TWM479451U - Embedded structure of touch panel - Google Patents
Embedded structure of touch panel Download PDFInfo
- Publication number
- TWM479451U TWM479451U TW102223327U TW102223327U TWM479451U TW M479451 U TWM479451 U TW M479451U TW 102223327 U TW102223327 U TW 102223327U TW 102223327 U TW102223327 U TW 102223327U TW M479451 U TWM479451 U TW M479451U
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- touch panel
- embedded structure
- group
- light shielding
- structure according
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- 239000010410 layer Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 125000005842 heteroatom Chemical group 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 125000004434 sulfur atom Chemical group 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- -1 poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
Landscapes
- Position Input By Displaying (AREA)
Description
本新型係有關一種觸控式面板結構,尤指一種具嵌入式結構的觸控式面板。The present invention relates to a touch panel structure, and more particularly to a touch panel with an embedded structure.
觸控式螢幕結合電子裝置,使得電子裝置如手機、MP3或隨身電腦等不需藉由實體按鍵,只需於螢幕上直接操作即可;如此可為電子裝置的操作模式增加更多的可能性,而不是僅限於鍵盤方式的操作。The touch screen is combined with the electronic device, so that the electronic device such as a mobile phone, an MP3 or a portable computer does not need to be operated by a physical button, and only needs to be directly operated on the screen; thus, the possibility of adding more possibilities to the operation mode of the electronic device Instead of being limited to keyboard mode operations.
觸控式螢幕包含電容式、電阻式、光學式等不同的觸控感測方式,而目前最被廣泛使用在手機、平板電腦等行動手持裝置上的為電容式觸控式螢幕。Touch screens include capacitive, resistive, optical and other touch sensing methods. Currently, the most widely used mobile handheld devices such as mobile phones and tablet computers are capacitive touch screens.
請參閱「圖1」,為習知的電容式觸控螢幕結構示意圖,係包含一玻璃基板1、一設置於該玻璃基板1周緣的遮光層2,一設置於該遮光層2上的導線部3以及一覆蓋於該玻璃基板1且與該導線部3連接的觸控感應層4,其中該觸控感應層4係以濺鍍之方式沉積形成;該遮光層2係用來遮蔽該導線部3以維持美觀,故必須具有一定的厚度,且該遮光層2的厚度通常較該觸控感應層4為厚,使得該觸控感應層4在濺鍍沉積時容易於交界區5處產生沉積厚度不均勻的情形,進而產生斷線的問題。Please refer to FIG. 1 , which is a schematic structural view of a conventional capacitive touch screen, comprising a glass substrate 1 , a light shielding layer 2 disposed on a periphery of the glass substrate 1 , and a lead portion disposed on the light shielding layer 2 . 3 and a touch sensing layer 4 covering the glass substrate 1 and connected to the wire portion 3, wherein the touch sensing layer 4 is deposited by sputtering; the light shielding layer 2 is used to shield the wire portion 3, in order to maintain the appearance, it must have a certain thickness, and the thickness of the light shielding layer 2 is generally thicker than the touch sensing layer 4, so that the touch sensing layer 4 is easy to deposit at the boundary region 5 during sputtering deposition. In the case of uneven thickness, the problem of disconnection occurs.
本新型之主要目的,在於避免觸控感應層形成時,因為厚度不均勻的情形產生斷線的現象。The main purpose of the novel is to avoid the phenomenon that the touch sensing layer is broken due to uneven thickness.
為達上述目的,本新型提供一種嵌入式結構的觸控式面板,係包含一玻璃基板、一遮光層、一觸控感應層以及一設置於該遮光層上的導線部,該玻璃基板包含一顯示區以及一形成於該顯示區周緣的置入槽,該遮光層之厚度相等於該置入槽之深度,使該遮光層形成於該置入槽並與該顯示區共同構成一平面,該觸控感應層形成於該顯示區及該置入槽所共同構成之該平面上且與該導線部電性連接。In order to achieve the above object, the present invention provides a touch panel of an embedded structure, comprising a glass substrate, a light shielding layer, a touch sensing layer, and a wire portion disposed on the light shielding layer, the glass substrate includes a a display area and a placement groove formed on a periphery of the display area, the thickness of the light shielding layer is equal to the depth of the insertion groove, so that the light shielding layer is formed in the insertion groove and forms a plane together with the display area, The touch sensing layer is formed on the plane formed by the display area and the insertion groove and electrically connected to the lead portion.
由上述說明可知,本新型之特點在於利用該置入槽的形成,使得該遮光層設置於該置入槽內時與該顯示區共同構成一平面,讓該觸控感應層形成於該平面時,可於該顯示區以及該遮光層上產生均勻的厚度,避免產生斷線問題而影響電導通特性。According to the above description, the present invention is characterized in that the formation of the insertion groove is such that when the light shielding layer is disposed in the insertion groove, the display area forms a plane together with the display area, so that the touch sensing layer is formed on the plane. A uniform thickness can be generated on the display area and the light shielding layer to avoid the problem of disconnection and affect the electrical conduction characteristics.
習知技術Conventional technology
1‧‧‧玻璃基板1‧‧‧ glass substrate
2‧‧‧遮光層2‧‧‧ shading layer
3‧‧‧導線部3‧‧‧Wire Department
4‧‧‧觸控感應層4‧‧‧ touch sensing layer
5‧‧‧交界區5‧‧‧ junction area
本新型This new type
10‧‧‧玻璃基板10‧‧‧ glass substrate
11‧‧‧顯示區11‧‧‧ display area
12‧‧‧置入槽12‧‧‧Into the slot
20‧‧‧遮光層20‧‧‧Lighting layer
30‧‧‧觸控感應層30‧‧‧ touch sensing layer
40‧‧‧導線部40‧‧‧Wire Department
50‧‧‧平面50‧‧‧ plane
60‧‧‧保護層60‧‧‧Protective layer
圖1,為習知技術之剖面結構示意圖。Figure 1 is a schematic cross-sectional view of a prior art.
圖2,為本新型之剖面結構示意圖。Figure 2 is a schematic cross-sectional view of the present invention.
圖3A~圖3D,為本新型之製作方法流程示意圖。3A to 3D are schematic views showing the flow of the manufacturing method of the present invention.
有關本新型之詳細說明及技術內容,現就配合圖示說明如下:The detailed description and technical content of this new model are as follows:
請參閱「圖2」所示,本新型係為一種嵌入式結構的觸控式面板,係包含一玻璃基板10、一遮光層20、一觸控感應層30以及一設置於該遮光層20上的導線部40,該玻璃基板10包含一顯示區11以及一形成於該顯示區11周緣的置入槽12,其中該置入槽12係以蝕刻形成且深度為6微米~15微米,而該遮光層20之厚度相等於該置入槽12之深度,使該遮光層20形成於該置入槽12並與該顯示區11共同構成一平面50,該觸控感應層30形成於該平面50上且與該導線部40電性連接,該遮光層20為樹脂材質的黑色矩陣(Black Matrix)或是暗色油墨,該觸控感應層30之材料則為氧化銦錫(ITO)、氧化鋁鋅(AZO)、氧化銦鋅(IZO)或氧化鎵鋅(GZO),更須進一步補充的是,該觸控感應層30之材料更可為高分子導電材料或奈米金屬材料,其中高分子導電材料可為未摻雜異原子的高分子導電材料如聚乙炔(polyacetylene,PAC)或聚對苯乙烯(poly(p-phenylene vinylene),PPV)、摻雜氮原子的高分子導電材料如聚吡咯(polypyrrole,PPY)或聚苯胺(polyaniline,PANI)、摻雜硫原子的高分子導電材料如聚(3,4-二氧乙基塞吩)(poly(3,4-ethylenedioxythiophene),PEDOT)或聚對苯乙烯磺酸 (poly(styrenesulfonate),PPS),奈米金屬導電材料可為奈米金、奈米銀或是奈米銅;該導線部40的材料為金、銀、銅等金屬材質。The touch panel of the embedded structure includes a glass substrate 10, a light shielding layer 20, a touch sensing layer 30, and a light shielding layer 20 disposed on the light shielding layer 20, as shown in FIG. The wire substrate 40 includes a display area 11 and a placement groove 12 formed on a periphery of the display area 11, wherein the insertion groove 12 is formed by etching and has a depth of 6 μm to 15 μm. The thickness of the light shielding layer 20 is equal to the depth of the insertion groove 12, so that the light shielding layer 20 is formed in the insertion groove 12 and forms a plane 50 together with the display area 11. The touch sensing layer 30 is formed on the plane 50. And electrically connected to the lead portion 40. The light shielding layer 20 is a black matrix or a dark ink of a resin material, and the material of the touch sensing layer 30 is indium tin oxide (ITO) and aluminum zinc oxide. (AZO), indium zinc oxide (IZO) or gallium zinc oxide (GZO), furthermore, the material of the touch sensing layer 30 may be a polymer conductive material or a nano metal material, wherein the polymer conductive The material may be a polymer conductive material such as polyacetylene which is not doped with a hetero atom. PAC) or poly(p-phenylene vinylene, PPV), polymer conductive materials doped with nitrogen atoms, such as polypyrrole (PPY) or polyaniline (PANI), doped with sulfur atoms Polymer conductive materials such as poly(3,4-ethylenedioxythiophene) (PEDOT) or poly(styrenesulfonate, PPS), nano metal conductive The material may be nano gold, nano silver or nano copper; the material of the wire portion 40 is made of metal such as gold, silver or copper.
再者,該嵌入式結構的觸控式面板更包含一保護層60,該保護層60覆蓋於該觸控感應層30與該導線部40遠離該玻璃基板10的一側,藉此保護該觸控感應層30與該導線部40,並達到避免氧化的效果。除此之外,該玻璃基板10的厚度隨著玻璃基板10的面積不同而改變,如玻璃基板10的大小為3.5吋時,厚度大約為0.7毫米,而當該玻璃基板10增加為20吋時,厚度則增加至1.1毫米,以避免過薄而容易斷裂的狀況。In addition, the touch panel of the embedded structure further includes a protective layer 60 covering the touch sensing layer 30 and the side of the lead portion 40 away from the glass substrate 10, thereby protecting the touch. The sensing layer 30 and the wire portion 40 are controlled to achieve an effect of avoiding oxidation. In addition, the thickness of the glass substrate 10 varies depending on the area of the glass substrate 10, such as when the size of the glass substrate 10 is 3.5 Å, the thickness is about 0.7 mm, and when the glass substrate 10 is increased to 20 Å. The thickness is increased to 1.1 mm to avoid a condition that is too thin and easily broken.
請參閱「圖3A」至「圖3D」所示,更進一步說明該嵌入式結構的觸控式面板之製作方式:Please refer to "Figure 3A" to "Figure 3D" to further illustrate how the touch panel of the embedded structure is made:
首先參閱「圖3A」,先選擇適合尺寸的一玻璃基板10,並在該玻璃基板10周緣形成一置入槽12,於本實施例中,係以蝕刻的方式形成該置入槽12,並定義該置入槽12所包圍區域形成一顯示區11;接續參閱「圖3B」,於該置入槽12內形成一厚度與該置入槽12之高度相等的遮光層20,使該遮光層20與該顯示區11共同構成一平面50;接著於該平面50上形成一觸控感應層30與一導線部40,且該觸控感應層30與該導線部40電性連接,如「圖3C」所示;最後形成一覆蓋於該觸控感應層30以及該導線部40上的保護層60,且該保護層60往該遮光層20及該觸控感應層30遠離該玻璃基板10的方向延伸覆蓋,如「圖3D」所示。Referring first to FIG. 3A, a glass substrate 10 of a suitable size is first selected, and a receiving groove 12 is formed on the periphery of the glass substrate 10. In the embodiment, the insertion groove 12 is formed by etching, and Defining a region surrounded by the insertion groove 12 to form a display region 11; and subsequently referring to FIG. 3B, a light shielding layer 20 having a thickness equal to the height of the insertion groove 12 is formed in the insertion groove 12 to make the light shielding layer The display area 11 and the display area 11 form a plane 50. Then, a touch sensing layer 30 and a lead portion 40 are formed on the plane 50, and the touch sensing layer 30 is electrically connected to the lead portion 40, such as The protective layer 60 is formed on the touch sensing layer 30 and the wire portion 40, and the protective layer 60 is away from the glass substrate 10 from the light shielding layer 20 and the touch sensing layer 30. The direction extends to cover as shown in Figure 3D.
綜上所述,本新型具以下特點:In summary, the new model has the following characteristics:
一、利用該置入槽的形成,使得該遮光層設置於該置入槽內時與該玻璃基板構成一平面,藉由該平面的形成,使得該觸控感應層形成時不會有斷線的現象產生。1. The formation of the insertion groove is such that the light shielding layer is disposed in a plane with the glass substrate when the light shielding layer is disposed in the insertion groove, and the formation of the plane prevents the touch sensing layer from being broken when formed. The phenomenon arises.
二、藉由該保護層的設置,可避免該觸控感應層與該導線部與其他電子元件接觸,更可降低該觸控感應層與該導線部之氧化程度。Secondly, by the setting of the protective layer, the touch sensing layer and the lead portion can be prevented from contacting with other electronic components, and the degree of oxidation of the touch sensing layer and the lead portion can be reduced.
10‧‧‧玻璃基板 10‧‧‧ glass substrate
11‧‧‧顯示區 11‧‧‧ display area
12‧‧‧置入槽 12‧‧‧Into the slot
20‧‧‧遮光層 20‧‧‧Lighting layer
30‧‧‧觸控感應層 30‧‧‧ touch sensing layer
40‧‧‧導線部 40‧‧‧Wire Department
50‧‧‧平面 50‧‧‧ plane
60‧‧‧保護層 60‧‧‧Protective layer
Claims (9)
一玻璃基板,該玻璃基板包含一顯示區以及一形成於該顯示區周緣的置入槽;
一形成於該置入槽內的遮光層,該遮光層之厚度等於該置入槽之深度,以與該顯示區共同構成一平面;
一觸控感應層,形成於該顯示區及該置入槽所共同構成之該平面上;以及
一設置於該遮光層上並與該觸控感應層電性連接的導線部。A touch panel with an embedded structure, comprising:
a glass substrate comprising a display area and a placement groove formed on a periphery of the display area;
a light shielding layer formed in the insertion groove, the thickness of the light shielding layer is equal to the depth of the insertion groove to form a plane together with the display area;
A touch sensing layer is formed on the plane formed by the display area and the insertion groove; and a wire portion disposed on the light shielding layer and electrically connected to the touch sensing layer.
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TW102223327U TWM479451U (en) | 2013-12-11 | 2013-12-11 | Embedded structure of touch panel |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105630217A (en) * | 2014-10-28 | 2016-06-01 | 宸鸿科技(厦门)有限公司 | Touch panel and production method thereof |
TWI707258B (en) * | 2018-10-15 | 2020-10-11 | 香港商宸盛光電有限公司 | Touch-sensing cover and manufacturing method thereof |
-
2013
- 2013-12-11 TW TW102223327U patent/TWM479451U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105630217A (en) * | 2014-10-28 | 2016-06-01 | 宸鸿科技(厦门)有限公司 | Touch panel and production method thereof |
TWI588693B (en) * | 2014-10-28 | 2017-06-21 | 宸鴻科技(廈門)有限公司 | Touch panel and process for manufacturing the same |
TWI707258B (en) * | 2018-10-15 | 2020-10-11 | 香港商宸盛光電有限公司 | Touch-sensing cover and manufacturing method thereof |
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