TW201416837A - 散熱器組合 - Google Patents

散熱器組合 Download PDF

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Publication number
TW201416837A
TW201416837A TW101139792A TW101139792A TW201416837A TW 201416837 A TW201416837 A TW 201416837A TW 101139792 A TW101139792 A TW 101139792A TW 101139792 A TW101139792 A TW 101139792A TW 201416837 A TW201416837 A TW 201416837A
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TW
Taiwan
Prior art keywords
heat sink
base
bracket
circuit board
sink assembly
Prior art date
Application number
TW101139792A
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English (en)
Inventor
chun-sheng Yu
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101139792A priority Critical patent/TW201416837A/zh
Priority to US13/928,355 priority patent/US20140116671A1/en
Publication of TW201416837A publication Critical patent/TW201416837A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/22—Fastening; Joining by using magnetic effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

一種散熱器組合，包括一散熱器，所述散熱器包括一底座，所述底座設有一密閉空間，所述底座包括一用於接觸一發熱元件的板體及多個自所述板體延伸形成的磁力柱，所述磁力柱位於所述密閉空間中，所述底座藉由所述磁力柱能吸附在一金屬材質的物體上。

Description

散熱器組合
本發明涉及一種散熱器組合，尤指一種具有均熱底座的散熱器組合。
隨著電腦技術的不斷發展，電腦功能越來越多，相應地電腦元件也越來越多，為了提高電腦工作的穩定性，電腦內部使用了許多散熱裝置，當前電腦內使用的散熱器主要用於晶片的散熱，如何將散熱器固定在電路板上，則顯得非常重要。業界也推出將散熱器直接藉由螺絲鎖固在發熱元件上，這樣裝配散熱器比較費時。
鑒於以上內容，有必要提供一種安裝方便的散熱器組合。
一種散熱器組合，包括一散熱器，所述散熱器包括一底座，所述底座設有一密閉空間，所述底座包括一用於接觸一發熱元件的板體及多個自所述板體延伸形成的磁力柱，所述磁力柱位於所述密閉空間中，所述底座藉由所述磁力柱能吸附在一金屬材質的物體上。
與習知技術相比，在上述散熱器組合中，所述散熱器的底座包括多個磁力柱，所述磁力柱可以吸附在金屬材質上，這樣在組裝散熱器時簡單方便。
請參閱圖1和圖2，一散熱器組合包括一電路板10、一支架30及一散熱器50。
所述電路板10包括一電路板本體11及一裝設在所述電路板本體11上的發熱元件13。所述電路板本體11設有多個固定孔15。
所述支架30為金屬材質，所述支架包括一支架本體31及多個自所述支架本體31延伸形成的固定部33。所述支架本體31設有一開口310。所述支架本體31包括一支撐部311及一自所述支撐部311垂直延伸形成的凸緣313。所述支撐部311呈方形。所述支撐部311平行所述電路板本體11。所述支撐部311及所述凸緣313環繞所述開口310。所述支架本體31的支撐部311及凸緣313在垂直所述電路板本體11的方向上的橫截面呈L形。
所述散熱器50包括一底座51及多個自所述底座延伸形成的散熱鰭片53。所述散熱鰭片53相互平行。所述底座51包括一均熱板511，所述底座51設有一密閉空間513。所述均熱板511位於所述密閉空間513中。所述均熱板511包括一板體5111、多個自所述板體5111延伸形成的磁力柱5113及多個自所述板體5111延伸形成的凸柱5115，所述磁力柱5113分佈在所述凸柱5115的周圍。
請參閱圖3及圖4，組裝時，先將所述支架30的固定部33與所述電路板10的固定孔15對應，將所述固定部33穿過所述固定孔15從而將所述支架30安裝在所述電路板10上。此時，所述發熱元件13位於所述支架30的開口310中。再將所述散熱器50的底座51放置在所述支架30的支撐部311上。由於所述底座51的磁力柱5113的磁力吸附作用，所述底座51與所述支架30的支撐部311吸附在一起。此時，所述底座51的板體5111接觸所述發熱元件13，用於傳導所述發熱元件13的熱量至所述散熱器50的散熱鰭片53。所述底座51的所述凸緣313用於限制所述散熱器50沿一平行所述電路板本體11上的方向上移動。
所述散熱器50磁力吸附作用而固定在所述支架30上，從而可以不使用固定裝置即可固定，簡單方便。在拆卸時，用力分開所述散熱器50及所述支架30即可將所述散熱器50從所述支架30上拆卸下來。
綜上所述，本發明確已符合發明專利要求，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
10．．．電路板
11．．．電路板本體
13．．．發熱元件
15．．．固定孔
30．．．支架
31．．．支架本體
310．．．開口
311．．．支撐部
313．．．凸緣
50．．．散熱器
51．．．底座
511．．．均熱板
5111．．．板體
5113．．．磁力柱
5115．．．凸柱
513．．．密閉空間
圖1係本發明散熱器組合的一較佳實施方式的一立體分解圖。
圖2係圖1的散熱器的剖視圖。
圖3係圖1的立體組裝圖。
圖4係圖3中沿IV-IV線的剖面圖。
11．．．電路板本體
13．．．發熱元件
30．．．支架
50．．．散熱器
5113．．．磁力柱
513．．．密閉空間

Claims (8)

  1. 一種散熱器組合，包括一散熱器，所述散熱器包括一底座，其改進在於：所述底座設有一密閉空間，所述底座包括一用於接觸一發熱元件的板體及多個自所述板體延伸形成的磁力柱，所述磁力柱位於所述密閉空間中，所述底座藉由所述磁力柱能吸附在一金屬材質的物體上。
  2. 如申請專利範圍第1項所述之散熱器組合，其中所述底座還包括多個自所述板體延伸形成的凸柱，所述凸柱位於所述密閉空間中，所述磁力柱環繞所述凸柱。
  3. 如申請專利範圍第1項所述之散熱器組合，其中所述散熱器還包括多個自所述底座延伸形成的散熱鰭片，所述散熱鰭片相互平行。
  4. 如申請專利範圍第1項所述之散熱器組合，其中所述散熱器組合還包括一電路板，所述支架安裝於所述電路板上，所述電路板包括一電路板本體及一安裝於所述電路板本體上的發熱元件，所述支架設有一開口，所述發熱元件位於所述開口中，所述底座安裝在所述支架上且所述板體接觸所述發熱元件。
  5. 如申請專利範圍第4項所述之散熱器組合，其中所述支架包括一支架本體，所述支架本體包括一環繞所述開口的支撐部，所述支撐部平行所述電路板本體，所述底座放置在所述支撐部上。
  6. 如申請專利範圍第5項所述之散熱器組合，其中所述支架本體還包括一自所述支撐部延伸形成的凸緣，所述凸緣環繞所述底座，所述凸緣用於限制所述底座沿一平行所述電路板本體的方向上移動。
  7. 如申請專利範圍第6項所述之散熱器組合，其中所述支撐部及所述凸緣沿一垂直所述電路板本體的方向上的橫截面呈L形。
  8. 如申請專利範圍第4項所述之散熱器組合，其中所述支架包括一支架本體及多個自所述支架本體延伸形成的固定部，所述開口設於所述支架本體中，所述電路板本體設有多個***述固定部的固定孔。
TW101139792A 2012-10-26 2012-10-26 散熱器組合 TW201416837A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101139792A TW201416837A (zh) 2012-10-26 2012-10-26 散熱器組合
US13/928,355 US20140116671A1 (en) 2012-10-26 2013-06-26 Heat sink assembly

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Application Number Priority Date Filing Date Title
TW101139792A TW201416837A (zh) 2012-10-26 2012-10-26 散熱器組合

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TW201416837A true TW201416837A (zh) 2014-05-01

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM504269U (zh) * 2014-11-19 2015-07-01 Giga Byte Tech Co Ltd 板件固定結構
CN115589646B (zh) * 2022-12-12 2023-03-21 久盛电气股份有限公司 一种加热***、罐装置及其控制方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6542369B1 (en) * 2001-12-27 2003-04-01 Nextronics Engineering Corp. Fixing frame for CPU cooling devices
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
US6831541B1 (en) * 2003-09-16 2004-12-14 Concept Workshop Worldwide, Llc Multi-stable magnetic article
TWI251656B (en) * 2004-12-03 2006-03-21 Hon Hai Prec Ind Co Ltd Boiling chamber cooling device
TW201221041A (en) * 2010-11-11 2012-05-16 Hon Hai Prec Ind Co Ltd Heat dissipation apparatus assembly

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