TW201419108A - Method for forming transparent conductive pattern, method for manufacturing touch panel, and conductive transfer film - Google Patents
Method for forming transparent conductive pattern, method for manufacturing touch panel, and conductive transfer film Download PDFInfo
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- TW201419108A TW201419108A TW102120791A TW102120791A TW201419108A TW 201419108 A TW201419108 A TW 201419108A TW 102120791 A TW102120791 A TW 102120791A TW 102120791 A TW102120791 A TW 102120791A TW 201419108 A TW201419108 A TW 201419108A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
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- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
Description
本發明係關於透明導電圖樣之形成方法、觸摸屏之製造方法和導電轉印膜。 The present invention relates to a method of forming a transparent conductive pattern, a method of manufacturing a touch panel, and an electrically conductive transfer film.
觸摸屏係可以向顯示器直接進行輸入的輸入裝置，一般設置在顯示器的前面來使用，應為藉由基於藉由顯示器得到的視覺資訊，可以進行直接輸入，故被用於各種用途。 The touch screen is an input device that can directly input to the display, and is generally disposed in front of the display for use. It can be directly input by using visual information obtained by the display, and is used for various purposes.
作為這樣的觸摸屏，廣為人知的有電阻式和電容式。電阻式觸摸屏係對於形成有透明導電膜的上部電極基板和下部電極基板，使得各透明導電膜之間相向設置，藉由在上部電極基板的一點施加力，使得各透明導電膜彼此接觸，據此可進行對施加了力的位置的位置檢測。 As such a touch panel, there are well-known resistive and capacitive types. The resistive touch panel is configured such that the upper conductive substrate and the lower electrode substrate are formed such that the transparent conductive films are disposed to face each other, and the transparent conductive films are brought into contact with each other by applying a force at a point of the upper electrode substrate. Position detection of the position where the force is applied can be performed.
又、電容式係藉由手指接近觸摸屏，檢測觸摸屏之透明電極之靜電容量之變化，來進行位置檢測。 Moreover, the capacitive type detects the change in the electrostatic capacitance of the transparent electrode of the touch screen by a finger approaching the touch screen to perform position detection.
可是，一般而言，觸摸屏被設置在液晶顯示器等顯示裝置上，因而需要高的透光率，因此，ITO(Indium Tin Oxide)等透明導電膜被廣泛應用。又，在電容式觸摸屏等中，需要形成預定形狀之透明導電膜之圖樣。 However, in general, a touch panel is provided on a display device such as a liquid crystal display, and thus a high light transmittance is required. Therefore, a transparent conductive film such as ITO (Indium Tin Oxide) is widely used. Further, in a capacitive touch panel or the like, it is necessary to form a pattern of a transparent conductive film having a predetermined shape.
作為通常的透明導電膜之圖樣之形成方法，參照圖1對塗敷的方法進行說明。 As a method of forming a pattern of a usual transparent conductive film, a method of coating will be described with reference to Fig. 1 .
首先，如圖1(a)所示般，於玻璃或透明膠片等之透明基板910之 表面上使用濺射或真空蒸鍍等形成透明導電膜911。又，也可以預先準備於透明基板910之表面形成了透明導電膜911的附帶透明導電膜之透明基板。 First, as shown in FIG. 1(a), on a transparent substrate 910 such as glass or transparent film. A transparent conductive film 911 is formed on the surface by sputtering, vacuum evaporation, or the like. Further, a transparent substrate with a transparent conductive film in which the transparent conductive film 911 is formed on the surface of the transparent substrate 910 may be prepared in advance.
而後，如圖1(b)所示般，在形成有透明導電膜911的面上塗敷光阻劑920。 Then, as shown in FIG. 1(b), a photoresist 920 is applied on the surface on which the transparent conductive film 911 is formed.
而後、如圖1(c)所示般，在曝光區域，使用具有開口部921a之光罩921，由曝光裝置照射紫外光進行曝光。 Then, as shown in Fig. 1(c), a photomask 921 having an opening portion 921a is used in the exposure region, and ultraviolet light is irradiated by the exposure device to perform exposure.
而後、如圖1(d)所示般，藉由進行顯影形成電阻圖樣920a。具體地說，進行根據曝光裝置的曝光後，使顯影液浸漬來進行顯影(第一次濕製程)，之後，用純淨水進行沖洗，使其乾燥，來形成電阻圖樣920a。 Then, as shown in Fig. 1(d), the resistance pattern 920a is formed by performing development. Specifically, after exposure by the exposure apparatus, development is performed by immersing the developer (first wet process), and then rinsing with pure water and drying to form a resistance pattern 920a.
而後，如圖1(e)所示般，藉由濕法刻蝕，去除沒有形成電阻圖樣920a之區域之透明導電膜911。具體地說，於透明導電膜911之上形成電阻圖樣920a後，藉由使用三氯化鐵等之酸的濕法刻蝕，來去除沒有形成電阻圖樣920a之區域之透明導電膜911(第二次濕製程)，用純淨水進行沖洗並使其乾燥。據此，形成透明導電膜之圖樣911a。 Then, as shown in Fig. 1(e), the transparent conductive film 911 in the region where the resistance pattern 920a is not formed is removed by wet etching. Specifically, after the resistance pattern 920a is formed on the transparent conductive film 911, the transparent conductive film 911 which does not form the region of the resistance pattern 920a is removed by wet etching using an acid such as ferric chloride (second Wet process), rinse with pure water and let it dry. According to this, the pattern 911a of the transparent conductive film is formed.
而後，如圖1(f)所示般，藉由有機溶劑等，去除電阻圖樣920a(第三次濕製程)。 Then, as shown in Fig. 1 (f), the electric resistance pattern 920a (third wet process) is removed by an organic solvent or the like.
又，作為其他透明導電膜之圖樣之形成方法，基於圖2對使用膜式電阻的方法進行說明。 Moreover, as a method of forming a pattern of another transparent conductive film, a method of using a film resistor will be described based on FIG. 2 .
首先，如圖2(a)所示般，首先在玻璃或透明膠片等之透明基板910之表面上藉由濺射或真空蒸鍍等形成透明導電膜911。又，也可以準備預先在透明基板910之表面上形成有透明導電膜911之帶透明導電膜之透明基板。 First, as shown in FIG. 2(a), first, a transparent conductive film 911 is formed on the surface of a transparent substrate 910 such as glass or a transparent film by sputtering or vacuum evaporation. Further, a transparent substrate with a transparent conductive film in which the transparent conductive film 911 is formed on the surface of the transparent substrate 910 in advance may be prepared.
而後，如圖2(b)所示般，於形成有透明導電膜911之面上，黏貼膜式電阻930。 Then, as shown in Fig. 2(b), a film resistor 930 is adhered to the surface on which the transparent conductive film 911 is formed.
而後，如圖2(c)所示般，於被曝光區域使用具有開口部921a之光罩921，藉由曝光裝置照射紫外光來進行曝光。 Then, as shown in FIG. 2(c), the photomask 921 having the opening portion 921a is used in the exposed region, and the exposure is performed by irradiating ultraviolet light with an exposure device.
而後，如圖2(d)所示般，藉由進行顯影，形成電阻圖樣930a。具體地說，由曝光裝置進行曝光後，將其浸漬於顯影液中進行顯影(第一次濕製程)、藉由用純淨水沖洗並使其乾燥，形成電阻圖樣930a。 Then, as shown in Fig. 2(d), the resist pattern 930a is formed by performing development. Specifically, after exposure by an exposure apparatus, it is immersed in a developing solution for development (first wet process), rinsed with pure water, and dried to form a resistance pattern 930a.
而後，如圖2(e)所示般，藉由濕法刻蝕，去除沒有形成電阻圖樣930a之區域之透明導電膜911。具體地說，於透明導電膜911之上形成電阻圖樣930a之後，藉由使用三氯化鐵等之酸的濕法刻蝕，去除沒有形成電阻圖樣930a之區域之透明導電膜911(第二次濕製程)，使用純淨水進行沖洗並使其乾燥。據此，形成透明導電膜之圖樣911a。 Then, as shown in Fig. 2(e), the transparent conductive film 911 in the region where the resistance pattern 930a is not formed is removed by wet etching. Specifically, after the resistance pattern 930a is formed on the transparent conductive film 911, the transparent conductive film 911 in the region where the resistance pattern 930a is not formed is removed by wet etching using an acid such as ferric chloride (second time) Wet process), rinse with pure water and let it dry. According to this, the pattern 911a of the transparent conductive film is formed.
而後、如圖2(f)所示般，藉由有機溶劑等去除電阻圖樣930a(第三次濕製程)。 Then, as shown in Fig. 2(f), the resistance pattern 930a is removed by an organic solvent or the like (third wet process).
專利文獻1：特開平10-148950號公報 Patent Document 1: Japanese Patent Publication No. Hei 10-148950
專利文獻2：特開平6-67428號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 6-67428
專利文獻3：特開2001-133992號公報 Patent Document 3: JP-A-2001-133992
專利文獻4：特開2003-15286號公報 Patent Document 4: JP-A-2003-15286
專利文獻5：特開2010-146283號公報 Patent Document 5: JP-A-2010-146283
然而，在圖1所示之方法和圖2所示之方法中，為了形成透明導電膜之圖樣911a，需要進行3次濕製程，工序複雜，耗費時間，因此，成為成本上升之主要原因。又，由於這樣的濕製程使用酸、鹼、有機溶劑等之液體進行，需要相當之設備，特別地，透明基板910是大型基板之情況下，不可避免帶來設備之大型化。又，在濕法刻蝕或 顯影等之工序中，特別地，在透明基板910為大型基板之情況下，容易產生刻蝕不均或顯影不均等，導致產量低下。 However, in the method shown in FIG. 1 and the method shown in FIG. 2, in order to form the pattern 911a of the transparent conductive film, it is necessary to perform the wet process three times, which is complicated and time consuming, and therefore causes a cost increase. Further, since such a wet process is carried out using a liquid such as an acid, an alkali or an organic solvent, a considerable amount of equipment is required. In particular, when the transparent substrate 910 is a large substrate, the size of the device is inevitably increased. Also, in wet etching or In the process of development or the like, in particular, when the transparent substrate 910 is a large substrate, uneven etching or development unevenness is likely to occur, resulting in a low yield.
本發明是為了解決前述問題而提出的，其目的在於提供一種低成本，容易形成期望之形狀之透明導電膜之圖樣之透明導電圖樣之形成方法，觸摸屏之製造方法和導電轉印膜。 The present invention has been made to solve the above problems, and an object of the invention is to provide a method for forming a transparent conductive pattern which is easy to form a pattern of a transparent conductive film having a desired shape, a method for producing a touch panel, and a conductive transfer film.
根據本發明之一態樣之觀點，將由藉由曝光而感光的電阻層和由透明導電材料形成的導電層按順序層疊的薄膜，以使該電阻層位於基板一側的方式，黏貼於基板之表面上；藉由光罩，使黏貼有由該電阻層和該導電層按順序層疊而成之薄膜的基板曝光；該曝光後，於該導電層上黏貼具有黏附性之薄膜；藉由剝離該黏附性薄膜，與該黏附性薄膜一起去除被該光罩遮光之區域中的該電阻層和該導電層，由留下的該導電膜形成透明導電圖樣。 According to an aspect of the present invention, a film laminated in this order by a resistive layer which is photosensitive by exposure and a conductive layer formed of a transparent conductive material is adhered to the substrate in such a manner that the resistive layer is located on one side of the substrate. Forming a substrate with a film formed by laminating the resistive layer and the conductive layer in sequence by a photomask; after the exposing, attaching an adhesive film to the conductive layer; An adhesive film, together with the adhesive film, removes the resistive layer and the conductive layer in a region shielded by the photomask, and a transparent conductive pattern is formed by the remaining conductive film.
又，根據本發明之一態樣之另一觀點，將由藉由曝光而感光的電阻層、由透明導電材料形成的導電層以及分離膜按順序層疊而成之薄膜，以使該電阻層位於基板一側般地黏貼於該基板之表面上；藉由光罩，將黏貼有按順序層疊該電阻層、該導電層以及該分離膜而成的薄膜之基板曝光；藉由剝離該分離膜，與該分離膜一起去除被該光罩遮光之區域中的該電阻層和該導電層，由留下的該導電膜形成透明導電圖樣。 Further, according to another aspect of an aspect of the present invention, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated to form the resistive layer on the substrate. Adhesively adhering to the surface of the substrate; exposing the substrate to which the film of the resistive layer, the conductive layer and the separation film are sequentially laminated by a photomask; by peeling off the separation film, The separation film together removes the resistance layer and the conductive layer in a region shielded by the reticle, and a transparent conductive pattern is formed from the remaining conductive film.
又，根據本實施態樣之另一觀點，將由藉由曝光而感光之電阻層、由透明導電材料形成之導電層、以及分離膜按順序層疊而成之薄膜，以使該電阻層位於基板一側般地黏貼於基板之表面上；於該分離膜之上，形成遮光之遮光層；從該遮光層形成之面進行曝光；藉由剝離該分離膜，與該分離膜一起去除形成有遮光層之區域中的該電阻層和該導電層，由留下的該導電膜形成透明導電圖樣。 Further, according to another aspect of the present embodiment, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated so that the resistive layer is on the substrate 1. Adhering to the surface of the substrate; forming a light-shielding layer on the separation film; exposing from the surface formed by the light-shielding layer; removing the separation film and removing the light-shielding layer together with the separation film The resistive layer and the conductive layer in the region form a transparent conductive pattern from the remaining conductive film.
又，根據本實施態樣之另一觀點，在由藉由曝光而感光之電阻 層、由透明導電材料形成之導電層、以及分離膜按順序層疊而成之薄膜中，於該分離膜之上形成遮光的遮光層；將由該電阻層、該導電層、以及該分離膜按順序層疊而成之薄膜，以使該電阻層位於基板一側般地黏貼於該基板之表面上；從該遮光層形成之面進行曝光；藉由剝離該分離膜，與該分離膜一起去除形成有遮光層之區域中的該電阻層和該導電層，由留下的該導電膜形成透明導電圖樣。 Moreover, according to another aspect of the embodiment, the resistor is exposed by exposure a layer, a conductive layer formed of a transparent conductive material, and a film in which the separation film is laminated in this order, a light-shielding light-shielding layer is formed on the separation film; the resistive layer, the conductive layer, and the separation film are sequentially arranged Laminating the film so that the resistive layer is adhered to the surface of the substrate on the side of the substrate; exposing from the surface formed by the light shielding layer; removing the separation film and removing the separation film together with the separation film The resistive layer and the conductive layer in the region of the light shielding layer form a transparent conductive pattern from the remaining conductive film.
又、根據本實施態樣之另一觀點，在由藉由曝光而感光之電阻層、由透明導電材料形成之導電層、以及分離膜按順序層疊，且該電阻層黏貼於基板上的導電型轉印膜中，曝光之前該電阻層和該基板之間的黏合強度比該分離膜和該導電層之間的黏合強度低，曝光之後該電阻層和該基板之間的黏合強度比該分離膜和該導電層之間的黏合強度高。 Further, according to another aspect of the present embodiment, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated, and the resistive layer is adhered to the conductive type on the substrate. In the transfer film, the bonding strength between the resistive layer and the substrate before exposure is lower than the bonding strength between the separation film and the conductive layer, and the bonding strength between the resistive layer and the substrate after exposure is greater than the separation film The bonding strength with the conductive layer is high.
根據本發明，可以提供一種容易且低成本形成所期望之形狀之透明導電膜之圖樣的透明導電圖樣之形成方法、觸摸屏之製造方法和導電轉印膜。 According to the present invention, it is possible to provide a method of forming a transparent conductive pattern, a method of manufacturing a touch panel, and a conductive transfer film which are easy and low-cost to form a pattern of a transparent conductive film of a desired shape.
10‧‧‧第一基板 10‧‧‧First substrate
11‧‧‧菱形圖案(藉由透明導電膜形成) 11‧‧‧Rhombus pattern (formed by a transparent conductive film)
20‧‧‧第二基板 20‧‧‧second substrate
30‧‧‧雙面膠帶 30‧‧‧Double-sided tape
40‧‧‧各向異性導電膜(ACF) 40‧‧‧ Anisotropic Conductive Film (ACF)
41‧‧‧柔性基板(FPC) 41‧‧‧Flexible Substrate (FPC)
110‧‧‧導電型轉印膜 110‧‧‧Conductive transfer film
111‧‧‧導電層 111‧‧‧ Conductive layer
111a‧‧‧導電層 111a‧‧‧ Conductive layer
112‧‧‧電阻層 112‧‧‧resistance layer
112a‧‧‧電阻層 112a‧‧‧resistance layer
113‧‧‧一方之分離膜 113‧‧‧one separation membrane
114‧‧‧另一方之分離膜 114‧‧‧The other side of the separation membrane
115‧‧‧複合層 115‧‧‧Composite layer
117‧‧‧薄膜 117‧‧‧film
121‧‧‧光罩 121‧‧‧Photomask
121a‧‧‧開口部 121a‧‧‧ openings
130‧‧‧遮光層 130‧‧‧Lighting layer
圖1(a)-(f)係說明先前之觸摸屏之製造方法之工序圖(1) 1(a)-(f) are process diagrams illustrating the manufacturing method of the prior touch panel (1)
圖2(a)-(f)係說明先前之觸摸屏之製造方法之工序圖(2) 2(a)-(f) are process diagrams illustrating the manufacturing method of the prior touch panel (2)
圖3係本實施態樣之觸摸屏之構造之說明圖(1) 3 is an explanatory diagram of the structure of the touch screen of the embodiment (1)
圖4係本實施態樣之觸摸屏之構造之說明圖(2) 4 is an explanatory diagram of the structure of the touch screen of the embodiment (2)
圖5(a)-(f)係說明第一實施態樣之觸摸屏之製造方法之工序圖 5(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of the first embodiment.
圖6(a)、(b)係導電型轉印膜之說明圖(1) Fig. 6 (a) and (b) are explanatory diagrams of the conductive type transfer film (1)
圖7係導電型轉印膜之說明圖(2) Figure 7 is an explanatory diagram of a conductive type transfer film (2)
圖8(a)-(e)係說明第二實施態樣之觸摸屏之製造方法之工序圖 8(a)-(e) are process diagrams illustrating a method of manufacturing a touch panel of a second embodiment;
圖9(a)-(f)係說明第三實施態樣之觸摸屏之製造方法之工序圖 9(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of a third embodiment.
圖10(a)、(b)係第三實施態樣之觸摸屏之製造方法之說明圖 10(a) and 10(b) are explanatory diagrams showing a method of manufacturing a touch panel according to a third embodiment.
圖11(a)-(f)係說明第四實施態樣之觸摸屏之製造方法之工序圖 11(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of a fourth embodiment.
圖12係第四實施態樣之觸摸屏之製造方法之說明圖 Figure 12 is an explanatory view showing a method of manufacturing the touch panel of the fourth embodiment
而後，對實施本發明之態樣進行說明。又，對於相同的部件賦予相同符號，並省略其說明。 Then, the aspect in which the present invention is carried out will be described. The same components are denoted by the same reference numerals, and their description will be omitted.
〔第一實施態樣〕 [First embodiment]
(觸摸屏) (touch screen)
下面對根據本實施態樣之觸摸屏之製造方法製造之觸摸屏進行說明。 Next, a touch panel manufactured according to the method of manufacturing a touch panel of the present embodiment will be described.
如圖3和圖4所示，根據本實施態樣之觸摸屏之製造方法製造的觸摸屏具有：第一基板10、第二基板20、將第一基板10和第二基板20黏合的雙面膠帶30。第一基板10和第二基板20由玻璃或透明的樹脂材料製成，係透光之透明基板。 As shown in FIG. 3 and FIG. 4, the touch panel manufactured by the method for manufacturing a touch panel according to the present embodiment has a first substrate 10, a second substrate 20, and a double-sided tape 30 that bonds the first substrate 10 and the second substrate 20. . The first substrate 10 and the second substrate 20 are made of glass or a transparent resin material, and are transparent substrates that transmit light.
於第一基板10之表面上，形成有由透明導電膜形成的沿Y軸方向相連的菱形圖案11，以及與菱形圖案11連接的銀制佈線12。又，於第二基板20之表面上，形成有由透明導電膜形成的沿X軸方向連續的菱形圖案21，以及與菱形圖案21連接的銀制佈線22。第一基板10和第二基板20與形成有第一基板10之菱形圖案11的面和形成有第二基板20之菱形圖案21的面朝向相同，並由雙面膠帶30黏合，且藉由各向異性導電膜(ACF：anisotropic conductive film)40與柔性基板(FPC：Flexible printed circuits)41連接。此時，柔性基板41之佈線和形成於第一基板10上的佈線12以及形成於第二基板20上的佈線藉由各向異性導電膜40而被電連接。 On the surface of the first substrate 10, a diamond pattern 11 formed by a transparent conductive film and connected in a Y-axis direction, and a silver wiring 12 connected to the diamond pattern 11 are formed. Further, on the surface of the second substrate 20, a diamond pattern 21 continuous in the X-axis direction formed of a transparent conductive film, and a silver wiring 22 connected to the diamond pattern 21 are formed. The faces of the first substrate 10 and the second substrate 20 and the diamond-shaped pattern 11 on which the first substrate 10 is formed and the surface of the diamond-shaped pattern 21 on which the second substrate 20 is formed are oriented in the same direction, and are bonded by the double-sided tape 30, and by each The anisotropic conductive film (ACF: 40) is connected to a flexible printed circuit (FPC) 41. At this time, the wiring of the flexible substrate 41 and the wiring 12 formed on the first substrate 10 and the wiring formed on the second substrate 20 are electrically connected by the anisotropic conductive film 40.
(觸摸屏之製造方法) (Manufacturing method of touch screen)
而後，對本實施態樣的觸摸屏之製造方法進行說明。本實施態 樣之觸摸屏的製造方法係形成所希望的形狀的透明導電膜的圖樣的方法。作為本實施態樣之觸摸屏的製造方法，根據圖5，對於於第一基板10上形成由透明導電膜構成的菱形圖案11的情況進行說明。又，於第二基板20上形成由透明導電膜構成的菱形圖案21的情況亦可藉由同樣的方法製造。 Next, a method of manufacturing the touch panel of the present embodiment will be described. This embodiment A method of manufacturing a touch panel is a method of forming a pattern of a transparent conductive film of a desired shape. As a method of manufacturing the touch panel of the present embodiment, a case where the diamond pattern 11 made of a transparent conductive film is formed on the first substrate 10 will be described with reference to FIG. Further, the case where the diamond pattern 21 made of a transparent conductive film is formed on the second substrate 20 can also be produced by the same method.
首先，如圖5(a)所示般，準備透明基板之第一基板10。 First, as shown in FIG. 5(a), the first substrate 10 of the transparent substrate is prepared.
而後，如圖5(b)所示般，從後述的轉寫型導電膜110剝離其他的分離膜114，黏貼於第一基板10之表面上。如圖6(a)所示，所謂轉寫型導電膜110具有用於形成透明導電膜的導電層111、電阻層112、設於導電層111一側之一方的分離膜113、以及設於電阻層112之另一方的分離膜114，如圖6(b)所示般，例如係卷成卷狀。導電層111由透光之導電性材料製成，具體地說，可以由銀納米線等金屬納米線、碳納米管、ITO等，且薄層電阻(表面抵抗率)為200 Ω/□以下之材料形成。一方之分離膜113和另一方之分離膜114由聚乙烯或聚酯纖維等的薄膜形成。 Then, as shown in FIG. 5(b), the other separation film 114 is peeled off from the transfer-type conductive film 110 to be described later, and is adhered to the surface of the first substrate 10. As shown in FIG. 6(a), the transfer-type conductive film 110 has a conductive layer 111 for forming a transparent conductive film, a resistance layer 112, a separation film 113 provided on one side of the conductive layer 111, and a resistor. The other separation membrane 114 of the layer 112 is wound into a roll shape, for example, as shown in Fig. 6(b). The conductive layer 111 is made of a light-transmitting conductive material, specifically, a metal nanowire such as a silver nanowire, a carbon nanotube, an ITO, or the like, and has a sheet resistance (surface resistivity) of 200 Ω/□ or less. Material formation. The one separation membrane 113 and the other separation membrane 114 are formed of a film of polyethylene or polyester fiber.
電阻層112作為聚合性單體，可使用丙烯酸酯、甲基丙烯酸酯、烯類不飽和羧酸等單體分子中具有碳雙鍵反應之物質。具體地說，可以使用：苯乙烯、丙烯酸苄酯、甲基丙烯酸苄酯、丙烯酸環己酯、甲基丙烯酸環己基酯、丙烯酸羥乙酯之鐵、甲基丙烯酸甲酯智鐵、丙烯酸苯氧基聚烯烴、苯氧基聚烯烴丙烯酸甲酯、丙烯酸酯、苯氧基丙基開平烯酸酯-2-羥基-3-、2丙烯醯氧基乙基鄰苯二甲酸酯、2-丙烯醯氧乙基-2-羥乙基酯、2-甲基丙烯醯氧基乙基-2-羥基丙基鄰苯二甲酸酯、甲基喜烯酸酯、甲基丙烯酸甲酯、丙烯酸乙酯丙烯酸酯、甲基丙烯酸乙酯、丙烯酸正丙酯(n-propyl acrylate)、甲基丙烯酸正丙酯(n-propyl methacrylate)正丙基丙烯酸酯(i-propyl acrylate)、甲基丙烯酸甲酯丙酯(i-propyl methacrylate)、丙烯酸正丁酯、甲基丙烯酸正丁 酯、丙烯酸第三丁酯、甲基丙烯酸第三丁酯、2-羥基乙基丙烯酸酯、2-羥乙基甲基丙烯酸酯等。又、也可將這些單體和寶萊塢乙烯醇、聚乙烯醇縮丁醛、纖維素、羥甲基纖維素、氰乙基纖維素、氰基乙基支鏈澱粉等水溶性聚合物混合。又，多功能單體聚合，比如也可以和季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸甲酯等聚合。作為光聚合引發劑，混合二苯甲酮化合物，比如4，4’-雙(二甲氨基)二苯甲酮、4，4’-雙(二乙氨基)二苯甲酮、3，3’-二甲基-4-甲氧基二苯甲酮、作為偶氮化合物的偶氮二異丁腈等為佳。這些組合物的特性為，一接觸顯影液(碳酸鈉溶液等鹼性水溶液等)即溶解，若照射UV光則聚合性單體等發生反應，高分子量化而硬化，不溶解到顯影液。 As the polymerizable monomer, the resistive layer 112 can be a compound having a carbon double bond reaction in a monomer molecule such as an acrylate, a methacrylate or an ethylenically unsaturated carboxylic acid. Specifically, styrene, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, iron hydroxyethyl acrylate, methyl methacrylate, phenoxy acrylate Polyolefin, phenoxy polyolefin methyl acrylate, acrylate, phenoxypropylopenoate-2-hydroxy-3-, 2 propylene methoxyethyl phthalate, 2-propene Ethoxyethyl 2-hydroxyethyl ester, 2-methylpropenyloxyethyl-2-hydroxypropyl phthalate, methyl phthalate, methyl methacrylate, acrylic acid B Ester acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate i-propyl acrylate, methyl methacrylate I-propyl methacrylate, n-butyl acrylate, butyl methacrylate Ester, tert-butyl acrylate, tert-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and the like. Alternatively, these monomers may be mixed with water-soluble polymers such as Bollywood vinyl alcohol, polyvinyl butyral, cellulose, hydroxymethyl cellulose, cyanoethyl cellulose, and cyanoethyl amylopectin. . Further, the multifunctional monomer is polymerized, for example, with pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate or the like. As a photopolymerization initiator, a benzophenone compound such as 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 3,3' is mixed. - dimethyl-4-methoxybenzophenone, azobisisobutyronitrile as an azo compound, or the like is preferred. The characteristics of these compositions are such that they are dissolved by contact with a developing solution (such as an alkaline aqueous solution such as a sodium carbonate solution), and when a UV light is irradiated, a polymerizable monomer or the like is reacted, polymerized and hardened, and dissolved in a developing solution.
具體地說，將這樣的導電型轉印膜110的另一方之分離膜114剝離後，將電阻層112黏貼到第一基板10上，之後，藉由剝離一方之分離膜113，將導電型轉印膜110的電阻層112和導電層111按該順序層疊的狀態黏貼於第一基板10之表面上。 Specifically, after the other separation film 114 of the conductive transfer film 110 is peeled off, the resistive layer 112 is adhered to the first substrate 10, and then the conductive film is transferred by peeling off one of the separation films 113. The resistive layer 112 and the conductive layer 111 of the printing film 110 are adhered to the surface of the first substrate 10 in a state of being laminated in this order.
而後，如圖5(c)所示般，使用於被曝光的區域具有開口部121a的光罩121，藉由曝光裝置照射紫外光(UV光)進行曝光。藉此，被紫外光照射的區域之電阻層112感光而硬化。 Then, as shown in FIG. 5(c), the photomask 121 having the opening 121a in the exposed region is exposed to ultraviolet light (UV light) by an exposure device. Thereby, the resistance layer 112 of the region irradiated with the ultraviolet light is photosensitive and hardened.
而後，如圖5(d)所示般，於導電層111之上黏貼表面具有黏附性的薄膜117。 Then, as shown in FIG. 5(d), a film 117 having an adhesive surface on the conductive layer 111 is adhered.
而後，如圖5(e)所示般，剝離表面具有黏附性的薄膜117。此時，由於被紫外光照射的區域之電阻層112感光而硬化，牢固黏貼於第一基板10上，電阻層112沒有感光的區域，即，沒有被紫外光照射的區域的電阻層112和導電層111與膜117一起被剝離。 Then, as shown in Fig. 5(e), the peeling surface has an adhesive film 117. At this time, since the resistive layer 112 of the region irradiated with the ultraviolet light is photosensitive and hardened, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive layer 112 and the conductive region of the region not irradiated with ultraviolet light. Layer 111 is peeled off together with film 117.
據此，如圖5(f)所示般，於第一基板10之表面上留下硬化的電阻層112a和電阻層122a之上的導電層111a，藉由該導電層111a，形成菱 形圖案11。 Accordingly, as shown in FIG. 5(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and the conductive layer 111a is used to form a diamond. Shape pattern 11.
又，如前所述，對於第二基板20也可藉由同様之方法，形成菱形圖案21，藉由黏合第一基板10和第二基板20，可以製作本實施態樣之觸摸屏。 Further, as described above, the diamond pattern 21 can be formed by the same method for the second substrate 20, and the touch panel of this embodiment can be produced by bonding the first substrate 10 and the second substrate 20.
又，導電型轉印膜110除圖6(a)所示之結構之外，如圖7所示般，也可以使用具有導電層和電阻層等形成一體的複合層115的結構。在導電型轉印膜110中，複合層115之一方之面上設有一方之分離膜113，而另一方之面上設有另一方之分離膜114。 Further, in addition to the structure shown in FIG. 6(a), the conductive type transfer film 110 may have a structure in which an integrated layer 115 having an integral layer such as a conductive layer and a resistance layer is used as shown in FIG. In the conductive type transfer film 110, one of the separation films 113 is provided on one surface of the composite layer 115, and the other separation film 114 is provided on the other surface.
在本實施態樣之觸摸屏的製造方法中，第一基板10上的菱形圖案11和第二基板20上的菱形圖案21等透明導電膜之圖樣無需藉由濕製程便可形成。故，可以簡化製造工序，又，無需高價之製造設備。據此，可以高產量低成本生產透明導電圖樣，進而可以低成本，高產量地製造觸摸屏。 In the method of manufacturing the touch panel of the present embodiment, the pattern of the transparent conductive film such as the diamond pattern 11 on the first substrate 10 and the diamond pattern 21 on the second substrate 20 can be formed without a wet process. Therefore, the manufacturing process can be simplified, and high-priced manufacturing equipment is not required. According to this, it is possible to produce a transparent conductive pattern at a high cost and at a low cost, and it is possible to manufacture a touch panel at low cost and high yield.
〔第二實施態樣〕 [Second embodiment]
而後，依據圖8對第二實施態樣進行說明。本實施態樣係形成所期望之形狀之透明導電膜之圖樣的方法，係與第一實施態樣不同的製造方法。 Then, the second embodiment will be described with reference to FIG. The present embodiment is a method of forming a pattern of a transparent conductive film of a desired shape, which is a manufacturing method different from that of the first embodiment.
首先，如圖8(a)所示般，準備作為透明基板的第一基板10。 First, as shown in FIG. 8(a), a first substrate 10 as a transparent substrate is prepared.
而後，如圖8(b)所示般，從轉寫型導電膜110上剝離另一方之分離膜114，於第一基板10之表面上進行黏貼。轉寫型導電膜110係與第一實施態樣中使用之物相同者。具體地說，剝離這樣的導電型轉印膜110上的另一方之分離膜114後，將電阻層112黏貼到第一基板10上。據此，於第一基板10之表面上黏貼由導電型轉印膜110上的電阻層112、導電層111、一方之分離膜113按該順序層疊的層疊體。 Then, as shown in FIG. 8(b), the other separation film 114 is peeled off from the transfer-type conductive film 110, and is pasted on the surface of the first substrate 10. The transfer type conductive film 110 is the same as that used in the first embodiment. Specifically, after the other separation film 114 on the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a laminated body in which the resistive layer 112, the conductive layer 111, and the one of the separation films 113 on the conductive type transfer film 110 are laminated in this order is adhered to the surface of the first substrate 10.
而後，如圖8(c)所示般，使用於被曝光之區域具有開口部121a之光罩121，藉由曝光裝置照射紫外光(UV光)進行曝光。據此，被紫外 光照射之區域之電阻層112感光而硬化。 Then, as shown in FIG. 8(c), the photomask 121 having the opening 121a in the exposed region is used, and exposure is performed by irradiating ultraviolet light (UV light) by the exposure device. According to this, by the ultraviolet The resistive layer 112 in the region irradiated with light is photosensitive and hardened.
而後，如圖8(d)所示般，剝離一方之分離膜113。此時，由於被紫外光照射之區域之電阻層112感光而硬化，牢固地附著於第一基板10上，電阻層112未感光之區域，即，未被紫外光照射之區域的電阻層112和導電層111與一方之分離膜113一起被剝離。 Then, as shown in FIG. 8(d), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 in the region irradiated with the ultraviolet light is hardened by light, it is firmly adhered to the first substrate 10, and the resistive layer 112 is not exposed to light, that is, the resistive layer 112 of the region not irradiated with ultraviolet light and The conductive layer 111 is peeled off together with one of the separation films 113.
據此，如圖8(f)所示般，於第一基板10之表面上留下硬化的電阻層112a和電阻層122a之上之導電層111a，藉由該導電層111a，形成菱形圖案11。 Accordingly, as shown in FIG. 8(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and a diamond pattern 11 is formed by the conductive layer 111a. .
又，前述之外之內容與第一實施態樣相同。 Further, the content other than the foregoing is the same as that of the first embodiment.
〔第三實施態樣〕 [Third embodiment]
而後，根據圖9，對第三實施態樣進行說明。本實施態樣係形成所期望之形狀之透明導電膜之圖樣的方法，係與第一和第二之實施態樣不同的觸摸屏之製造方法。 Next, a third embodiment will be described based on Fig. 9 . The present embodiment is a method of forming a pattern of a transparent conductive film of a desired shape, which is a method of manufacturing a touch panel different from the first and second embodiments.
首先，如圖9(a)所示般，準備作為透明基板之第一基板10。 First, as shown in FIG. 9(a), a first substrate 10 as a transparent substrate is prepared.
而後，如圖9(b)所示般，從轉寫型導電膜110剝離另一方之分離膜114，黏貼於第一基板10之表面上。轉寫型導電膜110可以使用與第一實施態樣使用之相同物。具體地說，剝離這樣的導電型轉印膜110的另一方之分離膜114後，將電阻層112黏貼於第一基板10上。據此，於第一基板10之表面上可以黏貼由導電型轉印膜110上的電阻層112、導電層111、一方之分離膜113按該順序層疊而成之層疊體。 Then, as shown in FIG. 9(b), the other separation film 114 is peeled off from the transfer-type conductive film 110 and adhered to the surface of the first substrate 10. The transfer type conductive film 110 can be the same as that used in the first embodiment. Specifically, after the other separation film 114 of the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a laminated body in which the resistive layer 112, the conductive layer 111, and the one of the separation films 113 on the conductive type transfer film 110 are laminated in this order can be adhered to the surface of the first substrate 10.
而後，如圖9(c)所示般，於一方之分離膜113上，且於形成菱形圖案11之區域上，形成遮光層130。遮光層130之形成方法如圖10(a)所示般，可藉由噴墨等形成遮光層130，也可以如圖10(b)般，藉由絲網印刷形成遮光層130。遮光層130由遮光的遮光性塗料等形成，由黒色材料或反射光的金屬材料等形成。 Then, as shown in FIG. 9(c), the light shielding layer 130 is formed on one of the separation films 113 and on the region where the diamond pattern 11 is formed. As shown in FIG. 10(a), the light shielding layer 130 may be formed by inkjet or the like, or the light shielding layer 130 may be formed by screen printing as shown in FIG. 10(b). The light shielding layer 130 is formed of a light-shielding light-shielding paint or the like, and is formed of a green material or a metal material that reflects light.
而後，如圖9(d)所示般，藉由曝光裝置照射紫外光(UV光)進行曝 光。據此，在沒有形成遮光層130之區域的電阻層112感光而硬化。 Then, as shown in FIG. 9(d), exposure is performed by irradiating ultraviolet light (UV light) by the exposure device. Light. Accordingly, the resistance layer 112 in the region where the light shielding layer 130 is not formed is photosensitive and hardened.
而後，如圖9(e)所示般，剝離一方之分離膜113。此時，由於被紫外光照射的區域之電阻層112感光而硬化，因而牢固地附著於第一基板10上，而電阻層112沒有感光之區域，也即，沒有被紫外光照射之區域的電阻層112和導電層111與一方之分離膜113一起被剝離。 Then, as shown in Fig. 9(e), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 of the region irradiated with the ultraviolet light is hardened by light, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive region of the region not irradiated with ultraviolet light. The layer 112 and the conductive layer 111 are peeled off together with one of the separation films 113.
據此，如圖9(f)所示般，於第一基板10之表面上留下硬化的電阻層112a和電阻層122a之上面的導電層111a，藉由導電層111a形成菱形圖案11。 Accordingly, as shown in FIG. 9(f), the hardened resistive layer 112a and the conductive layer 111a on the upper surface of the resistive layer 122a are left on the surface of the first substrate 10, and the diamond pattern 11 is formed by the conductive layer 111a.
又，關於前述以外之內容，與第二實施態樣相同。 In addition, the content other than the above is the same as that of the second embodiment.
〔第四實施態樣〕 [Fourth embodiment]
而後，根據圖11，對第四實施態樣進行說明。本實施態樣係形成所期望之形狀之透明導電膜之圖樣的方法，係與第一~第三實施態樣不同的觸摸屏的製造方法。 Next, a fourth embodiment will be described based on Fig. 11 . The present embodiment is a method of forming a pattern of a transparent conductive film having a desired shape, and is a method of manufacturing a touch panel different from the first to third embodiments.
首先，如圖11(a)所示般，準備作為透明基板的第一基板10。 First, as shown in FIG. 11(a), a first substrate 10 as a transparent substrate is prepared.
而後，如圖11(b)所示般，於導電型轉印膜110之一方之分離膜113之上，且於形成有菱形圖案11之區域上，形成遮光層130。又，導電型轉印膜110可以使用與第一實施態樣之相同物。遮光層130之形成方法如圖10(a)所示般，可藉由噴墨等形成遮光層130，也可如圖10(b)所示般，藉由絲網印刷形成遮光層130。圖12擴大示出了據此方法於表面形成遮光層130之狀態的導電型轉印膜110。 Then, as shown in FIG. 11(b), a light shielding layer 130 is formed on the separation film 113 which is one of the conductive type transfer films 110, and on the region where the diamond pattern 11 is formed. Further, the conductive type transfer film 110 can be the same as the first embodiment. As shown in FIG. 10(a), the light shielding layer 130 may be formed by inkjet or the like, or the light shielding layer 130 may be formed by screen printing as shown in FIG. 10(b). Fig. 12 is an enlarged view showing the conductive type transfer film 110 in a state in which the light shielding layer 130 is formed on the surface according to this method.
而後，如圖11(c)所示般，從導電型轉印膜110剝離另一方之分離膜114，黏貼於第一基板10之表面上。具體地說，剝離導電型轉印膜110上另一方之分離膜114後，將電阻層112黏貼於第一基板10。據此，由導電型轉印膜110之電阻層112、導電層111、一方之分離膜113按該順序層疊而成的薄膜黏貼於第一基板10之表面上。 Then, as shown in FIG. 11(c), the other separation film 114 is peeled off from the conductive type transfer film 110 and adhered to the surface of the first substrate 10. Specifically, after the other separation film 114 on the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a film formed by laminating the resistive layer 112, the conductive layer 111, and the one of the separation films 113 of the conductive transfer film 110 in this order is adhered to the surface of the first substrate 10.
而後，如圖11(d)所示般，藉由曝光裝置照射紫外光(UV光)進行 曝光。據此，於沒有形成遮光層130之區域的電阻層112感光而硬化。 Then, as shown in FIG. 11(d), ultraviolet light (UV light) is irradiated by the exposure device. exposure. Accordingly, the resistive layer 112 in the region where the light shielding layer 130 is not formed is photosensitive and hardened.
而後，如圖11(e)所示般，剝離一方之分離膜113。此時，由於紫外光照射之區域之電阻層112感光而硬化，因而，牢固地黏貼於第一基板10上，電阻層112之沒有感光之區域，也即紫外光沒有照射之區域之電阻層112和導電層111與一方之分離膜113一起被剝離。 Then, as shown in Fig. 11(e), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 in the region irradiated with the ultraviolet light is photosensitive and hardened, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive layer 112 in the region where the ultraviolet light is not irradiated. The conductive layer 111 is peeled off together with one of the separation films 113.
據此，圖11(f)所示般，於第一基板10之表面上留下硬化的電阻層112a和電阻層122a之上之導電層111a，藉由該導電層111a形成菱形圖案11。 Accordingly, as shown in FIG. 11(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and the conductive layer 111a forms a diamond pattern 11.
又、前述以外之內容與第三實施態樣相同。 Further, the content other than the above is the same as that of the third embodiment.
以上對實施本發明之相關態樣進行了說明，但前述內容並不限定發明之內容。 The related aspects for carrying out the invention have been described above, but the foregoing does not limit the content of the invention.
10‧‧‧第一基板 10‧‧‧First substrate
11‧‧‧菱形圖案(藉由透明導電膜形成) 11‧‧‧Rhombus pattern (formed by a transparent conductive film)
111‧‧‧導電層 111‧‧‧ Conductive layer
111a‧‧‧導電層 111a‧‧‧ Conductive layer
112‧‧‧電阻層 112‧‧‧resistance layer
112a‧‧‧電阻層 112a‧‧‧resistance layer
113‧‧‧一方之分離膜 113‧‧‧one separation membrane
117‧‧‧薄膜 117‧‧‧film
121‧‧‧光罩 121‧‧‧Photomask
121a‧‧‧開口部 121a‧‧‧ openings
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/079662 WO2014076798A1 (en) | 2012-11-15 | 2012-11-15 | Method for forming transparent conductive pattern, method for fabricating touch panel, and conductive transfer film |
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| TW201419108A true TW201419108A (en) | 2014-05-16 |
| TWI496063B TWI496063B (en) | 2015-08-11 |
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| TW102120791A TWI496063B (en) | 2012-11-15 | 2013-06-11 | A method of forming a transparent conductive pattern, a method of manufacturing a touch screen, and a conductive transfer film |
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| TW (1) | TWI496063B (en) |
| WO (1) | WO2014076798A1 (en) |
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| TWI557610B (en) * | 2014-05-30 | 2016-11-11 | And a method of manufacturing a conductive substrate of a touch device |
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| CN108845706B (en) * | 2018-06-30 | 2021-05-07 | 广州国显科技有限公司 | Conductive laminated structure, preparation method of conductive laminated structure and touch panel |
| CN113970978B (en) * | 2020-07-24 | 2023-11-24 | 洋华光电股份有限公司 | Manufacturing method of large-scale touch sensing pattern |
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| JP2001284350A (en) * | 2000-03-31 | 2001-10-12 | Nitto Denko Corp | Pattern-forming method and adhesive sheet for peeling off thin film |
| JP4779244B2 (en) * | 2001-06-28 | 2011-09-28 | Ｔｄｋ株式会社 | Method for forming functional layer pattern |
| TW201243665A (en) * | 2011-04-22 | 2012-11-01 | Young Lighting Technology Corp | Fabrication method of touch device |
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