameter data of the circuit element other than the inspection target to be inspected by the individual inspection material in the circuit network is changed within the allowable range of the circuit element. Use The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第9項之檢查用資料作成裝置係作成用以使探針接觸在具有1種類以上的檢查功能的基板檢查裝置中被配設在檢查對象基板的表面的檢查點,來個別檢查被構裝在該檢查對象基板的複數電子零件的個別檢查用資料的檢查用資料作成裝置,其係包括:記憶有包含根據關於前述檢查對象基板的設計資料所作成而由前述複數電子零件之中作為檢查對象的檢查對象零件,而且由被連接在2個以上的前述檢查點的至少2個以上的前述電子零件所構成的電路網,關於該電子零件為全部正常的正常電路網的正常電路網表、及關於僅使前述檢查對象零件在任意1個故障狀態下故障的前述電路網之故障電路網的故障電路網表的記憶部、及處理部,前述處理部係針對全部前述檢查對象零件,執行以下處理:正常時模擬處理,其係使用前述正常電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸被連接在前述正常電路網的前述檢查點而以前述1種類以上的檢查功能檢查時的正常時檢查結果;故障時模擬處理,其係使用前述故障電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸被連接在前述故障電路網的前述檢查點而以前述1種類以上的檢查功能檢查出該故障電路網時的故障時檢查結果;及個別檢查用資料作成處理,其係將前述1種類以上的每個檢查功能的前述正常時檢查結果及以與該正常時檢查結果為相同的前述檢 查功能進行檢查時的前述故障時檢查結果進行比較,該正常時檢查結果與該故障時檢查結果為相異的該檢查功能存在1種類以上時,將以其中1個該檢查功能檢查包含前述檢查對象零件的前述電路網的檢查內容,設為用以檢查前述檢查對象零件在前述任意1個故障狀態下是否為故障的前述個別檢查用資料。 The inspection data creation device of the ninth application of the patent application is formed so that the probe is placed in a checkpoint on the surface of the inspection target substrate in the substrate inspection device having one or more types of inspection functions, and the individual inspection is performed. The inspection data creation device for the individual inspection materials of the plurality of electronic components mounted on the inspection target substrate includes: the memory includes the design data according to the inspection target substrate, and is formed by the plurality of electronic components a circuit net composed of at least two or more electronic components connected to two or more of the inspection points, and a normal circuit netlist in which the electronic components are all normal normal circuit nets. And a memory unit and a processing unit of the fault circuit net of the faulty circuit network of the circuit network in which the component to be inspected is faulty in any one of the fault states, wherein the processing unit performs all of the inspection target components The following processing: normal time analog processing, which uses the aforementioned normal circuit netlist, according to the 1 type Each of the above-described inspection functions is simulated to obtain a normal-time inspection result when the probe is contacted with the inspection point connected to the normal circuit network and is inspected by the above-described one or more types of inspection functions; By using the above-described failing circuit netlist, each of the one or more types of inspection functions is simulated, and the probe is connected to the inspection point connected to the faulty circuit network, and the inspection function is detected by the above-described one or more types of inspection functions. The failure time inspection result in the faulty circuit network; and the individual inspection data creation processing, wherein the normal inspection result of each of the one or more types of inspection functions and the inspection result that is the same as the normal inspection result When the inspection function is checked, the result of the above-mentioned failure inspection is compared. When the normal inspection result is different from the inspection result of the failure, when one or more types of inspection functions are present, one of the inspection functions is checked to include the inspection. The inspection content of the circuit net of the target component is used to check whether the inspection target component is defective in the arbitrary one of the failure states.
申請專利範圍第10項之檢查用資料作成裝置係在如申請專利範圍第9項之檢查用資料作成裝置中,前述處理部係執行以下處理:零件選擇處理,其係根據前述設計資料,由前述複數電子零件之中選擇前述檢查對象零件;正常網表作成處理,其係根據前述設計資料,特定包含前述檢查對象零件而且由與2個以上的前述檢查點相連接的至少2個以上的前述電子零件所構成的電路網,並且將該電路網所包含的該電子零件為全部正常時的該電路網作為前述正常電路網而作成該正常電路網的網表作為前述正常電路網表;及故障網表作成處理,其係根據前述正常電路網表,將使前述檢查對象零件在任意1個故障狀態下故障時的前述電路網作為前述故障電路網而作成該故障電路網的網表作為前述故障電路網表。 The inspection data creation device of claim 10 is in the inspection data creation device according to claim 9 of the patent application scope, wherein the processing unit performs the following processing: part selection processing based on the aforementioned design data, Among the plurality of electronic components, the inspection target component is selected, and the normal net surface creation process is based on the design data, and the at least two or more electronic components connected to the two or more inspection points are specifically included in the inspection target component. a circuit network formed by the component, and the circuit component included in the circuit network is the normal circuit network as the normal circuit network, and the netlist of the normal circuit network is used as the normal circuit netlist; and the fault network The table creation process is based on the normal circuit net list, and the circuit network when the inspection target component fails in any one of the fault states is used as the fault circuit network to form a netlist of the fault circuit network as the fault circuit. Netlist.
申請專利範圍第11項之檢查用資料作成裝置係在如申請專利範圍第9項之檢查用資料作成裝置中,前述檢查功能係伴隨對前述電路網施加電壓者,前述處理部係執行:關於在前述個別檢查用資料作成處理中,前述正常時檢查結果與前述故障時檢查結果為相異的前述檢查功能連1種類亦不存在而前述個別檢查用資料形成為未作成的前述檢查對象零件,係使前述所施加的電壓的電壓值上升而執行前述正常時模擬處 理、前述故障時模擬處理及前述個別檢查用資料作成處理。 The inspection data creation device of the eleventh application of the patent application is in the inspection data creation device according to claim 9 of the patent application, wherein the inspection function is performed by applying a voltage to the circuit network, and the processing unit performs: In the above-described individual inspection data creation processing, the inspection function is different from the failure inspection result, and the individual inspection data is not formed, and the inspection target component is formed as an unprocessed inspection component. Performing the aforementioned normal time simulation by raising the voltage value of the aforementioned applied voltage The processing of the above-mentioned failure and the processing of the individual inspection data are performed.
申請專利範圍第12項之檢查用資料作成裝置係在如申請專利範圍第10項之檢查用資料作成裝置中,前述檢查功能係伴隨對前述電路網施加電壓者,前述處理部係執行:關於在前述個別檢查用資料作成處理中,前述正常時檢查結果與前述故障時檢查結果為相異的前述檢查功能連1種類亦不存在而前述個別檢查用資料形成為未作成的前述檢查對象零件,係使前述所施加的電壓的電壓值上升而執行前述正常時模擬處理、前述故障時模擬處理及前述個別檢查用資料作成處理。 The inspection data creation device of claim 12 is the inspection data creation device according to claim 10, wherein the inspection function is performed by applying a voltage to the circuit network, and the processing unit performs: In the above-described individual inspection data creation processing, the inspection function is different from the failure inspection result, and the individual inspection data is not formed, and the inspection target component is formed as an unprocessed inspection component. The normal time simulation process, the failure time simulation process, and the individual inspection data creation process are performed by increasing the voltage value of the applied voltage.
申請專利範圍第13項之檢查用資料作成裝置係在如申請專利範圍第9項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,使除了以前述電路網中之該個別檢查用資料所檢查的前述檢查對象零件之外的前述電子零件的參數值,在該電子零件的容許範圍內改變的狀態下利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the thirteenth application of the patent application is the inspection data creation device according to the ninth application of the patent application, wherein the processing unit performs verification processing for the individual inspection data creation processing. The individual inspection data to be created is such that the parameter value of the electronic component other than the inspection target component inspected by the individual inspection material in the circuit network is changed within the allowable range of the electronic component. The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第14項之檢查用資料作成裝置係在如申請專利範圍第10項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,使除了以前述電路網中之該個別檢查用資料所檢查的前述檢查對象零件之外的前述電子零件的參數值,在該電子零件的容許範圍內改變的狀態下利用 以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the 14th application of the patent application is the inspection data creation device according to claim 10, wherein the processing unit performs verification processing for the individual inspection data creation processing. The individual inspection data to be created is such that the parameter value of the electronic component other than the inspection target component inspected by the individual inspection material in the circuit network is changed within the allowable range of the electronic component. use The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第15項之檢查用資料作成裝置係在如申請專利範圍第11項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,使除了以前述電路網中之該個別檢查用資料所檢查的前述檢查對象零件之外的前述電子零件的參數值,在該電子零件的容許範圍內改變的狀態下利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection document preparation device of the fifteenth aspect of the patent application is the inspection document preparation device according to the eleventh aspect of the patent application, wherein the processing unit performs verification processing for the individual inspection data creation processing. The individual inspection data to be created is such that the parameter value of the electronic component other than the inspection target component inspected by the individual inspection material in the circuit network is changed within the allowable range of the electronic component. The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第16項之檢查用資料作成裝置係在如申請專利範圍第12項之檢查用資料作成裝置中,前述處理部係執行驗證處理,其係關於在前述個別檢查用資料作成處理中所作成的前述個別檢查用資料,使除了以前述電路網中之該個別檢查用資料所檢查的前述檢查對象零件之外的前述電子零件的參數值,在該電子零件的容許範圍內改變的狀態下利用以該個別檢查用資料所示之前述檢查內容,執行前述正常時模擬處理及前述故障時模擬處理,來驗證前述正常時檢查結果與前述故障時檢查結果的相異狀態是否被維持。 The inspection data creation device of the 16th application of the patent application is the inspection data creation device according to the 12th application of the patent application, wherein the processing unit performs verification processing for the individual inspection data creation processing. The individual inspection data to be created is such that the parameter value of the electronic component other than the inspection target component inspected by the individual inspection material in the circuit network is changed within the allowable range of the electronic component. The normal time simulation process and the failure time simulation process are executed by the above-described inspection contents indicated by the individual inspection materials, and it is verified whether or not the dissimilar state between the normal time inspection result and the failure time inspection result is maintained.
申請專利範圍第17項之檢查用資料作成方法係作成使探針接觸被配設在檢查對象基板的表面而與電路網相連接的檢查點,來檢查形成在該檢查對象基板之構成該電路網的 互相作電性連接的複數電路要素之中的至少1個電路要素時之供前述電路網之用的個別檢查用資料的檢查用資料作成方法,其係執行以下處理:正常時模擬處理,其係根據將前述複數電路要素設為全部正常狀態時的正常電路網表,對正常狀態的前述電路網執行以預先規定的檢查內容所檢查的模擬而求出正常時檢查結果;故障時模擬處理,其係根據將前述複數電路要素之中的至少1個電路要素作為檢查對象而形成為故障狀態,而且將剩餘的電路要素形成為全部正常狀態時的故障電路網表,對該故障狀態的前述電路網執行以前述檢查內容所檢查的模擬而求出故障時檢查結果;及個別檢查用資料作成處理,其係將前述正常時檢查結果與前述故障時檢查結果為相異時的前述檢查內容,形成為檢查前述檢查對象時的前述個別檢查用資料。 In the inspection data creation method of the seventeenth aspect of the invention, the probe is placed in a checkpoint that is placed on the surface of the inspection target substrate and connected to the circuit network, and the circuit formed on the inspection target substrate is inspected. of When at least one of the plurality of circuit elements that are electrically connected to each other is used as a method for preparing an inspection data for the individual inspection data for the circuit network, the following processing is performed: normal time simulation processing, According to the normal circuit net list when the plurality of circuit elements are in the normal state, the normal network inspection result is obtained by performing a simulation checked by a predetermined inspection content on the circuit network in a normal state; and the failure time simulation processing is performed. a fault circuit netlist in which the remaining circuit elements are formed into a fault state by at least one of the plurality of circuit elements as an inspection target, and the remaining circuit elements are in a normal state, and the circuit network of the fault state is used. The failure inspection result is obtained by performing the simulation checked by the inspection content; and the individual inspection data creation processing is performed by forming the inspection content when the normal inspection result and the failure inspection result are different The aforementioned individual inspection materials when the inspection target is inspected.
申請專利範圍第18項之檢查用資料作成方法係作成用以使探針接觸在具有1種類以上的檢查功能的基板檢查裝置中被配設在檢查對象基板的表面的檢查點,來個別檢查被構裝在該檢查對象基板的複數電子零件的個別檢查用資料的檢查用資料作成方法,其係執行以下處理:在記憶部係記憶有:包含根據關於前述檢查對象基板的設計資料所作成而由前述複數電子零件之中作為檢查對象的檢查對象零件,而且由被連接在2個以上的前述檢查點的至少2個以上的前述電子零件所構成的電路網,關於該電子零件為全部正常的正常電路網的正常電路網表、及關於僅使前述檢查對象零件在任意1個故障狀態下故障的前述電路網之故障電路網的故障電路網表,針對全 部的前述檢查對象零件,執行以下處理:正常時模擬處理,其係使用由前述記憶部所讀出的前述正常電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸與前述正常電路網相連接的前述檢查點而以前述1種類以上的檢查功能進行檢查時的正常時的正常時檢查結果;故障時模擬處理,其係使用由前述記憶部所讀出的前述故障電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸與前述故障電路網相連接的前述檢查點而以前述1種類以上的檢查功能檢查該故障電路網時的故障時檢查結果;及個別檢查用資料作成處理,其係將前述1種類以上的每個檢查功能的前述正常時檢查結果、及以與該正常時檢查結果為相同的前述檢查功能進行檢查時的前述故障時檢查結果進行比較,當該正常時檢查結果與該故障時檢查結果為相異的該檢查功能存在1種類以上時,將以其中1個該檢查功能檢查包含前述檢查對象零件的前述電路網的檢查內容,設為用以檢查前述檢查對象零件在前述任意1個故障狀態下是否故障的前述個別檢查用資料。 In the inspection method for the inspection of the surface of the substrate to be inspected in the substrate inspection device having one or more types of inspection functions, the inspection method is used to individually check the inspection. The inspection data creation method of the individual inspection materials of the plurality of electronic components mounted on the inspection target substrate, wherein the memory portion is stored in the memory unit including the design data based on the inspection target substrate Among the plurality of electronic components, the inspection target component to be inspected, and a circuit network including at least two or more electronic components connected to the two or more inspection points, all of the electronic components are normal. The normal circuit netlist of the circuit network, and the fault circuit netlist of the fault circuit network of the foregoing circuit network that only causes the aforementioned inspection target component to fail in any one fault state, In the inspection target component, the normal processing is performed by using the normal circuit net table read by the memory unit, and each of the one or more types of inspection functions is simulated and obtained. The normal time inspection result when the probe is in contact with the inspection point connected to the normal circuit network and is inspected by the above-described one or more types of inspection functions; the failure time simulation processing is read by the memory unit In the above-described fault circuit net list, the inspection points for causing the probe to be in contact with the faulty circuit network are obtained by simulation for each of the inspection functions of the one or more types, and the fault is checked by the inspection function of one or more types. The failure time inspection result in the circuit network; and the individual inspection data creation processing, which is the same as the normal inspection result of each of the above-described inspection functions and the inspection function which is the same as the normal inspection result The foregoing failure time inspection result at the time of inspection is compared, and when the normal time inspection result is different from the failure time inspection result When the inspection function is one or more types, the inspection contents of the circuit net including the inspection target component are inspected by one of the inspection functions to check whether the inspection target component is in any of the above-described failure states. The above-mentioned individual inspection materials.
申請專利範圍第19項之記錄有程式之電腦可讀取記錄媒體係使電腦作成使探針接觸被配設在檢查對象基板的表面而與電路網相連接的檢查點,來檢查形成在該檢查對象基板之構成該電路網的互相作電性連接的複數電路要素之中的至少1個電路要素時之供前述電路網之用的個別檢查用資料的記錄有程式之電腦可讀取記錄媒體,使電腦執行以下處理:正常時模擬處理,其係根據將前述複數電路要素設為全部正常狀態時的正常電路網表,對正常狀態的前述電路網執行以預先規 定的檢查內容所檢查的模擬而求出正常時檢查結果;故障時模擬處理,其係根據將前述複數電路要素之中的至少1個電路要素作為檢查對象而形成為故障狀態,而且將剩餘的電路要素形成為全部正常狀態時的故障電路網表,對該故障狀態的前述電路網執行以前述檢查內容所檢查的模擬而求出故障時檢查結果;及個別檢查用資料作成處理,其係將前述正常時檢查結果與前述故障時檢查結果為相異時的前述檢查內容,形成為檢查前述檢查對象時的前述個別檢查用資料。 The computer-readable recording medium recorded in the program of claim 19 is such that the computer is made to have a probe contact point which is disposed on the surface of the inspection target substrate and connected to the circuit network to check the formation of the inspection. The computer-readable recording medium on which the individual inspection data for the circuit network is used for recording the at least one of the plurality of circuit elements electrically connected to each other of the circuit board, The computer is caused to perform the following processing: normal time analog processing, which is performed on the foregoing circuit network in a normal state according to a normal circuit netlist when the plurality of circuit elements are set to all normal states. The normal inspection result is obtained by the simulation of the inspection contents, and the failure time simulation processing is performed in accordance with at least one of the plurality of circuit elements as a failure target, and the remaining The circuit element is formed as a fault circuit netlist in all normal states, and the fault detection result is obtained by performing the simulation checked by the inspection content on the circuit network in the fault state; and the individual inspection data creation processing is performed The content of the inspection when the normal time inspection result is different from the failure time inspection result is formed as the individual inspection data when the inspection target is inspected.
申請專利範圍第20項之記錄有程式之電腦可讀取記錄媒體係用以使電腦作成用以使探針接觸在具有1種類以上的檢查功能的基板檢查裝置中被配設在檢查對象基板的表面的檢查點,來個別檢查被構裝在該檢查對象基板的複數電子零件的個別檢查用資料的記錄有程式之電腦可讀取記錄媒體,在記憶部係記憶有:包含根據關於前述檢查對象基板的設計資料所作成而由前述複數電子零件之中作為檢查對象的檢查對象零件,而且由被連接在2個以上的前述檢查點的至少2個以上的前述電子零件所構成的電路網,關於該電子零件為全部正常的正常電路網的正常電路網表、及關於僅使前述檢查對象零件在任意1個故障狀態下故障的前述電路網之故障電路網的故障電路網表,針對全部的前述檢查對象零件,使電腦執行以下處理:正常時模擬處理,其係使用由前述記憶部所讀出的前述正常電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸與前述正常電路網相連接的前述檢查點而以前述1種類以上的檢查功能進行檢查時的正常時的正常時檢查結 果;故障時模擬處理,其係使用由前述記憶部所讀出的前述故障電路網表,按該1種類以上的每個檢查功能,模擬而求出使前述探針接觸與前述故障電路網相連接的前述檢查點而以前述1種類以上的檢查功能檢查該故障電路網時的故障時檢查結果;及個別檢查用資料作成處理,其係將前述1種類以上的每個檢查功能的前述正常時檢查結果、及以與該正常時檢查結果為相同的前述檢查功能進行檢查時的前述故障時檢查結果進行比較,當該正常時檢查結果與該故障時檢查結果為相異的該檢查功能存在1種類以上時,將以其中1個該檢查功能檢查包含前述檢查對象零件的前述電路網的檢查內容,設為用以檢查前述檢查對象零件在前述任意1個故障狀態下是否故障的前述個別檢查用資料。 The computer-readable recording medium on which the program is recorded in the 20th article of the patent application is for causing the computer to be made to be placed in the substrate to be inspected in the substrate inspection device having one or more types of inspection functions. In the inspection point of the surface, the computer-readable recording medium on which the individual inspection materials of the plurality of electronic components mounted on the inspection target substrate are recorded is stored, and the memory is stored in the memory system: The design information of the substrate is formed by the inspection target component to be inspected among the plurality of electronic components, and the circuit network including at least two or more electronic components connected to the two or more inspection points. The electronic component is a normal circuit netlist of all normal normal circuit nets, and a fault circuit netlist of the faulty circuit network of the circuit network in which only the aforementioned inspection target component fails in any one fault state, for all of the foregoing Check the target part and let the computer perform the following processing: normal time analog processing, which is used by the aforementioned memory unit The normal circuit net table read out is obtained by simulating the inspection point for causing the probe to contact the normal circuit network by each of the inspection functions of the one or more types, and performing the inspection function of one or more types. Normal inspection check at normal time during inspection In the case of a fault-time simulation process, the fault circuit net table read by the memory unit is used, and each of the one or more types of inspection functions is simulated to obtain the probe contact with the faulty circuit network. The failure check result when the faulty circuit net is inspected by the inspection function of one or more types, and the individual inspection data creation processing, which is the normal time of each of the above-described inspection functions The inspection result is compared with the foregoing failure time inspection result when the inspection function is the same as the normal inspection result, and the inspection function is different when the normal inspection result is different from the failure inspection result. In the case of the above-mentioned type, the inspection content of the circuit net including the inspection target component is checked by one of the inspection functions, and the individual inspection for checking whether the inspection target component is defective in any of the above-described failure states is used. data.
在申請專利範圍第1項之檢查用資料作成裝置、申請專利範圍第17項之檢查用資料作成方法及申請專利範圍第19項之記錄有程式之電腦可讀取記錄媒體中,係根據所取得的正常電路網表及故障電路網表,執行正常時模擬處理、故障時模擬處理及個別檢查用資料作成處理,當預先規定的檢查內容(例如基板檢查裝置所具有的檢查功能)的正常時檢查結果、及以與該正常時檢查結果為相同的檢查內容進行檢查時的故障時檢查結果(使用使檢查對象故障的故障狀態的電路網之模擬下的檢查結果)為相異時,將該檢查內容設為用以檢查該檢查對象是否為故障的個別檢查用資料。 In the computer-readable recording medium on which the inspection data preparation device of the first application of the patent application, the inspection data creation method of the application for the scope of the patent application, and the computer-readable recording medium recorded in the program of claim 19, The normal circuit netlist and the fault circuit netlist perform normal-time simulation processing, fault-time simulation processing, and individual inspection data creation processing, and check when the predetermined inspection content (for example, the inspection function of the substrate inspection device) is normal. When the result of the failure check when the inspection is performed in the same inspection content as the normal inspection result (the inspection result under the simulation of the circuit network using the failure state of the inspection target failure) is different, the inspection is performed. The content is set as an individual inspection material for checking whether the inspection object is a failure.
因此,藉由該檢查用資料作成裝置、檢查用資料 作成方法及記錄有程式之電腦可讀取記錄媒體,基於被內置於檢查對象基板等理由,關於在其兩端未設定有檢查點的電子零件的個別檢查用資料,亦可充分提高自動作成率。因此,可使根據該個別檢查用資料之關於檢查對象基板的檢查覆蓋率充分提升。 Therefore, the inspection data is used as a device and inspection data. The preparation method and the computer-readable recording medium on which the program is recorded are based on the information to be incorporated in the inspection target substrate, and the individual inspection data for the electronic components having no checkpoints at both ends thereof can be sufficiently increased. . Therefore, the inspection coverage of the inspection target substrate based on the individual inspection data can be sufficiently increased.
藉由申請專利範圍第2項之檢查用資料作成裝置,由於執行根據正常電路網表來作成故障電路網表的故障網表作成處理,因此僅取得正常電路網表,即可充分提高個別檢查用資料的自動作成率,藉此,可使根據該個別檢查用資料之關於檢查對象基板的檢查覆蓋率充分提升。。 By applying the inspection data creation device of the second item of the patent scope, since the failure net table creation processing of the fault circuit net table according to the normal circuit net list is performed, only the normal circuit net list can be obtained, and the individual inspection can be sufficiently improved. The automatic creation rate of the data can sufficiently increase the inspection coverage of the inspection target substrate based on the individual inspection data. .
在申請專利範圍第3、4、11、12項之檢查用資料作成裝置中,當存在個別檢查用資料為未作成的檢查對象時,關於該檢查對象(檢查對象零件),使所施加的電壓的電壓值上升來執行正常時模擬處理、故障時模擬處理及個別檢查用資料作成處理,而作成個別檢查用資料。亦即,將當作成個別檢查用資料時,一邊使所施加的電壓的電壓值依序上升,一邊作成個別檢查用資料的處理,關於在更低的電壓值中將個別檢查用資料作成完畢的電路要素,係在施加之後更高的電壓值的電壓時,一邊由檢查對象除外一邊執行。 In the inspection data creation device of the third, fourth, eleventh, and twelthth patent applications, when the individual inspection data is an uninspected inspection target, the applied voltage is applied to the inspection target (inspection target component). The voltage value is increased to perform normal-time simulation processing, fault-time simulation processing, and individual inspection data creation processing, and individual inspection data is created. In other words, when the voltage of the applied voltage is sequentially increased, the individual inspection data is processed, and the individual inspection data is created at a lower voltage value. The circuit element is executed when the voltage of a higher voltage value is applied after the application.
因此,藉由該檢查用資料作成裝置,相較於對全部檢查對象(檢查對象零件)執行以全部的電壓值施加電壓的模擬時的模擬的計算量,可作成可一邊使模擬的計算量充分減低、一邊對基板檢查裝置執行更為安全的檢查(若以施加低電壓值的電壓下的檢查即可時,即可省略在高電壓值下的檢查的 方面,為更為安全的檢查)的個別檢查用資料。 Therefore, with the inspection data creation device, it is possible to make the calculation amount of the simulation sufficient while performing the calculation calculation of the simulation when the voltage is applied to all the inspection targets (inspection target parts) with all the voltage values. It is possible to perform a safer inspection on the substrate inspection device while reducing (if the inspection at a voltage with a low voltage value is applied, the inspection at a high voltage value can be omitted. In terms of individual inspection materials for safer inspections.
藉由申請專利範圍5、6、7、8、13、14、15、16之檢查用資料作成裝置,驗證處理的結果,關於正常時檢查結果與故障時檢查結果的相異狀態被維持的個別檢查用資料,係殘留下來,關於相異狀態未被維持的個別檢查用資料,則可刪除,因此可大幅減低在基板檢查裝置使用個別檢查用資料來執行形成在實際的檢查對象基板之構成電路網的電路要素的檢查時的不良情形(無法檢查在模擬中原可檢測到的電路要素(檢查對象零件)的故障的不良情形)的發生。亦即,可使個別檢查用資料的可靠性大幅提升。 By applying the inspection data preparation device of the patent scopes 5, 6, 7, 8, 13, 14, 15, and 16, the result of the verification processing, the individual state in which the difference between the normal inspection result and the failure inspection result is maintained is maintained. The inspection data is retained, and the individual inspection materials that are not maintained in the different state can be deleted. Therefore, the substrate inspection device can be used to form the circuit formed on the actual inspection target substrate by using the individual inspection materials. The failure of the inspection of the circuit elements of the network (the failure of the failure of the circuit element (inspection target part) that can be detected in the simulation cannot be checked). That is, the reliability of individual inspection materials can be greatly improved.
在申請專利範圍第9項之檢查用資料作成裝置、申請專利範圍第18項之檢查用資料作成方法及申請專利範圍第20項之記錄有程式之電腦可讀取記錄媒體中,根據所取得的正常電路網表及故障電路網表,執行正常時模擬處理、故障時模擬處理及個別檢查用資料作成處理,基板檢查裝置所具有的每個檢查功能的正常時檢查結果、及以與該正常時檢查結果為相同的檢查功能進行檢查時的故障時檢查結果(使用在任意1個故障狀態下使檢查對象零件故障時的故障電路網之模擬下的檢查結果)為相異的檢查功能存在有1種類以上時,將以其中1個檢查功能檢查包含檢查對象零件的電路網的檢查內容,設為用以檢查檢查對象零件在上述任意1個故障狀態下是否故障的檢查用資料。 In the computer-readable recording medium on which the inspection data preparation device of the ninth application patent application, the inspection data preparation method of the application for the patent scope No. 18, and the computer-readable recording medium in which the patent application scope is recorded, according to the obtained The normal circuit netlist and the fault circuit netlist perform normal-time simulation processing, fault-time simulation processing, and individual inspection data creation processing, and the normal inspection result of each inspection function of the substrate inspection apparatus, and the normal time When the result of the inspection is the same as the inspection function, the result of the inspection at the time of failure (using the result of the simulation under the simulation of the faulty circuit network when the component to be inspected is faulty in any one fault state) is different. In the case of a type or more, the inspection contents of the circuit net including the inspection target component are checked by one of the inspection functions, and the inspection data for checking whether the inspection target component is defective in any of the above-described failure states is used.
因此,藉由該檢查用資料作成裝置、檢查用資料作成方法及記錄有程式之電腦可讀取記錄媒體,基於被內置於 檢查對象基板等理由,關於在其兩端未設定有檢查點的電子零件的個別檢查用資料,亦可充分提高自動作成率。因此,可使根據該個別檢查用資料之關於檢查對象基板的檢查覆蓋率充分提升。 Therefore, the inspection data creation device, the inspection data creation method, and the computer-readable recording medium on which the program is recorded are based on being built in For the reason of the inspection target substrate and the like, the automatic inspection rate can be sufficiently increased with respect to the individual inspection materials for the electronic components in which the inspection points are not provided at both ends. Therefore, the inspection coverage of the inspection target substrate based on the individual inspection data can be sufficiently increased.
此外,藉由申請專利範圍第10項之檢查用資料作成裝置,根據設計資料,執行由檢查對象零件的選擇至正常電路網表及故障網表的作成,因此僅取得設計資料,即可充分提高個別檢查用資料的自動作成率,藉此,可使根據該個別檢查用資料之關於檢查對象基板的檢查覆蓋率充分提升。 In addition, by applying the inspection data creation device of the tenth scope of the patent application, the selection of the parts to be inspected to the normal circuit netlist and the faulty netlist is performed according to the design data, so that only the design data can be obtained, and the design can be sufficiently improved. The automatic creation rate of the individual inspection materials can sufficiently increase the inspection coverage of the inspection target substrate based on the individual inspection materials.
1‧‧‧檢查用資料作成裝置 1‧‧‧Check data preparation device
2‧‧‧輸入部 2‧‧‧ Input Department
3‧‧‧處理部 3‧‧‧Processing Department
4‧‧‧記憶部 4‧‧‧Memory Department
5‧‧‧輸出部 5‧‧‧Output Department
71‧‧‧電路基板 71‧‧‧ circuit board
72、75、76、77、78‧‧‧電阻 72, 75, 76, 77, 78‧‧‧ resistance
73‧‧‧電容器 73‧‧‧ Capacitors
74‧‧‧二極體 74‧‧‧ diode
80‧‧‧檢查用資料作成處理 80‧‧‧Check data processing
81‧‧‧零件選擇處理 81‧‧‧Part selection processing
82‧‧‧正常網表作成處理 82‧‧‧Normal netlist creation
83‧‧‧故障網表作成處理 83‧‧‧ Fault netlist creation processing
84‧‧‧正常時模擬處理 84‧‧‧Normal simulation processing
85‧‧‧故障時模擬處理 85‧‧‧Analog processing in case of failure
86‧‧‧個別檢查資料作成處理 86‧‧‧Individual inspection data processing
第1圖係檢查用資料作成裝置1的構成圖。 The first drawing is a configuration diagram of the inspection data creation device 1.
第2圖係電路基板71的連接圖。 Fig. 2 is a connection diagram of the circuit board 71.
第3圖係顯示有關檢查對象零件ob的每個檢查功能fc的模擬結果的結果圖。 Fig. 3 is a view showing a result of simulation results of each inspection function fc of the inspection target part ob.
第4圖係有關用以說明檢查用資料作成裝置1的動作(檢查用資料作成方法)的檢查用資料作成處理80的流程圖。 Fig. 4 is a flowchart showing an inspection data creation process 80 for explaining the operation (inspection data creation method) of the inspection data creation device 1.
第5圖係用以說明檢查用資料作成方法的基本概念的說明圖。 Fig. 5 is an explanatory diagram for explaining the basic concept of the method for preparing a document for inspection.
第6圖係有關用以說明檢查用資料作成裝置1的動作(其他檢查用資料作成方法)的檢查用資料作成處理90的流程圖。 Fig. 6 is a flowchart showing an inspection data creation process 90 for explaining the operation of the inspection data creation device 1 (other inspection data creation method).
以下參照所附圖示,說明檢查用資料作成裝置、檢查用資料作成方法及記錄有程式之電腦可讀取記錄媒體之 實施形態。 Hereinafter, the inspection data creation device, the inspection data creation method, and the computer-readable recording medium on which the program is recorded will be described with reference to the attached drawings. Implementation form.
最初參照圖示,說明檢查用資料作成方法的基本概念。 First, the basic concept of the method for creating a data for inspection will be described with reference to the drawings.
該檢查用資料作成方法係僅以模擬,作成使基板檢查裝置的探針接觸被配設在該檢查對象基板的表面而與該電路網相連接的檢查點(例如第2圖所示之檢查點TP1~TP4)而以該基板檢查裝置檢查構成形成在檢查對象基板的電路網(例如第2圖所示之電路網)之互相作電性連接的複數電路要素(例如第2圖所示之電阻、電容器及二極體,透過導體圖案互相作電性連接的電路要素)之中的至少1個電路要素時之供該電路網之用的個別檢查用資料(在該基板檢查裝置中被使用的資料)。 In the inspection data creation method, the probe of the substrate inspection apparatus is brought into contact with the inspection point of the surface of the inspection target substrate and connected to the circuit network (for example, the inspection point shown in FIG. 2 is formed by simulation). TP1 to TP4), the substrate inspection device inspects a plurality of circuit elements (for example, the resistors shown in FIG. 2) that electrically connect each other to form a circuit network (for example, the circuit network shown in FIG. 2) formed on the substrate to be inspected. And an individual inspection material for the circuit network (at least one of the circuit elements electrically connected to each other through the conductor pattern) data).
在此,該基板檢查裝置係具有用以檢查電路網的1或2以上的檢查功能,與各檢查功能相對應包括以下功能:使探針之中的任意探針作為輸出探針來發揮功能,藉此將供檢查之用的電訊號(電壓或電流)透過該輸出探針而輸出至檢查點的功能;及使探針之中之其他任意探針作為輸入探針來發揮功能,藉此透過該輸入探針來輸入因上述電訊號對電路網輸出而在檢查點發生的電訊號的功能。此外,在模擬中,將使用各檢查功能之中的哪個檢查功能,與該檢查功能相對應而使各探針之中的哪個作為輸出探針及輸入探針來發揮功能,而且使如上所示發揮功能的輸出探針及輸入探針接觸哪個檢查點等有關檢查的內容作為檢查內容(檢查條件)者。 Here, the substrate inspection apparatus has an inspection function for inspecting one or two or more of the circuit nets, and includes, in association with each inspection function, a function of causing any of the probes to function as an output probe. Thereby, the electrical signal (voltage or current) for inspection is output to the checkpoint through the output probe; and any other probe among the probes functions as an input probe, thereby transmitting The input probe inputs the function of the electrical signal generated at the checkpoint due to the output of the electrical signal to the circuit network. Further, in the simulation, which of the inspection functions is used, which one of the probes functions as an output probe and an input probe corresponding to the inspection function, and as shown above The function of the output probe and the checkpoint that the input probe is in contact with, such as the inspection point, is the content of the inspection (inspection conditions).
該檢查用資料作成方法的基本考慮方式係根據以 下邏輯:將在1個檢查內容的模擬(檢查模擬),對構成電路網的全部電路要素為正常(電路要素的參數值為目錄等規格書所記載之標稱值的狀態)的該電路網(亦稱為正常電路網)、及構成該電路網的電路要素之中僅有特定的電路要素呈故障的狀態的該電路網(亦稱為故障電路網)之雙方,針對正常電路網,係使用正常電路網表,此外,針對故障電路網,則使用故障電路網表來執行,當對正常電路網之以模擬所得的模擬結果(正常時檢查結果)、及對故障電路網之以模擬所得的模擬結果(故障時檢查結果)為相異時,可使用該1個檢查內容,來作為以模擬檢查該特定的電路要素為正常或故障時的個別檢查用資料。 The basic consideration of the data creation method for inspection is based on Lower logic: This circuit network is a simulation (inspection simulation) of one inspection content, and all the circuit elements constituting the circuit network are normal (the parameter value of the circuit element is a state of a nominal value described in a specification such as a catalog) (also referred to as a normal circuit network), and a circuit network (also referred to as a faulty circuit network) in which only a specific circuit element is in a fault state among the circuit elements constituting the circuit network, for a normal circuit network Use the normal circuit netlist, in addition, for the faulty circuit network, use the fault circuit netlist to perform, when the simulation results of the simulation of the normal circuit network (normal test results), and the simulation of the faulty circuit network When the simulation result (the failure check result) is different, the one test content can be used as the individual inspection data when the specific circuit element is normally checked for failure or failure.
舉例具體說明該檢查用資料作成方法。以該一例而言,以由互異的3個檢查內容1、2、3之中的任一者中,決定以模擬檢查關於某電路網所包含的複數電路要素之中之互異的3個電路要素A、B、C的各個為正常或為故障時所使用的個別檢查用資料(亦即,電路要素A檢查時所使用的個別檢查用資料、電路要素B檢查時所使用的個別檢查用資料、及電路要素C檢查時所使用的個別檢查用資料)為例來進行說明。其中,關於該電路網所包含的複數電路要素的全部為正常的正常電路網N0的正常電路網表NEno,係設為已知者。 An example of the method for preparing the inspection data will be specifically described. In this example, three of the three test contents 1, 2, and 3 that are different from each other are determined to simulate three different ones of the plurality of circuit elements included in a certain circuit network. Each of the circuit elements A, B, and C is an individual inspection data used for normal or faulty (that is, individual inspection data used for inspection of the circuit component A, and individual inspection used for inspection of the circuit component B. The data and the individual inspection data used in the circuit element C inspection are described as an example. Among them, the normal circuit net list NEno of the normal circuit network N0 in which all of the plurality of circuit elements included in the circuit network are known is known.
首先,根據正常電路網表NEno,作成僅有電路要素A故障的故障電路網Na的故障電路網表NEabA、僅有電路要素B故障的故障電路網Nb的故障電路網表NEabB、及僅有電路要素C故障的故障電路網Nc的故障電路網表NEabC。 First, according to the normal circuit net list NEno, the fault circuit net list NEabA of the fault circuit network Na with only the circuit element A fault, the fault circuit net list NEabB of the fault circuit net Nb with only the circuit element B fault, and only the circuit The fault circuit net list NEabC of the fault circuit network Nc of the element C fault.
接著,對正常電路網N0,使用正常電路網表NEno,執行在檢查內容1的模擬,取得該模擬結果(關於正常電路網N0之在檢查內容1的結果(正常時檢查結果REno1))。同樣地,對故障電路網Na,使用故障電路網表NEabA,執行在檢查內容1的模擬,取得該模擬結果(關於故障電路網Na之在檢查內容1的結果(故障時檢查結果REabA1)),對故障電路網Nb,使用故障電路網表NEabB,執行在檢查內容1的模擬,取得該模擬結果(關於故障電路網Nb之在檢查內容1的結果(故障時檢查結果REabB1)),對故障電路網Nc,使用故障電路網表NEabC,執行在檢查內容1的模擬,取得該模擬結果(關於故障電路網Nc在檢查內容1的結果(故障時檢查結果REabC1))。 Next, the normal circuit net N0 is used to perform the simulation of the inspection content 1 using the normal circuit net list NEno, and the simulation result is obtained (the result of the inspection content 1 of the normal circuit network N0 (normal time inspection result REno1)). Similarly, for the faulty circuit network Na, the fault circuit net list NEabA is used to perform the simulation of the inspection content 1, and the simulation result is obtained (the result of the inspection content 1 of the faulty circuit network Na (the fault detection result REabA1)), For the faulty circuit network Nb, the fault circuit net list NEabB is used to perform the simulation of the check content 1, and the simulation result is obtained (the result of the check content 1 of the fault circuit network Nb (the fault check result REabB1)), the fault circuit The network Nc, using the fault circuit netlist NEabC, performs the simulation of the inspection content 1, and obtains the simulation result (the result of checking the content 1 with respect to the faulty circuit network Nc (the failure check result REabC1)).
接著,關於在檢查內容2的模擬,亦與上述在檢查內容1的模擬時同樣地執行,取得關於正常電路網N0之在檢查內容2的結果(正常時檢查結果REno2)、關於故障電路網Na之在檢查內容2的結果(故障時檢查結果REabA2)、關於故障電路網Nb之在檢查內容2的結果(故障時檢查結果REabB2)、及關於故障電路網Nc之在檢查內容2的結果(故障時檢查結果REabC2)。此外,關於在檢查內容3的模擬,亦與上述在檢查內容1、2之模擬時同樣地執行,取得關於正常電路網N0之在檢查內容3的結果(正常時檢查結果REno3)、關於故障電路網Na之在檢查內容3的結果(故障時檢查結果REabA3)、關於故障電路網Nb之在檢查內容3的結果(故障時檢查結果REabB3)、及關於故障電路網Nc之在檢查內容3 的結果(故障時檢查結果REabC3)。 Next, the simulation of the inspection content 2 is performed in the same manner as the above-described simulation of the inspection content 1, and the result of the inspection content 2 regarding the normal circuit network N0 (normal inspection result REno2) is acquired, and the fault circuit network Na is acquired. The result of checking the content 2 (the failure check result REabA2), the result of the inspection content 2 about the faulty circuit network Nb (the failure check result REabB2), and the result of the inspection content 2 regarding the faulty circuit network Nc (fault) When checking the result REabC2). In addition, the simulation of the inspection content 3 is performed in the same manner as in the simulation of the inspection contents 1 and 2 described above, and the result of the inspection content 3 regarding the normal circuit network N0 (normal inspection result REno3) is obtained, and the fault circuit is The result of checking the content 3 of the net Na (the failure check result REabA3), the result of the inspection content 3 regarding the faulty circuit network Nb (the failure check result REabB3), and the inspection content 3 regarding the faulty circuit network Nc The result (recovery result REabC3).
藉此,獲得第5圖所示之在各檢查內容1、2、3的模擬結果、亦即關於正常電路網N0之在各正常時檢查結果REno1、REno2、REno3(以下若無特別區別時,亦稱為「正常時檢查結果REno」)、關於故障電路網Na之各故障時檢查結果REabA1、故障時檢查結果REabA2、故障時檢查結果REabA3(以下若無特別區別時,亦稱為「故障時檢查結果REabA」)、關於故障電路網Nb之各故障時檢查結果REabB1、故障時檢查結果REabB2、故障時檢查結果REabB3(以下若無特別區別時,亦稱為「故障時檢查結果REabB」)、及關於故障電路網Nc之各故障時檢查結果REabC1、故障時檢查結果REabC2、故障時檢查結果REabC3(以下若無特別區別時,亦稱為「故障時檢查結果REabC」)。 Thereby, the simulation results of the respective inspection contents 1, 2, and 3 shown in FIG. 5, that is, the normal time inspection results REno1, REno2, and REno3 of the normal circuit network N0 are obtained (if there is no special difference, Also known as "normal time inspection result REno"), the failure detection result REabA1 of the faulty circuit network Na, the failure time inspection result REabA2, and the failure time inspection result REabA3 (hereinafter, if there is no special difference, it is also called "fault time" The result of the inspection REabA"), the detection result REabB1 of the failure circuit network Nb, the failure result inspection result REabB2, and the failure time inspection result REabB3 (hereinafter, if there is no special difference, it is also called "fault-time inspection result REabB"), And the failure detection result REabC1 of the faulty circuit network Nc, the failure detection result REabC2, and the failure inspection result REabC3 (hereinafter, if there is no special difference, it is also referred to as "failure inspection result REabC").
接著,按每個檢查內容1、2、3,將正常時檢查結果REno與各故障時檢查結果REabA、REabB、REabC(以下若無特別區別時,亦稱為「故障時檢查結果REab」)進行比較,判別與正常時檢查結果REno為相異之故障時檢查結果REab是否僅存在1個。 Then, for each inspection content 1, 2, and 3, the normal time inspection result REno and each failure time inspection result REabA, REabB, and REabC (hereinafter, if there is no special difference, also referred to as "failure inspection result REab") In comparison, it is judged whether or not there is only one check result REab when the fault is different from the normal time check result REno.
該判別的結果,如第5圖所示,形成為:在檢查內容1的模擬結果中,僅有標註□標記之故障時檢查結果REabB1與正常時檢查結果REno1為相異,在檢查內容2的模擬結果中,僅有標註□標記之故障時檢查結果REabC2與正常時檢查結果REno2為相異,在檢查內容3的模擬結果中,僅有標註□標記之故障時檢查結果REabA3與正常時檢查結果 REno3為相異的狀態。 As a result of the discrimination, as shown in FIG. 5, in the simulation result of the inspection content 1, only the failure detection result REabB1 marked with the □ mark is different from the normal inspection result REno1, and the inspection content 2 is In the simulation results, only the inspection result REabC2 marked with the □ mark is different from the normal inspection result REno2. In the simulation result of the inspection content 3, only the failure result marked with the □ mark is the inspection result REabA3 and the normal inspection result. REno3 is a different state.
此時,藉由在檢查內容1的模擬,可檢測僅有電路要素B呈故障的狀態,因此使用該檢查內容1,作為以模擬檢查該電路要素B為正常或為故障時的個別檢查用資料。同樣地,藉由在檢查內容2的模擬,可檢測僅有電路要素C呈故障的狀態,因此使用該檢查內容2,作為以模擬檢查該電路要素C為正常或為故障時的個別檢查用資料,且藉由在檢查內容3的模擬,可檢測僅有電路要素A呈故障的狀態,因此使用該檢查內容3,作為以模擬檢查該電路要素A為正常或為故障時的個別檢查用資料。 At this time, by the simulation of the inspection content 1, it is possible to detect that only the circuit element B is in a state of failure. Therefore, the inspection content 1 is used as the individual inspection data when the circuit element B is normal or faulty by the simulation. . Similarly, by the simulation of the inspection content 2, it is possible to detect that only the circuit element C is in a state of failure. Therefore, the inspection content 2 is used as an individual inspection data when the circuit element C is normal or faulty by simulation. By the simulation of the inspection content 3, it is possible to detect that only the circuit element A is in a failure state. Therefore, the inspection content 3 is used as the individual inspection data when the circuit element A is normal or faulty.
接著,參照圖示,說明執行如上所述之基本概念的檢查用資料作成方法的檢查用資料作成裝置的構成。 Next, a configuration of an inspection data creation device that executes the inspection data creation method of the basic concept as described above will be described with reference to the drawings.
作為第1圖所示之檢查用資料作成裝置的檢查用資料作成裝置1係以一例而言,構成為:包括:輸入部2、處理部3、記憶部4、及輸出部5,可根據由輸入部2被輸入的設計資料(關於成為檢查對象基板的電路基板的設計資料)Dde、及執行對該電路基板的檢查的基板檢查裝置的規格資料Dsp,自動作成在檢查該電路基板時在該基板檢查裝置中被使用的檢查用資料Dte。 The inspection data creation device 1 as the inspection data creation device shown in Fig. 1 includes, for example, an input unit 2, a processing unit 3, a storage unit 4, and an output unit 5, which can be The design data (design data of the circuit board to be the inspection target substrate) Dde input to the input unit 2 and the specification data Dsp of the substrate inspection device for performing the inspection on the circuit board are automatically created when the circuit board is inspected. The inspection data Dte used in the substrate inspection device.
在本例之設計資料Dde係包含有:表示被構裝在成為檢查用資料作成裝置的檢查對象的電路基板(檢查對象基板)的全部電子零件的規格的資訊、表示導體圖案的形狀的資訊、表示導體圖案中的全部電子零件的構裝位置的資訊、及表示設在位於電路基板的表面的導體圖案的檢查點的位置的資 訊等。在規格資料Dsp係包含有:表示執行對檢查對象基板的檢查的基板檢查裝置所具有的檢查功能fc(例如測定一對檢查點間的阻抗或電阻值(本例中以阻抗作為一例)來進行檢查的阻抗檢查功能;測定在一對檢查點間施加電壓,並且在施加該電壓時,在其他一對檢查點間所產生的電壓來進行檢查的電壓檢查功能、及測定在一對檢查點間施加電壓,並且在施加該電壓時,在該一對檢查點間流通的電流來進行檢查的電流檢查功能等)的資訊。 In the design data Dde of the present example, information indicating the specifications of all the electronic components of the circuit board (inspection target substrate) to be inspected by the inspection data creation device, and information indicating the shape of the conductor pattern, Information indicating the mounting position of all the electronic components in the conductor pattern, and information indicating the position of the checkpoint of the conductor pattern located on the surface of the circuit board News. The specification data Dsp includes an inspection function fc (for example, measuring impedance or resistance value between a pair of inspection points (in this example, an impedance is taken as an example) for performing inspection of the inspection target substrate. The impedance check function of the inspection; the voltage check function for measuring the voltage generated between the pair of inspection points and applying the voltage between the other pair of inspection points, and measuring between the pair of inspection points The voltage is applied, and when the voltage is applied, the current flowing between the pair of inspection points is used to check the current check function, etc.).
以一例而言,輸入部2係包括外部界面電路而構成,接收由外部裝置被發送的設計資料Dde及規格資料Dsp,且輸出至處理部3。 For example, the input unit 2 includes an external interface circuit, and receives the design data Dde and the specification data Dsp transmitted by the external device, and outputs the data to the processing unit 3.
以一例而言,處理部3係由電腦所構成,執行:讀出被記憶在記憶部4的動作程式來執行,藉此輸入由輸入部2被輸出的設計資料Dde及規格資料Dsp而記憶在記憶部4的記憶處理、根據被記憶在記憶部4的設計資料Dde及規格資料Dsp,作成檢查用資料Dte的後述的檢查用資料作成處理80、以及將所作成的檢查用資料Dte輸出至輸出部5的輸出處理。 For example, the processing unit 3 is configured by a computer, and reads and executes an operation program stored in the storage unit 4, thereby inputting the design data Dde and the specification data Dsp outputted by the input unit 2, and memorizing therein. In the memory processing of the memory unit 4, based on the design data Dde and the specification data Dsp stored in the memory unit 4, the inspection data creation processing 80, which will be described later, is performed, and the prepared inspection data Dte is output to the output. The output processing of the section 5.
記憶部4係由HDD(Hard Disk Drive,硬碟驅動機)、或RAM等半導體記憶體等所構成,作為一例。此外,在記憶部4係藉由從網路下載,而且藉由從記錄有動作程式的記錄媒體(例如以磁帶、磁碟、光碟或快閃記憶體等半導體記憶體所構成的可移除式媒體)載入,來預先記憶處理部3的動作程式(包含用以使處理部3執行檢查用資料作成處理80的程式),並且記憶設計資料Dde、規格資料Dsp、及檢查用資料 Dte等。以一例而言,輸出部5係包括外部界面電路而構成,輸入由處理部3被輸出的檢查用資料Dte,並且對與外部界面電路相連接的外部裝置輸出該檢查用資料Dte。 The memory unit 4 is constituted by an HDD (Hard Disk Drive) or a semiconductor memory such as a RAM, and is exemplified. Further, the memory unit 4 is downloaded from the network and is removable from a recording medium on which an operating program is recorded (for example, a semiconductor memory such as a magnetic tape, a magnetic disk, a compact disk, or a flash memory). The media is loaded in advance to memorize the operation program of the processing unit 3 (including a program for causing the processing unit 3 to execute the inspection data creation processing 80), and to memorize the design data Dde, the specification data Dsp, and the inspection data. Dte et al. For example, the output unit 5 includes an external interface circuit, and inputs the inspection data Dte outputted by the processing unit 3, and outputs the inspection data Dte to an external device connected to the external interface circuit.
接著,與檢查用資料作成方法一併說明藉由檢查用資料作成裝置1所為之檢查用資料Dte的作成動作。 Next, the creation operation of the inspection data Dte by the inspection data creation apparatus 1 will be described together with the inspection data creation method.
首先,處理部3係經由輸入部2來輸入由外部裝置被輸出的設計資料Dde及規格資料Dsp,並且記憶在記憶部4。在本例中,以一例而言,設為被輸入關於形成有第2圖所示之電路的電路基板71的設計資料Dde者。該電路為電路網之一例,如該圖所示,包含作為電路要素的5個電阻72、75、76、77、78、1個電容器73及1個二極體74的各電子零件作為檢查對象零件ob,該等各電子零件藉由作為電路要素的導體圖案而互相作電性連接。此外,在該電路中,以虛線包圍的電子零件(以一例而言,為二極體74及電阻75)被內置於電路基板71,但是在所被內置的電子零件的兩端並無法直接連接檢查點。因此,在該電路基板71中,係如該圖所示,在被內置的電子零件以外的電子零件的端部連接有4個檢查點TP1~TP4(以下若無特別區別時,亦稱為檢查點TP)。此外,檢查該電路基板71的基板檢查裝置係設為被輸入關於表示包括阻抗檢查功能fc1及電流檢查功能fc2的2個檢查功能fc的基板檢查裝置的規格資料Dsp者。 First, the processing unit 3 inputs the design data Dde and the specification data Dsp outputted from the external device via the input unit 2, and stores them in the storage unit 4. In this example, as an example, it is assumed that the design data Dde of the circuit board 71 on which the circuit shown in FIG. 2 is formed is input. This circuit is an example of a circuit network. As shown in the figure, each electronic component including five resistors 72, 75, 76, 77, 78, one capacitor 73, and one diode 74 as circuit elements is used as an inspection object. The parts ob, which are electrically connected to each other by a conductor pattern as a circuit element. Further, in this circuit, an electronic component (for example, a diode 74 and a resistor 75) surrounded by a broken line is built in the circuit board 71, but cannot be directly connected to both ends of the built-in electronic component. checking point. Therefore, in the circuit board 71, as shown in the figure, four check points TP1 to TP4 are connected to the end of the electronic component other than the built-in electronic component (hereinafter, if there is no special difference, it is also called inspection). Point TP). Further, the substrate inspection device for inspecting the circuit board 71 is a specification data Dsp to which a substrate inspection device indicating two inspection functions fc including the impedance inspection function fc1 and the current inspection function fc2 is input.
接著,處理部3係執行第4圖所示之檢查用資料作成處理80,作成檢查用資料Dte。 Next, the processing unit 3 executes the inspection data creation processing 80 shown in Fig. 4 to create the inspection data Dte.
在該檢查用資料作成處理80中,處理部3首先執 行零件選擇處理(步驟81)。在該零件選擇處理中,處理部3係根據被記憶在記憶部4的設計資料Dde,選擇被構裝在電路基板71之電子零件之中作為檢查對象的檢查對象零件ob。在本例的檢查用資料作成處理80中,以一例而言,在基板檢查裝置中,作成可將被構裝在電路基板71的電子零件各1個地個別檢查的檢查用資料Dte。因此,在該零件選擇處理中,處理部3係選擇1個作為檢查對象的檢查對象零件ob。在本例中,處理部3係首先選擇電阻72。 In the inspection data creation processing 80, the processing unit 3 first executes Line part selection processing (step 81). In the part selection processing, the processing unit 3 selects the inspection target part ob to be inspected as an inspection target in the electronic component of the circuit board 71 based on the design data Dde stored in the memory unit 4. In the inspection data creation processing 80 of the present example, for example, in the substrate inspection apparatus, the inspection data Dte which can be individually inspected by the electronic components mounted on the circuit board 71 is formed. Therefore, in the part selection processing, the processing unit 3 selects one inspection target part ob to be inspected. In this example, the processing unit 3 first selects the resistor 72.
接著,處理部3係執行正常網表作成處理(步驟82)。在該正常網表作成處理中,處理部3係包含在步驟81中所選擇的電子零件(檢查對象零件ob),而且特定與2以上的檢查點TP相連接的電路網。此外,將該特定的電路網(以下亦稱為特定電路網)所包含的電子零件全部為正常時的電路網設為正常電路網,作成該正常電路網的網表作為正常電路網表NEno,並且與檢查對象零件ob相對應而記憶在記憶部4。此時,在正常電路網表NEno係包含有檢查檢查對象零件ob時所使用的檢查點TP的資訊(例如編號名)。 Next, the processing unit 3 executes normal net list creation processing (step 82). In the normal net list creation processing, the processing unit 3 includes the electronic component (inspection target part ob) selected in step 81, and a circuit network that is connected to the inspection point TP of two or more. In addition, a circuit network in which the electronic components included in the specific circuit network (hereinafter also referred to as a specific circuit network) are all normal is a normal circuit network, and a net list of the normal circuit network is created as a normal circuit net list NEno. And it is stored in the memory unit 4 corresponding to the inspection target part ob. At this time, the normal circuit net list NEno includes information (for example, a number name) of the checkpoint TP used when the inspection target component ob is inspected.
當選擇電阻72作為檢查對象零件ob時,以一例而言,處理部3係特定與2個檢查點TP1、TP2相連接的電路網(電阻72與電容器73的串聯電路)。此外,處理部3係將當該特定電路網所包含的電子零件全部為正常時(既未斷線亦未短路,而且常數亦為正常的範圍內之時)的電路網設為正常電路網,作成該正常電路網的網表作為正常電路網表NEno。該正常電路網表NEno係作成如例如清單編號100〔檢查點 TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號102〔電容器73-2,檢查點TP2〕所示。「-1」及「-2」的記號係表示連同該記號一起被記載的電子零件的「一端」及「另一端」者。此外,關於清單編號,請參照第2圖。 When the resistor 72 is selected as the inspection target component ob, for example, the processing unit 3 specifies a circuit network (a series circuit of the resistor 72 and the capacitor 73) connected to the two inspection points TP1 and TP2. Further, the processing unit 3 sets the circuit network as a normal circuit network when all of the electronic components included in the specific circuit network are normal (when the line is not disconnected or short-circuited, and the constant is within a normal range). The net list of the normal circuit network is created as the normal circuit net list NEno. The normal circuit netlist NEno is created as, for example, list number 100 [checkpoint TP1, resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1), list number 102 [capacitor 73-2, check point TP2] are shown. The symbols "-1" and "-2" indicate the "one end" and the "other end" of the electronic component recorded together with the symbol. In addition, please refer to Figure 2 for the list number.
其中,以包含電阻72的電路網而言,除了上述電路網以外,可特定:由電阻72、電容器73、及電阻78的串聯電路所構成,且與檢查點TP1、TP4相連接的電路網、或由電阻72、二極體74、及電阻75~77所構成,且與2個檢查點TP1、TP3相連接的電路網等各種電路網,但是為了更加提高對電阻72的檢查精度,以電阻72之外的電子零件數為更少的電路網為佳。 The circuit network including the resistor 72 may be configured by a series circuit including a resistor 72, a capacitor 73, and a resistor 78, and a circuit network connected to the check points TP1 and TP4, in addition to the above-described circuit network. Or a circuit network composed of a resistor 72, a diode 74, and resistors 75 to 77 and connected to two checkpoints TP1 and TP3. However, in order to further improve the inspection accuracy of the resistor 72, a resistor is used. It is preferable that the number of electronic parts other than 72 is less.
接著,處理部3係執行故障網表作成處理(步驟83)。在該故障網表作成處理中,處理部3係根據在步驟82中所作成的正常電路網表NEno,將使檢查對象零件ob在1或2以上的故障狀態之中的任意1個故障狀態下故障時的電路網作為故障電路網,作成該故障電路網的網表作為故障電路網表NEab,並且與檢查對象零件ob相對應而記憶在記憶部4。此時,在故障電路網表NEab亦包含有當檢查檢查對象零件ob時所使用的檢查點TP的資訊。其中,在本例中,為容易理解發明,以關於電子零件的上述故障狀態而言,係設為斷線及短路之任何故障,並沒有常數錯誤的故障者。 Next, the processing unit 3 executes a failure netlist creation process (step 83). In the failure net table creation processing, the processing unit 3 causes the inspection target part ob to be in any one of the failure states of 1 or 2 or more based on the normal circuit net list NEno created in step 82. The circuit network at the time of the failure is used as the fault circuit network, and the net list of the fault circuit network is created as the fault circuit net list NEab, and is stored in the memory unit 4 corresponding to the inspection target part ob. At this time, the fault circuit net list NEab also contains information of the checkpoint TP used when the inspection target part ob is inspected. In this example, in order to easily understand the invention, in the case of the above-described failure state of the electronic component, any failure of the disconnection and the short circuit is performed, and there is no failure of the constant error.
因此,處理部3係作成作為檢查對象零件ob的電阻72呈斷線故障時的故障電路網表NEabo(清單編號200a〔檢查點TP1〕、清單編號201a〔電容器73-2,檢查點TP2〕)、 及作為檢查對象零件ob的電阻72呈短路故障時的故障電路網表NEabs(清單編號200b〔檢查點TP1,電容器73-1〕、清單編號201b〔電容器73-2,檢查點TP2〕),作為故障電路網表NEab。以下將故障電路網表NEabo及故障電路網表NEabs總括稱為故障電路網表NEab。 Therefore, the processing unit 3 is configured as a fault circuit net table NEabo (the list number 200a [check point TP1], list number 201a [capacitor 73-2, check point TP2]) when the resistor 72 as the inspection target part ob is broken. , And the resistor 72 as the inspection target part ob is a fault circuit net table NEabs (list number 200b [check point TP1, capacitor 73-1], list number 201b [capacitor 73-2, check point TP2])) as a short-circuit fault. Fault circuit netlist NEab. Hereinafter, the fault circuit netlist NEabo and the fault circuit netlist NEabs are collectively referred to as the fault circuit netlist NEab.
接著,處理部3係執行正常時模擬處理(步驟84)。在該正常時模擬處理中,處理部3係對在步驟82中所作成的正常電路網,使用正常電路網表NEno而按每個檢查功能fc進行模擬而求出使探針接觸在基板檢查裝置中與該正常電路網相連接的檢查點TP而以1或2以上的檢查功能fc進行檢查時的正常時檢查結果REno,且記憶在記憶部4。此時,對進行模擬而求出的正常時檢查結果,例如將預先規定的值進行加算而求出上限值,並且將該預先規定的值進行減算而求出下限值,且使該所求出的上限值及下限值作為正常時檢查結果REno而記憶在記憶部4。 Next, the processing unit 3 executes normal time simulation processing (step 84). In the normal-time simulation processing, the processing unit 3 performs simulation for each of the inspection functions fc using the normal circuit net list NEno for the normal circuit network created in step 82, and obtains the probe to be in contact with the substrate inspection device. The normal time check result REno at the time of inspection by the inspection function TP connected to the normal circuit network by the inspection point TP of 1 or 2 or more is stored in the memory unit 4. In this case, the normal time inspection result obtained by the simulation is added, for example, a predetermined value is added to obtain an upper limit value, and the predetermined value is subtracted to obtain a lower limit value, and the lower limit value is obtained. The obtained upper limit value and lower limit value are stored in the memory unit 4 as the normal time check result REno.
在本例中,處理部3係根據被記憶在記憶部4的規格資料Dsp,檢測基板檢查裝置的檢查功能fc為阻抗檢查功能fc1及電流檢查功能fc2的2個檢查功能fc,對在步驟82中所特定的正常電路網(電阻72與電容器73的串聯電路),進行模擬而求出使探針接觸檢查點TP1、TP2而以阻抗檢查功能fc1檢查時的正常時檢查結果REno1、及以電流檢查功能fc2檢查時的正常時檢查結果REno2。此外,處理部3係使以模擬求出的各正常時檢查結果REno1、REno2記憶在記憶部4(參照第3圖)。以下將正常時檢查結果REno1及正常時檢查結果 REno2總括稱為正常時檢查結果REno。 In this example, the processing unit 3 detects the two inspection functions fc of the impedance inspection function fc1 and the current inspection function fc2 based on the specification data Dsp stored in the storage unit 4, and the processing function fc of the substrate inspection apparatus is in step 82. The normal circuit network (the series circuit of the resistor 72 and the capacitor 73) specified in the middle is simulated, and the normal time inspection result REno1 and the current when the probe is in contact with the inspection points TP1 and TP2 and checked by the impedance inspection function fc1 are obtained. Check the normal time check result REno2 when the function fc2 is checked. Further, the processing unit 3 stores the normal time check results REno1 and REno2 obtained by the simulation in the memory unit 4 (see FIG. 3). The following will be the normal time check result REno1 and the normal time check result REno2 is collectively referred to as the normal time check result REno.
接著,處理部3係執行故障時模擬處理(步驟85)。在該故障時模擬處理中,處理部3係對在步驟83中所作成的全部故障電路網,使用故障電路網表NEab,按每個檢查功能fc進行模擬而求出使探針接觸在基板檢查裝置中與該故障電路網相連接的檢查點TP而以1或2以上的檢查功能fc檢查時的故障時檢查結果REab,且進行記憶。 Next, the processing unit 3 executes a failure time simulation process (step 85). In the failure-time simulation processing, the processing unit 3 uses the fault circuit net table NEab for all the fault circuit networks created in step 83, and performs simulation for each inspection function fc to obtain probe contact on the substrate. The check point TP of the device connected to the faulty circuit network is checked by the inspection function fc of 1 or 2 or more, and the result REab is checked and stored.
在本例中,基板檢查裝置的檢查功能fc為阻抗檢查功能fc1及電流檢查功能fc2的2個檢查功能fc,而且以在步驟83中所作成的故障電路網而言,有以故障電路網表NEabo、NEabs所示之2個故障電路網。因此,處理部3係對該各故障電路網,進行模擬而求出使探針接觸檢查點TP1、TP2而以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1、及以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2。此外,處理部3係使以模擬所求出的各故障時檢查結果REabo1、REabs1、REabo2、REabs2作為故障網表NEab而記憶在記憶部4(參照第3圖)。 In this example, the inspection function fc of the substrate inspection apparatus is the two inspection functions fc of the impedance inspection function fc1 and the current inspection function fc2, and the faulty circuit network created in step 83 has a faulty circuit netlist. Two fault circuit networks shown by NEabo and NEabs. Therefore, the processing unit 3 simulates each of the faulty circuit nets to obtain the failure time inspection results REabo1, REabs1, and the current check function fc2 when the probes are in contact with the inspection points TP1 and TP2 and are inspected by the impedance inspection function fc1. The result of the check at the time of inspection is REabo2, REabs2. Further, the processing unit 3 stores the failure time inspection results REabo1, REabs1, REabo2, and REabs2 obtained by the simulation as the failure net list NEab and stores them in the storage unit 4 (see FIG. 3).
接著,處理部3係執行個別檢查資料作成處理(步驟86)。在該個別檢查資料作成處理中,處理部3係將在步驟84中以模擬求出的各正常時檢查結果REno1、REno2、及在步驟85中以模擬求出的各故障時檢查結果REabo1、REabs1、REabo2、REabs2,按每個檢查功能fc(在本例中為按每個阻抗檢查功能fc1及電流檢查功能fc2)相比較,檢測(判別)是否存在常時檢查結果REno與故障時檢查結果REab為相異 的檢查功能fc。 Next, the processing unit 3 executes an individual inspection data creation process (step 86). In the individual inspection data creation processing, the processing unit 3 performs the normal time inspection results REno1 and REno2 obtained by simulation in step 84 and the failure time inspection results REabo1 and REabs1 obtained by simulation in step 85. , REabo2, REabs2, according to each inspection function fc (in this example, for each impedance check function fc1 and current check function fc2), it is detected (determined) whether there is a normal check result REno and a fault check result REab is Different Check function fc.
在本例中,處理部3係將以阻抗檢查功能fc1檢查出正常電路網時的正常時檢查結果REno1、及檢查出2個故障電路網時的故障時檢查結果REabo1、REabs1進行比較,檢測在故障時檢查結果REabo1、REabs1之中是否存在與正常時檢查結果REno1為相異者。此外,處理部3係將以電流檢查功能fc2檢查出正常電路網時的正常時檢查結果REno2、及檢查出2個故障電路網時的故障時檢查結果REabo2、REabs2進行比較,檢測在故障時檢查結果REabo2、REabs2之中是否存在與正常時檢查結果REno2為相異者。 In the present example, the processing unit 3 compares the normal time check result REno1 when the normal circuit network is detected by the impedance check function fc1, and the failure time check results REabo1 and REabs1 when the two failed circuit nets are checked, and detects Whether the failure result check result REabo1, REabs1 is different from the normal time check result REno1. Further, the processing unit 3 compares the normal time check result REno2 when the current check function is detected by the current check function fc2, and the failure time check results REabo2 and REabs2 when the two failed circuit nets are checked, and detects the check at the time of failure. As a result, whether there is a difference between REabo2 and REabs2 and the normal time check result REno2 is different.
該比較的結果,處理部3係當關於以故障電路網表NEabo(檢查對象零件ob亦即電阻72呈斷線故障時的故障電路網表NEab)所示之故障電路網之以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、及以電流檢查功能fc2檢查時的故障時檢查結果REabo2之中的至少一方,與關於以正常電路網表NEno所示之正常電路網的正常時檢查結果REno1、REno2之中相對應之正常時檢查結果REno為相異時,將使用檢查結果相異之阻抗檢查功能fc1及電流檢查功能fc2之中的其中一方檢查功能fc、及以該檢查功能fc的正常時檢查結果REno,檢查在步驟82中所特定的特定電路網的檢查內容,作為用以檢查作為檢查對象零件ob的電阻72是否呈斷線故障的個別檢查用資料Dteo,與檢查對象零件ob(在該例中為電阻72)相對應而記憶在記憶部4。 As a result of the comparison, the processing unit 3 is an impedance check function fc1 for the faulty circuit network shown by the faulty circuit net table NEabo (the faulty circuit net list NEab when the check target component ob is the resistor 72 is broken). At least one of the failure time inspection result REabo1 at the time of inspection and the failure time inspection result REabo2 when the current inspection function fc2 is checked, and the normal time inspection result REno1 regarding the normal circuit network indicated by the normal circuit net list NEno When the normal check result REno corresponding to REno2 is different, one of the impedance check function fc1 and the current check function fc2 having different check results will be used, and the normal time of the check function fc will be used. In the inspection result REno, the inspection content of the specific circuit network specified in the step 82 is checked, and the individual inspection data Dteo for checking whether the resistor 72 as the inspection target part ob is broken or not, and the inspection target part ob (in In this example, the resistor 72) is correspondingly stored in the memory unit 4.
具體而言,作為檢查對象零件ob的電阻72呈斷 線故障時,阻抗檢查功能fc1及電流檢查功能fc2之雙方的檢查結果係與正常時檢查結果REno1、REno2之中相對應的正常時檢查結果REno為相異。因此,將以阻抗檢查功能fc1及電流檢查功能fc2之中的其中一方檢查功能fc檢查特定電路網的檢查內容,設為用以檢查電阻72是否呈斷線故障的個別檢查用資料Dteo。 Specifically, the resistance 72 as the inspection target part ob is broken. In the case of a line failure, the inspection results of both the impedance check function fc1 and the current check function fc2 are different from the normal time check result REno corresponding to the normal time check results REno1 and REno2. Therefore, the inspection content of the specific circuit network is checked by one of the impedance inspection function fc1 and the current inspection function fc2, and the individual inspection data Dteo for checking whether the resistor 72 is broken or not is used.
其中,阻抗檢查功能fc1及電流檢查功能fc2之雙方的檢查結果為相異時,亦可在個別檢查用資料Dteo包含任何檢查功能fc,但是較佳為將以與相對應之正常時檢查結果REno的相異量更大的其中一方檢查功能fc檢查特定電路網的檢查內容,設為用以檢查作為檢查對象零件ob的電阻72是否呈斷線故障的個別檢查用資料Dteo。 In the case where the inspection results of both the impedance check function fc1 and the current check function fc2 are different, the inspection data fte may be included in the individual inspection data Dteo, but it is preferable to use the corresponding normal inspection result REno. The one inspection function fc having a larger amount of difference is used to check the inspection contents of the specific circuit network, and is used to check whether or not the resistor 72 as the inspection target component ob is broken.
此外,處理部3係關於以故障電路網表NEabs(作為檢查對象零件ob的電阻72呈短路故障時的故障電路網表NEab)所示之故障電路網之以阻抗檢查功能fc1檢查時的故障時檢查結果REabs1、及以電流檢查功能fc2檢查時的故障時檢查結果REabs2之中的至少一方,與關於以正常電路網表NEno所示之正常電路網的正常時檢查結果REno1、REno2之中相對應的正常時檢查結果REno為相異時,將使用檢查結果為相異的阻抗檢查功能fc1及電流檢查功能fc2之中的其中一方檢查功能fc、及以該檢查功能fc的正常時檢查結果REno,檢查在步驟82中所特定的特定電路網的檢查內容,設為用以檢查作為檢查對象零件ob的電阻72是否呈短路故障的個別檢查用資料Dtes,且與檢查對象零件ob(在該例中為電阻72)相對應 而記憶在記憶部4。 Further, the processing unit 3 is in the case of a fault when the impedance check function fc1 is inspected by the fault circuit network shown by the fault circuit net list NEabs (the fault circuit net list NEab when the resistor 72 of the inspection target part ob is short-circuited) At least one of the inspection result REabs1 and the failure time inspection result REabs2 when the current inspection function fc2 is checked corresponds to the normal time inspection results REno1 and REno2 of the normal circuit network indicated by the normal circuit net list NEno. When the normal time check result REno is different, one of the impedance check function fc1 and the current check function fc2 whose check result is different, and the normal check result REno of the check function fc are used. The inspection content of the specific circuit network specified in the step 82 is checked, and the individual inspection data Dtes for checking whether the resistor 72 as the inspection target component ob is short-circuited is set, and the inspection target component ob (in this example) Corresponding to resistance 72) And remember in memory 4.
具體而言,當作為檢查對象零件ob的電阻72呈短路故障時,阻抗檢查功能fc1及電流檢查功能fc2之雙方的檢查結果係與正常時檢查結果REno1、REno2之中相對應的正常時檢查結果REno為相異。因此,將以阻抗檢查功能fc1及電流檢查功能fc2之中的其中一方檢查功能fc檢查特定電路網的檢查內容,設為用以檢查電阻72是否呈短路故障的個別檢查用資料Dtes。 Specifically, when the resistance 72 as the inspection target part ob is short-circuited, the inspection results of both the impedance inspection function fc1 and the current inspection function fc2 are normal inspection results corresponding to the normal inspection results REno1 and REno2. REno is different. Therefore, the inspection content of the specific circuit network is checked by one of the impedance inspection function fc1 and the current inspection function fc2, and the individual inspection data Dtes for checking whether or not the resistor 72 is short-circuited is used.
其中,阻抗檢查功能fc1及電流檢查功能fc2之雙方的檢查結果為相異時,亦可在個別檢查用資料Dtes包含任何檢查功能fc,但是較佳為將以與相對應之正常時檢查結果REno的相異量更大的其中一方檢查功能fc檢查特定電路網的檢查內容,設為用以檢查作為檢查對象零件ob的電阻72是否呈短路故障的個別檢查用資料Dtes。 In the case where the inspection results of both the impedance check function fc1 and the current check function fc2 are different, any inspection function fc may be included in the individual inspection data Dtes, but it is preferable to use the corresponding normal inspection result REno. The one of the inspection functions fc, which has a larger amount of difference, checks the contents of the inspection of the specific circuit network, and sets the individual inspection data Dtes for checking whether or not the resistor 72 as the inspection target part ob is short-circuited.
藉此,當將電阻72作為檢查對象零件ob來進行檢查時所使用的檢查點TP的資訊、用以檢查電阻72是否呈斷線故障的個別檢查用資料Dteo、及用以檢查電阻72是否呈短路故障的個別檢查用資料Dtes係全體作為關於電阻72的個別檢查用資料,在與電阻72產生關連的狀態下被記憶在記憶部4。 Thereby, the information of the checkpoint TP used when the resistor 72 is used as the inspection target part ob, the individual inspection data Dteo for checking whether the resistor 72 is broken, and the inspection of whether the resistor 72 is present or not The individual inspection data Dtes of the short-circuit failure is stored in the memory unit 4 in a state in which it is associated with the resistor 72 as a separate inspection material for the resistor 72.
接著,處理部3係根據被記憶在記憶部4的設計資料Dde,判別關於被構裝在電路基板71的電子零件之中作為檢查對象之全部檢查對象零件ob的個別檢查用資料的作成是否已完成(亦即,是否有個別檢查用資料未作成的檢查對象 零件ob)(步驟87),當關於全部檢查對象零件ob的個別檢查用資料的作成未完成時,係返回至上述步驟81,反覆步驟81~步驟87,藉此依序作成關於全部檢查對象零件ob的個別檢查用資料。 Then, the processing unit 3 determines whether or not the preparation of the individual inspection materials for all the inspection target parts ob to be inspected among the electronic components mounted on the circuit board 71 is determined based on the design data Dde stored in the memory unit 4. Completion (ie, whether there are inspection objects that are not made for individual inspection materials) When the preparation of the individual inspection materials for all the inspection target parts ob is not completed, the process returns to the above-mentioned step 81, and the steps 81 to 87 are repeated, thereby sequentially creating all the inspection target parts. The individual inspection data of ob.
關於形成有第2圖所示之電路的電路基板71,處理部3係例如當將電容器73設為檢查對象零件ob時,將與2個檢查點TP1、TP2相連接的電路網(電阻72與電容器73的串聯電路)特定為特定電路網。此外,當將電阻78設為檢查對象零件ob時,將與2個檢查點TP2、TP4相連接的電路網(僅有電阻78的電路)特定為特定電路網。此外,當將二極體74設為檢查對象零件ob時,係將與2個檢查點TP1、TP3相連接的電路網(電阻72、二極體74及合成電阻(電阻75、76的串聯電路與電阻77的並聯合成電阻)的串聯電路)特定為特定電路網。 In the circuit board 71 on which the circuit shown in FIG. 2 is formed, the processing unit 3 is a circuit network (resistor 72 and (s) that is connected to the two check points TP1 and TP2, for example, when the capacitor 73 is the inspection target part ob. The series circuit of the capacitor 73 is specified as a specific circuit network. Further, when the resistor 78 is set as the inspection target part ob, the circuit network (the circuit having only the resistor 78) connected to the two inspection points TP2 and TP4 is specified as a specific circuit network. Further, when the diode 74 is used as the inspection target part ob, a circuit network (resistor 72, diode 74, and combined resistor (resistance of resistors 75, 76) connected to the two check points TP1, TP3 is used. A series circuit of a parallel synthesis resistor with a resistor 77) is specified as a specific circuit network.
此外,關於該等電容器73、電阻78及二極體74,即使在斷線故障及短路故障之任何故障之時,以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1係與相對應的正常時檢查結果REno1為相異,此外,以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2係與相對應的正常時檢查結果REno2為相異。因此,處理部3係與上述電阻72之時為相同,作成關於各個檢查對象零件ob的個別檢查用資料D。 Further, regarding the capacitors 73, the resistors 78, and the diodes 74, even when there is any failure of the disconnection failure and the short-circuit failure, the failure-time inspection results REabo1 and REabs1 at the time of the impedance inspection function fc1 are checked and corresponding. The normal inspection result REno1 is different, and the failure inspection result REabo2 and REabs2 at the time of the current inspection function fc2 are different from the corresponding normal inspection result REno2. Therefore, the processing unit 3 is the same as the above-described resistor 72, and the individual inspection data D for each inspection target part ob is created.
另一方面,關於上述構成合成電阻的電阻75、76、77之中的1個電阻,對應與其他電阻的電阻值的關係,與上述 電容器73、電阻78及二極體74同樣地,即使在斷線故障及短路故障的任何故障之時,亦有形成為以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1與相對應的正常時檢查結果REno1為相異,而且,以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2與相對應的正常時檢查結果REno2為相異的狀態的情形。此外,按照與其他電阻的電阻值的關係,會有以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1之中的至少一方形成為與相對應的正常時檢查結果REno1為不相異的狀態(成為相同的狀態),或另外以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2之中的至少一方成為與相對應的正常時檢查結果REno2為不相異的狀態(成為相同的狀態)的情形。 On the other hand, one of the resistors 75, 76, and 77 constituting the combined resistor corresponds to the resistance value of the other resistor, and Similarly, even in the case of any failure of the disconnection failure or the short-circuit failure, the capacitor 73, the resistor 78, and the diode 74 are formed to have the failure-time inspection results REabo1, REabs1 and the corresponding normality when the impedance inspection function fc1 is inspected. The time check result REno1 is different, and the failure check result REabo2, REabs2 at the time of the current check function fc2 and the corresponding normal time check result REno2 are different. Further, according to the relationship with the resistance value of the other resistor, at least one of the failure-time inspection results REabo1 and REabs1 when the impedance inspection function fc1 is inspected is formed to be different from the corresponding normal-time inspection result REno1. At least one of the fault detection results REabo2 and REabs2 at the time of the state (in the same state) or the current check function fc2 is in a state different from the corresponding normal time check result REno2 (the same is true) Situation).
此時,關於例如電阻75、76、77之中的1個電阻,即使為斷線故障及短路故障之任何故障之時,以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1與相對應的正常時檢查結果REno1為相異,此外,以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2與相對應的正常時檢查結果REno2為相異的狀態之時,係與上述電容器73、電阻78及二極體74同樣地,作成將各自設為檢查對象零件ob之時的個別檢查用資料。 At this time, with respect to, for example, one of the resistors 75, 76, and 77, even if there is any failure of the disconnection failure and the short-circuit failure, the failure-time inspection results REabo1 and REabs1 at the time of the impedance inspection function fc1 are checked. The normal time check result REno1 is different, and when the fault check result REabo2, REabs2 at the time of the current check function fc2 check is different from the corresponding normal time check result REno2, the capacitor 73 is In the same manner, the resistors 78 and the diodes 74 are used as individual inspection materials when each of the inspection target parts ob is used.
另一方面,例如,當將電阻77作為檢查對象零件ob,而且將在與上述二極體74之時為相同的電路網作為特定電路網時,電阻77的電阻值比其他電阻75、76的串聯合成電阻值為極大時,係發生以阻抗檢查功能fc1檢查時的故障時檢 查結果REabo1、REabs1之中的短路故障時的故障時檢查結果REabs1係與正常時檢查結果REno1為相異,但是斷線故障時的故障時檢查結果REabo1係與正常時檢查結果REno1為不相異的狀況。其中,此時,關於以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2,亦發生其中的短路故障時的故障時檢查結果REabs2係與正常時檢查結果REno2為相異,但是斷線故障時的故障時檢查結果REabo2係與正常時檢查結果REno2為不相異的狀況。 On the other hand, for example, when the resistor 77 is used as the inspection target part ob, and the same circuit network as that of the above-described diode 74 is used as the specific circuit net, the resistance value of the resistor 77 is higher than that of the other resistors 75, 76. When the series combined resistance value is extremely large, the fault detection is performed when the impedance check function fc1 is checked. When the short-circuit fault in the REabo1 and REabs1 is checked, the result of the fault detection REabs1 is different from the normal check result REno1, but the fault check result REabo1 at the time of the disconnection fault is not different from the normal check result REno1. The situation. In this case, the failure time inspection result REabs2 in the case of the failure detection result REabo2 and REabs2 when the current inspection function fc2 is inspected is different from the normal time inspection result REno2, but the disconnection failure is different. The time-of-failure check result REabo2 is in a state different from the normal-time check result REno2.
因此,處理部3係使將電阻77作為檢查對象零件ob檢查時所使用的檢查點TP1、TP3的資訊、及用以檢查電阻77是否呈短路故障的個別檢查用資料Dtes(以阻抗檢查功能fc1及電流檢查功能fc2之中其中一方檢查功能fc檢查正常電路網之檢查內容的個別檢查用資料),在與電阻77產生關連的狀態下記憶在記憶部4,作為關於將電阻77作為檢查對象零件ob之該特定電路網的個別檢查用資料。其中,關於電阻77,係在斷線故障時,處於阻抗檢查功能fc1及電流檢查功能fc2之任何故障時檢查結果REabo1、REabo2亦與相對應的正常時檢查結果REno1、REno2為不相異的狀況。因此,處理部3係關於電阻77,關於斷線故障係特定為無法檢查的零件,關於顯示該要旨的資訊,亦作為關於電阻77的個別檢查用資料的一部分,在與電阻77產生關連的狀態下記憶在記憶部4。 Therefore, the processing unit 3 is configured to check the information of the check points TP1 and TP3 used when the resistor 77 is the inspection target component ob, and the individual inspection data Dtes for checking whether the resistor 77 is short-circuited (with the impedance check function fc1). And one of the current check functions fc2, which checks the function of the inspection of the normal circuit network, is stored in the memory unit 4 in a state in which the resistor 77 is associated with the resistor 77. Ob the individual inspection data of this particular circuit network. In the case where the resistor 77 is in the event of a disconnection failure, the check results REabo1 and REabo2 of the impedance check function fc1 and the current check function fc2 are also different from the corresponding normal time check results REno1 and REno2. . Therefore, the processing unit 3 is a component that is incapable of being inspected for the disconnection failure, and the information indicating the purpose is also related to the resistance 77 as a part of the individual inspection data for the resistor 77. The memory is in memory 4.
此外,例如,當將電阻75設為檢查對象零件ob,而且將與上述二極體74之時為相同的電路網設為正常電路網時,係電阻75的電阻值小、而且與該電阻75作串聯連接之電 阻76的電阻值為極大的情形下,且電阻77的電阻值比電阻76的電阻值為極小的情形下(例如電阻75為10Ω,電阻76為10MΩ,而且電阻77為100Ω時),處於以阻抗檢查功能fc1檢查時的故障時檢查結果REabo1、REabs1之雙方與正常時檢查結果REno1為不相異的狀況。此外,此時關於以電流檢查功能fc2檢查時的故障時檢查結果REabo2、REabs2,亦處於該雙方為與正常時檢查結果REno2為不相異的狀況。 Further, for example, when the resistor 75 is set as the inspection target part ob and the same circuit network as that of the above-described diode 74 is a normal circuit network, the resistance value of the resistor 75 is small, and the resistor 75 is Electric connection in series When the resistance value of the resistor 76 is extremely large, and the resistance value of the resistor 77 is extremely smaller than the resistance value of the resistor 76 (for example, the resistor 75 is 10 Ω, the resistor 76 is 10 MΩ, and the resistor 77 is 100 Ω), In the case of the failure check function fc1, the check results of the check results REabo1 and REabs1 are not different from the normal check result REno1. Further, at this time, the failure time inspection results REabo2 and REabs2 at the time of the current inspection function fc2 are also in a state in which the two are not different from the normal time inspection result REno2.
因此,處理部3係使將電阻75作為檢查對象零件ob檢查時所使用的檢查點TP1、TP3的資訊、及表示即使使用阻抗檢查功能fc1及電流檢查功能fc2的任何檢查功能fc,亦無法針對斷線故障及短路故障之任一者進行檢查之要旨(為無法檢查的零件的要旨)的資訊,與電阻75產生關連地記憶在記憶部4,作為關於將電阻75作為檢查對象零件ob之該特定電路網的個別檢查用資料。 Therefore, the processing unit 3 does not allow the information of the check points TP1 and TP3 used when the resistor 75 is inspected as the inspection target component ob, and any inspection function fc indicating that the impedance check function fc1 and the current check function fc2 are used. The information of any of the disconnection failure and the short-circuit failure (in the gist of the undetectable component) is stored in the memory unit 4 in association with the resistor 75, and the resistance 75 is used as the inspection target part ob. Individual inspection data for a specific circuit network.
處理部3係反覆執行步驟81~步驟87,在步驟87中判別出關於全部檢查對象零件ob的個別檢查用資料的作成已完成(亦即,沒有個別檢查用資料未作成的檢查對象零件ob)時,即完成檢查用資料作成處理80。最後,處理部3係執行輸出處理,讀出在檢查用資料作成處理80中作成而記憶在記憶部4之關於各檢查對象零件ob的個別檢查用資料全體,作為檢查用資料Dte而輸出至輸出部5。 The processing unit 3 executes the steps 81 to 87 in the same manner, and in the step 87, it is determined that the preparation of the individual inspection materials for all the inspection target parts ob has been completed (that is, the inspection target part ob which is not prepared for the individual inspection materials). At this time, the inspection data creation processing 80 is completed. Finally, the processing unit 3 executes the output processing, and reads out the entire individual inspection data stored in the inspection data creation processing 80 and stored in the storage unit 4 for each inspection target component ob, and outputs it to the output as the inspection data Dte. Department 5.
在電路基板71檢查時,在基板檢查裝置中,使用上述檢查用資料Dte,檢查被構裝在電路基板71的電子零件,判別電路基板71的良否。 When the circuit board 71 is inspected, the substrate inspection apparatus uses the inspection data Dte to inspect the electronic components mounted on the circuit board 71, and determines whether or not the circuit board 71 is good or not.
如上所示,在該檢查用資料作成裝置1、檢查用資料作成方法、及上述記錄有程式之電腦可讀取記錄媒體中,執行零件選擇處理、正常網表作成處理、故障網表作成處理、正常時模擬處理、故障時模擬處理、及個別檢查用資料作成處理,基板檢查裝置所具有之每個檢查功能fc的正常時檢查結果REno、及以與該正常時檢查結果REno為相同的檢查功能fc檢查時的故障時檢查結果REab(在1或2以上的故障狀態之中的任意1個故障狀態下,使用使檢查對象零件ob故障時的故障電路網的模擬下的檢查結果)為相異的檢查功能fc存在1種類或2種類以上時,將以其中1個檢查功能fc檢查在正常網表作成處理中所特定的特定電路網的檢查內容,設為用以檢查檢查對象零件ob在上述任意1個故障狀態下是否故障的檢查用資料Dte。 As described above, in the inspection data creation device 1, the inspection data creation method, and the computer-readable recording medium on which the program is recorded, part selection processing, normal netlist creation processing, and fault nettable creation processing are performed. The normal-time simulation processing, the failure-time simulation processing, and the individual inspection data creation processing, the normal-time inspection result REno of each inspection function fc of the substrate inspection apparatus, and the inspection function identical to the normal-time inspection result REno The failure check result REab at the time of the fc check (in the case of any one of the failure states of 1 or 2 or more, the inspection result under the simulation of the faulty circuit network when the inspection target part ob fails) is different When there is one type or two types or more of the inspection function fc, the inspection content of the specific circuit network specified in the normal net list creation processing is checked by one of the inspection functions fc, and the inspection target part ob is used as described above. Check data Dte for failure in any one fault state.
因此,藉由該檢查用資料作成裝置1、檢查用資料作成方法、及上述記錄有程式之電腦可讀取記錄媒體,基於被內置於電路基板71等理由,關於在其兩端未設定(連接)有檢查點TP的電子零件(在上述之例中為二極體74及電阻75)的個別檢查用資料,亦可充分提高自動的作成率。因此,可使關於根據由關於各電子零件之個別檢查用資料所構成的檢查用資料Dte的電路基板71的檢查覆蓋率充分提升。 Therefore, the inspection data creation device 1, the inspection data creation method, and the computer-readable recording medium on which the program is recorded are not set at both ends because they are built in the circuit board 71 or the like. The individual inspection data of the electronic parts (in the above-described example, the diode 74 and the resistor 75) having the check point TP can also sufficiently increase the automatic production rate. Therefore, the inspection coverage of the circuit board 71 based on the inspection data Dte composed of the individual inspection materials for the respective electronic components can be sufficiently improved.
此外,藉由該檢查用資料作成裝置1、檢查用資料作成方法、及上述記錄有程式之電腦可讀取記錄媒體,若不存在正常時檢查結果REno與故障時檢查結果REab為相異的檢查功能fc時,係將檢查對象零件ob特定為無法檢查的零件, 並且將該要旨設為個別檢查用資料,藉此當對使用檢查用資料Dte的電路基板71進行檢查時,可根據個別檢查用資料來特定無法檢查的零件,在預先由檢查對象零件ob省去的狀態(遮蔽的狀態)下執行檢查,因此可縮短檢查時間。 Further, the inspection data creation device 1, the inspection data creation method, and the computer-readable recording medium on which the program is recorded may be different if there is no normal inspection result REno and the failure inspection result REab is different. When function fc, the object part ob is checked to be a part that cannot be inspected. In addition, when the inspection is performed on the circuit board 71 using the inspection data Dte, the parts that cannot be inspected can be specified based on the individual inspection materials, and the parts to be inspected are omitted in advance. The inspection is performed under the state (shaded state), so the inspection time can be shortened.
其中,在上述之例中,係說明基板檢查裝置的檢查功能fc為阻抗檢查功能fc1及電流檢查功能fc2之2個的情形,惟檢查功能fc亦可為1個,亦可為3個以上。此外,在上述之例中,亦可採用以下構成:由於基板檢查裝置的檢查功能fc為阻抗檢查功能fc1及電流檢查功能fc2,因此將與特定電路網相連接的檢查點TP的數量設為2個,但是例如基板檢查裝置在對一對檢查點TP間施加電壓的狀態下,包括檢測由其他一對檢查點TP間被輸出的電壓的電壓檢測功能作為檢查功能fc時,係將與特定電路網相連接的檢查點TP的數量設為4個(若電壓施加側的一對檢查點TP的1個、及電壓檢測側的一對檢查點TP的1個為共通時,即為3個)。 In the above-described example, the inspection function fc of the substrate inspection device is two of the impedance inspection function fc1 and the current inspection function fc2, but the inspection function fc may be one or three or more. Further, in the above-described example, the inspection function fc of the substrate inspection device may be the impedance inspection function fc1 and the current inspection function fc2, so that the number of checkpoints TP connected to the specific circuit network is set to 2 For example, when the voltage is applied between the pair of inspection points TP, the substrate inspection device includes a voltage detection function for detecting a voltage outputted between the other pair of inspection points TP as the inspection function fc, and the specific circuit is used. The number of checkpoints TP connected to the network is set to four (three if a pair of checkpoints TP on the voltage application side and one of the pair of checkpoints TP on the voltage detection side are common) .
此外,亦可採用以下構成:未圖示的外部裝置執行上述檢查用資料作成處理80之中的零件選擇處理(步驟81)、正常網表作成處理(步驟82)、及故障網表作成處理(步驟83),作成按每個檢查對象零件ob的正常電路網表NEno及故障電路網表NEab,且檢查用資料作成裝置1取入在該外部裝置所作成的正常電路網表NEno及故障電路網表NEab且記憶在記憶部4,並且使用該正常電路網表NEno及故障電路網表NEab,執行上述正常時模擬處理(步驟84)、故障時模擬處理(步驟85)、及個別檢查資料作成處理(步驟86),藉此作 成用以檢查特定電路網所包含的檢查對象零件ob的個別檢查用資料Dteo。 In addition, an external device (not shown) may perform part selection processing (step 81), normal net list creation processing (step 82), and failure net table creation processing in the inspection data creation processing 80 (step). Step 83), the normal circuit net list NEno and the fault circuit net list NEab for each inspection target part ob are created, and the inspection data creation device 1 takes in the normal circuit net list NEno and the fault circuit network made in the external device. The table NEab is stored in the memory unit 4, and the normal circuit simulation table (step 84), the failure time simulation process (step 85), and the individual inspection data creation processing are executed using the normal circuit net list NEno and the fault circuit net list NEab. (Step 86), by doing this The individual inspection data Dteo for inspecting the inspection target part ob included in the specific circuit network.
此外,在上述之例中,係將如被構裝在電路基板71的電子零件(被裝設在電路基板71的表面的電子零件、及內置於電路基板71的電子零件)般的電路要素作為檢查對象零件ob,但是例如,關於如將電阻體材料的糊膏進行網版印刷在電路基板71的表面,並且施行加熱硬化等處理所形成的電阻體等所示之形成零件,亦可作為電子零件的1個而包含在檢查對象零件ob。 In the above-described example, the circuit components such as the electronic components (the electronic components mounted on the surface of the circuit board 71 and the electronic components built in the circuit board 71) are mounted on the circuit board 71 as the circuit components. In the inspection of the target component ob, for example, a component such as a resistor or the like formed by screen-printing a paste of a resistor material on the surface of the circuit board 71 and performing heat curing or the like may be used as an electron. One of the parts is included in the inspection target part ob.
此外,關於將電子零件彼此作電性連接的導體圖案,亦與上述電子零件同樣地,亦可作為構成電路網的電路要素來處理,而包含在檢查對象零件ob。亦即,亦可採用執行以下處理的構成:在由外部裝置取得正常電路網表NEno及故障電路網表NEab的情形下,當作成使探針接觸被配設在檢查對象基板的表面而與該電路網相連接的檢查點來檢查形成在檢查對象基板(電路基板)之構成電路網的互相作電性連接的複數電路要素(電子零件及導體圖案)之中的至少1個電路要素時供該電路網用的個別檢查用資料時,根據將該複數電路要素形成為全部正常狀態時的正常電路網表,執行以對正常狀態的電路網被預先規定的檢查內容(例如基板檢查裝置的檢查功能fc)進行檢查的模擬而求出正常時檢查結果的正常時模擬處理;根據將該複數電路要素之中的至少1個電路要素作為檢查對象而形成為故障狀態,而且將剩餘的電路要素全部形成為正常狀態時的故障電路網表,執行對故障狀態的電路網以該檢查 內容進行檢查的模擬而求出故障時檢查結果的故障時模擬處理;及將正常時檢查結果與故障時檢查結果為相異時的該檢查內容,設為檢查檢查對象時的個別檢查用資料的個別檢查用資料作成處理。藉此,不僅電子零件,關於導體圖案(亦包含導體圖案與電子零件的接合部位),亦可針對其接合狀態(斷線的有無)進行檢查。 Further, the conductor pattern for electrically connecting the electronic components to each other may be processed as a circuit component constituting the circuit network, and may be included in the inspection target component ob, similarly to the above-described electronic component. In other words, in the case where the normal circuit net list NEno and the fault circuit net list NEab are acquired by the external device, the probe is placed in contact with the surface of the test target substrate. When at least one of the plurality of circuit elements (electronic components and conductor patterns) that are electrically connected to each other in the constituent circuit net of the inspection target substrate (circuit substrate) is inspected, it is provided for inspection. In the case of the individual inspection data for the circuit network, the inspection content that is predetermined for the circuit network in the normal state is performed based on the normal circuit netlist when the plurality of circuit elements are formed in the normal state (for example, the inspection function of the substrate inspection device) Fc) a normal-time simulation process for obtaining a normal-time inspection result by performing a simulation of the inspection; forming a failure state by at least one of the plurality of circuit elements as an inspection target, and forming the remaining circuit elements For the faulty circuit netlist in the normal state, perform the check on the circuit network of the fault state. When the content is checked and the simulation is performed, the failure time simulation process is performed; and when the normal inspection result and the failure time inspection result are different, the inspection content is set as the individual inspection data when the inspection target is inspected. Individual inspection data are processed. Thereby, not only the electronic component but also the conductor pattern (including the joint portion of the conductor pattern and the electronic component) can be inspected for the joint state (the presence or absence of the disconnection).
此外,由外部裝置僅取得正常電路網表NEno,且關於故障電路網表NEab,亦可採用在檢查用資料作成處理80中執行的構成。此時,關於正常電路網表NEno所包含的電路要素,執行一邊按照被預先規定的順序,變更設為檢查對象的至少1個電路要素,一邊形成為故障狀態而作成複數故障電路網表的故障網表作成處理,在故障時模擬處理中,係根據如上所示所作成的故障電路網表來執行模擬。 Further, only the normal circuit net list NEno is obtained by the external device, and the failure circuit net list NEab may be configured to be executed in the inspection data creation processing 80. At this time, in the circuit element included in the normal circuit net list NEno, the failure is made to change the at least one circuit element to be inspected in accordance with a predetermined order, and the fault condition is generated to form a complex fault circuit netlist. The netlist creation process, in the fault-time simulation process, performs simulation based on the fault circuit netlist made as shown above.
此外,在上述之例中,如第2圖所示之形成在電路基板71的電路般,亦可採用以下構成:對於任何電路要素(電子零件及導體圖案)亦與其他電路要素作電性連接的電路網,按每個檢查對象零件ob,執行特定1個包含該檢查對象零件ob的特定電路網(全體電路網之中的一部分電路網),來作成該正常電路網表NEno的處理,藉此不會作成白費的正常電路網表NEno,但是特定全部被連接在與該電路網相連接的複數檢查點之中的任一者與其他任一者之間的上述一部分電路網,按經特定之該一部分每個電路網作成正常電路網表NEno,根據該所作成的正常電路網表NEno,使該網表所包含的至少1個電路要素故障而作成故障電路網表NEab,而且使 用如上所示所作成的正常電路網表NEno及故障電路網表NEab,執行上述正常時模擬處理(步驟84)、故障時模擬處理(步驟85)及個別檢查資料作成處理(步驟86),藉此作成供檢查該全體的電路網所包含的檢查對象零件ob之用的個別檢查用資料Dteo。 Further, in the above-described example, as in the circuit formed on the circuit board 71 as shown in FIG. 2, a configuration may be adopted in which any circuit element (electronic component and conductor pattern) is electrically connected to other circuit elements. In the circuit network, a specific circuit network (a part of the circuit network of the entire circuit network) including the inspection target part ob is executed for each inspection target part ob, and the normal circuit net table NEno is processed. This does not make a vain normal circuit net list NEno, but a part of the circuit network that is specifically connected between any one of the plurality of checkpoints connected to the circuit network and any other one is specifically Each part of the circuit network is formed as a normal circuit net list NEno, and according to the normal circuit net list NEno made, the at least one circuit element included in the net list is broken to form a fault circuit net list NEab, and The above-described normal time simulation processing (step 84), fault time simulation processing (step 85), and individual inspection data creation processing (step 86) are performed by using the normal circuit net list NEno and the fault circuit net list NEab which are formed as described above. In this case, the individual inspection data Dteo for inspecting the inspection target part ob included in the entire circuit network is prepared.
關於該構成,對第2圖所示之電路網,列舉例如使用2個檢查點來作成供檢查之用的個別檢查用資料Dteo之例,具體說明至作成正常電路網表NEno及故障電路網表NEab為止。此時,由檢查點TP1~TP4之中選擇2個檢查點TP的組合係存在(TP1,TP2)、(TP1,TP3)、(TP1,TP4)、(TP2,TP3)、(TP2,TP4)、(TP3,TP4)等6組。 In the circuit network shown in FIG. 2, for example, an example of the individual inspection data Dteo for inspection is used by using two checkpoints, and specifically, the normal circuit netlist NEno and the fault circuit netlist are created. Until NEab. In this case, the combination of two checkpoints TP is selected from the checkpoints TP1 to TP4 (TP1, TP2), (TP1, TP3), (TP1, TP4), (TP2, TP3), (TP2, TP4). , (TP3, TP4) and other six groups.
藉此,例如若僅將電子零件設為電路要素時(不將導體圖案設為電路要素時),作成關於(TP1,TP2)之成組的正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號102〔電容器73-2,檢查點TP2〕)、關於(TP1,TP3)之成組的2個正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號104〔二極體74-2,電阻77-1〕、清單編號105〔電阻77-2,檢查點TP3〕)、及正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號106〔二極體74-2,電阻75-1〕、清單編號107〔電阻75-2,電阻76-1〕、清單編號108〔電阻76-2,電阻77-2〕、清單編號105〔電阻77-2,檢查點TP3〕)。 In this case, for example, when only the electronic component is a circuit element (when the conductor pattern is not a circuit element), a normal circuit net list NEno (group number 100) (check list TP1) for (TP1, TP2) is created. , resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1), list number 102 [capacitor 73-2, checkpoint TP2]), and two groups of (TP1, TP3) are normal. Circuit net list NEno (List No. 100 [Checkpoint TP1, Resistor 72-1], List No. 103 [Resistance 72-2, Diode 74-1], List No. 104 [Diode 74-2, Resistor 77- 1], list number 105 [resistor 77-2, checkpoint TP3), and normal circuit netlist NEno (list number 100 [checkpoint TP1, resistor 72-1], list number 103 [resistor 72-2, diode Body 74-1], list number 106 [diode 74-2, resistor 75-1], list number 107 [resistor 75-2, resistor 76-1], list number 108 [resistor 76-2, resistor 77- 2], list number 105 [resistance 77-2, check point TP3)).
此外,作成關於(TP1,TP4)之成組的正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕)、關於(TP2,TP3)之成組的2個正常電路網表NEno(清單編號102〔檢查點TP2,電容器73-2〕、清單編號101〔電容器73-1,電阻72-2〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號104〔二極體74-2,電阻77-1〕、清單編號105〔電阻77-2,檢查點TP3〕)、及正常電路網表NEno(清單編號102〔檢查點TP2,電容器73-2〕、清單編號101〔電容器73-1,電阻72-2〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號106〔二極體74-2,電阻75-1〕、清單編號107〔電阻75-2,電阻76-1〕、清單編號108〔電阻76-2,電阻77-2〕、清單編號105〔電阻77-2,檢查點TP3〕)。 In addition, a normal circuit net list NEno (list number 100 [check point TP1, resistance 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number) for grouping (TP1, TP4) is created. 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, checkpoint TP4), and two normal circuit netlists NEno of (TP2, TP3) (List No. 102 [ Check point TP2, capacitor 73-2], list number 101 [capacitor 73-1, resistor 72-2], list number 103 [resistor 72-2, diode 74-1], list number 104 [diode 74 -2, resistor 77-1], list number 105 [resistor 77-2, checkpoint TP3), and normal circuit netlist NEno (list no. 102 [checkpoint TP2, capacitor 73-2], list number 101 [capacitor 73-1, resistor 72-2], list number 103 [resistor 72-2, diode 74-1], list number 106 [diode 74-2, resistor 75-1], list number 107 [resistor 75 -2, resistor 76-1], list number 108 [resistor 76-2, resistor 77-2), list number 105 [resistor 77-2, check point TP3).
此外,作成關於(TP2、TP4)之成組的正常電路網表NEno(清單編號102〔檢查點TP2,電容器73-2〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕)、及關於(TP3,TP4)之組的2個正常電路網表NEno(清單編號105〔電阻77-2,檢查點TP3〕、清單編號104〔二極體74-2,電阻77-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕)、及正常電路網表NEno(清單編號105〔電阻77-2,檢查點TP3〕、清單編號108〔電阻76-2,電阻77-2〕、清單編 號107〔電阻75-2,電阻76-1〕、清單編號106〔二極體74-2,電阻75-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕)。 Further, a normal circuit net list NEno (list No. 102 [check point TP2, capacitor 73-2], list number 109 [capacitor 73-2, resistance 78-1], list number) for the group of (TP2, TP4) is created. 110 [resistor 78-2, checkpoint TP4]), and two normal circuit netlists NEno (group number 105 [resistance 77-2, checkpoint TP3], list number 104 [two] of the group of (TP3, TP4) Polar body 74-2, resistor 77-1], list number 103 [resistor 72-2, diode 74-1], list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73 -2, resistor 78-1], list number 110 [resistor 78-2, checkpoint TP4), and normal circuit netlist NEno (list no. 105 [resistor 77-2, checkpoint TP3], list number 108 [resistance 76-2, resistance 77-2], list No. 107 [resistance 75-2, resistance 76-1], list number 106 [diode 74-2, resistance 75-1], list number 103 [resistor 72-2, diode 74-1), list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, check point TP4).
此外,根據如上所示所作成的各正常電路網表NEno,使該網表所包含的至少1個電路要素故障而作成故障電路網表NEab。具體而言,若列舉關於(TP1、TP2)之成組的正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號102〔電容器73-2,檢查點TP2〕)為例,該網表所包含的電子零件由於為電阻72及電容器73,因此作成使電阻72及電容器73之中的至少1個故障時的故障電路網表NEab。藉此,根據所作成的正常電路網表NEno及故障電路網表NEab,作成個別檢查用資料Dteo。 Further, based on the normal circuit net list NEno created as described above, at least one circuit element included in the net list is broken to form a fault circuit net list NEab. Specifically, a normal circuit net list NEno (list no. 100 [check point TP1, resistance 72-1], list number 101 [resistor 72-2, capacitor 73-1] in the group of (TP1, TP2) is listed. For example, in the list No. 102 [capacitor 73-2, check point TP2]), since the electronic components included in the net list are the resistor 72 and the capacitor 73, at least one of the resistor 72 and the capacitor 73 is broken. Fault circuit netlist NEab. Thereby, the individual inspection data Dteo is created based on the created normal circuit net list NEno and the fault circuit net list NEab.
此外,在基板檢查裝置所具有的上述阻抗檢查功能fc1、電流檢查功能fc2及電壓檢查功能中,係執行對一對檢查點間施加電壓,但是依基板檢查裝置,亦有可將該所施加的電壓的電壓值設定為多階段(n階段。n為2以上的整數)者。為了作成該類基板檢查裝置用的個別檢查用資料,若適用上述檢查用資料作成裝置或檢查用資料作成方法時,在模擬中,對各正常電路網表NEno、及根據該各正常電路網表NEno所作成的各故障電路網表NEab的各個,一邊將所施加的電壓的電壓值設定為在全部階段的電壓值,一邊使用基板檢查裝置所具有的全部檢查功能(在上述之例中,為阻抗檢查功能fc1、 電流檢查功能fc2及電壓檢查功能等),作成個別檢查用資料。 Further, in the impedance inspection function fc1, the current inspection function fc2, and the voltage inspection function of the substrate inspection device, a voltage is applied between the pair of inspection points, but the substrate inspection device may apply the voltage. The voltage value of the voltage is set to a plurality of stages (n stages. n is an integer of 2 or more). In order to create the individual inspection data for the substrate inspection apparatus, if the inspection data creation apparatus or the inspection data creation method is applied, in the simulation, each normal circuit net list NEno and the normal circuit net list are used. Each of the fault circuit nets NEab made by NEno uses all the inspection functions of the substrate inspection device while setting the voltage value of the applied voltage to the voltage value at all stages (in the above example, Impedance check function fc1 The current check function fc2 and the voltage check function are used to create individual inspection data.
但是,在將在各檢查功能中所施加的電壓的電壓值設定為在全部階段(n階段)的電壓值的構成中,對可根據在施加某1個階段的電壓值的電壓的正常時模擬處理及故障時模擬處理中所得之正常時檢查結果及故障時檢查結果,作成個別檢查用資料的電路要素(電子零件及導體圖案等),執行施加另外其他階段的電壓值的電壓的正常時模擬處理及故障時模擬處理、以及個別檢查用資料作成處理的結果,存在有模擬全體下的計算量變得極多,檢查用資料作成處理所需時間變得極長的課題。 However, in the configuration in which the voltage value of the voltage applied to each of the inspection functions is set to the voltage value at all stages (n-stage), the normal time simulation can be performed based on the voltage at which the voltage value of one of the stages is applied. The normal time inspection result and the failure time inspection result obtained in the simulation process at the time of the processing and the failure, and the circuit elements (electronic parts, conductor patterns, etc.) for the individual inspection data are generated, and the normal time simulation of applying the voltage of the other phase is performed. As a result of the processing of the processing of the faults and the processing of the data for the individual inspections, the calculation amount of the entire simulation is extremely large, and the time required for the inspection data creation processing becomes extremely long.
因此,對各正常電路網表NEno及各故障電路網表NEab的各個,執行以n階段的電壓值之中的1個電壓值施加電壓的模擬(使用全部檢查功能的模擬)的結果,關於以對正常電路網的模擬所得的模擬結果(正常時檢查結果)、及以對故障電路網的模擬所得的模擬結果(故障時檢查結果)為相異的模擬即使存在有1種類的電路要素(在使用至少1個檢查功能的模擬中,正常時檢查結果與故障時檢查結果為相異的電路要素),較佳為省略以n階段的電壓值之中之剩餘的電壓值施加電壓的模擬,藉此減低在模擬全體的計算量,而更加縮短至作成個別檢查用資料為止所需時間。 Therefore, for each of the normal circuit net list NEno and each of the fault circuit nets NEab, a simulation of applying a voltage to one of the n-stage voltage values (simulation using all the inspection functions) is performed, and The simulation result obtained by the simulation of the normal circuit network (the normal time inspection result) and the simulation result (the failure time inspection result) obtained by the simulation of the faulty circuit network are different, even if there is one type of circuit element (in In the simulation using at least one inspection function, the normal time inspection result is different from the fault detection result, and it is preferable to omit the simulation of applying the voltage to the remaining voltage value among the n-stage voltage values. This reduction is simulated in the entire calculation amount, and is shortened to the time required to create individual inspection materials.
此時,在基板檢查裝置之中,亦存在一種可將所施加的電壓的電壓值在由其下限值至上限值之間以例如0.1V的一定的電壓步驟設定成多階段者,但是如第2圖所示之電路基板71般,在包含將如二極體74的半導體元件(依所被施加 的電壓的電壓值為超出該順向電壓值Vf的電壓值、或為未達順向電壓值Vf的電壓值,移至2個狀態之中的任一狀態的元件(在二極體中,係移至ON狀態及OFF狀態的2個狀態之中的任一狀態))作為電路要素的電路基板作為檢查對象的基板檢查裝置中,以多階段之一例而言,一般為以將電壓值設定成未達順向電壓值Vf的電壓值V1、及超出順向電壓值Vf的電壓值V2(>Vf>V1>0)的2階段者。 At this time, in the substrate inspection apparatus, there is also a possibility that the voltage value of the applied voltage is set to a plurality of stages from a lower limit value to an upper limit value by a constant voltage step of, for example, 0.1 V, but In the same manner as the circuit board 71 shown in FIG. 2, a semiconductor element such as a diode 74 is included (as applied The voltage value of the voltage is a voltage value exceeding the forward voltage value Vf or a voltage value that does not reach the forward voltage value Vf, and is moved to an element of any of two states (in the diode, In any of the two states of the ON state and the OFF state, the circuit board as the circuit element is a substrate inspection device to be inspected, and in one of the plurality of stages, the voltage value is generally set. It is a two-stage phase in which the voltage value V1 of the forward voltage value Vf and the voltage value V2 (>Vf>V1>0) exceeding the forward voltage value Vf are not reached.
以下係關於以包括可將所施加的電壓的電壓值如上所示規定為2個電壓值V1、V2的功能的基板檢查裝置,作成供檢查第2圖所示之電路基板71之用的個別檢查用資料之例,參照第6圖所示之檢查用資料作成處理90來進行說明。其中,關於與第4圖所示之檢查用資料作成處理80為相同的處理,係標註相同符號且省略重複說明。此外,在執行該檢查用資料作成處理90的檢查用資料作成裝置1中,雖未圖示,在記憶部4係形成為預先記憶有包含用以使處理部3執行檢查用資料作成處理90的程式的動作程式,並且作為多階段的電壓值之一例的上述2個電壓值V1、V2者。 In the following, the substrate inspection device including the function of setting the voltage value of the applied voltage to two voltage values V1 and V2 as described above is used for the individual inspection for checking the circuit substrate 71 shown in FIG. The example of the data is described with reference to the inspection data creation processing 90 shown in Fig. 6. It is to be noted that the same processes as those of the inspection data creation processing 80 shown in FIG. 4 are denoted by the same reference numerals and the description thereof will not be repeated. Further, in the inspection data creation device 1 that executes the inspection data creation processing 90, although not shown, the storage unit 4 is formed to store in advance a processing for causing the processing unit 3 to execute the inspection data creation processing 90. The program of the program is the above two voltage values V1 and V2 as an example of the multi-stage voltage value.
在第6圖所示之檢查用資料作成處理90中,處理部3係首先規定被記憶在記憶部4的2個電壓值V1、V2之中較低者的電壓值V1,作為所施加的電壓的電壓值(步驟91)。接著,處理部3係執行步驟81~步驟86,作成關於在步驟81中所選擇的電子零件的個別檢查用資料Dteo。具體而言,處理部3係在步驟84中,在與包含在步驟81中所選擇的電子零件的正常電路網相連接的檢查用點TP,模擬而求出施加電壓值 V1的電壓之以檢查功能fc檢查該正常電路網時的正常時檢查結果REno。此外,處理部3係在步驟85中,在與包含在步驟81中所選擇的電子零件的故障電路網相連接的檢查用點TP,模擬而求出施加電壓值V1的電壓之以檢查功能fc檢查該故障電路網時的故障時檢查結果REab。此外,處理部3係在步驟86中,將正常時檢查結果REno與故障時檢查結果REab進行比較而為相異之時,係作成將以求出各檢查結果REno、REab時的檢查內容檢查包含在步驟81中所選擇的電子零件的特定電路網的檢查內容,作為個別檢查用資料Dteo。 In the inspection data creation processing 90 shown in FIG. 6, the processing unit 3 first specifies the voltage value V1 which is the lower of the two voltage values V1 and V2 stored in the storage unit 4 as the applied voltage. Voltage value (step 91). Next, the processing unit 3 executes steps 81 to 86 to create an individual inspection document Dteo regarding the electronic component selected in step 81. Specifically, in step 84, the processing unit 3 simulates the applied voltage value by the inspection point TP connected to the normal circuit network including the electronic component selected in step 81. The voltage of V1 is checked by the check function fc for the normal time check result REno of the normal circuit network. Further, in step 85, the processing unit 3 simulates the voltage of the applied voltage value V1 by the inspection point TP connected to the faulty circuit network including the electronic component selected in step 81 to check the function fc. Check the result REab when checking the faulty circuit network. Further, in step 86, when the normal time inspection result REno is compared with the failure time inspection result REab and is different, the processing unit 3 is configured to include the inspection contents when the respective inspection results REno and REab are obtained. The inspection content of the specific circuit network of the electronic component selected in step 81 is used as the individual inspection data Dteo.
處理部3係一邊判別在步驟92中是否有未選擇的零件(亦即,在步驟81中的零件選擇處理是否已選擇全部電子零件),一邊執行步驟81~步驟86至沒有未選擇的零件為止。處理部3係當在該步驟92中判別出沒有未選擇的零件(亦即,在步驟81的零件選擇處理中全部電子零件均被選擇)時,判別關於作為檢查對象的全部電子零件的個別檢查用資料Dteo的作成是否已完成(亦即,是否有個別檢查用資料Dteo未作成的檢查對象零件ob)(步驟93)。 The processing unit 3 determines whether or not there are unselected parts in step 92 (that is, whether or not all the electronic parts have been selected in the part selection processing in step 81), and steps 81 to 86 are executed until there are no unselected parts. . When the processing unit 3 determines in the step 92 that there are no unselected parts (that is, all the electronic parts are selected in the part selection processing of the step 81), the processing unit 3 determines the individual inspection of all the electronic parts to be inspected. Whether or not the creation of the data Dteo has been completed (that is, whether or not there is an inspection target part ob which the individual inspection data Dteo has not created) (step 93).
處理部3係當在步驟93中判別出關於作為檢查對象的全部電子零件的個別檢查用資料Dteo的作成已完成(亦即,沒有個別檢查用資料Dteo未作成的檢查對象零件ob)時,使該檢查用資料作成處理90完成。另一方面,處理部3係當在步驟93中判別出關於作為檢查對象的全部電子零件的個別檢查用資料Dteo的作成未完成(亦即,存在有個別檢查用資料Dteo未作成的檢查對象零件ob)時,即移至步驟94。 When the processing unit 3 determines that the creation of the individual inspection document Dteo for all the electronic components to be inspected is completed (that is, the inspection target component ob which is not created by the individual inspection data Dteo) is completed in step 93, This inspection is completed by the data creation processing 90. On the other hand, the processing unit 3 determines in the step 93 that the preparation of the individual inspection data Dteo for all the electronic components to be inspected is not completed (that is, the inspection target component in which the individual inspection data Dteo is not created) When ob), the process moves to step 94.
此時,例如,如關於第2圖所示之電路基板71的(TP1,TP2)之成組的正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號102〔電容器73-2,檢查點TP2〕)、或關於(TP1,TP4)之成組的正常電路網表NEno(清單編號100〔檢查點TP1,電阻72-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕)所示,當將未包含二極體等半導體元件的網表所包含的電子零件作為檢查對象零件ob而作成該個別檢查用資料時,由於可進行施加低的電壓值V1的電壓之以檢查功能fc的模擬,因此作成關於網表所包含的全部電子零件的個別檢查用資料Dteo。 At this time, for example, the normal circuit net list NEno of the group (TP1, TP2) of the circuit board 71 shown in FIG. 2 (List No. 100 [Check Point TP1, Resistance 72-1], List No. 101 [ Resistor 72-2, capacitor 73-1], list number 102 [capacitor 73-2, checkpoint TP2]), or group of normal circuit netlists NEno (TP1, TP4) (List No. 100 [Checkpoint TP1] , resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, check point TP4] When the electronic component included in the netlist that does not include the semiconductor element such as the diode is used as the inspection target component ob, the voltage for applying the low voltage value V1 can be checked. The simulation of the function fc is made for the individual inspection data Dteo of all the electronic components included in the netlist.
另一方面,如關於(TP1,TP3)之成組的正常電路網表NEno(例如清單編號100〔檢查點TP1,電阻72-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號104〔二極體74-2,電阻77-1〕、清單編號105〔電阻77-2,檢查點TP3〕等)、或關於(TP3,TP4)之成組的正常電路網表NEno(例如清單編號105〔電阻77-2,檢查點TP3〕、清單編號104〔二極體74-2,電阻77-1〕、清單編號103〔電阻72-2,二極體74-1〕、清單編號101〔電阻72-2,電容器73-1〕、清單編號109〔電容器73-2,電阻78-1〕、清單編號110〔電阻78-2,檢查點TP4〕等)所示,當將包含二極體74之網表所包含的電子零件作為檢查對象零件ob時,由於所施加的電壓的電壓值V1為未達二極體74的順向電壓值Vf,因此在模擬中未流通電流。 On the other hand, as for the normal circuit net list NEno of (TP1, TP3) (for example, list number 100 [check point TP1, resistance 72-1], list number 103 [resistance 72-2, diode 74- 1], list number 104 [diode 74-2, resistor 77-1], list number 105 [resistor 77-2, checkpoint TP3), etc., or a group of normal circuit networks (TP3, TP4) Table NEno (for example, list number 105 [resistor 77-2, check point TP3], list number 104 [diode 74-2, resistor 77-1], list number 103 [resistor 72-2, diode 74-1 〕, list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, check point TP4), etc. When the electronic component included in the net list including the diode 74 is used as the inspection target part ob, since the voltage value V1 of the applied voltage is less than the forward voltage value Vf of the diode 74, it is not distributed in the simulation. Current.
因此,針對該等正常電路網表NEno所包含的電子零件之中的電阻72、電容器73及電阻78,根據關於其他(TP,TP)之成組的正常電路網表NEno來作成個別檢查用資料Dteo,但是關於除此之外的電子零件(電阻75、76、77),並未作成個別檢查用資料Dteo。其中,關於二極體74,可進行使該二極體74故障的模擬,因此作成個別檢查用資料Dteo。 Therefore, for the resistor 72, the capacitor 73, and the resistor 78 among the electronic components included in the normal circuit net list NEno, the individual inspection data is created based on the normal circuit net list NEno of the other (TP, TP) groups. Dteo, but the electronic parts (resistors 75, 76, 77) other than this are not made into individual inspection materials Dteo. In the case of the diode 74, the simulation of the failure of the diode 74 can be performed. Therefore, the individual inspection data Dteo is created.
因此,處理部3係在該例中,在步驟93中判別出有個別檢查用資料Dteo為未作成的檢查對象零件ob,接著,規定被記憶在記憶部4的2個電壓值V1、V2之中較高者的電壓值V2作為所施加的電壓的電壓值,亦即,使所施加的電壓的電壓值上升(步驟94),執行關於個別檢查用資料Dteo為未作成的電子零件的個別檢查用資料Dteo的作成。此時,處理部3係以與上述最初的步驟81~步驟87中的處理內容為大致同等的處理內容執行第2次的步驟81~步驟87,藉此作成該個別檢查用資料Dteo。以下係主要說明與最初在步驟81~步驟87的處理內容為不同的步驟,且省略說明關於處理內容為相同的步驟。 Therefore, in the example, the processing unit 3 determines in step 93 that the individual inspection data Dteo is an unprocessed inspection component part ob, and then defines the two voltage values V1 and V2 stored in the memory unit 4. The higher of the voltage value V2 is the voltage value of the applied voltage, that is, the voltage value of the applied voltage is increased (step 94), and the individual inspection of the electronic component for which the individual inspection data Dteo is not completed is performed. Made with the data Dteo. In this case, the processing unit 3 executes the second step 81 to 87 in the processing contents which are substantially equal to the processing contents in the first steps 81 to 87 described above, thereby creating the individual inspection material Dteo. The following mainly describes the steps different from the processing contents initially performed in steps 81 to 87, and the steps in which the processing contents are the same are omitted.
在該第2次的步驟81~步驟87的目的在作成關於個別檢查用資料Dteo為未作成的電子零件的個別檢查用資料Dteo。因此,處理部3係在第2次的步驟81中,僅依序選擇個別檢查用資料Dteo為未作成的電子零件(在本例中僅有電阻75、76、77)作為檢查對象零件ob,反覆執行步驟82至步驟86,至在步驟87中作成關於全部檢查對象零件ob的個別檢查用資料Dteo為止。 In the second step of the step 81 to the step 87, the individual inspection data Dteo for the electronic component that is not created for the individual inspection data Dteo is created. Therefore, in the second step 81, the processing unit 3 selects only the individual inspection materials Dteo as the unprocessed electronic components (in the present example, only the resistors 75, 76, and 77) as the inspection target component ob. Steps 82 to 86 are repeatedly executed until the individual inspection materials Dteo for all the inspection target parts ob are created in step 87.
在該第2次的各模擬處理84、85中,所施加的電壓的電壓值V2超出二極體74的順向電壓值Vf(亦即,藉由施加電壓值V2的電壓,二極體74移至ON狀態)。因此,即使在將包含二極體74之網表所包含的電子零件作為檢查對象零件ob之時,亦可在模擬中在該檢查對象零件ob流通電流。因此,藉由執行該第2次的步驟81~步驟87,關於作為檢查對象零件ob被選擇的電子零件的個別檢查用資料Dteo即全部被作成。最後,處理部3係在步驟87中判別出沒有個別檢查用資料Dteo為未作成的檢查對象零件ob,使第6圖所示之檢查用資料作成處理90完成。 In each of the second simulation processes 84 and 85, the voltage value V2 of the applied voltage exceeds the forward voltage value Vf of the diode 74 (that is, the voltage by applying the voltage value V2, the diode 74) Move to the ON state). Therefore, even when the electronic component included in the net list including the diode 74 is used as the inspection target part ob, a current can flow through the inspection target part ob in the simulation. Therefore, by performing the second step 81 to the step 87, the individual inspection materials Dteo of the electronic component selected as the inspection target part ob are all created. Finally, the processing unit 3 determines in step 87 that the individual inspection document Dteo is not the inspection target component ob, and the inspection data creation processing 90 shown in Fig. 6 is completed.
如上所示,在執行該檢查用資料作成處理90的檢查用資料作成裝置1、該檢查用資料作成處理90(檢查用資料作成方法)、及上述記錄有程式之電腦可讀取記錄媒體中,當作成可將在模擬中施加至包含檢查對象零件ob的網表(正常電路網表NEno及故障電路網表NEab)的電壓的電壓值設定為多階段(在上述之例中係以電壓值V1、V2的2階段作為一例)的基板檢查裝置用的個別檢查用資料Dteo時,關於一邊使所施加的電壓的電壓值由低側依序上升(一邊將所施加的電壓的電壓值依序上升為電壓值V1、接著電壓值V2),一邊藉由施加電壓而流通電流的網表所包含的檢查對象零件ob,係執行作成個別檢查用資料Dteo的處理,關於在更低的電壓值(在該例中為電壓值V1)中將個別檢查用資料Dteo作成完畢的電子零件,係在之後更高的電壓值(在該例中為電壓值V2)的電壓施加時,一邊由檢查對象零件ob除外一邊執行。 As described above, in the inspection data creation device 1 for performing the inspection data creation processing 90, the inspection data creation processing 90 (the inspection data creation method), and the computer-readable recording medium on which the program is recorded, The voltage value of the voltage applied to the net list (normal circuit net list NEno and fault circuit net list NEab) including the inspection target part ob in the simulation is set to be multi-stage (in the above example, the voltage value V1 is used) In the case of the individual inspection data Dteo for the substrate inspection device, the voltage value of the applied voltage is sequentially increased from the low side (the voltage value of the applied voltage is sequentially increased). In the case of the inspection target component ob included in the net meter that flows the current by applying a voltage, the processing of the individual inspection data Dteo is performed, and the voltage value is lower (in the case of the voltage value V1 and the voltage value V2). In this example, the electronic component in which the individual inspection data Dteo is created in the voltage value V1) is applied by a voltage after a higher voltage value (voltage value V2 in this example) is applied. Except ob side parts execution.
因此,藉由執行該檢查用資料作成處理90的檢查用資料作成裝置1、該檢查用資料作成處理90(檢查用資料作成方法)、及上述記錄有程式之電腦可讀取記錄媒體,相較於對全部檢查對象零件ob執行以在全部階段(在該例中為2階段)的電壓值施加電壓的模擬時的模擬的計算量,亦可作成可一邊使模擬的計算量充分減低,一邊對基板檢查裝置執行更為安全的檢查(並非為僅以藉由施加電壓而在任何網表亦流通電流的高電壓值V2的檢查,而為亦包含以更低電壓值V1的電壓的施加的檢查的檢查,換言之,關於利用以低電壓值的電壓的施加的檢查即可的檢查對象零件ob,可省略以高電壓值的檢查方面來看,為更為安全的檢查)的個別檢查用資料Dteo。 Therefore, the inspection data creation device 1, the inspection data creation processing 90 (inspection data creation method), and the computer-readable recording medium on which the program is recorded are executed by the inspection data creation processing 90. The calculation amount of the simulation when the voltage is applied to the voltage value of all the stages (two stages in this example) is performed on all the inspection target parts ob, and the calculation amount of the simulation can be sufficiently reduced while The substrate inspection apparatus performs a more secure inspection (not a check of a high voltage value V2 that only flows current in any net meter by applying a voltage, but an inspection that also includes application of a voltage of a lower voltage value V1. In the inspection, in particular, the inspection object part ob which can be used for the inspection of the application of the voltage with a low voltage value, the individual inspection data Dteo which is a safer inspection can be omitted for the inspection of the high voltage value. .
其中,係列舉作成對可將所施加的電壓的電壓值設定為電壓值V1、V2的2階段的基板檢查裝置的個別檢查用資料Dteo為例來進行說明,但是關於作成對可將所施加的電壓的電壓值設定為更多階段(3階段、4階段、...)的基板檢查裝置的個別檢查用資料Dteo的情形,亦可藉由適當變更上述檢查用資料作成處理90來適用。 In the above, the series of individual inspection materials Dteo of the substrate inspection apparatus which can set the voltage value of the applied voltage to the voltage values V1 and V2 are described as an example. However, the application can be applied to the pair. In the case where the voltage value of the voltage is set to the individual inspection data Dteo of the substrate inspection apparatus in a plurality of stages (three stages, four stages, ...), the inspection data creation processing 90 can be applied as appropriate.
但是,在以基板檢查裝置被檢查的實際的檢查對象基板中,構成電路網之互相作電性連接的複數電路要素的參數值(例如,電路要素為電阻之時,為電阻值,為電容器之時,為靜電電容值,為二極體之時,為順向電壓值等)並非恒與目錄等所記載的標稱值(在上述模擬中所使用的值)為相一致,在容許範圍(容許差)內呈不均。因此,若在基板檢查裝置使用如上述所作成的個別檢查用資料Dteo,來執行形成在實際的 檢查對象基板之構成電路網之互相電性連接的複數電路要素的檢查,會有成為與模擬下的結果為不同的結果(亦即,與無法檢查在模擬中原可檢測的電路要素(檢查對象零件)的故障的結果)的情形。 However, in the actual inspection target substrate to be inspected by the substrate inspection device, the parameter values of the plurality of circuit elements electrically connected to each other are formed (for example, when the circuit element is a resistor, the resistance value is a capacitor value). In the case of the electrostatic capacitance value, when the diode is a diode, the forward voltage value or the like is not consistent with the nominal value (the value used in the above simulation) described in the table, etc., and is within the allowable range ( The tolerance is uneven. Therefore, if the substrate inspection apparatus uses the individual inspection data Dteo created as described above, the actual formation is performed. The inspection of the plurality of circuit elements electrically connected to each other in the circuit board of the inspection target substrate may result in a different result from the simulation (that is, the circuit elements (inspection target parts that can be inspected in the simulation cannot be inspected) The case of the result of the failure).
因此,處理部3亦可採用對如上述所作成的個別檢查用資料Dteo執行驗證處理,提高對該個別檢查用資料Dteo的可靠性的構成。在該驗證處理中,處理部3係關於在個別檢查用資料作成處理中所作成之供各電路要素之用的個別檢查用資料Dteo,使除了電路網中以該個別檢查用資料Dteo被檢查之作為檢查對象的電路要素(檢查對象零件)之外的電路要素的參數值,在該電路要素的容許範圍(容許差)內使其改變的狀態下,利用以該個別檢查用資料Dteo所示之檢查內容,執行正常時模擬處理及故障時模擬處理,來驗證正常時檢查結果與故障時檢查結果的相異狀態是否被維持。 Therefore, the processing unit 3 can perform the verification processing on the individual inspection data Dteo created as described above, and can improve the reliability of the individual inspection data Dteo. In the verification processing, the processing unit 3 is configured to check the individual inspection data Dteo for each circuit element in the individual inspection data creation processing, and to check the individual inspection data Dteo in the circuit network. In the state in which the parameter value of the circuit element other than the circuit component (inspection target component) to be inspected is changed within the allowable range (allowable difference) of the circuit component, the individual inspection data Dteo is used. Check the contents, perform normal-time simulation processing, and fault-time simulation processing to verify whether the difference between the normal-time inspection result and the failure-time inspection result is maintained.
接著,該驗證處理的結果,關於正常時檢查結果與故障時檢查結果的相異狀態被維持的個別檢查用資料Dteo,係殘留下來,關於相異狀態未被維持的個別檢查用資料Dteo則刪除,關於原形成為以該個別檢查用資料Dteo予以檢查的電路要素,個別檢查用資料Dteo係設為沒有者。藉此,在基板檢查裝置使用如上所示執行驗證處理所得的個別檢查用資料Dteo,可大幅減低執行形成在實際的檢查對象基板之構成電路網的電路要素的檢查的情況下的不良情形(在模擬中無法檢查原可檢測的電路要素(檢查對象零件)的故障的不良情形)的發生,因此可使個別檢查用資料Dteo的可靠性大幅提 升。 Then, as a result of the verification processing, the individual inspection data Dteo in which the dissimilar state of the normal-time inspection result and the failure-time inspection result is maintained remains, and the individual inspection data Dteo in which the dissimilar state is not maintained is deleted. In the case of the circuit element which was originally inspected by the individual inspection data Dteo, the individual inspection data Dteo system was not included. By using the individual inspection data Dteo obtained by performing the verification process as described above, the substrate inspection apparatus can significantly reduce the problem in the case of performing inspection of the circuit elements constituting the circuit network formed on the actual inspection target substrate (in the case of In the simulation, it is impossible to check the occurrence of the failure of the original detectable circuit element (inspection target part), so the reliability of the individual inspection data Dteo can be greatly improved. Rise.
80~87‧‧‧步驟 80~87‧‧‧Steps
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