TW201448133A - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
- Publication number
- TW201448133A TW201448133A TW103108890A TW103108890A TW201448133A TW 201448133 A TW201448133 A TW 201448133A TW 103108890 A TW103108890 A TW 103108890A TW 103108890 A TW103108890 A TW 103108890A TW 201448133 A TW201448133 A TW 201448133A
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- release film
- resin
- forming die
- mold
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
Abstract
Description
本發明係關於一種樹脂密封裝置及樹脂密封方法，該樹脂密封裝置及樹脂密封方法係對由積體電路(Integrated Circuit：IC)的晶片狀元件、LED(Light Emitting Diode)的晶片狀元件及功率元件之晶片狀元件等構成的晶片狀的電子零件(以下稱作“晶片元件”)進行樹脂密封。 The present invention relates to a resin sealing device and a resin sealing method for a wafer-shaped device and an LED (Light Emitting Diode) wafer-like device and power by an integrated circuit (IC). A wafer-shaped electronic component (hereinafter referred to as a "wafer component") composed of a wafer-shaped device of the device or the like is resin-sealed.
伴隨電子機器的高功能化、高速化及小型化，半導體越來越往高性能化、多功能化及小型化發展。尤其是，在節能化的趨勢下，控制電力的功率元件引人注目。功率元件搭載於使用電力之各種機器中，在家電領域、汽車、發電機器等，尤其是在處理大功率的機器中，其作用越來越重要。 With the increase in the functionality, speed, and miniaturization of electronic devices, semiconductors are becoming more and more high-performance, multi-functional, and miniaturized. In particular, under the trend of energy saving, power components for controlling power are attracting attention. The power element is mounted on various devices that use electric power, and its role in home appliances, automobiles, generators, and the like, especially in machines that process high power, is becoming more and more important.
伴隨功率元件的發展，對半導體封裝件的要求也多樣化，且被要求高度的技術。尤其是，被強烈要求即使在高溫環境下亦能使用的高耐熱性、且低熱電阻的封裝件及其樹脂密封技術。 With the development of power components, the requirements for semiconductor packages are also diverse, and a high degree of technology is required. In particular, a package having high heat resistance and low thermal resistance which can be used even in a high temperature environment and a resin sealing technique thereof are strongly required.
在功率元件的樹脂密封中，廣泛應用量產性及可靠度優異的轉注成形法(transfer molding)之樹脂密封。在處理大功率的半導體製品中，作為熱對策而被要求內裝散熱板的封裝件或無蠟(waxless)之樹脂密封等。為了滿足這些要求，重要的是在對已進行樹脂密封的成形品進行脫模時不會賦予損傷。作為不會對成形品造成損傷的樹脂密封方法，在成形模的兩面使 用離模膜的樹脂密封方法是有效的。 In resin sealing of power elements, resin sealing of transfer molding which is excellent in mass productivity and reliability is widely used. In the processing of high-power semiconductor products, a package in which a heat dissipation plate is housed or a wax-free resin seal or the like is required as a countermeasure against heat. In order to satisfy these requirements, it is important that damage is not imparted when demolding a molded article that has been subjected to resin sealing. As a resin sealing method that does not damage the molded article, it is made on both sides of the forming mold. A resin sealing method using a release film is effective.
例如，在轉注成形法中，在兩面使用離模膜的情形，在上模中，形成腔室(上模腔室)與供由樹脂料錠(tablet)熔融而生成的流動性樹脂流動的樹脂通道(主流道、横澆道、澆注口)的區域、亦即上模的整個區域被離模膜所覆蓋。另一方面，對於下模，除了收容樹脂料錠的料槽(pot)區域之外，形成腔室(下模腔室)的區域被離模膜所覆蓋。 For example, in the transfer molding method, in the case where a release film is used on both sides, in the upper mold, a chamber (upper mold chamber) and a resin for flowing a flowable resin generated by melting a resin tablet are formed. The area of the passage (main flow, runner, sprue), that is, the entire area of the upper mold, is covered by the release film. On the other hand, with respect to the lower mold, in addition to the pot region in which the resin ingot is housed, the region where the chamber (the lower mold chamber) is formed is covered by the release film.
然而，如此般在成形模的兩面使用離模膜的情形，在俯視觀察時覆蓋下模的離模膜的端部與形成於上模的橫澆道(熔流道(runner))重疊的部位中，由柱塞(plunger)按壓且已從料槽壓送的流動性樹脂，有時會進入覆蓋下模的離模膜與下模的模面之間。一旦流動性樹脂進入離模膜與下模的模面之間，則恐有離模膜浮起、堵塞樹脂通道的情況產生。一旦樹脂通道被堵塞，則恐有流動性樹脂無法充分注入到腔室內而引起成形不良的情況產生。 However, in the case where the release film is used on both sides of the molding die, the end portion of the release film covering the lower mold overlaps the runner (runner) formed in the upper mold in plan view. Among them, the fluid resin which is pressed by the plunger and has been fed from the chute sometimes enters between the release film covering the lower mold and the die surface of the lower mold. When the fluid resin enters between the release film and the die face of the lower mold, there is a fear that the release film floats and blocks the resin passage. When the resin passage is clogged, there is a fear that the fluid resin cannot be sufficiently injected into the chamber to cause a molding failure.
此外，進入離模膜與下模的模面之間的流動性樹脂，殘留在下模側的模面而成為毛邊。該毛邊每進行一次樹脂成形時必須進行清潔而去除。因此，若附著在下模側的模面的毛邊量增加，則毛邊的去除需花費時間、生產效率大幅下降。如此般，在成形模的兩面使用離模膜的樹脂密封中，防止流動性樹脂進入覆蓋下模的離模膜與下模的模面之間係非常地重要。 Further, the fluid resin that has entered between the mold film and the mold surface of the lower mold remains on the mold surface on the lower mold side and becomes a burr. The burr must be cleaned and removed every time the resin is formed. Therefore, if the amount of burrs attached to the die surface on the lower mold side is increased, it takes time to remove the burrs and the production efficiency is largely lowered. As described above, in the resin sealing using the release film on both sides of the forming mold, it is extremely important to prevent the fluid resin from entering between the release film covering the lower mold and the mold surface of the lower mold.
作為防止覆蓋下模的離模膜浮起的技術，被提出有如下之使用分離膜(離模膜)的技術：“其特徵在於，由具有能夠承受鑄模模具的加熱溫度的耐熱性、鑄模模具與樹脂的剝離性及可撓性的薄膜材形成，配 合所述鑄模模具的料槽的配置位置而設置有用於往料槽投入樹脂的投入孔，(中略)在所述投入孔的周緣部設置有補強件，該補強件係沿寬度方向跨過連通料槽與腔室的樹脂通道的基部部分”(例如，參照專利文獻1的段落[0006]、圖2)。 As a technique for preventing the release film from covering the lower mold, a technique of using a separation membrane (release film) is proposed as follows: "It is characterized by having heat resistance capable of withstanding the heating temperature of the mold, and a mold for molding. Formed with a resin peeling property and a flexible film material, An input hole for introducing a resin into the trough is provided at a position where the trough of the mold is placed, and a reinforcing member is provided at a peripheral portion of the input hole, and the reinforcing member is connected in the width direction. The base portion of the resin passage of the chute and the chamber" (for example, refer to paragraph [0006] and Fig. 2 of Patent Document 1).
專利文獻1：日本特開平9-193177號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 9-193177
然而，在上述方法中，產生如下的問題。在黏附於下模的離模膜，配合料槽的配置而設置有用於投入樹脂料錠的投入孔。在該投入孔的周緣部黏附有聚醯亞胺薄膜等補強薄膜作為補強材，防止當從料槽壓送樹脂(流動性樹脂)時因樹脂壓導致投入孔的周緣部翻捲。但在現實情況中，僅利用在離模膜的投入孔的周緣部設置補強材，並不能充分地防止翻捲之情況。 However, in the above method, the following problems occur. In the release film adhered to the lower mold, an injection hole for feeding the resin ingot is provided in the arrangement of the mixing tank. A reinforcing film such as a polyimide film is adhered to the peripheral portion of the input hole as a reinforcing material to prevent the peripheral portion of the input hole from being rolled due to the resin pressure when the resin (fluid resin) is pressure-fed from the groove. However, in the actual case, it is not possible to sufficiently prevent the rollover by using the reinforcing member at the peripheral portion of the injection hole of the release film.
近幾年的樹脂密封技術，對於封裝件的薄型化、晶片元件的積層化、低應力化及散熱板之搭載等的要求進一步提高。隨之，改善樹脂對狹路的填充性，尤其是進行高流動化的樹脂密封技術變得越來越重要。因此，即使將聚醯亞胺等補強薄膜黏附於投入孔的周緣部，亦因樹脂壓而使高流動化的流動性樹脂變得容易進入離模膜與下模的模面之間。因此，難以防止已黏附於下模的離模膜之翻捲。一旦離模膜翻捲則樹脂通道將被堵塞，使流動性樹脂無法充分地注入腔室內，從而引起成形不良。這將降低製品的品質或良率。 In recent years, the resin sealing technology has further increased the demand for thinning of packages, lamination of wafer elements, reduction of stress, and mounting of heat sinks. Accordingly, it has become increasingly important to improve the filling property of the resin to the narrow path, especially the resin sealing technique for performing high fluidization. Therefore, even if a reinforcing film such as polyimide is adhered to the peripheral edge portion of the injection hole, the fluid resin having a high fluidity easily enters between the release film and the die surface of the lower mold due to the resin pressure. Therefore, it is difficult to prevent the unwinding of the release film which has adhered to the lower mold. Once the release film is rolled, the resin passage will be clogged, so that the fluid resin cannot be sufficiently injected into the chamber, causing poor molding. This will reduce the quality or yield of the product.
此外，一旦離模膜翻捲則流動性樹脂將進入離模膜與下模的模面之間，而在下模側的模面產生毛邊。毛邊將導致難以進行完全合模。 進一步地，由於每進行一次樹脂成形時必須去除形成在下模側模面的毛邊，因此毛邊的產生使樹脂密封裝置的生產性明顯降低。 Further, once the release film is rolled, the fluid resin will enter between the release film and the die face of the lower mold, and the die face on the lower mold side will be burred. The burrs will make it difficult to fully clamp. Further, since the burrs formed on the side surface of the lower mold side must be removed every time the resin molding is performed, the generation of the burrs causes the productivity of the resin sealing device to be remarkably lowered.
本發明係為了解決上述課題者，其目的在於提供一種樹脂密封裝置及樹脂密封方法，該樹脂密封裝置及樹脂密封方法，係在利用離模膜覆蓋成形模的兩面的樹脂密封裝置中，當進行樹脂密封時，防止覆蓋下模的離模膜因已從料槽壓送的流動性樹脂的影響而從下模的模面浮起。 In order to solve the above problems, an object of the present invention is to provide a resin sealing device and a resin sealing method which are carried out in a resin sealing device which covers both surfaces of a molding die by a release film. When the resin is sealed, the release film covering the lower mold is prevented from floating from the die surface of the lower mold due to the influence of the fluid resin which has been fed from the chute.
為了解決上述問題，本發明的樹脂密封裝置，具備：第一成形模；第二成形模，與所述第一成形模相對向設置；第一腔室，設置於所述第一成形模，並能夠收納安裝在基板的晶片元件；料槽，收容樹脂材料；柱塞，進退自如地設置在所述料槽中，並壓送所述樹脂材料熔融而生成的流動性樹脂；槽部，設置於所述第二成形模，並能夠作為使所述流動性樹脂材料朝向所述第一腔室流動的樹脂通道而發揮功能；驅動機構，對至少具有所述第一成形模與所述第二成形模的成形模組進行合模及開模；以及第一薄膜供給機構，供給覆蓋所述第一成形模的模面的第一離模膜；所述樹脂密封裝置，係使已注入於所述第一腔室的所述流動性樹脂固化以形成固化樹脂，藉由固化樹脂對安裝在所述基板的所述晶片元件進行樹脂密封， 其特徵在於：具備薄膜按壓構件，該薄膜按壓構件藉由在俯視觀察時所述槽部與所述第一離模膜重疊的範圍中，將所述第一離模膜中的包含橫切所述槽部的部分之一部分按壓於所述第一成形模的模面，而使所述第一離模膜的所述一部分與所述第一成形模的模面緊貼；在所述成形模組已合模的狀態下，所述槽部作為所述樹脂通道而發揮功能，且所述樹脂通道與所述第一腔室連通；所述第一離模膜以包含所述重疊的範圍中的所述第一成形模的模面與所述第一腔室所具有的模面之方式配置；藉由所述第一離模膜與所述第一成形模的模面緊貼，抑制所述流動性樹脂從所述第一離模膜的端部進入所述第一離模膜與所述第一成形模的模面之間。 In order to solve the above problems, the resin sealing device of the present invention includes: a first forming die; a second forming die disposed opposite to the first forming die; and a first chamber disposed in the first forming die, and The wafer element mounted on the substrate can be housed; the trough can accommodate the resin material; the plunger can be placed in the trough freely and retractably, and the fluid resin generated by melting the resin material can be pressure-fed; the groove portion is provided in The second forming die and functioning as a resin passage for flowing the fluid resin material toward the first chamber; the driving mechanism having at least the first forming die and the second forming a molding module of the mold performs mold clamping and mold opening; and a first film supply mechanism that supplies a first release film covering the mold surface of the first molding die; the resin sealing device is injected into the mold The fluid resin of the first chamber is cured to form a cured resin, and the wafer element mounted on the substrate is resin-sealed by a curing resin, The method includes a film pressing member that includes a cross-cutting portion in the first release film by a range in which the groove portion overlaps the first release film in a plan view One of the portions of the groove portion is pressed against the die face of the first forming die such that the portion of the first release film is in close contact with the die face of the first forming die; In the assembled state, the groove portion functions as the resin passage, and the resin passage communicates with the first chamber; the first release film is in a range including the overlap Arranging the die face of the first forming die and the die face of the first cavity; and suppressing the first release film and the die face of the first forming die The fluid resin enters between the first release film and the die face of the first molding die from the end of the first release film.
此外，本發明的樹脂密封裝置，進一步具備：第二腔室，係在所述第二成形模中與所述槽部連通地設置；及第二薄膜供給機構，係供給第二離模膜，所述第二離模膜係為了以包含所述第二成形模中的所述槽部的模面及與所述槽部連通的第二腔室的模面之方式進行覆蓋而配置。 Further, the resin sealing device of the present invention further includes: a second chamber that is provided in communication with the groove portion in the second molding die; and a second film supply mechanism that supplies the second release film, The second release film is disposed to cover a mold surface including the groove portion of the second molding die and a second cavity that communicates with the groove portion.
此外，本發明的樹脂密封裝置，具備：凹部，設置於所述第一成形模；料槽塊，形成有料槽且被設置成在所述凹部中可相對於所述第二成形模進退；以及伸出部，設置成所述料槽塊中的從所述第一成形模的模面突出的部分； 所述伸出部作為所述薄膜按壓構件而發揮功能；藉由所述伸出部中的與所述第一成形模的模面相對向的面，所述第一離模膜的一部分被按壓於所述第一成形模的模面。 Further, the resin sealing device of the present invention includes: a concave portion provided in the first forming die; a chute block formed with a chute and disposed to advance and retreat relative to the second forming die in the concave portion; a protruding portion disposed as a portion of the chute block protruding from a die surface of the first forming die; The projecting portion functions as the film pressing member; a portion of the first release film is pressed by a surface of the protruding portion that faces the die face of the first forming die On the die face of the first forming die.
此外，本發明的樹脂密封裝置，進一步具備：第三成形模，設置於所述第一成形模與所述第二成形模之間，並被包含在所述成形模組中；及貫通空間，設置於所述第三成形模，且在成形模組已合模的狀態下與所述樹脂通道連通並作為第二腔室而發揮功能；所述第三成形模作為所述薄膜按壓構件而發揮功能；藉由在所述第三成形模中的與所述第一成形模相對向的模面中、包圍所述貫通空間的模面，所述第一離模膜的所述一部分被按壓於所述第一成形模的模面。 Further, the resin sealing device of the present invention further includes: a third molding die provided between the first molding die and the second molding die, and included in the molding die; and a through space, Provided in the third molding die, and in a state in which the molding module has been clamped, communicates with the resin passage and functions as a second chamber; the third molding die functions as the film pressing member a function of the portion of the first release film being pressed by a die face surrounding the through space in a die face of the third forming die opposite to the first forming die The die face of the first forming die.
此外，本發明的樹脂密封裝置，在上述的樹脂密封裝置中，所述薄膜按壓構件直接按壓所述第一離模膜的所述一部分。 Further, in the resin sealing device of the present invention, in the above resin sealing device, the film pressing member directly presses the portion of the first release film.
此外，本發明的樹脂密封裝置，在上述的樹脂密封裝置中，所述薄膜按壓構件透過所述基板按壓所述第一離模膜的所述一部分。 Further, in the resin sealing device of the present invention, in the resin sealing device described above, the film pressing member presses the portion of the first release film through the substrate.
為了解決上述問題，本發明的樹脂密封方法，包含：在具有第一腔室的第一成形模和與所述第一成形模相對向設置的第二成形模之間，配置安裝有晶片元件的基板的步驟；對用於容納晶片元件密封用的樹脂材料的料槽供給所述樹脂材料的步驟；對至少具有所述第一成形模與所述第二成形模的成形模組進行合模的 步驟；使所述料槽內的樹脂材料熔融以生成流動性樹脂的步驟；經由設置於所述第二成形模且能夠作為樹脂通道而發揮功能的槽部，從所述料槽往所述第一腔室壓送所述流動性樹脂以進行注入的步驟；以及使注入到所述第一腔室的所述流動性樹脂固化以形成固化樹脂，藉此藉由所述固化樹脂對所述晶片元件進行樹脂密封的步驟；所述樹脂密封方法的特徵在於，進一步包含：對所述第一成形模供給覆蓋該第一成形模的模面的第一離模膜的步驟；及藉由在俯視觀察時所述槽部與所述第一離模膜重疊的範圍中，將所述第一離模膜中的包含橫切所述槽部的部分之一部分按壓於所述第一成形模的模面，而使所述第一第一離模膜的所述一部分與所述第一成形模的模面緊貼的步驟；在供給所述第一離模膜的步驟中，以包含所述重疊的範圍中的所述第一成形模的模面與所述第一腔室所具有的模面之方式配置所述第一離模膜；在所述緊貼的步驟中，抑制所述流動性樹脂從所述第一離模膜的端部進入所述第一離模膜與所述第一成形模的模面之間。 In order to solve the above problems, the resin sealing method of the present invention includes: arranging a wafer component mounted between a first molding die having a first chamber and a second molding die disposed opposite to the first molding die a step of supplying a resin material to a trough for accommodating a resin material for sealing a wafer element; and clamping a molding module having at least the first molding die and the second molding die a step of melting the resin material in the trough to form a fluid resin, and a groove portion that functions as a resin passage provided through the second molding die, from the chute to the first a chamber for pressurizing the fluid resin for injection; and curing the fluid resin injected into the first chamber to form a cured resin, whereby the wafer is cured by the cured resin a step of resin sealing the component; the resin sealing method, further comprising: a step of supplying the first molding die with a first release film covering the die face of the first molding die; and In a range in which the groove portion overlaps with the first release film when viewed, a portion of the first release film including a portion including the groove portion is pressed against the mold of the first molding die a step of bringing the portion of the first first release film into close contact with the die face of the first forming die; in the step of supplying the first release film, to include the overlap The mold of the first forming die in the range Disposing the first release film in a manner similar to a die face of the first chamber; in the step of adhering, inhibiting the flow resin from entering from an end of the first release film The first release film is between the die face of the first forming die.
此外，本發明的樹脂密封方法，進一步包含：供給第二離模膜的步驟，所述第二離模膜係以包含所述第二成形模中的所述槽部的模面及與所述槽部連通的第二腔室的模面之方式進行覆蓋。 Further, the resin sealing method of the present invention further includes a step of supplying a second release film, the second release film comprising a die face including the groove portion in the second molding die, and the The mold surface of the second chamber in which the groove portion communicates is covered.
此外，本發明的樹脂密封方法，在上述的樹脂密封方法中， 進一步包含：藉由使進一步在設置於所述第一成形模的凹部以可相對於所述第二成形模進退之方式設置形成有所述料槽的料槽塊，朝向所述第二成形模前進，而將設置成所述料槽塊中的從所述第一成形模的模面突出的部分並作為薄膜按壓構件而發揮功能的伸出部，從所述第一成形模的模面分開的步驟；在供給所述第一離模膜的步驟中，在已將所述伸出部從所述第一成形模的模面分開的狀態下利用所述第一離模膜覆蓋所述第一成形模的模面；在所述緊貼的步驟中，使所述料槽塊後退，藉此藉由所述伸出部將所述第一離模膜的所述一部分按壓於所述第一成形模的模面，而使所述第一離模膜的所述一部分與所述第一成形模的模面緊貼。 Further, in the resin sealing method of the present invention, in the above resin sealing method, Further comprising: locating the trough block formed with the trough in a manner of being further movable in the concave portion of the first forming mold with respect to the second forming mold, toward the second forming mold Advancing, and projecting a portion of the chute block protruding from the die face of the first forming die and functioning as a film pressing member, separated from the die face of the first forming die a step of supplying the first release film, covering the first portion with the first release film in a state where the protrusion is separated from a die face of the first molding die a molding surface of a forming die; wherein in the adhering step, the chute block is retracted, whereby the portion of the first release film is pressed against the first portion by the protruding portion Forming a die face of the mold such that the portion of the first release film is in close contact with the die face of the first forming die.
此外，本發明的樹脂密封方法，在上述的樹脂密封方法中，進一步包含：在所述第一成形模與所述第二成形模之間，進一步設置作為薄膜按壓構件而發揮功能的第三成形模，且藉由使該第三成形模朝向所述第二成形模前進，而將所述第三成形模從所述第一成形模的模面分開的步驟；及在已合模包含所述第三成形模的所述成形模組的狀態下，從所述料槽經由槽部，往包含形成於所述第三成形模的貫通空間的至少一部分的第二腔室壓送所述流動性樹脂以進行注入的步驟；在供給所述第一離模膜的步驟中，在將所述第三成形模從所述第一成形模的模面分開的狀態下，利用所述第一離模膜覆蓋所述第一成形模的模面； 在所述緊貼的步驟中，藉由使所述第三成形模後退，從而所述第三成形模將所述第一離模膜的一部分按壓於所述第一成形模的模面。 Further, in the resin sealing method of the present invention, the resin sealing method according to the present invention, further comprising: further providing a third molding functioning as a film pressing member between the first molding die and the second molding die And a step of separating the third forming die from the die face of the first forming die by advancing the third forming die toward the second forming die; and comprising the In the state of the forming module of the third forming die, the fluidity is pressure-fed from the chute to the second chamber including at least a portion of the through space formed in the third forming die via the groove portion. a step of injecting a resin; in the step of supplying the first release film, using the first die in a state where the third forming die is separated from a die face of the first forming die a film covering the die face of the first forming die; In the adhering step, the third forming die presses a portion of the first release film against the die face of the first forming die by retreating the third forming die.
此外，本發明的樹脂密封方法，在上述的樹脂密封方法中，在所述緊貼的步驟中，藉由所述薄膜按壓構件直接按壓所述第一離模膜的一部分。 Further, in the resin sealing method of the present invention, in the resin sealing method described above, in the step of adhering, a part of the first release film is directly pressed by the film pressing member.
此外，本發明的樹脂密封方法，在上述的樹脂密封方法中，在所述緊貼的步驟中，藉由所述薄膜按壓構件並透過所述基板而按壓所述第一離模膜的一部分。 Further, in the resin sealing method of the present invention, in the resin sealing method described above, in the step of adhering, a part of the first release film is pressed by the film pressing member and transmitted through the substrate.
根據本發明，在使用離模膜進行樹脂密封的樹脂密封裝置中，在俯視觀察時槽部與第一離模膜重疊的範圍中藉由薄膜按壓構件使第一離模膜的一部分與第一成形模的模面緊貼。因此，當進行樹脂密封時，防止覆蓋第一成形模的第一離模膜從第一成形模的模面浮起。由此，防止從料槽壓送出的流動性樹脂進入第一離模膜與第一成形模的模面之間。 According to the present invention, in the resin sealing device which performs the resin sealing using the release film, a part of the first release film is made first by the film pressing member in a range in which the groove portion overlaps the first release film in plan view. The die face of the forming die is in close contact. Therefore, when the resin sealing is performed, the first release film covering the first forming die is prevented from floating from the die face of the first forming die. Thereby, the fluid resin which is fed from the chute is prevented from entering between the first release film and the die face of the first molding die.
1‧‧‧樹脂密封裝置 1‧‧‧Resin sealing device
2‧‧‧底座 2‧‧‧Base
3‧‧‧連桿 3‧‧‧ Connecting rod
4‧‧‧固定盤 4‧‧‧ Fixed disk
5‧‧‧上模板 5‧‧‧Upper template
6‧‧‧上模(第二成形模) 6‧‧‧Upper mold (second forming mold)
7‧‧‧可動盤 7‧‧‧ movable plate
8‧‧‧下模板 8‧‧‧Next template
9‧‧‧下模(第一成形模) 9‧‧‧Down mold (first forming die)
10‧‧‧合模機構(驅動機構) 10‧‧‧Clamping mechanism (drive mechanism)
11‧‧‧上模腔室(第二腔室) 11‧‧‧Upper mold chamber (second chamber)
12‧‧‧下模腔室(第一腔室) 12‧‧‧ Lower mold chamber (first chamber)
13‧‧‧晶片元件 13‧‧‧ wafer components
14‧‧‧基板 14‧‧‧Substrate
15‧‧‧離模膜(第二離模膜) 15‧‧‧ release film (second release film)
16‧‧‧薄膜供給輥(第二薄膜供給機構) 16‧‧‧ film supply roller (second film supply mechanism)
17‧‧‧輥子 17‧‧‧ Roller
18‧‧‧薄膜捲取輥 18‧‧‧ film take-up rolls
19、19a、19b‧‧‧離模膜(第一離模膜) 19, 19a, 19b‧‧‧ release film (first release film)
20‧‧‧薄膜供給輥(第一薄膜供給機構) 20‧‧‧ film supply roller (first film supply mechanism)
21‧‧‧輥子 21‧‧‧ Roller
22‧‧‧薄膜捲取輥 22‧‧‧ Film take-up rolls
23‧‧‧吸附口 23‧‧‧Adsorption port
24‧‧‧吸附口 24‧‧‧ adsorption port
25‧‧‧料槽 25‧‧‧ trough
26‧‧‧基板設置部 26‧‧‧Substrate setting department
27‧‧‧主流道(槽部、樹脂通道) 27‧‧‧main road (slot, resin channel)
28‧‧‧橫澆道(槽部、樹脂通道) 28‧‧‧ runners (grooves, resin channels)
29‧‧‧凹部 29‧‧‧ recess
30‧‧‧料槽塊(薄膜按壓構件) 30‧‧‧Gutter block (film pressing member)
31‧‧‧彈簧 31‧‧‧ Spring
32、32a、32b‧‧‧伸出部 32, 32a, 32b‧‧‧ Extension
33‧‧‧樹脂料錠(樹脂材料) 33‧‧‧Resin ingot (resin material)
34‧‧‧流動性樹脂 34‧‧‧Liquid resin
35‧‧‧柱塞 35‧‧‧Plunger
36‧‧‧中間模(第三成形模、薄膜按壓構件) 36‧‧‧Intermediate mode (third forming die, film pressing member)
37‧‧‧驅動機構 37‧‧‧ drive mechanism
38‧‧‧下模腔室(第一腔室) 38‧‧‧Down mold chamber (first chamber)
39‧‧‧基板設置部 39‧‧‧Substrate setting department
40‧‧‧樹脂料錠(樹脂材料) 40‧‧‧Resin ingot (resin material)
41‧‧‧料槽 41‧‧‧ trough
42‧‧‧流動性樹脂 42‧‧‧Liquid resin
43‧‧‧柱塞 43‧‧‧Plunger
44‧‧‧槽部(樹脂通道) 44‧‧‧Slot (resin passage)
45‧‧‧貫通空間(第二腔室) 45‧‧‧through space (second chamber)
46‧‧‧貫通口 46‧‧‧through
圖1係表示在本發明的樹脂密封裝置的實施例1中裝置的概要的前視圖。 Fig. 1 is a front view showing the outline of the apparatus in the first embodiment of the resin sealing device of the present invention.
圖2係表示在本發明的樹脂密封裝置的實施例1中成形模與離模膜供給機構的構成的示意性剖面圖。 Fig. 2 is a schematic cross-sectional view showing the configuration of a molding die and a release film supply mechanism in the first embodiment of the resin sealing device of the present invention.
圖3係在圖2所示的樹脂密封裝置中省略料槽塊的圖示的圖，圖3(a)係表示從A-A線觀察覆蓋下模的離模膜的狀態的俯視圖，圖3(b)係表示從A-A線觀察覆蓋上模的離模膜的狀態的仰視圖。 3 is a view in which the groove block is omitted in the resin sealing device shown in FIG. 2, and FIG. 3(a) is a plan view showing a state in which the release film covering the lower mold is observed from the AA line, and FIG. 3(b) The system is a bottom view showing a state in which the release film covering the upper mold is observed from the AA line.
圖4係表示在本發明的樹脂密封裝置的實施例1中兩種狀態的部分剖面圖，其中，圖4(a)係表示已開模的狀態的部分剖面圖，圖4(b)係表示已合模的狀態的部分剖面圖。 Figure 4 is a partial cross-sectional view showing two states in the first embodiment of the resin sealing device of the present invention, wherein Figure 4(a) is a partial cross-sectional view showing a state in which the mold has been opened, and Figure 4(b) is a view showing A partial section view of the clamped state.
圖5係表示圖4所示的實施例1的料槽塊的伸出部的形狀的俯視圖，圖5(a)表示將料槽塊一體化的形狀，圖5(b)表示將料槽塊分割的形狀。 Fig. 5 is a plan view showing the shape of a projecting portion of the chute block of the first embodiment shown in Fig. 4, wherein Fig. 5(a) shows the shape in which the chute block is integrated, and Fig. 5(b) shows the chute block. The shape of the split.
圖6係表示在本發明的樹脂密封裝置的實施例2中裝置的概要的前視圖。 Fig. 6 is a front view showing an outline of the apparatus in the second embodiment of the resin sealing device of the present invention.
圖7係表示在本發明的樹脂密封裝置的實施例2中兩種狀態的部分剖面圖，其中，圖7(a)係表示已開模的狀態的部分剖面圖，圖7(b)係表示已合模的狀態的部分剖面圖。 Figure 7 is a partial cross-sectional view showing two states in the second embodiment of the resin sealing device of the present invention, wherein Figure 7(a) shows a partial cross-sectional view of the mold-opening state, and Figure 7(b) shows A partial section view of the clamped state.
在本發明的樹脂密封裝置中，在設置有料槽的下模設置凹部，且在凹部彈性支撐並設置能夠升降的料槽塊。除配置有凹部的區域之外，利用離模膜覆蓋下模的模面。藉由利用橫澆道周邊部中的上模的下面按壓料槽塊並使其下降(後退)，從而藉由料槽塊的伸出部的下面與下模的模面夾緊離模膜的端部並進行固定。 In the resin sealing device of the present invention, the concave portion is provided in the lower mold provided with the chute, and the trough portion capable of lifting and lowering is elastically supported and provided in the concave portion. The mold face of the lower mold is covered with a release film in addition to the area in which the concave portion is disposed. By pressing the chute block and lowering (retracting) by using the lower surface of the upper mold in the peripheral portion of the runner, the mold film is clamped by the lower surface of the projecting portion of the chute block and the die surface of the lower mold. The ends are fixed.
進一步，在本發明的樹脂密封裝置中，在上模與下模之間設置有中間模。除設置於下模的料槽區域之外，利用離模膜覆蓋下模的模面。在已合模上模、下模和中間模的狀態下，藉由被設置於中間模的貫通空間的周邊部的下面與下模的模面夾緊離模膜的端部並進行固定。 Further, in the resin sealing device of the present invention, an intermediate mold is provided between the upper mold and the lower mold. The mold face of the lower mold is covered with a release film in addition to the groove region provided in the lower mold. In the state in which the upper mold, the lower mold, and the intermediate mold have been clamped, the end portion of the release film is clamped and fixed by the lower surface of the peripheral portion of the through space provided in the intermediate mold and the mold surface of the lower mold.
以下，參照圖1至圖5，針對本發明的樹脂密封裝置的實施 例1進行說明。本申請書件中的任一張圖，係為了易於理解而進行適當的省略或者誇張且示意性地描繪。針對相同的構成要素，使用相同的符號標記，並適當地省略說明。 Hereinafter, the implementation of the resin sealing device of the present invention will be described with reference to FIGS. 1 to 5 . Example 1 is explained. Any one of the drawings of the present application is appropriately omitted or exaggerated and schematically depicted for ease of understanding. The same components are denoted by the same reference numerals, and the description is omitted as appropriate.
圖1係表示在本發明的樹脂密封裝置的實施例1中裝置的概要的前視圖。於樹脂密封裝置1，設置有底座2、設置於底座2上的四個角部的連桿(tie-bar)3、及固定在連桿3的上端部的固定盤4。在固定盤4的下面，設置有上模板5，且在上模板5內設置有樹脂成形用的上模6。在固定盤4的下方，與固定盤4相對向地設置有可動盤7。可動盤7，以相對於固定盤4能夠升降之方式安裝於連桿3。在可動盤7的上面，與上模板5相對向地設置有下模板8，且在下模板8內設置有樹脂成形用的下模9。上模6與下模9相對向地設置，並且該等上模6、下模9一起構成成形模。在上模板5及下模板8，內裝有用於加熱上模6及下模9的加熱器(未圖示)。上模板5與上模6及下模板8與下模9被加熱至175℃左右。上模6及下模9，構成為能夠根據進行樹脂密封的對象而在上模板5及下模板8內簡單地更換。合模機構10，係為了進行合模與開模而使可動盤7升降的機構。合模機構10，例如，藉由使用由肘節(toggle)機構或液壓缸所構成的合模機構10而使可動盤7升降，從而利用上模6與下模9進行合模與開模。 Fig. 1 is a front view showing the outline of the apparatus in the first embodiment of the resin sealing device of the present invention. The resin sealing device 1 is provided with a base 2, a tie-bar 3 provided at four corners of the base 2, and a fixed disk 4 fixed to the upper end portion of the link 3. An upper die plate 5 is provided on the lower surface of the fixed disk 4, and an upper die 6 for resin molding is provided in the upper die plate 5. Below the fixed disk 4, a movable disk 7 is provided opposite to the fixed disk 4. The movable platen 7 is attached to the link 3 so as to be movable up and down with respect to the fixed disk 4. A lower die plate 8 is provided on the upper surface of the movable platen 7 so as to face the upper die plate 5, and a lower die 9 for resin molding is provided in the lower die plate 8. The upper die 6 and the lower die 9 are disposed opposite to each other, and the upper die 6 and the lower die 9 together constitute a forming die. Heaters (not shown) for heating the upper mold 6 and the lower mold 9 are incorporated in the upper die plate 5 and the lower die plate 8. The upper die plate 5 and the upper die 6 and the lower die plate 8 and the lower die 9 are heated to about 175 °C. The upper mold 6 and the lower mold 9 are configured to be easily replaced in the upper mold 5 and the lower mold 8 in accordance with the object of resin sealing. The mold clamping mechanism 10 is a mechanism for moving the movable tray 7 up and down in order to perform mold clamping and mold opening. The mold clamping mechanism 10 performs the mold clamping and the mold opening by the upper mold 6 and the lower mold 9 by raising and lowering the movable tray 7 by using the mold clamping mechanism 10 composed of a toggle mechanism or a hydraulic cylinder.
另外，在實際的樹脂密封裝置中，上模6及下模9，由被稱作模套座(chase holder)的外側部分、被稱作模套(chase)的內側部分、及被稱作陰模(cavity block)的設置有腔室的部分構成的情形較多。在圖1中，省略對這些構成要素的圖示。 Further, in the actual resin sealing device, the upper mold 6 and the lower mold 9 are called an outer portion called a chase holder, an inner portion called a chase, and are called a yin. There are many cases in which the cavity block is arranged in a part of the chamber. In FIG. 1, illustration of these components is omitted.
圖2係表示在本發明的樹脂密封裝置中成形模與離模膜供 給機構的構成的示意性剖面圖。在樹脂密封裝置1中，在上模6設置有樹脂成形用的上模腔室11，在下模9以與上模腔室11相對向地設置有樹脂成形用的下模腔室12。安裝有晶片元件13的基板14藉由運送機構(未圖示)而被運送至上模腔室11與下模腔室12之間，並被設定在既定位置。 Figure 2 is a view showing a molding die and a release film in the resin sealing device of the present invention. A schematic cross-sectional view of the configuration of the mechanism. In the resin sealing device 1, the upper mold 6 is provided with an upper mold chamber 11 for resin molding, and the lower mold 9 is provided with a lower mold chamber 12 for resin molding so as to face the upper mold chamber 11. The substrate 14 on which the wafer element 13 is mounted is transported between the upper mold chamber 11 and the lower mold chamber 12 by a transport mechanism (not shown), and is set at a predetermined position.
上模6的模面(在圖中為下面)被離模膜15覆蓋。離模膜15，由薄膜供給輥16供給，且藉由多個輥17而調整方向和高度，並被設定在上模6的既定位置，在樹脂成形後藉由薄膜捲取輥18回收。同樣地，下模9的模面(在圖中為上面)被離模膜19覆蓋。離模膜19，由薄膜供給輥20供給，且藉由多個輥21而調整方向和高度，並被設定在下模9的既定位置，在樹脂成形後藉由薄膜捲取輥22回收。 The die face (lower in the figure) of the upper die 6 is covered by the release film 15. The release film 15 is supplied from the film supply roller 16, and is adjusted in direction and height by a plurality of rollers 17, and is set at a predetermined position of the upper mold 6, and is recovered by the film take-up roller 18 after resin molding. Similarly, the die face (upper in the figure) of the lower die 9 is covered by the release film 19. The release film 19 is supplied from the film supply roller 20, and is adjusted in direction and height by a plurality of rollers 21, and is set at a predetermined position of the lower mold 9, and is recovered by the film take-up roll 22 after resin molding.
在上模腔室11，設置有用於吸附離模膜15的吸附口23，且在下模腔室12，設置有用於吸附離模膜19的吸附口24。吸附口23及吸附口24，與上模腔室11及下模腔室12的大小或形狀相應地設置在腔室11的中央或端部等多個部位。在圖2中，只圖示了形成於腔室11的中央部的吸附口23，其他吸附口則省略圖示。 In the upper mold chamber 11, a suction port 23 for adsorbing the release film 15 is provided, and in the lower mold chamber 12, a suction port 24 for adsorbing the release film 19 is provided. The adsorption port 23 and the adsorption port 24 are provided at a plurality of locations such as the center or the end of the chamber 11 in accordance with the size or shape of the upper mold chamber 11 and the lower mold chamber 12. In FIG. 2, only the adsorption port 23 formed in the center part of the chamber 11 is shown, and the other adsorption port is abbreviate|omitted.
作為離模膜15、19，可使用具有能夠承受樹脂成形的加熱溫度的耐熱性、容易從成形模的模面剝離的脫模性、柔軟性和伸展性等的薄膜材。例如，可使用聚四氟乙烯(PTFE)、乙烯-四氟乙烯共聚物(ETFE)、聚對苯二甲酸乙二醇酯(PET)、聚全氟乙丙烯(FEP)、氟浸漬玻璃布、聚丙烯、聚苯乙烯或聚氯乙烯等。 As the release films 15 and 19, a film material having heat resistance capable of withstanding the heating temperature of resin molding, mold release property which is easily peeled off from the die surface of the mold, flexibility, and stretchability can be used. For example, polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE), polyethylene terephthalate (PET), polyperfluoroethylene propylene (FEP), fluorine-impregnated glass cloth, Polypropylene, polystyrene or polyvinyl chloride.
在圖2所示的樹脂密封裝置1中，省略料槽塊的圖示，圖3(a)係表示從A-A線觀察覆蓋下模9的離模膜19的狀態的俯視圖，圖3 (b)係表示從A-A線觀察覆蓋上模6的離模膜15的狀態的仰視圖。在圖3(a)中，於下模9設置有可收容樹脂料錠(參照圖4(a)的樹脂料錠33)的料槽25、及用於配置已安裝有晶片元件13的基板14(參照圖2)的基板設置部26。覆蓋下模9的模面的離模膜19，被分割成離模膜19a與離模膜19b，使得除配置有料槽25的區域之外，分別覆蓋設置於料槽25的兩側的下模腔室12與基板設置部26。 In the resin sealing device 1 shown in FIG. 2, the illustration of the chute block is omitted, and FIG. 3(a) is a plan view showing a state in which the release film 19 covering the lower mold 9 is viewed from the A-A line, and FIG. (b) is a bottom view showing a state in which the release film 15 covering the upper mold 6 is observed from the A-A line. In FIG. 3(a), the lower mold 9 is provided with a chute 25 capable of accommodating a resin ingot (see the resin ingot 33 of FIG. 4(a)), and a substrate 14 for arranging the wafer element 13 mounted thereon. (see FIG. 2) the substrate setting portion 26. The release film 19 covering the die face of the lower mold 9 is divided into the release film 19a and the release film 19b so as to cover the lower molds provided on both sides of the chute 25 except for the region where the chute 25 is disposed. The chamber 12 and the substrate setting portion 26.
如圖3(b)與圖4所示，在上模6，作為用於往上模腔室11注入加熱被收容在下模9的料槽25中的樹脂料錠33而熔融的流動性樹脂34的樹脂通道，設置有主流道27與橫澆道28。覆蓋上模6的模面的離模膜15，係由一張薄膜形成，以完全覆蓋主流道27、橫澆道28與上模腔室11。 As shown in Fig. 3 (b) and Fig. 4, the upper mold 6 is used as a fluid resin 34 for melting the resin ingot 33 accommodated in the chute 25 of the lower mold 9 to the upper mold chamber 11. The resin passage is provided with a main flow path 27 and a runner 28. The release film 15 covering the die face of the upper mold 6 is formed of a single film to completely cover the main flow path 27, the runner 28, and the upper mold chamber 11.
藉由使用設置於下模腔室12的吸附口24(參照圖2)吸引離模膜19a、19b，從而使離模膜19a、19b沿下模腔室12的內面緊貼。同樣地，藉由使用設置於上模腔室11的吸附口23(參照圖2)吸引離模膜15，從而使離模膜15沿設置於上模6的上模腔室11的內面緊貼。 The release films 19a and 19b are attracted to the inner faces of the lower mold chambers 12 by suctioning the release films 19a and 19b using the suction ports 24 (see FIG. 2) provided in the lower mold chamber 12. Similarly, the release film 15 is attracted by the suction port 23 (refer to FIG. 2) provided in the upper mold chamber 11, so that the release film 15 is tight along the inner surface of the upper mold cavity 11 provided in the upper mold 6. paste.
在本發明的樹脂密封裝置1的實施例1中，圖4(a)係表示已開模的狀態的部分剖面圖，圖4(b)係表示已合模的狀態的部分剖面圖。以與上模6的主流道27相對向之方式在下模9內設置有凹部29。在凹部29內設置有能夠升降的料槽塊30。料槽塊30，以在凹部29中能夠升降之方式相對於下模9透過彈簧31而被彈性支撐。形成於料槽塊30的前端的伸出部32，大於凹部29的直徑，並且形成為在俯視觀察時與在覆蓋下模9的離模膜19a、19b中靠近料槽25側的端部重疊的大小。在料槽塊30的內 部，設置有收容樹脂料錠33的料槽25。在料槽25內，樹脂料錠33被加熱並熔融而生成流動性樹脂34。在基板14，形成有流動性樹脂34所通過的孔(未圖示)。流動性樹脂34，由柱塞35壓送，並依序經由主流道27和橫澆道28而注入上模腔室11、下模腔室12。另外，主流道27及橫澆道28，在上模6的模面(下面)與下模9的模面(上面)已合模的狀態下，形成為與收容料槽塊30的伸出部32的空間相連。 In the first embodiment of the resin sealing device 1 of the present invention, Fig. 4(a) is a partial cross-sectional view showing a state in which the mold has been opened, and Fig. 4(b) is a partial cross-sectional view showing a state in which the mold is closed. A recess 29 is provided in the lower mold 9 so as to face the main passage 27 of the upper mold 6. A groove block 30 that can be raised and lowered is provided in the recess 29 . The chute block 30 is elastically supported by the spring 31 with respect to the lower mold 9 so as to be movable up and down in the recessed portion 29. The projecting portion 32 formed at the front end of the chute block 30 is larger than the diameter of the recessed portion 29, and is formed to overlap the end portion of the release film 19a, 19b covering the lower mold 9 on the side closer to the chute 25 in plan view. the size of. Within the chute block 30 A chute 25 for accommodating the resin ingot 33 is provided. In the trough 25, the resin ingot 33 is heated and melted to form a fluid resin 34. A hole (not shown) through which the fluid resin 34 passes is formed on the substrate 14. The fluid resin 34 is pressure-fed by the plunger 35 and sequentially injected into the upper mold chamber 11 and the lower mold chamber 12 via the main flow path 27 and the runner 28. Further, the main flow path 27 and the runner 28 are formed to protrude from the receiving chute block 30 in a state where the mold surface (lower surface) of the upper mold 6 and the mold surface (upper surface) of the lower mold 9 have been closed. The space of 32 is connected.
以下，針對本發明的實施例1的樹脂密封裝置1的動作進行說明。如圖4(a)所示，在設置於下模9的凹部29中，料槽塊30由彈簧31所支撐，以使伸出部32的下面處於與下模9的模面隔開既定距離的初始位置。首先，將離模膜15配置在上模6的既定位置。接著，在料槽塊30的伸出部32的下面與下模9的模面之間，將離模膜19a、19b配置在下模9的既定位置。接著，將已安裝有晶片元件13的基板14(兩片)配置在上模腔室11與下模腔室12之間的既定位置。兩片基板分別位於離模膜15與離模膜19a之間以及離模膜15與離模膜19b之間。將樹脂料錠33往設置於料槽塊30的料槽25內供給。 Hereinafter, the operation of the resin sealing device 1 of the first embodiment of the present invention will be described. As shown in Fig. 4(a), in the recess 29 provided in the lower die 9, the chute block 30 is supported by the spring 31 such that the lower surface of the projecting portion 32 is spaced apart from the die face of the lower die 9 by a predetermined distance. The initial position. First, the release film 15 is placed at a predetermined position of the upper mold 6. Next, between the lower surface of the projecting portion 32 of the chute block 30 and the die surface of the lower mold 9, the release films 19a and 19b are placed at predetermined positions of the lower mold 9. Next, the substrate 14 (two sheets) on which the wafer elements 13 have been mounted is placed at a predetermined position between the upper mold chamber 11 and the lower mold chamber 12. The two substrates are respectively located between the release film 15 and the release film 19a and between the release film 15 and the release film 19b. The resin ingot 33 is supplied into the chute 25 provided in the chute block 30.
接著，以沿主流道27、橫澆道28和上模腔室11的內面及上模6的模面之方式吸附離模膜15(吸附口未圖示)。同樣地，以分別沿各下模腔室12與各基板設置部26之內面及下模9的模面之方式吸附離模膜19a、19b(吸附口未圖示)。接著，將已安裝有晶片元件13的基板14設定在被設置於下模9的基板設置部26。 Next, the release film 15 is adsorbed along the inner surface of the main flow path 27, the runner 28, and the upper mold cavity 11 and the mold surface of the upper mold 6, (the adsorption port is not shown). Similarly, the release films 19a and 19b are adsorbed along the inner surfaces of the lower mold chambers 12 and the respective substrate mounting portions 26 and the die faces of the lower molds 9 (the adsorption ports are not shown). Next, the substrate 14 on which the wafer element 13 has been mounted is set in the substrate installation portion 26 provided in the lower mold 9.
接著，如圖4(b)所示，使用樹脂密封裝置1的合模機構10(參照圖1)使可動盤7(參照圖1)上升，並進行合模。伴隨可動盤7 的上升，樹脂料錠30亦上升。藉由使可動盤7上升，使料槽塊30的伸出部32的上面與形成於上模6的橫澆道28的周邊部(相對於橫澆道28的延伸方向為兩側的部分)的下面接觸。藉由進一步使可動盤7上升，從而藉由橫澆道28的周邊部的下面在凹部29內下壓料槽塊30並使其下降。此時，由於藉由橫澆道28的周邊部的下面來使料槽塊30下降的按壓力(將上模6與下模9合模的加壓壓力)大於彈簧31的按壓力，因此彈簧31壓縮且料槽塊30下降。藉由進一步使可動盤7上升，而將上模6與下模9合模。在該狀態下，能夠藉由料槽塊30的伸出部32的下面來使離模膜19a、19b的端部與下模9的模面緊貼以進行固定。 Next, as shown in FIG. 4(b), the movable platen 7 (see FIG. 1) is raised by the mold clamping mechanism 10 (see FIG. 1) of the resin sealing device 1, and the mold clamping is performed. Accompanying movable plate 7 As the rise, the resin ingot 30 also rises. By raising the movable disk 7, the upper surface of the projecting portion 32 of the chute block 30 and the peripheral portion of the runner 28 formed in the upper die 6 (portions on both sides with respect to the direction in which the runner 28 extends) Contact below. By further raising the movable platen 7, the groove block 30 is pressed down in the recessed portion 29 by the lower surface of the peripheral portion of the runner 28 and lowered. At this time, since the pressing force for lowering the chute block 30 by the lower surface of the peripheral portion of the runner 28 (the pressing pressure for clamping the upper mold 6 and the lower mold 9) is larger than the pressing force of the spring 31, the spring 31 is compressed and the chute block 30 is lowered. The upper mold 6 and the lower mold 9 are clamped by further raising the movable disk 7. In this state, the end portions of the release films 19a and 19b can be brought into close contact with the mold surface of the lower mold 9 by the lower surface of the projecting portion 32 of the chute block 30 to be fixed.
接著，藉由加熱被供給至料槽25內的樹脂料錠33並使其熔融而生成流動性樹脂34。接著，藉由柱塞35按壓流動性樹脂34，經由樹脂通道(主流道27、橫澆道28)往上模腔室11及下模腔室12注入流動性樹脂34。接著，以固化所需要的時間加熱流動性樹脂34，藉此使流動性樹脂34固化而成形固化樹脂。由此，安裝在基板14的晶片元件13，被密封在與上模腔室11和下模腔室12的形狀相對應地成形的固化樹脂內。接著，在經過固化所需的時間之後，使可動盤7(參照圖1)下降以將上模6與下模9開模。藉由開模，料槽塊30藉由彈簧31而上升至既定的位置並停止。在該狀態下，脫模已完成樹脂密封的基板並取出。 Next, the resin ingot 33 supplied to the inside of the chute 25 is heated and melted to form the fluid resin 34. Then, the fluid resin 33 is pressed by the plunger 35, and the fluid resin 34 is injected into the upper mold chamber 11 and the lower mold chamber 12 via the resin passages (the main flow path 27 and the runner 28). Next, the fluid resin 34 is heated for the time required for curing, whereby the fluid resin 34 is cured to form a cured resin. Thereby, the wafer element 13 mounted on the substrate 14 is sealed in the cured resin formed in accordance with the shapes of the upper mold chamber 11 and the lower mold chamber 12. Next, after the time required for the curing, the movable disk 7 (refer to FIG. 1) is lowered to open the upper die 6 and the lower die 9. By opening the mold, the chute block 30 is raised to a predetermined position by the spring 31 and stopped. In this state, the resin-sealed substrate is demolded and taken out.
在本實施例中，作為使料槽塊30升降(進退)的手段，使用有彈性構件的彈簧31。亦可取代此，使用其他形式的彈性構件。此外，只要是具有既定的彈性、耐久性以及耐熱性的材料，則作為彈性構件，可使用金屬材料、含金屬的複合材料或高分子材料等。進一步地，作為使料 槽塊30升降的手段，並不限於彈性構件，亦可以使用伺服馬達(servomotor)等升降料槽塊30。 In the present embodiment, a spring 31 having an elastic member is used as means for moving the trough block 30 up and down (forward and backward). Alternatively, other forms of elastic members may be used. Further, as long as it is a material having a predetermined elasticity, durability, and heat resistance, a metal material, a metal-containing composite material, or a polymer material can be used as the elastic member. Further, as a material The means for lifting and lowering the groove 30 is not limited to the elastic member, and a lift chute 30 such as a servomotor may be used.
圖5(a)、(b)，係表示圖4所示的料槽塊30的伸出部32的形狀的俯視圖。圖5(a)表示料槽塊30相對於各料槽25(在此為三個料槽)一體化地形成的情形。藉由料槽塊30的經一體化的伸出部32a的下面，將離模膜19a、19b的端部固定於下模9的模面。圖5(b)表示料槽塊30相對於各料槽25分別分割而形成的情形。藉由料槽塊30各自的伸出部32b的下面，將離模膜19a、19b的端部固定於下模9的模面。在任一種情況下，都在俯視觀察時料槽塊30的伸出部32a、32b與離模膜19a、19b重疊的範圍中，藉由伸出部32a、32b的下面使離模膜19a、19b的端部與下模9的模面緊貼以進行固定。料槽塊30的伸出部32的形狀，並不限於上述圖5(a)、(b)的形狀，只要是能夠使離模膜19a、19b的端部與下模9的模面緊貼以進行固定的形狀即可。此外，俯視觀察時伸出部32與離模膜19a、19b重疊的範圍，亦可以不包含離模膜19a、19b的邊緣。 5(a) and 5(b) are plan views showing the shape of the projecting portion 32 of the chute block 30 shown in Fig. 4. Fig. 5(a) shows a case where the chute block 30 is integrally formed with respect to each chute 25 (here, three chutes). The ends of the release films 19a, 19b are fixed to the die face of the lower mold 9 by the lower surface of the integrated projecting portion 32a of the chute block 30. Fig. 5(b) shows a case where the chute block 30 is formed separately from each of the chutes 25. The end portions of the release films 19a and 19b are fixed to the die face of the lower mold 9 by the lower surfaces of the respective projecting portions 32b of the chute block 30. In either case, in the range in which the projecting portions 32a, 32b of the chute block 30 overlap the release film 19a, 19b in plan view, the release films 19a, 19b are made by the lower surfaces of the projecting portions 32a, 32b. The end portion is in close contact with the die face of the lower die 9 for fixing. The shape of the projecting portion 32 of the chute block 30 is not limited to the above-described shapes of Figs. 5(a) and 5(b), so that the end portions of the release films 19a and 19b can be brought into close contact with the die face of the lower mold 9. To make a fixed shape. Further, the range in which the overhang portion 32 overlaps the release films 19a and 19b in plan view may not include the edges of the release films 19a and 19b.
如圖1至圖5所示，在本實施例中，能夠藉由料槽塊30的伸出部32的下面，使已覆蓋下模9的離模膜19a、19b的端部與下模9的模面緊貼以進行固定。由此，當進行樹脂密封時，能夠防止已覆蓋下模9的模面的離模膜19a、19b從下模9的模面浮起。因此，能夠防止熔融的流動性樹脂34進入離模膜19a、19b與下模9的模面之間。 As shown in Figs. 1 to 5, in the present embodiment, the end portions of the release films 19a, 19b which have covered the lower mold 9 and the lower mold 9 can be covered by the lower surface of the projecting portion 32 of the chute block 30. The die faces are snugly attached for fixing. Thereby, when the resin sealing is performed, it is possible to prevent the release films 19a and 19b which have covered the die surface of the lower mold 9 from floating from the die surface of the lower mold 9. Therefore, it is possible to prevent the molten fluid resin 34 from entering between the release films 19a and 19b and the die face of the lower mold 9.
圖6係表示本發明的樹脂密封裝置的實施例2中、裝置的概要的前視圖。在圖6中，與實施例1的情形不同，在實施例2中，在上模6 與下模9之間進一步設置有中間模36。驅動機構37，係使中間模36在上模6與下模9之間升降的機構。例如，藉由由齒條及小齒輪機構所構成的驅動機構37使中間模36進行升降。藉由使用驅動機構37使中間模36進行升降，從而在上模5與中間模36之間以及中間模36與下模9之間進行合模及開模。 Fig. 6 is a front elevational view showing the outline of the apparatus in the second embodiment of the resin sealing device of the present invention. In FIG. 6, unlike the case of Embodiment 1, in Embodiment 2, in the upper mold 6 An intermediate mold 36 is further disposed between the lower mold 9. The drive mechanism 37 is a mechanism for moving the intermediate mold 36 between the upper mold 6 and the lower mold 9. For example, the intermediate mold 36 is raised and lowered by a drive mechanism 37 composed of a rack and pinion mechanism. The intermediate mold 36 is lifted and lowered by using the drive mechanism 37 to perform mold clamping and mold opening between the upper mold 5 and the intermediate mold 36 and between the intermediate mold 36 and the lower mold 9.
以下，針對本發明的實施例2的樹脂密封裝置1的合模動作進行說明。圖6表示上模6、下模9與中間模36已開模的狀態。首先，藉由驅動機構37使中間模36下降，而將中間模36與下模9合模。接著，使用合模機構10使可動盤7上升，而將上模6與中間模36及下模9合模。在完成樹脂密封之後，使用合模機構10使可動盤7下降，而將上模6與中間模36及下模9開模。接著，藉由驅動機構37使中間模36上升，而將中間模36與下模9開模並完全地進行開模。 Hereinafter, the mold clamping operation of the resin sealing device 1 of the second embodiment of the present invention will be described. Fig. 6 shows a state in which the upper mold 6, the lower mold 9, and the intermediate mold 36 have been opened. First, the intermediate mold 36 is lowered by the drive mechanism 37, and the intermediate mold 36 is clamped to the lower mold 9. Next, the movable platen 7 is raised by the mold clamping mechanism 10, and the upper mold 6 is clamped to the intermediate mold 36 and the lower mold 9. After the resin sealing is completed, the movable platen 7 is lowered by the mold clamping mechanism 10, and the upper mold 6 and the intermediate mold 36 and the lower mold 9 are opened. Next, the intermediate mold 36 is raised by the drive mechanism 37, and the intermediate mold 36 and the lower mold 9 are opened and the mold is completely opened.
圖7係表示在本發明的樹脂密封裝置1的實施例2中兩種狀態的部分剖面圖，其中，圖7(a)係表示已開模狀態的部分剖面圖，圖7(b)係表示已合模狀態的部分剖面圖。在實施例2中，針對將上模6、下模9與中間模36合模的構成進行說明。在圖7(a)中，在下模9設置有下模腔室38與基板設置部39。作為加熱手段，在下模板8(參照圖6)內裝有加熱器(未圖示)。在下模9，設置有收容樹脂料錠40的料槽41及按壓流動性樹脂42的柱塞43，所述流動性樹脂42係加熱樹脂料錠40而熔融的物質。在上模6設置有槽部44，槽部44的中心部與下模9的料槽41相對向。作為加熱手段，在上模板5(參照圖6)內裝有加熱器(未圖示)。槽部44，成為用於往下模腔室38注入流動性樹脂42的樹脂通道。上模6與下模9，分別藉由加熱器而一般被加熱至175℃左右。在中間模36，設置有 與下模腔室39相對向並為樹脂成形部的一部分的貫通空間(實質上作為上模腔室而發揮功能)45。進一步地，在中間模36，設置有成為從料槽41將已熔融的流動性樹脂42往上模6的槽部44壓送的樹脂通道之貫通口46。 Figure 7 is a partial cross-sectional view showing two states in the second embodiment of the resin sealing device 1 of the present invention, wherein Figure 7(a) shows a partial cross-sectional view of the mold-opening state, and Figure 7(b) shows A partial section view of the clamped state. In the second embodiment, a configuration in which the upper mold 6, the lower mold 9, and the intermediate mold 36 are clamped will be described. In FIG. 7(a), a lower mold chamber 38 and a substrate setting portion 39 are provided in the lower mold 9. As a heating means, a heater (not shown) is placed in the lower die plate 8 (see Fig. 6). The lower mold 9 is provided with a chute 41 for accommodating the resin ingot 40 and a plunger 43 for pressing the fluid resin 42 which is a substance which heats the resin ingot 40 and melts. The upper mold 6 is provided with a groove portion 44, and the center portion of the groove portion 44 faces the groove 41 of the lower mold 9. As the heating means, a heater (not shown) is placed in the upper die plate 5 (see Fig. 6). The groove portion 44 serves as a resin passage for injecting the fluid resin 42 into the lower mold chamber 38. The upper mold 6 and the lower mold 9 are generally heated to about 175 ° C by a heater. In the intermediate mold 36, there is A through space (which functions substantially as an upper mold chamber) 45 that faces the lower mold cavity 39 and is a part of the resin molded portion. Further, the intermediate mold 36 is provided with a through port 46 which is a resin passage which presses the molten fluid resin 42 from the groove 41 to the groove portion 44 of the upper mold 6.
以下，針對本發明的實施例2的樹脂密封裝置1的動作進行說明。首先，將離模膜15配置在上模6與中間模36之間的既定位置。接著，將離模膜19a、19b送至中間模36與下模9之間，且以除形成有料槽41的區域之外、覆蓋下模腔室38與基板設置部39的方式配置於下模9的既定位置。接著，將已安裝晶片元件13的基板14配置在中間模36的貫通空間45與下模腔室38之間的既定位置。基板14，透過中間模36的貫通空間45而被夾在覆蓋上模6的模面的離模膜15與覆蓋下模9的模面的離模膜19a、19b之間。 Hereinafter, the operation of the resin sealing device 1 of the second embodiment of the present invention will be described. First, the release film 15 is disposed at a predetermined position between the upper mold 6 and the intermediate mold 36. Next, the release films 19a and 19b are sent between the intermediate mold 36 and the lower mold 9, and are disposed in the lower mold so as to cover the lower mold chamber 38 and the substrate installation portion 39 except for the region where the chute 41 is formed. The established position of 9. Next, the substrate 14 on which the wafer component 13 has been mounted is placed at a predetermined position between the through space 45 of the intermediate mold 36 and the lower mold chamber 38. The substrate 14 is passed between the release film 15 covering the mold surface of the upper mold 6 and the release films 19a and 19b covering the mold surface of the lower mold 9 through the through space 45 of the intermediate mold 36.
接著，以沿上模6的槽部44的內面及上模6的模面之方式吸附離模膜15(吸附口未圖示)。以沿各下模腔室38與各基板設置部39的內面及下模9的模面之方式吸附離模膜19a、19b(吸附口未圖示)。接著，將已安裝有晶片元件13的基板14設置在基板設置部39。接著，使用驅動機構37(參照圖6)使中間模36下降，而將中間模36與下模9合模。由此，中間模36的貫通空間45的周邊部中的下面，將離模膜19a、19b的兩端部(於圖中為各離模膜19a、19b的左右端部)按壓在下模9的模面。因此，離模膜19a、19b的兩端部，藉由貫通空間45的周邊部的下面，而與下模9的模面緊貼並固定。 Next, the release film 15 is adsorbed along the inner surface of the groove portion 44 of the upper mold 6 and the mold surface of the upper mold 6 (the adsorption port is not shown). The release films 19a and 19b are adsorbed along the inner surfaces of the lower mold chambers 38 and the respective substrate mounting portions 39 and the die faces of the lower molds 9 (the adsorption ports are not shown). Next, the substrate 14 on which the wafer element 13 has been mounted is placed in the substrate setting portion 39. Next, the intermediate mold 36 is lowered by the drive mechanism 37 (refer to FIG. 6), and the intermediate mold 36 is clamped to the lower mold 9. Thereby, the lower end of the peripheral portion of the through space 45 of the intermediate mold 36 presses both end portions of the release films 19a and 19b (the left and right end portions of the release films 19a and 19b in the drawing) against the lower mold 9. Die surface. Therefore, both end portions of the release films 19a and 19b are in close contact with and fixed to the die surface of the lower mold 9 by the lower surface of the peripheral portion of the through space 45.
接著，如圖7(b)所示，使用樹脂密封裝置1的合模機構10(參照圖6)使可動盤7上升，而將上模6與中間模36及下模9合模。 在該狀態下，料槽41、貫通口46、槽部44與貫通空間45依次連通，槽部44作為樹脂通道而發揮功能。接著，在料槽41內，加熱樹脂料錠40並使其熔融而生成流動性樹脂42。接著，藉由柱塞43來按壓流動性樹脂42，依次經由料槽41、貫通口46及槽部44，往中間模36的貫通空間45及下模腔室38注入流動性樹脂42。接著，藉由以固化所需要的時間加熱流動性樹脂42，而使流動性樹脂42固化並成形固化樹脂。由此，安裝在基板14的晶片元件13，被密封在與形成在中間模36的貫通空間45及下模腔室38的形狀相對應地成形之固化樹脂內。接著，在經過固化所需的時間之後，使用合模機構10使可動盤7下降，而將上模6與中間模36及下模9開模。接著，藉由驅動機構37(參照圖6)使中間模36上升，而將中間模36與下模9開模並完全地進行開模。 Next, as shown in FIG. 7(b), the movable platen 7 is raised by the mold clamping mechanism 10 (see FIG. 6) of the resin sealing device 1, and the upper die 6 is clamped to the intermediate die 36 and the lower die 9. In this state, the chute 41, the through hole 46, and the groove portion 44 are in communication with the through space 45 in order, and the groove portion 44 functions as a resin passage. Next, in the chute 41, the resin ingot 40 is heated and melted to form a fluid resin 42. Then, the fluid resin 42 is pressed by the plunger 43, and the fluid resin 42 is injected into the through space 45 of the intermediate mold 36 and the lower mold chamber 38 through the chute 41, the through hole 46, and the groove portion 44 in this order. Next, by heating the fluid resin 42 for the time required for curing, the fluid resin 42 is cured and the cured resin is molded. Thereby, the wafer element 13 mounted on the substrate 14 is sealed in the cured resin molded in accordance with the shape of the through space 45 and the lower mold chamber 38 formed in the intermediate mold 36. Next, after the time required for the curing, the movable platen 7 is lowered by the mold clamping mechanism 10, and the upper mold 6 and the intermediate mold 36 and the lower mold 9 are opened. Next, the intermediate mold 36 is raised by the drive mechanism 37 (refer to FIG. 6), and the intermediate mold 36 and the lower mold 9 are opened and the mold is completely opened.
在實施例2中，藉由中間模36的貫通空間45的周邊部的下面，使離模膜19a、19b的兩端部與下模9的模面緊貼以進行固定。由此，當進行樹脂密封時，能夠防止已覆蓋下模9的模面的離模膜19a、19b浮起。因此，能夠防止熔融的流動性樹脂42進入離模膜19a、19b與下模9的模面之間。 In the second embodiment, the both end portions of the release films 19a and 19b are brought into close contact with the die surface of the lower mold 9 by the lower surface of the peripheral portion of the through space 45 of the intermediate mold 36 to be fixed. Thereby, when the resin sealing is performed, the release films 19a and 19b which have covered the mold surface of the lower mold 9 can be prevented from floating. Therefore, it is possible to prevent the molten fluid resin 42 from entering between the release films 19a and 19b and the die face of the lower mold 9.
如前所述，各實施例均藉由料槽塊30的伸出部32的下面或中間模36的貫通空間45的周邊部的下面，將覆蓋下模9的離模膜19a、19b的端部與下模9的模面緊貼並固定。由此，當進行樹脂密封時，能夠防止覆蓋下模9的模面的離模膜19a、19b從下模9的模面浮起。能夠防止從料槽25、41壓送的流動性樹脂34、42進入離模膜19a、19b與下模9的模面之間。因此，在樹脂密封中，能夠防止因填充不足所引起的成形不良，並 大幅提高製品的品質和良率。 As described above, each embodiment covers the ends of the release films 19a, 19b of the lower mold 9 by the lower surface of the projecting portion 32 of the chute block 30 or the lower surface of the peripheral portion of the through space 45 of the intermediate mold 36. The portion is in close contact with and fixed to the die surface of the lower mold 9. Thereby, when the resin sealing is performed, the release films 19a and 19b covering the die surface of the lower mold 9 can be prevented from floating from the die surface of the lower mold 9. It is possible to prevent the fluid resins 34 and 42 which are fed from the chutes 25 and 41 from entering between the release films 19a and 19b and the die faces of the lower mold 9. Therefore, in the resin sealing, formation failure due to insufficient filling can be prevented, and Significantly improve the quality and yield of the product.
此外，由於能夠防止流動性樹脂34、42進入離模膜19a、19b與下模9的模面之間，因此在下模9側的模面不會產生毛邊。因此，不需要去除毛邊，此外，由於能夠將清潔下模9側的模面之次數和時間最小化，因此能夠大幅提高生產效率。 Further, since the fluid resins 34 and 42 can be prevented from entering between the mold films 19a and 19b and the mold surface of the lower mold 9, burrs are not generated on the mold surface on the lower mold 9. Therefore, it is not necessary to remove the burrs, and since the number and time of cleaning the mold faces on the side of the lower mold 9 can be minimized, the production efficiency can be greatly improved.
此外，覆蓋下模9的離模膜19a、19b，以除配置有料槽25、41的區域之外、覆蓋下模腔室12、38與基板設置部26、29之方式配置。無需與形成於下模9的料槽25、41的個數和配置相應地製作複雜的離模膜。因此，能夠使用簡單的離模膜供給機構來構成樹脂密封裝置。由於能夠使用簡單的離模膜供給機構來構成樹脂密封裝置，因此能夠降低裝置的費用。 Further, the release films 19a and 19b covering the lower mold 9 are disposed so as to cover the lower mold chambers 12 and 38 and the substrate installation portions 26 and 29 except for the regions in which the grooves 25 and 41 are disposed. It is not necessary to produce a complicated release film in accordance with the number and arrangement of the grooves 25, 41 formed in the lower mold 9. Therefore, the resin sealing device can be configured using a simple release film supply mechanism. Since the resin sealing device can be configured using a simple release film supply mechanism, the cost of the device can be reduced.
作為實施例1的變形例，可採用在圖4中沒有上模腔室11的構成。於該情形，基板14以晶片元件13朝下的方式配置。此外，流動性樹脂34，從橫澆道28經由形成於基板14的孔(未圖示)注入下模腔室12內。 As a modification of the first embodiment, a configuration in which the upper mold chamber 11 is not provided in Fig. 4 can be employed. In this case, the substrate 14 is disposed with the wafer element 13 facing downward. Further, the fluid resin 34 is injected into the lower mold chamber 12 from the runner 28 via a hole (not shown) formed in the substrate 14.
此外，在實施例1(包含上述的變形例)及實施例2中，亦可採用調換圖4與圖7所記載的內容之上模側與下模側的構成。 Further, in the first embodiment (including the above-described modifications) and the second embodiment, the configuration of the upper mold side and the lower mold side of the contents described in FIG. 4 and FIG. 7 may be replaced.
根據本發明，係提供一種在進行樹脂密封時，能夠防止熔融的流動性樹脂進入覆蓋下模的離模膜與下模的模面之間的樹脂密封裝置。因此，本發明對於提高製品的品質、提高良率、提高生產效率以及降低裝置的費用亦有頗大的貢獻，在工業上價值亦非常高。 According to the present invention, there is provided a resin sealing device capable of preventing a molten fluid resin from entering between a release film covering a lower mold and a die surface of a lower mold when resin sealing is performed. Therefore, the present invention contributes greatly to improving the quality of the product, improving the yield, improving the production efficiency, and reducing the cost of the device, and is also highly valuable in the industry.
此外，本發明並不限定於上述的各實施例，在不脫離本發明的趣旨之範圍內，可根據需要而任意且適當地組合、變更、或者選擇性地採用。 The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selectively employed as needed within the scope of the present invention.
6‧‧‧上模(第二成形模) 6‧‧‧Upper mold (second forming mold)
9‧‧‧下模(第一成形模) 9‧‧‧Down mold (first forming die)
11‧‧‧上模腔室(第二腔室) 11‧‧‧Upper mold chamber (second chamber)
12‧‧‧下模腔室(第一腔室) 12‧‧‧ Lower mold chamber (first chamber)
13‧‧‧晶片元件 13‧‧‧ wafer components
14‧‧‧基板 14‧‧‧Substrate
15‧‧‧離模膜(第二離模膜) 15‧‧‧ release film (second release film)
19a、19b‧‧‧離模膜(第一離模膜) 19a, 19b‧‧‧ release film (first release film)
25‧‧‧料槽 25‧‧‧ trough
26‧‧‧基板設置部 26‧‧‧Substrate setting department
27‧‧‧主流道(槽部、樹脂通道) 27‧‧‧main road (slot, resin channel)
28‧‧‧橫澆道(槽部、樹脂通道) 28‧‧‧ runners (grooves, resin channels)
29‧‧‧凹部 29‧‧‧ recess
30‧‧‧料槽塊(薄膜按壓構件) 30‧‧‧Gutter block (film pressing member)
31‧‧‧彈簧 31‧‧‧ Spring
32‧‧‧伸出部 32‧‧‧Outreach
33‧‧‧樹脂料錠(樹脂材料) 33‧‧‧Resin ingot (resin material)
34‧‧‧流動性樹脂 34‧‧‧Liquid resin
35‧‧‧柱塞 35‧‧‧Plunger
Claims (12)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013088410A JP5934139B2 (en) | 2013-04-19 | 2013-04-19 | Resin sealing device and resin sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201448133A true TW201448133A (en) | 2014-12-16 |
| TWI563611B TWI563611B (en) | 2016-12-21 |
Family
ID=51709421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103108890A TW201448133A (en) | 2013-04-19 | 2014-03-13 | Resin sealing device and resin sealing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5934139B2 (en) |
| KR (1) | KR101643451B1 (en) |
| CN (1) | CN104112679B (en) |
| TW (1) | TW201448133A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI618202B (en) * | 2015-11-09 | 2018-03-11 | Towa Corp | Resin packaging device and resin packaging method |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6560498B2 (en) * | 2015-01-27 | 2019-08-14 | Ｔｏｗａ株式会社 | Resin sealing method and resin molded product manufacturing method |
| JP6430342B2 (en) * | 2015-08-11 | 2018-11-28 | Ｔｏｗａ株式会社 | Resin molding apparatus, resin molding method, and mold |
| TWI575620B (en) * | 2016-03-10 | 2017-03-21 | 南茂科技股份有限公司 | Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure |
| CN207398072U (en) * | 2017-06-05 | 2018-05-22 | 日月光半导体制造股份有限公司 | Packaging mold for semiconductor packaging process |
| KR101986645B1 (en) * | 2017-07-19 | 2019-07-03 | 동아정밀(주) | Compression core device of transfer mold |
| CN108058352A (en) * | 2017-12-30 | 2018-05-22 | 宁国市欧泰橡塑制品有限公司 | A kind of wire bushing injection moulding equipment |
| JP6655150B1 (en) * | 2018-10-19 | 2020-02-26 | Ｔｏｗａ株式会社 | Transfer device, resin molding device, transfer method, and method of manufacturing resin molded product |
| JP7160770B2 (en) * | 2019-07-22 | 2022-10-25 | アピックヤマダ株式会社 | Resin molding equipment |
| JP6845903B1 (en) * | 2019-09-18 | 2021-03-24 | Ｔｏｗａ株式会社 | Molding mold, resin molding equipment and manufacturing method of resin molded products |
| JP6837530B1 (en) * | 2019-10-17 | 2021-03-03 | Ｔｏｗａ株式会社 | Resin molding method and resin molding equipment |
| JP7360368B2 (en) * | 2020-08-18 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
| JP7341105B2 (en) * | 2020-08-28 | 2023-09-08 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
| JP7341106B2 (en) * | 2020-08-28 | 2023-09-08 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
| JP7430125B2 (en) * | 2020-08-28 | 2024-02-09 | Ｔｏｗａ株式会社 | Molding mold, resin molding equipment, and method for manufacturing resin molded products |
| JP7360369B2 (en) * | 2020-08-28 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
| KR102456172B1 (en) * | 2020-10-15 | 2022-10-19 | 토와한국 주식회사 | Apparatus for molding semiconductor devices including a molding module |
| JP2024014263A (en) * | 2022-07-22 | 2024-02-01 | Ｔｏｗａ株式会社 | Transport device, resin molding device, and method for manufacturing resin molded product |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| JPH09193177A (en) * | 1996-01-17 | 1997-07-29 | Apic Yamada Kk | Resin molding method and release film used therefor |
| US6439869B1 (en) * | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Apparatus for molding semiconductor components |
| TWI327756B (en) * | 2002-11-29 | 2010-07-21 | Apic Yamada Corp | Resin molding machine |
| KR20120028639A (en) * | 2010-09-15 | 2012-03-23 | 한미반도체 주식회사 | Transfer molding device |
| JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
-
2013
- 2013-04-19 JP JP2013088410A patent/JP5934139B2/en active Active
-
2014
- 2014-02-24 KR KR1020140021166A patent/KR101643451B1/en active IP Right Grant
- 2014-03-07 CN CN201410082060.2A patent/CN104112679B/en active Active
- 2014-03-13 TW TW103108890A patent/TW201448133A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI618202B (en) * | 2015-11-09 | 2018-03-11 | Towa Corp | Resin packaging device and resin packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI563611B (en) | 2016-12-21 |
| JP2014212246A (en) | 2014-11-13 |
| JP5934139B2 (en) | 2016-06-15 |
| KR20140125716A (en) | 2014-10-29 |
| KR101643451B1 (en) | 2016-07-27 |
| CN104112679B (en) | 2017-10-13 |
| CN104112679A (en) | 2014-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201448133A (en) | Resin sealing device and resin sealing method | |
| TWI641471B (en) | Resin molding die and resin molding method | |
| JP2023022859A (en) | Compression molding apparatus and compression molding method | |
| JP6560498B2 (en) | Resin sealing method and resin molded product manufacturing method | |
| JP6144085B2 (en) | Molded product production apparatus and molded product production method | |
| CN113597365B (en) | Method for producing resin molded article | |
| JP4084844B2 (en) | Resin sealing molding method and apparatus for electronic parts | |
| TW201632330A (en) | Device and method for controlled moulding and degating of a carrier with electronic components and moulded produnt | |
| JP4855026B2 (en) | Resin sealing molding method and apparatus for electronic parts | |
| US20070069422A1 (en) | Method of resin-seal-molding electronic component and apparatus therefor | |
| TWI766729B (en) | Workpiece unloading device, resin molding device | |
| JP4886344B2 (en) | Resin sealing molding equipment for electronic parts | |
| JP5511724B2 (en) | Resin sealing molding method and apparatus for electronic parts | |
| WO2016125571A1 (en) | Resin molding die, resin molding method, and method for producing resin molded article | |
| JP6867229B2 (en) | Resin mold mold | |
| CN113573867B (en) | Resin molding device and method for manufacturing resin molded product | |
| TW202249128A (en) | Resin sealing device and resin sealing method | |
| JP2022125946A (en) | Method for manufacturing resin molding, molding die, and resin molding device | |
| TWI829565B (en) | Resin sealing apparatus | |
| WO2023067878A1 (en) | Mold for resin molding, resin molding apparatus, and method for producing resin molded article | |
| TW202333246A (en) | Resin sealing device and resin sealing method | |
| TW202330243A (en) | Resin sealing device | |
| JP2007281367A (en) | Resin sealing molding apparatus for electronic component | |
| JP2015144200A (en) | Molding die, resin molding device, and resin molding method |