TW201524687A - Glass plate manufacturing method - Google Patents
Glass plate manufacturing method Download PDFInfo
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- TW201524687A TW201524687A TW103140300A TW103140300A TW201524687A TW 201524687 A TW201524687 A TW 201524687A TW 103140300 A TW103140300 A TW 103140300A TW 103140300 A TW103140300 A TW 103140300A TW 201524687 A TW201524687 A TW 201524687A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Description
本發明係關於一種玻璃板之製造方法。 The present invention relates to a method of manufacturing a glass sheet.
對於智慧型手機等行動電話或PDA(Personal Digital Assistant，個人數位助理)等行動裝置，為了保護顯示器而使用覆蓋玻璃。近年來，要求將行動裝置薄型化、輕量化之技術，而推進有覆蓋玻璃之輕量化及薄板化。通常，若玻璃板變薄則強度降低，故而要求強度高於先前之覆蓋玻璃。又，除覆蓋玻璃以外，亦要求更高強度之玻璃板。作為使玻璃板高強度化之方法，開發有藉由離子交換法等而對玻璃板進行化學強化之技術。藉由化學強化，而於玻璃板之表面形成壓縮應力層，藉此可提供抑制撓曲且難以破損之玻璃板。 For mobile devices such as mobile phones and mobile devices such as PDAs (Personal Digital Assistants), cover glass is used to protect the display. In recent years, it has been demanded to reduce the weight and thickness of the cover glass by reducing the thickness and weight of the mobile device. Generally, if the glass sheet is thinned, the strength is lowered, so that the strength is required to be higher than that of the previous cover glass. Moreover, in addition to the cover glass, a glass sheet of higher strength is also required. As a method of increasing the strength of a glass sheet, a technique of chemically strengthening a glass sheet by an ion exchange method or the like has been developed. By compressing chemically, a compressive stress layer is formed on the surface of the glass plate, whereby a glass plate which is resistant to deflection and is hard to be broken can be provided.
關於此種覆蓋玻璃之製造，例如藉由將玻璃素板切斷為特定形狀後對主平面進行研磨等而製造。專利文獻1中揭示有如下方法：於化學強化後使用含有平均粒徑為80nm以下之膠體二氧化矽之漿料進行研磨，即進行強化後研磨步驟，藉此提供更高強度且輕量之強化玻璃板。 The production of such a cover glass is produced, for example, by cutting a glass plate into a specific shape and then polishing the main plane. Patent Document 1 discloses a method of performing polishing after chemical strengthening using a slurry containing colloidal ceria having an average particle diameter of 80 nm or less, that is, performing a post-intensification polishing step, thereby providing higher strength and lighter reinforcement. glass plate.
通常，玻璃板之製造方法中之研磨步驟係使用如下研磨裝置，該研磨裝置係將玻璃板保持於玻璃板用載體，使用研磨墊，一面將含有研磨粒之研磨液(漿料)供給至玻璃板與研磨墊之間，一面進行研磨。該研磨裝置係於上下壓盤貼附研磨墊，並***玻璃板，使用行星齒輪機構，使被保持於玻璃板用載體之玻璃板與研磨墊相對地移動， 藉此研磨玻璃板之主平面。玻璃板用載體典型而言係將板厚設定為薄於所研磨之玻璃板之板厚。利用該研磨裝置進行之研磨由於可同時研磨複數塊玻璃板，故而係於生產效率方面優異之方法。 In general, in the polishing step in the method for producing a glass sheet, a polishing apparatus for holding a glass plate on a carrier for a glass plate and supplying a polishing liquid (slurry) containing the abrasive grains to the glass using a polishing pad is used. Grinding is performed between the plate and the polishing pad. The polishing apparatus attaches a polishing pad to the upper and lower pressure plates, inserts the glass plate, and moves the glass plate held by the carrier for the glass plate and the polishing pad relative to each other by using a planetary gear mechanism. Thereby the main plane of the glass sheet is ground. The carrier for glass plates is typically set to a thickness that is thinner than the thickness of the glass plate being ground. The polishing by the polishing apparatus is a method excellent in production efficiency because a plurality of glass sheets can be simultaneously polished.
專利文獻1：日本專利特開2012-218995號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-218995
本發明者們進行努力研究，結果完成本發明。 The present inventors conducted diligent research and as a result completed the present invention.
本發明係提供以下之態樣者。(1)一種玻璃板之製造方法，其特徵在於：其係將玻璃板保持於在雙面研磨裝置之太陽齒輪與環形齒輪間進行行星齒輪運動之玻璃板用載體，並將被保持於上述玻璃板用載體之玻璃板***安裝於上壓盤與下壓盤之研磨墊之間，一面供給含有研磨粒之研磨液一面進行研磨，藉此製造玻璃板；且研磨時負載研磨荷重之狀態下的上述研磨墊之各者之變形量之平均值Dp為0.04mm以上。(2)如(1)記載之玻璃板之製造方法，其特徵在於：若將上述玻璃板用載體之板厚設為Lc，將上述玻璃板之板厚設為Lg，則滿足Lc<Lg-2．Dp。(3)如(1)或(2)記載之玻璃板之製造方法，其特徵在於：上述玻璃板之板厚為0.7mm以下。(4)如(1)至(3)中任一項記載之玻璃板之製造方法，其特徵在於：上述玻璃板係化學強化玻璃。(5)如(1)至(4)中任一項記載之玻璃板之製造方法，其特徵在於：上述玻璃板用載體係一體地形成有形成於外周面之齒輪部、與具有保持上述玻璃板之玻璃板保持孔且形成於上述齒輪部之內側之玻璃板保持部者。(6)如(1)至(5)中任一項記載之玻璃板之製造方法，其特徵在於：上述玻璃板係覆蓋玻璃。(7)如(1)至(6)中任一項記載之玻璃板之製造方法，其特徵在於：上述研磨墊係蕭氏A硬度處於45~95之範圍內者。(8)如(1)至(7)中任一項記載之強化玻璃板之製造方法，其特徵在於：以50 ~150g/cm2之研磨壓力進行研磨。(9)如(1)至(8)中任一項記載之強化玻璃板之製造方法，其特徵在於：上述研磨墊係軟質研磨墊。(10)如(9)記載之強化玻璃板之製造方法，其特徵在於：上述軟質研磨墊係不織布墊。 The present invention provides the following aspects. (1) A method of producing a glass sheet, which is a carrier for a glass sheet that holds a glass sheet in a planetary gear movement between a sun gear and a ring gear of a double-side polishing apparatus, and is held in the glass a glass plate for a carrier for a plate is inserted between a polishing pad attached to an upper platen and a lower platen, and is supplied to a polishing liquid containing abrasive grains while being polished, thereby producing a glass plate; and in a state of being loaded with a grinding load during polishing The average value Dp of the deformation amount of each of the polishing pads is 0.04 mm or more. (2) The method for producing a glass sheet according to the above aspect, wherein the thickness of the glass plate carrier is Lc, and if the thickness of the glass plate is Lg, Lc<Lg- is satisfied. 2. Dp. (3) The method for producing a glass sheet according to (1) or (2), wherein the glass sheet has a thickness of 0.7 mm or less. The method for producing a glass sheet according to any one of the preceding claims, wherein the glass sheet is a chemically strengthened glass. (5) The method for producing a glass sheet according to any one of the preceding claims, wherein the glass sheet carrier is integrally formed with a gear portion formed on an outer peripheral surface, and has a glass holding portion The glass plate of the plate holds the hole and is formed in the glass plate holding portion inside the gear portion. (6) The method for producing a glass sheet according to any one of (1) to (5), wherein the glass sheet is a cover glass. (7) The method for producing a glass sheet according to any one of (1) to (6), wherein the polishing pad has a Shore A hardness of 45 to 95. (8) The method for producing a tempered glass sheet according to any one of (1) to (7), wherein the tempered glass sheet is polished at a polishing pressure of 50 to 150 g/cm 2 . (9) The method for producing a tempered glass sheet according to any one of (1) to (8), wherein the polishing pad is a soft polishing pad. (10) The method for producing a tempered glass sheet according to (9), wherein the soft polishing pad is a non-woven mat.
根據本發明之強化玻璃板之製造方法，可製造高強度之強化玻璃板。 According to the method for producing a tempered glass sheet of the present invention, a high-strength tempered glass sheet can be produced.
1‧‧‧強化玻璃板 1‧‧‧Strengthened glass plate
2‧‧‧加壓治具 2‧‧‧ Pressing fixture
3‧‧‧承受治具 3‧‧‧Resistance
10‧‧‧玻璃板用載體 10‧‧‧ Carrier for glass plates
10a‧‧‧齒輪部 10a‧‧‧ Gear Department
10b‧‧‧玻璃板保持部 10b‧‧‧glass plate holder
11‧‧‧玻璃板保持孔 11‧‧‧ glass plate holding hole
12‧‧‧雙面研磨裝置 12‧‧‧Double-side grinding device
13‧‧‧太陽齒輪 13‧‧‧Sun Gear
14‧‧‧環形齒輪 14‧‧‧Ring gear
15‧‧‧上壓盤 15‧‧‧Upper platen
16、18‧‧‧研磨墊 16, 18‧‧‧ polishing pad
30‧‧‧玻璃板 30‧‧‧ glass plate
Dp1、Dp2‧‧‧研磨墊之變形量 Deformation of Dp1, Dp2‧‧‧ polishing pad
Lc‧‧‧玻璃板用載體之板厚 Lc‧‧‧Sheet thickness of the carrier for glass plates
Lg‧‧‧玻璃板之板厚 Lg‧‧‧ glass plate thickness
圖1係雙面研磨裝置之概略構成圖。 Fig. 1 is a schematic configuration diagram of a double-side polishing apparatus.
圖2係表示玻璃板用載體、研磨墊、玻璃板之關係之模式圖。 Fig. 2 is a schematic view showing the relationship between a carrier for a glass plate, a polishing pad, and a glass plate.
圖3係說明覆蓋玻璃之製造方法之流程之流程圖。 Fig. 3 is a flow chart showing the flow of a method of manufacturing a cover glass.
圖4係用以說明強度試驗之方法之概略圖。 Fig. 4 is a schematic view for explaining a method of strength test.
圖5係表示例1~4中之研磨墊之蕭氏A硬度與研磨後之玻璃板之BOR強度之關係之圖表。 Fig. 5 is a graph showing the relationship between the Shore A hardness of the polishing pad in Examples 1 to 4 and the BOR strength of the polished glass plate.
圖6係表示例1~4中之研磨墊(不織布墊)之變形量與研磨後之玻璃板之BOR強度之關係之圖表。 Fig. 6 is a graph showing the relationship between the amount of deformation of the polishing pad (non-woven pad) in Examples 1 to 4 and the BOR strength of the polished glass plate.
圖7係表示例5~7中之玻璃板用載體之板厚與研磨率之關係之圖表。 Fig. 7 is a graph showing the relationship between the thickness of the carrier for a glass plate and the polishing rate in Examples 5 to 7.
以下，一面參照圖式一面對本發明之玻璃板之製造方法之一實施形態、及於本實施形態之玻璃板之製造方法中可使用之雙面研磨裝置進行說明。 Hereinafter, an embodiment of a method for producing a glass sheet according to the present invention and a double-side polishing apparatus which can be used in the method for producing a glass sheet according to the present embodiment will be described with reference to the drawings.
作為去除含有缺陷及微細之凹凸之缺陷層之方法，可列舉利用圖1所示之雙面研磨裝置12進行研磨之方法。關於雙面研磨裝置12，如圖1所示，可設置玻璃板30(參照圖1)之玻璃板用載體10被設置於太陽齒輪13、環形齒輪14間。太陽齒輪13、環形齒輪14及形成於玻璃板 用載體10之外周面之齒輪部10a構成行星齒輪機構，以特定之旋轉比率旋轉驅動太陽齒輪13、環形齒輪14，藉此進行使玻璃板用載體10一面自轉一面繞太陽齒輪13之周圍公轉之行星齒輪運動。 As a method of removing the defective layer containing defects and fine irregularities, a method of polishing by the double-side polishing apparatus 12 shown in Fig. 1 can be cited. As shown in FIG. 1, the double-side polishing apparatus 12 is provided with a glass plate carrier 10 (see FIG. 1) provided between the sun gear 13 and the ring gear 14. Sun gear 13, ring gear 14 and formed on glass plate The planetary gear mechanism is configured by the gear portion 10a on the outer circumferential surface of the carrier 10, and the sun gear 13 and the ring gear 14 are rotationally driven at a specific rotation ratio, whereby the glass plate carrier 10 is rotated around the sun gear 13 while rotating. Planetary gear movement.
此時，玻璃板用載體10於將玻璃板30保持於在齒輪部10a之內側之玻璃板保持部10b所形成之玻璃板保持孔11之狀態下，如圖2所示，被夾持於在與玻璃板30對向之面安裝有研磨墊16、18之上壓盤15與下壓盤(未圖示)之間，並以特定之研磨荷重按壓玻璃板30。並且，對研磨墊16、18與玻璃板用載體10及玻璃板30之間供給含有研磨粒之研磨液(研磨漿料)，使上壓盤15與下壓盤相對旋轉，藉此同時研磨被保持於玻璃板用載體10之玻璃板30之兩主平面。 At this time, the glass plate carrier 10 is held in the state in which the glass plate 30 is held by the glass plate holding hole 11 formed by the glass plate holding portion 10b inside the gear portion 10a, as shown in FIG. The glass plate 30 is pressed between the platen 15 and the lower platen (not shown) on the polishing pad 16 and 18 opposite to the glass plate 30, and is pressed with a specific polishing load. Further, a polishing liquid (polishing slurry) containing abrasive grains is supplied between the polishing pads 16 and 18 and the glass plate carrier 10 and the glass plate 30, and the upper platen 15 and the lower platen are relatively rotated, whereby the polishing is simultaneously performed. The two main planes of the glass plate 30 of the carrier 10 for glass sheets are held.
玻璃板30之組成並無特別限定，較佳為可化學強化者。作為較佳之玻璃板30之組成，例如係以氧化物基準之莫耳%表示含有SiO2：50~80%、Al2O3：2~25%、Li2O：0~10%、Na2O：0~18%、K2O：0~10%、MgO：0~15%、CaO：0~5%及ZrO2：0~5%之玻璃。 The composition of the glass plate 30 is not particularly limited, and is preferably chemically strengthened. As a composition of the preferred glass plate 30, for example, the mole % based on the oxide means SiO 2 : 50 to 80%, Al 2 O 3 : 2 to 25%, Li 2 O: 0 to 10%, Na 2 . O: 0 to 18%, K 2 O: 0 to 10%, MgO: 0 to 15%, CaO: 0 to 5%, and ZrO 2 : 0 to 5% of glass.
除此以外，較佳為使用以氧化物基準之莫耳%表示含有SiO2：50~74%、Al2O3：1~10%、Na2O：6~14%、K2O：3~11%、MgO：2~15%、CaO：0~6%及ZrO2：0~5%，且SiO2及Al2O3之含量合計為75%以下、Na2O及K2O之含量合計為12~25%、MgO及CaO之含量合計為7~15%之玻璃；以氧化物基準之莫耳%表示含有SiO2：68~80%、Al2O3：4~10%、Na2O：5~15%、K2O：0~1%、MgO：4~15%及ZrO2：0~1%之玻璃；以氧化物基準之莫耳%表示含有SiO2：67~75%、Al2O3：0~4%、Na2O：7~15%、K2O：1~9%、MgO：6~14%及ZrO2：0~1.5%，且SiO2及Al2O3之含量合計為71~75%、Na2O及K2O之含量合計為12~20%，且含有CaO之情形時，其含量未達1%之玻璃。 In addition, it is preferable to use SiO 2 which is based on an oxide to represent SiO 2 : 50 to 74%, Al 2 O 3 : 1 to 10%, Na 2 O: 6 to 14%, and K 2 O: 3 ~11%, MgO: 2~15%, CaO: 0~6% and ZrO 2 : 0~5%, and the total content of SiO 2 and Al 2 O 3 is 75% or less, Na 2 O and K 2 O The total content is 12 to 25%, the total content of MgO and CaO is 7 to 15% glass; the mole % based on oxide means SiO 2 : 68 to 80%, Al 2 O 3 : 4 to 10%, Na 2 O: 5 to 15%, K 2 O: 0 to 1%, MgO: 4 to 15%, and ZrO 2 : 0 to 1% of glass; mol% based on oxide means SiO 2 : 67~ 75%, Al 2 O 3 : 0 to 4%, Na 2 O: 7 to 15%, K 2 O: 1 to 9%, MgO: 6 to 14%, and ZrO 2 : 0 to 1.5%, and SiO 2 and The total content of Al 2 O 3 is 71 to 75%, the total content of Na 2 O and K 2 O is 12 to 20%, and when CaO is contained, the content is less than 1%.
玻璃板30係藉由浮式法、熔融下拉法、狹縫下拉法、再曳引法 等方法而製作。 The glass plate 30 is a floating method, a melt down method, a slit down method, and a re-drag method. Made by other methods.
又，玻璃板30較佳為施加有化學強化處理之化學強化玻璃。藉此，於玻璃板30之表面形成壓縮應力層，而提高強度及耐擦傷性。化學強化係於玻璃轉移點以下之溫度下，將玻璃表面之離子半徑較小之鹼金屬離子(典型而言為Na離子或Li離子)交換為離子半徑更大之鹼金屬離子(典型而言為K離子)，藉此於玻璃表面形成壓縮應力層之處理。化學強化處理可藉由先前公知之方法而進行。 Further, the glass plate 30 is preferably a chemically strengthened glass to which a chemical strengthening treatment is applied. Thereby, a compressive stress layer is formed on the surface of the glass plate 30 to improve strength and scratch resistance. Chemical strengthening is the exchange of alkali metal ions (typically Na or Li ions) with a smaller ionic radius on the surface of the glass at a temperature below the glass transition point to an alkali metal ion with a larger ionic radius (typically K ion), whereby a process of forming a compressive stress layer on the surface of the glass. The chemical strengthening treatment can be carried out by a previously known method.
又，玻璃板30之尺寸、形狀、厚度係根據用途而不同，但於用於行動電話等之覆蓋玻璃用途之情形時，通常玻璃板30之厚度為0.3mm~1.5mm左右，較佳為0.35mm~1.2mm。 Further, the size, shape, and thickness of the glass sheet 30 vary depending on the application. However, when used for a cover glass application such as a mobile phone, the thickness of the glass sheet 30 is usually about 0.3 mm to 1.5 mm, preferably 0.35. Mm~1.2mm.
玻璃板30之厚度更佳為0.7mm以下，進而較佳為0.6mm以下。於對板厚為0.7mm以下之玻璃板30進行研磨之情形時，將研磨墊之變形量與玻璃板用載體10之板厚納入考慮範圍而進行研磨，藉此可高效率地實施研磨。 The thickness of the glass plate 30 is more preferably 0.7 mm or less, further preferably 0.6 mm or less. When the glass plate 30 having a thickness of 0.7 mm or less is polished, the amount of deformation of the polishing pad and the thickness of the carrier 10 for the glass plate are taken into consideration and polished, whereby polishing can be performed efficiently.
又，若根據玻璃板用載體10之板厚降低研磨率，則於玻璃板30之研磨時，玻璃板用載體10亦一併被較多地研磨。由此，玻璃板用載體10之壽命亦變短，故而選擇適當板厚之玻璃板用載體10亦可抑制玻璃板用載體10之更換頻度而較佳。 Moreover, when the polishing rate is lowered according to the thickness of the glass plate carrier 10, the glass plate carrier 10 is also polished a lot during the polishing of the glass plate 30. As a result, the life of the glass plate carrier 10 is also shortened. Therefore, it is preferable to select the glass plate carrier 10 having an appropriate thickness to suppress the frequency of replacement of the glass plate carrier 10.
研磨墊16、18較佳為軟質研磨墊，積層為4.5mm厚之硬度較佳為以蕭氏A硬度表示為45~95，更佳為55~92。若蕭氏A硬度未達45，則變得難以獲得充分之研磨率，若超過95，則有因研磨粒之壓入而使玻璃產生微小傷痕之虞。滿足此種條件之研磨墊16、18之素材典型而言可列舉不織布墊、織布墊、麂皮墊等。 The polishing pads 16, 18 are preferably soft polishing pads, and the hardness of the laminate layer of 4.5 mm is preferably 45 to 95, more preferably 55 to 92, in terms of Shore A hardness. If the Shore A hardness is less than 45, it becomes difficult to obtain a sufficient polishing rate, and if it exceeds 95, there is a slight flaw in the glass due to the press-in of the abrasive grains. The material of the polishing pads 16 and 18 satisfying such conditions is typically a non-woven mat, a woven mat, a suede mat or the like.
軟質研磨墊與硬質胺基甲酸酯墊之厚度(典型而言為1.5mm~2.0mm)相比較薄，典型而言具有0.3mm~5.0mm左右之厚度。又，關於形成於墊表面之溝深度，與硬質胺基甲酸酯墊之溝深度(典型而言為 1.2mm~1.7mm)相比亦較淺，典型而言具有0.2mm~2.5mm左右之厚度。 The soft polishing pad is thinner than the thickness of the hard urethane pad (typically 1.5 mm to 2.0 mm), and typically has a thickness of about 0.3 mm to 5.0 mm. Also, regarding the depth of the groove formed on the surface of the pad, the depth of the groove with the hard amine substrate pad (typically 1.2mm~1.7mm) is also shallower, typically having a thickness of about 0.2mm~2.5mm.
研磨墊16、18可選擇不織布墊。不織布墊係將纖維不編織而相互纏繞而成之毛氈、或將使橡膠或樹脂含浸於該毛氈而成者貼附於PET等基材而成之軟質研磨墊。硬度較佳為積層為4.5mm厚之硬度以蕭氏A硬度計為45~95。構成不織布墊之纖維可適當選擇聚酯纖維、芳族聚醯胺纖維、尼龍纖維、聚烯烴纖維等，但其中最佳為聚酯纖維。樹脂可適當選擇聚胺基甲酸酯、環氧樹脂等，但其中最佳為聚胺基甲酸酯。 The polishing pads 16, 18 may be selected from non-woven mats. The non-woven fabric mat is a soft abrasive mat which is obtained by attaching a felt to the base material such as PET by impregnating the fibers with the fibers, or by impregnating the felt with rubber or resin. The hardness is preferably such that the laminate has a hardness of 4.5 mm and a hardness of 45 to 95 in Shore A hardness. As the fiber constituting the non-woven mat, polyester fiber, aromatic polyamide fiber, nylon fiber, polyolefin fiber or the like can be appropriately selected, but among them, polyester fiber is most preferable. As the resin, a polyurethane, an epoxy resin or the like can be appropriately selected, but among them, a polyurethane is preferable.
不織布墊典型而言具有1.0mm~5.0mm左右之厚度。又，關於形成於墊表面之溝深度，典型而言具有相對於研磨墊之厚度為50%左右之厚度。 The non-woven mat typically has a thickness of about 1.0 mm to 5.0 mm. Further, the depth of the groove formed on the surface of the pad typically has a thickness of about 50% with respect to the thickness of the polishing pad.
研磨墊16、18亦可選擇麂皮墊。麂皮墊係藉由具有縱向孔之胺基甲酸酯片材而構成之軟質研磨墊。構成麂皮墊之樹脂係胺基甲酸酯樹脂。亦可於具有縱向孔構造之胺基甲酸酯片材之基底層重疊不織布、PET片材。麂皮墊典型而言具有0.3mm~1.2mm左右之厚度。又，關於形成於墊表面之溝深度，典型而言具有相對於研磨墊之厚度為30~70%左右之厚度。 The polishing pad 16, 18 can also be selected as a suede pad. A suede pad is a soft abrasive pad constructed of a urethane sheet having longitudinal pores. A resin-based urethane resin constituting a suede pad. The nonwoven fabric or the PET sheet may be laminated on the base layer of the urethane sheet having the longitudinal pore structure. The suede pad typically has a thickness of about 0.3 mm to 1.2 mm. Further, the depth of the groove formed on the surface of the pad typically has a thickness of about 30 to 70% with respect to the thickness of the polishing pad.
玻璃板用載體10係藉由積層複數片預浸體而製作。關於預浸體之材質，並無特別限定，可根據作為目的之玻璃板用載體10之變形量等而選擇。例如，作為基材，使用玻璃纖維布、玻璃纖維不織布、芳族聚醯胺纖維不織布、聚酯纖維布等，亦可使用使環氧樹脂、酚樹脂、不飽和聚酯樹脂、聚醯亞胺樹脂等樹脂含浸於該等基材而成之物。 The glass plate carrier 10 is produced by laminating a plurality of prepregs. The material of the prepreg is not particularly limited, and may be selected according to the amount of deformation of the glass carrier 10 for the purpose. For example, as the substrate, a glass fiber cloth, a glass fiber nonwoven fabric, an aromatic polyamide fiber nonwoven fabric, a polyester fiber cloth, or the like may be used, and an epoxy resin, a phenol resin, an unsaturated polyester resin, or a polyimine may also be used. A resin such as a resin is impregnated into the base materials.
又，所使用之預浸體並不限定於一種，亦可積層不同材料之預浸體。藉由對經過積層之預浸體利用壓製機進行加壓、加熱而製作玻 璃板用載體10。 Further, the prepreg to be used is not limited to one type, and a prepreg of a different material may be laminated. Making glass by pressurizing and heating the laminated prepreg by a press The carrier 10 for the glass plate.
此處，若如圖2所示，將於研磨時負載研磨荷重之狀態下的各研磨墊16、18之變形量(沈入量)分別設為Dp1、Dp2，且將Dp1與Dp2之平均值設為Dp(=(Dp1+Dp2)/2)，則Dp成為0.04mm以上。各研磨墊16、18之變形量Dp1、Dp2分別為與玻璃板30相接之研磨墊16、18之收縮最大之面、與位於玻璃板30間且位於最靠玻璃板用載體10側之部分之距離。研磨壓力可根據研磨時間與研磨量等之關係而適當設定，較佳為50~150g/cm2(SI)，進而較佳為60~120g/cm2。 Here, as shown in FIG. 2, the amount of deformation (sinking amount) of each of the polishing pads 16 and 18 in a state where the polishing load is applied during polishing is set to Dp1 and Dp2, respectively, and the average value of Dp1 and Dp2 is set. When Dp(=(Dp1+Dp2)/2) is set, Dp becomes 0.04 mm or more. The deformation amounts Dp1 and Dp2 of the respective polishing pads 16 and 18 are the surfaces of the polishing pads 16 and 18 which are in contact with the glass plate 30, respectively, and the portions which are located between the glass plates 30 and which are located closest to the carrier 10 for the glass plate. The distance. The polishing pressure can be appropriately set depending on the relationship between the polishing time and the amount of polishing, and is preferably 50 to 150 g/cm 2 (SI), more preferably 60 to 120 g/cm 2 .
即，若將研磨壓力設為固定，則為了確保因研磨時之研磨壓力而導致之各研磨墊16、18之變形量之平均值為0.04mm以上，而可於使用硬度較低即柔軟之研磨墊，抑或使用硬度較高即較硬之研磨墊之情形時，將研磨墊之厚度設為較厚，藉此確保研磨墊之變形量。於使用如麂皮墊般較薄之研磨布之情形時，亦可於基底層貼附不織布而增加厚度。再者，本實施形態中，變形量係於使研磨墊16、18潤濕之狀態下施加壓力而測定。藉由於潤濕之狀態下測定而可於與研磨中相同之條件下進行測定。 In other words, when the polishing pressure is fixed, the average value of the deformation amount of each of the polishing pads 16 and 18 due to the polishing pressure during polishing is 0.04 mm or more, and the softness can be used. In the case of a mat, or in the case of using a harder, harder abrasive pad, the thickness of the pad is set to be thicker, thereby ensuring the amount of deformation of the pad. In the case of using a polishing cloth as thin as a suede pad, it is also possible to attach a non-woven fabric to the base layer to increase the thickness. Further, in the present embodiment, the amount of deformation is measured by applying pressure in a state where the polishing pads 16 and 18 are wetted. The measurement can be carried out under the same conditions as in the polishing by measurement in a wet state.
又，若將玻璃板用載體10之板厚設為Lc，將玻璃板30之板厚設為Lg，則玻璃板用載體10之板厚Lc係以滿足以下(A)式之方式而設定。 In addition, when the thickness of the glass plate carrier 10 is Lc and the thickness of the glass plate 30 is Lg, the thickness Lc of the glass plate carrier 10 is set so as to satisfy the following formula (A).
Lc<Lg-2．Dp (A) Lc<Lg-2. Dp (A)
如此，考慮研磨時之研磨荷重下之研磨墊16、18之沈入，將玻璃板用載體10之板厚Lc設為小於研磨墊16、18間之距離(Lg-2．Dp)，藉此即便於在研磨時負載特定之研磨荷重之情形時，亦不會使研磨墊16、18接觸於玻璃板用載體10。藉此，研磨墊16、18僅接觸於玻璃板30，而使研磨荷重適當地負載於玻璃板30。 In this manner, the thickness Lc of the glass plate carrier 10 is set to be smaller than the distance between the polishing pads 16 and 18 (Lg-2.Dp) in consideration of the sinking of the polishing pads 16 and 18 under the polishing load during polishing. That is, when the specific polishing load is loaded during polishing, the polishing pads 16, 18 are not brought into contact with the carrier 10 for the glass plate. Thereby, the polishing pads 16, 18 are only in contact with the glass plate 30, and the polishing load is appropriately loaded on the glass plate 30.
因此，如先前般，使玻璃板用載體觸碰研磨墊，壓力並不會適 當作用於玻璃板，而使所需之研磨率劣化之不良情形得以消除。再者，自強度之觀點而言，研磨墊16、18之厚度較佳為300μm以上，更佳為350μm以上，進而較佳為370μm以上。 Therefore, as before, the glass plate is touched by the carrier with the carrier, and the pressure is not suitable. As a glass plate, the problem of deteriorating the required polishing rate is eliminated. Further, the thickness of the polishing pads 16 and 18 is preferably 300 μm or more, more preferably 350 μm or more, and still more preferably 370 μm or more from the viewpoint of strength.
又，由於研磨時使研磨墊16、18不接觸於玻璃板用載體10，而不對玻璃板用載體10施加壓力，故而可抑制齒輪部10a之破裂，可使玻璃板用載體10長壽命化。該抑制齒輪部10a之破裂之效果尤其對齒輪部10a、及齒輪部10a之內側之玻璃板保持部10b一體地形成之玻璃板用載體10顯著。因此，玻璃板用載體10較佳為齒輪部10a與玻璃板保持部10b一體地形成者。再者，玻璃板用載體10並不限定於齒輪部10a與玻璃板保持部10b一體地形成者，亦可為包含金屬製之齒輪部與樹脂製之玻璃基板保持部者。 Further, since the polishing pads 16 and 18 are not in contact with the glass plate carrier 10 during polishing, pressure is not applied to the glass plate carrier 10, so that cracking of the gear portion 10a can be suppressed, and the glass plate carrier 10 can be extended in life. The effect of suppressing the rupture of the gear portion 10a is remarkable particularly for the glass plate carrier 10 in which the gear portion 10a and the glass plate holding portion 10b on the inner side of the gear portion 10a are integrally formed. Therefore, it is preferable that the glass plate carrier 10 is integrally formed with the gear portion 10a and the glass plate holding portion 10b. Further, the glass plate carrier 10 is not limited to being integrally formed with the gear portion 10a and the glass plate holding portion 10b, and may be a metal gear portion or a resin glass substrate holding portion.
研磨液(研磨漿料)例如可使用含有膠體二氧化矽等氧化矽、氧化鈰等稀土類氧化物、氧化鋯、氧化鋁、氧化鎂、碳化矽、氧化錳、氧化鐵、金剛石、氮化硼及鋯英石等公知之研磨粒之漿料。研磨粒可單獨使用1種，亦可併用2種以上而使用。 As the polishing liquid (polishing slurry), for example, a rare earth oxide such as cerium oxide or cerium oxide such as colloidal cerium oxide, zirconia, alumina, magnesia, lanthanum carbide, manganese oxide, iron oxide, diamond or boron nitride can be used. And a slurry of known abrasive grains such as zircon. One type of the abrasive particles may be used alone or two or more types may be used in combination.
本發明之玻璃板之製造方法亦可包含另一步驟，即於化學強化處理前去除存在於玻璃板之表面之傷痕(龜裂)或玻璃板之撓曲或凹陷。作為於化學強化處理前去除玻璃板之表面之龜裂之方法，可列舉與上述去除缺陷層之步驟同樣地對玻璃板之表面進行研磨之方法。 The method for producing a glass sheet of the present invention may further comprise the step of removing the flaws (cracks) present on the surface of the glass sheet or the deflection or depression of the glass sheet before the chemical strengthening treatment. As a method of removing the crack of the surface of the glass plate before the chemical strengthening treatment, a method of polishing the surface of the glass plate in the same manner as the above step of removing the defective layer is exemplified.
繼而，作為本實施形態之玻璃板之製造方法之一例，一面參照圖3一面對覆蓋玻璃之製造方法進行說明。 Next, as an example of the method for producing a glass sheet of the present embodiment, a method of manufacturing the cover glass will be described with reference to FIG.
於覆蓋玻璃之製造方法中，首先，將藉由浮式法等而製造之玻璃板切斷，板狀裁切特定之玻璃素板(S1)。其次，以吻合所需之覆蓋玻璃之尺寸之方式進行切斷處理，而進行端面之倒角處理(S2)。繼而，使用雙面研磨裝置12對玻璃板之表面進行研磨(強化前研磨)而去除龜裂(S3)。 In the method for producing a cover glass, first, a glass plate produced by a float method or the like is cut, and a specific glass plate (S1) is cut in a sheet shape. Next, the cutting treatment is performed so as to match the size of the cover glass required for the bonding, and the chamfering treatment of the end surface is performed (S2). Then, the surface of the glass plate is polished (pre-strength polishing) using the double-side polishing device 12 to remove the crack (S3).
繼而，進行化學強化處理(S4)。藉由進行化學強化處理，使玻璃之表面進行離子交換，而形成殘留壓縮應力之表面層。具體而言，藉由使玻璃之表面進行離子交換，而將玻璃所含有之離子半徑較小之離子(例如Li離子、Na離子)置換為離子半徑較大之離子(例如K離子)。藉此，於玻璃之表面殘留壓縮應力，提昇玻璃之強度。化學強化處理例如藉由於400℃~450℃之KNO3熔鹽中浸漬1小時~10小時而進行。又，較佳為於化學強化處理後，以去除附著於玻璃板之熔鹽等附著物等為目的利用水洗淨。 Then, a chemical strengthening treatment (S4) is performed. The surface of the glass is ion-exchanged by chemical strengthening treatment to form a surface layer having residual compressive stress. Specifically, by ion-exchange the surface of the glass, ions having a small ionic radius (for example, Li ions and Na ions) contained in the glass are replaced with ions having a large ionic radius (for example, K ions). Thereby, compressive stress remains on the surface of the glass to increase the strength of the glass. The chemical strengthening treatment is carried out, for example, by immersing in a KNO 3 molten salt at 400 ° C to 450 ° C for 1 hour to 10 hours. Moreover, after the chemical strengthening treatment, it is preferable to wash with water for the purpose of removing adhering substances such as molten salt adhering to the glass plate.
藉由離子交換而進行化學強化處理後之強化玻璃板於其表面產生缺陷。又，有於強化玻璃板之表面殘留最大1μm左右之微細凹凸之情況。於使力作用於玻璃之情形時，有應力集中於存在上述缺陷或微細凹凸之部位，即便為小於理論強度之力亦會破裂之情況。存在缺陷之缺陷層之厚度亦根據化學強化處理之條件而異，但通常為0.01~0.5μm。因此，較佳為繼化學強化處理之後，去除存在於化學強化處理後之玻璃之至少一表面的具有缺陷及微細凹凸之層(稱為缺陷層)。缺陷層之去除係藉由使用雙面研磨裝置12對玻璃板之表面進行研磨(強化後研磨)而進行(S5)。最後，於玻璃板之周緣部印刷具有遮光性之黑色層等而製造覆蓋玻璃。 The tempered glass sheet subjected to chemical strengthening treatment by ion exchange causes defects on the surface thereof. Further, there is a case where fine irregularities of up to about 1 μm remain on the surface of the tempered glass sheet. When a force acts on the glass, stress concentrates on the portion where the above-mentioned defects or fine irregularities are present, and even if the force is less than the theoretical strength, the force may be broken. The thickness of the defective layer having defects also varies depending on the conditions of the chemical strengthening treatment, but is usually 0.01 to 0.5 μm. Therefore, it is preferable to remove a layer (referred to as a defect layer) having defects and fine concavities and convexities on at least one surface of the glass after the chemical strengthening treatment after the chemical strengthening treatment. The removal of the defect layer is performed by polishing (reinforcing post-grinding) the surface of the glass plate using the double-side polishing device 12 (S5). Finally, a cover layer is produced by printing a black layer or the like having a light-shielding property on the peripheral portion of the glass sheet.
本發明可適用於強化前研磨(S3)，亦可適用於強化後研磨(S5)，亦可適用於兩者，於使用更軟質之研磨墊之強化後研磨(S5)中可發揮更顯著之效果。 The invention can be applied to the pre-reinforcing polishing (S3), the post-enhancement grinding (S5), or both, and can be more prominent in the post-enhancement grinding (S5) using a softer polishing pad. effect.
以下，根據具體例對本發明進行說明，但本發明並不限定於該等之例。 Hereinafter, the present invention will be described based on specific examples, but the present invention is not limited to the examples.
於例1~4中，使用於藉由浮式法而成形後進行切斷而獲得之尺 寸為縱300mm×橫225mm、板厚Lg為0.56mm之玻璃板。所使用之玻璃板之組成以氧化物基準之莫耳%表示為SiO2：64%、Al2O3：8%、MgO：11%、Na2O：12.5%、ZrO2：0.5%。 In Examples 1 to 4, a glass plate having a size of 300 mm in length × 225 mm in width and a thickness Lg of 0.56 mm obtained by cutting by a floating method was used. The composition of the glass plate to be used is expressed by SiO 2 : 64%, Al 2 O 3 : 8%, MgO: 11%, Na 2 O: 12.5%, and ZrO 2 : 0.5%.
以下，使用例1~4之研磨墊(不織布墊)於化學強化處理後進行研磨處理。表1表示例1~4之研磨墊之厚度、密度、壓縮率、變形量、壓縮彈性模數、硬度。 Hereinafter, the polishing pad (non-woven pad) of Examples 1 to 4 was used for the polishing treatment after the chemical strengthening treatment. Table 1 shows the thickness, density, compression ratio, deformation amount, compression modulus, and hardness of the polishing pads of Examples 1 to 4.
(化學強化) (chemical strengthening)
將玻璃板浸漬於KNO3熔鹽，於離子交換處理後，冷卻至室溫附近，藉此進行化學強化。此時，將KNO3熔鹽之溫度設為435℃，將浸漬時間設為4小時。對所獲得之化學強化玻璃板(以下，稱為強化玻璃板)進行水洗，而供於後續之氧化鈰研磨步驟。強化後之強化玻璃板之表面壓縮應力(CS)為700±50MPa，壓縮應力層深度(DOL)為18±2μm。 The glass plate was immersed in a KNO 3 molten salt, and after ion exchange treatment, it was cooled to near room temperature to carry out chemical strengthening. At this time, the temperature of the KNO 3 molten salt was set to 435 ° C, and the immersion time was set to 4 hours. The obtained chemically strengthened glass plate (hereinafter referred to as a tempered glass plate) is washed with water and supplied to a subsequent cerium oxide polishing step. The surface of the strengthened tempered glass sheet has a compressive stress (CS) of 700 ± 50 MPa and a compressive stress layer depth (DOL) of 18 ± 2 μm.
(強化後研磨) (enhanced grinding)
作為研磨漿料，使平均粒子直徑(d50)為1μm之氧化鈰分散於水中而製作漿料，使用所獲得之漿料，對強化玻璃板研磨特定時間。 As the polishing slurry, cerium oxide having an average particle diameter (d50) of 1 μm was dispersed in water to prepare a slurry, and the obtained tempered glass plate was polished for a specific period of time using the obtained slurry.
以下，對評價方法進行說明。關於各例，於研磨處理後進行下述Ball on Ring(球對環)試驗。 Hereinafter, the evaluation method will be described. For each of the examples, the following Ball on Ring test was carried out after the rubbing treatment.
Ball on Ring(BOR)試驗係於將強化玻璃板1水平地載置之狀態下，使用SUS304製之加壓治具2對強化玻璃板1加壓，而測定強化玻璃板1之強度。圖4表示用以說明本發明中使用之強度試驗之概略圖。於圖4中，於SUS304製之承受治具3上水平地設置有成為樣品之強化玻璃板1。於強化玻璃板1上方設置有用以對強化玻璃板1加壓之加壓治具2。 The Ball on Ring (BOR) test measures the strength of the tempered glass sheet 1 by pressurizing the tempered glass sheet 1 with a press jig 2 made of SUS304 in a state where the tempered glass sheet 1 is placed horizontally. Fig. 4 is a schematic view for explaining the strength test used in the present invention. In Fig. 4, a tempered glass sheet 1 to be a sample is horizontally provided on a susceptor 3 made of SUS304. A pressurizing jig 2 for pressurizing the tempered glass sheet 1 is provided above the tempered glass sheet 1.
於本例中，自強化玻璃板1之上方對強化玻璃板1之中央區域加壓。再者，試驗條件如下所述。 In this example, the central region of the strengthened glass sheet 1 is pressurized from above the strengthened glass sheet 1. Furthermore, the test conditions are as follows.
樣品厚度：0.56(mm)；加壓治具2之下降速度：1.0(mm/min)：此時，將玻璃被破壞時之破壞荷重(單位N)設為BOR強度。表1之BOR強度係一面改變研磨壓力、壓盤轉數一面求出特定次數(N數)下之平均BOR強度，而設為可包含該所求出之平均BOR強度之範圍。 Sample thickness: 0.56 (mm); reduction speed of the press fixture 2: 1.0 (mm/min): At this time, the breaking load (unit N) when the glass was broken was set as the BOR strength. The BOR intensity in Table 1 is obtained by determining the average BOR intensity at a specific number of times (N number) while changing the polishing pressure and the number of platen revolutions, and is set to include the range of the average BOR intensity obtained.
例如，於例1中，如下述表2所示，一面於研磨壓力60~100g/cm3、下壓盤轉數20~40rpm之範圍內改變條件，一面於各條件下每6批次(N數)為一組進行研磨。將6批次之平均值作為BOR強度示於表2。又，亦一併測定此時之加工裕度並示於表2。於例1中，平均BOR強度之最低值為323N，最高值為339N，若四捨五入，則可包含平均BOR強度之範圍成為320N~340N。於表1中，將該範圍作為BOR強度而表示。再者，下壓盤、上壓盤、載體自轉、載體公轉係預先設為特定之比率，研磨時間係設為300秒。 For example, in Example 1, as shown in the following Table 2, the conditions were changed within the range of the polishing pressure of 60 to 100 g/cm 3 and the number of rotations of the lower platen of 20 to 40 rpm, and each of the six batches under each condition (N) Number) is ground for a group. The average of 6 batches is shown in Table 2 as the BOR intensity. Further, the processing margin at this time was also measured and shown in Table 2. In Example 1, the average BOR intensity has a minimum value of 323 N and a maximum value of 339 N. If rounded off, the range of the average BOR intensity can be included as 320 N to 340 N. In Table 1, this range is shown as the BOR intensity. Further, the lower platen, the upper platen, the carrier rotation, and the carrier revolution are previously set to a specific ratio, and the polishing time is set to 300 seconds.
圖5係表示例1~4中之研磨墊(不織布墊)之蕭氏A硬度與研磨後之強化玻璃之BOR強度之關係之圖表。 Fig. 5 is a graph showing the relationship between the Shore A hardness of the polishing pad (nonwoven pad) in Examples 1 to 4 and the BOR strength of the tempered glass after polishing.
若將使用例1~3之大致相同厚度(約1.35mm)之研磨墊之情形進行比較，則明確隨著蕭氏A硬度變低即研磨墊變柔軟，玻璃板之BOR強度變高。又，另一方面，於使用厚度較厚之例4(3mm)之研磨墊之情形時，明確即便蕭氏A硬度較高即研磨墊較硬，板玻璃之BOR強度仍較高。 When the polishing pads of substantially the same thickness (about 1.35 mm) of Examples 1 to 3 were used, it was confirmed that the polishing pad became soft as the Shore A hardness became low, and the BOR strength of the glass plate became high. On the other hand, in the case of using a polishing pad of Example 4 (3 mm) having a relatively large thickness, it is clear that even if the Shore A hardness is high, that is, the polishing pad is hard, the BOR strength of the plate glass is still high.
圖6係表示於對例1~4中之研磨墊施加100g/cm2之荷重之情形時之變形量(研磨墊之變形量)之平均值Dp與研磨後之強化玻璃板1之BOR強度之關係之圖表。 Fig. 6 is a graph showing the average value Dp of the deformation amount (the deformation amount of the polishing pad) and the BOR strength of the tempered glass sheet 1 after the application of the load of 100 g/cm 2 to the polishing pads of Examples 1 to 4. A chart of relationships.
如圖6所明示般，若橫軸採用研磨墊之變形量之平均值Dp，則明確隨著研磨墊之變形量之平均值Dp變大，BOR強度亦變大。可認為其原因在於，藉由確保特定之變形量可於研磨時使研磨粒漏至研磨墊，故而使研磨粒與玻璃表面之接觸變得適度，難以產生微小之傷痕。如此，可認為藉由確保研磨墊之變形量而使強化玻璃板1之BOR強度變高。 As shown in Fig. 6, when the horizontal axis is the average value Dp of the deformation amount of the polishing pad, it is clear that the BOR intensity also increases as the average value Dp of the deformation amount of the polishing pad increases. This is considered to be because the polishing particles can be leaked to the polishing pad during polishing by ensuring a specific amount of deformation, so that the contact between the abrasive grains and the glass surface is moderate, and it is difficult to cause minute scratches. Thus, it is considered that the BOR strength of the tempered glass sheet 1 is increased by securing the amount of deformation of the polishing pad.
根據圖5及圖6明確，為了確保研磨墊之變形量，於使用研磨墊之硬度較低之柔軟之研磨墊，抑或使用硬度較高(較硬)之研磨墊之情 形時，將研磨墊之厚度設為較厚有效。 It is clear from Fig. 5 and Fig. 6 that in order to ensure the amount of deformation of the polishing pad, use a soft polishing pad having a lower hardness of the polishing pad, or use a polishing pad having a higher hardness (harder). In the case of shape, it is effective to make the thickness of the polishing pad thicker.
根據圖6，於研磨墊之變形量之平均值Dp與BOR強度間確認到線性。若於該例1~4引近似直線(回歸直線)，則獲得y=1374.8x+151.11，若將BOR強度設為200N以上，則研磨墊之變形量之平均值Dp為0.04mm以上，若將BOR強度設為250N以上，則研磨墊之變形量之平均值Dp必須為0.072mm以上。 According to Fig. 6, linearity was confirmed between the average value Dp of the deformation amount of the polishing pad and the BOR intensity. If the approximate straight line (regressive straight line) is given in the examples 1 to 4, y=1374.8x+151.11 is obtained, and when the BOR intensity is 200N or more, the average value Dp of the deformation amount of the polishing pad is 0.04 mm or more. When the BOR strength is 250 N or more, the average value Dp of the deformation amount of the polishing pad must be 0.072 mm or more.
於對玻璃板負載特定之研磨荷重之狀態下，準備變形量不同之3種研磨墊(軟質研磨墊)，調查使用各研磨墊時之玻璃板用載體之板厚Lc與研磨率之關係。圖7係表示玻璃板用載體之板厚Lc與研磨率之關係之圖表，縱軸表示研磨率，橫軸表示玻璃板用載體之板厚Lc。 Three kinds of polishing pads (soft polishing pads) having different amounts of deformation were prepared in a state where a specific polishing load was applied to the glass plate, and the relationship between the thickness Lc of the carrier for the glass plate and the polishing rate when each polishing pad was used was examined. Fig. 7 is a graph showing the relationship between the thickness Lc of the carrier for a glass plate and the polishing rate, and the vertical axis represents the polishing rate, and the horizontal axis represents the thickness Lc of the carrier for the glass sheet.
作為變形量不同之3種研磨墊，準備特定之研磨荷重下之研磨墊之合計變形量為0.08mm之軟質研磨墊(例5)、0.1mm之軟質研磨墊(例6)、及0.25mm之軟質研磨墊(例7)，測定使用板厚Lc不同為0.250mm、0.350mm、0.450mm之玻璃板用載體進行研磨之情形時之研磨率。所謂合計變形量係指將上下之研磨墊之變形量(沈入量)相加而獲得之量。 As a type of polishing pad having different amounts of deformation, a soft polishing pad (Example 5) having a total deformation amount of the polishing pad of 0.08 mm, a soft polishing pad of 0.1 mm (Example 6), and 0.25 mm were prepared. The soft polishing pad (Example 7) was measured for the polishing rate when the glass plate with a thickness Lc of 0.250 mm, 0.350 mm, or 0.450 mm was used for polishing. The total amount of deformation refers to an amount obtained by adding the amount of deformation (sinking amount) of the upper and lower polishing pads.
圖7係以使用具有0.450mm之板厚Lc之玻璃板用載體時之研磨率為基準(100%)算出研磨率。再者，玻璃板係使用尺寸為150mm×84mm、板厚Lg為0.56mm、表面壓縮應力(CS)為700±50MPa、壓縮應力層深度(DOL)為18±2μm者。 Fig. 7 is a graph showing the polishing rate based on the polishing rate (100%) when a carrier for a glass plate having a thickness Lc of 0.450 mm was used. Further, the glass plate was used in a size of 150 mm × 84 mm, a plate thickness Lg of 0.56 mm, a surface compressive stress (CS) of 700 ± 50 MPa, and a compressive stress layer depth (DOL) of 18 ± 2 μm.
根據圖7之結果，於使用研磨墊之合計變形量最小之例5之研磨墊之研磨中，不論玻璃板用載體之板厚Lc為多少，研磨率均顯示大致固定之值。相對於此，於使用研磨墊之合計變形量為第2小之例6之研磨墊之研磨中，確認到若將玻璃板用載體自0.450mm至0.350mm變薄，則研磨率上升。於0.350mm與0.250mm之玻璃板用載體之情形 時，研磨率之差微小。另一方面，於使用研磨墊之合計變形量最大之例7之研磨墊之研磨中，結果為玻璃板用載體之板厚Lc變得越小，研磨率越顯著地變大。 According to the results of Fig. 7, in the polishing of the polishing pad of Example 5 in which the total amount of deformation of the polishing pad was the smallest, the polishing rate showed a substantially constant value regardless of the thickness Lc of the carrier for the glass plate. On the other hand, in the polishing of the polishing pad of Example 6 in which the total amount of deformation of the polishing pad was the second smallest, it was confirmed that the polishing rate was increased when the glass plate carrier was thinned from 0.450 mm to 0.350 mm. In the case of carriers for glass plates of 0.350 mm and 0.250 mm When the difference in the polishing rate is small. On the other hand, in the polishing of the polishing pad of Example 7 in which the total amount of deformation of the polishing pad was the largest, the smaller the thickness Lc of the carrier for the glass plate was, the more the polishing rate became significantly larger.
據此，可認為若研磨墊之變形量較大，則研磨時之研磨墊間之距離變小，即便使用單純地薄於玻璃板之玻璃板用載體，亦會使玻璃板用載體觸碰研磨墊，壓力不會適當作用於玻璃板，而無法確保所需之研磨率。可認為該情形因以下原因而產生：於板厚Lg厚於0.7mm之玻璃板之研磨中，使用先前之玻璃板用載體不會存在問題，但伴隨著玻璃板之厚度變薄而使研磨墊間之距離變小。 Accordingly, it is considered that when the amount of deformation of the polishing pad is large, the distance between the polishing pads during polishing becomes small, and even if the carrier for the glass plate which is simply thinner than the glass plate is used, the carrier for the glass plate is touched and polished. The pad, the pressure does not properly act on the glass plate, and does not ensure the required polishing rate. It can be considered that this situation occurs for the following reasons: in the polishing of a glass plate having a thickness Lg of 0.7 mm, the use of the carrier for the previous glass plate does not have a problem, but the polishing pad is made thinner with the thickness of the glass plate. The distance between them becomes smaller.
又，根據上述(A)式明確，於例5中，玻璃板用載體10之板厚Lc只要小於0.48mm即可，於例6中，玻璃板用載體10之板厚Lc只要小於0.46mm即可，於例7中，玻璃板用載體10之板厚Lc只要小於0.31mm即可。 Further, according to the above formula (A), in the example 5, the thickness Lc of the glass plate carrier 10 may be less than 0.48 mm, and in the example 6, the sheet thickness Lc of the glass plate carrier 10 is less than 0.46 mm. However, in Example 7, the sheet thickness Lc of the glass plate carrier 10 may be less than 0.31 mm.
再者，本發明並不受上述實施形態任何限制，可於不脫離其主旨之範圍內以各種形態實施。 Further, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention.
例如，上述實施形態係例示覆蓋玻璃之製造方法作為玻璃板之製造方法之一例，但並不限定於此，可適用於各種用途之玻璃。 For example, the above embodiment exemplifies a method for producing a cover glass as an example of a method for producing a glass sheet. However, the present invention is not limited thereto and can be applied to glass for various uses.
又，本申請案係基於2013年11月20日申請之日本專利申請案2013-240417、2014年1月27日申請之日本專利申請案2014-012548，該等申請案之內容作為參照被併入於此。 Further, the present application is based on Japanese Patent Application No. 2013-240417, filed on Nov. 20, 2013, the entire contents of herein.
10‧‧‧玻璃板用載體 10‧‧‧ Carrier for glass plates
16、18‧‧‧研磨墊 16, 18‧‧‧ polishing pad
30‧‧‧玻璃板 30‧‧‧ glass plate
Dp1、Dp2‧‧‧研磨墊之變形量 Deformation of Dp1, Dp2‧‧‧ polishing pad
Lc‧‧‧玻璃板用載體之板厚 Lc‧‧‧Sheet thickness of the carrier for glass plates
Lg‧‧‧玻璃板之板厚 Lg‧‧‧ glass plate thickness
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| JP2013240417A JP2017013138A (en) | 2013-11-20 | 2013-11-20 | Glass sheet manufacturing method |
| JP2014012548A JP2017014023A (en) | 2014-01-27 | 2014-01-27 | Method for producing strengthened glass plate |
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| JPH05177539A (en) * | 1991-12-24 | 1993-07-20 | Sumitomo Electric Ind Ltd | Wafer polishing method with two-side polish device |
| JP2004058201A (en) * | 2002-07-29 | 2004-02-26 | Hoya Corp | Work polishing method and manufacturing method of substrate for electronic device |
| JP2004303280A (en) * | 2003-03-28 | 2004-10-28 | Hoya Corp | Method for manufacturing glass substrate for information recording medium |
| DE102007029907A1 (en) * | 2007-06-28 | 2009-01-02 | Peter Wolters Gmbh | Rotor disk for material-erosive processing of tool in e.g. double-sided processing machine, has insert ring engaged into recess and comprises another recess for receiving tool to be processed |
| JP5334428B2 (en) * | 2008-03-10 | 2013-11-06 | Ｈｏｙａ株式会社 | Manufacturing method of glass substrate for magnetic disk |
| JP5580685B2 (en) * | 2009-08-18 | 2014-08-27 | Ｈｏｙａ株式会社 | Glass manufacturing method, glass melting furnace, glass manufacturing apparatus, glass blank manufacturing method, information recording medium substrate manufacturing method, information recording medium manufacturing method, display substrate manufacturing method and optical component manufacturing method |
| JP5804846B2 (en) * | 2011-08-24 | 2015-11-04 | 日本電気硝子株式会社 | Manufacturing method of cover glass |
| CN104093524A (en) * | 2012-02-06 | 2014-10-08 | 旭硝子株式会社 | Method for producing glass product and method for producing magnetic disk |
| JP5830800B2 (en) * | 2012-03-26 | 2015-12-09 | 富士紡ホールディングス株式会社 | Polishing pad and polishing pad manufacturing method |
| JP2014008555A (en) * | 2012-06-28 | 2014-01-20 | Asahi Glass Co Ltd | Polishing method of glass substrate |
| JP2014188668A (en) * | 2013-03-28 | 2014-10-06 | Hoya Corp | Method of manufacturing glass substrate |
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