TW201616306A - Touch panel and process for manufacturing the same - Google Patents
Touch panel and process for manufacturing the same Download PDFInfo
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Abstract
Description
本發明係關於一種觸控面板與其製作方法,特別關於一種可具有非黑色邊框的觸控面板與其製作方法。 The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a touch panel that can have a non-black border and a method of fabricating the same.
觸控面板由於可以與顯示面板整合,常見於可攜式裝置上。然而,由於觸控面板的邊框通常需要一層「遮蓋層」來界定可用來觸控輸入的區域,而現有的遮蓋層材料主要是黑色遮光層(black mask),因此常見的觸控螢幕以及可攜式裝置的邊框也以黑色為主流。當製作具有其他顏色邊框的觸控面板時,往往需要用一般的油墨來塗布於觸控面板的基板上,再於油墨層上設置遮蓋層,由於一般的油墨顆粒較大因此在基板的邊框處會極不平整,在設置觸控電路層時,走線往往會因為油墨的顆粒造成的不平整而被扯斷,最終導致觸控面板的良率下降。因此,如何提供具有其他顏色的邊框的可攜式裝置,一直是一個待克服的問題。 Touch panels are commonly found on portable devices because they can be integrated with display panels. However, since the border of the touch panel usually requires a "cover layer" to define the area that can be used for touch input, and the existing cover layer material is mainly a black mask, the common touch screen and portability are common. The frame of the device is also dominated by black. When a touch panel having other color borders is produced, it is often required to apply a general ink to the substrate of the touch panel, and then a mask layer is disposed on the ink layer. Since the general ink particles are large, the substrate is at the border of the substrate. It will be extremely uneven. When the touch circuit layer is set, the traces are often torn off due to the unevenness caused by the particles of the ink, which eventually leads to a decrease in the yield of the touch panel. Therefore, how to provide a portable device with frames of other colors has been a problem to be overcome.
鑑於以上的問題,本發明提供一種觸控面板與其製作方法。所揭露的觸控面板在鋪設觸控電路層的表面沒有油墨層的顆粒造成的不平整,因此走線斷裂的機率下降,從而提高製作 的良率。 In view of the above problems, the present invention provides a touch panel and a method of fabricating the same. The disclosed touch panel has no unevenness caused by particles of the ink layer on the surface of the touch circuit layer, so the probability of the wire breakage is lowered, thereby improving the manufacturing. Yield.
依據本發明一個或多個實施例的一種觸控面板,其特徵在於包括基板、容置槽與油墨層。其中所述的基板具有基板上表面。而所述的容置槽至少具有底面、側壁與開口。容置槽的開口位在所述基板上表面,且容置槽的側壁鄰接所述基板上表面,容置槽的底面鄰接前述側壁。由容置槽的底面與前述基板上表面可以定義容置槽的槽深。油墨層設置在容置槽的底面上並且具有油墨層厚度,油墨層厚度不大於該槽深。 A touch panel according to one or more embodiments of the present invention includes a substrate, a receiving groove and an ink layer. The substrate described therein has an upper surface of the substrate. The accommodating groove has at least a bottom surface, a side wall and an opening. The opening of the accommodating groove is located on the upper surface of the substrate, and the sidewall of the accommodating groove abuts the upper surface of the substrate, and the bottom surface of the accommodating groove abuts the sidewall. The groove depth of the accommodating groove can be defined by the bottom surface of the accommodating groove and the upper surface of the substrate. The ink layer is disposed on the bottom surface of the accommodating groove and has an ink layer thickness, and the ink layer thickness is not greater than the groove depth.
依據本發明的某些實施例,所述的觸控面板可以更包括設置在油墨層上的遮蓋層。遮蓋層具有遮蓋層厚度,且油墨層厚度與遮蓋層厚度相加的總和厚度不小於前述容置槽的槽深。而於某些實施例中,當總和厚度等於容置槽的槽深時,觸控面板可以更包括一個設置在基板上表面並覆蓋容置槽的分隔板。 According to some embodiments of the present invention, the touch panel may further include a cover layer disposed on the ink layer. The covering layer has a thickness of the covering layer, and the sum of the thickness of the ink layer and the thickness of the covering layer is not less than the groove depth of the aforementioned receiving groove. In some embodiments, when the sum thickness is equal to the groove depth of the accommodating groove, the touch panel may further include a partition plate disposed on the upper surface of the substrate and covering the accommodating groove.
依據本發明某些實施例的觸控面板可以更包括觸控電路層。在沒有分隔板的實施例中,觸控電路層可以設置在基板上表面。而在有分隔板的實施例中,觸控電路層可以設置在分隔板上表面。 The touch panel according to some embodiments of the present invention may further include a touch circuit layer. In an embodiment without a spacer, the touch circuit layer can be disposed on the upper surface of the substrate. In embodiments with a spacer, the touch circuit layer can be disposed on the surface of the spacer.
依據本發明的某些實施例的觸控面板,容置槽的開口可以與基板上表面的一個端緣間隔一個距離,也可以位於前述側緣。 In the touch panel according to some embodiments of the present invention, the opening of the receiving groove may be spaced apart from an edge of the upper surface of the substrate by a distance or may be located at the side edge.
依據本發明的某些實施例的觸控面板,容置槽的側壁與前述油墨層之間不具間隙。 According to some embodiments of the present invention, there is no gap between the sidewall of the accommodating groove and the ink layer.
依據本發明一個或多個實施例所揭露的一種觸控面板製作方法,其特徵在於包括下列步驟:提供基板,基板具有基板上表面、在基板上表面設置防污層、在基板上表面形成容置槽、將油墨層填入容置槽中以及去除防污層。 A method for fabricating a touch panel according to one or more embodiments of the present invention includes the steps of: providing a substrate having an upper surface of the substrate, providing an antifouling layer on the upper surface of the substrate, and forming a surface on the upper surface of the substrate The groove is formed, the ink layer is filled into the accommodating groove, and the antifouling layer is removed.
依據本發明某些實施例,前述方法可以更包括將遮蓋層設置於油墨層上的步驟。而依據本發明另一些實施例,前述方法可以更包括在基板上表面設置分隔板以覆蓋容置槽的步驟。而依據本發明某些實施例,前述方法可以更包括在分隔板的分隔板上表面設置觸控電路層的步驟。 According to some embodiments of the invention, the foregoing method may further comprise the step of disposing a cover layer on the ink layer. According to still other embodiments of the present invention, the foregoing method may further include the step of disposing a partition plate on the upper surface of the substrate to cover the receiving groove. According to some embodiments of the present invention, the foregoing method may further comprise the step of providing a touch circuit layer on the surface of the partition plate of the partition plate.
依據本發明一個或多個實施例所揭露的一種觸控面板,其特徵在於包括:基板、裝飾塊與觸控電路層。其中基板具有基板上表面與容置空間。裝飾塊置於前述容置空間。而觸控電路層設置在前述基板上表面。 A touch panel according to one or more embodiments of the present invention includes a substrate, a decorative block, and a touch circuit layer. The substrate has an upper surface of the substrate and an accommodating space. The decorative block is placed in the aforementioned accommodation space. The touch circuit layer is disposed on the upper surface of the substrate.
依據本發明某些實施例,前述的容置空間位於基板的內部。而依據本發明某些實施例,前述的容置空間具有位於基板上表面、基板側表面或基板下表面的開口。依據本發明另一些實施例,前述的開口位於基板側表面時,開口與基板側表面的上緣間隔第一距離,且開口與基板側表面的下緣間隔第二距離。 According to some embodiments of the invention, the aforementioned accommodating space is located inside the substrate. According to some embodiments of the present invention, the aforementioned accommodating space has an opening on the upper surface of the substrate, the side surface of the substrate, or the lower surface of the substrate. According to still another embodiment of the present invention, when the opening is located on a side surface of the substrate, the opening is spaced apart from the upper edge of the substrate side surface by a first distance, and the opening is spaced apart from the lower edge of the substrate side surface by a second distance.
依據本發明一個或多個實施例所揭露的一種觸控面板製作方法,其特徵在於包括下列步驟:提供基板部件與裝飾塊、依據配置規則配置基板部件與裝飾塊以形成基板組件、加熱基板組件、以治具固定並加壓基板組件以及冷卻基板組件以形成基板。 A method for fabricating a touch panel according to one or more embodiments of the present invention includes the steps of: providing a substrate component and a decorative block, configuring the substrate component and the decorative block according to a configuration rule to form a substrate component, and heating the substrate component Fixing and pressing the substrate assembly with the fixture and cooling the substrate assembly to form the substrate.
依據本發明某些實施例,前述方法中,基板組件包括底板與中板,底板具有底板形狀,中板具有中板厚度與中板形狀。裝飾塊具有裝飾塊厚度與裝飾塊形狀。中板厚度等於裝飾塊厚度,中板形狀與裝飾塊形狀依據配置規則組合後全等於底板形狀。且在依據配置規則配置基板部件與裝飾塊以形成基板組件的步驟中,包括將中板與裝飾塊組合後設置於底板的底板上表面以形成基板組件。 According to some embodiments of the present invention, in the foregoing method, the substrate assembly includes a bottom plate and a middle plate, the bottom plate has a bottom plate shape, and the middle plate has a middle plate thickness and a middle plate shape. The decorative block has a decorative block thickness and a decorative block shape. The thickness of the middle plate is equal to the thickness of the decorative block, and the shape of the middle plate and the shape of the decorative block are all equal to the shape of the bottom plate according to the configuration rule. And in the step of configuring the substrate member and the decorative block to form the substrate assembly according to the configuration rule, the intermediate plate and the decorative block are combined and disposed on the upper surface of the bottom plate of the bottom plate to form the substrate assembly.
依據本發明某些實施例,前述方法中,基板組件更包括上板。上板具有上板形狀,上板形狀全等於底板形狀。且依據配置規則配置基板部件與裝飾塊以形成基板組件的步驟中,更包括將上板設置於中板上以形成基板組件。 According to some embodiments of the present invention, in the foregoing method, the substrate assembly further includes an upper plate. The upper plate has an upper plate shape, and the upper plate shape is all equal to the shape of the bottom plate. And the step of configuring the substrate component and the decorative block to form the substrate assembly according to the configuration rule, further comprising disposing the upper plate on the middle plate to form the substrate assembly.
依據本發明某些實施例,前述方法中,在加熱基板組件的步驟中,係將基板組件加熱至基板組件的熔點與裝飾塊的熔點較高者。 According to some embodiments of the present invention, in the foregoing method, in the step of heating the substrate assembly, the substrate assembly is heated to a higher melting point of the substrate assembly and a higher melting point of the decorative block.
依據本發明某些實施例,前述方法中,治具包括下治具與上治具。下治具用以承載基板組件並從下方對基板組件施壓。上治具用以從上方對基板組件施壓。其中下治具的承載面積與上治具加壓面積均不小於基板組件的基板面積。依據本發明某些實施例,前述方法中,治具更包括多個側治具,用以從側面對基板組件施壓。 According to some embodiments of the present invention, in the foregoing method, the jig includes a lower jig and an upper jig. The lower fixture is used to carry the substrate assembly and press the substrate assembly from below. The upper fixture is used to press the substrate assembly from above. The bearing area of the lower fixture and the pressing area of the upper fixture are not less than the substrate area of the substrate assembly. According to some embodiments of the present invention, in the foregoing method, the fixture further includes a plurality of side fixtures for pressing the substrate assembly from the side.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之 專利申請範圍更進一步之解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the invention The scope of the patent application is further explained.
10、20、30、40、50‧‧‧基板 10, 20, 30, 40, 50‧‧‧ substrates
101、201、301、401、501‧‧‧基板上表面 101, 201, 301, 401, 501‧‧ ‧ upper surface of the substrate
12、22、32、42、52‧‧‧油墨層 12, 22, 32, 42, 52‧ ‧ ink layer
14、24、34、44、54、64‧‧‧觸控電路層 14, 24, 34, 44, 54, 64‧‧‧ touch circuit layers
26、46‧‧‧遮蓋層 26, 46‧‧ ‧ cover layer
41‧‧‧防污層 41‧‧‧Anti-fouling layer
56‧‧‧分隔板 56‧‧‧ partition board
601~606‧‧‧基板 601~606‧‧‧Substrate
6011、6052‧‧‧中板 6011, 6052‧‧‧ medium board
6012、6053‧‧‧底板 6012, 6053‧‧‧ bottom plate
6051‧‧‧上板 6051‧‧‧Upper board
6054、6055‧‧‧側板 6054, 6055‧‧‧ side panels
62、621、622‧‧‧裝飾塊 62, 621, 622‧‧‧ decorative blocks
70‧‧‧烤箱 70‧‧‧Oven
81~84‧‧‧治具 81~84‧‧‧ fixture
l3、l4‧‧‧距離 l 3 , l 4 ‧ ‧ distance
P、P1、P2‧‧‧壓力 P, P 1 , P 2 ‧ ‧ pressure
d1~d5‧‧‧槽深 d 1 ~d 5 ‧‧‧ groove depth
d0、t1、t21、t22、t3、t41、t42、t5‧‧‧厚度 d 0 , t 1 , t 21 , t 22 , t 3 , t 41 , t 42 , t 5 ‧‧‧ thickness
圖1至圖5分別為依據本發明多個實施例的觸控面板剖面示意圖。 1 to 5 are schematic cross-sectional views of a touch panel according to various embodiments of the present invention.
圖6至圖12係依據本發明一實施例的觸控面板製作流程的各步驟。 6 to 12 illustrate steps of a touch panel fabrication process in accordance with an embodiment of the invention.
圖13至圖19係依據本發明另一實施例的觸控面板製作流程的各步驟。 13 to FIG. 19 are steps of a touch panel manufacturing process according to another embodiment of the present invention.
圖20至圖25分別為依據本發明多個實施例的觸控面板剖面示意圖。 20 to 25 are schematic cross-sectional views of a touch panel according to various embodiments of the present invention.
圖26至圖29係依據本發明一實施例的觸控面板製作流程的各步驟。 26 to 29 are steps of a touch panel manufacturing process according to an embodiment of the invention.
圖30至圖33係依據本發明另一實施例的觸控面板製作流程的各步驟。 FIG. 30 to FIG. 33 are diagrams showing steps of a touch panel manufacturing process according to another embodiment of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
請參照圖1至圖5,其分別為依據本發明多個實施例的觸控面板剖面示意圖。於一個實施例中,如圖1所示,依據本發明一實施例所揭露的觸控面板可以包括基板10與油墨層12。其中有一個或多個容置槽被設於基板10的基板上表面101。更明確的說,每個容置槽具有側壁、底面以及在基板上表面101的開口。油墨層12被設置(佈植)於基板10的一個或多個容置槽的底面,從而填充了容置槽。油墨層12具有油墨層厚度t1,而容置槽的槽深d1(也就是容置槽的底面到基板上表面101的距離)大於等於前述油墨層厚度t1,同時,容置槽的槽深d1大於20微米,並且小於基板10的厚度d0的一半。此外,如圖1所示,觸控面板可以更在基板上表面101配置觸控電路層14。 Please refer to FIG. 1 to FIG. 5 , which are schematic cross-sectional views of a touch panel according to various embodiments of the present invention. In one embodiment, as shown in FIG. 1 , a touch panel according to an embodiment of the invention may include a substrate 10 and an ink layer 12 . One or more receiving slots are provided in the upper surface 101 of the substrate of the substrate 10. More specifically, each of the accommodating grooves has a side wall, a bottom surface, and an opening in the upper surface 101 of the substrate. The ink layer 12 is disposed (planted) on the bottom surface of one or more accommodating grooves of the substrate 10 to fill the accommodating grooves. The ink layer 12 has an ink layer thickness t 1 , and the groove depth d 1 of the accommodating groove (that is, the distance from the bottom surface of the accommodating groove to the upper surface 101 of the substrate) is greater than or equal to the thickness t 1 of the ink layer, and at the same time, the groove of the accommodating groove The groove depth d 1 is greater than 20 microns and is less than half the thickness d 0 of the substrate 10. In addition, as shown in FIG. 1 , the touch panel can further configure the touch circuit layer 14 on the upper surface 101 of the substrate.
於一個實施例中,如圖2所示,依據本發明一實施例所揭露的觸控面板可以包括基板20、油墨層22與遮蓋層26。其中有一個或多個容置槽被設於基板20的基板上表面201。更明確的說,每個容置槽具有側壁、底面以及在基板上表面201的開口。油墨層22被設置於基板20的一個或多個容置槽的底面,而遮蓋層26被設置於油墨層22之上,從而填充了容置槽。如圖2所示,油墨層22具有油墨層厚度t21,遮蓋層26具有遮蓋層厚度t22,而容置槽的槽深d2(也就是容置槽的底面到基板上表面201的距離)大於等於前述油墨層厚度t21,但是槽深d2小於等於油墨層厚度t21與遮蓋層厚度t22相加的總和厚度,同時,容置槽的槽深d2大於20微米,並且小於基板20的厚度d0的一半。此外, 如圖2所示,觸控面板可以更在基板上表面201配置觸控電路層24。再者,依據圖1與圖2的實施例,可以描述為容置槽的開口位於基板上表面的端緣。 In one embodiment, as shown in FIG. 2 , a touch panel according to an embodiment of the invention may include a substrate 20 , an ink layer 22 , and a cover layer 26 . One or more receiving slots are provided on the substrate upper surface 201 of the substrate 20. More specifically, each of the accommodating grooves has a side wall, a bottom surface, and an opening in the upper surface 201 of the substrate. The ink layer 22 is disposed on the bottom surface of one or more accommodating grooves of the substrate 20, and the visor layer 26 is disposed on the ink layer 22 to fill the accommodating groove. As shown in FIG. 2, the ink layer 22 has an ink layer thickness t 21 , the cover layer 26 has a cover layer thickness t 22 , and the groove depth d 2 of the accommodating groove (that is, the distance from the bottom surface of the accommodating groove to the upper surface 201 of the substrate) Is greater than or equal to the aforementioned ink layer thickness t 21 , but the groove depth d 2 is less than or equal to the total thickness of the ink layer thickness t 21 and the cover layer thickness t 22 , while the groove depth d 2 of the accommodating groove is greater than 20 μm and smaller than half the thickness of the substrate 20 is d 0. In addition, as shown in FIG. 2 , the touch panel can further configure the touch circuit layer 24 on the upper surface 201 of the substrate. Furthermore, according to the embodiment of FIGS. 1 and 2, it can be described that the opening of the receiving groove is located at the end edge of the upper surface of the substrate.
於一個實施例中,如圖3所示,依據本發明一實施例所揭露的觸控面板可以包括基板30與油墨層32。其中有一個或多個容置槽被設於基板30的基板上表面301。更明確的說,每個容置槽具有側壁、底面以及在基板上表面301的開口。油墨層32被設置於基板30的一個或多個容置槽的底面,從而填充了容置槽。油墨層32具有油墨層厚度t3,而容置槽的槽深d3(也就是容置槽的底面到基板上表面301的距離)大於等於前述油墨層厚度t3,同時,容置槽的槽深d3大於20微米,並且小於基板30的厚度d0的一半。並且,如圖3所示,容置槽的開口與基板上表面301的端緣間隔一個距離l3,此外,觸控面板可以更在基板上表面301配置觸控電路層34。 In one embodiment, as shown in FIG. 3 , a touch panel according to an embodiment of the invention may include a substrate 30 and an ink layer 32 . One or more receiving slots are provided on the substrate upper surface 301 of the substrate 30. More specifically, each of the accommodating grooves has a side wall, a bottom surface, and an opening at the upper surface 301 of the substrate. The ink layer 32 is disposed on the bottom surface of one or more accommodating grooves of the substrate 30 to fill the accommodating grooves. The ink layer 32 has an ink layer thickness t 3 , and the groove depth d 3 of the accommodating groove (that is, the distance from the bottom surface of the accommodating groove to the upper surface 301 of the substrate) is greater than or equal to the thickness t 3 of the ink layer, and at the same time, the groove of the accommodating groove The groove depth d 3 is greater than 20 microns and is less than half the thickness d 0 of the substrate 30. And, FIG. 3, the end surface 301 of the upper opening edge of the substrate receiving groove spaced a distance L 3, in addition, the touch panel may be more disposed 301 on the substrate surface layer 34 of the touch circuit.
於一個實施例中,如圖4所示,依據本發明一實施例所揭露的觸控面板可以包括基板40、油墨層42與遮蓋層46。其中有一個或多個容置槽被設於基板40的基板上表面401。更明確的說,每個容置槽具有側壁、底面以及在基板上表面401的開口。油墨層42被設置於基板40的一個或多個容置槽的底面,而遮蓋層46被設置於油墨層42之上,從而填充了容置槽。如圖4所示,油墨層42具有油墨層厚度t41,遮蓋層46具有遮蓋層厚度t42,而容置槽的槽深d4(也就是容置槽的底面到基板上表面401 的距離)大於等於前述油墨層厚度t41,但是槽深d2小於等於油墨層厚度t41與遮蓋層厚度t42相加的總和厚度,同時,容置槽的槽深d4大於20微米,並且小於基板40的厚度d0的一半。並且,如圖4所示,容置槽的開口與基板上表面401的端緣間隔一個距離l4,此外,觸控面板可以更在基板上表面401配置觸控電路層44。 In one embodiment, as shown in FIG. 4 , a touch panel according to an embodiment of the invention may include a substrate 40 , an ink layer 42 , and a cover layer 46 . One or more receiving slots are provided on the substrate upper surface 401 of the substrate 40. More specifically, each of the accommodating grooves has a side wall, a bottom surface, and an opening in the upper surface 401 of the substrate. The ink layer 42 is disposed on the bottom surface of one or more accommodating grooves of the substrate 40, and the visor layer 46 is disposed on the ink layer 42 to fill the accommodating groove. 4, the ink layer of the ink layer 42 has a thickness t 41, the cover layer 46 has a thickness T cap layer 42, and the receiving groove from the groove depth d 4 (i.e. the bottom surface of the receiving groove 401 on the substrate surface Is greater than or equal to the aforementioned ink layer thickness t 41 , but the groove depth d 2 is less than or equal to the total thickness of the ink layer thickness t 41 and the cover layer thickness t 42 , and at the same time, the groove depth d 4 of the accommodating groove is greater than 20 μm and smaller than The substrate 40 has a half thickness d 0 . Moreover, as shown in FIG. 4, the opening of the receiving groove is spaced apart from the edge of the upper surface 401 of the substrate by a distance l 4 . Further, the touch panel can further configure the touch circuit layer 44 on the upper surface 401 of the substrate.
於一個實施例中,如圖5所示,依據本發明一實施例所揭露的觸控面板可以包括基板50、油墨層52與分隔板56。其中有一個或多個容置槽被設於基板50的基板上表面501。更明確的說,每個容置槽具有側壁、底面以及在基板上表面501的開口。油墨層52被設置於基板50的一個或多個容置槽的底面,從而填充了容置槽。油墨層52具有油墨層厚度t5,而容置槽的槽深d5(也就是容置槽的底面到基板上表面501的距離)大於等於前述油墨層厚度t5。分隔板56具有分隔板下表面561與分隔板上表面562,分隔板下表面561與基板上表面501接觸,並且分隔板56覆蓋了容置槽。此外,如圖5所示,觸控面板可以更在分隔板上表面562配置觸控電路層54。 In one embodiment, as shown in FIG. 5 , a touch panel according to an embodiment of the invention may include a substrate 50 , an ink layer 52 , and a partition plate 56 . One or more receiving slots are provided on the substrate upper surface 501 of the substrate 50. More specifically, each of the accommodating grooves has a side wall, a bottom surface, and an opening at the upper surface 501 of the substrate. The ink layer 52 is disposed on the bottom surface of one or more accommodating grooves of the substrate 50 to fill the accommodating grooves. The ink layer 52 has an ink layer thickness t 5 , and the groove depth d 5 of the accommodating groove (that is, the distance from the bottom surface of the accommodating groove to the upper surface 501 of the substrate) is greater than or equal to the thickness t 5 of the ink layer. The partition plate 56 has a partition plate lower surface 561 and a partition plate surface 562, the partition plate lower surface 561 is in contact with the substrate upper surface 501, and the partition plate 56 covers the accommodating groove. In addition, as shown in FIG. 5 , the touch panel can further configure the touch circuit layer 54 on the partition surface 562 .
接著,說明於一個實施例中,例如圖4所揭露的觸控面板如何製作。請參照圖6至圖12,其係依據本發明一實施例的觸控面板製作流程的各步驟。首先,如圖6所示,提供基板40。接著,如圖7所示,於基板40的基板上表面401鋪設一層防污層41。防污層41的鋪設可以用濺鍍、化學蒸鍍、物理蒸鍍等方法, 本發明於此不加以限制。接著,如圖8所示,從防污層41表面經由基板上表面401至基板40形成至少一凹槽,使得從基板40的基板上表面401形成一個或多個容置槽。形成容置槽的方法可以用治具挖設、可以用蝕刻法或是其他適於在一個表面形成凹槽的方法,本發明於此不加以限制。其中,若以蝕刻法形成容置槽,則必須選擇能蝕刻防污層41的藥劑。再來,如圖9所示,在容置槽中填入油墨層42。再如圖10所示,於油墨層42上覆蓋遮蓋層46。如圖9及圖10所示,在填入油墨層42及遮蓋層46時,防污層41上靠近容置槽的邊緣會沾有部分油墨層的材料或遮蓋層的材料。而後如圖11所示,將防污層41去除,則沾黏在防污層41上的油墨層的材料或遮蓋層的材料也會一併被去除,而形成如圖11的剖面結構。其中,防污層41可以使用不抗酸蝕的材料,而遮蓋層46選用抗酸蝕的材料,則可以用酸性試劑去除防污層41。之後可以如圖12所示,在基板40的基板上表面401上設置觸控電路層44。 Next, how to make the touch panel disclosed in FIG. 4 in one embodiment is illustrated. Please refer to FIG. 6 to FIG. 12 , which are steps of a touch panel manufacturing process according to an embodiment of the invention. First, as shown in FIG. 6, a substrate 40 is provided. Next, as shown in FIG. 7, an anti-fouling layer 41 is laid on the substrate upper surface 401 of the substrate 40. The antifouling layer 41 can be laid by sputtering, chemical vapor deposition, physical vapor deposition, or the like. The invention is not limited thereto. Next, as shown in FIG. 8, at least one groove is formed from the surface of the antifouling layer 41 via the substrate upper surface 401 to the substrate 40 such that one or more receiving grooves are formed from the substrate upper surface 401 of the substrate 40. The method of forming the accommodating groove may be performed by a jig, may be etched or other method suitable for forming a groove on one surface, and the present invention is not limited thereto. However, if the accommodating groove is formed by an etching method, it is necessary to select a chemical which can etch the antifouling layer 41. Further, as shown in FIG. 9, the ink layer 42 is filled in the accommodating groove. As shown in FIG. 10, the cover layer 46 is covered on the ink layer 42. As shown in FIG. 9 and FIG. 10, when the ink layer 42 and the cover layer 46 are filled, the edge of the antifouling layer 41 adjacent to the accommodating groove may be partially contaminated with a material of the ink layer or a material of the cover layer. Then, as shown in Fig. 11, when the antifouling layer 41 is removed, the material of the ink layer or the material of the cover layer adhered to the antifouling layer 41 is also removed, and a cross-sectional structure as shown in Fig. 11 is formed. Wherein, the antifouling layer 41 can use a material that is not resistant to etching, and the covering layer 46 is made of an acid resistant material, and the antifouling layer 41 can be removed with an acidic reagent. Then, as shown in FIG. 12, a touch circuit layer 44 may be disposed on the substrate upper surface 401 of the substrate 40.
於另一個實施例中,例如圖4所揭露的觸控面板如何製作請參照圖13至圖19,其係依據本發明另一實施例的觸控面板製作流程的各步驟。首先,如圖13所示,提供基板40。接著,如圖14所示,從基板40的基板上表面401形成一個或多個容置槽。形成容置槽的方法可以用治具挖設、可以用蝕刻法或是其他適於在一個表面形成凹槽的方法,本發明於此不加以限制。接著,如圖15所示,於基板40的基板上表面401除了容置槽以 外的部份鋪設一層防污層41。防污層41的鋪設可以用濺鍍、化學蒸鍍、物理蒸鍍等方法,本發明於此不加以限制。再來,如圖16所示,在容置槽中填入油墨層42。再如圖17所示,於油墨層42上覆蓋遮蓋層46。如圖16及圖17所示,在填入油墨層42及遮蓋層46時,防污層41上靠近容置槽的邊緣會沾有部分油墨層的材料或遮蓋層的材料。而後如圖18所示,將防污層41去除,則沾黏在防污層41上的油墨層的材料或遮蓋層的材料也會一併被去除,而形成如圖18的剖面結構。之後可以如圖19所示,在基板40的基板上表面401上設置觸控電路層44。 In another embodiment, for example, how to make the touch panel disclosed in FIG. 4, please refer to FIG. 13 to FIG. 19, which are steps of a touch panel manufacturing process according to another embodiment of the present invention. First, as shown in FIG. 13, a substrate 40 is provided. Next, as shown in FIG. 14, one or more accommodating grooves are formed from the substrate upper surface 401 of the substrate 40. The method of forming the accommodating groove may be performed by a jig, may be etched or other method suitable for forming a groove on one surface, and the present invention is not limited thereto. Next, as shown in FIG. 15, the substrate upper surface 401 of the substrate 40 is provided with a groove. The outer portion is covered with an antifouling layer 41. The deposition of the antifouling layer 41 may be performed by sputtering, chemical vapor deposition, physical vapor deposition, or the like, and the present invention is not limited thereto. Next, as shown in FIG. 16, the ink layer 42 is filled in the accommodating groove. As shown in FIG. 17, the cover layer 46 is covered on the ink layer 42. As shown in FIG. 16 and FIG. 17, when the ink layer 42 and the cover layer 46 are filled, the edge of the antifouling layer 41 near the accommodating groove may be contaminated with a material of a part of the ink layer or a material of the cover layer. Then, as shown in Fig. 18, when the antifouling layer 41 is removed, the material of the ink layer or the material of the cover layer adhered to the antifouling layer 41 is also removed together to form a cross-sectional structure as shown in Fig. 18. Then, as shown in FIG. 19, a touch circuit layer 44 is provided on the substrate upper surface 401 of the substrate 40.
前述的多個結構實施例以及方法流程中所提及的油墨層可以是各種色彩的油墨,例如白色、銀色、黑色、灰色等。而遮蓋層可以例如為黑色矩陣光阻層。以上述的流程所製作出來如圖1至圖5的觸控面板,由於顆粒較大的油墨層不會高於基板的基板上表面,因此在鋪設觸控電路層的時候,觸控電路層中的走線不會因為油墨層所造成的不平整而產生斷裂。因此可以在觸控面板的邊框以各種顏色的油墨來裝飾而不會因此降低觸控面板的良率,從而提供具有不同顏色的邊框的觸控面板。 The ink layers mentioned in the foregoing various structural embodiments and method flows may be inks of various colors such as white, silver, black, gray, and the like. The mask layer can be, for example, a black matrix photoresist layer. According to the above process, the touch panel of FIG. 1 to FIG. 5 is formed, because the ink layer with larger particles is not higher than the upper surface of the substrate of the substrate, when the touch circuit layer is laid, the touch circuit layer is The traces do not break due to unevenness caused by the ink layer. Therefore, the border of the touch panel can be decorated with inks of various colors without reducing the yield of the touch panel, thereby providing a touch panel having frames of different colors.
請參照圖20至圖25,其分別為依據本發明多個實施例的觸控面板剖面示意圖。於一個實施例中,如圖20所示,依據本發明一實施例所揭露的觸控面板可以包括基板601、裝飾塊62與觸控電路層64。其中有一個或多個容置空間被設於基板601的基板上表面。更明確的說,每個容置空間具有多個容置空間側面 以及在基板上表面的開口。裝飾塊62被設置於基板601的一個或多個容置空間中,從而填充了容置槽。而觸控電路層64位於基板601的基板上表面。雖然在圖20中,裝飾塊62與基板601有明確的分界,然而依照本發明後述的製作流程,裝飾塊62固定地附著於基板601的容置空間中。 Please refer to FIG. 20 to FIG. 25 , which are schematic cross-sectional views of a touch panel according to various embodiments of the present invention. In one embodiment, as shown in FIG. 20 , a touch panel according to an embodiment of the invention may include a substrate 601 , a decorative block 62 , and a touch circuit layer 64 . One or more accommodating spaces are provided on the upper surface of the substrate of the substrate 601. More specifically, each accommodating space has a plurality of accommodating spaces on the side And an opening in the upper surface of the substrate. The decorative block 62 is disposed in one or more accommodating spaces of the substrate 601 to fill the accommodating groove. The touch circuit layer 64 is located on the upper surface of the substrate of the substrate 601. Although the decorative block 62 and the substrate 601 have a clear boundary in FIG. 20, the decorative block 62 is fixedly attached to the accommodating space of the substrate 601 in accordance with the manufacturing flow described later in the present invention.
於一個實施例中,如圖21所示,依據本發明一實施例所揭露的觸控面板可以包括基板602、裝飾塊62與觸控電路層64。其中有一個或多個容置空間被設於基板602的基板側表面。更明確的說,每個容置空間具有多個容置空間側面以及在基板側表面的開口。裝飾塊62被設置於基板602的一個或多個容置空間中,從而填充了容置槽。此外,由圖21可知,容置空間的開口與基板602的基板側表面的上緣與下緣分別間隔第一距離與第二距離,第一距離不一定要等於第二距離。而觸控電路層64位於基板602的基板上表面。雖然在圖21中,裝飾塊62與基板602有明確的分界,然而依照本發明後述的製作流程,裝飾塊62固定地附著於基板602的容置空間中。 In one embodiment, as shown in FIG. 21 , a touch panel according to an embodiment of the invention may include a substrate 602 , a decorative block 62 , and a touch circuit layer 64 . One or more accommodating spaces are provided on the substrate side surface of the substrate 602. More specifically, each of the accommodating spaces has a plurality of accommodating space sides and an opening on the substrate side surface. The decorative block 62 is disposed in one or more accommodating spaces of the substrate 602 to fill the accommodating groove. In addition, as shown in FIG. 21, the opening of the accommodating space and the upper edge and the lower edge of the substrate side surface of the substrate 602 are respectively spaced apart by a first distance and a second distance, and the first distance does not have to be equal to the second distance. The touch circuit layer 64 is located on the upper surface of the substrate of the substrate 602. Although the decorative block 62 and the substrate 602 have a clear boundary in FIG. 21, the decorative block 62 is fixedly attached to the accommodating space of the substrate 602 in accordance with the manufacturing flow described later in the present invention.
於一個實施例中,如圖22所示,依據本發明一實施例所揭露的觸控面板可以包括基板603、裝飾塊62與觸控電路層64。其中有一個或多個容置空間被設於基板603的基板下表面。更明確的說,每個容置空間具有多個容置空間側面以及在基板下表面的開口。裝飾塊62被設置於基板603的一個或多個容置空間中,從而填充了容置空間。而觸控電路層64位於基板603的基板 上表面。雖然在圖22中,裝飾塊62與基板603有明確的分界,然而依照本發明後述地製作流程,裝飾塊62固定的附著於基板603的容置空間中。 In one embodiment, as shown in FIG. 22 , a touch panel according to an embodiment of the invention may include a substrate 603 , a decorative block 62 , and a touch circuit layer 64 . One or more accommodating spaces are provided on the lower surface of the substrate of the substrate 603. More specifically, each of the accommodating spaces has a plurality of accommodating space sides and an opening on the lower surface of the substrate. The decorative block 62 is disposed in one or more accommodating spaces of the substrate 603 to fill the accommodating space. The touch circuit layer 64 is located on the substrate of the substrate 603. Upper surface. Although the decorative block 62 and the substrate 603 have a clear boundary in FIG. 22, the decorative block 62 is fixedly attached to the accommodating space of the substrate 603 in accordance with the manufacturing process described later in the present invention.
於一個實施例中,如圖23所示,依據本發明一實施例所揭露的觸控面板可以包括基板604、裝飾塊62與觸控電路層64。其中有一個或多個容置空間被設於基板604的基板上表面。更明確的說,每個容置空間具有多個容置空間側面以及在基板上表面的開口。並且,與圖20不同之處在於,圖20中的容置空間(也就是裝飾塊62在圖20中的位置)鄰接於(或者說位於)基板上表面的端緣,而圖23中的容置空間在基板上表面的開口與基板上表面的端緣間隔一個距離。裝飾塊62被設置於基板604的一個或多個容置空間中,從而填充了容置槽。而觸控電路層64位於基板604的基板上表面。雖然在圖23中,裝飾塊62與基板604有明確的分界,然而依照本發明後述的製作流程,裝飾塊62固定的附著於基板604的容置空間中。 In one embodiment, as shown in FIG. 23 , a touch panel according to an embodiment of the invention may include a substrate 604 , a decorative block 62 , and a touch circuit layer 64 . One or more accommodating spaces are provided on the upper surface of the substrate of the substrate 604. More specifically, each of the accommodating spaces has a plurality of accommodating space sides and an opening on the upper surface of the substrate. Moreover, the difference from FIG. 20 is that the accommodating space in FIG. 20 (that is, the position of the decorative block 62 in FIG. 20) is adjacent to (or located at) the edge of the upper surface of the substrate, and the capacity in FIG. The opening of the space on the upper surface of the substrate is spaced apart from the edge of the upper surface of the substrate by a distance. The decorative block 62 is disposed in one or more accommodating spaces of the substrate 604 to fill the accommodating groove. The touch circuit layer 64 is located on the upper surface of the substrate of the substrate 604. Although the decorative block 62 and the substrate 604 are clearly demarcated in FIG. 23, the decorative block 62 is fixedly attached to the accommodating space of the substrate 604 in accordance with the manufacturing flow described later in the present invention.
於一個實施例中,如圖24所示,依據本發明一實施例所揭露的觸控面板可以包括基板605、裝飾塊62與觸控電路層64。其中有一個或多個容置空間被設於基板605內部。更明確的說,每個容置空間具有多個容置空間側面並且不具有對外的開口。裝飾塊62被設置於基板605的一個或多個容置空間中,從而填充了容置槽。而觸控電路層64位於基板605的基板上表面。雖然在圖24中,裝飾塊62與基板605有明確的分界,然而依照本 發明後述的製作流程,裝飾塊62固定的附著於基板605的容置空間中。 In one embodiment, as shown in FIG. 24 , a touch panel according to an embodiment of the invention may include a substrate 605 , a decorative block 62 , and a touch circuit layer 64 . One or more accommodating spaces are disposed inside the substrate 605. More specifically, each of the accommodating spaces has a plurality of accommodating space sides and does not have an external opening. The decorative block 62 is disposed in one or more accommodating spaces of the substrate 605 to fill the accommodating groove. The touch circuit layer 64 is located on the upper surface of the substrate of the substrate 605. Although in FIG. 24, the decorative block 62 and the substrate 605 have a clear boundary, In the manufacturing flow described later in the invention, the decorative block 62 is fixedly attached to the accommodating space of the substrate 605.
於一個實施例中,如圖25所示,依據本發明一實施例所揭露的觸控面板可以包括基板606、裝飾塊62與觸控電路層64。其中裝飾塊62被設置於基板606的一側或兩側,也就是說,相較於圖20至圖24的觸控面板,裝飾塊62並不是被設置在容置空間中,而是被附著於基板606的一側或兩側。而觸控電路層64位於基板606的基板上表面。雖然在圖24中,裝飾塊62與基板606有明確的分界,然而依照本發明後述的製作流程,裝飾塊62固定的附著於基板606。 In one embodiment, as shown in FIG. 25 , a touch panel according to an embodiment of the invention may include a substrate 606 , a decorative block 62 , and a touch circuit layer 64 . The decorative block 62 is disposed on one side or both sides of the substrate 606. That is, the decorative block 62 is not disposed in the accommodating space but is attached to the touch panel of FIGS. 20 to 24 . On one or both sides of the substrate 606. The touch circuit layer 64 is located on the upper surface of the substrate of the substrate 606. Although the decorative block 62 and the substrate 606 have a clear boundary in FIG. 24, the decorative block 62 is fixedly attached to the substrate 606 in accordance with the manufacturing process described later in the present invention.
關於如何製作如圖20至圖25的觸控面板的方法,以製作如圖20的觸控面板為例,請參照圖26至圖29,其係依據本發明一實施例的觸控面板製作流程的各步驟。首先,如圖26所示,提供基板部件(也就是中板6011與底板6012)、裝飾塊621與裝飾塊622,並依據配置規則配置前述中板6011、底板6012、裝飾塊621與裝飾塊622以形成基板組件。而後如圖27所示,以烤箱70(也可以是加熱治具)加熱前述基板組件。其中在加熱時,係將整個基板組件加熱至基板部件的熔點與裝飾塊的熔點較高者,如此讓中板6011、底板6012、以及兩塊裝飾塊621與622的表面都稍微熔化。再來如圖28所示,用治具(上治具81與下治具82)固定並以壓力P加壓基板組件。藉此,由於基板組件各部(例如中板6011與裝飾塊621)的表面都稍微熔化了,所以基板組件 各部受壓而密合,也就是說,前述中板6011與底板6012藉此被壓合成基板601。並且為了均勻的施加壓力於基板組件,上治具81的加壓面積與下治具82的承載面積都略大於基板面積。再來,如圖29所示,冷卻基板組件以形成基板,並在基板上表面設置觸控電路層64。 For example, the method for manufacturing the touch panel of FIG. 20 to FIG. 25 is as follows. Referring to FIG. 26 to FIG. 29, the touch panel manufacturing process according to an embodiment of the invention is described. Each step. First, as shown in FIG. 26, the substrate member (that is, the middle plate 6011 and the bottom plate 6012), the decorative block 621, and the decorative block 622 are provided, and the intermediate plate 6011, the bottom plate 6012, the decorative block 621, and the decorative block 622 are disposed according to the arrangement rules. To form a substrate assembly. Then, as shown in Fig. 27, the substrate assembly is heated by an oven 70 (which may also be a heating jig). Wherein, when heating, the entire substrate assembly is heated to a higher melting point of the substrate member than the melting point of the decorative block, so that the surfaces of the middle plate 6011, the bottom plate 6012, and the two decorative blocks 621 and 622 are slightly melted. Next, as shown in Fig. 28, the jig (the upper jig 81 and the lower jig 82) is fixed and the substrate assembly is pressed at a pressure P. Thereby, since the surfaces of the various parts of the substrate assembly (for example, the middle plate 6011 and the decorative block 621) are slightly melted, the substrate assembly The respective portions are pressed and adhered, that is, the intermediate plate 6011 and the bottom plate 6012 are thereby pressed into the substrate 601. And in order to uniformly apply pressure to the substrate assembly, the pressing area of the upper jig 81 and the bearing area of the lower jig 82 are both slightly larger than the substrate area. Next, as shown in FIG. 29, the substrate assembly is cooled to form a substrate, and a touch circuit layer 64 is disposed on the upper surface of the substrate.
關於如何製作如圖20至圖25的觸控面板的方法,以製作如圖24的觸控面板為例,請參照圖30至圖33,其係依據本發明一實施例的觸控面板製作流程的各步驟。首先,如圖30所示,提供基板部件(也就是上板6051、中板6052、底板6053與側板6054、側板6055)、裝飾塊621與裝飾塊622,並依據配置規則配置前述上板6051、中板6052、底板6053、側板6054、側板6055、裝飾塊621與裝飾塊622以形成基板組件。而後如圖31所示,以烤箱70(也可以是加熱治具)加熱前述基板組件。其中在加熱時,係將整個基板組件加熱至基板部件的熔點與裝飾塊的熔點較高者,如此讓上板6051、中板6052、底板6053、側板6054、側板6055、以及兩塊裝飾塊621與622的表面都稍微熔化。再來如圖32所示,用治具(上治具81、下治具82、左治具83與右治具84)固定並以壓力P1及壓力P2分別從上下與左右加壓基板組件。藉此,由於基板組件各部(例如中板6052與裝飾塊621)的表面都稍微熔化了,所以基板組件各部受壓而密合,從而使上板6051、中板6052、底板6053、側板6054、側板6055被壓合成基板605。並且為了均勻的施加壓力於基板組件,上治具81的加壓 面積與下治具82的承載面積都略大於基板面積。再來,如圖33所示,冷卻基板組件以形成基板605,並在基板上表面設置觸控電路層64。 For a method of manufacturing the touch panel of FIG. 20 to FIG. 25, for example, the touch panel of FIG. 24 is used as an example. Referring to FIG. 30 to FIG. 33, the touch panel manufacturing process according to an embodiment of the invention is described. Each step. First, as shown in FIG. 30, the substrate member (that is, the upper plate 6051, the middle plate 6052, the bottom plate 6053 and the side plate 6054, the side plate 6055), the decorative block 621, and the decorative block 622 are provided, and the upper plate 6051 is configured according to the configuration rule. The middle plate 6052, the bottom plate 6053, the side plates 6054, the side plates 6055, the decorative block 621 and the decorative block 622 form a substrate assembly. Then, as shown in Fig. 31, the substrate assembly is heated by an oven 70 (which may also be a heating jig). Wherein, when heating, the entire substrate assembly is heated to a higher melting point of the substrate member and the melting point of the decorative block, so that the upper plate 6051, the middle plate 6052, the bottom plate 6053, the side plate 6054, the side plate 6055, and the two decorative blocks 621 are allowed. Both surfaces and 622 are slightly melted. Next, as shown in FIG. 32, the jig (the upper jig 81, the lower jig 82, the left jig 83, and the right jig 84) are fixed, and the substrate is pressed from the upper and lower sides and the left and right by the pressure P 1 and the pressure P 2 , respectively. Component. Thereby, since the surfaces of the respective portions of the substrate assembly (for example, the middle plate 6052 and the decorative block 621) are slightly melted, the respective portions of the substrate assembly are pressed and adhered, thereby making the upper plate 6051, the middle plate 6052, the bottom plate 6053, the side plate 6054, The side plate 6055 is pressed into the substrate 605. And in order to uniformly apply pressure to the substrate assembly, the pressing area of the upper jig 81 and the bearing area of the lower jig 82 are both slightly larger than the substrate area. Then, as shown in FIG. 33, the substrate assembly is cooled to form the substrate 605, and the touch circuit layer 64 is disposed on the upper surface of the substrate.
依據本發明一個或多個實施例所揭露的方法中,使用裝飾塊來製作完成的觸控面板,由於基板上表面可以視為一個完整平滑面,因此在設置觸控電路層的時候不會有不平整的表面使走線斷裂。裝飾塊可以選用與基板的材料相同的材料,差別僅在於裝飾塊表面或內部可以有預先設計好的顏色或花紋。 According to the method disclosed in one or more embodiments of the present invention, a touch panel is used to fabricate a completed touch panel. Since the upper surface of the substrate can be regarded as a complete smooth surface, there is no time when the touch circuit layer is disposed. An uneven surface breaks the trace. The decorative block may be of the same material as the substrate, except that the surface or interior of the decorative block may have a pre-designed color or pattern.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.
40‧‧‧基板 40‧‧‧Substrate
42‧‧‧油墨層 42‧‧‧Ink layer
44‧‧‧觸控電路層 44‧‧‧Touch circuit layer
46‧‧‧遮蓋層 46‧‧‧ Cover
401‧‧‧基板上表面 401‧‧‧Top surface of the substrate
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TWI707258B (en) * | 2018-10-15 | 2020-10-11 | 香港商宸盛光電有限公司 | Touch-sensing cover and manufacturing method thereof |
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TW201218035A (en) * | 2010-10-29 | 2012-05-01 | Anxar Touch Technology Co Ltd | by eliminating configuration of cover lens in prior art to reduce thickness and manufacturing cost |
JP2013152562A (en) * | 2012-01-24 | 2013-08-08 | Japan Display West Co Ltd | Touch panel, manufacturing method of the same, display device and electronic apparatus |
TWM445219U (en) * | 2012-08-28 | 2013-01-11 | Henghao Technology Co Ltd | Touch panel |
CN103677459A (en) * | 2012-09-25 | 2014-03-26 | 比亚迪股份有限公司 | Capacitive touch screen and manufacturing method thereof |
TWI507935B (en) * | 2012-10-22 | 2015-11-11 | Single-glass capacitive touch panel and method for fabricating the same | |
CN103885626A (en) * | 2012-12-20 | 2014-06-25 | 瑞世达科技(厦门)有限公司 | Touch panel and cover plate structure thereof |
TW201437718A (en) * | 2013-03-22 | 2014-10-01 | Eturbo Touch Technology Inc | Manufacturing method for touch panel |
JP6416461B2 (en) * | 2013-04-08 | 2018-10-31 | Nissha株式会社 | Decorative cover substrate for touch panel and method for producing the same |
TWM479451U (en) * | 2013-12-11 | 2014-06-01 | Chenfeng Optronics Corp | Embedded structure of touch panel |
CN203870600U (en) * | 2014-04-03 | 2014-10-08 | 太仓市斯瑞特电器有限公司 | Uniwafer capacitive touch sensor |
CN105630217B (en) * | 2014-10-28 | 2018-10-26 | 宸鸿科技(厦门)有限公司 | Touch panel and its production method |
CN204242137U (en) * | 2014-10-28 | 2015-04-01 | 宸鸿科技(厦门)有限公司 | Contact panel |
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