TW201423872A - 多層氣體阻障疊層膜 - Google Patents

多層氣體阻障疊層膜 Download PDF

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TW201423872A
TW201423872A TW103108413A TW103108413A TW201423872A TW 201423872 A TW201423872 A TW 201423872A TW 103108413 A TW103108413 A TW 103108413A TW 103108413 A TW103108413 A TW 103108413A TW 201423872 A TW201423872 A TW 201423872A
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organic
gas barrier
inorganic
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layer
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Hsiao-Fen Wei
Liang-You Jiang
Pao-Ming Tsai
Jhen-Hao Jiang
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Ind Tech Res Inst
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Abstract

一種多層氣體阻障疊層膜,包括可撓式基板、多個有機層以及多個無機層。多個有機層配置於可撓式基板上,且多個無機層配置於可撓式基板上。多個有機層以及多個無機層交替堆疊,且多個無機層彼此互相連接。

Description

多層氣體阻障疊層膜
本發明是有關於一種阻障膜及其製造方法,且特別是有關於一種有機/無機多層氣體阻障膜及其製造方法。
由於可撓式基板提供較佳的柔軟性以及設計自由度,可撓式顯示面板變得廣受歡迎且因此快速地取代了硬式顯示面板。相較於硬式基板,可撓式塑膠基板較為便宜、兼具可加工性以及安全性需求,且適合各種顯示介質以及連續捲軸式製程(roll-to-roll process)。然而,其仍具有某些缺點,包括較低的溫度及化學抵抗性、對氧氣及水氣的阻絕性差,以及具較大熱膨脹係數等。一般可撓式塑膠基板的水氣滲透率為100~10g/m2/day(在25℃),其無法完全阻隔水氣與氧氣滲透,從而導致元件損傷。為避免水氣與氧氣滲透,需塗佈特殊的材料在塑膠基板與電子元件之間。此種結構緻密的特殊材料必須在形成薄膜或薄層時無缺陷且無針孔,且為高透光性或對可見光無吸收。一般來說,此種材料可形成單層或多層堆疊結構,以達到氣體阻障的目的。
可撓式氣體阻障膜包括無機層(如金屬氧化物、金屬氮化物或金屬氮氧化物)以及有機層。無機層提供較佳的氣體阻障能力,而有機層可幫助維持阻障膜的可撓性。然而,傳統的氣體阻障結構主要是藉由有機/無機薄膜交替堆疊所製造而成,此結構面臨到最重要的問題即是有機材料與無機材料之間的附著力不佳。若在有機或無機層的表面進行進一步的處理以改善所述有機與無機層之間的附著力,則會增加製造成本。此外,諸如針孔之類的缺陷存在於藉由真空方法所製得的阻障膜中,造成氧氣與水氣之滲透,導致電子元件劣化以及較短的使用壽命。額外的缺點包括真空方法的設備或系統昂貴、良率低,以及大尺寸基板的製作困難。
本發明提出一種用以形成多層氣體阻障疊層膜的製造方法,所述製造方法簡單且直接而成本較低。
本發明提供一種全印製方法,藉由交替形成有機層與無機層以產生多層氣體阻障疊層膜,所述全印製方法可幫助減少針孔的形成。
本發明提供一種多層氣體阻障膜,至少包括可撓式基板、配置於可撓式基板上的多個有機層以及配置於可撓式基板上的多個無機層。多個有機層以及多個無機層交替堆疊,且多個無機層彼此互相連接。
依照本發明的實施例,多層氣體阻障膜,包括可撓式基板、配置於可撓式基板上的多個有機層、配置於該可撓式基板上的多個有機/無機混合層以及配置於可撓式基板上的多個無機層。其中該些有機層各具有一圖案,該些有機層、該些有機/無機混合層以及該些無機層交替堆疊於該可撓式基板上,且該些有機/無機混合層透過填滿該些有機層的該些圖案中的孔洞而與該些無機層彼此互相連接。
依照本發明的實施例,多個有機層各具有圖案,且最為鄰近的兩個有機層的圖案未對齊或互為補償***錯。在此情況下,由於交錯的圖案設計,在阻障膜中的無機材料為立體互相連接,且有機材料夾於無機材料之間,如此改善了阻障膜的可撓性且避免了可能的阻障膜斷裂。
為讓本揭露之上述特徵能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
11‧‧‧有機材料
12‧‧‧模板
20‧‧‧堆疊膜
100、300‧‧‧塑膠基板
100a‧‧‧表面
110、310‧‧‧圖案化有機層
120、320‧‧‧無機層
200‧‧‧基板
210a、210b、210c‧‧‧圖案化有機層
220a、220b、220c‧‧‧無機層
315‧‧‧混合層
330‧‧‧有機層
P‧‧‧網板
S‧‧‧孔洞
圖1A~圖1C繪示依照本發明實施例形成有機層後形成無機層以得到阻障膜的範例方法。
圖2A為本發明一實施例之阻障膜的剖面示意圖。
圖2B為本發明一實施例之阻障膜的上視示意圖。
圖3A~圖3B繪示依照本發明實施例形成混合層以得到阻 障膜的示範方法。
以下將詳細地提及本發明目前的較佳實施方式,其實例以所附圖式說明。在圖示與說明書中,儘可能地使用相同的代號來表示相同或類似的構件。
圖1A~圖1C繪示依照本發明實施例先形成有機層後,再形成無機層以得到阻障膜的範例方法。依照1A的方法流程,提供塑膠基板100(步驟10a)。之後,例如使用網印,以網板P將圖案化有機層110(具有由孔洞S所定義之圖案)塗佈在塑膠基板100的表面100a上(步驟10b)。接著,例如藉由滾輪印刷(roller printing)將無機層120塗佈至圖案化有機層110,填滿圖案化有機層110的孔洞S並覆蓋圖案化有機層110的整個表面(步驟10c)。然後,執行乾燥步驟(步驟10d)以使無機層120乾燥。乾燥步驟可包括紫外光乾燥步驟(UV-dried step)、熱乾燥步驟、空氣乾燥步驟及/或電子束照射步驟(electron-beam irradiation step)。可依照在處理中的產品所需的氣體阻障能力重複數次所述的方法流程,以形成交替堆疊的數個有機層與數個無機層。
依照1B的方法流程,提供塑膠基板100,並提供有機材料11至具有圖案的模板12(步驟10a)。之後,例如使用微壓印(micro-stamping)技術將有機材料11經由模板12轉印至塑膠基板100,在塑膠基板100上形成圖案化有機層110(步驟10b)。接著, 例如藉由刮刀塗佈(Doctor blade coating)或刮刀印刷(squeegee printing)將無機層120塗佈至圖案化有機層110,填滿圖案化有機層110的孔洞S並覆蓋圖案化有機層110的整個表面(步驟10c)。然後,執行乾燥步驟(步驟10d)以使無機層120乾燥。乾燥步驟可包括紫外光乾燥步驟(UV-dried step)、熱乾燥步驟、空氣乾燥步驟及/或電子束照射步驟(electron-beam irradiation step)。可依照在處理中的產品所需的氣體阻障能力重複數次所述的方法流程,以形成交替疊層的數個有機層與數個無機層。
依照1C的方法流程,提供塑膠基板100,並例如藉由旋轉塗佈(spin coating)在塑膠基板100上形成有機層110a(步驟10a)。之後,藉由微影(photolithography)以及濕式蝕刻圖案化有機層110a,以形成塑膠基板100上的圖案化有機層110(步驟10b)。接著,例如藉由刮刀塗佈或刮刀印刷將無機層120塗佈至圖案化有機層110,填滿圖案化有機層110的孔洞S並覆蓋圖案化有機層110的整個表面(步驟10c)。然後,執行乾燥步驟(步驟10d)以使無機層120乾燥。乾燥步驟可包括紫外光乾燥步驟(UV-dried step)、熱乾燥步驟、空氣乾燥步驟及/或電子束照射步驟(electron-beam irradiation step)。可依照在處理中的產品所需的氣體阻障能力重複數次所述的方法流程,以形成交替疊層的數個有機層與數個無機層。
較佳地,本發明的有機層或無機層中的任一層是藉由所謂的全印製方法所形成。全印製方法可包括網印技術、刮刀塗佈 (未使用網板)、刮刀印刷、滾輪塗佈、微(或極微)壓印(micro-,nano-imprinting)、旋轉塗佈、噴印、流塗、毛細管塗佈、化學塗佈以及浸泡或沈浸塗佈。所述的全印製方法簡單、成本低,並且能夠在單一步驟中形成具有圖案(或不具有圖案)之單層。由於有機層與無機層的堆疊,先形成之膜層中的針孔可大符地減少,或是可藉由後形成之膜層的流動性所補償。
塑膠基板的材料例如可以是聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)、聚氯乙烯(polyvinylchloride,PVC)、聚醯亞胺(polyimide,PI)或聚乙烯(polyethylene,PE)。
適於用在上述方法中的有機材料可以是大分子(macromolecules)或具有低成膜溫度及高光線透明度的聚合物,例如:光學級聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)、聚對二甲苯(poly-p-xylene)、乙烯一氯三氟乙烯共聚物(ethylene-chlorotrifluoroethylene copolymers)、氟化乙烯丙烯(fluorinated ethylene-propylene)、全氟醚(fluorinated ethers)、四氟乙烯(polytetrafluoroethene)、聚一氯三氟乙烯(polychlorotrifluoroethylene)、聚醯亞胺前驅物(polyimide precursor)、自組裝材料或感光性材料。有機材料中可添加吸收劑或乾燥劑,例如:NaBH4、CaCl2、矽膠(silica gel)以及CaO。有機材料更可添加氧化鋁、氧化鋅或銀的奈米微粒,藉以增加阻障能 力。
適於用在上述方法中的無機材料可以是具有氣體阻障能力的溶膠凝膠材料(sol-gel materials)、氧化矽或金屬氧化物,例如:該金屬氧化物為氧化鈦(TiO2)、氧化錫(SnO2)、氧化鋁(Al2O3)或氧化鋅(ZnO),而該非金屬氧化物為氧化矽(SiO2)。
在層與層之間,用於有機層的有機材料可為相同或不同。同樣地,在層與層之間,用於無機層的無機材料可為相同或不同。
圖2A為本發明一實施例之阻障膜的剖面示意圖,而圖2B為此阻障膜的上視示意圖。
在圖2A中,三層圖案化有機層210a、210b與210c,以及三層無機層220a、220b與220c交替堆疊且配置於基板200上。在堆疊膜20中,無機層220a/220b/220c彼此互相連接且成為立體連續的基底結構。由於藉由印刷方法所形成的圖案化有機層,在堆疊膜中的無機材料互相連接且在整個膜層中變為連續網絡以達到更好的氣體阻障效能。因此,有機與無機層之間的附著力增加,且有機與無機層之間的剝落(peeling)減少。
由圖2B可看出,圖案化有機層210a、210b與210c為交錯配置的圓形團塊。然而,有機層的圖案的形狀或設計並不限於此處所提供的實施例。較佳地,最鄰近的兩個有機層的圖案為彼此錯開或互補。至少,最鄰近的兩個有機層的圖案未對齊或互為交錯。在此情況下,由於交錯的圖案設計,在阻障膜的垂直方 向上,阻障膜中的無機材料並不直接疊在彼此之上,且有機材料夾於無機材料之間,如此改善了阻障膜的可撓性具避免可能的阻障膜斷裂。
宏觀而言,堆疊膜中的無機材料可視為互相連接或交錯的基質或網絡,而分佈在連續的無機材料中之不連貫的有機材料可幫助提高疊層膜的柔軟度以及可撓性。
傳統上,為了提高氣體阻障能力,必須要增加無機層的厚度,或是需要更多的無機層。但是當施加外力時,無機層的厚度越厚就越容易產生微破裂結構。然而,由於在膜層之間的交錯圖案配置,無機層的厚度並未正向地累增,反而因此,水或氧氣的滲透路徑變為曲折且延長,增加滲透困難度。
除了形成有機層後形成無機層以得到阻障膜的範例方法外,可在形成有機層後、以及形成無機層前,形成有機/無機混合層。圖3A~圖3B繪示依照本發明形成混合層以得到阻障膜的範例方法。
依照3A的方法流程,提供塑膠基板300,並在塑膠基板300上形成圖案化有機層310(步驟30a)。接著,藉由狹縫模具式塗佈(slot-die coating)將有機/無機混合層315塗佈至圖案化有機層310,填滿圖案化有機層310的孔洞S並覆蓋圖案化有機層310的整個表面(步驟30b)。之後,執行乾燥步驟(步驟30c)以使混合層315乾燥。然後,在混合層315上塗佈無機層320(步驟30d)。可依照在處理中的產品所需的氣體阻障能力重複數次所述的方法流 程,以形成堆疊膜。有機/無機混合層例如選自含矽、含鈦或含鋁之混合材料。有機/無機混合層可使平坦化有機層,並且有機/無機混合層具有氣體阻障能力。
依照3B的方法流程,採用與3A相同的步驟30a~30c,而在步驟30d中,在混合層315上塗佈另一個有機層330。
實施例:在透明的聚醯亞胺(PI)基板上,將大約1微米厚的有機丙烯酸酯類光阻材料旋轉塗佈至PI基板表面。在90℃軟烤、曝光能量為500mJ/cm2以及220℃硬烤後得到透明有機層。接著,將含矽的溶膠凝膠材料(IC1-200)所構成、大約為300奈米厚的無機層旋轉塗佈在圖案化有機層上,然後在100℃乾燥10分鐘,以及在220℃乾燥30分鐘,以移除溶劑。之後,將大約1微米厚的另一個有機丙烯酸酯類光阻層旋轉塗佈至混合層。在90℃軟烤、曝光能量為500mJ/cm2以及220℃硬烤後形成另一個透明有機層,並且得到疊層膜。在25℃以及相對濕度60%下,所述氣體阻障基板所具有的水氣滲透速率(WVTR)值為1×10-1g/m2/day。
本發明所提供的方法較佳地應用全印製方法來製造有機/無機多層氣體阻障膜。由於單一的印刷步驟能夠同時達到圖案化與塗佈,因此簡化了方法且成本較低。藉由有機層的圖案設計(例如交錯圖案)以及圖案化有機層與鄰近的無機層交替或互補的配置,層與層之間的無機層互相連接,並且延長了氣體的垂直擴散路徑,從而改善了氣體阻障效能。此外,連續的無機材料基底減輕了不同材料層之間的剝落,更提高了有機與無機層之間的附著 力。
藉由使用全印製方法,可較容易製造應用於可撓式基板的大尺寸氣體阻障膜。並且,所述方法可提高可撓式基板的氣體阻障能力與可撓性,而應用於可撓式觸控面板。
相較於一般製程常使用的真空方法,本發明所使用的材料或是工作裝置/設備的成本均較低。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100‧‧‧塑膠基板
100a‧‧‧表面
110‧‧‧圖案化有機層
120‧‧‧無機層
P‧‧‧網板
S‧‧‧孔洞

Claims (11)

  1. 一種多層氣體阻障疊層膜,包括:一可撓式基板;多個有機層,配置於該可撓式基板上,其中該些有機層各具有一圖案;多個有機/無機混合層,配置於該可撓式基板上;以及多個無機層,配置於該可撓式基板上,其中該些有機層、該些有機/無機混合層以及該些無機層交替堆疊於該可撓式基板上,且該些有機/無機混合層透過填滿該些有機層的該些圖案中的孔洞並覆蓋該些有機層而與該些無機層彼此互相連接。
  2. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中一個該有機層的該圖案不同於最為鄰近的另一個該有機層的該圖案。
  3. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中一個該有機層的該圖案與最為鄰近的另一個該有機層的該圖案為交錯配置。
  4. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中該有機/無機混合層材料包括含矽、含鈦或含鋁之混合材料。
  5. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中該有機層的材料為一大分子或一聚合物材料。
  6. 如申請專利範圍第5項所述之多層氣體阻障疊層膜,其中 該聚合物材料為光學級聚甲基丙烯酸甲酯、聚對二甲苯、乙烯一氯三氟乙烯共聚物、氟化乙烯丙烯、全氟醚、四氟乙烯、聚一氯三氟乙烯、聚醯亞胺前驅物、自組裝材料或感光性材料。
  7. 如申請專利範圍第5項所述之多層氣體阻障疊層膜,其中該有機層材料更包括氧化鋁、氧化鋅或銀之奈米微粒。
  8. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中該無機層的材料為溶膠凝膠材料。
  9. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中該無機層的材料包括一金屬氧化物或一非金屬氧化物。
  10. 如申請專利範圍第9項所述之多層氣體阻障疊層膜,其中該金屬氧化物為氧化鈦(TiO2)、氧化錫(SnO2)、氧化鋁(Al2O3)或氧化鋅(ZnO),而該非金屬氧化物為氧化矽(SiO2)。
  11. 如申請專利範圍第1項所述之多層氣體阻障疊層膜,其中該可撓式基板的材料為聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、聚甲基丙烯酸甲酯(PMMA)、聚氯乙烯(PVC)、聚醯亞胺(PI)或聚乙烯(PE)。
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