TW201608743A - 反射器、附反射器之引線框架、半導體發光裝置及樹脂組成物 - Google Patents

反射器、附反射器之引線框架、半導體發光裝置及樹脂組成物 Download PDF

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Publication number
TW201608743A
TW201608743A TW104125078A TW104125078A TW201608743A TW 201608743 A TW201608743 A TW 201608743A TW 104125078 A TW104125078 A TW 104125078A TW 104125078 A TW104125078 A TW 104125078A TW 201608743 A TW201608743 A TW 201608743A
Authority
TW
Taiwan
Prior art keywords
reflector
mass
resin
resin composition
fibrous filler
Prior art date
Application number
TW104125078A
Other languages
English (en)
Chinese (zh)
Inventor
Tomoki Sasou
Katsuya Sakayori
Kei Amagai
Satoru Kanke
Toshiyuki Sakai
Keisuke Hashimoto
Hiroyuki Hasegawa
Akihiro Maeda
Makoto Mizoshiri
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of TW201608743A publication Critical patent/TW201608743A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Led Device Packages (AREA)
TW104125078A 2014-08-01 2015-08-03 反射器、附反射器之引線框架、半導體發光裝置及樹脂組成物 TW201608743A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014157983 2014-08-01

Publications (1)

Publication Number Publication Date
TW201608743A true TW201608743A (zh) 2016-03-01

Family

ID=55523696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125078A TW201608743A (zh) 2014-08-01 2015-08-03 反射器、附反射器之引線框架、半導體發光裝置及樹脂組成物

Country Status (2)

Country Link
JP (1) JP2016036028A (ja)
TW (1) TW201608743A (ja)

Also Published As

Publication number Publication date
JP2016036028A (ja) 2016-03-17

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