TW201443091A - 硬化膜形成用樹脂組成物 - Google Patents
硬化膜形成用樹脂組成物 Download PDFInfo
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- TW201443091A TW201443091A TW103101423A TW103101423A TW201443091A TW 201443091 A TW201443091 A TW 201443091A TW 103101423 A TW103101423 A TW 103101423A TW 103101423 A TW103101423 A TW 103101423A TW 201443091 A TW201443091 A TW 201443091A
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 9
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- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 13
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- XQAVYBWWWZMURF-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO XQAVYBWWWZMURF-UHFFFAOYSA-N 0.000 claims description 3
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- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 claims description 2
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- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
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- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract
一種硬化膜形成用樹脂組成物,其係含有:(A)含有由下列式(1)~(3)表示之重複單位之(共)聚合物,(B)矽烷偶合劑,(C)多官能(甲基)丙烯酸酯化合物,以及(D)溶劑。□(式中,R分別獨立地表示氫原子或甲基;R1表示烷基;R2~R6分別獨立地表示氫原子、鹵素原子或烷基;a、b及c分別為滿足40≦a≦100、0≦b≦30、0≦c≦30之正數,且40≦a+b+c≦100)。
Description
本發明係關於硬化膜形成用樹脂組成物。
以往,觸控面板等所必要之保護膜、絕緣膜等,係藉由使用感光性樹脂組成物之光微影技術來進行圖型加工而形成於必要部位(專利文獻1)。
然而,依據光微影技術所進行之圖型加工,不僅步驟複雜,亦有耗費成本之問題。因此,係期望一種能夠以更簡便的方法且低成本將保護膜、絕緣膜等形成於必要部位之組成物。
此外,從運送或保存上的要求來看,乃逐漸增加薄膜基板的利用以取代玻璃基板。薄膜基板於保存時被保存為捲狀等,此時由於基板為彎曲,故對於塗佈於薄膜基板上之材料,亦要求具有與薄膜同樣的柔軟性。
再者,於ITO薄膜等之將電極形成於薄膜上之基板中,當將黏接劑使用在基板的貼合時,由於黏接劑的水分使銀配線劣化而產生短路等問題,故係要求一種可保護電極與配線之保護膜材料。
另一方面,以往的保護膜材料,是以塗佈於玻璃基板上者為目的,為了提升硬度而含有無機微粒(專利文獻2)。然而,在含有無機微粒等之以往的方法中,雖可改善硬度,但缺乏柔軟性,例如在彎折時會產生龜裂等缺失,而處於無法適用在對薄膜基板的塗佈之狀況。
[專利文獻1]日本特開2013-064973號公報
[專利文獻2]日本特開2012-116975號公報
本發明係鑒於上述課題而創作出,該目的在於提供一種可形成能夠藉由印刷法等之簡便方法於必要部位形成膜,且具有高穿透率、高緊密性、高硬度,並且亦具有高柔軟性、長期可靠度之硬化膜之組成物。
本發明者們係為了解決上述課題而進行精心探討,結果發現可藉由一種含有特定的(共)聚合物、矽烷偶合劑、多官能(甲基)丙烯酸酯化合物、以及溶劑之組成物來解決上述課題,因而完成本發明。
亦即,本發明係提供下列硬化膜形成用樹脂組成物。
1.一種硬化膜形成用樹脂組成物,其特徵係含有:(A)含有由下列式(1)~(3)表示之重複單位之(共)聚合物,
(式中,R分別獨立地表示氫原子或甲基;R1表示烷基;R2~R6分別獨立地表示氫原子、鹵素原子或烷基;a、b及c分別為滿足40≦a≦100、0≦b≦30、0≦c≦30之正數,且40≦a+b+c≦100)。
(B)矽烷偶合劑,(C)多官能(甲基)丙烯酸酯化合物,以及(D)溶劑。
2.如第1項之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自四丙烯酸新戊四醇酯、四甲基丙烯酸新戊四醇酯、三丙烯酸新戊四醇酯、三甲基丙烯酸新戊四醇酯、六丙烯酸二新戊四醇酯、六甲基丙烯酸二新戊四醇酯、五丙烯酸二新戊四醇酯、五甲基丙烯酸二新戊四醇酯、三丙烯酸三羥甲基乙烷酯、三甲基
丙烯酸三羥甲基乙烷酯、三丙烯酸三羥甲基丙烷酯、三甲基丙烯酸三羥甲基丙烷酯、四丙烯酸二(三羥甲基)丙烷酯及四甲基丙烯酸二(三羥甲基)丙烷酯中之至少1種。
3.如第2項之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自四丙烯酸新戊四醇酯、四甲基丙烯酸新戊四醇酯、三丙烯酸新戊四醇酯及三甲基丙烯酸新戊四醇酯中之至少1種。
4.如第2項之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自六丙烯酸二新戊四醇酯、六甲基丙烯酸二新戊四醇酯、五丙烯酸二新戊四醇酯及五甲基丙烯酸二新戊四醇酯中之至少1種。
5.如第1至4項中任一項之硬化膜形成用樹脂組成物,其中進一步含有(E)離子捕集劑。
6.如第5項之硬化膜形成用樹脂組成物,其中(E)離子捕集劑為5-甲基苯并***。
7.如第1至6項中任一項之硬化膜形成用樹脂組成物,其中於25℃的黏度為1~10,000mPa.s。
8.如第1至6項中任一項之硬化膜形成用樹脂組成物,其中溶劑的沸點為150℃以上。
9.如第8項之硬化膜形成用樹脂組成物,其中於25℃的黏度為10~100,000mPa.s。
10.如第1至9項中任一項之硬化膜形成用樹脂組成物,其中進一步含有(F)自由基聚合起始劑。
11.一種硬化膜之製造方法,其特徵係將如第10項之
硬化膜形成用樹脂組成物塗佈於基板,並在照射紫外線後,於80~120℃燒結。
12.一種硬化膜,其係使用如第1至10項中任一項之硬化膜形成用樹脂組成物所得。
13.一種層合體,其係將如第12項之硬化膜層合於基板上而成。
14.如第13項之層合體,其中基板為薄膜。
15.一種觸控面板,其係包含如第12項之硬化膜。
使用本發明之硬化膜形成用樹脂組成物所得之硬化膜,其硬度高且緊密性優異。因此有用於作為形成有機電激發光(有機EL)元件等之各種顯示器中的保護膜、平坦化膜、絕緣膜、絕緣膜等,以及觸控面板中的保護膜、絕緣膜等的硬化膜之材料。此外,由於柔軟性亦優異,故亦適合作為ITO薄膜用的保護膜材料。
本發明之硬化膜形成用樹脂組成物,係含有:(A)下列(共)聚合物,(B)矽烷偶合劑,(C)多官能(甲基)丙烯酸酯化合物,以及(D)溶劑。
本發明之硬化膜形成用樹脂組成物中所含有之(A)成分,為含有由下列式(1)~(3)表示之重複單位之(共)聚合物。
上述式中,R分別獨立地表示氫原子或甲基,較佳為甲基。R1表示烷基。R2~R6分別獨立地表示氫原子、鹵素原子或烷基。
上述鹵素原子可列舉出氟、氯、溴、碘原子。
上述烷基可為直鏈狀、分枝狀、環狀中任一種。此外,上述烷基的碳數較佳為1~4,尤佳為1~3,更佳為1或2。
上述烷基的具體例,可列舉出甲基、乙基、正丙基、異丙基、順丙基、正丁基、異丁基、二級丁基、三級丁基、順丁基等。此外,上述烷基之氫原子的一部分或全部可由取代基所取代,上述取代基可列舉出鹵素原子、羥基、胺基等。上述R1~R6,較佳為不與後述(C)成分反應之基。
上述(共)聚合物,係以由式(1)表示之重複單位為必要,且因應必要進一步含有由式(2)表示之重複單位及/或由式(3)表示之重複單位。藉由含有由式(2)表示之重複單位,可令人期待緊密性的提升,藉由含有由式(3)表示之重複單位,可賦予緊密性與疏水性(低吸水性)之特性。
上述式中,a、b及c表示各重複單位的含有率(mol%),分別為滿足40≦a≦100、0≦b≦30、0≦c≦30之正數,且40≦a+b+c≦100。較佳為60≦a≦96、2≦b≦20、2≦c≦20,尤佳為70≦a≦90、5≦b≦15、5≦c≦15。
上述(共)聚合物,考量到處理性、緊密性,其重量平均分子量(Mw)較佳為5,000~200,000,尤佳為10,000~100,000,更佳為15,000~80,000。當Mw超過200,000時,相對於溶劑之溶解性降低,有時導致處理性的降低,當Mw未達5,000時,緊密性有時會降低。
此外,考量到印刷性,上述(共)聚合物的Mw較佳為10,000~200,000,尤佳為30,000~180,000,更佳為40,000~170,000。當Mw超過200,000時,相對於溶劑之溶解性降低,有時導致處理性的降低,當Mw未達10,000時,印刷性有時會降低。
Mw為依據凝膠滲透層析法(GPC)之經聚苯乙烯換算的測定值。
當(A)成分為共聚合物時,上述共聚合物可
為隨機共聚合物、交替共聚合物、嵌段共聚合物中的任一種。
(A)成分的(共)聚合物,可藉由使賦予由式(1)表示之重複單位之單體,及因應必要之賦予由式(2)表示之重複單位之單體、賦予由式(3)表示之重複單位之單體等進行(共)聚合而製造出。
聚合方法可採用自由基聚合、陰離子聚合、陽離子聚合等。此等當中,特佳為自由基聚合,具體而言,可於溶劑中,在聚合起始劑的存在下加熱上述單體使其聚合。
上述賦予由式(1)表示之重複單位之單體,可列舉出丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯、丙烯酸正丙酯、甲基丙烯酸正丙酯、丙烯酸異丙酯、甲基丙烯酸異丙酯、丙烯酸2,2,2-三氟乙酯、甲基丙烯酸2,2,2-三氟乙酯、丙烯酸三級丁酯、甲基丙烯酸三級丁酯、丙烯酸2-羥乙酯、甲基丙烯酸2-羥乙酯、丙烯酸2-羥丙酯、甲基丙烯酸2-羥丙酯、丙烯酸2,3-二羥丙酯、甲基丙烯酸2,3-二羥丙酯、丙烯酸4-羥丁酯、甲基丙烯酸4-羥丁酯等。此等當中,特佳為甲基丙烯酸甲酯、甲基丙烯酸乙酯等。
上述賦予由式(2)表示之重複單位之單體,為丙烯酸或甲基丙烯酸。
上述賦予由式(3)表示之重複單位之單體,例如可列舉出苯乙烯、甲基苯乙烯、氯苯乙烯、溴苯乙
烯、4-三級丁基苯乙烯等之苯乙烯化合物。
上述(共)聚合物,除了上述由式(1)~(3)表示之重複單位之外,在不損及本發明的效果之範圍內,可含有其他重複單位。賦予其他重複單位之單體,可列舉出乙烯基化合物、順丁烯二醯亞胺化合物、丙烯腈、順丁烯二酸酐等。
上述乙烯基化合物,例如可列舉出甲基乙烯醚、苄基乙烯醚、乙烯基萘、乙烯基蒽、乙烯基聯苯、乙烯基咔唑、2-羥乙基乙烯醚、苯基乙烯醚、丙基乙烯醚等。上述順丁烯二醯亞胺化合物,例如可列舉出順丁烯二醯亞胺、N-甲基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺等。
上述聚合起始劑,可從以往所知者適當地選擇而使用。例如可列舉出過氧化苯甲醯、異丙苯過氧化氫、三級丁基過氧化氫等之過氧化物;過硫酸鈉、過硫酸鉀、過硫酸銨等之過硫酸鹽;偶氮雙異丁腈、偶氮雙甲基異丁腈、偶氮雙異戊腈、2,2’-偶氮雙(異丁酸)二甲酯等之偶氮系化合物等。此等可單獨使用1種或組合2種以上使用。
上述聚合起始劑的用量,相對於單體1mol,較佳約為0.005~0.05mol。聚合時的反應溫度,可適當地設定在0℃至所使用之溶劑的沸點為止,較佳為20~100℃。反應時間較佳約為0.1~30小時。
聚合反應所使用之溶劑並無特別限定,可從
上述聚合反應所一般使用之各種溶劑中適當地選擇而使用。具體可列舉出水;甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、2-丁醇、異丁醇、三級丁醇、1-戊醇、2-戊醇、3-戊醇、異戊醇、三級戊醇、1-己醇、1-庚醇、2-庚醇、3-庚醇、2-辛醇、2-乙基-1-己醇、苄醇、環己醇等之醇類;二***、二異丙醚、二丁醚、環戊基甲醚、四氫呋喃、1,4-二噁烷等之醚類;三氯甲烷、二氯甲烷、二氯乙烷、四氯化碳等之鹵化烴類;甲基溶纖劑、乙基溶纖劑、異丙基溶纖劑、丁基溶纖劑、二乙二醇單丁醚等之醚醇類;丙酮、丁酮、甲基異丁酮、環己酮等之酮類;乙酸乙酯、乙酸丁酯、丙酸乙酯、溶纖劑乙酸酯等之酯類;正戊烷、正己烷、正庚烷、正辛烷、正壬烷、正癸烷、環戊烷、甲基環戊烷、環己烷、甲基環己烷、苯、甲苯、二甲苯、乙基苯、甲氧苯等之脂肪族或芳香族烴類;二甲醇縮甲醛、二乙基縮醛等之醛類;甲酸、乙酸、丙酸等之脂肪酸類;硝基丙烷、硝基苯、二甲胺、單乙醇胺、吡啶、N-甲基-2-吡咯啶酮、N,N-二甲基甲醯胺、二甲基亞碸、乙腈等。此等可單獨使用1種或混合2種以上使用。
本發明之組成物中的(B)成分,為矽烷偶合劑。上述矽烷偶合劑,較佳係由下列式(4)表示之矽烷化合物。
式(4)中,R7表示甲基或乙基。X表示水解性基。Y表示反應性官能基。m為0~3的整數。n為0~3的整數。
由X表示之水解性基,可列舉出鹵素原子、碳數1~3的烷氧基、碳數2~4的烷氧烷氧基等。上述鹵素原子可列舉出氯原子、溴原子等。碳數1~3的烷氧基較佳為直鏈狀或分枝狀,具體為甲氧基、乙氧基、正丙氧基及異丙氧基。此外,碳數2~4的烷氧烷氧基,具體為甲氧甲氧基、2-甲氧乙氧基、乙氧甲氧基及2-乙氧乙氧基。
由Y表示之反應性官能基,可列舉出胺基、脲基、(甲基)丙烯氧基、乙烯基、環氧基、巰基等,較佳為胺基、脲基、(甲基)丙烯氧基等。特佳為胺基或脲基。
上述矽烷偶合劑,具體可列舉出3-胺丙基三氯矽烷、3-胺丙基三甲氧矽烷、3-胺丙基三乙氧矽烷、3-胺丙基甲基二甲氧矽烷、3-胺丙基甲基二乙氧矽烷、3-脲基丙基三甲氧矽烷、3-脲基丙基三乙氧矽烷、3-丙烯氧基丙基三甲氧矽烷、3-丙烯氧基丙基三乙氧矽烷、3-甲基丙烯氧基丙基三甲氧矽烷、3-甲基丙烯氧基丙基三乙氧矽烷、乙烯基三氯矽烷、乙烯基三甲氧矽烷、乙烯基三乙氧矽烷、烯丙基三氯矽烷、烯丙基三甲氧矽烷、烯丙基三乙氧矽烷、3-環氧丙氧基丙基三甲氧矽烷、3-環氧丙氧基丙
基甲基二乙氧矽烷、3-環氧丙氧基丙基三乙氧矽烷、3-巰丙基三甲氧矽烷、3-巰丙基三乙氧矽烷、3-巰丙基甲基二甲氧矽烷、3-巰丙基甲基二乙氧矽烷等。
此等當中,特佳為3-胺丙基三甲氧矽烷、3-胺丙基三乙氧矽烷、3-脲基丙基三甲氧矽烷、3-脲基丙基三乙氧矽烷、3-甲基丙烯氧基丙基三甲氧矽烷、3-甲基丙烯氧基丙基三乙氧矽烷等。上述矽烷偶合劑可使用市售品。
(B)成分的含量,相對於(A)成分100質量份,較佳為0.001~10質量份,尤佳為0.01~5質量份,更佳為0.05~1質量份。當未達0.001質量份時,緊密性有時會降低,超過10質量份時,硬度有時會降低。
本發明之組成物中的(C)成分,為多官能(甲基)丙烯酸酯化合物。多官能(甲基)丙烯酸酯化合物,為於分子中具有至少2個,較佳具有至少3個(甲基)丙烯氧基之化合物,具體可列舉出丙烯酸胺甲酸乙酯、丙烯酸環氧酯、由多元醇與(甲基)丙烯酸所得之酯化合物等。此等當中,考量到兼顧對基材之緊密性及表面硬度兩者,較佳為由多元醇與(甲基)丙烯酸所得之酯化合物。此外,1分子中之(甲基)丙烯氧基的數目為2~10,較佳為3~6,尤佳為3或4。
上述丙烯酸胺甲酸乙酯的具體例,可列舉出
使含羥基的(甲基)丙烯酸酯與聚異氰酸酯反應而得之化合物等。上述含羥基的(甲基)丙烯酸酯,例如可列舉出(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸羥己酯、三丙烯酸新戊四醇酯、五丙烯酸二新戊四醇酯、二丙烯酸三羥甲基丙烷酯等。此等含羥基的(甲基)丙烯酸酯可單獨使用1種或組合2種以上使用。
上述聚異氰酸酯,可為脂肪族系、芳香族系及脂環型系中的任一種聚異氰酸酯,例如可列舉出亞甲二異氰酸酯、四亞甲二異氰酸酯、六亞甲二異氰酸酯、2,2,4-三甲基六亞甲二異氰酸酯、異佛爾酮二異氰酸酯、二甲苯二異氰酸酯、二環己甲烷二異氰酸酯、甲苯二異氰酸酯、苯二異氰酸酯、亞甲聯苯二異氰酸酯等。此等聚異氰酸酯可單獨使用1種或組合2種以上使用。此等聚異氰酸酯中,較適合為可成為無黃變胺甲酸乙酯者。
市售的胺甲酸乙酯低聚物,可列舉出EB2ECRYL220(Daicel Cytec公司製);Art Resin UN-3320HA、該UN-3320HB、該UN-3320HC、該UN-330、該UN-901T(以上為根上工業股份有限公司製);NK Oligo U-4HA、該U-6HA、該U-324A、該U-15HA、該U-108A、該U-200AX、該U-122P、該U-5201、該U-340AX、該U-511、該U-512、該U-311、該UA-W1、該UA-W2、該UA-W3、該UA-W4、該UA-4000、該UA-100(以上為新中村化學股份有限公司製);紫光UV-
1400B、該UV-1700B、該UV-6300B、該UV-7550B、該UV-7600B、該UV-7605B、該UV-7610B、該UV-7620EA、該UV-7630B、該UV-7640B、該UV-6630B、該UV-7000B、該UV-7510B、該UV-7461TE、該UV-3000B、該UV-3200B、該UV-3210EA、該UV-3310B、該UV-3500BA、該UV-3520TL、該UV-3700B、該UV-6100B、該UV-6640B(以上為日本合成化學工業股份有限公司製)等。
上述丙烯酸環氧酯,一般可列舉出使聚環氧化合物(或環氧樹脂)與丙烯酸酯化而得者。丙烯酸環氧酯的具體例,可列舉出藉由各種雙酚(雙酚A、雙酚S、雙酚F等)與表氯醇與丙烯酸之反應所合成之雙酚型丙烯酸環氧酯,以及藉由酚-酚醛與表氯醇與丙烯酸之反應所合成之酚-酚醛型丙烯酸環氧酯等。
上述多元醇,可列舉出甘油、丁四醇、新戊四醇、三羥甲基乙烷、三羥甲基丙烷、二新戊四醇、二(三羥甲基)丙烷等。
上述由多元醇與(甲基)丙烯酸所得之酯化合物的具體例,可列舉出四丙烯酸新戊四醇酯、四甲基丙烯酸新戊四醇酯、三丙烯酸新戊四醇酯、三甲基丙烯酸新戊四醇酯、六丙烯酸二新戊四醇酯、六甲基丙烯酸二新戊四醇酯、五丙烯酸二新戊四醇酯、五甲基丙烯酸二新戊四醇酯、三丙烯酸三羥甲基乙烷酯、三甲基丙烯酸三羥甲基乙烷酯、三丙烯酸三羥甲基丙烷酯、三甲基丙烯酸三羥甲
基丙烷酯、四丙烯酸二(三羥甲基)丙烷酯及四甲基丙烯酸二(三羥甲基)丙烷酯等。
上述由多元醇與(甲基)丙烯酸所得之酯化合物,可容易從市售品中取得,該具體例,例如可列舉出KAYARAD T-1420、該DPHA、該DPHA-2C、該D-310、該D-330、該DPCA-20、該DPCA-30、該DPCA-60、該DPCA-120、該DN-0075、該DN-2475、該R-526、該NPGDA、該PEG400DA、該MANDA、該R-167、該HX-220、該HX620、該R-551、該R-712、該R-604、該R-684、該GPO-303、該TMPTA、該THE-330、該TPA-320、該TPA-330、該PET-30、該RP-1040(以上為日本化藥股份有限公司製);Aronix M-210、該M-240、該M-6200、該M-309、該M-400、該M-402、該M-405、該M-450、該M-7100、該M-8030、該M-8060、該M-1310、該M-1600、該M-1960、該M-8100、該M-8530、該M-8560、該M-9050(以上為東亞合成股份有限公司製);Viscoat 295、該300、該360、該GPT、該3PA、該400、該260、該312、該335HP(以上為大阪有機化學工業股份有限公司製)等。
(C)成分的含量,相對於(A)成分100質量份,較佳為10~300質量份,尤佳為20~200質量份,更佳為50~150質量份。當該含量過小時,硬化膜的硬度特性降低,該含量過大時,緊密性與柔軟性的特性降低,容易產生龜裂。多官能(甲基)丙烯酸酯化合物可單獨使用
1種或組合2種以上使用。
本發明之組成物,係在溶解於溶劑之溶液狀態下使用。此時所使用之溶劑,只要可溶解上述(A)~(C)成分,且在進一步含有後述(E)成分、(F)成分、(G)成分、(H)成分及其他添加劑時亦可溶解此等成分者即可,並無特別限定。
溶劑的具體例,可列舉出甲苯、二甲苯、丁酮、乙二醇單甲醚、乙二醇單甲醚乙酸酯、乙二醇單***、乙二醇二***、乙二醇單***乙酸酯、乙二醇異丙醚、乙二醇單乙酸酯、二乙二醇甲基***、丙二醇單甲醚、丙二醇單***、1,1,2-三氯乙烷、1,1,1,2-四氯乙烷、1,1,2,2-四氯乙烷、甲基苯醚、1,4-二噁烷、二乙基縮醛、丁醇、2-丁醇、異戊醇、甲基丙酮、甲基丁酮、甲基異丁酮、二乙酮、乙基正丁酮、二正丙酮、乙酸異丁酯、丙酸正丁酯、癸烷、十二烷、對孟烷、二戊烯、乙二醇、乙二醇單丁醚、乙二醇二丁醚、乙二醇單丁醚乙酸酯、乙二醇單苯醚、乙二醇單苄醚、乙二醇單己醚、甲氧基甲氧乙烷、乙二醇二乙酸酯、二乙二醇、二乙二醇單甲醚、二乙二醇單***、二乙二醇單***乙酸酯、二乙二醇單丁醚、二乙二醇單丁醚乙酸酯、二乙二醇二甲醚、二乙二醇二***、二乙二醇二丁醚、二乙二醇單己醚、二乙二醇單苯醚、二乙二醇單苄醚、二乙二醇乙酸酯、三乙二醇單甲
醚、二氯化三甘醇、丙二醇、丙二醇單丁醚、1-丁氧基乙氧丙醇、二丙二醇、二丙二醇單甲醚、二丙二醇單***、三丙二醇單丁醚、三丙二醇單甲醚、二丙二醇單丁醚、1,3-丙二醇、1,3-丁二醇、2,3-丁二醇、1,5-戊二醇、己二醇、辛二醇、甘油、六氯乙烷、鄰二氯苯、間二氯苯、對二氯苯、1,2,4-三氯苯、鄰二溴苯、二氯***、二異戊醚、正己醚、乙基苯醚、乙基苄醚、桉醚、1-辛醇、2-辛醇、2-乙基己醇、3,5,5-三甲基己醇、壬醇、正癸醇、三甲基壬醇、2-甲基環己醇、苄醇、糠醇、四氫糠醇、α-松油醇、松脂醇、丙酮基丙酮、佛爾酮、異佛爾酮、苯乙酮、乙酸甲氧丁酯、乙酸2-乙基己酯、乙酸環己酯、乙酸甲基環己酯、乙酸苄酯、乙酸異戊酯、硬脂酸丁酯、乙醯丁酸乙酯、異戊酸異戊酯、乳酸正丁酯、乳酸異丁酯、乳酸正戊酯、乳酸異戊酯、苯甲酸甲酯、苯甲酸乙酯、苯甲酸丙酯、柳酸甲酯、草酸二丁酯、丙二酸二乙酯、丁酸酐、戊酸、異戊酸、己酸、辛酸、2-乙基己酸、三氯乙酸、乳酸、硝基苯、苯甲腈、α-三腈、N-甲基甲醯胺、N-甲基乙醯胺、2-吡咯啶酮等。
上述溶劑可單獨使用1種或組合2種以上使用。此外,亦可直接使用使(A)成分聚合時所使用之溶劑。
上述溶劑,從印刷性之觀點來看,沸點較佳為150℃以上,尤佳為180℃以上,更佳為200℃以上。此溶劑特佳為二乙二醇單甲醚、二乙二醇單***、二乙二
醇單***乙酸酯、二乙二醇單丁醚、二乙二醇單丁醚乙酸酯、二乙二醇二甲醚、二乙二醇二***、二乙二醇二丁醚、二乙二醇單己醚、三乙二醇單丁醚、丙二醇單丁醚、二丙二醇、二丙二醇單甲醚、二丙二醇單***、二乙二醇單苯醚、乙二醇單苄醚、二乙二醇單苄醚等。
當混合2種以上的溶劑使用時,至少1種的沸點較佳為150℃以上,尤佳為180℃以上,更佳為200℃以上。
上述溶劑的量,較佳係使本發明之組成物中的固體成分濃度成為1~95質量%之量,尤佳為固體成分濃度成為5~90質量%之量,更佳為固體成分濃度成為10~85質量%之量。在此,固體成分,為從本發明之硬化膜形成用樹脂組成物的全部成分中扣除(D)溶劑者。
本發明之硬化膜形成用樹脂組成物,係含有上述(A)~(D)成分,亦可因應必要進一步含有:(E)離子捕集劑,(F)自由基聚合起始劑,(G)多官能硫醇化合物,及/或(H)聚合禁止劑。
(E)成分為離子捕集劑,當於基板上形成有金屬配線時,乃具有防止因該金屬配線與水接觸而引起遷移之作用。該離子捕集劑,較佳為於結構中具有未配對電子之具
有螯合能之化合物,例如可列舉出N,N’-雙[3-(3,5-二(三級丁基)-4-羥苯基)丙醯基]肼(Irganox MD1024、BASF公司製)、草酸雙(苯亞甲醯肼)(Eastman Inhibitor OABH、Eastman Chemical公司製)、苯并***、5-甲基苯并***等。此等可從市售品中取得。此外,其他市售品可列舉出Adeka Stab CDA-1(旭電化股份有限公司製)、Adeka Stab CDA-6(旭電化股份有限公司製)、Qunox(Mitsui Toatsu Fine股份有限公司製)、Naugard XL-1(Uniroyal股份有限公司製)等。此等當中,特佳為5-甲基苯并***。
上述離子捕集劑的添加量,相對於(A)成分100質量份,較佳為0.0001~20質量份,尤佳為0.001~10質量份。當未達0.0001質量份時,有時無法得到金屬配線的保護效果,超過20質量份時,有時使作為硬化膜的硬度、緊密性等特性降低,且成本上亦較不利。
(F)成分為自由基聚合起始劑,係有益於(C)成分之聚合的起始或促進。(C)成分雖可在高溫下處理而自發性地聚合,但當由於基板可能變質等而無法進行高溫硬化處理時,可藉由添加(F)成分而進行低溫硬化處理或光硬化處理。
自由基聚合起始劑,只要是可釋放出藉由光照射及/或加熱使自由基聚合之物質即可。例如,光自由
基聚合起始劑可列舉出二苯基酮衍生物、咪唑衍生物、雙咪唑衍生物、N-芳基甘胺酸衍生物、有機疊氮化合物、二茂鈦化合物、鋁酸鹽錯合物、有機過氧化物、N-烷氧吡啶鹽、噻吨酮衍生物等。更具體而言,可列舉出二苯基酮、1,3-二(三級丁基二氧羰基)二苯基酮、3,3’,4,4’-四(三級丁基二氧羰基)二苯基酮、3-苯基-5-異噁唑酮、2-巰基苯并咪唑、雙(2,4,5-三苯基)咪唑、2,2-二甲氧基-1,2-二苯基乙烷-1-酮(Irgacure 651、BASF公司製)、1-羥基環己基苯基酮(Irgacure 184、BASF公司製)、2-苄基-2-二甲基胺基-1-(4-嗎啉苯基)-丁烷-1-酮(Irgacure 369、BASF公司製)、雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦(Irgacure 784、BASF公司製)等,但並不限定於此。
除了上述以外,亦可使用市售品,具體可列舉出BASF公司製的Irgacure 500、Irgacure 907、Irgacure 379、Irgacure 819、Irgacure 127、Irgacure 500、Irgacure 754、Irgacure 250、Irgacure 1800、Irgacure 1870、Irgacure OXE01、DAROCUR TPO、DAROCUR 1173;Lambson公司製的Speedcure MBB、Speedcure PBZ、Speedcure ITX、Speedcure CTX、Speedcure EDB、Esacure ONE、Esacure KIP150、Esacure KTO46;日本化藥股份有限公司製的KAYACURE DETX-S、KAYACURE CTX、KAYACURE BMS、KAYACURE DMBI等。
此外,熱自由基聚合起始劑,例如可列舉出
過氧化乙醯、過氧化苯甲醯、過氧化丁酮、過氧化環己酮、過氧化氫、三級丁基過氧化氫、異丙苯過氧化氫、過氧化二(三級丁基)、過氧化二異丙苯、過氧化二月桂醯、三級丁基過氧基乙酸酯、三級丁基過氧基三甲基乙酸酯、三級丁基過氧基-2-乙基己酸酯等之過氧化物類;2,2’-偶氮雙異丁腈、2,2’-偶氮雙(2,4-二甲基戊腈)、(1-苯基乙基)偶氮雙苯基甲烷、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、二甲基2,2’-偶氮雙異丁酸酯、2,2’-偶氮雙(2-甲基丁腈)、1,1’-偶氮雙(1-環己烷羰腈)、2-(胺甲醯基偶氮)異丁腈、2,2’-偶氮雙(2,4,4-三甲基戊烷)、2-苯基偶氮-2,4-二甲基-4-甲氧基戊腈、2,2’-偶氮雙(2-甲基戊烷)等之偶氮系化合物類;過硫酸銨、過硫酸鈉、過硫酸鉀等之過硫酸鹽類等,但並不限定於此。
市售的熱自由基聚合起始劑,例如可列舉出Peroyl IB、Percumyl ND、Peroyl NPP、Peroyl IPP、Peroyl SBP、Perocta ND、Peroyl TCP、Peroyl OPP、Perhexyl ND、Perbutyl ND、Perbutyl NHP、Perhexyl PV、Perbutyl PV、Peroyl 355、Peroyl L、Perocta O、Peroyl SA、Perhexa 250、Perhexyl O、Nyper PMB、Perbutyl O、Nyper BMT、Nyper BW、Perhexa MC、Perhexa TMH、Perhexa HC、Perhexa C、Pertetra A、Perhexyl I、Perbutyl MA、Perbutyl 355、Perbutyl L、Perbutyl I、Perbutyl E、Perhexyl Z、Perhexa 25Z、Perbutyl A、Perhexa 22、Perbutyl Z、Perhexaper V、
Perbutyl P、Percumyl D、Perhexyl D、Perhexa 25B、Perbutyl C、Perbutyl D、Permenta H、Nofuma BC(以上為日油股份有限公司製);V-70、V-65、V-59、V-40、V-30、VA-044、VA-046B、VA-061、V-50、VA-057、VA-086、VF-096、VAm-110、V-601、V-501(以上為和光純藥股份有限公司製);Irgacure(註冊商標)184、369、651、500、819、907、784、2959、CGI1700、CGI1750、CGI1850、CG24-61、Darocure 1116、1173、Lucirin TPO(以上為BASF公司製);Ebecryl P36(以上為UCB公司製);Esacure KIP150、KIP65LT、KIP100F、KT37、KT55、KTO46、KIP75/B(以上為Fratelli Lamberti公司製)等,但並不限定於此。
(F)成分的含量,相對於(A)成分100質量份,較佳為1~20質量份,尤佳為1~15質量份。
本發明之組成物,可因應必要含有(G)成分的多官能硫醇化合物。本發明之組成物所使用之多官能硫醇化合物,較佳為3官能以上的硫醇化合物。多官能硫醇化合物,可作為多元醇、與單官能及/或多官能硫醇化合物之加成反應物而得到。具體的化合物,可列舉出1,3,5-三(3-巰基丙醯氧基乙基)-三聚異氰酸酯、1,3,5-三(3-巰基丁醯氧基乙基)-三聚異氰酸酯(昭和電工股份有限公司製、Karenz MT(註冊商標)NR1)、三羥甲基丙烷三
(3-巰基丙酸酯)等之3官能硫醇化合物;新戊四醇四(3-巰基丙酸酯)、新戊四醇四(3-巰基丁酸酯)(昭和電工股份有限公司製、Karenz MT(註冊商標)PEI)等之4官能硫醇化合物;二新戊四醇六(3-丙酸酯)等之6官能硫醇化合物等。
本發明之組成物中之多官能硫醇化合物的含有率,較佳為全體固體成分中的0.1~8質量%,尤佳為0.8~5質量%。當含有率過大時,有時會使組成物的穩定性、臭氣、緊密性等惡化。
本發明之組成物,可因應必要含有作為(H)成分之聚合禁止劑。上述聚合禁止劑,例如可列舉出2,6-二異丁基酚、3,5-二(三級丁基)酚、3,5-二(三級丁基)甲酚、氫醌、氫醌單甲醚、苯三酚、三級丁基兒茶酚、4-甲氧基-1-萘酚等。
作為(H)成分之聚合禁止劑的含有率,較佳為全體固體成分中的1質量%以下,尤佳為0.5質量%以下。當含有率超過1質量%時,有時會引起硬化不良,使反應不充分。
本發明之組成物,在不損及本發明之效果下,可因應必要進一步含有界面活性劑、消泡劑、流變調整劑、顏
料、染料、保存穩定劑、多元酚或多元羧酸等之溶解促進劑等。
界面活性劑並無特別限定,例如可列舉出氟系界面活性劑、矽系界面活性劑、非離子系界面活性劑等。此類界面活性劑,例如可列舉出Sumitomo 3M股份有限公司製、DIC股份有限公司製、旭硝子股份有限公司製等之市售品。該具體例可列舉出F-Top EF301、EF303、EF352(Mitsubishi Materials Electronic Chemicals股份有限公司製)、Megafac F171、F173(DIC股份有限公司製)、Fluorad FC430、FC431(Sumitomo 3M股份有限公司製)、Asahi Guard AG710、Surflon S-382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子股份有限公司製)等之氟系界面活性劑。
消泡劑可列舉出炔屬二醇類、聚矽氧流體及乳劑、環氧化或丙氧化聚矽氧類、烴類、脂肪酸酯衍生物、乙醯化聚醯亞胺類、聚(環氧烷)聚合物類及共聚物類等,但並不限定於此等。當進行網版印刷時,本發明之組成物較佳係含有消泡劑。
本發明之組成物的調製方法並無特別限定。例子之一,可列舉出將(A)成分溶解於(D)溶劑,並以既定比率將(B)成分、(C)成分混合於該溶液,而形成均一溶液之方法。此外,亦可列舉出在該調製方法的適當階
段中,可因應必要進一步添加(E)成分、(F)成分、(G)成分、(H)成分及/或其他成分而混合之調製方法。
於本發明之組成物的調製時,可直接使用溶液中藉由聚合反應所得之(A)成分的溶液。此時,在與上述相同地將(B)成分、(C)成分,以及因應必要之(E)成分、(F)成分等投入於該(A)成分的溶液而形成均一溶液時,以濃度調整為目的,可追加投入(D)溶劑。此時,於(A)成分的合成過程中所使用之溶劑、以及組成物的調製用於濃度調整之(D)溶劑,可為相同或相異。
如此調製之溶液狀態的硬化膜形成用樹脂組成物,較佳係使用孔徑約0.2μm的過濾器等進行過濾後使用。
本發明之組成物,從塗佈性之觀點來看,於25℃的黏度較佳為1~10,000mPa.s,尤佳為1~5,000mPa.s,更佳為1~1,000mPa.s。當黏度過低時,有時無法得到目的的膜厚,黏度過高時,塗佈性有時會降低。
本發明之組成物,從印刷性之觀點來看,於25℃的黏度較佳為10~100,000mPa.s,尤佳為500~100,000mPa.s,更佳為1000~100,000mPa.s。當黏度過低時,塗佈後組成物會擴散,有時無法得到期望的圖型,黏度過高時,由於吐出性降低等,有時對步驟造成負荷,或是組成物轉印至基板之轉印性降低。
此外,當藉由網版印刷、凹版平版印刷等之印刷法,將用以構成橋接構造之絕緣膜般的細微構造形成於觸控面板中之X軸電極及Y軸電極正交之部分時,本發明之組成物之於25℃的黏度較佳為10~100,000mPa.s,尤佳為5,000~100,000mPa.s,更佳為20,000~100,000mPa.s。當黏度過低時,塗佈後組成物會擴散,有時無法形成期望的圖型,黏度過高時,由於吐出性降低等,有時對步驟造成負荷,或是組成物轉印至基板之轉印性降低。
本發明中,黏度為依據E型黏度計的測定值。
藉由旋轉塗佈、流動塗佈、輥塗佈、狹縫塗佈、接續於狹縫塗佈之旋轉塗佈、噴墨塗佈、網版印刷、凹版平版印刷等之印刷法等,將本發明之硬化膜形成用樹脂組成物塗佈於基板(例如矽/二氧化矽被覆基板;氮化矽基板;被覆鋁、鉬、鉻等金屬之基板;玻璃基板;石英基板;ITO基板;ITO薄膜基板;TAC薄膜、聚酯薄膜、丙烯酸薄膜等之樹脂薄膜基板)等上方,然後以加熱板或烘烤爐等進行預備烘烤(預烘烤),藉此可形成塗膜。本發明之組成物,特別適合於網版印刷、凹版平版印刷等之印刷法。
預烘烤一般係採用下列方法,亦即較佳於60℃~150℃,尤佳於80℃~120℃,且在使用加熱板時進行
0.5~30分鐘,使用烘烤爐時進行0.5~90分鐘之處理。
接著進行用於熱硬化之後烘烤。具體而言,係使用加熱板、烘烤爐等。後烘烤一般係採用下列方法,亦即較佳於150℃~300℃,尤佳於200℃~250℃,且在使用加熱板時進行1~30分鐘,使用烘烤爐時進行1~90分鐘之處理。
當本發明之硬化膜形成用樹脂組成物含有熱自由基聚合起始劑時,可在低溫下硬化。此時預烘烤條件可與上述相同,但後烘烤溫度較佳為60℃~200℃,尤佳為80℃~150℃。其他條件與上述相同。
此外,當本發明之硬化膜形成用樹脂組成物含有光自由基聚合起始劑時,預烘烤後,藉由將紫外線照射在上述塗膜,可進行光硬化。紫外線,於波長200~500nm的範圍中,該曝光量較佳為100~5,000mJ/cm2。
光硬化後,進行用於熱硬化之後烘烤。具體而言,係使用加熱板、烘烤爐等。後烘烤一般係採用下列方法,亦即較佳於60℃~150℃,尤佳於80℃~120℃,且在使用加熱板時進行1~30分鐘,使用烘烤爐時進行1~90分鐘之處理。
依據上述條件使本發明之組成物硬化,藉此可使基板的階差充分地平坦化,而形成具有高透明性之硬化膜。
本發明之硬化膜,由於具有至少為必要水準
之平坦化性、硬度及緊密性,因此有用於作為形成薄膜電晶體(TFT)型液晶顯示元件、有機EL元件等之各種顯示器中的保護膜、平坦化膜、絕緣膜等,以及觸控面板中的保護膜、絕緣膜等的硬化膜之材料。此外,由於柔軟性亦優異,故亦適合作為ITO薄膜用的保護膜材料。
以下係列舉出合成例、實施例及比較例來更詳細說明本發明,但本發明並不限定於此等實施例。合成例中所得到之共聚合物的重量平均分子量(Mw),係使用昭和電工股份有限公司製GPC裝置(Shodex GPC-101)(管柱:Shodex(註冊商標)KF803L及KF804L(昭和電工股份有限公司製)),並在以流量1mL/分使溶出溶劑四氫呋喃流通於管柱而溶離之條件下進行測定。Mw是由聚苯乙烯換算值所表示。
此外,下列合成例、實施例、比較例中所使用之試藥及裝置如下所述。
‧DEGMEA:二乙二醇單***乙酸酯、DEGMHE:二乙二醇單己醚、MEK:丁酮、MMA:甲基丙烯酸甲酯、MMA:甲基丙烯酸、ST:苯乙烯、tBuST:4-三級丁基苯乙烯,東京化成工業股份有限公司製。
‧TEGMBuE:三乙二醇單丁醚,和光純藥股份有限公司製。
‧MAIB:2,2’-偶氮雙(異丁酸)二甲酯,東京化成
工業股份有限公司製。
‧PET-30:(三/四)丙烯酸新戊四醇酯,日本化藥股份有限公司製。
‧DPHA:(六/五)丙烯酸二新戊四醇酯,日本化藥股份有限公司製。
‧5-MBT:5-甲基苯并***,東京化成工業股份有限公司製。
‧IRG500:光聚合起始劑,BASF公司製Irgacure 500。
‧IRG651:光聚合起始劑,BASF公司製Irgacure 651。
‧APS:3-胺乙基三乙氧矽烷,信越化學工業股份有限公司製LS-3150。
‧UPS:3-脲丙基三乙氧矽烷,Toray Dow-Corning股份有限公司製AY43-031。
‧MPMS:3-甲基丙烯氧基丙基三甲氧矽烷,Momentive Performance Materials Japan公司製A-174。
‧AGITAN771:消泡劑,MUNZING公司製。
‧攪拌裝置:Thinky股份有限公司製THINKY MIXER ARE-310。
‧Z320:Daicel Cytec股份有限公司製Cyclomer P。
將DEGMEA 532.0g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於70℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 280.0g、MAA 30.1g、ST 36.5g及MAIB 8.1g的混合液滴入於此。滴入後再於70℃反應20小時,而得到樹脂溶液P1。Mw=約5萬。
將DEGMEA 537.1g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於70℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 350.0g及MAIB 8.1g的混合液滴入於此。滴入後再於70℃反應20小時,而得到樹脂溶液P2。Mw=約5萬。
將DEGMHE 571.0g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於70℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 240.0g、MAA 25.8g、ST 31.3g及MAIB 10.4g的混合液滴入於此。滴入後再於70℃反應20小時,而得到樹脂溶液P3。Mw=約4萬。
將TEGMBuE 694.8g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於70℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 140.0g、MAA 15.0g、ST 18.3g及MAIB
0.4g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P4。Mw=約17萬。
將MEK 577.4g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於70℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 250.0g、MAA 26.9g、ST 32.6g及MAIB 1.4g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P5。Mw=約8萬。
將DEGMEA 570.0g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於80℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 300.0g、MAA 32.2g、ST 39.2g及MAIB 8.6g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P6。Mw=約3萬。
將DEGMEA 540.2g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於80℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 300.0g、MAA 15.2g、ST 36.8g及MAIB 7.7g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P7。Mw=約3萬。
將DEGMEA 460.3g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於80℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 300.0g及MAIB 6.8g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P8。Mw=約3萬。
將DEGMEA 452.1g裝入於1,000mL的四頸燒瓶,於氮氣氛圍中,一邊於80℃(內溫)攪拌,一邊於2小時內緩慢地將MMA 200.0g、MAA 49.1g、tBuST 45.7g及MAIB 6.6g的混合液滴入於此。滴入後再於80℃反應20小時,而得到樹脂溶液P9。Mw=約3萬。
上述合成例中所得到之各樹脂的組成比如第1表所示。
將合成例1中得到之樹脂溶液P1 58.0g、DPHA 25.5g、UPS 0.23g及DEGMEA 16.2g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例2中得到之樹脂溶液P2 58.0g、DPHA 25.5g、UPS 0.23g及DEGMEA 16.2g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例3中得到之樹脂溶液P3 67.7g、DPHA 26.1g、UPS 0.24g及DEGMHE 6.0g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例3中得到之樹脂溶液P3 58.2g、DPHA 22.4g、UPS 0.20g及DEGMHE 19.2g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例4中得到之樹脂溶液P4 64.3g、DPHA 14.1g、UPS 0.13g及TEGMBuE 21.4g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例3中得到之樹脂溶液P3 67.3g、DPHA 21.2g、UPS 0.24g及DEGMHE 11.3g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例3中得到之樹脂溶液P3 55.7g、DPHA 25.3g、UPS 0.19g及DEGMHE 18.8g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例5中得到之樹脂溶液P5 58.0g、DPHA 25.5g、UPS 0.23g及MEK 16.2g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.8g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、APS 0.11g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.7g、PET-30 23.6g、IRG500 2.6g、5-MBT 1.1g、APS 0.21g、AGITAN771 0.04g及DEGMEA 18.8g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.9g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、UPS 0.02g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.8g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、UPS 0.11g、
AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.9g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、MPMS 0.02g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.8g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、MPMS 0.11g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例7中得到之樹脂溶液P7 53.9g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、APS 0.02g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例8中得到之樹脂溶液P8 53.9g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、APS 0.02g、AGITAN771 0.04g及DEGMEA 18.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 55.1g、PET-30 24.3g、IRG651 1.31g、5-MBT 1.3g、APS 0.02g、AGITAN771 0.04g及DEGMEA 17.9g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 55.6g、PET-30 24.5g、IRG651 0.89g、5-MBT 1.3g、APS 0.02g、AGITAN771 0.04g及DEGMEA 17.6g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例9中得到之樹脂溶液P9 58.9g、DPHA
21.2g、IRG500 2.83g、5-MBT 1.2g、APS 0.24g、AGITAN771 0.04g及DEGMEA 15.7g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例9中得到之樹脂溶液P9 53.7g、DPHA 23.6g、IRG500 2.58g、5-MBT 1.1g、APS 0.21g、AGITAN771 0.04g及DEGMEA 18.8g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例1中得到之樹脂溶液P1 99.0g、UPS 0.40g及DEGMEA 0.59g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 53.9g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、AGITAN771 0.04g及DEGMEA 18.6g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將Z320 21.6g、PET-30 23.7g、IRG500 2.6g、5-MBT 1.1g、APS 0.02g、AGITAN771 0.04g及DEGMEA 51.0g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將Z320 41.8g、IRG500 5.0g、5-MBT 2.1g、APS 0.04g、AGITAN771 0.04g及DEGMEA 51.0g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將PET-30 78.7g、IRG500 9.5g、5-MBT 3.9及APS 0.08g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將合成例6中得到之樹脂溶液P6 93.5g、IRG500 4.49g、5-MBT 1.9g、APS 0.19g、AGITAN771 0.04g及DEGMEA 0.1g裝入於200mL的塑膠容器,並將此裝入於攪拌裝置,以2,000rpm攪拌10分鐘而製作出清漆。
將實施例1~8及比較例1中所製作之清漆的組成彙總顯示於第2表。此外,將實施例9~20及比較例
2~6中所製作之清漆的組成彙總顯示於第3表。
以使厚度成為約3~10μm之方式,藉由棒塗佈機將
實施例1~8及比較例1的清漆分別塗佈於附有ITO之玻璃上,首先於110℃進行2分鐘的預烘烤。接著於230℃進行30分鐘的後烘烤,而製作出硬化膜。
對所得之硬化膜,藉由下列方法進行鉛筆硬度、緊密性、透明性的評估。此外,對實施例3~5的清漆所進行之黏度的測定以及對實施例3~5、8的清漆所進行之印刷性的評估,分別藉由下列方法來進行。結果如第4表所示。
此外,以使厚度成為約3~10μm之方式,藉由棒塗佈機將實施例9~20及比較例2~6的清漆分別塗佈於三容真空股份有限公司製的ITO薄膜(電阻膜(高穿透)ITO薄膜、電阻值:400±100Ω/sq、總透光率:>90%)上,首先於110℃進行10分鐘的預烘烤。接著進行UV照射(400mJ/cm2),然後於110℃進行50分鐘的後烘烤,而製作出硬化膜。
對所得之硬化膜,藉由下列方法進行鉛筆硬度、緊密性、柔軟性的評估。結果如第5表所示。
依據JIS K 5400,以1,000g的荷重進行測定。
藉由橫切試驗方法來評估。首先使用刀具導軌,於塗佈膜上製作出100個棋盤方格。接著將Nichiban股份有限公司製的玻璃紙膠帶黏接於該棋盤方格上,以橡皮擦從
上方強力擦拭,使其充分地緊密接觸。然後將玻璃紙膠帶剝離,算出此時於100個棋盤方格中剝離幾個來進行評估。
0B:66個以上剝離
1B:36個~65個剝離
2B:16個~35個剝離
3B:6個~15個剝離
4B:1個~5個剝離
5B:無剝離
使用Micro-Tec股份有限公司製的MT-320TVC,藉由網版印刷法將實施例3的清漆印刷於附有ITO之玻璃基板上。此外,使用Komura Tech股份有限公司製的Smart Labo-III,藉由凹版平版印刷將實施例4、5及8的清漆印刷於附有ITO之玻璃基板上。以光學顯微鏡來觀察所得之附有ITO之玻璃基板上的圖型(縱20μm、橫20μm)。以目視來觀察無圖型的滲出等且可完整的印刷者為○。結果如第4表所示。
藉由東機產業股份有限公司製的TVE-20LT、TVE-20HT,對實施例3~5的清漆測定黏度(mPa.s)。結果如第4表所示。
使用島津製作所股份有限公司製的UV-3100PC,測定出使用實施例1~7及比較例1的清漆所製作之上述硬化膜的紫外線可見光吸收光譜,並評估波長400nm時的穿透率。結果如第4表所示。
以塗佈側為外側,沿著直徑3cm的圓柱,將使用實施例9~20及比較例2~6的清漆所製作之上述薄膜固定15秒。觀察塗膜外觀的變化,以無變化者為○,產生破裂者為×。
從第4表所示之結果中,可得知從實施例1~8的硬化膜形成用樹脂組成物所得之硬化膜,鉛筆硬度均為較高之H以上,緊密性亦為較高的4B以上。此外,實施
例3~5的硬化膜形成用樹脂組成物,具有既定範圍的黏度,且印刷性亦良好。惟關於實施例8,緊密性、硬度雖良好,但由於使用低沸點溶劑,所以印刷性低。
關於比較例1,其鉛筆硬度為較低之未達B。
從第5表所示之結果中,可得知從實施例9~20的硬化膜形成用樹脂組成物所得之硬化膜,鉛筆硬度均為較高之2H以上,緊密性亦為較高的3B以上,柔軟性亦良好。
另一方面,關於比較例2~6,其緊密性為較低的1B以下,關於比較例4、5,柔軟性亦低。此外,關於比較例6,其鉛筆硬度為較低之未達B。
Claims (15)
- 一種硬化膜形成用樹脂組成物,其特徵係含有:(A)含有由下列式(1)~(3)表示之重複單位之(共)聚合物,
- 如請求項1之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自四丙烯酸新戊四醇酯、四甲基丙烯酸新戊四醇酯、三丙烯酸新戊四醇酯、三甲基丙烯酸新戊四醇酯、六丙烯酸二新戊四醇酯、六甲基丙烯酸二新戊四醇酯、五丙烯酸二新戊四醇酯、五甲基丙烯酸二新戊四醇酯、三丙烯酸三羥甲基乙烷酯、三甲基丙烯酸三羥甲基乙烷酯、三丙烯酸三羥甲基丙 烷酯、三甲基丙烯酸三羥甲基丙烷酯、四丙烯酸二(三羥甲基)丙烷酯及四甲基丙烯酸二(三羥甲基)丙烷酯中之至少1種。
- 如請求項2之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自四丙烯酸新戊四醇酯、四甲基丙烯酸新戊四醇酯、三丙烯酸新戊四醇酯及三甲基丙烯酸新戊四醇酯中之至少1種。
- 如請求項2之硬化膜形成用樹脂組成物,其中(C)多官能(甲基)丙烯酸酯化合物,係選自六丙烯酸二新戊四醇酯、六甲基丙烯酸二新戊四醇酯、五丙烯酸二新戊四醇酯及五甲基丙烯酸二新戊四醇酯中之至少1種。
- 如請求項1至4中任一項之硬化膜形成用樹脂組成物,其中進一步含有(E)離子捕集劑。
- 如請求項5之硬化膜形成用樹脂組成物,其中(E)離子捕集劑為5-甲基苯并***。
- 如請求項1至6中任一項之硬化膜形成用樹脂組成物,其中於25℃的黏度為1~10,000mPa.s。
- 如請求項1至6中任一項之硬化膜形成用樹脂組成物,其中溶劑的沸點為150℃以上。
- 如請求項8之硬化膜形成用樹脂組成物,其中於25℃的黏度為10~100,000mPa.s。
- 如請求項1至9中任一項之硬化膜形成用樹脂組成物,其中進一步含有(F)自由基聚合起始劑。
- 一種硬化膜之製造方法,其特徵係將如請求項10 之硬化膜形成用樹脂組成物塗佈於基板,並在照射紫外線後,於80~120℃燒結。
- 一種硬化膜,其係使用如請求項1至10中任一項之硬化膜形成用樹脂組成物所得。
- 一種層合體,其係將如請求項12之硬化膜層合於基板上而成。
- 如請求項13之層合體,其中基板為薄膜。
- 一種觸控面板,其係包含如請求項12之硬化膜。
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KR102065717B1 (ko) * | 2016-12-26 | 2020-01-13 | 주식회사 엘지화학 | 편광자 보호 필름, 이를 포함하는 편광판, 상기 편광판을 포함하는 액정 디스플레이 장치, 및 편광자 보호 필름용 코팅 조성물 |
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KR102501061B1 (ko) * | 2018-12-26 | 2023-02-21 | 디아이씨 가부시끼가이샤 | 광학 재료용 수지 조성물, 광학 필름 및 표시 장치 |
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JPH06287470A (ja) * | 1993-04-05 | 1994-10-11 | Mitsubishi Petrochem Co Ltd | 耐摩耗性被覆組成物 |
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JP2011248274A (ja) * | 2010-05-31 | 2011-12-08 | Sanyo Chem Ind Ltd | 感光性樹脂組成物 |
KR101795833B1 (ko) * | 2010-11-02 | 2017-11-10 | 닛폰고세이가가쿠고교 가부시키가이샤 | 아크릴계 수지 조성물, 아크릴계 점착제, 점착 시트, 양면 점착 시트, 투명 전극용 점착제, 터치 패널 및 화상 표시장치, 및 점착제층 함유 적층체의 제조 방법 |
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